A cross-segment repair method and device, electronic equipment and storage medium

Abstract

The application provides a cross-partition repair method and device, electronic equipment and a storage medium, comprising: acquiring a signal line existing in the circuit board and a reference plane corresponding to the signal line, the reference plane having a partition area, and the normal projection of the signal line in the reference plane overlapping with the partition area; based on the size of the normal projection of the signal line in the partition area, a part or all of the areas in the partition area are closed to obtain a closed area; wherein the normal projection of the signal line in the partition area is located in the closed area, and the material of the closed area is the same as that of the reference plane. Since the partition area of the reference plane is partially or completely closed, the normal projection of the signal line in the partition area is located in the closed area, so that the signal line crosses the complete reference plane. In this way, the implementation is simple and the cost is low, and the implementation of the signal line cross-partition repair is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board design, and in particular to a method, apparatus, electronic device, and storage medium for cross-segment repair. Background Technology

[0002] A circuit board is used to mount electronic components and connect with them to achieve certain functions. Different copper foil layers in a circuit board have different uses, generally divided into two types: copper foil layers that serve as signal transmission paths are called signal layers; copper foil layers that serve as power supply and / or return paths are called power layers or ground layers. Routing on signal layers is called signal lines, and large or complete copper areas on power or ground layers are called reference planes.

[0003] In circuit board design, when multiple power supplies exist on a reference plane, the reference plane becomes segmented, resulting in an incomplete reference plane. During actual routing, the incompleteness of adjacent reference planes on signal layers can cause signal lines to cross the segmentation, easily leading to impedance abrupt changes and affecting signal integrity.

[0004] Currently, the common solutions to the signal line crossing split problem are to increase the number of circuit board layers to give the signal line a complete reference plane, or to add patch capacitors to allow the signal line to pass through the network of the two planes divided by the reference plane. This leads to an increase in circuit board cost, and due to structural and space limitations, the number of circuit board layers or patch capacitors cannot be increased indefinitely, making the design quite difficult. Summary of the Invention

[0005] In view of this, the present invention aims to provide a cross-segment repair method, apparatus, electronic device and storage medium to solve the problems of high cost and design difficulty in current cross-segment repair of signal lines.

[0006] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0007] A cross-segment repair method, applied to a circuit board, includes:

[0008] Obtain signal lines that cross divisions in the circuit board and reference planes corresponding to the signal lines. The reference planes have division areas, and the orthographic projection of the signal lines in the reference planes overlaps with the division areas.

[0009] Based on the size of the orthographic projection of the signal line into the segmented region, a portion or all of the segmented region is closed to obtain a closed region.

[0010] The orthographic projection of the signal line in the segmented region is located in the closed region, and the material of the closed region is the same as the material of the reference plane.

[0011] Furthermore, when there is only one signal line, the step of closing off part or all of the segmented area based on the size of the orthographic projection of the signal line into the segmented area to obtain a closed area includes:

[0012] Based on the center point of the signal line, the edge of the reference plane surrounding the segmented area is expanded outward to form the closed area.

[0013] Furthermore, when there are two signal lines, the step of closing off part or all of the segmented area based on the size of the orthographic projection of the signal lines into the segmented area to obtain a closed area includes:

[0014] Based on the center point between the two signal lines, the edge of the reference plane surrounding the segmented area is expanded outward to form a complete closed area;

[0015] The orthographic projections of the two signal lines in the segmented area are both located within the enclosed area.

[0016] Furthermore, where there are two signal lines, the method of closing off part or all of the segmented area based on the size of the orthographic projection of the signal lines into the segmented area to obtain a closed area includes:

[0017] Based on the center points of the two signal lines, the closed regions corresponding to the two signal lines are formed by expanding outward from the edge of the reference plane surrounding the segmented region; wherein the two closed regions do not overlap.

[0018] The orthographic projection of each of the signal lines in the segmented region lies within the corresponding enclosed region.

[0019] Furthermore, the step of closing off part or all of the segmented region to obtain a closed region includes:

[0020] The closed region is formed by extending from a first edge of the reference plane surrounding the segmented region to a second edge of the reference plane surrounding the segmented region; or, it extends simultaneously from both the first edge and the second edge into the segmented region.

[0021] The first edge and the second edge are two opposite edges.

[0022] Furthermore, the first edge is the upper or lower edge of the reference plane surrounding the segmented region.

[0023] Furthermore, the first edge is the left or right edge of the reference plane surrounding the segmented region.

[0024] Furthermore, the difference between the width of the enclosed area and the width of the orthographic projection of the signal line within the segmented area is within a preset range, and the maximum value of the preset range is 3H, where H is the thickness of the dielectric layer between the signal line and the nearest reference plane.

