Electronic device including antenna and operating method

Abstract

An electronic device according to various embodiments of the disclosure includes a frame structure forming at least a portion of a side surface of the electronic device, wherein the side surface formed by the frame structure can include a first edge, a second edge perpendicular to the first edge, and a third edge parallel to the first edge. The frame structure can include a first insulating portion at a point on the first edge, a first conductive portion, a second conductive portion separated from the first conductive portion by a second insulating portion and corresponding to a portion of the second edge, and a third conductive portion separated from the second conductive portion by a third insulating portion at a second point on the second edge and extending to the third edge. The electronic device according to various embodiments includes a wireless communication circuit, a first switching circuit connecting the first conductive portion and / or the second conductive portion with the wireless communication circuit, a second switching circuit connecting the second conductive portion and / or the third conductive portion with the wireless communication circuit, and a proximity sensor for detecting proximity of a human body to the first edge. Power feeding can be performed according to a proximity state of the human body detected by the proximity sensor.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to an antenna for overcoming the human body effect and an electronic device including the antenna. Background Technology

[0002] Portable electronic devices, such as portable communication devices, mobile terminals, mobile communication terminals, or smartphones, can communicate with external electronic devices using communication circuits and antennas, or can connect to external devices located within a short distance using a predetermined network.

[0003] Electronic devices are striving to increase rigidity, enhance design, and reduce thinness to meet consumer purchasing desires. As part of this trend, electronic devices are racing to efficiently secure the placement space for at least one antenna device, which should essentially be provided for communication between components, preventing radiation performance degradation in advance, and achieving superior performance.

[0004] According to various embodiments, the antenna device used in the electronic device may include an inverted-F antenna (IFA) or a monopole antenna. Furthermore, the size and number of antenna radiators installed in a portable electronic device can be determined based on the frequency, bandwidth, and type of each communication service. For example, regional groups around the world differ in frequency, but typically the low-frequency band of 600MHz to 1000MHz, the mid-frequency band of 1700MHz to 2200MHz, and the high-frequency band of 2300MHz to 2700MHz are used as the main communication bands. Optionally, the electronic device can use various frequencies for various wireless communication services, such as Bluetooth (BT), Global Navigation Satellite System (GNSS), and Wi-Fi. Summary of the Invention

[0005] Technical issues

[0006] To satisfy all the aforementioned communication bands within a limited antenna volume, the electronic device faces practical difficulties in ensuring all bands with a single antenna. To overcome this difficulty, the antenna of the electronic device is designed to be divided into several service bands with similar frequency ranges.

[0007] Electronic devices may include metal components (e.g., metal frames, etc.) on their exterior. The electronic device can utilize the metal components forming the exterior as antenna radiators. For example, when a metal frame serving as the edge of the electronic device is used as an antenna radiator, the electronic device may include a main antenna radiator and at least one coupled antenna radiator, with a segmented portion made of a dielectric material inserted between them. In the electronic device, an electrical gap can be formed by the segmented portion between the main antenna radiator and the coupled antenna radiator, thus allowing resonance to be formed in a desired frequency band using the coupled antenna radiator.

[0008] However, when the user holds the electronic device so that the user comes into contact with the segmented portion of the antenna, the electronic device may experience a significant deterioration in the antenna's radiation performance due to changes in the capacitance and increased dielectric loss of the segmented portion.

[0009] Solution to the problem

[0010] Electronic devices according to various embodiments of the present disclosure include a frame structure that configures at least a portion of a side surface of the electronic device, and the side surface configured by the frame structure includes a first edge, a second edge extending from the first edge and perpendicular to the first edge, and a third edge extending from the second edge and parallel to the first edge.

[0011] The frame structure includes a first insulating portion located at a point on a first edge, a first conductive portion extending from the first insulating portion to a second edge, a second conductive portion separated from the first conductive portion by a second insulating portion located at a first point on the second edge and corresponding to a portion of the second edge, and a third conductive portion separated from the second conductive portion by a third insulating portion located at a second point on the second edge and extending to a third edge.

[0012] An electronic device according to various embodiments includes a wireless communication circuit disposed in an internal space formed by a frame structure, a first switching circuit configured to connect the wireless communication circuit to at least one of a first conductive portion and a second conductive portion, a second switching circuit configured to connect the wireless communication circuit to at least one of a second conductive portion and a third conductive portion, and a proximity sensor configured to detect the approach of a human body to a first edge, wherein in a first state in which the proximity sensor does not detect the approach of a human body, the wireless communication circuit supplies power to the first conductive portion via the first switching circuit and to the second conductive portion via the second switching circuit, respectively; and in a second state in which the proximity sensor detects the approach of a human body, the wireless communication circuit supplies power to the first and second conductive portions via the first switching circuit and to the third conductive portion via the second switching circuit.

[0013] Beneficial effects of the invention

[0014] Various embodiments of this disclosure can provide an apparatus and method for preventing radiation performance degradation due to changes in the capacitance of a frame portion used as an antenna in an electronic device. Attached Figure Description

[0015] Figure 1a The unfolded state of the electronic device according to an embodiment is shown;

[0016] Figure 1b The folded state of the electronic device according to an embodiment is shown;

[0017] Figure 2a An exploded view and an unfolded view of an electronic device according to an embodiment are shown;

[0018] Figure 2b It shows Figure 2a The folded state of the electronic device;

[0019] Figure 3 This is a perspective view of an electronic device according to another embodiment, viewed from one side.

[0020] Figure 4 An electronic device including an antenna structure according to an embodiment is shown;

[0021] Figure 5 The connection relationships between wireless communication circuits and conductive parts according to various embodiments are shown;

[0022] Figure 6 This is a flowchart for determining the connection relationship between the wireless communication circuit and the conductive part according to the embodiment;

[0023] Figure 7 This is a flowchart for changing the connection relationship between the wireless communication circuit and the conductive part according to an embodiment;

[0024] Figure 8a A switching circuit including internal components according to an embodiment is shown;

[0025] Figure 8b A switching circuit including internal components according to another embodiment is shown;

[0026] Figure 8c A third switching circuit connected to the first conductive portion according to an embodiment is shown;

[0027] Figure 8d A fourth switching circuit connected to the second conductive portion according to an embodiment is shown;

[0028] Figure 9a The results of signal radiation via a wireless communication circuit of an electronic device according to an embodiment are shown;

[0029] Figure 9b The results of signal radiation via a wireless communication circuit of an electronic device according to another embodiment are shown;

[0030] Figure 9c The results of signal radiation via a wireless communication circuit of an electronic device according to another embodiment are shown;

[0031] Figure 10 The results of signal radiation via a wireless communication circuit of an electronic device according to another embodiment are shown;

[0032] Figure 11 An electronic device including a first wireless communication circuit and a second wireless communication circuit according to an embodiment is shown.

[0033] Figure 12 This is a flowchart for determining the connection relationship between the wireless communication circuit and the conductive part according to the embodiment;

[0034] Figure 13a The results of signal radiation via the first wireless communication circuit are shown according to an embodiment in a first state in which no human body is detected approaching.

[0035] Figure 13b The results of signal radiation via the second wireless communication circuit are shown according to an embodiment in a first state in which no human body is detected approaching.

[0036] Figure 14a The results of signal radiation via the first wireless communication circuit are shown in a second state in which the proximity of a human body is detected, according to an embodiment.

[0037] Figure 14b The results of signal radiation via the second wireless communication circuit in a second state, according to an embodiment, are shown; and

[0038] Figure 15 This is a block diagram of an electronic device in a network environment according to various embodiments. Detailed Implementation

[0039] Figure 1a The unfolded state of the electronic device 100 according to various embodiments of the present disclosure is shown. Figure 1b Various embodiments according to this disclosure are shown. Figure 1a The electronic device 100 is in a folded state.

[0040] Reference Figure 1a The electronic device 100 may include a pair of housing structures 110 and 120 rotatably coupled via a hinge structure to fold relative to each other, a hinge cover 165 configured to cover the foldable portions of the pair of housing structures 110 and 120, and a display 130 (e.g., a flexible display or a foldable display) disposed in the space formed by the pair of housing structures 110 and 120. In this disclosure, the surface on which the display 130 is disposed may be defined as the front surface of the electronic device 100, and the opposite surface of the front surface may be defined as the rear surface of the electronic device 100. Furthermore, the surface surrounding the space between the front and rear surfaces may be defined as the side surface of the electronic device 100.

[0041] In an embodiment, the pair of housing structures 110 and 120 may include a first housing structure 110 including a sensor region 131d, a second housing structure 120, a first rear cover 140, and a second rear cover 150. The pair of housing structures 110 and 120 of the electronic device 100 may be unaffected by... Figure 1a and Figure 2b The forms and coupling limitations shown can be achieved through another form or combination and / or coupling of components. For example, in another embodiment, the first housing structure 110 and the first rear cover 140 can be integrally formed, and the second housing structure 120 and the second rear cover 150 can be integrally formed. According to an embodiment, the first housing structure 110 and the second housing structure 120 can be arranged on opposite sides around a folding axis (axis A) and can have a shape that is completely symmetrical with respect to the folding axis (axis A). According to an embodiment, the angle or distance between the first housing structure 110 and the second housing structure 120 can vary depending on whether the electronic device 100 is in an unfolded state (flat or closed state), a folded state (folded state), or an intermediate state. According to an embodiment, unlike the second housing structure 120, the first housing structure 110 may additionally include a sensor region 131d in which various sensors are arranged, but may have a mutually symmetrical shape in other regions. In another embodiment, the sensor arrangement region 131d may additionally be provided or replace at least a portion of the second housing structure 120.

[0042] In an embodiment, when the electronic device 100 is in its unfolded state, the first housing structure 110 may be connected to a hinge structure and may include a first surface 111 facing the front surface of the electronic device 100, a second surface 112 facing a direction opposite to the first surface 111, and a first side surface member 113 surrounding at least a portion of the space between the first surface 111 and the second surface 112. In an embodiment, the first side surface member 113 may include a first side surface 113a disposed parallel to the folding axis (axis A), a second side surface 113b extending from one end of the first side surface 113a in a direction perpendicular to the folding axis, and a third side surface 113c extending from the other end of the first side surface 113a in a direction perpendicular to the folding axis (axis A).

[0043] In an embodiment, when the electronic device 100 is in its unfolded state, the second housing structure 120 may be connected to a hinge structure (e.g., Figure 3The hinge structure 164 may include a third surface 121 facing the front surface of the electronic device 100, a fourth surface 122 facing in a direction opposite to the third surface 121, and a second side surface member 123 surrounding at least a portion of the space between the third surface 121 and the fourth surface 122. In an embodiment, the second side surface member 123 may include a fourth side surface 123a disposed parallel to the folding axis (axis A), a fifth side surface 123b extending from one end of the fourth side surface 123a in a direction perpendicular to the folding axis (axis A), and a sixth side surface 123c extending from the other end of the fourth side surface 123a in a direction perpendicular to the folding axis (axis A). In an embodiment, the third surface 121 may face the first surface 111 in the folded state.

[0044] In an embodiment, the electronic device 100 may include a recess 101 configured to accommodate a display 130 via a combination of structural shapes of a first housing structure 110 and a second housing structure 120. The recess 101 may have substantially the same dimensions as the display 130. In an embodiment, due to the sensor region 131d, the recess 101 may have two or more widths that differ from each other in a direction perpendicular to the folding axis (axis A). For example, the recess 101 may have a first width (W1) between a first portion 120a of the second housing structure 120 parallel to the folding axis (axis A) and a first portion 110a of the first housing structure 110 located at the edge of the sensor region 131d, and a second width (W2) configured by a second portion 110b of the second housing structure 110 parallel to the folding axis (axis A) (while the second portion 110b does not correspond to the sensor region 131d). The second width (W2) may be configured to be longer than the first width (W1). For example, the groove 101 can be configured to have a first width (W1) formed by a first portion 110a of the first housing structure 110 and a second width (W2) formed by a second portion 110b of the first housing structure 110, the first portion 110a having a shape asymmetrical to the first portion 120a of the second housing structure 120, and the second portion 110b having a shape symmetrical to the second portion 120b of the second housing structure 120. In embodiments, the first portion 110a and the second portion 110b of the first housing structure 110 can be configured to have different distances from each other from the folding axis (axis A). The width of the groove 101 is not limited to the example shown. In various embodiments, the groove 101 can have one or more widths different from each other, either in the form of the sensor region 113d of the first housing structure 110 and the second housing structure 120 or in the form of a portion having an asymmetrical shape.

