Display module, preparation method thereof and display device

Abstract

Embodiments of the present disclosure provide a display module, a preparation method thereof and a display device, and relate to the technical field of display, so as to improve the production yield of the display panel. The display module comprises a display panel and a protective film. The display panel has a display side and a non-display side. The display panel comprises a rigid substrate. The protective film is located on the non-display side of the display panel and directly contacts the rigid substrate of the display panel. The boundary of the orthographic projection of the protective film on a first reference plane coincides with the boundary of the orthographic projection of the display panel on the first reference plane. The first reference plane is the surface of the display side of the display panel. The display module is used for displaying images.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display module, a preparation method thereof and a display device. BACKGROUND

[0002] With the rapid development of display technology, display devices have gradually spread in people's lives. Among them, organic light emitting diodes (OLED) have been widely used in smart products such as mobile phones, televisions, and notebook computers due to their self-luminous, low power consumption, wide viewing angle, fast response speed, high contrast ratio, and other advantages.

[0003] The display panel in the related art will have the phenomenon of screen breakage and screen cracking in the drop test, resulting in a decrease in the production yield of the display panel. SUMMARY

[0004] The present disclosure provides a display module, a preparation method thereof, and a display device to improve the production yield of the display panel.

[0005] To achieve the above-mentioned purpose, embodiments of the present disclosure provide the following technical solutions:

[0006] In one aspect, a display module is provided. The display module includes a display panel and a protective film. The display panel has a display side and a non-display side, and the display panel includes a rigid substrate. The protective film is located on the non-display side of the display panel and directly contacts the rigid substrate of the display panel. The boundary of the protective film in the orthographic projection of a first reference surface coincides with the boundary of the display panel in the orthographic projection of the first reference surface. The first reference surface is the surface of the display side of the display panel. In some embodiments, the protective film includes a metal shielding coating formed on one side of the rigid substrate. The boundary of the metal shielding coating in the orthographic projection of the first reference surface coincides with the boundary of the display panel in the orthographic projection of the first reference surface.

[0007] The display module provided by some embodiments of the present disclosure has the protective film arranged on the non-display side of the display panel, and the boundary of the protective film in the orthographic projection of the first reference surface coincides with the boundary of the display panel in the orthographic projection of the first reference surface. That is, the boundary of the protective film is substantially flush with the boundary of the display panel, so that the protective film can protect the edge of the display panel, so that the impact force on the display panel can be dispersed by the protective film, reducing the risk of screen breakage and screen cracking of the display panel, thereby improving the production yield of the display panel.

[0008] In some embodiments, the protective film further comprises a light shielding layer disposed on a side of the metal shielding coating away from the display panel. The light shielding layer has a boundary of a projection of the first reference plane, which coincides with a boundary of a projection of the display panel on the first reference plane.

[0009] In some embodiments, the display module further comprises a circuit board disposed on a side of the protective film away from the display panel. The circuit board comprises a driving circuit layer and an insulating cover layer on a side of the driving circuit layer close to the protective film. The driving circuit layer comprises a grounding portion, a first binding portion and a wiring portion. The wiring portion is covered by the insulating cover layer, and the first binding portion and the grounding portion are exposed by the insulating cover layer. The first binding portion is electrically connected to the display panel, and the grounding portion is electrically connected to the metal shielding coating, and the metal shielding coating is grounded.

[0010] In some embodiments, in the case that the light shielding layer is not conductive, the light shielding layer is provided with a connecting hole penetrating through the light shielding layer. The display module further comprises a conductive portion disposed in the connecting hole, and the conductive portion is electrically connected to the grounding portion and the metal shielding coating, respectively. In the case that the light shielding layer is conductive, the light shielding layer is electrically connected to the grounding portion and the metal shielding coating, respectively.

[0011] In some embodiments, the display module further comprises a chip on film, which comprises a second binding portion, a first bending portion and a third binding portion connected in sequence. The second binding portion is connected to a display side of the display panel. The first bending portion is bent towards a non-display side of the display panel, so that the third binding portion is bent to the non-display side of the display panel. The third binding portion is connected to the first binding portion of the circuit board.

[0012] In some embodiments, the thickness of the protective film is less than or equal to 40 μm.

[0013] In some embodiments, the display panel has a light sensing area, and the protective film is provided with a light sensing hole penetrating through the protective film. The boundary of the projection of the light sensing area on the first reference plane coincides with the boundary of the projection of the light sensing hole on the first reference plane, or the boundary of the projection of the light sensing area on the first reference plane is within the boundary of the projection of the light sensing hole on the first reference plane.

[0014] In some embodiments, the protective film is further provided with at least one first alignment mark hole penetrating through the protective film.

[0015] In another aspect, a display device is provided. The display device includes the display module as in any of the preceding embodiments.

