A via bridge defect determination method and apparatus
By integrating the minimum distance matrix and the safe distance curve, the problem of via bridging defects caused by overlay errors and linewidth variations was solved, enabling accurate detection and optimized design of bridging defects and improving the manufacturing quality of integrated circuits.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGDONG GREATER BAY AREA INST OF INTEGRATED CIRCUIT & SYST
- Filing Date
- 2023-02-22
- Publication Date
- 2026-06-05
AI Technical Summary
In the integrated circuit manufacturing process, through-hole bridging defects caused by overlay errors and linewidth variations affect the manufacturing quality of the circuit, and existing technologies are difficult to effectively detect and optimize them.
By obtaining the distance between the first through hole at a fixed position and the second through holes at different positions, a minimum distance matrix is formed to determine the target distance, a safe distance curve is fitted, and integration is performed to identify the failure area and success area of the bridging defect.
It enables accurate detection and optimized design of through-hole bridging defects, guides the adjustment of etching process parameters, and improves the manufacturing quality of integrated circuits.
Smart Images
Figure CN116206994B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductors, and in particular to a method and apparatus for determining through-hole bridging defects. Background Technology
[0002] With the development of semiconductor technology, the feature size of integrated circuits continues to shrink. In the manufacturing of integrated circuits, double patterning (DPT) can be introduced to expand the physical limits of photolithography and achieve finer circuit etching.
[0003] Double exposure technology includes a litho-etch-litho-etch (LELE) process, which can be applied to the etching of via layers. In actual manufacturing processes, overlay errors and variations in linewidth (CD) can cause changes in the via positions, leading to via bridging defects and consequently affecting integrated circuit manufacturing. Summary of the Invention
[0004] In view of this, the purpose of this application is to provide a method and apparatus for determining through-hole bridging defects, which can determine whether through-hole bridging defects exist, and to optimize through-hole design and process parameters using the determination method.
[0005] This application provides a method for determining through-hole bridging defects, the method comprising:
[0006] Obtain the distances between the first through hole at a fixed position and the second through holes at different positions, and form a minimum distance matrix;
[0007] Determine the first target distance in each row of the minimum distance matrix that is greater than or equal to the threshold;
[0008] Multiple safe distance location points are determined based on the multiple target distances;
[0009] Fit a safety distance curve based on the safety distance location points;
[0010] By integrating the safety distance curve, the failure region where bridging defects exist between the first through hole and the second through hole, and the success region where bridging defects do not exist, can be obtained.
[0011] Optionally, determining multiple safe distance location points based on multiple target distances includes:
[0012] Determine the threshold position point corresponding to the target distance based on the target distance;
[0013] The location point with the same x-coordinate as the threshold location point, but with its y-coordinate shifted one position forward or one position backward, is determined as the safe distance location point.
[0014] Optionally, determining the location point with the same x-coordinate as the threshold location point, but with its y-coordinate shifted one position forward or one position backward, as the safe distance location point includes:
[0015] The initial position point is determined by having the same x-coordinate as the threshold position point and shifting the y-coordinate one position forward or one position backward.
[0016] The plurality of initial position points include a plurality of target position points with the same x-coordinate. A safe distance position point is determined among the plurality of target position points based on the positional relationship between the first through hole and the second through hole.
[0017] Optionally, the positional relationship between the first through hole and the second through hole includes a first positional relationship and a second positional relationship. The first positional relationship is that the second through hole is located in the first quadrant and the third quadrant of the first through hole with the first through hole as the origin, and the second positional relationship is located in the second quadrant and the fourth quadrant of the first through hole with the first through hole as the origin.
[0018] The integration using the safety distance curve includes:
[0019] Based on the first positional relationship, the two-dimensional direction is integrated, which includes the X direction and the Y direction. The X direction and the Y direction are perpendicular, and the integration interval of the Y direction is from the safety distance curve to positive infinity.
[0020] or,
[0021] Based on the second positional relationship, integration is performed in the two-dimensional direction, and the integration interval in the Y direction is from negative infinity to the safety distance curve.