[0045] In an embodiment, at least a portion of the first housing structure 110 and the second housing structure 120 may be configured with a metallic or non-metallic material having rigidity of an order selected to support the display 130.

[0046] In one embodiment, sensor region 131d may be disposed adjacent to one side corner of the first housing structure 110 to have a predetermined area. The arrangement, shape, or size of sensor region 131d is not limited to the example shown. For example, in another embodiment, sensor region 131d may be provided in another corner of the first housing structure 110 or in any area between the upper and lower corners. In another embodiment, sensor region 131d may be disposed in at least a portion of the second housing structure. In another embodiment, sensor region 231d may be disposed in the first housing 211 or may be configured to extend into the first housing 211. In one embodiment, electronic device 200 may be a component configured to perform various functions, the component being arranged to be exposed on the front surface of electronic device 100 via sensor region 213d or via one or more openings provided in sensor region 131d. In various embodiments, the component may include at least one of, for example, a front-facing camera device, a receiver, a proximity sensor, an illumination sensor, an iris recognition sensor, an ultrasonic sensor, or an indicator.

[0047] In one embodiment, a first rear cover 140 may be disposed on a second surface 112 of the first housing structure 110 and may have a substantially rectangular periphery. In another embodiment, at least a portion of the periphery may be surrounded by the first housing structure 110. Similarly, a second cover 150 may be disposed on a fourth surface 122 of the second housing structure 120, and at least a portion of its periphery may be surrounded by the second housing structure 120.

[0048] In the illustrated embodiment, the first rear cover 140 and the second rear cover 150 may have a substantially symmetrical shape based on the folding axis (axis A). In another embodiment, the first rear cover 140 and the second rear cover 150 may include various shapes that differ from each other. In yet another embodiment, the first rear cover 140 may be integrally disposed with the first housing structure 110, and the second rear cover 150 may be integrally disposed with the second housing structure 120.

[0049] In embodiments, the first rear cover 140, the second rear cover 150, the first housing structure 110, and the second housing structure 120 may provide space for various components of the electronic device 100 (e.g., printed circuit boards, antenna modules, sensor modules, or batteries) via structures coupled to each other. In embodiments, one or more components may be arranged or visibly exposed on the rear surface of the electronic device 100. For example, one or more components or sensors may be visibly exposed via a first rear region 141 of the first rear cover 140. In various embodiments, sensors may include proximity sensors, rear-surface camera devices, and / or flashes. In another embodiment, at least a portion of the sub-display 152 may be visibly exposed via a second rear region 151 of the second rear cover 150. The display 130 may be disposed within the space formed by the foldable housing structures 110 and 120. For example, the display 130 may be stably positioned within a recess formed by the pair of housing structures 110 and 120 and may be configured to substantially occupy a large portion of the front surface of the electronic device 100. Therefore, the front surface of the electronic device 100 may include a portion of the display 130 and the first housing structure 110 adjacent to the display 130 (e.g., a peripheral region), and a portion of the first housing structure 110 (e.g., a peripheral region). In an embodiment, the rear surface of the electronic device 100 may include a first rear cover 140, a portion of the first housing structure 110 adjacent to the first rear cover 140 (e.g., a peripheral region), a second rear cover 150, and a portion of the first housing structure 110 adjacent to the second rear cover 150 (e.g., a peripheral region).

[0050] In an embodiment, display 130 may refer to a display in which at least a portion of its area can be transformed into a planar or curved surface. In an embodiment, display 130 may include a folded region 131c, a first region 131a disposed on one side (e.g., the right side of folded region 131c) based on folded region 131c, and a second region 131b disposed on the other side (e.g., the left side of folded region 131c). For example, the first region 131a may be disposed on a first surface 111 of the first housing structure 110, and the second region 131b may be disposed on a third surface 121 of the first housing structure 110. In an embodiment, the region division of display 130 is exemplary, and display 130 may be divided into multiple (four or more, or one) regions according to its structure or function. As an example, in Figure 1aIn the embodiment shown, the area of ​​display 130 may be divided by a folding axis (axis A) or a folding region 131c extending parallel to the y-axis. However, in another embodiment, the area of ​​display 130 may be divided based on another folding axis (e.g., a folding axis parallel to the x-axis) or another folding region (e.g., a folding region parallel to the x-axis). The above-described division of the display area is merely a physical division by the pair of housing structures 110 and 120 and the hinge structure, and in essence, display 130 may be divided via the pair of housing structures 110 and 120 and the hinge structure (e.g., Figure 3 The hinge structure 164 is displayed as a full screen. In an embodiment, the first region 131a and the second region 131b may have a shape that is completely symmetrical about the folded region 131c. Unlike the second region 131b, the first region 131a may include a cut-out notch region (e.g., depending on the presence of the sensor region 131d) Figure 3 The first region 131a and the second region 131b may have a notched region 133, but other regions may have a shape symmetrical to the second region 131b. For example, the first region 131a and the second region 131b may include portions with shapes symmetrical to each other and portions with shapes asymmetrical to each other.

[0051] Reference Figure 1b The hinge cover 165 can be configured to be disposed between the first housing structure 110 and the second housing structure 120 to cover internal components (e.g., Figure 3 The hinge structure 164). In an embodiment, depending on the operating state of the electronic device 100 (expanded state (flat state) or folded state), the hinge cover 165 may be covered by a portion of the first housing structure 110 and the second housing structure 120 or exposed to the outside.

[0052] As an example, such as Figure 1a As shown, when the electronic device 100 is in the unfolded state, the hinge cover 165 can be covered by the first housing structure 110 and the second housing structure 120, and therefore is not exposed. As an example, such as... Figure 1b As shown, when the electronic device 100 is in a folded state (e.g., a fully folded state), the hinge cover 165 may be exposed to the outside between the first housing structure 110 and the second housing structure 120. In an embodiment, the hinge cover 165 may include a curved surface.

[0053] In the following description, the operation of the first housing structure 110 and the first housing structure 120, and each region of the display 130, according to the operating states of the electronic device 100 (e.g., unfolded state (flat state) and folded state (folded

[0049] state)) is described. In an embodiment, when the electronic device 100 is in the unfolded state (flat state) (e.g., Figure 1aIn the case of the first housing structure 110 and the second housing structure 120 forming a 180-degree angle, the first region 131a and the second region 131b of the display can be arranged to face the same direction. Furthermore, the folding region 131c can form the same plane as the first region 131a and the second region 131b.

[0054] In this embodiment, the electronic device 100 is in a folded state (e.g., Figure 1b In the case of (the state of the first housing structure 110 and the second housing structure 120), the first housing structure 110 and the second housing structure 120 can be arranged to face each other. The first region 131a and the second region 131b of the display 130 can form a narrow angle with each other (e.g., between 0 degrees and 10 degrees) and can face each other. At least a portion of the folded region 131c can be formed as a curved surface with a predetermined curvature.

[0055] In an embodiment, when the electronic device 100 is in an intermediate state, the first housing structure 110 and the second housing structure 120 can be arranged to form an angle with each other. The first region 131a and the second region 131b of the display 130 can form an angle larger than that in the folded state and smaller than that in the unfolded state. At least a portion of the folded region 131c can be formed as a curved surface with a predetermined curvature, and its curvature can be smaller than that in the folded state.

[0056] Figure 2a An exploded view and an unfolded view of an electronic device according to an embodiment are shown. Figure 2b It shows Figure 2a The folded state of the electronic device.

[0057] Figure 2a An exploded view and an unfolded view of the electronic device 200 according to an embodiment are shown, and Figure 2b It shows Figure 2a The electronic device 200 is in a folded state.

[0058] Reference Figure 2a and Figure 2b The electronic device 200 according to the embodiment may include a foldable housing 210 (or “housing”) including a first housing 211 and a second housing 212, a first side surface member 220, a second side surface member 230, a flexible display 240, a connection structure 250 and / or a cover 260 (or “back cover”).

[0059] According to an embodiment, the first housing 211 and the second housing 212 can form an internal space for arranging electronic components included in the electronic device 200. In this embodiment, multiple electronic components configured to perform various functions of the electronic device 200 can be arranged within the internal spaces of the first housing 211 and the second housing 212. For example, electronic components such as front-surface cameras, rear-surface cameras 214 and 215, interfaces, receivers, or sensor modules can be arranged within the internal spaces of the first housing 211 and the second housing 212. Although not shown in the figures, according to an embodiment, a portion of the electronic components can be viewed in the front surface of the electronic device 200 via at least one opening or recess arranged in the flexible display 240.

[0060] In the example (for example, see...) Figure 2a When the electronic device 200 is in the deployed state, the first housing 211 and the second housing 212 can be arranged parallel to each other. In another example (see, for example, see...) Figure 4 When the electronic device 200 is in a folded state, the first housing 211 can be rotated (or pivoted) relative to the second housing 212 via the connecting structure 250, so that one surface of the first housing 211 and one surface of the second housing 212 can be arranged to face each other.

[0061] According to an embodiment, a recess configured to accommodate the flexible display 240 may be provided in the first housing 211 and the second housing 212. For example, the flexible display 240 may be stably positioned in the recess to be supported by a first side surface member 220 and / or a second side surface member 230 disposed between the flexible display 240 and the first housing 211 and the second housing 212.

[0062] According to an embodiment, the first side surface member 220 may configure the side surface of the first housing 211 of the foldable housing 210. In an example, the first side surface member 220 may include a first structure 220-1 forming the side surface of the first housing 211 and / or a second structure 220-2 providing space for arranging electronic components disposed in the first housing 211. In an example, the first structure 220-1 of the first side surface member 220 may include a plurality of conductive portions (e.g., 220a, 220b, 220c, 220d, and 220e) and a plurality of non-conductive portions (e.g., 220f, 220g, 220h, 220i, and 220j) (or “segmented regions”) disposed between the plurality of conductive portions. Some of the plurality of non-conductive portions may be omitted. In an embodiment, the first structure 220-1 and the second structure 220-2 may be integrally arranged or coupled together. As another example, the first structure 220-1 and the second structure 220-2 may include the same material or may include different materials from each other.

[0063] In the example, the first structure 220-1 of the first side surface member 220 may include the upper end of the side surface of the first housing 221 (e.g., Figure 2a The first conductive portion 220a is located in the +y direction, and is disposed at one right end of the first conductive portion 220a (e.g., in the +y direction). Figure 2a The second conductive portion 220b in the region adjacent to the first conductive portion 220a (in the +x direction) is disposed at one left end (e.g., in the +x direction). Figure 2a The third conductive portion 220c in the region adjacent to the second conductive portion 220b and disposed on the right side surface of the first housing 211 (e.g., in the -x direction), Figure 2a The fourth conductive portion 220d on the side surface in the +x direction, and / or the fifth conductive portion 220e adjacent to the third conductive portion 220c and disposed on the left side surface of the first housing 211 (e.g., the side surface in the -x direction of FIG2).

