Color film substrate and preparation method thereof, display panel, and display device

Abstract

The present application provides a color filter substrate and a preparation method thereof, a display panel, and a display device. The color filter substrate includes a substrate, a pixel defining layer, and a color resist block. The pixel defining layer is arranged on the substrate. The pixel defining layer includes a first sub-defining layer and a second sub-defining layer stacked in a direction perpendicular to the plane where the substrate is located. The second sub-defining layer is located on the side of the first sub-defining layer away from the substrate. The first sub-defining layer includes a first spacer and a plurality of first openings formed by the first spacer. The second sub-defining layer includes a second spacer and a plurality of second openings formed by the second spacer. Each first opening corresponds to each second opening one by one and together constitutes a defining cavity. The color resist block is arranged in the defining cavity. According to the embodiments of the present application, the stability of the preparation process of the color filter substrate can be effectively improved, and the product yield can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a color film substrate and a preparation method thereof, a display panel, and a display device. Background Art

[0002] In recent years, with the continuous development of virtual reality (VR) technology, users' performance requirements for VR display panels have become increasingly higher. Among them, the production of high-pixel-density VR display panels has become the development direction of major VR manufacturers.

[0003] In order to make the VR display device have a high pixel density, it is necessary to make the VR display panel have a high pixel density while maintaining the aperture ratio as much as possible. Therefore, it is necessary to further reduce the width of the pixel defining layer in the color filter substrate. Furthermore, the reduction in the width of the pixel defining layer makes the color resistance preparation process requirements more stringent. Due to factors such as the accuracy of the exposure machine, it is difficult to prepare the color resistance under the narrow width pixel defining layer. For example, it is easy to have large fluctuations in the color resistance spacing, resulting in light leakage, color mixing, low transmittance and other phenomena, resulting in poor optical performance of the display panel. Therefore, it is necessary to increase the thickness of the pixel defining layer to improve the pixel defining layer's ability to limit the color resistance material in the color resistance preparation process, so as to reduce the difficulty of color resistance preparation and improve product yield. However, due to the material properties of the pixel defining layer, the high-thickness pixel defining layer is difficult to process and difficult to prepare. In view of this, there is an urgent need to improve the color filter substrate. Summary of the Invention

[0004] In view of the above problems, the present application provides a color film substrate and a preparation method thereof, a display panel, and a display device, which can effectively improve the stability of the preparation process of the color film substrate and improve the product yield.

[0005] In the first aspect, an embodiment of the present application provides a color filter substrate, which includes a substrate, a pixel defining layer and a color resist block. The pixel defining layer is arranged on the substrate, and the pixel defining layer includes a first sub-defining layer and a second sub-defining layer stacked in a direction perpendicular to the plane of the substrate. The second sub-defining layer is located on the side of the first sub-defining layer away from the substrate. The first sub-defining layer includes a first spacer and a plurality of first openings formed by the first spacer. The second sub-defining layer includes a second spacer and a plurality of second openings formed by the second spacer. Each first opening corresponds to each second opening one by one and together constitutes a defining cavity, and the color resist block is arranged in the defining cavity.

[0006] In the above technical solution, by setting the pixel defining layer as a double-layer stacked structure including a first sub-definition layer and a second sub-definition layer, during the production process of the pixel defining layer, the first sub-definition layer is first formed on the substrate, and then the second sub-definition layer is formed on the first sub-definition layer. The pixel defining layer is divided into two processes for production. In this way, the problem of high difficulty and difficulty in preparing the high-thickness pixel defining layer due to the material properties of the pixel defining layer is solved, and the stability of the preparation process of the high-thickness pixel defining layer is effectively improved.

[0007] Furthermore, since the problem of preparing a high-thickness pixel defining layer is solved, the width of the pixel defining layer can be reduced to achieve the preparation of a color filter substrate with a high pixel density. Since the embodiment of the present application has a high-thickness pixel defining layer composed of a first sub-defining layer and a second sub-defining layer stacked together, during the preparation of the color resist, the high-thickness pixel defining layer can better confine the color resist material within the defined cavity, effectively reducing the occurrence of light leakage, color mixing, low transmittance and other phenomena caused by large fluctuations in the spacing between the color resist blocks. Moreover, even if the exposure offset of the color resist blocks occurs during the preparation process, due to the high thickness of the pixel defining layer, the adjacent color resist blocks located in the defined cavity can be separated, and the color resist material that is offset to the outside of the defined cavity can be well removed in the subsequent development process. In summary, the high-thickness pixel defining layer can effectively improve the stability of the preparation process of the color resist of the color filter substrate under high pixel density, thereby effectively improving the product yield of the high-pixel-density color filter substrate.

