A heat sink structure, an integrated circuit module, and a method for manufacturing the same.

Abstract

This invention discloses a heat sink structure, an integrated circuit module, and a method for manufacturing the same, relating to the field of circuit board manufacturing technology. The heat sink structure includes: a ceramic substrate, with conductive lines disposed on the upper surface of the ceramic substrate; a plurality of first thermally conductive metal blocks spaced apart on the lower surface of the ceramic substrate, with a spacer groove between each of the first thermally conductive metal blocks; a plurality of second thermally conductive metal blocks disposed in the area corresponding to the spacer groove, the upper surface of the second thermally conductive metal blocks being at the same horizontal plane and in contact with the lower surface of the first thermally conductive metal blocks; the first thermally conductive metal blocks and the second thermally conductive metal blocks are staggered to increase the contact area with the heat dissipation medium, thereby effectively improving the heat dissipation performance and integration of the ceramic substrate.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a heat sink structure, an integrated circuit module, and a method for manufacturing the same. Background Technology

[0002] In today's society, various power and electronic devices are being used more and more widely. These devices require power management and power control to ensure their efficient, high-precision, and highly reliable operation. As an integrated circuit, power chips have a variety of power control functions and can meet the needs of different electronic devices and power systems.

[0003] For power chip packaging, chip heat dissipation is a highly challenging reliability issue, especially for ultra-high power scenarios such as high-performance computing. Currently, using microchannel heat sinks in conjunction with ceramic substrates is the mainstream solution to the heat dissipation problem of high-power chips. The specific approach is to integrate the microchannel heat sink with the ceramic substrate containing the packaged device in the later stage. Although this approach can improve the heat dissipation effect, the overall heat dissipation performance and integration of the ceramic substrate are relatively low because the chip is packaged by splicing components in the later stage. Summary of the Invention

[0004] Therefore, it is necessary to provide a heat sink structure, an integrated circuit module, and a method for manufacturing the above-mentioned technical problems, so as to solve the problem that the overall heat dissipation performance and integration of the ceramic substrate are low when the microchannel heat sink is integrated with the ceramic substrate containing the device in the later stage in the prior art.

[0005] In a first aspect, embodiments of the present invention provide a heat sink structure, comprising:

[0006] A ceramic substrate, wherein conductive lines are provided on the upper surface of the ceramic substrate;

[0007] The lower surface of the ceramic substrate is provided with a plurality of first thermally conductive metal blocks spaced apart, and a spacer groove is provided between each of the first thermally conductive metal blocks.

[0008] The area corresponding to the spacer slot is provided with a plurality of second heat-conducting metal blocks, the upper surface of the second heat-conducting metal blocks being at the same level as the lower surface of the first heat-conducting metal blocks and in contact with each other.

[0009] The above scheme has the following beneficial effects:

[0010] The heat sink structure of the present invention has a plurality of spaced first thermally conductive metal blocks disposed on the lower surface of a ceramic substrate, with a spacer groove formed between each first thermally conductive metal block, and a second thermally conductive metal block disposed in the area corresponding to the lower part of the spacer groove, so that the first thermally conductive metal blocks and the second thermally conductive metal blocks are staggered to increase the contact area with the heat dissipation medium, thereby effectively improving the heat dissipation performance and integration of the ceramic substrate.

[0011] Optionally, the first heat-conducting metal block has a rectangular structure, and the spacing groove is provided between each of the first heat-conducting metal blocks in a first direction or a second direction.

[0012] Optionally, the first heat-conducting metal block has a square structure, and the spacing grooves are provided between each of the first heat-conducting metal blocks in the first and second directions.

[0013] Optionally, the two ends of the spacer groove are respectively connected to the edge of the ceramic substrate.

[0014] Optionally, the heat sink structure further includes:

[0015] A heat dissipation box is disposed on the lower surface of the ceramic substrate, and the heat dissipation box encloses the first thermally conductive metal block and the second thermally conductive metal block;

[0016] The heat sink has a coolant inlet at one end and a coolant outlet at the other end.

