Electronic package module and method of manufacturing the same

Abstract

An electronic package module and a method for manufacturing the same are provided. The method includes providing a circuit substrate including a first surface. On the first surface, a dielectric substrate and at least a first electronic component are disposed. A first encapsulation layer covering the first electronic component and the dielectric substrate is formed on the first surface. A masking material is disposed on the first encapsulation layer such that the masking material covers the dielectric substrate and an opening of the masking material overlaps the first electronic component. A thermally conductive solder is deposited on the first encapsulation layer using the masking material as a mask. After the masking material is removed, the dielectric substrate is connected to a main board. Thus, heat dissipation of the electronic component toward the main board can be accelerated by the thermally conductive solder on the first encapsulation layer.

Description

Technical Field

[0001] This invention relates to an electronic packaging module, and more particularly to a packaging module with thermal solder and a method for manufacturing the same. Background Technology

[0002] Double-sided surface mount technology (DSM) involves mounting electronic components on opposite surfaces of a circuit board and electrically connecting the circuit board with the electronic components to the main board using a frame board, forming a double-sided molding architecture. While this double-sided molding architecture increases the number of electronic components, the heat generated by the internal electronic components must be conducted outwards to the molding surface for dissipation, either directly through air convection or via the frame board to the main board.

[0003] However, because one side of the double-sided molded structure is connected to the motherboard, electronic components close to the motherboard cannot dissipate heat through air convection, thus reducing heat dissipation efficiency and adversely affecting the electronic components. This is especially true for components near the motherboard, which can experience severe heat buildup. Summary of the Invention

[0004] Therefore, the present invention provides an electronic packaging module and a method for manufacturing the same, thereby improving heat dissipation efficiency.

[0005] This invention provides a method for manufacturing an electronic packaging module, comprising: providing a circuit board including a first surface; disposing an intermediate substrate and at least one first electronic component on the first surface, wherein the intermediate substrate includes a contact surface remote from the circuit board; forming a first sealing layer on the first surface, wherein the first sealing layer covers the first electronic component and the intermediate substrate; disposing a shielding material on the first sealing layer such that the shielding material covers the intermediate substrate, wherein the shielding material has at least one opening that overlaps with the first electronic component; using the shielding material as a mask, depositing a thermally conductive solder on the first sealing layer, wherein the thermally conductive solder does not directly contact the first electronic component; removing the shielding material after depositing the thermally conductive solder; and connecting the intermediate substrate and a motherboard after removing the shielding material, wherein the contact surface of the intermediate substrate faces the motherboard.

[0006] The present invention also provides an electronic packaging module, comprising a circuit board having a first surface and a second surface; a first electronic component located on the first surface; an intermediate substrate located on the first surface and electrically connected to the circuit board; a first sealing layer covering the first electronic component and the intermediate substrate; and a thermally conductive solder covering the first sealing layer and the first electronic component, wherein the first sealing layer exists between the first electronic component and the thermally conductive solder, and the first electronic component does not directly contact the thermally conductive solder.

[0007] Based on the above, the present invention provides thermally conductive solder in the molding area overlapping with electronic components on the side of the electronic packaging module facing the motherboard. Since this thermally conductive solder is located between the packaging module and the motherboard, it improves the efficiency of directly transferring heat generated by the electronic components to the motherboard, further enhancing the heat dissipation effect of the electronic packaging module. Attached Figure Description

[0008] Figures 1A to 1F A cross-sectional view showing a method for manufacturing an electronic packaging module according to an embodiment of the present invention is shown.

[0009] Figure 2 A partial top view of a shielding material according to an embodiment of the present invention is shown.

[0010] Figure 3 Show Figure 1E The top view.

[0011] Figure 4 A partial top view showing a method for manufacturing an electronic packaging module according to another embodiment of the present invention.

[0012] Figure 5 A cross-sectional view of an electronic packaging module according to an embodiment of the present invention is shown.

[0013] Figures 6A to 6C A cross-sectional view showing a method for manufacturing an electronic packaging module according to another embodiment of the present invention.

[0014] Figure 7 A cross-sectional view of an electronic packaging module according to another embodiment of the present invention is shown.

