Impedance anomaly nondestructive positioning method, system, device, equipment and storage medium

Abstract

The application provides an impedance abnormality nondestructive positioning method, device and equipment and a storage medium, and relates to the field of circuit board testing.The method is applied to a circuit board, the circuit board comprises at least one signal line to be tested, and the method comprises the following steps: obtaining a first impedance curve of the signal line to be tested; the horizontal axis of the first impedance curve represents collection time, and the vertical axis of the first impedance curve represents the impedance of a collection position corresponding to the collection time; when the first impedance curve contains abnormal impedance information, an abnormal position is obtained; a shielding material is moved according to a preset moving track on the circuit board, and a second impedance curve is obtained during the moving process; when a sudden change signal of the second impedance curve is detected, a sudden change position is obtained; and when the sudden change position corresponds to the abnormal position, the impedance abnormal position of the signal line to be tested is positioned according to the position of the shielding material on the circuit board. According to the method, the impedance abnormal point of the signal line to be tested can be confirmed without damaging the circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board testing, and in particular to a non-destructive method, system, device, equipment, and storage medium for locating impedance anomalies. Background Technology

[0002] The impedance characteristics of signal lines on a circuit board are related to physical factors such as the width of the signal line, its distance from the ground plane, and the dielectric constant of the substrate; these are inherent characteristics of the signal lines. If the impedance of a signal line does not match the impedance of the devices on the circuit board, it will cause the transmitted signal to reverse, resulting in oscillations in the digital waveform, logical errors, and reduced signal transmission quality.

[0003] When a signal line is located inside a circuit board and its route is unknown, it is difficult to pinpoint the exact location of the impedance anomaly, making it impossible for testing personnel to quickly investigate the cause of the impedance anomaly. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] In response to the above problems, this application proposes a non-destructive method, system, device, equipment, and storage medium for locating impedance anomalies, which can identify impedance anomalies in the signal line under test without damaging the circuit board.

[0006] According to a first aspect of this application, a non-destructive impedance anomaly localization method is proposed, applied to a circuit board, the circuit board including at least one signal line under test, the signal line under test having a surface circuit, comprising: obtaining a first impedance curve of the signal line under test; the first impedance curve characterizing the impedance information of the signal line under test; the horizontal axis of the first impedance curve representing the acquisition time, the vertical axis of the first impedance curve representing the impedance at the acquisition position corresponding to the acquisition time, the acquisition time corresponding to the acquisition position; when the first impedance curve contains abnormal impedance information, obtaining the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve to obtain the abnormal position; moving a covering material on the circuit board according to a preset movement trajectory, and obtaining a second impedance curve during the movement; when a sudden change signal is detected in the second impedance curve, obtaining the second horizontal axis coordinate of the sudden change signal in the second impedance curve to obtain the sudden change position; when the sudden change position corresponds to the abnormal position, locating the impedance anomaly position of the signal line under test according to the position of the covering material on the circuit board.

[0007] According to the non-destructive impedance anomaly localization method of the first aspect of this application, since the impedance of the dielectric near the signal line under test will also change abruptly when the dielectric changes, this application can detect the location of the impedance anomaly of the signal line under test by moving the covering material on the circuit board, thereby non-destructively locating the impedance anomaly location of the signal line under test with an unknown direction.

[0008] In some embodiments, obtaining the first impedance curve of the signal line under test includes: connecting the probes of a network analyzer to both ends of the signal line under test; and continuously measuring the impedance information of the signal under test to obtain the first impedance curve of the signal line under test.

[0009] In some embodiments, when the first impedance curve contains abnormal impedance information, obtaining the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve to obtain the abnormal location includes: obtaining at least one first peak value based on the first impedance curve; defining the first peak value as abnormal impedance information when the difference between the first peak value and the standard impedance is greater than or equal to a first threshold value; and obtaining the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve to obtain the abnormal location.

[0010] In some embodiments, when a sudden change signal is detected in the second impedance curve, obtaining the second horizontal axis coordinate of the sudden change signal in the second impedance curve to obtain the sudden change position includes: obtaining at least one second peak value according to the second impedance curve; defining the second peak value as a sudden change signal when the difference between the second peak value and the standard deviation value is greater than or equal to a second threshold value; and obtaining the second horizontal axis coordinate of the sudden change signal in the second impedance curve to obtain the sudden change position.

