A Mini LED display module film packaging method

Abstract

The present invention provides a method for packaging a Miniled display module film, comprising a substrate to be pressed, a film pressing jig and a film to be pressed, the film pressing jig comprising an extension portion and a hollow area arranged in the middle, the middle portion of the film pressing jig forming a hollow area through an opening, the size of the hollow area matches the size of the film to be pressed, the thickness of the film to be pressed is greater than or equal to the thickness of the film pressing jig, and the size of the film pressing jig is greater than or equal to the size of the substrate to be pressed; by adding a film pressing jig in the outer ring area of ​​the film, the height difference of the film position can be reduced, and support can be formed for the substrate during the film pressing process, thereby reducing the force on the edge area of ​​the film, thereby reducing glue overflow at the edge of the film, and further improving the concave indentation of the joint.

Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging, and in particular to a method for packaging a Mini LED display module with an adhesive film. Background Art

[0002] At present, as electronic products are developing towards the trend of being light, thin, short and small, Miniled display products have begun to be widely used in ultra-large screen high-definition displays, such as monitoring and command, high-definition broadcasting, high-end cinemas, medical diagnosis, advertising display, conference and exhibition, office display, virtual reality and other commercial fields. Its circuit substrate can carry more Minileds. In the process of packaging the substrate and the LED chip, a film is needed for packaging. At the same time, the glue layer needs to be heated and softened and filled in the gap between the LED chip and the substrate under the action of external pressure. For example, the Chinese patent application number is 202120893411.3, and the announcement date is 2021.12.21, which discloses a new type of Mini or Micro The LED packaging structure includes a circuit board and a film. The surface of the circuit board is mounted with an LED chip. The film is a semi-cured film, which is fixed to the surface of the circuit board by high-temperature molding and completely covers the LED chip. The semi-cured film is used and fixed to the surface of the circuit board by high-temperature molding to completely cover the LED chip to achieve packaging, replacing the traditional potting method. This structure does not require glue mixing before packaging, and the process is simple. In addition, the semi-cured film has a small expansion coefficient, which can effectively improve the problem of board warping after packaging.

[0003] However, in the lamination process, the structure is pressed onto the substrate. Figure 6 As shown, if the diaphragm is thicker, in order to make the adhesive film better integrated between the LED chips on the substrate, it is necessary to apply a certain amount of pressure on the upper end. If the pressure is too great, the edge adhesive layer of the adhesive film will overflow, resulting in a large height difference between the top of the two sides 01 and the top of the film 03 after the film is formed. Therefore, when multiple modules are spliced ​​together to form a display device, obvious concave indentations will appear at the joints of the modules after they are spliced ​​and packed, affecting the appearance of the product. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for packaging a Miniled display module film, which can reduce the height difference of the film position by adding a film pressing jig in the outer ring area of ​​the film, and provide support for the substrate during the film pressing process, thereby reducing the force on the edge area of ​​the film, thereby reducing glue overflow at the edge of the film, and further improving the concave indentation of the joint.

[0005] To achieve the above objectives, a Mini LED display module film packaging method is provided, comprising a substrate to be pressed, a film pressing jig, and a film to be pressed, wherein the film pressing jig comprises an extension portion and a hollow area provided in the middle, the middle portion of the film pressing jig is formed with an opening to form a hollow area, the size of the hollow area matches the size of the film to be pressed, a functional area for placing an LED chip is provided on the substrate to be pressed, the thickness of the film to be pressed is greater than or equal to the thickness of the film pressing jig, the functional area of ​​the LED chip on the substrate to be pressed is smaller than the size of the hollow area, and the size of the film pressing jig is greater than or equal to the size of the substrate to be pressed;

[0006] The specific steps include:

[0007] (1) Before laminating, place the film to be laminated on the base of the laminator;

[0008] (2) placing the laminating jig so that the hollow area in the middle of the laminating jig is aligned with the film to be pressed, and at the same time, the film to be pressed falls into the hollow area, and the outer portion forms a closed loop around the film to be pressed;

[0009] (3) Start the laminating machine to soften the adhesive film to be pressed, place the substrate to be pressed on the laminating jig, cover the hollow area, and support the substrate to be pressed with the extension;

[0010] (4) Apply pressure to the substrate to be pressed until the adhesive film to be pressed and the LED chip on the substrate to be pressed are completely covered and the film is pressed.

