Method for turning a workpiece using a fluid jet guided laser beam

Abstract

The invention relates to turning a workpiece with a laser beam coupled into a fluid jet, i.e. with a fluid jet guided laser beam. The invention provides a method (20) and an apparatus (10) for machining a workpiece, respectively, wherein the machining comprises turning the workpiece. The method is performed by the apparatus (10) which is configured to provide a fluid jet (11) guided laser beam (12). The method comprises turning the workpiece (30), wherein turning the workpiece comprises rotating the workpiece about an axis of rotation (31) during the machining and providing the fluid jet guided laser beam to a machined surface (32) of the workpiece.

Description

Technical Field

[0001] This invention relates to the field of workpiece machining, particularly the field of workpiece machining by turning. Specifically, this invention relates to turning workpieces using a laser beam coupled to a fluid jet, i.e., a laser beam guided by a fluid jet. The invention provides both a method and an apparatus for machining workpieces, wherein the machining includes turning the workpiece. The method can be performed by the apparatus, and the apparatus is configured to provide a fluid jet-guided laser beam. Background Technology

[0002] Turning is a process of machining a workpiece, for example, involving cutting into the workpiece with a cutting tool while the workpiece is rotating. Thus, the cutting tool can move linearly while the workpiece is rotating, such that, for example, the cutting tool describes a helical path on the workpiece surface. In other words, conventional turning of a workpiece involves rotating the workpiece about an axis of rotation while machining it, for example, cutting it with a cutting tool. The speed at which the workpiece is turned is determined by the rotational speed of the workpiece. Conventional cutting tools can be conventional lasers.

[0003] Conventional turning has several drawbacks. For example, not all materials can be easily turned in the conventional way, i.e., using conventional cutting tools. Some materials, such as diamond or superalloys, may be too hard for cutting tools, while others, such as phenyloxine or magnesium gold, may be too brittle or too sensitive to the heat generated by the cutting tools during the turning process. Furthermore, there are often limitations on workpiece size, which can still occur when turning workpieces. Specifically, workpieces with high aspect ratios are difficult to machine using conventional turning. Additionally, larger workpieces (with large volumes and / or diameters) may be difficult to machine using conventional laser turning. Finally, the surface roughness of the machined surface after conventional turning is often unsatisfactory; the surface is often too rough and requires further processing steps such as polishing.

[0004] Another drawback of conventional turning is that the process cannot be easily integrated into a workflow that also includes other workpiece machining processes, such as drilling, milling, or engraving of the workpiece (especially turned workpieces). Summary of the Invention

[0005] Therefore, embodiments of the present invention aim to improve upon conventional methods of machining workpieces by turning. In particular, the objective is to provide a method and apparatus capable of turning workpieces made of a variety of materials, even very hard and / or brittle and heat-sensitive materials. Turning should be performed fully automatically. Furthermore, integrating turning with one or more other machining processes on the workpiece should be readily achievable. The turning should further result in an improvement in the surface roughness of the machined surface of the workpiece. Moreover, performing turning on larger workpieces should be highly feasible. Finally, the time required to machine workpieces of a given precision, quality, and shape should be reduced, as should tool consumption during machining processes. Embodiments of the present invention should also allow for the machining of new types of workpieces, such as turning grooves with high aspect ratios in workpieces made of hard, brittle, and / or heat-sensitive materials.

[0006] These and other objectives are achieved by means of the embodiments presented in the appended independent claims. Advantageous implementations of these embodiments are defined in the dependent claims.

[0007] In particular, embodiments of the present invention are generally based on the use of equipment for a method of machining a workpiece, the method including turning the workpiece. The equipment provides a laser beam that is guided in a fluid jet by internal reflection. This fluid jet-guided laser beam can efficiently turn the workpiece. Thus, according to embodiments of the present invention, different orientations between the laser beam and the machined surface of the workpiece are possible. These embodiments enable the turning of even ultrahard materials and brittle or heat-sensitive materials with very high precision, particularly with high aspect ratios or complex geometries.

[0008] A first aspect provides a method for machining a workpiece, wherein the method is performed by a device providing a fluid jet-guided laser beam, wherein the method includes turning the workpiece, and wherein turning the workpiece includes: rotating the workpiece about a rotation axis during machining; and providing the fluid jet-guided laser beam to the machined surface of the workpiece.

[0009] During turning, especially during workpiece machining, the workpiece can rotate continuously. A fluid jet-guided laser beam can turn workpieces made of a variety of materials, including very hard, brittle, or very heat-sensitive materials. Turning can be performed fully automatically using this equipment. Compared to conventional turning methods that do not use a fluid jet-guided laser beam, the method utilizing this first aspect achieves improved results in workpiece turning. For example, in terms of speed, accuracy, and surface roughness or fluid jet accessibility.

[0010] Workpieces can have regular shapes, such as cylindrical shapes with a certain diameter. Turning a workpiece can produce one or more cylindrical surfaces of such a workpiece, wherein the one or more cylindrical surfaces have a reduced diameter. Generally, any shape of rotation is feasible. Turning can also produce one or more surfaces oriented primarily perpendicular to the workpiece axis, which can be called facing by turning. Turning can also produce one or more grooves on the outer surface of the workpiece, i.e., grooves circumferentially relative to the workpiece diameter, which can be called grooving by turning. Turning can also produce one or more grooves on the end face of the workpiece, i.e., grooves about the axis of rotation, which can be called boring. Workpieces can also have irregular shapes, such as having a radius that varies infinitely along the axis of rotation, or having a helical shape. Irregularly shaped original workpieces can be pre-processed to have a more regular shape, for example, by faceting as described further below.

[0011] In one implementation of this method, a fluid jet-guided laser beam is provided perpendicularly to the processing surface, or provided tangentially to the processing surface, or provided substantially tangentially to the processing surface.

[0012] Therefore, different orientations between the laser beam and the processing surface are possible, enabling various applications. For example, a perpendicular orientation can result in higher material removal rates, thus benefiting the processing of larger workpieces, while a tangential orientation allows for higher precision, better surface quality, and lower stress within the workpiece. Tangential cases can involve the nozzle axis (the nozzle axis of the fluid-generating nozzle used to generate the fluid jet in the device, where the nozzle axis is aligned with the propagation direction of the fluid jet) contacting the workpiece's processing surface. Notably, if a 6-axis device is used, any angle between the laser beam and the processing surface can be achieved.

[0013] In one implementation of this method, the axis of rotation is perpendicular to the propagation direction of the laser beam guided by the fluid jet provided by the device.

[0014] In one implementation of this method, the propagation direction of the fluid jet-guided laser beam does not intersect the axis of rotation.

[0015] For example, the propagation direction of a fluid jet-guided laser beam is perpendicular to the axis of rotation, but deviates from it. That is, the shortest connection between the axis of rotation and the processing surface is tilted relative to the propagation direction of the fluid jet-guided laser beam, and for example, also tilted relative to the vertical direction.

[0016] In one implementation of this method, a fluid jet-guided laser beam is delivered to the processing surface at a certain angle.

