Display module, preparation method thereof and display device

Abstract

A display module includes a display panel, a first flexible circuit board and a second flexible circuit board. A plurality of binding terminals are arranged at intervals on a selected side edge of a non-display surface of the display panel, and the plurality of binding terminals are divided into a first binding terminal group and a second binding terminal group. The first flexible circuit board includes a first trace area and a first fan-out area, each first conductive contact patch of the first trace area is electrically connected to a binding terminal of the first binding terminal group. The second flexible circuit board includes a second trace area and a second fan-out area, each second conductive contact patch of the second trace area is electrically connected to a binding terminal of the second binding terminal group. Wherein, along a first direction, the first trace area is closer to the selected side edge than the second trace area, and along a second direction, the first fan-out area has a spacing with the second trace area; the first direction is perpendicular to the second direction, and the second direction is the extension direction of the selected side edge.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology

[0002] As display devices demand increasingly higher pixel density and resolution, the light-emitting diode (LED) crystal particles in these devices are becoming smaller and smaller, offering significant technological advantages. This has led to the development of mini LEDs and micro LEDs, which have broad application prospects. Currently, Mini / Micro LED splicing display devices are assembled from independently displayable devices, and seamless splicing technology remains a key challenge in the splicing of these display devices. Summary of the Invention

[0003] On the one hand, a display module is provided, including: a display panel, a first flexible circuit board and a second flexible circuit board.

[0004] The non-display surface of the display panel includes multiple sides, at least one of which is a selected side; the display panel includes multiple bonding terminals disposed on the non-display surface, the multiple bonding terminals are arranged sequentially and spaced apart along the selected side; the multiple bonding terminals are divided into a first bonding terminal group and a second bonding terminal group, the first bonding terminal group includes a portion of the multiple bonding terminals, and the second bonding terminal group includes another portion of the multiple bonding terminals.

[0005] The first flexible circuit board includes a first trace area and a first fan-out area connected to each other. The first trace area is closer to the selected side than the first fan-out area. A plurality of first conductive contacts are spaced apart in the first trace area, and each first conductive contact is electrically connected to a bonding terminal of the first bonding terminal group.

[0006] The second flexible circuit board includes a second routing area and a second fan-out area connected to each other. The second routing area is closer to the selected side than the second fan-out area. A plurality of second conductive contacts are spaced apart in the second routing area, and each second conductive contact is electrically connected to a bonding terminal of the second bonding terminal group.

[0007] Wherein, along the first direction, the first routing area is closer to the selected side than the second routing area, and along the second direction, the first fan-out area and the second routing area are spaced apart; the first direction is perpendicular to the second direction, and the second direction is the extension direction of the selected side.

[0008] In some embodiments, along a first direction, the side of the first trace area away from the selected side is closer to the selected side than the side of the second trace area close to the selected side.

[0009] In some embodiments, along the first direction, the distance between the second trace area and the first trace area is greater than 1 mm.

[0010] In some embodiments, along the second direction, the shortest distance between the first fan-out area and the second routing area is greater than 1 mm.

[0011] In some embodiments, the display panel further includes a display surface and a plurality of side surfaces connecting the display surface and the non-display surface. A plurality of side traces are spaced apart on the side surface near the selected side surface. One end of each side trace extends to the display surface and the other end extends to the non-display surface. The end of each side trace extending to the non-display surface serves as one of the plurality of bonding terminals.

[0012] In some embodiments, the plurality of bonding terminals extend along a first direction, and the minimum length of each bonding terminal in the first bonding terminal group along its extension direction is less than the minimum length of each bonding terminal in the second bonding terminal group along its extension direction.

[0013] In some embodiments, the plurality of first conductive contacts correspond one-to-one with the plurality of bonding terminals of the first bonding terminal group, and a first adhesive film is located between the plurality of first conductive contacts and the first bonding terminal group, and is in direct contact with both. The plurality of second conductive contacts correspond one-to-one with the plurality of bonding terminals of the second bonding terminal group, and a second adhesive film is located between the plurality of second conductive contacts and the second bonding terminal group, and is in direct contact with both. The first adhesive film and the second adhesive film extend along the second direction, with the first adhesive film closer to the selected side relative to the second adhesive film.

[0014] In some embodiments, at least one alignment mark is further provided on the non-display surface of the display panel, the at least one alignment mark being used for the connection alignment of the plurality of first conductive contacts with the binding terminals of the first binding terminal group, and the plurality of second conductive contacts with the binding terminals of the second binding terminal group.

[0015] In some embodiments, the alignment mark includes a marking pattern and a clearance area surrounding the marking pattern, the clearance area being insulated from the outer region of the clearance area.

[0016] In some embodiments, the at least one alignment mark includes a plurality of alignment marks, the plurality of alignment marks including a first set of alignment marks, a second set of alignment marks and a third set of alignment marks spaced apart along a first direction.

[0017] The first routing area of ​​the first flexible circuit board includes a first bonding area and a first alignment area arranged along the first direction. The first alignment area is connected to the first fan-out area, and the plurality of first conductive contacts are disposed within the first bonding area. The second routing area of ​​the second flexible circuit board includes a second bonding area and a second alignment area arranged along the first direction. The second alignment area is connected to the second fan-out area, and the plurality of second conductive contacts are disposed within the second bonding area.

[0018] The first set of alignment marks includes a first sub-alignment mark and a second sub-alignment mark. The marking patterns of the first sub-alignment mark and the second sub-alignment mark are located within the orthographic projection of the first alignment area onto the non-display surface. The marking patterns of the first sub-alignment mark and the second sub-alignment mark are symmetrically arranged with respect to the centerline of the orthographic projection of the first alignment area onto the non-display surface in a first direction. The first sub-alignment mark is closer to the side of the non-display surface than the second sub-alignment mark.

[0019] The second set of alignment marks includes a third sub-alignment mark, a fourth sub-alignment mark, and a fifth sub-alignment mark. The marking patterns of the third and fourth sub-alignment marks are located within the orthographic projection of the second alignment area onto the non-display surface, and the marking patterns of the third and fourth sub-alignment marks are symmetrically arranged relative to the centerline of the orthographic projection of the second alignment area onto the non-display surface in a first direction. The fourth sub-alignment mark is closer to the side of the non-display surface than the third sub-alignment mark. The center of the fifth sub-alignment mark is on the same straight line along a second direction as the centers of the third and fourth sub-alignment marks, and the marking pattern of the fifth sub-alignment mark is located on one side of the orthographic projection of the first fan-out area onto the non-display surface along the second direction.

[0020] The third set of alignment marks includes a sixth sub-alignment mark and a seventh sub-alignment mark. The sixth and seventh sub-alignment marks are symmetrically arranged with respect to the centerline of the non-display surface in the first direction. The marking pattern of the seventh sub-alignment mark is located on one side of the orthographic projection of the second fan-out area onto the non-display surface along the second direction.

[0021] On the other hand, a display device is provided. The display device includes a display module as described in any of the above embodiments.

[0022] On the other hand, a method for manufacturing a display module is provided, comprising the following steps:

[0023] An initial display panel is created, wherein the non-display surface of the initial display panel includes multiple sides, at least one of which is a selected side.

[0024] Multiple bonding terminals are formed on the non-display surface. The multiple bonding terminals are arranged sequentially and spaced apart along the selected side. The multiple bonding terminals are divided into a first bonding terminal group and a second bonding terminal group. The first bonding terminal group includes a portion of the multiple bonding terminals, and the second bonding terminal group includes another portion of the multiple bonding terminals.

[0025] A first flexible circuit board and a second flexible circuit board are electrically connected to a plurality of bonding terminals. The first flexible circuit board includes a first trace area and a first fan-out area connected together, with the first trace area closer to the selected side than the first fan-out area. A plurality of first conductive contacts are spaced apart in the first trace area, and each first conductive contact is electrically connected to a bonding terminal of the first bonding terminal group. The second flexible circuit board includes a second trace area and a second fan-out area connected together, with the second trace area closer to the selected side than the second fan-out area. A plurality of second conductive contacts are spaced apart in the second trace area, and each second conductive contact is electrically connected to a bonding terminal of the second bonding terminal group.

[0026] Wherein, along the first direction, the first routing area is closer to the selected side than the second routing area, and along the second direction, the first fan-out area and the second routing area are spaced apart; the first direction is perpendicular to the second direction, and the second direction is the extension direction of the selected side.

[0027] In some embodiments, before the plurality of bonding terminals are formed on the non-display surface, the method further includes:

[0028] A protective film with a target shape is formed, the protective film comprising a first portion and a second portion arranged along a third direction, the first portion having a dimension along a fourth direction greater than the second portion having a dimension along a fourth direction, the first portion and the second portion being flush at the same end along the fourth direction, and the maximum dimension of the protective film along the third direction being greater than or equal to the dimension of the non-display surface along a second direction; wherein, the second direction is the extension direction of the selected side, and the third direction is perpendicular to the fourth direction.

[0029] The protective film is attached to the target position on the non-display surface of the initial display panel. The first part and the second part are arranged in a direction parallel to the extension direction of the selected side. The flush ends of the first part and the second part are far away from the selected side, and the first part and the second part are respectively separated from the selected side by a set distance.

[0030] Based on the protective film, at least a metal layer is formed on the non-display panel.

[0031] The metal layer is etched to form multiple bonding terminals on the non-display surface. The multiple bonding terminals are divided into a first bonding terminal group and a second bonding terminal group, with the boundary line between the first part and the second part of the protective film as the boundary.

[0032] In some embodiments, at least one alignment mark is further provided on the non-display surface. The at least one alignment mark includes a first set of alignment marks, a second set of alignment marks, and a third set of alignment marks arranged at intervals along a first direction. The first set of alignment marks includes a first sub-alignment mark and a second sub-alignment mark. The second set of alignment marks includes a third sub-alignment mark, a fourth sub-alignment mark, and a fifth sub-alignment mark. The third set of alignment marks includes a sixth sub-alignment mark and a seventh sub-alignment mark.

[0033] In the step of forming a protective film with a target shape, the protective film includes a first hollow area, a second hollow area, and a third hollow area, the first hollow area, the second hollow area, and the third hollow area correspond to the positions of the fifth sub-alignment mark, the sixth sub-alignment mark, and the seventh sub-alignment mark, respectively.

[0034] In the step of attaching the protective film to the target position of the non-display surface of the initial display panel, portions of the non-display surface corresponding to the first cutout area, the second cutout area, and the third cutout area of ​​the protective film are exposed.

[0035] In the step of forming a metal layer on at least the non-display surface based on the protective film, the metal layer also covers portions of the non-display surface that expose the first, second, and third cutout areas corresponding to the protective film.

[0036] In the step of etching the metal layer to form multiple bonding terminals on the non-display surface, the first sub-alignment mark, the second sub-alignment mark, the third sub-alignment mark, the fourth sub-alignment mark, the fifth sub-alignment mark, the sixth sub-alignment mark, and the seventh sub-alignment mark are formed simultaneously.

[0037] In some embodiments, in the step of electrically connecting the first flexible circuit board and the second flexible circuit board to a plurality of bonding terminals, the first flexible circuit board and the second flexible circuit board are aligned with the plurality of bonding terminals according to the first set of alignment marks, the second set of alignment marks and the third set of alignment marks, and the first flexible circuit board and the second flexible circuit board are electrically connected to the plurality of bonding terminals.

