Processing system, processing method, display device, and display method

Abstract

A processing system, a processing method, a display device, and a display method capable of appropriately measuring a workpiece based on workpiece information are provided. The processing system includes a processing device capable of processing an object; a measuring device capable of measuring a three-dimensional shape of the object; and a control device that controls the processing device, the control device controlling the processing device based on three-dimensional shape information of a second region of the object, the three-dimensional shape information of the second region of the object being derived based on a measurement result obtained by measuring a first region of the object using the measuring device and model information representing a three-dimensional model of the object, the three-dimensional shape information of the second region being derived without measuring the three-dimensional shape of the second region by the measuring device, at least a part of the second region being processed by the processing device based on the three-dimensional shape information of the second region.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of a processing system capable of processing an object and a display device used in the processing system. BACKGROUND

[0002] As a processing system capable of processing an object, Patent Literature 1 describes a processing device that forms a structure by irradiating a surface of an object with processing light. In such a processing device, it is required to appropriately process an object.

[0003] PRIOR ART DOCUMENT

[0004] PATENT LITERATURE

[0005] Patent Literature 1: International Publication No. 2000 / 054925 SUMMARY

[0006] According to a first aspect, there is provided a processing system including: a processing device capable of processing an object; a measuring device capable of measuring a three-dimensional shape of at least a portion of the object; and a control device that controls the processing device, the control device controlling the processing device based on three-dimensional shape information of a second region of a surface of the object, the three-dimensional shape information of the second region of the surface of the object being derived based on a measurement result obtained by measuring a first region of the surface of the object using the measuring device and model information representing a three-dimensional model of at least a portion of the object, the three-dimensional shape information of the second region being derived without measuring a three-dimensional shape of the second region by the measuring device, at least a portion of the second region being processed by the processing device based on the three-dimensional shape information of the second region.

[0007] According to a second aspect, there is provided a processing system including: a processing device capable of processing an object; a measuring device capable of measuring a three-dimensional shape of the object; and a display device that displays information related to the object, the display device displaying, after the processing device has processed the object, object information representing a shape of the object that has been processed, first processing region information representing a first processing region that has been processed based on a measurement result derived by the measuring device, and second processing region information representing a second processing region that has been processed based on model information representing a three-dimensional model of at least a portion of the object.

[0008] According to a third aspect, there is provided a processing system including: a processing device capable of processing an object; a measuring device capable of measuring a shape of at least a portion of the object; and a control device controlling the processing device, the control device controlling the processing device based on a measurement result obtained by measuring a first region of a surface of the object using the measuring device and model information representing a shape of a second region of the surface of the object.

[0009] According to a fourth aspect, there is provided a processing system including: a processing device capable of processing an object; a measuring device capable of measuring a shape of at least a portion of the object; and a display device displaying information related to the object, the display device displaying object information representing a shape of the object, first processing region information related to a first processing region processed using a measurement result obtained by the measuring device, and second processing region information related to a second processing region processed using at least a portion of model information representing a model of the object.

[0010] According to a fifth aspect, there is provided a processing system including: a processing device capable of processing an object; a measuring device capable of measuring a shape of at least a portion of the object; and a display device displaying information related to the object, the display device displaying information related to the object based on a result of the measuring device and model information representing a model of the object.

[0011] According to a sixth aspect, there is provided a processing system including: a processing device capable of processing an object; a measuring device capable of measuring a shape of at least a portion of the object; and a control device controlling the processing device, the measuring device measuring a second region of a surface of the object based on a measurement result obtained by measuring a first region of the surface of the object and model information representing a shape of the second region of the surface of the object, the control device controlling the processing device based on at least a measurement result of the second region.

[0012] According to a seventh aspect, there is provided a processing system including: a processing device capable of processing an object; a first measuring device capable of measuring a shape of at least a portion of the object; a second measuring device capable of measuring a shape of at least a portion of the object; and a control device controlling the processing device, the second measuring device measuring a second region of a surface of the object based on a first measurement result obtained by measuring a first region of the surface of the object by means of the first measuring device and model information representing a shape of the second region of the surface of the object, the control device controlling the processing device based on at least a measurement result of the second region.

[0013] According to an eighth aspect, there is provided a display device capable of displaying information related to an object processed by a processing system including: a processing device capable of processing the object; a measuring device capable of measuring a shape of at least a portion of the object; and a control device that controls the processing device based on a measurement result obtained by measuring a first region of a surface of the object using the measuring device and model information representing a shape of a second region of the surface of the object, wherein the display device displays object information representing the shape of the object, first region information related to the first region, and second region information related to the second region.

[0014] According to a ninth aspect, there is provided a display device capable of displaying information related to an object processed by a processing system including: a processing device capable of processing the object; and a measuring device capable of measuring a shape of at least a portion of the object, wherein the display device displays object information representing the shape of the object, first processing region information related to a first processing region processed using a measurement result obtained by the measuring device, and second processing region information related to a second processing region processed using at least a portion of model information representing a model of the object. BRIEF DESCRIPTION OF DRAWINGS

[0015] FIG. 1 is a perspective view schematically showing an overall structure of a processing system of the first embodiment.

[0016] FIG. 2 is a system structure diagram showing a system structure of the processing system of the first embodiment.

[0017] FIG. 3 is a perspective view showing an example of a workpiece.

[0018] FIG. 4 is a flowchart showing a flow of a first processing operation.

[0019] FIG. 5 is a perspective view showing a measuring device that measures a shape of a turbine as an example of a workpiece.

[0020] FIG. 6 (a) of FIG. 6 (b) of

[0021] FIG. 7 is a conceptual diagram conceptually showing a case where a workpiece model is pattern-matched with a workpiece shown by workpiece measurement information.

[0022] FIG. 8is a cross-sectional view indicating a movement locus of the machining head that moves relatively to the work based on the machining path information.

[0023] FIG. 9 (a) to (c) of FIG. 1 are cross-sectional views indicating movement loci of the machining head that moves relatively to the work based on the machining path information, respectively. FIG. 9 (a) to (c) of FIG. 1 are cross-sectional views indicating movement loci of the machining head that moves relatively to the work based on the machining path information, respectively.

[0024] FIG. 10 (a) to (c) of FIG. 1 are cross-sectional views indicating movement loci of the machining head that moves relatively to the work based on the machining path information, respectively. FIG. 10 (a) to (c) of FIG. 1 are cross-sectional views indicating movement loci of the machining head that moves relatively to the work based on the machining path information, respectively.

[0025] FIG. 11 is a flowchart indicating a flow of the second machining operation.

[0026] FIG. 12 is a flowchart indicating a flow of the third machining operation.

[0027] FIG. 13 (a) of FIG. 1 is a perspective view of a measurement device indicating that a shape of the work is measured by the measurement device in a case where a positional relationship between the measurement device and the work is in a first positional relationship, FIG. 13 (b) of FIG. 1 is a perspective view of a measurement device indicating that a shape of the work is measured by the measurement device after the positional relationship between the measurement device and the work is changed from the first positional relationship to a second positional relationship.

[0028] FIG. 14 is a flowchart indicating a flow of the fourth machining operation.

[0029] FIG. 15 is a flowchart indicating a flow of the fifth machining operation.

[0030] FIG. 16 is a flowchart indicating a flow of the sixth machining operation.

[0031] FIG. 17 is a flowchart indicating a flow of the measurement operation.

[0032] FIG. 18 is a system configuration diagram indicating a system configuration of the machining system of the second embodiment.

[0033] FIG. 19 is a plan view indicating an example of an image containing work shape information, first region information, and second region information.

[0034] FIG. 20 is a perspective view schematically indicating an overall configuration of the machining system of the third embodiment.

[0035] FIG. 21 is a system configuration diagram indicating a system configuration of the machining system of the third embodiment.

[0036] FIG. 22 is a perspective view schematically showing the overall structure of the machining system of the fourth embodiment.

[0037] FIG. 23 is a system configuration view showing the system configuration of the machining system of the fourth embodiment. DETAILED DESCRIPTION

[0038] Hereinafter, embodiments of the machining system and the display device will be described with reference to the drawings. Hereinafter, embodiments of the machining system and the display device will be described using a machining system SYS that machines a workpiece W using machining light EL. However, the present application is not limited to the embodiments described below.

[0039] Furthermore, in the following description, the positional relationship of various constituent elements that constitute the machining system SYS is described using an XYZ orthogonal coordinate system defined by X, Y, and Z axes that are orthogonal to each other. In addition, in the following description, for the sake of convenience of description, the X-axis direction and the Y-axis direction are each assumed to be a horizontal direction (i.e., a prescribed direction in a horizontal plane), and the Z-axis direction is assumed to be a vertical direction (i.e., a direction orthogonal to the horizontal plane, which is substantially an up-down direction). Furthermore, the directions of rotation (in other words, the directions of inclination) about the X, Y, and Z axes are referred to as the θX direction, the θY direction, and the θZ direction, respectively.

[0040] (1) Processing system SYSa of first embodiment

[0041] First, the machining system SYS of the first embodiment (hereinafter, the machining system SYS of the first embodiment is referred to as "machining system SYSa") will be described.

[0042] (1-1) Overall structure of processing system SYSa

[0043] First, the structure of the machining system SYSa of the first embodiment will be described with reference to FIG. 1 and FIG. 2 . FIG. 1 is a perspective view showing the structure of the machining system SYSa of the first embodiment. FIG. 2 is a system configuration view showing the system configuration of the machining system SYSa of the first embodiment.

[0044] As shown in FIG. 1 and FIG. 2As shown, the processing system SYSa includes a processing unit 1, a measurement unit 2, a stage unit 3, and a control device 4. The processing unit 1, the measurement unit 2, and the stage unit 3 are housed in a frame 5. However, at least a part of the processing unit 1, the measurement unit 2, and the stage unit 3 can not be housed in the frame 5. That is, the processing system SYSa can not include the frame 5 that houses the processing unit 1, the measurement unit 2, and the stage unit 3. The inside space of the frame 5 can or can not be purged with a purge gas such as nitrogen or argon. The inside space of the frame 5 can or can not be vacuumed.

[0045] The processing unit 1 can process a workpiece W under the control of the control device 4. The workpiece W is an object to be processed by the processing unit 1. The workpiece W can be, for example, a metal, an alloy (e.g., duralumin), a semiconductor (e.g., silicon), a resin, a composite material such as a carbon fiber reinforced plastic (CFRP), a paint (as an example, a paint layer to be applied to a base material), a glass, or an object including any material other than these.

[0046] The processing unit 1 irradiates the workpiece W with processing light EL in order to process the workpiece W. The processing light EL can be any kind of light as long as the workpiece W can be processed by irradiation with the processing light EL to the workpiece W. In the first embodiment, an example in which the processing light EL is a laser light is described, but the processing light EL can be a light different from the laser light. Furthermore, the wavelength of the processing light EL can be any wavelength as long as the workpiece W can be processed by irradiation with the processing light EL to the workpiece W. For example, the processing light EL can be a visible light or an invisible light (e.g., at least one of an infrared light, an ultraviolet light, and an extreme ultraviolet light). The processing light EL can include a pulsed light (e.g., a pulsed light having a light emission time of less than one picosecond). Alternatively, the processing light EL can not include a pulsed light. In other words, the processing light EL can be a continuous light.

[0047] The machining unit 1 can also perform removal machining that removes a portion of the workpiece W by irradiating machining light EL against the workpiece W. In the case where removal machining is performed, the machining unit 1 can also form a rib structure on the workpiece W. The rib structure can also include a structure that is capable of reducing the resistance (particularly at least one of the frictional resistance and the turbulent frictional resistance) of the surface of the workpiece W to a fluid. The rib structure can also include a structure that is capable of reducing the noise generated when a fluid moves relative to the surface of the workpiece W. The rib structure can also include, for example, a structure in which a plurality of grooves that extend along a first direction (for example, the Y-axis direction) along the surface of the workpiece W are arranged along the surface of the workpiece W and along a second direction (for example, the X-axis direction) that intersects the first direction. In addition, the fluid referred to here is a medium (for example, at least one of a gas and a liquid) that flows relative to the surface of the workpiece W. For example, in the case where the medium itself is stationary, the medium can also be referred to as a fluid in the case where the surface of the workpiece W moves relative to the medium. In addition, the state in which the medium is stationary can also refer to a state in which the medium does not move relative to a prescribed reference (for example, the ground surface).

[0048] In the case of removal processing, the machining system SYSa can also form arbitrary structures of arbitrary shapes on the surface of the workpiece W. As an example of an arbitrary structure, a structure that generates vortices in the flow of fluid on the surface of the workpiece W can be listed. As another example of an arbitrary structure, a structure used to impart hydrophobicity to the surface of the workpiece W can be listed. As yet another example of an arbitrary structure, a micro-nanoscale fine texture structure (typically an uneven structure) formed regularly or irregularly can be listed. The fine texture structure may also include at least one of a sharkskin structure and a dimple structure that reduces resistance caused by fluids (gases and / or liquids). The fine texture structure may also include a lotus surface structure that has at least one of hydrophobic and self-cleaning functions (e.g., exhibiting a lotus effect). The fine texture structure may also include at least one of the following: a fine protrusion structure with liquid transport function (refer to U.S. Patent Publication No. 2017 / 0044002); a texture structure with hydrophilic function; a texture structure with anti-fouling function; a moth-eye structure with at least one of reflectivity reduction and hydrophobic functions; a texture structure that enhances light of a specific wavelength through interference to produce structural color; a pillar array structure with adhesive function utilizing van der Waals forces; a texture structure with aerodynamic noise reduction function; a honeycomb structure with droplet trapping function; a texture structure that improves adhesion to layers formed on the surface; and a texture structure for reducing frictional resistance. Here, the fine texture structure may not have a specific function. Furthermore, the machining system SYSa may also smooth the surface of the workpiece W. Here, surface smoothing may also refer to machining the surface to make the machined surface smoother than the unmachined surface. Moreover, the machining system SYSa may also remove burrs present on the surface of the workpiece W.

[0049] As an example of a workpiece W that has undergone removal processing (e.g., forming a rib structure through removal processing), examples can be cited. FIG. 3 The turbine WT is shown. (As shown) FIG. 3As shown, the turbine WT can also include a disc-shaped rotary body RT rotatable about a rotary axis RX, and a plurality of turbine blades BL extending radially from an outer circumferential surface of the rotary body RT. In this case, the machining unit 1 can also form the rib structure on at least a portion of the surfaces of the plurality of turbine blades BL. The machining unit 1 can also form the rib structure on at least a portion of the surface of the rotary body RT. Further, although not shown, as another example of the workpiece W subjected to the removal machining, a fan or a propeller can be cited. The fan is a member for forming an air current, which is used in a blower or the like. The propeller is a member for converting a rotational force output from a prime mover including at least one of an engine and a motor into a propulsive force of a moving body including at least one of an airplane and a ship or the like, for example. Also, although not shown, as another example of the workpiece W subjected to the removal machining, a mold can be cited. In this case, the mold formed by the removal machining can also be used for forming at least one of a film and a resin-made part or the like having the rib structure (or another structure) on the surface. Further, the workpiece W is not limited to the objects exemplified here.

[0050] The machining unit 1 can also perform additive machining of irradiating the machining light EL to the workpiece W to add a new structure to the workpiece W, in addition to or instead of the removal machining. In this case, the machining unit 1 can also form the rib structure on the surface of the workpiece W by performing the additive machining. The machining unit 1 can also perform marking machining of irradiating the machining light EL to the workpiece W to form a desired mark on the surface of the workpiece W, in addition to or instead of at least one of the removal machining and the additive machining.

[0051] In order to machine the workpiece W, the machining unit 1 includes a machining light source 11 that generates the machining light EL, a machining head 12, and a head drive system 13.

[0052] The machining head 12 irradiates the machining light EL from the machining light source 11 to the workpiece W. The machining head 12 machines the workpiece W by irradiating the machining light EL to the workpiece W. Therefore, the machining head 12 can also be referred to as a machining device. In order to irradiate the machining light EL to the workpiece W, the machining head 12 includes an irradiation optical system 121. The machining head 12 irradiates the machining light EL to the workpiece W via the irradiation optical system 121. The irradiation optical system 121 can also condense the machining light EL to the surface of the workpiece W, for example. The irradiation optical system 121 can also control an optical property of the machining light EL, for example. As an example of the optical property of the machining light EL, at least one of an intensity of the machining light EL, a temporal change in the intensity of the machining light EL, a condensing position of the machining light EL, an incident angle of the machining light EL with respect to the workpiece W, a shape of the machining light EL in an optical plane intersecting an optical axis of the irradiation optical system 121, an intensity distribution of the machining light EL in the optical plane, and a number of pulses of the machining light (in the case where the machining light is pulsed light) can be cited.

