Display device

Abstract

A display device includes a display panel for reproducing an image or a video, a metal plate disposed at a rear of the display panel, a printed circuit board disposed at a rear of the metal plate and electrically connected to the display panel, and a chip on film having one end electrically connected to the display panel and the other end electrically connected to the printed circuit board, wherein a portion of the chip on film is bendable, and the metal plate includes a bending guide formed at a position corresponding to the bendable portion of the chip on film and guiding a bending shape of the chip on film. In the display device according to the disclosure, the bending guide disposed in a portion in which the chip on film is bent can prevent a curvature of the chip on film from deviating from a designed curvature range, thereby suppressing excessive bending of the chip on film. For this, the chip on film can be effectively suppressed from being excessively bent and damaged.

Description

Technical Field

[0001] This disclosure relates to display devices, and more specifically, to display devices having a structure that effectively guides the bending of chips on a film. Background Technology

[0002] The content described in this background section is only to provide background information about this disclosure and does not constitute prior art.

[0003] As we enter the mature information age, display devices that visually represent electrical information signals have developed rapidly. In response, various display devices with excellent performance, thinness, light weight, and low power consumption have been developed.

[0004] Display devices include liquid crystal displays (LCDs), quantum dot (QD) displays, field emission displays (FEDs), electrowetting displays (EWDs), and organic light-emitting diode (OLEDs).

[0005] The display device has been miniaturized, making it portable for users. It has been developed for installation on mobile devices such as vehicles. Therefore, users can more conveniently use the display device in their vehicles. Summary of the Invention

[0006] Display devices may include chips on film (COF). COF may have a built-in driver for driving the display device. COF may be made of a thin, flexible material. Therefore, COF is highly effective in increasing assembly convenience and reducing the space occupied by components.

[0007] Chip-on-film (COP) technology allows for electrical connection between the display panel and the printed circuit board. To achieve this, the COP can be configured to be bent in a portion adjacent to the edge of the display panel. Therefore, the COP can protrude from the bottom of the display panel.

[0008] The length by which the chip on the film protrudes from the bottom of the display panel (i.e., the protrusion length) is the length from the bottom of the display panel to the bottom of the flexible portion of the chip on the film.

[0009] The protruding length of the on-film chip is the length of the portion of the on-film chip that protrudes from the bottom of the display panel. Therefore, when a user views the front of the display panel, the portion corresponding to the protruding length enters the user's field of vision, which may reduce the aesthetics of the display device.

[0010] Therefore, in order to enhance the aesthetics of the display device, the portion of the cover glass corresponding to the protruding length of the chip on the film is made invisible by using black ink or the like, and this portion becomes the bezel.

[0011] As the bezel area increases, the aesthetics of the display device may decrease, and unnecessary areas of the display device may increase. Therefore, it is necessary to reduce the protruding length of the chip on the film to reduce the bezel area.

[0012] To reduce the protruding length of the chip on the film, the chip may be excessively bent. When the chip on the film is excessively bent, it may be damaged, which may lead to malfunction or failure of the display device.

[0013] In one example, when the display device is mounted on a movable device such as a vehicle, an impact exerted from the outside by the movement may be transmitted to the display device.

[0014] The display device may deform due to external impact, or in severe cases, it may be damaged by the impact. In cases of severe damage, fragments of the display device may injure users in the vehicle.

[0015] Even if the display device is not damaged after being subjected to an external impact, some of the components that make up the display device may be damaged by the external impact, which may lead to the failure or malfunction of the display device.

[0016] In particular, the impact of external shocks may be greater in display devices with thin structures or flexible, curved components.

[0017] Because wafers on membranes are formed to be thin, they are susceptible to external impacts. Such impacts can damage the wafers. Therefore, there is a need to develop technologies that can suppress damage to wafers on membranes caused by external impacts.

[0018] Therefore, the purpose of this disclosure is to provide a display device having a structure capable of suppressing excessive bending of the chip on the film.

[0019] Additionally, an optional objective of this disclosure is to provide a display device having a structure that can effectively respond to external impacts.

[0020] Additionally, an optional objective of this disclosure is to provide a display device having a structure that can suppress damage to the chip on the film due to external impact.

[0021] The purpose of this disclosure is not limited to those mentioned above. Other purposes and advantages not mentioned in this disclosure may be understood based on the following description and may be more clearly understood based on embodiments of this disclosure. Furthermore, it will be readily understood that the purposes and advantages of this disclosure may be achieved using the means set forth in the claims and combinations thereof.

[0022] One embodiment of the display device may include: a display panel for reproducing images or videos; a metal plate disposed at the rear of the display panel; a printed circuit board disposed at the rear of the metal plate and electrically connected to the display panel; and a chip on film (COF) having one end electrically connected to the display panel and the other end electrically connected to the printed circuit board, wherein a portion of the COF is flexible, and the metal plate includes a bending guide formed at a position corresponding to the flexible portion of the chip on film and guiding the bending shape of the chip on film.

