A vertical fiber-liquid metal heat conducting gasket and a method for manufacturing the same
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGDONG GUANGTI ADVANCED NEW MATERIALS CO LTD
- Filing Date
- 2023-03-08
- Publication Date
- 2026-07-10
AI Technical Summary
In existing thermal interface materials, the continuity of the thermal conduction channel is difficult to control, which leads to increased contact thermal resistance and material hardness due to high thermal conductivity fillers. It is difficult to achieve a balance between low thermal resistance and flexibility, especially in high-power electronic devices, where the thermal conductivity and thermal resistance of existing materials are difficult to optimize simultaneously.
A composite material of silk fiber, liquid metal, and silicone was used. By controlling the volume ratio of liquid metal to silicone to be (1-2):1, a vertical fiber-liquid metal thermal pad was prepared. The flexibility and continuous thermal conduction channel characteristics of silk fiber were utilized, combined with the low thermal resistance of liquid metal, to form a material with high thermal conductivity and low thermal resistance.
A high thermal conductivity and low thermal resistance material with a thermal conductivity greater than 7 W/mk and a thermal resistance less than 0.25 cm2k/w has been achieved. The material is soft and thin as 0.5 mm, making it suitable for the heat dissipation needs of high-power electronic devices.
Smart Images
Figure SMS_1