[0008] In a second aspect, an embodiment of the present application provides a method for preparing a color filter substrate as provided in any embodiment of the first aspect, comprising:

[0009] providing a substrate;

[0010] forming a pixel defining layer on the substrate, wherein the pixel defining layer comprises a first sub-defining layer and a second sub-defining layer stacked together, the second sub-defining layer covering a side of the first sub-defining layer facing away from the substrate, the first sub-defining layer comprising a first spacer and a plurality of first openings formed by the first spacer, the second sub-defining layer comprising a second spacer and a plurality of second openings formed by the second spacer, each first opening corresponding to each second opening and jointly constituting a defined cavity;

[0011] A color resist block is formed in the defined cavity.

[0012] In a third aspect, an embodiment of the present application provides a display panel, comprising the color film substrate provided by any embodiment of the first aspect.

[0013] In a fourth aspect, an embodiment of the present application provides a display device, comprising a display panel provided by any embodiment of the third aspect.

[0014] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0016] Figure 1 A schematic top view of a color filter substrate provided in some embodiments of the present application;

[0017] Figure 2 A schematic cross-sectional structure diagram of a color filter substrate provided in some embodiments of the present application;

[0018] Figure 3 A schematic diagram of an exploded cross-section structure of a color filter substrate provided in some embodiments of the present application;

[0019] Figure 4 A schematic cross-sectional structure diagram of another color filter substrate provided in some embodiments of the present application;

[0020] Figure 5 A schematic cross-sectional structure diagram of another color filter substrate provided in some embodiments of the present application;

[0021] Figure 6 A schematic structural diagram of the steps of a preparation process for a color filter substrate provided in some embodiments of the present application;

[0022] Figure 7 A schematic structural diagram of another color filter substrate preparation process provided in some embodiments of the present application;

[0023] Figure 8 A schematic flow chart of a method for preparing a color filter substrate provided in some embodiments of the present application;

[0024] Figure 9 A schematic structural diagram of a display device provided in some embodiments of the present application.

[0025] The accompanying drawings in the specific implementation manner are as follows:

[0026] 10. Substrate; 20. Pixel defining layer; 21. First sub-defining layer; 211. First spacer; 212. First opening; 22. Second sub-defining layer; 221. Second spacer; 222. Second opening; 30. Defining cavity; 40. Color resist; 50. Non-photosensitive material layer; 60. Photosensitive material layer; 61. First photosensitive material layer; 62. Second photosensitive material layer; 1000. Display device. DETAILED DESCRIPTION

[0027] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0028] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the embodiments of the present application should have the common meanings understood by technicians in the field to which the embodiments of the present application belong.

[0029] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present application.

[0030] In addition, the technical terms "first," "second," etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. In the description of the embodiments of the present application, the meaning of "plurality" is more than two, unless otherwise specifically defined.

[0031] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0032] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0033] In recent years, with the continuous development of virtual reality (VR) technology, users' performance requirements for VR display panels have become increasingly higher. Among them, the production of high-pixel-density VR display panels has become the development direction of major VR manufacturers.

[0034] The inventors of this application have noticed that in order to make the VR display device have a high pixel density, it is necessary to make the VR display panel have a high pixel density while maintaining the aperture ratio as much as possible. Therefore, it is necessary to further reduce the width of the pixel defining layer in the color filter substrate. In addition, in order to increase the contrast, the thickness of the pixel defining layer also needs to be further increased. Limited by the material properties of the pixel defining layer, the process of preparing a high-thickness pixel defining layer is difficult. Furthermore, the width of the pixel defining layer is reduced, which makes the preparation process requirements of the color resistance more stringent. However, due to factors such as the accuracy of the exposure machine, the preparation of color resistance under a narrow-width pixel defining layer is difficult to achieve. For example, it is easy for the color resistance spacing to fluctuate too much, resulting in light leakage, color mixing, low transmittance and other phenomena, resulting in poor optical performance of the display panel. Therefore, it is necessary to further increase the thickness of the pixel defining layer to improve the stability of the color resistance preparation process and improve the product yield.

