Material transfer positioning device and laser processing system

Abstract

The present application relates to a kind of material transfer positioning device and laser processing system. Wherein, material transfer positioning device includes: transfer pressure holding piece, with suction pressure holding surface, and from suction pressure holding surface along first predetermined direction and extend through the through hole of transfer pressure holding piece;Suction mechanism includes first suction mechanism or second suction mechanism;First suction mechanism is around the through hole along the through hole and is arranged on transfer pressure holding piece, and is used to suction material on suction pressure holding surface and make material set at the through hole, wherein, the through hole is configured to be used for laser to pass through to carry out welding to material;Or, second suction mechanism is configured to have first working state and second working state, second suction mechanism is configured to be connected when being in first working state by the end of airflow via through hole and suction pressure holding surface with suction material on suction pressure holding surface, second suction mechanism is configured to the through hole when being in second working state can be used for laser to pass through to carry out welding to material.

Description

Technical Field

[0001] This invention relates to the technical field of moving and handling materials in manufacturing, and particularly to a material transfer positioning device and a laser processing system. Background Technology

[0002] In many manufacturing industries, materials need to be handled and moved, such as moving materials to be processed to a processing station and moving processed materials to the next processing station. Furthermore, after the materials to be processed are placed at the processing station, they need to be secured using fixtures, clamping jigs, etc.

[0003] Taking the production of new energy batteries as an example, it is necessary to move nickel sheets and other materials to a processing station for corresponding processing, which is called...

[0004] This is called feeding; after feeding, the nickel sheets are processed at the processing station, such as by laser welding. During laser welding, the nickel sheets need to be fixed.

[0005] Chinese utility model patent number ZL 202122123102.0 discloses a magnet for laser welding lithium batteries.

[0006] Suction-type nickel sheet clamps, such as Figure 1 As shown, the fixture includes a base plate 1, with connecting components 2 fixedly connected to the four corners of the top of the base plate 1. A cover plate 3 is fixedly connected to the top of each of the four connecting components 2. A slot 4 is provided on each opposite side of the cover plate 3, and the bottom of the slot 4 is open...

[0007] The device has several welding holes 5, and each welding hole 5 is surrounded by a first magnet 6. A limiting component is inserted into each welding hole 5. In the technical solution of this patent, during material loading and welding, the battery is first placed between the base plate 1 and the cover plate 3, and a nickel sheet is placed on the base plate 1 or the cover plate 3. The nickel sheet is attracted and fixed by the first magnet 6. Then, according to the welding holes 5 opened on the base plate 1 and the cover plate 3, the laser welding head directly welds the nickel sheet to the lithium battery through the welding holes 5.

[0008] In the above technical solution, although the first magnet 6 is used to attract and fix the nickel sheet during welding, before that, a

[0009] Generally, nickel sheets need to be placed in the corresponding positions on the bottom plate 1 or the cover plate 3 by manual feeding. This manual feeding method is inefficient and has high labor costs. Moreover, the positional accuracy of the nickel sheets after manual feeding is not high, which can easily lead to deviations in the welding position when laser welding is performed. Summary of the Invention

[0010] 5. This invention provides a material transfer and positioning device and a laser processing system to solve the technical problems existing in the prior art.

[0011] One of the technical issues.

[0012] The material transfer and positioning device provided by the present invention includes:

[0013] The transfer holding member is provided with an adsorption holding surface and a through hole extending from the adsorption holding surface along a first preset direction and penetrating the transfer holding member;

[0014] The suction mechanism includes a first suction mechanism or a second suction mechanism;

[0015] The first suction mechanism surrounds the through hole circumferentially and is disposed on the transfer holding member, and is used to adsorb material onto the adsorption holding surface and to place the material at the through hole, wherein the through hole is configured to allow a laser to pass through for welding the material; or,

[0016] The second suction mechanism is configured to have a first working state and a second working state. When the second suction mechanism is in the first working state, it is configured to allow airflow to adsorb material onto the adsorption and holding surface through one end of the through hole. When the second suction mechanism is in the second working state, it is configured to allow laser to pass through the through hole for welding the material.

[0017] The transfer holding member is configured to be movable and is used to hold the transferred material via the adsorption holding surface.

[0018] Wherein, the first suction mechanism is at least one magnet that surrounds the through hole circumferentially, and the magnet is an electromagnet; or

[0019] The first suction mechanism consists of multiple vacuum channels that surround the through hole circumferentially.

[0020] Wherein, the first suction mechanism includes a magnet, and the magnet is a ring magnet; or

[0021] The first suction mechanism includes a plurality of magnets, and the plurality of magnets are arranged sequentially along the circumferential direction of the through hole.

[0022] The second suction mechanism includes a first negative pressure suction mechanism; the first negative pressure suction mechanism includes a first suction head and a first negative pressure channel, the first suction head is connected to one end of the first negative pressure channel, and the other end of the first negative pressure channel is used to connect to a negative pressure source;

[0023] The first suction head is configured such that: when the second suction mechanism is in a first working state, its position is located at the through hole and it generates suction on the adsorption and holding surface side of the through hole; and when the second suction mechanism is in a second working state, its position relative to the through hole is offset from the direction of the through hole.

