A heat dissipation structure for circuit board mounting

Abstract

This application relates to the field of circuit board heat dissipation structure technology, and provides a heat dissipation structure for circuit board mounting, including an upper cover and a lower cover, both of which are made of thermally conductive metal. A first insulating plate is disposed in the lower cover, and a through hole is formed on the first insulating plate. A first protrusion penetrating the through hole is disposed on the lower cover, and the first protrusion is at the same height as the first insulating plate. A first insulating tape is disposed on the first protrusion, and a plurality of first insulating adhesives are distributed on the first insulating tape. The circuit board is laid flat on the insulating plate and the first protrusion, and the first insulating adhesives adhere to the circuit board and the first insulating tape. The upper cover is used to seal and fix the circuit board inside the lower cover. Based on this, the overall structure of this application is ingeniously designed, has low design cost, and provides good heat dissipation for the circuit board.

Description

Technical Field

[0001] This application relates to the field of heat dissipation structure technology for circuit boards, and in particular to a heat dissipation structure for mounting circuit boards. Background Technology

[0002] In existing commercially available power charging management systems, circuit boards are used as the connection carriers between various electronic components. These circuit boards are typically housed in metal casings with good thermal conductivity. However, because there are many components on the circuit board surface, some may conduct through the metal casing, leading to short circuits. The common practice is to place a thick insulating plate inside the metal casing for isolation. However, this insulation prevents heat from the circuit board from being directly transferred to the metal casing. Typically, a spacer cavity is used to transfer heat to the metal casing using air as the heat transfer medium, but this structure has low heat dissipation efficiency. Therefore, further improvements are needed. Summary of the Invention

[0003] To address the problem of low heat dissipation efficiency in existing circuit board mounting systems, the purpose of this application is to provide a heat dissipation structure for circuit board mounting.

[0004] The heat dissipation structure for circuit board mounting provided in this application adopts the following technical solution:

[0005] A heat dissipation structure for circuit board mounting includes an upper cover and a lower cover, both made of thermally conductive metal. A first insulating plate is disposed in the lower cover, with a through hole. A first protrusion penetrating the through hole is disposed on the lower cover, the first protrusion being at the same height as the first insulating plate. A first insulating tape is disposed on the first protrusion, with a plurality of first insulating adhesives distributed on the first insulating tape. The circuit board is laid flat on the insulating plate and the first protrusion, the first insulating adhesives adhering to the circuit board and the first insulating tape. The upper cover is used to seal and fix the circuit board inside the lower cover.

[0006] By adopting the above technical solution, the circuit board avoids direct contact with the lower cover during installation, thus preventing short circuit hazards. The main heat-generating components of the circuit board during operation are in contact with the first insulating adhesive. The first insulating adhesive has high thermal conductivity and does not cause circuit continuity. The heat generated by the components is transferred to the lower cover via the first insulating tape using the first insulating adhesive. This allows the circuit board and the first protrusion to be isolated by the first insulating tape alone. This solves the problem of short circuits caused by direct contact between the circuit board and the metal lower shell in traditional structures, and also solves the problem of low heat transfer efficiency when only air is used as the heat transfer medium. The overall structure is ingeniously designed, has low design cost, and provides good heat dissipation for the circuit board.

[0007] Optionally, the upper cover may be mirror-image-mounted with a second insulating plate, a second protrusion, a second insulating tape, and a second insulating adhesive.

[0008] By adopting the above technical solution, the upper cover, using the same structure of the second insulating plate, the second protrusion, the second insulating tape, and the second insulating colloid, can make contact with both sides of the circuit board, so that the heat generated by the circuit board during operation can be effectively utilized by the upper and lower covers to maximize the heat dissipation performance, resulting in a significant heat dissipation effect.

[0009] Optionally, both the first protrusion and the lower cover are made of thermally conductive metal and are integrally formed.