[0022] Optionally, the distance between the first through hole at a fixed position and the second through holes at different positions includes:
[0023] The first through hole is fixed in position, and the second through hole moves in a two-dimensional direction within a fixed range according to the Gaussian probability density distribution. The two-dimensional direction includes the X direction and the Y direction, and the X direction and the Y direction are perpendicular.
[0024] As the second through hole moves along the X and Y directions, the minimum distance between the first through hole and the second through hole is obtained.
[0025] Optionally, determining the first target distance greater than or equal to a threshold in each row of the minimum distance matrix includes:
[0026] Obtain the target row in the minimum distance matrix, where the target row is any row in the minimum distance matrix;
[0027] The first target distance in the target row that is greater than a threshold is determined, the threshold being determined based on the absence of bridging defects in the first and second vias.
[0028] Optionally, obtaining the distance between a first through hole at a fixed position and second through holes at different positions to form a minimum distance matrix includes:
[0029] Obtain the distances between first through holes with different graphic contours at fixed positions and second through holes with different graphic contours at different positions, and form a minimum distance matrix.
[0030] Optionally, the first through hole and the second through hole are disposed in different through hole layers.
[0031] This application provides a device for determining through-hole bridging defects, the device comprising:
[0032] The acquisition unit is used to acquire the distance between a first through hole at a fixed position and second through holes at different positions, forming a minimum distance matrix;
[0033] The first determining unit is used to determine the first target distance in each row of the minimum distance matrix that is greater than or equal to a threshold.
[0034] The second determining unit is used to determine multiple safe distance location points based on the multiple target distances;
[0035] A fitting unit is used to fit a safety distance curve based on the safety distance location points;
[0036] An integration unit is used to integrate the safety distance curve to obtain the failure region where there is a bridging defect between the first through hole and the second through hole, and the success region where there is no bridging defect.
[0037] Optionally, the second determining unit is configured to:
[0038] Determine the threshold position point corresponding to the target distance based on the target distance;
[0039] The location point with the same x-coordinate as the threshold location point, but with its y-coordinate shifted one position forward or one position backward, is determined as the safe distance location point.
[0040] This application provides a method for determining through-hole bridging defects. The method includes: obtaining the distance between a first through-hole at a fixed position and second through-holes at different positions to form a minimum distance matrix; determining the first target distance greater than or equal to a threshold in each row of the minimum distance matrix; determining multiple safe distance position points based on multiple target distances; fitting a safe distance curve based on the safe distance position points; and integrating the safe distance curve to obtain the failure region where bridging defects exist between the first and second through-holes and the success region where no bridging defects exist. Thus, this application adjusts the position of the second through-hole, introduces the statistical characteristics of overlay error, obtains multiple safe distance position points based on the minimum distance matrix, and then obtains the safe distance curve between the first and second through-holes. Integrating the safe distance curve yields the failure region where bridging defects exist between the first and second through-holes and the success region where no bridging defects exist. Subsequently, the failure region and success region can be used to directly determine whether bridging defects exist between the two through-holes, and can also be used to guide the optimized design of the through-holes and etching process parameters. Attached Figure Description
[0041] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0042] Figure 1 A schematic diagram of a through-hole bridging defect is shown;
[0043] Figure 2 A flowchart illustrating a method for determining through-hole bridging defects according to an embodiment of this application is shown.
[0044] Figure 3 A schematic diagram of a through hole provided in an embodiment of this application is shown;
[0045] Figure 4 This illustration shows a minimum distance matrix provided in an embodiment of this application;
[0046] Figure 5 This illustration shows a schematic diagram of a through-hole moving in the X direction according to an embodiment of this application;
[0047] Figure 6 This illustration shows a schematic diagram of a through-hole moving in the Y direction according to an embodiment of this application;
[0048] Figure 7 This illustration shows a schematic diagram of the movement of a through hole in the X and Y directions according to an embodiment of this application;
[0049] Figure 8 This illustration shows a flowchart of forming a minimum distance matrix according to an embodiment of this application;
[0050] Figure 9 This illustration shows a schematic diagram of a matrix to be fitted according to an embodiment of this application;
[0051] Figure 10 This illustration shows a schematic diagram of a safety distance curve fitting process provided in an embodiment of this application;
[0052] Figure 11 This illustration shows a schematic diagram of a safety distance curve provided in an embodiment of this application;
[0053] Figure 12 This illustration shows a schematic diagram of an integration result provided in an embodiment of this application;
[0054] Figure 13 A schematic diagram of a through-hole bridging defect determination device provided in an embodiment of this application is shown. Detailed Implementation
[0055] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.