[0038] In some embodiments, a first adhesive film is applied to a target location of the first bonding terminal group according to a fourth sub-alignment mark and a fifth sub-alignment mark, and a second adhesive film is applied to a target location of the second bonding terminal group. The first flexible circuit board and the first bonding terminal group are connected via the first adhesive film. The second flexible circuit board and the second bonding terminal group are connected via the second adhesive film. The first adhesive film and the second adhesive film extend along the second direction, with the first adhesive film closer to the selected side relative to the second adhesive film.

[0039] In some embodiments, the initial display panel further includes a display surface and a plurality of side surfaces connecting the display surface and the non-display surface. In the step of forming a plurality of bonding terminals on the non-display surface, a plurality of side traces are simultaneously formed on the side surface near the selected side; the plurality of side traces are spaced apart, with one end of each side trace extending to the display surface and the other end extending to the non-display surface, and the end of each side trace extending to the non-display surface serving as one of the plurality of bonding terminals.

[0040] In some embodiments, after the metal layer is etched and before the first flexible circuit board, the second flexible circuit board and the plurality of bonding terminals are electrically connected, the protective film is peeled off from the non-display surface. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0042] Figure 1 This is a structural diagram of a display panel provided according to some embodiments;

[0043] Figure 2 This is a structural diagram of a display module provided according to some embodiments;

[0044] Figure 3 According to Figure 2Enlarged view of point A of the provided display module;

[0045] Figure 4 This is another structural diagram of a display module provided according to some embodiments;

[0046] Figure 5 According to Figure 4 Enlarged view of section A' of the provided display module;

[0047] Figure 6 This is a structural diagram of a display module provided in some embodiments of this disclosure;

[0048] Figure 7 This is a structural diagram of a display panel provided in some embodiments of the present disclosure;

[0049] Figure 8 This is a structural diagram of a first flexible circuit board provided in some embodiments of the present disclosure;

[0050] Figure 9 This is a structural diagram of a second flexible circuit board provided in some embodiments of the present disclosure;

[0051] Figure 10 Some embodiments of this disclosure are based on Figure 6 The provided enlarged view of display module B;

[0052] Figure 11 Some embodiments of this disclosure are based on Figure 6 The provided enlarged view of display module B;

[0053] Figure 12 This is another structural diagram of the display module provided in some embodiments of the present disclosure;

[0054] Figure 13 Some embodiments of this disclosure are based on Figure 12 The provided enlarged view of display module C;

[0055] Figure 14 This is another structural diagram of the display panel provided in some embodiments of the present disclosure;

[0056] Figure 15 This is yet another structural diagram of the display module provided in some embodiments of the present disclosure;

[0057] Figure 16 This is yet another structural diagram of the display module provided in some embodiments of the present disclosure;

[0058] Figure 17 A side view of a display panel provided in some embodiments of this disclosure;

[0059] Figure 18AThis is another structural diagram of the display panel provided in some embodiments of the present disclosure;

[0060] Figure 18B Some embodiments of this disclosure are based on Figure 18A The provided cross-sectional structural diagram of the display panel along GG';

[0061] Figure 18C Some embodiments of this disclosure are based on Figure 6 The provided cross-sectional structural diagram of the display module along HH';

[0062] Figure 19 This is yet another structural diagram of a display panel provided in some embodiments of the present disclosure;

[0063] Figure 20 This is yet another structural diagram of a display panel provided in some embodiments of the present disclosure;

[0064] Figure 21 This is a structural diagram of a display module provided in some embodiments of this disclosure;

[0065] Figure 22 This is another structural diagram of the display module provided in some embodiments of the present disclosure;

[0066] Figure 23 This is yet another structural diagram of the display module provided in some embodiments of the present disclosure;

[0067] Figure 24 Some embodiments of this disclosure are based on Figure 23 The provided enlarged view of display module D;

[0068] Figure 25 This is yet another structural diagram of the display module provided in some embodiments of the present disclosure;

[0069] Figure 26 This is a structural diagram of a display device provided in some embodiments of the present disclosure;

[0070] Figure 27 This is a flowchart illustrating a method for manufacturing a display module according to some embodiments of this disclosure;

[0071] Figure 28 This is a structural diagram of an initial display panel provided in some embodiments of the present disclosure;

[0072] Figure 29 These are step diagrams illustrating the display module fabrication method provided in some embodiments of this disclosure;

[0073] Figure 30 These are step diagrams illustrating the display module fabrication method provided in some embodiments of this disclosure;

[0074] Figure 31This is a flowchart illustrating a method for manufacturing a display module according to some embodiments of this disclosure;

[0075] Figure 32 This is a structural diagram of the protective film provided in some embodiments of this disclosure;

[0076] Figure 33 This is yet another structural diagram of the initial display panel provided in some embodiments of the present disclosure;

[0077] Figure 34 This is a structural diagram of a display panel provided in some embodiments of the present disclosure;

[0078] Figure 35 This is yet another structural diagram of a display panel provided in some embodiments of the present disclosure;

[0079] Figure 36 A side view of an initial display panel provided in some embodiments of this disclosure;

[0080] Figure 37 This is a structural diagram of a display panel provided in some embodiments of the present disclosure;

[0081] Figure 38 This is another structural diagram of the protective film provided in some embodiments of this disclosure;

[0082] Figure 39 This is another structural diagram of the initial display panel provided in some embodiments of the present disclosure;

[0083] Figure 40 This is yet another structural diagram of a display panel provided in some embodiments of the present disclosure;

[0084] Figure 41 This is yet another structural diagram of a display panel provided in some embodiments of the present disclosure. Detailed Implementation

[0085] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0086] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0087] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0088] In describing some embodiments, the term "connection" and its derivative expressions may be used. For example, the term "connection" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0089] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0090] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0091] As used herein, depending on the context, the term “if” may optionally be interpreted as meaning “when”, “in the event of”, “in response to determination”, or “in response to detection”. Similarly, depending on the context, the phrase “if it is determined that…” or “if [the stated condition or event] is detected” may optionally be interpreted as meaning “in the event of determination that…”, “in response to determination that…”, “when [the stated condition or event] is detected”, or “in response to the detection of [the stated condition or event]”.

[0092] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0093] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0094] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0095] As used herein, the terms "parallel," "perpendicular," and "equal" include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; "equal" includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0096] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0097] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0098] In related technologies, a single display panel can utilize traces located on the side of the panel to connect the display surface traces with the non-display surface drivers of the display panel. This allows for a smaller spacing between adjacent display panels when multiple display panels are joined to form a larger display device. The structure of display panel 1' is as follows: Figure 1 As shown, the film layer on the side of the display panel 1' forms a side trace 13. The side trace 13 extends to one end of the display surface 12 and connects to the film layer 12a of the display surface 12. The film layer 12a of the display surface 12 includes all signal lines, power lines, control lines, etc. The side trace 13 is located at one end of the non-display surface 11 and serves as a bonding terminal 11a for connection with the flexible circuit board. Figure 2 As shown, the conductive contact 1b on one side of the flexible circuit board 2 is connected to the bonding terminal 11a, and the other side of the flexible circuit board 2 is connected to the driver (such as a printed circuit board or system circuit board, not shown in the figure), thereby forming a display module 10'. The display module 10' is connected to the driver of the non-display surface 11 of the display panel 1' to realize the connection of the product circuit.

[0099] The inventor discovered, see again Figure 2Taking the lower side in the figure as an example, when the density of the bonding terminals 11a on one side of the non-display surface 11 of the display panel 1' is small, the distance D1 between two adjacent bonding terminals 11a is large. Here, the distance D1 can be understood as the average value of the distance D1 between adjacent bonding terminals 11a. The conductive contacts 1b on the long flexible circuit board 2 can be bonded to the bonding terminals 11a to complete the circuit connection. That is, the production tolerance of the flexible circuit board 2 meets the bonding requirements. The flexible circuit board includes a board body and multiple conductive contacts disposed on the board body. The multiple conductive contacts are arranged sequentially in the same direction and spaced apart. The tolerance of the flexible circuit board is related to the length of the flexible circuit board and the number of conductive contacts 1b disposed thereon. The length of the flexible circuit board is the dimension of the board body in the direction of the arrangement of its multiple conductive contacts. The longer the length of the flexible circuit board, the larger the tolerance of the flexible circuit board. The more conductive contacts 1b disposed in the length direction of the flexible circuit board, that is, the greater the density of the conductive contacts 1b, the greater the tolerance of the flexible circuit board. For example, for a relatively long flexible circuit board, such as 150mm in length, the current tolerance is approximately ±100μm. However, for some display panels with high pixel density, the corresponding number of signal lines is greater. Since the number of conductive contacts is generally positively correlated with the number of signal lines, the number of conductive contacts per unit area increases, requiring the flexible circuit board to have a tolerance of at least ±50μm to meet the requirements. This presents a problem where the existing tolerance limits of flexible circuit boards cannot meet the bonding requirements of specific display panels. See again... Figure 2 Taking the upper side of the display panel in the figure as an example, because the bonding terminals 11a arranged on this side have a relatively high density, that is, in order to connect with the film layer 12a of the display surface 12 of the display panel 1', a large number of bonding terminals 11a are formed along one side of the non-display surface 11 of the display panel 1', making the spacing D2 between adjacent bonding terminals 11a smaller. Therefore, the corresponding conductive contacts 1b on the flexible circuit board 3 also need to be denser. Moreover, when the length of the flexible circuit board 3 is long, the current process limit of the flexible circuit board cannot meet the requirements. The spacing D2 here can be understood as the average value of the spacing D2 between the bonding terminals 11a. Figure 2 and Figure 3 As shown, when the flexible circuit board 3 is bonded to the bonding terminal 11a on the non-display surface 11 side of the display panel 1', the bonding terminal 11a and the conductive contact 1b of the flexible circuit board 3 will be misaligned. This results in the problem that the conductive contact 1b of the flexible circuit board 3 and the bonding terminal 11a cannot be connected in a corresponding manner, and there is also a misalignment of the flexible circuit board 3 relative to the display panel 1', which leads to a decrease in product yield.

[0100] To address the issue that flexible circuit boards with long lengths and high density of conductive contacts 1b cannot meet bonding requirements, such as... Figure 4As shown, the inventors used two shorter flexible circuit boards instead of a longer flexible circuit board to bond with the bonding terminals 11a of the non-display surface 11 of the display panel 1'. The shorter flexible circuit boards have smaller tolerances. Currently, the tolerances of flexible circuit boards in mass production can meet the bonding requirements in terms of dimensions. For example, the tolerance of a 60mm long flexible circuit board is ±30μm, which is less than ±50μm and can meet the requirements.

[0101] However, the inventors discovered that if two shorter flexible circuit boards, such as flexible circuit board 4 and flexible circuit board 5, are bonded to the bonding terminals 11a of the non-display surface 11 of the display panel 1' on the same horizontal line, such as... Figure 4 and Figure 5 As shown, flexible circuit boards 4 and 5 overlap in shape. The later-bonded flexible circuit board will inevitably be pressed against the earlier-bonded one, causing interference between the two flexible circuit boards. For example, when the conductive contact 1b of flexible circuit board 5 is connected to the bonding terminal 11a, and the conductive contact 1b of flexible circuit board 4 is also connected to the bonding terminal 11a, flexible circuit board 4 will cover the edge area of ​​flexible circuit board 5, resulting in interference between the two boards.

[0102] Based on this, some embodiments of this disclosure provide a display module 10, such as... Figure 6 As shown, the display module 10 includes a display panel 1, a first flexible circuit board 6, and a second flexible circuit board 7.