[0017] For example, the angle is between 90° (in which case the fluid jet-guided laser beam will be provided perpendicularly to the processing surface) and 0° (in which case the liquid jet-guided beam will be provided tangentially to the processing surface).

[0018] When a workpiece is processed using a fluid jet-guided laser beam according to the method of the first aspect, the radius of the workpiece is reduced in the above-described implementation. Therefore, the angle at which the fluid jet-guided laser beam is applied to the processing surface is also reduced until the fluid jet-guided laser beam is applied tangentially to the processing surface. The advantage of this is that the workpiece processing automatically changes from a coarser process with a high material removal rate (MRR) to a smoother process that provides a surface finish to the processed surface.

[0019] Furthermore, as the fluid jet-guided laser beam moves along a given contour, its propagation direction relative to the axis of rotation may change, thus altering the angle at which the fluid jet-guided laser beam is applied to the machining surface. For example, when the propagation direction of the fluid jet-guided laser beam is closer to the axis of rotation, the angle is higher (closer to 90°), resulting in higher throughput and MRR. As the contour path guides the fluid jet-guided laser beam closer to the axis of rotation, the amount of material removed can be increased accordingly. Therefore, using the method of the first aspect, a functional machining strategy can be applied that provides high throughput to areas requiring the removal of large volumes of material while smoothly finishing areas closer to the workpiece's outer diameter without any parameter changes.

[0020] In one implementation, the method further includes moving the fluid jet-guided laser beam along the direction of movement during workpiece turning.

[0021] Therefore, the laser beam can move along a defined path on the workpiece surface; for example, it can describe a helical path. This allows for the creation of different shapes of the workpiece being turned. Specifically, the laser beam can be moved by displacing the workpiece and the laser beam relative to each other. This means that the workpiece can also move, or both the workpiece and the laser beam can move, to achieve effective movement of the laser beam. The laser beam and / or the workpiece can be linearly displaced simultaneously or sequentially along two or three axes. Furthermore, the workpiece can be rotated about two or three different axes of rotation during machining. The rotation of the workpiece about one or more axes of rotation can be synchronized with the linear displacement of the workpiece and / or the laser beam along one or more axes.

[0022] The fluid jet can move accordingly on the workpiece. In one embodiment, the fluid jet can perform multiple passes on the workpiece. These multiple passes can be achieved (primarily) through rotation of the workpiece.

[0023] In one implementation of this method, the direction of movement is parallel to or perpendicular to the axis of rotation and perpendicular to the propagation direction of the laser beam guided by the fluid jet.

[0024] In one implementation of this method, the axis of rotation is parallel to the laser beam guided by the fluid jet.

[0025] In one implementation of the method, the laser beam is pulsed; and the rotational speed of the workpiece about the rotation axis is set such that the continuous pulses of the pulsed laser beam overlap each other by at least 50% on the machined surface of the workpiece.

[0026] This means that a laser beam can describe a continuous path on the machined surface of a workpiece. 50% or more overlap of laser pulses results in efficient machining of the workpiece, particularly leading to low surface roughness on the machined surface.

[0027] In one implementation of this method, the laser beam is pulsed, and the pulsed laser beam includes at least two superimposed pulses selected based on a specific material of the workpiece, wherein the first pulse has a different power and frequency than the second pulse.

[0028] In other words, for a single-material workpiece to be processed using the method of the first aspect, at least two pulses can be selected and combined to form a complex pulsed laser beam. Each laser pulse contributes a specific, particularly regular pulse shape to the complex pulsed laser beam, namely a first laser pulse shape having at least a first laser power and a first laser frequency, and a second laser pulse shape having a second laser power and a second laser frequency. The two laser powers and laser frequencies are superimposed. Therefore, the complex pulsed laser beam can display a beat frequency pattern.

[0029] Primarily, this method can be specified for machining workpieces made of solid blocks of one type of material (i.e., a specific material), and the method uses at least two pulses to machine that specific material by turning. However, the method can also be applied to workpieces comprising more than one material, for example, workpieces made of layers of different materials. In this case, each layer is ideally machined individually using at least two pulses per layer. If two such layers are to be machined simultaneously, then multiple pulses are preferably selected, particularly at least two pulses per layer.

[0030] The first pulse in a pulsed laser beam can be generated by a primary / master laser emission, for example, output from a first laser source, while the second pulse can be generated by a secondary laser emission, for example, output from a second laser source. Each laser source can be configured to output a simple pulsed laser beam with a defined power (absolute peak power and / or pulse width) and frequency (pulse repetition rate). For example, the primary / master laser emission can be selected such that the specific material to be processed exhibits stronger absorption of the laser and / or its intensity is higher than that of the secondary laser emission, while the secondary laser emission is selected such that the specific material exhibits weaker absorption of the laser and / or its intensity is lower than that of the primary laser emission. However, the effects associated with the primary / secondary laser emission described herein are not necessarily defined according to the naming of the "first" and "second" pulses herein. Therefore, the selection of the power and frequency of each laser pulse can be based on (depending on) the frequency-dependent absorption coefficient of the specific material to be processed. In other words, a specific material can absorb differently at different laser emission wavelengths and pulse characteristics. It is worth noting that the two superimposed laser pulses can also be generated by a single dedicated laser source.

[0031] Complex pulsed laser beams can be constructed to ablate the workpiece material, resulting in a highly uniform ablated surface. Specifically, by selecting at least two pulses based on the specific workpiece material, very low surface roughness and little or no surface quality variation can be achieved. Furthermore, the occurrence of defects and debris can be significantly reduced or even completely suppressed. Therefore, workpiece machining is improved, particularly for workpieces made of hard and / or brittle materials.

[0032] In one implementation of the method, the first pulse is suitable for cutting a workpiece of a specific material; and the second pulse is not suitable for cutting a workpiece of a specific material and / or is suitable for smoothing the surface of a workpiece of a specific material, for example, smoothing the surface produced by cutting the specific material with the first pulse.

[0033] This means that the first pulse in a separately executed pulsed laser beam (e.g., the main laser emission) will have already cut / ablated the workpiece material, but with relatively poor surface quality. The second pulse executed alone (the second pulsed laser emission) will not be able to cut / ablate the workpiece material, but can only smooth or polish the surface of the workpiece. These capabilities of the two laser pulses are due to their specific characteristics, particularly their respective power and frequency. These characteristics are selected based on the type of material of the workpiece to be processed. When the at least two laser pulses are superimposed in a pulsed laser beam used by the method of the first aspect, they work together to process a workpiece with improved surface quality. This can result in a considerably low surface roughness. Furthermore, defects and material debris can be largely avoided.

[0034] In one implementation, the method further includes faceting the workpiece prior to turning it; wherein faceting the workpiece includes removing a set of fragments from the workpiece using a fluid jet-guided laser beam to reduce the diameter of the workpiece relative to the axis of rotation.

[0035] Faceting can help to quickly reduce the size of large workpieces, thereby speeding up the entire machining process, including turning. Faceting can particularly reduce the diameter of the workpiece, while enabling subsequent turning processes to be performed efficiently and with high precision.

