Wavelength conversion module and projection device

Abstract

The present application provides a wavelength conversion module, which includes a substrate, a wavelength conversion layer and at least one fin. The substrate has a wavelength conversion region, a non-wavelength conversion region and at least one through hole. The through hole penetrates the substrate and is located in the non-wavelength conversion region. The wavelength conversion layer is arranged on the wavelength conversion region of the substrate. The fin is arranged on the non-wavelength conversion region of the substrate. When the substrate reaches a first temperature range, the fin closes the through hole. When the substrate reaches a second temperature range, at least one air flow channel is formed between the fin and the through hole. In addition, the present application discloses a projection device using the above wavelength conversion module. The wavelength conversion module and the projection device using the same can effectively reduce the temperature of the wavelength conversion module, thereby having better reliability.

Description

Technical Field

[0001] This invention relates to an optical module and a projection device, and more particularly to a wavelength conversion module and a projection device having the wavelength conversion module. Background Technology

[0002] In solid-state laser (SSI) projectors, the phosphor wheel is located in the path of the excitation beam from the light source module. Blue laser light emitted from a blue laser source is projected onto the light conversion area of ​​the phosphor wheel to excite a yellow conversion beam, thus synthesizing white light. Generally, a counterweight ring is additionally assembled into the phosphor wheel for subsequent dynamic balancing. However, the counterweight ring and the substrate are usually connected by an adhesive. Therefore, the heat accumulated in the center of the turntable is difficult to transfer to the counterweight ring due to the adhesive barrier, and the center of the turntable is also not directly exposed to air because of the counterweight ring, leading to heat accumulation. Furthermore, the difference in thermal expansion between the counterweight ring and the substrate due to temperature differences further causes deformation of the phosphor wheel. Although existing technologies have used additional heat dissipation structures to address the heat accumulation problem in the center of the turntable, these structures not only increase weight and motor height but also affect dynamic balance and noise.

[0003] The "Background Art" paragraph is only used to help understand the content of this invention. Therefore, the content disclosed in the "Background Art" paragraph may include some prior art that is not known to those skilled in the art. The content disclosed in the "Background Art" paragraph does not mean that the content or the problem to be solved by one or more embodiments of this invention was known or recognized by those skilled in the art before this application was filed. Summary of the Invention

[0004] This invention provides a wavelength conversion module with better reliability.

[0005] The present invention provides a projection device including the wavelength conversion module described above, which has better projection quality and product competitiveness.

[0006] Other objects and advantages of the present invention can be further understood from the technical features disclosed herein.

[0007] To achieve one or more of the above-mentioned objectives, or other objectives, an embodiment of the present invention provides a wavelength conversion module, comprising a substrate, a wavelength conversion layer, and at least one wing. The substrate has a wavelength conversion region, a non-wavelength conversion region, and at least one through-hole. The through-hole penetrates the substrate and is located within the non-wavelength conversion region. The wavelength conversion layer is disposed in the wavelength conversion region of the substrate. The wing is disposed in the non-wavelength conversion region of the substrate. When the substrate reaches a first temperature range, the wing closes the through-hole. When the substrate reaches a second temperature range, at least one airflow channel is formed between the wing and the through-hole.

[0008] To achieve one or more of the above-mentioned objectives, or other objectives, an embodiment of the present invention provides a projection device, comprising an illumination system, a light valve, and a projection lens. The illumination system provides an illumination beam and includes a light source module and a wavelength conversion module. The light source module provides an excitation beam. The wavelength conversion module is disposed in the transmission path of the excitation beam to convert the excitation beam into an illumination beam. The wavelength conversion module includes a substrate, a wavelength conversion layer, and at least one wing. The substrate has a wavelength conversion region, a non-wavelength conversion region, and at least one through-hole. The through-hole penetrates the substrate and is located in the non-wavelength conversion region. The wavelength conversion layer is disposed in the wavelength conversion region of the substrate. The wing is disposed in the non-wavelength conversion region of the substrate. When the substrate reaches a first temperature range, the wing closes the through-hole. When the substrate reaches a second temperature range, at least one airflow channel is formed between the wing and the through-hole. The light valve is disposed in the transmission path of the illumination beam to convert the illumination beam into an image beam. The projection lens is disposed in the transmission path of the image beam to project the image beam out of the projection device.