[0010] By adopting the above technical solution, the first protrusion is also made of thermally conductive metal. When the first insulating colloid transfers heat to the first insulating tape, the heat can be quickly transferred using the first protrusion, which greatly shortens the space and distance for heat transfer and improves the heat conduction efficiency in many ways. At the same time, the first protrusion and the lower cover are integrally formed, which has good overall stability and facilitates the limiting of the installation position of the first insulating plate.

[0011] Optionally, the outer side of the lower cover is provided with a plurality of heat sinks, and a first cooling fan is provided on the heat sinks.

[0012] By adopting the above technical solution, multiple heat sinks are used to increase the contact area between the lower cover and the outside air, effectively increasing the heat dissipation area of ​​the lower cover and improving the heat dissipation performance. At the same time, the first cooling fan on the heat sink can dissipate the heat on the lower cover more quickly when the first cooling fan is working.

[0013] Optionally, the top cover is provided with a filter screen, and a louver is hinged to the filter screen. A second cooling fan is provided along the rotation direction of the louver, and the second cooling fan blows air towards the circuit board.

[0014] By adopting the above technical solution, when the second cooling fan is working, the vortex wind force generated flows from the outside through the filter and impacts the louvers. After being impacted, the louvers open, allowing the external wind to pass through the internal circuit board to form a circulating wind. This utilizes natural wind to assist in cooling the heat generated by the circuit board, achieving multi-dimensional heat transfer and cooling with comprehensive heat dissipation. At the same time, when the second cooling fan stops working, the louvers return to their original position along the hinge point, preventing external dust or obvious foreign objects from entering the interior and affecting the circuit board. Meanwhile, the filter can also prevent larger particles of foreign objects from entering the interior through the louvers.

[0015] Optionally, the first insulating plate has a plurality of first vent holes, and the second insulating plate has a plurality of second vent holes.

[0016] By adopting the above technical solution, the first and second vents allow external air to penetrate into every corner of the upper and lower covers, increasing the contact area between the circuit board, various structural surfaces, and the air, thereby achieving rapid heat reduction within the space and effectively improving the service life of the power supply equipment.

[0017] Optionally, the first insulating plate abutting against one side of the lower cover is provided with a plurality of first support blocks, and the second insulating plate abutting against one side of the upper cover is provided with a plurality of second support blocks.

[0018] By adopting the above technical solution, gaps are created between the first insulating plate and the lower cover, and between the second insulating plate and the upper cover, using the first support block and the second support block. This increases the local gap cavity, facilitates airflow, and improves heat dissipation.

[0019] Optionally, the circuit board is provided with a connector on its outer periphery. The connector is square-shaped with a clearance in the middle. The two sides of the connector are provided with sliding grooves. The circuit board is inserted into the sliding grooves. The outer periphery of the connector is provided with a plurality of connector heads. The lower cover is provided with snap-fit ​​grooves that are adapted to the connector heads.

[0020] By adopting the above technical solution, the circuit board can be fixed to the connector by plugging in the groove on the connector. Then, the connector head on the connector is snapped into the snap-fit ​​groove on the lower cover, thereby achieving effective installation and positioning of the circuit board. This structure can effectively avoid the shaking phenomenon that occurs during ordinary flat installation of the circuit board, which would affect the adhesion between the circuit board surface and the first insulating colloid. It can effectively ensure the stable heat transfer effect, and at the same time avoid the potential damage to components caused by the impact of the circuit board shaking. The overall design is reasonable and the related structures are closely connected.

[0021] Optionally, the connector is made of silicone.

[0022] By adopting the above technical solution, the connector is made of silicone material, so that the outer periphery of the circuit board will not make direct contact with the bottom cover, avoiding the possibility of short circuit. At the same time, the connector is limited to the outer periphery of the circuit board, with less contact surface, which helps the circuit board to achieve stable installation without affecting the normal heat dissipation of the circuit board.