[0036] It is worth noting that the diameter of the workpiece can vary along the workpiece (e.g., along the main axis of rotation used for turning). Such a workpiece can be cut into a controlled shape by performing faceting before turning, thereby obtaining better turning results afterwards. Furthermore, faceting allows for obtaining various shapes of the workpiece being machined, such as spherical or hemispherical shapes.

[0037] In one implementation of the method, removing fragments from a workpiece includes: cutting into the workpiece using a fluid jet-guided laser beam; rotating the workpiece by a specific angle about a rotation axis; and cutting into the workpiece again using the fluid jet-guided laser beam to remove the fragments from the workpiece.

[0038] The first cut into the workpiece may include a portion of the workpiece thickness. It is worth noting that, instead of two cuts that involve rotating the workpiece between cuts, one or more pieces of the workpiece can also be cut / removed from the workpiece individually using a single cut.

[0039] In one implementation of the method, faceting the workpiece includes: removing a first subset of fragments from the workpiece, wherein the specific angle is a large angle to reduce the diameter of the workpiece relative to the axis of rotation; and removing a second subset of fragments from the workpiece, wherein the specific angle is a small angle to further reduce the diameter of the workpiece relative to the axis of rotation.

[0040] In this way, using faceting at larger angles provides a rough workpiece shape but a fast faceting process, while subsequent faceting at smaller angles allows for a smoother reduction in workpiece shape. Overall, this results in a reduction in processing time.

[0041] In one implementation of the method, the method further includes performing an optimization algorithm based on the size and / or shape of the workpiece and with regard to the surface finish of the workpiece and / or the processing time of the workpiece; and performing faceting and turning of the workpiece based on the result of the optimization algorithm.

[0042] The algorithm can select a faceting strategy, i.e., how to facet the workpiece. Constraints considered by the algorithm may include the maximum diameter or volume of the workpiece (typically before faceting) and the minimum diameter or volume of the workpiece (typically after subsequent turning, as needed). The algorithm can specifically determine at least one of the following: how many fragments are removed from the workpiece, how many facets are created, what specific angle is used in the faceting, whether a first and second subset of fragments are removed as described above, the difference between the first and second specific angles, from which side the workpiece is cut (e.g., determined for each cut), what laser power is used for each cut, and how far and how fast the workpiece is turned after faceting.

[0043] In one implementation of this method, the material of the workpiece includes at least one of the following: diamond; diamond composite material; polycrystalline diamond; polycrystalline boron nitride; silicon carbide; superalloy; ceramic; PHYNOX; titanium; titanium alloy; cobalt alloy; composite material containing the foregoing materials.

[0044] Therefore, it can machine workpieces made of a variety of materials, even (very) hard and (very) brittle or heat-sensitive materials, or compliant and / or soft materials.

[0045] In one implementation, in addition to turning the workpiece, the method includes at least one of the following: using a fluid jet-guided laser beam to cut deep into the workpiece, drilling the workpiece, engraving the workpiece, and laser milling the workpiece.

[0046] In one implementation of the method, the method is performed automatically and / or seamlessly by the device; and / or the method is performed by the device in a single process.

[0047] In one implementation of this method, the arithmetic mean roughness of the machined surface of the workpiece is 0.4 μm or less.

[0048] Specifically, the arithmetic mean roughness can be 0.2 μm or less. In one implementation of this method, the workpiece diameter is greater than 30 mm. For example, the workpiece diameter can be 125 mm or greater.

[0049] Therefore, compared to turning using a laser without a fluid jet, it is highly feasible to perform turning on larger workpieces (larger diameters and / or volumes) using the method of the first aspect, especially in the case of tangential incidence. It is worth noting that the workpiece can have a regular shape, such as a cylinder, sphere, etc., for example, with a constant and well-defined diameter. However, the workpiece can also have an irregular shape and / or diameter that varies along the turning axis. In this case, the diameter can refer to the largest measurable diameter of the workpiece. The diameter can be measured from one workpiece surface (e.g., the machined surface) to the opposite workpiece surface. The diameter of the workpiece is generally understood by those skilled in the art.

[0050] A second aspect provides an apparatus for machining a workpiece, the apparatus comprising: a machining unit configured to provide a fluid jet-guided laser beam; a support configured to hold and rotate the workpiece; and a control unit configured to control the machining unit and the support respectively to turn the workpiece, and for turning the workpiece: to rotate the workpiece about a rotation axis during machining; and to provide the fluid jet-guided laser beam to the machining surface of the workpiece.

[0051] In one implementation of the device, the device is configured to rotate the support to rotate the workpiece about two or three different axes of rotation and to linearly displace the workpiece along the two or three axes; and / or the control unit is configured to control the support to synchronize the rotation of the workpiece about one or more axes of rotation with the linear displacement of the workpiece along one or more axes of rotation.

[0052] The device in the second aspect provides all the advantages described above for the method in the first aspect, and can be implemented similarly. That is, in the implementation of the device, the device can be configured according to the implementation of the method described above.

[0053] This equipment specifically allows for the machining of workpieces, including turned workpieces, and optionally includes seamless and / or automated and / or further processing of workpieces in a single process.

[0054] The third aspect provides a computer program including program code for controlling the device according to the second aspect when executed by a processor, particularly a processor of a control unit, or for performing the method according to the first aspect.

[0055] A fourth aspect of the invention provides a non-transitory storage medium for storing executable program code that, when executed by a processor, causes execution according to the method of the first aspect or any implementation thereof. Attached Figure Description

[0056] The above aspects and implementations that define the general embodiments of the present invention are explained in the following description of specific embodiments with reference to the accompanying drawings, wherein:

[0057] Figure 1 A method according to an embodiment of the present invention is shown, and an apparatus according to an embodiment of the present invention for performing the method is schematically shown.

[0058] Figure 2 A schematic flowchart of a method according to an embodiment of the present invention is shown.

[0059] Figure 3 Different examples of a method according to one embodiment of the invention are shown, in particular, how a fluid jet-guided laser beam can be provided to a processing surface.

[0060] Figure 4 Different examples of a method according to one embodiment of the invention are shown, in particular, how a fluid jet-guided laser beam can be moved during workpiece turning.

[0061] Figure 5 Different examples of a method according to one embodiment of the invention are shown, in particular, how a fluid jet-guided laser beam can be provided to a processing surface.

[0062] Figure 6 Different examples of a method according to one embodiment of the invention are shown, in particular, how a fluid jet-guided laser beam can be provided to a processing surface.

[0063] Figure 7 The advantages of a method according to one embodiment of the invention are shown if a fluid jet-guided laser beam is provided perpendicularly but off-axis of rotation onto the processing surface.

[0064] Figure 8 It shows Figure 7 Further advantages of the method shown.

[0065] Figure 9 An example of a method according to an embodiment of the present invention is shown, which is particularly applicable to workpieces with varying diameters.

[0066] Figure 10 A method according to an embodiment of the present invention is shown, wherein the method includes faceting the workpiece before turning it.

[0067] Figure 11 Various faceting strategies according to an embodiment of the present invention are illustrated, wherein the method includes faceting the workpiece before turning it.