[0009] Based on the above, the embodiments of the present invention have at least one of the following advantages or effects. In the design of the wavelength conversion module of the present invention, the fins are disposed in the non-wavelength conversion area of ​​the substrate. When the substrate reaches a first temperature range (e.g., low temperature), the fins close the perforations, and when the substrate reaches a second temperature range (e.g., high temperature), an airflow channel is formed between the fins and the perforations. That is, by means of the airflow channel formed between the fins and the perforations, the turbulence effect is increased, thereby effectively reducing the temperature of the wavelength conversion module and thus giving the wavelength conversion module better reliability. Furthermore, since the wavelength conversion module of the present invention can dynamically and automatically adjust the spacing between the fins and the perforations at different temperature ranges, the noise perceptible to the user can be reduced while meeting the heat dissipation requirements. In addition, projection devices using the wavelength conversion module of the present invention can have better projection quality and product competitiveness. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of a projection device according to an embodiment of the present invention.

[0011] Figure 2A yes Figure 1 A three-dimensional schematic diagram of the wavelength conversion module of the projection device.

[0012] Figure 2B yes Figure 2A A three-dimensional schematic diagram of the wavelength conversion module from another perspective.

[0013] Figure 2C yes Figure 2A A three-dimensional exploded view of the wavelength conversion module.

[0014] Figure 2D yes Figure 2A A stereoscopic exploded view of the wavelength conversion module from another perspective.

[0015] Figure 2E yes Figure 2A A cross-sectional schematic diagram of the wavelength conversion module.

[0016] Figure 2F yes Figure 2A A three-dimensional schematic diagram of the wavelength conversion module when the substrate reaches the second temperature range.

[0017] Figure 3A This is a perspective view of a wavelength conversion module according to an embodiment of the present invention.

[0018] Figure 3B yes Figure 3A A three-dimensional exploded view of the wavelength conversion module.

[0019] Figure 3C yes Figure 3A A stereoscopic exploded view of the wavelength conversion module from another perspective.

[0020] Figure 3D yes Figure 3A A cross-sectional schematic diagram of the wavelength conversion module.

[0021] Figure 4A This is a perspective view of a wavelength conversion module according to another embodiment of the present invention.

[0022] Figure 4B yes Figure 4A A three-dimensional exploded view of the wavelength conversion module.

[0023] Figure 4C yes Figure 4A A stereoscopic exploded view of the wavelength conversion module from another perspective.

[0024] Figure 4D yes Figure 4A A cross-sectional schematic diagram of the wavelength conversion module.

[0025] Figure 5AThis is a perspective view of a wavelength conversion module according to another embodiment of the present invention.

[0026] Figure 5B yes Figure 5A A three-dimensional schematic diagram of the wavelength conversion module from another perspective.

[0027] Figure 5C yes Figure 5A A three-dimensional exploded view of the wavelength conversion module.

[0028] Figure 5D yes Figure 5A A cross-sectional schematic diagram of the wavelength conversion module.

[0029] Figure 6A This is a perspective view of a wavelength conversion module according to another embodiment of the present invention.

[0030] Figure 6B yes Figure 6A A three-dimensional schematic diagram of the wavelength conversion module from another perspective.

[0031] Figure 6C yes Figure 6A A three-dimensional exploded view of the wavelength conversion module.

[0032] Figure 6D yes Figure 6A A stereoscopic exploded view of the wavelength conversion module from another perspective.

[0033] Figure 6E yes Figure 6A A cross-sectional schematic diagram of the wavelength conversion module.

[0034] List of reference numerals

[0035] 10: Projection device

[0036] 20: Lighting System

[0037] 25: Light Source Module

[0038] 30: Light valve

[0039] 40: Projection lens

[0040] 100a, 100b, 100c, 100d, 100e: Wavelength conversion modules

[0041] 110a, 110b, 110c, 110d, 110e: substrate

[0042] 114a, 114b, 114c, 114d, 114e: Perforation

[0043] 115a, 115b, 115c, 115d, 115e: First surface

[0044] 116: Disruption section

[0045] 117: Third Surface

[0046] 120: Wavelength conversion layer

[0047] 125: Translucent panel

[0048] 130c, 130d, 130e, 144a, 144b: winglets

[0049] 132e: Part One

[0050] 134e: Part Two

[0051] 135c, 135d, 135e, 145a: Second surface

[0052] 140a, 140b, 140c: Clamping elements

[0053] 142a, 142b: Main body

[0054] 143a: Side surface

[0055] 150a, 150b, 150c, 150d: Adhesive layer

[0056] 152: Adhesive part

[0057] 160: Driver Components

[0058] 162: Shaft

[0059] A1: Wavelength conversion region

[0060] A2: Non-wavelength conversion region

[0061] C: Airflow channel

[0062] L': Excitation beam

[0063] L1: illumination beam

[0064] L2: Image beam. Detailed Implementation

[0065] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the present invention.