[0011] The above setting is to set an opening in the middle of the laminating jig and form a hollow area through the opening, and at the same time make the size of the hollow area match the size of the film to be pressed, so that the film to be pressed can be matched and fall into the hollow area of ​​the laminating jig. In addition, the thickness of the film to be pressed is set to be greater than or equal to the thickness of the laminating jig, and the size of the substrate to be pressed is set to be greater than or equal to the size of the hollow area. When the substrate to be pressed is placed on the laminating jig, it can be ensured that the substrate to be pressed is in full contact with the film to be pressed. This method presses the substrate to be pressed into the film to be pressed, so that the LED chip on the substrate to be pressed can enter the film to be pressed faster, thereby achieving a good laminating effect. At the same time, during the laminating process, while ensuring that the laminating jig forms support for the substrate to be pressed, it can reduce the force on the edge area of ​​the film, reduce glue overflow at the edge of the film, and thus improve the concave indentation of the joint.

[0012] Furthermore, the size of the hollow area is greater than or equal to the size of the film to be laminated.

[0013] The above arrangement facilitates the film to be pressed to fall into the hollow area, while reducing glue overflow from the edge of the film to be pressed during film pressing.

[0014] Furthermore, the thickness of the laminating jig is set to 0.20-0.30 mm.

[0015] The above arrangement enables the height of the film to be pressed to be minimized after the film to be pressed falls into the hollow area of ​​the film pressing fixture.

[0016] Furthermore, a driver IC is provided on the first surface of the substrate to be pressed.

[0017] The above settings are used to connect with the LED chip.

[0018] Furthermore, an LED chip is provided on the second surface of the substrate to be pressed.

[0019] The above arrangement is used to emit light and encapsulate the LED chip through the adhesive film.

[0020] Furthermore, the film pressing jig includes a first connecting plate, a second connecting plate, a third connecting plate and a fourth connecting plate connected in sequence end to end, the first connecting plate, the second connecting plate and the third connecting plate are connected to form a U-shaped connecting plate, two ends of one side of the fourth connecting plate are respectively provided with connecting grooves, and the top of the connecting groove is provided with a first opening, the first connecting plate and the third connecting plate are provided with connecting protrusions at positions corresponding to the connecting grooves, and the fourth connecting plate is clamped with the U-shaped connecting plate, step (2) includes placing the U-shaped connecting plate of the film pressing jig so that the hollow area in the middle of the film pressing jig is aligned with the film to be pressed, and at the same time, the film to be pressed enters the hollow area from one side of the U-shaped connecting plate, and the connecting groove of the fourth connecting plate is connected to the connecting protrusion of the U-shaped connecting plate so that the extension forms a closed loop around the film to be pressed.

[0021] The above arrangement facilitates the film to be pressed to enter the hollow area of ​​the laminating jig by firstly passing the film to be pressed from one side of the U-shaped connecting plate, and then forming a closed loop with the fourth connecting plate and the U-shaped connecting plate.

[0022] Furthermore, the method also includes step (5) after the lamination is completed, after the adhesive film to be pressed is solidified, the U-shaped connecting plate and the substrate to be pressed that has completed the lamination are slid out of the first opening on one side of the connecting groove of the fourth connecting plate, and then the substrate to be pressed that has completed the lamination is moved out of the opening on one side of the U-shaped connecting plate to achieve demolding of the substrate to be pressed.

[0023] The above arrangement can conveniently separate the substrate to be laminated after lamination from the lamination jig, and the operation is convenient and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the present invention.

[0025] Figure 2It is a side sectional view of the present invention.

[0026] Figure 3 It is a side cross-sectional view after the film packaging of the present invention.

[0027] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0028] Figure 5 It is the workflow diagram of the present invention.

[0029] Figure 6 It is a schematic diagram of the structure after film pressing in the prior art.

[0030] Figure 7 Schematic diagram of the connection of a lamination jig in one embodiment of the present invention.