[0015] Explanation of reference numerals in the attached figures:

[0016] 100: Circuit board

[0017] 100f, 100s, 160f: Surface

[0018] 102, 602: Solder joints

[0019] 120: Intermediate substrate

[0020] 120i: Interface

[0021] 122, 182: Opening

[0022] 140, 640: Electronic components

[0023] 160, 660: Sealing layer

[0024] 180: Shielding material

[0025] 190: Thermally conductive solder

[0026] 50, 70: Electronic packaging modules

[0027] 502: Welding material

[0028] 510: Motherboard

[0029] 515: Solder pad

[0030] 670: Conductive layer

[0031] p: Cutting device Detailed Implementation

[0032] At least one embodiment of the present invention discloses a method for manufacturing an electronic packaging module, comprising: Figures 1A to 1F The invention will be described by referring to a series of steps in the present invention to illustrate at least one embodiment. Please refer to... Figure 1A First, a circuit board 100 is provided, wherein the circuit board 100 includes a surface 100f. Next, as... Figure 1B As shown, an intermediate substrate 120 and at least one electronic component 140 are disposed on the surface 100f of the circuit board 100. In the accompanying drawings of this embodiment, only three electronic components 140 are shown for illustration; however, the invention is not limited thereto, and the number of electronic components 140 may be more than one.

[0033] In some embodiments, the circuit board 100 may further include at least one solder mask (not shown), which may cover the surface 100f of the circuit board 100 and expose a plurality of pads (not shown) on the surface 100f. Electronic components 140 are soldered to the circuit board 100 via these pads using a plurality of solder joints 102 to electrically connect the electronic components 140 to the circuit board 100. These solder joints 102 may be solder balls, copper pillars, or various connection structures suitable for electrical connection. Furthermore, in other embodiments, the electronic components 140 may be electrically connected to the circuit board 100 using wire bonding. The electronic components 140 may be packaged chips or unpackaged dies.

[0034] Please continue to refer to this. Figure 1BThe intermediate substrate 120 includes a contact surface 120i, and the contact surface 120i is located on the side away from the circuit substrate 100, that is, the contact surface 120i is the surface 100f opposite to the circuit substrate 100. In this embodiment, there is one intermediate substrate 120, and it includes at least one opening 122, in which the electronic component 140 is disposed. However, in other embodiments of the present invention, there may be more than one intermediate substrate 120, and each intermediate substrate 120 may include more than one (e.g., one) opening 122.

[0035] Similar to the way electronic component 140 is connected to circuit board 100, intermediate substrate 120 is also electrically connected to circuit board 100 via a plurality of solder points 102 through pads (not shown) exposed on circuit board 100. It is worth noting that although in this embodiment the contact surface 120i of intermediate substrate 120 is higher than the top of electronic component 140, the invention is not limited thereto. In other embodiments, the contact surface 120i of intermediate substrate 120 may be lower than or flush with the top of electronic component 140.

[0036] After the intermediate substrate 120 and electronic components 140 are disposed on the circuit board 100, please refer to Figure 1C A sealing layer 160 is formed on surface 100f, such that the sealing layer 160 covers the electronic component 140 and the intermediate substrate 120. The material of this sealing layer 160 may include insulating materials such as organic resins (e.g., epoxy resin) or similar materials. In this embodiment, the sealing layer 160 completely covers the electronic component 140 and the intermediate substrate 120. However, in other embodiments of the invention, the sealing layer 160 may expose a portion of the interface 120i of the intermediate substrate 120. In other words, the intermediate substrate 120 may not be completely covered by the sealing layer 160.

[0037] Next, as Figure 1D As shown, a shielding material 180 is disposed on the sealing layer 160, and the shielding material 180 covers the intermediate substrate 120. Since the interface 120i in this embodiment does not expose the sealing layer 160, the shielding material 180 does not directly contact the intermediate substrate 120. However, in other embodiments, the shielding material 180 can directly contact the intermediate substrate 120.

[0038] Figure 2 Please refer to the partial top view of the masked material 180 as well. Figure 1D as well as Figure 2The shielding material 180 has at least one opening 182, which overlaps with the electronic component 140 so that the electronic component 140 is not covered by the shielding material 180. The shielding material 180 can be a steel plate or other alloy plate, but the shielding material 180 in this invention is not limited to a metal plate. For example, the shielding material 180 can also be a ceramic plate or a polymer-containing film (e.g., polyimide tape).