[0056] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0057] With the development of semiconductor technology, the feature size of integrated circuits continues to shrink. In the manufacturing of integrated circuits, double patterning (DPT) can be introduced to expand the physical limits of photolithography and achieve finer circuit etching.
[0058] The double exposure process includes a litho-etch-litho-etch (LELE) process, which can be applied to the etching of via layers. (Reference) Figure 1 As shown, the through-hole layer (M) x and M x+1The minimum distance typically occurs at the corner-to-corner (C2C) position, where bridging defects are extremely prone to occur under double exposure. In actual processes, via bridging defects can occur due to via process parameters, overlay errors, pattern offset caused by mask 3D effects (M3D), or defects in optical proximity correction strategies. Among these, via process parameters include linewidth (CD) variations.
[0059] In other words, overlay errors and changes in linewidth (CD) can cause changes in the position of vias, leading to via bridging defects and thus affecting the manufacturing of integrated circuits.
[0060] Based on this, embodiments of this application provide a method for determining via bridging defects. The method includes: obtaining the distance between a first via at a fixed position and second vias at different positions to form a minimum distance matrix; determining the first target distance greater than or equal to a threshold in each row of the minimum distance matrix; determining multiple safe distance position points based on multiple target distances; fitting a safe distance curve based on the safe distance position points; and integrating the safe distance curve to obtain a failure region where bridging defects exist between the first and second vias and a success region where no bridging defects exist. Thus, this application adjusts the position of the second via, introduces the statistical characteristics of overlay error, obtains multiple safe distance position points based on the minimum distance matrix, and then obtains a safe distance curve between the first and second vias. Integrating the safe distance curve yields a failure region where bridging defects exist between the first and second vias and a success region where no bridging defects exist. Subsequently, the failure region and success region can be used to directly determine whether bridging defects exist between the two vias, and can also be used to guide the optimized design of the vias and etching process parameters.
[0061] To better understand the technical solution and effects of this application, the specific embodiments will be described in detail below with reference to the accompanying drawings.
[0062] See Figure 2 The figure is a flowchart illustrating a method for determining through-hole bridging defects according to an embodiment of this application.
[0063] The method for determining through-hole bridging defects provided in this embodiment includes the following steps:
[0064] S101, obtain the distance between the first through hole at a fixed position and the second through holes at different positions, and form the minimum distance matrix.
[0065] In embodiments of this application, the first through-hole (Via1) and the second through-hole (Via2) can be through-holes disposed in different through-hole layers, and the first through-hole and the second through-hole can be disposed diagonally, as shown in the reference. Figure 3 As shown. To determine whether there is a bridging defect between the first and second through holes, the distance between the first and second through holes can be calculated. For example, the position of one through hole can be fixed, and the other through hole can be moved to obtain the minimum distance between the two through holes at different positions.
[0066] Specifically, the minimum distances between the first through hole at a fixed position and the second through holes at different positions are obtained to form a minimum distance matrix (M).
[0067] As one possible implementation, the position of the first through-hole is fixed, and the second through-hole moves in a two-dimensional direction within a fixed range according to a Gaussian probability density distribution. The two-dimensional direction includes the X and Y directions, which are perpendicular. As the second through-hole moves along the X and Y directions, the minimum distance between the first through-hole and the second through-hole at different positions is obtained, forming a minimum distance matrix. (Refer to...) Figure 4 As shown, the rows of the minimum distance matrix can be the positions in the X direction, the columns of the minimum distance matrix can be the positions in the Y direction, and the parameter of the minimum distance matrix is the minimum distance between the first through hole and the second through hole.
