A logic chip leakage failure analysis and stripping device

Abstract

The present invention provides a logic chip leakage failure analysis and stripping device applied to the field of logic chips. This solution places the leakage chip in a stripping groove to decap it. When part of the lead is exposed, the chip is buckled using the limiting groove on the protective polishing block and resin is injected into the chip surface through the glue outlet. The resin is used to fix the leads, reducing the shaking and damage to the leads during continued stripping, thereby improving the safety of continued stripping. A high-definition camera is used to photograph the chip and an image analysis module is used to analyze the area that needs to be further stripped. An electric polishing ball is used to strip the designated position, accurately identifying the area to be stripped, effectively avoiding damage to the leads and chip, and improving the integrity of the stripping. The chip surface is flushed with a mixture of pure water and silica particles, so that the corroded chip packaging layer can be gradually stripped, reducing the damage to the chip caused by mechanical stripping.

Description

Technical Field

[0001] The present application relates to the field of logic chips, and in particular to a logic chip leakage failure analysis and stripping device. Background Art

[0002] A logic chip, also known as a programmable logic device (PLD), is a general-purpose integrated circuit whose logic functions are determined by user programming. Logic chips are always accompanied by logic circuits, essentially composed of AND, OR, and NOT gates. PLD chips are digital circuit chips, not analog or mixed-signal chips (those with both digital and analog circuits).

[0003] Transistor leakage is one of the main causes of chip failure in most chips (such as logic chips containing NAND or NOR gate structures). In particular, as the line width decreases, the leakage of nano-integrated circuits will increase dramatically. In order to inspect and analyze the cause of chip leakage, the chip needs to be decapped. The traditional decapping method can easily damage the leads, causing secondary damage and affecting the judgment of the leakage cause.

[0004] To this end, we proposed a stripping device for logic chip leakage failure analysis. After the initial decapping, the leads are fixed with a transparent resin, and the specific position can be polished without affecting the observation. Summary of the Invention

[0005] The purpose of the present application is to fix the lead by transparent resin to avoid secondary damage to the lead, and compared with the prior art, a logic chip leakage failure analysis and stripping device is provided, including a base, a vertical plate fixedly connected to the upper end of the base, a stripping component is provided at the upper end of the base, a stripping groove is provided in the middle of the stripping component, a storage cavity is provided near the side wall of the stripping component on the vertical plate, and a protective polishing block is rotatably connected to the inner wall of the storage cavity through a multi-link, the protective polishing block includes an electric shaft connected to the multi-link, a limiting groove is provided at the lower end of the protective polishing block, a glue outlet hole is provided on the bottom wall of the limiting groove, and the glue outlet hole is connected to an external melt glue component through a glue filling tube, and a plurality of electric polishing balls are movably embedded in the upper end of the protective polishing block, and the plurality of electric polishing balls are respectively connected to An external controller and a high-definition camera are provided at the lower end of the protective grinding block, which is electrically connected to the image analysis module. The leakage chip is placed in the stripping groove to open its cap. When part of the lead is exposed, the chip is buckled using the limiting groove on the protective grinding block and resin is injected into the chip surface through the glue outlet. The resin is used to fix the leads, which reduces the shaking and damage to the leads during continued stripping and improves the safety of continued stripping. The chip is photographed with a high-definition camera and the image analysis module is used to analyze the area that needs to be stripped further. The electric grinding ball is used to strip the designated position, accurately identifying the area to be stripped, effectively avoiding damage to the leads and chips, and improving the integrity of the stripping.

[0006] Furthermore, an annular cavity corresponding to the position of the stripping groove is opened inside the stripping component, and the interior of the annular cavity is divided into an upper cavity and a lower cavity by an isolation plate. The upper cavity is connected to the stripping groove through a cleaning hole, and the lower cavity is connected to the interior of the stripping groove through a grinding hole. The upper cavity is connected to an external water storage tank through a clean water pipe, and the lower cavity is connected to an external mixing tank through a mixing pipe. The cleaning holes opened on the inner wall of the stripping groove are used to clean the corrosive liquid on the surface of the chip, and the isolation plate is used to separate the annular cavity, which improves the space utilization of the annular cavity and reduces the production difficulty.