[0011] In some embodiments, the covering material includes one of: a piece of paper or a piece of resin.

[0012] In some embodiments, when the abrupt change location corresponds to the abnormal location, locating the impedance abnormality location of the signal line under test based on the position of the covering material on the circuit board includes: defining the abrupt change location as corresponding to the abnormal location when the difference between the first coordinate value of the abnormal location on the first horizontal axis and the second coordinate value of the abrupt change location on the second horizontal axis is less than a third threshold; obtaining the covering position of the covering material on the circuit board; and locating the impedance abnormality location of the signal line under test based on the covering position.

[0013] According to a second aspect of this application, a non-destructive impedance anomaly localization system is proposed for impedance detection of a circuit board. The circuit board includes at least one signal line to be tested. The system includes a detection platform, a robotic arm, a network analyzer, and a control device. The control device is connected to the robotic arm and the network analyzer. The detection platform is used to place the circuit board. The robotic arm includes a moving device and an end effector. The end effector is mounted on the moving device and is used to grasp or absorb a covering material, causing the covering material to move on the circuit board along a preset trajectory as the moving device moves. The network analyzer includes a first probe and a second probe. The robotic arm is further used to move the first probe and the second probe, connecting them to the two ends of the signal line to be tested. The control device controls the network analyzer and the robotic arm to enable the non-destructive impedance anomaly localization system to perform the non-destructive impedance anomaly localization method described above.

[0014] According to a third aspect of this application, a non-destructive impedance anomaly location device is proposed, applied to a circuit board, the circuit board including at least one signal line under test, comprising: an impedance curve measurement module, used to obtain a first impedance curve of the signal line under test; the first impedance curve characterizes the impedance information of the signal line under test; the horizontal axis of the first impedance curve represents the acquisition time, and the vertical axis of the first impedance curve represents the impedance at the acquisition position corresponding to the acquisition time, the acquisition time corresponding to the acquisition position; an anomaly location acquisition module, used to obtain the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve when the first impedance curve contains abnormal impedance information, thereby obtaining an anomaly location; a movement module, used to move a covering material on the circuit board according to a preset movement trajectory; the impedance curve measurement module is further used to obtain a second impedance curve during the movement of the covering material; a sudden change location acquisition module, used to obtain the second horizontal axis coordinate of the sudden change signal in the second impedance curve when a sudden change signal is detected, thereby obtaining a sudden change location; and an anomaly location positioning module, used to locate the impedance anomaly location of the signal line under test according to the position of the covering material on the circuit board when the sudden change location corresponds to the anomaly location.

[0015] According to a fourth aspect of this application, an electronic device is proposed, comprising a memory, a processor, a communication bus, a communication interface, and a computer program stored in the memory and executable on the processor, wherein the communication bus is used to enable communication between the processor and the memory; and the processor, when executing the computer program, implements the impedance anomaly non-destructive localization method as described in any of the preceding claims.

[0016] According to a fifth aspect of this application, a storage medium is provided, the storage medium being a readable storage medium storing a computer program for causing a computer to execute: the impedance anomaly non-destructive localization method as described in any of the preceding claims.

[0017] It is understood that the beneficial effects of the second to fifth aspects compared with the related technologies are the same as the beneficial effects of the first aspect compared with the related technologies. Please refer to the relevant description in the first aspect above, which will not be repeated here.

[0018] Other features and advantages of this application will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the description, claims and drawings. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the impedance anomaly non-destructive positioning system according to an embodiment of this application.

[0020] Figure 2 This is a flowchart of the impedance anomaly non-destructive location method according to an embodiment of this application.

[0021] Figure 3 This is a schematic diagram of the first impedance curve of an embodiment of this application.

[0022] Figure 4 This is a schematic diagram of the second impedance curve in an embodiment of this application.

[0023] Figure 5 This is a structural diagram of the impedance anomaly non-destructive positioning device according to an embodiment of this application.

[0024] Figure 6 This is a schematic diagram of an electronic device according to an embodiment of this application. Detailed Implementation

[0025] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that the embodiments of this application can also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, optical paths, and methods are omitted so as not to obscure the description of the embodiments of this application with unnecessary detail.