[0103] like Figure 7 As shown, the non-display surface 11 of the display panel 1 includes a plurality of sides 11c, wherein at least one side 11c is a selected side 11cc; the display panel 1 includes a plurality of bonding terminals 11a disposed on the non-display surface 11, the plurality of bonding terminals 11a being arranged sequentially and spaced apart along the selected side 11cc; the plurality of bonding terminals 11a are divided into a first bonding terminal group 11aa and a second bonding terminal group 11ab, the first bonding terminal group 11aa including a portion of the plurality of bonding terminals 11a, and the second bonding terminal group 11ab including another portion of the plurality of bonding terminals 11a.

[0104] In some embodiments, see again Figure 7 The non-display surface 11 has a side 11c that is selected as side 11cc.

[0105] It should be noted that, as Figure 7As shown, the extension lengths of the multiple bonding terminals 11a in the display panel 1 can be different. This can be due to the manufacturing method of the display module 10, the specific formation process of which will be described in detail in the subsequent manufacturing method of the display module 10. Of course, it can also be a specially designed pattern shape, which is not limited here. The lengths of the multiple bonding terminals 11a in the first bonding terminal group 11aa are not necessarily different and can be the same. Similarly, the lengths of the multiple bonding terminals 11a in the second bonding terminal group 11ab are not necessarily different and can be the same.

[0106] like Figure 8 and Figure 6 As shown, the first flexible circuit board 6 includes a first trace area 6m and a first fan-out area 6n connected to each other. The first trace area 6m is closer to the selected side 11cc than the first fan-out area 6n. A plurality of first conductive contacts 61b are spaced apart in the first trace area 6m, and each first conductive contact 61b is electrically connected to a bonding terminal 11a of the first bonding terminal group 11aa.

[0107] In some embodiments, see again Figure 8 The first flexible circuit board 6 is provided with a plurality of third conductive contacts 661b at intervals on the other end opposite to the first trace area 6m. The first flexible circuit board 6 is provided with a plurality of first connection traces 62 at intervals. Each first connection trace 62 extends from the first trace area 6m and the first fan-out area 6n. One end of each first connection trace 62 is electrically connected to a first conductive contact 61b, and the other end is connected to a third conductive contact 661b. The plurality of third conductive contacts 661b are connected to the driver of the non-display surface 11.

[0108] like Figure 9 and Figure 6 As shown, the second flexible circuit board 7 includes a second trace area 7m and a second fan-out area 7n connected to each other. The second trace area 7m is closer to the selected side 11cc than the second fan-out area 7n. A plurality of second conductive contacts 71b are spaced apart in the second trace area 7m, and each second conductive contact 71b is electrically connected to a bonding terminal 11a of the second bonding terminal group 11ab.

[0109] In some embodiments, see again Figure 9 The second flexible circuit board 7 is provided with a plurality of fourth conductive contacts 771b at intervals on the other end opposite to the second wiring area 7m. The second flexible circuit board 7 is provided with a plurality of second wirings 63 at intervals. Each second wiring 63 extends from the second wiring area 7m and the second fan-out area 7n. One end of each second wiring 63 is electrically connected to a second conductive contact 71b, and the other end is electrically connected to a fourth conductive contact 771b. The plurality of fourth conductive contacts 771b are connected to the driver of the non-display surface 11.

[0110] In some embodiments, such as Figure 6 and Figure 10 As shown, along the first direction Y, the first routing area of ​​6m is 11cc closer to the selected side edge than the second routing area of ​​7m. See again. Figure 10 The entire area of ​​the first routing area 6m is closer to the selected side by 11cc than the entire area of ​​the second routing area 7m. That is, the first routing area 6m of the first flexible circuit board 6 and the second routing area 7m of the second flexible circuit board 7 are not on the same horizontal line; the areas where the first flexible circuit board 6 is bonded to the first bonding terminal group and the areas where the second flexible circuit board 7 is bonded to the first bonding terminal group are misaligned. Furthermore, as... Figure 6 and Figure 11 As shown, along the second direction X, the first fan-out area 6n and the second trace area 7m have a distance d1, wherein the first direction Y is perpendicular to the second direction X, and the second direction X is the extension direction of the selected side 11cc. In this way, the orthographic projection of the first flexible circuit board 6 on the display panel 1 and the orthographic projection of the second flexible circuit board 7 on the display panel 1 do not overlap.

[0111] By dividing the multiple bonding terminals 11a on the selected side 11cc of the non-display surface 11 of the display panel 1 into a first bonding terminal group 11aa and a second bonding terminal group 11ab, and then electrically connecting the two shorter first flexible circuit boards 6 and second flexible circuit boards 7 to the multiple bonding terminals 11a, for example, the first conductive contact 61b of the first flexible circuit board 6 is electrically connected to the bonding terminals 11a of the first bonding terminal group 11aa, and the second conductive contact 71b of the second flexible circuit board 7 is electrically connected to the bonding terminals 11a of the second bonding terminal group 11ab. Along the first direction Y, the entire area of ​​the first trace area 6m is closer to the selected side 11cc than the entire area of ​​the second trace area 7m. Along the second direction X, the first fan-out area 6n and the second trace area 7m have a distance d1. In this way, the first flexible circuit board 6 and the second flexible circuit board 7 are staggered and bonded on the non-display surface 11 of the display panel 1, so that the orthographic projection of the first flexible circuit board 6 on the display panel 1 and the orthographic projection of the second flexible circuit board 7 on the display panel 1 do not overlap, avoiding interference between the first flexible circuit board 6 and the second flexible circuit board 7. Moreover, the shorter length of the first flexible circuit board 6 and the second flexible circuit board 7 meets the single-sided process bonding tolerance requirements, which is convenient for the mass production of flexible circuit boards.

[0112] It should be noted that in the staggered binding of the first flexible circuit board 6 and the second flexible circuit board 7 on the non-display surface 11 of the display panel 1, "one up and one down" means that the position relatively closer to the selected side 11cc in the first direction Y is called "up", and the position relatively farther away from the selected side 11cc in the first direction Y is called "down".

[0113] In some embodiments, see again Figure 10In each flexible circuit board, the size of the fan-out area in the second direction is smaller than the size of the routing area in the second direction. Furthermore, the width of the fan-out area in the second direction X gradually decreases along the first direction Y, which moves further away from the selected side 11cc. Therefore, to achieve no overlap in the external shape of two flexible circuits, it is essential to ensure that the routing areas of the two flexible circuits do not overlap in external shape. In some examples, the side 6mb of the first routing area 6m that is further away from the selected side 11cc is closer to the selected side 11cc than the side 7mb of the second routing area 7m that is closer to the selected side 11cc. Compared to the side 7mb of the second routing area 7m, the side 6mb of the first routing area 6m that is further away from the selected side 11cc is closer to the selected side 11cc. For example, along the first direction Y, the distance d2 between the second routing area 7m and the first routing area 6m is greater than 1mm. That is, there is a gap 6mb between the side of the first routing area 6m away from the selected side 11cc and the side of the second routing area 7m close to the selected side 11cc in the first direction Y, and the gap is greater than 1mm. For example, along the first direction Y, the distance d2 between the second routing area 7m and the first routing area 6m is 1.2mm, or along the first direction Y, the distance d2 between the second routing area 7m and the first routing area 6m is 1.5mm.

[0114] By designing the distance d2 between the second wiring area 7m and the first wiring area 6m to be greater than 1mm, the first flexible circuit board 6 and the second flexible circuit board 7 can be bonded separately in the first direction Y without interference, so that the first flexible circuit board 6 and the second flexible circuit board 7 do not overlap in the first direction Y, thus achieving the purpose of no interference between the first flexible circuit board 6 and the second flexible circuit board 7.

[0115] In some embodiments, see again Figure 11 Along the second direction X, the shortest distance d1 between the first fan-out area 6n and the second routing area 7m is greater than 1 mm. For example, the first fan-out area 6n can be trapezoidal, and the second routing area 7m can be square. The hypotenuses of the square second routing area 7m and the trapezoidal first fan-out area 6n are not equidistant from each other in the second direction X, resulting in a shortest distance d1. Along the second direction X, the shortest distance d1 between the first fan-out area 6n and the second routing area 7m is the shortest distance between the two adjacent sides of the second routing area 7m and the first fan-out area 6n in the second direction X, and this shortest distance d1 is greater than 1 mm. For example, along the second direction X, the shortest distance d1 between the first fan-out area 6n and the second routing area 7m is 1.1 mm, or along the second direction X, the shortest distance d1 between the first fan-out area 6n and the second routing area 7m is 1.35 mm.

[0116] By designing the shortest distance d1 between the first fan-out area 6n and the second trace area 7m to be greater than 1mm, the first flexible circuit board 6 and the second flexible circuit board 7 can be bonded separately in the second direction X without interference, so that the first flexible circuit board 6 and the second flexible circuit board 7 do not overlap in the second direction X, thus achieving the purpose of no interference between the first flexible circuit board 6 and the second flexible circuit board 7.

[0117] In some embodiments, see again Figure 6 The first flexible circuit board 6, located closer to the selected side 11cc, is situated on the left side of the display panel 1, while the second flexible circuit board 7, located relatively farther from the selected side 11cc, is situated on the right side of the display panel 1. The left and right positions of the first flexible circuit board 6 and the second flexible circuit board 7 are not limited; in some examples, such as... Figure 12 and Figure 13 As shown, the first flexible circuit board 6, which is closer to the selected side 11cc, is located on the right side of the display panel 1, and the second flexible circuit board 7, which is relatively farther away from the selected side 11cc, is located on the left side of the display panel 1. The left and right positions of the first flexible circuit board 6 and the second flexible circuit board 7 are not limited, but the following conditions must be met: along the first direction Y, the first trace area 6m is closer to the selected side 11cc than the second trace area 7m; the side 6mb of the first trace area 6m that is farther away from the selected side 11cc is closer to the selected side 11cc than the side 7mb of the second trace area 7m that is closer to the selected side 11cc; and the distance d2 between the second trace area 7m and the first trace area 6m is greater than 1 mm. For example, the distance d2 between the second trace area 7m and the first trace area 6m is 1.05 mm. Meanwhile, along the second direction X, the shortest distance d1 between the first fan-out area 6n and the second routing area 7m is greater than 1mm. For example, the shortest distance d1 between the first fan-out area 6n and the second routing area 7m is 1.2mm.

[0118] In other embodiments, such as Figure 14 As shown, the two sides 11c of the non-display surface 11 are selected sides 11cc. The two selected sides 11cc are arranged opposite to each other on the non-display surface 11 of the display panel 1. The flexible circuit boards required for the two selected sides 11cc of the non-display surface 11 have high tolerance specifications. Therefore, the bonding terminals 11a of each selected side 11cc are divided into a first bonding terminal group 11aa and a second bonding terminal group 11ab. Figure 15As shown, the binding terminal 11a of the first binding terminal group 11aa of each selected side 11cc is connected to the first conductive contact 61b of the first flexible circuit board 6, and the binding terminal 11a of the second binding terminal group 11ab is electrically connected to the corresponding second conductive contact 71b. The left and right arrangement positions of the first flexible circuit board 6 and the second flexible circuit board 7 of each selected side 11cc are designed according to the design requirements, and will not be described in detail here.