[0007] Furthermore, the external water storage tank is filled with pure water, and the external mixing tank is filled with a mixture of pure water and silica particles. The chip surface is flushed with the mixture of pure water and silica particles, which can gradually peel off the corroded chip packaging layer, reducing the damage to the chip caused by mechanical peeling and improving the safety of peeling. At the same time, the silica particles are used to react with excess corrosive liquid to reduce the continuous corrosion of the chip by the corrosive liquid and protect the integrity of the chip. Subsequently, the corrosive liquid on the chip surface is cleaned with pure water, which reduces the continuous corrosion of the chip by the corrosive liquid and effectively avoids excessive corrosion of the chip.

[0008] Furthermore, a slag discharge channel is provided on the bottom wall of the stripping trough, one end of the slag discharge channel is located in the middle of the stripping trough, and the other end of the slag discharge channel extends to the outside of the stripping assembly and is connected to a sewage pipe. A gas-liquid dual-purpose pump is provided inside the slag discharge channel, and the gas-liquid dual-purpose pump is used to promptly extract the peeled packaging layer and sewage, thereby keeping the inner wall of the stripping trough clean. At the same time, it can cooperate with the suction generated by it in the working state to keep the chip in a stable position.

[0009] Furthermore, a water diversion groove is provided on the bottom wall of the stripping tank corresponding to the upper end of the slag discharge channel. The depth of the water diversion groove decreases from the inside to the outside. The sewage and impurities inside the stripping tank can be sucked in along the water diversion groove in time. At the same time, the gas-liquid dual-purpose pump can generate negative pressure to adsorb the chip during operation, keeping it stable in the stripping state. Secondly, it can also absorb harmful gases generated by the volatilization of the corrosive liquid, thereby ensuring the safety of the operator.

[0010] Furthermore, the length of the water diversion trough is not less than 10 centimeters, and the side walls of the water diversion trough are polished to obtain a smooth surface. The water diversion trough of sufficient length can effectively guide sewage and airflow.

[0011] Furthermore, the upper end of the vertical plate is rotatably connected to a fixed plate, the upper end of the fixed plate is provided with an eyepiece, and the lower end of the fixed plate is provided with an objective lens corresponding to the position of the eyepiece. The eyepiece and the objective lens are interconnected through an optical tube. The rotatable connection with the fixed plate allows the staff to flip the fixed plate backward during operation, providing a larger operating space and improving the convenience of operation. The eyepiece and objective lens can be used to magnify the peeled chip structure and conduct a detailed analysis of the leakage problem.

[0012] Furthermore, the surface of the electric grinding ball is polished to obtain a rough surface. The electric grinding ball is made of ceramic material. The electric grinding ball is used to accurately polish the position to be stripped, thereby improving the efficiency and accuracy of stripping and reducing damage to the leads and chips.

[0013] Furthermore, the edge of the limiting groove is beveled, and an anti-sticking layer is provided on the inner wall of the limiting groove. The limiting groove can limit the flow direction and range of the resin, thereby preventing the stripping groove from being contaminated by excessive resin.

[0014] Furthermore, an anti-skid pad is provided at the lower end of the base. The anti-skid pad is made of rubber material. A plurality of interconnected pores are provided inside the anti-skid pad. The stability of the base is improved by utilizing the anti-skid pad.

[0015] Compared with the existing technology, the advantages of this application are:

[0016] (1) The leakage chip is placed in the stripping groove to open its cap. When part of the lead is exposed, the chip is held by the limiting groove on the protective grinding block and resin is injected into the chip surface through the glue outlet. The resin is used to fix the lead, which reduces the shaking and damage to the lead during continued stripping and improves the safety of continued stripping. The chip is photographed with a high-definition camera and the area that needs to be further stripped is analyzed through the image analysis module. The electric grinding ball is used to strip the designated position, and the area to be stripped is accurately identified, which effectively avoids damage to the lead and chip and improves the integrity of the stripping.

[0017] (2) The cleaning holes on the inner wall of the stripping tank are used to clean the corrosive liquid on the chip surface, and the annular cavity is separated by an isolation plate, which improves the space utilization of the annular cavity and reduces the production difficulty.

[0018] (3) By flushing the chip surface with a mixture of pure water and silica particles, the corroded chip packaging layer can be gradually peeled off, reducing the damage to the chip caused by mechanical peeling and improving the safety of peeling. Subsequently, the corrosive liquid on the chip surface is cleaned with pure water, reducing the continuous corrosion of the chip by the corrosive liquid.