[0066] Figure 1This is a schematic diagram of a projection device according to an embodiment of the present invention. Please refer to [the diagram first]. Figure 1 In this embodiment, the projection device 10 includes an illumination system 20, a light valve 30, and a projection lens 40. The illumination system 20 provides an illumination beam L1, and includes a light source module 25 and a wavelength conversion module 100a. The light source module 25 provides an excitation beam L'. The wavelength conversion module 100a is positioned in the transmission path of the excitation beam L' to convert the excitation beam L' into an illumination beam L1. The light valve 30 is positioned in the transmission path of the illumination beam L1 to convert the illumination beam L1 into an image beam L2. The projection lens 40 is positioned in the transmission path of the image beam L2 to project the image beam L2 out of the projection device 10. The wavelength conversion module 100a is, for example, a phosphor wheel, which periodically enters the transmission path of the excitation beam L'.

[0067] In detail, the light source module 25 used in this embodiment is, for example, a laser diode (LD) or a laser diode bank. Specifically, any light source that meets the size requirements of the actual design can be implemented, and the present invention is not limited thereto. The light valve 30 is, for example, a reflective light modulator such as a liquid crystal on silicon panel (LCoS panel) or a digital micro-mirror device (DMD). In one embodiment, the light valve 30 is, for example, a transparent liquid crystal panel, an electro-optic modulator, a magneto-optic modulator, or an acousto-optic modulator (AOM), etc., a transmissive light modulator, but this embodiment does not limit the type or kind of the light valve 30. The method by which the light valve 30 converts the illumination beam L1 into the image beam L2 is well-documented, and its detailed steps and implementation methods are readily available from common knowledge in the art, and therefore will not be elaborated further. Additionally, the projection lens 40 may include, for example, a combination of one or more optical lenses with refractive power, such as various combinations of non-planar lenses including biconcave lenses, biconvex lenses, concave-convex lenses, convex-concave lenses, plano-convex lenses, and plano-concave lenses. In one embodiment, the projection lens 40 may also include planar optical lenses to convert the image beam L2 from the light valve 30 into a projection beam and project it out of the projection device 10 by reflection or transmission. Therefore, this embodiment does not limit the type or form of the projection lens 40.

[0068] Figure 2A yes Figure 1 A three-dimensional schematic diagram of the wavelength conversion module of the projection device. Figure 2B yes Figure 2A A three-dimensional schematic diagram of the wavelength conversion module from another perspective. Figure 2C yes Figure 2A A three-dimensional exploded view of the wavelength conversion module. Figure 2D yes Figure 2A A stereoscopic exploded view of the wavelength conversion module from another perspective. Figure 2E yes Figure 2A A cross-sectional schematic diagram of the wavelength conversion module. Figure 2F yes Figure 2A A three-dimensional schematic diagram of the wavelength conversion module when the substrate reaches the second temperature range.

[0069] Please refer to the following at the same time. Figure 2A , Figure 2B , Figure 2C as well as Figure 2D In this embodiment, the wavelength conversion module 100a includes a substrate 110a, a wavelength conversion layer 120, and at least one wing (three wings 144a are schematically shown). The substrate 110a has a wavelength conversion region A1, a non-wavelength conversion region A2, and at least one through-hole (three through-holes 114a are schematically shown). The through-holes 114a penetrate the substrate 110a and are located within the non-wavelength conversion region A2, wherein the through-holes 114a are interconnected. The substrate 110a is made of, for example, a metal, a non-metal, or a composite material of metal and non-metal. The wavelength conversion layer 120 is disposed in the wavelength conversion region A1 of the substrate 110a, wherein the wavelength conversion layer 120 is, for example, a fluorescent material, for conversion. Figure 1 The illumination beam L1 has a wavelength that generates different wavelength conversion beams. Furthermore, the wavelength conversion module 100a of this embodiment also includes a light-transmitting plate 125, which is disposed in the non-wavelength conversion region A2 of the substrate 110a to define a disk shape with the substrate 125. When the substrate 110a rotates, the wavelength conversion layer 120 located in the wavelength conversion region A1 and the light-transmitting plate 125 located in the non-wavelength conversion region A2 can be sequentially moved to... Figure 1 The illumination beam L1 is shown in the transmission path. When the light-transmitting plate 125 located in the non-wavelength conversion region A2 enters the transmission path of the illumination beam L1, the illumination beam L1 penetrates the light-transmitting plate 125 and is transmitted to the light valve 30.