[0016] In yet another aspect, a method for manufacturing a display module is provided. The method includes manufacturing a display mother board, the display mother board including a plurality of display panels, the display panels having a display side and a non-display side, the display mother board including a rigid substrate. Forming a protective mother film on a first side of the display mother board, the first side being a side of the display mother board that is on the same side as the non-display side of the display panels, the plurality of display panels being within a projection of the protective mother film on a second reference plane, the second reference plane being a surface of the first side of the display mother board. Cutting the display mother board covered with the protective mother film. Wherein forming the protective mother film on the first side of the display mother board includes forming a metal shielding film on a non-display side surface of the rigid substrate using an evaporation or sputtering process.

[0017] The display device and the method for manufacturing a display module provided by the embodiments of the present disclosure have the same beneficial effects as the display module provided by the above technical solution, and thus are not described here. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are only some drawings of the embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual time sequence, etc. of the products, methods, signals, etc. involved in the embodiments of the present disclosure.

[0019] Figure 1 A structural diagram of a display device according to some embodiments;

[0020] Figure 2 A sectional view of a display device according to some embodiments;

[0021] Figure 3 A sectional view of a display panel according to some embodiments;

[0022] Figure 4A A structural diagram of a display module according to some embodiments;

[0023] Figure 4B A structural diagram of another display module according to some embodiments;

[0024] Figure 5A A structural diagram of yet another display module according to some embodiments;

[0025] Figure 5B Structure diagram of yet another display module according to some embodiments;

[0026] Figure 6 Structure diagram of yet another display module according to some embodiments;

[0027] Figure 7 Structure diagram of yet another display module according to some embodiments;

[0028] Figure 8 Structure diagram of yet another display module according to some embodiments;

[0029] Figure 9 Structure diagram of yet another display module according to some embodiments;

[0030] Figure 10 Structure diagram of yet another display module according to some embodiments;

[0031] Figure 11 Structure diagram of a display motherboard according to some embodiments;

[0032] Figure 12 is a flowchart of a method of manufacturing a display module according to some embodiments. Figure 11 is a partial enlarged view of B in FIG. 8;

[0033] Figure 13 is a sectional view along the section line C-C' in FIG. 8; Figure 12

[0034] Figure 14 is a partial enlarged view of A in FIG. 9; Figure 11

[0035] Figure 15 is a sectional view along the section line A-A' in FIG. 9; Figure 1

[0036] Figure 16 is a sectional view along the section line B-B' in FIG. 9; Figure 11

[0037] Figures 17-19 is a flowchart of a method of manufacturing a display module according to some embodiments. DETAILED DESCRIPTION

[0038] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art are within the scope of protection of the present disclosure.

[0039] ​​​​Unless otherwise required by context, as used herein, the term "comprises" or "comprising" is to be interpreted as an open term meaning "including, but not limited to," and the like. In describing the embodiments, specific terminology is employed for the sake of clarity. However, the disclosure should not be construed as limited to the specific terminology so selected. In some embodiments, the terms "a" and "an" are understood to mean "one or more" in some embodiments, the terms "a" and "an" are understood to mean "at least one" in some embodiments, the terms "a" and "an" are understood to mean "one" in some embodiments, the terms "a" and "an" are understood to mean "one, or possibly more than one," in some embodiments, the terms "a" and "an" are understood to mean "one, or possibly more than one, but not all" in some embodiments, the terms "a" and "an" are understood to mean "one" in some embodiments, the terms "a" and "an" are understood to mean "one, or possibly more than one, but not all, but possibly some." In some embodiments, the terms "a" and "an" are understood to mean "one" or "at least one."

[0040] Hereinafter, the terms "first", "second", etc. are used only for the purpose of description and are not to be construed as indicating or implying relative importance or implying the number of the indicated technical features. Thus, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0041] In describing some embodiments, "coupled" and "connected" and variations thereof, can be used. The term "connected" is to be construed broadly, for example, "connected" can be fixed connection, or detachable connection, or integral; can be directly connected, or indirectly connected through intermediate media.

[0042] "A, B, and C at least one of" has the same meaning as "at least one of A, B, or C", both including the following combinations of A, B, and C: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0043] "A and / or B" includes the following three combinations: only A, only B, and a combination of A and B.

[0044] As used herein, the term "if' is optionally interpreted as meaning "when" or "upon" or "in response to a determination" or "in response to a detection" depending on the context. Similarly, the phrase "if determined" or "if detected [a stated condition or event]" is optionally interpreted as meaning "upon a determination" or "in response to a determination" or "upon a detection" or "in response to a detection" of [a stated condition or event], depending on the context.

