Laser irradiation head and laser irradiation device

Abstract

The laser irradiation head of the present invention comprises: a semiconductor laser module including a semiconductor laser element and a lens; a heat sink having a refrigerant flow path; and a first piping connector capable of assembling and disassembling a first piping for supplying refrigerant to the flow path; wherein the heat sink has an outer surface including a first region and a second region intersecting the first region, the semiconductor laser module is threadedly fixed relative to the heat sink in the first region, and the first piping connector is threadedly fixed relative to the heat sink in the second region.

Description

Technical Field

[0001] This invention relates to a laser irradiation head and a laser irradiation device. Background Technology

[0002] Patent document 1 describes a laser device comprising a semiconductor laser and a cooling jacket, wherein the semiconductor laser is positioned at a predetermined location on the cooling jacket using a thermally conductive adhesive.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2006-339569 Summary of the Invention

[0006] [The technical problem that the invention aims to solve]

[0007] When the laser device described in Patent Document 1 is mounted on a moving component such as a robotic arm and used as a laser irradiation head, there is a risk that the semiconductor laser may accidentally detach from a designated position on the cooling jacket if the adhesive deteriorates. In other words, the laser device described in Patent Document 1 is not suitable for applications such as mounting on a moving component.

[0008] The object of the present invention is to provide a laser irradiation head suitable for use in installation on moving components, and a laser irradiation device having such a laser irradiation head.

[0009] [Technical means used to solve the problem]

[0010] One aspect of the present invention relates to a laser irradiation head comprising: a semiconductor laser module including a semiconductor laser element and a lens; a heat sink having a refrigerant flow path; and a first piping connector capable of assembling and disassembling a first piping for supplying refrigerant to the flow path; wherein the heat sink has: an outer surface including a first region and a second region intersecting the first region, the semiconductor laser module being threadedly fixed relative to the heat sink in the first region, and the first piping connector being threadedly fixed relative to the heat sink in the second region.

[0011] In the aforementioned laser irradiation head, the semiconductor laser module and the first piping connector are threadedly fixed relative to the heat sink. This prevents the semiconductor laser module and the first piping connector from accidentally detaching from the heat sink when the laser irradiation head is mounted on a moving component such as a robotic arm. Furthermore, the second region where the first piping connector is threadedly fixed to the heat sink intersects with the first region where the semiconductor laser module is threadedly fixed to the heat sink. This allows for miniaturization of the heat sink while enabling space-efficient configuration of the semiconductor laser module and the first piping connector relative to the heat sink. As described above, the aforementioned laser irradiation head is suitable for applications where it is mounted on a moving component.

[0012] One aspect of the laser irradiation head of the present invention may further include: a second piping connector, which enables the installation and removal of a second piping for discharging refrigerant from the flow path; the second piping connector is threadedly fixed relative to the heat sink in a second region. Therefore, when the laser irradiation head is mounted on a moving component such as a robotic arm, accidental detachment of the second piping connector from the heat sink can be prevented. Furthermore, while achieving miniaturization of the heat sink, the semiconductor laser module, the first piping connector, and the second piping connector can be arranged relative to the heat sink in a space-efficient manner.

[0013] In one aspect of the laser irradiation head of the present invention, the heat sink may include a main body having a first region and a second region, and a cover. The main body has a recess containing a flow path and opening on a side opposite to the first region. The cover is mounted on the main body to block the opening of the recess. This allows for flow path maintenance while the semiconductor laser module and the first piping connector are threadedly fixed to the main body of the heat sink.

[0014] In one aspect of the laser irradiation head of the present invention, the main body may include: a bottom wall portion and a side wall portion defining a recess, and a protrusion extending from the bottom wall portion into the recess, wherein the bottom wall portion, the side wall portion, and the protrusion are integrally formed. This facilitates heat conduction between the bottom wall portion, the side wall portion, and the protrusion, thereby improving the cooling effect of the semiconductor laser module threaded relative to the main body.

[0015] In one aspect of the laser irradiation head of the present invention, the semiconductor laser module may be threadedly fixed to the sidewall portion in the first region. This improves the stability of the threaded fixation of the semiconductor laser module to the main body.

[0016] In one aspect of the laser irradiation head of the present invention, the semiconductor laser module may further include: a housing for housing the semiconductor laser element and a support member for supporting the lens. This increases the design freedom of the lens relative to the semiconductor laser element.

[0017] In one aspect of the laser irradiation head of the present invention, a mounting member may be further provided between the heat sink and the semiconductor laser module, and the housing and support member are threadedly fixed relative to the heat sink in a first region via the mounting member. Thus, compared to a structure in which the housing and support member are respectively mounted on different components, the alignment of the optical axis of the semiconductor laser element with the optical axis of the lens can be performed easily and with high precision.

[0018] In one aspect of the laser irradiation head of the present invention, the mounting member may have a first surface and a second surface parallel to the first region, the second surface being located at a lower position than the first surface, the housing being disposed on the first surface, and the support member being disposed on the second surface. Thus, for example, when the lens size is large, the optical axis of the semiconductor laser element can be easily and with high precision aligned with the optical axis of the lens.