[0017] Secondly, embodiments of the present invention provide a method for manufacturing a heat sink, comprising:

[0018] Provide a ceramic substrate;

[0019] A first metal seed layer is formed on the upper surface of the ceramic substrate, and a second metal seed layer is formed on the lower surface of the ceramic substrate.

[0020] Conductive circuitry is fabricated on the outer surface of the first metal seed layer;

[0021] A plurality of first heat-conducting metal blocks are fabricated on the outer surface of the second metal seed layer, and the first heat-conducting metal blocks are spaced apart to form a gap groove.

[0022] Several second thermally conductive metal blocks are fabricated in the area corresponding to the spacer slot. The upper surface of the second thermally conductive metal block is at the same horizontal plane as the lower surface of the first thermally conductive metal block and is in contact with it.

[0023] The above scheme has the following beneficial effects:

[0024] The method for manufacturing the heat sink structure of the present invention involves creating a metal seed layer on the lower surface of a ceramic substrate, creating first thermally conductive metal blocks at intervals on the outer surface of the metal seed layer, forming a gap groove between each of the first thermally conductive metal blocks, and creating a second thermally conductive metal block below the gap groove, so that the first thermally conductive metal blocks and the second thermally conductive metal blocks are staggered to increase the contact area with the heat dissipation medium, thereby effectively improving the heat dissipation performance and integration of the ceramic substrate.

[0025] Optionally, a plurality of first thermally conductive metal blocks are formed on the outer surface of the second metal seed layer, including:

[0026] A first photoresist layer is formed on the surface of the metal seed layer on the lower surface of the ceramic substrate, and the first photoresist layer is exposed and developed.

[0027] In the first direction and / or the second direction of the edge of the first photoresist layer, a plurality of first electroplating tanks spaced apart by a first preset distance are sequentially formed, and metal is electroplated in the first electroplating tanks to form the first thermally conductive metal block.

[0028] Optionally, a plurality of second thermally conductive metal blocks are fabricated in the region corresponding to the spacer slot, including:

[0029] A second photoresist layer is fabricated on the plane where the lower surface of each of the first thermally conductive metal blocks is located, and the second photoresist layer is exposed and developed.

[0030] A plurality of second electroplating tanks are made on the lower surface of the second photoresist layer in areas corresponding to the intervals or intersections of the first electroplating tanks, and metal is electroplated in the second electroplating tanks to form the second thermally conductive metal block.

[0031] Optionally, after fabricating a plurality of second thermally conductive metal blocks in the region corresponding to the spacer slot, the process includes:

[0032] A heat dissipation box is formed on the lower surface of the ceramic substrate, and a coolant inlet and a coolant outlet are formed at both ends of the heat dissipation box, so that the heat dissipation box encloses the first thermally conductive metal block and the second thermally conductive metal block.

[0033] Thirdly, embodiments of the present invention provide an integrated circuit module, including a heat sink structure and an integrated chip as described in the first aspect, wherein the integrated chip is mounted on the upper surface of the ceramic substrate.

[0034] The above scheme has the following beneficial effects:

[0035] The integrated circuit module of the present invention has an integrated chip mounted on the upper surface of a heat dissipation substrate. A first thermally conductive metal block and a second thermally conductive metal block are disposed on the lower surface of the ceramic substrate. A spacer groove is formed between each of the first thermally conductive metal blocks, and a second thermally conductive metal block is disposed in the corresponding area below the spacer groove, so that the first thermally conductive metal blocks and the second thermally conductive metal blocks are staggered to increase the contact area with the heat dissipation medium, thereby effectively conducting the heat generated by the integrated chip through the first thermally conductive metal blocks and the second thermally conductive metal blocks, and improving the overall heat dissipation performance of the integrated circuit module. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the first heat sink structure provided in one embodiment of the present invention;

[0038] Figure 2 This is a schematic diagram of a second heat sink structure provided in one embodiment of the present invention;

[0039] Figure 2 (a) is a top view of a first thermally conductive metal block structure provided in an embodiment of the present invention;