[0053] The head driving system 13 moves the machining head 12 in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction under the control of the control device 4. In addition, the head driving system 13 can move the machining head 12 in at least one of the θX direction, the θY direction, and the θZ direction in addition to or instead of at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. When the machining head 12 moves, the positional relationship between the stage 32 (and further, the workpiece W placed on the stage 32) described later and the machining head 12 changes. Further, when the positional relationship between the stage 32 and the workpiece W and the machining head 12 changes, the irradiation position of the machining light EL on the workpiece W changes.

[0054] The measurement unit 2 includes a measurement head 21 and a head driving system 22. The measurement head 21 includes measurement devices 211 and 212. However, the measurement head 21 can include either one of the measurement devices 211 and 212, or neither of the measurement devices 211 and 212.

[0055] Each of the measurement devices 211 and 212 can measure the state of a measurement target. In the present embodiment, an example in which the measurement target is at least a portion of the workpiece W is described. However, the measurement target can include an object other than the workpiece W. In this case, each of the measurement devices 211 and 212 can measure the state of at least a portion of the workpiece W. The measurement result obtained by each of the measurement devices 211 and 212 measuring at least a portion of the workpiece W (hereinafter, appropriately referred to as "workpiece measurement information") is output from the measurement unit 2 to the control device 4.

[0056] The state of the workpiece W can include the position of the workpiece W. The position of the workpiece W can include the position of the surface of the workpiece W. The position of the surface of the workpiece W can include the position of each surface portion into which the surface of the workpiece W is subdivided in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The position of the surface of the workpiece W can include the position of each surface portion into which the surface of the workpiece W is subdivided in at least one of the θX direction, the θY direction, and the θZ direction. In addition, the position of each surface portion in at least one of the θX direction, the θY direction, and the θZ direction can be considered equivalent to the posture of each surface portion (i.e., the direction of each surface portion (for example, the direction of the normal line of each surface portion), which is substantially equivalent to the amount of inclination of each surface portion with respect to at least one of the X-axis, the Y-axis, and the Z-axis). In this case, the state of the workpiece can be said to substantially include the shape of the workpiece W. Furthermore, the state of the workpiece W can include the size of the workpiece W (for example, the size in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction).

[0057] Also, each of the measurement devices 211 and 212 can measure a three-dimensional shape of at least a part of the workpiece W as the shape of at least a part of the workpiece W. Also, each of the measurement devices 211 and 212 can measure a two-dimensional shape of at least a part of the workpiece W. Also, each of the measurement devices 211 and 212 can measure a one-dimensional shape (i.e., a length) of at least a part of the workpiece W.

[0058] The measurement accuracy (in other words, the measurement resolution) of the measurement device 211 is different from the measurement accuracy of the measurement device 212. In the first embodiment, an example in which the measurement accuracy of the measurement device 212 is lower than the measurement accuracy of the measurement device 211 is described. In the case where the measurement accuracy of the measurement device 212 is lower than the measurement accuracy of the measurement device 211, the measurement device 212 can be a measurement device that measures a relatively wide range with relatively low measurement accuracy (in other words, roughly or coarsely), the measurement device 211 can be a measurement device that measures a relatively narrow range with relatively high measurement accuracy (in other words, precisely or finely), the measurement device 212 can be a wide-range measurement device, and the measurement device 211 can be a narrow-range measurement device. The measurement device 211 can also take longer to perform measurement than the measurement device 212. Specifically, the measurement device 211 can also take longer to perform measurement of a part of one measurement target than the measurement device 212 to perform measurement of the same part of the same measurement target. However, the measurement accuracy of the measurement device 211 can also be the same as the measurement accuracy of the measurement device 212.

[0059] Further, the measurement accuracy can refer to a limit value of the fineness of measurement (for example, an index value for evaluating the smallest size that can be measured). The measurement accuracy can also refer to the magnitude of measurement error with respect to the size (for example, the length) of the measurement target (at this time, the smaller the measurement error with respect to the size of the measurement target, the higher the measurement accuracy). In the case where the measurement result is obtained as dot data, the measurement error can refer to the deviation accuracy of the dot. In the case where the measurement action is performed a plurality of times, the measurement accuracy can refer to the deviation of the measurement results of the plurality of measurement actions (in other words, the accuracy of repeated measurement). The measurement accuracy can also refer to other accuracies.

[0060] The measurement devices 211 and 212 each non-contactly measure a state of at least a portion of the workpiece W. For example, the measurement devices 211 and 212 each can also include an optical measurement device capable of optically measuring a state of at least a portion of the workpiece W. As an example of the optical measurement device, at least one of a photographing device (i.e., a camera) that can photograph the workpiece W, a measurement device using an optical section method that projects a slit light to a surface of the workpiece W and measures a shape of the projected slit light, a measurement device using a pattern projection method that projects a light pattern to the surface of the workpiece W and measures a shape of the projected pattern, a measurement device using a time-of-flight method that projects light to the surface of the workpiece W at a plurality of positions on the workpiece W and measures a distance to the workpiece W from a time until the projected light returns, an equal-height cloud method (specifically, a grating irradiation method or a grating projection method), a holographic interference method, a collimation method, a stereoscopic method, a coma method, a critical angle method, an edge method, an interferometric measurement method, and a confocal method can be listed. In any case, the measurement devices 211 and 212 each can also include a light receiver that receives light from at least a portion of the workpiece W. The light received by the light receiver from at least a portion of the workpiece W can include light (e.g., at least one of reflected light, scattered light, and transmitted light of the measurement light) due to measurement light that is irradiated to the workpiece W for measuring a state of the workpiece W. The light received by the light receiver from at least a portion of the workpiece W can also include light (e.g., light from the workpiece W that is irradiated with ambient light) due to ambient light.

[0061] The measurement device 211 can measure at least a portion of the workpiece W included in a measurement field of view (in other words, a measurable range) of the measurement device 211. On the other hand, the measurement device 211 cannot measure at least a portion of the workpiece W not included in the measurement field of view of the measurement device 211. Here, the measurement field of view can refer to a region that satisfies a condition that the light receiver of the measurement device 211 can receive light from an object included in the measurement field of view. Further, with respect to the measurement device 212, as with the measurement device 211, at least a portion of the workpiece W included in a measurement field of view of the measurement device 212 can be measured, and on the other hand, at least a portion of the workpiece W not included in the measurement field of view of the measurement device 212 cannot be measured.

[0062] The size of the measurement field of the measurement device 211 is different from the size of the measurement field of the measurement device 212. In the first embodiment, an example in which the size of the measurement field of the measurement device 212 is larger than the size of the measurement field of the measurement device 211 is described. At this time, the measurement field of the measurement device 211 can also be included in the measurement field of the measurement device 212. In the case where the measurement field of the measurement device 211 is included in the measurement field of the measurement device 212, the measurement device 212 is able to measure the state of at least a portion of the workpiece W that cannot be measured by the measurement device 211. However, the size of the measurement field of the measurement device 212 can also be smaller than the size of the measurement field of the measurement device 211. The size of the measurement field of the measurement device 212 can also be the same as the size of the measurement field of the measurement device 211. At least a portion of the measurement field of the measurement device 211 can also not be included in at least a portion of the measurement field of the measurement device 212.

[0063] The head driving system 22 moves the measurement head 21 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction under the control of the control device 4. That is, the measurement head 21 (more specifically, each of the measurement devices 211 and 212 included in the measurement head 21) can be moved by the head driving system 22. Further, moving the measurement head 21 in at least one of the θX direction, the θY direction, and the θZ direction can also be regarded as equivalent to changing the posture of the measurement head 21 around at least one of the X-axis, the Y-axis, and the Z-axis. Alternatively, moving the measurement head 21 in at least one of the θX direction, the θY direction, and the θZ direction can also be regarded as equivalent to rotating (or rotationally moving) the measurement head 21 around at least one of the X-axis, the Y-axis, and the Z-axis. When the measurement head 21 is moved, the positional relationship between the stage 32 (further, the workpiece W placed on the stage 32) and the measurement head 21 changes. Further, when the positional relationship between the stage 32 and the workpiece W and the measurement head 21 changes, the positional relationship between the stage 32 and the workpiece W and the measurement fields of the measurement devices 211 and 212 changes.

[0064] The stage unit 3 includes a table plate 31, a stage 32, and a stage driving system 33.

[0065] The table plate 31 is placed on the bottom surface of the frame 5 (or a support surface such as a floor surface on which the frame 5 is placed). The stage 32 is disposed on the table plate 31. An unillustrated antivibration device for reducing the transmission of vibration of the table plate 31 to the stage 32 can also be provided between the bottom surface of the frame 5 or the support surface such as the floor surface on which the frame 5 is placed and the table plate 31. Further, the stage 32 can also be a structure that is supported on the table plate 31 by floating using an air bearing.

[0066] The work W is placed on the stage 32. The stage 32 can also not hold the work W placed on the stage 32. That is, the stage 32 can also not apply a holding force for holding the work W placed on the stage 32. Alternatively, the stage 32 can also hold the work W placed on the stage 32. That is, the stage 32 can also apply a holding force for holding the work W placed on the stage 32. For example, the stage 32 can also hold the work W by vacuum chucking and / or electrostatic chucking the work W.

[0067] The stage driving system 33 moves the stage 32 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. Further, moving the stage 32 in at least one of the θX direction, the θY direction, and the θZ direction can also be regarded as equivalent to changing the posture of the stage 32 (further, the work W placed on the stage 32) around at least one of the X-axis, the Y-axis, and the Z-axis. Alternatively, moving the stage 32 in at least one of the θX direction, the θY direction, and the θZ direction can also be regarded as equivalent to rotating (or rotationally moving) the stage 32 around at least one of the X-axis, the Y-axis, and the Z-axis.

[0068] When the stage 32 moves, the positional relationship of the stage 32 (further, the work W placed on the stage 32) with each of the machining head 12 and the measurement head 21 changes. Thus, moving the stage 32 is equivalent to changing the positional relationship of each of the stage 32 and the work W with each of the machining head 12 and the measurement head 21. Further, when the positional relationship of the work W with the machining head 12 changes, the irradiation position of the machining light EL on the work W changes. Further, when the positional relationship of the work W with the measurement head 21 changes, the positional relationship of the work W with the measurement fields of the measurement devices 211 and 212 changes.

[0069] The control device 4 controls the operation of the machining system SYSa. For example, the control device 4 can generate machining control information for machining the work W, and control at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 based on the machining control information to machine the work W in accordance with the generated machining control information. That is, the control device 4 can control the machining of the work W. For example, the control device 4 can generate measurement control information for measuring the work W, and control at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 based on the measurement control information to measure the work W in accordance with the generated measurement control information. That is, the control device 4 can control the measurement of the work W.

[0070] The control device 4 may, for example, also include an arithmetic device and a storage device. The arithmetic device may, for example, also include at least one of a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU). The control device 4 functions as a device that controls the operation of the machining system Sys a by executing a computer program with the arithmetic device. The computer program is a computer program for causing the control device 4 (for example, the arithmetic device) to perform (that is, execute) the operation described later that the control device 4 should perform. That is, the computer program is a computer program for causing the control device 4 to function so as to cause the machining system Sys a to perform the operation described later. The computer program executed by the arithmetic device can be recorded in the storage device (that is, a recording medium) included in the control device 4, or in any storage medium (for example, a hard disk or a semiconductor memory) built in the control device 4 or externally attachable to the control device 4. Alternatively, the arithmetic device can download the computer program to be executed from a device external to the control device 4 via a network interface.

[0071] The control device 4 can also be provided outside the machining system SYSa. For example, the control device 4 can be provided as a server or the like outside the machining system SYSa. In this case, the control device 4 and the machining system SYSa can be connected by a wired and / or wireless network (or a data bus and / or a communication line). As the wired network, for example, a network using an interface of a serial bus system typified by at least one of Institute of Electrical and Electronics Engineers (IEEE) 1394, RS-232x, RS-422, RS-423, RS-485, and Universal Serial Bus (USB) can be used. As the wired network, a network using an interface of a parallel bus system can be used. As the wired network, a network using an interface complying with Ethernet (registered trademark) typified by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T can be used. As the wireless network, a network using radio waves can be used. As an example of the network using radio waves, a network complying with IEEE 802. lx (for example, at least one of a wireless Local Area Network (LAN) and Bluetooth (registered trademark)) can be cited. As the wireless network, a network using infrared rays can be used. As the wireless network, a network using optical communication can be used. In this case, the control device 4 and the machining system SYSa can be configured to transmit and receive various information via the network. Further, the control device 4 can be able to transmit information such as a command or a control parameter to the machining system SYSa via the network. The machining system SYSa can include a reception device that receives information such as a command or a control parameter from the control device 4 via the network. Alternatively, a first control device that performs a part of the processing performed by the control device 4 can be provided inside the machining system SYSa, and a second control device that performs another part of the processing performed by the control device 4 can be provided outside the machining system SYSa.

[0072] In addition, as the recording medium of the computer program executed by the recording operation device, at least one of a compact disc read only memory (CD-ROM), a compact disc-recordable (CD-R), a compact disc-rewritable (CD-RW), a floppy disk, a magneto-optical disc (MO), a digital versatile disc read only memory (DVD-ROM), a digital versatile disc random access memory (DVD-RAM), a digital versatile disc-recordable (DVD-R), DVD+R, a digital versatile disc-rewritable (DVD-RW), DVD+RW, a Blu-ray (registered trademark), and the like, a magnetic medium such as a magnetic tape, an optical magnetic disc, a semiconductor memory such as a USB memory, and any medium in which a program can be saved can be used. The recording medium can also include a machine in which a computer program can be recorded (for example, a general-purpose machine or a dedicated machine installed with a computer program in a state capable of executing at least one of software and firmware). Furthermore, each process or function included in the computer program can be implemented by a logical processing block implemented in the control device 4 (that is, a computer) by executing the computer program, by hardware such as a prescribed gate array (FPGA, ASIC) included in the control device 4, or by a form in which a logical processing block and a partial hardware module implementing a part of the hardware coexist.

[0073] (1-2) Action of processing system SYSa

[0074] Next, the operation of the machining system SYSa will be described. As described above, the machining system SYSa machines the workpiece W. That is, the machining system SYSa performs a machining operation for machining the workpiece W. Also, the machining system SYSa measures the workpiece W. That is, the machining system SYSa performs a measurement operation for measuring the workpiece W. Therefore, hereinafter, the machining operation and the measurement operation will be described in order.

[0075] (1-2-1) Processing action

[0076] First, the machining operation for machining the workpiece W will be described. In the first embodiment, the machining system SYSa performs at least one of a first machining operation to a sixth machining operation. Therefore, the first machining operation to the sixth machining operation will be described in order below.

[0077] (1-2-1-1) First processing action

[0078] First, the first machining operation will be described with reference to FIG. 4 to FIG. 8. FIG. 4 is a flowchart showing a flow of the first machining operation.

[0079] As shown in FIG. 4 , first, the workpiece W is placed on the stage 32 (step Sll). The workpiece W can be placed on the stage 32 by an operator of the machining system SYSa, for example. At this time, the machining system SYSa can also prompt the operator for information related to a target placement position at which the workpiece W should be placed on the stage 32. For example, the machining system SYSa can also prompt the operator for information related to the target placement position by forming a mark (e.g., a mark formed by a light emitting member such as a light emitting diode (LED)) indicating the target placement position on the stage 32. The operator can place the workpiece W at the target placement position based on the prompted information. Alternatively, the workpiece W can be placed on the stage 32 by a transfer robot or the like.

[0080] Subsequently, the processing system SYSa corrects a placement error of the workpiece W (step S12). Further, the placement error corresponds to an amount of deviation between a target placement position at which the workpiece W should be placed on the stage 32 and an actual placement position at which the workpiece W is actually placed on the stage 32. In order to correct the placement error, first, at least one of the measuring devices 211 and 212 measures a state of the workpiece W. Specifically, at least one of the measuring devices 211 and 212 measures a position of the workpiece W on the stage 32. Here, at least one of the measuring devices 211 and 212 can also measure a position with respect to a portion of the workpiece W. The portion of the workpiece W can also include a characteristic point of the workpiece W. As a result, the control device 4 can generate information related to the actual placement position based on the workpiece measurement information. Also, the target placement position is generally information known to the control device 4. Therefore, the control device 4 calculates the placement error based on the information related to the actual placement position included in the workpiece measurement information and the information related to the target placement position as known information. Subsequently, the control device 4 determines whether the placement error is greater than a prescribed allowable threshold TH1. If it is determined that the placement error is greater than the allowable threshold TH1, the control device 4 can also perform an operation of urging an operator to re-place the workpiece W. As a result, correction is performed so that the placement error becomes zero or smaller. However, in the case where the processing system SYSa includes a workpiece moving device for moving the workpiece W on the stage 32, the control device 4 can also control the workpiece moving device to correct the placement error. However, the processing system SYSa can also not perform the operation of step S12.