[0035] The inventors of this application have discovered that the pixel defining layer can be set as a double-layer stacked structure. In the preparation process of a color film substrate with high pixel density, the stability of the preparation process of the high-thickness pixel defining layer can be effectively improved. At the same time, the high-thickness pixel defining layer is conducive to the preparation of the color resist layer, thereby improving the stability of the preparation process of the color resist layer and effectively improving the product yield.

[0036] In order to solve the problems of the prior art, the embodiments of the present application provide a color filter substrate and a preparation method thereof, a display panel, and a display device. The color filter substrate provided in the embodiments of the present application is first introduced below. Figure 1 This is a schematic diagram of a top view of a color filter substrate provided in some embodiments of the present application. Figure 2 A schematic cross-sectional structure diagram of a color filter substrate provided in some embodiments of the present application is shown. Figure 3 This is a schematic diagram of an exploded cross-section structure of a color filter substrate provided in some embodiments of the present application. Figure 4 This is a schematic cross-sectional structure diagram of another color filter substrate provided in some embodiments of the present application. Figure 5 This is a schematic cross-sectional structure diagram of another color filter substrate provided in some embodiments of the present application.

[0037] like Figures 1 to 5 As shown, an embodiment of the present application provides a color filter substrate, which includes a substrate 10, a pixel defining layer 20, and a color resist block 40. The pixel defining layer 20 is disposed on the substrate 10. The pixel defining layer 20 includes a first sub-defining layer 21 and a second sub-defining layer 22 stacked in a direction perpendicular to the plane of the substrate 10. The second sub-defining layer 22 is located on the side of the first sub-defining layer 21 facing away from the substrate 10. The first sub-defining layer 21 includes a first spacer 211 and a plurality of first openings 212 formed by the first spacer 211. The second sub-defining layer 22 includes a second spacer 221 and a plurality of second openings 222 formed by the second spacer 221. Each first opening 212 corresponds to each second opening 222 one by one and together constitutes a defined cavity 30. The color resist block 40 is disposed within the defined cavity 30.

[0038] It should be noted that in order to achieve a high pixel density in VR display devices, it is necessary to ensure that the VR display panel has a high pixel density while maintaining the aperture ratio as much as possible. Therefore, it is necessary to further reduce the width of the pixel definition layer 20 in the color filter substrate. In addition, to increase the contrast, the thickness of the pixel definition layer 20 must also be further increased. However, due to the material properties of the pixel definition layer 20, the process of preparing a thick pixel definition layer 20 is difficult.

[0039] Furthermore, the reduced width of the pixel-defining layer 20 makes the color resist fabrication process more demanding. However, factors such as the precision of the exposure machine make color resist fabrication difficult under a narrow pixel-defining layer 20. For example, large fluctuations in the spacing between the color resists can easily lead to light leakage, color mixing, and low transmittance, resulting in poor optical performance of the display panel. Therefore, it is necessary to further increase the thickness of the pixel-defining layer 20 to improve the stability of the color resist fabrication process and increase product yield.

[0040] The thickness of the pixel defining layer 20 may be understood as the dimension of the pixel defining layer 20 in a direction perpendicular to the plane where the substrate 10 is located.

[0041] Due to the limitations of the material properties of the pixel defining layer 20, the preparation process of the high-thickness pixel defining layer 20 is difficult and has poor stability. Therefore, in an embodiment of the present application, during the production process of the pixel defining layer 20, a first sub-definition layer 21 is first formed on the substrate, and then a second sub-definition layer 22 is formed on the first sub-definition layer 21. In this way, the pixel defining layer 20 has a double-layer stacked structure, which can effectively improve the stability of the preparation process of the high-thickness pixel defining layer 20.

[0042] The first sub-defining layer 21 can be understood as a leading layer, used to support the second sub-defining layer 22, and mainly serves to increase the overall thickness of the pixel defining layer 20. The second sub-defining layer 22 can be understood as a black matrix layer, which mainly serves as a barrier. During the preparation process of the color resist blocks 40, the second sub-defining layer 22 can effectively prevent the material that is supposed to form the color resist blocks 40 in a certain interval from escaping into the adjacent intervals forming the color resist blocks 40 when forming the color resist blocks 40, thereby causing the colors of the color resist blocks 40 to mix, and thus failing to form a color filter substrate that can function effectively.