[0025] Furthermore, obtaining the preset range includes:

[0026] Construct simulation models of the signal lines and the reference plane; the signal lines include striplines and microstrip lines;

[0027] Using the center of the signal line as a reference, the distance between the edge of the signal line and the two sides of the reference plane is gradually increased, and the electric field intensity of the signal line is simulated and tested to obtain the electric field energy transfer rate corresponding to each spacing.

[0028] The optimal spacing is determined based on the electric field energy transfer rate corresponding to each spacing.

[0029] Based on the optimal spacing, the preset range is determined.

[0030] Further, after closing off part or all of the segmented region based on the size of the orthographic projection of the signal line into the segmented region to obtain a closed region; the method further includes:

[0031] The circuit board after the closed area is formed is smoothed.

[0032] Compared with existing technologies, the cross-segment repair method of the present invention has the following advantages:

[0033] This invention obtains a signal line that spans a segment in the circuit board and a reference plane corresponding to the signal line. The reference plane has a segmented area, and the orthographic projection of the signal line in the reference plane overlaps with the segmented area. Based on the size of the orthographic projection of the signal line in the segmented area, part or all of the segmented area is closed to obtain a closed area. The orthographic projection of the signal line in the segmented area is located in the closed area, and the material of the closed area is the same as the material of the reference plane.

[0034] By partially or completely enclosing the segmented regions of the reference plane, the orthographic projection of the signal line within the segmented region lies within the enclosed region, allowing the signal line to span the entire reference plane. This method is simple to implement and low in cost, significantly improving the ease of signal line repair across segments.

[0035] Another objective of this invention is to provide a cross-segment repair device to solve the problems of high cost and design difficulty in current cross-segment repair of signal lines.

[0036] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0037] A cross-segment repair device, comprising:

[0038] The acquisition module is used to acquire signal lines that cross the segment in the circuit board and the reference plane corresponding to the signal lines. The reference plane has a segmentation area, and the orthographic projection of the signal lines in the reference plane overlaps with the segmentation area.

[0039] A sealing module is used to seal off part or all of the segmented area based on the size of the orthogonal projection of the signal line in the segmented area, thereby obtaining a sealed area; wherein the orthogonal projection of the signal line in the segmented area is located in the sealed area, and the material of the sealed area is the same as the material of the reference plane.

[0040] The advantages of the cross-segmentation device and the cross-segmentation method described above compared to the prior art are the same, and will not be repeated here.

[0041] Another objective of this invention is to provide an electronic device that solves the problems of high cost and design difficulty in repairing cross-segmented signal lines.

[0042] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0043] An electronic device, comprising:

[0044] A processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the program, implements the cross-segment repair method described above.

[0045] The electronic device described herein has the same advantages over the prior art as the cross-segmentation method described above, and will not be elaborated here.

[0046] Another objective of this invention is to provide a computer-readable storage medium to address the current problems of high cost and design difficulty in repairing signal lines across splits.

[0047] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0048] A computer-readable storage medium comprising:

[0049] When the instructions in the storage medium are executed by the processor of the electronic device, the electronic device is able to perform any of the cross-segment repair methods described above.

[0050] The computer-readable storage medium described herein has the same advantages over the prior art as the cross-segmentation method described above, and will not be elaborated here. Attached Figure Description

[0051] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0052] Figure 1 A flowchart illustrating the steps of a cross-segment repair method according to Embodiment 1 of the present invention is shown.

[0053] Figure 2 A schematic diagram of the signal line crossing the split of the present invention is shown;

[0054] Figure 3 This diagram illustrates the signal line cross-segment repair according to the present invention.

[0055] Figure 4 This diagram illustrates a closed region obtained by cross-segment repair of a signal line according to another embodiment of the present invention.

[0056] Figure 5 This diagram illustrates a closed region obtained by cross-segment repair of two signal lines according to another embodiment of the present invention.

[0057] Figure 6 This diagram illustrates a closed region obtained by cross-segment repair of two signal lines according to another embodiment of the present invention.

[0058] Figure 7 A flowchart illustrating the steps for obtaining a preset range according to another embodiment of the present invention is shown;

[0059] Figure 8 A schematic diagram of the simulation test of the signal line and reference plane of the present invention is shown;

[0060] Figure 9 An example flowchart of a cross-segment repair method according to another embodiment of the present invention is shown;

[0061] Figure 10 A schematic diagram of a cross-segment repair device according to Embodiment 2 of the present invention is shown. Detailed Implementation

[0062] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0063] It should be noted that, without conflict, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0064] A printed circuit board (PCB) is a bare board used to mount and connect electronic components to achieve a specific function. PCBs enable the miniaturization and visualization of circuits, playing a crucial role in the mass production of fixed circuits and the optimization of electrical appliance layout.