[0040] Figure 2 (b) is a side view of a first thermally conductive metal block structure provided in an embodiment of the present invention;

[0041] Figure 2 (c) is a top view of a second thermally conductive metal block structure provided in an embodiment of the present invention;

[0042] Figure 2 (d) is a side view of a second thermally conductive metal block structure provided in an embodiment of the present invention;

[0043] Figure 2 (e) is a top view of a third thermally conductive metal block structure provided in an embodiment of the present invention;

[0044] Figure 2 (f) is a side view of a third thermally conductive metal block structure provided in an embodiment of the present invention;

[0045] Figure 3 This is a schematic diagram of an integrated circuit module provided in one embodiment of the present invention;

[0046] Figure 4This is a schematic diagram of a method for manufacturing a heat sink according to an embodiment of the present invention;

[0047] Figure 5(a) is a schematic diagram of the fabrication of a metal layer provided in an embodiment of the present invention;

[0048] Figure 5(b) is a schematic diagram of a method for fabricating a photoresist pattern according to an embodiment of the present invention;

[0049] Figure 5(c) is a schematic diagram of the fabrication of the first heat-conducting metal block provided in one embodiment of the present invention;

[0050] Figure 5(d) is a schematic diagram of another method for fabricating photoresist patterns according to an embodiment of the present invention;

[0051] Figure 5(e) is a schematic diagram of the fabrication of the second heat-conducting metal block provided in one embodiment of the present invention;

[0052] Figure 5(f) is a schematic diagram of the photoresist removal pattern provided in one embodiment of the present invention;

[0053] Figure 5(g) is a schematic diagram of the fabrication of a heat sink according to an embodiment of the present invention;

[0054] The symbols are explained as follows:

[0055] 100, Ceramic substrate; 110, First metal seed layer; 120, Second metal seed layer; 200, First photoresist layer; 210, Conductive circuit; 300, Second photoresist layer; 310, First thermally conductive metal block; 311, Spacing groove; 320, Third photoresist layer; 330, Second thermally conductive metal block; 400, Heat sink; 410, Coolant inlet; 420, Coolant outlet; 500, Integrated chip; 510, Pin. Detailed Implementation

[0056] To make the technical problems solved by the present invention, the technical solutions and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0057] It should be understood that the embodiments described below represent essential information to enable those skilled in the art to implement the embodiments and to illustrate the best mode of implementation. Upon reading the following description in conjunction with the accompanying drawings, those skilled in the art will understand the concepts of this disclosure and recognize the applications of these concepts not specifically mentioned herein. It should be understood that these concepts and applications fall within the scope of this disclosure and the appended claims.

[0058] It should also be understood that although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0059] It should also be understood that when a component is referred to as "connected" or "coupled" to another component, it can be directly connected or coupled to the other component, or there may be intermediate components. Conversely, when an element is referred to as "directly connected" or "directly coupled" to another element, there are no intermediate components.

[0060] It should also be understood that the terms “upper,” “lower,” “left,” “right,” “front,” “back,” “bottom,” “middle,” “center,” “top,” etc., may be used herein to describe various elements, indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are used only for the convenience of describing the invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, these elements should not be limited by these terms.

[0061] These terms are used only to distinguish one element from another. For example, a first element may be referred to as the “upper” element, and similarly, a second element may be referred to as the “upper” element depending on the relative orientation of these elements, without departing from the scope of this disclosure.

[0062] To be further understood, the terms “comprising,” “including,” “including,” and / or “include” as used herein specify the presence of the said feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0063] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that the terms used herein should be interpreted as having the same meaning as they mean in the context of this specification and related art, and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0064] like Figure 1As shown, a heat sink structure is provided in Embodiment 1 of this application. The heat sink structure includes: a ceramic substrate 100, wherein a conductive line 210 is provided on the upper surface of the ceramic substrate 100; a plurality of first thermally conductive metal blocks 310 are spaced apart on the lower surface of the ceramic substrate 100, and a spacer groove 311 is provided between each of the first thermally conductive metal blocks 310; a plurality of second thermally conductive metal blocks 330 are provided in the area corresponding to the spacer groove 311, and the upper surface of each second thermally conductive metal block 330 is at the same horizontal plane and in contact with the lower surface of the first thermally conductive metal block 310.