[0070] In particular, in this embodiment, the wing 144a is disposed in the non-wavelength conversion region A2 of the substrate 110a. More specifically, the wavelength conversion module 100a of this embodiment also includes a clamping element 140a, which includes an integrally formed body 142a and a wing 144a, wherein the wing 144a is connected to each other. The wing 144a is located on one side surface 143a of the body 142a and extends outward from the body 142a along different radial directions. That is, the wing 144a protrudes from the side surface 143a of the body 142a, and the material of the body 142a is the same as that of the wing 144a. Here, the clamping element 140a can be manufactured by computer numerical control (CNC) to effectively reduce production costs, wherein the material of the wing 144a is, for example, metal, non-metal, or a composite material of metal and non-metal, but is not limited thereto.

[0071] When the substrate 110a reaches a first temperature range, for example, a room temperature / low temperature state, with a temperature between 20 degrees and 90 degrees, the wing 144a is embedded in the through hole 114a of the substrate 110a to seal the through hole 114a. At this time, please simultaneously Figure 2A and Figure 2E The substrate 110a has a first surface 115a, and the wing 144a has a second surface 145a, with the first surface 115a and the second surface 145a located on the same plane. That is, in the first temperature range, the wing 144a and the substrate 110a are preferably tightly or nearly tightly fitted, wherein the wing 144a is used to fill the perforation 114a, so that the substrate 110a, which was originally not a complete circle or not a complete ring due to the perforation 114a, becomes a complete circle or a complete ring.

[0072] Next, please refer to the following: Figure 2A and Figure 2F When the substrate 110a reaches the second temperature range, for example, a high temperature of 90 to 170 degrees Celsius, since the coefficient of thermal expansion of the fin 144a is different from that of the substrate 110a, preferably, the coefficient of thermal expansion of the fin 144a is smaller than that of the substrate 110a, at least one airflow channel (three airflow channels C are schematically shown) is formed between the fin 144a and the perforation 114a of the substrate 110a. That is, the airflow channel C can be formed between the fin 144a and the perforation 114a due to the difference in thermal expansion, thereby increasing the turbulence effect and effectively reducing the temperature of the wavelength conversion module 100a, thereby giving the wavelength conversion module 100a better reliability.

[0073] It should be noted that during use, the wavelength conversion module 100a experiences thermal expansion due to the heat accumulated from laser light irradiation and wavelength conversion. However, because the amount of thermal expansion differs between the substrate 110a and the clamping element 140a (caused by differences in coefficients of thermal expansion or temperature differences due to accumulated heat), the gap between the perforation 114a and the embedded fin 144a of the substrate 110a increases, forming an airflow channel C that allows airflow between the front and back of the substrate 110a. Furthermore, the higher the temperature, the greater the difference in deformation between the substrate 110a and the clamping element 140a, resulting in a larger gap between the perforation 114a and the embedded fin 144a. This allows the wavelength conversion module 100a of this embodiment to produce better heat dissipation at higher temperatures.

[0074] Furthermore, please refer to [the following]: Figure 2C , Figure 2D as well as Figure 2E The wavelength conversion module 100a in this embodiment further includes an adhesive layer 150a, which includes a plurality of adhesive portions 152, disposed between the main body 142a of the clamping element 140a and the non-wavelength conversion region A2 of the substrate 110a. The clamping element 140a is fixed to the substrate 110a by means of the adhesive layer 150a.

[0075] Furthermore, the wavelength conversion module 100a of this embodiment also includes a driving component 160, with a driving substrate 110a rotating about a pivot 162 of the driving component 160. A clamping element 140a is arranged around the pivot 162 perpendicular to the driving component 160. The substrate 110a and the clamping element 140a are coaxially arranged with the driving component 160. Here, the driving component 160 is, for example, a motor, but is not limited thereto. Of course, in other embodiments not shown, the wavelength conversion module may not have a driving component, meaning the wavelength conversion module is not a disc type and does not rotate; this still falls within the scope of protection of this invention.