[0045] As used herein, "about," "approximately," or "around" includes the recited value and the average value within an acceptable range of deviation from the particular value, as determined by one of ordinary skill in the art considering the measurement at issue and the error (i.e., limitations of the measurement system) associated with the measurement of the particular quantity.

[0046] It is understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present.

[0047] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized examples. In the interest of clarity, not all of the circular features can be shown in the drawings. It will be appreciated that in the development of any such actual implementation, numerous implementation-specific decisions can be made. These implementation-specific decisions can include, for example, manufacturing or processing tolerances, variations from the teaching, and / or the skill(s) of artisans. Additionally, specific measurement and test equipment can be used in developing implementations, but every implementation would not necessarily be required to use the same specific equipment, as will be appreciated by one skilled in the art. Accordingly, it will be appreciated that exemplary embodiments are not limited to the specific illustrative implementations described herein but rather are applicable to a wide range of implementations commensurate with the described functionality.

[0048] Referring to Figure 1 , some embodiments of the disclosure provide a display device 1000, which can be any device displaying images whether moving (e.g., video) or fixed (e.g., still images) and whether text or graphics.

[0049] Exemplarily, the display device 1000 can be any product or component having a display function, such as a television, a notebook computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigation device, a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, etc.

[0050] The display device 1000 described above can be a curved display device or a flat display device. Exemplarily, as shown in Figure 5A , the display device 1000 is a flat display device. Exemplarily, as shown in Figure 5B , the display device 1000 is a curved display device.

[0051] In some embodiments, referring to Figure 2 , the display device 1000 includes a display module 100 and a housing 200.

[0052] As shown in Figure 2 , a longitudinal section of the housing 200 can be, for example, in a U shape.

[0053] As shown in Figure 2 , the display module 100 includes a display panel 10 and a cover plate 20. The display panel 10 can be disposed in the housing 200, for example, and the cover plate 20 can be disposed at an opening of the housing 200, for example.

[0054] Referring to Figure 3 , the display panel 10 is configured to display an image. The display panel 10 has a display side 10A and a non-display side 10B. Among them, the display side 10A refers to the surface of the display panel 10 used to display the image, and the non-display side 10B refers to the side of the display panel 10 away from the surface used to display the image.

[0055] In some embodiments, the display panel 10 includes a display substrate 11 and an encapsulation layer 12 used to encapsulate the display substrate 11.

[0056] As shown in Figure 4A , the display substrate 11 has an opposite light-emitting side and a non-light-emitting side, and the encapsulation layer 12 is disposed on the light-emitting side of the display substrate 11, that is Figure 3 , the upper side.

[0057] The material of the above-mentioned encapsulation layer 12 can be a rigid material or a flexible material. The rigid material can be, for example, glass or polymethyl methacrylate (PMMA) and the like. The flexible material can be, for example, polyethylene terephthalate (PET), polyethylene naphthalate two formic acid glycol ester (PEN), or polyimide (PI) and the like.

[0058] Among them, referring to Figure 3 , the display substrate 11 includes a rigid substrate 110 and a pixel circuit 120 and a light-emitting device 130 disposed on the rigid substrate 110.

[0059] The material of the above-mentioned rigid substrate 110 is a rigid material, which can be, for example, glass or polymethyl methacrylate and the like. As shown in Figure 3 , the pixel circuit 120 includes a plurality of thin film transistors 121. The thin film transistor 121 includes an active layer 1211, a source 1212, a drain 1213, and a gate 1214, and the source 1212 and the drain 1213 are in contact with the active layer 1211, respectively.

[0060] It should be noted that the source electrode 1212 and the drain electrode 1213 can be interchanged, that is Figure 3 1212 represents the drain electrode, and 1213 represents the source electrode.

[0061] As shown in Figure 3 The light-emitting device 130 includes a first electrode 131, a light-emitting functional layer 132, and a second electrode 133. The first electrode 131 can be electrically connected to the source electrode 1212 or the drain electrode 1213 of one of the plurality of thin film transistors 121, for example, Figure 3 The first electrode 131 is electrically connected to the drain electrode 1213 of the thin film transistor 121.

[0062] It should be noted that the first electrode 131 is the anode of the light-emitting device 130, and the second electrode 133 is the cathode of the light-emitting device 130; or the first electrode 131 is the cathode of the light-emitting device 130, and the second electrode 133 is the anode of the light-emitting device 130.

[0063] The light-emitting functional layer 132 can include only a light-emitting layer, or can include at least one of an electron transporting layer (ETL), an electron injection layer (EIL), a hole transporting layer (HTL), and a hole injection layer (HIL) in addition to the light-emitting layer.

[0064] At present, in order to improve the production efficiency of the display panel and reduce the production cost, the display panel is formed by cutting and separating after being integrally manufactured on a display mother board, which causes the edge of the display panel to have micro cracks or edge collapse and other problems. At the same time, a super clear film (SCF) is attached to the back of the display panel to achieve the effects of light shielding and heat dissipation of the display panel.

