Coating apparatus, coating method, and semiconductor processing system

Abstract

The application discloses a coating device, a coating method and a semiconductor processing system, comprising: a bearing assembly comprising a rotatable bearing table; a housing in a liftable structure, the housing comprising a top-opened coating cavity for accommodating the bearing table; a cover body above the housing; and a shower head assembly comprising a shower head above the bearing table; wherein the housing has a first state of interfacing with the cover body and a second state of separating from the cover body, the bearing table and the shower head are accommodated in the closed coating cavity in response to the housing being lifted to the first state, and the bearing table is exposed outside the coating cavity in response to the housing being lowered to the second state. The application can prevent the protective liquid from splashing out during the coating process, and simplifies wafer taking and placing and the coating process, improves the coating efficiency, and also simplifies the overall structure of the coating device and reduces the manufacturing cost.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a coating apparatus, a coating method, and a semiconductor processing system. Background Technology

[0002] In recent years, the semiconductor industry has developed rapidly. As the substrate in the semiconductor industry, the yield and efficiency of wafer processing are particularly important.

[0003] During wafer processing, operations such as grooving and cutting are required. To avoid damage to the wafer, a protective layer needs to be spin-coated on its surface before processing. This not only cleans impurities adhering to the wafer surface but also provides significant protection, effectively preventing the redeposition of molten material and improving surface quality.

[0004] In existing technologies, coating operations are primarily performed using coating equipment. This equipment includes a housing, a support assembly, and a nozzle assembly. The support assembly includes a support platform within the housing that holds the wafer. The top of the housing is open, and the support platform can be raised, lowered, and rotated relative to the housing. During coating operations, the nozzle assembly sprays the protective liquid onto the wafer. The support platform rotates the wafer within the housing, and centrifugal force ensures that the protective liquid is evenly coated on the wafer surface. After coating is complete, the support platform extends from the top of the housing for easy loading and unloading.

[0005] However, due to the open structure at the top of the housing, protective liquid can splash out from the open side during coating, creating a harsh environment, increasing cleaning workload, and hindering cost reduction. To avoid this, some existing coating equipment uses a liftable cover assembly at the top of the housing to open or close it. This method requires a lifting mechanism for the cover assembly, complicating the overall structure. Furthermore, after each coating cycle, the cover assembly must be raised before the support platform is raised to allow the transfer assembly to remove the wafer. This process is cumbersome for both wafer removal and coating, hindering coating efficiency.

[0006] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Summary of the Invention

[0007] The purpose of this invention is to provide a coating device, coating method, and semiconductor processing system with high coating efficiency and the ability to avoid splashing of protective liquid.

[0008] The objective of this invention is achieved through the following technical solution: a coating device, comprising: a support assembly including a rotatable support platform; a housing having a liftable structure, the housing including a coating cavity with a top opening for accommodating the support platform; a cover located above the housing; and a nozzle assembly including a nozzle located above the support platform; wherein the housing has a first state of being engaged with the cover and a second state of being separated from the cover, the support platform and the nozzle being accommodated within the closed coating cavity in response to the housing rising to the first state, and the support platform being exposed outside the coating cavity in response to the housing falling to the second state.

[0009] Furthermore, the coating equipment includes a mounting frame, on which both the housing and the support assembly are mounted.

[0010] Furthermore, the coating equipment includes a first lifting drive assembly that is driveably connected to the housing, the first lifting drive assembly being capable of driving the housing to move to the first state or the second state.

[0011] Furthermore, the mounting bracket is provided with a first guide rod along the vertical direction, and the housing is movably fitted onto the first guide rod.

[0012] Furthermore, the support assembly includes a rotary drive assembly mounted on the mounting bracket. The housing has a clearance hole at the position corresponding to the rotary drive assembly. The rotary drive assembly extends into the coating cavity through the clearance hole and is connected to the support platform in a driving connection.

[0013] Furthermore, the cover is at least partially made of a transparent material.

[0014] Furthermore, the cover includes a fixed cover plate and a movable cover plate movably connected to the fixed cover plate, the fixed cover plate and the movable cover plate cooperating to close the coating cavity.

[0015] Furthermore, the nozzle assembly includes a rotary drive component mounted on the cover, the rotary drive component being pulsatorically connected to the nozzle, and the rotary drive component being capable of moving the nozzle relative to the support platform.