[0023] Optionally, one embodiment of the display device may further include: a cover glass disposed at the frontmost portion of the display device; an adhesive layer disposed at the rear of the cover glass; and a polarizing portion disposed between the adhesive layer and the display panel.

[0024] Alternatively, one embodiment of the display device may further include a guide retainer disposed between a metal plate and a printed circuit board, with the printed circuit board mounted on one side of the guide retainer.

[0025] In the display device according to this disclosure, a bending guide provided in the bent portion of the chip on the film prevents the curvature of the chip on the film from deviating from the designed curvature range, thereby suppressing excessive bending of the chip on the film. Therefore, excessive bending and damage to the chip on the film can be effectively suppressed.

[0026] Additionally, in the display device according to this disclosure, for example, a bending guide may be formed in a portion corresponding to the driver chip, and may include clearance holes for preventing contact between the driver chip and the bending guide.

[0027] When the chip-on-film assembly is completed and mounted onto the display device, the driver chip mounted on the chip-on-film can be placed in the clearance holes of the bending guide. This structure prevents the driver chip from contacting the bending guide and from being damaged by external forces.

[0028] Additionally, in the display device according to this disclosure, the bending guide may optionally include an elastically deformable reinforcement that can elastically deform upon being subjected to an external impact to cushion the impact. Therefore, a bending guide positioned in contact with or close to the chip on the film can cushion the impact upon being subjected to an external impact, thereby effectively preventing the chip on the film from colliding with the bending guide and being damaged by the external impact.

[0029] Furthermore, when an external impact is applied to the bending guide, the chip on the membrane can move together with the elastic deformation reinforcement while it is elastically deforming, which can reduce the external impact applied to the chip on the membrane.

[0030] Furthermore, a variant embodiment of the display device may include: a display panel; a printed circuit board disposed on the rear side of the display panel; a chip on film having one end electrically connected to the display panel and the other end electrically connected to the printed circuit board; and a bending guide disposed between the display panel and the printed circuit board at a position corresponding to the bendable portion of the chip on film, and restricting the bending of the chip on film.

[0031] The effects of this disclosure are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art based on the following description. Attached Figure Description

[0032] Figure 1 This is a front view of a display device according to one embodiment.

[0033] Figure 2 This is a rear view of a display device according to one embodiment.

[0034] Figure 3 This is a rear perspective view of a display device according to one embodiment.

[0035] Figure 4 This is an exploded perspective view of a display device according to one embodiment.

[0036] Figure 5 This is a partial perspective view of a display device according to one embodiment.

[0037] Figure 6 This is a partial cross-sectional view of a display device according to one embodiment.

[0038] Figure 7 yes Figure 5 A magnified view of a portion of it.

[0039] Figure 8A This is a cross-sectional view showing a bending guide according to one embodiment.

[0040] Figure 8B This is a cross-sectional view showing a bending guide according to another embodiment.

[0041] Figure 8C This is a cross-sectional view showing a bending guide according to another embodiment.

[0042] Figure 8D This is a cross-sectional view showing a bending guide according to another embodiment.

[0043] Figure 8E This is a cross-sectional view showing a bending guide according to another embodiment.

[0044] Figure 9 This is a perspective view used to illustrate a curved guide according to another embodiment.

[0045] Figure 10 It is shown Figure 9 A view showing the arrangement between the curved guide and the driver chip.

[0046] Figure 11 It is shown Figure 9 A cross-sectional view of a portion of the curved guide shown.

[0047] Figure 12 This is a perspective view used to illustrate a curved guide according to another embodiment.

[0048] Figure 13 It is shown Figure 12 A view showing the arrangement of the curved guide and the chip on the membrane.

[0049] Figure 14 yes Figure 13 A cross-sectional view of part AA' in the diagram. Detailed Implementation

[0050] The advantages and features of this disclosure, as well as the methods for achieving these advantages and features, will be described later in conjunction with the appendix. Figure 1 The embodiments described in detail below will become apparent. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various different forms. Therefore, these embodiments are set forth only to make this disclosure complete and to fully inform those skilled in the art to which this disclosure pertains, and this disclosure is limited only by the scope of the claims.

[0051] The shapes, dimensions, ratios, angles, numbers, etc., disclosed in the accompanying drawings used to describe embodiments of this disclosure are exemplary, and this disclosure is not limited thereto. Throughout this document, the same reference numerals refer to the same elements. Furthermore, for the sake of simplicity, descriptions and details of well-known steps and elements have been omitted. Moreover, numerous specific details are set forth in the following detailed description of this disclosure to provide a thorough understanding of it. However, it should be understood that this disclosure can be practiced without these specific details. In other instances, well-known methods, processes, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of this disclosure.