[0064] In another example, the plurality of non-conductive portions may include a first non-conductive portion 220f disposed between the first conductive portion 220a and the second conductive portion 220b, a second non-conductive portion 220g disposed between the first conductive portion 220a and the third conductive portion 220c, a third non-conductive portion 220h disposed between the second conductive portion 220b and the fourth conductive portion 220f, a fourth non-conductive portion 220i disposed between one end of the third conductive portion 220c and the fifth conductive portion 220e, and / or a fifth non-conductive portion 220j disposed at the other end of the fifth conductive portion 220e. The plurality of non-conductive portions may be arranged between the first conductive portion 220a, the second conductive portion 220b, the third conductive portion 220c, the fourth conductive portion 220d, and / or the fifth conductive portion 220e to insulate the plurality of conductive portions; therefore, the first structure 220-1 of the first side surface member 220 may be segmented into five regions. The electronic device 200 according to an embodiment may use at least one of the insulated first conductive portion 220a, second conductive portion 220b, third conductive portion 220c, fourth conductive portion 220d, and fifth conductive portion 220e as an antenna radiator. In the example, the plurality of non-conductive portions may be filled with a non-conductive material, such as synthetic resin.

[0065] In the example, the second structure 220-2 of the first side surface member 220 can be configured from a non-metallic material and / or a metallic material with predetermined rigidity to support electronic components (e.g., the flexible display 240 and the printed circuit board). In the example, at least a portion of the flexible display 240 (e.g., the first region 240a) can be disposed on one surface of the second structure 220-2 (e.g., on...). Figure 2aOn a surface in the +z direction, a printed circuit board (not shown) can be positioned on another surface (e.g., on a surface facing the direction opposite to that surface) in the +z direction. Figure 2a On the surface in the -z direction.

[0066] According to an embodiment, the second side surface member 230 may configure the side surface of the second housing 212 of the foldable housing 210. In an example, the second side surface member 230 may include a third structure 230-1 configuring the side surface of the second housing 212 and a fourth structure 230-2 configured to provide space for arranging electronic components disposed in the second housing 212. In an example, the third structure 230-1 of the second side surface member 230 may include a plurality of conductive portions (e.g., 230a, 230b, 230c, 230d, and 230e) and a plurality of non-conductive portions (e.g., 230f, 230g, 230h, 230i, and 230j) (or “segmented regions”) disposed between the plurality of conductive portions. In an embodiment, the third structure 230-1 and the fourth structure 230-2 may be integrally formed or coupled together. As another example, the third structure 230-1 and the fourth structure 230-2 may include the same material or different materials from each other.

[0067] In the example, the third structure 230-1 of the second side surface member 230 may include the lower end of the side surface of the second housing 212 (e.g., Figure 2a The sixth conductive portion 230a (in the -y direction) is provided at one end (e.g., on the right side of the sixth conductive portion 230a). Figure 2a The seventh conductive portion 230b is located in the region adjacent to the sixth conductive portion 230a in the +x direction, and is disposed at one end to the left of the sixth conductive portion 230a (e.g., Figure 2a The eighth conductive portion 230c in the region adjacent to the -x direction, and the right side surface of the second housing 212 (e.g., Figure 2a The seventh conductive portion 230b of the side surface in the +x direction is adjacent to the ninth conductive portion 230d, and / or adjacent to the eighth conductive portion 230c and disposed on the left side surface of the second housing 212 (e.g., the side surface in the +x direction). Figure 2a The tenth conductive portion 230e of the side surface in the -x direction.

[0068] In another example, the plurality of non-conductive portions may include a sixth non-conductive portion 230f disposed between the sixth conductive portion 230a and the seventh conductive portion 230b, a seventh non-conductive portion 230g disposed between the sixth conductive portion 230a and the eighth conductive portion 230c, an eighth non-conductive portion 230h disposed between the seventh conductive portion 230b and the ninth conductive portion 230d, a ninth non-conductive portion 230i disposed between one end of the eighth conductive portion 230c and the tenth conductive portion 230e, and / or a tenth non-conductive portion 230j disposed at the other end of the tenth conductive portion 230e. The aforementioned plurality of non-conductive portions are arranged between the sixth conductive portion 230a, the seventh conductive portion 230b, the eighth conductive portion 230c, the ninth conductive portion 230d, and / or the tenth conductive portion to insulate the plurality of conductive portions; therefore, the third structure 230-1 of the second side surface member 230 can be segmented into five regions. The electronic device 200 according to the embodiment may use at least one of the insulated sixth conductive portion 230a, seventh conductive portion 230b, eighth conductive portion 230c, ninth conductive portion 230d and tenth conductive portion 230e as an antenna radiator.

[0069] According to an embodiment, when the electronic device 200 is in a folded state, the first conductive portion 220a of the first side surface member 220 can be positioned at the location corresponding to the sixth conductive portion 230a of the second side surface member 230, and the second conductive portion 220b of the first side surface member 220 can be positioned at the location corresponding to the seventh conductive portion 230b of the second side surface member 230. According to an embodiment, when the electronic device 200 is in a folded state, the third conductive portion 220c can be positioned at the location corresponding to the eighth conductive portion 230c, the fourth conductive portion 220d can be positioned at the location corresponding to the ninth conductive portion 230d, and the fifth conductive portion 220e can be positioned at the location corresponding to the tenth conductive portion 230e. The electronic device 200 according to the embodiment can reduce interference between the multiple conductive portions used as antenna radiators via the above-described arrangement.

[0070] In the example, the fourth structure 230-2 of the second side surface member 230 can be formed of a non-metallic material and / or a metallic material with predetermined rigidity to support electronic components (e.g., the flexible display 240 and the printed circuit board). In the example, at least a portion of the flexible display 240 (e.g., the second region 240b) can be disposed on one surface of the fourth structure 230-2 (e.g., Figure 2a On the surface in the +z direction), and the printed circuit board (not shown) can be placed on another surface (e.g., facing the direction opposite to that surface). Figure 2a On the surface in the -z direction.

[0071] According to an embodiment, when the electronic device 200 is in an unfolded state, the flexible display 240 can be disposed within the first housing 211 and the second housing 212 to configure the front surface of the electronic device 200 (e.g., Figure 3 (Surface in the +z direction). For example, the flexible display 240 may be configured to extend across the connecting structure 250 from a region of the first housing 211 to at least a region of the second housing 212. According to an embodiment, the flexible display 240 may be stably located in a recess formed by the first housing 211 and the second housing 212, to be disposed within the first housing 211 and the second housing 212.

[0072] In the example, the flexible display 240 may include a first region 240a corresponding to at least one region of the first housing 211, a second region 240b corresponding to at least one region of the second housing 212, or a folded region 240c located between the first region 240a and the second region 240b and having flexible features. The flexible display is not limited to the above embodiment, and according to another embodiment, at least one of the first region 240a, the second region 240b, or the folded region 240c of the flexible display 240 may be configured to have flexible characteristics. In the example, when the electronic device 200 is in the unfolded state, the first region 240a, the folded region 240c, and the second region 240b may be arranged in parallel to face the same direction (e.g., Figure 3 (in the +z direction). As another example, when the electronic device 200 is in a folded state, at least a portion of the folded region 240c can be configured to bend to allow the first region 240a and the second region 240b to face each other.

[0073] According to an embodiment, the connecting structure 250 can connect the first housing 211 and the second housing 212. Therefore, the second housing 212 can rotate relative to the first housing 211 within a specified rotational range, or conversely, the first housing 211 can rotate relative to the second housing 212 within a specified rotational range. In the example, a groove is provided in the region where the first housing 211 and the second housing 212 connect to allow the connecting structure 250 to be disposed between the first housing 211 and the second housing 212. As an example, the aforementioned groove can be provided in a groove shape with a predetermined curvature, but is not limited thereto.

[0074] According to an embodiment, the connection structure 250 may be a hinge assembly. In an example, the hinge assembly may include at least one hinge structure 250a and 250b and a hinge housing 250c. At least one hinge structure 250a and 250b may include a plurality of gears, a plurality of gear shafts, and / or a plurality of rotating side surface members (supports), and may be connected to a first housing 211 and / or a second housing 212 to allow the first housing 211 and / or the second housing 212 to rotate within a specified rotational range. As an embodiment, depending on the state of the electronic device 200, the hinge housing 240c may be exposed to the outside of the electronic device 200 or covered by a foldable housing 210. In an example (see, for example, see...) Figure 2a When the electronic device 200 is in the unfolded state, the hinge housing 240c can be covered by the foldable housing 210 to prevent exposure to the outside of the electronic device 200. In another example (see, for example, see...) Figure 2b When the electronic device 200 is in a folded state, the hinge housing 240c can be exposed to the outside of the electronic device 200 by rotating the first housing 211 and the second housing 212.

[0075] According to an embodiment, the cover 260 may be disposed at the lower end of the first housing 211 and the second housing 212 (e.g., Figure 2a (in the -z direction) to form the rear surface of the electronic device 200. As an example, the cover 260 may include the lower end coupled to the first housing 211 (e.g., in the -z direction) to form the rear surface of the electronic device 200. Figure 2a The first cover 261 (in the -z direction) and the second cover 262 coupled to the lower end of the second housing 212. As another example, the first cover 261 and the first housing 211 may be integrally formed. As yet another example, the second cover 262 and the second housing 212 may be integrally formed.

[0076] The electronic device 200 according to the embodiment may further include a sensor module (not shown), a key input device 213, camera modules 214, 215 and 216 and / or a connector hole 217.

[0077] According to an embodiment, the key input device 213 may be disposed on at least one side surface of the foldable housing 210. As an example (see, for example, see...) Figure 2b The key input device 213 may be disposed on a side surface of the first housing 211. In another example (not shown), the key input device 317 may be disposed on a side surface of the second housing 212. In another embodiment, the electronic device 200 may not include part or all of the aforementioned key input device 213, and the un-included key input device 213 may be implemented on the flexible display 240 in another form such as a soft key.

[0078] According to an embodiment, camera modules 214, 215, and 216 may include a first camera device (not shown) (or "front camera") facing the flexible display 240, a second camera device 214 and 215 (or "rear camera") disposed on the cover 260, and / or a flash 216. For example, camera devices 214 and 215 may include at least one lens, an image sensor, and / or an image signal processor. For example, flash 216 may include a light-emitting diode or a xenon lamp.

[0079] According to an embodiment, connector hole 217 may accommodate a connector configured to send / receive power and / or data to / from an external electronic device, and / or a connector configured to send / receive audio signals to / from an external electronic device. For example, connector hole 217 may include a USB connector or a headphone jack (not shown) (or "headphone interface").

[0080] Figure 3 This is a perspective view of an electronic device 300 according to another embodiment, viewed from one side. Figure 3 A candybar-type electronic device 300 is shown.

[0081] Reference Figure 3 According to another embodiment, the electronic device 300 may include a housing 310, an audio module 313, a camera module 315, a key input device 317, a connector hole 318, and / or a display 330.

[0082] According to an embodiment, the housing 310 may include a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and a side surface (or sidewall) 310C configured to surround the space between the first surface 310A and the second surface 310B. According to another embodiment (not shown), the housing 310 may refer to a configuration... Figure 3 The structure of at least a portion of the first surface 310A, the second surface 310B and / or the side surface 310C.

[0083] According to an embodiment, the first surface 310A may be configured by a front panel 302 (e.g., a polymer panel or glass panel including various coatings), wherein at least a portion of the front panel 302 is substantially transparent. According to an embodiment, the front panel 302 may include a curved portion that extends seamlessly from the first surface 310A toward a rear panel (not shown) by bending in at least one side edge portion.

[0084] According to an embodiment, the second surface 310B may be configured with a substantially opaque back panel (not shown). In the example, the back panel may be configured with coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. According to an embodiment, the back panel may include a curved portion that extends seamlessly from the second surface 310B to the front panel 302 by bending at least one side edge portion.

[0085] According to one embodiment, the side surface 310C may be coupled to the front panel 302 and the rear panel, and may be configured by a side surface member 320 comprising metal and / or polymer. According to another embodiment (not shown), the rear panel and the side surface member 320 may be integrally formed and comprise the same material (e.g., a metallic material such as aluminum).

[0086] According to an embodiment, the side surface member 320 may include a plurality of conductive portions (e.g., 320a, 320b, 320c, 320d, 320e, 330a, 330b, 330c, 330d and 330e) and / or a plurality of non-conductive portions (e.g., 320f, 320g, 320h, 320i, 320j, 330f, 330g, 330h, 330i and 330j) (or “segmented regions”) arranged between the plurality of conductive portions.