[0031] Figure 8 FIG. 1 is a top view of the fourth connecting plate in the lamination fixture according to one embodiment of the present invention. DETAILED DESCRIPTION

[0032] The embodiments of the present invention are further described in detail below with reference to the accompanying drawings and specific implementation plans.

[0033] like Figure 1-4 As shown, the embodiment of the present invention provides a Mini LED display module film packaging method, including a substrate to be pressed 1, a film pressing jig 2 and a film to be pressed 3, the film pressing jig 2 includes an extension portion 21 and a hollow area 22 arranged in the middle. In this embodiment, an opening is provided in the middle of the film pressing jig 2, and the hollow area 22 is formed by the opening. The size of the hollow area 22 is greater than or equal to the size of the film to be pressed 3, so that it is easy to fall into the hollow area 22; in this embodiment, the thickness of the film to be pressed 3 is greater than or equal to the thickness of the film pressing jig 2. In this embodiment, the thickness of the film pressing jig 2 is set to 0.25 mm, and the size of the substrate to be pressed 1 is greater than or equal to the thickness of the film pressing jig 2. The size of the hollow area 22 is greater than or equal to that of the hollow area 22, and a functional area for placing LED chips is provided on the substrate 1 to be pressed. The functional area of ​​the LED chip on the substrate to be pressed is smaller than the size of the hollow area. The size of the laminating jig 2 is greater than or equal to the size of the substrate 1 to be pressed, so that when the substrate 1 to be pressed is placed on the laminating jig 2, it is ensured that the substrate 1 to be pressed is in full contact with the adhesive film 3 to be pressed. Therefore, during the laminating process, while ensuring that the laminating jig 2 supports the substrate 1 to be pressed, it can reduce the force on the edge area of ​​the adhesive film, reduce adhesive overflow at the edge of the adhesive film, and reduce the contact between the extension part and the adhesive film to be pressed, thereby improving the concave indentation of the joint.

[0034] In this embodiment, a driver IC 12 is provided on the first surface 11 of the substrate to be pressed 1, and an LED chip 14 is provided on the second surface 13 of the substrate to be pressed. The driver IC 12 is connected to the LED chip 14, and the LED chip 14 is encapsulated by a film.

[0035] like Figure 7-8 As shown, in one embodiment of the present invention, the laminating jig 2 includes a first connecting plate 21, a second connecting plate 22, a third connecting plate 23, and a fourth connecting plate 24 connected end to end in sequence. The first connecting plate 21, the second connecting plate 22, and the third connecting plate 23 are connected to form a U-shaped connecting plate. The fourth connecting plate 24 is provided with connecting grooves 241 at both ends of one side, and the connecting groove 241 is provided with a first opening 242 only at the top. Connecting protrusions 211 are provided at positions corresponding to the connecting grooves 241 on the first connecting plate 21 and the third connecting plate 23, and the fourth connecting plate 24 is snap-fitted to the U-shaped connecting plate. In this embodiment, the first connecting plate 21, the second connecting plate 22, the third connecting plate 23, and the fourth connecting plate 24 are integrally formed. The connecting protrusion 211 of the U-shaped connecting plate enters the connecting groove 241 of the fourth connecting plate 24 from the first opening 242 to achieve installation.

[0036] See also Figure 5 As shown, a method for encapsulating a Mini LED display module with a film, the specific steps of which include:

[0037] (1) Before laminating, place the film to be laminated on the base of the laminator;

[0038] (2) placing the film pressing jig so that the hollow area in the middle of the film pressing jig is aligned with the film to be pressed, and at the same time, the film to be pressed falls into the hollow area, and the extension forms a closed loop around the film to be pressed; in one embodiment, step (2) includes placing a U-shaped connecting plate of the film pressing jig so that the hollow area in the middle of the film pressing jig is aligned with the film to be pressed, and at the same time, the film to be pressed enters the hollow area from one side of the U-shaped connecting plate, and the connecting groove 241 of the fourth connecting plate 24 is connected to the connecting protrusion of the U-shaped connecting plate so that the extension forms a closed loop around the film to be pressed.