[0052] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, unless the context clearly indicates otherwise, the singular constructions “a” and “an” are intended to include the plural constructions as well. It should also be understood that, when used in this specification, the terms “comprise,” “comprising,” “include,” and “including” specify the presence of the stated feature, integer, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, operations, elements, components, and / or portions thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the items listed herein. Expressions such as “at least one” may modify the entire list of elements when preceding it, and may not modify individual elements in the list. Errors or tolerances may occur in the interpretation of numerical values, even without explicit description.

[0053] Furthermore, it should be understood that when a first element or layer is referred to as existing "on" a second element or layer, the first element may be directly disposed on the second element or indirectly disposed on the second element, wherein a third element or layer is disposed between the first element or layer and the second element or layer. It should be understood that when an element or layer is referred to as being "connected to" or "coupled to" another element or layer, it may be directly on the other element or layer, directly connected to or coupled to the other element or layer, or one or more intermediate elements or layers may exist. Additionally, it should be understood that when an element or layer is referred to as being "between" two elements or layers, it may be the only element or layer between the two elements or layers, or one or more intermediate elements or layers may exist.

[0054] Furthermore, as used herein, when a layer, membrane, region, plate, etc., is disposed "on" or "on top" of another layer, membrane, region, plate, etc., the former can directly contact the latter, or another layer, membrane, region, plate, etc., can be disposed between the former and the latter. As used herein, when a layer, membrane, region, plate, etc., is directly disposed "on" or "on top" of another layer, membrane, region, plate, etc., the former directly contacts the latter, and no other layer, membrane, region, plate, etc., is disposed between the former and the latter. Furthermore, as used herein, when a layer, membrane, region, plate, etc., is disposed "below" or "under" another layer, membrane, region, plate, etc., the former can directly contact the latter, or another layer, membrane, region, plate, etc., can be disposed between the former and the latter. As used herein, when a layer, membrane, region, plate, etc., is directly disposed "below" or "under" another layer, membrane, region, plate, etc., the former directly contacts the latter, and no other layer, membrane, region, plate, etc., is disposed between the former and the latter.

[0055] In descriptions of temporal relationships, such as those between two events described by terms like "after," "following," or "before," another event may occur between the two events unless it is indicated that the event is "directly after," "directly following," or "directly before."

[0056] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the spirit and scope of this disclosure, the first element, component, region, layer, or part described below may be referred to as the second element, component, region, layer, or part.

[0057] Features of the various embodiments of this disclosure can be combined in part or in whole with each other, and can be technically related to or operable on each other. Embodiments can be implemented independently of each other, or can be implemented together in an associated relationship.

[0058] When interpreting numerical values, unless there is a separate, explicit description, the value is interpreted to include a range of error.

[0059] It should be understood that when a component or layer is referred to as being "connected to" or "coupled to" another component or layer, it can be directly connected to or coupled to the other component or layer, or there can be one or more intermediate components or layers. Additionally, it should be understood that when a component or layer is referred to as being "between" two components or layers, it can be the only component or layer between the two components or layers, or there can be one or more intermediate components or layers.

[0060] Features of the various embodiments of this disclosure can be combined in part or in whole with each other, and can be technically related to or operable on each other. Embodiments can be implemented independently of each other, or can be implemented together in an associated relationship.

[0061] Unless otherwise defined, all terms used herein, including technical and scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept pertains. It should also be understood that terms such as those defined in common dictionaries shall be interpreted as having the meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0062] Figure 1 This is a front view of a display device according to one embodiment. Figure 2This is a rear view of a display device according to one embodiment. Figure 3 This is a rear perspective view of a display device according to one embodiment. Figure 4 This is an exploded perspective view of a display device according to one embodiment.

[0063] The display device according to the embodiments can be installed in the cockpit of a vehicle, for example, to provide the driver and passengers of the vehicle with images or videos required for driving. However, this disclosure is not limited to this, and the display device can be used by a user without being installed in the vehicle. Hereinafter, for example, a display device installed in a vehicle will be described.

[0064] The display device according to the embodiment may include a display panel 100, a metal plate 200, a printed circuit board 300, and a chip-on-film 400.

[0065] Images or videos can be reproduced on display panel 100. The reproduced images or videos can be navigation information needed for driving, images taken by a camera device installed on the vehicle, or various other content needed by the driver or passengers.

[0066] The metal plate 200 can be disposed at the rear of the display panel 100. The metal plate 200 can be formed thin to manufacture a thin display panel. The metal plate 200 can be used as a heat sink to cool the display panel 100 by dissipating the heat generated from the display panel 100 to the outside.

[0067] The metal plate 200 can be made of a material such as aluminum, which is easy to manufacture by sheet metal processing, has a high heat transfer rate, and has excellent electrical resistance. However, this disclosure is not limited thereto.

[0068] In one example, a back plate may be provided between the display panel 100 and the metal plate 200. The back plate may be attached to the back of the display panel 100 to prevent the display panel 100 from bending and being damaged. That is, the back plate may be used to enhance the rigidity of the display panel 100.