[0087] In the example, multiple conductive portions may include those disposed on the side surface of the housing 310 (e.g., Figure 3 The first conductive portion 320a is located on the upper end of the side surface in the +y direction, and is disposed at the right end of the first conductive portion 320a (e.g., the side surface in the +y direction). Figure 3 The second conductive portion 320b is located in the region adjacent to the first conductive portion 320a in the +x direction, and is disposed at the left end of the region adjacent to the first conductive portion 320a (e.g., in the +x direction). Figure 3 The third conductive portion 320c in the region adjacent to the second conductive portion 320b and disposed on the right side surface of the housing 310 (e.g., in the -x direction) Figure 3 The fourth conductive portion 320d on the side surface in the +x direction, and / or adjacent to the third conductive portion 320c and disposed on the left side surface of the housing 310 (e.g., the side surface in the +x direction). Figure 3 The fifth conductive portion 320e on the side surface in the -x direction.

[0088] In another example, multiple conductive portions may include those disposed on the side surface of the housing 310 (e.g., Figure 3 The sixth conductive portion 330a is located at the lower end of the side surface in the -y direction, and is provided at the right end of the sixth conductive portion 330a (e.g., ...). Figure 3The seventh conductive portion 330b is located in the region adjacent to the sixth conductive portion 330a in the +x direction, and is disposed at the left end of the region adjacent to the sixth conductive portion 330a (e.g., in the +x direction). Figure 3 The eighth conductive portion 330c in the region adjacent to the seventh conductive portion 330b and / or the fourth conductive portion 320d and disposed on the right side surface of the housing 310 (e.g., in the -x direction). Figure 3 The ninth conductive portion 330d on the surface in the +x direction, and / or adjacent to the eighth conductive portion 330c and / or the fifth conductive portion 320e and disposed on the left side surface of the housing 310 (e.g., Figure 3 The tenth conductive portion 330e on the surface in the -x direction.

[0089] In the example, the plurality of non-conductive portions may include a first non-conductive portion 320f disposed between the first conductive portion 320a and the second conductive portion 320b, a second non-conductive portion 320g disposed between the first conductive portion 320a and the third conductive portion 320c, a third non-conductive portion 320h disposed between the second conductive portion 320b and the fourth conductive portion 320f, a fourth non-conductive portion 320i disposed between one end of the third conductive portion 330c and the fifth conductive portion 320e, and / or a fifth non-conductive portion 320j disposed at the other end of the fifth conductive portion 320e.

[0090] In another example, the plurality of non-conductive portions may include a sixth non-conductive portion 330f disposed between the sixth conductive portion 330a and the seventh conductive portion 330b, a seventh non-conductive portion 330g disposed between the sixth conductive portion 330a and the eighth conductive portion 330c, an eighth non-conductive portion 330h disposed between the seventh conductive portion 330b and the ninth conductive portion 330d, a ninth non-conductive portion 330i disposed between one end of the eighth conductive portion 330c and the tenth conductive portion 330e, and / or a tenth non-conductive portion 330j disposed at the other end of the tenth conductive portion 330e.

[0091] According to an embodiment, multiple non-conductive portions may be filled with a non-conductive material, such as synthetic resin. In an example, multiple non-conductive portions (e.g., first non-conductive portion 320f, second non-conductive portion 320g, third non-conductive portion 320h, fourth non-conductive portion 320i, and fifth non-conductive portion 320j) may be arranged between first conductive portion 320a, second conductive portion 320b, second conductive portion 320c, fourth conductive portion 320d, and / or fifth conductive portion 320e to insulate the multiple conductive portions, thus the upper region of the side surface member 320 (e.g., Figure 3The region in the +y direction can be segmented into five regions. In another example, multiple non-conductive portions (e.g., the sixth non-conductive portion 330f, the seventh non-conductive portion 330g, the eighth non-conductive portion 330h, the ninth non-conductive portion 330i, and the tenth non-conductive portion 330j) can be arranged between the sixth conductive portion 330a, the seventh conductive portion 330b, the eighth conductive portion 330c, the ninth conductive portion 330d, and / or the tenth conductive portion 330e to insulate the multiple conductive portions, thus the lower end region of the side surface member 320 (e.g., Figure 3 The region in the -y direction can be divided into five regions.

[0092] According to an embodiment, the electronic device 300 may use at least one of the insulated first conductive portion 320a, second conductive portion 320b, third conductive portion 320c, fourth conductive portion 320d, and / or fifth conductive portion 320e as an antenna radiator. According to another embodiment, the electronic device 300 may use at least one of the insulated sixth conductive portion 330a, seventh conductive portion 330b, eighth conductive portion 330c, ninth conductive portion 330d, and / or tenth conductive portion 330e as an antenna radiator. For example, the plurality of conductive portions may be electrically connected to a wireless communication circuit disposed in the housing 310, and the wireless communication circuit may transmit RF signals of a specified frequency band to or receive RF signals from the plurality of conductive portions.

[0093] According to an embodiment, the audio module 313 may include a microphone hole and a speaker hole 313. A microphone configured to acquire external sound may be disposed in the microphone hole, and in an embodiment, multiple microphones may be arranged to detect the direction of sound. In an embodiment, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker may be included without a speaker hole (e.g., a piezoelectric speaker). The speaker hole 313 may include an external speaker hole for communication and a receiver hole.

[0094] According to an embodiment, the camera module 315 may include a first camera device 315 disposed on a first surface 310A, a second camera device (not shown) disposed on a second surface 310B, and / or a flash (not shown) of the electronic device 300. The camera device 315 may include one or more lenses, an image sensor, and / or an image signal processor. For example, the flash may include a light-emitting diode or a xenon lamp. In an embodiment, two or more lenses (infrared cameras, wide-angle lenses, and telephoto lenses) and image sensors may be arranged on one surface of the electronic device 300.

[0095] According to an embodiment, the key input device 317 may be disposed on the side surface 310C of the housing 310. In another embodiment (not shown), the electronic device 300 may not include part or all of the aforementioned key input device 317, and the unincluded key input device 317 may be implemented on the display 330 in another form such as soft keys.

[0096] According to an embodiment, connector hole 318 may accommodate a connector configured to send / receive power and / or data to / from an external electronic device, and / or a connector configured to send / receive audio signals to / from an external electronic device. For example, connector hole 318 may include a USB connector or a headphone jack.

[0097] According to an embodiment, the display 330 may be exposed via a substantial portion of the front panel 302. In one example, the edge of the display 330 may be configured to be substantially identical to the adjacent external shape (e.g., curved surface) of the front panel 302. In another embodiment (not shown), the gap between the boundary of the display 330 and the boundary of the front panel 302 may be configured to be substantially identical to increase the exposed area of ​​the display 330. In another embodiment (not shown), a recess or opening may be provided on a portion of the screen display area of ​​the display 330 and may include other electronic components aligned with the recess or opening, such as a camera module 315, a proximity sensor (not shown), or an illuminance sensor.

[0098] Figure 4 An electronic device including an antenna structure according to an embodiment is shown. The same reference numerals are used to denote components that are the same as or substantially the same as those described above, and overlapping descriptions will be omitted.

[0099] Reference Figure 4 The electronic device 100 according to an embodiment may include an antenna structure 400. The antenna structure 400 according to an embodiment may be disposed in a first region 131a and / or a second region 131b. Figure 4 In one embodiment, the antenna structure 400 is described as being disposed in the second region 131b.

[0100] The antenna structure 400 according to an embodiment may include a wireless communication circuit 430, a plurality of switching circuits 440, a plurality of conductive portions 410, a printed circuit board (PCB) 470 including a ground layer, and a plurality of insulating portions 420. The plurality of insulating portions 420 according to an embodiment may be filled with a non-conductive material, such as a synthetic polymer.

[0101] The wireless communication circuit 430 according to an embodiment can be disposed in the electronic device 100. The wireless communication circuit 430 according to an embodiment can be electrically connected to a plurality of conductive portions 410. The wireless communication circuit 430 according to an embodiment can transmit signals of a specified frequency band to the plurality of conductive portions 410, or can receive signals of a specified frequency band from the plurality of conductive portions 410.

[0102] According to an embodiment, multiple conductive portions 410 can be configured on at least a portion of the housing of the electronic device 100. A first conductive portion 411 and a second conductive portion 412, according to an embodiment, can be separated from each other by a second insulating portion 422. A second conductive portion 412 and a third conductive portion 413, according to an embodiment, can be separated from each other by a third insulating portion 423. Power can be fed from a wireless communication circuit 430 to the multiple conductive portions 410 according to an embodiment to operate as antenna radiators.

[0103] In the example, electronic device 100 may include a sensor module (not shown) that can generate data values ​​or electrical signals corresponding to internal operating states or external environmental states. In the example, electronic device 100 may also include a sensor module (not shown), such as at least one of a gesture sensor, gyroscope sensor, barometric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biosensor, temperature sensor, humidity sensor, or illuminance sensor. According to an embodiment, electronic device 100 can detect the approach of a human body via a grip sensor. According to an embodiment, the grip sensor (not shown) may be positioned at a first point where the first conductive portion 411 is connected to a third switching circuit 443, or at a second point where the first conductive portion 411 is connected to the first switching circuit 441. According to another embodiment, the grip sensor may be positioned symmetrically to the first or second point (e.g., Figure 1a The first side member 113), but not limited thereto.

[0104] For example, the electronic device 100 can detect the approach of a human body relative to the first insulating portion 421 via a grip sensor, but the portion by which the approach of a human body is detected by the grip sensor is not limited to this.

[0105] At least a portion of the plurality of switching circuits 440 according to an embodiment may be electrically connected to the wireless communication circuit 430. At least a portion of the plurality of switching circuits 440 according to an embodiment may be electrically connected to a plurality of conductive portions 410. The electronic device 100 according to an embodiment may control the electrical connection between the wireless communication circuit 430 and the plurality of conductive portions 410 via at least a portion of the plurality of switching circuits 440. For example, the wireless communication circuit 430 may be electrically connected to a first conductive portion 411 and / or a second conductive portion 412 via a first switching circuit 441. In an example, the wireless communication circuit 430 may be electrically connected to a second conductive portion 412 and / or a third conductive portion 413 via a second switching circuit 442.

[0106] The electronic device 100 according to an embodiment may include a plurality of connection portions 480. The plurality of connection portions 480 according to an embodiment may be part of a plurality of conductive portions 410. The plurality of connection portions 480 according to another embodiment may include connection structures (e.g., C-clamps, spring pins, and screws) disposed on a printed circuit board 470, but are not limited thereto. For example, a first conductive portion 411 may be electrically connected to a third switching circuit 443 via a third connection portion 483. A second conductive portion 412 may be electrically connected to a fourth switching circuit 444 via a fourth connection portion 484, and may be electrically connected to a second switching circuit 442 via a second connection portion 482.

[0107] According to an embodiment, the third conductive portion 413 and / or the fourth conductive portion 414 may be connected to a ground layer included in the printed circuit board 470.

[0108] The multiple switching circuits 440 according to the embodiments may include internal components. At least a portion of the multiple switching circuits 440 according to the embodiments can control the internal components to change the electrical path associated with the multiple conductive portions 410. A detailed description of the change of electrical path via the multiple switching circuits 440 will be described later.

[0109] Figure 5 (a) to Figure 5 (e) illustrates the connection relationship between the wireless communication circuit and the conductive part according to various embodiments.

[0110] Reference Figure 5 (a) to Figure 5 (e) According to various embodiments, the electrical connection between the wireless communication circuit 430 and the plurality of conductive portions 410 can be controlled by a plurality of switching circuits 440.

