Display device having display module and method of manufacturing the same

Abstract

According to the disclosure, a display module includes a substrate including a mounting surface on which a plurality of inorganic light emitting elements are mounted, a side surface, and a rear surface located on an opposite side of the mounting surface, a front cover joined to the mounting surface and covering the mounting surface, and a side cover for surrounding the side surface and a metal plate joined with the rear surface. A position of the front cover is more outward than the mounting surface in a first direction in which the mounting surface extends, and the side cover extends from an upper portion of the metal plate to a lower end of an area of the front cover in a second direction in which the mounting surface faces, such that the side surface is sealed with respect to the outside, wherein a position of the area of the front cover is more outward than the mounting surface. In the side cover, a position of a portion provided at the lower end of the area of the front cover and more outward than the mounting surface is more outward than the mounting surface in the first direction.

Description

Technical Field

[0001] Embodiments of this disclosure relate to a display device for displaying images via coupled modules, each module having a self-emitting inorganic light-emitting diode (LED) mounted on a substrate. Background Technology

[0002] A display device is an output device that visually displays data information such as characters, graphics, and images.

[0003] Typically, display devices primarily use backlit liquid crystal panels or organic LED (OLED) panels, which are formed from organic compound films that emit light in response to electric current. However, liquid crystal panels suffer from slow response times, high power consumption, and require backlighting due to their self-emissive nature, making it difficult to provide compact display devices. In contrast, OLED panels do not require backlighting because they are self-emissive, thus achieving thinner designs. However, OLED panels are prone to burn-in, a phenomenon where, when displaying the same image for an extended period, even during image transitions, a portion of the image remains due to the end of the subpixel's lifespan.

[0004] Therefore, in order to find alternatives to LCD and OLED panels, research has been conducted on micro light-emitting diodes (micro LEDs or μLEDs) that mount inorganic LEDs on a substrate and use the inorganic LEDs themselves as pixels.

[0005] Micro LED display panels (hereinafter referred to as micro LED panels) are a type of flat panel display panel and consist of multiple inorganic LEDs, each of which has a size of less than or equal to 100 micrometers.

[0006] This type of LED panel is a self-emissive device, but as an inorganic light-emitting diode, it is not prone to OLED burn-in and has excellent brightness, resolution, power consumption, and durability.

[0007] Compared to LCD panels that require backlighting, micro-LED display panels offer better contrast, response time, and energy efficiency. Both OLED and micro-LED are inorganic LEDs with excellent energy efficiency, but micro-LEDs offer superior brightness, luminous efficiency, and a longer lifespan than OLEDs.

[0008] Furthermore, micro LEDs can achieve substrate-level display modulation by arranging LEDs on a circuit board in units of pixels, and can provide various resolutions and screen sizes of displays according to customer requirements. Summary of the Invention

[0009] Technical issues

[0010] The embodiments of this disclosure aim to provide a display device and a method for manufacturing the display device, and more specifically, to provide a technical feature suitable for large-size displays for anti-static protection in display modules and a display device having the technical feature.

[0011] Solutions to technical problems

[0012] According to an embodiment, a display module is provided. The display module includes: a substrate including a mounting surface on which a plurality of inorganic light-emitting diodes (LEDs) are mounted, a side surface, and a rear surface disposed opposite to the mounting surface; a front cover joined to and covering the mounting surface; a metal plate joined to the rear surface; and a side cover configured to surround the side surface, wherein the front cover extends to a region outside the mounting surface in a first direction extending from the mounting surface, and wherein the side cover is configured to extend from the upper side of the metal plate to the lower end of the region of the front cover in a second direction facing the mounting surface to seal the side surface relative to the outside, and a portion of the side cover disposed at the lower end of the region of the front cover extends outward from the mounting surface in the first direction extending from the mounting surface.

[0013] According to one or more embodiments, the display module further includes: a side end member disposed on the outer end of the side cover in a first direction extending from the mounting surface, and the side end member comprises a material with a higher conductivity than that of the side cover.

[0014] According to one or more embodiments, one end of the side member in a second direction facing the mounting surface contacts the metal plate.

[0015] According to one or more embodiments, the other end of the side member in a first direction facing the mounting surface contacts the front cover.

[0016] According to one or more embodiments, one end of the side member is in contact with the side end of the metal plate.

[0017] According to one or more embodiments, one end of the side member contacts the side end of the metal plate in a first direction extending from the mounting surface, and the other end of the side member contacts the side end of the front cover in the first direction extending from the mounting surface.

[0018] According to one or more embodiments, the side cover comprises a non-conductive material.

[0019] According to one or more embodiments, the side cover includes a light-absorbing material.

[0020] According to one or more embodiments, the side surface is configured to correspond to the four edges of the mounting surface, the front cover is configured to extend beyond the four edges of the mounting surface in the direction in which the mounting surface extends, and the side cover surrounds the lower end and side surface of the area of ​​the front cover outside the mounting surface in the direction.

[0021] According to one or more embodiments, the side cover extends from the four edges of the mounting surface to the four edges of the metal plate corresponding to the four edges of the mounting surface, such that the side cover surrounds all four edges of the metal plate.

[0022] According to one or more embodiments, the display module further includes a driving circuit board disposed on a metal plate and configured to electrically control a plurality of inorganic LEDs, wherein the substrate further includes: chamfered portions formed between a mounting surface and a side surface and between a rear surface and a side surface, respectively; side surface wiring extending along the side surface and the chamfered portions and configured to electrically connect the plurality of inorganic LEDs to the driving circuit board, and side covers surrounding the side surface, the chamfered portions and the side surface wiring.

[0023] According to one or more embodiments, the substrate further includes: a chamfered portion formed between the mounting surface and the side surface and between the rear surface and the side surface, respectively, and a side cover surrounding the entire chamfered portion.

[0024] According to one or more embodiments, the front cover includes a first region in a region outside the mounting surface in a second direction extending from the mounting surface, and also includes a second region disposed on the mounting surface, and the side cover is disposed below the front cover at a position corresponding to the first region along the second direction, and is not disposed in the second region.

[0025] According to an embodiment, a display device is provided. The display device includes: a display module array, wherein a plurality of display modules are horizontally arranged in an M×N matrix, wherein each of the plurality of display modules includes: a substrate, including a mounting surface on which a plurality of inorganic light-emitting diodes (LEDs) are mounted, a side surface, and a rear surface disposed opposite to the mounting surface; a front cover, joined to and covering the mounting surface; a metal plate, joined to the rear surface; and a side cover configured to surround the side surface, wherein the front cover extends beyond the mounting surface in a first direction extending from the mounting surface, and wherein the side cover extends from the upper side of the metal plate to the lower end of the area of ​​the front cover in a second direction facing the mounting surface to seal the side surface relative to the outside, and a portion of the side cover disposed at the lower end of the area of ​​the front cover extends outward from the mounting surface in the first direction extending from the mounting surface.

[0026] According to one or more embodiments, each of the plurality of display modules further includes: a side end member disposed on the outer end of the side cover in a first direction extending from the mounting surface, and the side end member comprising a material with a higher conductivity than that of the side cover.

[0027] According to an embodiment, a method for manufacturing a display module is provided. The method includes: obtaining a substrate including a mounting surface on which a plurality of inorganic light-emitting diodes (LEDs) are mounted, a side surface, and a rear surface disposed opposite to the mounting surface; attaching a front cover to the mounting surface to cover the mounting surface; distributing side covers to surround the side surfaces; and attaching a metal plate to the rear surface of the substrate, wherein the front cover extends beyond the mounting surface in a first direction extending from the mounting surface, and wherein the side covers extend from an upper side of the metal plate to a lower end of a region of the front cover in a second direction facing the mounting surface to seal the side surface relative to the outside, and a portion of the side cover disposed at the lower end of the region of the front cover extends outwardly from the mounting surface in the first direction extending from the mounting surface.

[0028] According to one or more embodiments, the method further includes: disposing a side end member on an outer end of a side cover in a first direction extending from the mounting surface, wherein the side end member comprises a material with a higher conductivity than that of the side cover.

[0029] According to one or more embodiments, the method further includes: simultaneously cutting the front cover and the side cover in a second direction, such that at least a portion of the front cover and the side cover of the display module remains outside the mounting surface in a first direction extending from the mounting surface.

[0030] According to one or more embodiments, one end of the side member in a second direction facing the mounting surface contacts the metal plate.

[0031] According to one or more embodiments, the other end of the side member in a first direction facing the mounting surface contacts the front cover.

[0032] Beneficial effects

[0033] As is apparent from the above description, the plurality of display modules of the display device according to embodiments of the present disclosure have a front side and a lateral side sealed by a front cover and a side cover, respectively, and a rear side sealed by a metal plate, thereby improving the electrostatic discharge (ESD) withstand voltage during the manufacturing and transportation of the display modules and after the display modules are assembled in the display device. Attached Figure Description

[0034] Figure 1 This is a diagram illustrating a display device according to an embodiment.

[0035] Figure 2 It shows Figure 1 An exploded view of the main components of the display device shown.

[0036] Figure 3 It shows Figure 1 The image shows an enlarged view of some components of the display module.

[0037] Figure 4 It shows Figure 1 The rear perspective view of the display module of the display device shown.

[0038] Figure 5 It shows Figure 1 The image shows a perspective view of some components of the display module.

[0039] Figure 6 It shows Figure 1 The diagram shows a cross-sectional view of some components of the display device taken along the second direction.

[0040] Figure 7 It shows Figure 1 The diagram shows a cross-sectional view of some components of the display device taken along a third direction.

[0041] Figure 8 It shows Figure 1 The diagram shows a cross-sectional view of some components of the display module taken along a third direction.

[0042] Figure 9 It shows Figure 6 Enlarged cross-sectional views of some of the components shown.

[0043] Figure 10 It shows Figure 7 Enlarged cross-sectional views of some of the components shown.

[0044] Figure 11 This is an enlarged cross-sectional view showing some components of the display module of a display device according to another embodiment.

[0045] Figure 12 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment.

[0046] Figure 13 This is a diagram illustrating the process of manufacturing a display device according to an embodiment.

[0047] Figure 14 It is shown in Figure 12 The diagram shows the process of manufacturing the display device after the process shown.

[0048] Figure 15 It is shown in Figure 13 The diagram shows the process of manufacturing the display device after the process shown.

[0049] Figure 16 It is shown in Figure 14 The diagram shows the process of manufacturing the display device after the process shown.

[0050] Figure 17 It is shown in Figure 15The diagram shows the process of manufacturing the display device after the process shown.

[0051] Figure 18 It is shown in Figure 16 The diagram shows the process of manufacturing the display device after the process shown. Detailed Implementation

[0052] The exemplary embodiments described herein do not represent the full technical spirit of this disclosure, and therefore should be understood to be substituted with various equivalents and modifications.

[0053] In the following description, it should be understood that, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” include plural references. For clarity, irrelevant parts are not shown, and the dimensions of components are enlarged for clarity.

[0054] It will also be understood that the terms “comprising,” “including,” and / or “having,” when used in this specification, specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof.

[0055] Furthermore, the term "identical" in this specification can include things that are similar in nature or similar within a certain range. Additionally, "identical" means "substantially identical." It should be understood that "substantially identical" means a value falling within the manufacturing tolerance range, or a value that differs but is not significantly different from a reference value.

[0056] In the following description, certain non-limiting exemplary embodiments will be described in detail with reference to the accompanying drawings.

[0057] Figure 1 This is a diagram illustrating a display device according to an embodiment. Figure 2 It shows Figure 1 An exploded view of the main components of the display device shown. Figure 3 It shows Figure 1 The diagram shows the substrate of the display module. Figure 4 It shows Figure 1 Enlarged cross-sectional views of some of the components shown, and Figure 5 It shows Figure 1 The diagram shows a cross-sectional view of some components of the display device taken along the second direction.

[0058] In the following description, the components of the display device 1, including the plurality of inorganic LEDs 50 shown in the accompanying drawings, are components with micro-units ranging in size from a few μm to several hundred μm, and for ease of description, the dimensions of some components shown in the accompanying drawings (the plurality of inorganic LEDs 50, the black matrix 48, etc.) may be enlarged.

[0059] Display device 1 is a device that displays information, data, etc. (e.g., characters, numbers, graphics, images, etc.), and can be implemented as a television (TV), personal computer (PC), mobile device, digital signage, etc.