[0068] Figure 12 An exemplary device according to one embodiment of the present invention is shown. Detailed Implementation

[0069] Figure 1 A method 20 according to one embodiment of the present invention is illustrated schematically. Figure 2 The steps of method 20 are further illustrated in the flowchart. Method 20 is suitable for machining workpiece 30, wherein method 20 includes turning workpiece 30 using a laser beam 12 guided by a fluid jet 11.

[0070] Method 20 is performed by device 10 according to an embodiment of the present invention, such as Figure 1 As illustrated in the diagram, or as shown in the diagram Figure 10 Further optional details are shown. Device 10 is configured to provide a laser beam 12 coupled to a (pressurized) fluid jet 11, i.e., to provide a laser beam 12, guided by the fluid jet 11, onto the workpiece 30. The fluid jet 11 may thus include a liquid jet, and in particular, it may include a water jet.

[0071] The material of workpiece 30 may include at least one of the following: diamond, diamond composite material, polycrystalline diamond, polycrystalline boron nitride, silicon carbide, superalloy, ceramic; PHYNOX, MAGIC GOLD, titanium, titanium alloy, cobalt alloy, or one or more composite materials containing the foregoing. Workpiece 30 may have any volume or diameter. In particular, the workpiece may have a diameter greater than 20 mm, greater than 30 mm, or even greater than 50 mm, or even greater than 100 mm, or even greater than 125 mm.

[0072] Method 20 includes turning workpiece 30 21, 22. Turning workpiece 30 21, 22 includes the following steps: rotating workpiece 30 about axis of rotation 31 during machining. Workpiece 30 may rotate continuously about axis of rotation 31 during turning 21, 22. Workpiece 30 may also rotate about one or more additional axes of rotation during turning 21, 22 or more generally during machining of workpiece 30. Furthermore, turning 21, 22 includes the following step: providing a laser beam 12 guided by a fluid jet 11 22 to the machining surface 32 of workpiece 30. The laser beam 12 guided by the fluid jet 11 may be provided, for example, perpendicular to the machining surface 32 (e.g., ...). Figure 1 As exemplarily shown in the example, it can be provided to be tangent to the machined surface 32, or to be substantially tangent to the machined surface 32, as will be discussed below regarding, for example Figures 4-7 Further description.

[0073] Figure 3Different examples of a method 20 according to an embodiment of the present invention are shown, the method being based on Figure 1 The implementation shown is above. In particular, Figure 3 Different examples of providing a laser beam 12, which is guided by a fluid jet 11, to the machined surface 32 of a workpiece 30 are shown in (a) and (b). Figure 3 as well as Figure 1 and Figure 2 The same elements are labeled with the same reference numerals and implemented similarly.

[0074] exist Figure 3 In (a), the laser beam 12 guided by the fluid jet 11 is provided perpendicularly to the machining surface 32 of the workpiece 30. This means that the propagation direction of the laser beam 12 guided by the fluid jet 11 is perpendicular to the plane containing the machining surface 32. Figure 3 In (b), the laser beam 12 guided by the fluid jet 11 is provided tangentially to the machined surface 32 of the workpiece 30. This means that the propagation direction of the laser beam 12 guided by the fluid jet 11 is parallel to the machined surface 32 and contacts the machined surface 32. Figure 3 In both cases shown, the rotation axis 31 is exemplary perpendicular to the propagation direction of the laser beam 12 guided by the fluid jet 11, and the workpiece 30 rotates at least 21 about the rotation axis 31 during turning 21, 22.

[0075] In the first case where the laser beam 12 is provided perpendicularly to the machining surface 32, and in the second case where the laser beam 12 is provided tangentially to the machining surface 32, the power of the laser beam 12 or the pulse characteristics of the pulsed laser beam 12 (i.e., pulse width, pulse rate, pulse burst rate, pulse power, etc.) can differ for machining, particularly turning 21, 22. The first case may be advantageous for turning larger workpieces 30 (e.g., those with large volumes and / or diameters of, for example, 30 mm or greater) because the perpendicular laser beam 12 can result in a higher workpiece material removal rate. The second case may be advantageous for turning workpieces 30 21, 22 when improved accuracy and workpiece surface finish are required, and when stress reduction in workpiece 30 is required during machining. It is noteworthy that the second case, where the laser beam 12 is provided tangentially to the machining surface 32, is feasible solely due to the fact that the laser beam 12 is guided within the fluid jet 11. This approach is not feasible for laser beams without fluid jets because such lasers cannot provide a long parallel focus or sufficient laser power coupling to the workpiece surface.

[0076] Figures 4-7 Different examples of method 20 according to one embodiment of the present invention are shown, which are respectively based on Figure 1 and Figure 2The embodiment shown is above. In particular, it is shown that a laser beam 12, guided by a fluid jet 11, is provided to the machined surface 32 of the workpiece 30. Figures 5-7 ) and the laser beam 12 guided by the fluid jet 11 is moved relative to the workpiece 30 during the turning of workpiece 30 21, 22. Figure 4 Different examples of ). Figures 4-7 and Figures 1-3 The same elements are labeled with the same reference numerals and implemented similarly.

[0077] In particular, Figure 4 (a) shows two orientations of the laser beam 12 guided by the fluid jet 11 relative to the processing surface 32, which have already been shown. Figure 3 As shown in the image. However, Figure 4 (a) further illustrates that the laser beam 12 guided by the fluid jet 11 can move parallel to the axis of rotation 31 during turning 21, 22. It is noteworthy that... Figure 4 The direction of movement indicated in (a) is, for example, perpendicular to the propagation direction of the laser beam 12. Thus, as... Figure 4 As shown in (a), for example, the diameter of the cross section of workpiece 30 can be reduced by turning 21, 22 of workpiece 30.

[0078] Figure 4 (b) further illustrates two orientations of the laser beam 12 guided by the fluid jet 11 relative to the processing surface 32, which have already been shown in [the diagram]. Figure 3 As shown in the image. However, Figure 4 (b) further shows that the laser beam 12, guided by the fluid jet 11, can move perpendicular to the axis of rotation 31 during turning 21, 22. However, unlike the laser beam 12, which is shown moving diametrically perpendicular to the workpiece 30... Figure 4 Compared to (a), in Figure 4 In (b), the laser beam 12 is shown moving in the radial direction of the workpiece 30. Figure 4 The procedure shown in (b) is particularly useful for faceting and grooving workpiece 30 by turning 21, 22.

[0079] Note that for the machining of workpiece 30, Figure 4 The directions of movement shown in (a) and (b) can be added to another direction of movement, or can be performed simultaneously.

[0080] Figure 4 As further shown in (c), the rotation axis 31 can also be parallel to the propagation direction of the laser beam 12 guided by the fluid jet 11. In this case, as Figure 4As exemplarily shown in (c), the laser beam 12 can cut a circular groove on the end face of the workpiece 30. The laser beam 12 can also be moved perpendicular to the axis of rotation 31, for example, to widen the circular groove. Figure 4 The procedure shown in (c) is particularly useful for boring the workpiece 30 by turning 21, 22. The movement of the laser beam 12 can be achieved using sophisticated pocketing cinematics techniques.