[0081] Subsequently, the measuring device 212 measures a shape of at least a portion of the workpiece W (step S13). Specifically, the measuring device 212 measures a shape of at least a portion of the workpiece W included in a measurement field of view of the measuring device 212 (step S13). As a result, the control device 4 can acquire, from the workpiece measurement information, information related to a measurement result of the shape of at least a portion of the workpiece W as shape-related information. Also, as described above, as the state of the workpiece W, the measuring device 212 can measure not only the shape of the workpiece W but also the position (including the posture) and the dimensions of the workpiece W, respectively. Therefore, in the first embodiment, the operation of measuring the shape of at least a portion of the workpiece W can also be regarded as equivalent to the operation of measuring the state of at least a portion of the workpiece W. At this time, the control device 4 can also acquire, from the workpiece measurement information, information related to a measurement result of the position of at least a portion of the workpiece W and information related to a measurement result of the dimensions of at least a portion of the workpiece W. Further, in step S13, the measuring device 211 can also measure the shape of at least a portion of the workpiece W instead of or in addition to the measuring device 212.

[0082] Here, since the workpiece W is a three-dimensional object, not all of its surface is necessarily included within the measurement field of view of the measuring device 212. That is, it is possible that a portion of the surface of the workpiece W is included within the measurement field of view of the measuring device 212, while another portion is not. In other words, when the measuring device 212 measures the shape of a portion of the surface of the workpiece W, the other portion of the surface may be located in a blind spot that the measuring device 212 cannot measure.

[0083] For example, FIG. 5 This describes a measuring device 212 used to measure the shape of a turbine WT, an example of a workpiece W. Here, with the positional relationship between the measuring device 212 and the workpiece W unchanged (i.e., fixed), it is possible that the shape of the first region W1 of the workpiece W... FIG. 5 Light from the area shown by the solid line in the middle can reach the measuring device 212, while light from the second area W2 of the workpiece W (shown by the solid line in the middle) can reach the measuring device 212. FIG. 5 Light from the area shown by the dashed line in the image cannot reach the measuring device 212. Specifically, for example, there is a possibility that light from the first area W1 of the surface portion of the surface containing the workpiece W facing the measuring device 2 can reach the measuring device 212, while light from the second area W2 of the surface portion of the surface containing the workpiece W facing the opposite side to the measuring device 2 cannot reach the measuring device 212. For example, there is a possibility that light from the first area W1 of the surface portion of the surface containing the workpiece W facing the outer side when viewed from the measuring device 2 can reach the measuring device 212, while light from the second area W2 of the surface portion of the surface containing the workpiece W facing the inner side when viewed from the measuring device 2 cannot reach the measuring device 212. For example, there is a possibility that light from the first area W1 of the surface portion of the surface containing the workpiece W where there is no obstacle (e.g., part of the workpiece W or an object different from the workpiece W) between it and the measuring device 212 can reach the measuring device 212, while light from the second area W2 of the surface portion of the surface containing the workpiece W where there is an obstacle between it and the measuring device 212 cannot reach the measuring device 212. Furthermore, as FIG. 5 As shown, typically, the first region W1 and the second region W2 are adjacent to each other.

[0084] The state in which the positional relationship between the measurement device 212 and the workpiece W is constant can also be considered equivalent to a state in which each of the measurement device 212 and the workpiece W is positioned at a fixed position within the machining system SYSa. The state in which the positional relationship between the measurement device 212 and the workpiece W is constant can also be considered equivalent to a state in which the measurement device 212 is disposed at a first prescribed position within the machining system SYSa and the workpiece W is disposed at a second prescribed position within the machining system SYSa. Furthermore, the "position" in the first embodiment can also include a position in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. Alternatively, the "position" in the first embodiment can also include a position (so-called attitude) in at least one of the θX direction, the θY direction, and the θZ direction in addition to or instead of a position in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0085] In this way, the state in which light from the first region W1 is able to reach the measurement device 212 and, on the other hand, light from the second region W2 is unable to reach the measurement device 212 is equivalent to a state in which the first region W1 is included within the measurement field of view of the measurement device 212 and, on the other hand, the second region W2 is not included within the measurement field of view of the measurement device 212. In other words, the state in which light from the first region W1 is able to reach the measurement device 212 and, on the other hand, light from the second region W2 is unable to reach the measurement device 212 is equivalent to a state in which the first region W1 is included within the measurement field of view of the measurement device 212 and, on the other hand, the second region W2 is positioned in a dead angle region that is unable to be measured by the measurement device 212.

[0086] At this time, the control device 4 can acquire information related to the shape of the first region Wl based on the workpiece measurement information. Alternatively, the control device 4 can acquire information related to at least one of the position and the size of the first region Wl in addition to the information related to the shape of the first region Wl based on the workpiece measurement information. On the other hand, the control device 4 cannot acquire information related to the shape (further, the position and the size) of the second region W2 based on the workpiece measurement information. At this time, the machining system SYSa can change the positional relationship between the measurement device 212 and the workpiece W so that at least a part of the second region W2 is included in the measurement field of view of the measurement device 212 in order to acquire information related to the shape and the like of the second region W2, and then measure the shape and the like of at least a part of the second region W2 using the measurement device 212. However, even in this case, there is a possibility that a part of the second region W2 is not included in the measurement field of view of the measurement device 212. Therefore, the machining system SYSa must repeat the operation of changing the positional relationship between the measurement device 212 and the workpiece W and then measuring the shape and the like of at least a part of the workpiece W using the measurement device 212 until the entire surface of the workpiece W is included in the measurement field of view of the measurement device 212 (i.e., the entire surface shape and the like of the workpiece W is measured by the measurement device 212). Therefore, a relatively long time is required to acquire information related to the state of the workpiece W on the stage 32 (i.e., the shape, the position, and the size of the workpiece W) (hereinafter referred to as "workpiece information"). As a result, the productivity related to the machining of the workpiece W can be deteriorated. Further, the workpiece information can include a measurement error caused by repeatedly changing the positional relationship between the measurement device 212 and the workpiece W while measuring the shape and the like of at least a part of the workpiece W. Moreover, even if the positional relationship between the measurement device 212 and the workpiece W is changed, there is a possibility that the entire surface shape and the like of the workpiece W cannot be measured by the measurement device 212 depending on the shape of the workpiece W.

[0087] Therefore, in the first embodiment, the control device 4 acquires information about the shape of the second region W2 and the like by a method different from a method of measuring the entire shape of the work W and the like using the measuring device 212. That is, the control device 4 acquires information about the shape of the second region W2 and the like without measuring the entire shape of the second region W2 and the like using the measuring device 212. Specifically, the control device 4 acquires information about the shape of the second region W2 from model information of a three-dimensional model (hereinafter referred to as "work model WM") representing at least a portion of the work W. The work model WM is, for example, a three-dimensional model having a shape identical to or similar to an ideal or designed shape of the work W. Alternatively, the work model WM can be, for example, a three-dimensional model generated based on information about the shape of the work W obtained by measuring the work W using a prescribed measuring method. Since the control device 4 acquires information about the shape of the second region W2 from the model information, the model information can include at least information representing the shape of the second region W2 (for example, information of a three-dimensional model representing the second region W2). Further, in a case where the work W is processed with a fine structure, the work model WM can be a shape model not including the fine structure. Also, in a case where the work model WM is used for inspection after processing, the work model WM can be a shape model reflecting the fine structure.

[0088] Here, if the model information represents a three-dimensional model of the work W, it can also be considered that the control device 4 can use the model information itself as the work information without using the work measurement information. However, the model information is ultimately information representing an ideal or designed shape of the work W. The model information is ultimately information representing a shape of the work W measured at a certain point in time. Therefore, the model information contains only information about the shape of the work W. That is, the model information does not contain information about the position and size of the work W on the stage 32. In addition to this, the shape of the work W actually placed on the stage 32 can not necessarily coincide with the shape of the work W shown by the model information. Therefore, the model information is information not reflecting the actual shape of the work W actually placed on the stage 32 at all.

[0089] Therefore, in the present embodiment, the control device 4 generates workpiece information including information about the state (i.e., shape, position, and size) of each of the first region Wl and the second region W2 on the stage 32, using both the model information and the workpiece measurement information (step S14). In order to generate the workpiece information using both the model information and the workpiece measurement information, the control device 4 first acquires the workpiece measurement information from the measurement device 212. Further, the control device 4 acquires the model information. The model information can also be recorded in a storage (i.e., recording medium) included in the control device 4. The model information can also be recorded in any recording medium (e.g., a hard disk or a semiconductor memory) built in the control device 4 or externally provided to the control device 4. At this time, the control device 4 can also acquire the model information by reading out the model information from these recording media as necessary. The model information can also be recorded in a device external to the control device 4. The model information can also be recorded in a device (e.g., a server, a database, or any other information processing device) external to the machining system SYSa. At this time, the control device 4 can also acquire the model information by downloading the workpiece model data from the external device as necessary. In addition, the model information can also be recorded in the recording medium or the like by a user or an operator of the machining system SYSa.

[0090] Subsequently, the control device 4 correlates the workpiece measurement information with the model information, thereby generating the workpiece information. Specifically, the control device 4 performs a positioning process for positioning the workpiece model WM shown by the model information at the position of at least a portion of the workpiece W shown by the workpiece measurement information in a three-dimensional coordinate system, i.e., a measurement coordinate system, used for determining the position of the workpiece W measured by the measurement device 212. That is, the control device 4 performs a positioning process of translating, enlarging, reducing, and / or rotating the workpiece model WM in the measurement coordinate system, thereby bringing the workpiece model WM close to the workpiece W shown by the workpiece measurement information. When the positioning process is completed, the shape, position, and size of the workpiece model WM in the measurement coordinate system can be regarded as substantially equivalent to those of the workpiece W in the measurement coordinate system, respectively. That is, the shape, position, and size of the workpiece model WM in the measurement coordinate system can be regarded as substantially equivalent to those of the workpiece W on the stage 32, respectively. Therefore, the control device 4 can generate the workpiece information based on the result of the positioning process.

[0091] The information on the shape, position, and size of the portion of the workpiece model WM corresponding to the first region Wl is considered to be equivalent to the information on the shape, position, and size of the first region Wl of the workpiece W contained in the workpiece measurement information. On the other hand, the workpiece measurement information is information obtained by actually measuring the workpiece W. Therefore, it is assumed that the reliability of the workpiece measurement information is higher than that of the model information. Therefore, the control device 4 can also generate the workpiece information containing information on at least one of the shape, position, and size of the workpiece W by synthesizing the information on at least one of the shape, position, and size of the first region Wl of the workpiece W contained in the workpiece measurement information and the information on at least one of the shape, position, and size of the portion of the workpiece model WM corresponding to the second region W2. Specifically, the control device 4 acquires information on at least one of the shape, position, and size of the first region Wl of the workpiece W from the workpiece measurement information. The control device 4 acquires information on at least one of the shape, position, and size of the portion of the workpiece model WM corresponding to the second region W2 from the result of the alignment process. Subsequently, the control device 4 generates the workpiece information using the information on at least one of the shape, position, and size of the portion of the workpiece model WM corresponding to the second region W2 as information on at least one of the shape, position, and size of the second region W2 of the workpiece W. That is, it can be said that in the first embodiment, the control device 4 generates the workpiece information using the workpiece measurement information in principle, and supplements information insufficient to generate the workpiece information (i.e., information necessary to generate the workpiece information but not contained in the workpiece measurement information) by the model information.

[0092] Alternatively, the control device 4 can also generate (in other words, can also calculate) the information on the state of the second region W2 of the workpiece W based on the information on the state of the first region Wl of the workpiece W calculated from the workpiece measurement information and the information on the state of the portion of the workpiece model WM corresponding to the second region W2, instead of directly using the information on the state (i.e., the shape, position, and size) of the portion of the workpiece model WM corresponding to the second region W2 as the information on the state of the second region W2 of the workpiece W. For example, as described above, the first region Wl and the second region W2 are generally contiguous. Therefore, it is assumed that the possibility that the state of the first region Wl and the state of the second region W2 differ greatly to an unnatural degree at the boundary between the first region Wl and the second region is relatively low. Therefore, at the boundary between the first region Wl and the second region, if the state of the first region Wl shown by the workpiece measurement information and the state of the second region W2 shown by the result of the alignment process differ greatly to an unnatural degree, it is possible that the reliability of either one of the state of the first region Wl shown by the workpiece measurement information and the state of the second region W2 shown by the result of the alignment process is low. Here, as described above, it is assumed that the reliability of the workpiece measurement information is higher than that of the model information. Therefore, the control device 4 can also regard the state of the first region Wl shown by the workpiece measurement information as a true value, and correct the information on the state of the second region W2 shown by the result of the alignment process based on the information on the state of the first region Wl shown by the workpiece measurement information. At this time, the control device 4 can also generate the workpiece information by synthesizing the information on the state of the first region Wl shown by the workpiece measurement information and the corrected information on the state of the second region W2. At this time, it can also be regarded that the control device 4 generates the information on the state of the second region W2 to be included in the workpiece information based on the information on the state of the first region Wl shown by the workpiece measurement information and the information on the state of the second region W2 shown by the result of the alignment process.

[0093] An example of the operation of correcting the information on the state of the second region W2 will be described with reference to (a) of FIG. 10 and (b) of FIG. 10. FIG. 6 FIG. 6 As described above, the control device 4 can also generate the workpiece information by synthesizing the information on the state of the first region Wl shown by the workpiece measurement information and the information on the state of the second region W2 shown by the result of the alignment process. At this time, it can also be regarded that the control device 4 generates the information on the state of the second region W2 to be included in the workpiece information based on the information on the state of the first region Wl shown by the workpiece measurement information and the information on the state of the second region W2 shown by the result of the alignment process. FIG. 6 ​(a) and (b) of FIG. 10, the control device 4 can generate the average value (= (100 + 80) / 2 = 90) of the position coordinate in the Z-axis direction of the first region W1 (= 100) indicated by the workpiece measurement information and the position coordinate in the Z-axis direction of the second region W2 (= 80) indicated by the result of the alignment process, as the position coordinate in the Z-axis direction of the second region W2 to be included in the workpiece information. FIG. 6 (a) and (b) of FIG. 10, the control device 4 can generate the average value (= (100 + 80) / 2 = 90) of the position coordinate in the Z-axis direction of the first region W1 (= 100) indicated by the workpiece measurement information and the position coordinate in the Z-axis direction of the second region W2 (= 80) indicated by the result of the alignment process, as the position coordinate in the Z-axis direction of the second region W2 to be included in the workpiece information.

[0094] As a part of the alignment process, the control device 4 can also perform a pattern matching process. Hereinafter, a specific example of the alignment process including the pattern matching process will be described. The control device 4 extracts feature points of the workpiece W, i.e., measurement feature points, based on the workpiece measurement information. The control device 4 extracts a plurality of (e.g., three or more) measurement feature points. Since the workpiece measurement information includes information related to the state of the first region W1, on the other hand, it does not include information related to the state of the second region W2, the control device 4 extracts a plurality of measurement feature points from the first region W1 of the workpiece W. Further, the feature points can include, for example, at least one of an edge, a vertex, a corner, and an end portion of an object. Furthermore, the control device 4 extracts a plurality of feature points of the workpiece model WM, i.e., workpiece model feature points, corresponding to the measurement feature points, based on the workpiece model WM. In particular, the control device 4 extracts a plurality of (e.g., three or more) workpiece model feature points. The control device 4 extracts a plurality of workpiece model feature points from a portion of the workpiece model WM corresponding to the first region W1. Subsequently, the control device 4 performs pattern matching between the workpiece model WM and the workpiece W indicated by the workpiece measurement information, based on the workpiece model feature points and the measurement feature points. Specifically, the control device 4 performs pattern matching between the workpiece model WM and the workpiece W indicated by the workpiece measurement information, as conceptually represented by a conceptual diagram of FIG. 11. FIG. 7As shown, the control device 4 translates, enlarges, reduces, and / or rotates the workpiece model WM so that the workpiece model feature points approach the measurement feature points. The control device 4 translates, enlarges, reduces, and / or rotates the workpiece model WM until the deviation of the workpiece model feature points from the measurement feature points becomes equal to or less than a prescribed amount (typically, equal to or less than a minimum value). As a result, in the measurement coordinate system, the shape of the portion of the workpiece model WM corresponding to the first region W1 is identical to the shape of the first region W1 of the workpiece W shown in the workpiece measurement information, the position of the portion of the workpiece model WM corresponding to the first region W1 is identical to the position of the first region W1 of the workpiece W shown in the workpiece measurement information, and the size of the portion of the workpiece model WM corresponding to the first region W1 is identical to the size of the first region W1 of the workpiece W shown in the workpiece measurement information. Thus, as a result of the alignment processing, the control device 4 can determine the shape, position, and size of the portion of the workpiece model WM corresponding to the second region W2 as the shape, position, and size of the second region W2 of the workpiece W on the stage 32 in the measurement coordinate system.