[0060] According to the embodiment, see Figure 1 and Figure 2 The display device 1 includes a display panel 20 configured to display an image, a power supply device configured to supply power to the display panel 20, a main board 25 configured to control the overall operation of the display panel 20, a frame 15 supporting the display panel 20, and a rear cover 10 covering the rear surface of the frame 15.

[0061] The display panel 20 may include: a plurality of display modules 30A, 30B, 30C, 30D, 30E, 30F, 30G, 30H, 30I, 30J, 30K, 30L, 30M, 30N, 30O and 30P, a driver board for driving each of the display modules 30A to 30P, and a timing controller (TCON) board for generating the timing signals required to control each of the display modules 30A to 30P.

[0062] The back cover 10 can support the display panel 20. The back cover 10 can be mounted on the floor by a bracket or on the wall by a wall mount.

[0063] Multiple display modules 30A to 30P can be arranged adjacent to each other in a top-to-bottom and left-to-right direction. The multiple display modules 30A to 30P can be arranged in an M×N matrix, where M and N are natural numbers. In this embodiment, 16 display modules 30A to 30P are configured and arranged in a 4×4 matrix, but there are no limitations on the number of display modules or their arrangement.

[0064] Multiple display modules 30A to 30P can be mounted on the frame 15. The multiple display modules 30A to 30P can be mounted on the frame 15 by various methods (e.g., using magnetic force or mechanical assembly structures). A rear cover 10 is coupled to the rear of the frame 15, and the rear cover 10 can form the rear appearance of the display device 1.

[0065] The back cover 10 may include a metallic material. Therefore, heat generated from the multiple display modules 30A to 30P and the frame 15 can be easily conducted to the back cover 10, thereby improving the heat dissipation efficiency of the display device 1.

[0066] As described above, the display device 1 according to the embodiment can realize a large screen by tiling multiple display modules 30A to 30P.

[0067] In other embodiments of this disclosure, multiple display modules 30A to 30P can be individually applied to a display device. That is, display modules 30A to 30P can be individually installed and applied to wearable devices, portable devices, handheld devices, and other various types of electronic products or electronic components and mounting components that require a display, or they can be applied to display devices, such as monitors for personal computers (PCs), high-resolution televisions (TVs), signage, and electronic displays assembled in a matrix form.

[0068] Multiple display modules 30A to 30P can have the same configuration. Therefore, the following description of any display module can be equally applied to all other display modules.

[0069] Since multiple display modules 30A to 30P have the same configuration, the multiple display modules 30A to 30P will be described with respect to display module 30A (hereinafter referred to as "first display module 30A").

[0070] That is, to avoid repetitive description, the configuration of multiple display modules 30A to 30P will be described with respect to the display module 30, the substrate 40 and the front cover 70 as examples.

[0071] In addition, the first display module 30A, the display module 30E (hereinafter referred to as "second display module 30E") which is disposed adjacent to the first display module 30A in the second direction Y, and the display module 30B (hereinafter referred to as "third display module 30E") which is disposed adjacent to the first display module 30A in the third direction Z will be described.

[0072] One of the multiple display modules 30A to 30P (e.g., the first display module 30A) can be formed in a quadrilateral shape. Alternatively, the first display module 30A can be configured as a rectangular or square shape.

[0073] Therefore, the first display module 30A may include an upper edge 32 and a lower edge 34 formed on the upper and lower sides respectively relative to the first direction X (i.e., the forward direction), and a left edge 33 and a right edge 31 formed on the left and right sides respectively.

[0074] refer to Figure 3Each of the plurality of display modules 30A to 30P may include a substrate 40 and a plurality of inorganic LEDs 50 mounted on the substrate 40. The plurality of inorganic LEDs 50 may be mounted on a mounting surface 41 of the substrate 40 facing a first direction X. Figure 3 In the diagram, for ease of description, the thickness of the substrate 40 in the first direction X is shown magnified.

[0075] The substrate 40 can be formed in a quadrilateral shape. As described above, the plurality of display modules 30A to 30P can be formed in a quadrilateral shape, and the substrate 40 can be formed in a quadrilateral shape to correspond to each display module.

[0076] The substrate 40 can be configured as a rectangular shape or a square shape.

[0077] Therefore, taking the first display module 30A as an example, the substrate 40 may include the right edge 31, upper edge 32, left edge 33, and lower edge 34 of the first display module 30A (see [link to documentation]). Figure 2 The four corresponding edges E (see) Figure 5 ).

[0078] The substrate 40 may include a substrate body 42, a mounting surface 41 forming one surface of the substrate body 42, a rear surface 43 forming the other surface of the substrate body 42 and disposed opposite to the mounting surface 41, and a side surface 45 disposed between the mounting surface 41 and the rear surface 43 (see See Figure 5 ).

[0079] The substrate 40 may include a plurality of chamfered portions 49 formed between the mounting surface 41 and the side surface 45 and between the rear surface 43 and the side surface 45 (see [reference]). Figure 5 ).

[0080] Multiple chamfered portions 49 can prevent the corresponding substrate from being bumped and damaged when multiple display modules 30A to 30P are arranged.

[0081] The edge E of the substrate 40 is intended to include the side surface 45 and the chamfered portion 49.

[0082] The substrate 40 includes a thin-film transistor (TFT) layer 44 formed on the substrate body 42 to drive the inorganic LED 50. The substrate body 42 may include a glass substrate. That is, the substrate 40 may include a chip-on-glass (COG) type substrate. The substrate 40 may include a first pad electrode 44a and a second pad electrode 44b configured to electrically connect the inorganic LED 50 to the TFT layer 44.

[0083] The TFT forming the thin-film transistor (TFT) layer 44 is not limited to a specific structure or type and can be configured in various embodiments. That is, the TFT of the TFT layer 44 according to embodiments of the present disclosure can be implemented using low-temperature polycrystalline silicon (LTPS) TFTs, oxide TFTs, Si (polycrystalline silicon or monocrystalline silicon) TFTs, but can also be implemented using organic TFTs, graphene TFTs, etc.

[0084] Furthermore, when the substrate body 42 of the substrate 40 is formed from a silicon wafer, the TFT layer 44 can be replaced with a complementary metal-oxide-semiconductor (CMOS) transistor, or an n-type MOSFET or a p-type MOSFET transistor.

[0085] Multiple inorganic LEDs 50 may include inorganic LEDs formed of inorganic materials, each having a width, length, and height of several μm to tens of μm.

[0086] According to one example of an embodiment of this disclosure, a plurality of inorganic light-emitting diodes 50 may be configured to have miniature inorganic light-emitting diodes. Each miniature inorganic LED may have a short side of 100 μm or less in width, length, and height. That is, each of the inorganic LEDs 50 can be picked up from a sapphire or silicon wafer and transferred directly onto the substrate 40. The plurality of inorganic LEDs 50 can be picked up and transported by an electrostatic method using an electrostatic head, or by a stamping method using an elastic polymer material such as polydimethylsiloxane (PDMS) or silicon as the head.

[0087] Multiple inorganic LEDs 50 are light-emitting structures comprising an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57b.

[0088] Although not shown in the accompanying drawings, one of the first contact electrode 57a and the second contact electrode 57b is electrically connected to the n-type semiconductor 58a, while the other is configured to be electrically connected to the p-type semiconductor 58b.

[0089] The first contact electrode 57a and the second contact electrode 57b can be in the form of flip chips so that they are arranged parallel to each other while facing the same direction (opposite to the direction of light emission).

[0090] Each of the inorganic LEDs 50 may include a light-emitting surface 54, a side surface 55, and a bottom surface 56 disposed on the side opposite to the light-emitting surface 54 when mounted on the mounting surface 41, and a first contact electrode 57a and a second contact electrode 57b may be formed on the bottom surface 56.

[0091] That is, the first contact electrode 57a and the second contact electrode 57b of the inorganic LED 50 can be disposed on the side opposite to the light-emitting surface 54, thereby being disposed on the side opposite to the light-emitting direction.

[0092] The first contact electrode 57a and the second contact electrode 57b can be configured to face the mounting surface 41, can be electrically connected to the TFT layer 44, and the light-emitting surface 54 can be arranged to emit light in a direction opposite to the first contact electrode 57a and the second contact electrode 57b.

[0093] Therefore, when light generated from the active layer 58c is emitted along the first direction X through the light-emitting surface 54, the light can be emitted along the first direction X without interfering with the first contact electrode 57a or the second contact electrode 57b.

[0094] That is, the first direction X can be defined as the direction in which light is emitted from the light-emitting surface 54.

[0095] The first contact electrode 57a and the second contact electrode 57b can be electrically connected to the first pad electrode 44a and the second pad electrode 44b formed on one side of the mounting surface 41 of the substrate 40, respectively.

[0096] Each of the plurality of inorganic LEDs 50 can be directly connected to a corresponding pad electrode in the first pad electrode 44a and the second pad electrode 44b by means of a bonding configuration (e.g., anisotropic conductive layer 47 or solder).

[0097] An anisotropic conductive layer 47 can be formed on the substrate 40 to serve as a medium for electrical bonding between the first contact electrode 57a and the first pad electrode 44a, and between the second contact electrode 57b and the second pad electrode 44b. The anisotropic conductive layer 47 can represent anisotropic conductive adhesive attached to a protective film, and has a structure in which conductive spheres 47a are dispersed in the adhesive resin. The conductive spheres 47a can be conductive spheres surrounded by a thin insulating film, and electrical connections occur between the conductors when the insulating film is damaged by pressure.

[0098] The anisotropic conductive layer 47 may include an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste.

[0099] Therefore, when multiple inorganic LEDs 50 are mounted on the substrate 40, the pressure applied to the anisotropic conductive layer 47 causes the insulating film of the conductive ball 47a to break, so that the first contact electrode 57a and the second contact electrode 57b of the inorganic LED 50 can be electrically connected to the first pad electrode 44a and the second pad electrode 44b of the substrate 40.

[0100] Although not shown in the accompanying drawings, multiple inorganic LEDs 50 can be mounted on the substrate 40 using solder instead of the anisotropic conductive layer 47. The inorganic LEDs 50 can be first aligned on the substrate 40, and then the inorganic LEDs 50 can be bonded to the substrate 40 via a reflow process.

[0101] Multiple inorganic LEDs 50 may include red LEDs 51, green LEDs 52, and blue LEDs 53, and the inorganic LEDs 50 may be mounted on the mounting surface 41 of the substrate 40 as a unit, consisting of a series of multiple red LEDs 51, multiple green LEDs 52, and multiple blue LEDs 53. This series of multiple red LEDs 51, multiple green LEDs 52, and multiple blue LEDs 53 can form a pixel. In this case, each of the red LEDs 51, multiple green LEDs 52, and multiple blue LEDs 53 can form a sub-pixel.

[0102] The red LED 51, green LED 52, and blue LED 53 can be arranged in a line at predetermined intervals as in the embodiment, or they can be arranged in different shapes, such as triangles.

[0103] The substrate 40 may include a light-absorbing layer 44c to improve contrast by absorbing external light. The light-absorbing layer 44c may be integrally formed on one side of the mounting surface 41 of the substrate 40. The light-absorbing layer 44c may be formed between the TFT layer 44 and the anisotropic conductive layer 47.

[0104] The multiple display modules 30A to 30P may also include a black matrix 48 formed between multiple inorganic LEDs 50.

[0105] The black matrix 48 can supplement the light-absorbing layer 44c, which is integrally formed on one side of the mounting surface 41 of the substrate 40. That is, the black matrix 48 absorbs external light and makes the substrate 40 appear black, thereby improving the contrast of the image.

[0106] Black Matrix 48 can be black.

[0107] In this embodiment, the black matrix 48 is formed between pixels, each of which is formed by a series of multiple red LEDs 51, multiple green LEDs 52, and multiple blue LEDs 53. In this embodiment, the black matrix 48 can be formed with high precision and separate each of the red LEDs 51, green LEDs 52, and blue LEDs 53 as sub-pixels.

[0108] The black matrix 48 can be formed into a grid shape with horizontal and vertical patterns to be arranged between pixels.

[0109] The black matrix 48 can be formed by applying light-absorbing ink to the anisotropic conductive layer 47 using an inkjet process and then curing the ink, or by coating the anisotropic conductive layer 47 with a light-absorbing film.

[0110] That is, on the anisotropic conductive layer 47 integrally formed on the mounting surface 41, the black matrix 48 can be formed in the gaps between the multiple inorganic LEDs 50 where no multiple inorganic LEDs 50 are installed.