[0065] The circuit board is mainly composed of copper foil, a curing film (CORE), and a prepreg (PP). Both the curing film and the prepreg are composed of glass fiber (solid) and epoxy resin (semi-solid), differing only in the proportion of epoxy resin. The copper foil deposited on the curing film forms a copper-clad laminate (CCL). The CCL and PP are then laminated under high temperature, high pressure, and chemical assistance. Finally, holes are drilled and electroplated onto the laminated CCL and PP to form a multilayer board.

[0066] The number of layers in a circuit board is defined by the number of copper foil layers it contains. For example, a 4-layer circuit board means that it contains 4 copper foil layers.

[0067] Different copper foil layers serve different purposes, generally falling into two categories: copper foil layers used as signal transmission paths are called signal layers; copper foil layers used as power supply / return paths are called power layers or ground layers. Routing on signal layers is called signal lines, while large or complete copper areas on power or ground layers are called reference planes.

[0068] Referring to Table 1, which shows the design parameters of each layer of an example 10-layer circuit board, as shown in Table 1, the stack-up design of the circuit board is conventionally labeled on the layers corresponding to the purpose. The signal layer is labeled as Si gna l, and the power layer or bottom layer can be labeled as Power or GND.

[0069] There is a dielectric layer between adjacent layers, and in some cases, the dielectric layer between each pair of adjacent layers can also be referred to as the dielectric layer. The unit of dielectric thickness is usually microliters (mils), while copper foil thickness is usually characterized by weight units (ounces, oz), for example, 1 oz is approximately equal to 1.2 microliters.

[0070]

[0071] Table 1

[0072] In the process of circuit board design, the splitting of power planes or ground planes will result in an incomplete reference plane. When laying signal lines, the reference plane of the signal lines will appear to cross from one power plane to another. This phenomenon can be called signal line cross-split.

[0073] Crossing splits in signal lines can easily cause sudden changes in signal impedance, leading to reflections and affecting signal integrity. Furthermore, crossing splits can also cause overlapping traces on adjacent layers, creating interlayer crosstalk, which also affects signal integrity.

[0074] As the signal transmission rate of signal lines increases, in order to ensure signal integrity, the circuit board design process must ensure that the signal lines have a complete reference plane, that is, the adjacent layers of the signal layer must be complete.

[0075] In prior art, there are two methods for repairing signal lines that cross splits: increasing the number of circuit board layers to give the signal line a complete reference plane, or adding patch capacitors to allow the signal line to pass through the network of the two planes divided by the reference plane. However, this undoubtedly increases the cost of the circuit board, and due to structural and space limitations, the number of circuit board layers or patch capacitors cannot be increased indefinitely, making the design quite difficult.

[0076] Therefore, the development of a circuit board signal line cross-segment repair method that can control circuit board costs while reducing design complexity is urgently needed.

[0077] Example 1

[0078] Embodiment 1 of the present invention provides a low-cost, easy-to-implement method for repairing cross-segmented signal lines on circuit boards.

[0079] Reference Figure 1 , Figure 1 A flowchart illustrating the steps of a cross-segment repair method according to Embodiment 1 of the present invention is shown, as follows: Figure 1 As shown, it includes:

[0080] Step S101: Obtain the signal line that crosses the segment in the circuit board and the reference plane corresponding to the signal line. The reference plane has a segmentation area, and the orthographic projection of the signal line in the reference plane overlaps with the segmentation area.

[0081] First, obtain the circuit board design file, and then find the signal lines that cross the split and the corresponding reference planes in the circuit board design file.

[0082] In one specific implementation, the circuit board design file can be imported into an electronic design automation tool to check for signal line crossings, such as Allegro software.

[0083] In existing technologies, electronic design automation (EDA) tools can perform cross-split checks on signal lines in circuit board design files and display the coordinates of points where cross-split issues occur. This technology is relatively mature and will not be elaborated upon here.

[0084] Understandably, a signal line splitting could occur in one segment of the signal line, or in two or more segments of the signal line.

[0085] After obtaining the signal lines that cross the segment in the circuit board and their corresponding reference planes, step S102 is executed.

[0086] Step S102: Based on the size of the orthographic projection of the signal line in the segmented area, a portion or all of the area in the segmented area is closed to obtain a closed area; wherein the orthographic projection of the signal line in the segmented area is located in the closed area, and the material of the closed area is the same as the material of the reference plane.

[0087] After obtaining the coordinates of the signal lines that cross the segment on the circuit board and their corresponding reference planes, the partial or complete area of ​​the segment is closed off based on the size of the orthographic projection of the signal lines in the segment area to obtain the closed area.

[0088] In one specific implementation, the actual location of the cross-segmentation on the circuit board is determined based on the coordinates of the signal line points where the cross-segmentation occurs.