[0095] The control device 4 can also perform the alignment processing using any algorithm for performing alignment processing. As an example of such an algorithm, the Interative Closest Point (ICP) algorithm for performing alignment of a plurality of point clouds (e.g., a point cloud including the workpiece model feature points and a point cloud including the measurement feature points) can be cited.

[0096] Again in the case where the workpiece information is generated in step S14, FIG. 4 Subsequently, the control device 4 generates machining control information based on the workpiece information generated in step S14 (step S15). The machining control information can also include information for controlling at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 by the control device 4 to machine the workpiece W.

[0097] The machining control information can also include machining path information. The machining path information can also include information related to a movement trajectory of an irradiation region of the machining light EL on the workpiece W, i.e., a tool path. As described above, the irradiation region of the machining light EL on the workpiece W is moved by moving the machining head 12 by the head drive system 13 and / or moving the stage 32 by the stage drive system 33. Thus, the machining path information can also be considered to be equivalent to information related to a movement trajectory of at least one of the machining head 12 and the stage 32 (workpiece W). That is, the machining path information can also be considered to be equivalent to information for moving at least one of the machining head 12 and the stage 32 (workpiece W). When at least one of the machining head 12 and the stage 32 is moved, the positional relationship of the machining head 12 and the stage 32 (workpiece W) changes. Thus, the machining path information can also be considered to be equivalent to information for changing the positional relationship of the machining head 12 and the stage 32 (workpiece W).

[0098] The workpiece information contains information relating to the shape, position, and size of the workpiece W. Therefore, the machining path information can also contain information for moving at least one of the machining head 12 and the stage 32 in cooperation with at least one of the shape, position, and size of the workpiece W. For example, as indicated by a movement trajectory of the machining head 12 that moves relatively to the workpiece W based on the machining path information, the machining head 12 can move along a movement trajectory that is parallel to the surface of the workpiece W. FIG. 8 As indicated by (a) of FIG. 10, the machining path information can also contain information for moving the machining head 12 relatively along a movement trajectory that is parallel to the surface of the workpiece W.

[0099] The process of generating the machining control information can also contain correcting the generated machining control information. For example, if the shape of the workpiece W assumed by the generated machining control information is different from the shape of the workpiece W indicated by the workpiece information, the control device 4 can also correct the generated machining control information to generate appropriate machining control information corresponding to the shape of the workpiece W indicated by the workpiece information. For example, if the size of the workpiece W assumed by the generated machining control information is different from the size of the workpiece W indicated by the workpiece information, the control device 4 can also correct the generated machining control information to generate appropriate machining control information corresponding to the size of the workpiece W indicated by the workpiece information. For example, if the position of the workpiece W assumed by the generated machining control information is different from the position of the workpiece W indicated by the workpiece information, the control device 4 can also correct the generated machining control information to become appropriate machining control information corresponding to the position of the workpiece W indicated by the workpiece information.

[0100] As an example, FIG. 9 (a) of FIG. 9 indicates a movement trajectory of the machining head 12 based on machining path information for moving the machining head 12 relatively along the surface of the workpiece W to machine the workpiece W whose surface is planar. Subsequently, the following example is described, in which the machining head 12 is moved based on the machining path information indicated by (a) of FIG. 9. FIG. 9 (a) of FIG. 9, the machining head 12 is moved based on the machining path information indicated by (a) of FIG. 9. FIG. 9 (b) of FIG. 9 indicates workpiece information indicating that the surface of the workpiece W is curved (i.e., the shape of the surface of the workpiece W is different from the assumed shape). At this time, when the machining head 12 is moved based on the generated machining path information relative to the workpiece W, the machining head 12 cannot move along a movement trajectory that is parallel to the surface of the workpiece W as indicated by (b) of FIG. 9. Therefore, the control device 4 can also correct the generated machining path information as indicated by (c) of FIG. 9 to generate machining path information for moving the machining head 12 relatively along a movement trajectory that is parallel to the surface of the workpiece W whose surface is curved. FIG. 9 (b) of FIG. 9, the machining head 12 cannot move along a movement trajectory that is parallel to the surface of the workpiece W. Therefore, the control device 4 can also correct the generated machining path information as indicated by (c) of FIG. 9 to generate machining path information for moving the machining head 12 relatively along a movement trajectory that is parallel to the surface of the workpiece W whose surface is curved. FIG. 9 (b) of FIG. 9, the machining head 12 cannot move along a movement trajectory that is parallel to the surface of the workpiece W. Therefore, the control device 4 can also correct the generated machining path information as indicated by (c) of FIG. 9 to generate machining path information for moving the machining head 12 relatively along a movement trajectory that is parallel to the surface of the workpiece W whose surface is curved.

[0101] As an example, FIG. 10(a) indicates a moving locus of the machining head 12 based on machining path information for relatively moving the machining head 12 along the surface of the workpiece W to machine the workpiece W whose surface is parallel to the XY plane. Subsequently, an example is explained in which, as shown in (a) of FIG. 10, machining path information for moving the machining head 12 has been generated in a state in which the workpiece W is inclined with respect to the XY plane (i.e., the position (attitude) of the workpiece W is different from the assumed position (attitude)). FIG. 10 FIG. 10 (b) indicates that workpiece information indicating that the surface of the workpiece W is inclined with respect to the XY plane (i.e., the position (attitude) of the workpiece W is different from the assumed position (attitude)) is generated. At this time, when the machining head 12 moves with respect to the workpiece W based on the generated machining path information, as shown in (b) of FIG. 10, the machining head 12 cannot move along the moving locus parallel to the surface of the workpiece W. Therefore, the control device 4 can also correct the generated machining path information to become machining path information for relatively moving the machining head 12 along a moving locus parallel to the surface of the workpiece W inclined with respect to the XY plane, as shown in (c) of FIG. 10. FIG. 10 FIG. 10 (b) of FIG. 10, the machining head 12 cannot move along the moving locus parallel to the surface of the workpiece W. Therefore, the control device 4 can also correct the generated machining path information to become machining path information for relatively moving the machining head 12 along a moving locus parallel to the surface of the workpiece W inclined with respect to the XY plane, as shown in (c) of FIG. 10.

[0102] In the explanation described above, the control device 4 corrects the machining control information to relatively move the machining head 12 along the desired moving locus with respect to the workpiece W. However, the control device 4 can also correct information related to the position of the workpiece W in addition to or instead of correcting the machining control information to relatively move the machining head 12 along the desired moving locus with respect to the workpiece W. In summary, in a situation in which a second object (e.g., the machining head 12) is relatively moved with respect to a first object (e.g., the workpiece W) serving as a reference, the control device 4 can also correct at least one of information related to the first object and information related to the second object to relatively move the second object along the desired moving locus with respect to the first object.

[0103] The control device 4 can also correct (or generate) the machining control information using a part of the workpiece information. Specifically, as described above, the workpiece information is generated based on the workpiece measurement information and the model information. Here, the workpiece measurement information is information obtained by actually measuring the first region Wl of the workpiece W. Therefore, it is assumed that information related to the shape (further, the position and the size) of the first region Wl included in the workpiece information is more reliable than information related to the shape (further, the position and the size) of the second region W2 included in the workpiece information and generated based on the model information. Therefore, the control device 4 can also correct (or generate) the machining control information using information related to the state (i.e., at least one of the shape, the position, and the size) of the first region Wl in the workpiece information.

[0104] Again in the case in which the workpiece W is inclined with respect to the XY plane, the control device 4 can also correct the machining control information to relatively move the machining head 12 along the desired moving locus with respect to the workpiece W, as shown in (c) of FIG. 10. FIG. 4 ​​Subsequently, the control device 4 controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 based on the machining control information generated in step S15 to machine the workpiece W (step S16). That is, the machining system SYSa starts machining of the workpiece W. It can be said that, in the first machining operation, the measurement device 212 measured the shape of the workpiece W before the machining unit 1 started machining the workpiece W. It can be said that the control device 4 generated the workpiece information before the machining unit 1 started machining the workpiece W. Further, since the machining control information is generated based on the workpiece measurement information and the model information, it can also be said that the control device 4 controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 based on the workpiece measurement information and the model information to machine the workpiece W.

[0105] Here, as described above, the workpiece information includes the information on the state of the first region W1 shown by the workpiece measurement information and the information on the state of the second region W2 shown by the result of the alignment processing. At this time, it can also be said that the control device 4 controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 based on the information on the state of the first region W1 in the workpiece information to machine the first region W1 of the workpiece W. In other words, it can also be said that the control device 4 controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 based on the workpiece measurement information to machine the first region W1 of the workpiece W. That is, it can also be said that the first region W1 is machined using the workpiece measurement information. Likewise, it can also be said that the control device 4 controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 based on the information on the state of the second region W2 in the workpiece information to machine the second region W2 of the workpiece W. In other words, it can also be said that the control device 4 controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 using at least a part of the model information (more specifically, using the result of the alignment processing using at least a part of the model information) to machine the second region W2 of the workpiece W. That is, it can also be said that the second region W2 is machined using the model information.

[0106] Subsequently, after the machining of the workpiece W is completed, at least one of the measurement devices 211 and 212 measures the machined workpiece W (step S17). The control device 4 can also determine whether the workpiece W is appropriately machined based on the measurement result (i.e., the workpiece measurement information) of at least one of the measurement devices 211 and 212. That is, the control device 4 can also determine whether the machining quality of the workpiece W is appropriate. However, the operation of step S17 can not be performed.

[0107] By performing the first processing operation described above, even in a case where a part of the workpiece W is not included in the measurement field of view of the measurement device 212, the control device 4 can generate workpiece information including information related to the state of the part of the workpiece W on the stage 32 that is not included in the measurement field of view of the measurement device 212. Thus, the processing system SYSa can appropriately process the workpiece W based on the workpiece information. In particular, the processing system SYSa can no longer repeatedly perform the operation of changing the positional relationship between the measurement device 212 and the workpiece W and then measuring the shape and the like of at least a part of the workpiece W using the measurement device 212 until the entire shape and the like of the workpiece W is measured by the measurement device 212. Thus, the processing system SYSa can appropriately process the workpiece W without deteriorating the productivity related to the processing of the workpiece W.

[0108] Further, in the first processing operation, at least one of the measurement devices 211 and 212 can measure the shape of a processed part in the workpiece W that is processed by the processing unit 1. On the other hand, at least one of the measurement devices 211 and 212 can not measure the shape of a non-processed part in the workpiece W that is not processed by the processing unit 1. At this time, the information related to the shape of the processed part can be acquired from the workpiece measurement information, and the information related to the shape of the non-processed part can be acquired from the model information.

[0109] Further, in the first processing operation, a measurement part in the workpiece W whose shape is measured by at least one of the measurement devices 211 and 212 and a non-measurement part in the workpiece W whose shape is not measured by at least one of the measurement devices 211 and 212 can be specified in advance by a user.

[0110] (1-2-1-2) Second processing action

[0111] Next, the second processing operation will be described with reference to FIG. 11 , which is a flowchart indicating a flow of the second processing operation. Further, hereinafter, for the operations already described, the same step numbers are annotated, and thus detailed descriptions thereof are omitted. FIG. 11

[0112] As shown in FIG. 11 , in the second processing operation, the workpiece W is also placed (step S11) as in the first processing operation, and the processing system SYSa corrects the placement error of the workpiece W (step S12).

[0113] ​Subsequently, the measuring device 212 measures the shape of at least a portion of the workpiece W (step S231). Subsequently, the measuring device 211 measures the shape of at least a portion of the workpiece W (step S232). That is, in the second embodiment, the shape of at least a portion of the workpiece W is measured by both the measuring devices 211 and 212. Further, the actions of steps S231 and S232 can each be the same as the action of step S13 of the above-described FIG. 4

[0114] The measuring device 211 can also measure the shape of a measured portion of the workpiece W (for example, at least a portion of the first region Wl) that has already been measured by the measuring device 212. For example, if the difference (hereinafter referred to as "shape difference") between the shape of the measured portion indicated by the workpiece measurement information including the measurement result of the measuring device 212 and the shape of the measured portion indicated by the model information is greater than a prescribed allowable threshold TH2, it is possible that the reliability of either one of the workpiece measurement information and the model information is low. At this time, in the first embodiment, it is assumed in principle that the reliability of the workpiece measurement information is higher than that of the model information. However, depending on the situation, it is possible that the reliability of the workpiece measurement information is lower than that of the model information. Therefore, in the second embodiment, in the case where the shape difference related to the measurement result of the measuring device 212 is greater than the allowable threshold TH2, the shape of the measured portion can also be measured by the measuring device 211, which has a higher measurement precision than the measuring device 212. At this time, in order to generate the workpiece information, the control device 4 can generate the workpiece information using the workpiece measurement information indicating the measurement result of the measuring device 211 in addition to or instead of the workpiece measurement information indicating the measurement result of the measuring device 212. On the other hand, in the case where the shape difference related to the measurement result of the measuring device 212 is less than the allowable threshold TH2, it is assumed that the reliability of the workpiece measurement information is high. At this time, the measuring device 211 can not measure the shape of the measured portion. Further, it can also be that the measuring device 211 does not measure the shape of the measured portion even in the case where the shape difference related to the measurement result of the measuring device 212 is greater than the allowable threshold TH2.

[0115] Further, the shape difference can refer to the difference (in substance, the difference in position) between the shape of the measured portion (for example, the first region Wl) indicated by the workpiece measurement information and the shape of the portion of the workpiece model WM corresponding to the measured portion indicated by the model information. In order to calculate the shape difference, the control device 4 can perform the above-described alignment processing and calculate the difference between the shape of the measured portion (for example, the first region Wl) indicated by the workpiece measurement information and the shape of the portion of the workpiece model WM corresponding to the measured portion that has been subjected to the alignment processing.

[0116] ​Such a shape difference can also be said to be information indicating the manufacturing precision (in other words, the manufacturing quality) of the workpiece W. The reason for this is that the higher the manufacturing precision, the closer the shape difference is to zero. Therefore, the control device 4 can also store information related to the shape difference as log information in advance. The log information can also be used for the purpose of evaluating the manufacturing precision of the workpiece W.

[0117] Furthermore, the allowable threshold value TH2 used in the second processing operation can also be set to a value that can distinguish between a state in which the shape difference is large to the extent that it cannot be ignored for the purpose of being able to appropriately process the workpiece W, and a state in which the shape difference is small to the extent that it is not a problem even if it is ignored for the purpose of being able to appropriately process the workpiece W.

[0118] A plurality of allowable threshold values TH2 having mutually different values can also be used. For example, a first allowable threshold value TH2 that is compared with the shape difference related to the measurement results of the processed portion of the workpiece W that is processed by the processing unit 1, and a second allowable threshold value TH2 that is compared with the shape difference related to the measurement results of the non-processed portion of the workpiece W that is not processed by the processing unit 1 can also be used. At this time, the first allowable threshold value TH2 can also be a different value from the second allowable threshold value TH2. The first allowable threshold value TH2 can also be a value that is larger than the second allowable threshold value TH2.

[0119] Furthermore, a high-precision measurement portion of the workpiece W that is measured by the measurement device 211 having relatively high measurement precision, and a low-precision measurement portion of the workpiece W that is measured by the measurement device 212 having relatively low measurement precision can also be specified by the user in advance. It can also be that the shape of the processed portion of the workpiece W that is processed by the processing unit 1 is measured by the measurement device 212 having relatively low measurement precision, and the shape of the non-processed portion of the workpiece W that is not processed by the processing unit 1 is measured by the measurement device 212 having relatively low measurement precision.

[0120] The measurement device 211 can also measure the state of the portion of the workpiece W that is extracted as the measurement feature point used when performing the pattern matching. At this time, the state of the measurement feature point is measured with higher precision, and therefore the alignment (for example, the pattern matching) of the workpiece model WM shown by the model information and the workpiece W shown by the workpiece measurement information can be performed with higher precision.

[0121] As described above, when at least a portion of the measurement field of view of measuring device 211 is not included in at least a portion of the measurement field of view of measuring device 212, a portion of the workpiece W not included in the measurement field of view of measuring device 212 may be included in the measurement field of view of measuring device 211. Alternatively, when the size of the measurement field of view of measuring device 211 is larger than that of measuring device 212, a portion of the workpiece W not included in the measurement field of view of measuring device 212 may be included in the measurement field of view of measuring device 211. For example, when measuring device 211 is a measuring device that allows the measurement field of view to move, a portion of the workpiece W not included in the measurement field of view of measuring device 212 may be included in the measurement field of view of measuring device 211. In this case, measuring device 211 can also measure the shape of the unmeasured portion of the workpiece W that has not yet been measured by measuring device 212.