[0119] In some other embodiments, such as Figure 16 As shown, the two sides 11c of the non-display surface 11 are selected sides 11cc. The two selected sides 11cc are arranged opposite to each other on the non-display surface 11 of the display panel 1. The flexible circuit board required for one of the selected sides 11cc of the non-display surface 11 has a higher tolerance specification, while the flexible circuit board required for the other selected side 11cc has a lower tolerance specification. Therefore, the bonding terminal 11a of the selected side 11cc with higher tolerance specification for the flexible circuit board can be divided into a first bonding terminal group 11aa and a second bonding terminal group 11ab. The bonding terminal 11a of the first bonding terminal group 11aa is connected to the first conductive contact 61b of the first flexible circuit board 6, and the bonding terminal 11a of the second bonding terminal group 11ab is electrically connected to the corresponding second conductive contact 71b. For flexible circuit boards with lower tolerance requirements, the bonding terminals 11a on the selected side 11cc are not divided. In this case, the bonding of the flexible circuit board 2 described above can be used as a reference. The spacing D1 between the bonding terminals 11a is relatively large. The conductive contact 1b on the long flexible circuit board 2 can be bonded to the bonding terminals 11a to complete the circuit connection.

[0120] In some embodiments, such as Figure 17 As shown, the display panel 1 also includes a display surface 12 and multiple side surfaces 14 connecting the display surface 12 and the non-display surface 11. Multiple side traces 13 are spaced apart on the side surface 14 near the selected side edge 11cc. Each side trace 13 extends to one end of the non-display surface 11 as one of multiple bonding terminals 11a. Therefore, the bonding terminal 11a on the selected side edge 11cc of the non-display surface 11 is part of the side trace 13. For example, the bonding terminal 11a is formed simultaneously with the side trace 13 using a single-sided process.

[0121] In some embodiments, see again Figure 7Multiple bonding terminals 11a extend along the first direction Y. The minimum length L3 of each bonding terminal 11a in the first bonding terminal group 11aa along its extension direction is less than the minimum length L4 of each bonding terminal 11a in the second bonding terminal group 11ab along its extension direction. Therefore, in order to achieve electrical connection between each first conductive contact 61b and a bonding terminal 11a of the first bonding terminal group 11aa, and between each second conductive contact 71b and a bonding terminal 11a of the second bonding terminal group 11ab, the shortest extension length of the bonding terminal 11a of the first bonding terminal group 11aa in the first direction Y is less than the shortest extension length of the bonding terminal 11a of the second bonding terminal group 11ab in the first direction Y.

[0122] In some embodiments, such as Figure 18A As shown, the non-display surface of the display panel 1 is further provided with a first adhesive film 81 and a second adhesive film 82. A plurality of first conductive contacts 61b correspond one-to-one with a plurality of bonding terminals 11a of the first bonding terminal group 11aa. The first adhesive film 81 is located between the plurality of first conductive contacts 61b and the first bonding terminal group 11aa, and is in direct contact with both. A plurality of second conductive contacts 71b correspond one-to-one with a plurality of bonding terminals 11a of the second bonding terminal group 11ab. The second adhesive film 82 is located between the plurality of second conductive contacts 71b and the second bonding terminal group 11ab, and is in direct contact with both. The first adhesive film 81 and the second adhesive film 82 extend along the second direction X, with the first adhesive film 81 closer to the selected side 11cc relative to the second adhesive film 82.

[0123] See again in some examples Figure 18A One side 11c of the non-display surface 11 is designated side 11cc. A first adhesive film 81 is coated on the bonding terminals 11a of the first bonding terminal group 11aa, corresponding to the bonding positions of the first conductive contact 61b. A second adhesive film 82 is coated on the bonding terminals 11a of the second bonding terminal group 11ab, corresponding to the bonding positions of the multiple second conductive contacts 71b. To achieve the connection between the multiple first conductive contacts 61b and the first bonding terminal group 11aa, and the connection between the multiple second conductive contacts 71b and the multiple bonding terminals 11a of the second bonding terminal group 11ab, the first adhesive film 81 and the second adhesive film 82 extend along the second direction X. The first adhesive film 81 is closer to the designated side 11cc than the second adhesive film 82. The structure of the display module 10 after connection is described again. Figure 6 As shown.

[0124] In some embodiments, such as Figure 18BAs shown, both the first adhesive film 81 and the second adhesive film 82 include a plurality of conductive microspheres 8a and an insulator 8b. The conductive microspheres 8a are embedded in the insulator 8b in a spaced manner. Both the conductive microspheres 8a and the insulator 8b in the first adhesive film 81 and the second adhesive film 82 have the characteristics of adhesion and deformation. For example, the first adhesive film 81 and the second adhesive film 82 can be anisotropic conductive adhesive films. The conductive microspheres 8a have a particle size of approximately 5 μm, and the density of the conductive microspheres 8a in the insulator 8b is 2*10⁻⁶. 5 pcs / mm 2 Left and right. For example, the conductive microsphere 8a has a structure with a surface including gold and nickel and an interior coated with resin. When the conductive microsphere 8a is subjected to a certain compressive force, it will be crushed, and the metal particles in the conductive microsphere 8a will be embedded in the conductive contact and / or bonding terminal, thereby realizing the electrical connection between the two.

[0125] In some embodiments, such as Figure 18C As shown, the first flexible circuit board 6 and the second flexible circuit board 7 are electrically connected to multiple bonding terminals 11a through the bonding and deformation characteristics of the conductive microspheres 8a and the insulator 8b of the first adhesive film 81 and the second adhesive film 82, as well as the conductivity of the conductive microspheres 8a. Exemplarily, after the conductive microspheres 8a between the bonding terminals 11a and the second conductive contact 71b in the second adhesive film 82 undergo hot-press deformation, the metal particles in the conductive microspheres 8a embed into the conductive contact and the bonding terminal, thereby achieving the electrical connection between the bonding terminals 11a and the second conductive contact 71b. The conductive microspheres 8a located between two adjacent bonding terminals (or second conductive contacts) in the second adhesive film 82 are not subjected to sufficient pressure and therefore will not be crushed. Thus, this part of the second adhesive film is non-conductive, and adjacent bonding terminals (or second conductive contacts) are electrically insulated. The structure and conductivity principle of the first adhesive film 81 can be referred to the second adhesive film 82, and will not be repeated here.

[0126] It should be noted that, in order to achieve the staggered bonding of the first flexible circuit board 6 and the second flexible circuit board 7 on the non-display surface 11 of the display panel 1, the first adhesive film 81 is closer to the selected side 11cc relative to the second adhesive film 82. At the same time, the shortest extension length of the multiple bonding terminals 11a of the second bonding terminal group 11ab in the first direction Y is greater than the shortest extension length of the multiple bonding terminals 11a of the second bonding terminal group 11ab in the first direction Y.

[0127] In other examples, such as Figure 19As shown, the two sides 11c of the non-display surface 11 are selected sides 11cc. The binding terminals 11a of the first binding terminal group 11aa of each selected side 11cc are used to connect to the first conductive contact 61b of a first flexible circuit board 6. The binding terminals 11a of the second binding terminal group 11ab are used to connect to a corresponding second conductive contact 71b. The binding terminals 11a of the first binding terminal group 11aa of each selected side 11cc are coated with a first adhesive film 81 at the binding positions of the first conductive contact 61b and the first binding terminal 11a. The multiple binding terminals 11a of the second binding terminal group 11ab are coated with a second adhesive film 82 at the binding positions of the multiple second conductive contacts 71b. The structure of the connected display module 10 is described again. Figure 15 Furthermore, the first adhesive film 81 at each selected side 11cc is closer to the selected side 11cc than the second adhesive film 82.

[0128] In some other examples, such as Figure 20 As shown, the two sides 11c of the non-display surface 11 are selected sides 11cc. The two selected sides 11cc are arranged opposite to each other on the non-display surface 11 of the display panel 1. One of the selected sides 11cc of the non-display surface 11 requires a flexible circuit board with higher tolerance specifications, while the other selected side 11cc requires a flexible circuit board with lower tolerance specifications. Therefore, the bonding terminals 11a of the selected side 11cc with higher tolerance specifications for the flexible circuit board can be divided into a first bonding terminal group 11aa and a second bonding terminal group 11ab. The bonding terminals 11a of the first bonding terminal group 11aa are used to make one-to-one electrical connections with the first conductive contact 61b of the first flexible circuit board 6, and the bonding terminals 11a of the second bonding terminal group 11ab are used to make one-to-one electrical connections with the corresponding second conductive contact 71b. For flexible circuit boards with lower tolerance requirements, the bonding terminal 11a on the selected side 11cc is not divided. A conductive contact 1b on the longer flexible circuit board 2 can be used to connect to the bonding terminal 11a. The structure of the connected display module 10 is described again. Figure 16 For example, the first bonding terminal 11a of the first bonding terminal group 11aa is coated with a first adhesive film 81 corresponding to the first conductive contact 61b, the multiple bonding terminals 11a of the second bonding terminal group 11ab are coated with a second adhesive film 82 corresponding to the multiple second conductive contacts 71b, and the bonding terminal 11a for connecting with the conductive contact 1b of the flexible circuit board 2 is coated with a third adhesive film 83 corresponding to the conductive contact 1b of the flexible circuit board 2.

[0129] In some embodiments, see again Figure 18A , Figure 19 and Figure 20For the extension lengths of the first adhesive film 81 and the second adhesive film 82 in the second direction X, the overall length of the first adhesive film 81 is approximately the same as the arrangement length of the plurality of bonding terminals 11a of the first bonding terminal group 11aa in the second direction X, and the overall length of the second adhesive film 82 is approximately the same as the arrangement length of the plurality of bonding terminals 11a of the second bonding terminal group 11ab in the second direction X, ensuring that each bonding terminal 11a is coated with an adhesive film layer. Similarly, the extension length of the third adhesive film 83 in the second direction X is approximately the same as the arrangement length of the plurality of bonding terminals 11a of the selected side 11cc to which it is coated, ensuring that each bonding terminal 11a is coated with an adhesive film layer.

[0130] In some embodiments, see again Figure 18A The widths of the first adhesive film 81 and the second adhesive film 82 in the first direction Y range from 1 mm to 1.5 mm. For example, the widths of the first adhesive film 81 and the second adhesive film 82 in the first direction Y are 1 mm. Alternatively, the width of the first adhesive film 81 in the first direction Y is 1.2 mm, and the width of the second adhesive film 82 in the first direction Y is 1.5 mm.

[0131] In some embodiments, such as Figure 21 As shown, at least one alignment mark 15 is also provided on the non-display surface 11 of the display panel 1. The at least one alignment mark 15 is used for the connection and alignment of multiple first conductive contacts 61b with multiple binding terminals 11a of the first binding terminal group 11aa, and multiple second conductive contacts 71b with multiple binding terminals 11a of the second binding terminal group 11ab. In the process of manufacturing the display module 10, it is necessary to achieve the connection of the first conductive contacts 61b and the second conductive contacts 71b with the corresponding binding terminals 11a. It is necessary to use the identification of the alignment mark 15 to complete the accurate alignment of the flexible circuit board when attaching it.