[0024] The second suction mechanism includes a first driving mechanism, and the first suction head is connected to the first driving mechanism and moves under the drive of the first driving mechanism.

[0025] The first driving mechanism includes a second negative pressure suction mechanism, which includes a second suction head and a second negative pressure channel. The second suction head is connected to one end of the second negative pressure channel, and the other end of the second negative pressure channel is used to connect to a negative pressure source. The second suction head is used to connect to the first suction head and drives the first suction head to move to or away from the through hole by adsorbing the first suction head. Alternatively, the first driving mechanism includes a cylinder or a motor.

[0026] The second suction mechanism includes a tongue, and the first suction head is fixed on the tongue.

[0027] The tongue is connected to the first driving mechanism and moves towards the through hole and away from the through hole under the drive of the first driving mechanism.

[0028] The second suction mechanism includes a first channel; the first channel includes a main channel and a branch channel; the main channel has a first port and a second port, the first port being connected to the through hole, the through hole, the first port, and the second port being arranged sequentially along a first preset direction, and the second port having a light-transmitting hole; one end of the branch channel is connected to the main channel between the first port and the second port, and the other end of the branch channel is used to connect to a negative pressure source; the second suction mechanism also includes a sealing element, the sealing element being movably disposed within the main channel and located between the second port of the main channel and the connection point between the main channel and the branch channel; when the second suction mechanism is in a first working state, the sealing element is configured to seal the main channel, and when the second suction mechanism is in a second working state, the sealing element is configured to open the main channel; or

[0029] The second suction mechanism includes a second channel; the second channel has a first port and a second port, the first port being connected to the through hole, and the second port being used to connect to a negative pressure source; the second port is located outside the first preset direction relative to the through hole; the second channel has an opening in the wall located in the first preset direction, and a cover plate is provided at the opening; when the second suction mechanism is in a first working state, the cover plate is configured to close the opening, and when the second suction mechanism is in a second working state, the cover plate is configured to open the opening.

[0030] The material transfer positioning further includes a transfer mechanism connected to the transfer holding member. The transfer mechanism is configured to move the transfer holding member when the material is adsorbed onto the adsorption holding surface, and to drive the transfer holding member to hold the material after moving the transfer holding member.

[0031] The transfer mechanism includes a first transfer mechanism and a second transfer mechanism;

[0032] The first transfer mechanism is configured to extend and retract along a first preset direction;

[0033] The second transfer mechanism is configured to reciprocate along a second preset direction, which is not parallel to the first preset direction;

[0034] The transfer holding member is connected to the first transfer mechanism and / or the second transfer mechanism, and moves along the first preset direction and the second preset direction respectively under the drive of the first transfer mechanism and the second transfer mechanism.

[0035] The material transfer and positioning device further includes a rotating body and a second driving mechanism, the second driving mechanism being connected to the rotating body and used to drive the rotating body to rotate;

[0036] The transfer holding member is disposed on the rotating body and rotates with the rotating body, and the rotation plane of the transfer holding member is configured to be perpendicular to the first preset direction.

[0037] The laser processing system provided by the present invention includes a laser processing device and the aforementioned material transfer and positioning device. The laser processing device is disposed at the material unloading station, and when the transfer holding member of the material gripping device is located at the unloading station, it corresponds to the through hole on the transfer holding member.

[0038] The material transfer and positioning device and laser processing system provided by the present invention have the following advantages compared with the prior art:

[0039] The material transfer and positioning device provided by this invention adsorbs and fixes materials such as nickel sheets onto the adsorption and holding surface of a transfer clamping member according to a first or second suction mechanism. After the material is adsorbed and fixed, the transfer clamping member can move itself to change the position of the material, moving it from the initial position (picking station) to the target position (discharging station). After the material is moved to the discharging station and placed, the adsorption and holding surface on the transfer clamping member can apply pressure to the material, pressing it firmly at the discharging station. At this time, a laser can be used to perform welding or other processing on the pressed material through the through hole.

[0040] The laser processing system provided by the present invention includes the material transfer and positioning device described above, and naturally has the same beneficial effects as the material transfer and positioning device described above, which will not be repeated here. Attached Figure Description

[0041] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the structure of an existing magnetic clamp.

[0044] Figure 2 This is a schematic diagram of a material transfer and positioning device according to one embodiment of the present invention;

[0045] Figure 3 This is a schematic diagram of a material transfer and positioning device according to another embodiment of the present invention;

[0046] Figure 4 This is a schematic diagram of the material transfer and positioning device in another embodiment of the present invention in a state where no material has been adsorbed.

[0047] Figure 5 for Figure 4 The diagram shows the structure of the material transfer and positioning device in the state of adsorbing material.

[0048] Figure 6 This is a schematic diagram of the material transfer and positioning device in another embodiment of the present invention;

[0049] Figure 7 This is a schematic diagram of the material transfer and positioning device in another embodiment of the present invention.