[0068] As an example, when moving in a two-dimensional direction, the fixed range can be determined based on a Gaussian probability density distribution, where the fixed range in the X direction is [-3σx, 3σx]. (Refer to...) Figure 5 The diagram shows the movement of the second through-hole along the X direction. The fixed range in the Y direction is [-3σy, 3σy]. (Refer to...) Figure 6 The diagram shows the movement of the second through hole along the Y direction. This is because the minimum distance outside this range has little impact on the determination of through hole bridging defects. To improve determination efficiency and save computational resources, the calculation can be performed using only the minimum distance within a fixed range.
[0069] In practical applications, the second through hole can move simultaneously along both the X and Y directions, as shown in the reference. Figure 7 The diagram shows the second through hole moving along the X and Y directions.
[0070] In embodiments of this application, the first through hole and the second through hole have different positional relationships; that is, the location of the second through hole differs from that of the first through hole. The positional relationship between the first through hole and the second through hole includes a first positional relationship and a second positional relationship. The first positional relationship is that, with the first through hole as the origin, the second through hole is located in the first quadrant and the third quadrant of the first through hole, as shown in the reference... Figure 3 As shown. The second positional relationship is with the first through hole as the origin, and the second through hole located in the second and fourth quadrants of the first through hole.
[0071] Specifically, the first positional relation can be represented using relation type=1, and the second positional relation can be represented using relation type=0.
[0072] In practical applications, when two through holes are obtained, the positional relationship between the two through holes can be determined first, and then a minimum distance matrix can be formed based on the positional relationship, as shown in the reference. Figure 8 As shown.
[0073] In the embodiments of this application, changing the distance between the first and second through holes by moving the position of the second through hole is equivalent to introducing the statistical characteristics of overlay error, that is, it is possible to perform model calculation on the overlay error in the actual process.
[0074] In addition to introducing overlay error to assess through-hole bridging defects, we can also introduce through-hole bridging defects caused by different through-hole profiles during the actual etching process, further improving the accuracy of determining through-hole bridging defects.
[0075] Specifically, the distances between first through holes with different graphic contours at fixed positions and second through holes with different graphic contours at different positions can be obtained to form a minimum distance matrix. In other words, when calculating the minimum distance between the first through hole and the second through hole, the graphic contour information is also taken into account accordingly.
[0076] S102, determine the distance of the first target in each row of the minimum distance matrix that is greater than or equal to the threshold.
[0077] In the embodiments of this application, after obtaining the minimum distance matrix, multiple minimum distances between the second through hole and the first through hole at different positions are obtained. At this time, the first target distance greater than or equal to the threshold in each row of the minimum distance matrix can be determined. That is, multiple distances greater than or equal to the threshold in each row of the minimum distance matrix can be determined, and the first distance greater than or equal to the threshold among the multiple distances is determined as the target distance. In this way, the target distance of each row is obtained. The first distance greater than or equal to the threshold can be the first distance greater than the threshold obtained by traversing each row from left to right.
[0078] Specifically, the target row in the minimum distance matrix can be obtained. The target row can be any row in the minimum distance matrix. The first target distance in the target row that is greater than a threshold can be determined. The threshold can be determined based on the fact that there is no bridging defect in the first and second through holes. In other words, the target distance is the safe critical distance between the first and second through holes.
[0079] The row vector of the target row can be represented by Row, and the threshold can be represented by Threshold.
[0080] S103, determine multiple safe distance location points based on multiple target distances.
[0081] In the embodiments of this application, after determining the target distance of each row in the minimum distance matrix, multiple target distances in the minimum distance matrix can be obtained. Each target distance is determined by the distance between the second through hole and the first through hole at a certain position. The safe distance position point corresponding to each target distance can be determined according to each target distance, thereby obtaining multiple safe distance position points. When the second through hole is at the safe distance position point, the first through hole and the second through hole are at the critical position of the through hole bridging defect.