[0019] (4) A gas-liquid dual-purpose pump is used to promptly remove the peeled packaging layer and sewage, thereby keeping the inner wall of the peeling tank clean. At the same time, the suction force generated by the pump during operation can be used to keep the chip in a stable position.

[0020] (5) The water inlet trough is used to allow the sewage and impurities inside the stripping tank to be sucked in along the water inlet trough in time. At the same time, the gas-liquid dual-purpose pump can generate negative pressure when working to adsorb the chip, keeping it stable in the stripping state.

[0021] (6) The fixed plate is rotatably connected so that the operator can flip the fixed plate backwards during operation, thereby providing a larger operating space and improving the convenience of operation.

[0022] (7) The position to be stripped is precisely polished using an electric grinding ball, which improves the efficiency and accuracy of stripping and reduces damage to the leads and chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the main structure of this application;

[0024] Figure 2 This is an exploded view of the main structure of this application;

[0025] Figure 3 A bottom view of the protective sanding block of this application;

[0026] Figure 4 A top view of the protective sanding block of this application;

[0027] Figure 5 This is a schematic diagram of the stripping assembly structure of this application;

[0028] Figure 6 A cross-sectional view of the stripping assembly of the present application;

[0029] Figure 7 A cross-sectional view of the stripping assembly and the protective grinding block of the present application in a working state;

[0030] Figure 8 This is a schematic diagram of the structure of the subject of this application in the state of resin injection;

[0031] Figure 9 This is a schematic diagram of the structure of the subject of this application when the electric grinding ball is in working state;

[0032] Figure 10 This is a schematic diagram of the structure of the subject of this application in an observation state.

[0033] Description of the numbers in the figure:

[0034] 1. Base; 11. Vertical plate; 12. Eyepiece; 13. Objective lens; 14. Storage chamber; 2. Stripping assembly; 21. Stripping groove; 22. Annular cavity; 221. Cleaning hole; 222. Grinding hole; 23. Slag discharge channel; 231. Water diversion trough; 24. Mixing tube; 25. Clean water pipe; 26. Sewage pipe; 3. Protective grinding block; 31. Limiting groove; 311. Glue outlet hole; 32. Electric grinding ball. DETAILED DESCRIPTION

[0035] The embodiments will be combined with the drawings in the specification to clearly and completely describe the technical solution of this application. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making any creative work shall fall within the scope of protection of this application.

[0036] Example 1:

[0037] The present invention provides a logic chip leakage failure analysis and stripping device, please refer to Figure 1-4 , including a base 1, a vertical plate 11 is fixedly connected to the upper end of the base 1, a stripping component 2 is provided at the upper end of the base 1, a stripping groove 21 is provided in the middle of the stripping component 2, a storage cavity 14 is provided on the side wall of the vertical plate 11 near the stripping component 2, and a protective grinding block 3 is rotatably connected to the inner wall of the storage cavity 14 through a multi-link. The protective grinding block 3 includes an electric shaft connected to the multi-link, a limiting groove 31 is provided at the lower end of the protective grinding block 3, and a glue outlet hole 311 is provided on the bottom wall of the limiting groove 31. The glue outlet hole 311 is connected to an external melt glue component through a glue filling tube. A plurality of electric grinding balls 32 are movably embedded in the upper end of the protective grinding block 3, and the plurality of electric grinding balls 32 are respectively connected to an external controller. A high-definition camera is provided at the lower end of the protective grinding block 3, and the high-definition camera is electrically connected to the image analysis module.

[0038] An anti-skid pad is provided at the lower end of the base 1 . The anti-skid pad is made of rubber material. A plurality of interconnected pores are provided inside the anti-skid pad. The anti-skid pad improves the stability of the base 1 .

[0039] See also Figure 1 The upper end of the vertical plate 11 is rotatably connected to a fixed plate, an eyepiece 12 is provided on the upper end of the fixed plate, and an objective lens 13 corresponding to the position of the eyepiece 12 is provided on the lower end of the fixed plate. The eyepiece 12 and the objective lens 13 are connected to each other through an optical tube. The rotatable connection with the fixed plate allows the staff to flip the fixed plate backward during operation, providing a larger operating space and improving the convenience of operation. The eyepiece 12 and the objective lens 13 can be used to magnify the peeled chip structure and conduct a detailed analysis of the leakage problem.