[0050] In the picture:

[0051] 11-Transfer holding component; 111-Adsorption holding surface; 112-Through hole;

[0052] 12-Suction mechanism; 121-First suction mechanism; 122-Second suction mechanism;

[0053] 1221-First negative pressure suction mechanism; 12211-First suction head; 12212-Negative pressure source;

[0054] 1222-First drive mechanism; 12221-Second suction head; 12222-Negative pressure source;

[0055] 1223 - First channel; 12231 - Main channel; 12231a - First port; 12231b - Second port; 12232 - Branch channel; 12233 - Seal;

[0056] 1224 - Negative pressure source;

[0057] 1225 - Second channel; 1225a - First port; 1225b - Second port; 1225c - Opening;

[0058] 1226-tongue slice;

[0059] 13-Rotating body; 14-Second drive mechanism. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0061] The embodiments of the material transfer and positioning device and laser processing system provided by the present invention will be described below with reference to the accompanying drawings.

[0062] In one embodiment of the material transfer and positioning device of the present invention, the material transfer and positioning device includes a transfer holding member 11 and a suction mechanism 12. The transfer holding member 11 is provided with an adsorption holding surface 111 and a through hole 112 extending from the adsorption holding surface 111 along a first preset direction and penetrating the transfer holding member 11. The suction mechanism 12 includes a first suction mechanism 121 or a second suction mechanism 122. The first suction mechanism 121 is circumferentially surrounding the through hole 112 and disposed on the transfer holding member 11, and is used to adsorb material onto the adsorption holding surface 111 and to place the material at the through hole 112; wherein, the through hole 112 is configured to allow a laser to pass through for welding the material. The second suction mechanism 122 is configured to have a first working state and a second working state. When the second suction mechanism 122 is in the first working state, it is configured to allow the airflow to adsorb the material onto the adsorption and holding surface 111 through the through hole 112. When the second suction mechanism 122 is in the second working state, it is configured such that the through hole 112 allows the laser to pass through for welding the material. The transfer holding member 11 is configured to be movable and to hold the transferred material via the adsorption and holding surface 111.

[0063] In this embodiment, the material transfer and positioning device mainly serves the following two purposes: First, according to the first suction mechanism 121 or the second suction mechanism 122, the transfer holding member 11 adsorbs and fixes the material on the adsorption holding surface 111.

[0064] Especially for smaller materials, such as nickel sheets used in lithium battery production (the nickel sheets used in lithium battery production are typically small in size); after the material is adsorbed and fixed, the transfer holding member 11 can move along its own path.

[0065] The material is moved from its initial position (picking station) to its target position (discharging station). Secondly, after the material is moved to the discharging station and placed, the adsorption and holding surface 111 on the transfer holding member 11 can apply pressure to the material, fixing it at the discharging station to facilitate processing at that station. Furthermore, regarding the material transfer in this invention...

[0066] The transfer and positioning device has a through hole 112 for laser welding and other processes on materials and an area for adsorbing and fixing materials to generate zero suction force in a circumferential relationship. Its structure is compact and it is particularly suitable for the transfer and positioning of small materials.

[0067] In this embodiment, the transfer holding member 11 and the suction mechanism 12 are disposed on the main body of the device. Specifically, the transfer holding member 11 can be a plate-like structure, such as... Figure 2 As shown, and in combination Figure 4 and Figure 5The illustrated partial structure has a lower surface of the plate-like structure that serves as an adsorption and holding surface 111, and the plate-like structure has a hole penetrating both the upper and lower surfaces; this hole is a through-hole 112. Of course...

[0068] Besides the plate-like structure, the transfer holding member 11 can also take other shapes, such as wedges; in these other structures, the adsorption holding surface 111 and the through hole 112 can exhibit different characteristics than in the plate-like structure. Figure 4 and Figure 5 The plate-like structure shown has characteristics, but generally...

[0069] Hole 112 needs to be set as a straight hole extending along the first preset direction.

[0070] like Figure 2 As shown, the first suction mechanism 121 is arranged circumferentially along the through hole 112. Naturally, the first suction mechanism 121 generates suction force on the material in this area. When the first suction mechanism 121 suctions material, the material is subjected to suction in the circumferential area of ​​the through hole 112.

[0071] The material is attracted and fixed to the adsorption and holding surface 111 by force (there is no suction force at the through hole 112 itself). It can be understood that when the material is attracted and fixed to the adsorption and holding surface 111, a portion of the material (usually the central region) is located at the position corresponding to the through hole 112; that is, a portion of the material is exposed through the through hole 112 on the other side of the through hole 112 (in...). Figure 4 and Figure 5 (The upper side of the through hole 112 is in the middle). In this case, a laser can be used to perform processes such as welding on the material through the through hole 112.

[0072] The second suction mechanism 122 has two working states, namely a first working state and a second working state, and can be used in this state.

[0073] The system switches between two operating states. In the first operating state, the second suction mechanism 122 generates an airflow in the through-hole 112, creating a negative pressure and suction at the through-hole 112. The transfer holding member 11 moves to the through-hole 112 to contact the material.

[0074] When in a nearby position, the material is adsorbed and fixed on the adsorption and holding surface 111 by the suction force at the through hole 112. In the second working state, the second suction mechanism 122 is offset away from the through hole 112, and the through hole 112 is in an open state (in the first working state, the through hole 112 is more or less blocked by the second suction mechanism 122). At this time, laser can be used to perform processes such as welding on the material through the through hole 112.