[0089] Reference Figure 2 , Figure 2 A schematic diagram of the signal line crossing the split of the present invention is shown, as follows. Figure 2 As shown, point A of the high-speed signal line crosses the reference plane segmentation area, resulting in a cross-segmentation situation.

[0090] Signal lines on circuit boards are divided into low-speed signal lines and high-speed signal lines. Signal lines that transmit low-speed signals are called low-speed signal lines, and those that transmit high-speed signals are called high-speed signal lines. Generally, signals whose steepness exceeds a certain threshold are called high-speed signals, and vice versa. High-speed signal lines typically consist of a pair of signal lines.

[0091] The signal line obtains power and / or signal return through the reference plane. In order for the signal line to cross the complete reference plane, part or all of the area in the segmented region is closed to obtain a closed region. The closed region is connected to the reference plane to form a new complete reference plane.

[0092] When dividing a portion or all of the segmented region, the edges of the reference plane surrounding the segmented region are expanded outward based on the orthographic projection of the signal line in the segmented region to obtain a closed region, so that the orthographic projection of the signal line in the segmented region is completely located within the closed region.

[0093] When expanding the edge of the reference plane around the segmented area, you can use two opposite edges to expand from one edge to the other, or you can use two opposite edges to expand towards the center at the same time.

[0094] In one specific implementation, Skill language programs can be written to extend the edges of the reference planes surrounding the partitioned areas of the circuit board design file.

[0095] Skill language programs refer to programs written in Skill language. These programs can be application software, scripts, or any other program that can extend the edges of the reference plane around the segmented region.

[0096] The size of the enclosed area can be the size of the orthographic projection of the signal line in the segmented area, or it can be a specific preset size, depending on the actual needs.

[0097] Reference Figure 3 , Figure 3 A schematic diagram of the signal line cross-segment repair according to the present invention is shown, as follows. Figure 3 As shown, based on the projection of signal line point A onto the segmented region, the edges of the reference plane surrounding the segmented region are expanded outwards, so that the projection of signal line point A onto the segmented region lies within the closed region. The closed region is connected to the reference plane to form a new reference plane, thus the signal line crosses the complete reference plane.

[0098] When the area of ​​the enclosed region is smaller than the area of ​​the divided region, it forms as follows: Figure 3 The closed region shown is located within the segmented region and connected to a new reference plane. If the area of ​​the closed region is larger than the area of ​​the segmented region, then a new reference plane is formed where the closed region extends beyond the segmented region and is connected to the reference plane.

[0099] This invention provides an embodiment of a circuit board that obtains a signal line that spans a segment and a reference plane corresponding to the signal line. The reference plane has a segmented area, and the orthographic projection of the signal line in the reference plane overlaps with the segmented area. Based on the size of the orthographic projection of the signal line in the segmented area, a portion or all of the segmented area is closed to obtain a closed area. The orthographic projection of the signal line in the segmented area is located in the closed area, and the material of the closed area is the same as the material of the reference plane.

[0100] By partially or completely enclosing the segmented regions of the reference plane, the orthographic projection of the signal line within the segmented region lies within the enclosed region, allowing the signal line to span the entire reference plane. This method is simple to implement and low in cost, significantly improving the ease of signal line repair across segments.

[0101] In an optional embodiment, when there is only one signal line, the step of closing off part or all of the segmented area based on the size of the orthographic projection of the signal line into the segmented area to obtain a closed area includes:

[0102] Based on the center point of the signal line, the edge of the reference plane surrounding the segmented area is expanded outward to form the closed area.

[0103] Reference Figure 4 , Figure 4 This diagram illustrates a closed region obtained by cross-segment repair of a signal line according to another embodiment of the present invention, as shown below. Figure 4 As shown, when there is only one signal line in the case of crossing the segment, the edge of the reference plane around the segment is expanded outward based on the center point of the orthographic projection of the signal line into the segment area to form a closed area.

[0104] When expanding the edge of the reference plane around the segmented area, you can use two opposite edges to expand from one edge to the other, or you can use two opposite edges to expand towards the center at the same time.

[0105] The size of the enclosed area can be the size of the orthographic projection of the signal line in the segmented area, or it can be a specific preset size, depending on the actual needs.

[0106] In an optional embodiment, when there are two signal lines, the step of closing off part or all of the segmented area based on the size of the orthographic projection of the signal lines into the segmented area to obtain a closed area includes:

[0107] Based on the center point between the two signal lines, the edge of the reference plane surrounding the segmented area is expanded outward to form a complete closed area;

[0108] The orthographic projections of the two signal lines in the segmented area are both located within the enclosed area.