[0132] In some embodiments, see again Figure 21 The alignment mark 15 includes a marking pattern 15a and a clearance area 15b surrounding the marking pattern 15a. The clearance area 15b is insulated from its outer perimeter, and the alignment mark 15 is spaced apart from adjacent bonding terminals to achieve insulation between the clearance area 15b and its outer perimeter. The marking pattern 15a can be either circular or cross-shaped, and the clearance area 15b can be either circular or square. In some examples, such as... Figure 21As shown, the marking pattern 15a is circular, and the clearance area 15b surrounding the marking pattern 15a is square. A distance d4 exists between the clearance area 15b and its adjacent bonding terminal 11a, ensuring that the clearance area 15b is insulated from its surrounding area, preventing the surrounding lines from affecting identification and alignment, and improving alignment accuracy. When the clearance area 15b is square, its side length is greater than 300 μm; for example, the side length of the clearance area 15b is 350 μm.

[0133] In some examples, such as Figure 22 As shown, the marking pattern 15a is cross-shaped, and the clearance area 15b surrounding the marking pattern 15a is circular. When the clearance area 15b is circular, the diameter of the clearance area 15b is greater than 300μm. For example, the diameter of the clearance area 15b is 320μm.

[0134] It should be noted that the shape of the marking pattern 15a can be selected as a circle, a cross, or other shapes as needed, and the clearance area 15b can be a circle, a square, or other shapes, as long as it has a recognizable alignment function.

[0135] Additionally, it should be noted that in order to... Figure 21 and Figure 22 The approximate structure and position of the alignment mark 15 can be clearly shown in the image, and the alignment mark 15 is enlarged.

[0136] In some embodiments, such as Figure 23 As shown, at least one alignment mark 15 includes a plurality of alignment marks 15, and the plurality of alignment marks 15 include a first group of alignment marks 151, a second group of alignment marks 152 and a third group of alignment marks 153 arranged at intervals along the first direction Y.

[0137] In some embodiments, such as Figure 24 As shown, the first wiring area 6m of the first flexible circuit board 6 includes a first bonding area 6m1 and a first alignment area 6m2 arranged along the first direction Y. The first alignment area 6m2 is connected to the first fan-out area 6n, and a plurality of first conductive contacts 61b are disposed within the first bonding area 6m1. The second wiring area 7m of the second flexible circuit board 7 includes a second bonding area 7m1 and a second alignment area 7m2 arranged along the first direction Y. The second alignment area 7m2 is connected to the second fan-out area 7n, and a plurality of second conductive contacts 71b are disposed within the second bonding area 7m1.

[0138] In some embodiments, see again Figure 23The first set of alignment marks 151 includes a first sub-alignment mark 151a and a second sub-alignment mark 151b. The marking patterns 15a of the first sub-alignment mark 151a and the marking patterns 15a of the second sub-alignment mark 151b are located within the orthographic projection of the first alignment area 6m2 onto the non-display surface 11. The marking patterns 15a of the first sub-alignment mark 151a and the marking patterns 15a of the second sub-alignment mark 151b are symmetrically arranged with respect to the centerline Y1 of the orthographic projection of the first alignment area 6m2 onto the non-display surface 11 in the first direction Y. For example, the marking patterns 15a of the first sub-alignment mark 151a and the marking patterns 15a of the second sub-alignment mark 151b are located near both ends of the first alignment area 6m2 along the second direction X within the orthographic projection of the non-display surface 11. The first sub-alignment mark 151a is closer to the side 11c of the non-display surface 11 than the second sub-alignment mark 151b.

[0139] In some embodiments, such as Figure 23 As shown, the second set of alignment marks 152 includes a third sub-alignment mark 152a, a fourth sub-alignment mark 152b, and a fifth sub-alignment mark 152c. The marking patterns 15a of the third sub-alignment mark 152a and the fourth sub-alignment mark 152b are located within the orthographic projection of the second alignment area 7m2 onto the non-display surface 11, and the marking patterns 15a of the third sub-alignment mark 152a and the fourth sub-alignment mark 152b are symmetrically arranged with respect to the centerline Y2 of the orthographic projection of the second alignment area 7m2 onto the non-display surface 11 in the first direction Y. The fourth sub-alignment mark 152b is closer to the side 11c of the non-display surface 11 than the third sub-alignment mark 152a. The center of the fifth sub-alignment mark 152c is on the same straight line as the center of the third sub-alignment mark 152a and the center of the fourth sub-alignment mark 152b along the second direction X. The mark pattern 15a of the fifth sub-alignment mark 152c is located on one side of the orthographic projection of the first fan-out area 6n onto the non-display surface 11 along the second direction X.

[0140] In some embodiments, see again Figure 23 The third set of alignment marks 153 includes a sixth sub-alignment mark 153a and a seventh sub-alignment mark 153b. The sixth sub-alignment mark 153a and the seventh sub-alignment mark 153b are symmetrically arranged with respect to the center line Y3 of the non-display surface 11 in the second direction X. The marking pattern 15a of the seventh sub-alignment mark 153b is located on one side of the orthographic projection of the second fan-out area 7n onto the non-display surface 11 along the second direction Y.

[0141] When bonding the flexible circuit board to the bonding terminal 11a, see again in some examples. Figure 23 and Figure 18AThe first bonding terminal group 11aa has a first adhesive film 81 coated on its bonding terminals 11a, corresponding one-to-one with the first conductive contact 61b. The second bonding terminal group 11ab has multiple bonding terminals 11a coated with a second adhesive film 82, corresponding one-to-one with the multiple second conductive contacts 71b. Alignment is performed before coating using a sixth sub-alignment mark 153a and a seventh sub-alignment mark 153b. The sixth sub-alignment mark 153a and the seventh sub-alignment mark 153b are symmetrically arranged relative to the centerline Y3 of the non-display surface 11 in the second direction X. Therefore, the sixth sub-alignment mark 153a and the seventh sub-alignment mark 153b can serve to identify the alignment. Since the fourth sub-alignment mark 152b and the fifth sub-alignment mark 152c are also symmetrically arranged relative to the center line Y3 of the non-display surface 11 in the second direction X, and since the alignment mark 15 is more accurate in identifying and aligning the area closer to the coating area, the fourth sub-alignment mark 152b and the fifth sub-alignment mark 152c can be used for alignment before coating the first adhesive film 81 and the second adhesive film 82. Therefore, it can be understood that a pair of alignment marks 15 symmetrically arranged relative to the center line Y3 of the non-display surface 11 in the second direction X can be used for coating the adhesive film.

[0142] See again in some examples Figure 23 By identifying and aligning the third sub-alignment mark 152a and the fourth sub-alignment mark 152b, the one-to-one alignment of the second conductive contact 71b of the second flexible circuit board 7 with the binding terminal 11a of the second binding terminal group 11ab is completed. Therefore, it can be understood that a pair of alignment marks symmetrically arranged relative to the center line Y2 of the non-display surface 11 on the first direction Y, i.e., the third sub-alignment mark 152a and the fourth sub-alignment mark 152b, can be used for the alignment and placement of the second flexible circuit board 7.

[0143] See again in some examples Figure 23 By identifying the alignment of the first sub-alignment mark 151a and the second sub-alignment mark 151b, the one-to-one alignment of the first conductive contact 61b of the first flexible circuit board 6 with the binding terminal 11a of the first binding terminal group 11aa is completed. Therefore, it can be understood that a pair of alignment marks symmetrically arranged relative to the center line Y1 of the non-display surface 11 on the first direction Y, i.e., the first sub-alignment mark 151a and the second sub-alignment mark 151b, can be used for the alignment and placement of the first flexible circuit board 6.

[0144] See again in some examples Figure 23 A pair of alignment marks 15, symmetrically arranged relative to the non-display surface 11 along the centerline Y3 in the second direction X, pre-press and bond the first flexible circuit board 6 and the second flexible circuit board 7. See again Figure 18CIn the space corresponding to the first conductive contact 61b, the second conductive contact 71b, and the bonding terminal 11a in the direction perpendicular to the non-display surface 11 of the display panel 1, the conductive microspheres 8a in the adhesive film are crushed, and the metal particles in the conductive microspheres 8a are embedded in the first conductive contact 61b, the second conductive contact 71b, or the bonding terminal 11a, thereby achieving electrical connection between them. It should be noted that since the attached second flexible circuit board 7 covers the fourth sub-alignment mark 152b, the pair of alignment marks 15 symmetrically arranged relative to the center line Y3 in the second direction X of the non-display surface 11 are the sixth sub-alignment mark 153a and the seventh sub-alignment mark 153b. Therefore, the alignment system is aligned by the sixth sub-alignment mark 153a and the seventh sub-alignment mark 153b, so that the first flexible circuit board 6 and the second flexible circuit board 7 can be stably and firmly connected by hot pressing within a temperature range of 130℃-150℃.

[0145] In some embodiments, such as Figure 25 As shown, the two sides 11c of the non-display surface 11 are designated sides 11cc. One of the designated sides 11cc requires a flexible circuit board with higher tolerance specifications, while the other designated side 11cc requires a flexible circuit board with lower tolerance specifications. Therefore, the designated side 11cc with higher tolerance specifications for the flexible circuit board can be configured with the first set of alignment marks 151, the second set of alignment marks 152, and the third set of alignment marks 153 as described above, to achieve the binding connection between the first flexible circuit board 6, the second flexible circuit board 7, and the display panel 1. Further details are omitted here. For the designated side 11cc with lower tolerance specifications for the flexible circuit board, corresponding alignment marks 15 can be set for identification and alignment, achieving accurate alignment and binding between the flexible circuit board and the display panel.

[0146] See again in some examples Figure 25The tolerance of the longer third flexible circuit board 8 meets the bonding requirements of one of the selected side edges 11cc. The third flexible circuit board 8 includes a third bonding area 8m1 and a third alignment area 8m2 arranged along the first direction Y. The third bonding area 8m1 is close to the selected side edge 11cc to be bonded. Multiple third conductive contacts 81b are provided in the third bonding area 8m1, and the third conductive contacts 81b are used to connect with the bonding terminals 11a of the selected side edge 11cc to be bonded. A fourth set of alignment marks 154 and a fifth set of alignment marks 155 are arranged at intervals along the first direction Y for the identification, alignment and bonding of the third flexible circuit board 8. The fourth set of alignment marks 154 includes an eighth sub-alignment mark 154a and a ninth sub-alignment mark 154b spaced apart along the second direction X. The marking patterns 15a of the eighth sub-alignment mark 154a and the marking patterns 15a of the ninth sub-alignment mark 154b are located within the orthographic projection of the third alignment area 8m2 onto the non-display surface 11, and the marking patterns 15a of the eighth sub-alignment mark 154a and the marking patterns 15a of the ninth sub-alignment mark 154b are symmetrically arranged with respect to the centerline Y3 of the non-display surface 11 in the second direction X. The fifth set of alignment marks 155 includes a tenth sub-alignment mark 155a and an eleventh sub-alignment mark 155b. The tenth sub-alignment mark 155a and the eleventh sub-alignment mark 155b are symmetrically arranged with respect to the centerline Y3 of the non-display surface 11 in the second direction X, and the tenth sub-alignment mark 155a and the eleventh sub-alignment mark 155b do not coincide with the orthographic projection of the third flexible circuit board 8 onto the non-display surface 11.