[0075] The above describes and explains the solution of this embodiment. In this embodiment, the material transfer and positioning device is mainly used to achieve the following two functions: first, to adsorb and fix the material (especially for small materials, such as nickel sheets used in lithium battery production), and move its position from the material picking station to the material discharging station; second, to fix the material at the material discharging station. The general process of achieving the above functions according to the technical solution of this embodiment is as follows:

[0076] First, at the material handling station, the transfer holding member 11 adsorbs and fixes the material onto the adsorption holding surface 111 according to either the first suction mechanism 121 or the second suction mechanism 122. As described above, when the suction mechanism 12 includes the first suction mechanism 121, the area around the through hole 112 has suction force, achieving adsorption and fixation of the material; when the suction mechanism 12 includes the second suction mechanism 122, the second suction mechanism 122 is switched to the first working state, generating negative pressure suction at the through hole 112, achieving adsorption and fixation of the material.

[0077] Secondly, after the material is adsorbed and fixed, the transfer holding member 11 can move itself to change the position of the material, moving it from the initial position (material picking station) to the target position (material discharging station). During this process, the first suction mechanism 121 or the second suction mechanism 122 maintains the adsorption and fixation of the material.

[0078] Finally, after the material is moved to the unloading station and placed, the transfer holding member 11 applies pressure to the material through its adsorption holding surface 111 in contact with the material, pressing the material firmly in the unloading station to facilitate the processing at the unloading station, such as welding the material using a laser through the through hole 112.

[0079] At the material feeding station, when it is necessary to release the adsorption and fixation of the material, the first suction mechanism 121 can mainly achieve this by stopping its own work and no longer generating suction in the area around the through hole 12; the second suction mechanism 122 achieves this by switching its own working state from the first working state to the second working state.

[0080] According to the above, the material transfer and positioning device in this embodiment adsorbs and fixes materials such as nickel sheets onto the adsorption and holding surface 111 of the transfer clamping member 11 based on the first suction mechanism 121 or the second suction mechanism 122. After the material is adsorbed and fixed, the transfer clamping member 11 can move itself to change the position of the material, moving it from the initial position (material picking station) to the target position (material discharging station). After the material is moved to the discharging station and placed, the adsorption and holding surface 111 on the transfer clamping member 11 can apply pressure to the material, pressing it firmly at the discharging station. At this time, a laser can be used to perform welding or other processing on the pressed material through the through hole 112.

[0081] In a further embodiment of the material transfer and positioning device, the first suction mechanism 121 is at least one magnet circumferentially surrounding the through hole 112, such as... Figure 2 As shown.

[0082] The first suction mechanism 121 can generate an attractive force on ferromagnetic materials, such as nickel sheets, and use this attractive force to fix the materials. Based on this, a magnet surrounds the through hole 112 along a first preset direction. Therefore, the area where the magnet generates an attractive force on materials such as nickel sheets is an annular region. The attractive force generated in the annular region outside the through hole 112 better fixes the materials. Alternatively, an electromagnet can be selected as the first suction mechanism 121. The electromagnet can be easily energized and de-energized to generate and stop the magnetic attraction force. Thus, the material can be released from its attraction and fixation after, for example, placing it at the feeding station or after laser welding.

[0083] In this embodiment, the first suction mechanism 121 may contain one magnet. In this case, the magnet is a ring magnet, and the ring hole of the ring magnet surrounds the through hole 112 to generate magnetic attraction in the ring area outside the through hole 112.

[0084] Of course, such as Figure 3 As shown, the first suction mechanism 121 can also contain multiple magnets, in which case the multiple magnets are arranged sequentially along the circumference of the through hole 112. With this arrangement, the area that has the attraction force on materials such as nickel sheets is a plurality of block-shaped areas arranged sequentially on the outside of the through hole 112. By adsorbing and fixing the material through these multiple areas, a better fixing effect on the material can also be achieved.

[0085] In an alternative embodiment of the above embodiments, the first suction mechanism 121 is a plurality of vacuum channels circumferentially surrounding the through hole 112, such as... Figure 3 As shown, the multiple vacuum channels can be represented as a perforated structure passing through the transfer pressure holding member 11. One end of this perforated structure is located on the adsorption pressure holding surface 111, and the other end is connected to a negative pressure adsorption mechanism (such as a vacuum pump). With this configuration, airflow can be generated within the multiple vacuum channels through the negative pressure adsorption mechanism, thereby creating a negative pressure on the adsorption pressure holding surface 111, adsorbing and fixing the material onto the adsorption pressure holding surface 111. Furthermore, the multiple vacuum channels generate suction in the circumferential direction of the through holes 112, which can effectively fix the material.

[0086] It is understood that in this embodiment, the material is fixed by vacuum adsorption, and the transferred material is not limited to ferromagnetic materials. Generally speaking, it can be any material.

[0087] In one embodiment of the material transfer and positioning device, the second suction mechanism 122 includes a first negative pressure suction mechanism 1221; the first negative pressure suction mechanism 1221 includes a first suction head 12211 and a first negative pressure channel, the first suction head 12211 is connected to one end of the first negative pressure channel, and the other end of the first negative pressure channel is used to connect to a negative pressure source 12212 (in...). Figure 4 and Figure 5 The location indicated is actually the connection end with the negative pressure source 12212 (for illustration purposes only). The first suction head 12211 is configured such that: when the second suction mechanism 122 is in the first working state, its position is located at the through hole 112 and generates suction on the adsorption and holding surface side of the through hole 112; and when the second suction mechanism 122 is in the second working state, its position is offset from the direction of the through hole 112.