[0081] exist Figure 4 In each of the cases shown in (a), (b), and (c), for example, during the machining of workpiece 30, particularly during turning 21 and 22, workpiece 30 can be further rotated about another axis of rotation to produce a more complex shape of the machined workpiece 30. This can be combined with one or more directions of movement of the laser beam 12 during the machining of workpiece 30, particularly during turning 21 and 22.

[0082] Figure 5 (a) illustrates the previously described scenario, where the laser beam 12, guided by the fluid jet 11, is provided tangentially to the machining surface 32 of the workpiece 30. Here, in Figure 5 In (a), the propagation direction of the laser beam 12 guided by the fluid jet 11 is perpendicular to the rotation axis 31 (its extension into) Figure 5 (the plane). Furthermore, the laser beam 12 guided by the fluid jet 11 travels along the vertical direction (its plane). Figure 5 The laser beam 12 propagates from top to bottom in (a), meaning that the angle β between the propagation direction of the laser beam 12 and the vertical direction (or usually the reference direction) is 0°. The laser beam 12 also contacts the processing surface 32 tangentially, such that the angle α between the shortest connection (between the rotation axis 31 and the processing surface 32) and the vertical direction is 90°.

[0083] Figure 5 The aforementioned situation is illustrated in (b), where the laser beam 12 guided by the fluid jet 11 is provided perpendicular to the processing surface 32. Here, in Figure 5 In (b), the propagation direction of the laser beam 12 guided by the fluid jet 11 is again perpendicular to the rotation axis 31. Furthermore, the laser beam 12 guided by the fluid jet 11 propagates along the vertical direction (reference direction) such that the angle β is 0°. In this case, the angle α is 0°, meaning that the shortest connection (between the rotation axis 31 and the processing surface 32) is along the vertical direction.

[0084] Figure 6 (a) shows that different angles (values) of angle α are possible. For example, the laser beam 12 guided by the fluid jet 11 can be provided in a vertical direction, i.e., angle β is 0°, but it can be relative to its direction of motion. Figure 5The positional offset in (b) means that the propagation direction of the laser beam 12 does not intersect the rotation axis 31. This means that the angle α can be greater than 0° and less than 90°. This also means that the fluid jet-guided laser beam 12 is provided to the processing surface 32 at a certain angle, wherein the angle is between 0° and 90°, and wherein the angle at which the fluid jet-guided laser beam 12 is provided to the processing surface 32 is (90°-α).

[0085] Figure 6 (b) further illustrates that different angles (values) of angle β are also possible. For example, the laser beam 12 guided by the fluid jet 11 can be tilted relative to the vertical direction, i.e., angle β can be greater than 0° and less than 90°. For example, angle β can be equal to angle α, in Figure 6 In (b), the angle α is exemplarily greater than 0° and less than 90°.

[0086] Figure 7 The figures shown in (a)-(d) are as follows: Figure 6 The advantages of the configuration shown, especially regarding Figure 6 Advantages of the configuration shown in (a). The propagation direction of the laser beam 12 guided by the fluid jet 11 is perpendicular to the rotation axis 31, but does not intersect the rotation axis 31. That is, the propagation direction deviates from the rotation axis 31 such that angle α > 0° and α < 90°, as... Figure 6 As shown in (a). In Figure 7 In (a), the angle is specifically α = α1. When the workpiece is machined by turning according to method 20, its radius continuously decreases, such as... Figure 7 (b) Figure 7 As shown in (c) and the last 7 (d), the angle α also increases as shown in the figure. Figure 7 In (b), the angle is specifically α = α2. Figure 7 In (c), the angle is specifically α = α3, and in Figure 6 In (d), this angle is specifically α = α4, where α4 > α3 > α2 > α1. Simultaneously, the angle (calculated by 90° - α) provided by the laser beam 12 guided by the fluid jet 11 onto the processed surface 32 is reduced. Figure 7 In (a), the angle is closer to 90° (i.e., closer to 90°). Figure 5 The configuration shown in (b) indicates that the laser beam 12, guided by the fluid jet 11, is provided vertically onto the processing surface 32, and... Figure 7 In (d), the angle is closer to 0° (i.e., closer to the angle shown in the image). Figure 5The configuration shown in (a) is such that the laser beam 12 guided by the fluid jet 11 is provided tangentially to the machining surface 32. As the angle at which the fluid jet-guided laser beam 12 is provided to the machining surface 32 decreases (and / or as α increases), the machining process gradually changes from roughing with high material removal on the machining surface 32 of the workpiece 30 to surface finishing.

[0087] Figure 8 It shows about Figure 7 Further advantages of the described methods and configurations. In particular, Figure 8 (a) illustrates that a laser beam 12 guided by a fluid jet 11 can move along a given contour path 70 to process a workpiece 30 into a product having a target shape, which can be a complex shape, such as... Figure 8 The shape shown in (b) alters the distance between the propagation direction of the laser beam 12 guided by the fluid jet 11 and the rotation axis 31. A higher throughput can be achieved when the laser beam 12 guided by the fluid jet 11 is closer to the rotation axis 31 (in a view along its propagation direction). A higher amount of material can be removed where the contour path 70 is closer to the rotation axis 31.

[0088] Figure 8 (c) illustrates two different exemplary cases. Where the radius of workpiece 30 must be significantly reduced to obtain the desired final shape of the product (Case 1), the laser beam 12 guided by the fluid jet 11 is provided more vertically (“more vertical”) onto the machined surface 32; that is, the angle at which the laser beam 12 guided by the fluid jet 11 is provided onto the machined surface 32 is larger. In this case, ablation efficiency is increased, but surface quality is reduced. This case corresponds to the optimal settings for the roughing step. Where the target radius is already close to the initial radius, i.e., the radius of workpiece 30 must be reduced even further to obtain the desired final shape of the product (Case 2), the laser beam 12 guided by the fluid jet 11 is provided more tangentially (“more tangential”) to the machined surface 32. That is, the angle at which the laser beam 12 guided by the fluid jet 11 is provided onto the machined surface 32 is smaller. In this case, ablation efficiency is lower, but this results in higher surface quality (lower roughness). This case corresponds to the optimal settings for the finishing step. It is worth noting that where the radius must be significantly reduced (i.e., case 1), the process of turning workpiece 30 can reduce the radius at an increasingly smaller ablation rate, but the quality can become better and better as the target radius approaches.

[0089] The aforementioned technical effect is that turning can be performed efficiently and simply by guiding a laser beam 12 guided by a fluid jet 11 along a single, invariant contour path 70 perpendicular to the axis of rotation 31 while rotating (turning) the workpiece 30. The transition between roughing and finishing can be automated, while localized, self-optimizing ablation occurs at each location along the axis of rotation 31. After machining the workpiece 30 for a specific period, the machining quality can be improved at the point of maximum diameter along the axis of rotation 31 as the target radius approaches. These surfaces can advantageously correspond to the functional surfaces of the machined workpiece 30, i.e., the functional surfaces of the final product.

[0090] Figure 9 In (a) and (b), a further example is shown where the laser beam 12, guided by the fluid jet 11, is provided tangentially to the processing surface 32 and along a vertical direction (reference direction). Furthermore, the laser beam 12 is provided perpendicular to the rotation axis 31, about which the workpiece 30 rotates 21. In particular, the illustrated procedure can be used to process workpieces 30 with varying diameters, as shown in [the diagrams]. Figure 9 (a) and Figure 9 (b) is shown for workpiece 30.