[0023] In summary, this application includes at least one of the following beneficial effects:

[0024] 1. During installation, the circuit board avoids direct contact with the lower cover, preventing short circuits. The main heat generated by the circuit board during operation comes into contact with the first insulating adhesive. The first insulating adhesive has high thermal conductivity and does not cause circuit continuity. The heat generated by the components is transferred to the lower cover via the first insulating tape. This allows the circuit board and the first protrusion to be isolated by the first insulating tape alone. This solves the problem of short circuits caused by direct contact between the circuit board and the metal lower shell in traditional structures, as well as the problem of low heat transfer efficiency when using only air as the heat transfer medium. The overall structure is ingeniously designed, has low design cost, good heat dissipation, and strong practicality, making it highly valuable for market promotion.

[0025] 2. The top cover utilizes the same structure of second insulating plate, first protrusion, first insulating tape and first insulating colloid to make contact with both sides of the circuit board, so that the heat generated by the circuit board during operation can be effectively utilized by the top cover and the bottom cover to maximize the heat dissipation performance, and the heat dissipation effect is obvious.

[0026] 3. When the second cooling fan is working, the vortex airflow generated flows from the outside through the filter and impacts the louvers. The louvers open after being impacted, allowing the outside air to pass through the internal circuit board to form a circulating airflow. This natural airflow is used to assist in cooling the heat generated by the circuit board, achieving multi-dimensional heat transfer and cooling, resulting in comprehensive heat dissipation. At the same time, when the second cooling fan stops working, the louvers return to their original position along the hinge point to prevent external dust or obvious foreign objects from entering the interior and affecting the circuit board. The filter can also prevent larger particles of foreign objects from entering the interior through the louvers.

[0027] 4. By using the first support block and the second support block, gaps are created between the first insulating plate and the lower cover, and between the second insulating plate and the upper cover, increasing the local gap cavity, facilitating airflow, and improving heat dissipation.

[0028] 5. The circuit board can be fixed to the connector by plugging in the groove on the connector. Then, the connector head on the connector is snapped into the snap-fit ​​groove on the lower cover, thereby achieving effective installation and positioning of the circuit board. This structure can effectively avoid the shaking phenomenon that occurs during ordinary flat installation of the circuit board, which would affect the adhesion between the circuit board surface and the first insulating adhesive. It can effectively ensure the stable heat transfer effect, and at the same time avoid the potential damage to components caused by the impact of the circuit board shaking. The overall design is reasonable and the related structures are closely connected. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of this application;

[0030] Figure 2This is a front view of the circuit board of this application installed inside the lower cover;

[0031] Figure 3 yes Figure 2 Sectional view of AA;

[0032] Figure 4 yes Figure 3 Enlarged view of section A in the middle;

[0033] Figure 5 This is a schematic diagram of the structure of the heat sink and the second cooling fan highlighted in this application;

[0034] Figure 6 This is a schematic diagram of the structure of the circuit board mounted on the connector, as shown in this application;

[0035] Figure 7 yes Figure 6 Enlarged view of section B;

[0036] Figure 8 This is a schematic diagram of the protruding graphics card slot in the lower cover of this application;

[0037] Figure 9 yes Figure 8 Enlarged view of section C;

[0038] Figure 10 yes Figure 1 Enlarged view of section D in the middle;

[0039] Figure 11 This is a schematic diagram of the internal structure of the top cover.

[0040] Explanation of reference numerals in the attached figures:

[0041] 100. Top cover; 110. Second insulating plate; 111. Second vent; 112. Second support block; 120. Second protrusion; 121. Second insulating tape; 122. Second insulating colloid; 130. Filter screen; 131. Louver; 140. Second cooling fan; 200. Bottom cover; 210. First insulating plate; 211. First vent; 212. First support block; 220. First protrusion; 221. First insulating tape; 222. First insulating colloid; 230. Heat sink; 231. First cooling fan; 240. Snap-fit ​​groove; 300. Circuit board; 400. Connector; 410. Clearance opening; 420. Slide groove; 430. Connector head. Detailed Implementation

[0042] The following is in conjunction with the appendix Figure 1-11 This application will be described in further detail below.