[0026] It should be noted that although a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than that shown in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0027] Impedance is a physical quantity that represents the performance of a component or the electrical performance of a circuit. It characterizes the resistance that current encounters in a circuit with resistance, inductance, and capacitance, and its unit is ohms.

[0028] Impedance matching refers to the process where, when two devices with different impedances are connected together for signal transmission, signal reflection occurs at the connection point, causing signal attenuation and preventing perfect transmission. In such cases, impedance matching is necessary.

[0029] The impedance characteristics of signal lines on a circuit board are related to physical factors such as the width of the signal line, its distance from the ground plane, and the dielectric constant of the substrate; these are inherent characteristics of the signal lines. If the impedance of a signal line does not match the impedance of the devices on the circuit board, it will cause the transmitted signal to reverse, resulting in oscillations in the digital waveform, logical errors, and reduced signal transmission quality.

[0030] However, some signal lines, such as those with surface traces on circuit boards, or striplines running internally between two substrates, cannot be observed with the naked eye or optical means. Therefore, it is difficult to pinpoint the location of impedance abnormalities.

[0031] The embodiments of this application aim to solve the problem of locating impedance anomalies in various signal lines that cannot be directly observed. The impedance anomaly non-destructive locating method, device, electronic device and storage medium of the embodiments of this application can solve at least one of the above problems.

[0032] According to a first aspect of this application, a non-destructive impedance anomaly localization method is proposed, applied to a circuit board, the circuit board including at least one signal line under test, comprising: obtaining a first impedance curve of the signal line under test; the first impedance curve characterizing the impedance information of the signal line under test; the horizontal axis of the first impedance curve representing the acquisition time, and the vertical axis of the first impedance curve representing the impedance at the acquisition position corresponding to the acquisition time, the acquisition time corresponding to the acquisition position; when the first impedance curve contains abnormal impedance information, obtaining the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve to obtain the abnormal position; moving a covering material on the circuit board according to a preset movement trajectory, and obtaining a second impedance curve during the movement; when a sudden change signal is detected in the second impedance curve, obtaining the second horizontal axis coordinate of the sudden change signal in the second impedance curve to obtain the sudden change position; when the sudden change position corresponds to the abnormal position, locating the impedance anomaly position of the signal line under test according to the position of the covering material on the circuit board.

[0033] Figure 1 This is a schematic diagram of an impedance anomaly non-destructive positioning system 10 according to an embodiment of this application. The system includes a detection platform 11, a robotic arm 12, a network analyzer 13, and a control device 14, used for impedance detection of a circuit board 1. The circuit board 1 is placed on the detection platform 11 and includes at least one signal line 2 to be tested. During measurement, the two probes of the network analyzer 13, the first probe and the second probe (not shown in the figure), should be connected to the two ends of the signal line 2 to be tested (not shown in the figure), respectively. The robotic arm 12 includes a moving device 15 and an end effector 16. The moving device can drive the end effector 16 to move. The end effector 16 can be a suction device or a jointed robotic arm with grasping ability. In the embodiment where the end effector 16 is a suction device, the end effector 16 is used to suction a covering material 3 so that the covering material 3 can move on the circuit board 1 as the end effector 16 moves. The control device 14 is communicatively connected to the robot arm 12 and the network analyzer 13, respectively, so that the control device 14 can receive signals transmitted by the network analyzer 13 and the robot arm 12 and control the network analyzer 13 and the robot arm 12.

[0034] In the aforementioned non-destructive positioning system 10, the moving device 15 of the robotic arm 12 can be composed of an X-axis linear sliding rail and a Y-axis linear sliding rail. By moving the sliders on the X-axis and Y-axis linear sliding rails respectively, the end effector 16 can move freely in a plane. Furthermore, a Z-axis linear sliding rail can be added to increase the degree of freedom of movement of the end effector 16. In other embodiments, the moving device 15 is a jointed robotic arm with multiple degrees of freedom and a grasping function. Through the rotation of each joint, the end effector 16 can move to various positions within the range of motion of the moving device 15, excluding dead points. In summary, the moving device 15 of this application is not limited in any way.