[0043] For example, along a direction perpendicular to the plane of the substrate 10, the first spacer 211 and the second spacer 221 both have a certain thickness. In this way, the first opening 212 and the second opening 222 can form a defined cavity 30, and the color resist block 40 is disposed in the defined cavity 30. The color resist block 40 can include a red color resist block 40, a green color resist block 40, and a blue color resist block 40. The red color resist block 40, the green color resist block 40, and the blue color resist block 40 together realize the color function of the color filter substrate.

[0044] Since the first sub-defining layer 21 and the second sub-defining layer 22 are stacked together to form a high-thickness pixel defining layer 20, the adjacent color resist blocks 40 located in the defining cavity 30 can be separated. Even if the exposure offset of the color resist blocks 40 occurs during the formation process of the color resist blocks 40, the color resist blocks 40 that are offset to the outside of the defining cavity 30 can be well removed in the subsequent development process, further improving the stability of the preparation process of the color resist layer and the product yield.

[0045] In the above technical solution, the pixel defining layer 20 is set to a double-layer stacked structure including a first sub-defining layer 21 and a second sub-defining layer 22. During the production of the pixel defining layer 20, the first sub-defining layer 21 is first formed on the substrate 10, and then the second sub-defining layer 22 is formed on the first sub-defining layer 21. The pixel defining layer 20 is divided into two processes for production. In this way, the problem of high process difficulty and difficulty in preparation of the high-thickness pixel defining layer 20 due to the material properties of the pixel defining layer 20 is solved, and the stability of the preparation process of the high-thickness pixel defining layer 20 is effectively improved.

[0046] Furthermore, since the preparation problem of the high-thickness pixel defining layer 20 is solved, the width of the pixel defining layer 20 can be reduced to achieve the preparation of a color filter substrate with a high pixel density. Since the embodiment of the present application has a high-thickness pixel defining layer 20 composed of a first sub-defining layer 21 and a second sub-defining layer 22 stacked together, during the preparation of the color resist, the high-thickness pixel defining layer 20 can better confine the color resist material within the defining cavity 30, effectively reducing the occurrence of light leakage, color mixing, low transmittance and other phenomena caused by the large fluctuation in the spacing of the color resist blocks 40. Moreover, even if the exposure offset of the color resist blocks 40 occurs during the preparation process, due to the high thickness of the pixel defining layer 20, the color resist blocks 40 located in the defining cavity 30 and adjacent to each other can be isolated, and the color resist material that is offset to the outside of the defining cavity 30 can be well removed during the subsequent development process. In summary, the high-thickness pixel defining layer 20 can effectively improve the stability of the preparation process of the color resist of the color filter substrate under high pixel density, thereby effectively improving the product yield of the high-pixel-density color filter substrate.

[0047] In some embodiments, along a direction perpendicular to the plane of the substrate 10 , a projection of the first spacer 211 on the substrate 10 covers a projection of the second spacer 221 on the substrate 10 .

[0048] Exemplarily, along a direction perpendicular to the plane of the substrate 10, the projection of the first spacer 211 on the substrate 10 covers the projection of the second spacer 221 on the substrate 10. It can be understood that the projection area of ​​the first spacer 211 on the substrate 10 is greater than or equal to the projection area of ​​the second spacer 221 on the substrate 10.

[0049] As described above, in the embodiment of the present application, during the fabrication of the pixel defining layer 20, a first sub-defining layer 21 is first formed on the substrate, and then a second sub-defining layer 22 is formed on the first sub-defining layer 21. In this way, along the direction perpendicular to the plane of the substrate 10, the projection of the first spacer 211 on the substrate 10 covers the projection of the second spacer 221 on the substrate 10. On the one hand, this can effectively improve the support performance of the first spacer 211 on the second spacer 221, allowing the second spacer 221 to stand more firmly on the first spacer 211; on the other hand, during the fabrication of the pixel defining layer 20, the risk of misalignment between the second spacer 221 and the first spacer 211 along the direction perpendicular to the plane of the substrate 10 can be reduced, further improving the stability of the fabrication process of the thick pixel defining layer 20.