[0109] Reference Figure 5 , Figure 5 This diagram illustrates a closed region obtained by cross-segment repair of two signal lines according to another embodiment of the present invention, as shown below. Figure 5 As shown, when there is a pair of signal lines that cross the segmentation, the two signal lines can be treated as a whole to construct a closed region.

[0110] Based on the center point between the orthographic projections of the two signal lines in the segmented area, the edge of the reference plane surrounding the segmented area is expanded outward to form a complete closed area, so that the orthographic projections of the two signal lines in the segmented area fall completely within the closed area.

[0111] When expanding the edge of the reference plane around the segmented area, you can use two opposite edges to expand from one edge to the other, or you can use two opposite edges to expand towards the center at the same time.

[0112] The size of the enclosed area can be the size of the orthographic projection of the signal line in the segmented area, or it can be a specific preset size, depending on the actual needs.

[0113] In one optional embodiment, where there are two signal lines, the process of closing off part or all of the segmented area based on the size of the orthographic projection of the signal lines into the segmented area to obtain a closed area includes:

[0114] Based on the center points of the two signal lines, the closed regions corresponding to the two signal lines are formed by expanding outward from the edge of the reference plane surrounding the segmented region; wherein the two closed regions do not overlap.

[0115] The orthographic projection of each of the signal lines in the segmented region lies within the corresponding enclosed region.

[0116] Reference Figure 6 , Figure 6 This diagram illustrates a closed region obtained by cross-segment repair of two signal lines according to another embodiment of the present invention, as shown below. Figure 6 As shown, when there is a pair of signal lines that cross the segmentation, the two signal lines can also be treated as separate individuals to construct their own closed regions.

[0117] Based on the center point of the orthographic projection of each of the two signal lines in the segmented region, the edge of the reference plane surrounding the segmented region is expanded outward to form the closed region corresponding to each of the two signal lines, so that the orthographic projection of the two signal lines in the segmented region falls within the corresponding closed region.

[0118] When expanding the edge of the reference plane around the segmented area, you can use two opposite edges to expand from one edge to the other, or you can use two opposite edges to expand towards the center at the same time.

[0119] The size of the enclosed area can be the size of the orthographic projection of the signal line in the segmented area, or it can be a specific preset size, depending on the actual needs.

[0120] In one optional embodiment, a portion or all of the segmented region is closed to obtain a closed region, including:

[0121] The closed region is formed by extending from a first edge of the reference plane surrounding the segmented region to a second edge of the reference plane surrounding the segmented region; or, it extends into the segmented region from both the first edge and the second edge simultaneously; wherein the first edge and the second edge are two opposite edges.

[0122] When constructing the closed region, the edges of the reference plane surrounding the segmented region are expanded outwards.

[0123] The process of expanding the edge of the reference plane surrounding the segmented region can be done by extending from the first edge of the reference plane surrounding the segmented region to the second edge, or by simultaneously extending from the first edge and the second edge towards the center of the orthogonal projection of the signal line into the segmented region, until a closed region is obtained.

[0124] The first edge and the second edge are two opposite edges.

[0125] The size of the enclosed area can be the size of the orthographic projection of the signal line in the segmented area, or it can be a specific preset size, depending on the actual needs.

[0126] In one alternative embodiment, the first edge is the upper or lower edge of a reference plane surrounding the segmented region.

[0127] The second edge is the edge opposite to the first edge.

[0128] When the first edge is the top edge, the second edge is the bottom edge; when the first edge is the bottom edge, the second edge is the top edge.

[0129] In the case where the first edge and the second edge are the upper and lower edges, when expanding the upper and lower edges of the reference plane around the segmented area, the upper edge can be expanded towards the lower edge until the expanded area of ​​the upper edge coincides with the lower edge; the lower edge can be expanded towards the upper edge until the expanded area of ​​the lower edge coincides with the upper edge; or the upper and lower edges can be expanded simultaneously towards the center with the center of the orthographic projection of the signal line in the segmented area as the reference until the expanded area of ​​the upper edge coincides with the expanded area of ​​the lower edge.

[0130] Finally, a closed area is obtained.

[0131] In one alternative embodiment, the first edge is the left or right edge of a reference plane surrounding the segmented region.

[0132] The second edge is the edge opposite to the first edge.

[0133] When the first edge is the left edge, the second edge is the right edge; when the first edge is the right edge, the second edge is the left edge.

[0134] In the case where the first edge and the second edge are the left and right edges, when expanding the left and right edges of the reference plane around the segmented area, the left edge can be expanded towards the right edge until the expanded area of ​​the left edge coincides with the right edge; the right edge can be expanded towards the left edge until the expanded area of ​​the right edge coincides with the left edge; or the left and right edges can be expanded simultaneously towards the center with the center of the orthographic projection of the signal line in the segmented area as the reference until the expanded area of ​​the left edge coincides with the expanded area of ​​the right edge.