[0111] Reference Figure 5(a) According to an embodiment, the wireless communication circuit 430 can be electrically connected to the first conductive portion 411 via a first switching circuit 441 and a first feed line 461. According to an embodiment, in a first mode, the wireless communication circuit 430 can be electrically connected to the first conductive portion 411 via the first switching circuit 441 and can transmit or receive signals in a first frequency band (e.g., a low-frequency band) by feeding power to the first conductive portion 411. According to an embodiment, the wireless communication circuit 430 can be electrically connected to the second conductive portion 412 via a second switching circuit 442 and a third feed line 463. The wireless communication circuit 430 can be electrically connected to the second conductive portion 412 via the second switching circuit 442 and can transmit or receive signals in a second frequency band (e.g., a mid-frequency band, a high-frequency band, or an ultra-high-frequency band) by feeding power to the second conductive portion 412.

[0112] Reference Figure 5 (b) According to an embodiment, the wireless communication circuit 430 can be electrically connected to the first conductive portion 411 via a first switching circuit 441 and a first feed line 461. According to an embodiment, in a second mode, the wireless communication circuit 430 can be electrically connected to the first conductive portion 411 via the first switching circuit 441 and can transmit or receive signals of a first frequency band (e.g., a low-frequency band) by feeding power to the first conductive portion 411. According to an embodiment, the wireless communication circuit 430 can be electrically connected to the second conductive portion 412 via a third feed line 463. The wireless communication circuit 430 can be electrically connected to the third conductive portion 413 via a fourth feed line 464. The wireless communication circuit 430 can be electrically connected to the second conductive portion 412 and the third conductive portion 413 via a second switching circuit 442 and can transmit or receive signals of a second frequency band (e.g., a mid-frequency band, a high-frequency band, or an ultra-high-frequency band) by feeding power to the second conductive portion 412 and the third conductive portion 413.

[0113] Reference Figure 5 (c) According to an embodiment, the wireless communication circuit 430 can be electrically connected to the first conductive portion 411 via a first switching circuit 441 and a first feed line 461. According to an embodiment, in a third mode, the wireless communication circuit 430 can be electrically connected to the first conductive portion 411 via the first switching circuit 441 and can transmit or receive signals of a first frequency band (e.g., a low-frequency band) by feeding power to the first conductive portion 411. According to an embodiment, the wireless communication circuit 430 can be electrically connected to the third conductive portion 413 via a second switching circuit 442 and a fourth feed line 464. The wireless communication circuit 430 can be electrically connected to the third conductive portion 413 via the second switching circuit 442 and can transmit or receive signals of a second frequency band (e.g., a mid-frequency band, a high-frequency band, or an ultra-high-frequency band) by feeding power to the third conductive portion 413.

[0114] Reference Figure 5 (d) According to an embodiment, the wireless communication circuit 430 can be electrically connected to the first conductive portion 411 via a first switching circuit 441 and a first feed line 461. The wireless communication circuit 430 can be electrically connected to the second conductive portion 412 via the first switching circuit 441 and a second feed line 462. According to an embodiment, the fourth switching circuit 444 can be electrically connected to the second feed line 462 via a fifth feed line 465. According to an embodiment, in a fourth mode, the wireless communication circuit 430 can be electrically connected to the first conductive portion 411 and the second conductive portion 412 via the first switching circuit 441, and can transmit or receive signals in a first frequency band (e.g., a low-frequency band) by feeding power to the first conductive portion 411 and the second conductive portion 412. According to an embodiment, the wireless communication circuit 430 can be electrically connected to the third conductive portion 413 via the second switching circuit 442 and the fourth feed line 464. The wireless communication circuit 430 can be electrically connected to the third conductive portion 413 via the second switching circuit 442 and fed to the third conductive portion 413 to transmit or receive signals in a second frequency band (e.g., intermediate frequency, high frequency, or ultra-high frequency). According to an embodiment, the third switching circuit 443 can control internal components to have an impedance electrically close to a short circuit. The third switching circuit 443 according to an embodiment can have an impedance electrically close to a short circuit, and thus can change the electrical path from the wireless communication circuit 430 to the first conductive portion 411 via the first switching circuit 441. For example, the third switching circuit 443 can be electrically connected to a circuit on a printed circuit board (e.g., Figure 4 The ground plane in the printed circuit board 470.

[0115] Reference Figure 5(e) According to an embodiment, the wireless communication circuit 430 can be electrically connected to the second conductive portion 412 via a first switching circuit 441 and a second feeder 462. According to an embodiment, the fourth switching circuit 444 can be electrically connected to the second feeder 462 via a fifth feeder 465. According to an embodiment, in a fifth mode, the wireless communication circuit 430 can be electrically connected to the second conductive portion 412 via the first switching circuit 441 and can transmit or receive signals in a first frequency band (e.g., a low-frequency band) by feeding power to the second conductive portion 412. According to an embodiment, the wireless communication circuit 430 can be electrically connected to the third conductive portion 413 via the second switching circuit 442 and the fourth feeder 464. The wireless communication circuit 430 can be electrically connected to the third conductive portion 413 via the second switching circuit 442 and can transmit or receive signals in a second frequency band (e.g., a mid-frequency band, a high-frequency band, or an ultra-high-frequency band) by feeding power to the third conductive portion 413. According to an embodiment, the fourth switching circuit 444 can control internal components to change the electrical path from the wireless communication circuit 430 to the second conductive portion 412 via the first switching circuit 441. According to an embodiment, the fourth switching circuit 444 can be electrically connected to a circuit board (e.g., a printed circuit board). Figure 4 The ground in the printed circuit board 470).

[0116] According to an embodiment, the third switching circuit 443 and / or the fourth switching circuit 444 can be connected to a circuit board disposed on a printed circuit board (e.g., via a control signal from a wireless communication circuit 430). Figure 4 The ground in the printed circuit board 470).

[0117] According to an embodiment, the wireless communication circuit 430 can switch from a first mode to a fifth mode. According to an embodiment, during the switch from the first mode to the fifth mode, the wireless communication circuit 430 may include at least one of a second mode, a third mode, and a fourth mode. For example, after switching from the first mode to the fourth mode, the wireless communication circuit can switch to the fifth mode. According to an embodiment, when the mode of the wireless communication circuit 430 is changed, the conductive portions 411, 412, 413, or 414 that transmit and / or receive signals in the first and second frequency bands can be changed. For example, in the case of switching from the first mode to the fifth mode, the conductive portion that transmits / receives signals in the first frequency band can switch from the first conductive portion 411 to the second conductive portion 412, and the conductive portion that transmits / receives signals in the second frequency band can switch from the second conductive portion 412 to the third conductive portion 413.

[0118] Figure 6 This is a flowchart for determining the connection relationship between the wireless communication circuit and the conductive part according to the embodiment.

[0119] Reference Figure 6The wireless communication circuit 430 can change the feed structure for transmitting and receiving signals in the first frequency band and the second frequency band according to the proximity of a human body.

[0120] According to an embodiment, in operation 610, the wireless communication circuit 430 can be electrically connected to a first conductive portion, feeding power to the first conductive portion and thus capable of transmitting or receiving a first signal including a first frequency band, and can also be electrically connected to a second conductive portion, feeding power to the second conductive portion and thus capable of transmitting or receiving a second signal including a second frequency band. For example, via Figure 5 (a) or Figure 5 (b) In this structure, the wireless communication circuit 430 can feed power to the first conductive portion to transmit / receive a first signal, and can feed power to the second conductive portion to transmit / receive a second signal.

[0121] According to one embodiment, in operation 620, the grip sensor can detect the approach of a human body. In operation 620 according to another embodiment, if the grip sensor, which has already detected the approach of a human body, does not detect the approach of a human body, operation 610 can be performed. According to yet another embodiment, if the determination result of operation 620 indicates that a human body is approaching, operation 630 can be performed.

[0122] In operation 630 according to an embodiment, the wireless communication circuit 430 can be electrically connected to the first conductive portion and the second conductive portion, feeding power to the first conductive portion and the second conductive portion, and thus can transmit or receive a first signal including a first frequency band. For example, via Figure 5 (d) In this structure, the wireless communication circuit 430 can feed power to the first conductive portion and the second conductive portion, and thus can transmit or receive a first signal including the first frequency band.

[0123] In operation 630 according to an embodiment, the wireless communication circuit 430 can be electrically connected to the third conductive portion, feeding power to the third conductive portion, and thus can transmit or receive a second signal including the second frequency band. For example, via Figure 5 (d) Figure 5 (b) Figure 5 (c) and Figure 5 (e) In this structure, the wireless communication circuit 430 can feed power to the third conductive portion and thus can transmit or receive a second signal including the second frequency band.

[0124] Figure 7 This is a flowchart illustrating the process of changing the connection relationship between the wireless communication circuit and the conductive portion according to an embodiment. (The remaining text is omitted.) Figure 6 Overlapping descriptions.

[0125] Reference Figure 6 and Figure 7According to the embodiment, the electronic device can change the electrical connection path between the wireless communication circuit and multiple conductive parts depending on whether certain conditions are met.

[0126] In operation 710 according to an embodiment, when operation 630 is performed, the electronic device can determine whether a first condition is met. The first condition according to an embodiment may be a condition that the radiation performance (e.g., radiation intensity, coverage, or resonance) of the first signal is below a predetermined level, but is not limited thereto. According to another embodiment, the first condition may be whether a user has input information. The electronic device according to an embodiment can provide guidance for the aforementioned user input. According to an embodiment, if the first signal does not meet the first condition, the electronic device can perform operation 630. According to another embodiment, if the first signal meets the first condition, the electronic device can perform operation 720.

[0127] In operation 720 according to an embodiment, the electronic device can release the connection between the wireless communication circuit and the first conductive portion. (Refer to...) Figure 5 and Figure 7 In operation 720, the connection between the wireless communication circuit 430 and the conductive portion can be switched from a first mode, a second mode, or a third mode to a fifth mode by the first switching circuit 441. According to another embodiment, in operation 720, the connection between the wireless communication circuit 430 and the conductive portion can be switched from a first mode, a second mode, or a third mode to a fourth mode by the first switching circuit 441, and then switched to a fifth mode.

[0128] In operation 730 according to an embodiment, the wireless communication circuit 430 can be electrically connected to the second conductive portion, feeding power to the second conductive portion, and thus can transmit or receive a first signal including a first frequency band. In operation 730 according to an embodiment, the wireless communication circuit 430 can be electrically connected to a third conductive portion, feeding power to the third conductive portion, and thus can transmit or receive a second signal including a second frequency band. See also... Figure 5 and Figure 7 In operation 730, the connection between the wireless communication circuit 430 and the conductive part can be switched from a first mode to a third mode, a fourth mode, or a fifth mode by the second switching circuit 442. For example, in operation 730, the connection between the wireless communication circuit 430 and the conductive part can be switched from a first mode to a second mode by the second switching circuit 442, and then switched to a third mode, a fourth mode, or a fifth mode.

[0129] Figure 8a A switching circuit including internal components according to an embodiment is shown. Figure 8b A switching circuit including internal components according to another embodiment is shown. Figure 8cA third switching circuit connected to the first conductive portion according to an embodiment is shown. Figure 8d A fourth switching circuit connected to the second conductive portion according to an embodiment is shown.

[0130] Reference Figure 8a and Figure 8b The switching circuit 800 according to the embodiment may include a plurality of internal components 801 or 811 and a switch 802 or 812.

[0131] Refer to together Figure 5 , Figure 8a and Figure 8b According to the embodiment, the switching circuit 800 (e.g., Figure 5 The first switching circuit 441 may be a tuner including a plurality of internal components 801 or 811 and a plurality of internal switches 802 or 812, but is not limited thereto. According to an embodiment, the switching circuit 800 may be electrically connected to a plurality of conductive portions 411 or 412. According to an embodiment, the switching circuit 800 may be electrically connected to a fourth switching circuit 444. According to an embodiment, the fourth switching circuit 444 may be connected to ground.