[0050] In some embodiments, a cross-section of a side surface of the second partition 221 facing away from the first partition 211 along the extension direction of the second partition 221 is convexly arc-shaped.

[0051] Exemplarily, the cross-section of the side surface of the second spacer 221 away from the first spacer 211 along the extension direction of the second spacer 221 is convex arc-shaped. It can be understood that, along the direction from the second spacer 221 to the first spacer 211, the width of the cross-section of the side surface of the second spacer 221 away from the first spacer 211 along the extension direction of the second spacer 221 tends to gradually decrease.

[0052] In the above technical solution, the cross-section of the side surface of the second spacer 221 facing away from the first spacer 211 along the extension direction of the second spacer 221 is convex arc-shaped, which is beneficial to reducing the adhesion between the color resist material and the second spacer 221 during the process of forming the color resist block 40 in the defining cavity 30. The color resist material can flow along the second spacer 221 into the defining cavity 30, so as to more effectively confine the color resist material in the defining cavity 30, further improving the stability of the preparation process of the color resist layer and the product yield.

[0053] Figure 6 A schematic structural diagram of the steps of a preparation process for a color film substrate provided in some embodiments of the present application.

[0054] Continue to refer Figure 6 In some embodiments, the first spacer 211 may be made of a non-photosensitive material, and the second spacer 221 may be made of a photosensitive material.

[0055] In the embodiment of the present application, the non-photosensitive material may be but is not limited to copper, silver, aluminum or silicon nitride, and the photosensitive material may be but is not limited to transparent materials such as photoresist, or opaque materials such as brominated polystyrene.

[0056] Exemplarily, when the first spacer 211 is a non-photosensitive material and the second spacer 221 is a photosensitive material, in the process of manufacturing the pixel defining layer 20, first, a non-photosensitive material is coated on the substrate 10 to form a non-photosensitive material layer 50; secondly, a photosensitive material is coated on the non-photosensitive material layer 50 to form a photosensitive material layer 60; then, the photosensitive material layer 60 is patterned to form a second sub-defining layer 22; finally, the second sub-defining layer 22 is used as a template to pattern the non-photosensitive material layer 50 to form a first sub-defining layer 21.

[0057] The patterning process of the photosensitive material layer 60 can be a photolithography process, and the patterning process of the non-photosensitive material layer 50 can be a self-aligned etching process, and the etching can be dry etching or wet etching. Thus, through the above arrangement, the deviation between the first sub-defining layer 21 and the second sub-defining layer 22 can be effectively reduced, further improving the stability of the preparation process of the high-thickness pixel defining layer 20 and the product yield.

[0058] Figure 7A schematic structural diagram of another process step for preparing a color filter substrate provided in some embodiments of the present application.

[0059] Continue to refer Figure 7 In some optional embodiments, the first spacer 211 and the second spacer 221 are both made of photosensitive materials.

[0060] Exemplarily, when the first spacer 211 and the second spacer 221 are both photosensitive materials, in the process of manufacturing the pixel defining layer 20, first, a photosensitive material is coated on the substrate 10 to form a first photosensitive material layer 61; secondly, the first photosensitive material layer 61 is patterned to form a first sub-defining layer 21; then, a photosensitive material is coated on the first sub-defining layer 21 to form a second photosensitive material layer 62; finally, the second photosensitive material layer 62 is patterned to form a second sub-defining layer 22.

[0061] Among them, the patterning processes of the first photosensitive material layer 61 and the second photosensitive material layer 62 can both be photolithography processes. Thus, through the above-mentioned settings, the first sub-definition layer 21 and the second sub-definition layer 22 are prepared using the same material and the same patterning process, which can effectively reduce the complexity of the preparation process of the pixel definition layer 20, and thus can effectively improve the product yield and reduce costs.

[0062] In some embodiments, the first spacer 211 and the second spacer 221 are both made of opaque material.

[0063] For example, the pixel defining layer 20 made of opaque material can also block ambient light. On the one hand, since the color film substrate and the array substrate are stacked, it can prevent ambient light from entering the array substrate and affecting the operation of the metal circuits and electrodes; on the other hand, it can effectively improve the overall contrast of the pixel defining layer 20, thereby improving the display effect of the display panel.