[0040] See also Figure 3 The edge of the limiting groove 31 is beveled, and the inner wall of the limiting groove 31 is provided with an anti-sticking layer. The limiting groove 31 can limit the flow direction and range of the resin, thereby preventing excessive contamination of the stripping groove 21 by the resin.

[0041] See also Figure 4 The surface of the electric grinding ball 32 is polished to obtain a rough surface. The electric grinding ball 32 is made of ceramic material. The electric grinding ball 32 is used to accurately polish the position to be stripped, which improves the efficiency and accuracy of stripping and reduces damage to the leads and chips.

[0042] See also Figure 5-6 An annular cavity 22 corresponding to the position of the stripping groove 21 is opened inside the stripping component 2. The interior of the annular cavity 22 is divided into an upper cavity and a lower cavity by an isolation plate. The upper cavity is connected to the stripping groove 21 through a cleaning hole 221, and the lower cavity is connected to the interior of the stripping groove 21 through a grinding hole 222. The upper cavity is connected to an external water storage tank through a clean water pipe 25, and the lower cavity is connected to an external mixing tank through a mixing pipe 24. The cleaning hole 221 opened on the inner wall of the stripping groove 21 is used to clean the corrosive liquid on the surface of the chip. The annular cavity 22 is separated by an isolation plate, which improves the space utilization of the annular cavity 22 and reduces the production difficulty.

[0043] The external water storage tank is filled with pure water, and the external mixing tank is filled with a mixture of pure water and silica particles. The chip surface is flushed with the mixture of pure water and silica particles, which can gradually peel off the corroded chip packaging layer, reducing the damage to the chip caused by mechanical peeling and improving the safety of peeling. At the same time, the silica particles are used to react with excess corrosive liquid to reduce the continuous corrosion of the chip by the corrosive liquid and protect the integrity of the chip. Subsequently, the corrosive liquid on the chip surface is cleaned with pure water, which reduces the continuous corrosion of the chip by the corrosive liquid and effectively avoids excessive corrosion of the chip.

[0044] A slag discharge channel 23 is provided on the bottom wall of the stripping groove 21. One end of the slag discharge channel 23 is located in the middle of the stripping groove 21, and the other end of the slag discharge channel 23 extends to the outside of the stripping component 2 and is connected to a sewage pipe 26. A gas-liquid dual-purpose pump is provided inside the slag discharge channel 23. The gas-liquid dual-purpose pump is used to pump away the peeled packaging layer and sewage in time, keeping the inner wall of the stripping groove 21 clean. At the same time, it can cooperate with the suction generated by it in the working state to keep the chip in a stable position.

[0045] See also Figure 5 A water diversion groove 231 corresponding to the upper end of the slag discharge channel 23 is provided on the bottom wall of the stripping tank 21. The depth of the water diversion groove 231 decreases from the inside to the outside. The water diversion groove 231 is used to allow the sewage and impurities inside the stripping tank 21 to be sucked in along the water diversion groove 231 in time. At the same time, the gas-liquid dual-purpose pump can generate negative pressure to adsorb the chip during operation, keeping it stable in the stripping state. Secondly, it can also absorb the harmful gases generated by the volatilization of the corrosive liquid, thereby ensuring the safety of the operator.

[0046] The length of the water diversion trough 231 is not less than 10 centimeters, and the sidewalls of the water diversion trough 231 are polished to obtain a smooth surface. The water diversion trough 231 of sufficient length can effectively guide sewage and airflow.

[0047] When the staff uses the device to open the chip cap, they first place the leakage chip in the stripping groove 21, add a small amount of corrosive liquid to the chip surface, and after standing for a period of time, rinse the chip surface with a mixture of pure water and silica particles, gradually stripping off the corroded chip packaging layer, and then use pure water to clean the corrosive liquid on the chip surface. After repeating the operation many times, until part of the lead is exposed, use the limiting groove 31 on the protective grinding block 3 to hold the chip and inject resin into the chip surface through the glue outlet 311, use the resin to fix the leads, use a high-definition camera to shoot the chip and analyze the area that needs to be further stripped through the image analysis module, cooperate with the electric grinding ball 32 to strip the designated position, accurately identify the area to be stripped, effectively avoid damage to the leads and chips, and improve the integrity of the stripping. After the viewing angle of the leads and chips is completely exposed, the staff flips the fixing plate forward and uses the eyepiece 12 and objective lens 13 to magnify the stripped chip structure and conduct a detailed analysis of the leakage problem.