[0016] Furthermore, the coating equipment also includes a transfer assembly for loading and unloading materials. The transfer assembly includes: a lifting frame; a second lifting drive assembly, which is pulsatorically connected to the lifting frame and drives the lifting frame to lift; a translation drive assembly, which is disposed on the lifting frame; and support guide rails, which are pulsatorically connected to the translation drive assembly. There are two support guide rails, which are disposed opposite to each other on both sides of the support platform. The translation drive assembly can drive the two support guide rails to move towards each other or away from each other.

[0017] Furthermore, the support rail includes a support surface for supporting the wafer and a correction surface facing the edge of the wafer, the correction surface being used to position the wafer when the two support rails move toward each other.

[0018] Compared with the prior art, the present invention has the following beneficial effects: The coating equipment of the present invention sets the housing as a liftable structure and sets a cover adapted to the housing on the top of the housing. When coating is required, the housing can be raised to the first state so that the housing and the cover are connected and the coating cavity is closed. The support platform and the nozzle are both housed in the coating cavity, thereby preventing the protective liquid from splashing out of the opening of the coating cavity when the nozzle is spraying, reducing the subsequent cleaning workload. After the wafer coating is completed, the housing can be lowered to the second state so that the housing and the cover are separated. At this time, the support platform is exposed outside the coating cavity, which facilitates the removal of the coated wafer and the placement of the wafer to be coated on the support platform for coating. This simplifies the wafer handling and coating process, improves coating efficiency, and also simplifies the overall structure of the coating equipment and reduces manufacturing costs. Attached Figure Description

[0019] Figure 1 This is a front view schematic diagram of the coating equipment of the present invention.

[0020] Figure 2 This is a three-dimensional structural schematic diagram of the coating equipment of the present invention.

[0021] Figure 3 This is a schematic diagram of the coating equipment of the present invention after the transfer component has been removed.

[0022] Figure 4 This is a schematic diagram of the coating equipment of the present invention after the cover is removed.

[0023] Figure 5 This is a partial cross-sectional schematic diagram of the transfer component in this invention.

[0024] Explanation of reference numerals in the attached figures:

[0025] 100, Support assembly; 110, Support platform; 111, Clamping component; 120, Rotary drive assembly; 200, Housing; 210, Coating chamber; 300, Cover; 310, Side plate; 311, Protruding flange; 320, Cover plate; 321, Fixed cover plate; 322, Movable cover plate; 400, Nozzle assembly; 410, Nozzle; 420, Rotary drive component; 430, Mounting plate; 500, Wafer; 510, Clamping fixture; 600, Mounting bracket; 610, First guide rod; 70 0. First lifting drive assembly; 800. Transfer assembly; 810. Lifting frame; 811. Second guide rod; 820. Second lifting drive assembly; 830. Translation drive assembly; 831. Translation drive component; 832. Transmission wheel; 833. Transmission belt; 840. Support guide rail; 841. Clearance groove; 842. Support surface; 843. Correction surface; 850. Guide sleeve; 860. Transmission frame; 861. Connecting block; 870. Slide rail assembly; 871. Slide rail; 872. Slider. Detailed Implementation

[0026] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0027] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0028] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0029] Please see Figures 1 to 3As shown, a coating apparatus corresponding to a preferred embodiment of the present invention includes: a support assembly 100, including a rotatable support platform 110; a housing 200, which is a liftable structure, the housing 200 including a coating cavity 210 with a top opening for accommodating the support platform 110; a cover 300 located above the housing 200; and a nozzle assembly 400, including a nozzle 410 located above the support platform 110; wherein the housing 200 has a first state of docking with the cover 300 and a second state of being separated from the cover 300, the support platform 110 and the nozzle 410 are accommodated in the closed coating cavity 210 in response to the housing 200 rising to the first state, and the support platform 110 is exposed outside the coating cavity 210 in response to the housing 200 falling to the second state.

