Assembled grid tray

Abstract

An assembled grid tray is disclosed that includes a frame for holding a plurality of substrate trays to form a larger tray for use in a semiconductor processing tool. The frame can include two outer frame members that hold one or more trays, each outer frame member having a magnetic track for use with a magnetic levitation system. The frame can further include an inner frame member positioned between the outer frame members that can also include a magnetic track, where the frame members are held in place by one or more outer beam members. The frame members can be made of a material that has a similar thermal expansion as the trays placed in the frame.

Description

Technical Field

[0001] Embodiments of this disclosure generally relate to semiconductor substrate processing trays, and more particularly to assemblies comprising multiple trays. Background Technology

[0002] In the processing of semiconductor substrates for products such as solar cells in solar arrays, processing tools can handle multiple substrates simultaneously. For many applications, substrate trays capable of holding multiple substrates are used to facilitate the processing and transport of multiple substrates. The tray may contain multiple pockets, each configured to hold the substrates to be processed.

[0003] In smaller-generation solar cell processing tools with processing chamber dimensions of up to approximately 1941 mm × 2305 mm, trays capable of holding, for example, up to approximately 99 substrates can be used. However, larger tools with processing chamber dimensions of approximately 2800 mm × 3205 mm can accommodate larger tray sizes, such as trays capable of holding 208 or more substrates that may be larger than those used in previous-generation tools.

[0004] Manufacturing larger trays can be significantly more expensive than smaller trays, thus increasing the cost considerably for large-scale processing of multiple substrates. Furthermore, larger tray sizes present additional engineering challenges, such as tray sagging during processing under the extremely hot conditions of semiconductor processing tools.

[0005] What is needed are systems and methods to overcome the shortcomings of manufacturing larger pallets. Summary of the Invention

[0006] The methods and systems disclosed herein generally relate to an assembled grid tray comprising a frame for holding multiple substrate trays to form a larger tray for use in semiconductor processing tools. The frame may include two outer frame members that hold one or more trays, each outer frame member having a magnetic track for use with a magnetic levitation system. The frame may further include inner frame members positioned between the outer frame members, the inner frame members also including magnetic tracks, wherein these frame members are held in place by one or more outer beam members. These frame members may be made of a material with thermal expansion similar to that of the trays placed within the frame.

[0007] According to some embodiments, an assembly grid tray for semiconductor processing is disclosed, comprising: a first frame member configured to hold one or more of a plurality of processing trays, each processing tray capable of holding a plurality of substrates for processing, the first frame member including a first frame member transport extending along a length of the first frame member, the first frame member transport being configured to allow the first frame member to move within a semiconductor processing tool; a second frame member configured to hold one or more of the plurality of processing trays and including a second frame member transport being configured to allow the second frame member to move within the semiconductor processing tool; and a coupling member configured to movably couple the assembled grid tray to the semiconductor processing tool.

[0008] In another embodiment, a system for processing semiconductor substrates is disclosed, comprising: a semiconductor processing tool including a robot; and an assembled grid tray configured to hold a plurality of trays, each of the plurality of trays including a plurality of bags, each bag being configured to hold a substrate, the assembled grid tray being configured to be coupled to the robot to move the assembled grid tray within the semiconductor processing tool.

[0009] In another embodiment, a system for processing a semiconductor substrate is disclosed, comprising: a semiconductor processing tool; an assembled grid tray configured to hold a plurality of trays, each of the plurality of trays including a plurality of bags for holding the substrate; and a controller including a processor configured to perform a method of processing the semiconductor substrate using the assembled grid tray, the method comprising moving the assembled grid tray containing the plurality of trays within the semiconductor processing tool. Attached Figure Description

[0010] To gain a more detailed understanding of the features described above in this disclosure, reference can be made to embodiments to obtain a more specific description of the disclosure briefly outlined above, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments and should therefore not be construed as limiting the scope of this disclosure, and other equivalent embodiments are permissible.

[0011] Figure 1 A mesh tray assembled according to the disclosed embodiment is depicted.

[0012] Figure 2A and Figure 2B A side view of the outer frame member according to the disclosed embodiment is depicted.

[0013] Figure 3A and Figure 3B A side view of an inner frame member according to the disclosed embodiment is depicted.

[0014] Figure 4A and Figure 4B The side of the outer beam member according to the disclosed embodiment is depicted.

[0015] Figures 5A to 5D The operation of a magnetic levitation system according to the disclosed embodiments is described.

[0016] Figure 6 A semiconductor processing system according to the disclosed embodiments is described.