[0069] For example, the backplate may be formed in the shape of a film and attached to the display panel 100. However, this disclosure is not limited thereto.

[0070] The printed circuit board 300 can be disposed at the rear of the metal plate 200 and can be electrically connected to the display panel 100. The printed circuit board 300 can be mounted on the guide retainer 540 and can be electrically connected to the display panel 100.

[0071] The printed circuit board 300 may include a camera device, means for communicating with an external device (e.g., the main control module of a vehicle), and means for driving the display panel 100 to reproduce an image or video. The printed circuit board 300 may include circuitry and may include a variety of other active and passive components.

[0072] The chip-on-film (COF) 400 can be configured such that one end is electrically connected to the display panel 100, the other end is electrically connected to the printed circuit board 300, and a portion thereof is flexible.

[0073] One end of the on-film chip 400 can be electrically connected to the display panel 100, and the other end can be electrically connected to the printed circuit board 300. The on-film chip 400 can be bent to surround the guide retainer 540.

[0074] The chip-on-film 400 can be formed thin and can be made of a flexible material so that it is bendable. The chip-on-film 400 can be electrically connected to the display panel 100 and the printed circuit board 300. The chip-on-film 400 can include various active and passive components and can have driving circuitry for driving the display panel 100.

[0075] The driving circuitry for driving the display panel 100 can extend on both the printed circuit board 300 and the chip-on-film 400. The chip-on-film 400 may include a driving chip 410 for driving the display panel 100 (see [link]). Figure 7 That is, the driver chip 410, which forms at least a part of the driving circuit of the display panel 100 (see...). Figure 7 It can be set on the on-film chip 400.

[0076] Multiple on-membrane chips 400 can be configured. The on-membrane chips 400 can be spaced apart from each other.

[0077] The display device according to an embodiment may include a cover glass 510, an adhesive layer 520, a polarizing portion 530, and a guide retainer 540. The adhesive layer 520 and the polarizing portion 530 may be formed thin to manufacture a thin display panel.

[0078] The cover glass 510 can be disposed at the frontmost part of the display device. The cover glass 510 can be disposed in front of the display panel 100 to protect the display panel 100. The cover glass 510 can be made of a transparent material so that light shining from the cover glass 510 can pass through the cover glass 510.

[0079] An adhesive layer 520 may be disposed on the rear of the cover glass 510. One side of the adhesive layer 520 may be adhered to the cover glass 510 and the other side may be adhered to the polarizing portion 530 to adhere the polarizing portion 530 to the cover glass 510.

[0080] The polarizing portion 530 can be disposed between the adhesive layer 520 and the display panel 100. The polarizing portion 530 can be formed in the shape of a thin film and can be attached to the display panel 100. Therefore, the display panel 100 can be attached to the cover glass 510 through the adhesive layer 520 and the polarizing portion 530.

[0081] The polarizing part 530 can be disposed on the front side of the display panel 100 to polarize the light irradiated from the display panel 100, thereby providing the user with a clear image or video.

[0082] A guide retainer 540 may be disposed between the metal plate 200 and the printed circuit board 300, and the printed circuit board 300 may be mounted on one side of the guide retainer 540. The printed circuit board 300 may be mounted on the guide retainer 540 and may be electrically connected to the display panel 100. The guide retainer 540 may be mounted on the metal plate 200, and the printed circuit board 300 may be mounted on the back side of the guide retainer 540.

[0083] The printed circuit board 300 can be mounted on the back of the guide retainer 540. The display panel 100 can be disposed on the front of the guide retainer 540. Therefore, in order to electrically connect the chip on film 400 to the printed circuit board 300 and the display panel 100, the two ends of the chip on film 400 should be coupled to the printed circuit board 300 and the display panel 100, respectively.

[0084] Therefore, the on-film chip 400 must extend beyond the metal plate 200 located between the guide holder 540 and the display panel 100, and may also extend beyond the guide holder 540.

[0085] Because of this structure, when the display device is assembled, the on-film chip 400 can be configured to extend over the metal plate 200 and the guide holder 540 at a position below the lower end of the guide holder 540.

[0086] When viewing the lower ends of the metal plate 200 and the guide retainer 540, the lower end of the metal plate 200 can be positioned at its lowest point. This is because the length of the metal plate 200 in the downward direction is greater than the length of the guide retainer 540 in the downward direction.

[0087] Therefore, the chip-on-film 400 can be bent at the portion corresponding to the lower end of the metal plate 200, which is the portion extending beyond the metal plate 200 and the guide retainer 540. Furthermore, due to this structure, the chip-on-film 400 can be configured to protrude from the lower end of the metal plate 200.

[0088] In one example, the lower end of the metal plate 200 and the lower end of the display panel 100 can be placed in substantially the same or similar positions. Therefore, the length by which the on-film chip 400 protrudes from the lower end of the metal plate 200 can be similar to the length by which it protrudes from the lower end of the display panel 100.

