Heating unit and substrate processing apparatus including the same
By forming holes inside the bushing and combining them with a suction component to remove particles, the problem of particles caused by friction between the lifting pin and the bushing was solved, thus improving the process quality of the substrate processing device.
CN116266549BActive Publication Date: 2026-07-24SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SYSTEM ENGINEERING MEGA SOLUTION CO LTD
- Filing Date
- 2022-12-15
- Publication Date
- 2026-07-24
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Figure CN116266549B_ABST
Abstract
The present application provides a heating unit capable of removing particles using holes formed in a bushing and a substrate processing apparatus including the same. The substrate processing apparatus includes a heating unit including a heating plate and heating a substrate, a cooling unit cooling the substrate, and a transfer unit moving the substrate to the heating unit or the cooling unit, wherein the heating plate includes a first plate providing a seating surface to the substrate, and a second plate disposed at a lower portion of the first plate and having a heater and a bushing provided inside thereof, and the bushing provides a movement space to a lift pin for lifting the substrate up and down through an inner space of the bushing and includes a plurality of holes formed through from the inner space to an outer side direction.
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