[0064] In some embodiments, the cross-sectional shape of the first spacer 211 along a direction perpendicular to the extension of the first spacer 211 is rectangular or trapezoidal, and / or the cross-sectional shape of the second spacer 221 along a direction perpendicular to the extension of the second spacer 221 is rectangular, trapezoidal, triangular, or semicircular. Compared to other more complex cross-sectional shapes, this simplifies the complexity of the manufacturing process for the first spacer 211 and helps reduce manufacturing costs.

[0065] In some embodiments, the thickness of the first spacer 211 is 1 μm-1.5 μm, and the thickness of the second spacer 221 is 1 μm-2 μm.

[0066] In the above embodiments, the thickness of the first spacer 211 can be understood as the height of the first spacer 211 in a direction perpendicular to the plane where the substrate 10 is located, and the thickness of the second spacer 221 can be understood as the height of the second spacer 221 in a direction perpendicular to the plane where the substrate 10 is located.

[0067] For example, the thickness of the first spacer 211 may be but is not limited to 1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, etc., and the thickness of the second spacer 221 may be but is not limited to 1 μm, 1.3 μm, 1.5 μm, 2 μm, etc.

[0068] In the above technical solution, setting the thickness of the first spacer 211 and the second spacer 221 within the above range can further improve the overall blocking performance of the pixel defining layer 20 to the color resist block 40, thereby further improving the stability of the preparation process of the color resist layer and the product yield.

[0069] In some embodiments, the thickness of the color resist is less than the sum of the thicknesses of the first spacer 211 and the second spacer 221 .

[0070] It should be noted that during the formation of the color resist blocks 40, there is a certain probability that the exposure of the color resist blocks 40 will shift, thereby affecting the product yield. Through the above technical solution, the thickness of the color resist is set to be less than the sum of the thicknesses of the first spacer 211 and the second spacer 221. Even if the exposure of the color resist blocks 40 shifts during the formation of the color resist blocks 40, the pixel defining layer 20 can separate the color resist blocks 40 located within the defining cavity 30 from the color resist blocks 40 that have shifted outside the defining cavity 30. In the subsequent development process, the color resist blocks 40 that have shifted outside the defining cavity 30 can be effectively removed, further improving the stability of the preparation process of the color resist layer and the product yield.

[0071] In some embodiments, the color resist includes a photoresist having a viscosity less than 3 mPa·s and a solvent ratio greater than 60%.

[0072] It should be noted that during the formation of the color resist blocks 40 , there is a certain probability that defects such as small spacing between the color resist blocks 40 or gaps at the bottom will occur, thereby affecting the product yield.

[0073] In an embodiment of the present application, the solvent ratio of the photoresist is greater than 60%, which is a characteristic of a high solvent ratio compared to ordinary photoresists. The high solvent content can cause most of the color resist material to evaporate during the pre-baking process, so that the film surface is lower than the pixel definition layer 20.

[0074] Furthermore, the viscosity of the photoresist is less than 3 mPa·s, which has a low viscosity characteristic compared to ordinary photoresists. Therefore, it has high fluidity, can reduce the risk of film breakage during coating, and is conducive to reducing the adhesion between the color resist material and the second spacer 221. The color resist material can flow along the second spacer 221 into the defining cavity 30 to more effectively confine the color resist material within the defining cavity 30, so that there is no color resist material attached to the side of the pixel defining layer 20 away from the substrate 10, thereby facilitating development. At the same time, the normal color resist production process can also be well utilized to achieve self-repair of the above-mentioned defects. This further improves the stability of the preparation process of the color resist layer and the product yield.

[0075] Figure 8 A schematic flow chart of a method for preparing a color film substrate provided in some embodiments of the present application.