[0035] The end effector 16 can be a bionic robotic arm with grasping function or a pneumatic suction cup with adsorption function. As long as the end effector can stably grasp and move the covering material 3, there are no specific limitations. In embodiments where the end effector 16 can be a bionic robotic arm with grasping function, the end effector 16 can also be used to grasp the first probe and the second probe, and connect the first probe and the second probe to the two ends of the signal line under test, respectively.

[0036] In addition, the control device 14 in this application embodiment can be various types of devices with computing capabilities, such as various terminal devices, servers, embedded computing systems, distributed computers, etc. Similarly, the selection of the control device 14 will not affect the implementation of the impedance anomaly non-destructive location method of this application and the realization of the beneficial effects of this application.

[0037] Depending on the actual production situation, certain adjustments can be made to the aforementioned non-destructive positioning system 10, such as the size and shape of the covering material 3. Figure 1 The proportions of each component can be adjusted, or a movable detection platform 11 can be selected. Those skilled in the art can make adjustments according to the actual situation, or the robotic arm 12 can be omitted and the process can be achieved through a combination of assembly line and manual labor. As long as the impedance anomaly non-destructive positioning method of this application can be executed, it is sufficient.

[0038] The method for non-destructive location of impedance anomalies according to embodiments of this application will be described below.

[0039] Figure 2 This is a flowchart of the non-destructive impedance anomaly localization method according to an embodiment of this application. (Reference) Figure 2 The impedance anomaly non-destructive location method of this application embodiment is applied to a test circuit board, which should include at least one signal line under test. The method includes:

[0040] S110: Obtain the first impedance curve of the signal line under test; the first impedance curve represents the impedance information of the signal line under test; the horizontal axis of the first impedance curve represents the acquisition time, and the vertical axis of the first impedance curve represents the impedance at the acquisition position corresponding to the acquisition time, and the acquisition time corresponds to the acquisition position.

[0041] S120: When the first impedance curve contains abnormal impedance information, obtain the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve to obtain the abnormal location.

[0042] S130: Move the covering material on the circuit board according to the preset moving trajectory, and obtain the second impedance curve during the moving process;

[0043] S140: When a sudden change signal is detected in the second impedance curve, the second horizontal axis coordinate of the sudden change signal in the second impedance curve is obtained to determine the location of the sudden change.

[0044] S150: When the sudden change position corresponds to the abnormal position, the impedance abnormal position of the signal line under test is located according to the position of the covering material on the circuit board.

[0045] Based on the aforementioned non-destructive impedance anomaly localization method, this method utilizes the principle that a change in the dielectric near the signal line under test (DUT) causes a sudden change in its impedance. By moving a covering material on the circuit board to detect the location of the impedance anomaly on the DUT, the location of the impedance anomaly on the DUT with an unknown path can be located non-destructively. Specifically, when the covering material moves onto the DUT, it alters the dielectric around the signal line, thus changing the propagation environment of the electromagnetic wave signal and causing a sudden impedance change. The measured second impedance curve will then show a sudden change signal compared to the first impedance curve, and the location of this sudden signal corresponds to the position of the covering material covering the DUT. When the position of the sudden signal in the second impedance curve matches the position of the abnormal impedance information in the first impedance curve, it can be considered that the covering material covers the impedance anomaly location of the DUT.

[0046] Specifically, in S110: obtaining the first impedance curve of the signal line under test, the first impedance curve of the signal line under test can be tested using an impedance analyzer, a network analyzer, or other TDR (Time-Domain Reflectometry) devices. In an embodiment using a network analyzer, the two probes of the network analyzer should be connected to both ends of the signal line under test, for example, by inserting the two probes into the vias corresponding to the signal line under test on the circuit board and connecting the two probes to both ends of the signal line under test.

[0047] Figure 3This is a schematic diagram of the first impedance curve in an embodiment of this application. Segments Z1 and Z2 are generated by external interference, occurring at both ends of the signal line under test, and are not relevant to this embodiment.

[0048] exist Figure 3 In this embodiment, a network analyzer is used to obtain a first impedance curve. The vertical axis represents impedance, and the horizontal axis represents the time domain. The horizontal axis characterizes the propagation time of the pulse signal emitted by the network analyzer in the signal line under test. Since the pulse signal propagates along the signal line under test, the horizontal axis can also characterize the distance the pulse travels in the signal line under test. Therefore, the first impedance curve can characterize the impedance at different locations in the signal line under test.