[0122] Subsequently, in the second processing action, similar to the first processing action, the control device 4 uses both model information and workpiece measurement information to generate workpiece information (step S14), generates processing control information based on the workpiece information (step S15), and controls at least one of the processing unit 1, measurement unit 2, and stage unit 3 to process workpiece W based on the processing control information (step S16).

[0123] By performing the second processing action described above, the processing system SYSa can enjoy the same effect as that achieved by performing the first processing action.

[0124] (1-2-1-3) Third processing action

[0125] Then, while referring to FIG. 12 On the one hand, explain the third processing action. FIG. 12 This is a flowchart representing the process of the third processing action.

[0126] like FIG. 12 As shown, in the third processing action, the same as in the first processing action, the workpiece W is placed (step S11), the processing system SYSa corrects the placement error of the workpiece W (step S12), and the measuring device 212 measures the shape of the workpiece W (step S13).

[0127] Subsequently, the control device 4 determines whether the difference between the shape of the workpiece W shown in the workpiece measurement information (specifically, the shape of the first region W1) and the shape of the workpiece W shown in the model information (i.e., the shape difference) exceeds a predetermined tolerance threshold TH3 (step S31). Furthermore, the tolerance threshold TH3 used in the third processing action can be the same as or different from the tolerance threshold TH2 used in the second processing action. The tolerance threshold TH3 can also be set as an expected value based on the same viewpoint as the tolerance threshold TH2.

[0128] If the result of the determination in step S31 is that it is determined that the shape difference is greater than the allowable threshold TH3 (step S31: YES), it is assumed that the reliability of either one of the workpiece measurement information and the model information is low. At this time, in the third machining operation as well, it is considered in principle that the reliability of the workpiece measurement information is higher than that of the model information, as in the first embodiment. That is, the control device 4 generates the workpiece information without using the model information assumed to be low in reliability.

[0129] In order to generate the workpiece information without using the model information, the measurement device 212 sequentially measures a plurality of portions of the workpiece W (step S32). Specifically, the control device 4 repeatedly performs an operation of changing the positional relationship between the measurement device 212 and the workpiece W so that at least a portion of an unmeasured portion (for example, the second region W2) of the workpiece W, the shape of which has not been measured by the measurement device 212, is newly included in the measurement field of view of the measurement device 212, and then measuring the shape of at least a portion of the unmeasured portion using the measurement device 212. For example, FIG. 13 (a) of FIG. 12 indicates the measurement device 212 that measures the shape of the workpiece W in a case where the positional relationship between the measurement device 212 and the workpiece W is in the first positional relationship. In the case where the positional relationship between the measurement device 212 and the workpiece W is in the first positional relationship, the first region W1 of the workpiece W is included in the measurement field of view of the measurement device 212, and on the other hand, the second region W2 of the workpiece W is not included in the measurement field of view of the measurement device 212. FIG. 13 (b) of FIG. 12 indicates the measurement device 212 that measures the shape of the workpiece W after the positional relationship between the measurement device 212 and the workpiece W is changed from the first positional relationship to the second positional relationship. As FIG. 13 (a) of FIG. 12 and FIG. 13 (b) of FIG. 12, when the positional relationship between the measurement device 212 and the workpiece W is changed, at least a portion of the second region W2 of the workpiece W that was not included in the measurement field of view of the measurement device 212 is newly included in the measurement field of view of the measurement device 212. For example, a portion of the second region W2 of the workpiece W that was not included in the measurement field of view of the measurement device 212 before the positional relationship between the measurement device 212 and the workpiece W was changed, that is, the third region W3, is included in the measurement field of view of the measurement device 212 after the positional relationship between the measurement device 212 and the workpiece W is changed. As a result, the measurement device 212 is able to measure the shape of the third region W3.

[0130] The control device 4 repeatedly performs the action of changing the positional relationship between the measurement device 212 and the workpiece W, and then measuring the shape or the like of at least a portion of the workpiece W using the measurement device 212, until the entire workpiece W is included in the measurement field of view of the measurement device 212 (i.e., the entire shape or the like of the workpiece W is measured by the measurement device 212). However, the control device 4 can repeatedly perform the action of changing the positional relationship between the measurement device 212 and the workpiece W, and then measuring the shape or the like of at least a portion of the workpiece W using the measurement device 212, until a certain proportion of the workpiece W is included in the measurement field of view of the measurement device 212 (i.e., the shape or the like of the certain proportion of the workpiece W is measured by the measurement device 212).

[0131] The control device 4 can acquire workpiece measurement information indicating the measurement results of the plurality of portions of the workpiece W by repeatedly performing the action. The control device 4 uses the acquired workpiece measurement information as the workpiece information.

[0132] On the other hand, if the determination result in step S31 is that the shape difference is determined to be not greater than the allowable threshold TH3, it is assumed that the reliability of both the workpiece measurement information and the model information is high. Therefore, in this case, in the third machining action as well, the control device 4 generates the workpiece information using both the model information and the workpiece measurement information (step S14), as in the first machining action.

[0133] Subsequently, in the third machining action as well, the control device 4 generates the machining control information based on the workpiece information (step S15), and controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to machine the workpiece W based on the machining control information (step S16), as in the first machining action.

[0134] By performing the above-described third processing operation, the processing system SYSa can enjoy the same effect as that which can be enjoyed by performing the first processing operation. Furthermore, in the third processing operation, in a scenario in which the reliability of the assumed model information is low, the processing system SYSa repeatedly performs the operation of changing the positional relationship between the measurement device 212 and the workpiece W so that at least a part of the unmeasured portion of the workpiece W is included in the measurement field of view of the measurement device 212, and then measures the shape or the like of at least a part of the unmeasured portion using the measurement device 212. As a result, the processing system SYSa can prevent a decrease in the processing quality of the workpiece W resulting from processing the workpiece W based on the model information having low reliability. That is, in the third processing operation, the processing system SYSa, in a scenario in which the reliability of the assumed model information is low, preferably prevents a decrease in the processing quality of the workpiece W resulting from the model information having low reliability, rather than preventing deterioration in the productivity related to the processing of the workpiece W. As a result, the processing system SYSa can process the workpiece W with high precision. On the other hand, in a scenario in which the reliability of the assumed model information is not low, the processing system SYSa, since the possibility of a decrease in the processing quality of the workpiece W resulting from the model information having low reliability is low, preferably prevents deterioration in the productivity related to the processing of the workpiece W. As a result, the processing system SYSa can both prevent deterioration in the productivity related to the processing of the workpiece W and process the workpiece W with high precision.

[0135] Further, in the description, in a case where the shape difference is larger than the allowable threshold TH3, the measurement device 212 sequentially measures a plurality of portions of the workpiece W, and the control device 4 uses workpiece measurement information indicating measurement results of the plurality of portions of the workpiece W as the workpiece information. Here, the reliability of the workpiece information equivalent to the workpiece measurement information indicating the measurement results of the plurality of portions (typically, the entirety) of the workpiece W should be higher than that of the workpiece information generated on the basis of the workpiece measurement information indicating the measurement results of a portion of the workpiece W (for example, only the first region W1) and the model information. That is, the workpiece information equivalent to the workpiece measurement information indicating the measurement results of the plurality of portions of the workpiece W should more accurately represent the state of the workpiece W on the stage 32 than the workpiece information generated on the basis of the workpiece measurement information indicating the measurement results of a portion of the workpiece W and the model information. Therefore, in a case where it is preferable to process the workpiece W with high accuracy, it can also be that the measurement device 212 sequentially measures a plurality of portions of the workpiece W, and the control device 4 uses workpiece measurement information indicating measurement results of the plurality of portions of the workpiece W as the workpiece information. On the other hand, as described above, in a case where the measurement device 212 sequentially measures a plurality of portions of the workpiece W, the productivity related to the processing of the workpiece W will deteriorate. Therefore, in a case where it is preferable to prevent deterioration of the productivity related to the processing of the workpiece W, the control device 4 can also generate the workpiece information using both the model information and the workpiece measurement information. That is, it can also be that the operation mode of the processing system SYSa is switched between a high-accuracy processing mode in which the workpiece W is processed with high accuracy by using the workpiece measurement information indicating the measurement results of a plurality of portions of the workpiece W as the workpiece information and a productivity improvement mode in which the workpiece information is generated by using both the model information and the workpiece measurement information, with priority given to the productivity of the processing of the workpiece W, regardless of the magnitude relationship between the shape difference and the allowable threshold TH3.

[0136] Further, in the description, the operation of the measurement device 212 measuring the shape of at least a portion of the workpiece W is repeated until the shape of the entirety of the workpiece W is measured. However, the operation of the measurement device 212 measuring the shape of at least a portion of the workpiece W can also be repeated until the shape of a processed portion of the workpiece W that is processed by the processing unit 1 (that is, that is scheduled to be processed) is measured. That is, the shape of a non-processed portion of the workpiece W that is not processed by the processing unit 1 (that is, that is not scheduled to be processed) can also not be measured.

[0137] (1-2-1-4) Fourth processing action

[0138] Next, a fourth processing operation will be described with reference to FIG. 14 FIG. 14 is a flowchart indicating the flow of the fourth processing operation. ​

[0139] like FIG. 14 As shown, in the fourth processing action, similar to the first processing action, the workpiece W is placed (step S11), the processing system SYSa corrects the placement error of the workpiece W (step S12), the measuring device 212 measures the shape of the workpiece W (step S13), the control device 4 uses both the workpiece measurement information and the model information to generate workpiece information (step S14), the control device 4 generates processing control information based on the workpiece information (step S15), and the control device 4 controls at least one of the processing unit 1, the measuring unit 2, and the stage unit 3 to process the workpiece W based on the processing control information (step S16).

[0140] After the processing unit 1 begins processing the workpiece W, the measuring device 212 measures the shape of at least a portion of the workpiece W (step S41). That is, in the fourth processing operation, the measuring device 212 measures the shape of at least a portion of the workpiece W during at least a portion of the processing period after the processing unit 1 begins processing the workpiece W (step S41). Furthermore, the operation of step S41 can also be the same as that of step S13, therefore its detailed description is omitted. Additionally, in step S41, similar to step S13, the measuring device 211 can also measure the shape of at least a portion of the workpiece W instead of the measuring device 212.

[0141] After processing unit 1 begins processing workpiece W, the positional relationship between workpiece W and measuring device 212 may sometimes change. Measuring device 212 can also measure the shape of at least a portion of workpiece W even when the positional relationship between workpiece W and measuring device 212 changes after processing unit 1 begins processing workpiece W. In this case, as described above... FIG. 13 (a) and FIG. 13 As explained in (b), at least a portion (e.g., a third region W3) of the second region W2 of the workpiece W, which was not within the measurement field of view of the measuring device 212 before the processing unit 1 began processing the workpiece W, will be newly included in the measurement field of view of the measuring device 212 after the processing unit 1 begins processing the workpiece W. As a result, the measuring device 212 can measure the shape of at least a portion (e.g., a third region W3) of the second region W2 of the workpiece W, whose shape could not be measured before the processing unit 1 began processing the workpiece W, after the processing unit 1 begins processing the workpiece W. That is, the control device 4 can acquire workpiece measurement information representing the shape of at least a portion (e.g., a third region W3) of the second region W2, which could not be obtained before the processing unit 1 began processing the workpiece W, after the processing unit 1 begins processing the workpiece W. In the following description of the fourth processing operation, an example will be described in which, in step S41, the measuring device 212 measures the shape of the third region W3, and the control device 4 acquires workpiece measurement information representing the measurement result of the shape of the third region W3.

[0142] Subsequently, the control device 4 determines whether or not a difference (i.e., a shape difference) between the shape of the workpiece W shown by the workpiece measurement information acquired in step S41 (i.e., the shape of the third region W3) and the shape of the workpiece W shown by the model information (i.e., the shape of the third region W3) is greater than a prescribed allowable threshold TH4 (step S42). Further, the allowable threshold TH4 used in the fourth machining operation can be the same as at least one of the allowable threshold TH2 used in the second machining operation and the allowable threshold TH3 used in the third machining operation, or can be different. The allowable threshold TH4 can also be set to a desired value in accordance with the same viewpoint as at least one of the allowable thresholds TH2 and TH3.

[0143] If the determination result in step S42 is that the shape difference is determined to be greater than the allowable threshold TH4 (step S42: YES), it is assumed that the shape of the third region W3 shown by the model information is not accurate. Therefore, it is assumed that the workpiece information generated before the machining unit 1 starts machining the workpiece W does not accurately represent the state of the third region W3. Therefore, in this case, the control device 4 regenerates the workpiece information based on the workpiece measurement information representing the measurement result of the shape of the third region W3 (step S43). Specifically, the control device 4 generates the workpiece information based on the workpiece measurement information representing the measurement result of the shapes of the first region W1 and the third region W3 and the model information using the same method as the method of generating the machining control information based on the workpiece measurement information representing the measurement result of the shape of the first region W1 and the model information. That is, the control device 4 can also regenerate the workpiece information containing information related to the shape, position, and size of the workpiece W by synthesizing the information related to the shape, position, and size of each of the first region W1 and the third region W3 of the workpiece W and the information related to the shape, position, and size of the portion other than the first region W1 and the third region W3 in the workpiece model WM, which are contained in the workpiece measurement information.

[0144] Subsequently, the control device 4 corrects the machining control information based on the workpiece information regenerated in step S43 (step S44). Further, the control device 4 can also not regenerate the workpiece information in step S43, but directly correct the machining control information based on the workpiece measurement information representing the measurement result of the shape of the third region W3.

[0145] On the other hand, if the determination result in step S42 is that the shape difference is determined to be less than the allowable threshold TH4 (step S42: NO), it is assumed that the shape of the third region W3 shown by the model information is accurate. Therefore, it is assumed that the workpiece information generated before the machining unit 1 starts machining the workpiece W accurately represents the state of the third region W3. At this time, the control device 4 can also not regenerate the workpiece information.

[0146] After that, the processing system SYSa repeatedly performs the operation of the step S16 and the steps S41 to S44 until the processing of the workpiece W is completed (step S45). After the processing of the workpiece W is completed, at least one of the measuring devices 211 and 212 can also measure the processed workpiece W (step S17).

[0147] By performing the fourth processing operation described above, the processing system SYSa can enjoy the same effects as those which can be enjoyed by performing the first processing operation. Further, in the fourth processing operation, in the case where the positional relationship between the workpiece W and the measuring device 212 is changed after the processing unit 1 starts processing the workpiece W, the processing system SYSa can measure the shape of the third region W3 of the workpiece W, which cannot be measured before the processing unit 1 starts processing the workpiece W, using the measuring device 212. Therefore, in the fourth processing operation, the proportion of the unmeasured portion of the workpiece W, whose shape is not measured by the measuring device 212, with respect to the entire workpiece W gradually becomes smaller. As a result, the proportion of the information supplemented based on the model information (i.e., the information related to the state of the unmeasured portion) with respect to the workpiece information gradually becomes smaller. That is, the state of the workpiece W indicated by the workpiece information gradually becomes accurate. Therefore, the processing system SYSa can process the workpiece W with high accuracy compared to the case where the workpiece information is not regenerated after the processing unit 1 starts processing the workpiece W.

[0148] (1-2-1-5) Fifth processing action

[0149] Next, the fifth processing operation will be described with reference to FIG. 15 . FIG. 15 is a flowchart indicating the flow of the fifth processing operation.

[0150] As shown in FIG. 15 , in the fifth processing operation, as in the fourth processing operation, the workpiece W is placed (step S11), the processing system SYSa corrects the placement error of the workpiece W (step S12), the measuring device 212 measures the shape of the workpiece W (step S13), the control device 4 generates the workpiece information using both the workpiece measurement information and the model information (step S14), the control device 4 generates the processing control information based on the workpiece information (step S15), and the control device 4 controls at least one of the processing unit 1, the measuring unit 2, and the stage unit 3 to process the workpiece W based on the processing control information (step S16).

[0151] After the processing unit 1 starts processing the workpiece W, the measuring device 212 measures the shape of at least a portion of the workpiece W (step S51). That is, in the fifth processing operation as well, the measuring device 212 measures the shape of at least a portion of the workpiece W during at least a portion of the processing period after the processing unit 1 starts processing the workpiece W (step S51), as in the fourth processing operation. Further, the operation of step S53 can be the same as that of step S13, and thus a detailed description thereof is omitted.

[0152] Subsequently, in the fifth processing operation as well, the control device 4 determines whether the shape difference is greater than the allowable threshold TH4 (step S42), as in the fourth processing operation.

