A simulator device for an aircraft attachment point
By using a relay-type structure and a rigid-flexible printed circuit board simulator design, combined with an SOPC single chip and a battery wireless module, the problem of large size and inconvenience of use of aircraft attachment point inspection equipment is solved. This enables fast and accurate simulation and synchronization of multi-attachment point signals, improving testing efficiency.
Patent Information
- Application Number
- CN202310165291.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-02-15
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2043-02-15
AI Technical Summary
Existing aircraft hardpoint inspection equipment is bulky and inconvenient to use, making it difficult to quickly and accurately simulate and measure the effectiveness of various signal loads.
The simulator design adopts a relay-type structure, combining a rigid-flex printed circuit board and an SOPC single chip. It exchanges and synchronizes data through a serial asynchronous bus, eliminates connectors, integrates bus and non-bus signals, and uses a battery wireless module for data exchange and power supply.
This approach achieves miniaturization of the simulator, simplifies the connection process, reduces test preparation time, and improves test efficiency and space utilization.
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Figure CN116238704B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the technical field of aircraft integrated support, and particularly relates to a simulator device for aircraft hanging points. BACKGROUND
[0002] With the development of science and technology, more and more auxiliary equipment of aircraft is developed. Before the aircraft is loaded with weapons, the inspection of the aircraft hanging points is extremely important, and the effectiveness of the hanging points needs to be checked in advance so as to work effectively after the hanging points are loaded with weapons. At present, there are various types of aircraft hanging points, and the signals are also complex. The traditional method is to use an ATE device to simulate various signal loads so as to measure the effectiveness of the hanging points. The automatic test equipment (ATE) is large in size and heavy in weight, and is very inconvenient in use. Therefore, a simulator with a very small size needs to be designed so as to quickly and accurately check the aircraft hanging point interface. The ATE device is an automatic system, and the purpose is to be used for electrical, thermal and physical tests without direct human intervention. Especially for the inspection of whether the functions of the aircraft hanging points are complete, it is more important. SUMMARY
[0003] The purpose of the present application is to provide a simulator device for aircraft hanging points, which solves the problems of large size and inconvenience in use, and realizes the design of a very small size simulator under the aircraft hanging points.
[0004] In order to achieve the above purpose, the present application adopts the following technical scheme:
[0005] A simulator device for aircraft hanging points comprises a plurality of simulators, the plurality of simulators are connected in sequence in a force type structure, and node data interaction and synchronization are performed between the simulators; the simulator comprises a rigid-flex-rigid printed board 4 and a battery wireless module 3 connected with the rigid-flex-rigid printed board, the rigid-flex-rigid printed board comprises rigid printed boards and a flexible board, the rigid printed boards are welded to form a whole through the flexible board, and the rigid printed board comprises an SOPC single chip 1.
[0006] Preferably, the rigid-flex-rigid printed board is installed in a stacked manner in the simulator shell.
[0007] Preferably, the rigid printed board and the interconnection cable are electrically connected.
[0008] Preferably, the battery wireless module 3 is plugged into the simulator shell through the connector 6.
[0009] Preferably, the wireless battery module is installed on one side of the simulator, and data exchange is performed with the simulator through a serial asynchronous bus.
[0010] Preferably, the battery wireless module comprises a battery module and a wireless module, the battery module is used to provide power for the simulator, and the wireless module is used for data exchange among the plurality of simulators.
[0011] Preferably, the SOPC single chip package has an ARM9 processor, a FPGA chip and necessary interfaces together.
[0012] Preferably, the necessary interfaces include non-bus signals and bus signals; the bus signals include GJB289A bus, HB6096 bus and CAN bus signals; the non-bus interfaces include analog signals, discrete signals, frequency signals and CCIR-D signals.