[0017] For ease of understanding, the same reference numerals have been used as much as possible to indicate common elements in the figures. It is contemplated that elements and features of one embodiment can be advantageously combined in other embodiments without further explanation. Detailed Implementation

[0018] In the following description, reference will be made to embodiments of this disclosure. However, it should be understood that this disclosure is not limited to the specifically described embodiments. Rather, any combination of the following features and elements, whether or not they relate to different embodiments, is contemplated for implementation and practice of this disclosure. Furthermore, while embodiments of this disclosure may achieve advantages over other possible technical solutions and / or over the prior art, whether a given embodiment achieves a particular advantage is not a limitation of this disclosure. Therefore, the following aspects, features, embodiments, and advantages are merely illustrative and should not be considered elements or limitations of the appended claims unless expressly stated in the claims. Similarly, reference to “this disclosure” should not be construed as a generalization of any inventive subject matter disclosed herein and should not be considered elements or limitations of the appended claims unless expressly stated in the claims.

[0019] This disclosure generally relates to methods and systems for assembling a grid tray, the assembled grid tray comprising a frame for holding multiple substrate trays to form a larger tray for use in semiconductor processing tools. The frame may include two outer frame members that hold one or more trays, each outer frame member having a magnetic track for use with a magnetic levitation system. The frame may further include inner frame members positioned between the outer frame members, the inner frame members also including magnetic tracks, wherein these frame members are held in place by one or more outer beam members. These frame members may be made of a material with thermal expansion similar to that of the trays placed within the frame.

[0020] In methods utilizing systems with smaller processing chambers (e.g., 1941 mm × 2305 mm, such as the 6th generation processing tool from Applied Materials of Santa Clara, CA), trays are used to hold, for example, 99 substrates for processing. In this context, trays achieve scale efficiency, thereby making efficient use of processing tools, materials, time, etc. Trays can be constructed from materials such as graphite, composite carbon fibers, or other materials suitable for supporting substrates during processing. For example, a tray can be constructed from a material with a coefficient of thermal expansion approximately the same as the number of substrates it can support.

[0021] As increasingly larger semiconductor processing tools become available (e.g., processing chambers of approximately 2800mm × 3205mm or larger, such as the 8th generation solar cell processing tool from Applied Materials, Santa Clara, California), larger trays capable of holding 208 or more substrates become possible. As those skilled in the art will understand, efficiency increases when processing more substrates in a single processing cycle, thereby reducing the cost of the devices produced. However, manufacturing larger trays is significantly more expensive than smaller trays, costing four times (and possibly more) the cost. Furthermore, larger tray sizes can introduce additional complexities such as tray sagging. Attempts have been made to use multiple smaller trays placed close together without connecting infrastructure, but the spacing between trays and the complexities that arise when handling multiple individual trays present significant engineering challenges.

[0022] According to the disclosed embodiments, an assemblable grid tray is assembled to hold multiple trays. The assembled grid tray includes a frame comprising an outer frame member, one or more inner frame members, and one or more outer beams. The assembled grid tray, holding multiple smaller trays, is provided to semiconductor processing tools, such as 8th generation (or higher) solar cell processing tools. The assembled grid tray eliminates the need to manufacture larger trays and simplifies the handling of multiple smaller trays by allowing all smaller trays in the assembled grid tray to be disposed of as a unit, and eliminates unwanted gaps between trays. By using multiple smaller trays in the assembled grid tray, scale efficiency is achieved without the cost and engineering complexity involved in developing larger trays and / or attempting to use multiple single trays individually in a production line.

[0023] Figure 1An assembled mesh tray 100 according to the disclosed embodiments is depicted. The assembled mesh tray includes an outer frame member 105, also referred to herein as a first frame member and a second frame member, respectively. The outer frame member 105 may be made of a material with a coefficient of thermal expansion substantially the same as that of the tray 115 carried by the assembled mesh tray 100. For example, the outer frame member 105 may be made of graphite, carbon fiber composite, aluminum, or other materials with a coefficient of thermal expansion similar to that of one or more trays carried by the assembled mesh tray 100. As shown, the outer frame member 105 is positioned in an orientation such that its longitudinal dimension is parallel to the direction of travel of the assembled mesh tray 100 for use in a semiconductor processing tool. However, those skilled in the art will understand that the outer frame member 105 may be interchanged with one or more outer beam members discussed below, such that the longitudinal dimension of the outer beam members is parallel to the direction of travel of the assembled mesh tray 100. In some embodiments, the outer frame member 105 may include a magnet to enable the assembled mesh tray 100 to be transported within the semiconductor processing tool (or factory) via magnetic levitation. In other embodiments, wheels may be used, while in still others, the robotic component may carry an assembled mesh tray. Furthermore, one or both outer frame members 105 may further include outer wheels 113 to facilitate movement within semiconductor processing tools or factories. Additional details of the outer frame members 105 will be discussed below in conjunction with Figure 2.