[0039] (3) Start the laminating machine to soften the film to be pressed, place the substrate to be pressed on the laminating jig, cover the hollow area, and support the substrate to be pressed with the extension part; in this embodiment, a heating component is provided at the upper end of the laminating machine base to heat the film to be pressed so as to soften the film to be pressed.

[0040] (4) Applying pressure to the substrate 1 to be pressed until the adhesive film 3 to be pressed and the LED chip on the substrate 1 to be pressed are completely covered and the lamination is completed. In this embodiment, the substrate 1 to be pressed can be clamped by a robot and placed on top of the lamination fixture, and a pressure is applied to the substrate 1 by the robot. The magnitude of the pressure is determined by the thickness of the adhesive film to be pressed, etc.

[0041] (5) After the lamination is completed, wait for the adhesive film to be laminated to solidify, slide the U-shaped connecting plate and the substrate to be laminated that has completed lamination out of the first opening 242 on one side of the connecting groove 241 of the fourth connecting plate 24, and then move the substrate to be laminated that has completed lamination out of the opening on one side of the U-shaped connecting plate to achieve demolding of the substrate to be laminated.

Claims

1. A method for encapsulating a Mini LED display module adhesive film, comprising a substrate to be pressed, a film pressing fixture, and an adhesive film to be pressed, characterized in that: The laminating jig includes an extension portion and a hollow area arranged in the middle, the middle portion of the laminating jig is formed with an opening to form a hollow area, the size of the hollow area matches the size of the film to be pressed, a functional area for placing an LED chip is provided on the substrate to be pressed, the thickness of the film to be pressed is greater than or equal to the thickness of the laminating jig, the functional area of ​​the LED chip on the substrate to be pressed is smaller than the size of the hollow area, and the size of the laminating jig is greater than or equal to the size of the substrate to be pressed; the laminating jig includes a first connecting plate, a second connecting plate, a third connecting plate and a fourth connecting plate connected end to end in sequence, the first connecting plate, the second connecting plate and the third connecting plate are connected to form a U-shaped connecting plate, both ends of one side of the fourth connecting plate are respectively provided with connecting grooves, and the top of the connecting groove is provided with a first opening, and the positions of the first connecting plate and the third connecting plate corresponding to the connecting grooves are provided with connecting protrusions, and the fourth connecting plate is clamped with the U-shaped connecting plate; The specific steps include: (1) Before laminating, place the film to be laminated on the base of the laminator; (2) placing the film pressing jig so that the hollow area in the middle of the film pressing jig is aligned with the film to be pressed, and at the same time, the film to be pressed falls into the hollow area, and the extension forms a closed loop around the film to be pressed; placing the U-shaped connecting plate of the film pressing jig so that the hollow area in the middle of the film pressing jig is aligned with the film to be pressed, and at the same time, the film to be pressed enters the hollow area from one side of the U-shaped connecting plate, and the connecting groove of the fourth connecting plate is connected to the connecting protrusion of the U-shaped connecting plate so that the extension forms a closed loop around the film to be pressed; (3) Start the laminating machine to soften the adhesive film to be pressed, place the substrate to be pressed on the laminating jig, cover the hollow area, and support the substrate to be pressed with the extension; (4) Applying pressure to the substrate to be pressed until the adhesive film to be pressed and the LED chip on the substrate to be pressed are completely covered and the film is pressed; (5) After the lamination is completed, wait for the adhesive film to be laminated to solidify, slide the U-shaped connecting plate and the substrate to be laminated that has completed lamination out of the first opening on one side of the connecting groove of the fourth connecting plate, and then move the substrate to be laminated that has completed lamination out of the opening on one side of the U-shaped connecting plate to achieve demolding of the substrate to be laminated.

2. A Mini LED display module film encapsulation method according to claim 1, characterized in that: The size of the hollow area is greater than or equal to the size of the film to be laminated.

3. The method for encapsulating a Mini LED display module with adhesive film according to claim 1, wherein: The thickness of the laminating jig is set to 0.20-0.30 mm.

4. The method for encapsulating a Mini LED display module with adhesive film according to claim 1, wherein: A driving IC is disposed on the first surface of the substrate to be pressed.

5. A Mini LED display module film encapsulation method according to claim 4, characterized in that: An LED chip is arranged on the second surface of the substrate to be pressed.

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