[0043] Example 1: A heat dissipation structure for circuit board mounting, see... Figure 1 and Figure 2It includes an upper cover 100 and a lower cover 200. The upper cover 100 and the lower cover 200 are hollow structures and are both made of thermally conductive metal materials, such as copper and aluminum alloy. In this embodiment, they are selectively used according to the installation conditions. A circuit board 300 is installed inside the lower cover 200. By setting relevant heat dissipation structures in the lower cover 200 and the upper cover 100, the circuit board 300 can be effectively dissipated after installation and use, thus extending the service life of the circuit board 300.

[0044] Specifically, see Figure 3 and Figure 4 The lower cover 200 is provided with a first insulating plate 210, which has a through hole. The lower cover 200 is provided with a first protrusion 220 that passes through the through hole. The first protrusion 220 is at the same height as the first insulating plate 210. A first insulating tape 221 is provided on the first protrusion 220. A plurality of first insulating adhesives 222 are distributed on the first insulating tape 221. Both the first insulating tape 221 and the first insulating adhesives 222 are thermally conductive. The circuit board 300 is laid flat on the insulating plate and the first protrusion 220. The first insulating adhesives 222 are attached to the circuit board 300 and the first insulating tape 221.

[0045] During installation, the circuit board 300 avoids direct contact with the lower cover 200 via the first insulating plate 210, preventing potential short circuits. When the circuit board 300 is in operation, the main heat-generating components come into contact with the first insulating adhesive 222. The first insulating adhesive 222 has high thermal conductivity and does not cause circuit continuity. The heat generated by the components is transferred to the lower cover 200 via the first insulating tape 221 using the first insulating adhesive 222. This allows the circuit board 300 and the first protrusion 220 to be isolated solely by the first insulating tape 221. This solves the problem of short circuits caused by direct contact between the circuit board 300 and the metal lower cover in traditional structures, as well as the problem of low heat transfer efficiency when only air is used as the heat transfer medium. The overall structural design is ingenious.

[0046] The first insulating plate 210 has several first vent holes 211, allowing external air to pass through all corners inside the upper cover 100 and lower cover 200, increasing the contact area between the circuit board 300, various structural surfaces, and air, achieving rapid heat reduction within the space, and effectively improving the service life of the power supply equipment. Several first support blocks 212 are provided on one side of the first insulating plate 210 that abuts against the lower cover 200. These first support blocks 212 create gaps between the first insulating plate 210 and the lower cover 200, and between the second insulating plate 110 and the upper cover 100, increasing localized cavities, facilitating airflow, and improving heat dissipation.

[0047] It should be noted that both the first protrusion 220 and the lower cover 200 are made of thermally conductive metal, and the two use the same material and are integrally formed. The first protrusion 220 is also made of thermally conductive metal. When the first insulating colloid 222 transfers heat to the first insulating tape 221, the heat can be quickly transferred using the first protrusion 220, which greatly shortens the space and distance for heat transfer and improves the heat conduction efficiency in many ways. At the same time, the first protrusion 220 and the lower cover 200 are integrally formed structures, which have good overall stability and facilitate the limiting of the installation position of the first insulating plate 210.

[0048] See Figure 5 The outer surface of the lower cover 200 is provided with a plurality of heat sinks 230, which are integrally formed with the lower cover 200. The heat sinks 230 are formed by providing multiple channels on the bottom surface of the lower cover 200. A first cooling fan 231 is provided on the heat sink 230. The number of first cooling fans 231 can be set according to the actual installed area of ​​the lower cover 200, which is not specifically limited in this embodiment. The use of multiple heat sinks 230 is used to increase the contact area between the lower cover 200 and the outside air, effectively increasing the heat dissipation area of ​​the lower cover 200 and improving the heat dissipation performance. At the same time, the first cooling fans 231 on the heat sinks 230 can dissipate the heat on the lower cover 200 more quickly when they are working.