[0135] Finally, a closed area is obtained.

[0136] When the segmented region is located at the edge of the reference plane and the reference planes around the segmented region do not have complete left and right edges, the closed region can be obtained by expanding the top and bottom edges; when the segmented region is located at the edge of the reference plane and the reference planes around the segmented region do not have complete top and bottom edges, the closed region can be obtained by expanding the left and right edges; when the reference planes around the segmented region have complete top and bottom edges and left and right edges, one of the two methods can be used to obtain the closed region.

[0137] In one optional embodiment, the difference between the width of the closed region and the width of the orthographic projection of the signal line within the segmented region is within a preset range, the maximum value of which is 3H, where H is the thickness of the dielectric layer between the signal line and the nearest reference plane.

[0138] In an alternative embodiment, refer to Figure 7 , Figure 7 A flowchart illustrating the steps for obtaining a preset range according to another embodiment of the present invention is shown, as follows: Figure 7 As shown, it includes:

[0139] Step S701: Construct simulation models of the signal lines and the reference plane; the signal lines include striplines and microstrip lines.

[0140] Based on practical application requirements, when constructing a closed area, the size requirement of the closed area should be such that the electric field energy transfer rate of the signal line is optimal.

[0141] Thus, the preset range is obtained through electric field strength simulation testing based on signal lines.

[0142] Reference Figure 8 , Figure 8 A schematic diagram of the simulation test of the signal line and reference plane of the present invention is shown, as follows: Figure 8 As shown, firstly, a simulation model of the signal line and the reference plane is constructed.

[0143] Signal lines include striplines and microstrip lines.

[0144] A stripline is a copper strip embedded in a dielectric layer between two conductive planes, located inside a circuit board. A microstrip line is a strip-shaped signal line located between a conductive layer and a ground layer, with a dielectric layer between them.

[0145] Then proceed to step S702.

[0146] Step S702: Using the center of the signal line as a reference, gradually increase the distance between the edge of the signal line and the two sides of the reference plane, and perform electric field strength simulation test on the signal line to obtain the electric field energy transfer rate corresponding to each spacing.

[0147] In the simulation model, the distance between the edge of the signal line and the two sides of the reference plane is gradually increased, with the center of the signal line as the reference.

[0148] Understandably, the width of the signal line will not change. Increasing the distance between the edge of the signal line and the two sides of the reference plane means gradually increasing the width of the reference plane with the center of the signal line as the reference, so that the distance between the edge of the signal line and the two sides of the reference plane gradually increases.

[0149] The expansion value of the reference plane width each time can be a preset value, and is not limited here.

[0150] Each time the width of the reference plane is increased, an electric field strength simulation test of the signal line is performed to obtain the electric field energy transfer rate corresponding to each spacing.

[0151] Then proceed to step S703.

[0152] Step S703: Determine the optimal spacing based on the electric field energy transfer rate corresponding to each spacing.

[0153] After obtaining the electric field energy transfer rate corresponding to each spacing, the distance between the edge of the signal line corresponding to the optimal electric field energy transfer rate and the two edges of the reference plane is selected, and this spacing is taken as the optimal spacing.

[0154] Then proceed to step S704.

[0155] Step S704: Determine the preset range based on the optimal spacing.

[0156] The optimal spacing is used as the preset range of the enclosed area.

[0157] This invention embodiment constructs a simulation model of the signal line and the reference plane; the signal line includes striplines and microstrip lines; taking the center of the signal line as a reference, the distance between the edge of the signal line and the two sides of the reference plane is gradually increased, and the electric field intensity of the signal line is simulated and tested to obtain the electric field energy transfer rate corresponding to each spacing; based on the electric field energy transfer rate corresponding to each spacing, the optimal spacing is determined; based on the optimal spacing, the preset range is determined.

[0158] The distance between the edge of the signal line and the two edges of the reference plane with optimal electric field energy transfer rate was obtained through simulation testing. This distance was then used as the preset range of the enclosed region, which not only corrected the cross-segmentation problem but also ensured the optimal electric field energy transfer rate of the signal line. By controlling the size of the enclosed region, circuit board costs were reduced.

[0159] In one alternative embodiment, after closing off part or all of the segmented area based on the size of the orthographic projection of the signal line in the segmented area to obtain a closed area, the circuit board after forming the closed area is also smoothed.

[0160] By smoothing the circuit board design files, issues such as short circuits in signal lines or isolated copper areas can be avoided.

[0161] Isolated copper foil refers to copper foil that is isolated in a circuit board and not connected to any other part of the circuit.

[0162] In one specific implementation, the circuit board design files can be smoothed using the smoothing functions of existing electronic design automation software, such as Allegro software.