[0091] Figure 10 and Figure 11 A method 20 according to an embodiment of the present invention is shown, the method being based on Figure 1 and Figure 2 The above embodiments are illustrated. In particular, method 20 may also include the step of faceting the workpiece 30 24, such as... Figure 10 As shown. The faceting 24 of workpiece 30 can be performed before the turning 21, 22 of workpiece 30. The faceting 24 and turning 21, 22 of workpiece 30 can be performed by the same equipment 10, and / or can be performed seamlessly or in a single process. Figure 10 and Figure 11 China and Figures 1-9 The same elements are labeled with the same reference numerals and implemented similarly.

[0092] The faceting process 24 of workpiece 30 may include, for example, using a laser beam 12 guided by a fluid jet 11 to remove a set of fragments from workpiece 30 in order to reduce the diameter of workpiece 30 (where the diameter is perpendicular to the axis of rotation 31). Specifically, the faceting process 24 may include the step of cutting into workpiece 30 using a laser beam 12 guided by a fluid jet 11 at step 81, a further step of rotating workpiece 30 about the axis of rotation 31 at step 82, and another step of cutting into workpiece 30 again using a laser beam 12 guided by a fluid jet 11 at step 83, in order to cut fragments from workpiece 30. In this way, multiple fragments can be cut from workpiece 30.

[0093] like Figure 10 As further shown, the faceting 24 of workpiece 30 may include performing a first cutting 81 (e.g., Figure 10 As shown in (a), a complete cut may not be necessary, but is possible. Furthermore, the workpiece 30 can then be rotated 82 (as shown in (a)). Figure 10 As shown in (b), especially if the first cut 81 itself does not remove fragments from the workpiece 30), and another cut 83 is shown (as shown in [the diagram]). Figure 10 As shown in (c), this other cut may intersect with the first cut to remove the extruded material, i.e., to remove debris from the workpiece 30. This procedure can be performed multiple times in the same manner (e.g., ...). Figure 10 As shown in (d), this results in the final removal of a set of fragments from workpiece 30. Figure 10 (f)). The removal of this set of fragments results in faceting 24 of workpiece 30, that is, workpiece 30 can have a defined faceted shape. In faceting 24, the last fragment cut off from workpiece 30 (i.e., for the last facet of workpiece 30 to be produced, see [f]). Figure 10 (e) can be cut from the bottom side of the workpiece 30 because a smaller / shorter cut is required from that side. The faceted workpiece 30 can then be processed according to method 20, in particular by turning 21, 22.

[0094] Figure 11 Different examples of effective faceting strategies that can be applied to workpiece 30 are shown. Figure 11 The diagram is shown in a view along the axis of rotation 31. The gray lines 90 drawn on the various workpieces 30 represent the cuts that can be performed on the faceting process 24 of the corresponding workpiece 30. It is understood that different cutting arrangements, orientations, and / or sequences can be performed to effectively reduce the workpiece diameter. For some faceting strategies, based on the indicated cutting lines 90, it is understood that in a first step, a first subset of fragments can be removed from the workpiece 30, wherein the specific angle can be a larger angle (to reduce the diameter of the workpiece 30 relative to the axis of rotation 31), and then in a second step, a second subset of fragments can be removed from the workpiece 30, wherein the specific angle is a smaller angle (to further reduce the diameter of the workpiece 30 relative to the axis of rotation 31). Therefore, the workpiece 30 can be faceted more roughly in the first step (roughing) and then more finely faceted in the second step (finishing). Conversely, it is also possible to perform a first step using a smaller specific angle and then a second step using a larger second angle. Thus, even higher precision can be achieved.

[0095] An algorithm can be used to determine the faceting strategy for the workpiece 30 to be machined by method 20. For example, an optimization algorithm can be performed based on the dimensions (e.g., volume and / or diameter) and / or shape of the workpiece 30, and / or on the surface finish of the workpiece 30, and / or on the process time of machining the workpiece 30. The faceting 24 of the workpiece 30 (and subsequent turning 21, 22) can then be performed based on the results of the optimization algorithm. The results may include cutting lines 90, and in particular, a cutting sequence represented by such cutting lines 90.

[0096] In one example, constraints for determining the optimal faceting strategy for a workpiece could be a maximum radius (e.g., the initial radius or diameter of workpiece 30, i.e., the radius or diameter before faceting 24) and a minimum radius (e.g., the desired final radius or diameter of workpiece 30 after faceting 24). Another constraint could be the minimum defect size of workpiece 30 after processing. An algorithm for determining the faceting strategy for workpiece 30 can then provide multiple facets that workpiece 30 should have after faceting 24 and / or fragments removed from workpiece 30, i.e., the most efficient processing sequence for cutting facets into workpiece 30, as output. Furthermore, for faceting 24, the algorithm can consider the maximum volume of material to be reduced and the maximum length of each cut. The final shape of workpiece 30 can be, in particular, polygonal, e.g., having an offset from the actual geometry. The algorithm can be executed by device 10, and device 10 can directly use the results of the algorithm to, for example, perform faceting 24 in a single run, followed by turning.

[0097] With or without faceting 24, turning 21, 22 can be combined with one or more further processing steps, such as with at least one processing step including a laser beam 12 guided by a fluid jet 11 to cut deep into the workpiece 30, drilling the workpiece 30, engraving the workpiece 30, and laser milling the workpiece 30. In addition to faceting 24 and turning 21, 22, the apparatus 10 can also perform other processing steps.

[0098] In all implementations, method 20 can be derived from the following: Figure 12 The described device 10 performs automatically and / or seamlessly and / or in a single process.

[0099] Figure 12 An apparatus 10 according to an embodiment of the present invention is shown. The apparatus 10 is configured to process a workpiece 30, such as... Figure 1 or Figure 2As shown, it can be the device 10 used in method 20. Device 10 includes at least a processing unit 101, a support 102, and a control unit 103. Device 10 may also include an optical sensor 103a, a distance sensor 103b, and other optional elements and units described below (and indicated by dashed boxes).

[0100] The processing unit 101 is configured to provide a laser beam 12 coupled to a pressurized fluid jet 11. The control unit 103 is configured to control the processing unit 101 and the support 102. Specifically, the control unit 103 can control the support 102 to rotate the workpiece 30 about a rotation axis 31 by 21. Furthermore, the control unit 103 can control the processing unit 101 to provide the laser beam 12, guided by the fluid jet 11, to the processing surface 32 of the workpiece 30, particularly while the workpiece 30 is rotating by 21. These actions can achieve, for example... Figure 1 and Figure 2 The method 20 shown is based on an embodiment of the present invention.