[0049] See Figure 6 and Figure 7 The circuit board 300 is provided with a connector 400 on its outer periphery. The connector 400 is square and has a clearance opening 410 in the middle. The two sides of the connector 400 are symmetrically arranged with grooves 420 in the length direction. The circuit board 300 is inserted into the grooves 420. The connector 400 is provided with several connectors 430 on its outer periphery.

[0050] See Figure 8 and Figure 9 The inner wall of the lower cover 200 is provided with several snap-fit ​​grooves 240 along the length of the connector 400.

[0051] See Figures 6-9The snap-fit ​​groove 240 is adapted to the connector 430. Using the sliding groove 420 on the connector 400, the circuit board 300 can be fixed to the connector 400 by plugging in. Then, the connector 430 on the connector 400 snaps into the snap-fit ​​groove 240 on the lower cover 200, thereby achieving effective installation and positioning of the circuit board 300. This structure can effectively avoid the shaking phenomenon that occurs during the ordinary flat installation of the circuit board 300, which would affect the adhesion between the surface of the circuit board 300 and the first insulating adhesive 222. It can effectively ensure the stable heat transfer effect, and at the same time avoid the potential damage to components caused by the impact of the circuit board 300 shaking. The overall design is reasonable and the related structures are closely connected.

[0052] It should be noted that the connector 400 is made of silicone material, so that the outer periphery of the circuit board 300 will not make direct contact with the lower cover 200, avoiding the possibility of short circuit. At the same time, the connector 400 is limited to the outer periphery of the circuit board 300, with less contact surface, which helps the circuit board 300 to achieve stable installation without affecting the normal heat dissipation of the circuit board 300.

[0053] See Figure 1 , Figure 2 and Figure 10 The upper cover 100 is equipped with a filter screen 130, and a louver 131 is hinged to the filter screen 130. When the upper cover 100 and the lower cover 200 are installed, they are vertically arranged, and the louver 131 can be closed under the action of gravity. A second cooling fan 140 is arranged along the rotation direction of the louver 131. The second cooling fan 140 blows air towards the circuit board 300. When the second cooling fan 140 is working, the vortex airflow generated flows from the outside through the filter screen 130 and impacts the louver 131, causing the louver 131 to be impacted. The louvers open at the rear edge, allowing external air to circulate through the internal circuit board 300, thus using natural wind to assist in cooling the heat generated by the circuit board 300. This achieves multi-dimensional heat transfer and comprehensive heat dissipation. Simultaneously, when the second cooling fan 140 stops working, the louvers 131 return to their original position along the hinge point, preventing external dust or foreign objects from entering and affecting the circuit board 300. The filter 130 also prevents larger particles from entering through the louvers 131.

[0054] See Figure 1 and Figure 11The upper cover 100 is used to enclose the circuit board 300 and fix it inside the lower cover 200. The upper cover 100 has a mirror image of the second insulating plate 110, the second protrusion 120, the second insulating tape 121 and the second insulating adhesive 122. When the upper cover 100 is installed, the second insulating adhesive 122 simultaneously abuts against the other side of the circuit board 300. The upper cover 100 uses the same structure of the second insulating plate 110, the second protrusion 120, the second insulating tape 121 and the second insulating adhesive 122 to make contact with both sides of the circuit board 300, so that the heat generated by the circuit board 300 during operation can be effectively utilized by the upper cover 100 and the lower cover 200 to maximize the heat dissipation performance, and the heat dissipation effect is obvious.