[0030] The coating equipment of the present invention features a liftable housing 200 with a cover 300 adapted to the housing 200 on its top. When coating is required, the housing 200 can be raised to a first state, allowing it to align with the cover 300 and close the coating chamber 210. The support platform 110 and the nozzle 410 are both housed within the coating chamber 210, thus preventing the protective liquid from splashing out of the opening of the coating chamber 210 during spraying and reducing the risk of spillage. This reduces the workload of continuous cleaning. After the wafer 500 is coated, the housing 200 can be lowered to the second state to separate the housing 200 from the cover 300. At this time, the support platform 110 is exposed outside the coating cavity 210, which facilitates the removal of the coated wafer 500 and the placement of the wafer 500 to be coated on the support platform 110 for coating operations. This simplifies the wafer 500 handling and coating process, improves coating efficiency, and also simplifies the overall structure of the coating equipment and reduces manufacturing costs.

[0031] Furthermore, the coating equipment includes a mounting frame 600, with the housing 200 and the support assembly 100 all mounted on the mounting frame 600. The housing 200 is movably connected to the mounting frame 600. The coating equipment includes a first lifting drive assembly 700 mounted on the mounting frame 600. The first lifting drive assembly 700 is drively connected to the housing 200 and can drive the housing 200 to move to a first state or a second state. Specifically, the first lifting drive assembly 700 can be a linear cylinder or electric cylinder arranged vertically, connected to the bottom of the housing 200, to drive the housing 200 to rise vertically to the first state or descend to the second state.

[0032] The mounting bracket 600 is provided with a first guide rod 610 along the vertical direction. The housing 200 is movably fitted onto the first guide rod 610 and can rise or fall under the guidance of the first guide rod 610. Preferably, in this embodiment, there are multiple first guide rods 610 to guide multiple areas of the housing 200, thereby improving the reliability of the lifting and lowering of the housing 200.

[0033] Furthermore, the support assembly 100 includes a rotary drive assembly 120 mounted on the mounting bracket 600. The housing 200 has a clearance hole (not shown) corresponding to the position of the rotary drive assembly 120. The rotary drive assembly 120 extends through the clearance hole into the coating cavity 210 and is connected to the support platform 110 via a transmission mechanism. In this embodiment, the rotary drive assembly 120 can specifically drive the support platform 110 to rotate via a rotary motor and a rotary transmission structure; further details will not be elaborated upon here.

[0034] Reference Figure 4 As shown, a rotatable clamping member 111 is connected to the support stage 110. Multiple clamping members 111 are spaced apart circumferentially along the support stage 110. The wafer 500 is located between the clamping members 111 and the support stage 110. The multiple clamping members 111 cooperate to restrict the radial position of the wafer 500. When the support stage 110 rotates, the clamping members 111 are adapted to rotate towards the support stage 110 under the action of centrifugal force to secure the wafer 500 to the support stage 110, and release the wafer 500 when the support stage 110 stops rotating. To avoid wafer slippage during spin coating, the pressure applied to the wafer 500 by the clamping members 111 is N, and the centrifugal force on the wafer 500 is m1R1W. 2 N > m1R1W 2 Where m1 is the mass of wafer 500, R1 is the wafer radius, and W is the operating speed of the rotary drive component 120.

[0035] Preferably, since directly clamping the wafer 500 with the clamping member 111 may damage the wafer 500, in this embodiment, the wafer 500 is connected to a clamping fixture 510. The clamping fixture 510 is an annular sheet structure and is coaxially disposed outside the wafer 500. The wafer 500 and the clamping fixture 510 are fixedly connected together by a thin film. The clamping member 111 is used to clamp the clamping fixture 510. At this time, the pressure N of the clamping member 111 needs to be greater than m2R2W. 2 Where m2 is the sum of the masses of wafer 500 and clamping fixture 510, and R2 is the distance from the edge of clamping fixture 510 to the center of wafer 500.

[0036] Furthermore, referring to Figures 1 to 3 As shown, the cover 300 includes side plates 310 and a cover plate 320. There are multiple side plates 310, which are connected end to end to form the periphery of the cover 300. The cover plate 320 covers the top of the cover 300 and opens towards the top of the coating cavity 210. The bottom of the cover 300 is an open structure to communicate with the top opening of the coating cavity 210.

[0037] Preferably, the bottom of the side plate 310 is provided with a raised edge 311, which is formed around the periphery of the cover 300. When the housing 200 is in the first state, the top of the housing 200 abuts against the raised edge 311 to improve the sealing between the housing 200 and the cover 300.