[0101] An optional optical sensor 103a can be configured to determine the machining state of workpiece 30 during machining. For example, the optical sensor 103a can determine whether the laser beam 12 has penetrated workpiece 30, is about to penetrate workpiece 30, or has not penetrated workpiece 30 (e.g., in the case of cutting off fragments of workpiece 30 during faceting 24). In this case, the current machining step can be stopped immediately, and the device 10 can continue to the next machining step. A distance sensor 103b can be configured to measure the distance between machining unit 101 and the machined surface 32 of workpiece 30, for example, during turning 21, 22. Thus, the device 10 can determine how much material has been removed from the workpiece during turning 21, 22. The distance sensor 103b can also be configured to measure the surface orientation of the machined surface 32 of workpiece 30. Then, for example, the control unit 103 can determine, based on the measured surface orientation, how to provide the laser beam 12 guided by the fluid jet 11 onto the machined surface 32 to achieve the most efficient turning 21, 22 of workpiece 30.

[0102] The processing unit 101 can couple a laser beam 12 (e.g., a laser beam received from a laser source 105, or, for example, a laser beam received from multiple laser sources 105) into a fluid jet 11, which may optionally be part of the device 10. This coupling can be performed within the processing unit 101. The processing unit 101 may specifically include optical elements, such as at least one lens 106, to couple the laser beam 12 into the fluid jet 11. The laser beam 12 can be generated outside the processing unit 101 and can be injected into the processing unit 101. Within the processing unit 101, a reflector and / or a beam splitter 107 and / or another optical element can guide the laser beam 12 toward, for example, at least one lens 106. The beam splitter 107 can also be used to couple a portion of the laser or electromagnetic radiation from the workpiece 30 to an optical sensor 103a. The processing unit 101 may also include an optically transparent protective window 109 to separate the optical device (here exemplarily an optical element 106) from the fluid circuit (e.g., a water circuit) and from the area of ​​the processing unit 101 that generates the fluid jet 11.

[0103] To generate the fluid jet 11, the processing unit 101 may include a fluid jet generating nozzle 108 with an orifice of a defined size. The fluid jet generating nozzle 108 may be disposed within the processing unit 101 to generate the fluid jet 11 in a protected environment. The orifice may define the width of the fluid jet 11. The orifice may have a diameter of, for example, 10 μm to 200 μm, and the fluid jet 11 may have a diameter of, for example, about 0.6 to 1 times the orifice diameter. The pressure of the pressurized fluid jet 11 may be provided by an external fluid supply source 104, which is typically not part of the device 10 (but may be). For example, the pressure is between 50 bar and 800 bar. To output the fluid jet 11 from the device 10, the processing unit 101 may include an outlet nozzle with an outlet orifice. In particular, the outlet orifice is wider than the fluid nozzle orifice.

[0104] The control unit 103 can also control at least one laser source 105 (e.g., it can command the laser controller of the laser source 105). That is, the control unit 103 can instruct the laser controller of the laser source 105 to output a corresponding laser emission. The laser controller of the laser source 105 can thus be configured to produce a constant or pulsed laser beam, particularly the latter for setting the pulse power, pulse width, pulse repetition rate, pulse burst rate, or pauses between pulses according to the instructions of the control unit. For example, for turning operations 21 and 22, the pulse intensity of the laser beam 12 can be 0.4 GW / cm². 2 -2 GW / cm 2Within the range of 20W-300W, and the average power of the laser beam 12 can be in the range of 150ns-400ns. The control unit 103 can also control the fluid supply source 104.

[0105] During turning operations 21 and 22, the workpiece 30 can be held by the support 102. The device 10 can be arranged such that it can machine the workpiece 30 held by the support 102. The support 102 can be attached to a rotatable element of the device 10, or it can be a rotatable element of the device 10 itself. Thus, the device 10, and particularly the control unit 103, can control the movement of the support 102 in up to three dimensions (e.g., as shown in the image). Figure 12 The xyz directions are indicated in the diagram, where the z-direction is parallel to the fluid jet 11, and the x and y directions are perpendicular to the z-direction and to each other. The support 102 can be rotated by the device 10, for example, by rotating a rotatable element. Then, specifically, the device 10 can, as described above, turn the workpieces 21 and 22 30 by moving the laser beam 12 guided by the fluid jet 11 while rotating the support 102. Thus, multiple passes can be performed, i.e., the laser beam 12 can move along the same path on the workpiece 30 more than once. Furthermore, the movement of the laser beam 12 can be continuous or stepped, and the speed of the laser beam 12 movement can be selected / changed. It is worth noting that the movement of the laser beam 12 is relative to the workpiece 30, such that the workpiece 30 (e.g., mounted on a movable workpiece support) can also be moved.

[0106] The rotation of the support 102 can be driven by a motor or CNC. For example, the support 102 may include a rod or a so-called "Dop". The support 102 may be at least 10% smaller than the diameter of the workpiece 30, and particularly at least 20% smaller (in diameter / width). The support 102 can rotate about the axis of rotation 31 (e.g., Figure 12 (As indicated in the document). The rotation of the bracket 102 can be controlled by the control unit 103, specifically based on input from the optical sensor 103a.

[0107] Optical sensor 103a can be arranged to receive laser-induced electromagnetic radiation that propagates away from workpiece 30 (e.g., when workpiece 30 11 is being cut using laser beam 12), for example, propagating towards optical sensor 103b through fluid jet 11 and further through at least one optical element 106, 107. Optical sensor 103a can be specifically arranged to receive laser-induced electromagnetic radiation through fluid jet 11 and through at least one optical element 106 configured to couple laser beam 12 into fluid jet 11. The laser-induced electromagnetic radiation can include secondary radiation emitted from a portion of workpiece 30 being cut using laser beam 12. For example, laser-induced electromagnetic radiation can be sensed because the machined surface 32 of workpiece 30 is converted into plasma. This plasma can emit characteristic radiation that can be readily isolated on or through optical sensor 103a. The laser-induced electromagnetic radiation can also include primary laser radiation reflected from workpiece 30. The electromagnetic radiation induced by the laser may also include secondary radiation generated by scattering the laser beam 12 in the fluid jet 11, preferably by Raman scattering.

[0108] Distance sensor 103b can be a second optical sensor (i.e., in addition to optical sensor 103a) or an ultrasonic sensor. In this case, distance sensor 103b can be arranged to optically measure the distance to the workpiece surface and / or the surface orientation of workpiece 30, for example, by measuring the light reflected from workpiece 30. For this purpose, distance sensor 103b can also be configured to send light onto workpiece 30. Distance sensor 103b can also be a touch probe. In this case, distance sensor 103b can be arranged such that it can contact workpiece 30 to perform surface orientation measurement, or it can be configured such that it can move toward or be moved toward workpiece 30 to perform measurement.

[0109] Optical sensor 103a and / or distance sensor 103b can be arranged in processing unit 101. However, optical sensor 103a can also be arranged in laser source 105. In this case, laser-induced radiation can propagate backward from workpiece 30 and can be guided to laser source 105 through processing unit 101, where the laser-induced radiation is received by optical sensor 103a. Processing unit 101 can be optically connected to laser source 105, for example, via fiber optics.

[0110] Furthermore, the optical sensor 103a can be configured to convert the received radiation into a signal. The control unit 103 may include processing circuitry configured to determine the state of the processed / cut product 11 based on the signal. The state of the processed workpiece 30 may be whether the laser beam 12 has penetrated the workpiece 30.