[0065] However, considering the cutting and attaching precision process, the boundary of the super clear film is inwardly recessed compared to the boundary of the display panel. In this way, the edge of the display panel is unprotected, and the micro cracks or edge collapse of the edge of the display panel will accelerate the deterioration in the drop test, causing the display panel to have a broken screen and a cracked screen, which reduces the production yield of the display panel.

[0066] Based on this, some embodiments of the display module 100 provided by the present disclosure, with reference to Figure 4A Further comprising a protective film 30.

[0067] With reference to Figure 3The protective film 30 is located on the non-display side 10B of the display panel 10. Figure 4A (on the upper side) directly contacts the rigid substrate of the display panel 10.

[0068] The boundary of the protective film 30 projected onto the first reference surface roughly coincides with the boundary of the display panel 10 projected onto the first reference surface. It should be noted that the first reference surface is the surface of the display side 10A of the display panel 10.

[0069] As described above, in some embodiments of the present disclosure, the display module 100 has a protective film 30 on the non-display side 10B of the display panel 10, and the boundary of the protective film 30 projected onto the first reference surface roughly coincides with the boundary of the display panel 10 projected onto the first reference surface. In other words, the boundary of the protective film 30 is approximately flush with the boundary of the display panel 10. This allows the protective film 30 to protect the edges of the display panel 10, dispersing impact forces and reducing the risk of screen breakage or cracking, thereby improving the production yield of the display panel 10.

[0070] In some embodiments, see Figure 4A The protective film 30 includes a metal shielding coating 31, which is formed on the non-display side of the rigid substrate 110 to reduce electromagnetic interference to the display panel 10 and improve the screen flickering phenomenon that occurs when the display device 1000 is wirelessly charged.

[0071] The metal shielding coating 31 is located on the non-display side of the display panel 10, providing excellent heat dissipation. Furthermore, the metal shielding coating 31 can be formed directly, for example, by vacuum evaporation or vacuum magnetron sputtering. This results in a high density of the metal shielding coating 31 and superior electromagnetic shielding, further mitigating the screen flickering phenomenon that occurs during wireless charging of the display device 1000. Simultaneously, the thickness of the metal shielding coating 31 can be relatively thin. For example, the thickness of the metal shielding coating 31 is less than or equal to 20 μm; for instance, the thickness of the metal shielding coating 31 can be any one of 2 μm, 3 μm, 8 μm, 16 μm, 18 μm, and 20 μm.

[0072] Furthermore, the boundary of the metal shielding coating 31 projected onto the first reference surface roughly coincides with the boundary of the display panel 10 projected onto the first reference surface. In other words, the boundary of the metal shielding coating 31 is roughly flush with the boundary of the display panel 10. This can protect the edge of the display panel 10, allowing the impact force on the display panel 10 to be dispersed, reducing the risk of screen breakage and cracking, and improving the production yield of the display panel 10.

[0073] The material of the metal shielding coating 31 includes metal. Exemplarily, the material of the metal shielding coating 31 includes aluminum. At this time, the aluminum can form a film layer with excellent compactness through a film plating process such as vacuum evaporation or vacuum sputtering, has good electromagnetic shielding effect, low cost, and good heat dissipation effect.

[0074] In some embodiments, referring to Figure 4A The protective film 30 further includes a light shielding layer 32, which is arranged on a side of the metal shielding coating 31 away from the display panel 10, to reduce the interference of external ambient light on the display panel 10, reduce the risk of threshold voltage drift of the thin film transistor in the display panel 10 due to external ambient light, and improve the display effect.

[0075] The boundary of the light shielding layer 32 in the orthographic projection of the first reference plane substantially coincides with the boundary of the display panel 10 in the orthographic projection of the first reference plane, that is, the boundary of the light shielding layer 32 is substantially flush with the boundary of the display panel 10. In this way, the edge of the display panel 10 can be protected, so that the impact force on the display panel 10 can be further dispersed, the risk of screen breakage and screen cracking of the display panel 10 is reduced, and the production yield of the display panel 10 is improved.

[0076] The material of the light shielding layer 32 includes a black light shielding material. Exemplarily, the material of the light shielding layer 32 includes polyimide or polyterephthalic plastic.

[0077] The thickness of the light shielding layer 32 can be set to be relatively thin. Exemplarily, the thickness of the light shielding layer 32 is less than or equal to 20 μm; for example, the thickness of the metal shielding coating 31 is any one of 2 μm, 3 μm, 8 μm, 16 μm, 18 μm, and 20 μm.

[0078] It can be understood that the light shielding layer 32 can be directly formed through a vacuum evaporation process or formed through an attaching process.