[0076] Continue to refer Figure 8 Based on the color filter substrate provided in the above embodiment of the present application, the embodiment of the present application further provides a method for preparing the color filter substrate, the method for preparing the color filter substrate comprising:

[0077] Step S01, providing a substrate 10;

[0078] Step S02, forming a pixel defining layer 20 on the substrate 10, wherein the pixel defining layer 20 includes a stacked first sub-defining layer 21 and a second sub-defining layer 22, the second sub-defining layer 22 covering the side of the first sub-defining layer 21 facing away from the substrate 10, the first sub-defining layer 21 includes a first spacer 211 and a plurality of first openings 212 formed by the first spacer 211, the second sub-defining layer 22 includes a second spacer 221 and a plurality of second openings 222 formed by the second spacer 221, each first opening 212 corresponds to each second opening 222 one by one and together constitutes a defined cavity 30;

[0079] Step S03 , forming a color resist block 40 in the defined cavity 30 .

[0080] In the above technical solution, by setting the pixel defining layer 20 as a double-layer stacked structure including a first sub-defining layer 21 and a second sub-defining layer 22, the preparation process stability of the high-thickness pixel defining layer 20 can be effectively improved during the preparation of a color film substrate with high pixel density. At the same time, the high-thickness pixel defining layer 20 is conducive to the preparation of the color resist layer, thereby improving the preparation process stability of the color resist layer and effectively improving the product yield.

[0081] In some embodiments, in step S02 above, forming a pixel defining layer 20 on the substrate 10 may include the following steps:

[0082] Coating a non-photosensitive material on the substrate 10 to form a non-photosensitive material layer 50;

[0083] coating a photosensitive material on the non-photosensitive material layer 50 to form a photosensitive material layer 60;

[0084] Patterning the photosensitive material layer 60 to form a second sub-definition layer 22;

[0085] The non-photosensitive material layer 50 is patterned using the second sub-defining layer 22 as a template to form the first sub-defining layer 21 .

[0086] Exemplarily, when the first spacer 211 is a non-photosensitive material and the second spacer 221 is a photosensitive material, in the process of manufacturing the pixel defining layer 20, first, a non-photosensitive material is coated on the substrate 10 to form a non-photosensitive material layer 50; secondly, a photosensitive material is coated on the non-photosensitive material layer 50 to form a photosensitive material layer 60; then, the photosensitive material layer 60 is patterned to form a second sub-defining layer 22; finally, the second sub-defining layer 22 is used as a template to pattern the non-photosensitive material layer 50 to form a first sub-defining layer 21.

[0087] The patterning process of the photosensitive material layer 60 can be a photolithography process, and the patterning process of the non-photosensitive material layer 50 can be a self-aligned etching process, and the etching can be dry etching or wet etching. Thus, through the above arrangement, the deviation between the first sub-defining layer 21 and the second sub-defining layer 22 can be effectively reduced, further improving the stability of the preparation process of the high-thickness pixel defining layer 20 and the product yield.

[0088] In some embodiments, in step S02 above, forming a pixel defining layer 20 on the substrate 10 may include the following steps:

[0089] Coating a photosensitive material on the substrate 10 to form a first photosensitive material layer 61;

[0090] Patterning the first photosensitive material layer 61 to form a first sub-defining layer 21;

[0091] coating a photosensitive material on the first sub-defining layer 21 to form a second photosensitive material layer 62;

[0092] The second photosensitive material layer 62 is patterned to form a second sub-defining layer 22 .

[0093] Exemplarily, when the first spacer 211 and the second spacer 221 are both photosensitive materials, in the process of manufacturing the pixel defining layer 20, first, a photosensitive material is coated on the substrate 10 to form a first photosensitive material layer 61; secondly, the first photosensitive material layer 61 is patterned to form a first sub-defining layer 21; then, a photosensitive material is coated on the first sub-defining layer 21 to form a second photosensitive material layer 62; finally, the second photosensitive material layer 62 is patterned to form a second sub-defining layer 22.

[0094] Among them, the patterning processes of the first photosensitive material layer 61 and the second photosensitive material layer 62 can both be photolithography processes. Thus, through the above-mentioned settings, the first sub-definition layer 21 and the second sub-definition layer 22 are prepared using the same material and the same patterning process, which can effectively reduce the complexity of the preparation process of the pixel definition layer 20, and thus can effectively improve the product yield and reduce costs.

[0095] Based on the color film substrate provided in the above embodiments of the present application, the embodiments of the present application further provide a display panel, which includes the color film substrate provided in any of the above embodiments.

[0096] Figure 9 A schematic structural diagram of a display device provided in some embodiments of the present application.