[0089] The length by which the on-film chip 400 protrudes from the lower end of the display panel 100 (i.e., the protrusion length) is the length from the lower end of the display panel 100 to the lower end of the flexible portion of the on-film chip 400.

[0090] The protruding length of the on-film chip 400 is the length of the portion exposed from the bottom of the display panel 100. Therefore, when a user views the front of the display panel 100, the portion corresponding to the protruding length enters the user's field of vision, which may reduce the aesthetics of the display device.

[0091] Therefore, in order to enhance the aesthetics of the display device, the portion of the cover glass 510 corresponding to the protruding length of the on-film chip 400 is made invisible by using black ink or the like, and this portion becomes the bezel.

[0092] As the bezel area increases, the aesthetics of the display device may decrease, and unnecessary areas of the display device may increase. Therefore, it is necessary to reduce the protruding length of the on-film chip 400 to reduce the bezel area.

[0093] To reduce the protruding length of the chip-on-film 400, the chip-on-film 400 can be configured to be curved, extending beyond the guide holder 540 at a position very close to the lower end of the guide holder 540. For this purpose, the flexible portion of the chip-on-film 400 can be positioned vertically very close to the lower end of the display panel 100.

[0094] When the chip on film 400 is excessively bent to reduce the protruding length of the chip on film 400, the thin chip on film 400 may be damaged, which may lead to malfunction or failure of the display device.

[0095] Furthermore, during assembly, the on-film chip 400 may be excessively bent, even though it is not expected, and may therefore be damaged.

[0096] Therefore, it is necessary to suppress damage to the chip-on-film 400 due to excessive bending by enabling the chip-on-film 400 to bend at a designed curvature. For this purpose, in an embodiment, the metal plate 200 may have a bending guide 210. The bending guide 210 will be described in detail below with reference to the accompanying drawings.

[0097] Note that in the display device (not shown) according to a variant embodiment, the metal plate 200 may be omitted. In the case where the metal plate 200 is omitted (but not limited to), the printed circuit board 300 may be disposed on the rear side of the display panel 100, and a bending guide 210 (which may be formed separately, for example) may be disposed between the display panel 100 and the printed circuit board 300 at a position corresponding to the bendable portion of the chip on film 400, and this bending guide may restrict the bending of the chip on film 400. As an example, such a bending guide may protrude from one end of the back of the display panel, and at least a portion of the bending guide may be in a bent shape. The following description of the display device and its components of various embodiments can be similarly applied to this variant embodiment.

[0098] Figure 5 This is a partial perspective view of a display device according to one embodiment. Figure 6 This is a partial cross-sectional view of a display device according to one embodiment. Figure 7 yes Figure 5 A magnified view of a portion of it.

[0099] The metal plate 200 may include a bending guide 210 formed at a position corresponding to the bendable portion of the chip on film 400 and guiding the chip on film 400 into a bent shape.

[0100] The on-film chip 400 can be configured to be spaced apart from the end of the metal plate 200 to span the metal plate 200. The bending guide 210 can protrude from this end of the metal plate 200 and can be formed in a shape that is at least partially bent.

[0101] like Figure 6 As shown, the bending guide 210 can protrude from the lower end of the metal plate 200 and can be bent toward the rear of the display device. The on-film chip 400 can be bent to surround the outside of the bending guide 210.

[0102] In this embodiment, the bending guide 210 may be integrally formed with the metal plate 200, but this disclosure is not limited thereto; that is, the bending guide 210 may be formed separately. For example, the bending guide 210 may be formed by forming a portion protruding from the end of the metal plate 200 and bending the protruding portion. The bending guide 210 may be formed as thin as the metal plate 200 and may be formed into a bent shape.

[0103] The bending guide 210 can be formed by bending it with its designed curvature. The bendable portion of the chip-on-film 400 can be guided by the bending guide 210 to bend into a designed curvature.

[0104] When the chip on the membrane 400 is bent, its bending curvature can be limited by the bending guide 210. Therefore, the radius of curvature of the chip on the membrane 400 will not become smaller than the range determined by the bending guide 210.

[0105] When the chip on film 400 is bent during the assembly of the display device, the chip on film 400 can be prevented from bending excessively when one side of the chip on film 400 contacts the bending guide 210.

[0106] In this embodiment, the bending guide 210 disposed at the bendable portion of the chip-on-film 400 can suppress excessive bending of the chip-on-film 400 by preventing the curvature of the chip-on-film 400 from deviating from the design range. Therefore, excessive bending and damage to the chip-on-film 400 can be effectively suppressed.

[0107] The on-film chip 400 may include a plurality of on-film chips, and the on-film chips 400 may be arranged to be spaced apart from each other in the lateral direction of the display device. The bending guide 210 may include a plurality of bending guides.