[0079] In the case where the light shielding layer 32 is formed through an attaching process, as shown in Figure 4B The protective film 30 further includes a first adhesive layer 33 arranged between the light shielding layer 32 and the metal shielding coating 31. Some embodiments of the present disclosure are exemplarily described below with the protective film 30 not including the first adhesive layer 33.

[0080] It should be noted that the material of the first adhesive layer 33 includes optical glue or pressure-sensitive adhesive (other adhesive materials with high light transmittance (such as light transmittance greater than or equal to 90%), exemplarily, the material of the first adhesive layer 33 includes pressure-sensitive adhesive.

[0081] Based on the above, the thickness of the protective film 30 may be less than or equal to 40 μm, for example. Compared with the related art, the thickness of the protective film 30 is thinner than the thickness of the ultra-clean film, thereby reducing the thickness of the display module 100 and facilitating the thinning of the display device 1000.

[0082] In some embodiments, referring to Figure 5A , the display module 100 further includes a circuit board 40, which is disposed on a side of the protective film 30 away from the display panel 10.

[0083] Referring to Figure 5A , the circuit board 40 includes a driving circuit layer 41 and an insulating cover layer 42, and the insulating cover layer 42 is located on a side of the driving circuit layer 41 close to the protective film 30, so as to protect the driving circuit layer 41 and reduce the risk of short circuit between the circuit traces of the circuit board 40 and other circuits.

[0084] As shown in Figure 5A , the driving circuit layer 41 includes a grounding portion 411 and a first binding portion 412, and the first binding portion 412 and the grounding portion 411 are exposed by the insulating cover layer 42.

[0085] Referring to Figure 5A , the first binding portion 412 is electrically connected to the display panel 10, so as to provide the display panel 10 with a data signal required for displaying a picture.

[0086] As shown in Figure 5A , the display module 100 further includes a chip on film 50, which includes a second binding portion 51, a first bending portion 52 and a third binding portion 53 connected in sequence. The second binding portion 51 is connected to the display side 10A of the display panel 10, the first bending portion 52 is bent towards the non-display side 10B of the display panel 10, so that the third binding portion 53 is bent to the non-display side 10B of the display panel 10. The third binding portion 53 is connected to the first binding portion 412 of the circuit board 40, so that the first binding portion 412 is electrically connected to the display panel 10.

[0087] Referring to Figure 5A , the grounding portion 411 is electrically connected to the metal shielding coating 31, and the metal shielding coating 31 is grounded, so as to realize the grounding of the circuit board 40 and enhance the anti-static capability of the display module 100. It should be noted that the grounding of the metal shielding coating 31 may be, for example, that the metal shielding coating 31 is connected to the housing 200.

[0088] It can be understood that the manner in which the grounding portion 411 is electrically connected to the metal shielding coating 31 is not unique.

[0089] In some examples, as shown in Figure 5AAs shown, the light-shielding layer 32 is conductive, and the light-shielding layer 32 is electrically connected with the ground part 411 and the metal shielding coating 31 respectively, so that the ground part 411 is electrically connected with the metal shielding coating 31.

[0090] It should be noted that, referring to Figure 6 , the second adhesive layer 43 is further arranged between the light-shielding layer 32 and the circuit board 40, so as to fix the circuit board 40 to the non-display side 10B of the display panel 10. In this case, the material of the second adhesive layer 43 is conductive adhesive.

[0091] In other examples, referring to Figure 7 and Figure 8 , the light-shielding layer 32 is non-conductive, i.e., the light-shielding layer 32 is insulated. In this case, the light-shielding layer 32 is provided with a connecting hole 321 penetrating the light-shielding layer 32. The display module 100 further comprises a conductive part 60 arranged in the connecting hole 321, and the conductive part 60 is electrically connected with the ground part 411 and the metal shielding coating 31, so that the ground part 411 is electrically connected with the metal shielding coating 31.

[0092] It should be noted that, referring to Figure 9 , the second adhesive layer 43 is further arranged between the light-shielding layer 32 and the circuit board 40, so as to fix the circuit board 40 to the non-display side 10B of the display panel 10. In this case, the material of the second adhesive layer 43 is conductive adhesive. In addition, the material of the conductive part 60 may, for example, be the same as that of the second adhesive layer 43, so as to reduce the manufacturing cost.

[0093] In some embodiments, referring to Figure 1 and Figure 10 , the display panel 10 has a light-sensing area 101, and the protective film 30 is provided with a light-sensing hole 301 penetrating the protective film 30, i.e., the light-sensing hole 301 penetrates the metal shielding coating 31 and the light-shielding layer 32.