[0097] Continue to refer Figure 9 Based on the display panel provided in the above-mentioned embodiments of the present application, the embodiments of the present application further provide a display device 1000, and the display device 1000 includes the display panel provided in any of the above-mentioned embodiments.

[0098] Since the display device 1000 provided in the embodiment of the present application includes the display panel of any of the above embodiments, the display device 1000 provided in the embodiment of the present application has the beneficial effects of the display panel of any of the above embodiments, which will not be described in detail here.

[0099] The display device 1000 in the embodiment of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A color film substrate, characterized in that: include: substrate; A pixel defining layer is disposed on the substrate, the pixel defining layer comprises a first sub-defining layer and a second sub-defining layer stacked in a direction perpendicular to a plane where the substrate is located, the second sub-defining layer is located on a side of the first sub-defining layer away from the substrate, the first sub-defining layer comprises a first spacer and a plurality of first openings formed by the first spacer, the second sub-defining layer comprises a second spacer and a plurality of second openings formed by the second spacer, each of the first openings corresponds to each of the second openings one by one and together constitutes a defining cavity; A color blocking block is disposed in the defined cavity; Wherein, a cross section of a side surface of the second spacer away from the first spacer along the extension direction of the second spacer is in a convex arc shape.

2. The color film substrate according to claim 1, characterized in that: Along a direction perpendicular to the plane where the substrate is located, the orthographic projection of the first spacing portion covers the orthographic projection of the second spacing portion.

3. The color film substrate according to claim 1, characterized in that: The first spacer is made of non-photosensitive material, and the second spacer is made of photosensitive material, or, The first spacer and the second spacer are both made of photosensitive materials.

4. The color film substrate according to claim 1, characterized in that: The first spacer and the second spacer are both made of opaque material.

5. The color film substrate according to claim 1, characterized in that: Along the extending direction perpendicular to the first spacer, the cross-sectional shape of the first spacer is rectangular or trapezoidal, and / or, Along the extending direction perpendicular to the second spacer, the cross-sectional shape of the second spacer is rectangular, trapezoidal, triangular or semicircular.

6. The color film substrate according to claim 1, characterized in that: The thickness of the first spacer is 1 μm-1.5 μm, and the thickness of the second spacer is 1 μm-2 μm.

7. The color film substrate according to claim 1, characterized in that: The thickness of the color resist is less than the sum of the thickness of the first spacer and the second spacer.

8. The color film substrate according to any one of claims 1 to 7, characterized in that: The color resist includes a photoresist, wherein the viscosity of the photoresist is less than 3 mPa·s and the solvent ratio is greater than 60%.

9. A method for preparing a color film substrate according to any one of claims 1 to 8, characterized in that: The preparation method comprises: providing a substrate; A pixel defining layer is formed on the substrate, wherein the pixel defining layer comprises a first sub-defining layer and a second sub-defining layer stacked, the second sub-defining layer is coated on a side of the first sub-defining layer away from the substrate, the first sub-defining layer comprises a first spacer and a plurality of first openings formed by the first spacer, the second sub-defining layer comprises a second spacer and a plurality of second openings formed by the second spacer, each of the first openings corresponds to each of the second openings one by one and together constitutes a defining cavity; A color resist block is formed in the defined cavity.

10. The method for preparing a color film substrate according to claim 9, characterized in that: The forming of a pixel defining layer on the substrate comprises: coating a non-photosensitive material on the substrate to form a non-photosensitive material layer; coating a photosensitive material on the non-photosensitive material layer to form a photosensitive material layer; Patterning the photosensitive material layer to form the second sub-definition layer; The non-photosensitive material layer is patterned using the second sub-defining layer as a template to form the first sub-defining layer.

11. The method for preparing a color film substrate according to claim 9, characterized in that: The forming of a pixel defining layer on the substrate comprises: coating a photosensitive material on the substrate to form a first photosensitive material layer; Patterning the first photosensitive material layer to form the first sub-definition layer; coating a photosensitive material on the first sub-definition layer to form a second photosensitive material layer; The second photosensitive material layer is patterned to form the second sub-defining layer.

12. A display panel, characterized in that: It comprises the color film substrate as described in any one of claims 1-8.

13. A display device, characterized in that: Comprising the display panel as claimed in claim 12.

Images