[0049] In S120: When the first impedance curve contains abnormal impedance information, the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve is obtained, and the abnormal location is obtained, including:

[0050] S121: Based on the first impedance curve, at least one first peak value is obtained. Specifically, the first peak value may refer to the maximum ordinate value (impedance) of the envelope of the first impedance curve where the rate of change is greater than that of other positions on the first impedance curve. Alternatively, it may be the point on the first impedance curve where the average ordinate value differs the most from the average ordinate value of other points within a certain horizontal coordinate range. Those skilled in the art can determine the specific range of a certain horizontal coordinate range based on different signal lines under test and different impedance measurement methods, and no limitation is made here.

[0051] S122: When the difference between the first peak value and the standard impedance is greater than or equal to the first threshold, the first peak value is defined as abnormal impedance information. Specifically, the standard impedance is determined by factors such as the signal line under test, other components on the circuit board, and the dielectric material surrounding the signal under test. The first threshold is set according to the signal line under test and the processing requirements. Figure 3 In one embodiment, the standard impedance is 110Ω, and the first threshold is 5.5Ω. In other embodiments, due to different processing accuracy requirements, the first threshold can be set to 6Ω. Therefore, in Figure 3 The first peak value A in the data represents abnormal impedance information.

[0052] Furthermore, one or more first peaks obtained are defined as abnormal impedance information, and the number of first peaks represents the number of locations with impedance abnormalities in the signal line under test.

[0053] S123: Obtain the abnormal position by finding the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve. Specifically, the abnormal position is obtained by finding the corresponding first horizontal axis coordinate value based on the position of the abnormal impedance information in the first impedance curve.

[0054] After obtaining the abnormal location through the above steps, step S130 can be executed: The covering material is moved on the circuit board according to a preset trajectory, and a second impedance curve is obtained during the movement. Specifically, the covering material is placed on the circuit board and moved along the preset trajectory, and the second impedance curve of the signal line under test is continuously obtained through measurement. For ease of operation, the method for obtaining the second impedance curve is the same as that for obtaining the first impedance curve in step S110, but a different method can also be used, as long as the obtained second impedance curve can be compared with the first impedance curve. In some embodiments, the first impedance curve is first measured by connecting a network analyzer to the signal line under test, and then the network analyzer is adjusted to continuous measurement mode and connected to the signal line under test to continuously obtain the second impedance curve.

[0055] The preset movement trajectory can be an S-shaped movement of the masking material until it sweeps across the entire exposed surface of one side of the circuit board. The masking material can move while attached to the circuit board or at a certain distance. The distance depends on the type of signal line under test and the type of masking material. An empirical distance can be derived by observing impedance changes when using a specific masking material to cover a specific signal line under test. In some embodiments, the preset movement trajectory is not limited; it is sufficient that the masking material sweeps across the entire surface of one side of the circuit board during its movement. However, in other embodiments, a relational database can be established based on the circuit board type and the function of the signal line under test. This database records possible routing directions that can be derived from the relational database based on the circuit board type and the type of signal line under test. The relational database can be obtained through prior knowledge or through a neural network model obtained by training an adversarial training model. Therefore, the trajectory of the masking material can be obtained by inputting the circuit board type and the test signal line of the test into the relational library to obtain the predicted routing direction. First, the masking material moves according to the predicted routing direction. If the second impedance curve does not produce a sudden signal, other movement trajectories are used so that the masking material can sweep across the entire surface of one side of the circuit board during the movement.

[0056] The cover material is a thin sheet material with an area smaller than the circuit board area. It's easy to understand that a smaller cover material improves the accuracy of subsequent positioning, but increases the difficulty of finding abrupt changes and increases operation time. Therefore, the size of the cover material should be appropriately selected based on the accuracy requirements. In some embodiments, the cover material can be either paper or resin.

[0057] The above steps are easy to understand and can all be accomplished through... Figure 1 The robotic arm 12, network analyzer 13, and control device 14 in the embodiment work together to complete the task. Alternatively, some of the steps described above can be replaced by manual labor.