[0013] Compared with the prior art, the present application has the following advantages:
[0014] The present application is simple in connection and can exchange and synchronize data without adding extra equipment, thus greatly reducing the preparation time of test, reducing the printed board area, more efficiently utilizing the space inside the simulator and reducing the volume of the connector between the interconnected printed boards. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 is a functional block diagram of the SOPC single chip of the simulator device of the present application;
[0016] Figure 2 is a relay type structure diagram of the simulator device of the present application;
[0017] Figure 3 is a battery wireless module and a simulator of the simulator device of the present application;
[0018] Figure 4 is a rigid-flex printed board of the simulator device of the present application;
[0019] Figure 5 is a front view of a simulator housing of the simulator device of the present application;
[0020] Figure 6 is a side view of a simulator housing of the simulator device of the present application;
[0021] Figure 7 is a top view of a simulator housing of the simulator device of the present application. DETAILED DESCRIPTION
[0022] The present application will be further described in detail below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application. In addition, it should be noted that only the parts related to the present application are shown in the drawings for the convenience of description.
[0023] EMBODIMENT
[0024] As Figure 2 The application provides a simulator device for an aircraft hanging point, comprising a plurality of simulators, the plurality of simulators are sequentially connected to form a relay type structure, and node data interaction and synchronization are performed between the simulators; the simulator comprises a rigid-flexible-rigid printed board 4 and a battery wireless module 3 connected to the rigid-flexible-rigid printed board; the rigid-flexible-rigid printed board comprises five rigid printed boards 4 and four flexible boards 5, the rigid printed boards are welded to form an integral whole through the flexible boards, and the rigid printed board comprises an SOPC single chip 1; wherein the relay type structure refers to that after a simulator receives data of a previous simulator, the data of the previous simulator and data of the simulator are packaged together to be transmitted to a next simulator, and the process is repeated.
[0025] Preferably, the rigid-flexible-rigid printed board is installed in a stacked manner in a simulator shell. A node is composed of the rigid-flexible-rigid printed board and a simulator shell, and the rigid-flexible-rigid printed board is placed inside the node.
[0026] Preferably, the rigid printed boards are electrically connected through an interconnection cable.
[0027] Preferably, the battery wireless module 3 is plugged to the simulator shell through a connector 6. The battery wireless module is an integral whole, and is functionally divided into a wireless function and a battery function. The battery wireless module can be installed to one side of the simulator and performs data exchange with the simulator through a serial asynchronous bus. The battery wireless module is further connected with an antenna 7.
[0028] Preferably, the battery wireless module comprises a battery module and a wireless module, the battery module is used for providing power for the simulator, and the wireless module is used for data exchange among the plurality of simulators.
[0029] Preferably, as Figure 1 shown, the SOPC single chip is packaged with an ARM9 processor, an FPGA chip and necessary interfaces; the necessary interfaces comprise non-bus signals and a plurality of bus signals; the bus signals comprise a GJB289A bus, an HB6096 bus and a CAN bus signal packaged into the chip; the non-bus interfaces comprise analog signals, discrete signals, frequency signals and CCIR-D signals; and the SOPC single chip further comprises power conversion, interface conversion, clock PLL and the like, which are used for completing the functions of power conversion and interface conversion.
[0030] The aircraft has multiple hanging points, and the number of hanging points is several to dozens. However, the bus type network needs a bus cable to connect each node, and also needs a terminal resistance, which brings complexity to the connection. The star type network needs a central node for switching, so it needs to add a central node device, increasing the types of devices. In order to speed up the test and improve the efficiency, multiple simulators can be used to test multiple hanging points at the same time, so data exchange and synchronization between simulators are needed. Further, serial asynchronous bus is used for data exchange and synchronization between simulators. As shown in Figure 2 The simulator does not use traditional bus type and star type network, and the simulator uses a relay type structure 2 for data exchange and synchronization between nodes to realize simultaneous testing of multiple simulators. The right socket of the first simulator is connected to the left socket of the second simulator by a cable, and the right socket of the second simulator is connected to the left socket of the third simulator by a cable, and so on, to form a relay type structure of simulators. The structure connects each node in a head-to-tail manner, and the connection method is simple, without the need for additional devices for data exchange and synchronization.
[0031] In order to further reduce the size of the simulator, make more efficient use of the internal space of the simulator, and reduce the size of the connector between the interconnection printed boards, the connector is directly cancelled, but the signals between the printed boards need to be electrically interconnected, and flexible boards are used to connect the rigid printed boards. As shown in Figure 4 There are five rigid printed boards inside the simulator, and the rigid printed boards carry the welding of components and necessary installation of external interface connectors. The five rigid printed boards are connected together as a whole by four flexible printed boards, and each rigid printed board is connected to an interconnection cable. The flexible printed board can be bent and twisted, and the whole printed board is placed in the simulator in a stacked manner, fully and efficiently utilizing the internal three-dimensional space of the simulator, thereby further reducing the three-dimensional size of the simulator.