[0019] In one aspect, the laser irradiation head of the present invention may further include a Peltier element disposed between the heat sink and the mounting member. This allows heat to be dissipated from the Peltier element to the heat sink, thereby cooling the semiconductor laser module in a manner that keeps the temperature of the semiconductor laser element constant.

[0020] In one aspect of the laser irradiation head of the present invention, the housing and support member may be threadedly fixed directly relative to the heat sink in the first region. This simplifies the construction compared to a structure where the housing and support member are disposed in separate components, while allowing for easy and high-precision alignment of the optical axis of the semiconductor laser element with the optical axis of the lens.

[0021] One aspect of the laser irradiation head of the present invention can also have the following structure: a heat sink has a third surface and a fourth surface as a first region, the fourth surface being located at a lower position than the third surface, a housing is disposed on the third surface, and a support member is disposed on the fourth surface. Thus, for example, when the lens size is large, the optical axis of the semiconductor laser element can be easily and with high precision aligned with the optical axis of the lens.

[0022] The laser irradiation device of one side of the present invention includes: the laser irradiation head; a first pipe having flexibility and connected to a first pipe connector; a refrigerant supply source that supplies refrigerant to a flow path via the first pipe; and a moving member that moves the laser irradiation head.

[0023] The laser irradiation device described above can achieve appropriate laser irradiation.

[0024] [Invention Effects]

[0025] According to the present invention, a laser irradiation head suitable for use in installation on a moving component and a laser irradiation device having the laser irradiation head can be provided. Attached Figure Description

[0026] Figure 1 This is a structural diagram of a laser irradiation device according to one embodiment.

[0027] Figure 2 yes Figure 1 A top view of the laser irradiation device shown.

[0028] Figure 3 yes Figure 2 The diagram shows a side view of the laser irradiation device.

[0029] Figure 4 yes Figure 2 The image shows a front view of the laser irradiation device.

[0030] Figure 5 It is along Figure 2 The diagram shows a cross-sectional view of the laser irradiation device for the VV line.

[0031] Figure 6 It is along Figure 3 The diagram shows a cross-sectional view of the laser irradiation device along the VI-VI line.

[0032] Figure 7 yes Figure 3 The diagram shows a partial structural diagram of the semiconductor laser module.

[0033] Figure 8 This is a side view of a modified laser irradiation device.

[0034] Figure 9 This is a top view of a modified laser irradiation device.

[0035] Figure 10 yes Figure 9 The diagram shows a side view of the laser irradiation device.

[0036] Figure 11 This is a top view of a modified heat sink.

[0037] Figure 12 This is a structural diagram of a modified semiconductor laser module.

[0038] Figure 13 This is a structural diagram of a modified semiconductor laser module. Detailed Implementation

[0039] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in the various drawings, the same or equivalent parts are labeled with the same reference numerals, and repeated descriptions are omitted.

[0040] like Figure 1 As shown, the laser irradiation device 1 includes a housing 2, a support 3, a refrigerant supply source 4, a first piping 5, a second piping 6, a moving member 7, and a laser irradiation head 10. The support 3 supports multiple workpieces W within the housing 2. The refrigerant supply source 4 supplies refrigerant to the laser irradiation head 10 (the flow path 24 of the radiator 11 described later) via the first piping 5, and discharges refrigerant from the laser irradiation head 10 via the second piping 6. The refrigerant supply source 4 is, for example, a pump that compresses air as refrigerant. The moving member 7 moves the laser irradiation head 10 within the housing 2. The moving member 7 is, for example, a robotic arm or a three-dimensional stage. In this embodiment, the laser irradiation device 1 is a laser processing device that performs heat processing (e.g., soldering, resin welding, preheating, etc.) on each workpiece W by irradiating each workpiece W with a laser L emitted from the laser irradiation head 10.

[0041] like Figure 2 , Figure 3 and Figure 4 As shown, the laser irradiation head 10 includes a heat sink 11, a Peltier element 12, a mounting member 13, a semiconductor laser module 14, a first piping connector 15, and a second piping connector 16. The heat sink 11, Peltier element 12, mounting member 13, and semiconductor laser module 14 are covered, for example, by a housing (not shown) formed in the shape of a cuboid box. Hereinafter, the direction parallel to the emission direction of the laser L will be called the Z-axis direction, the direction perpendicular to the Z-axis direction will be called the X-axis direction, and the direction perpendicular to both the Z-axis and X-axis directions will be called the Y-axis direction. Furthermore, the side from which the laser L is emitted will be called the front side, and the opposite side will be called the rear side.

[0042] The heat sink 11 includes a main body 21 and a cover 22. The main body 21 has a surface 21a perpendicular to the Y-axis direction and a back surface 21b, and a rear surface 21c perpendicular to the Z-axis direction. The rear surface 21c is the surface of the main body 21 opposite to the recess 23. The main body 21 is formed of aluminum in a cuboid shape, for example. The cover 22 has a surface 22a perpendicular to the Y-axis direction and a back surface 22b. The surface 22a of the cover 22 contacts the back surface 21b of the main body 21. The cover 22 is formed of aluminum in a rectangular plate shape, for example. As an example, when viewed from the Y-axis direction, the outer edge of the cover 22 coincides with the outer edge of the main body 21.