[0111] Each of the multiple display modules 30A to 30P may include a front cover 70 disposed on the mounting surface 41 along the first direction X, so as to cover the mounting surface 41 of the respective display module among the multiple display modules 30A to 30P.

[0112] Multiple front covers 70 can be provided, such that the multiple front covers 70 are respectively formed on multiple display modules 30A to 30P along the first direction X (see...). Figure 6 and Figure 7 ).

[0113] Each of the plurality of display modules 30A to 30P can be assembled with each other after its respective front cover 70 is formed. That is, among the plurality of display modules 30A to 30P, for the first display module 30A and the second display module 30E, a first front cover 70A can be formed on the mounting surface 41 of the first display module 30A, and a second front cover 70E can be formed on the mounting surface 41 of the second display module 30E.

[0114] The front cover 70 can be configured to cover the substrate 40 to protect the substrate 40 from external forces or external moisture.

[0115] The front cover 70 may include multiple layers (not shown). The front cover 70 may include an adhesive layer (not shown) configured to bond the front cover 70 to the mounting surface 41 of the substrate 40.

[0116] The multiple layers (not shown) of the front cover 70 can be configured as functional films with optical properties. This will be described in detail below.

[0117] Each front cover 70 can be formed of optically transparent resin (OCR). Specifically, the adhesive layer (not shown) can be formed of OCR. The OCR can be in a highly transparent state with a transmittance of 90% or higher.

[0118] OCR can improve visibility and image quality through its low reflectivity. That is, in structures with air gaps, light loss occurs due to the difference in refractive index between the film layer and the air layer, but in structures using OCR, the difference in refractive index is reduced, thereby reducing light loss and thus improving visibility and image quality.

[0119] That is, OCR can improve image quality while protecting the substrate 40.

[0120] Typically, the front cover 70 can be configured to have a height greater than or equal to a predetermined height in the first direction X facing the mounting surface 41 or the light-emitting surface 54.

[0121] Therefore, when the front cover 70 is formed on the substrate 40, the gap that may be formed between the front cover 70 and the plurality of inorganic LEDs 50 is fully filled.

[0122] In addition, each of the plurality of display modules 30A to 30P may include an adhesive layer 61 disposed between the rear surface 43 and the metal plate 60 to bond the rear surface 43 of the substrate 40 and the metal plate 60 to each other.

[0123] Multiple inorganic LEDs 50 can be electrically connected to pixel drive wiring (not shown) formed on mounting surface 41 and an upper surface wiring layer (not shown) extending through side surface 45 of substrate 40 and formed by pixel drive wiring (not shown).

[0124] An upper surface wiring layer (not shown) may be formed beneath the anisotropic conductive layer 47. The upper surface wiring layer (not shown) may be electrically connected to side surface wiring 46 formed on the side surface 45 of the substrate 40. For example... Figure 4 As shown, the side surface wiring 46 can be configured as a thin film.

[0125] Regarding the first direction X facing the forward direction of the display device 1, when it is assumed that the direction perpendicular to the first direction X and facing the left and right direction of the display device 1 is the second direction Y, and when it is assumed that the direction perpendicular to the first direction X and the second direction Y and facing the up and down direction of the display device 1 is the third direction Z, the side surface wiring 46 can extend along the chamfered portion 49 and the side surface 45 of the substrate 40 in the third direction Z to the rear surface 43 of the substrate 40.

[0126] However, embodiments of this disclosure are not limited thereto, and the side surface wiring 46 may extend along the chamfered portion 49 and the side surface 45 of the substrate 40 in the second direction Y to the rear surface 43 of the substrate 40.

[0127] According to an embodiment, the side surface wiring 46 may be configured to extend along one side of the substrate 40 corresponding to the upper edge 32 and lower edge 34 of the first display module 30A.

[0128] However, embodiments of this disclosure are not limited thereto, and the side surface wiring 46 may extend along the edge E of the substrate 40 corresponding to at least two of the right edge 31, upper edge 32, left edge 33 and lower edge 34 of the first display module 30A.

[0129] The upper surface wiring layer (not shown) can be connected to the side surface wiring 46 via an upper surface connection pad (not shown) formed on one side of the edge E of the substrate 40.

[0130] The side surface wiring 46 can extend along the side surface 45 of the substrate 40 and can be connected to the rear surface wiring layer 43b formed on the rear surface 43.

[0131] An insulating layer 43c covering the rear surface wiring layer 43b can be formed on the rear surface wiring layer 43b in the direction facing the rear surface 43 of the substrate 40.

[0132] That is, multiple inorganic LEDs 50 can be sequentially electrically connected to the upper surface wiring layer (not shown), the side surface wiring 46 and the rear surface wiring layer 43b.

[0133] In addition, such as Figure 4 As shown, the first display module 30A may include a driver circuit board 80 configured to electrically control a plurality of inorganic LEDs 50 mounted on a mounting surface 41. The driver circuit board 80 may be formed as a printed circuit board. The driver circuit board 80 may be disposed on the rear surface 43 of the substrate 40 along a first direction X. Although described in detail below, the driver circuit board 80 may be disposed on a metal plate 60 bonded to the rear surface 43 of the substrate 40.

[0134] The first display module 30A may include a flexible film 81 that connects a drive circuit board 80 to a rear surface wiring layer 43b, such that the drive circuit board 80 is electrically connected to a plurality of inorganic LEDs 50.

[0135] In detail, one end of the flexible film 81 can be disposed on the rear surface 43 of the substrate 40, and the flexible film 81 can be connected to the rear surface connection pad 43d, which is electrically connected to a plurality of inorganic LEDs 50.

[0136] The rear surface connection pad 43d can be electrically connected to the rear surface wiring layer 43b. Therefore, the rear surface connection pad 43d can electrically connect the rear surface wiring layer 43b to the flexible film 81.

[0137] With the flexible film 81 electrically connected to the rear surface connection pad 43d, power and electrical signals from the drive circuit board 80 can be sent to multiple inorganic LEDs 50.

[0138] The flexible membrane 81 can be formed from a flexible flat cable (FFC) or a chip on membrane (COF).

[0139] The flexible membrane 81 may include a first flexible membrane 81a and a second flexible membrane 81b arranged in an upward direction and a downward direction respectively relative to the first direction X (i.e., the forward direction).

[0140] The first flexible membrane 81a and the second flexible membrane 81b are not limited thereto, and can be arranged in the left and right directions relative to the first direction X, or can be arranged in at least two of the directions of up, down, left and right.

[0141] The second flexible membrane 81b can be configured as multiple units. However, the embodiments of this disclosure are not limited thereto; the second flexible membrane 81b can be configured as a single unit, and the first flexible membrane 81a can be configured as multiple units.

[0142] The first flexible film 81a can send data signals from the drive circuit board 80 to the substrate 40. A COF (Chip-on-Foil) can be used to provide the first flexible film 81a.

[0143] The second flexible film 81b can transmit power from the drive circuit board 80 to the substrate 40. An FFC can be used to provide the second flexible film 81b.

[0144] However, the embodiments disclosed herein are not limited thereto, and the first flexible membrane 81a and the second flexible membrane 81b may be formed opposite to each other.

[0145] Although not shown in the attached diagram, the drive circuit board 80 can be electrically connected to the motherboard 25 (see Figure 25). Figure 2 The motherboard 25 can be mounted on the rear side of the frame 15, and the motherboard 25 can be connected to the drive circuit board 80 via a cable (not shown) at the rear of the frame 15.

[0146] As described above, the metal plate 60 can be configured to contact the substrate 40. The metal plate 60 and the substrate 40 can be bonded to each other through an adhesive layer 61 disposed between the rear surface 43 of the substrate 40 and the metal plate 60.

[0147] The metal plate 60 can be formed from a metallic material with high thermal conductivity. For example, the metal plate 60 can be formed from aluminum.

[0148] Heat generated from the plurality of inorganic LEDs 50 mounted on the substrate 40 and the TFT layer 44 is transferred along the rear surface 43 of the substrate 40 to the metal plate 60 through the adhesive layer 61.

[0149] Therefore, the heat generated from the substrate 40 can be easily transferred to the metal plate 60, and the substrate 40 can be prevented from rising above a certain temperature.

[0150] Multiple display modules 30A to 30P can be arranged in an M×N matrix at various locations. Each display module 30A to 30P is configured to be independently movable. In this case, each of the display modules 30A to 30P individually includes a metal plate 60, so that a constant level of heat dissipation performance is maintained regardless of the location of the display modules 30A to 30P.

[0151] Multiple display modules 30A to 30P can be arranged in various M×N matrix forms to form screens of various sizes for the display device 1. Therefore, compared with using a single metal plate set for heat dissipation, the display modules 30A to 30P (each including an independent metal plate 60 as in the embodiments of this disclosure) can dissipate heat individually, thereby improving the overall heat dissipation efficiency of the display device 1.

[0152] When only a single metal plate is installed inside the display device 1, a portion of the metal plate may not be installed at a position corresponding to the position where some display modules are installed along the front-back direction, and the metal plate may be installed at a position corresponding to the position where no display modules are installed, thereby reducing the heat dissipation efficiency of the display device 1.

[0153] That is, since each of the display modules 30A to 30P is provided with a corresponding metal plate 60, each of the display modules 30A to 30P can independently perform self-heating through the corresponding metal plate 60, regardless of the position of each display module in the display modules 30A to 30P, thereby improving the overall heat dissipation performance of the display device 1.

[0154] The metal plate 60 can be configured as a rectangular shape that substantially corresponds to the shape of the substrate 40.

[0155] The area of ​​substrate 40 can be at least equal to or greater than the area of ​​metal plate 60. When substrate 40 and metal plate 60 are arranged parallel to each other in the first direction X, the four edges of substrate 40, which has a rectangular shape, can be set based on the center of substrate 40 and metal plate 60 corresponding to the four edges of metal plate 60, or can be set based on the center of substrate 40 and metal plate 60 corresponding to the area outside the four edges of metal plate 60.

[0156] According to an embodiment, the four edges E of the substrate 40 can be configured to correspond to the areas outside the four edges of the metal plate 60. That is, the area of ​​the substrate 40 can be configured to be larger than the area of ​​the metal plate 60.

[0157] When heat is transferred to each of the display modules 30A to 30P, the substrate 40 and the metal plate 60 can thermally expand. The coefficient of thermal expansion of the metal plate 60 is higher than that of the substrate 40, so the expansion of the metal plate 60 can be greater than that of the substrate 40.

[0158] In this case, when the four edges E of the substrate 40 are set to correspond to the four edges of the metal plate 60 or to correspond to the area within the four edges of the metal plate 60, the edges of the metal plate 60 can protrude into the area outside the substrate 40.

[0159] Therefore, the gap length formed between the various display modules 30A to 30P may become irregular due to the thermal expansion of the metal plate 60 of each of the display modules 30A to 30P, which may increase the exposure of the seams and reduce the overall appearance of the image on the display panel 20.

[0160] However, when the four edges E of the substrate 40 are set outside the four edges of the metal plate 60, even when the substrate 40 and the metal plate 60 are thermally expanded, the metal plate 60 will not protrude into the area outside the four edges E of the substrate 40. Therefore, the interval length of the gaps formed between the various display modules 30A to 30P can remain constant.

[0161] Furthermore, in order to maintain a constant spacing length between the various display modules 30A to 30P, the frame 15 supporting each of the display modules 30A to 30P may include a front surface 40 with material properties similar to those of the substrate. That is, each of the display modules 30A to 30P may be attached to the front surface of the frame 15.

[0162] According to embodiments of this disclosure, the substrate 40 and the metal plate 60 can be configured to have areas that substantially correspond to each other. Therefore, heat generated from the substrate 40 can be radiated uniformly over the entire area of ​​the substrate 40 without being isolated to specific regions.

[0163] The metal plate 60 can be configured to be bonded to the rear surface 43 of the substrate 40 via an adhesive layer 61.

[0164] The dimensions of the adhesive layer 61 can correspond to the dimensions of the metal plate 60. That is, the area of ​​the adhesive layer 61 can be set to correspond to the area of ​​the metal plate 60. The metal plate 60 can be configured as a generally rectangular shape, and the adhesive layer 61 can be configured as a rectangular shape to correspond to the shape of the metal plate 60.

[0165] The edges of the metal plate 60 and the adhesive layer 61 can be formed to correspond to each other with respect to the centers of the metal plate 60 and the adhesive layer 61.