[0032] Considering the aircraft hanging point interface signals, the interface signals that meet the standard requirements of GJB1188A are the standard interface, and there are also non-standard interface signals. According to the signal characteristic classification, the interface signals are generally divided into bus interface and non-bus interface, among which the bus interface is mainly GJB289A and HB6096 signals, and the non-bus interface includes analog signals, discrete signals, frequency signals, CCIR-D signals, etc. As shown in Figure 1As shown, to save simulator space, Shenzhen Guowei's SOPC single-chip is used. This chip integrates multiple bus signals and non-bus signals into a single IC chip, and also encapsulates an ARM9 processor and an FPGA chip for signal expansion. Essential interface functions such as GJB289A bus, HB6096 bus, and CAN bus signals are also encapsulated within the chip, greatly reducing the design and area of peripheral circuits, thereby reducing the printed circuit board area.
[0033] like Figure 3 As shown, the front view of the battery wireless module is composed of thick lines. To further reduce the complexity of use and the number of interconnecting cables, the battery wireless module can be expanded externally, provided the operating environment allows. The battery wireless module is plugged in via the simulator's connector, requiring no additional cables or accessories. Figure 5 First, assemble the simulator and battery wireless module. The battery wireless module can be quickly plugged into the left side of the simulator for easy installation. Then, connect the assembled simulator battery module directly to the aircraft's pylons as a single unit, without the need for adapter cables. Figure 6 , 7 As shown, the simulator's shell structure allows each simulator to be directly connected to the aircraft's hardpoints. After powering on, testing can begin without the need for additional wiring between simulators, significantly reducing test preparation time.
[0034] By comprehensively utilizing the above four components, the size of the simulator has been minimized. On a macro level, a unique relay-type structure is used to enable data exchange with minimal increase in equipment and interconnecting cables. On a micro level, the combination of SOPC single-chip and rigid-flex-rigid printed circuit board maximizes the use of internal space within the simulator. Furthermore, considering environmental constraints, a battery wireless module has been added, further reducing interconnecting cables and test preparation time.
[0035] In the description of this specification, references to terms such as "in one embodiment," "in yet another embodiment," "exemplary," or "in a particular embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0036] While the application has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various modifications and changes can be made therein without departing from the spirit of the application. Accordingly, all such modifications and changes are contemplated as falling within the scope of the application as defined by the appended claims.
Claims
1. A simulator device for aircraft hardpoints, comprising multiple simulators, characterized in that, Multiple simulators are connected sequentially in a relay-like structure, with node data interaction and synchronization between each simulator; the relay-like structure means that after a simulator receives data from the previous simulator, it packages the data from the previous simulator and the data from the current simulator together into a data packet and passes it to the next simulator; The simulator includes: a rigid-flex printed circuit board and a battery wireless module connected to the rigid-flex printed circuit board. The rigid-flex printed circuit board includes: five rigid printed circuit boards and four flexible boards. The rigid printed circuit boards are welded together as a whole through the flexible boards and are stacked and installed in the simulator housing. The rigid printed circuit board includes an SOPC single chip, which encapsulates an ARM9 processor, an FPGA chip, a GJB289A bus interface, an HB6096 bus interface, a CAN bus interface, an analog interface, a discrete interface, a frequency interface, and a CCIR-D interface.
2. The simulator device for aircraft hardpoints according to claim 1, characterized in that, The rigid printed circuit board and interconnecting cables are electrically connected.
3. The simulator device for aircraft hardpoints according to claim 1, characterized in that, The battery wireless module is connected to the simulator housing via a connector.
4. The simulator device for aircraft hardpoints according to claim 3, characterized in that, The battery wireless module exchanges data with the simulator via a serial asynchronous bus.
5. The simulator device for aircraft hardpoints according to claim 1, characterized in that, The battery wireless module includes a battery module and a wireless module. The battery module provides power to the simulator, and the wireless module is used for data exchange between multiple simulators.
Citation Information
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