[0076] In short, the wing 144a in this embodiment is disposed in the non-wavelength conversion region A2 of the substrate 110a. In a first temperature range (e.g., low temperature), the wing 144a closes the perforation 114a of the substrate 110a. In a second temperature range (e.g., high temperature), the difference in thermal deformation between the wing 144a and the substrate 110a creates an airflow channel C between the wing 144a and the perforation 114a. That is, the airflow channel C formed between the wing 144a and the perforation 114a increases the turbulence effect and effectively reduces the heat energy transferred from the substrate 110a to the body 142a of the clamping element 140a, thereby effectively reducing the temperature of the wavelength conversion module 100a and thus improving the reliability of the wavelength conversion module 100a. Furthermore, since the wavelength conversion module 100a of this embodiment can dynamically and automatically adjust the spacing between the fins 144a and the perforations 114a at different temperature ranges, the noise perceptible to the user can be reduced while meeting heat dissipation requirements. In addition, the projection device 10 using the wavelength conversion module 100a of this embodiment can have better projection quality and product competitiveness.

[0077] It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals used to represent the same or similar components, and descriptions of the same technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0078] Figure 3A This is a perspective view of a wavelength conversion module according to an embodiment of the present invention. Figure 3B yes Figure 3A A three-dimensional exploded view of the wavelength conversion module. Figure 3C yes Figure 3A A stereoscopic exploded view of the wavelength conversion module from another perspective. Figure 3D yes Figure 3A A cross-sectional view of the wavelength conversion module. Please refer to the following simultaneously. Figure 2A as well as Figure 3A In this embodiment, the wavelength conversion module 100b and Figure 2A Similar to the wavelength conversion module 100a, the difference lies in the structure of the wing 144b of the clamping element 140b in this embodiment. Figure 2A The clamping element 140a has a wing 144a structure, and the structure of the substrate 110b is also different. Figure 2A The structure of substrate 110a.

[0079] For more details, please also refer to... Figure 3A , Figure 3B , Figure 3C as well as Figure 3DIn this embodiment, the clamping element 140b includes an integrally formed body 142b and winglets 144b, wherein the winglets 144b are separately connected to the edge of the body 142b, and the winglets 144b extend along different radial directions of the body 142b. Figure 3D As shown, the wing 144b and the main body 142b are located on different planes. The clamping element 140b can be manufactured by stamping to effectively reduce production costs. The clamping element 140b is fixed to the substrate 110b by an adhesive layer 150b. When the substrate 110b reaches a first temperature range, such as a room temperature / low temperature state, with a temperature of 20 degrees to 90 degrees, the wing 144b is embedded in the perforation 114b of the substrate 110b to seal the perforation 114b. At this time, the first surface 115b of the substrate 110b and the second surface 145b of the wing 144b are located on the same plane. When the substrate 110b reaches a second temperature range, such as a high temperature state, with a temperature of 90 degrees to 170 degrees, because the substrate 110b and the wing 144b have different thermal expansion, an airflow channel is formed between the wing 144b and the perforation 114b of the substrate 110b (see reference). Figure 2F This can increase the turbulence effect, thereby effectively reducing the temperature of the wavelength conversion module 100b.

[0080] Furthermore, the substrate 110b of this embodiment includes a plurality of turbulence-dissipating portions 116, wherein the turbulence-dissipating portions 116 are separately protruding from or recessed into the non-wavelength conversion region A2. Heat energy at the center of the substrate 110b can be dissipated due to the larger surface area formed by the turbulence-dissipating portions 116, and the turbulence-dissipating portions 116 can also further turbulentize the airflow along the airflow guide path, improving heat dissipation. Here, the material of the turbulence-dissipating portions 116 can be the same as the material of the substrate 110b, or the turbulence-dissipating portions 116 can be formed by coating the non-wavelength conversion region A2 of the substrate 110b with a colloid; all of the above fall within the scope of protection of this invention.

[0081] Figure 4A This is a perspective view of a wavelength conversion module according to another embodiment of the present invention. Figure 4B yes Figure 4A A three-dimensional exploded view of the wavelength conversion module. Figure 4C yes Figure 4A A stereoscopic exploded view of the wavelength conversion module from another perspective. Figure 4D yes Figure 4A A cross-sectional view of the wavelength conversion module. Please refer to the following simultaneously. Figure 3A as well as Figure 4A In this embodiment, the wavelength conversion module 100c and Figure 3A Similar to the wavelength conversion module 100b, the difference lies in the structure of the clamping element 140c and the wing 130c in this embodiment. Figure 3AThe structure of the clamping element 140b and the wing 144b.