[0038] The cover 300 is at least partially made of a transparent material, allowing operators to observe the coating chamber 210 through it, thereby monitoring the coating process of the wafer 500 in real time. This facilitates the timely detection of problems during the coating process and enables appropriate measures to be taken to prevent a decrease in the yield of the wafer 500 due to coating issues. Preferably, to improve the observation effect, in this embodiment, the cover plate 320 is at least partially made of a transparent material.

[0039] Preferably, the cover plate 320 includes a fixed cover plate 321 and a movable cover plate 322 movably connected to the fixed cover plate 321. The movable cover plate 322 can move relative to the fixed cover plate 321 to open or close the cover 300. For ease of operation, in this embodiment, the movable cover plate 322 is hinged to the fixed cover plate 321 to open and close the cover 300 by flipping. Of course, in other embodiments, the movable cover plate 322 can also slide to the fixed cover plate 321 to open and close the cover 300 by translation.

[0040] By adopting the above structure, in the event of an emergency during the coating process of wafer 500, the operator can open the coating chamber 210 by opening the movable cover 322, and then reach into the coating chamber 210 to perform operations. Compared with opening the coating chamber 210 by lowering the housing 200, the above method is more efficient. Moreover, since the movable cover 322 faces the opening of the coating chamber 210, it is more convenient to reach into the coating chamber 210 through the opening on the cover 300. In addition, due to the obstruction of the side plate 310, when the movable cover 322 is opened without closing the nozzle assembly 400, the protective liquid in the coating chamber 210 is less likely to splash to the outside, further improving the convenience of operation.

[0041] Reference Figure 3 and Figure 4 As shown, the nozzle assembly 400 includes a mounting plate 430 mounted on a side plate 310 of the housing 300 and a rotary drive 420 mounted on the mounting plate 430. The rotary drive 420 is kinetically connected to the nozzle 410, which is located directly below the housing 300 and facing the support platform 110. The rotary drive 420 can drive the nozzle 410 to move relative to the wafer 500 to adjust the nozzle 410 to the optimal spraying position. At the same time, the rotary drive 420 can also move the nozzle 410 away from directly above the wafer 500, thereby facilitating the loading and unloading of the wafer 500.

[0042] Furthermore, to ensure that the nozzle 410 can work smoothly, the coating equipment includes an anti-clogging device (not shown). The anti-clogging device has a liquid-containing cavity, and the side of the cavity facing the nozzle 410 is an open side. After the nozzle 410 has finished spraying, the nozzle 410 can be moved to the anti-clogging device and immersed in the liquid, thereby effectively preventing the protective liquid on the nozzle 410 from solidifying, thus making the nozzle 410 less prone to clogging.

[0043] In one embodiment, the anti-clogging device is vertically and flexibly positioned in the non-rotational position of the support assembly 100. The rotation drive 420 can drive the nozzle 410 to move directly above the anti-clogging device, allowing the anti-clogging device to rise towards the nozzle 410 so that the nozzle 410 is submerged in the liquid. In another embodiment, the anti-clogging device can also be fixedly mounted on the housing 200 to rise and fall synchronously with the housing 200. When the drive 420 drives the nozzle 410 to move directly above the anti-clogging device, the housing 200 can lift the anti-clogging device to submerge the nozzle 410 in the liquid. Compared to mounting the anti-clogging device on the support assembly 100, mounting it on the housing 200 avoids the need for additional lifting structures, thereby simplifying the structure and reducing costs.

[0044] Furthermore, referring to Figure 2 , Figure 4 and Figure 5 As shown, the coating equipment also includes a transfer component 800, which is used to load the wafer 500 to be coated onto the carrier stage 110 or to remove the wafer 500 after coating from the carrier stage 110.

[0045] The transfer assembly 800 includes a lifting frame 810, a second lifting drive assembly 820, a translation drive assembly 830, and support guide rails 840. The second lifting drive assembly 820 is pulsatorically connected to the lifting frame 810 and can drive the lifting frame 810 to move vertically. The translation drive assembly 830 is mounted on the lifting frame 810, and the support guide rails 840 are pulsatorically connected to the translation drive assembly 830. There are two support guide rails 840, which are arranged opposite each other on both sides of the support platform 110. The translation drive assembly 830 can drive the two support guide rails 840 to move towards each other or away from each other in the horizontal direction.