[0082] Specifically, in determining the safe distance location based on the target distance, the selection of the safe distance location can be determined according to the actual situation, as detailed below:
[0083] As one possible implementation, a threshold position point corresponding to the target distance can be determined based on the target distance. The position point with the same x-coordinate as the threshold position point but shifted one position forward on the y-coordinate is determined as the safe distance position point. When the target distance is greater than or equal to the threshold, it means that there is no bridging defect between the first and second through holes. If the y-coordinate of the threshold position point is shifted one position forward and this position point is used as the safe distance position point, the area of the successful region without bridging defects can be increased. Furthermore, the safe distance position point obtained by shifting the y-coordinate of the threshold position point one position forward is the critical position point, which can improve the calculation accuracy and the accuracy of determining whether there is a bridging defect between the two through holes.
[0084] As an example, obtain the threshold position (i, j) in the row vector Row that is first greater than or equal to the threshold Threshold, and take the position (i, j-1) before p(i, j) as the safe distance position.
[0085] As another possible implementation, a threshold position point corresponding to the target distance can be determined based on the target distance. The position point with the same x-coordinate as the threshold position point but with its y-coordinate shifted one position to the right is determined as the safe distance position point. When the target distance is greater than or equal to the threshold, it means that there is no bridging defect between the first and second through holes. If the y-coordinate of the threshold position point is shifted one position to the right and this position point is taken as the safe distance position point, this safe distance position point is the critical position point, which can improve the calculation accuracy and improve the accuracy of determining whether there is a bridging defect between the two through holes.
[0086] In practical applications, multiple safe distance locations can be stored in the initial matrix to be fitted (N) so that the multiple safe distance locations in the initial matrix to be fitted can be processed directly in the subsequent process.
[0087] In the embodiments of this application, during the process of determining the safe distance location point based on the threshold location point, there may be data duplication. In this case, duplicate data can be deleted, and only one data can be retained to improve the accuracy of the data and improve the accuracy of determining whether there is a bridging defect between two through holes.
[0088] Specifically, the initial position point is determined by having the same x-coordinate as the threshold position point and shifting the y-coordinate one position forward or one position backward. The multiple initial position points include multiple target position points with the same x-coordinate. One target position point is selected from the multiple target position points as the safe distance position point, and the remaining target position points are deleted. The safe distance position point can be determined from the multiple target position points based on the positional relationship between the first through hole and the second through hole.
[0089] As an example, when the positional relationship between the first and second through holes is the first positional relationship, i.e., type=1, the target position point whose ordinate is at the first data position among multiple target position points can be retained and determined as the safe distance position point. Here, the ordinate being at the first data position can be determined by traversing multiple target position points with the same abscissa from top to bottom for the matrix. This is because when type=1, taking the target position point whose ordinate is at the first data position can increase the area of the successful area without bridging defects obtained in the end, which can improve the calculation accuracy and improve the accuracy of determining whether there is a bridging defect between the two through holes.
[0090] As another example, when the positional relationship between the first through hole and the second through hole is the second positional relationship, that is, when type=0, the target position point whose ordinate is at the last data position among multiple target position points can be retained and the target position point is determined as the safe distance position point. Here, the ordinate being at the last data position can be determined by traversing multiple target position points with the same abscissa from top to bottom for the matrix.
[0091] In other words, after deleting multiple target location points with the same x-coordinate, multiple safe distance location points can be determined, and these safe distance location points have different x-coordinates, forming a matrix M_N to be fitted. The matrix M_N includes two columns: the first column represents the x-coordinate (X) of the safe distance location points, and the second column represents the y-coordinate (Y) of the safe distance location points. (Refer to...) Figure 9 As shown.
[0092] S104, Fit the safety distance curve based on the safety distance location point.
[0093] In the embodiments of this application, after obtaining multiple safety distance location points, a safety distance curve can be fitted based on the multiple safety distance location points. The safety distance curve can be used as a critical curve to divide the failure region where there is a bridging defect between the first through hole and the second through hole and the success region where there is no bridging defect.