[0094] Among them, referring to Figure 10 , the boundary of the projection of the light-sensing area 101 on the first reference plane substantially coincides with the boundary of the projection of the light-sensing hole 301 on the first reference plane. Or, the boundary of the projection of the light-sensing area 101 on the first reference plane is located within the range of the boundary of the projection of the light-sensing hole 301 on the first reference plane.

[0095] Exemplarily, as shown in Figure 10 , the boundary of the projection of the light-sensing area 101 on the first reference plane is located within the range of the boundary of the projection of the light-sensing hole 301 on the first reference plane. And the average distance D between the boundary of the projection of the light-sensing area 101 on the first reference plane and the boundary of the projection of the light-sensing hole 301 on the first reference plane is 0.1mm-0.2mm.

[0096] In some embodiments, referring toFigure 12 and Figure 13 The protective film 30 is further provided with at least one first alignment mark hole 302 which penetrates the protective film 30.

[0097] It should be noted that the shape of the first alignment mark hole 302 can be circular, cross-shaped, triangular, pentagonal, etc., and the embodiments of the present disclosure do not make specific limitations thereon.

[0098] Exemplarily, as shown in Figure 12 and Figure 13 , the protective film 30 is further provided with a plurality of first alignment mark holes 302, and the plurality of first alignment mark holes 302 include a whole-machine alignment mark hole 3021 and a module alignment mark hole 3022. The whole-machine alignment mark hole 3021 is used for the alignment of the assembly process in the display device 1000 (see Figure 1 ), and the module alignment mark hole 3022 is used for the alignment of the binding process in the display module 100.

[0099] It should be noted that the shapes and / or areas of the whole-machine alignment mark hole 3021 and the module alignment mark hole 3022 are different. Figure 12 Exemplarily, the shapes of the whole-machine alignment mark hole 3021 and the module alignment mark hole 3022 are the same and the areas are different.

[0100] In some embodiments, referring to Figure 5A , the display module 100 can further include a polarizer 70 and a third adhesive layer 80.

[0101] As shown in Figure 5A , the polarizer 70 is arranged on the display side 10A of the display panel 10 to reduce the interference of external ambient light and improve the display effect.

[0102] As shown in Figure 5A , the third adhesive layer 80 is arranged between the polarizer 70 and the cover plate 20 to bond the polarizer 70 and the cover plate 20.

[0103] It should be noted that the material of the third adhesive layer 80 includes optical glue or pressure-sensitive adhesive (other adhesive materials with high light transmittance (such as light transmittance greater than or equal to 90%), and exemplarily, the material of the third adhesive layer 80 includes optical glue.

[0104] Embodiments of the present disclosure further provide a preparation method of a display module, referring to Figure 17 , the preparation method includes S100-S300.

[0105] S100: preparing a display mother board.

[0106] In the above steps, referring to Figure 11 and Figure 15 , the display mother board is prepared.The display motherboard 10' includes a plurality of display panels 10, and each display panel 10 has a display side 10A and a non-display side 10B. The display motherboards include rigid substrates.

[0107] S200: forming a protective mother film on the first side of the display motherboards.

[0108] In the above steps, referring to Figure 11 and Figure 15 , the first side is the side of the display motherboards 10' on the same side as the non-display side 10B of the display panels 10. In addition, the projection of the plurality of display panels 10 on the second reference surface is within the projection of the protective mother film 30' on the second reference surface. For example, the protective mother film 30' is an integral layer structure, and the projection of the plurality of display panels 10 on the second reference surface is within the projection of the protective mother film 30' on the second reference surface.

[0109] It should be noted that the second reference surface is the surface of the first side of the display motherboards 10'.

[0110] In some examples, referring to Figure 18 , S200 includes S210-S220.

[0111] S210: forming a metal shielding film on the non-display side surface of the rigid substrate of the display motherboards by using a vapor deposition or sputtering process.

[0112] In the above steps, referring to Figure 11 and Figure 15 , the projection of the plurality of display panels 10 of the display motherboards 10' on the second reference surface is within the projection of the metal shielding film 31' on the second reference surface.

[0113] In the case where the display panel 10 has a photosensitive area 101, the metal shielding film 31' needs to avoid the photosensitive area 101, that is, the metal shielding film 31' is provided with a portion of the photosensitive hole 301 in the above-mentioned metal shielding coating 31.

[0114] In the case where the protective film 30 is provided with a first alignment mark hole 302, the metal shielding film 31' also needs to avoid the first alignment mark hole 302, that is, the metal shielding film 31' is provided with a portion of the first alignment mark hole 302 in the above-mentioned metal shielding coating 31.

[0115] In some embodiments, referring to Figure 11 and Figure 14 , a second alignment mark hole 303 is provided on the display motherboards 10', and the second alignment mark hole 303 is located between two adjacent display panels 10. The second alignment mark hole 303 is used for process alignment in the display panel 10.