[0046] The second lifting drive assembly 820 can specifically be a cylinder or electric cylinder arranged in a vertical direction. Preferably, in order to better guide the lifting frame 810 to rise and fall, the lifting frame 810 includes a second guide rod 811 arranged in a vertical direction, and the transfer assembly 800 includes a guide sleeve 850 located below the lifting frame 810, with the second guide rod 811 movably passing through the guide sleeve 850. In this embodiment, there are two second guide rods 811, which are respectively arranged on both sides of the lifting frame 810 in the direction of movement of the support guide rail 840. When the wafer 500 needs to be mounted on the support platform 110, the wafer 500 is placed on the support rail 840 by the transport structure. The second lifting drive assembly 820 drives the lifting frame 810 to descend, so that the wafer 500 on the support rail 840 is supported on the support platform 110. The translation drive assembly 830 can drive the support rails 840 to move closer or further apart, so that after the wafer 500 is placed on the support platform 110, it moves away from the support platform 110 in the horizontal direction, avoiding the lifting limit of the housing 200. At the same time, it can also enable the support rails 840 to support wafers 500 of different sizes. Preferably, the support rail 840 includes a support surface 842 for supporting the wafer 500 and a correction surface 843 facing the edge of the wafer 500. When the two support rails 840 approach each other, the two correction surfaces 843 can abut against the edge of the wafer 500 to correct the position of the wafer 500, thereby improving the positional accuracy of the wafer 500. The support guide rail 840 has a clearance groove 841 at the position corresponding to the clamping member 111. The clearance groove 841 is adapted to the clamping member 111 and has a through structure in the vertical direction.

[0047] The translation drive assembly 830 includes a translation drive component 831 and a pulley assembly. The translation drive component 831 is specifically a rotary motor, which is fixedly connected to the lifting frame 810. The translation drive component 831 is driveably connected to the pulley assembly and can drive the pulley assembly to rotate. The pulley assembly includes a drive wheel 832 and a drive belt 833. The drive wheels 832 are rotatably mounted on the lifting frame 810. There are two drive wheels 832, which are arranged opposite each other on both sides of the lifting frame 810. The drive belt 833 is wound around the drive wheels 832, forming a first belt section (not shown) and a second belt section (not shown) opposite each other. Two support guide rails 840 are driveably connected to the first belt section and the second belt section, respectively. When the translation drive component 831 rotates, it can drive the drive wheel 832 to rotate, thereby causing the first belt section and the second belt section to move towards each other or away from each other. By using the pulley assembly to drive the two support guide rails 840 to move towards or away from each other, the structure is simple and the movement is highly reliable.

[0048] The transfer assembly 800 also includes a transmission frame 860, which is connected to the transmission belt 833 via a connecting block 861. Two transmission frames 860 are provided, one for connecting to the first belt section and the other to the second belt section. Two support rails 840 are respectively mounted on different transmission frames 860. Preferably, the transmission frame 860 extends vertically towards the top of the housing 200, and the support rails 840 are located on the top of the transmission frame 860, thereby reducing the lifting stroke of the second lifting drive assembly 820 and improving the reliability of the lifting process.

[0049] Since the transmission belt 833 is a flexible structure, it is difficult for it to support the transmission frame 860. To reliably support the transmission frame 860, the transfer assembly 800 also includes a slide rail assembly 870 mounted on the lifting frame 810, on which the transmission frame 860 rests. The slide rail assembly 870 includes a slide rail 871 fixedly connected to the lifting frame 810 and sliders 872 slidably connected to the slide rail 871. The length direction of the slide rail 871 is consistent with the moving direction of the transmission frame 860. There are two sliders 872, located at opposite ends of the slide rail 871. The two transmission frames 860 are fixedly connected to different sliders 872, so that when the pulley assembly drives the transmission frame 860 to move, the transmission frame 860 can move along the slide rail 871.