[0132] According to an embodiment, when the grip sensor has detected the approach of a human body, the switching circuit 800 can control internal switches 802 or 812 to allow the wireless communication circuit 430 to be electrically connected to the first conductive portion 411 and / or the second conductive portion 412. According to an embodiment, when the grip sensor has detected the approach of a human body, the switching circuit 800 can control internal components 801 or 811 to have an impedance that is electrically close to a short circuit. The switching circuit 800 according to an embodiment can have an impedance that is electrically close to a short circuit, and thus can change the electrical path from the wireless communication circuit 430 to the first conductive portion 411 via the switching circuit 800. According to an embodiment, by changing the electrical path from the wireless communication circuit 430 to the first conductive portion 411, the wireless communication circuit 430 can adjust the frequency band of the first signal transmitted or received via the first conductive portion 411.

[0133] According to another embodiment, when the proximity sensor does not detect the approach of a human body, the switching circuit 800 can control internal switches 802 or 812 to allow the wireless communication circuit 430 to be electrically connected to the first conductive portion 411. According to another embodiment, the switching circuit 800 can control internal switches 802 or 812 to allow the wireless communication circuit 430 to be electrically connected to the second conductive portion 412. According to another embodiment, the switching circuit 800 can control internal elements 801 or 811 to change the length of the electrical path from the wireless communication circuit 430 to the first conductive portion 411. According to another embodiment, the switching circuit 800 can control internal elements 801 or 811 to change the length of the electrical path from the wireless communication circuit 430 to the second conductive portion 412. According to another embodiment, by changing the electrical path from the wireless communication circuit 430 to the second conductive portion 412, the wireless communication circuit 430 can adjust the frequency band of the first signal transmitted or received via the second conductive portion 412.

[0134] Reference Figure 8c and Figure 8d The third switching circuit 443 and / or the fourth switching circuit 444 may include a single-pole four-throw (SP4T) switch. According to an embodiment, the third switching circuit 443 and / or the fourth switching circuit 444 may include a single-pole double-throw (SPDT) switch, but are not limited thereto.

[0135] According to an embodiment, the third switching circuit 443 and / or the fourth switching circuit 444 can be electrically connected to a plurality of impedances Z1, Z2, Z3, and Z4. For example, at least one of the plurality of impedances Z1, Z2, Z3, and Z4 can be 100pF, but is not limited thereto. According to an embodiment, the third switching circuit 443 and the fourth switching circuit 444 can control the internal paths of the plurality of impedances Z1, Z2, Z3, and Z4, and thus can change the feed structure of the conductive portion 410 and the wireless communication circuit 430.

[0136] According to an embodiment, the third switching circuit 443 can be electrically connected to the first conductive portion 411. According to an embodiment, the fourth switching circuit 444 can be electrically connected to the second feeder 462 via the fifth feeder 465. According to an embodiment, the fourth switching circuit 444 can be electrically connected to the second conductive portion 412 via the fifth feeder 465 and the second feeder 462.

[0137] Figure 9a The results of signal radiation via a wireless communication circuit of an electronic device according to an embodiment are shown. Figure 9b The result of signal radiation via a wireless communication circuit of an electronic device according to another embodiment is shown. Figure 9c The result of signal radiation via a wireless communication circuit of an electronic device according to another embodiment is shown.

[0138] Refer to together Figure 4 , Figure 5 , Figure 9a , Figure 9b and Figure 9c The performance of the antenna structure 400 (e.g., the resonance of the signal or the intensity of radiation) can be improved by changing the electrical connection path between the wireless communication circuit 430 and the plurality of conductive portions 410 of the electronic device 100 according to the embodiment.

[0139] Reference Figure 5 and Figure 9a The connection path between the wireless communication circuit 430 and the plurality of conductive parts 410 has Figure 5 (a) Figure 5 (b) or Figure 5 In the case of connection path (c), the results of the first right grip 911, the first left grip 912, the second right grip 913, and the second left grip 914 can be equal to or less than the target performance of the antenna structure 400 in terms of radiation efficiency. According to an embodiment, the connection path between the wireless communication circuit 430 and the plurality of conductive portions 410 has… Figure 5 (a) Figure 5 (b) or Figure 5 In the case of the connection path (c), the results of the first right grip 921, the first left grip 922, the second right grip 923, and the second left grip 924 can be equal to or less than the target performance of the antenna structure 400 in terms of reflection coefficient.

[0140] Reference Figure 5 and Figure 9b The connection path between the wireless communication circuit 430 and the plurality of conductive parts 410 has Figure 5 In the case of connection path (d), at least a portion of the results of the first right grip 931, the first left grip 932, the second right grip 933, and the second left grip 934 can be greater than the target performance of the antenna structure 400 in terms of radiation efficiency. According to an embodiment, the connection path between the wireless communication circuit 430 and the plurality of conductive portions 410 has… Figure 5 In the case of connection path (d), at least a portion of the results of the first right grip 941, the first left grip 942, the second right grip 943, and the second left grip 944 can be greater than the target performance of the antenna structure 400 in terms of reflection coefficient.

[0141] Reference Figure 5 and Figure 9c The connection path between the wireless communication circuit 430 and the plurality of conductive parts 410 has Figure 5In the case of connection path (d), at least a portion of the results of the first right grip 951, the first left grip 952, the second right grip 953, and the second left grip 954 can be greater than the target performance of the antenna structure 400 in terms of radiation performance. According to an embodiment, the connection path between the wireless communication circuit 430 and the plurality of conductive portions 410 has… Figure 5 In the case of connection path (d), at least a portion of the results of the first right grip 961, the first left grip 962, the second right grip 963, and the second left grip 964 can be greater than the target performance of the antenna structure 400 in terms of reflection coefficient.

[0142] Figure 10 The result of signal radiation via a wireless communication circuit of an electronic device according to another embodiment is shown.

[0143] Refer to together Figure 4 , Figure 5 and Figure 10 By changing the electrical connection path between the wireless communication circuit 430 and the plurality of conductive portions 410 of the electronic device 100 according to the embodiment, the performance of the antenna structure 400 (e.g., the resonance of the signal or the radiation intensity) can be improved.

[0144] Reference Figure 5 and Figure 10 (a) The connection path between the wireless communication circuit 430 and the plurality of conductive portions 410 is from Figure 5 (a) The connection path is changed to Figure 5 In the case of the connection path in (e), from the first radiation 1011 to the second radiation 1012, the radiation efficiency can be improved by about 1.5 dB to about 2.0 dB, but is not limited to these values.

[0145] Reference Figure 5 and Figure 10 (b) The connection path between the wireless communication circuit 430 and the plurality of conductive portions 410 is from Figure 5 (a) The connection path is changed to Figure 5 In the case of the connection path (e), the radiation coefficient can be increased from the first reflection coefficient 1021 to the second reflection coefficient.

[0146] Figure 11 An electronic device including a first wireless communication circuit and a second wireless communication circuit according to an embodiment is shown.

[0147] Reference Figure 11The antenna structure 1100 according to an embodiment may include a first wireless communication circuit 1130, a second wireless communication circuit 1132, a plurality of switching circuits 1140, a plurality of conductive portions 1110, a printed circuit board (PCB) 1170 including a ground layer, and a plurality of insulating portions 1120. The same / similar reference numerals are used for components that are the same or substantially the same as those described above, and overlapping descriptions will be omitted.

[0148] Reference Figure 11 The first wireless communication circuit 1131 can be electrically connected to the first switching circuit 1141. According to an embodiment, the first wireless communication circuit 1131 can be electrically connected via the first switching circuit 1141 to the first conductive portion 1111 and / or the second conductive portion 1112. According to an embodiment, the first wireless communication circuit 1131 can feed power to the first conductive portion 1111 and / or the second conductive portion 1112, and thus can transmit or receive a first signal including a first frequency band.

[0149] The second wireless communication circuit 1132 according to an embodiment can be electrically connected to the second switching circuit 1142. The second wireless communication circuit 1132 according to an embodiment can be electrically connected via the second switching circuit 1142 to the second conductive portion 1112 and / or the third conductive portion 1113. The second wireless communication circuit 1132 according to an embodiment can feed power to the second conductive portion 1112 and / or the third conductive portion 1113, and thus can transmit or receive a second signal including a second frequency band.

[0150] The third switching circuit 1143 according to an embodiment can be electrically connected to the first conductive portion 1111. The third switching circuit 1143 according to an embodiment may include internal components that control the internal components and thus can change the electrical path associated with the first conductive portion 1111. For example, the internal variable capacitor of the third switching circuit 1143 can be adjusted to configure the impedance of the third switching circuit 1143 to be very small, and thus the electrical path from the first wireless communication circuit 1131 via the first switching circuit 1141 to the point on the first conductive portion 1111 connected to the third switching circuit 1143 can be configured.

[0151] The fourth switching circuit 1144 according to an embodiment can be electrically connected to the second conductive portion 1112. The fourth switching circuit 1144 according to an embodiment may include internal components that control the internal components and thus can change the electrical path associated with the second conductive portion 1112. For example, the internal variable capacitor of the fourth switching circuit 1144 can be adjusted, and thus the length of the electrical path from the first wireless communication circuit 1131 via the first switching circuit 1141 to the second conductive portion 1112 can be changed.

[0152] The second switching circuit 1142 according to an embodiment may include internal components. The second switching circuit 1142 according to an embodiment can control the internal components and thus can change the length of the electrical path extending from the second wireless communication circuit 1132 via the second switching circuit 1142 to the second conductive portion 1112 and / or the third conductive portion 1113.

[0153] The electronic device 1100 according to an embodiment may include a plurality of connection portions 1180. The plurality of connection portions 1180 according to an embodiment may be part of a plurality of conductive portions 1110. The plurality of connection portions 1180 according to another embodiment may include connection structures (e.g., C-clamps, spring pins, and screws) disposed on a printed circuit board 1170, but are not limited thereto. For example, a first conductive portion 1111 may be electrically connected to a third switching circuit 1143 via a third connection portion 1183. A second conductive portion 1112 may be electrically connected to a fourth switching circuit 1144 via a fourth connection portion 1184, and may be electrically connected to a second switching circuit 1142 via a second connection portion 1182.

[0154] According to an embodiment, the third conductive portion 1113 and / or the fourth conductive portion 1114 may be connected to a ground layer included in the printed circuit board 1170.

[0155] Figure 12 This is a flowchart for determining the connection relationship between the wireless communication circuit and the conductive part according to the embodiment.

[0156] Refer to together Figure 11 and Figure 12 In operation 1210, the first wireless communication circuit 1131 according to the embodiment can feed power to the first conductive portion 1111, and thus can transmit or receive a first signal including a first frequency band. The second wireless communication circuit 1132 according to the embodiment can feed power to the second conductive portion 1112 in operation 1210, and thus can transmit or receive a second signal including a second frequency band.

[0157] The electronic device according to an embodiment may include a processor (not shown). A process (not shown) according to an embodiment may determine in operation 1220 whether to use the first wireless communication circuit 1131 alone or preferentially use the first wireless communication circuit 1131 to transmit or receive signals. Based on the determination, in the case of using the first wireless communication circuit 1131 alone or preferentially using the first wireless communication circuit 1131, a process (not shown) according to an embodiment may detect and determine the approach of a human body in operation 1230 by using a grip sensor. The component configured to detect the approach of a human body is not limited to a grip sensor.

[0158] If the grip sensor does not detect the approach of a human body, the antenna structure 1100 according to the embodiment can perform operation 1210. According to another embodiment, if the grip sensor detects the approach of a human body, in operation 1250, the first wireless communication circuit 1131 can be electrically connected to the first conductive portion 1111 and the second conductive portion 1112, feeding the first conductive portion 1111 and the second conductive portion 1112, and thus can transmit or receive a first signal including a first frequency band. In an embodiment, if the grip sensor detects the approach of a human body, in operation 1250, the second wireless communication circuit 1131 can be electrically connected to the third conductive portion 1113, feeding the third conductive portion 1113, and thus can transmit or receive a second signal including a second frequency band.