[0166] Therefore, the metal plate 60 and the adhesive layer 61 can be easily manufactured in a single combined configuration, thereby improving the overall manufacturing efficiency of the display device 1.

[0167] That is, when the metal plate 60 is cut from a plate in a preset quantity, the adhesive layer 61 is pre-bonded to the plate before cutting the metal plate 60, and the adhesive layer 61 and the metal plate 60 can be cut simultaneously in a preset quantity, thereby reducing the number of processing steps.

[0168] The heat generated from the substrate 40 can be transferred to the metal plate 60 through the adhesive layer 61. Therefore, the adhesive layer 61 can be configured to bond the metal plate 60 to the substrate 40 while transferring the heat generated from the substrate 40 to the metal plate 60.

[0169] Therefore, adhesive layer 61 may include a material with high heat dissipation performance.

[0170] Basically, the adhesive layer 61 may include a material having adhesive properties to bond the substrate 40 and the metal plate 60 to each other.

[0171] Furthermore, the adhesive layer 61 may include a material with higher heat dissipation performance than general adhesive materials. Therefore, heat can be efficiently transferred between the substrate 40 and the metal plate 60.

[0172] Furthermore, the adhesive material of the adhesive layer 61 can be formed from a material with higher heat dissipation performance than the adhesive material used to form general adhesives.

[0173] Materials with high heat dissipation performance refer to materials that have high thermal conductivity, high heat transfer rate, and low specific heat, and can efficiently transfer heat.

[0174] For example, adhesive layer 61 may include a graphite material. However, embodiments of this disclosure are not limited thereto, and adhesive layer 61 may be formed of a material with high heat dissipation properties.

[0175] The adhesive layer 61 can be configured to have a greater ductility than the substrate 40 and the metal plate 60. Therefore, the adhesive layer 61 can be formed from a material that has high ductility while also possessing adhesive and heat dissipation properties. The adhesive layer 61 can be formed from inorganic double-sided tape. As described above, the adhesive layer 61 can be formed from inorganic tape, such that the adhesive layer 61 can be configured as a single layer, with one surface bonded to the substrate 40 and the other surface bonded to the metal plate 60, without the need for a substrate to support both surfaces.

[0176] The adhesive layer 61 does not include the substrate, and therefore does not include materials that interfere with heat conduction, thereby improving heat dissipation performance. However, the adhesive layer 61 is not limited to inorganic double-sided tape, and can be configured to use a heat-dissipating tape with superior heat dissipation performance compared to ordinary double-sided tape.

[0177] As described above, since the substrate 40 is formed of glass and the metal plate 60 is formed of metal, the material properties of each configuration are different, and thus the degree to which the materials deform under the same heat can be different. That is, when heat is generated in the substrate 40, the substrate 40 and the metal plate 60 can thermally expand to different dimensions. Therefore, in the comparative embodiment, the first display module 30A may be damaged.

[0178] With the substrate 40 and the metal plate 60 fixed to each other, the substrate 40 and the metal plate 60, which have different expansion values ​​at the same temperature, expand to different sizes, thereby generating stress in each of the substrate 40 and the metal plate 60.

[0179] In particular, the different coefficients of thermal expansion between materials result in different degrees of physical deformation when heated. Specifically, since the coefficient of thermal expansion of metallic materials is generally greater than that of glass, when the substrate 40 and the metal plate 60 are subjected to the same amount of heat, the metal plate 60 expands and deforms to a greater extent than the substrate 40.

[0180] Conversely, even when heat generation in substrate 40 ceases and substrate 40 and metal plate 60 are cooled, the degree of shrinkage and deformation of metal plate 60 can be greater than that of substrate 40.

[0181] Since the substrate 40 and the metal plate 60 are bonded to each other through the adhesive layer 61, when the deformation of the metal plate 60 is greater than that of the substrate 40, the external force can be transmitted to the substrate 40.

[0182] Conversely, external forces can also be transmitted from the substrate 40 to the metal plate 60, but since the rigidity of the glass substrate 40 is less than that of the metal plate 60, the substrate 40 may be damaged in the comparative embodiment.

[0183] An adhesive layer 61 may be disposed between the substrate 40 and the metal plate 60 to absorb external forces transmitted from the substrate 40 and the metal plate 60, which expand at different sizes.

[0184] Therefore, it prevents external forces from being transmitted to the substrate 40 and the metal plate 60, and especially prevents the substrate 40 from being damaged.

[0185] The adhesive layer 61 can be formed of a material with high ductility to absorb external forces transmitted from the substrate 40 and the metal plate 60. Specifically, the ductility of the adhesive layer 61 can be greater than that of the substrate 40 and the metal plate 60.

[0186] Therefore, when an external force generated by the dimensional changes of the substrate 40 and the metal plate 60 is transmitted to the adhesive layer 61, the adhesive layer 61 deforms itself to prevent the external force from being transmitted to other components.

[0187] The adhesive layer 61 may have a predetermined thickness in the first direction X. When the metal plate 60 expands due to heat or contracts due to cold, the metal plate 60 may expand or contract in a direction orthogonal to the first direction X and in the first direction X, so that external force can be transmitted to the substrate 40.

[0188] Even when the metal plate 60 expands or contracts in a direction orthogonal to the first direction X, the thickness of the adhesive layer 61 changes, thereby preventing external forces from being transmitted to the substrate 40. Furthermore, the coefficient of thermal expansion of the adhesive layer 61 may differ from that of the substrate 40 and the metal plate 60.

[0189] According to an embodiment, the coefficient of thermal expansion of the adhesive layer 61 can be greater than that of the substrate 40 and less than that of the metal plate 60.

[0190] Therefore, at the same temperature, the adhesive layer 61 may not deform in the same way as the substrate 40 or the metal plate 60, and the adhesive layer 61 between the substrate 40 and the metal plate 60 can buffer the deformation of the substrate 40 and the metal plate 60.

[0191] Therefore, the adhesive layer 61 is disposed between the substrate 40 and the metal plate 60, and can easily absorb external forces generated by the difference in the coefficients of thermal expansion between the substrate 40 and the metal plate 60 through deformation.

[0192] The adhesive layer 61 may have a minimum thickness such that the adhesive layer 61, which deforms due to the thermal expansion of the metal plate 60 and the substrate 40, remains in a state where an additional external force is applied to the substrate 40.

[0193] The first display module 30A may include an adhesive member 82 configured to attach the frame 15 to the first display module 30A.

[0194] Adhesive member 82 may be disposed on the rear surface of metal plate 60 to engage metal plate 60 with frame 15.

[0195] As described above, the metal plate 60 is formed to have dimensions corresponding to the dimensions of the substrate 40 and to cover the entire area of ​​the rear surface 43 of the substrate 40, and the adhesive member 82 can be disposed on the rear surface of the metal plate 60.

[0196] However, embodiments of this disclosure are not limited thereto, and the adhesive member 82 may be configured to be disposed on the rear surface 43 of the substrate 40. In this case, the substrate 40 can be directly bonded to the frame 15 via the adhesive member 82.

[0197] According to another embodiment of this disclosure, the metal plate 60 may be configured to cover only a portion of the rear surface 43 of the substrate 40, and the metal plate 60 covers the rear surface 43 of the substrate 40. The adhesive member 82 may be configured to bond to the area of ​​the rear surface 43 of the substrate 40 that is not covered by the metal plate 60.

[0198] According to an embodiment, the adhesive member 82 may include double-sided adhesive tape.

[0199] The front cover 70 and the side cover 90 will be described in detail below.

[0200] Figure 6 It shows Figure 1 The cross-sectional view of some components of the display device shown is taken along the second direction Y. Figure 7 It shows Figure 1 The diagram shows a cross-sectional view of some components of the display device taken along the third direction Z. Figure 8 It shows Figure 1 The diagram shows a cross-sectional view of some components of the display module taken along the third direction Z. Figure 9 It shows Figure 6 Enlarged cross-sectional views of some of the components shown, and Figure 10 It shows Figure 7 Enlarged cross-sectional views of some of the components shown.

[0201] The front cover 70 can protect the substrate 40 from external forces and reduce the exposure of the seams formed by the gaps G between the multiple display modules 30A to 30P, as well as reduce the color deviation between the multiple display modules 30A to 30P.

[0202] When multiple display modules 30A to 30P are arranged, each of the multiple display modules 30A to 30P may include a side cover 90 disposed in a gap G, which is formed between the multiple display modules 30A to 30P.

[0203] In order to absorb light reflected from the gap G between the multiple display modules 30A to 30P, the front cover 70 of each of the multiple display modules 30A to 30P can be formed as an area extending beyond the substrate 40 of each of the multiple display modules 30A to 30P.

[0204] In detail, the front cover 70 can be configured to extend in the second direction Y and the third direction Z to the area outside the edge 41e of the mounting surface 41 of the substrate 40 (see Figure 5 ).

[0205] In essence, gaps between display modules 30A to 30P can be formed between the side surfaces 45 of each substrate 40 of display modules 30A to 30P. However, since gap G according to the embodiment refers to a non-display area that can be formed between display modules 30A to 30P, gap G formed between multiple display modules 30A to 30P should be understood as the gap from one edge 41e of the mounting surface 41 of one of the substrates 40 of display modules 30A to 30P to the other edge 41e of the mounting surface 41 of the substrate 40 of the other adjacent display module in display modules 30A to 30P.

[0206] Therefore, the gap G formed between the multiple display modules 30A to 30P refers to the gap formed between one edge 41e of the mounting surface 41 of one of the display modules 30A to 30P and the other edge 41e of the mounting surface 41 of another adjacent display module in the second direction Y or the third direction Z of the display module 30A to 30P.

[0207] The front cover is arranged in the gap G between multiple substrates 40 to absorb light transmitted to or reflected from the gap G, thereby minimizing the perception of the butt joint.

[0208] Furthermore, as will be described below, light directed toward the gap G can be absorbed by the side covers 90 of the multiple display modules 30A to 30P disposed in the gap G, thereby minimizing the perception of the seam.

[0209] refer to Figure 6 and Figure 7 The front cover 70 may extend in the second direction Y to the outside of the substrate 40. Specifically, the front cover 70 may be configured to extend in the second direction Y to the area beyond the side surface 45 and the chamfered portion 49.

[0210] The embodiment is described with respect to one edge of the substrate 40 corresponding to the right edge 31 of the first display module 30A, but the front cover 70 may extend in the second direction Y or the third direction Z to the area beyond the four edges E of the substrate 40.

[0211] That is, the side end 75 of the front cover 70 corresponding to the edge of the front cover 70 can extend in the second direction Y or the third direction Z to the area outside the four edges E of the substrate 40.

[0212] The front cover 70 may include multiple layers (not shown), each of which has different optical properties. The multiple layers (not shown) may be stacked on top of each other in a first direction X.

[0213] Among the multiple layers, one layer can be configured as an anti-glare layer. However, the embodiments are not limited to this, and the single layer can be configured as an anti-reflective layer or a layer in which an anti-glare layer and an anti-reflective layer are combined.

[0214] Among the multiple layers, another layer can be configured as a light transmittance control layer. However, the embodiments are not limited to this, and this other layer can be formed from layers that include different physical properties or materials or have different functions. For example, the other layer can be configured as a circularly polarized light layer.

[0215] Furthermore, the embodiments are not limited to this, and multiple layers can be configured as a single layer. A single layer can be configured to functionally implement each of the multiple layers (not shown).

[0216] As described above, the front cover 70 may include an adhesive layer (not shown), and the adhesive layer (not shown) may be disposed at the last side of a plurality of layers (not shown) to engage with the mounting surface 41.

[0217] Therefore, the front cover 70 can be tightly engaged with the mounting surface 41 and protect the components mounted on the mounting surface 41, so the display module 30 enables the front cover 70 to be directly engaged with the substrate 40 without the need for an additional molding configuration between the front cover 70 and the substrate 40.

[0218] Furthermore, the embodiments disclosed herein are not limited thereto, and multiple layers (not shown) and adhesive layers may be formed as a single component.

[0219] The front cover 70 can diffuse light incident from the outside to prevent external light from being regularly reflected and dazzling the user.

[0220] Because light incident from the outside is diffused, glare can be reduced and the contrast of the image displayed on the display panel 20 can be improved.

[0221] The front cover 70 can reduce the transmittance of incident external light or the transmittance of external light reflected from the substrate 40 and the gap G.