[0024] Although pallet 115 is indicated by a single reference numeral, those skilled in the art will understand that the pallets do not need to be identical in material composition or size. Multiple pallets of different sizes can be assembled so that all pallets fit within the assembled grid frame.

[0025] The assembled mesh tray 100 further includes one or more inner frame members 120 and 125, either of which may also be referred to herein as a third frame component. Although two inner frame members 120 and 125 are depicted, in some embodiments there may be one inner frame member or no inner frame member, while in other embodiments there may be more than two inner frame members. Similar to at least one of the outer frame members 105, the inner frame members 120 and / or 125 may be made of a material with a coefficient of thermal expansion substantially equal to that of one or more trays 115 to be carried by the assembled mesh tray 100. In some embodiments, one or more of the inner frame members 120 and 125 may include a plurality of magnets to enable the assembled mesh tray to move within the semiconductor processing tool via magnetic levitation. In other embodiments, wheels may be utilized, while in still other embodiments, the assembled mesh tray may be carried by one or more robotic components. One or more trays 115 may be positioned between the inner frame member 120 or 125 and the outer frame member 105. The inner frame members 120 and 125 will be discussed in more detail below in conjunction with FIG3.

[0026] The assembled mesh pallet 100 further includes one or more outer beam members 130. As shown, one or more of the outer beam members 130 are coupled to one or more of the outer frame members 105 and the inner frame members 120 and / or 125 to form a rigid frame structure to support one or more of the pallets 115. The outer beam members 130 may be coupled to one or more outer frame members 105 and / or inner frame members 120 and 125 via screws or rivets, welding, gluing, or some other techniques that rigidly connect these elements to form a rigid frame capable of holding one or more pallets 115. The one or more outer beam members 130 may further include one or more connection points 135 to connect the assembled mesh pallet 100 to a robot (e.g., illustrated below in Figure 2) or other conveying device to enable the assembled mesh pallet to move within semiconductor processing tools and / or factories.

[0027] Figure 2A A side view 200 depicts an outer frame member 205 according to a disclosed embodiment, which may resemble one or two outer frame members 105. The outer frame member 205 includes a magnet channel 210 extending through the length of the outer frame member 205. In one embodiment, a magnet tray 215 is positioned within the magnet channel 210, holding a plurality of magnets 220 extending through the length of the outer frame member 205, and covering magnets 220 that might otherwise be exposed under the outer frame member 205. In one embodiment, the magnets 220 may be natural magnets, while in other embodiments, the magnets may be electromagnets. The outer frame member 205 has a lower ledge 225 on which one or more trays may be held, the upper surface 235 of which contacts the upper lip 240 of the outer frame member 205.

[0028] Figure 2B An alternative embodiment of the outer frame member 205 is depicted. Instead of the upper lip 240, a clip 250 is movably and / or removably coupled to the top surface of the outer frame member 205, wherein a portion of the clip 250 extends to contact the upper surface 235 of the tray 230, thereby holding the tray in position against the lower projection 225 of the outer frame member 205.

[0029] Figure 3AA side view 300 is depicted according to a disclosed embodiment of an inner frame member 305, which may resemble one or more inner frame members 120 and 125. The inner frame member 305 includes a magnet channel 310 extending through the length of the inner frame member 305. In one embodiment, a magnet tray 315 is positioned within the magnet channel 310, holding a plurality of magnets 320 extending through the length of the inner frame member 305, and covering magnets 320 that might otherwise be exposed under the inner frame member 305. In one embodiment, the magnets 320 may be natural magnets, while in other embodiments, the magnets may be electromagnets. The inner frame member 305 has a lower protrusion 325 on each side of the inner frame member 305, and trays 330 and / or 331 or more trays can be placed on the lower protrusion 325. The upper surface 335 of tray 330 and the upper surface 336 of tray 331 contact an upper lip 340 extending from either side of the inner frame member 305.

[0030] Figure 3B An alternative embodiment of the inner frame member 305 is depicted. Instead of the upper lip 340, a clip 350 is movably and / or removably coupled to the top surface of the inner frame member 305, wherein a portion of the clip 350 extends to contact the upper surface 335 of the tray 330, thereby holding the tray 330 in a position abutting against the lower projection 325 of the inner frame member 305.