[0043] In this embodiment, the surface 21a of the main body 21 is the first region A1 in the outer surface 11a of the heat sink 11, and the rear surface 21c of the main body 21 is the second region A2 in the outer surface 11a of the heat sink 11. That is, the main body 21 has a first region A1 and a second region A2. In this embodiment, the second region A2 is orthogonal to the first region A1 (i.e., perpendicularly intersecting). However, the second region A2 only needs to be in a relationship of intersecting with the first region A1. In addition, the second region A2 being in a relationship of intersecting with the first region A1 means that the "surface containing the second region A2" intersects with the "surface containing the first region A1" (not limited to being orthogonal).

[0044] like Figure 5 and Figure 6 As shown, the main body 21 has a recess 23. The recess 23 is formed on the back surface 21b and opens on the side opposite to the first region A1. The recess 23 includes a flow path 24 for the refrigerant R of the radiator 11. In this embodiment, the refrigerant R is supplied from the refrigerant supply source 4 (see reference 4). Figure 1 Compressed air.

[0045] The main body 21 includes a bottom wall portion 25, a side wall portion 26, and a plurality of protrusions 27. The bottom wall portion 25, the side wall portion 26, and the plurality of protrusions 27 are integrally formed. The bottom wall portion 25 and the side wall portion 26 define a recess 23. That is, the bottom wall portion 25 is opposite to the opening 23a of the recess 23 in the Y-axis direction, and the side wall portion 26 surrounds the recess 23 when viewed in the Y-axis direction. The plurality of protrusions 27 protrude from the bottom wall portion 25 into the recess 23. In this embodiment, the plurality of protrusions 27 are arranged side by side in the Z-axis direction with each protrusion 27 extending in the X-axis direction. As an example, the position (position in the Y-axis direction) of the end face of each protrusion 27 opposite to the bottom wall portion 25 is the same as the position of the back surface 21b in the Y-axis direction.

[0046] The main body 21 has a refrigerant supply port 28 and a refrigerant discharge port 29. The supply port 28 is formed in the portion of the side wall 26 on the side of the second region A2, opening into the inner surface of the second region A2 and the recess 23. Similarly, the discharge port 29 is formed in the portion of the side wall 26 on the side of the second region A2, opening into the inner surface of the second region A2 and the recess 23. The supply port 28 and the discharge port 29 are arranged side by side in the X-axis direction, each extending along the Z-axis direction.

[0047] The cover portion 22 has a recess 31. The recess 31 is formed on the surface 22a. When viewed in the Y-axis direction, the outer edge of the recess 31 is located outside the outer edge of the opening 23a of the recess 23. A rubber sheet 32 ​​is disposed in the recess 31. When viewed in the Y-axis direction, the outer edge of the rubber sheet 32 ​​coincides with the outer edge of the recess 31. When the rubber sheet 32 ​​exists as a single object, the thickness of the rubber sheet 32 ​​is greater than the depth of the recess 31. The cover portion 22 is mounted on the main body portion 21 with the rubber sheet 32 ​​disposed in the recess 31, thereby blocking the opening 23a of the recess 23. The cover portion 22 is threadedly fixed to the main body portion 21 on the back surface 21b. In this embodiment, a plurality of threaded holes 21d are formed in the main body portion 21 such that they are at least open on the back surface 21b, and a plurality of screw holes 22c are formed in the cover portion 22 in a manner corresponding to the plurality of threaded holes 21d. The cover 22 is mounted on the main body 21 by screwing bolts 33 into each threaded hole 21d from the back side 22b via each screw hole 22c.

[0048] In the radiator 11, the area surrounding the opening 23a in the back surface 21b of the main body 21 is tightly fitted with a rubber sheet 32. This prevents leakage of refrigerant R from the flow path 24. In this embodiment, the end faces of each protrusion 27 opposite to the bottom wall 25 are also tightly fitted with the rubber sheet 32. Alternatively, a groove extending around the opening 23a when viewed from the Y-axis direction may be formed on the surface 22a of the cover 22, and an O-ring may be disposed in this groove. In this case, leakage of refrigerant R from the flow path 24 can also be prevented.

[0049] The first piping connector 15 is threadedly fixed to the radiator 11 in the second region A2. In this embodiment, a female thread is formed on the inner peripheral surface of the supply port 28 of the main body 21, and a male thread is formed on the outer peripheral surface of one end 15a of the first piping connector 15. The first piping connector 15 is screwed onto the supply port 28 from the rear side via one end 15a and is thus mounted on the main body 21. A first piping 5 for supplying refrigerant R to the flow path 24 is connected to the first piping connector 15. The first piping connector 15 is a connector capable of detaching and attaching the first piping 5. The first piping 5 is flexible. The material of the first piping 5 is, for example, nylon, polyurethane, or fluoropolymer. In this embodiment, the first piping connector 15 is a connector capable of detaching and attaching the end of the first piping connector 15 (the flexible end) of the first piping 5. Alternatively, a connecting portion capable of detaching and attaching to the first piping connector 15 may be provided at the end of the first piping connector 15 of the first piping 5.