[0088] In this embodiment, the negative pressure source 12212 can specifically be a vacuum pump, etc. In the first working state, the first suction head 12211 is located at the through hole 112, and the negative pressure source 12212 can generate airflow within the first negative pressure channel, the first suction head 12211, and the through hole 112 to form negative pressure, adsorbing and fixing materials such as nickel sheets onto the adsorption and holding surface 111. In the first working state, the first suction head 12211 is moved away from the through hole 112, and the through hole 112 is disconnected from the first suction head 12211. It can be understood that the negative pressure source 12212 can no longer generate airflow and form negative pressure at the through hole 112. At the same time, the through hole 112 is no longer blocked by the first suction head 12211, etc. At this time, it switches to the second working state. In this second working state, on the one hand, the material is de-adsorbed (as described above, at this time the material is pressed and fixed by the adsorption holding surface 111 at the discharge station), and on the other hand, a laser can be shot into the through hole 112 to weld the pressed material.

[0089] In a further embodiment, the second suction mechanism 122 includes a first driving mechanism 1222, and a first suction head 12211 is connected to the first driving mechanism 1222 and moves under the drive of the first driving mechanism 1222. The first driving mechanism 1222 includes a second negative pressure suction mechanism, which includes a second suction head 12221 and a second negative pressure channel. The second suction head 12221 is connected to one end of the second negative pressure channel, and the other end of the second negative pressure channel is connected to a negative pressure source 12222. The second suction head 12221 is used to connect with the first suction head 12211 and, by adsorbing the first suction head 12211, drives the first suction head 12211 to move to or away from the through hole 112.

[0090] In this embodiment, a second negative pressure suction mechanism is used as the first driving mechanism 1222. When the first suction head 12211 is driven to move, the second suction head 12221 is directed toward the first suction head 12211. The negative pressure source 12222 generates airflow and forms negative pressure between the second negative pressure channel and the second suction head 12221. Under the negative pressure adsorption, the first suction head 12211 will move between the position of the first working state and the position of the second working state.

[0091] It should be noted that, for example, if the second suction head 12221 has already moved the position of the first suction head 12211 from the position of the first working state to the position of the second working state, and if the first suction head 12211 needs to move from the position of the second working state to the position of the first working state, then the second suction head 12221 can spray air onto the first suction head 12211 to push the first suction head 12211 to move; or, a reset mechanism can be provided on the first suction head 12211, so that when the second suction head 12221 no longer adheres to the first suction head 12211, the reset mechanism can apply a force to the first suction head 12211 to move the first suction head 12211 to the position of the first working state.

[0092] In this embodiment, negative pressure source 12222 and negative pressure source 12212 can be the same negative pressure source, that is, the first driving mechanism 1222 and the first negative pressure adsorption mechanism 1221 share the same negative pressure source, which can reduce costs.

[0093] In this further embodiment, the first driving mechanism 1222 may include a second negative pressure suction mechanism, and may also include a cylinder or a motor, which is connected to the first suction head 12211 and drives the first suction head 12211 to move to or away from the through hole 112.

[0094] In this embodiment, an additional cylinder or motor is required to drive the movement of the first suction head 12211. Compared to the embodiment described above, which uses a second negative pressure suction mechanism as the first driving mechanism 1222, especially considering the shared negative pressure source in the above embodiments, this embodiment increases costs. Therefore, in the actual implementation of the present invention, the embodiment described above, which uses a second negative pressure suction mechanism as the first driving mechanism 1222, is preferred.

[0095] Specifically, in the above embodiment where the second negative pressure suction mechanism is used as the first driving mechanism 1222, or in the embodiment where a motor or cylinder is used as the first driving mechanism 1222, the second suction mechanism 122 may further include a tongue 1226, and the first suction head 12211 is fixed on the tongue 1226; the tongue 1226 is connected to the first driving mechanism 1222 and moves towards the through hole 112 and away from the through hole 112 under the drive of the first driving mechanism 1222.

[0096] In this embodiment, with the tongue 1226 provided, the first drive mechanism 1222, whether it is a first negative pressure suction mechanism, a motor, or a cylinder, can move the first suction head 12211 by connecting to and driving the tongue 1226. Furthermore, based on the shape of the tongue 1226, the connection between the first drive mechanism 1222 and the tongue 1226 can be more reliable and stable.

[0097] Unlike the above embodiments, in one embodiment of the material transfer and positioning device, the suction mechanism 12 may not include the first suction mechanism 121, and the adsorption and fixation of materials may not be achieved through the first suction mechanism 121. Instead, it may include a second suction mechanism 122, through which the adsorption and fixation of materials are achieved.

[0098] Specifically, such as Figure 6 As shown, the second suction mechanism 122 includes a first channel 1223. The first channel 1223 includes a main channel 12231 and a branch channel 12232; the main channel 12231 has a first port 12231a and a second port 12231b. The first port 12231a is connected to a through hole 112. The through hole 112, the first port 12231a, and the second port 12231b are arranged sequentially along a first preset direction. The second port 12231b has a light-transmitting hole. One end of the branch channel 12232 is connected to the main channel 12231 between the first port 12231a and the second port 12231b, and the other end of the branch channel is used to connect to the negative pressure source 1224.