[0111] Device 10, particularly control unit 103, may include a processor or processing circuitry (not shown) configured to perform, conduct, or initiate various operations of device 10 as described in this invention, particularly execution method 20. The processing circuitry may include hardware, and / or may be controlled by software. The hardware may include analog or digital circuitry, or both. The digital circuitry may include components such as application-specific integrated circuits (ASICs), field-programmable arrays (FPGAs), digital signal processors (DSPs), or multi-purpose processors.

[0112] Device 10 may also include memory circuitry storing one or more instructions that can be executed by a processor or processing circuitry, particularly under the control of software. For example, the memory circuitry may include a non-transitory storage medium storing executable software code or program code that, when executed by a processor or processing circuitry, causes various operations of the device described in this invention, particularly the execution of method 20.

[0113] The invention has been described in conjunction with various embodiments and implementations as examples. However, based on a study of the drawings, specification, and independent claims, those skilled in the art and those practicing the claimed embodiments can understand and implement other variations. In the claims and specification, the word "comprising" does not exclude other elements or steps, and the indefinite articles "a" or "an" do not exclude a plurality. A single element or other unit can perform the function of multiple entities or items as described in the claims. The fact that certain measures are enumerated only in mutually different dependent claims does not indicate that combinations of these measures cannot be used in advantageous implementations.

[0114] The embodiments of the present invention have various applications. For example, method 20 can be beneficial for watchmaking due to the achievable low surface roughness, or due to the verticality of the fluid jet 11 possible with device 10, or due to the versatility of method 20. For example, method 20 can be performed to manufacture or form pinions or cabochon gemstones. Furthermore, method 20 can be beneficial for manufacturing grinding tools, etc., which typically require hard materials. For example, these benefits arise from the high material removal rate possible with method 20, or the verticality of the fluid jet 11 possible with device 10. In addition, method 20 can be beneficial for manufacturing or forming medical ceramics. For example, these benefits arise from the high material removal rate possible with method 20, or the sensitive processing of (heat)-sensitive and / or fragile materials by the fluid jet-guided laser beam 12, particularly in the tangential direction.

Claims

1. A method (20) for processing a workpiece (30), wherein, The method (20) is performed by a device (10) that provides a laser beam (12) guided by a fluid jet (11). The method (20) includes faceting (24) the workpiece (30) before turning it. The faceting (24) of the workpiece (30) includes using a laser beam (12) guided by the fluid jet (11) to remove a set of fragments from the workpiece (30) to reduce the diameter of the workpiece (30) relative to the axis of rotation (31), and The turning of the workpiece (30) includes: During the processing, the workpiece (30) is rotated (21) about the axis of rotation (31); and The laser beam (12) guided by the fluid jet (11) is provided (22) to the machined surface (32) of the workpiece (30).

2. The method (20) according to claim 1, wherein: The laser beam (12) guided by the fluid jet (11) is provided vertically onto the processing surface (32), or provided tangent to the processing surface (32), or provided substantially tangent to the processing surface (32).

3. The method (20) according to claim 1, wherein: The rotation axis (31) is perpendicular to the propagation direction of the laser beam (12) guided by the fluid jet (11) provided by the device (10).

4. The method (20) according to claim 3, wherein: The propagation direction of the laser beam (12) guided by the fluid jet (11) does not intersect with the rotation axis (31).

5. The method (20) according to claim 3, wherein: The laser beam (12) guided by the fluid jet (11) is delivered to the processing surface (32) at a certain angle.

6. The method (20) according to claim 1, further comprising: During the turning of the workpiece (30), the laser beam (12) guided by the fluid jet (11) is moved along the direction of movement.

7. The method (20) according to claim 6, wherein: The direction of movement is parallel or perpendicular to the axis of rotation (31) and perpendicular to the propagation direction of the laser beam (12) guided by the fluid jet (11).

8. The method (20) according to claim 1, wherein: The rotation axis (31) is parallel to the laser beam (12) guided by the fluid jet (11).

9. The method (20) according to claim 1, wherein: The laser beam (12) is pulsed; and The rotational speed of the workpiece (30) about the rotation axis (31) is set such that the continuous pulses of the pulsed laser beam (12) overlap each other by at least 50% on the processed surface (32) of the workpiece (30).

10. The method (20) according to any one of claims 1 to 9, wherein: The laser beam (12) is pulsed; and The pulsed laser beam (12) comprises at least two superimposed pulses selected based on a specific material of the workpiece (30). The first pulse has a different power and frequency than the second pulse.

11. The method (20) according to claim 10, wherein: The first pulse is suitable for cutting workpieces (30) of a specific material; and The second pulsation is not suitable for cutting the workpiece (30) of the particular material and / or is suitable for smoothing the surface of the workpiece (30) of the particular material.

12. The method (20) according to claim 1, wherein, Removing fragments from the workpiece (30) includes: The laser beam (12) guided by the fluid jet (11) cuts into (81) the workpiece; Rotate the workpiece (30) about the axis of rotation (31) by a specific angle (82); and The laser beam (12) guided by the fluid jet (11) cuts (83) into the workpiece (30) again to cut the fragment from the workpiece (30).

13. The method (20) according to claim 12, wherein, The faceting process (24) of the workpiece (30) includes: A first subset of fragments is removed from the workpiece (30), wherein the specific angle is a large angle to reduce the diameter of the workpiece (30) relative to the axis of rotation (31); and A second subset of fragments is removed from the workpiece (30), wherein the specific angle is a smaller angle to further reduce the diameter of the workpiece (30) relative to the axis of rotation (31).

14. The method (20) according to claim 1, further comprising: An optimization algorithm is executed based on the size and / or shape of the workpiece (30) and with regard to the surface finish of the workpiece (30) being processed and / or the processing time for processing the workpiece (30); and The faceting (24) and turning of the workpiece (30) are performed based on the results of the optimization algorithm.

15. The method (20) according to claim 1, wherein: The method (20) is performed automatically and / or seamlessly by the device (10); and / or The method (20) is performed by the device (10) in a single process.

16. An apparatus (10) for processing a workpiece (30), the apparatus (10) comprising: Processing unit (101), the processing unit is configured to provide a laser beam (12) guided by a fluid jet (11); A support (102) configured to hold and rotate the workpiece (30); and A control unit (103) is configured to control the machining unit (101) and the support (102) respectively to perform faceting (24) on the workpiece (30) before turning it, and, in order to perform faceting (24) on the workpiece (30): A laser beam (12) guided by the fluid jet (11) is used to remove a set of fragments from the workpiece (30) to reduce the diameter of the workpiece (30) relative to the axis of rotation (31); The control unit (103) is further configured to control the machining unit (101) and the support (102) respectively to turn the workpiece (30), and in order to turn the workpiece (30): During the processing, the workpiece (30) is rotated (21) about the axis of rotation (31); and The laser beam (12) guided by the fluid jet (11) is provided to the processing surface (32) of the workpiece (30).

17. A computer program product comprising program code for controlling the device (10) according to claim 16 when executed by a processor, or for performing the method (20) according to any one of claims 1 to 15.

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