[0050] The second piping connector 16 is threadedly fixed to the radiator 11 in the second region A2. In this embodiment, a female thread is formed on the inner circumferential surface of the outlet 29 of the main body 21, and a male thread is formed on the outer circumferential surface of one end 16a of the second piping connector 16. The second piping connector 16 is mounted on the main body 21 by screwing it onto the outlet 29 from the rear via one end 16a. A second piping 6 for discharging refrigerant R from the flow path 24 is connected to the second piping connector 16. The second piping connector 16 is a connector capable of detaching and attaching the second piping 6. The second piping 6 is flexible. The material of the second piping 6 is, for example, nylon, polyurethane, or fluoropolymer. In this embodiment, the second piping connector 16 is a connector capable of detaching and attaching the end of the second piping connector 16 side of the second piping 6 (the flexible end). Alternatively, a connecting portion capable of detaching and attaching to the second piping connector 16 may be provided at the end of the second piping connector 16 side of the second piping 6.

[0051] like Figure 2 , Figure 3 and Figure 4 As shown, the Peltier element 12 includes an element portion 41 and a pair of wires 42. The element portion 41 has a heat-absorbing region 41a and a heat-generating region 41b. The element portion 41 is disposed in the recess 21e such that the heat-generating region 41b contacts the bottom surface of the recess 21e and the pair of wires 42 extend rearward from the element portion 41. The recess 21e is a countersunk portion formed on the surface 21a of the main body portion 21. By disposing the element portion 41 in the recess 21e, the element portion 41 is positioned relative to the main body portion 21 in various directions in the X-axis, Y-axis, and Z-axis directions. The pair of wires 42 are connected to a power source (not shown).

[0052] The mounting member 13 is mounted on the heat sink 11 such that the Peltier element 12 is positioned between the heat sink 11 and the mounting member 13. The mounting member 13 includes a middle portion 51, a front portion 52, and a rear portion 53. The middle portion 51, the front portion 52, and the rear portion 53 are integrally formed, for example, from aluminum.

[0053] The middle portion 51 has a surface (first surface) 51a perpendicular to the Y-axis direction and a back surface 51b. The front portion 52 has a surface (second surface) 52a perpendicular to the Y-axis direction and a back surface 52b. The rear portion 53 has a surface 53a perpendicular to the Y-axis direction and a back surface 53b. The back surface 51b of the middle portion 51 is in contact with the heat-absorbing region 41a of the Peltier element 12. The back surface 52b of the front portion 52 is close to the first region A1 of the heat sink 11. The back surface 53b of the rear portion 53 is close to the first region A1 of the heat sink 11. The surface 51a of the middle portion 51 and the surface 53a of the rear portion 53 are located on the same plane. The surface 52a of the front portion 52 is located on the heat sink 11 side relative to the surfaces 51a and 53a. That is, the mounting member 13 has a surface 51a and a surface 52a parallel to the first region A1, and the surface 52a is located at a position lower than the surface 51a.

[0054] The mounting member 13 is threadedly fixed to the main body 21 in the first region A1. In this embodiment, a plurality of threaded holes 21f are formed in the main body 21 with openings at least on surface 21a, and a plurality of screw holes 52c, 53c are formed in the front side 52 and the rear side 53 corresponding to the plurality of threaded holes 21f. The mounting member 13 is mounted on the main body 21 by screwing bolts 54 into each threaded hole 21f from the side opposite to the main body 21 via each screw hole 52c, 53c. In addition, a plurality of heat-insulating washers (not shown) are disposed between the first region A1 and the back surface 52b of the front side 52, and between the first region A1 and the back surface 53b of the rear side 53, and each bolt 54 passes through each heat-insulating washer. The material of each heat-insulating washer is, for example, resin. Thus, the mounting member 13 is thermally connected to the heat-absorbing region 41a of the Peltier element 12 in a state of thermal isolation from the heat sink 11.

[0055] The semiconductor laser module 14 is mounted on the mounting member 13 such that the mounting member 13 is disposed between the heat sink 11 and the semiconductor laser module 14. In this embodiment, the center of the semiconductor laser module 14 in the Z-axis direction is located at the front relative to the center of the heat sink 11 in the Z-axis direction. Figure 7 As shown, the semiconductor laser module 14 includes a housing 61, a support member 62, an insulating member 63, a wiring substrate 64, a semiconductor laser element 65, a pair of electrode pins 66, and a pair of wires 67. The housing 61 hermetically houses the support member 62, the insulating member 63, the wiring substrate 64, and the semiconductor laser element 65. A window member 61a is provided on the front side wall of the housing 61 to allow the laser L emitted from the semiconductor laser element 65 to pass through. The portion of the housing 61, except for the window member 61a, is formed of copper in a rectangular box shape, for example. The window member 61a is formed of sapphire in a circular plate shape, for example.