[0147] See again in some examples Figure 25 Since the eighth sub-alignment mark 154a, the ninth sub-alignment mark 154b, the tenth sub-alignment mark 155a, and the eleventh sub-alignment mark 155b are all symmetrically arranged relative to the centerline Y3 of the non-display surface 11 in the second direction X, the eighth sub-alignment mark 154a, the ninth sub-alignment mark 154b, the tenth sub-alignment mark 155a, and the eleventh sub-alignment mark 155b can all be used for the attachment and alignment of the third adhesive film 83. The attachment position of the third adhesive film 83 is detailed in [reference needed]. Figure 20As shown, details will not be repeated here. Since the closer to the coating area, the more accurate the identification and alignment of the alignment mark 15, the eighth sub-alignment mark 154a and the ninth sub-alignment mark 154b can be used for alignment before coating the third adhesive film 83. Since the marking pattern 15a of the eighth sub-alignment mark 154a and the marking pattern 15a of the ninth sub-alignment mark 154b are located within the orthographic projection of the third alignment area 8m2 onto the non-display surface 11, the third flexible circuit board 8 will block the alignment system from identifying the marking pattern 15a of the eighth sub-alignment mark 154a and the marking pattern 15a of the ninth sub-alignment mark 154b when attaching the third flexible circuit board 8. Therefore, the tenth sub-alignment mark 155a and the eleventh sub-alignment mark 155b, which do not coincide with the orthographic projection of the third flexible circuit board 8 onto the non-display surface 11, are used for the identification and alignment of the third flexible circuit board 8, and pre-pressing and main pressing are performed to achieve the alignment and binding of the third flexible circuit board 8.

[0148] It is understandable that when the first flexible circuit board 6 and the second flexible circuit board 7 need to be swapped in the second direction X, the alignment marks 151, 152, and 153 of each group are set to their corresponding positions, which will not be elaborated here. When the two sides 11c of the non-display surface 11 are selected sides 11cc, and the tolerance specifications of the flexible circuit boards required for the two selected sides 11cc of the non-display surface 11 are both high, the alignment marks are set in conjunction with the first flexible circuit board 6 and the second flexible circuit board 7 that need to be bound, which will not be elaborated here.

[0149] Some embodiments of this disclosure also provide a display device 100, such as Figure 26 As shown, the display device 100 includes the aforementioned display module 10. The display device 100 also includes a driver 1001 electrically connected to the display module 10. The driver 1001 is disposed on the non-display surface 11 side of the display panel 1. A plurality of third conductive contacts 661b and a plurality of fourth conductive contacts 771b of the second flexible circuit board 7 are electrically connected to the driver 1001 respectively. The driver 1001 is used to transmit signals to the display device 100.

[0150] The beneficial effects of the above-described display device 100 are the same as those of the display module 10 provided in the first aspect of this disclosure, and will not be repeated here.

[0151] Some embodiments of this disclosure also provide a method for manufacturing a display module, which is used to manufacture the display module 10 described above. For example... Figure 27 As shown, the preparation method includes:

[0152] S1. Create the initial display panel 1", as shown below Figure 28As shown, the non-display surface 11 of the initial display panel 1” includes a plurality of sides 11c, wherein at least one side 11c is a selected side 11cc.

[0153] The aforementioned initial display panel 1" refers to a display panel with a display surface 12 film layer, which includes all signal lines, power lines, control lines, etc.

[0154] S2. Multiple bonding terminals 11a are formed on the non-display surface 11. See again. Figure 7 Multiple binding terminals 11a are arranged sequentially and spaced apart along a selected side 11cc; the multiple binding terminals 11a are divided into a first binding terminal group 11aa and a second binding terminal group 11ab, the first binding terminal group 11aa includes a part of the multiple binding terminals 11a, and the second binding terminal group 11ab includes another part of the multiple binding terminals 11a.

[0155] It should be noted that after the above-mentioned initial display panel 1” forms multiple bonding terminals 11a, it serves as the display panel 1 of this disclosure.

[0156] In some embodiments, see again Figure 7 One side 11c of the display panel 1 is a selected side 11cc, and multiple bonding terminals 11a are formed on the selected side 11cc of the non-display surface 11 of the display panel 1.

[0157] S3. Electrically connect the first flexible circuit board 6 and the second flexible circuit board 7 to multiple bonding terminals 11a, such as... Figure 6 and Figure 8 As shown, the first flexible circuit board 6 includes a first trace area 6m and a first fan-out area 6n connected to each other. The first trace area 6m is closer to a selected side 11cc than the first fan-out area 6n. Multiple first conductive contacts 61b are spaced apart within the first trace area 6m, and each first conductive contact 61b is electrically connected to a bonding terminal 11a of the first bonding terminal group 11aa. (See diagram below.) Figure 6 and Figure 9 As shown, the second flexible circuit board 7 includes a second trace area 7m and a second fan-out area 7n connected to each other. The second trace area 7m is closer to the selected side 11cc than the second fan-out area 7n. A plurality of second conductive contacts 71b are spaced apart in the second trace area 7m. Each second conductive contact 71b is electrically connected to a bonding terminal 11a of the second bonding terminal group 11ab to form the display module 10.

[0158] For example, the structure of the display module 10 is as follows Figure 6 As shown.

[0159] In some embodiments, such as Figure 6 and Figure 10As shown, along the first direction Y, the first routing area of ​​6m is 11cc closer to the selected side edge than the second routing area of ​​7m. See again. Figure 10 The entire 6m area of ​​the first routing zone is 11cc closer to the selected side edge than the entire 7m area of ​​the second routing zone. Furthermore, as... Figure 6 and Figure 11 As shown, along the second direction X, the first fan-out area 6n and the second trace area 7m have a distance d1 between them. The first direction Y is perpendicular to the second direction X, and the second direction X is the extension direction of the selected side 11cc. The orthographic projection of the first flexible circuit board 6 on the display panel 1 does not overlap with the orthographic projection of the second flexible circuit board 7 on the display panel 1.

[0160] After the aforementioned initial display panel 1” forms multiple bonding terminals 11a, it serves as the display panel 1 of this disclosure, such as Figure 29 and Figure 30 As shown, the process steps for manufacturing the initial display panel 1” include:

[0161] S11. Applying a film: attaching a film material 9 to the display surface 12 and non-display surface 11 of the initial display panel 1". For example, the material of the film material 9 can be polymethyl methacrylate.

[0162] S12. First laser film cutting: Laser is used to cut the film material 9 attached to the display surface 12 and non-display surface 11 of the initial display panel 1”, exposing the edge of the display surface 12 and non-display surface 11 connected to one side 14 of the initial display panel 1”.

[0163] S13. Process edge cutting: Process edge 141 cutting is performed on the side 14 of the initial display panel 1”.

[0164] S14. Grinding: Grind the above-mentioned process edge 141 to form a chamfer.

[0165] S15. Cleaning: Clean the initial display panel 1” after the above-mentioned polishing process 141.

[0166] S16. Secondary film application: Apply film material 9 to the display surface 12 of the initial display panel 1” for the second time, and apply a protective film 91 with a certain design shape to the non-display surface 11 of the initial display panel 1”. For example, the material of the protective film 91 can be polymethyl methacrylate.

[0167] S17. Second laser cutting: The second film material 9 attached to the display surface 12 of the initial display panel 1” is cut to expose the pads of the display surface 12 for connection with the driving circuit.

[0168] S18. Laser cleaning: Perform laser cleaning on the initial display panel 1” to remove submicron-level contaminant particles from the surface of the initial display panel 1”.

[0169] In some embodiments, before the plurality of bonding terminals 11a are formed on the non-display surface 11, such as Figure 31 As shown, it also includes the following steps:

[0170] S01, forming a protective film 91 with the target shape, such as Figure 32 As shown, the protective film 91 includes a first portion 91a and a second portion 91b arranged along a third direction Z. The first portion 91a has a larger dimension along a fourth direction T than the second portion 91b along the fourth direction T. Along the fourth direction T, the first portion 91a and the second portion 91b are flush at the same end. See again, for example. Figure 32 In the example view of the front of the protective film 91, the lower ends of the first part 91a and the second part 91b are flush. Figure 32 and Figure 33 As shown, the maximum dimension L1 of the protective film 91 along the third direction Z is greater than or equal to the dimension L2 of the non-display surface 11 along the second direction X. It should be noted that the second direction X is the extension direction of the selected side 11cc, the direction perpendicular to the second direction X is the first direction Y, and the third direction Z is perpendicular to the fourth direction T.

[0171] S02. Attach the protective film 91 to the target position on the non-display surface 11 of the initial display panel 1”. See again. Figure 33 The first part 91a and the second part 91b are arranged in a direction parallel to the extension direction of the selected side 11cc. The flush ends of the first part 91a and the second part 91b are far away from the selected side 11cc. The first part 91a and the second part 91b have a set distance from the selected side 11cc. The first part 91a has a set distance d5 from the selected side 11cc, and the second part 91b has a set distance d6 from the selected side 11cc.

[0172] See again in some examples Figure 33 The first part 91a and the selected side 11cc have a distance d5 of 3mm, and the second part 91b and the selected side 11cc have a distance d6 of 8mm.

[0173] In some embodiments, such as Figure 34 As shown, based on the protective film 91, a metal layer 133 is formed at least on the non-display surface 11. See again. Figure 30 and Figure 31 The specific steps for forming the metal layer 133 include:

[0174] S21. Sputter metal onto the side 14 of the initial display panel 1” and the edges of the display surface 12 and non-display surface 11 connected to the side 14 to form a metal layer 133.

[0175] The metal layer 133 covers the side 14, the area of ​​the display surface near the side 14 and the area of ​​the non-display surface 11 near the side 14 and exposed by the protective film 91. Exemplarily, the metal layer can be sputtered and deposited using electroplating, vapor deposition, pad printing silver paste, sputtering (e.g., multi-arc magnetron sputtering).

[0176] In some embodiments, see again Figure 30 and Figure 31 The process of forming multiple bonding terminals 11a on the non-display surface 11 includes the above-described step S21, and also includes:

[0177] S22. Etch the metal layer 133, such as... Figure 35 As shown, a plurality of bonding terminals 11a are formed on the non-display surface 11. For example, see again Figure 7 The boundary line between the first part 91a and the second part 91b of the protective film 91 serves as the boundary, and the multiple binding terminals 11a are divided into the first binding terminal group 11aa and the second binding terminal group 11ab.

[0178] In some embodiments, such as Figure 36 As shown, the initial display panel 1” also includes a display surface 12 and multiple side surfaces 14 connecting the display surface 12 and the non-display surface 11. Etching the metal layer 133 includes etching the metal layer located on the side surfaces 14, the area of ​​the display surface near the side surfaces 14, and the area of ​​the non-display surface 11 near the side surfaces 14 and exposed by the protective film 91, thereby forming multiple side traces spaced apart. One end of each side trace extends to the display surface, and the other end extends to the non-display surface. The end of each side trace extending to the non-display surface serves as one of the multiple bonding terminals. It is understood that after etching the metal layer 133, an organic resin layer can be used to protect the side traces, except for the area to be bonded to the flexible circuit board. The organic resin can be dark in color, such as black, green, or brown, or it can be transparent or white.

[0179] In the portion of the metal layer 133 located on the non-display surface, based on the target shape of the protective film 91, with the boundary line between the first portion 91a and the second portion 91b of the protective film 91 as the boundary, along the first direction Y, the size of the metal layer on one side of the boundary line is smaller than the size of the metal layer on the other side of the boundary line. As a result, after etching the metal layer 133, the size of the bonding terminals formed in the first direction Y is different. That is to say, the length of each side trace extending to one end of the non-display surface is different. For example, the length of the bonding terminal in the first bonding terminal group 11aa is smaller than the length of the bonding terminal in the second bonding terminal group 11ab.