[0058] Figure 4This is a schematic diagram of the second impedance curve according to an embodiment of this application. Segments Z3 and Z4 are generated by external interference, occurring at both ends of the signal line under test, and are not relevant to this embodiment. Figure 4 The vertical axis represents impedance, and the horizontal axis represents the time domain. The horizontal axis characterizes the propagation time of the pulse signal emitted by the network analyzer in the signal line under test.

[0059] S140: When a sudden change signal is detected in the second impedance curve, the coordinates of the sudden change signal on the second horizontal axis of the second impedance curve are obtained, and the location of the sudden change is obtained, including:

[0060] S141: Obtain at least one second peak value based on the second impedance curve; specifically, the second peak value may refer to the maximum ordinate value (impedance) of the envelope of the second impedance curve where the rate of change is greater than that of other positions on the second impedance curve. Alternatively, it may be the point on the second impedance curve where the average ordinate value differs the most from the average ordinate value of other points within a certain abscissa range. Those skilled in the art can determine the abscissa range based on the different materials of the signal line under test, the circuit board substrate or base plate, and the covering material.

[0061] S142: When the difference between the second peak value and the standard deviation value is greater than or equal to the second threshold, the second peak value is defined as a sudden change signal; specifically, refer to... Figure 4 , Figure 4 Point B indicates the second peak value B. The magnitude of the second peak value is related to the material and type of the signal line under test, the material of the circuit board substrate or base plate, the masking material, the distance between the masking material and the circuit board, and the distance between the signal line under test and the outer surface of the circuit board. Those skilled in the art need to determine the second threshold value based on different specific scenarios. Figure 4 In one embodiment, the second threshold is set to 5 ohms. Therefore Figure 4 The second peak B can be defined as a mutation signal.

[0062] When the covering material obscures the inflection point of the signal line under test, or when the signal line bends and extends, causing the covering material to be present at different positions of the signal line under test simultaneously, multiple abrupt signal changes may occur. In this case, the covering material should be moved or replaced so that only one abrupt signal exists in the second impedance curve.

[0063] S143: Obtain the second horizontal axis coordinate of the sudden change signal in the second impedance curve to obtain the sudden change position. Specifically, based on the position of the sudden change signal in the second impedance curve, find the corresponding second horizontal axis coordinate value to obtain the sudden change position.

[0064] As is easily understood, the relevant steps in S140 above can all be achieved through... Figure 1 The robotic arm 12, network analyzer 13, and control device 14 in the embodiment work together to complete the task. Alternatively, some steps can be replaced by manual labor.

[0065] Therefore, based on the above steps, the abnormal location of the first impedance curve and the abrupt change location of the second impedance curve are obtained. Then, step S150 is executed: when the abrupt change location corresponds to the abnormal location, the impedance abnormality location of the signal line under test is located based on the position of the covering material on the circuit board.

[0066] It is easy to understand that when the abrupt change position in the second impedance curve is roughly the same as the abnormal position in the first impedance curve on the horizontal axis, it means that the covering material has just covered the impedance abnormal position of the first impedance curve, thus completing the location of the impedance abnormal position of the signal line under test.

[0067] In some embodiments, S150 includes:

[0068] S151: When the difference between the first coordinate value of the abnormal position on the first horizontal axis and the second coordinate value of the mutation position on the second horizontal axis is less than the third threshold, the mutation position is defined to correspond to the abnormal position.

[0069] S152: Obtain the covering position of the covering material on the circuit board;

[0070] S153: Locate the impedance anomaly of the signal line under test based on the obstruction position.

[0071] Specifically, in S151, the third threshold is determined based on the required process precision and the size of the covering material. In the most preferred embodiment, the third threshold should be equal to zero. The smaller the covering material, the smaller the set third threshold. Similarly, the smaller the required process precision, the smaller the set third threshold. However, if the third threshold is too small or the covering material is too small, it may increase the time required for judgment. Therefore, the value should be appropriately selected according to the required process precision.

[0072] exist Figure 4 In the embodiment shown, the positional difference between the second peak B and the first peak A on the horizontal axis is less than a third threshold. Therefore, the positions of the second peak C and the first peak A can be considered to be approximately the same, and can be defined as abrupt change positions corresponding to abnormal positions. At this time, the impedance abnormality position of the signal line under test can be located based on the coverage position of the covering material.