[0056] The support member 62 is fixed to one side of the mounting member 13 of the housing 61 (see reference). Figure 3 The insulating member 63 is fixed to the support member 62. The wiring substrate 64 is fixed to the insulating member 63. The semiconductor laser element 65 is mounted on the wiring substrate 64 opposite to the window member 61a in the Z-axis direction. A pair of electrode pins 66 are fixed to the insulating member 63 in a rearward manner and penetrate the rear wall of the housing 61. The pair of electrode pins 66 penetrate the wall in a hermetically sealed manner with electrical insulation from the wall. A pair of wires 67 are laid between the wiring substrate 64 and the pair of electrode pins 66. Thus, the pair of electrode pins 66 are electrically connected to the semiconductor laser element 65. The pair of electrode pins 66 are connected to the power supply (not shown) via a pair of wiring (not shown).

[0057] like Figure 2 , Figure 3 and Figure 4 As shown, a pair of mounting portions 68 are integrally formed on the housing 61. The pair of mounting portions 68 are provided on both sides of the housing 61 in the X-axis direction such that the back surface 61b of the housing 61 and the back surface 68a of each mounting portion 68 are on the same plane. The back surface 61b of the housing 61 and the back surface 68a of each mounting portion 68 contact the surface 51a of the intermediate portion 51 of the mounting member 13. The housing 61 is threadedly fixed to the surface 51a of the intermediate portion 51 relative to the intermediate portion 51. In this embodiment, a plurality of threaded holes 51c are formed in the intermediate portion 51 such that they are at least open on the surface 51a, and a plurality of screw holes 68b are formed in the pair of mounting portions 68 corresponding to the plurality of threaded holes 51c. The housing 61 is mounted to the intermediate portion 51 by screwing bolts 69 into the threaded holes 51c from the side opposite to the mounting member 13 via the screw holes 68b.

[0058] The semiconductor laser module 14 further includes a support member 71, a bracket 72, and a lens 73. The lens 73 is mounted inside the cylindrical bracket 72, and the bracket 72 is mounted on the support member 71. That is, the support member 71 supports the lens 73.

[0059] The support member 71 includes a mounting portion 74 and a support portion 75. The mounting portion 74 is a plate-shaped portion with its thickness along the Y-axis. The support portion 75 is a plate-shaped portion with its thickness along the Z-axis. The support portion 75 is erected along the rear end of the mounting portion 74. The mounting portion 74 and the support portion 75 are integrally formed, for example, from aluminum.

[0060] The mounting portion 74 has a back surface 74a perpendicular to the Y-axis direction. The back surface 74a is the surface of the mounting portion 74 on the side of the heat sink 11. The back surface 74a contacts the surface 52a of the front side portion 52 of the mounting member 13. The support portion 75 has a rear surface 75a perpendicular to the Z-axis direction. The rear surface 75a is the surface of the housing 61 side of the support portion 75. The rear surface 75a contacts the front surface 51d of the middle portion 51 of the mounting member 13. The front surface 51d is a surface formed by the step difference between the surface 51a of the middle portion 51 and the surface 52a of the front side portion 52, and is a surface perpendicular to the Z-axis direction. The support member 71 is threaded to the surface 52a of the front side portion 52 relative to the front side portion 52. In this embodiment, a plurality of screw holes 74b are formed in the mounting portion 74 in a manner corresponding to the plurality of screw holes 52c formed in the front side portion 52. The support member 71 is mounted on the front part 52 by screwing bolts 54 into the threaded holes 21f from the side opposite to the main body 21 of the radiator 11 via screw holes 74b and screw holes 52c.

[0061] A bracket 72 is positioned in an opening 75b formed in a support portion 75 to hold the lens 73 in place. A threaded hole 75c is formed in the support portion 75. The threaded hole 75c extends from the end face of the support portion 75 opposite to the mounting portion 74 to the inner surface of the opening 75b. The bracket 72 is fixed to the support portion 75 by a retaining screw 76 that engages with the threaded hole 75c. The optical axis of the lens 73 is aligned with the semiconductor laser element 65 (see reference). Figure 7 The optical axis is aligned with the laser beam. Lens 73 directs the laser L emitted from semiconductor laser element 65 at an exit angle of several degrees to tens of degrees toward workpiece W (refer to...). Figure 1 A focusing lens for concentrating light.

[0062] As described above, the mounting member 13 is threadedly fixed to the main body 21 of the heat sink 11 in the first region A1, and the housing 61 is threadedly fixed to the middle portion 51 of the intermediate portion 51 of the mounting member 13 via the surface 51a of the intermediate portion 51. That is, the housing 61 is threadedly fixed to the heat sink 11 in the first region A1 via the mounting member 13. Furthermore, as described above, the mounting member 13 is threadedly fixed to the main body 21 of the heat sink 11 in the first region A1, and the support member 71 is threadedly fixed to the front portion 52 of the mounting member 13 via the surface 52a of the front side portion 52. That is, the support member 71 is threadedly fixed to the heat sink 11 in the first region A1 via the mounting member 13. As described above, the semiconductor laser module 14, including the housing 61 and the support member 71, is threadedly fixed to the heat sink 11 in the first region A1. In the laser irradiation head 10, a plurality of threaded holes 21f are formed in the sidewall portion 26 of the main body 21 of the heat sink 11; therefore, the semiconductor laser module 14 is threadedly fixed to the sidewall portion 26 in the first region A1.