[0048] The above is only the best implementation method adopted by this application in combination with current actual needs, but the scope of protection of this application is not limited to this.

Claims

1. A logic chip leakage failure analysis and stripping device, comprising a base (1), characterized in that: The upper end of the base (1) is fixedly connected to a vertical plate (11), the upper end of the base (1) is provided with a stripping assembly (2), a stripping groove (21) is provided in the middle of the stripping assembly (2), a storage cavity (14) is provided on the side wall of the vertical plate (11) close to the stripping assembly (2), the inner wall of the storage cavity (14) is rotatably connected to a protective grinding block (3) through a multi-link, the protective grinding block (3) includes an electric shaft connected to the multi-link, a limiting groove (31) is provided at the lower end of the protective grinding block (3), a glue outlet hole (311) is provided on the bottom wall of the limiting groove (31), and the glue outlet hole (311) is connected to the glue filling pipe Connected to an external melt glue component, the upper end of the protective grinding block (3) is movably embedded with a plurality of electric grinding balls (32), and the plurality of electric grinding balls (32) are respectively connected to an external controller. When a portion of the lead is exposed, the chip is buckled by using the limiting groove (31) on the protective grinding block (3) and resin is injected into the chip surface through the glue outlet (311), and the lead is fixed by using the resin. The lower end of the protective grinding block (3) is provided with a high-definition camera, which is used to shoot the chip and analyze the area that needs to be further peeled through the image analysis module, and the electric grinding balls (32) are used to peel the designated position; The edge of the limiting groove (31) is in the shape of a bevel, and the inner wall of the limiting groove (31) is provided with an anti-sticking layer. The limiting groove (31) limits the flow direction and range of the resin, thereby preventing excessive contamination of the stripping groove (21) by the resin.

2. The logic chip leakage failure analysis and stripping device according to claim 1, characterized in that: An annular cavity (22) corresponding to the position of the stripping groove (21) is provided inside the stripping assembly (2). The interior of the annular cavity (22) is divided into an upper cavity and a lower cavity by an isolation plate. The upper cavity is connected to the stripping groove (21) through a cleaning hole (221), and the lower cavity is connected to the interior of the stripping groove (21) through a grinding hole (222). The upper cavity is connected to an external water storage tank through a clean water pipe (25), and the lower cavity is connected to an external mixing tank through a mixing pipe (24).

3. The logic chip leakage failure analysis and stripping device according to claim 2, characterized in that: The external water storage tank is filled with pure water, and the external mixing tank is filled with a mixture of pure water and silicon dioxide particles.

4. The logic chip leakage failure analysis and stripping device according to claim 1, characterized in that: A slag discharge channel (23) is provided on the bottom wall of the stripping trough (21), one end of the slag discharge channel (23) is located in the middle of the stripping trough (21), and the other end of the slag discharge channel (23) extends to the outside of the stripping assembly (2) and is connected to a sewage discharge pipe (26). A gas-liquid dual-purpose pump is provided inside the slag discharge channel (23).

5. The logic chip leakage failure analysis and stripping device according to claim 4, characterized in that: The bottom wall of the stripping groove (21) is provided with a water diversion groove (231) corresponding to the upper end position of the slag discharge channel (23), and the depth of the water diversion groove (231) decreases from the inside to the outside.

6. The logic chip leakage failure analysis and stripping device according to claim 5, characterized in that: The length of the water diversion groove (231) is not less than 10 centimeters, and the side wall of the water diversion groove (231) is polished to obtain a smooth surface.

7. The logic chip leakage failure analysis and stripping device according to claim 1, characterized in that: The upper end of the vertical plate (11) is rotatably connected to a fixed plate, the upper end of the fixed plate is provided with an eyepiece (12), and the lower end of the fixed plate is provided with an objective lens (13) corresponding to the position of the eyepiece (12), and the eyepiece (12) and the objective lens (13) are connected to each other through an optical tube.

8. The logic chip leakage failure analysis and stripping device according to claim 1, characterized in that: The surface of the electric grinding ball (32) is subjected to grinding treatment to obtain a rough surface, and the electric grinding ball (32) is made of ceramic material.

9. The logic chip leakage failure analysis and stripping device according to claim 1, characterized in that: The lower end of the base (1) is provided with an anti-skid pad, the anti-skid pad is made of rubber material, and a plurality of interconnected pores are provided inside the anti-skid pad.

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