[0039] like Figure 2 As shown, the shielding material 180 may include a plurality of openings 182. Since these openings 182 must overlap with the electronic component 140, which is disposed within the openings 122 of the intermediate substrate 120, the number and position of the openings 182 are configured according to the openings 122 of the intermediate substrate 120. On the other hand, although in this embodiment the shielding material 180 completely covers (or even extends beyond) the intermediate substrate 120, the invention is not limited thereto. In other embodiments, the shielding material 180 may only partially cover the intermediate substrate 120. In other words, the size and shape of the openings 182 of the shielding material 180 and the openings 122 of the intermediate substrate 120 may be different.

[0040] Please refer to Figure 1E Using a shielding material 180 as a mask, thermally conductive solder 190 is deposited on the sealing layer 160. It is worth noting that the thermally conductive solder 190 does not directly contact the electronic component 140, and the sealing layer 160 exists between them. In this embodiment, the thermally conductive solder 190 can be deposited on the sealing layer 160 by sputtering, stencil printing, or other similar methods, wherein the material of the thermally conductive solder 190 can include solderable metals such as copper or tin and their alloys.

[0041] like Figure 3 As shown, in this embodiment, the thermally conductive solder 190 is deposited in each opening 182 in the form of a single area, wherein Figure 3 This is a drawing that omits the masking material 180. It is worth noting that in some embodiments, the thermally conductive solder 190 in each opening 182 (not shown) can be composed of multiple regions. For example, please refer to... Figure 4 Another embodiment shown, wherein Figure 4 It is also drawn with the masking material 180 omitted. A single opening 182 (not shown) contains multiple areas (not shown) of thermally conductive solder 190, and these areas are separated from each other. In this way, when the thermally conductive solder 190 is soldered, the uniformity of the thermally conductive solder 190 thickness can be improved, preventing uneven overflow of the thermally conductive solder 190.

[0042] After the thermally conductive solder 190 is deposited, the shielding material 180 is removed. In this embodiment, after removing the shielding material 180, the circuit board 100, the sealing layer 160, and the interposer substrate 120 can be cut by means of, for example, mechanical cutting, laser cutting, or ion beam cutting. Please refer to... Figure 1F The cutting device p cuts the circuit board 100 from the surface 100s along the normal direction of the circuit board 100 to form multiple completely segmented electronic package units, wherein... Figure 1F The cutting device p shown can be a cutting tool, a laser beam, or an ion beam.

[0043] It should be noted that although the cutting is performed after the thermally conductive solder 190 is formed in this embodiment, the order of this cutting step is not limited to this. In practice, the circuit board 100, the sealing layer 160, and the interposer 120 can also be cut before the shielding material 180 is applied.

[0044] Please refer to further information. Figure 5 After removing the shielding material 180 and cutting to form an electronic package unit, the intermediate substrate 120 is connected to a motherboard 510. When connecting the two, the interface 120i of the intermediate substrate 120 faces the motherboard 510, that is, the surface 100f of the circuit board 100 faces the motherboard 510 for connection. In this step, firstly, a plurality of soldering materials 502 are provided on the interface 120i of the intermediate substrate 120, wherein the soldering materials 502 and the solder joints 102 can be made of the same material. Then, these soldering materials 502 are connected to the motherboard 510 by soldering.

[0045] In addition, in this embodiment, the mainboard 510 is soldered with thermally conductive solder 190 on the sealing layer 160 to connect the sealing layer 160 to the mainboard 510, thereby fixing the electronic package unit to the mainboard 510. Since the thermally conductive solder 190 is in direct contact with the mainboard 510, the thermally conductive solder 190 can be grounded through the mainboard 510.

[0046] This invention further discloses an electronic packaging module, the structure of which can be found in at least one embodiment. Figure 5As shown, the electronic packaging module 50 of this embodiment includes a circuit board 100, an intermediate substrate 120, electronic components 140, a sealing layer 160, and thermally conductive solder 190. The circuit board 100 has a surface 100f and a surface 100s opposite to the surface 100f, and the electronic components 140 are located on the surface 100f and electrically connected to the circuit board 100 via a plurality of solder joints 102. These solder joints 102 can be solder balls, copper pillars, or various connection structures suitable for electrical connection. In the accompanying drawings of this embodiment, only three electronic components 140 are shown for illustration; however, the invention is not limited to this, and the number of electronic components 140 can be more than one. On the other hand, the intermediate substrate 120 is also located on the surface 100f and is electrically connected to the circuit board 100 via a plurality of solder joints 102.