[0094] For details, please refer to Figure 10 As shown, we can first construct the objective function and constraints for the safety distance curve. The objective function aims to make multiple safety distance points as close as possible to the fitted safety distance curve, with the optimal result being that all multiple safety distance points lie within the fitted safety distance curve. Next, we construct the logarithmic barrier augmentation function, selecting the initial point, penalty factor, and reduction coefficient. We update the logarithmic barrier augmentation function based on the penalty factor and reduction coefficient, and then perform an unconstrained solution to the logarithmic barrier augmentation. If the stopping condition (accuracy or number of calculations) is met, the current solution is considered optimal. (Refer to...) Figure 11 As shown, the fitted safety distance curve f is obtained. If it does not meet the requirements, the process continues to update the logarithmic barrier augmentation function according to the latest parameters, such as the penalty factor and the reduction coefficient, and then performs an unconstrained solution for the logarithmic barrier augmentation.
[0095] S105, by integrating the safety distance curve, the failure region where there is a bridging defect between the first through hole and the second through hole and the success region where there is no bridging defect are obtained.
[0096] In the embodiments of this application, after fitting a safety distance curve using multiple safety distance location points, the safety distance curve can be integrated to obtain the failure region where there is a bridging defect between the first through hole and the second through hole, and the success region where there is no bridging defect.
[0097] Specifically, when integrating using the safety distance curve, assuming that the overlay error follows a Gaussian probability density distribution, the corresponding integration intervals can be determined based on the positional relationship between the first and second through holes, so as to obtain the accurate failure region where there is a bridging defect between the first and second through holes and the success region where there is no bridging defect.
[0098] As an example, when the positional relationship between the first through hole and the second through hole is the first positional relationship, that is, when type=1, the integration is performed in two dimensions, where the two dimensions include the X direction and the Y direction. The integration can be a double integral, with the integration interval in the X direction from negative infinity to positive infinity, and the integration interval in the Y direction from the safety distance curve to positive infinity.
[0099] As another example, when the positional relationship between the first and second through holes is the second positional relationship, i.e., type = 0, integration is performed in the two-dimensional direction. The integration can be a double integral, with the integration interval in the X direction from negative infinity to positive infinity, and the integration interval in the Y direction from negative infinity to the safety distance curve. (Reference) Figure 12 As shown, this is a schematic diagram of the result obtained by performing double integration in the two-dimensional direction. The shaded area in the figure represents the successful region P where there is no bridging defect.
[0100] In practical applications, the first and second through holes can be manufactured using a double exposure process.
[0101] Therefore, this application addresses the decisive factors affecting bridging defects in via layers: lithographic CD variation and overlay error. Overlay error is addressed using a moving second via, while lithographic CD variation is addressed using the graphic contours of the first and second vias. A safe distance curve is obtained through the minimum distance matrix between the first and second vias, and further integration yields the failure region where bridging defects exist between the first and second vias, and the success region where no bridging defects exist. In other words, the method provided in this application can detect potential bridging hotspots and predict the corresponding probability of failure (PoF) or probability of success (PoS) of the via layer. Using the method provided in the embodiments of this application, the layout design of integrated circuits, lithography process selection, and related parameters can be quantitatively guided, and negative effects caused by mask three-dimensional effects or overlay errors can be quantitatively compensated.
[0102] This application provides a method for determining through-hole bridging defects. The method includes: obtaining the distance between a first through-hole at a fixed position and second through-holes at different positions to form a minimum distance matrix; determining the first target distance greater than or equal to a threshold in each row of the minimum distance matrix; determining multiple safe distance position points based on multiple target distances; fitting a safe distance curve based on the safe distance position points; and integrating the safe distance curve to obtain the failure region where bridging defects exist between the first and second through-holes and the success region where no bridging defects exist. Thus, this application adjusts the position of the second through-hole, introduces the statistical characteristics of overlay error, obtains multiple safe distance position points based on the minimum distance matrix, and then obtains the safe distance curve between the first and second through-holes. Integrating the safe distance curve yields the failure region where bridging defects exist between the first and second through-holes and the success region where no bridging defects exist. Subsequently, the failure region and success region can be used to directly determine whether bridging defects exist between the two through-holes, and can also be used to guide the optimized design of the through-holes and etching process parameters.
[0103] Based on the through-hole bridging defect determination method provided in the above embodiments, this application also provides a through-hole bridging defect determination device, the working principle of which will be described in detail below with reference to the accompanying drawings.