[0108] The bending guide 210 can be disposed at the end of the metal plate 200, and the number of bending guides 210 can correspond to the number of on-film chips 400. The bending guides 210 can be arranged to be spaced apart from each other in the lateral direction of the display device. The bending guides 210 can be disposed at positions corresponding to the on-film chips 400 in the lateral direction of the display device.

[0109] At least a portion of the chip on membrane 400 may be configured to contact the bending guide 210. Alternatively, at least a portion of the chip on membrane 400 may be configured to remain spaced apart from the bending guide 210.

[0110] For example, the chip-on-film 400 can be configured to be spaced apart from and not in contact with the bending guide 210. In this case, since the bendable portion of the chip-on-film 400 maintains a curvature greater than the designed minimum curvature, the chip-on-film 400 is less likely to be damaged by excessive bending.

[0111] For example, the chip-on-film 400 can be configured such that a large portion of one side of it contacts one side of the bending guide 210. Even in this case, the chip-on-film 400 is unlikely to be damaged by excessive bending because the flexible portion of the chip-on-film 400 maintains a curvature equal to or greater than the designed minimum curvature.

[0112] In the following description, various embodiments of the bending guide 210 will be described in detail with reference to the accompanying drawings.

[0113] Figure 8AThis is a cross-sectional view showing a bending guide 210 according to one embodiment. Figure 8A As shown, the bending guide 210 according to the embodiment may have a curved cross-section, that is, a cross-section having the following shape: the shape includes a curved portion. As a whole, the bending guide 210 may be formed into the shape of a closed curve with an irregular curvature.

[0114] Figure 8B This is a cross-sectional view showing a bending guide 210 according to another embodiment. Figure 8B As shown, the bending guide 210 may have a circular cross-section.

[0115] Since the chip on film 400 is bent by being guided by the circular shape of the bending guide 210, the chip on film 400 can be bent to have a substantially constant curvature in the portion corresponding to the bending guide 210.

[0116] Figure 8C This is a cross-sectional view showing a bending guide 210 according to another embodiment. Figure 8C As shown, the bending guide 210 can have an arcuate cross-section. In this case, the arcuate shape can be formed as a shape that bulges outward from the lower end of the metal plate 200.

[0117] Since the chip on film 400 is bent by being guided by the arcuate shape of the bending guide 210, the chip on film 400 can be bent to have a substantially constant curvature in the portion corresponding to the bending guide 210.

[0118] Figure 8D This is a cross-sectional view showing a bending guide 210 according to another embodiment. Figure 8D As shown, the bending guide 210 may have a cross-section having a shape including a bent portion 210a and a straight portion 210b.

[0119] In the bending guide 210, a bent portion 210a with a shape protruding outward from the lower end of the metal plate 200 can be formed. Since the chip on film 400 is bent by the bending guide 210 through the bent portion 210a, the chip on film 400 can have a bendable portion with a substantially bent shape.

[0120] The bending guide 210 can be formed to include: a first straight portion 210b connected to a bent portion 210a protruding outward from the lower end of the metal plate 200, and a second straight portion 210b bent from the first straight portion 210b. In this respect, at least a portion of the bending guide 210 in the straight portion 210b, which is perpendicular to the metal plate 200 in its length direction, can contact the chip on the film 400.

[0121] In another example, to avoid forming sharp edges in the curved portion that connects the first straight portion 210b and the second straight portion 210b to each other, a curved portion 210a may be formed.

[0122] Figure 8E This is a cross-sectional view showing a bending guide 210 according to another embodiment. Figure 8E As shown, the bending guide 210 may have a polygonal cross-section.

[0123] However, in the case where the bending guide 210 has a polygonal cross section, in order to prevent the chip on the film 400 from being damaged by the edge of the bending guide 210, it is necessary to set the chip on the film 400 at a position slightly spaced from the bending guide 210.

[0124] Figure 9 This is a perspective view used to illustrate a curved guide 210 according to another embodiment. Figure 10 It is shown Figure 9 A view showing the arrangement between the curved guide 210 and the drive chip 410. Figure 11 It is shown Figure 9 A cross-sectional view of a portion of the bending guide 210 shown.

[0125] The on-film chip 400 may include a driver chip 410 for driving the display panel 100. Since such a driver chip 410 has a constant volume, when the on-film chip 400 is bent, the on-film chip 400 may come into contact with the bending guide 210 at the portion where the driver chip 410 is located. Therefore, a structure is needed to suppress damage to the driver chip 410 of the on-film chip 400 due to contact with the bending guide 210.

[0126] Therefore, the bending guide 210 can be formed in the portion corresponding to the driver chip 410, and can have a clearance hole 211 defined therein to prevent contact between the driver chip 410 and the bending guide 210. The clearance hole 211 can be defined in a shape corresponding to the shape of the driver chip 410.

[0127] When the chip-on-film assembly 400 is completed and assembled into the display device, the driver chip 410 disposed on the chip-on-film assembly 400 is placed in the clearance hole 211 of the bending guide 210. Due to this structure, contact between the driver chip 410 and the bending guide 210 and damage due to external forces can be prevented.