[0082] For more details, please also refer to... Figure 4A , Figure 4B , Figure 4C as well as Figure 4D In this embodiment, the clamping element 140c and the three flaps 130c are each independent components. The material of the flaps 130c is different from the material of the clamping element 140c and the substrate 110c, and these flaps 130c are separate from each other and independent. The clamping element 140c is disposed in the non-wavelength conversion region A2 of the substrate 110c and covers part of the flaps 130c. That is, the flaps 130c are assembled downward from the first surface 115c of the substrate 110c into the through hole 114c. The clamping element 140c is coaxially arranged with the substrate 110c, and the clamping element 140c is fixed to the substrate 110c by an adhesive layer 150c. Here, the material of the clamping element 140c can be metal, non-metal, or metal / non-metal composite material, such as aluminum alloy or a cured colloidal material.

[0083] When the substrate 110c reaches a first temperature range, such as a room temperature / low temperature state, with a temperature of 20 degrees to 90 degrees, the wing 130c is embedded in the through-hole 114c of the substrate 110c to seal the through-hole 114c. At this time, the first surface 115c of the substrate 110c and the second surface 135c of the wing 130c are located on the same plane. When the substrate 110c reaches a second temperature range, such as a high temperature state, with a temperature of 90 degrees to 170 degrees, because the deformation of the wing 130c is different from that of the substrate 110c, the wing 130c warps in the opposite direction to the first surface 115c, thus forming an airflow channel between the wing 130c and the through-hole 114b of the substrate 110c (see reference). Figure 2F This can increase the turbulence effect, thereby effectively reducing the temperature of the wavelength conversion module 100c.

[0084] Figure 5A This is a perspective view of a wavelength conversion module according to another embodiment of the present invention. Figure 5B yes Figure 5A A three-dimensional schematic diagram of the wavelength conversion module from another perspective. Figure 5C yes Figure 5A A three-dimensional exploded view of the wavelength conversion module. Figure 5D yes Figure 5A A cross-sectional view of the wavelength conversion module. Please refer to the following simultaneously. Figure 4A as well as Figure 5A In this embodiment, the wavelength conversion module 100d and Figure 4A Similar to the wavelength conversion module 100c, the difference is that in this embodiment, no wavelength conversion module is provided. Figure 4AThe clamping element 140c, and the assembly direction of the wing 130d is different. Figure 4A The assembly direction of the 130c wing.

[0085] For more details, please also refer to... Figure 5A , Figure 5B , Figure 5C as well as Figure 5D In this embodiment, the wing 130d is inserted into the through hole 114d of the substrate 110d from the side of the substrate 110d relative to the drive assembly 160 to close the through hole 114d. That is, the wing 130d is assembled into the through hole 1104d from bottom to top. At this time, the pivot 162 of the drive assembly 160 can be regarded as a clamping element. The adhesive layer 150d is disposed between the pivot 162 of the drive assembly 160 and the non-wavelength conversion region A2 of the substrate 110d, wherein the drive assembly 160 is fixed to the substrate 110d by means of the adhesive layer 150d. When the substrate 110d reaches a first temperature range, for example, a room temperature / low temperature state, the temperature is 20 degrees to 90 degrees, the wing 130d is inserted into the through hole 114d of the substrate 110d to close the through hole 114d. At this time, the first surface 115d of the substrate 110d and the second surface 135d of the wing 130d are located on the same plane. When the substrate 110d reaches the second temperature range, for example, a high temperature of 90 to 170 degrees Celsius, the substrate 110d and the fin 130d have different amounts of thermal expansion, thus forming an airflow channel between the fin 130d and the through-hole 114d of the substrate 110d (see reference). Figure 2F This can increase the turbulence effect, thereby effectively reducing the temperature of the wavelength conversion module 100d.

[0086] Figure 6A This is a perspective view of a wavelength conversion module according to another embodiment of the present invention. Figure 6B yes Figure 6A A three-dimensional schematic diagram of the wavelength conversion module from another perspective. Figure 6C yes Figure 6A A three-dimensional exploded view of the wavelength conversion module. Figure 6D yes Figure 6A A stereoscopic exploded view of the wavelength conversion module from another perspective. Figure 6E yes Figure 6A A cross-sectional view of the wavelength conversion module. Please refer to the following simultaneously. Figure 4A as well as Figure 6A In this embodiment, the wavelength conversion module 100e and Figure 4A Similar to the wavelength conversion module 100c, the difference lies in that: in this embodiment, the structure and size of the wing 130e are different. Figure 4A The structure and dimensions of wing 130c, and the assembly direction of wing 130e are different. Figure 4AThe assembly direction of the 130c wing.