[0116] It should be noted that the shapes and / or areas of the whole-machine alignment mark hole 3021, the module alignment mark hole 3022, and the second alignment mark hole 303 are different. Figure 12 and Figure 14 In some examples, the shapes of the whole-machine alignment mark hole 3021, the module alignment mark hole 3022, and the second alignment mark hole 303 are the same, and the areas are different.

[0117] On this basis, the metal shielding film 31' also needs to avoid the second alignment mark hole 303, that is, the metal shielding film 31' is provided with a portion through which the second alignment mark hole 303 penetrates the metal shielding film 31'.

[0118] S220: using an evaporation or coating process, forming a light shielding film on the side of the metal shielding film away from the display mother board.

[0119] In the above steps, referring to Figure 11 and Figure 15 , the orthographic projection of the plurality of display panels 10 on the second reference plane is located within the range of the orthographic projection of the light shielding film 32' on the second reference plane.

[0120] In the case where the display panel 10 has a photosensitive area 101, the light shielding film 32' needs to avoid the photosensitive area 101, that is, the light shielding film 32' is provided with a portion through which the photosensitive hole 301 in the foregoing penetrates the light shielding film 32'.

[0121] In the case where the protective film 30 is provided with the first alignment mark hole 302, the light shielding film 32' also needs to avoid the first alignment mark hole 302, that is, the light shielding film 32' is provided with a portion through which the first alignment mark hole 302 in the foregoing penetrates the light shielding film 32'.

[0122] In the case where the light shielding film 32' is not conductive, that is, the light shielding layer 32 in the foregoing is provided with a connection hole 321 penetrating the light shielding layer 32, the light shielding film 32' needs to avoid the connection hole 321, that is, the light shielding film 32' is provided with the connection hole 321.

[0123] In the case where the display mother board 10' is provided with the second alignment mark hole 303, the light shielding film 32' also needs to avoid the second alignment mark hole 303, that is, the light shielding film 32' is provided with a portion through which the second alignment mark hole 303 penetrates the light shielding film 32'.

[0124] In some other examples, referring to Figure 19 , S200 includes S230-S250.

[0125] S230: using an evaporation or sputtering process, forming a metal shielding film on the non-display side surface of the rigid substrate of the display mother board.

[0126] In the above steps, referring to Figure 11and Figure 15 The second reference plane is a plane parallel to the display panel 10 and the metal shielding film 31', and the second reference plane is located between the display panel 10 and the metal shielding film 31'.

[0127] In the case that the display panel 10 has the light-sensitive area 101, the metal shielding film 31' needs to avoid the light-sensitive area 101, i.e. the metal shielding film 31' is provided with the part of the light-sensitive hole 301 in the above which penetrates the metal shielding coating 31.

[0128] In the case that the protective film 30 is provided with the first alignment mark hole 302, the metal shielding film 31' also needs to avoid the first alignment mark hole 302, i.e. the metal shielding film 31' is provided with the part of the first alignment mark hole 302 in the above which penetrates the metal shielding coating 31.

[0129] In the case that the display panel 10' is provided with the second alignment mark hole 303, the metal shielding film 31' also needs to avoid the second alignment mark hole 303, i.e. the metal shielding film 31' is provided with the part of the second alignment mark hole 303 which penetrates the metal shielding film 31'.

[0130] S240: forming a first adhesive film on one side of the light shielding film by using a coating process.

[0131] S250: adhering the light shielding film with the first adhesive film to the side of the metal shielding film away from the display panel by using an adhering process.

[0132] In the above steps, refer to Figure 11 and Figure 16 The second reference plane is a plane parallel to the display panel 10 and the metal shielding film 31', and the second reference plane is located between the display panel 10 and the metal shielding film 31'.

[0133] In the case that the display panel 10 has the light-sensitive area 101, the first adhesive film 33' and the light shielding film 32' can avoid the light-sensitive area 101, i.e. the light shielding film 32' of the first adhesive film 33' is provided with the part of the light-sensitive hole 301 in the above which penetrates the light shielding film 32' of the first adhesive film 33'.

[0134] In the case that the protective film 30 is provided with the first alignment mark hole 302, the first adhesive film 33' and the light shielding film 32' also need to avoid the first alignment mark hole 302, i.e. the first adhesive film 33' and the light shielding film 32' are provided with the part of the first alignment mark hole 302 in the above which penetrates the metal shielding coating 31.

[0135] In the case that the display motherboard 10' is provided with the second alignment mark hole 303, the first adhesive film 33' and the light shielding film 32' also need to avoid the second alignment mark hole 303, that is, the first adhesive film 33' and the light shielding film 32' are provided with a portion through which the second alignment mark hole 303 penetrates the first adhesive film 33' and the light shielding film 32'.