[0065] In this embodiment, a heat sink structure has several first thermally conductive metal blocks spaced apart on the lower surface of the ceramic substrate. A spacer groove is formed between each of the first thermally conductive metal blocks, and a second thermally conductive metal block is disposed in the area corresponding to the spacer groove. The first and second thermally conductive metal blocks are staggered to increase the contact area with the heat dissipation medium, thereby effectively improving the heat dissipation performance and integration of the ceramic substrate.

[0066] like Figure 2 As shown, this is a heat sink structure provided in Embodiment 2 of this application. The difference between this heat sink structure and the heat sink structure in Embodiment 1 is that this heat sink structure also includes a heat sink box 400. The heat sink box 400 is disposed on the lower surface of the ceramic substrate 100, and the heat sink box 400 completely encloses each of the first thermally conductive metal blocks 310 and each of the second thermally conductive metal blocks 330. A coolant inlet 410 is provided at one end of the heat sink box 400, and a coolant outlet 420 is provided at the other end. The heat dissipation coolant enters from the coolant inlet 410, passes through the metal microchannel heat dissipation structure composed of the first thermally conductive metal blocks 310 and the second thermally conductive metal blocks 330, and flows out from the coolant outlet 420, thereby improving the heat dissipation effect of the heat sink.

[0067] In this embodiment, three shapes of the first heat-conducting metal block and the second heat-conducting metal block and their relative placement positions are provided; Figure 2 (a) A top view of the first and second thermally conductive metal blocks provided in this embodiment. Figure 2 (b) is a side view of the first type of thermally conductive metal block and the second thermally conductive metal block, by Figure 2 (a) and Figure 2(b) It can be seen that the first heat-conducting metal block 310 and the second heat-conducting metal block 330 are both rectangular structures. Each of the first heat-conducting metal blocks 310 is set at a certain distance, and a gap groove is formed between each of the first heat-conducting metal blocks 310. The distance between each of the first heat-conducting metal blocks 310 can be equal or unequal. Each of the second heat-conducting metal blocks 330 is located on the surface of the first heat-conducting metal block 310 and is set perpendicularly and alternately to each of the first heat-conducting metal blocks 310. The spacing between each of the second heat-conducting metal blocks 330 can be equal or unequal. The width and thickness of the first heat-conducting metal block 310 and the second heat-conducting metal block 330 can be equal or unequal, and no restriction is imposed here.

[0068] Figure 2 (c) is a top view of the second type of first and second heat-conducting metal blocks provided in this embodiment. Figure 2 (d) is a side view of the second type of first and second heat-conducting metal blocks, composed of... Figure 2 (c) and Figure 2 (d) It can be seen that the first heat-conducting metal block 310 and the second heat-conducting metal block 330 are both rectangular structures. Each of the first heat-conducting metal blocks 310 is set at a certain distance, and a gap groove is formed between each of the first heat-conducting metal blocks 310. The distance between each of the first heat-conducting metal blocks 310 can be equal or unequal. Each of the second heat-conducting metal blocks 330 is set above the gap groove formed between the first heat-conducting metal blocks 310, and the lower surface of the second heat-conducting metal block 330 is in contact with the upper surface of the first heat-conducting metal block 310. The width of the second heat-conducting metal block 330 is greater than the width of the gap groove between the first heat-conducting metal blocks 310, so that the lower surface of the second heat-conducting metal block 330 can effectively contact the upper surface of the first heat-conducting metal block 310.