[0159] According to the process of the embodiment (not shown), in operation 1240, it can be determined whether to use the second wireless communication circuit 1132 alone or to use the second wireless communication circuit 1132 preferentially to transmit or receive signals. Based on the determination result, if the second wireless communication circuit 1132 is used alone or preferentially to transmit or receive signals, operation 1210 can be performed. In another embodiment, if the second wireless communication circuit 1132 is not used alone and is not preferentially used to transmit or receive signals, operation 1250 can be performed.

[0160] According to an embodiment, in operation 1250, the first wireless communication circuit 1131 can be fed to the first conductive portion 1111 and the second conductive portion 1112, and thus can transmit or receive a first signal including a first frequency band. In operation 1250, the second wireless communication circuit 1132 according to an embodiment can be fed to the third conductive portion 1113, and thus can transmit or receive a second signal including a second frequency band.

[0161] Figure 13a The results of signal radiation via the first wireless communication circuit are shown in a first state in which no human body is detected approaching, according to an embodiment. Figure 13b The results of signal radiation via the second wireless communication circuit are shown in a first state, according to an embodiment, in which no human presence is detected.

[0162] Refer to together Figure 11 and Figure 13a In the absence of human presence detected according to the embodiment, the radiation efficiency and reflection coefficient of the first signal via the first wireless communication circuit 1131 are shown. The first wireless communication circuit 1131 according to the embodiment can ensure constant radiation efficiency and reflection coefficient for normal operation of the antenna structure 1100 in a frequency range of approximately 850 MHz to approximately 950 MHz.

[0163] According to an embodiment, the electrical path from the first wireless communication circuit 1131 to the plurality of conductive portions 1110 can be changed according to the state of the plurality of switching circuits 1140.

[0164] According to an embodiment, the first wireless communication circuit 1131 can ensure multiple radiation efficiencies 1311 to 1315 based on the state of the third switching circuit 1143 or the fourth switching circuit 1144. For example, the third switching circuit 1143 can obtain a first radiation efficiency 1311 by configuring a low impedance. According to an embodiment, the first wireless communication circuit 1131 can ensure multiple reflection coefficients 1321 to 1325 based on the state of the third switching circuit 1143 or the fourth switching circuit 1144. For example, the third switching circuit 1311 can obtain a fifth reflection coefficient 1325 by configuring a high impedance.

[0165] Refer to together Figure 11 and Figure 13b In the case where no human presence is detected according to the embodiment, the radiation efficiency and reflection coefficient of the second signal via the second wireless communication circuit 1132 are shown.

[0166] According to an embodiment, the electrical path from the second wireless communication circuit 1132 to the plurality of conductive portions 1110 can be changed according to the state of the plurality of switching circuits 1140.

[0167] According to an embodiment, the second wireless communication circuit 1132 can ensure multiple radiation efficiencies 1331 and 1332 based on the states of the first switching circuit 1141 and the second switching circuit 1142. For example, when connected to the first conductive portion 1111, the first switching circuit 1141 can obtain a first radiation efficiency 1331. According to another example, when the first switching circuit 1141 is connected to the second conductive portion 1112, a second radiation efficiency 1332 can be obtained. According to an embodiment, the second wireless communication circuit 1132 can ensure multiple reflection coefficients 1341 and 1342 based on the states of the first switching circuit 1141 and the second switching circuit 1142. For example, when the first switching circuit 1141 is connected to the first conductive portion 1111, a first reflection coefficient 1341 can be obtained. According to another example, when the first switching circuit 1141 is connected to the second conductive portion 1112, a second reflection coefficient 1342 can be obtained.

[0168] Figure 14a The results of signal radiation via the first wireless communication circuit are shown in a second state, according to an embodiment, when the approach of a human body is detected. Figure 14b The results of signal radiation via a second wireless communication circuit are shown in a second state, according to an embodiment, when the approach of a human body is detected.

[0169] Reference Figure 5 , Figure 11 and Figure 14a In the event of a human body approaching according to an embodiment, the radiation efficiency and reflection coefficient of a first signal via the first wireless communication circuit 1131 are shown. The first wireless communication circuit 1131 according to the embodiment can ensure constant radiation efficiency and reflection coefficient in a frequency band of approximately 750 MHz or approximately 880 MHz based on the connection relationship between the first wireless communication circuit 1131 and the plurality of conductive portions 1110. For example, when the first switching circuit 1141 is connected to the first conductive portion 1111, a first radiation efficiency 1411 and a first reflection coefficient 1421 can be obtained. According to another example, when the first switching circuit 1141 is connected to the second conductive portion 1112, a second radiation efficiency 1412 and a second reflection coefficient 1422 can be obtained.

[0170] Reference Figure 5 , Figure 11 and Figure 14b In the case of detecting the approach of a human body according to the embodiment, the radiation efficiency and reflection coefficient of the second signal via the second wireless communication circuit 1132 are shown. For example, in the case of detecting the approach of a human body, the radiation efficiency 1430 and reflection coefficient 1440 of the second signal via the second wireless communication circuit 1132 can be obtained.

[0171] Figure 15 This is a block diagram of an electronic device in a network environment according to various embodiments.

[0172] Reference Figure 15In network environment 1500, electronic device 1501 can communicate with electronic device 1502 via a first network 1598 (e.g., a short-range wireless communication network), or with at least one of electronic device 1504 or server 1508 via a second network 1599 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 1501 can communicate with electronic device 1504 via server 1508. According to an embodiment, electronic device 1501 may include a processor 1520, a memory 1530, an input module 1550, a sound output module 1555, a display module 1560, an audio module 1570, a sensor module 1576, an interface 1577, a connection terminal 1578, a haptic module 1579, a camera module 1580, a power management module 1588, a battery 1589, a communication module 1590, a Subscriber Identity Module (SIM) 1596, or an antenna module 1597. In some embodiments, at least one of the aforementioned components (e.g., connection terminal 1578) may be omitted from electronic device 1501, or one or more other components may be added to electronic device 1501. In some embodiments, some of the aforementioned components (e.g., sensor module 1576, camera module 1580, or antenna module 1597) may be implemented as a single component (e.g., display module 1560).

[0173] Processor 1520 may run software (e.g., program 1540) to control at least one other component (e.g., hardware or software component) of electronic device 1501 connected to processor 1520, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, processor 1520 may store commands or data received from another component (e.g., sensor module 1576 or communication module 1590) in volatile memory 1532, process the commands or data stored in volatile memory 1532, and store the resulting data in non-volatile memory 1534. According to an embodiment, processor 1520 may include a main processor 1521 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 1523 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 1521. For example, when electronic device 1501 includes a main processor 1521 and an auxiliary processor 1523, the auxiliary processor 1523 may be adapted to consume less power than the main processor 1521, or adapted to be dedicated to a specific function. The auxiliary processor 1523 may be implemented separately from the main processor 1521, or may be implemented as part of the main processor 1521.

[0174] When the main processor 1521 is inactive (e.g., in sleep) state, the auxiliary processor 1523 (rather than the main processor 1521) can control at least some of the functions or states associated with at least one component of the electronic device 1501 (e.g., display module 1560, sensor module 1576, or communication module 1590), or when the main processor 1521 is active (e.g., running an application), the auxiliary processor 1523 can work with the main processor 1521 to control at least some of the functions or states associated with at least one component of the electronic device 1501 (e.g., display module 1560, sensor module 1576, or communication module 1590). According to embodiments, the auxiliary processor 1523 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 1580 or communication module 1590) functionally associated with the auxiliary processor 1523. According to embodiments, the auxiliary processor 1523 (e.g., a neural processing unit) may include hardware structures dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 1501 where the artificial intelligence is executed, or via a separate server (e.g., server 1508). Learning algorithms may include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural networks may be, but are not limited to, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), or deep Q-networks, or combinations of two or more thereof. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0175] Memory 1530 may store various data used by at least one component of electronic device 1501 (e.g., processor 1520 or sensor module 1576). The various data may include, for example, software (e.g., program 1540) and input or output data for commands associated with it. Memory 1530 may include volatile memory 1532 or non-volatile memory 1534.

[0176] The program 1540 may be stored as software in the memory 1530, and the program 1540 may include, for example, an operating system (OS) 1542, middleware 1544, or application 1546.

[0177] Input module 1550 can receive commands or data from outside electronic device 1501 (e.g., a user) that will be used by other components of electronic device 1501 (e.g., processor 1520). Input module 1550 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0178] The sound output module 1555 can output sound signals to the outside of the electronic device 1501. The sound output module 1555 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0179] Display module 1560 can visually provide information to the outside of electronic device 1501 (e.g., to a user). Display device 1560 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 1560 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0180] The audio module 1570 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 1570 can obtain sound via the input module 1550, or output sound via the sound output module 1555 or headphones of an external electronic device (e.g., electronic device 1502) that is directly (e.g., wired) or wirelessly connected to the electronic device 1501.

[0181] Sensor module 1576 can detect the operating state of electronic device 1501 (e.g., power or temperature) or the environmental state outside electronic device 1501 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 1576 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0182] Interface 1577 may support one or more specific protocols used to enable electronic device 1501 to connect directly (e.g., wired) or wirelessly to external electronic device (e.g., electronic device 1502). According to embodiments, interface 1577 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0183] Connection end 1578 may include a connector, through which electronic device 1501 can be physically connected to an external electronic device (e.g., electronic device 1502). According to embodiments, connection end 1578 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0184] The haptic module 1579 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 1579 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0185] Camera module 1580 can capture still or moving images. According to an embodiment, camera module 1580 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0186] The power management module 1588 manages the power supply to the electronic device 1501. According to an embodiment, the power management module 1588 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0187] Battery 1589 can power at least one component of electronic device 1501. According to an embodiment, battery 1589 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0188] Communication module 1590 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 1501 and external electronic devices (e.g., electronic device 1502, electronic device 1504, or server 1508), and perform communication via the established communication channel. Communication module 1590 may include one or more communication processors capable of operating independently of processor 1520 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 1590 may include wireless communication module 1592 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 1594 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 1598 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 1599 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 1592 can identify and verify the electronic device 1501 in the communication network (such as the first network 1598 or the second network 1599) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1596.

[0189] Wireless communication module 1592 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 1592 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 1592 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 1592 can support various requirements specified in electronic device 1501, external electronic device (e.g., electronic device 1504), or network system (e.g., second network 1599). According to an embodiment, the wireless communication module 1592 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0190] Antenna module 1597 can transmit or receive signals or power to or from the exterior of electronic device 1501 (e.g., external electronic device). According to an embodiment, antenna module 1597 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 1597 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 1598 or a second network 1599) can be selected from the multiple antennas by, for example, communication module 1590 (e.g., wireless communication module 1592). Signals or power can then be transmitted or received between communication module 1590 and the external electronic device via the selected at least one antenna. According to an embodiment, another component besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 1597.

[0191] According to various embodiments, antenna module 1597 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0192] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0193] According to an embodiment, commands or data can be sent or received between electronic device 1501 and external electronic device 1504 via server 1508 connected to a second network 1599. Each of electronic device 1502 or electronic device 1504 can be a device of the same type as electronic device 1501, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 1501 can be performed on one or more of external electronic devices 1502, external electronic devices 1504, or server 1508. For example, if electronic device 1501 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 1501 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 1501 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 1501. Electronic device 1501 may provide the result as at least a partial response to the request, with or without further processing. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 1501 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 1504 may include an Internet of Things (IoT) device. Server 1508 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, external electronic device 1504 or server 1508 may be included in a second network 1599. Electronic device 1501 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0194] The electronic devices according to the various embodiments disclosed herein can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. The electronic devices according to embodiments of this disclosure are not limited to those described above.

[0195] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or alternatives to the respective embodiments. In the description of the drawings, similar reference numerals may be used to designate similar or related elements. The singular form of a noun corresponding to an item may include one or more items unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first,” “second,” “first,” and “second” may be used to simply distinguish a corresponding element from another element and do not limit the element in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with / attached to another element (e.g., a second element)” or “connected to / attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wired), wirelessly, or via a third element to be combined / attached to or connected to the other element.