[0180] In some embodiments, at least one alignment mark 15 is also provided on the non-display surface 11, see again Figure 35 At least one alignment mark 15 includes a plurality of alignment marks 15. The plurality of alignment marks 15 include a first group of alignment marks 151, a second group of alignment marks 152 and a third group of alignment marks 153 arranged at intervals along a first direction Y. The first group of alignment marks 151 includes a first sub-alignment mark 151a and a second sub-alignment mark 151b. The second group of alignment marks 152 includes a third sub-alignment mark 152a, a fourth sub-alignment mark 152b and a fifth sub-alignment mark 152c. The third group of alignment marks 153 includes a sixth sub-alignment mark 153a and a seventh sub-alignment mark 153b.

[0181] In some embodiments, see again Figure 21 The alignment mark 15 includes a marking pattern 15a and a clearance area 15b surrounding the marking pattern 15a, the clearance area 15b being insulated from its outer perimeter. The marking pattern 15a can be either circular or cross-shaped, and the clearance area 15b can be either circular or square. In some examples, such as... Figure 21 As shown, the marking pattern 15a is circular, and the clearance area 15b surrounding the marking pattern 15a is square. There is a gap d4 between the clearance area 15b and its adjacent binding terminal 11a, so that the clearance area 15b is insulated from the outer area of ​​the clearance area 15b, preventing the surrounding lines from affecting identification and alignment, and improving the accuracy of alignment.

[0182] See again in some examples Figure 22 The marking pattern 15a is cross-shaped, and the clearance area 15b surrounding the marking pattern 15a is circular.

[0183] In some embodiments, see again Figure 24The first flexible circuit board 6 has a first trace area 6m including a first bonding area 6m1 and a first alignment area 6m2 arranged along the first direction Y. The first alignment area 6m2 is connected to the first fan-out area 6n. A plurality of first conductive contacts 61b are disposed within the first bonding area 6m1. The second flexible circuit board 7 has a second trace area 7m including a second bonding area 7m1 and a second alignment area 7m2 arranged along the first direction Y. The second alignment area 7m2 is connected to the second fan-out area 7n. A plurality of second conductive contacts 71b are disposed within the second bonding area 7m1.

[0184] The positional relationships between the first sub-alignment mark 151a, the second sub-alignment mark 151b, the third sub-alignment mark 152a, the fourth sub-alignment mark 152b, the fifth sub-alignment mark 152c, the sixth sub-alignment mark 153a, and the seventh sub-alignment mark 153b and the first flexible circuit board 6 and the second flexible circuit board 7 can be referred to the previous description and will not be repeated here.

[0185] The method for manufacturing the display module also includes the step of forming multiple alignment marks 15, and determining the target positions of the multiple alignment marks 15 based on the positional relationship between the multiple alignment marks 15 and the subsequently bonded first flexible circuit board 6 and second flexible circuit board 7.

[0186] In some embodiments, during the step of forming the protective film 91 having the target shape, see again... Figure 32 The protective film 91 includes a first cutout area 911, a second cutout area 912, and a third cutout area 913. The first cutout area 911, the second cutout area 912, and the third cutout area 913 correspond to the positions of the fifth sub-alignment mark 152c, the sixth sub-alignment mark 153a, and the seventh sub-alignment mark 153b, respectively.

[0187] In step S02, where the protective film 91 is affixed to the target position on the non-display surface 11 of the initial display panel 1", please refer again to... Figure 33 This exposes portions of the first cutout area 911, the second cutout area 912, and the third cutout area 913 of the protective film 91 corresponding to the non-display surface 11.

[0188] Based on the protective film 91, in step S21, at least on the non-display surface 11, a metal layer 133 is formed. See again... Figure 34 The metal layer 133 also covers portions of the non-display surface 11 that expose the first cutout area 911, the second cutout area 912, and the third cutout area 913 corresponding to the protective film 91. It should be noted that during the metal sputtering process, a small amount of metal may also remain on the surface of the protective film 91. Figure 34 For ease of illustration, the metal layer is not shown on the surface of the protective film 91. The metal layer 133 in this disclosure refers only to the metal layer located on the non-display surface. The protective film will be removed in subsequent processes; therefore, the pattern of the metal layer 133 is not shown. Figure 34 The consistency shown in the diagram.

[0189] In some embodiments, in step S22, where the metal layer 133 is etched to form a plurality of bonding terminals 11a on the non-display surface 11, see again... Figure 35 Simultaneously, the first sub-alignment mark 151a, the second sub-alignment mark 151b, the third sub-alignment mark 152a, the fourth sub-alignment mark 152b, the fifth sub-alignment mark 152c, the sixth sub-alignment mark 153a, and the seventh sub-alignment mark 153b are formed. For example, when editing the desired etching pattern in a laser etching apparatus, and multiple bonding terminals 11a are involved, the first sub-alignment mark 151a, the second sub-alignment mark 151b, the third sub-alignment mark 152a, the fourth sub-alignment mark 152b, the fifth sub-alignment mark 152c, the sixth sub-alignment mark 153a, and the seventh sub-alignment mark 153b are formed simultaneously.

[0190] In some embodiments, see again Figure 23 In step S3, which electrically connects the first flexible circuit board 6 and the second flexible circuit board 7 to multiple bonding terminals 11a, the first flexible circuit board 6 and the second flexible circuit board 7 are aligned with the multiple bonding terminals 11a according to the first set of alignment marks 151, the second set of alignment marks 152, and the third set of alignment marks 153, and then electrically connected to the multiple bonding terminals 11a. Specifically, according to the fourth sub-alignment mark 152b and the fifth sub-alignment mark 152c, a first adhesive film 81 is applied to the target position of the first bonding terminal group 11aa, and a second adhesive film 82 is applied to the target position of the second bonding terminal group 11ab. The first flexible circuit board 6 and the first bonding terminal group 11aa are connected through the first adhesive film 81. The second flexible circuit board 7 and the second bonding terminal group 11ab are connected through the second adhesive film 82. The first adhesive film 81 and the second adhesive film 82 extend along the second direction X, with the first adhesive film 81 closer to the selected side 11cc relative to the second adhesive film 82.

[0191] In some embodiments, after etching the metal layer 133 and before the step of electrically connecting the first flexible circuit board 6, the second flexible circuit board 7, and the plurality of bonding terminals 11a, the protective film 91 is peeled off from the non-display surface 11 to obtain a structure as shown. Figure 37 The display panel 1 is shown. The structure of the bonding terminal 11a and the alignment mark 15 on the display panel 1 is as described above, and will not be repeated here.

[0192] In some embodiments, see again Figure 25Two sides 11c of the non-display surface 11 are designated sides 11cc. One of the designated sides 11cc requires a flexible circuit board with higher tolerance specifications, while the other designated side 11cc requires a flexible circuit board with lower tolerance specifications. Therefore, the designated side 11cc with higher tolerance specifications for the flexible circuit board can be equipped with a first set of alignment marks 151, a second set of alignment marks 152, and a third set of alignment marks 153 as described above, to achieve the bonding connection between the first flexible circuit board 6, the second flexible circuit board 7, and the display panel 1. The specific manufacturing method has been described above and will not be repeated here. For the designated side 11cc with lower tolerance specifications for the flexible circuit board, corresponding alignment marks 15 can be set for identification and alignment, achieving accurate alignment and bonding between the flexible circuit board and the display panel. For example, see again... Figure 25 The tolerance of the longer third flexible circuit board 8 meets the binding requirements of one of the selected side edges 11cc. The binding of the third flexible circuit board 8 can be performed using the fourth set of alignment marks 154 (eighth sub-alignment mark 154a and ninth sub-alignment mark 154b) and the fifth set of alignment marks 155 (tenth sub-alignment mark 155a and eleventh sub-alignment mark 155b), which can be referred to the previous description and will not be repeated here.

[0193] In some embodiments, such as Figure 25 As shown, the two sides 11c of the non-display surface 11 are selected sides 11cc. If one of the selected sides 11cc of the non-display surface 11 requires a flexible circuit board with higher tolerance specifications, while the other selected side 11cc requires a flexible circuit board with lower tolerance specifications, the fabrication method of the display panel 1 is as follows: Figure 31 As shown, this will not be repeated here. The difference is that for the selected side 11cc, which has lower tolerance requirements for flexible circuit boards, step S01, which forms a protective film 91' with the target shape, is as follows: Figure 38 As shown, the protective film 91' includes a fourth cutout area 91'4 and a fifth cutout area 91'5, which correspond to the positions of the tenth sub-alignment mark 155a and the eleventh sub-alignment mark 155b, respectively. The maximum dimension L3 of the protective film 91' along the third direction Z is greater than or equal to the dimension L2 of the non-display surface 11 along the second direction X.

[0194] In step S02, the protective film 91' is attached to the target position of the non-display surface 11 of the initial display panel 1", as follows: Figure 39 As shown, portions of the first cutout area 911, the second cutout area 912, and the third cutout area 913 corresponding to the protective film 91 on the non-display surface 11 are exposed, as are the fourth cutout area 91'4 and the fifth cutout area 91'5 corresponding to the protective film 91' on the non-display surface 11.

[0195] See again in some examples Figure 39 The protective film 91' has a set distance d7 with the corresponding selected side 11cc. For example, the distance d7 between the protective film 91' and the corresponding selected side 11cc is 2mm.

[0196] In step S21, based on protective films 91 and 91', a metal layer 133 is formed on one selected side 11cc of the non-display surface 11, and a metal layer 134 is formed on the other selected side 11cc. Figure 40 As shown, the metal layer 133 also covers the portion of the non-display surface 11 that exposes the first cutout area 911, the second cutout area 912, and the third cutout area 913 corresponding to the protective film 91. The metal layer 134 also covers the non-display surface 11 that exposes the fourth cutout area 91'4 and the fifth cutout area 91'5 corresponding to the protective film 91'.

[0197] In some embodiments, in step S22, where the metal layer 134 is etched to form a plurality of bonding terminals 11a in the region of the non-display surface 11 corresponding to the metal layer 134, as shown... Figure 41 As shown, the tenth sub-alignment marker 155a and the eleventh sub-alignment marker 155b are formed simultaneously. The etching steps for the metal layer 133 will not be described in detail here.

[0198] In some embodiments, see again Figure 25 In step S3, which electrically connects the third flexible circuit board 8 to multiple bonding terminals 11a, the use of the tenth sub-alignment mark 155a and the eleventh sub-alignment mark 155b is as described above and will not be repeated here.

[0199] It should be noted that metal layer 134 and metal layer 133 are metal layers sprayed on different selected sides 11cc of the display panel 1.

[0200] In other embodiments, see again Figure 14 The two sides 11c of the non-display surface 11 are designated sides 11cc. These two designated sides 11cc are positioned opposite each other on the non-display surface 11 of the display panel 1. The flexible circuit boards required for the two designated sides 11cc of the non-display surface 11 have high tolerance specifications. Therefore, the bonding terminals 11a of each designated side 11cc are divided into a first bonding terminal group 11aa and a second bonding terminal group 11ab. For example... Figure 15As shown, the binding terminal 11a of the first binding terminal group 11aa of each selected side 11cc is connected to the first conductive contact 61b of the first flexible circuit board 6, and the binding terminal 11a of the second binding terminal group 11ab is electrically connected to the corresponding second conductive contact 71b. The left and right positions of the first flexible circuit board 6 and the second flexible circuit board 7 of each selected side 11cc are designed according to design requirements and will not be described in detail here. Regarding the manufacturing method of the display module 10 in this embodiment, the above steps form the module as shown in the diagram. Figure 6 The steps for the display module shown can be performed by preparing the two selected sides 11cc of the non-display surface 11, which will not be described in detail here.