[0050] The working process of the coating equipment of the present invention is as follows: When a coating operation is required on the wafer 500, the housing 200 is in the second state; the wafer 500 is placed on the support rail 840, and the translation drive component 830 drives the two support rails 840 to move in opposite directions so that the correction surface 843 of the support rail 840 abuts against the edge of the wafer 500, thereby achieving the positioning of the wafer 500; then the second lifting drive component 820 drives the support rail 840 to descend, so as to place the wafer 500 on the support platform 110; then the translation drive component 830 drives the support rail 840 to move away from the housing 200; then the housing 200 rises to the first state under the drive of the first lifting drive component 700, so as to dock with the cover 300, and the wafer 500 and the support platform 110 are aligned. Both the nozzle 410 and the coating chamber 210 are located in the closed coating chamber. The rotation drive assembly 120 drives the support platform 110 to rotate. At the same time, the nozzle 410 sprays the protective liquid onto the wafer 500 to perform coating operations on the surface of the wafer 500. After the coating operation is completed, the first lifting drive assembly 700 drives the housing 200 to descend to the second state, the translation drive assembly 830 drives the support guide rail 840 to move in the opposite direction to directly below the wafer 500, and the second lifting drive assembly 820 drives the support guide rail 840 to rise to move the wafer 500 away from the support platform 110. At this time, the conveying structure can move the wafer 500 out of the support guide rail 840 and continue to place the wafer 500 to be coated on the support guide rail 840. The above actions are repeated to achieve continuous coating of the wafer 500.

[0051] Furthermore, the present invention also provides a coating method implemented by the aforementioned coating equipment, comprising the following steps:

[0052] S1: Move nozzle 410 to the center of wafer 500.

[0053] S2: The stage 110 begins to rotate. When it reaches the preset rotation speed, the nozzle 410 sprays atomized protective liquid onto the center of the wafer 500. By setting the nozzle 410 to spray the protective liquid onto the wafer after the stage 110 reaches the preset rotation speed, it can be ensured that the clamping member 111 secures the wafer 500 to the stage 110 before spraying, thereby avoiding the situation where the protective liquid may seep into the rotary drive assembly 120 due to the increased gap between the wafer 500 and the stage 110. Since the linear velocity near the center is low, the protective liquid is not easy to spread and accumulate, resulting in a thicker adhesive at the center of the wafer 500. Preferably, to avoid the above situation, the nozzle 410 is slightly off-center at the starting position of the spray.

[0054] S3: After spraying for the first preset time, the nozzle 410 moves towards the edge of the wafer 500 at a preset speed, continuously spraying the protective liquid during this period. The spray trajectory unfolds in a spiral pattern. Due to the difference in linear velocity on each circumference, a segmented thickness compensation method is provided above the basic radial movement speed of the nozzle 410. This calculates the dwell time and movement speed required for each segment, avoiding the situation where the protective liquid is too thick in the center of the wafer 500 and too thin at the edge of the wafer 500 under the same base speed, thus meeting the requirement of uniform coating thickness on the wafer 500. The protective liquid can specifically be a hydrophilic layer protective liquid, PVA protective liquid, etc., and in this embodiment, a PVA protective liquid is preferred.

[0055] S4: When the nozzle 410 moves to the edge of the wafer 500, the nozzle 410 sprays for a second preset time and then stops spraying. Then the carrier stage 110 rotates for a third preset time and then stops rotating.

[0056] By adopting the above method, the uniformity of the protective solution can be well controlled, the dripping phenomenon around the 500 wafer can be significantly improved, and the reproducibility of the protective solution thickness can be guaranteed.

[0057] In addition, the present invention also provides a semiconductor processing system, including: the aforementioned coating equipment; and a cleaning equipment (not shown) that sprays water vapor to clean the coated wafer 500.