[0196] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and is used interchangeably with other terms such as "logic," "logic block," "component," or "circuit." A module can be the smallest unit or part of a single integrated component adapted to perform one or more functions. For example, according to an embodiment, a "module" can be implemented in the form of an application-specific integrated circuit (ASIC).

[0197] The various embodiments set forth herein can be implemented as software (e.g., program 1540) comprising one or more machine-readable instructions stored in a storage medium (e.g., internal memory 1536 or external memory 1538). For example, under the control of a processor, the machine's processor (e.g., processor 1520) can invoke at least one of the one or more stored instructions from the storage medium and execute the at least one instruction. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0198] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0199] According to various embodiments, each of the above-described elements (e.g., a module or program) may comprise a single entity or multiple entities, and some of the multiple entities may be separately disposed in any other element. According to various embodiments, one or more of the above-described elements may be omitted, or one or more other elements may be added. Optionally or additionally, multiple elements (e.g., modules or programs) may be integrated into a single element. In this case, according to various embodiments, the integrated element may still perform the one or more functions of each of the multiple elements in the same or similar manner as the corresponding element of the multiple elements performed one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or other element may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0200] An electronic device according to an embodiment may include a frame structure that configures at least a portion of a side surface of the electronic device, wherein the side surface configured by the frame structure includes a first edge, a second edge extending from the first edge and perpendicular to the first edge, and a third edge extending from the second edge and parallel to the first edge.

[0201] The frame structure may include a first insulating portion located at a point on a first edge, a first conductive portion extending from the first insulating portion to a second edge, a second conductive portion separated from the first conductive portion by a second insulating portion located at a first point on the second edge and corresponding to a portion of the second edge, and a third conductive portion separated from the second conductive portion by a third insulating portion located at a second point on the second edge and extending to a third edge.

[0202] The electronic device according to an embodiment may include a wireless communication circuit, a first switching circuit configured to connect the wireless communication circuit to at least one of a first conductive portion and a second conductive portion, a second switching circuit configured to connect the wireless communication circuit to at least one of a second conductive portion and a third conductive portion, and a proximity sensor configured to detect the approach of a human body relative to a first edge, disposed in an internal space formed by a frame structure. In the electronic device according to an embodiment, in a first state where the proximity sensor does not detect the approach of a human body, the wireless communication circuit can feed power to the first conductive portion via the first switching circuit and can feed power to the second conductive portion via the second switching circuit; and in a second state where the proximity sensor detects the approach of a human body, the wireless communication circuit can feed power to the first and second conductive portions via the first switching circuit and can feed power to the third conductive portion via the second switching circuit.

[0203] The electronic device according to the embodiment may further include a processor electrically connected to a wireless communication circuit and a third switching circuit connected to a first conductive portion.

[0204] In the second state, the wireless communication circuit or processor according to the embodiment can control the third switching circuit to change the electrical path associated with the first conductive portion.

[0205] In the second state, the wireless communication circuit according to the embodiment can feed power to the first conductive portion and the second conductive portion via the first switching circuit, and feed power to the third conductive portion via the second switching circuit, and then release the connection with the first conductive portion.

[0206] The electronic device according to the embodiment may further include a processor electrically connected to a wireless communication circuit and a fourth switching circuit connected to a second conductive portion.

[0207] According to the embodiment, the processor can control the fourth switching circuit to change the electrical path associated with the second conductive portion.

[0208] According to the embodiment, the proximity sensor can be disposed in the internal space formed by the frame structure.

[0209] The wireless communication circuit according to an embodiment may include a first wireless communication circuit and a second wireless communication circuit. According to an embodiment, the first wireless communication circuit may be connected to a first switching circuit, and the second wireless communication circuit may be electrically connected to a second switching circuit. The first and second wireless communication circuits according to an embodiment may transmit or receive signals in different frequency bands.

[0210] In the first state, the wireless communication circuit according to the embodiment can feed power to the first conductive portion via the first switching circuit, and can feed power to the second conductive portion and the third conductive portion via the second switching circuit.

[0211] The operation method of the electronic device according to the embodiment may include the following operations: detecting the approach of a human body relative to a first edge of the electronic device; in a first state in which the approach of a human body is not detected, feeding power from the wireless communication circuit of the electronic device to a first conductive portion including at least a portion of the first edge via a first switching circuit, and feeding power from the second conductive portion separated from the first conductive portion by a second switching circuit via a second switching circuit; and in a second state in which the approach of a human body is detected, feeding power from the wireless communication circuit to the first conductive portion and the second conductive portion via the first switching circuit, and feeding power from the third conductive portion separated from the second conductive portion by a second switching circuit via a second switching circuit.

[0212] In the second state, the operation method of the electronic device according to the embodiment may include changing the electrical path associated with the first conductive portion via a third switching circuit.

[0213] In the second state, the operation method of the electronic device according to the embodiment may include the following operations: the wireless communication circuit feeds power to the first conductive portion and the second conductive portion via the first switching circuit, feeds power to the third conductive portion via the second switching circuit, and then releases the connection with the first conductive portion.

[0214] The operation method of the electronic device according to the embodiment may include changing the electrical path associated with the second conductive portion via a fourth switching circuit.

[0215] In the first state, the operation method of the electronic device according to the embodiment may include the operation of a wireless communication circuit feeding power to a first conductive portion via a first switching circuit and feeding power to a second conductive portion and a third conductive portion via a second switching circuit.

[0216] In either the first or second state, the operation method of the electronic device according to the embodiment may include the operation of a wireless communication circuit feeding power to a first conductive portion via a first switching circuit and feeding power to a third conductive portion via a second switching circuit.

[0217] According to the embodiment, the operation of detecting the approach of a human body can be performed by a proximity sensor disposed in an electronic device.

[0218] An electronic device according to an embodiment may include a frame structure that configures at least a portion of a side surface of the electronic device, wherein the side surface configured by the frame structure includes a first edge, a second edge extending from the first edge and perpendicular to the first edge, and a third edge extending from the second edge and parallel to the first edge.

[0219] The frame structure according to the embodiment may include a first insulating portion located at a point on a first edge, a first conductive portion extending from the first insulating portion to a second edge, a second conductive portion separated from the first conductive portion by a second insulating portion located at a first point on the second edge and corresponding to a portion of the second edge, and a third conductive portion separated from the second conductive portion by a third insulating portion located at a second point on the second edge and extending to a third edge.

[0220] The electronic device according to an embodiment may include a wireless communication circuit disposed in an internal space formed by a frame structure, a switching circuit configured to connect the wireless communication circuit to at least one of a first conductive portion and a second conductive portion, and a proximity sensor configured to detect the approach of a human body relative to a first edge.

[0221] In the electronic device according to the embodiment, in a first state where the proximity sensor does not detect the approach of a human body, the wireless communication circuit can feed power to the first conductive portion via a switching circuit, and in a second state where the proximity sensor detects the approach of a human body, the wireless communication circuit can feed power to the first conductive portion and the second conductive portion via a switching circuit.

[0222] In the second state, the wireless communication circuit according to the embodiment can feed power to the first conductive portion and the second conductive portion via a switching circuit, and then release the connection with the first conductive portion.

[0223] The electronic device according to an embodiment may further include a processor and a third switching circuit connected to the first conductive portion. In a second state, the processor according to an embodiment can control the third switching circuit to change the electrical path associated with the first conductive portion.

[0224] The electronic device according to an embodiment may further include a fourth switching circuit connected to the second conductive portion. In a second state, the processor according to an embodiment can control the fourth switching circuit to change the electrical path associated with the second conductive portion.

[0225] According to the embodiment, the proximity sensor can be disposed in the internal space formed by the frame structure.

Claims

1. An electronic device comprising: A frame structure, comprising at least a portion of the side surface of the electronic device. The side surface is configured by the frame structure and includes a first edge, a second edge extending from the first edge and perpendicular to the first edge, and a third edge extending from the second edge and parallel to the first edge. The framework structure includes: The first insulating portion is located at a point on the first edge. A first conductive portion extends from the first insulating portion to the second edge. The second conductive portion is separated from the first conductive portion by a second insulating portion located at a first point on the second edge, and corresponds to a portion of the second edge. The third conductive portion is separated from the second conductive portion by a third insulating portion located at a second point on the second edge, and extends to the third edge; A wireless communication circuit is disposed within the internal space formed by the frame structure; A first switching circuit is configured to connect the wireless communication circuit to at least one of the first conductive portion and the second conductive portion; A second switching circuit is configured to connect the wireless communication circuit to at least one of the second conductive portion and the third conductive portion; and A proximity sensor is configured to detect the approach of a human body relative to the first edge. In the first state, where the proximity sensor does not detect the approach of the human body, the wireless communication circuit feeds power to the first conductive portion via the first switching circuit and to the second conductive portion via the second switching circuit. In the second state where the proximity sensor detects the approach of the human body, the wireless communication circuit feeds power to the first conductive part and the second conductive part via the first switching circuit, and feeds power to the third conductive part via the second switching circuit.

2. The electronic device according to claim 1, further comprising: The processor is electrically connected to the wireless communication circuit; as well as A third switching circuit is connected to the first conductive portion, wherein... In the second state, the wireless communication circuit or the processor controls the third switching circuit to change the electrical path associated with the first conductive portion.

3. The electronic device according to claim 1, wherein, In the second state, the wireless communication circuit feeds power to the first conductive portion and the second conductive portion via the first switching circuit, feeds power to the third conductive portion via the second switching circuit, and then releases the connection with the first conductive portion.

4. The electronic device according to claim 3, further comprising: The processor is electrically connected to the wireless communication circuit; as well as The fourth switching circuit is connected to the second conductive part. The processor controls the fourth switching circuit to change the electrical path associated with the second conductive portion.

5. The electronic device according to claim 1, wherein, The proximity sensor is disposed in the internal space formed by the frame structure.

6. The electronic device according to claim 1, wherein, The wireless communication circuit includes a first wireless communication circuit and a second wireless communication circuit, and The first wireless communication circuit is connected to the first switching circuit, and the second wireless communication circuit is connected to the second switching circuit.

7. The electronic device according to claim 6, wherein, The first wireless communication circuit and the second wireless communication circuit transmit or receive signals in different frequency bands.

8. The electronic device according to claim 1, wherein, In the first state, the wireless communication circuit feeds power to the first conductive portion via the first switching circuit, and feeds power to the second conductive portion and the third conductive portion via the second switching circuit.

9. A method for operating an antenna of an electronic device, the method comprising: Detecting the proximity of a human body to the first edge of the electronic device; In a first state where no human body is detected approaching, the wireless communication circuit of the electronic device feeds power to a first conductive portion including at least a portion of the first edge via a first switching circuit, and feeds power to a second conductive portion separated from the first conductive portion by a first insulating portion via a second switching circuit. as well as In the second state where the proximity of the human body is detected, the wireless communication circuit feeds power to the first conductive portion and the second conductive portion via the first switching circuit, and feeds power to the third conductive portion which is separated from the second conductive portion by the second insulating portion via the second switching circuit.

10. The method of claim 9, further comprising, in the second state, changing the electrical path associated with the first conductive portion via a third switching circuit.

11. The method of claim 9, further comprising, in the second state, feeding the first conductive portion and the second conductive portion by the wireless communication circuit via the first switching circuit, feeding the third conductive portion via the second switching circuit, and then releasing the connection with the first conductive portion.

12. The method of claim 11, further comprising changing the electrical path associated with the second conductive portion via a fourth switching circuit.

13. The method of claim 9, further comprising, in the first state, feeding the first conductive portion by the wireless communication circuit via the first switching circuit, and feeding the second conductive portion and the third conductive portion via the second switching circuit.

14. The method of claim 9, further comprising, in the first state or the second state, feeding the first conductive portion via the wireless communication circuit through the first switching circuit, and feeding the third conductive portion via the second switching circuit.

15. The method according to claim 9, wherein, The detection of the human body's approach is performed by a proximity sensor located in the electronic device.

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