[0087] For more details, please also refer to... Figure 6A , Figure 6B , Figure 6C , Figure 6D as well as Figure 6E In this embodiment, the wing 130e includes a first portion 132e and a second portion 134e, wherein the thickness of the first portion 132e is greater than the thickness of the second portion 134e. Specifically, the area of ​​the wing 130e is greater than the area of ​​the perforation 114e of the substrate 110e, and the wing 130e blocks airflow by closing the perforation 114e on the third surface 117 of the substrate 110e. When the substrate 110e reaches a first temperature range, for example, a room temperature / low temperature state, with a temperature between 20 and 90 degrees Celsius, the wing 130e covers the perforation 114e of the substrate 110e to close the perforation 114e. At this time, the first surface 115e of the substrate 110e and the second surface 135e of the second portion 134e of the wing 130e are located on different planes. When the substrate 110e reaches the second temperature range, for example, a high temperature of 90 to 170 degrees Celsius, the substrate 110e and the fin 130e have different amounts of thermal expansion, thus forming an airflow channel between the fin 130e and the through-hole 114e of the substrate 110e (see reference). Figure 2F This can increase the turbulence effect, thereby effectively reducing the temperature of the wavelength conversion module 100e.

[0088] In short, in the design of the wavelength conversion modules 100a, 100b, 100c, 100d, and 100e in this embodiment, the perforations 114a, 114b, 114c, 114d, and 114e of the closed substrates 110a, 110b, 110c, 110d, and 110e can be partially or completely embedded in or covered by the perforations 114a, 114b, 114c, 114d, and 114e. By dynamically and automatically adjusting the spacing between the fins 144a, 144b, 130c, 130d, and 130e and the perforations 114a, 114b, 114c, 114d, and 114e under different temperature ranges, the noise perceptible to the user can be reduced while meeting heat dissipation requirements.

[0089] In summary, the embodiments of the present invention have at least one of the following advantages or effects. In the design of the wavelength conversion module of the present invention, the fins are disposed in the non-wavelength conversion area of ​​the substrate. When the substrate reaches a first temperature range (e.g., low temperature), the fins close the perforations, and when the substrate reaches a second temperature range (e.g., high temperature), an airflow channel is formed between the fins and the perforations. That is, by utilizing the airflow channel formed between the fins and the perforations, the turbulence effect is increased, effectively reducing the temperature of the wavelength conversion module, thereby improving the reliability of the wavelength conversion module. Furthermore, since the wavelength conversion module of the present invention can dynamically and automatically adjust the spacing between the fins and the perforations at different temperature ranges, the noise perceptible to the user can be reduced while meeting heat dissipation requirements. In addition, projection devices using the wavelength conversion module of the present invention can have better projection quality and product competitiveness.

[0090] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the invention are still within the scope of this patent. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features disclosed in the invention. In addition, the abstract and title of the invention are only used to assist in patent document retrieval and are not intended to limit the scope of the invention. Furthermore, the terms "first," "second," etc., mentioned in this specification or claims are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

Claims

1. A wavelength conversion module, characterized in that, The wavelength conversion module includes a substrate, a wavelength conversion layer, and at least one wing, wherein... The substrate has a wavelength conversion region, a non-wavelength conversion region, and at least one through hole, wherein the at least one through hole penetrates the substrate and is located within the non-wavelength conversion region; The wavelength conversion layer is disposed in the wavelength conversion region of the substrate; and The at least one wing is disposed in the non-wavelength conversion region of the substrate, wherein When the substrate reaches a first temperature range, the at least one wing closes the at least one perforation, and When the substrate reaches the second temperature range, at least one airflow channel is formed between the at least one wing and the at least one perforation.

2. The wavelength conversion module according to claim 1, characterized in that, The coefficient of thermal expansion of at least one wing is different from that of the substrate.

3. The wavelength conversion module according to claim 2, characterized in that, The coefficient of thermal expansion of at least one wing is less than that of the substrate.

4. The wavelength conversion module according to claim 1, characterized in that, The wavelength conversion module also includes a clamping element, wherein The clamping element includes an integrally formed body and the at least one wing, the at least one wing being located on one side surface of the body and extending beyond the body, wherein the at least one wing is embedded in the at least one perforation to close the at least one perforation.

5. The wavelength conversion module according to claim 4, characterized in that, The substrate has a first surface, and the at least one wing has a second surface, and the first surface and the second surface are located on the same plane.

6. The wavelength conversion module according to claim 4, characterized in that, The at least one perforation is a plurality of perforations, and the plurality of perforations are interconnected with each other; the at least one wing is a plurality of winglets, and the plurality of winglets extend outward from the body along different radial directions of the body, and the plurality of winglets are connected together with each other.