[0069] Figure 2 (e) A top view of the third type of first and second thermally conductive metal blocks provided in this embodiment. Figure 2 (f) is a side view of the third type of first and second heat-conducting metal blocks, composed of... Figure 2 (e) and Figure 2 (f) It can be seen that the first heat-conducting metal block 310 and the second heat-conducting metal block 330 are both square or rectangular structures. Each first heat-conducting metal block 310 is set at a certain distance in the first direction and the second direction on the lower surface of the ceramic substrate 100, thereby forming a cross-shaped interval groove. In the first direction and the second direction, the distance between each first heat-conducting metal block 310 can be equal or unequal. Each second heat-conducting metal block 330 is set in the area where the interval grooves cross, and the lower surface of the second heat-conducting metal block 330 is in contact with the upper surface of the first heat-conducting metal block 310. The second heat-conducting metal block 330 is also square or rectangular.

[0070] In this embodiment, the gaps between each of the first heat-conducting metal blocks 310 and each of the second heat-conducting metal blocks 330 are all connected to the edge of the ceramic substrate 100, i.e., the external air, in order to maintain good ventilation and improve the heat dissipation effect of the heat sink.

[0071] In this embodiment, the metal material can be copper, or other metal materials with good thermal conductivity.

[0072] In another embodiment, N layers of heat-conducting metal blocks are disposed on the lower surface of the ceramic substrate 100, where N is an integer greater than 2; each layer of heat-conducting metal blocks can be rectangular, square, circular or other arbitrary shapes, and a gap groove communicating with the external air is formed between the heat-conducting metal blocks of each layer to further increase the contact area with the heat dissipation medium and improve the heat dissipation effect of the heat sink.

[0073] The heat sink structure in this embodiment has the following characteristics:

[0074] (1) The first heat-conducting metal block and the second heat-conducting metal block are staggered to increase the overall heat dissipation area, thereby effectively improving the heat dissipation performance and integration of the ceramic substrate.

[0075] (2) The spacer slot is set to be connected to the outside air, so that the air can flow freely on the surface of the heat-conducting metal block, thereby improving the heat dissipation effect of the heat sink.

[0076] (3) A heat dissipation box is provided on the lower surface of the ceramic substrate, so that the first heat-conducting metal block and the second heat-conducting metal block are placed in the heat dissipation box. The heat dissipation effect is further improved by the flow of coolant in the heat dissipation box.

[0077] like Figure 3 As shown, an integrated circuit module is provided in Embodiment 3 of this application. The integrated circuit module includes: the heat sink structure in Embodiment 1 or Embodiment 2 and an integrated chip 500. The integrated chip 500 is mounted on the upper surface of the ceramic substrate 100, and the pins 510 of the integrated chip 500 are connected to the conductive lines on the upper surface of the ceramic substrate 100.

[0078] In one application scenario, the integrated chip 500 generates a certain amount of heat when it is working. The heat is conducted through the ceramic substrate to the heat-conducting metal block on the lower surface. At this time, coolant is injected into the coolant inlet 410 of the heat sink 400. The coolant can be gaseous air or liquid coolant. The coolant flows out from the coolant outlet 420. When the coolant flows, it carries away the heat from the surface of the heat-conducting metal block, thereby improving the overall heat dissipation performance of the integrated circuit module.

[0079] like Figure 4As shown, this is a method for manufacturing a heat sink according to Embodiment 4 of this application. The method may include the following steps:

[0080] Step S100: Provide a ceramic substrate.

[0081] In this embodiment, a ceramic substrate of a preset size is used. According to the heat dissipation requirements of the product, the material of the ceramic substrate can be one of alumina, aluminum nitride, silicon nitride, silicon carbide, or zirconium oxide toughened alumina, or diamond. As a preferred option, aluminum nitride is selected as the ceramic substrate.

[0082] The ceramic substrate can be square (rectangular or square) or circular; when the minimum line size of the conductive circuit pattern is ≤10μm, a circular ceramic substrate is preferred, and the process is carried out using equipment based on a wafer platform.

[0083] Step S200: A first metal seed layer is formed on the upper surface of the ceramic substrate, and a second metal seed layer is formed on the lower surface of the ceramic substrate.