[0055] The second insulating plate 110 has a second vent hole 111, which allows external air to pass through all corners inside the upper cover 100 and lower cover 200, increasing the contact area between the circuit board 300, various structural surfaces and air, achieving rapid heat reduction within the space, and effectively improving the service life of the power supply equipment. Several second support blocks 112 are provided on one side of the second insulating plate 110 that abuts against the upper cover 100. These second support blocks 112 create gaps between the first insulating plate 210 and the lower cover 200, and between the second insulating plate 110 and the upper cover 100, increasing localized cavities, facilitating airflow, and improving heat dissipation.

[0056] The implementation principle of this application embodiment is as follows: During installation, the circuit board 300 avoids direct contact with the lower cover 200 via the first insulating plate 210, preventing a short circuit hazard. When the circuit board 300 is operating, the main heat-generating components abut against the first insulating adhesive 222. The first insulating adhesive 222 has high thermal conductivity and does not cause circuit continuity. The heat generated by the components is transferred to the lower cover 200 via the first insulating tape 221 using the first insulating adhesive 222. This allows the circuit board 300 and the first protrusion 220 to be isolated solely by the first insulating tape 221, solving the problem of short circuits caused by direct contact between the circuit board 300 and the metal lower cover in traditional structures, as well as the low heat transfer efficiency when using only air as the heat transfer medium. To improve heat dissipation, a second cooling fan 140 is used to accelerate the cooling of the internal circuit board 300.

[0057] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heat dissipation structure for circuit board mounting, characterized in that: The utility model provides a circuit board fixing device, including upper cover (100) and lower cover (200), upper cover (100) and lower cover (200) are made of heat conducting metal material, be provided with first insulating plate (210) in lower cover (200), be provided with through -hole on first insulating plate (210), be provided with first protruding portion (220) through the through -hole on lower cover (200), first protruding portion (220) with first insulating plate (210) height is same, be provided with first insulating tape (221) on first protruding portion (220), first insulating tape (221) is distributed with a plurality of first insulating colloid (222), circuit board (300) is installed on the insulating plate with first protruding portion (220), first insulating colloid (222) is adhered to circuit board (300) with first insulating tape (221), upper cover (100) is used for closing circuit board (300) fixed in lower cover (200) inside, Second insulating plate (110), second protruding portion (120), second insulating tape (121) and second insulating colloid (122) are mirror image arranged in upper cover (100), A plurality of first supporting blocks (212) are arranged on one side of the first insulating plate (210) abutting against the lower cover (200), and a plurality of second supporting blocks (112) are arranged on one side of the second insulating plate (110) abutting against the upper cover (100). The outer periphery of the circuit board (300) is provided with a connecting piece (400), the connecting piece (400) is in the shape of a square frame and has a clearance (410) in the middle, the two sides of the connecting piece (400) symmetrically provided with a sliding groove (420), the circuit board (300) is inserted into the sliding groove (420), and the outer periphery of the connecting piece (400) is provided with a plurality of connecting heads (430), the lower cover (200) is provided with a clamping groove (240) matched with the connecting heads (430).

2. The heat dissipating structure for a circuit board mounting according to claim 1, characterized by: The first protruding portion (220) and the lower cover (200) are made of heat-conducting metal material and are integrally formed.

3. The heat dissipating structure for a circuit board mounting according to claim 1, characterized by: A plurality of heat dissipation fins (230) are arranged on the outer side of the lower cover (200), and a first heat dissipation fan (231) is arranged on the heat dissipation fin (230).

4. The heat dissipating structure for a circuit board mounting according to claim 1, characterized by: The upper cover (100) is provided with a filter screen (130), the filter screen (130) is hingedly provided with a louver (131), a second heat dissipation fan (140) is arranged at the position along the rotating direction of the louver (131), and the second heat dissipation fan (140) blows air towards the circuit board (300).

5. The heat dissipating structure for a circuit board mounting according to claim 1, characterized by: A plurality of first air holes (211) are arranged on the first insulating plate (210), and a plurality of second air holes (111) are arranged on the second insulating plate (110).

6. The heat dissipating structure for a circuit board mounting according to claim 1, characterized by: The connecting piece (400) is made of silica gel material.

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