[0047] Please continue to refer to this. Figure 5 The sealing layer 160 covers the electronic component 140 and the intermediate substrate 120. The material of the sealing layer 160 may include insulating materials such as organic resins (e.g., epoxy resin) or similar materials. In this embodiment, the sealing layer 160 completely covers the electronic component 140; on the other hand, the sealing layer 160 may expose a portion of the intermediate substrate 120. In other words, the intermediate substrate 120 may not be completely covered by the sealing layer 160.

[0048] Thermally conductive solder 190 is located on the sealing layer 160 and overlaps with the sealing layer 160 and the electronic component 140. For example... Figure 5 As shown, in this embodiment, a sealing layer 160 exists between the electronic component 140 and the thermally conductive solder 190, and the electronic component 140 does not directly contact the thermally conductive solder 190. In other words, the electronic component 140 and the thermally conductive solder 190 are completely separated by the sealing layer 160 and do not directly contact each other. In addition, the sealing layer 160 also has a surface 160f away from the circuit board 100, and the thermally conductive solder 190 protrudes from the surface 160f. However, the present invention is not limited to this; in other embodiments, the thermally conductive solder 190 may be flush with the surface 160f or recessed into the surface 160f.

[0049] The electronic packaging module 50 of this embodiment further includes a motherboard 510, and the motherboard 510 is connected to the thermally conductive solder 190. An intermediate substrate 120 and electronic components 140 are located between the circuit board 100 and the motherboard 510, and are electrically connected to the intermediate substrate 120 and the motherboard 510 through a plurality of solder materials 502 located on the intermediate substrate 120. The solder materials 502 and the solder joints 102 can be made of the same material. The motherboard 510 also includes solder pads 515, which are used in this embodiment to connect the motherboard 510 and the thermally conductive solder 190. It is worth noting that, in order to ground the thermally conductive solder 190, at least one solder pad 515 can be electrically connected to a ground line.

[0050] Figures 6A to 6B A cross-sectional view of a method for manufacturing an electronic packaging module according to another embodiment of the present invention is shown, wherein Figure 6A The steps can continue at Figure 1C Following the embodiments described above. Because this embodiment is in... Figure 6A The previous steps are the same as those in the foregoing embodiments. Figures 1A to 1C Therefore, I will not repeat it here.

[0051] Please refer to Figure 6A After forming the sealing layer 160, electronic components 640 are disposed on another surface 100s of the circuit board 100, wherein the type of electronic components 640 may be the same as that of electronic components 140. Surfaces 100f and 100s are located on opposite sides of the circuit board 100, and the electronic components 640 are electrically connected to the circuit board 100 via a plurality of solder joints 602, wherein the solder joints 602 may be the same as those 102. In the accompanying drawings of this embodiment, several (four) electronic components 640 are shown for illustration. However, the invention is not limited thereto, and the number of electronic components 640 may be more than one, for example, one.

[0052] Please refer to further information. Figure 6B After the electronic component 640 is placed, a sealing layer 660 is formed on the surface for 100 seconds, so that the sealing layer 660 covers the electronic component 640. The material of this sealing layer 660 may include insulating materials such as organic resin (e.g., epoxy resin) or similar materials.

[0053] This embodiment Figure 6B The subsequent steps are similar to those in the aforementioned embodiments, such as... Figures 1D to 1F The steps shown. However, the difference between this embodiment and the previous embodiment is that, after setting the shielding material 180, a conductive layer 670 can be deposited on the sealing layer 660, such as... Figure 6C As shown. Since the conductive layer 670 completely covers the electronic component 640, it can be used for electromagnetic shielding of the electronic component 640. The material of the conductive layer 670 can include metals (e.g., copper, nickel, or alloys), conductive adhesives, or other materials, and can be deposited by spraying, sputtering, chemical plating, or similar methods. It should be noted that in this embodiment, the conductive layer 670 must be cut before deposition so that it can cover the sides of the electronic component 640.

[0054] Figure 7 This is a cross-sectional view of an electronic packaging module 70 according to another embodiment of the present invention. Figure 5The difference between the illustrated electronic packaging module 50 and the electronic packaging module 70 is that the electronic packaging module 70 also includes electronic components 640 and a sealing layer 660. In this embodiment, four electronic components 640 are located on the surface 100s of the circuit board 100, and the circuit board 100 and the electronic components 640 are electrically connected by a plurality of solder points 602. However, the invention is not limited thereto, and the number of electronic components 640 may be more than one.