[0084] Referring to Figure 5(a), a first metal seed 110 is formed on the upper surface of the ceramic substrate 100 by sputtering or vapor deposition, and a second metal seed layer 120 is formed on the lower surface. The metal seed layer can be selected from one of titanium-tungsten / copper, titanium / copper, and stainless steel / copper, thereby realizing the metallization of the upper and lower surfaces of the ceramic substrate 100.

[0085] Step S300: Conductive circuits are fabricated on the outer surface of the first metal seed layer.

[0086] Referring to Figure 5(b), a first photoresist layer 200 is fabricated on the upper surface of the ceramic substrate 100, and exposed and developed to form a window pattern at a preset position; when the minimum size of the conductive line pattern or microchannel pattern is ≤10μm, the photoresist layer is preferably photoresist, otherwise a dry film is preferred; referring to Figure 5(c), the window pattern is then electroplated to form a conductive line 210.

[0087] Step S400: Several first heat-conducting metal blocks are made on the outer surface of the second metal seed layer, and the first heat-conducting metal blocks are spaced apart to form a gap groove.

[0088] Referring to Figure 5(b), a second photoresist layer 300 is fabricated on the lower surface of the ceramic substrate 100, and then exposed and developed. A first thermally conductive metal block is then fabricated. In this embodiment, the first method for fabricating the first thermally conductive metal block is as follows:

[0089] In the first direction along the edge of the second photoresist layer 300, a plurality of first electroplating tanks spaced at a certain distance are sequentially formed, as shown in Figure 5(c). Copper is electroplated in the first electroplating tanks to form a structure resembling... Figure 2 (a) and Figure 2The first thermally conductive metal block 310 shown in (b)

[0090] The second method for making the first heat-conducting metal block is as follows:

[0091] On the second direction of the edge of the second photoresist layer 300, a plurality of first electroplating tanks spaced at a certain distance are sequentially formed, as shown in Figure 5(c). Copper is electroplated in the first electroplating tanks to form a structure as shown in Figure 5(c). Figure 2 (c) and Figure 2 The first thermally conductive metal block 310 shown in (d)

[0092] The third method for making the first heat-conducting metal block is as follows:

[0093] In the first and second directions at the edge of the second photoresist layer 300, a plurality of first electroplating tanks spaced at a certain distance are sequentially formed, as shown in Figure 5(c). Copper is electroplated in the first electroplating tanks to form a structure as shown in Figure 5(c). Figure 2 (e) and Figure 2 The first thermally conductive metal block 310 shown in (f) is shown.

[0094] Step S500: Several second heat-conducting metal blocks are made in the area corresponding to the spacer groove. The upper surface of the second heat-conducting metal block and the lower surface of the first heat-conducting metal block are on the same horizontal plane and in contact.

[0095] Referring to Figure 5(d), a photoresist layer is formed on the surface of the conductive lines on the upper surface of the ceramic substrate 100 to cover the conductive lines; a third photoresist layer 320 is formed on the surface of the first thermally conductive metal block 310, and exposed and developed to form a window pattern at a preset position of the third photoresist layer to form the second thermally conductive metal block; when the minimum size of the window in the window pattern is ≤10μm, the photoresist layer is preferably photoresist, otherwise a dry film is preferred.

[0096] In this embodiment, the first method for manufacturing the second heat-conducting metal block is as follows:

[0097] This method corresponds to the first method for fabricating the first thermally conductive metal block described above. In the second direction along the edge of the third photoresist layer 320, a plurality of second electroplating tanks spaced at a certain distance are sequentially fabricated, as shown in Figure 5(e). Copper is electroplated in the second electroplating tanks to form a structure as described above. Figure 2 (a) and Figure 2 The second thermally conductive metal block 330 is shown in (b).