[0099] The second suction mechanism 122 further includes a seal 12233, which is movably disposed within the main channel 12231 and located between the second port 12231b of the main channel 12231 and the connection point between the main channel 12231 and the branch channel 12232. When the second suction mechanism 122 is in its first operating state, the seal 12233 is configured to seal the main channel 12231; when the second suction mechanism 122 is in its second operating state, the seal 12233 is configured to open the main channel 12231.

[0100] In the aforementioned second suction mechanism 122, the working state of the second suction mechanism 122 is controlled by the sealing element 12233. When the sealing element 12233 seals the main channel 12231, the second suction mechanism 122 is in a first working state. In this first working state, the closure of the main channel 12231 establishes a sealed channel structure between the through hole 112 connected to the first port 12231a of the main channel 12231 and the branch channel 12232. Under this structure, the negative pressure source 1224 connected to the branch channel 12232 can generate airflow and form negative pressure in the sealed channel structure. Under the action of this negative pressure, when the material is close to the side of the through hole 112 located on the adsorption holding surface 111, the material can be adsorbed and fixed on the adsorption holding surface 111. When the sealing element 12233 opens the main channel 12231, the second suction mechanism 122 is in a second working state. In this second operating state, the opening of the main channel 12231 forms a channel structure between the first port 12231a and the second port 12231b of the main channel 12231. Laser can be transmitted through this channel structure for processes such as laser welding of materials.

[0101] In this embodiment, when picking up material at the material picking station, the second suction mechanism 122 is controlled in the first working state by controlling the sealing element 12233, and the first working state is maintained before moving to the material discharging station; when reaching the material discharging station, the second suction mechanism 122 is controlled in the second working state by controlling the sealing element 12233 (at the same time, the negative pressure source 1224 connected to the branch channel 12232 can stop working). At this time, the material is de-adsorbed (or the adsorption can be left unremoved until after laser welding by stopping the work of the negative pressure source 1223, or the adsorption holding surface 111 can be directly dragged and separated from the material by the drive mechanism after laser welding. However, generally, during the laser welding process, since there is pressure between the adsorption holding surface 111 and the material, the fixation of the material during the laser welding process can be fully guaranteed, so there is no need to maintain the adsorption effect. This is similar in other embodiments, and is only described here). The transfer holding element 11 can press the material firmly at the material discharging station. Subsequently, a laser can be shone through the channel structure formed by connecting the main channel 12231 and the through hole 112 to perform laser welding and other processes on the material.

[0102] It should be noted that in this embodiment, the sealing element 12233 may not be provided. In this case, the first channel 1223 does not constitute a closed channel space. If sufficient negative pressure adsorption force is to be formed in the through hole 112, the power and work of the negative pressure source 1224 connected to the first channel 1223 need to be greater.

[0103] Alternatively, in another embodiment of the material transfer device, such as Figure 7 As shown, the second suction mechanism includes a second channel 1225. The second channel 1225 has a first port 1225a and a second port 1225b. The first port 1225a is connected to the through hole 112, and the second port 1225b is used to connect to the negative pressure source 1224. The position of the second port 1225b relative to the through hole 112 is outside a first preset direction. The wall of the second channel 1225 in the first preset direction has an opening 1225c, and a cover plate is provided at the opening 1225c. When the second suction mechanism 122 is in a first working state, the cover plate is configured to close the opening 1225c, and when the second suction mechanism 122 is in a second working state, the cover plate is configured to open the opening 1225c.

[0104] In this embodiment, the opening 1225c is opened and closed by a cover plate to control the working state of the second suction mechanism 122. When the opening 1225c is closed by the cover plate, and the second suction mechanism 122 is in the first working state, a through hole 112 is superimposed between the first port 1225a and the second port 1225b of the second channel 1225 to form a sealed channel structure. The negative pressure source 1224 connected to the second port 1225b of the second channel 1225 can generate airflow and form negative pressure in this channel structure, adsorbing and fixing the material onto the adsorption and holding surface 111 of the transfer holding member 11. When the opening 1225c is opened by the cover plate (at the same time, the negative pressure source 1224 can stop working), and the second suction mechanism 122 is in the second working state, a channel structure is formed between the first port 1225a and the opening 1225c of the second channel 1225. Lasers can be transmitted through this channel structure to perform processes such as welding and fixing of materials.

[0105] The timing for switching the working state of the second suction mechanism 122 via the cover plate and opening 1225c is similar to the timing for switching the working state of the second suction mechanism 122 via the sealing element 12233, and will not be repeated here.

[0106] It should be noted that in this embodiment, a cover plate may not be provided at the opening 1225c. In this case, the second channel 1225 does not constitute a closed channel space. If sufficient negative pressure adsorption force is to be formed in the through hole 112, the power and work of the negative pressure source 1224 connected to the second channel 1225 need to be greater.

[0107] In one embodiment of the material transfer positioning device, the material transfer positioning further includes a transfer mechanism connected to the transfer holding member 11. The transfer mechanism is configured to move the transfer holding member 11 when the material is adsorbed onto the adsorption holding surface 111, and to drive the transfer holding member 11 to hold the material after moving the transfer holding member 11.