[0222] According to an embodiment, the front cover 70 includes a material component that reduces light transmittance to allow at least a portion of the light to be transmitted through the material to the substrate 40 or to absorb at least a portion of the light reflected from the substrate 40 and traveling in a first direction X.

[0223] When multiple substrates are produced, some substrates may have different colors due to process errors during the manufacturing process. Therefore, substrates with different unique colors can be laid out to form a single display panel.

[0224] As described above, the front cover 70 according to the embodiment absorbs at least a portion of the light reflected from the substrate 40 and transmitted to the outside, thereby increasing the overall visual quality of the display panel 20.

[0225] That is, the front cover 70 can reduce the color deviation of each display module 30A to 30P due to the process error of the display modules 30A to 30P by reducing the external light transmittance.

[0226] The front cover 70 can prevent external light incident on the display panel 20 from being transmitted to the substrate 40, and can absorb a portion of the light incident on the display panel 20 from the outside or absorb a portion of the external light reflected from the substrate 40 and transmitted to the outside of the display panel 20, thereby improving the contrast of the image displayed on the display panel. These different optical actions can be achieved individually by the aforementioned multiple layers (not shown).

[0227] That is, the front cover 70 can be disposed in front of the substrate 40 in the first direction X to improve the contrast of the image displayed on the display panel 20, which may be reduced by external light.

[0228] As described above, in the case of the display module 30 according to the embodiment, the front cover 70 may extend in the second direction Y to a region outside the substrate 40.

[0229] Therefore, a portion of the light introduced into the gap G formed between the multiple display modules 30A to 30P can be blocked by at least a portion of the front cover 70 disposed in the gap G, and at least a portion of the external light introduced into or reflected in the gap G can be absorbed by the front cover 70 disposed in the gap G and prevented from being transmitted to the outside. Thus, the exposure of the seams formed in the gap G can be reduced, and as the exposure of the seams is reduced, the overall appearance of the image displayed on the display panel 20 can be improved.

[0230] In detail, the side end 75 of the front cover 70 in the second direction Y can be arranged in the second direction Y in an area outside the edge 41e of the mounting surface 41, or in the gap G.

[0231] Therefore, the front cover 70 may include a first region 71 and a second region 72, wherein the first region 71 is disposed in the region outside one of the edges 41e of the mounting surface 41 in the second direction Y or disposed in the gap G, and the second region 72 is disposed on the mounting surface 41.

[0232] The first region 71 and the second region 72 of the front cover 70 can be divided by the end of the gap G in the second direction Y.

[0233] The first region 71 of the front cover 70 is disposed in the gap G, such that external light toward the gap G can be blocked by the first region 71 of the front cover 70, or light reflected from the gap G and then toward the outside can be blocked by the first region 71 of the front cover 70, thereby reducing the exposure of the seam that may be formed by the gap G, which serves as the boundary between the multiple display modules 30A to 30P, and improving the overall appearance of the display panel 20.

[0234] As described above, the front cover 70 can be configured to extend beyond the four edges 41e of the mounting surface 41 of the substrate 40, thereby reducing the exposure of seams that may be formed at each edge of the plurality of display modules 30A to 30P.

[0235] Taking the first display module 30A and the second display module 30E as examples, the first region 71A of the first front cover 70A can be set in the gap G formed between the first display module 30A and the second display module 30E.

[0236] In the gap G, adjacent side ends 75A and 75E of the side ends of the first front cover 70A of the first display module 30A and the second front cover 70E of the second display module 30E can be provided.

[0237] Furthermore, multiple side surfaces 45 and multiple chamfered portions 49 of the first display module 30A and the second display module 30E can be disposed in the gap G.

[0238] The second area 72A of the first front cover 70A can be disposed on the mounting surface 41 of the first display module 30A.

[0239] The first region 71E of the second front cover 70E can be disposed in the gap G formed between the first display module 30A and the second display module 30E, and the second region 72E of the second front cover 70E can be disposed on the mounting surface 41 of the second display module 30E.

[0240] That is, in the gap G formed between the first display module 30A and the second display module 30E, the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E are arranged parallel to each other in the second direction Y.

[0241] The first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E can each extend in the second direction Y by a length equal to or less than half the length of the gap G.

[0242] Therefore, when the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E are arranged parallel to each other in the second direction Y, the sum of the lengths of the first region 71A and the first region 71E can be equal to or less than the length of the gap G in the second direction Y.

[0243] According to an embodiment, when the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E are arranged parallel to each other in the second direction Y, a predetermined distance may exist between one of the side ends 75A of the first front cover 70A and one of the side ends 75E of the second front cover 70E.

[0244] As will be described below, the side end member 100 may be disposed in the second direction Y on the side end 75 of the front cover 70 and the side end 91 of the side cover 90, such that a gap may be formed between the first display module 30A and the second display module 30E.

[0245] However, since the side member 100 is provided in essentially a thin film and formed to have a very thin thickness, the spacing is negligible. Therefore, the first display module 30A and the second display module 30E can be laid flat, and there is not a large gap between the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E.

[0246] As described above, the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E can be arranged in the gap G between the first display module 30A and the second display module 30E.

[0247] External light toward the display panel 20 is transmitted through the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E, thereby the external light is diffused to the outside or partially absorbed by the first regions 71A and 71E, which reduces the amount of light reaching the gap G and can reduce the exposure of the boundary between the first display module 30A and the second display module 30E caused by the gap G.

[0248] Furthermore, light reflected from the gap G and directed toward the outside of the display panel 20 is transmitted through the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E. As a result, the light is diffusely reflected to the outside of the display panel 20 or partially absorbed by the first regions 71A and 71E, thereby reducing the amount of light transmitted to the outside of the display panel 20 and reducing the exposure of the boundary between the first display module 30A and the second display module 30E caused by the gap G.

[0249] That is, the amount of external light introduced into the gap G formed between the multiple display modules 30A to 30P can be reduced, while at least a portion of the external light reflected from the gap G can be absorbed, thereby improving the overall image quality of the display panel 20.

[0250] Furthermore, even when the first substrate 40A of the first display module 30A and the second substrate 40E of the second display module 30E have different colors, when each of the first substrate 40A and the second substrate 40E is displayed to the outside through the reflection of external light, at least a portion of the reflected light is absorbed by the corresponding first front cover of the first front cover 70A and the first front cover 70E, so that the unique color of each of the first substrate 40A and the second substrate 40E is not perceived by the outside, thereby improving the overall sense of the picture.

[0251] The first display module 30A may include a side cover 90, which is disposed below the front cover 70 and on the side surface 45 of the substrate 40 in the direction facing the mounting surface 41.

[0252] In detail, the side cover 90 may be disposed in the space formed between the lower end 76 of the first region 71 of the front cover 70 in the first direction X and the side surface 45 of the substrate 40 in the second direction Y.

[0253] The side cover 90 may be configured to engage at least a portion of the lower end 76, side surface 45, and metal plate 60 of the first region 71. According to an embodiment, the side cover 90 may be configured to engage the entire area of ​​the lower end 76 of the first region 71. Furthermore, according to an embodiment, the side cover 90 may be configured to cover the entire area of ​​the side surface 45.

[0254] Here, the lower end 76 of the first region 71 refers to the lower surface of the entire front cover 70, that is, the rear surface of the adhesive layer 130 formed at the rear end of the front cover 70.

[0255] Furthermore, the side cover 90 may be configured to cover each of a pair of chamfered portions among a plurality of chamfered portions 49 disposed along the front-rear direction in the first direction X of the side surface 45.

[0256] The side cover 90 can be configured to surround the chamfered portion 49 and the entire area between the mounting surface 41 and the side surface 45, as well as the side surface 45.

[0257] Since the side cover 90 is configured to surround the chamfered portion 49 formed between the mounting surface 41 and the side surface 45, the side cover 90 can fill all the space that may be generated between the substrate 40 and the front cover 70.

[0258] Therefore, the side cover 90 can prevent foreign objects or moisture from entering the space between the substrate 40 and the front cover 70 from the outside.

[0259] Furthermore, since the side cover 90 is configured to surround the chamfered portion 49 formed between the rear surface 43 and the side surface 45, the side cover 90 can fill all the space that may be generated between the substrate 40 and the metal plate 60.

[0260] Therefore, the side cover 90 can prevent foreign objects or moisture from entering the space between the substrate 40 and the metal plate 60 from the outside.

[0261] The side cover 90 can be configured to contact the lower end 76 of the first region 71 and the chamfered portion 49 and side surface 45 of the substrate 40. Therefore, the side cover 90 can support the lower end 76 of the first region 71 and the chamfered portion 49 and side surface 45 of the substrate 40.

[0262] As described above, the front cover 70 and the substrate 40 are joined together by the front cover 70, and the adhesion between the front cover 70 and the substrate 40 can be strengthened by the side cover 90. Therefore, the side cover 90 can prevent the front cover 70 from separating from the substrate 40.

[0263] That is, the reliability of the first display module 30A can be increased by using the side cover 90.

[0264] Furthermore, the substrate 40 and the metal plate 60 are bonded to each other by an adhesive layer 61, and the adhesion between the metal plate 60 and the substrate 40 can be strengthened by a side cover 90. Therefore, the side cover 90 can prevent the metal plate 60 from separating from the substrate 40.

[0265] As described above, the side surface 45 of the substrate 40 is configured to correspond to the four edges 41e of the mounting surface 41, and the first region 71 of the front cover 70 can extend in the second direction Y and the third direction Z (i.e., the direction in which the mounting surface 41 extends) to the region beyond the four edges 41e of the mounting surface 41.

[0266] The side cover 90 can be configured to surround the lower end 76 of the first region 71 along the perimeter of the four edges 41e of the mounting surface 41 and the side surface 45 corresponding to the four edges 41e of the mounting surface 41.

[0267] That is, the side cover 90 can be configured to cover the entire edge of the portion where the sealing substrate 40 and the front cover 70 are joined together.

[0268] The side cover 90 can cover the lower end 76 and side surface 45 of the first region 71 in each direction perpendicular to the first direction X.

[0269] Therefore, the coupling between the front cover 70 and the substrate 40 can be improved, and the side surfaces 45 of the front cover 70 and the substrate 40 can be protected from external forces.

[0270] Furthermore, as described above, the side cover 90 can prevent external moisture or foreign matter from penetrating between the substrate 40 and the front cover 70. Additionally, when gaps are formed due to adhesive failure between the substrate 40 and the front cover 70, the side cover 90 can prevent external moisture or foreign matter from penetrating into the gaps.

[0271] The side cover 90 is configured to surround all four edges E of the substrate 40 along the side surface 45 of the substrate 40, thereby sealing the space between the substrate 40, the front cover 70 and the metal plate 60.

[0272] Therefore, even if foreign matter or moisture enters the substrate 40 in any direction, the side cover 90 can prevent foreign matter or moisture from penetrating between the substrate 40 and the front cover 70.

[0273] As described above, the rearmost end of the front cover 70 in the first direction X is configured as the adhesive layer 130, and the lower end 76 of the first region 71 is configured as the rear surface of the adhesive layer 130.

[0274] Therefore, when the lower end 76 of the first region 71 is exposed to the outside, foreign matter flowing in from the outside can adhere to the lower end 76 of the first region 71.

[0275] When multiple display modules 30A to 30P are arranged with foreign objects attached to the lower end 76 of the first region 71, the foreign objects attached to the lower end 76 of the first region 71 may increase the visibility of the seams created between the multiple display modules 30A to 30P.

[0276] However, the first display module 30A according to the embodiment includes a side cover 90, which is configured to cover the lower end 76 of the first region 71, thereby preventing foreign objects from adhering to the lower end 76 of the first region 71.

[0277] Therefore, when multiple display modules 30A to 30P are arranged, the visibility of the seams between the multiple display modules 30A to 30P caused by foreign objects attached to the front cover 70 can be reduced.

[0278] Furthermore, in the comparative embodiment described below, due to electrostatic discharge (ESD) that can be generated on the display modules 30A to 30P, current can flow into multiple electronic components mounted on the substrate 40 and damage them. However, the side cover 90 can seal the substrate 40 relative to the outside, thereby preventing the flow of ESD-generated charge into the substrate 40 and thus preventing damage to the electronic components.

[0279] That is, the substrate 40 is sealed by the front cover 70 and the side cover 90 to prevent ESD-generated charges from passing through the front cover 70 and the side cover 90, thereby preventing charge flow to the substrate 40. Furthermore, since the charges moving on the front cover 70 and the side cover 90 are guided to the metal plate 60 in contact with the side cover 90, an ESD-based current path is provided. Therefore, the ESD withstand voltage of electronic components mounted on the substrate 40 can be improved.