[0128] Figure 12 This is a perspective view used to illustrate a curved guide 210 according to another embodiment. Figure 13 It is shown Figure 12A view showing the arrangement relationship between the curved guide 210 and the chip on the membrane 400. Figure 14 yes Figure 13 A cross-sectional view of part AA' in the diagram.

[0129] When the display device is subjected to an external impact, the on-film chip 400 may move due to the impact. At this point, the on-film chip 400 comes into contact with the bending guide 210. If the bending guide 210 does not cushion the external impact, the on-film chip 400 may be damaged upon collision with the bending guide 210.

[0130] Therefore, a bending guide 210 with a structure for cushioning external impacts is needed. Thus, the bending guide 210 according to the embodiment may include an elastic deformation reinforcement 212, which increases the elastic deformation of the bending guide 210 in response to external impacts by reducing the area of ​​the bending guide 210 in the length direction (which is, for example, but not limited to, the lateral direction corresponding to the display panel).

[0131] When an external impact is applied to the bending guide 210, the elastic deformation reinforcement 212 can elastically deform to buffer the external impact applied to the bending guide 210. Therefore, even when the on-film chip 400 placed at the position corresponding to the bending guide 210 collides with the bending guide 210 due to an external impact, the impact applied from the bending guide 210 to the on-film chip 400 can be reduced.

[0132] In one example, when the chip on membrane 400 is placed in contact with the bending guide 210, when an external impact is applied to the bending guide 210, the chip on membrane 400 moves together with the elastic deformation reinforcement 212 as the elastic deformation reinforcement 212 elastically deforms, thereby mitigating the external impact applied to the chip on membrane 400.

[0133] An elastically deformable reinforcement 212 can be formed by defining a plurality of slit holes 212a spaced apart from each other along the length of the bending guide 210. The plurality of slit holes 212a can reduce the volume of a portion of the bending guide 210.

[0134] As the number of slit holes 212a increases, the cushioning effect increases, but the rigidity and durability of the bending guide 210 may decrease. Therefore, taking this into consideration, it is necessary to design the elastic deformation reinforcement 212 to have an appropriate number of slit holes 212a.

[0135] Therefore, when an external impact is applied, the elastic deformation reinforcement 212, which has a smaller volume than other parts of the bending guide 210, can more easily undergo elastic deformation than other parts, and can buffer the impact applied to the bending guide 210 through elastic deformation.

[0136] In this embodiment, the elastically deformable reinforcement 212 can elastically deform upon being subjected to an external impact to cushion the impact. Therefore, the curved guide 210, positioned in contact with or near the on-film chip 400, cushions the external impact upon such an event, effectively preventing the on-film chip 400 from colliding with the curved guide 210 and being damaged by the external impact.

[0137] Furthermore, when an external impact is applied to the bending guide 210, the chip on the membrane 400 moves together with the elastic deformation reinforcement 212 as it elastically deforms, thereby reducing the external impact applied to the chip on the membrane 400.

[0138] The display device according to embodiments of the present disclosure can be described as follows.

[0139] One aspect of this disclosure provides a display device comprising: a display panel for reproducing an image or video; a metal plate disposed at the rear of the display panel; a printed circuit board disposed at the rear of the metal plate and electrically connected to the display panel; and a chip on film (COF) having one end electrically connected to the display panel and the other end electrically connected to the printed circuit board, wherein a portion of the COF is bendable, and wherein the metal plate includes a bending guide formed at a position corresponding to the bendable portion of the chip on film and guiding the bending shape of the chip on film.

[0140] In one implementation, the chip on film is positioned spaced apart from and across the end of a metal plate, and a bending guide protrudes from that end of the metal plate and is formed such that at least a portion of it is bent.

[0141] In one implementation, multiple chips on a membrane are provided, and multiple bending guides are provided at the ends of a metal plate, with the number of bending guides corresponding to the number of chips on a membrane.

[0142] In one implementation, the chip on the membrane is configured such that at least a portion of it is in contact with the bending guide.

[0143] In one implementation, at least a portion of the chip on the membrane remains spaced apart from the bending guide.

[0144] In one implementation, the bending guide has a cross-section with the following shape: the shape includes a bending portion.

[0145] In one implementation, the bending guide has a circular or arc-shaped cross-section.

[0146] In one implementation, the bending guide has a polygonal cross-section.

[0147] In one implementation, the bending guide has a cross-section that includes both a curved portion and a straight portion.

[0148] In one implementation, the chip-on-film includes a driver chip for driving a display panel, and the bending guide includes a clearance hole defined in a portion corresponding to the driver chip, the clearance hole being used to prevent contact between the driver chip and the bending guide.

[0149] In one implementation, the bending guide includes an elastic deformation reinforcement that increases the bending guide's elastic deformation resistance to external impacts by reducing the area of ​​the bending guide along its length.