[0108] In this embodiment, the position movement of the transfer holding member 11 is achieved by a transfer mechanism. For example, the transfer holding member 11 is moved to the material picking station and approaches the material at the material picking station, and the transfer holding member 11 is moved to the material discharging station and approaches the accurate placement position of the material at the material discharging station. The movement of the transfer holding member 11 is driven by the transfer mechanism.

[0109] Specifically, the transfer mechanism includes a first transfer mechanism and a second transfer mechanism. The first transfer mechanism is configured to extend and retract along a first preset direction; the second transfer mechanism is configured to reciprocate along a second preset direction, which is not parallel to the first preset direction. The transfer holding member 11 is connected to the first transfer mechanism and / or the second transfer mechanism, and moves along the first preset direction and the second preset direction respectively under the drive of the first transfer mechanism and the second transfer mechanism.

[0110] In this specific embodiment, typically, the first preset direction is vertical and the second preset direction is horizontal. That is, the material is placed horizontally at the material picking station and the material discharging station. The first transfer mechanism is used to extend and retract in the vertical direction, driving the transfer holding member 11 to rise and fall, while the second transfer mechanism moves in the horizontal direction, driving the transfer holding member 11 to move horizontally from above the material picking station to above the material discharging station, and from above the material discharging station to above the material picking station.

[0111] Of course, in theory and in practice, the first preset direction and the second preset direction are not limited to the vertical or horizontal direction. They can be any non-parallel direction. As long as the first preset direction and the second preset direction are not parallel, the transfer holding member 11, which can move along the first preset direction and the second preset direction, can move to any position in three-dimensional space. Naturally, it can also move to the material picking station to pick up materials, and move to the material unloading station to unload materials.

[0112] In one embodiment of the material transfer positioning device, the material transfer positioning device further includes a rotating body 13 and a second driving mechanism 14, which is connected to the rotating body 13 and is used to drive the rotating body 13 to rotate. A transfer holding member 11 is disposed on the rotating body 13 and rotates with the rotating body 13, and the rotation plane of the transfer holding member 11 is configured to be perpendicular to a first preset direction.

[0113] In this embodiment, the second drive mechanism 14 can be a motor. Various transmission methods, such as belts, chains, or gears, can be used between the motor's output and the rotating body 13 to drive the rotating body 13 to rotate. Furthermore, the rotating body 13 essentially rotates around a first preset direction. This rotation of the rotating body 13 allows for the correction of the circumferential position of the material adsorbed and fixed on the adsorption and holding surface 111. For example, at the material handling station, if the material is not accurately positioned at the handling station, or if a deviation occurs during material adsorption, resulting in an inaccurate circumferential position, the second drive mechanism 14 can drive the rotating body 13 to rotate, moving the adsorbed and fixed material to the correct position. This is achieved by acquiring and analyzing images (e.g., by analyzing the material or identifying markers set at the handling station to determine the circumferential state of the material) using an image acquisition device.

[0114] The correction of the material's position in the circumferential direction by the aforementioned rotating body 13 can be performed during the process of the transfer mechanism driving the transfer holding member 11 to move between the material picking station and the material discharging station.

[0115] In summary, the material transfer and positioning device provided in the above embodiments of the present invention adsorbs and fixes materials such as nickel sheets onto the adsorption and holding surface 111 of the transfer clamping member 11 according to the first suction mechanism 121 or the second suction mechanism 122. After the material is adsorbed and fixed, the transfer clamping member 11 can move itself to change the position of the material, moving it from the initial position (material picking station) to the target position (material discharging station). After the material is moved to the discharging station and placed, the adsorption and holding surface 111 on the transfer clamping member 11 can apply pressure to the material, pressing it firmly at the discharging station. At this time, a laser can be used to perform welding or other processing on the pressed material through the through hole 112. Furthermore, in the material transfer and positioning device of the present invention, the through hole 112 for laser welding and other processes on the material and the area for adsorbing and fixing the material to generate suction have a circumferential relationship, resulting in a compact structure that is particularly suitable for the transfer and positioning of small-sized materials.

[0116] In one embodiment of the laser processing system provided by the present invention, the laser processing system includes a laser processing device and a material transfer and positioning device described in the above embodiment. The laser processing device is disposed at the material unloading station and corresponds to the through hole on the transfer holding member 11 of the material gripping device when the material gripping device is located at the unloading station.

[0117] The laser processing system in this embodiment of the invention includes the material transfer and positioning device described above, and naturally has the same beneficial effects as the material transfer and positioning device described above, which will not be repeated here.

[0118] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0119] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A material transfer positioning device, comprising: The method comprises the following steps: a transfer holding member is provided with an adsorption holding surface, and a through hole extending from the adsorption holding surface along a first preset direction and penetrating through the transfer holding member; a suction mechanism is provided, and the suction mechanism comprises a second suction mechanism; the second suction mechanism is configured to have a first working state and a second working state, and when the second suction mechanism is in the first working state, the second suction mechanism is configured to connect the airflow to one end of the adsorption holding surface through the through hole to adsorb the material on the adsorption holding surface, and when the second suction mechanism is in the second working state, the through hole is configured to allow the laser to pass through to weld the material; wherein the transfer holding member is configured to move and is used to hold the material in the material discharge station after transfer through the adsorption holding surface; the second suction mechanism is used to adsorb and fix the material, so that the material is moved to the material discharge station with the transfer holding member; the material transfer positioning further comprises a transfer mechanism, the transfer mechanism is connected with the transfer holding member, and the transfer mechanism is configured to move the transfer holding member when the material is adsorbed on the adsorption holding surface, and drive the transfer holding member to hold the material after moving the transfer holding member.