[0031] Figure 4A A side view 400 depicts an outer beam member 405 according to the disclosed embodiment, which may be identical to outer beam member 130. The outer beam member 405 includes a lower projection wall 410 extending along the length of the outer beam member 405, on which tray 415 or more such trays may be positioned. The top surface 420 of the tray 415 may contact an upper lip 425 extending from and along the length of the outer beam member 405.

[0032] Figure 4B An alternative embodiment of the outer beam member 405 is depicted. Instead of the upper lip 425, a clip 450 is movably and / or removably coupled to the top surface of the outer beam member 405, wherein a portion of the clip 450 extends to contact the top surface 420 of the tray, thereby holding the tray in position against the lower projection 410 of the outer beam member 405.

[0033] Figures 5A to 5D The operation of a magnetic levitation system according to the disclosed embodiments is described.

[0034] Figure 5A A grid tray 510 (which may be similar to) for assembly along the semiconductor processing system is depicted. Figure 1The assembled grid tray 510 is transported to the magnetic levitation system 505 at the base 520 by the outer frame member 515 (which may be similar to the outer frame member 205 of FIG. 2) in a first operating state 500. The magnetic levitation system 505 includes a lifting arm 506 configured to move up and down and a plurality of magnets 507.

[0035] In the first operating state 500, the lifting arm 506 is in the upward position, wherein a plurality of magnets 507 of the lifting arm 506 provide an upward force to the magnets of the outer frame member 515 to lift the assembled mesh tray 510. A robot (not shown) of the semiconductor processing system can be coupled to one or more connection points of the assembled mesh tray 510, such as... Figure 1 Connection point 135 is used to position the assembled mesh tray 510 above the base 520.

[0036] Figure 5B A second operating state 501 is depicted, in which the lifting arm 506 of the magnetic levitation system 505 is configured to be lowered, thereby placing the assembled mesh pallet 510 on the base for further processing. Although the operating state depicted herein is the placement of the assembled mesh pallet for processing, those skilled in the art will understand that the magnetic levitation system and associated components of the assembled mesh pallet 510 can be used to transport the assembled mesh pallet to any type of processing, testing, cleaning, or other site within the plant.

[0037] Figure 5C A grid tray 510 (which may be similar to) for assembly along the semiconductor processing system is depicted. Figure 1 The magnetic levitation system 505, in an embodiment, transports the assembled mesh tray 510 to the base 520 via an inner frame member 555 (which may be similar to the inner frame member 305 of FIG. 3) of the inner frame member 555. This first operating state 550 is the same as the first operating state 500. The magnetic levitation system 560 includes a lifting arm 561 configured to move vertically and a plurality of magnets 562.

[0038] In the first operating state 550, the magnetic lifting arm 561 is in the upward position, wherein a plurality of magnets 562 of the magnetic lifting arm 561 provide an upward force to the magnets of the inner frame member 555 to lift the assembled mesh tray 510. A robot (not shown) of the semiconductor processing system may be coupled to one or more connection points of the assembled mesh tray 510, such as... Figure 1 Connection point 135 is used to position the assembled mesh tray 510 above the base 520.

[0039] Figure 5DA second operating state 551 is depicted, which in this embodiment is identical to the second operating state 501, wherein the lifting arm 561 of the magnetic levitation system 560 is configured to be lowered to place the assembled mesh pallet 510 on the base for further processing. While the operating state depicted herein is the placement of the assembled mesh pallet for processing, those skilled in the art will understand that the magnetic levitation system and associated components of the assembled mesh pallet 510 can be used to transport the assembled mesh pallet to any type of processing, testing, cleaning, or other station within the plant.

[0040] Figure 6 A semiconductor processing system 600 according to the disclosed embodiments is described.

[0041] Semiconductor processing system 600 includes: an assembled grid tray 605, the assembled grid tray 605 being similar to... Figure 1 The assembled mesh tray 100; the magnetic levitation system 610, the magnetic levitation system 610 includes Figure 5A and Figure 5B Magnetic levitation systems 505 and 560; robot 615, configured to move and assemble a grid tray 605; controller 620 for controlling the semiconductor processing system 600; and base 625, which may be similar to Figure 5A and Figure 5B The base 520.

[0042] While the foregoing describes embodiments of this disclosure, other and further embodiments of this disclosure may be conceived without departing from the basic scope of this disclosure, and the scope of this disclosure is defined by the scope of the appended claims.