[0280] Furthermore, the side end member 100 disposed on the outside of the side cover 90 allows the charge flowing on the front cover 70 and the side cover 90 to be more easily guided to the metal plate 60, thereby providing an ESD-based current path, which will be described in detail below.

[0281] As described above, the side cover 90 can be configured to be positioned below the front cover 70 in a direction opposite to the direction facing the mounting surface 41. That is, the side cover 90 is not positioned above the lower end 76 in the first direction X.

[0282] The upper end 92 of the side cover 90 in the first direction X is configured to contact the lower end 76 of the first region 71, and is not located in front of the lower end 76 of the first region 71 in the first direction X.

[0283] This is to prevent the side cover 90 from being positioned in the path of light emitted from the multiple inorganic LEDs 50.

[0284] When at least a portion of the side cover 90 is positioned in the first direction X in front of the lower end 76 or the front cover 70, at least a portion of the side cover 90 can be positioned in the path of light that moves forward through the front cover 70.

[0285] That is, because the side cover 90 absorbs or diffuses a portion of the moving light, a portion of the image displayed on the display panel 20 may be distorted.

[0286] However, according to the embodiment, the side cover 90 is disposed behind the front cover 70 in the first direction X and does not restrict the movement of light emitted by the plurality of inorganic LEDs 50, thereby improving the image quality of the display panel 20.

[0287] The side end 75 of the front cover 70 in the second direction Y and the side end 91 of the side cover 90 in the second direction Y are disposed on substantially the same line along the first direction X.

[0288] This is because the front cover 70 and the side cover 90 are cut simultaneously during the manufacturing process of the first display module 30A, as will be described below. In addition, the side end member 100 can be joined to the side end 75 of the front cover 70 and the side end 91 of the side cover 90, which are arranged on substantially the same line along the first direction X.

[0289] That is, when multiple display modules 30A to 30P are arranged, the spacing formed between the multiple display modules 30A to 30P is minimized, and the visually identifiable seams caused by the spacing between the multiple display modules 30A to 30P can be minimized.

[0290] The side cover 90 may include a light-absorbing material. For example, the side cover 90 may be formed of an opaque or translucent material.

[0291] Furthermore, the side cover 90 may include a photosensitive material. For example, the side cover 90 may be formed of a photosensitive optically transparent adhesive resin (optically transparent resin OCR). When the photosensitive material is irradiated with external light (e.g., ultraviolet (UV) light) of a wavelength different from that of visible light, the physical properties of the photosensitive material are altered, and the color of the photosensitive material may change to a darker color.

[0292] Therefore, the side cover 90 is formed of a material that is configured to darken in color when irradiated with UV light during the manufacturing process in order to absorb light.

[0293] The side cover 90 can be set to a dark color. The color of the side cover 90 can be set to a color that is darker than the color of the front cover 70.

[0294] The side cover 90 can be set to a color similar to that of the black matrix 48.

[0295] Therefore, due to the light-absorbing material of the side cover 90, the light incident on the side cover 90 can be absorbed by the side cover 90 and not reflected.

[0296] When multiple display modules 30A to 30P are arranged, the side cover 90 can be disposed together with the first area 71 of the front cover 70 in the gap G formed between the multiple display modules 30A to 30P.

[0297] Therefore, the side cover 90 absorbs light introduced into the gap G, thereby minimizing the light introduced into the gap G and reflected to the outside. This reduces the exposure of seams that may be formed by the gaps G between the multiple display modules 30A to 30P.

[0298] Taking the first display module 30A and the second display module 30E as examples, the first side cover 90A of the first display module 30A and the second side cover 90E of the second display module 30E can be disposed together with the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E in the gap G formed between the first display module 30A and the second display module 30E.

[0299] In the gap G, the adjacent side ends 91A and 91E of the side ends of the first side cover 90A and the second side cover 90E can be disposed together with the adjacent side ends 75A and 75E of the side ends of the first front cover 70A of the first display module 30A and the second front cover 70E of the second display module 30E.

[0300] The adjacent side ends 75A and 75E of the first front cover 70A and the second front cover 70E can be configured to face each other, and the adjacent side ends 91A and 91E of the first side cover 90A and the second side cover 90E can be configured to face each other. Furthermore, the first side end member 100A disposed at the outermost end of the first display module 30A in the second direction Y and the second side end member 100E disposed at the outermost end of the second display module 30E in the direction relative to the second direction Y toward the first display module 30A can be configured to face each other.

[0301] According to the embodiment, the adjacent side ends 75A and 75E of the first front cover 70A and the second front cover 70E can be arranged parallel to each other, the adjacent side ends 91A and 91E of the first side cover 90A and the second side cover 90E can be arranged parallel to each other, and the adjacent side ends 103A and 103E of the first side end member 100A and the second side end member 100E can be arranged parallel to each other.

[0302] Therefore, when the first display module 30A and the second display module 30E are arranged, the first side end member 100A and the second side end member 100E respectively disposed at the outermost ends of the first display module 30A and the second display module 30E in the second direction Y can be arranged parallel to each other and can be surface-fitted to each other.

[0303] That is, in the gap G formed between the first display module 30A and the second display module 30E, the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E can be arranged side by side along the second direction Y, and the first side cover 90A and the second side cover 90E can be arranged side by side along the second direction Y.

[0304] Since the side end 75 of the front cover 70 and the side end 91 of the side cover 90 are formed on the same line along the first direction X, and the side end member 100 is provided on the side end 75 of the front cover 70 and the side end 91 of the side cover 90, the gap formed when arranging the first display module 30A and the second display module 30E can be minimized.

[0305] The length of each of the first side cover 90A and the second side cover 90E extending along the second direction Y is approximately equal to or less than half the length of the gap G, corresponding to the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E.

[0306] In the gap G between the first display module 30A and the second display module 30E, a first region 71A of the first front cover 70A and a first region 71E of the second front cover 70E are provided, and the first side cover 90A and the second side cover 90E can be respectively provided behind the first region 71A and the first region 71E in the first direction X.

[0307] As described above, external light incident on the display panel 20 passes through the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E, thereby the external light is diffusely reflected to the outside of the display panel 20 or partially absorbed, thus reducing the amount of light reaching the gap G.

[0308] Furthermore, even when some light reaches the gap G, the light introduced into the gap G is absorbed by the first side cover 90A and the second side cover 90E disposed in the gap G, thereby reducing the exposure of the boundary between the first display module 30A and the second display module 30E.

[0309] That is, while reducing the amount of external light introduced into the gap G formed between the multiple display modules 30A to 30P, the light reaching the gap G is additionally absorbed, thereby improving the overall picture quality of the display panel 20.

[0310] Furthermore, light may not be absorbed by the first side cover 90A and the second side cover 90E, and may be reflected on the first side cover 90A and the second side cover 90E and directed toward the outside of the display panel 20. However, light passing through the first region 71A of the first front cover 70A and the first region 71E of the third front cover 70B may be diffusely reflected to the outside of the display panel 20, or may be partially absorbed by the first regions 71A and 71E, thereby reducing the amount transmitted to the outside of the display panel 20. This can reduce the exposure of the boundary between the first display module 30A and the second display module 30E caused by the gap G.

[0311] As described above, when multiple display modules 30A to 30P are arranged, the side cover 90 is disposed in the gap G formed between the multiple display modules 30A to 30P, so that the side cover 90 absorbs the light reaching the gap G, thereby reducing the exposure of the seam that can be perceived due to the gap G.

[0312] In the example above, the front cover 70 is configured to reduce the amount of light reaching the substrate 40 by diffuse reflection, absorption, circular polarization, or by changing the direction of reflection of a portion of the light introduced into the display panel 20.

[0313] However, the embodiments are not limited to this, and the front cover 70 may be formed of a transparent material that allows light to pass through without distortion. Even in this case, the exposure of the boundary between the multiple display modules 30A to 30P due to the gap G can be reduced by providing a side cover 90 between the multiple display modules 30A to 30P.

[0314] As described above, since the side cover 90 is formed of a light-absorbing material, when at least a portion of the side cover 90 is positioned in front of the front cover 70 in the first direction X, a portion of the light emitted from the plurality of inorganic LEDs 50 can be absorbed by at least a portion of the side cover 90. Therefore, according to the comparative embodiment, a portion of the image displayed on the display panel 20 appears darker.

[0315] However, according to the embodiment, the side cover 90 is disposed below the front cover 70 in the first direction X (specifically, below the lower end 76 of the first region 71), so that the light emitted from the plurality of inorganic LEDs 50 is not absorbed, and the brightness of the image displayed on the display panel 20 can be uniform.

[0316] refer to Figure 8 and Figure 9 The front cover 70 may be configured to extend in the third direction Z to the outside of the substrate 40. Specifically, the front cover 70 may be configured to extend in the third direction Z to the area beyond the side surface 45 and the chamfered portion 49.

[0317] The side end 75 of the front cover 70 in the third direction Z can be located outside one of the edges 41e of the mounting surface 41 in the third direction Z or can be located in the gap G.

[0318] The first region 71 and the second region 72 of the front cover 70 can be divided by the end of the gap G in the third direction Z.

[0319] Taking the first display module 30A and the third display module 30B as examples, the first area 71A of the first front cover 70A can be set in the gap G formed between the first display module 30A and the third display module 30B.

[0320] In the gap G, adjacent side ends 75A and 75B of the side ends of the first front cover 70A of the first display module 30A and the third front cover 70B of the third display module 30B can be provided.

[0321] Furthermore, multiple side surfaces 45 and multiple chamfered portions 49 of the first display module 30A and the third display module 30B can be disposed in the gap G.

[0322] The first region 71B of the third front cover 70B can be disposed in the gap G formed between the first display module 30A and the third display module 30B, and the second region 72B of the third front cover 70B can be disposed on the mounting surface 41 of the third display module 30B.

[0323] That is, in the gap G formed between the first display module 30A and the third display module 30B, the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B are arranged side by side along the third direction Z.

[0324] External light directed toward the display panel 20 is transmitted through the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B, thereby causing the external light to be diffusely reflected to the outside or partially absorbed by the first regions 71A and 71B, which reduces the amount of light reaching the gap G and can reduce the exposure of the boundary between the first display module 30A and the third display module 30B caused by the gap G.

[0325] Furthermore, light reflected from the gap G and directed toward the outside of the display panel 20 is transmitted through the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B. As a result, the light is diffusely reflected to the outside of the display panel 20 or partially absorbed by the first regions 71A and 71B, thereby reducing the amount of light transmitted to the outside of the display panel 20 and reducing the exposure of the boundary between the first display module 30A and the third display module 30B caused by the gap G.

[0326] As described above, the side cover 90 can be disposed in the space formed on the side surface of the substrate 40 along the second direction Y and in the space formed on the side surface of the substrate 40 along the third direction Z.

[0327] Side surface wiring 46 can be provided on the side surface 45 of the substrate 40, which is arranged facing the third direction Z. Therefore, the side cover 90 provided on the side surface 45 facing the third direction Z can be configured to cover the side surface 45, the chamfered portion 49, and the side surface wiring 46. Thus, the side surface wiring 46 is protected from external forces and prevents foreign objects or moisture from penetrating into it.

[0328] That is, the side cover 90 can be configured to surround the lower end 76 of the first region 71 and the side surface 45 corresponding to the four edges 41e of the mounting surface 41 along the perimeter of the four edges 41e of the mounting surface 41, thereby surrounding the side surface wiring 46 extending along the side surface 45 in the third direction Z.

[0329] Therefore, the coupling between the front cover 70 and the substrate 40 can be improved, and the side surface 45 and side surface wiring 46 of the front cover 70 and the substrate 40 can be protected from external forces.

[0330] The side end 75 of the front cover 70 in the third direction Z and the side end 91 of the side cover 90 in the third direction Z are arranged on the same line along the first direction X. In a direction parallel to the first direction X, the side end 75 of the front cover 70 and the side end 91 of the side cover 90 can be arranged on the same line.

[0331] Taking the first display module 30A and the third display module 30B as examples, the first side cover 90A of the first display module 30A and the third side cover 90B of the third display module 30B can be disposed together with the first area 71A of the first front cover 70A and the first area 71B of the third front cover 70B in the gap G formed between the first display module 30A and the third display module 30B.