[0098] The second method for manufacturing the second heat-conducting metal block is as follows:

[0099] This method corresponds to the second method for fabricating the first thermally conductive metal block described above. In the second direction along the edge of the third photoresist layer 320, a plurality of second electroplating tanks spaced at a certain distance are sequentially fabricated, such that the second electroplating tanks are located above the spacer grooves between the first thermally conductive metal blocks, and the width of the second electroplating tanks is greater than the width of the spacer grooves between the first thermally conductive metal blocks, as shown in Figure 5(e). Copper is electroplated in the second electroplating tanks to form a structure as shown in Figure 5(e). Figure 2 (c) and Figure 2 (d) shows the second thermally conductive metal block 330; the width of the second thermally conductive metal block is greater than the width of the first thermally conductive metal block so that the second thermally conductive metal block and the first thermally conductive metal block have good contact and connection.

[0100] The third method for making the second heat-conducting metal block is as follows:

[0101] This method corresponds to the third method for fabricating the first thermally conductive metal block described above. In this method, several second electroplating tanks are sequentially fabricated at intervals along the first and second directions at the edge of the third photoresist layer 320. These second electroplating tanks are located above the area where the spacer grooves between the first thermally conductive metal blocks intersect, and the length and width of the second electroplating tanks are greater than the length and width of the area where the spacer grooves between the first thermally conductive metal blocks intersect, as shown in Figure 5(e). Copper is electroplated in the second electroplating tanks to form a structure as described above. Figure 2 (e) and Figure 2 (f) shows the second thermally conductive metal block 330; the length and width of the second thermally conductive metal block are greater than the length and width of the first thermally conductive metal block, so that the second thermally conductive metal block and the first thermally conductive metal block have good contact and connection.

[0102] As another implementation method, heat-conducting metal blocks of any shape can be made, and gaps can be formed between the heat-conducting metal blocks to achieve a good heat dissipation effect.

[0103] In this embodiment, the gaps between the heat-conducting metal blocks produced by the above method are all connected to the external air, so that the heat-conducting metal blocks maintain a good heat dissipation effect.

[0104] Referring to Figure 5(f), after the second heat-conducting metal block is fabricated, the photoresist layer on the surface of the conductive circuit and the metal seed layer not covered by the conductive circuit are removed, and the third photoresist layer and the metal seed layer not covered by the first heat-conducting metal block are removed to obtain the heat sink structure.

[0105] As another implementation, several more layers of heat-conducting metal blocks can be fabricated on the surface of the second heat-conducting metal block to form a heat sink structure with N layers of heat-conducting metal blocks, where N is an integer greater than 2, in order to further improve the heat dissipation effect of the heat sink.

[0106] Referring to Figure 5(g), a heat dissipation box 400 is formed on the lower surface of the ceramic substrate 100, and a coolant inlet 410 and a coolant outlet 420 are formed at both ends of the heat dissipation box 400, so that the heat dissipation box 400 encloses the first thermally conductive metal block 310 and the second thermally conductive metal block 330; the coolant (air or coolant) enters from the coolant inlet 410, passes through the metal copper microchannel heat dissipation structure formed by the first thermally conductive metal block 310 and the second thermally conductive metal block 330, and flows out from the coolant outlet 420, thereby improving the heat dissipation effect of the heat dissipation plate.

[0107] The method for manufacturing the heat sink structure in this embodiment has the following characteristics:

[0108] (1) A first thermally conductive metal block and a second thermally conductive metal block are alternately fabricated on the lower surface of the ceramic substrate to increase the contact area with the heat dissipation medium, thereby effectively improving the heat dissipation performance of the ceramic substrate.

[0109] (2) A heat-conducting metal block is made on the lower surface of the ceramic substrate by electroplating to form a heat dissipation structure integrated with the ceramic substrate, thereby improving the integration of the heat dissipation plate.

[0110] (3) A heat dissipation box is made on the lower surface of the ceramic substrate, which is wrapped with a heat-conducting metal block. The heat dissipation effect is further improved by the flow of coolant in the heat dissipation box, which carries away the heat conducted by the heat-conducting metal block.