[0163] The following example illustrates the cross-segment repair method of the present invention in detail:

[0164] Reference Figure 9 , Figure 9 An example flowchart of another embodiment of the cross-segment repair method of the present invention is shown, such as Figure 9 As shown, it includes:

[0165] First, the circuit board design file is entered into electronic design automation software for inspection to obtain the coordinates of signal line points where cross-split situations occur.

[0166] In one specific implementation, the Segment over voids tool from the Allegro software can be used for cross-segment checks.

[0167] After obtaining the coordinates of the signal line points where the segmentation occurs, the edges of the reference plane surrounding the segmentation area are expanded outwards using the center of the orthographic projection of the signal line into the segmentation area as a reference to obtain a pre-defined closed area. The orthographic projection of the signal line into the segmentation area falls within this closed area. The closed area is connected to the reference plane to form a new, complete reference plane, allowing the signal line to cross the complete reference plane.

[0168] The preset range of the closed area is determined by constructing a simulation model of the signal line and the reference plane, and gradually expanding the width of the reference plane with the center of the signal line as the reference to conduct simulation tests of the electric field strength of the signal line with different spacing between the edge of the signal line and the edge of the reference plane, so as to obtain the spacing corresponding to the optimal electric field energy transfer rate, and this spacing is used as the preset range of the closed area.

[0169] Finally, the circuit board design files after cross-segment repair are smoothed to avoid issues such as short circuits in signal lines or isolated copper areas.

[0170] Example 2

[0171] Reference Figure 10 , Figure 10 A schematic diagram of a cross-segment repair device according to Embodiment 2 of the present invention is shown, as follows: Figure 10 As shown, it includes:

[0172] The acquisition module 1001 is used to acquire signal lines that cross the segment in the circuit board and the reference plane corresponding to the signal lines. The reference plane has a segmentation area, and the orthographic projection of the signal lines in the reference plane overlaps with the segmentation area.

[0173] The sealing module 1002 is used to seal off part or all of the area in the segmented region based on the size of the orthogonal projection of the signal line in the segmented region, thereby obtaining a sealed region; wherein the orthogonal projection of the signal line in the segmented region is located in the sealed region, and the material of the sealed region is the same as the material of the reference plane.

[0174] In one optional embodiment, the enclosing module 1002 includes:

[0175] The first expansion submodule is used to expand the edge of the reference plane surrounding the segmented area based on the center point of the signal line to form the closed area.

[0176] In an optional embodiment, the enclosing module 1002 further includes:

[0177] The second expansion submodule is used to expand the edge of the reference plane around the segmented area based on the center point between the two signal lines to form a complete closed area; wherein the orthographic projections of the two signal lines in the segmented area are both located within the closed area.

[0178] In an optional embodiment, the enclosing module 1002 further includes:

[0179] The third expansion submodule is used to expand outward from the edge of the reference plane surrounding the segmented area based on the center points of the two signal lines, forming closed areas corresponding to the two signal lines respectively; wherein, the two closed areas do not overlap; the orthographic projection of each signal line in the segmented area is located within the corresponding closed area.

[0180] In an optional embodiment, the enclosing module 1002 further includes:

[0181] The fourth expansion submodule is used to extend from the first edge of the reference plane surrounding the segmented area to the second edge of the reference plane surrounding the segmented area to form the closed area; or, simultaneously extend from the first edge and the second edge into the segmented area; wherein the first edge and the second edge are two opposite edges.

[0182] In an optional embodiment, the enclosing module 1002 further includes:

[0183] A construction module is used to construct simulation models of the signal lines and the reference plane; the signal lines include striplines and microstrip lines.

[0184] An expansion module is used to gradually increase the distance between the edge of the signal line and the two sides of the reference plane, with the center of the signal line as a reference, to perform electric field intensity simulation tests on the signal line and obtain the electric field energy transfer rate corresponding to each spacing.

[0185] The optimal spacing determination module is used to determine the optimal spacing based on the electric field energy transfer rate corresponding to each spacing.

[0186] The preset range determination module is used to determine the preset range based on the optimal spacing.

[0187] In an optional embodiment, the enclosing module 1002 further includes:

[0188] A smoothing module is used to smooth the circuit board after the closed area is formed.

[0189] Based on the same inventive concept, embodiments of the present invention also provide an electronic device, comprising:

[0190] A processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the program, implements the cross-segment repair method described in any of the above embodiments.

[0191] Based on the same inventive concept, embodiments of the present invention also provide a computer-readable storage medium, comprising: when the instructions in the storage medium are executed by a processor of an electronic device, enabling the electronic device to perform any of the cross-segment repair methods described in the above embodiments.