[0153] If the determination result in step S42 is that the shape difference is determined to be greater than the allowable threshold TH4 (step S42: No), in the fifth processing operation as well, the control device 4 re-generates the workpiece information based on the workpiece measurement information acquired after the processing unit 1 starts processing the workpiece W (i.e., the workpiece measurement information indicating the measurement result of the shape of the third region W3) (step S43), as in the fourth processing operation. However, in the fifth processing operation, the measuring device 211, which has higher measurement accuracy than the measuring device 212, measures the shape of the third region W3 (i.e., the portion of the workpiece W whose shape cannot be measured before the processing unit 1 starts processing the workpiece W) (step S52). Subsequently, the control device 4 re-generates the workpiece information based on the workpiece measurement information acquired by measuring the third region W3 with the measuring device 211 (step S43).

[0154] Subsequently, in the fifth processing operation as well, the control device 4 corrects the processing control information based on the workpiece information re-generated in step S43 (step S44), as in the fourth processing operation. Further, if the determination result in step S42 is that the shape difference is determined to be less than the allowable threshold TH4 (step S42: No), the measuring device 211 can not measure the third region W3, and the control device 4 can not re-generate the workpiece information.

[0155] By performing the fifth processing operation described above, the processing system SYSa can enjoy the same effects as those that can be enjoyed by performing the fifth processing operation. Further, in the fifth processing operation, the control device 4 re-generates the workpiece information based on the workpiece measurement information acquired by measuring the third region W3 with the measuring device 211, which has higher measurement accuracy than the measuring device 212. Therefore, the possibility that the workpiece information re-generated in the fifth processing operation indicates the state of the workpiece W with higher accuracy is high, as compared to the workpiece information re-generated based on the workpiece measurement information acquired by measuring the third region W3 with the measuring device 212. Thus, the processing system SYSa can process the workpiece W with high accuracy.

[0156] (1-2-1-6) Sixth processing action

[0157] Next, the sixth processing operation will be described with reference to FIG. 16 to the flowchart shown in Fig. 6. FIG. 16 Fig. 6 is a flowchart showing the flow of the sixth processing operation.

[0158] The sixth processing operation is an operation for processing a plurality of workpieces W having the same shape and size. Hereinafter, the sixth processing operation performed in order to process N (N is a constant representing an integer of 2 or more) workpieces W#1 to W#N having the same shape and size will be described.

[0159] As shown in Fig. 6, the processing system SYSa processes the workpiece W#1 to be processed first by performing at least one of the first to fifth processing operations (step S60). Further, in the case where the workpiece W#1 is processed by performing the third processing operation, the processing system SYSa can also not perform the determination operation of step S31 of the first processing operation, but sequentially measure the plurality of portions of the workpiece W using the measuring device 212 (step S32) FIG. 16 FIG. 12 FIG. 12

[0160] Subsequently, after the processing of the workpiece W is completed, the workpiece W#2 to be processed next is placed on the stage 32 (step S61). Further, the operation of step S61 can be the same as the operation of step S11 of the first processing operation, and thus detailed description thereof will be omitted. FIG. 4

[0161] Subsequently, the control device 4 determines whether or not the difference (i.e., the shape difference) between the shape of the workpiece W#1 shown by the workpiece measurement information acquired in order to process the workpiece W#1 and the shape of the workpiece W#1 shown by the model information is greater than a prescribed allowable threshold TH5 (step S62). Further, the allowable threshold TH5 used in the sixth processing operation can be the same as at least one of the allowable threshold TH2 used in the second processing operation, the allowable threshold TH3 used in the third processing operation, and the allowable threshold TH4 used in the fourth processing operation, or can be different. The allowable threshold TH5 can also be set to a desired value in accordance with the same viewpoint as at least one of the allowable thresholds TH2 to TH4.

[0162] ​​​​If the determination result in step S62 is that the shape difference is less than the allowable threshold TH5 (step S62: No), then it is assumed that the actual shape of workpiece W#1 is substantially the same as the ideal or designed shape of workpiece W#1 shown in the model information. That is, it is assumed that workpiece W#1 is manufactured with high precision in such a way that the shape of workpiece W#1 becomes the ideal or designed shape. At this time, it is assumed that workpieces W#2 to W#N are also manufactured with high precision in such a way that the shapes of workpieces W#2 to W#N respectively become the ideal or designed shapes. Therefore, the workpiece information generated for processing workpiece W#1 can be regarded as representing not only the state (shape, etc.) of workpiece W#1, but also the state (shape, etc.) of workpieces W#2 to W#N respectively. As a result, the processing control information generated based on the workpiece information generated for processing workpiece W#1 can be used not only as information for processing workpiece W#1, but also substantially as information for processing workpieces W#2 to W#N respectively. Specifically, for example, the machining path information generated for machining workpiece W#1 can utilize not only information representing the movement trajectory of the machining head 12 relative to workpiece W#1, but also information representing the movement trajectories of the machining head 12 relative to workpieces W#2 to W#N respectively. Therefore, in this case, the control device 4 replaces the generation of new machining control information for machining workpieces W#2 to W#N respectively, and uses the machining control information generated for machining workpiece W#1 as the machining control information for machining workpieces W#2 to W#N respectively. That is, the machining system SYSa may also omit the actions of steps S63 to S65, described later, for generating machining control information for machining workpieces W#2 to W#N respectively.

[0163] On the other hand, if the result of the determination in step S62 is that the shape difference is determined to be greater than the allowable threshold TH5 (step S62: YES), it is assumed that the shape of the actual workpiece W#1 is different from the ideal or designed shape of the workpiece W shown by the model information. That is, since the manufacturing accuracy of the workpiece W#1 is low, it is assumed that the shape of the workpiece W#1 does not become the ideal or designed shape. At this time, the manufacturing accuracy of at least one of the workpieces W#2 to W#N can also be similarly low. Therefore, as described above, the workpiece information generated for machining the workpiece W#1 can not indicate the state (shape, etc.) of each of the workpieces W#2 to W#N. As a result, the machining control information generated on the basis of the workpiece information generated for machining the workpiece W#1 can not be usable as information for machining each of the workpieces W#2 to W#N. Therefore, in this case, the control device 4 newly generates machining control information for machining each of the workpieces W#2 to W#N. Specifically, the measurement device 212 measures the shape of the workpiece W#2 (step S63), the control device 4 generates workpiece information using both the workpiece measurement information and the model information (step S64), and the control device 4 generates machining control information on the basis of the workpiece information (step S65). Further, the operations of steps S63 to S65 can each be the same as the operations of steps S13 to S15 described above, and thus detailed descriptions thereof are omitted. FIG. 4

[0164] In step S63, the measurement device 212 can also selectively measure the shape of a portion in the workpiece W#2 in which the shape difference is relatively large. For example, the control device 4 can determine, on the basis of the workpiece measurement information and the model information acquired for machining the workpiece W#1, a portion of interest in the workpiece W#2 in which the difference from the shape of the workpiece W shown by the model information is relatively large. The portion of interest can include a portion in the workpiece W#1 corresponding to the portion in which the difference from the shape of the workpiece W shown by the model information is relatively large. Subsequently, the measurement device 212 can also selectively measure the shape of the portion of interest.

[0165] Subsequently, the control device 4 controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to machine the workpiece W#2 on the basis of the machining control information (step S66). After the machining of the workpiece W#2 is completed, at least one of the measurement devices 211 and 212 can measure the machined workpiece W#2 (step S67). Further, the operations of steps S66 to S67 can each be the same as the operations of steps S16 to S17 described above, and thus detailed descriptions thereof are omitted. FIG. 4

[0166] The operations of steps S61 to S67 are repeated until the machining of the plurality of workpieces W (i.e., the N workpieces W#1 to W#N) is completed (step S68).

[0167] ​​By performing the above-described sixth processing operation, the processing system SYSa can enjoy the same effect as that which can be enjoyed by performing the first processing operation. Furthermore, in the sixth processing operation, the control device 4 can no longer generate the plurality of workpiece information respectively corresponding to the plurality of workpieces W. The control device 4 can no longer generate the plurality of processing control information respectively corresponding to the plurality of workpieces W. Therefore, compared with the case where the plurality of workpiece information respectively corresponding to the plurality of workpieces W (furthermore, the plurality of processing control information respectively corresponding to the plurality of workpieces W) is generated, the productivity related to the processing of the workpieces W is improved.

[0168] (1-2-2) Measuring action

[0169] Next, the measurement operation is described with reference to FIG. 17 , shown in FIG. 17. FIG. 17 is a flowchart showing a flow of the measurement operation.

[0170] As shown in FIG. 17 , in the measurement operation, as with the processing operation, the workpiece W is placed (step Sll), the processing system SYSa corrects the placement error of the workpiece W (step S12), the measurement device 212 measures the shape of the workpiece W (step S13), and the control device 4 generates the workpiece information using both the workpiece measurement information and the model information (step S14).

[0171] Subsequently, the control device 4 generates the measurement control information (step S71). The measurement control information can include information for controlling at least one of the processing unit 1, the measurement unit 2, and the stage unit 3 by the control device 4 to measure the workpiece W.

[0172] The measurement control information can include the measurement path information. The measurement path information can be considered to be equivalent to information related to the movement trajectory of at least one of the measurement head 21 and the stage 32 (workpiece W). That is, the measurement path information can be considered to be equivalent to information for moving at least one of the measurement head 21 and the stage 32 (workpiece W). When at least one of the measurement head 21 and the stage 32 moves, the positional relationship of the measurement head 21 and the stage 32 (workpiece W) changes. Therefore, the measurement path information can be considered to be equivalent to information for changing the positional relationship of the measurement head 21 and the stage 32 (workpiece W).

[0173] The measurement path information differs from the machining path information including information for controlling movement or position of the machining head 12 in that it includes information for controlling movement or position of the measurement head 21. Other features of the measurement path information can also be the same as those of the machining path information. Thus, the control device 4 can also generate the measurement control information using the same method as in the case of generating the machining path information (and further, the machining control information). For example, the control device 4 can also generate the measurement control information including information for moving at least one of the measurement head 21 and the stage 32 in coordination with the state (shape, etc.) of the workpiece W. For example, if the state of the workpiece W assumed from the generated measurement control information is different from the state of the workpiece W shown in the workpiece information, the control device 4 can also correct the generated measurement control information to generate appropriate measurement control information corresponding to the state of the workpiece W shown in the workpiece information.

[0174] As described above, the workpiece information includes information related to the state of the first region Wl measured by the measurement device 212 and information related to the state of the second region W2 which has not been measured by the measurement device 212. At this time, the control device 4 can also generate the measurement control information based on the workpiece information (particularly, the information related to the state of the second region W2) to cause at least one of the measurement devices 211 and 212 to measure the shape of at least a part of the second region W2 which has not been measured by the measurement device 212. For example, the control device 4 can also generate the measurement control information to cause at least one of the measurement devices 211 and 212 to measure the shape of at least a part of the second region W2 which has not been measured by the measurement device 212, i.e., the third region W3 (refer to (b) of FIG. 8). FIG. 13

[0175] Subsequently, the control device 4 controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 based on the measurement control information generated in step S71 to cause at least one of the measurement devices 211 and 212 to measure the shape of the workpiece W (step S71). For example, the control device 4 can also control at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 based on the measurement control information to cause at least one of the measurement devices 211 and 212 to measure the shape of at least a part of the second region W2 which has not been measured by the measurement device 212, i.e., the third region W3 (refer to (b) of FIG. 8). FIG. 13 ​The shape of (b) is measured. Furthermore, if the measuring device 212 measures the shape of the first region W1 of the workpiece W in step S13, and the positional relationship between the measuring head 21 and the workpiece W remains unchanged, it is possible that neither the measuring devices 211 nor 212 can measure the shape of the third region W3. Therefore, in this case, the control device 4 may also control at least one of the head drive system 22 and the stage drive system 33 based on measurement control information to change the positional relationship between the measuring head 21 and the workpiece W until the third region W3 is included within the measurement field of view of at least one of the measuring devices 211 and 212. After changing the positional relationship between the measuring head 21 and the workpiece W until the third region W3 is included within the measurement field of view of at least one of the measuring devices 211 and 212, the measuring device 211 and 212 measures the shape of the third region W3.

[0176] The workpiece measurement information representing the measurement results in steps S13 and S72 can also be used to generate machining control information. In this case, the control device 4 can also generate machining control information based on the workpiece measurement information representing the measurement results in steps S13 and S72, instead of generating machining control information by performing a portion of the first to sixth machining operations.

[0177] By performing the measurement actions described above, even when a part of the workpiece W is not within the measurement field of view of the measuring device 212, the control device 4 can generate workpiece information containing information related to the state of the part of the workpiece W not within the measurement field of view of the measuring device 212 on the stage 32. Therefore, the machining system SYSa can appropriately measure the workpiece W based on the workpiece information.

[0178] As an example of a scenario in which such a measurement action is performed, a scenario in which machining control information for machining the inside of the inner wall that defines the hole formed in the workpiece W is generated can be cited. At this time, first, at least one of the measurement devices 211 and 212 measures the shape of at least a portion of the workpiece W, and the control device 4 generates workpiece information using both the workpiece measurement information and the model information. Subsequently, the control device 4 generates measurement control information for controlling at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to measure the shape of the hole formed in the workpiece W (for example, to measure the shape of the inner wall that surrounds the hole) using the generated workpiece information. Subsequently, the control device 4 controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to cause at least one of the measurement devices 211 and 212 to measure the shape of the hole formed in the workpiece W based on the measurement control information. Subsequently, the control device 4 generates machining control information for controlling at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to machine the inner wall that defines the hole formed in the workpiece W using the workpiece measurement information. Subsequently, the control device 4 controls at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to machine the inner wall that defines the hole formed in the workpiece W based on the machining control information.

[0179] Further, the control device 4 can also generate measurement control information based on the workpiece information generated before the machining unit 1 starts machining the workpiece W (that is, the workpiece information generated in step S14) during at least one of the first to third machining actions. That is, the control device 4 can also generate measurement control information based on the workpiece information generated before the machining unit 1 starts machining the workpiece W during at least a portion of the non-machining period before the machining unit 1 starts machining the workpiece W. The measurement control information can also include information for controlling at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to measure the workpiece W during at least a portion of the machining period after the machining unit 1 starts machining the workpiece W. The measurement control information can also include information for controlling at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to measure the workpiece W during at least a portion of the non-machining period before the machining unit 1 starts machining the workpiece W. The measurement control information can also include information for controlling at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to measure the workpiece W during at least a portion of the machining end period after the machining unit 1 finishes machining the workpiece W.

[0180] Further, the control device 4 can generate the measurement control information based on the workpiece information generated again after the machining unit 1 starts machining the workpiece W (i.e., the workpiece information generated again in step S43) during at least one of the fourth to fifth machining operations. That is, the control device 4 can generate the measurement control information based on the workpiece information generated again after the machining unit 1 starts machining the workpiece W during at least a part of the machining period after the machining unit 1 starts machining the workpiece W. The measurement control information can include information for controlling at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to measure the workpiece W during at least a part of the machining period after the machining unit 1 starts machining the workpiece W. The measurement control information can include information for controlling at least one of the machining unit 1, the measurement unit 2, and the stage unit 3 to measure the workpiece W during at least a part of the machining end period after the machining unit 1 finishes machining the workpiece W.

[0181] Further, in a case where at least one of the measurement devices 211 and 212 sequentially measures a plurality of workpieces W having the same shape and dimensions, the machining system SYSa can perform the same operation as the sixth machining operation. Specifically, in a case where it is determined that the shape difference is smaller than the allowable threshold TH5, the control device 4 can use the measurement control information generated for measuring the workpiece W#1 as the measurement control information for measuring the workpieces W#2 to W#N instead of newly generating the measurement control information for measuring the workpieces W#2 to W#N, respectively.

[0182] (2) Processing system SYSb of second embodiment

[0183] Next, a machining system SYS of a second embodiment (hereinafter, referred to as "machining system SYSb") will be described with reference to FIG. 18 FIG. 18 is a system configuration diagram showing the system configuration of the machining system SYSb of the second embodiment. Further, for the constituent elements already described, the same reference numerals are assigned, and detailed description thereof will be omitted.

[0184] As shown in FIG. 18 , the machining system SYSb of the second embodiment differs from the machining system SYSa of the first embodiment described above in that it includes a display 6b. Other features of the machining system SYSb can be the same as those of the machining system SYSa.

[0185] The display 6b is a display device that can display a desired image under the control of the control device 4. In the second embodiment, the display 6b can display an image including information related to the workpiece W.

[0186] ​For example, as described above, the workpiece W includes: a first region W1 whose shape has been measured by at least one of measuring devices 211 and 212, and a second region W2 whose shape has not been measured by measuring device 211 and has not yet been measured by measuring device 212. That is, the workpiece W includes: a first region W1 processed based on the measurement results of at least one of measuring devices 211 and 212, i.e., workpiece measurement information, and a second region W2 processed based on model information. At this time, the display 6b may also display an image that includes workpiece shape information representing the shape of the workpiece W, first region information representing the first region W1, and second region information representing the second region W2.