[0058] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A coating device, characterized in that, include: The support assembly (100) includes a rotatable support platform (110). The housing (200) is a liftable structure, and the housing (200) includes a top-opening coating cavity (210) for accommodating the support platform (110). The cover (300) is located above the housing (200); as well as The nozzle assembly (400) includes a rotary drive (420) mounted on the housing (300) and a nozzle (410) located above the support platform (110). The rotary drive (420) is convexly connected to the nozzle (410). The rotary drive (420) can drive the nozzle (410) to move relative to the support platform (110), so that the nozzle (410) gradually moves from the liquid spraying start position corresponding to the center of the wafer (500) to the edge of the wafer (500). The liquid spraying start position is eccentrically arranged with respect to the wafer (500). The anti-clogging device has a liquid-containing cavity, the side of which facing the nozzle (410) is open, and the nozzle (410) can be moved toward the anti-clogging device and immersed in the liquid; The anti-clogging device is fixedly installed on the housing (200) and rises and falls synchronously with the housing (200). The rotary drive (420) can drive the nozzle (410) to move directly above the anti-clogging device. The housing (200) can drive the anti-clogging device to rise, so that the nozzle (410) is immersed in the liquid. A transfer assembly (800) for loading and unloading materials, the transfer assembly (800) comprising: Lifting frame (810); The second lifting drive assembly (820) is connected to the lifting frame (810) in a transmission manner, and drives the lifting frame (810) to lift up and down; A translation drive assembly (830) is disposed on the lifting frame (810); and Support rails (840) are connected to the translation drive assembly (830) via transmission. There are two support rails (840), which are arranged opposite to each other on both sides of the support platform (110). The translation drive assembly (830) can drive the two supporting guide rails (840) to move towards each other or away from each other. The translation drive assembly (830) includes a translation drive component (831) and a pulley assembly. The translation drive component (831) is a rotary motor, which is fixedly connected to the lifting frame (810). The translation drive component (831) is drively connected to the pulley assembly and can drive the pulley assembly to rotate. The pulley assembly includes a drive wheel (832) and a drive belt (833). The drive wheel (832) is rotatably mounted on the lifting frame (810). On the lifting frame (810), there are two transmission wheels (832), which are arranged opposite to each other on both sides of the lifting frame (810). The transmission belt (833) is wound around the transmission wheel (832) and forms a first belt section and a second belt section arranged opposite to each other through the transmission wheel (832). The two support guide rails (840) are respectively connected to the first belt section and the second belt section. When the translation drive (831) rotates, it can drive the transmission wheel (832) to rotate, thereby driving the first belt section and the second belt section to move towards each other or away from each other. The housing (200) has a first state of docking with the cover (300) and a second state of being separated from the cover (300). The support platform (110) and the nozzle (410) are housed in the closed coating cavity (210) in response to the housing (200) rising to the first state. The support platform (110) is exposed outside the coating cavity (210) in response to the housing (200) falling to the second state.

2. The coating equipment as described in claim 1, characterized in that, The coating equipment includes a mounting frame (600), on which the housing (200) and the support assembly (100) are both mounted.

3. The coating equipment as described in claim 2, characterized in that, The coating equipment includes a first lifting drive assembly (700) that is connected to the housing (200) in a transmission manner. The first lifting drive assembly (700) can drive the housing (200) to move to the first state or the second state.

4. The coating equipment as described in claim 3, characterized in that, The mounting bracket (600) is provided with a first guide rod (610) in the vertical direction, and the housing (200) is movably sleeved on the first guide rod (610).

5. The coating equipment as described in claim 2, characterized in that, The support assembly (100) includes a rotary drive assembly (120) mounted on the mounting bracket (600). The housing (200) has a clearance hole at the position corresponding to the rotary drive assembly (120). The rotary drive assembly (120) extends into the coating cavity (210) through the clearance hole and is connected to the support platform (110) in a transmission manner.

6. The coating equipment as described in claim 1, characterized in that, The cover (300) is at least partially made of a transparent material.

7. The coating equipment as described in claim 1, characterized in that, The cover (300) includes a fixed cover plate (321) and a movable cover plate (322) movably connected to the fixed cover plate (321). The fixed cover plate (321) and the movable cover plate (322) cooperate to close the coating cavity (210).

8. The coating equipment as described in claim 1, characterized in that, The support rail (840) includes a support surface (842) for supporting the wafer (500) and a correction surface (843) facing the edge of the wafer (500), the correction surface (843) being used to position the wafer (500) when the two support rails (840) move toward each other.

9. A coating method, implemented using the coating apparatus as described in any one of claims 1 to 8, characterized in that, Includes the following steps: S1: Move the nozzle (410) to the center of the wafer (500); S2: The stage (110) starts to rotate. When it reaches the preset speed, the nozzle (410) sprays atomized protective liquid into the center of the wafer (500). S3: After spraying for the first preset duration, the nozzle (410) moves toward the edge of the wafer (500) at a preset speed, and continues to spray protective liquid during this period; S4: When the nozzle (410) moves to the edge of the wafer (500), the nozzle (410) sprays for a second preset time and then stops spraying. Then the stage (110) rotates for a third preset time and then stops rotating.

10. A semiconductor processing system, comprising: The coating apparatus as described in any one of claims 1 to 8; A cleaning device for spraying water vapor onto a wafer (500) to clean the coated wafer (500).

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