[0104] See Figure 13 The figure is a schematic diagram of a through-hole bridging defect determination device provided in an embodiment of this application.
[0105] The through-hole bridging defect determination device 100 provided in this embodiment includes:
[0106] The acquisition unit 110 is used to acquire the distance between a first through hole at a fixed position and second through holes at different positions to form a minimum distance matrix;
[0107] The first determining unit 120 is used to determine the first target distance in each row of the minimum distance matrix that is greater than or equal to a threshold.
[0108] The second determining unit 130 is used to determine multiple safe distance location points based on the multiple target distances;
[0109] Fitting unit 140 is used to fit a safety distance curve based on the safety distance location point;
[0110] The integration unit 150 is used to integrate using the safety distance curve to obtain the failure region where there is a bridging defect between the first through hole and the second through hole and the success region where there is no bridging defect.
[0111] Optionally, the second determining unit 130 is configured to:
[0112] Determine the threshold position point corresponding to the target distance based on the target distance;
[0113] The location point with the same x-coordinate as the threshold location point, but with its y-coordinate shifted one position forward or one position backward, is determined as the safe distance location point.
[0114] Optionally, the second determining unit 130 is configured to:
[0115] The initial position point is determined by having the same x-coordinate as the threshold position point and shifting the y-coordinate one position forward or one position backward.
[0116] The plurality of initial position points include a plurality of target position points with the same x-coordinate. A safe distance position point is determined among the plurality of target position points based on the positional relationship between the first through hole and the second through hole.
[0117] Optionally, the positional relationship between the first through hole and the second through hole includes a first positional relationship and a second positional relationship. The first positional relationship is that the second through hole is located in the first quadrant and the third quadrant of the first through hole with the first through hole as the origin, and the second positional relationship is located in the second quadrant and the fourth quadrant of the first through hole with the first through hole as the origin.
[0118] The integration unit 150 is used for:
[0119] Based on the first positional relationship, the two-dimensional direction is integrated, which includes the X direction and the Y direction. The X direction and the Y direction are perpendicular, and the integration interval of the Y direction is from the safety distance curve to positive infinity.
[0120] or,
[0121] Based on the second positional relationship, integration is performed in the two-dimensional direction, and the integration interval in the Y direction is from negative infinity to the safety distance curve.
[0122] Optionally, the acquisition unit 110 is configured to:
[0123] The first through hole is fixed in position, and the second through hole moves in a two-dimensional direction within a fixed range according to the Gaussian probability density distribution. The two-dimensional direction includes the X direction and the Y direction, and the X direction and the Y direction are perpendicular.
[0124] As the second through hole moves along the X and Y directions, the minimum distance between the first through hole and the second through hole is obtained.
[0125] Optionally, the first determining unit 120 is configured to:
[0126] Obtain the target row in the minimum distance matrix, where the target row is any row in the minimum distance matrix;
[0127] The first target distance in the target row that is greater than a threshold is determined, the threshold being determined based on the absence of bridging defects in the first and second vias.
[0128] Optionally, the acquisition unit 110 is configured to:
[0129] Obtain the distances between first through holes with different graphic contours at fixed positions and second through holes with different graphic contours at different positions, and form a minimum distance matrix.
[0130] Optionally, the first through hole and the second through hole are disposed in different through hole layers.
[0131] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on its differences from other embodiments. In particular, the device embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments. The device embodiments described above are merely illustrative. The units and modules described as separate components may or may not be physically separate. Furthermore, some or all of the units and modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without creative effort.
[0132] The above description is merely a preferred embodiment of this application. Although this application has disclosed preferred embodiments above, it is not intended to limit this application. Any person skilled in the art can make many possible variations and modifications to the technical solutions of this application using the methods and techniques disclosed above, or modify them into equivalent embodiments with equivalent changes, without departing from the scope of the technical solutions of this application. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this application without departing from the content of the technical solutions of this application shall still fall within the protection scope of the technical solutions of this application.