[0136] In the case that the light shielding film 32' is not conductive, that is, the light shielding layer 32 is provided with the connecting hole 321 penetrating the light shielding layer 32, the first adhesive film 33' and the light shielding film 32' need to avoid the connecting hole 321, that is, the first adhesive film 33' and the light shielding film 32' are provided with the connecting hole 321.

[0137] S300: cutting the display motherboards covered with the protective mother films.

[0138] In the above steps, referring to Figure 11 and Figure 15 the display motherboards 10' can be cut by a cutter wheel to cut the display motherboards 10' into a plurality of display panels 10, so as to reduce the production cost.

[0139] At this time, in the process of cutting the display motherboards 10', the edges of the display panels 10 are all protected by the protective mother films 30', which can disperse the stress suffered by the display motherboards 10' in the cutting process, so as to improve the risk of micro-cracks or edge collapse of the edges of the display panels 10.

[0140] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto, any person skilled in the art can think of changes or replacements within the technical range disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display module, characterized in that, include: A display panel having a display side and a non-display side; the display panel includes a rigid substrate; The protective film is located on the non-display side of the display panel and is in direct contact with the rigid substrate of the display panel; the boundary of the protective film's orthographic projection on the first reference surface coincides with the boundary of the display panel's orthographic projection on the first reference surface. The first reference surface is the surface of the display side of the display panel; The protective film includes at least the following: A metal shielding coating is formed on one side of the rigid substrate; the boundary of the metal shielding coating in the orthographic projection of the first reference surface coincides with the boundary of the display panel in the orthographic projection of the first reference surface. The protective film also includes: A light-shielding layer is disposed on the side of the metal shielding coating away from the display panel; the boundary of the light-shielding layer in the orthographic projection of the first reference surface coincides with the boundary of the display panel in the orthographic projection of the first reference surface.

2. The display module according to claim 1, characterized in that, Also includes: A circuit board is disposed on the side of the protective film away from the display panel; the circuit board includes a driving circuit layer and an insulating cover layer, the insulating cover layer being located on the side of the driving circuit layer closer to the protective film; The driving circuit layer includes a grounding portion, a first bonding portion, and a wiring portion. The wiring portion is covered by the insulating covering layer, and the first bonding portion and the grounding portion are exposed by the insulating covering layer. The first bonding portion is electrically connected to the display panel, the grounding portion is electrically connected to the metal shielding coating, and the metal shielding coating is grounded.

3. The display module according to claim 2, characterized in that, When the light-shielding layer is non-conductive, the light-shielding layer is provided with a connection hole penetrating the light-shielding layer; the display module further includes: a conductive part disposed in the connection hole, and the conductive part is electrically connected to the grounding part and the metal shielding coating respectively; When the light-shielding layer is conductive, the light-shielding layer is electrically connected to the grounding portion and the metal shielding coating, respectively.

4. The display module according to claim 2, characterized in that, Also includes: The flip-chip film includes a second bonding portion, a first bending portion, and a third bonding portion connected in sequence. The second bonding portion is connected to the display side of the display panel. The first bending portion bends toward the non-display side of the display panel, so that the third bonding portion is bent toward the non-display side of the display panel. The third bonding portion is connected to the first bonding portion of the circuit board.

5. The display module according to any one of claims 1 to 4, characterized in that, The thickness of the protective film is less than or equal to 40 μm.

6. The display module according to any one of claims 1 to 4, characterized in that, The display panel has a photosensitive area, and the protective film has a photosensitive hole that penetrates the protective film; Wherein, the boundary of the photosensitive area projected onto the first reference surface coincides with the boundary of the photosensitive aperture projected onto the first reference surface; or, the boundary of the photosensitive area projected onto the first reference surface is located within the range of the boundary of the photosensitive aperture projected onto the first reference surface.

7. The display module according to any one of claims 1 to 4, characterized in that, The protective film is further provided with at least one first alignment mark hole, which penetrates the protective film.

8. A display device, characterized in that, include: The display module as described in any one of claims 1 to 7.

9. A method for manufacturing a display module, characterized in that, include: Preparation of display motherboard; The display motherboard includes multiple display panels, each display panel having a display side and a non-display side; the display motherboard includes a rigid substrate; A protective film is formed on a first side of the display motherboard; the first side is the same side of the display motherboard and the non-display side of the display panel; the orthographic projection of the plurality of display panels onto a second reference surface is located within the range of the orthographic projection of the protective film onto the second reference surface; the second reference surface is the surface of the first side of the display motherboard; The display motherboard covered with the protective film is cut; The step of forming a protective film on the first side of the display motherboard includes forming a metal shielding film on the non-display side surface of the rigid substrate using a vapor deposition or sputtering process.

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