[0187] An example of an image containing workpiece shape information, first region information, and second region information is shown below. FIG. 19 .like FIG. 19 As shown, the display 6b displays a workpiece image WI obtained by photographing or simulating the workpiece W, in a display form distinguishable between a first image portion WI1 corresponding to the first region W1 and a second image portion WI2 corresponding to the second region W2. In this case, it can also be said that the display 6b displays a first image portion WI1 corresponding to the first region information and a second image portion WI2 corresponding to the second region information, superimposed on the workpiece image WI corresponding to the object information. As an example of a display form where the first image portion WI1 and the second image portion WI2 are distinguishable, at least one of the following can be listed: a display form where the color of the first image portion WI1 is different from the color of the second image portion WI2, and a display form where the brightness of the first image portion WI1 is different from the brightness of the second image portion WI2. Furthermore, at least one of the workpiece image WI, the first image portion WI1, and the second image portion WI2 can also be generated based on model information.

[0188] Display 6b can also display an image containing information related to workpiece W (e.g., before processing unit 1 begins processing workpiece W) FIG. 19 The first image portion WI1 and the second image portion WI2 shown are distinguishable workpiece images WI. At this time, the display 6b can also display an image containing object information representing the shape of the workpiece W before processing (e.g., a workpiece image WI obtained by photographing the workpiece W before processing or simulating the workpiece W before processing).

[0189] Display 6b may also display images containing information related to workpiece W (e.g., during at least a portion of the processing period when processing unit 1 is processing workpiece W) during the processing of workpiece W. FIG. 19The first image portion WI1 and the second image portion WI2 are distinguishable in the workpiece image WI shown. At this time, the display 6b can also display an image containing object information indicating the shape of the workpiece W in processing (for example, a workpiece image WI obtained by photographing the workpiece W in processing or simulating the workpiece W in processing).

[0190] The display 6b can also display an image containing information related to the workpiece W after the processing unit 1 finishes processing the workpiece W (for example, a workpiece image WI obtained by photographing the workpiece W after processing or simulating the workpiece W after processing). (3) Processing system SYS c of third embodiment The first image portion WI1 and the second image portion WI2 are distinguishable in the workpiece image WI shown. At this time, the display 6b can also display an image containing object information indicating the shape of the workpiece W in processing (for example, a workpiece image WI obtained by photographing the workpiece W in processing or simulating the workpiece W in processing).

[0191] The processing system SYSb of the second embodiment described above can enjoy the same effects as the processing system SYSa of the first embodiment described above. Furthermore, the processing system SYSb displays an image containing workpiece shape information, first region information, and second region information. Therefore, the operator of the processing system SYSb can recognize which portions of the workpiece W are processed based on workpiece measurement information and which portions are processed based on model information.

[0192] Furthermore, the first region W1 of the workpiece W is processed based on workpiece measurement information obtained by actually measuring the first region W1. Therefore, the shape of the first region W1 after processing is relatively highly likely to coincide with the designed shape of the workpiece W after processing. That is, the first region W1 is relatively highly likely to be subjected to high-precision (in other words, high-quality) processing. On the other hand, the second region W2 of the workpiece W is processed based on model information instead of workpiece measurement information obtained by actually measuring the second region W2. Therefore, the shape of the second region W2 after processing can not coincide with the designed shape of the workpiece W after processing. That is, the second region W2 can not be subjected to high-precision (in other words, high-quality) processing. At this time, the operator of the processing system SYSb can distinguish the first region W1, which is relatively highly likely to be subjected to high-precision processing, from the second region W2, which can not be subjected to high-precision processing, by referring to the image displayed on the display 6b. As a result, the operator can focus on checking the processing quality of the second region W2. That is, the image containing first region information and second region information can be used as information indicating the processing quality of the workpiece W. Therefore, the control device 4 can also store the first region information and the second region information as log information in advance. The log information can also be used to evaluate the processing quality of the workpiece W.

[0193] Further, the processing system SYSb can also replace the display 6b or in place thereof include a projector (i.e., a projection device) that can project a desired image to a desired projection surface. For example, the projector can also project a desired image to at least a portion of the surface of the workpiece W. At this time, at least a portion of the surface of the workpiece W is used as a projection surface. For example, the projector can also project information related to the content of the processing performed on the workpiece W to the surface of the workpiece W. For example, in the case where the workpiece W is processed in a manner to form a structure (e.g., the rib structure described above) on the workpiece W, the projector can also project an image simulating the structure formed on the workpiece W by the processing action to the surface of the workpiece W before the processing unit 1 starts processing the workpiece W. At this time, the operator of the processing system SYSc can visually recognize the structure formed on the workpiece W actually placed on the stage 32. For example, the projector can also project an image simulating the structure actually formed on the workpiece W by the processing action to the surface of the workpiece W after the processing unit 1 finishes processing the workpiece W. At this time, the operator of the processing system SYSc can visually recognize the structure actually formed on the workpiece W actually placed on the stage 32.

[0194] FIG. 20

[0195] Next, the processing system SYS of the third embodiment (hereinafter, the processing system SYS of the third embodiment will be referred to as "processing system SYSc") will be described. The processing system SYSc of the third embodiment differs from the processing system SYSa of the first embodiment described above in that the workpiece W can also be processed by irradiating the workpiece W with the processing light EL. For example, the processing system SYSc can also form a three-dimensional structure on the workpiece W by performing additive processing.

[0196] As an example, the processing system SYSc can also perform additive processing based on a laser metal deposition method (LMD). At this time, the processing system SYSc can also form a shaped object by processing a shaped material M with the processing light EL. The shaped material M is a material that can be melted by irradiation with the processing light EL of a prescribed intensity or more. As such a shaped material M, for example, at least one of a metallic material and a resinous material can be used. However, as the shaped material M, other materials different from the metallic material and the resinous material can also be used. The shaped material M is a material that is powdery or granular. That is, the shaped material M is a powder. However, the shaped material M can also not be a powder. For example, as the shaped material M, at least one of a wire-shaped shaped material and a gaseous shaped material can also be used. However, the processing system SYSc can also form a three-dimensional structure ST by performing additive processing based on other additive processing methods.

[0197] An example of the processing system SYSc of the third embodiment which performs additive processing based on the laser metal deposition method FIG. 21 and FIG. 20 is shown. FIG. 21 is a system configuration diagram showing the system configuration of the processing system SYSc of the third embodiment. FIG. 20 is a perspective view showing the external appearance of the processing system SYSc of the third embodiment. As shown in FIG. 21 and (4) Processing system SYSd of fourth embodiment , the processing system SYSc of the third embodiment differs from the processing system SYSa of the first embodiment described above in that the processing unit 1c is included instead of the processing unit 1. The processing system SYSc differs from the processing system SYSa in that the material supply source 7c is included. The other features of the processing system SYSc can be the same as those of the processing system SYSa.

[0198] The processing unit 1c differs from the processing unit 1 in that the processing head 12c is included instead of the processing head 12. The other features of the processing unit 1c can be the same as those of the processing unit 1. The processing head 12c differs from the processing head 12 in that the material nozzle 122c is further included. The other features of the processing head 12c can be the same as those of the processing head 12.

[0199] The material nozzle 122c supplies (e.g., emits, ejects, spouts, or sprays) the modeling material M. Therefore, the material nozzle 122c can also be referred to as a material supply device. Specifically, the material nozzle 122c is physically connected to the material supply source 7c which is a supply source of the modeling material M via a supply pipe which is not shown. The material nozzle 122c supplies the modeling material M supplied from the material supply source 7c. The material nozzle 122c is aligned with respect to the irradiation optical system 121 to supply the modeling material M toward an irradiation position of the processing light EL from the irradiation optical system 121. Further, it can also be that the material nozzle 122c is aligned with the irradiation optical system 121 to supply the modeling material M to a molten pool formed by the processing light EL emitted from the irradiation optical system 121. Further, the material nozzle 122c can also not supply the modeling material M to the molten pool. For example, the processing system SYSc can melt the modeling material M from the material nozzle 122c by the processing light EL from the irradiation optical system 121 before the modeling material M reaches the workpiece W, and cause the molten modeling material M to adhere to the workpiece W.

[0200] Such a processing system SYSc of the third embodiment can appropriately perform additive processing on the workpiece W. Further, the processing system SYSc can enjoy the same effects as those which the processing system SYSa of the first embodiment described above can enjoy.

[0201] FIG. 22

[0202] Next, the machining system SYS of the fourth embodiment (hereinafter referred to as "machining system SYSd") will be described. The machining system SYSd of the fourth embodiment differs from the machining system SYSa of the first embodiment in that, in addition to machining the optical fiber EL, or instead of machining it, a tool 123d (described later) for machining the workpiece W can be used. FIG. 23 as well as FIG. 22 The machining system SYSd can be used to process workpiece W. That is, the difference between machining system SYSd and machining system SYSa is that SYSd can also perform machining on workpiece W. For example, machining system SYSd can also perform cutting, grinding, lapping, or parting operations on workpiece W by bringing tool 123d into contact with workpiece W. For example, machining system SYSd can also machine workpiece W to make its shape into a desired shape. For example, machining system SYSd can also machine workpiece W to form a desired structure on workpiece W. For example, machining system SYSd can also machine workpiece W to form a desired structure on the surface of workpiece W. For example, machining system SYSd can also machine workpiece W to grind the surface of workpiece W.

[0203] For example, one example of the processing system SYSd in this fourth embodiment. FIG. 23 as well as FIG. 22 As shown. FIG. 23 This is a block diagram showing the system structure of the processing system SYSd in the fourth embodiment. FIG. 22 This is a cross-sectional view showing the structure of the machining system SYSd according to the fourth embodiment. (Example) FIG. 23 as well as (5) Other modifications As shown, the machining system SYSd differs from the machining system SYSa in that it may not include the machining light source 11. Furthermore, the machining system SYSd differs from the machining system SYSa in that it may not include the illumination optical system 121. Specifically, the machining system SYSd differs from the machining system SYSa in that it includes a machining unit 1d instead of a machining head 12 containing the illumination optical system 121, which includes a machining head 12d that does not include the illumination optical system 121. That is, the machining system SYSd differs from the machining system SYSa in that it may not include the components for irradiating the workpiece W with the machining light EL. Furthermore, the machining system SYSd differs from the machining system SYSa in that it includes a machining head 12d containing a tool 123d instead of a machining head 12. Other features of the machining system SYSd may be the same as those of the machining system SYSa.

[0204] The machining system SYSd of this fourth embodiment can appropriately machine the work W. Furthermore, the machining system SYSd can enjoy the same effects as the machining system SYS of the first embodiment can enjoy.

[0205] ​

[0206] In the description, the machining unit 1 includes the head driving system 13. However, the machining unit 1 can not include the head driving system 13. That is, the machining head 12 can not move. In the description, the measurement unit 2 includes the head driving system 22. However, the measurement unit 2 can not include the head driving system 22. That is, the measurement head 21 can not move. In the description, the stage unit 3 includes the stage driving system 33. However, the stage unit 3 can not include the stage driving system 33. That is, the stage 32 can not move.

[0207] In the description, the machining unit 1 (each of the machining units 1 of the first and second embodiments and the machining unit 1c of the third embodiment) machines the work W by irradiating the work W with the machining light EL. However, the machining unit 1 can machine the work W by irradiating the work W with an arbitrary energy beam (which can be referred to as a "machining beam") other than light. At this time, the machining unit 1 can include a beam source that can generate an arbitrary energy beam in addition to or instead of the machining light source 11. As an example of the arbitrary energy beam, a charged particle beam such as an electron beam and a focused ion beam can be given. As another example of the arbitrary energy beam, an electromagnetic wave can be given.

[0208] The components of each of the embodiments can be appropriately combined. Some of the components of each of the embodiments can not be used. The components of each of the embodiments can be appropriately replaced with the components of the other embodiments. Furthermore, all of the publications and U.S. patent publications cited in each of the embodiments are incorporated by reference as part of the description herein to the extent permitted by law.

[0209] Furthermore, the present application can be appropriately changed within the scope that does not depart from the gist or the idea of the present application that can be read from the claims and the entire specification, and the machining system and the display device accompanying the change as described above are also included in the technical idea of the present application.

[0210] Explanation of symbols

[0211] 1: Machining unit

[0212] 12: Machining head

[0213] 13: Head driving system

[0214] 2: Measurement unit

[0215] 21: measurement head

[0216] 211, 212: measuring device

[0217] 22: head drive system

[0218] 3: stage unit

[0219] 32: stage

[0220] 33: stage drive system

[0221] 4: control device

[0222] EL: machining light

[0223] SYS: machining system

[0224] W: workpiece

Claims

1. A processing system, comprising: A processing device that can process objects; A measuring device capable of measuring the shape of at least a portion of the object; as well as Control device, controls the processing device. Before the processing device begins processing the object, the control device acquires measurement results obtained by measuring the shape of a first region of the object's surface using the measuring device, and model information representing the three-dimensional shape of a second region of the object's surface, and controls the processing device based on the measurement results and the three-dimensional shape information of the second region obtained through the model information.

2. The processing system according to claim 1, wherein The measuring device is capable of measuring the three-dimensional shape of at least a portion of the object. The model information represents a three-dimensional model of at least a portion of the object. The three-dimensional shape information of the second region is obtained without measuring the three-dimensional shape of the second region using the measuring device. At least a portion of the second region is processed by the processing device based on the three-dimensional shape information of the second region.

3. The processing system according to claim 2, wherein The measuring device is the first measuring device. The processing system also includes a second measuring device capable of measuring the three-dimensional shape of at least a portion of the object. The measurement accuracy of the second measuring device is lower than that of the first measuring device, and The three-dimensional shape information of the second region is derived based on the measurement results obtained by measuring the first region using the first measuring device, the model information, and the measurement results obtained by measuring the second region using the second measuring device.

4. The processing system according to any one of claims 1 to 3, wherein When the measuring device is positioned at a first predetermined location within the machining system. The first region of the object, positioned at a second predetermined location within the processing system, is included within the measurable range of the measuring device. The second region of the object, positioned at the second predetermined location within the processing system, includes a portion that is not within the measurable range of the measuring device.

5. The processing system according to any one of claims 1 to 3, further comprising: The display device displays information related to the object. The display device together displays object information representing the shape of the object, first region information representing the first region, and second region information representing the second region.

6. The processing system according to any one of claims 1 to 3, wherein The measuring device measures the three-dimensional shape of at least a portion of the object before the processing device begins processing the object. The control device determines the three-dimensional shape of the first region before the processing device begins processing the object.

7. The processing system according to any one of claims 1 to 3, wherein The control device is capable of modifying the machining control information for machining the object based at least on the three-dimensional shape of the first region. The processing device is able to process the object based on the corrected processing control information.

8. The processing system according to any one of claims 1 to 3, wherein The second region is the region adjacent to the first region.

9. The processing system according to any one of claims 1 to 3, wherein The measuring device is the first measuring device. The processing system also includes a second measuring device capable of measuring the shape of at least a portion of the object. The measurement accuracy of the second measuring device is lower than that of the first measuring device. The shape information of the second region is determined based on the measurement results obtained by measuring the first region using the first measuring device, the model information, and the measurement results obtained by measuring the second region using the second measuring device.

10. The processing system according to any one of claims 1 to 3, wherein The measuring device is fixedly configured within the machining system. The first region of the object, which is fixedly disposed within the processing system, is included within the measurable range of the measuring device. The second region of the object, which is fixedly disposed within the processing system, includes a portion that is not within the measurable range of the measuring device.

11. The processing system according to any one of claims 1 to 3, wherein The measuring device is movable. The first region of the object located at a first predetermined position of the processing device is included within the measurable range of the measuring device located at a second predetermined position. The second region of the object located at the first predetermined position of the processing device includes a portion that is not within the measurable range of the measuring device located at the second predetermined position.

12. The processing system according to any one of claims 1 to 3, further comprising: The display device displays information related to the object. The display device together displays object information representing the shape of the object, as well as first region information representing the first region and second region information representing the second region.

13. The processing system according to any one of claims 1 to 3, wherein The measuring device measures the shape of at least a portion of the object before the processing device begins processing the object. The control device determines the shape of the first region before the processing device begins processing the object.

14. The processing system according to claim 9, wherein The first measuring device and the second measuring device measure the shape of at least a portion of the object before the processing device begins processing the object. Before the processing device begins processing the object, the control device determines at least the shapes of the first region and the second region.

15. The processing system according to any one of claims 1 to 3, wherein The control device is capable of modifying the processing control information for processing the object based at least on the shape of the first region. The processing device is able to process the object based on the corrected processing control information.

16. The processing system according to claim 12, wherein Before the processing device begins processing the object, the display device displays at least one of the first area information and the second area information.

17. The processing system according to claim 12, wherein During the processing of the object by the processing device, the display device displays at least one of the first area information and the second area information.