Claims

1. A mesh tray for assembly in semiconductor processing, comprising: A first frame component is configured to hold one or more of a plurality of processing trays, each processing tray capable of holding a plurality of substrates for processing. The first frame component includes a first frame component transport extending along the length of the first frame component, the first frame component transport being configured to enable the first frame component to move within a semiconductor processing tool. A second frame component, configured to hold one or more of the plurality of processing trays and including a second frame component transporter, the second frame component transporter being configured to enable the second frame component to move within the semiconductor processing tool; as well as A coupling element configured to movably couple the assembled mesh tray to the semiconductor processing tool. One or more of the first frame component transporter and the second frame component transporter include a magnetic track, the magnetic track including one or more magnets, and the one or more magnets extending through the length of the respective frame component.

2. The assembled grid tray of claim 1, further comprising a third frame component positioned between the first frame component and the second frame component, the third frame component being configured to hold two or more of the plurality of processing trays, the third frame component including a third frame component transporter configured to enable the third frame component to move within the semiconductor processing tool.

3. The assembled mesh pallet as claimed in claim 2, wherein the third frame component transporter includes a magnetic rail, the magnetic rail comprising one or more magnets.

4. The assembled mesh tray of claim 3, further comprising an outer beam connected to the first frame component, the second frame component, and the third frame component, wherein the coupling is mounted to the outer beam.

5. The assembled mesh tray as claimed in claim 1, wherein one of the first frame component and the second frame component is made of a material with a coefficient of thermal expansion similar to one or more of the plurality of processing trays.

6. The assembled mesh tray as claimed in claim 5, wherein one of the first frame component and the second frame component is made of a graphite and carbon fiber composite (CFC).

7. The assembled mesh tray of claim 1, wherein one of the first frame component and the second frame component includes a protrusion and a lip, the protrusion being configured to receive the bottom surface of one or more of the plurality of processing trays, and the lip being configured to receive the top surface of one or more of the plurality of processing trays.

8. A system for processing a semiconductor substrate, comprising: Semiconductor processing tools, the semiconductor processing tools including robots; and An assembled grid tray configured to hold a plurality of trays, each of the plurality of trays including a plurality of bags, each bag being configured to hold a substrate, the assembled grid tray being configured to be coupled to the robot for moving the assembled grid tray within the semiconductor processing tool, wherein the assembled grid tray includes: A first frame component, the first frame component including a first frame component transporter configured to enable the first frame component to move within the semiconductor processing tool, the first frame component configured to hold one or more of the plurality of trays; and A second frame component, comprising a second frame component transport component, is configured to hold one or more of the plurality of pallets. One or more of the first frame component and the second frame component include one or more magnets, and the one or more magnets extend through the length of the respective frame component.

9. The system of claim 8, wherein the assembled mesh tray further comprises: A coupling element configured to be coupled to the robot.

10. The system of claim 9, further comprising a third frame component positioned between the first frame component and the second frame component, the third frame component being configured to hold one or more of the plurality of trays.

11. The system of claim 9, wherein the assembled mesh tray further includes an outer beam connected to the first frame component and the second frame component.

12. The system of claim 10, wherein one of the first frame component, the second frame component, and the third frame component is made of a material with a coefficient of thermal expansion similar to that of one of the plurality of trays.

13. The system of claim 12, wherein one of the first frame component, the second frame component, and the third frame component is made of a graphite and carbon fiber composite (CFC).

14. A system for processing a semiconductor substrate, comprising: Semiconductor processing tools; An assembled mesh pallet, the assembled mesh pallet being configured to hold a plurality of pallets, each of the plurality of pallets including a plurality of bags for holding substrates; as well as A controller, including a processor configured to perform a method of processing a semiconductor substrate using the assembled grid trays, the method comprising moving the assembled grid trays, which house the plurality of trays, within the semiconductor processing tool. The assembled mesh tray mentioned above includes: A first frame component, the first frame component being configured to hold one or more of the plurality of trays; A second frame component, configured to hold one or more of the plurality of trays. One of the first frame component and the second frame component includes a plurality of magnets extending along the length of the respective of the first frame component and the second frame component.

15. The system of claim 14, wherein the assembled mesh tray further includes a third frame component positioned between the first frame component and the second frame component, the third frame component being configured to hold one or more of the plurality of trays.

16. The system of claim 15, wherein the third frame component includes a plurality of magnets positioned along the length of the third frame component.

17. The system of claim 14, wherein one of the first frame component and the second frame component is made of a material with a coefficient of thermal expansion similar to that of one of the plurality of trays.

18. The system of claim 15, wherein the assembled mesh tray further includes an outer beam connected to one of the first frame component, the second frame component, and the third frame component.

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