[0332] In the gap G, the adjacent side ends 91A and 91B of the side ends of the first side cover 90A and the third side cover 90B can be disposed together with the adjacent side ends 75A and 75B of the side ends of the first front cover 70A of the first display module 30A and the third front cover 70B of the third display module 30B.

[0333] The adjacent side ends 75A and 75B of the first front cover 70A and the third front cover 70B can be configured to face each other, and the adjacent side ends 91A and 91B of the first side cover 90A and the third side cover 90B can be configured to face each other.

[0334] Furthermore, the first side member 100A disposed at the outermost end of the first display module 30A in the third direction Z and the third side member 100B disposed at the outermost end of the third display module 30B in the direction relative to the third direction Z toward the first display module 30A can be configured to face each other.

[0335] According to the embodiment, the adjacent side ends 75A and 75B of the first front cover 70A and the third front cover 70B can be arranged parallel to each other, the adjacent side ends 91A and 91B of the first side cover 90A and the third side cover 90B can be arranged parallel to each other, and the side ends 103A and 103B of the first side end member 100A and the third side end member 100B can be arranged parallel to each other.

[0336] Therefore, when the first display module 30A and the third display module 30B are arranged, the first side end member 100A and the third side end member 100B respectively disposed at the outermost ends of the first display module 30A and the third display module 30B in the third direction Z can be arranged parallel to each other and surface-fitted to each other.

[0337] That is, in the gap G formed between the first display module 30A and the third display module 30B, the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B can be arranged side by side along the third direction Z, and the first side cover 90A and the third side cover 90B can be arranged side by side along the third direction Z.

[0338] Since the side end 75 of the front cover 70 and the side end 91 of the side cover 90 are formed on the same line along the first direction X, and the side end member 100 is provided on the side end 75 of the front cover 70 and the side end 91 of the side cover 90 along the third direction Z, the gap formed when arranging the first display module 30A and the third display module 30B can be minimized.

[0339] In the gap G formed between the first display module 30A and the third display module 30B, the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B can be arranged side by side along the third direction Z, and the first side cover 90A and the third side cover 90B can be arranged side by side along the third direction Z.

[0340] In the gap G between the first display module 30A and the third display module 30B, a first region 71A of the first front cover 70A and a first region 71B of the third cover 100B are provided, and the first side cover 90A and the third side cover 90B can be respectively provided behind the first region 71A and the first region 71B in the first direction X.

[0341] As described above, external light incident on the display panel 20 passes through the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B, thereby diffusely reflecting the external light to the outside of the display panel 20 or partially absorbing it, thus reducing the amount of light reaching the gap G.

[0342] Furthermore, even when some light reaches the gap G, the light introduced into the gap G is absorbed by the first side cover 90A and the third side cover 90B disposed in the gap G, thereby reducing the exposure of the boundary between the first display module 30A and the third display module 30B.

[0343] Light may not be absorbed by the first side cover 90A and the third side cover 90B, and may be reflected by the first side cover 90A and the third side cover 90B and directed toward the outside of the display panel 20. However, light may be diffusely reflected to the outside of the display panel 20 as it passes through the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B, or may be partially absorbed by the first regions 71A and 71B, thereby reducing the amount transmitted to the outside of the display panel 20. This can reduce the exposure of the boundary between the first display module 30A and the third display module 30B caused by the gap G.

[0344] The side end member 100 will be described in detail below.

[0345] Figure 10 It shows Figure 7 Enlarged cross-sectional views of some of the components shown.

[0346] In the manufacturing process of a display device that uses display modules to realize a display panel, multiple display modules can be laid out to form a display panel.

[0347] The process of using each display module to form a display panel includes the manufacturing and shipping of each display module, and during this process, current generated by ESD can flow into the display module, which may cause damage to the electronic components installed inside the display module.

[0348] Each display module may need to include components configured to absorb electric shocks to prevent the inflow of current due to ESD that occurs during the process of the display module being joined to the frame 15 and assembled to the display device 1, thereby preventing damage to electronic components installed inside the display module.

[0349] That is, each of the display modules 30A to 30P may include a component configured to independently block the flow of current generated by ESD into electronic components mounted on the substrate 40, and may include a grounding configuration configured to easily direct the generated current to a grounding configuration formed on each of the display modules 30A to 30P, without introducing the current into the components mounted on the substrate 40.

[0350] Each of the display modules 30A to 30P of the display device 1 according to an embodiment of the present disclosure may include a side cover 90, which is formed to extend from the upper part of the metal plate 60 to the lower end 76 of the lower end of the first region 71 disposed outside the mounting surface 41 in a first direction X facing the mounting surface 41, such that the side surface 45 is sealed relative to the outside.

[0351] Since display modules 30A to 30P have the same configuration, the description will refer to the first display module 30A, which is representative of the display modules.

[0352] See Figure 10 The side cover 90 can be configured to cover not only the outer side of the side surface 45 of the substrate 40 in the third direction Z, but also the outer side of the side surface 45 in the second direction Y.

[0353] That is, as described above, the side cover 90 can be configured to surround all four edges E of the substrate 40.

[0354] Therefore, the mounting surface 41, which is the front surface of the substrate 40, can be covered by the front cover 70, the rear surface 43 of the substrate 40 can be covered by the metal plate 60, and the multiple side surfaces 45 and the multiple chamfered portions 49 can be covered by the side cover 90.

[0355] Specifically, since the side cover 90 is configured to extend from the upper part of the metal plate 60 to the lower end 76 of the front cover 70 in the first direction X, the substrate 40 is completely sealed relative to the outside.

[0356] The front cover 70 can be formed of a non-conductive material that does not allow electric charge to pass through.

[0357] The side cover 90 can be formed of a non-conductive material that does not allow electric charge to pass through.

[0358] Since the front cover 70 and the side cover 90 are made of non-conductive material, most of the current applied to the front cover 70 or the side cover 90 can flow on the front cover 70 and the side cover 90 without passing through the front cover 70 and the side cover 90.

[0359] Furthermore, the metal plate 60 can be formed of a material with large capacitance to serve as a grounding structure. Therefore, when a current is applied to the metal plate 60, the potential of the metal plate 60 remains constant, such that the current flowing into the metal plate 60 is absorbed by the metal plate 60, and the current does not flow through the metal plate 60 to the substrate 40.

[0360] Specifically, in conventional techniques, side surface wiring extending along the side surface of a substrate is exposed to the outside, causing current to flow into the side surface wiring due to ESD, which leads to damage to electronic components disposed on the substrate.

[0361] In the case of the display device 1 according to the embodiment of the present disclosure, the entire side surface wiring 46 of the substrate 40 is arranged to be surrounded by a side cover 90, and is therefore sealed and not exposed to the outside. Therefore, even when static electricity is discharged at one side of the side surface 45 of the substrate, the side cover 90 can prevent current from flowing into the side surface wiring 46.

[0362] In addition, the display module 30 may include a side member 100 disposed at the outermost part of the side cover 90 along the second direction Y and the third direction Z, and formed of a material with a conductivity higher than that of the side cover 90.

[0363] like Figure 10 As shown, the side end member 100 can be configured to cover not only the outer side of the side surface 45 of the substrate 40 in the third direction Z, but also the outer side of the side surface 45 of the substrate 40 in the second direction Y.

[0364] That is, the side member 100 can be configured to surround all four edges E of the substrate 40.

[0365] The side member 100 may be formed of a metallic material, and may be formed of a material with a conductivity higher than that of the side cover 90. The side member 100 may be coated on the side cover 90 to be disposed on the outer end of the side cover 90.

[0366] According to an embodiment, one end 101 of the side member 100 in the first direction X may be configured to contact the side surface 60a of the metal plate 60 in the second direction Y or the third direction Z.

[0367] According to an embodiment, the other end 102 of the side member 100 in the first direction X can be configured to contact the side end 75 of the front cover 70 in the second direction Y or the third direction Z.

[0368] The other end 102 of the side member 100 in the first direction X can be disposed above the lower end 76 of the front cover 70.

[0369] One end 101 of the side member 100 in the first direction X can be configured to be located below the lower end of the side cover 90.

[0370] Therefore, the side member 100 can be configured to surround the entire side cover 90 corresponding to the four edges E of the substrate 40 and prevent the side cover 90 from being exposed to the outside.

[0371] As described above, the side member 100 may be formed of a material with a higher conductivity than that of the side cover 90.

[0372] Furthermore, the side member 100 may be formed of a material with a higher conductivity than that of the front cover 70.

[0373] Therefore, when ESD E1 generates current e1 on the front cover 70, the current e1 can bypass the front cover 70 and not flow into the substrate 40, so that the current e1 flowing on the front cover 70 can enter the side member 100.

[0374] The current e1 entering the side member 100 can flow through the side member 100 to the metal plate 60.

[0375] That is, the side end member 100 can be configured to contact the metal plate 60 to ground to the ground.

[0376] The side member 100 can provide a path for the current e1 caused by ESD E1 generated on the front cover 70 so that the current flows to the metal plate 60 which is configured to be grounded.

[0377] In other words, the side member 100 can guide the charge caused by ESD to ground.

[0378] Furthermore, when ESD E2 generates a current e2 on the side member 100 or the side cover 90, the current e2 may not pass through the side cover 90 and may not flow into the substrate 40. The current e2 may flow into the side member 100 and then into the metal plate 60.

[0379] As described above, all of the current e1 caused by ESD E1 on the front cover 70 or the current e2 caused by ESD E2 on the side cover 90 may not flow to the side member 100, but at least a portion of the current e1 or the current e2 may remain on the front cover 70 or the side cover 90 and may flow through the front cover 70 and the side cover 90 to the substrate 40 side.

[0380] However, most of the current e1 caused by ESD E1 on the front cover 70 or the current e2 caused by ESD E2 on the side cover 90 flows through the side end member 100 and to the metal plate 60. Therefore, even when some of the currents e1 and e2 flow to the substrate 40, the ESD withstand voltage of the electronic components mounted on the substrate 40 can be improved.

[0381] Some of the currents e1 and e2 can flow into the substrate 40 through the boundary between the lower end 76 of the front cover 70 and the upper end 92 of the side cover 90 or between the rear surface 43 of the substrate 40 and the adhesive layer 61.

[0382] However, as described above, the other end 102 of the side member 100 in the first direction X is disposed above the lower end 76 of the front cover 70, and one end 101 of the side member 100 is disposed below the lower end 76 of the side cover 90. Therefore, the boundary between the lower end 76 of the front cover 70 and the upper end 92 of the side cover 90, or between the rear surface 43 of the substrate 40 and the adhesive layer 61, can be sealed to the outside by the side member 100.

[0383] Therefore, due to the side member 100, the amount of some currents e1 and e2 retained on the front cover 70 and side cover 90 and flowing into the substrate 40 is negligible. This can improve the ESD withstand voltage of electronic components mounted on the substrate 40.

[0384] That is, the display module 30 can be configured to be sealed relative to the outside by the front cover 70, the side cover 90 and the side end member 100, and the metal plate 60 provided on the rear surface 43 of the substrate 40 is formed as a grounded structure. Therefore, even if a current caused by ESD is generated on the front cover 70 or the side cover 90, the current flows into the metal plate 60 through the side end member 100, thereby improving the ESD withstand voltage of the electronic components mounted on the substrate 40.

[0385] As described above, each of the display modules 30A to 30P may independently include a front cover 70, a side cover 90, a metal plate 60, and a side end member 100, which are configured to prevent the infiltration of current according to ESD.

[0386] Therefore, each of the display modules 30A to 30P, after being equipped with a front cover 70, a side cover 90, a metal plate 60, and a side end member 100, can be protected from the current that may be generated by ESD during subsequent manufacturing or transportation.

[0387] Furthermore, even when each of the display modules 30A to 30P is assembled into the frame 15 to form the display device 1, no additional anti-static configuration is required because each of the display modules 30A to 30P independently includes an ESD current protection component.

[0388] Therefore, the front cover 70, side cover 90, metal plate 60 and side end member 100 of each of the display modules 30A to 30P can absorb electric shocks caused by ESD during the manufacturing or transportation of the multiple display modules 30A to 30P and after the multiple display modules 30A to 30P are assembled into display device 1.

[0389] In the following, a display module 30 according to another embodiment of the present disclosure will be described. The components described below, except for the side cover 90', are the same as those of the display module according to the above embodiment, and therefore their description will be omitted.