[0201] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, comprising: The display panel, wherein the non-display surface of the display panel includes a plurality of sides, at least one of which is a selected side; The display panel includes a plurality of bonding terminals disposed on the non-display surface. The plurality of bonding terminals are arranged sequentially and spaced apart along the selected side. The plurality of bonding terminals are divided into a first bonding terminal group and a second bonding terminal group. The first bonding terminal group includes a portion of the plurality of bonding terminals, and the second bonding terminal group includes another portion of the plurality of bonding terminals. A first flexible circuit board includes a first trace area and a first fan-out area connected together, wherein the first trace area is closer to the selected side than the first fan-out area; Multiple first conductive contacts are spaced apart in the first wiring area, and each first conductive contact is electrically connected to a binding terminal of the first binding terminal group; The second flexible circuit board includes a second trace area and a second fan-out area connected to each other, wherein the second trace area is closer to the selected side than the second fan-out area; Multiple second conductive contacts are spaced apart within the second wiring area, and each second conductive contact is electrically connected to a bonding terminal of the second bonding terminal group; Wherein, along the first direction, the first routing area is closer to the selected side than the second routing area, and along the second direction, the first fan-out area and the second routing area are spaced apart; the first direction is perpendicular to the second direction, and the second direction is the extension direction of the selected side; along the second direction, the shortest distance between the first fan-out area and the second routing area is greater than 1mm.

2. The display module according to claim 1, wherein, Along the first direction, the side of the first routing area away from the selected side is closer to the selected side than the side of the second routing area close to the selected side.

3. The display module according to claim 2, wherein, Along the first direction, the distance between the second routing area and the first routing area is greater than 1 mm.

4. The display module according to claim 3, wherein, The display panel further includes: a display surface, a plurality of side surfaces connecting the display surface and the non-display surface, and a plurality of side traces are spaced apart on the side surface near the selected side surface. One end of each side trace extends to the display surface and the other end extends to the non-display surface. The end of each side trace extending to the non-display surface serves as one of the plurality of bonding terminals.

5. The display module according to claim 1 or 4, wherein, The plurality of bonding terminals extend along a first direction, and the minimum length of each bonding terminal in the first bonding terminal group along its extension direction is less than the minimum length of each bonding terminal in the second bonding terminal group along its extension direction.

6. The display module according to claim 5, wherein, The plurality of first conductive contacts correspond one-to-one with the plurality of bonding terminals of the first bonding terminal group, and the first adhesive film is located between the plurality of first conductive contacts and the first bonding terminal group and is in direct contact with both. The plurality of second conductive contacts correspond one-to-one with the plurality of bonding terminals of the second bonding terminal group, and the second adhesive film is located between the plurality of second conductive contacts and the second bonding terminal group and is in direct contact with both; The first adhesive film and the second adhesive film extend along the second direction, with the first adhesive film being closer to the selected side relative to the second adhesive film.

7. The display module according to claim 1 or 6, wherein, The non-display surface of the display panel is also provided with at least one alignment mark, which is used for the connection and alignment of the plurality of first conductive contacts with the binding terminals of the first binding terminal group and the plurality of second conductive contacts with the binding terminals of the second binding terminal group.

8. The display module according to claim 7, wherein, The alignment mark includes a marking pattern and a clearance area surrounding the marking pattern, the clearance area being insulated from the outer region of the clearance area.

9. The display module according to claim 8, wherein, The at least one alignment mark includes a plurality of alignment marks, the plurality of alignment marks including a first group of alignment marks, a second group of alignment marks and a third group of alignment marks arranged at intervals along a first direction; The first trace area of ​​the first flexible circuit board includes a first bonding area and a first alignment area arranged along the first direction. The first alignment area is connected to the first fan-out area, and the plurality of first conductive contacts are disposed in the first bonding area. The second wiring area of ​​the second flexible circuit board includes a second bonding area and a second alignment area arranged along the first direction. The second alignment area is connected to the second fan-out area, and the plurality of second conductive contacts are disposed in the second bonding area. The first set of alignment marks includes a first sub-alignment mark and a second sub-alignment mark. The marking patterns of the first sub-alignment mark and the second sub-alignment mark are located within the orthographic projection of the first alignment area onto the non-display surface. The marking patterns of the first sub-alignment mark and the second sub-alignment mark are symmetrically arranged with respect to the centerline of the orthographic projection of the first alignment area onto the non-display surface in a first direction. The first sub-alignment mark is closer to the side of the non-display surface than the second sub-alignment mark. The second set of alignment marks includes a third sub-alignment mark, a fourth sub-alignment mark, and a fifth sub-alignment mark. The marking patterns of the third and fourth sub-alignment marks are located within the orthographic projection of the second alignment area onto the non-display surface, and the marking patterns of the third and fourth sub-alignment marks are symmetrically arranged relative to the centerline of the orthographic projection of the second alignment area onto the non-display surface in a first direction. The fourth sub-alignment mark is closer to the side of the non-display surface than the third sub-alignment mark. The center of the fifth sub-alignment mark is on the same straight line along a second direction as the centers of the third and fourth sub-alignment marks, and the marking pattern of the fifth sub-alignment mark is located on one side of the orthographic projection of the first fan-out area onto the non-display surface along the second direction. The third set of alignment marks includes a sixth sub-alignment mark and a seventh sub-alignment mark. The sixth and seventh sub-alignment marks are symmetrically arranged with respect to the centerline of the non-display surface in the first direction. The marking pattern of the seventh sub-alignment mark is located on one side of the orthographic projection of the second fan-out area onto the non-display surface along the second direction.

10. A display device comprising a display module as claimed in any one of claims 1 to 9.

11. A method for manufacturing a display module, comprising: Create the initial display panel; The non-display surface of the initial display panel includes multiple sides, of which at least one side is a selected side; Multiple bonding terminals are formed on the non-display surface; the multiple bonding terminals are arranged sequentially and spaced apart along the selected side; the multiple bonding terminals are divided into a first bonding terminal group and a second bonding terminal group, the first bonding terminal group including a portion of the multiple bonding terminals, and the second bonding terminal group including another portion of the multiple bonding terminals; The first flexible circuit board and the second flexible circuit board are electrically connected to a plurality of bonding terminals; the first flexible circuit board includes a first trace area and a first fan-out area connected to each other, and the first trace area is closer to the selected side than the first fan-out area. The first trace area is provided with a plurality of first conductive contacts at intervals, and each first conductive contact is electrically connected to a bonding terminal of the first bonding terminal group; the second flexible circuit board includes a second trace area and a second fan-out area connected to each other, and the second trace area is closer to the selected side than the second fan-out area. Multiple second conductive contacts are spaced apart within the second wiring area, and each second conductive contact is electrically connected to a bonding terminal of the second bonding terminal group; Wherein, along the first direction, the first routing area is closer to the selected side than the second routing area, and along the second direction, the first fan-out area and the second routing area are spaced apart; the first direction is perpendicular to the second direction, and the second direction is the extension direction of the selected side; along the second direction, the shortest distance between the first fan-out area and the second routing area is greater than 1mm.

12. The method for preparing a display module according to claim 11, wherein, Before forming multiple bonding terminals on the non-display surface, the method further includes: A protective film with a target shape is formed; the protective film includes a first portion and a second portion arranged along a third direction, the first portion having a larger dimension along a fourth direction than the second portion along the fourth direction, the first portion and the second portion being flush at the same end along the fourth direction, and the maximum dimension of the protective film along the third direction being greater than or equal to the dimension of the non-display surface along the second direction; wherein, the second direction is the extension direction of the selected side, and the third direction is perpendicular to the fourth direction; The protective film is attached to the target position on the non-display surface of the initial display panel; the first part and the second part are arranged in a direction parallel to the extension direction of the selected side, the flush ends of the first part and the second part are away from the selected side, and the first part and the second part are respectively separated from the selected side by a set distance; Based on the protective film, at least a metal layer is formed on the non-display panel; The metal layer is etched to form multiple bonding terminals on the non-display surface. The multiple bonding terminals are divided into a first bonding terminal group and a second bonding terminal group, with the boundary line between the first part and the second part of the protective film as the boundary.

13. The method for preparing a display module according to claim 12, wherein, At least one alignment mark is also provided on the non-display surface. The at least one alignment mark includes a first group of alignment marks, a second group of alignment marks, and a third group of alignment marks that are spaced apart along a first direction. The first group of alignment marks includes a first sub-alignment mark and a second sub-alignment mark. The second group of alignment marks includes a third sub-alignment mark, a fourth sub-alignment mark, and a fifth sub-alignment mark. The third group of alignment marks includes a sixth sub-alignment mark and a seventh sub-alignment mark. In the step of forming a protective film with a target shape, the protective film includes a first hollow area, a second hollow area, and a third hollow area, the first hollow area, the second hollow area, and the third hollow area correspond to the positions of the fifth sub-alignment mark, the sixth sub-alignment mark, and the seventh sub-alignment mark, respectively; In the step of attaching the protective film to the target position of the non-display surface of the initial display panel, portions of the non-display surface corresponding to the first cutout area, the second cutout area, and the third cutout area of ​​the protective film are exposed; Based on the protective film, at least in the step of forming a metal layer on the non-display surface, the metal layer also covers the portions of the non-display surface that expose the first cutout area, the second cutout area, and the third cutout area corresponding to the protective film; In the step of etching the metal layer to form multiple bonding terminals on the non-display surface, the first sub-alignment mark, the second sub-alignment mark, the third sub-alignment mark, the fourth sub-alignment mark, the fifth sub-alignment mark, the sixth sub-alignment mark, and the seventh sub-alignment mark are formed simultaneously.

14. The method for preparing a display module according to claim 13, wherein, In the step of electrically connecting the first flexible circuit board and the second flexible circuit board to multiple bonding terminals, the first flexible circuit board and the second flexible circuit board are aligned with the multiple bonding terminals according to the first set of alignment marks, the second set of alignment marks and the third set of alignment marks, and then the first flexible circuit board and the second flexible circuit board are electrically connected to the multiple bonding terminals.

15. The method for preparing a display module according to claim 14, wherein, According to the fourth sub-alignment mark and the fifth sub-alignment mark, a first adhesive film is applied to the target position of the first bonding terminal group, and a second adhesive film is applied to the target position of the second bonding terminal group. The first flexible circuit board and the first bonding terminal group are connected by the first adhesive film; The second flexible circuit board and the second bonding terminal group are connected by the second adhesive film; The first adhesive film and the second adhesive film extend along the second direction, with the first adhesive film being closer to the selected side relative to the second adhesive film.

16. The method for manufacturing a display module according to claim 11, wherein, The initial display panel also includes a display surface and multiple side surfaces connecting the display surface and the non-display surface; In the step of forming multiple bonding terminals on the non-display surface, multiple side traces are simultaneously formed on the side near the selected side; the multiple side traces are spaced apart, with one end of each side trace extending to the display surface and the other end extending to the non-display surface, and the end of each side trace extending to the non-display surface serving as one of the multiple bonding terminals.

17. The method for preparing a display module according to claim 15, wherein, After etching the metal layer, and before the electrical connection steps of the first flexible circuit board, the second flexible circuit board and the multiple bonding terminals, the protective film is peeled off from the non-display surface.

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