[0055] Furthermore, in some embodiments, the surface 100s may not even have electronic components 640, but instead include other devices, such as antennas, wherein the electronic packaging module 70 may not include... Figure 6C The conductive layer 670 is shown. In this embodiment, the sealing layer 660 covers the electronic component 640, and the sealing layer 660 completely covers the electronic component 640. However, in other embodiments, the sealing layer 660 may partially cover the electronic component 640, or may not cover the electronic component 640.

[0056] In summary, the thermally conductive solder in the electronic packaging module of the present invention can improve the efficiency of heat conduction from electronic components to the motherboard (i.e., from the electronic components in a direction away from the circuit board), thereby improving the heat dissipation effect of the electronic packaging module. On the other hand, since the thermally conductive solder is soldered onto the motherboard, the bonding force between the electronic package unit and the motherboard can be improved, further enhancing the reliability of the connection between the signal solder joints and the motherboard.

[0057] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains may make some changes and modifications without departing from the concept and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A method for manufacturing an electronic packaging module, characterized in that, The method includes: A circuit board is provided, the circuit board including a first surface; An intermediate substrate and at least one first electronic component are disposed on the first surface, wherein the intermediate substrate includes a junction surface that is remote from the circuit substrate. A first sealing layer is formed on the first surface, wherein the first sealing layer covers the first electronic component and the intermediate substrate; A shielding material is disposed on the first sealing layer to cover the intermediate substrate, wherein the shielding material has at least one opening and the opening overlaps with the first electronic component; Using the shielding material as a shield, a thermally conductive solder is deposited on the first sealing layer, wherein the thermally conductive solder does not directly contact the first electronic component; After depositing the thermally conductive solder, remove the shielding material; After removing the shielding material, the intermediate substrate is connected to a motherboard, wherein the contact surface of the intermediate substrate faces the motherboard, and the motherboard includes at least one solder pad. The first sealing layer is soldered to the solder pad by the thermally conductive solder, so that the first sealing layer is connected to the motherboard. as well as The thermally conductive solder is grounded through the motherboard.

2. The method as described in claim 1, characterized in that, The step of connecting the intermediate substrate and the motherboard includes: On the interface surface of the intermediate substrate, a plurality of welding materials are disposed; and Connect the welding material to the motherboard.

3. The method as described in claim 1, characterized in that, After removing the shielding material, the circuit board, the first sealing layer, and the intermediate substrate are cut.

4. The method as described in claim 1, characterized in that, Before applying the shielding material, the circuit board, the first sealing layer, and the intermediate substrate are cut.

5. The method as described in claim 1, characterized in that, Also includes: A second electronic component is disposed on a second surface of the circuit board, wherein the first surface and the second surface are located on opposite sides of the circuit board; and A second sealing layer is formed on the second surface, wherein the second sealing layer covers the second electronic component.

6. The method as described in claim 5, characterized in that, Also includes: A conductive layer is deposited on the second sealing layer, wherein the conductive layer completely covers the second electronic component.

7. An electronic packaging module, characterized in that, Include: A circuit board having a first surface and a second surface; A first electronic component is located on the first surface; An intermediate substrate is located on the first surface and is electrically connected to the circuit substrate; A first sealing layer covers the first electronic component and the intermediate substrate; A thermally conductive solder covers the first sealing layer and the first electronic component, wherein the first electronic component and the thermally conductive solder are separated by the first sealing layer, and the first electronic component does not directly contact the thermally conductive solder. A motherboard, connected to the thermally conductive solder, wherein the intermediate substrate and the first electronic component are located between the circuit board and the motherboard; A solder pad connects the motherboard and the thermally conductive solder; The thermally conductive solder is grounded through the motherboard.

8. The electronic packaging module as described in claim 7, characterized in that, Also includes: A second electronic component is located on the second surface; and A second sealing layer covers the second electronic component.

9. The electronic packaging module as described in claim 7, characterized in that, The first sealing layer has a third surface that is away from the circuit board, and the thermally conductive solder protrudes from the third surface.

10. The electronic packaging module as described in claim 7, characterized in that, Also includes: Multiple soldering materials are located on one interface of the intermediate substrate and are connected to the motherboard.

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