[0192] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

[0193] For the sake of simplicity, the method embodiments are described as a series of actions. However, those skilled in the art should understand that the present invention is not limited to the described order of actions, as some steps can be performed in other orders or simultaneously according to the present invention. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and components involved are not necessarily essential to the present invention.

[0194] The foregoing has provided a detailed description of the cross-segment repair method, apparatus, electronic device, and storage medium provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A cross-segment repair method, characterized in that, Applied to a circuit board, the method includes: Obtain signal lines that cross divisions in the circuit board and reference planes corresponding to the signal lines. The reference planes have division areas, and the orthographic projection of the signal lines in the reference planes overlaps with the division areas. Based on the size of the orthographic projection of the signal line into the segmented region, a portion or all of the segmented region is closed to obtain a closed region. Wherein, the orthographic projection of the signal line in the segmented region is located in the closed region, and the material of the closed region is the same as the material of the reference plane; The process of closing off part or all of the segmented region to obtain a closed region includes: The closed region is formed by extending from a first edge of the reference plane surrounding the segmented region to a second edge of the reference plane surrounding the segmented region; or, it extends simultaneously from both the first edge and the second edge into the segmented region. The first edge and the second edge are two opposite edges.

2. The method according to claim 1, characterized in that, When there is only one signal line, the step of closing off part or all of the segmented area based on the size of the orthographic projection of the signal line into the segmented area to obtain a closed area includes: Based on the center point of the signal line, the edge of the reference plane surrounding the segmented area is expanded outward to form the closed area.

3. The method according to claim 1, characterized in that, When there are two signal lines, the step of closing off part or all of the segmented area based on the size of the orthographic projection of the signal lines into the segmented area to obtain a closed area includes: Based on the center point between the two signal lines, the edge of the reference plane surrounding the segmented area is expanded outward to form a complete closed area; The orthographic projections of the two signal lines in the segmented area are both located within the enclosed area.

4. The method according to claim 1, characterized in that, Where there are two signal lines, the method of closing off part or all of the segmented area based on the size of the orthographic projection of the signal lines into the segmented area to obtain a closed area includes: Based on the center points of the two signal lines, the closed areas corresponding to the two signal lines are formed by expanding outward from the edge of the reference plane surrounding the segmented area. There is no overlap between the two closed regions, and the orthographic projection of each signal line in the segmented region is located within the corresponding closed region.

5. The method according to claim 1, characterized in that, The first edge is the upper or lower edge of the reference plane surrounding the segmented region.

6. The method according to claim 1, characterized in that, The first edge is the left or right edge of the reference plane surrounding the segmented region.

7. The method according to claim 1, characterized in that, The difference between the width of the enclosed area and the width of the orthographic projection of the signal line within the segmented area is within a preset range, and the maximum value of the preset range is 3H, where H is the thickness of the dielectric layer between the signal line and the nearest reference plane.

8. The method according to claim 7, characterized in that, Obtaining the preset range includes: Construct simulation models of the signal lines and the reference plane; the signal lines include striplines and microstrip lines; Using the center of the signal line as a reference, the distance between the edge of the signal line and the two sides of the reference plane is gradually increased, and the electric field intensity of the signal line is simulated and tested to obtain the electric field energy transfer rate corresponding to each spacing. The optimal spacing is determined based on the electric field energy transfer rate corresponding to each spacing. Based on the optimal spacing, the preset range is determined.

9. The method according to claim 1, characterized in that, After closing off part or all of the segmented area based on the size of the orthogonal projection of the signal line in the segmented area to obtain a closed area; The method further includes: The circuit board after the closed area is formed is smoothed.

10. A cross-segment repair device, characterized in that, The device includes: The acquisition module is used to acquire signal lines that cross the segment in the circuit board and the reference plane corresponding to the signal lines. The reference plane has a segmentation area, and the orthographic projection of the signal lines in the reference plane overlaps with the segmentation area. A sealing module is used to seal off part or all of the segmented area based on the size of the orthogonal projection of the signal line in the segmented area, thereby obtaining a sealed area; wherein the orthogonal projection of the signal line in the segmented area is located in the sealed area, and the material of the sealed area is the same as the material of the reference plane; The enclosed module also includes: The fourth expansion submodule is used to extend from the first edge of the reference plane surrounding the segmented area to the second edge of the reference plane surrounding the segmented area to form the closed area; or, simultaneously extend from the first edge and the second edge into the segmented area; wherein the first edge and the second edge are two opposite edges.

11. An electronic device, characterized in that, include: A processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the program, implements the cross-segment repair method according to any one of claims 1 to 9.

12. A computer-readable storage medium, characterized in that, When the instructions in the storage medium are executed by the processor of the electronic device, the electronic device is able to perform the cross-segment repair method according to any one of claims 1 to 9.

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