[0150] In one implementation, an elastically deformable reinforcement is formed by defining a plurality of slit holes spaced apart from each other along the length of the bending guide.

[0151] In one implementation, the display device further includes: a cover glass disposed at the frontmost part of the display device; an adhesive layer disposed at the rear of the cover glass; and a polarizing portion disposed between the adhesive layer and the display panel.

[0152] In one implementation, the display device further includes a guide retainer disposed between a metal plate and a printed circuit board, wherein the printed circuit board is mounted on one side of the guide retainer.

[0153] The scope of this disclosure should be interpreted as the scope of the claims, and all technical concepts within the scope of the claims should be interpreted as including within the scope of this disclosure. Although embodiments of this disclosure have been described in more detail with reference to the accompanying drawings, this disclosure is not necessarily limited to these embodiments. This disclosure can be implemented in various modifications without departing from the scope of the technical concept of this disclosure. Therefore, the embodiments disclosed in this disclosure are not intended to limit the technical concept of this disclosure, but are intended to describe this disclosure. The scope of the technical concept of this disclosure is not limited by the embodiments. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects. The scope of this disclosure should be interpreted as the claims, and all technical concepts within the scope of this disclosure should be interpreted as including within the scope of this disclosure.

Claims

1. A display device, comprising: Display panel, used to reproduce images or videos; A metal plate is disposed at the rear of the display panel; A printed circuit board is disposed at the rear of the metal plate and electrically connected to the display panel; as well as A chip-on-film assembly has one end electrically connected to the display panel and the other end electrically connected to the printed circuit board, wherein a portion of the chip-on-film assembly is flexible. The metal plate includes a bending guide formed at a position corresponding to the bendable portion of the chip on the film and guiding the bending shape of the chip on the film. The bending guide includes an elastically deformable reinforcement portion, which is formed by defining a plurality of slit holes. The on-film chip extends to the printed circuit board while covering at least a portion of the plurality of slit holes. The on-film chip includes a driver chip for driving the display panel, and The surface of the driving chip on the membrane is the same as the surface that contacts the bending guide.

2. The display device according to claim 1, wherein, The chip on the membrane is positioned spaced apart from the end of the metal plate and extends across the metal plate. The bending guide protrudes from the end of the metal plate and is formed such that at least a portion of the bending guide is bent.

3. The display device according to claim 1, wherein, Multiple chips on the membrane were configured, and The bending guides are disposed at the ends of the metal plate, wherein the number of bending guides corresponds to the number of chips on the membrane.

4. The display device according to claim 1, wherein, The chip-on-film is configured such that at least a portion of the chip-on-film contacts the bending guide.

5. The display device according to claim 1, wherein, At least a portion of the chip on the membrane remains spaced apart from the bending guide.

6. The display device according to claim 1, wherein, The bending guide has a cross-section with the following shape: the shape includes a bending portion.

7. The display device according to claim 1, wherein, The bending guide has a circular or arc-shaped cross-section.

8. The display device according to claim 1, wherein, The bending guide has a polygonal cross-section.

9. The display device according to claim 1, wherein, The bending guide has a cross-section with the following shape: the shape includes a curved portion and a straight portion.

10. The display device according to claim 1, wherein, The bending guide includes a clearance hole defined in the portion of the bending guide corresponding to the driver chip, wherein the clearance hole is used to prevent contact between the driver chip and the bending guide.

11. The display device according to claim 1, wherein, The elastic deformation reinforcement increases the elastic deformation of the bending guide against external impacts by reducing the area of ​​the bending guide in the length direction of the bending guide.

12. The display device according to claim 11, wherein, The plurality of slit holes are spaced apart from each other along the length of the curved guide.

13. The display device according to claim 1, further comprising: A cover glass is disposed at the frontmost part of the display device; An adhesive layer is disposed at the rear of the cover glass; as well as A polarizing portion is disposed between the adhesive layer and the display panel.

14. The display device according to claim 13, further comprising: A guide retainer is disposed between the metal plate and the printed circuit board, wherein the printed circuit board is mounted on one side of the guide retainer.

15. A display device, comprising: Display panel; A printed circuit board is disposed on the rear side of the display panel; A chip on a film, having one end electrically connected to the display panel and the other end electrically connected to the printed circuit board; as well as A bending guide is disposed between the display panel and the printed circuit board at a position corresponding to the bendable portion of the chip on the film, and restricts the bending of the chip on the film. The bending guide includes an elastically deformable reinforcement portion, which is formed by defining a plurality of slit holes. The on-film chip extends to the printed circuit board while covering at least a portion of the plurality of slit holes. The on-film chip includes a driver chip for driving the display panel, and The surface of the driving chip on the membrane is the same as the surface that contacts the bending guide.

16. The display device according to claim 15, wherein, The curved guide protrudes from one end of the rear portion of the display panel, and at least a portion of the curved guide is curved.

Images