[0063] Furthermore, in this specification, "the first structure (part, component, module, connector, etc.) is threadedly fixed relative to the second structure (part, component, etc.) in a region (including surfaces, etc.)" means that the first structure is located within or on the region (either the first structure is in contact with the region or separated from the region), and the first structure is directly (without the aid of other components) or indirectly (with the aid of other components) mounted to the second structure using screws. Here, as a means of using screws, any combination selected from bolts, nuts, female threads formed in the first structure, male threads formed in the first structure, female threads formed in the second structure, and male threads formed in the second structure can be chosen.

[0064] In the laser irradiation head 10 configured as described above, heat is generated from the semiconductor laser element 65 when the laser L is emitted from it. The heat generated from the semiconductor laser element 65 is conducted through the housing 61 to the mounting member 13 and recovered in the heat-absorbing region 41a of the Peltier element 12. The heat discharged from the heat-generating region 41b of the Peltier element 12 is conducted to the heat sink 11 and recovered by the refrigerant R flowing in the flow path 24, including adjacent protrusions 27, etc.

[0065] As described above, in the laser irradiation head 10, the semiconductor laser module 14, the first piping connector 15, and the second piping connector 16 are threadedly fixed to the heat sink 11. Therefore, when the laser irradiation head 10 is mounted on a moving member 7 such as a robotic arm, accidental detachment of the semiconductor laser module 14, the first piping connector 15, and the second piping connector 16 from the heat sink 11 can be prevented. Furthermore, the second region A2 where the first piping connector 15 and the second piping connector 16 are threadedly fixed to the heat sink 11 intersects with the first region A1 where the semiconductor laser module 14 is threadedly fixed to the heat sink 11. Thus, while miniaturizing the heat sink 11, the semiconductor laser module 14, the first piping connector 15, and the second piping connector 16 can be spatially efficient in their arrangement relative to the heat sink 11. As described above, the laser irradiation head 10 is suitable for applications where it is mounted on a moving member 7.

[0066] By threading the semiconductor laser module 14, the first piping connector 15, and the second piping connector 16 (referred to as "semiconductor laser module 14, etc.") relative to the heat sink 11, the following effects are also achieved: Even if loosening occurs in the threaded fixation of the semiconductor laser module 14, etc., relative to the heat sink 11, the loosening is gradual, and therefore, abnormalities such as a gradual decrease in laser L output will occur in stages. Thus, the probability of detecting the loosening before the semiconductor laser module 14, etc., detaches from the heat sink 11 is increased. Consequently, damage to the laser irradiation device 1 can be reduced compared to the case of the semiconductor laser module 14, etc., accidentally detaching from the heat sink 11. Furthermore, the threaded fixation of the semiconductor laser module 14, etc., relative to the heat sink 11 also facilitates maintenance.

[0067] In the laser irradiation head 10, the heat sink 11 includes a main body 21 having a first region A1 and a second region A2, and a cover 22. The main body 21 has a recess 23 that includes a flow path 24 and opens on the side opposite to the first region A1. The cover 22 is mounted on the main body 21 to block the opening 23a of the recess 23. Thus, the flow path 24 can be maintained while the semiconductor laser module 14, the first piping connector 15, and the second piping connector 16 are threadedly fixed to the main body 21 of the heat sink 11.

[0068] In the laser irradiation head 10, the main body 21 includes a bottom wall portion 25 and a side wall portion 26 defining a recess 23, and a protrusion 27 protruding from the bottom wall portion 25 into the recess 23. The bottom wall portion 25, the side wall portion 26, and the protrusion 27 are integrally formed. As a result, heat can be easily conducted between the bottom wall portion 25, the side wall portion 26, and the protrusion 27, thereby improving the cooling effect of the semiconductor laser module 14, which is threadedly fixed relative to the main body 21.

[0069] In the laser irradiation head 10, the semiconductor laser module 14 is threadedly fixed to the side wall portion 26 of the main body portion 21 in the first region A1. This improves the stability of the threaded fixation of the semiconductor laser module 14 to the main body portion 21.

[0070] In the laser irradiation head 10, the semiconductor laser module 14 includes a housing 61 for housing the semiconductor laser element 65 and a support member 71 for supporting the lens 73. This increases the design freedom of the lens 73 relative to the semiconductor laser element 65.

[0071] In the laser irradiation head 10, the housing 61 and the support member 71 are threadedly fixed to the heat sink 11 in the first region A1 via the mounting member 13. Therefore, compared to a structure where the housing 61 and the support member 71 are respectively mounted on different members, the optical axis of the semiconductor laser element 65 and the optical axis of the lens 73 can be easily and with high precision aligned. That is, the height of the semiconductor laser element 65 and the lens 73 can be adjusted solely by the machining accuracy of the mounting member 13.

[0072] In the laser irradiation head 10, the mounting member 13 has a surface 51a and a surface 52a parallel to the first region A1, with surface 52a positioned lower than surface 51a. Furthermore, the housing 61 is disposed on surface 51a, and the support member 71 is disposed on surface 52a. Therefore, for example, even when the lens 73 is large, the optical axis of the semiconductor laser element 65 can be easily and with high precision aligned with the optical axis of the lens 73.