[0073] Figure 5 This is a structural diagram of the impedance anomaly non-destructive positioning device 500 according to an embodiment of this application. (Reference) Figure 5This device is applied to a circuit board, which includes at least one signal line under test. The device includes: an impedance curve measurement module 501, used to obtain a first impedance curve of the signal line under test; the first impedance curve characterizes the impedance information of the signal line under test; the horizontal axis of the first impedance curve represents the acquisition time, and the vertical axis of the first impedance curve represents the impedance at the acquisition position corresponding to the acquisition time, and the acquisition time corresponds to the acquisition position; an abnormal position acquisition module 502, used to obtain the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve when the first impedance curve contains abnormal impedance information, and obtain the abnormal position; a movement module 503, used to move a covering material on the circuit board according to a preset movement trajectory; the impedance curve measurement module 501 is also used to obtain a second impedance curve during the movement of the covering material; a sudden change position acquisition module 504, used to obtain the second horizontal axis coordinate of the sudden change signal in the second impedance curve when a sudden change signal is detected, and obtain the sudden change position; and an abnormal position positioning module 505, used to locate the impedance abnormal position of the signal line under test according to the position of the covering material on the circuit board when the sudden change position corresponds to the abnormal position.

[0074] At the same time, refer to Figure 6 This application also proposes an electronic device 600, including a memory 601, a processor 602, a communication bus 603, a communication interface 604, and a computer program stored in the memory 601 and executable on the processor 602. The communication bus 603 is used to establish a connection and communication between the processor 602 and the memory 601. When the processor 602 executes the computer program, it implements any of the impedance anomaly non-destructive location methods described above.

[0075] This application also provides a computer-readable storage medium, which includes volatile or non-volatile, removable or non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, computer program modules or other data). Computer-readable storage media include, but are not limited to, RAM (Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), flash memory or other memory technologies, CD-ROM (Compact Disc Read-Only Memory), DVD or other optical disc storage, magnetic cartridges, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible by a computer.

[0076] Those skilled in the art will understand that all or some of the steps, systems, or devices disclosed above, and their functional modules / units, can be implemented as software (using computer program code executable by a computing device), firmware, hardware, or suitable combinations thereof. In hardware implementations, the division between functional modules / units mentioned above does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed collaboratively by several physical components. Some or all physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as integrated circuits, such as application-specific integrated circuits (ASICs).

[0077] It should also be understood that references to "one embodiment" or "some embodiments" in the specification of embodiments of this application mean that one or more embodiments of this application include the specific features, structures, or characteristics described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and their variations all mean "including but not limited to," unless otherwise specifically emphasized in the description of embodiments of this application. Unless otherwise expressly limited, terms such as "setting," "installing," and "connecting" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in the embodiments of this application in conjunction with the specific content of the technical solution.

[0078] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A non-destructive method for locating impedance anomalies, applied to a circuit board, the circuit board including at least one signal line under test, the signal line under test having surface traces, characterized in that, include: Obtain the first impedance curve of the signal line under test; The first impedance curve characterizes the impedance information of the signal line under test; The horizontal axis of the first impedance curve represents the acquisition time, and the vertical axis of the first impedance curve represents the impedance at the acquisition position corresponding to the acquisition time, wherein the acquisition time corresponds to the acquisition position. When the first impedance curve contains abnormal impedance information, the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve is obtained to determine the abnormal location. The covering material is moved on the circuit board according to a preset moving trajectory, and a second impedance curve is obtained during the moving process; When a sudden change signal is detected in the second impedance curve, the second horizontal axis coordinate of the sudden change signal in the second impedance curve is obtained to determine the location of the sudden change. When the mutation location corresponds to the abnormal location, the impedance abnormality location of the signal line under test is located according to the position of the covering material on the circuit board.

2. The non-destructive impedance anomaly localization method according to claim 1, characterized in that, Obtaining the first impedance curve of the signal line under test includes: Connect the network analyzer probes to both ends of the signal line under test; The impedance information of the signal under test is continuously measured to obtain the first impedance curve of the signal under test line.