2. The material transfer positioning device of claim 1, wherein, The suction mechanism further comprises a first suction mechanism, the first suction mechanism is circumferentially arranged around the through hole and arranged on the transfer holding member, and is used to adsorb the material on the adsorption holding surface and arrange the material at the through hole, wherein the through hole is configured to be used for the laser to pass through to weld the material; the first suction mechanism is used to adsorb and fix the material, so that the material is moved to the material discharge station with the transfer holding member; the first suction mechanism is at least one magnet circumferentially arranged around the through hole, and the magnet is an electromagnet; or the first suction mechanism is a plurality of vacuum channels circumferentially arranged around the through hole.

3. The material transfer positioning device of claim 2, wherein, The first suction mechanism comprises one magnet, and the magnet is a ring magnet; or the first suction mechanism comprises a plurality of magnets, and the plurality of magnets are sequentially arranged circumferentially along the through hole.

4. The material transfer positioning device of claim 1, wherein, The second suction mechanism comprises a first negative pressure suction mechanism; the first negative pressure suction mechanism comprises a first suction head and a first negative pressure channel, the first suction head is connected to one end of the first negative pressure channel, and the other end of the first negative pressure channel is used to be connected with a negative pressure source; the first suction head is configured to be located at the through hole and generate suction force on the side of the adsorption holding surface of the through hole when the second suction mechanism is in the first working state, and the position of the first suction head deviates from the direction of the through hole when the second suction mechanism is in the second working state.

5. The material transfer positioning device of claim 4, wherein, The second suction mechanism comprises a first driving mechanism, the first suction head is connected with the first driving mechanism and moves under the driving of the first driving mechanism; The first driving mechanism comprises a second negative pressure suction mechanism, the second negative pressure suction mechanism comprises a second suction head and a second negative pressure channel, the second suction head is connected with one end of the second negative pressure channel, and the other end of the second negative pressure channel is used for being connected with a negative pressure source; the second suction head is used for being connected with the first suction head, and the first suction head is driven to move to the through hole or away from the through hole by the second suction head; or the first driving mechanism comprises a pneumatic cylinder or a motor.

6. The material transfer positioning device of claim 5, wherein, The second suction mechanism comprises a tongue, and the first suction head is fixed on the tongue. The tongue is connected with the first driving mechanism and is driven by the first driving mechanism to move towards the through hole and to move away from the through hole.

7. The material transfer positioning device of claim 1, wherein, The second suction mechanism comprises a first channel; the first channel comprises a main channel and a branch channel; the main channel has a first port and a second port, the first port is connected with the through hole, the through hole, the first port and the second port are sequentially arranged along the first preset direction, and the second port has a light transmission hole; one end of the branch channel is connected with the main channel between the first port and the second port, and the other end of the branch channel is used for being connected with a negative pressure source; the second suction mechanism further comprises a sealing member, the sealing member is movably arranged in the main channel and located between the second port of the main channel and the connection between the main channel and the branch channel; When the second suction mechanism is in a first working state, the sealing member is configured to close the main channel, and when the second suction mechanism is in a second working state, the sealing member is configured to open the main channel; Or The second suction mechanism comprises a second channel; the second channel has a first port and a second port, the first port is connected with the through hole, and the second port is used for being connected with a negative pressure source; the position of the second port relative to the through hole is located outside the first preset direction; The wall body on the second channel in the first preset direction is provided with an opening, and the opening is provided with a cover plate; when the second suction mechanism is in a first working state, the cover plate is configured to close the opening, and when the second suction mechanism is in a second working state, the cover plate is configured to open the opening.

8. The material transfer positioning device of claim 1, wherein, The transfer mechanism comprises a first transfer mechanism and a second transfer mechanism; The first transfer mechanism is configured to move in extension and retraction along a first preset direction; The second transfer mechanism is configured to move reciprocatingly along a second preset direction, and the second preset direction is not parallel to the first preset direction; The transfer holding member is connected with the first transfer mechanism and / or the second transfer mechanism and is driven to move along the first preset direction and the second preset direction respectively by the first transfer mechanism and the second transfer mechanism.

9. The material transfer positioning device of claim 1, wherein, The material transfer positioning device further comprises a rotating body and a second driving mechanism, the second driving mechanism is connected with the rotating body and is used for driving the rotating body to rotate; The transfer pressure holder is arranged on the rotating body and rotates with the rotating body, and a rotation plane of the transfer pressure holder is configured to be perpendicular to the first preset direction.

10. A laser processing system characterized by comprising: The laser processing system comprises a laser processing device and the material transfer positioning device according to any one of claims 1-9, the laser processing device is arranged at a material unloading station, and corresponds to the through hole on the transfer pressure holder of the material grabbing device when the transfer pressure holder is located at the unloading station.

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