[0073] In the laser irradiation head 10, a Peltier element 12 is disposed between the heat sink 11 and the mounting member 13. As a result, heat can be dissipated from the Peltier element 12 to the heat sink 11, thereby cooling the semiconductor laser module 14 in a manner that keeps the temperature of the semiconductor laser element 65 constant.

[0074] In the laser irradiation head 10, the center of the semiconductor laser module 14 in the Z-axis direction (the direction parallel to the emission direction of the laser L) is located in front of the center of the heat sink 11 in the Z-axis direction (the side from which the laser L is emitted). Therefore, a space is provided on the heat sink 11 behind the semiconductor laser module 14, for example, a power supply for the semiconductor laser element 65 can be arranged in this space. Furthermore, machining the threaded holes in the heat sink 11 becomes easier.

[0075] The laser irradiation device 1 equipped with the laser irradiation head 10 described above can achieve good laser irradiation.

[0076] The present invention is not limited to the embodiments described above. The laser irradiation head 10 may also be without the Peltier element 12. In this case, the heat generated from the semiconductor laser element 65 is also conducted to the heat sink 11 via the housing 61 and the mounting member 13, and is recovered by the refrigerant R flowing in the flow path 24.

[0077] The laser irradiation head 10 may also lack the Peltier element 12 and the setting component 13. Figure 8In the laser irradiation head 10 shown, the housing 61 and the support member 71 are directly threaded relative to the heat sink 11 in the first region A1. This simplifies the construction compared to a structure where the housing 61 and the support member 71 are respectively mounted on different components, while allowing for easy and high-precision alignment of the optical axis of the semiconductor laser element 65 with the optical axis of the lens 73. In other words, the height of the semiconductor laser element 65 and the lens 73 can be adjusted solely by the machining precision of the heat sink 11.

[0078] Here, it is explained Figure 8 The structure of the laser irradiation head 10 shown is as follows. Figure 8 As shown, the back surface 61b of the housing 61 and the back surface 68a of each mounting portion 68 are in contact with the surface (third surface) 21a of the main body 21. A plurality of threaded holes 21g are formed in the main body 21, with openings at least in surface 21a. The housing 61 is mounted to the main body 21 by screwing bolts 69 into each threaded hole 21g from the side opposite to the main body 21 via each screw hole 68b. Thus, the surface 21a of the housing 61 in the first region A1 is threadedly fixed relative to the main body 21.

[0079] The back surface 74a of the mounting portion 74 of the support member 71 contacts the surface (fourth surface) 21h of the main body 21. Surface 21h is a surface perpendicular to the Y-axis direction and is located on the cover 22 side relative to surface 21a. The rear surface 75a of the support portion 75 of the support member 71 contacts the front surface 21i of the main body 21. The front surface 21i is a surface formed by the step difference between surface 21a and surface 21h, and is a surface perpendicular to the Z-axis direction. The support member 71 is mounted on the main body 21 by screwing bolts 54 into threaded holes 21f from the side opposite to the main body 21 via screw holes 74b. In this way, the support member 71 is threadedly fixed relative to the main body 21 on surface 21h, which is the first region A1. Figure 8 In the laser irradiation head 10 shown, the heat sink 11 has a surface 21a and a surface 21h that form a first region A1, with surface 21h located at a lower position than surface 21a. Furthermore, the housing 61 is disposed on surface 21a, and the support member 71 is disposed on surface 21h. Therefore, for example, even when the lens 73 is large, the optical axis of the semiconductor laser element 65 can be easily and with high precision aligned with the optical axis of the lens 73.

[0080] like Figure 9 and Figure 10As shown, alternatively, the housing 61 can be mounted on the heat sink 11 via the mounting member 13, while the support member 71 is mounted on the heat sink 11 without the mounting member 13. Thus, the semiconductor laser module 14 is threadedly fixed to the heat sink 11 in the first region A1. This allows the Peltier element 12 to be clamped between the mounting member 13 and the heat sink 11. Furthermore, alignment of the optical axis of the semiconductor laser element 65 with the optical axis of the lens 73 can be easily achieved.

[0081] In the heat sink 11, the protrusion 27 protruding from the bottom wall portion 25 into the recess 23 can be either a portion that functions as a heat dissipation fin or a portion that functions as a flow path 24. Furthermore, as... Figure 11 As shown, alternatively, a flow path 24 for refrigerant R can be formed in the radiator 11 by embedding heat pipes or the like in the radiator 11. Furthermore, the refrigerant R is not limited to air; it can be other gases such as inert gases, or liquids such as water. However, if the refrigerant R is air, even if it leaks from the radiator 11, it is possible to prevent the workpiece W from being contaminated by the refrigerant R. Furthermore, if the refrigerant R is air, it is not necessary for the refrigerant R to return to the refrigerant supply source 4 from the flow path 24 via the second piping connector 16 and the second piping 6. Additionally, in the laser irradiation apparatus 1 described above, the refrigerant R can be supplied in a circulating manner while cooling.