3. The non-destructive impedance anomaly localization method according to claim 1, characterized in that, When the first impedance curve contains abnormal impedance information, obtaining the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve to determine the abnormal location includes: At least one first peak value is obtained based on the first impedance curve; When the difference between the first peak value and the standard impedance is greater than or equal to the first threshold, the first peak value is defined as abnormal impedance information. The location of the abnormality is obtained by finding the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve.

4. The non-destructive impedance anomaly localization method according to claim 1, characterized in that, When a sudden change signal is detected in the second impedance curve, the second horizontal axis coordinate of the sudden change signal in the second impedance curve is obtained to determine the location of the sudden change, including: At least one second peak value is obtained based on the second impedance curve; When the difference between the second peak value and the standard deviation value is greater than or equal to the second threshold, the second peak value is defined as a sudden change signal; The location of the abrupt change is obtained by measuring the second horizontal axis coordinate of the abrupt change signal in the second impedance curve.

5. The non-destructive method for locating impedance anomalies according to any one of claims 1 to 4, characterized in that, The covering material includes one of the following: a piece of paper or a piece of resin.

6. The non-destructive impedance anomaly localization method according to any one of claims 1 to 4, characterized in that, When the mutation location corresponds to the abnormal location, the impedance abnormality location of the signal line under test is located based on the position of the covering material on the circuit board, including: When the difference between the first coordinate value of the abnormal location on the first horizontal axis and the second coordinate value of the mutation location on the second horizontal axis is less than a third threshold, the mutation location is defined to correspond to the abnormal location. Obtain the covering position of the covering material on the circuit board; The impedance anomaly location of the signal line under test is determined based on the covered position.

7. A non-destructive positioning system for impedance anomalies, characterized in that, An impedance detection system is used for circuit boards, wherein the circuit board includes at least one signal line to be tested. The system includes a testing platform, a robotic arm, a network analyzer, and a control device. The control device is connected to the robotic arm and the network analyzer, respectively. The testing platform is used to place the circuit board; The robotic arm includes a moving device and an actuator. The actuator is mounted on the moving device and is used to grasp or absorb covering material, so that the covering material moves on the circuit board along a preset trajectory as the moving device moves. The network analyzer includes a first probe and a second probe; The robotic arm is also used to move the first probe and the second probe so that the first probe and the second probe are respectively connected to the two ends of the signal line under test; The control device is used to control the network analyzer and the robotic arm to enable the impedance anomaly non-destructive positioning system to perform the impedance anomaly non-destructive positioning method according to any one of claims 1 to 6.

8. A non-destructive impedance anomaly location device, applied to a circuit board, the circuit board including at least one signal line to be tested, characterized in that, include: An impedance curve measurement module is used to obtain a first impedance curve of the signal line under test; the first impedance curve characterizes the impedance information of the signal line under test. The horizontal axis of the first impedance curve represents the acquisition time, and the vertical axis of the first impedance curve represents the impedance at the acquisition position corresponding to the acquisition time, wherein the acquisition time corresponds to the acquisition position. An abnormal location acquisition module is used to obtain the first horizontal axis coordinate of the abnormal impedance information in the first impedance curve when the first impedance curve contains abnormal impedance information, thereby obtaining the abnormal location. The moving module is used to move the covering material on the circuit board according to a preset moving trajectory; The impedance curve measurement module is also used to obtain a second impedance curve during the movement of the covering material. The abrupt change location acquisition module is used to acquire the second horizontal axis coordinate of the abrupt change signal in the second impedance curve when an abrupt change signal is detected in the second impedance curve, thereby obtaining the abrupt change location; An abnormal location positioning module is used to locate the impedance abnormality position of the signal line under test based on the position of the covering material on the circuit board when the sudden change position corresponds to the abnormal position.

9. An electronic device, comprising a memory, a processor, a communication bus, a communication interface, and a computer program stored in the memory and executable on the processor, characterized in that, The communication bus is used to enable communication between the processor and the memory; When the processor executes the computer program, it implements the impedance anomaly non-destructive location method as described in any one of claims 1 to 6.

10. A storage medium, wherein the storage medium is a readable storage medium, characterized in that, The readable storage medium stores a computer program for causing a computer to execute: the non-destructive impedance anomaly localization method as described in any one of claims 1 to 6.

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