Claims
1. A method for determining through-hole bridging defects, characterized in that, The method includes: Obtain the distances between the first through hole at a fixed position and the second through holes at different positions, and form a minimum distance matrix; Determine the first target distance in each row of the minimum distance matrix that is greater than or equal to the threshold; Multiple safe distance location points are determined based on the multiple target distances; Fit a safety distance curve based on the safety distance location points; By integrating the safety distance curve, the failure region where bridging defects exist between the first through hole and the second through hole, and the success region where bridging defects do not exist, can be obtained.
2. The method according to claim 1, characterized in that, Determining multiple safe distance location points based on multiple target distances includes: Determine the threshold position point corresponding to the target distance based on the target distance; The location point with the same x-coordinate as the threshold location point, but with its y-coordinate shifted one position forward or one position backward, is determined as the safe distance location point.
3. The method according to claim 2, characterized in that, The step of determining a safe distance location point as one position point with the same x-coordinate as the threshold location point but with its y-coordinate shifted one position forward or one position backward includes: The initial position point is determined by having the same x-coordinate as the threshold position point and shifting the y-coordinate one position forward or one position backward. The plurality of initial position points include a plurality of target position points with the same x-coordinate. A safe distance position point is determined among the plurality of target position points based on the positional relationship between the first through hole and the second through hole.
4. The method according to claim 1, characterized in that, The positional relationship between the first through hole and the second through hole includes a first positional relationship and a second positional relationship. The first positional relationship is that the second through hole is located in the first quadrant and the third quadrant of the first through hole with the first through hole as the origin. The second positional relationship is that the second through hole is located in the second quadrant and the fourth quadrant of the first through hole with the first through hole as the origin. The integration using the safety distance curve includes: Based on the first positional relationship, the two-dimensional direction is integrated, which includes the X direction and the Y direction. The X direction and the Y direction are perpendicular, and the integration interval of the Y direction is from the safety distance curve to positive infinity. or, Based on the second positional relationship, integration is performed in the two-dimensional direction, and the integration interval in the Y direction is from negative infinity to the safety distance curve.
5. The method according to claim 1, characterized in that, The distance between the first through hole at a fixed position and the second through holes at different positions includes: The first through hole is fixed in position, and the second through hole moves in a two-dimensional direction within a fixed range according to the Gaussian probability density distribution. The two-dimensional direction includes the X direction and the Y direction, and the X direction and the Y direction are perpendicular. As the second through hole moves along the X and Y directions, the minimum distance between the first through hole and the second through hole is obtained.
6. The method according to claim 1, characterized in that, Determining the first target distance greater than or equal to a threshold in each row of the minimum distance matrix includes: Obtain the target row in the minimum distance matrix, where the target row is any row in the minimum distance matrix; The first target distance in the target row that is greater than a threshold is determined, the threshold being determined based on the absence of bridging defects in the first and second vias.
7. The method according to any one of claims 1-6, characterized in that, The step of obtaining the distance between a first through hole at a fixed position and second through holes at different positions to form a minimum distance matrix includes: Obtain the distances between first through holes with different graphic contours at fixed positions and second through holes with different graphic contours at different positions, and form a minimum distance matrix.
8. The method according to any one of claims 1-6, characterized in that, The first through hole and the second through hole are disposed in different through hole layers.
9. A device for determining defects in through-hole bridging, characterized in that, The device includes: The acquisition unit is used to acquire the distance between a first through hole at a fixed position and second through holes at different positions, forming a minimum distance matrix; The first determining unit is used to determine the first target distance in each row of the minimum distance matrix that is greater than or equal to a threshold. The second determining unit is used to determine multiple safe distance location points based on the multiple target distances; A fitting unit is used to fit a safety distance curve based on the safety distance location points; An integration unit is used to integrate the safety distance curve to obtain the failure region where there is a bridging defect between the first through hole and the second through hole, and the success region where there is no bridging defect.
10. The apparatus according to claim 9, characterized in that, The second determining unit is used for: Determine the threshold position point corresponding to the target distance based on the target distance; The location point with the same x-coordinate as the threshold location point, but with its y-coordinate shifted one position forward or one position backward, is determined as the safe distance location point.