7. The wavelength conversion module according to claim 4, characterized in that, The wavelength conversion module also includes an adhesive layer, wherein The adhesive layer is disposed between the body of the clamping element and the non-wavelength conversion region of the substrate, wherein the clamping element is fixed to the substrate by means of the adhesive layer.

8. The wavelength conversion module according to claim 1, characterized in that, The wavelength conversion module also includes a clamping element, wherein The clamping element includes an integrally formed body and the at least one wing, the at least one wing being connected to the edge of the body and located on a different plane from the body, wherein the at least one wing is embedded in the at least one perforation to close the at least one perforation.

9. The wavelength conversion module according to claim 8, characterized in that, The substrate has a first surface, and the at least one wing has a second surface, and the first surface and the second surface are located on the same plane.

10. The wavelength conversion module according to claim 8, characterized in that, The at least one perforation is a plurality of perforations, and the plurality of perforations are separated from each other; the at least one wing is a plurality of winglets, and the plurality of winglets extend along different radial directions of the body, and the plurality of winglets are separated from each other.

11. The wavelength conversion module according to claim 8, characterized in that, The wavelength conversion module also includes an adhesive layer. The adhesive layer is disposed between the body of the clamping element and the non-wavelength conversion region of the substrate, wherein the clamping element is fixed to the substrate by means of the adhesive layer.

12. The wavelength conversion module according to claim 1, characterized in that, The wavelength conversion module also includes a clamping element and an adhesive layer, wherein The clamping element is disposed in the non-wavelength conversion region of the substrate and covers a portion of the at least one wing; the clamping element is coaxially disposed with the substrate; and The adhesive layer is disposed between the clamping element and the non-wavelength conversion region of the substrate, wherein the clamping element is fixed to the substrate by means of the adhesive layer.

13. The wavelength conversion module according to claim 12, characterized in that, The material of at least one wing is different from the material of the clamping element and the substrate.

14. The wavelength conversion module according to claim 1, characterized in that, The wavelength conversion module also includes a driving component and an adhesive layer, wherein The drive assembly is connected to the substrate to drive the substrate to rotate about the drive assembly's pivot axis, wherein at least one flap is inserted from the side of the substrate opposite to the drive assembly into the at least one through hole to close the at least one through hole; and The adhesive layer is disposed between the rotating shaft of the driving component and the non-wavelength conversion region of the substrate, wherein the driving component is fixed to the substrate by means of the adhesive layer.

15. The wavelength conversion module according to claim 1, characterized in that, The substrate has a first surface, and the at least one wing has a second surface, wherein the first surface and the second surface are located on different planes, and the at least one wing covers the at least one perforation to close the at least one perforation.

16. The wavelength conversion module according to claim 15, characterized in that, The area of ​​the at least one wing is greater than the area of ​​the at least one perforation.

17. The wavelength conversion module according to claim 1, characterized in that, The substrate includes multiple turbulence-inducing portions that protrude from or are recessed into the non-wavelength conversion region.

18. The wavelength conversion module according to claim 1, characterized in that, The material of at least one wing includes metal, non-metal, or a composite material of metal and non-metal.

19. The wavelength conversion module according to claim 1, characterized in that, The substrate is made of metal, non-metal, or a composite material of metal and non-metal.

20. A projection device, characterized in that, The projection device includes an illumination system, a light valve, and a projection lens, wherein... The lighting system is used to provide an illumination beam, and the lighting system includes a light source module and a wavelength conversion module, wherein... The light source module is used to provide an excitation beam; and The wavelength conversion module is disposed on the transmission path of the excitation beam to convert the excitation beam into the illumination beam. The wavelength conversion module includes a substrate, a wavelength conversion layer, and at least one wing. The substrate has a wavelength conversion region, a non-wavelength conversion region, and at least one through hole, wherein the at least one through hole penetrates the substrate and is located within the non-wavelength conversion region; The wavelength conversion layer is disposed in the wavelength conversion region of the substrate; and The at least one wing is disposed in the non-wavelength conversion region of the substrate, wherein when the substrate reaches a first temperature range, the at least one wing closes the at least one through-hole. When the substrate reaches the second temperature range, at least one airflow channel is formed between the at least one wing and the at least one perforation; The light valve is disposed in the transmission path of the illumination beam to convert the illumination beam into an image beam; and The projection lens is positioned on the transmission path of the image beam to project the image beam out of the projection device.

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