18. The processing system according to claim 12, wherein After the processing device finishes processing the object, the display device displays at least one of the first area information and the second area information.

19. The processing system according to claim 12, wherein The display device together displays object information representing the shape of the object before processing, as well as information about the first region and information about the second region.

20. The processing system according to claim 12, wherein The display device together displays object information representing the processed shape of the object, as well as information about the first region and information about the second region.

21. The processing system according to claim 12, wherein The display device together displays object information representing the shape of the object during processing, as well as information about the first region and information about the second region.

22. The processing system according to any one of claims 1 to 3, wherein The second region is the region adjacent to the first region. The shape information of the second region is obtained without measuring the shape of the second region using the measuring device.

23. The processing system according to any one of claims 1 to 3, wherein The measuring device measures the shape of at least a portion of the object during at least a portion of the processing period after the processing device begins processing the object. The processing system includes a control device that, during at least a portion of the processing, generates processing control information for processing the object and measurement control information for measuring the object, based on measurement results from the measuring device.

24. The processing system according to any one of claims 1 to 3, wherein The measuring device: i. measures the shape of the first region during at least a portion of the non-processing period before the processing device begins processing the object; ii. measures the shape of a third region, which is at least a part of the second region, during at least a portion of the processing period after the processing device begins processing the object. The control device: i. during at least a portion of the non-processing period, uses measurement results obtained by measuring the first region using the measuring device and shape information of the second region calculated based on the model information to generate at least one of processing control information for processing the object and measurement control information for measuring the object; ii. during at least a portion of the processing period, uses measurement results obtained by measuring the first region and the third region using the measuring device and shape information of the second region calculated based on the model information to generate at least one of the processing control information and the measurement control information.

25. The processing system according to claim 24, wherein During the non-processing period, the second region is not within the measurable range of the measuring device. During the processing, the second region is included within the measurable range.

26. The processing system according to claim 24, further comprising: A position changing device that changes the positional relationship between the object and the measuring device. The measuring device measures the shape of the second region when, during at least a portion of the processing, the positional change device alters the positional relationship to include the second region within the measurable range of the measuring device.

27. The processing system according to claim 24, wherein During at least a portion of the processing, if the difference between the shape of the second region shown by the measurement results and the shape of the second region shown by the model information exceeds an allowable threshold, the control device generates at least one of the processing control information and the measurement control information.

28. The processing system according to claim 27, wherein During at least a portion of the processing, if the difference does not exceed the allowable threshold, the control device does not generate at least one of the processing control information and the measurement control information.

29. The processing system according to any one of claims 1 to 3, wherein The measuring device is the first measuring device. The processing system also includes a second measuring device capable of measuring the shape of at least a portion of the object. The measurement accuracy of the second measuring device is lower than that of the first measuring device.

30. The processing system according to claim 29, wherein The control device uses the measurement results obtained by measuring the first region using at least one of the first measuring device and the second measuring device, and the shape information of the second region obtained based on the model information, to generate at least one of the processing control information for processing the object and the measurement control information for measuring the object.

31. The processing system according to claim 29, wherein If the difference between the shape of the first region shown in the measurement results of the second measuring device and the shape of the first region shown in the model information exceeds an allowable threshold, the first measuring device measures the three-dimensional shape of the first region. The control device uses the measurement results obtained by measuring the first region using the first measuring device and the shape information of the second region calculated based on the model information to generate at least one of processing control information for processing the object and measurement control information for measuring the object.

32. The processing system according to any one of claims 1 to 3, wherein The control device uses the measurement results obtained by measuring the first region using the measuring device, and the shape information of the second region calculated based on the model information, to generate measurement control information for measuring the shape of the third region of the object.

33. The processing system according to claim 32, further comprising: A position changing device that changes the positional relationship between the object and the measuring device. After the measuring device has measured the shape of the first region, the position changing device changes the positional relationship based on the measurement control information, so that the third region is included within the measurable range of the measuring device. The measuring device measures the shape of the third region after the position changing device alters the positional relationship to include the third region within the measurable range.

34. The processing system according to claim 32, wherein During the period when the measuring device measures the first region, the third region is not within the measurable range of the measuring device.

35. The processing system according to claim 32, wherein The control device uses the measurement results obtained by measuring the first region and the third region using the measuring device, and the shape information of the second region calculated based on the model information, to generate processing control information for processing the object.

36. The processing system according to any one of claims 1 to 3, wherein If the difference between the shape of the first region shown by the measurement result of the measuring device and the shape of the first region shown by the model information exceeds an allowable threshold: i. the measuring device measures the shape of the third region of the object; ii. the control device uses the measurement results obtained by measuring the first region and the third region by using the measuring device to generate at least one of processing control information for processing the object and measurement control information for measuring the object.

37. The processing system according to claim 36, wherein The control device uses the measurement results obtained by measuring the first region and the third region using the measuring device, and on the other hand, generates at least one of the processing control information and the measurement control information without using the model information.

38. The processing system according to any one of claims 1 to 3, wherein The control device uses the measurement results obtained by measuring the first region and the third region of the object using the measuring device, and the shape information of the second region calculated based on the model information, to generate at least one of the processing control information for processing the object and the measurement control information for measuring the object.

39. The processing system according to claim 36, wherein The measuring device measures the shape of multiple different third regions.

40. The processing system according to claim 36, further comprising: A position changing device that changes the positional relationship between the object and the measuring device. After the measuring device has measured the shape of the first region, the positional alteration device changes the positional relationship so that the third region is included within the measurable range of the measuring device. The measuring device measures the shape of the third region after the position changing device alters the positional relationship to include the third region within the measurable range.

41. The processing system according to claim 36, wherein During the period when the measuring device measures the first region, the third region is not within the measurable range of the measuring device.

42. The processing system according to any one of claims 1 to 3, wherein The object comprises a first object and a second object having the same shape as the first object. If the difference between the shape of the first region of the first object shown by the measurement result of the measuring device and the shape of the first region shown by the model information does not exceed an allowable threshold, and the processing system processes the first object and then processes the second object in the same way as the first object: i. the measuring device does not measure the shape of the first region of the second object; ii. the second object is processed using processing control information generated for processing the first object; and / or the second object is measured using measurement control information generated for measuring the first object.

43. The processing system according to any one of claims 1 to 3, wherein The object comprises a first object and a second object having the same shape as the first object. If the difference between the shape of the first region of the first object shown by the measurement result of the measuring device and the shape of the first region shown by the model information does not exceed an allowable threshold, and the processing system processes the first object and then processes the second object in the same way as the first object: i. The measuring device measures the shape of the first region of the second object, which is distributed in a region narrower than the first region of the first object; ii. The control device uses the measurement result obtained by measuring the first region of the second object using the measuring device to generate at least one of processing control information for processing the second object and measurement control information for measuring the second object.

44. The processing system according to claim 7, wherein The processing control information includes information for changing the positional relationship between the object and the processing device.

45. The processing system according to claim 23, wherein The measurement control information includes information for changing the positional relationship between the object and the measuring device.

46. ​​The processing system according to any one of claims 1 to 3, wherein The processing device processes the object by irradiating it with processing light.

47. The processing system according to any one of claims 1 to 3, wherein The processing device performs removal processing or additive processing on the object.

48. The processing system according to any one of claims 1 to 3, wherein The processing device performs mechanical processing on the object.

49. A processing system, comprising: A processing device that can process objects; A measuring device capable of measuring the shape of at least a portion of the object; as well as The display device displays information related to the object. Before the processing device begins processing the object, the display device displays information related to the object based on the results of the measuring device and model information representing the object's model.

50. The processing system according to claim 49, wherein The display device displays object information representing the shape of the object, first processing area information related to a first processing area that has been processed using the measurement results obtained using the measuring device, and second processing area information related to a second processing area that has been processed using at least a portion of the model information.

51. The processing system according to claim 49, wherein The measuring device is capable of measuring the three-dimensional shape of at least a portion of the object. The model information represents a three-dimensional model of at least a portion of the object. The display device displays the following after the processing device has processed the object: Object information, representing the shape of the object that has undergone the aforementioned processing; The first processing area information indicates the first processing area that has been processed based on the measurement results obtained from the measuring device; and The second processing area information indicates the second processing area that has been processed based on the model information.

52. The processing system according to claim 50 or 51, wherein The measuring device is the first measuring device. The processing system also includes a second measuring device capable of measuring the three-dimensional shape of at least a portion of the object. The measurement accuracy of the second measuring device is lower than that of the first measuring device. The second processing area is the area that has been processed based on the model information and the measurement results obtained from the second measuring device.

53. The processing system according to claim 50 or 51, wherein When the measuring device is positioned in a first predetermined position on the processing device. The first processing area of ​​the object, positioned at a second predetermined position in the processing apparatus, is included within the measurable range of the measuring device. The second processing area of ​​the object, positioned at the second predetermined position of the processing apparatus, includes a portion that is not within the measurable range of the measuring apparatus.

54. The processing system according to claim 50 or 51, wherein The measuring device measures the three-dimensional shape of at least a portion of the object before the processing device begins processing the object. The processing system includes a control device that, before the processing device begins processing the object, determines at least the three-dimensional shapes of the first processing area and the second processing area.

55. The processing system according to claim 50 or 51, wherein In the display device, the first processing area information and the second processing area information are displayed overlaid with the object information representing the object.

56. The processing system according to claim 50 or 51, wherein The measuring device is the first measuring device. The processing system also includes a second measuring device capable of measuring the shape of at least a portion of the object. The measurement accuracy of the second measuring device is lower than that of the first measuring device. The second processing area is the area that has been processed based on the model information and the measurement results obtained from the second measuring device.

57. The processing system according to claim 50 or 51, wherein The measuring device is fixedly disposed within the processing device. The first processing area of ​​the object, which is fixedly disposed within the processing apparatus, is included within the measurable range of the measuring device. The second processing area of ​​the object, which is fixedly disposed within the processing apparatus, includes a portion that is not within the measurable range of the measuring apparatus.

58. The processing system according to claim 50 or 51, wherein The measuring device is movable. The first processing area of ​​the object located at a first predetermined position of the processing device is included within the measurable range of the measuring device located at a second predetermined position. The second processing area of ​​the object located at the first predetermined position of the processing device includes a portion that is not within the measurable range of the measuring device located at the second predetermined position.

59. The processing system according to claim 50 or 51, wherein In the display device, the first processing area information and the second processing area information are displayed overlaid on the object information of the object.

60. The processing system according to claim 50 or 51, wherein During the process of the processing device processing the object, the display device displays at least one of the first processing area information and the second processing area information.

61. The processing system according to claim 50 or 51, wherein After the processing device finishes processing the object, the display device displays at least one of the first processing area information and the second processing area information.

62. The processing system according to claim 50 or 51, wherein The display device together displays object information representing the shape of the object before processing, as well as information about the first processing area and information about the second processing area.

63. The processing system according to claim 50 or 51, wherein The display device together displays object information representing the processed shape of the object, as well as information about the first processing area and information about the second processing area.

64. The processing system according to claim 50 or 51, wherein The display device together displays object information indicating the shape of the object during processing, as well as information about the first processing area and information about the second processing area.

65. A processing system, comprising: A processing device that can process objects; A measuring device capable of measuring the shape of at least a portion of the object; as well as Control device, controls the processing device. The measuring device measures the second region of the object's surface based on measurement results obtained by measuring a first region of the object's surface and model information representing the shape of a second region of the object's surface. The control device acquires measurement results of the second region before the processing device begins processing the object, and controls the processing device based at least on the measurement results.

66. The processing system according to claim 65, wherein The measuring device measures the second region based on the measurement results obtained by measuring the first region using the measuring device and the model information.

67. The processing system according to claim 66, wherein The control device generates measurement control information for controlling the measuring device to measure the second region based on the measurement results obtained by measuring the first region and the model information, and controls the measuring device to measure the second region based on the measurement control information.

68. The processing system according to any one of claims 65 to 67, wherein The first region includes the area in the object where a hole is formed. The second region includes at least a portion of the inner wall of the object defining the hole.

69. The processing system according to any one of claims 65 to 67, wherein The control device controls the processing device based at least on the measurement results of the second region, so as to process at least a portion of the second region.

70. A processing system, comprising: A processing device that can process objects; The first measuring device is capable of measuring the shape of at least a portion of the object; The second measuring device is capable of measuring the shape of at least a portion of the object; as well as Control device, controls the processing device. The second measuring device measures the second region of the object's surface based on a first measurement result obtained by measuring the shape of a first region of the object's surface using the first measuring device, and model information representing the three-dimensional shape of a second region of the object's surface. Before the processing device begins processing the object, the control device acquires the measurement results of the second region and controls the processing device based at least on the three-dimensional shape information of the second region obtained through the model information.

71. The processing system according to claim 70, wherein The control device generates measurement control information for controlling the second measuring device to measure the second region based on the measurement results obtained by measuring the first region with the aid of the first measuring device and the model information, and controls the second measuring device to measure the second region based on the measurement control information.

72. The processing system according to claim 70 or 71, wherein The first region includes the area in the object where a hole is formed. The second region includes at least a portion of the inner wall of the object defining the hole.

73. The processing system according to claim 70 or 71, wherein The control device controls the processing device based at least on the measurement results of the second region, so as to process at least a portion of the second region.

74. The processing system according to claim 70 or 71, wherein The measurement accuracy of the second measuring device differs from that of the first measuring device.

75. A display device capable of displaying information relating to an object processed by a processing system, the processing system comprising: A processing device capable of processing the object; A measuring device capable of measuring the shape of at least a portion of the object; And a control device, before the processing device begins processing the object, acquires measurement results obtained by using the measuring device to measure the shape of a first region of the object's surface, and model information representing the three-dimensional shape of a second region of the object's surface, and controls the processing device based on the measurement results and the three-dimensional shape information of the second region obtained through the model information, wherein... The display device displays object information representing the shape of the object, first region information related to the first region, and second region information related to the second region.

76. A display device capable of displaying information relating to an object processed by a processing system, the processing system comprising: A processing device that can process objects; and a measuring device capable of measuring the shape of at least a portion of the object, wherein Before the processing device begins processing the object, the display device displays object information representing the shape of the object, first processing area information related to a first processing area processed using measurement results obtained using the measuring device, and second processing area information related to a second processing area processed using at least a portion of model information representing the object.

77. A processing method, comprising: Using processing equipment to process objects; as well as A measuring device is used to measure the shape of at least a portion of the object, wherein Processing the object includes: before the processing device starts processing the object, acquiring measurement results obtained by measuring the shape of a first region of the object's surface using the measuring device and model information representing the three-dimensional shape of a second region of the object's surface, and controlling the processing device based on the measurement results and the three-dimensional shape information of the second region obtained through the model information.

78. A processing method, comprising: To process or manipulate objects; Use a measuring device to measure the shape of at least a portion of the object; as well as Before processing the object, the results of the measuring device and model information representing the object are obtained, and information related to the object is displayed based on the measurement results and the model information.

79. A processing method, comprising: Using processing equipment to process objects; as well as A measuring device is used to measure the shape of at least a portion of the object, wherein Measuring the shape of at least a portion of the object includes: measuring a second region of the object's surface based on measurement results obtained by measuring the shape of a first region of the object's surface and model information representing the three-dimensional shape of a second region of the object's surface. Processing the object includes: acquiring measurement results of the second region before the processing device begins processing the object, and controlling the processing device based at least on the measurement results.

80. A processing method, comprising: Using processing equipment to process objects; The shape of at least a portion of the object is measured using a first measuring device; as well as Using a second measuring device, the second region of the object's surface is measured based on a first measurement result obtained by measuring the shape of a first region of the object's surface using the first measuring device, and model information representing the three-dimensional shape of a second region of the object's surface, wherein... Processing the object includes: acquiring measurement results of the second region before the processing device begins processing the object, and controlling the processing device based at least on the measurement results.

81. A display method capable of displaying information related to an object processed by a processing system, the processing system comprising: A processing device capable of processing the object; a measuring device capable of measuring the shape of at least a portion of the object; And a control device, before the processing device begins processing the object, acquires measurement results obtained by using the measuring device to measure the shape of a first region of the object's surface, and model information representing the three-dimensional shape of a second region of the object's surface, and controls the processing device based on the measurement results and the three-dimensional shape information of the second region obtained through the model information, wherein... The display method displays object information representing the shape of the object, first region information related to the first region, and second region information related to the second region.

82. A display method capable of displaying information related to an object processed by a processing system, the processing system comprising: A processing device that can process objects; and a measuring device capable of measuring the shape of at least a portion of the object, wherein The display method, before the processing device begins processing the object, displays object information representing the shape of the object, first processing area information related to a first processing area processed using measurement results obtained using the measuring device, and second processing area information related to a second processing area processed using at least a portion of model information representing the object.

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