[0111] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A heat spreader structure, characterized by, include: A ceramic substrate, wherein conductive lines are provided on the upper surface of the ceramic substrate; The lower surface of the ceramic substrate is provided with a plurality of first thermally conductive metal blocks spaced apart, and a spacer groove is provided between each of the first thermally conductive metal blocks. The area corresponding to the spacer slot is provided with a plurality of second heat-conducting metal blocks, the upper surface of the second heat-conducting metal blocks and the lower surface of the first heat-conducting metal blocks being at the same horizontal plane and in contact with each other. The fabrication process of several first heat-conducting metal blocks includes: A first photoresist layer is formed on the surface of the metal seed layer on the lower surface of the ceramic substrate, and the first photoresist layer is exposed and developed. In the first direction and / or the second direction of the edge of the first photoresist layer, a plurality of first electroplating tanks spaced apart by a first preset distance are sequentially formed, and metal is electroplated in the first electroplating tanks to form the first thermally conductive metal block.

2. The heat spreader structure of claim 1, wherein, The first heat-conducting metal block has a rectangular structure, and the spacing groove is provided between each of the first heat-conducting metal blocks in a first direction or a second direction.

3. The heat spreader structure of claim 1, wherein, The first heat-conducting metal block has a square structure, and the spacing grooves are provided between each of the first heat-conducting metal blocks in the first direction and the second direction.

4. The heat spreader structure of claim 1, wherein, The two ends of the spacer groove are respectively connected to the edge of the ceramic substrate.

5. The heat sink structure according to claim 1, characterized in that, The heat sink structure also includes: A heat dissipation box is disposed on the lower surface of the ceramic substrate, and the heat dissipation box encloses the first thermally conductive metal block and the second thermally conductive metal block; The heat sink has a coolant inlet at one end and a coolant outlet at the other end.

6. A method for manufacturing a heat sink structure, characterized in that, include: Provide a ceramic substrate; A first metal seed layer is formed on the upper surface of the ceramic substrate, and a second metal seed layer is formed on the lower surface of the ceramic substrate. Conductive circuitry is fabricated on the outer surface of the first metal seed layer; A plurality of first heat-conducting metal blocks are fabricated on the outer surface of the second metal seed layer, and the first heat-conducting metal blocks are spaced apart to form a gap groove. Several second thermally conductive metal blocks are fabricated in the area corresponding to the spacer slot. The upper surface of the second thermally conductive metal block is at the same horizontal plane as the lower surface of the first thermally conductive metal block and is in contact with it. The process of fabricating a plurality of first thermally conductive metal blocks on the outer surface of the second metal seed layer includes: fabricating a first photoresist layer on the surface of the metal seed layer on the lower surface of the ceramic substrate, and exposing and developing the first photoresist layer. In the first direction and / or the second direction of the edge of the first photoresist layer, a plurality of first electroplating tanks spaced apart by a first preset distance are sequentially formed, and metal is electroplated in the first electroplating tanks to form the first thermally conductive metal block.

7. The method for manufacturing the heat sink structure according to claim 6, characterized in that, Several second heat-conducting metal blocks are fabricated in the region corresponding to the spacer slot, including: A second photoresist layer is fabricated on the plane where the lower surface of each of the first thermally conductive metal blocks is located, and the second photoresist layer is exposed and developed. A plurality of second electroplating tanks are made on the lower surface of the second photoresist layer in areas corresponding to the intervals or intersections of the first electroplating tanks, and metal is electroplated in the second electroplating tanks to form the second thermally conductive metal block.

8. The method for manufacturing the heat sink structure according to claim 6, characterized in that, After fabricating a plurality of second heat-conducting metal blocks in the region corresponding to the spacer slot, the process includes: A heat dissipation box is formed on the lower surface of the ceramic substrate, and a coolant inlet and a coolant outlet are formed at both ends of the heat dissipation box, so that the heat dissipation box encloses the first thermally conductive metal block and the second thermally conductive metal block.

9. An integrated circuit module, characterized in that, It includes the heat sink structure and integrated chip as described in any one of claims 1-5, wherein the integrated chip is mounted on the upper surface of the ceramic substrate.

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