[0390] Figure 11 This is an enlarged cross-sectional view showing some components of the display module of a display device according to another embodiment.

[0391] refer to Figure 11 The display module 30' may not include the side member 100 as described above.

[0392] The side cover 90' according to embodiments of the present disclosure may include a non-conductive material and may additionally include a mixture of materials having an antistatic agent.

[0393] Due to the antistatic agent, charge is prevented from accumulating on the side end 91' on the outside of the side cover 90'.

[0394] Therefore, ESD E2 is prevented from easily occurring on the side cover 90', and even if a current e2 is generated due to ESD E2, the amount of current e2 is negligible. Current e2 can flow on the side cover 90' and flow to the metal plate 60 that is configured to contact the side cover 90'.

[0395] When electrostatic discharge E1 generates current e1 on the front cover 70, the current e1 can pass through the front cover 70 and not flow into the substrate 40, so that the current e1 flowing on the front cover 70 can flow to the side cover 90'.

[0396] The current e1 flowing to the side cover 90' can bypass the side cover 90' and not flow into the substrate 40, so that the current e1 flowing on the side cover 90' can flow through the side cover 90' to the metal plate 60.

[0397] That is, the side end 91' of the side cover 90' can provide a path for current to flow to the metal plate 60.

[0398] Therefore, unlike the display module 30 of the above embodiments according to the present disclosure, the display module 30' of the embodiment is sealed to the outside by the front cover 70 and the side cover 90' without the side end member 100, and since the metal plate 60 provided on the rear surface 43 of the substrate 40 is formed as a grounded structure, the current generated by ESD on the front cover 70 or the side cover 90' can flow into the metal plate 60 along the side end 91' of the side cover 90', thereby improving the ESD withstand voltage of the electronic components mounted on the substrate 40.

[0399] The method of manufacturing the first display module 30A according to an embodiment will be briefly described below.

[0400] Figure 12 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment. Figure 13 This is a diagram illustrating the process of manufacturing a display device according to an embodiment. Figure 14 It is shown in Figure 12 The diagram shows the process of manufacturing the display device following the process shown. Figure 15 It is shown in Figure 13 The diagram shows the process of manufacturing the display device following the process shown. Figure 16 It is shown in Figure 14 The diagram shows the process of manufacturing the display device following the process shown. Figure 17 It is shown in Figure 15 A diagram illustrating the manufacturing process of the display device following the process shown, and... Figure 18 It is shown in Figure 16 The diagram shows the process of manufacturing the display device after the process shown.

[0401] First, a display module 30 (501) is fabricated. A plurality of inorganic LEDs 50 are mounted on the mounting surface 41 of the substrate 40 of the display module 30. Furthermore, a black matrix 48 can be formed between the plurality of inorganic LEDs 50.

[0402] Next, as Figure 13 As shown, the front cover 70X is bonded to the mounting surface 41 (502) of the display module 30. The front cover 70X refers to the front cover 70X before it is cut. The front cover 70X can cover the entire area of ​​the substrate 40 (including the mounting surface 41). The front cover 70X can be formed by a compression hardening process on the mounting surface 41.

[0403] Next, as Figure 14 As shown, a side cover 90X (503) is distributed in the space between the rear surface of the front cover 70X in the first direction X and the chamfered portion 49, wherein the chamfered portion 49 is formed between the side surface 45 and the mounting surface 41.

[0404] Here, side cover 90X refers to the side cover 90X before it was cut together with the front cover 70X.

[0405] The side cap 90X can be applied in a predetermined dose by the dispenser W. The side cap 90X can be cured by subsequent operations. The side cap 90X can be formed, for example, from a non-conductive black resin.

[0406] Side cover 90X can be applied to cover all of the following: the rear surface of front cover 70X, the side surface 45 of substrate 40, the chamfered portion 49 formed between mounting surface 41 and side surface 45, and the chamfered portion 49 formed between side surface 45 and rear surface 43.

[0407] The side cover 90X can be dispensed onto each of the four edges E of the substrate 40. Thus, the side cover 90X can be dispensed to cover the entire side surface 45 of the substrate 40.

[0408] The side cover 90X is configured to be bonded to the rear surface of the front cover 70X in the first direction X and the side surface 45 of the substrate 40 while being cured, and a chamfered portion 49 is formed between the side surface 45 and the mounting surface 41.

[0409] When the side cover 90X includes a photosensitive material, as a subsequent process, the side cover 90X can be darkened by irradiation with ultraviolet light or the like. However, when the side cover 90X is formed of a translucent or opaque material that does not contain a photosensitive material, ultraviolet irradiation is not required.

[0410] Next, as Figure 15 As shown, the front cover 70X and the side cover 90X are cut in the first direction X such that at least a portion of the front cover 70X extends into a region (504) outside the substrate 40 in the second direction Y, which is perpendicular to the first direction X to which the mounting surface 41 faces.

[0411] The cutting process can be performed using laser (L) cutting or similar methods. Therefore, it is possible to cut the front cover (70X) and the side cover (90X) simultaneously.

[0412] In the cutting process, the front cover 70X and the side cover 90X can be cut such that the front cover 70X includes a first region 71 not only in the second direction Y but also in a third direction X perpendicular to the first direction X and the second direction Y, and the side cover 90X is arranged along the second direction Y and the third direction Z.

[0413] That is, a cutting process can be performed on each of the four edges E of the substrate 40.

[0414] like Figure 16As shown, the side end 75 of the front cover 70 and the side end 91 of the side cover 90 can be formed on the same line along the first direction X by a cutting process. According to an embodiment, the side end 75 of the front cover 70 and the side end 91 of the side cover 90 can be cut to be aligned in a direction parallel to the first direction X.

[0415] The first region 71 can be processed such that when multiple display modules 30 (display modules 30A to 30P) are provided, the length of the first region 71 extending outside the mounting surface 41 is equal to or less than half of the gap G formed between the multiple display modules 30A to 30P.

[0416] Next, the metal plate 60 is bonded to the rear surface 43 (505) of the substrate 40.

[0417] An adhesive layer 61 is provided on the upper surface of the metal plate 60 in the first direction X, such that when the adhesive layer 61 and the rear surface 43 of the substrate 40 are pressed together, the adhesive layer 61 allows the substrate 40 and the metal plate 60 to be joined together.

[0418] However, the embodiments disclosed herein are not limited thereto. The adhesive layer 61 may be disposed on the rear surface 43 of the substrate 40, and the metal plate 60 may be pressed against the adhesive layer 61 disposed on the rear surface 43.

[0419] In this case, a portion of the side cover 90X distributed on the rear surface 43 of the substrate 40 can be retained, but since the amount of the retained portion is negligible, the metal plate 60 and the rear surface 43 of the substrate 40 can be joined substantially parallel to each other.

[0420] Next, the side end member 100X is coated on the side end 75 of the front cover 70 and the side end 91 of the side cover 90 (506).

[0421] The side end member 100X can be formed of a conductive material with high conductivity. The side end member 100X can be coated and bonded to the side end portion 75 of the front cover 70 and the side end portion 91 of the side cover 90. Therefore, the side end member 100X can be provided in the form of a thin film.

[0422] The side member 100X can be coated on each of the four edges E of the substrate 40. Therefore, the side member 100X can be coated to cover the side surface 45 and the side cover 90 of the substrate 40.

[0423] After that, as Figure 18As shown, the display module 30 processed as described above can be fabricated as a plurality of display modules 30A to 30P, and the plurality of display modules 30A to 30P can be arranged adjacent to each other. In this case, the plurality of display modules 30A to 30P can be fixed by jigs. The plurality of display modules 30A to 30P can be arranged in an M×N matrix.

[0424] Therefore, when multiple display modules 30A to 30P are arranged to be adjacent to each other, multiple first regions 71 of multiple front covers 70, multiple side covers 90 disposed on multiple side surfaces 45 of multiple substrates 40, and multiple side end members 100 can be disposed in multiple gaps G formed between multiple display modules 30A to 30P.

[0425] Since the side end 75 of the front cover 70 and the side end 91 of the side cover 90 are formed on the same line along the first direction X, and the side end member 100 is formed on a line parallel to the first direction X, the spacing between the display modules 30A to 30P can be minimized when multiple display modules 30A to 30P are arranged.

[0426] Although several non-limiting example embodiments of the present disclosure have been shown and described, such embodiments are for illustrative purposes only, and those skilled in the art will understand that changes and modifications can be made to these embodiments without departing from the principles and scope of the present disclosure.

Claims

1. A display module, comprising: The substrate includes a mounting surface on which a plurality of inorganic light-emitting diodes (LEDs) are mounted, a side surface, and a rear surface disposed opposite to the mounting surface; Front cover, which engages with and covers the mounting surface; Metal plate, joined to the rear surface; as well as The side cover is configured to surround the side surface. Wherein, the front cover extends beyond the mounting surface in a first direction extending from the mounting surface, and The side cover is configured to extend from the upper side of the metal plate to the lower end of the region of the front cover in a second direction facing the mounting surface to seal the side surface relative to the outside, and the portion of the side cover located at the lower end of the region of the front cover extends outward from the mounting surface in the first direction extending from the mounting surface. The display module further includes a side end member disposed on the outer end of the side cover in the first direction extending from the mounting surface, the side end member comprising a material with a higher conductivity than the side cover, such that charges flowing on the side cover are guided to the metal plate.

2. The display module according to claim 1, wherein, One end of the side member in the second direction facing the mounting surface contacts the metal plate.

3. The display module according to claim 2, wherein, The other end of the side member, in the second direction facing the mounting surface, contacts the front cover.

4. The display module according to claim 2, wherein, One end of the side member is in contact with the side end of the metal plate.

5. The display module according to claim 3, wherein, One end of the side member contacts the side end of the metal plate in the first direction extending from the mounting surface, and The other end of the side member contacts the side end of the front cover in the first direction extending from the mounting surface.

6. The display module according to claim 1, wherein, The side cover comprises a non-conductive material.

7. The display module according to claim 6, wherein, The side cover includes a light-absorbing material.

8. The display module according to claim 1, wherein, The side surface is configured to correspond to the four edges of the mounting surface. The front cover is configured to extend beyond the four edges of the mounting surface in the direction in which the mounting surface extends, and The side cover surrounds the lower end and the side surface of the region of the front cover outside the mounting surface along the direction described.

9. The display module according to claim 8, wherein, The side cover extends from the four edges of the mounting surface to the four edges of the metal plate corresponding to the four edges of the mounting surface, such that the side cover surrounds all four edges of the metal plate.

10. The display module according to claim 1, further comprising a driving circuit board disposed on the metal plate and configured to electrically control the plurality of inorganic LEDs. in, The substrate further includes: Chamfered portions are formed respectively between the mounting surface and the side surface, and between the rear surface and the side surface; and Side surface wiring extends along the side surface and the chamfered portion and is configured to electrically connect the plurality of inorganic LEDs to the driver circuit board. The side cover is wired around the side surface, the chamfered portion, and the side surface.

11. The display module according to claim 1, wherein, The substrate further includes: chamfered portions formed between the mounting surface and the side surface, and between the rear surface and the side surface, respectively. The side cover surrounds the entire chamfered portion.

12. The display module according to claim 1, wherein, The front cover includes a first region in the region outside the mounting surface in the first direction extending from the mounting surface, and also includes a second region disposed on the mounting surface. The side cover is disposed below the front cover at a position corresponding to the first region along the second direction, but is not disposed in the second region.

13. A display device, comprising: Display module array, wherein multiple display modules are arranged horizontally in an M×N matrix. Each of the plurality of display modules includes: The substrate includes a mounting surface on which a plurality of inorganic light-emitting diodes (LEDs) are mounted, a side surface, and a rear surface disposed opposite to the mounting surface; Front cover, which engages with and covers the mounting surface; Metal plate, joined to the rear surface; and The side cover is configured to surround the side surface. Wherein, the front cover extends beyond the mounting surface in a first direction extending from the mounting surface, and The side cover extends from the upper side of the metal plate to the lower end of the region of the front cover in a second direction facing the mounting surface to seal the side surface relative to the outside, and the portion of the side cover located at the lower end of the region of the front cover extends outward from the mounting surface in the first direction extending from the mounting surface. Each of the plurality of display modules further includes: a side end member disposed on the outer end of the side cover in the first direction extending from the mounting surface, the side end member comprising a material with a higher conductivity than that of the side cover, such that charges flowing on the side cover are guided to the metal plate.

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