[0082] like Figure 12 As shown in (a), in the semiconductor laser module 14, a lens 77 serving as a collimating lens may also be disposed between the housing 61 housing the semiconductor laser element 65 and the lens 73 serving as a focusing lens. Furthermore, as... Figure 12 As shown in (b), in the semiconductor laser module 14, a lens 77, serving as a collimating lens, may be used instead of the lens 73, which is a condenser lens. Figure 12 In (a) and (b), the illustration of the support member 71 for supporting at least one of the lenses 73 and 77 is omitted. However, by using a different support member 71, which is different from the housing 61, to support at least one of the lenses 73 and 77, the design freedom of the lens 73 relative to the semiconductor laser element 65 can be increased.

[0083] like Figure 13 As shown in (a), in the semiconductor laser module 14, it is also possible that, instead of window member 61a (see reference), a different component is used on the housing 61 that houses the semiconductor laser element 65. Figure 7 Lens 77 is configured as a collimating lens. Furthermore, as... Figure 13 As shown in (b), in the semiconductor laser module 14, it is also possible that, instead of window member 61a (see reference), a different component is used on the housing 61 that houses the semiconductor laser element 65. Figure 7The lens 73 is configured as a condenser lens. As a result, the structure of the support member 71 for at least one of the supporting lenses 73 and 77 can be simplified, or the support member 71 can be omitted.

[0084] The semiconductor laser module 14 may also include multiple semiconductor laser elements 65 (e.g., an array of semiconductor laser elements). Furthermore, heat spreaders such as carbon graphite sheets may be arranged between thermally connected components. Additionally, the laser irradiation head 10 may also be equipped with a power supply for the semiconductor laser elements 65.

[0085] [Symbol Explanation]

[0086] 1. Laser irradiation device

[0087] 4. Refrigerant supply source

[0088] 5 First Piping

[0089] 6 Second piping

[0090] 7 moving components

[0091] 10 laser irradiation heads

[0092] 11 Radiators

[0093] 11a outer surface

[0094] 12 Peltier elements

[0095] 13 Setting up components

[0096] 14 Semiconductor Laser Module

[0097] 15 First Pipe Connector

[0098] 16 Second Pipe Connector

[0099] 21 Main body

[0100] Surface 21a (Third Surface)

[0101] 21h surface (fourth surface)

[0102] 22 cover

[0103] 23 concavity

[0104] 23a opening

[0105] 24 flow paths

[0106] 25 bottom wall

[0107] 26 side wall sections

[0108] 27 protrusions

[0109] 51a surface (first surface)

[0110] 52a surface (second surface)

[0111] 61 enclosure

[0112] 65 Semiconductor Laser Components

[0113] 71 Supporting Components

[0114] 73 and 77 lenses

[0115] A1 First Area

[0116] A2 Second Area

[0117] R refrigerant.

Claims

1. A laser irradiation head, wherein, have: A semiconductor laser module, comprising a semiconductor laser element and a lens; A radiator, which has a refrigerant flow path; and A first piping connector is available for attaching and detaching a first piping used to supply refrigerant to the flow path. The heat sink has an outer surface comprising a first region and a second region. The heat sink includes: a main body having the first region and the second region, and a cover. The main body portion has a recess that includes the flow path and opens on a side opposite to the first region. The cover is installed on the main body in such a way that it blocks the opening of the recess. The main body includes: a bottom wall portion and a side wall portion defining the recess, and a protrusion portion protruding from the bottom wall portion into the recess. The bottom wall portion, the side wall portion, and the protrusion are integrally formed. The face containing the second region intersects with the face containing the first region. The semiconductor laser module is threadedly fixed relative to the heat sink in the first region. The first piping connector is threaded in the second region relative to the heat sink.

2. The laser irradiation head as described in claim 1, wherein, It also includes: a second piping connector, which enables the installation and removal of a second piping for discharging the refrigerant from the flow path. The second piping connector is threaded in the second region relative to the heat sink.

3. The laser irradiation head as described in claim 1, wherein, The semiconductor laser module is threadedly fixed in the first region relative to the sidewall portion.

4. The laser irradiation head according to any one of claims 1 to 3, wherein, The semiconductor laser module further includes: a housing for housing the semiconductor laser element, and a support member for supporting the lens.

5. The laser irradiation head as described in claim 4, wherein, It also includes: a mounting component disposed between the heat sink and the semiconductor laser module. The housing and the support member are threadedly fixed relative to the radiator in the first region via the setting member.

6. The laser irradiation head as described in claim 5, wherein, The mounting component has a first surface and a second surface parallel to the first region. The second surface is located at a lower position than the first surface. The housing is disposed on the first surface. The support member is disposed on the second surface.

7. The laser irradiation head as described in claim 5 or 6, wherein, It also includes a Peltier element disposed between the heat sink and the mounting member.

8. The laser irradiation head as described in claim 4, wherein, The housing and the supporting member are threadedly fixed directly relative to the radiator in the first region.

9. The laser irradiation head as described in claim 8, wherein, The heat sink has a third surface and a fourth surface that form the first region. The fourth surface is located at a lower position than the third surface. The housing is disposed on the third surface. The support member is disposed on the fourth surface.

10. A laser irradiation device, wherein, have: The laser irradiation head according to any one of claims 1 to 9; The first conduit is flexible and connected to the first conduit connector; A refrigerant supply source supplies the refrigerant to the flow path via the first piping; as well as A movable component that moves the laser irradiation head.

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