Electronic devices and display modules

Abstract

This application provides an electronic device and a display module. The electronic device includes a display module and a motherboard. The display module includes a display panel, a ribbon cable circuit board, and a flexible output circuit board. The display panel includes a display section, a bending section, and a packaging section connected in sequence. The packaging section is bent to the back side of the light-emitting surface of the display section via the bending section. The packaging section includes a first end and a second end. The first end is the end of the packaging section away from the bending section, and the second end is the end of the packaging section connected to the bending section. The ribbon cable circuit board is bonded to the packaging section. The motherboard is located on the side of the packaging section opposite to the display section. One end of the flexible output circuit board is connected to the wide side of the ribbon cable circuit board, and the other end is connected to the motherboard. The extension direction of the wide side of the ribbon cable circuit board is consistent with the direction from the first end to the second end of the packaging section. This application provides an electronic device and a display module that can improve battery capacity.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to an electronic device and a display module. BACKGROUND

[0002] With the continuous popularity of electronic devices, electronic devices gradually develop towards the direction of extreme thinness, and at the same time, users' requirements for the battery capacity of electronic devices are continuously increasing. The thinness of electronic devices leads to limited internal space of the whole machine, which will inevitably compress the space of the battery, so it is required that the display module and other components of the electronic device improve compactness to leave enough space for the battery.

[0003] In the related art, the display module can adopt a flexible screen. In the packaging mode of the flexible screen, a COP (Chip On Pi, chip binding on a polyimide film of a display panel) packaging process bends the packaging part on the back side of the display part, and the flat cable circuit board is bound on the packaging part. The flat cable circuit board is connected to the mainboard in the electronic device through the flexible wire-out circuit board.

[0004] However, in the related art, the flexible wire-out circuit board generally wires out from the middle of the long side of the flat cable circuit board. The flat cable circuit board needs to be broken and an anti-cracking groove is added at the wire-out position, which will waste the space of the flat cable circuit board and the wiring space, resulting in reduction of the battery capacity. SUMMARY

[0005] The electronic device and the display module provided by the embodiments of the present application can improve the battery capacity.

[0006] The electronic device provided by the embodiments of the present application comprises a display module and a mainboard. The display module comprises a display panel, a flat cable circuit board and a flexible wire-out circuit board. The display panel comprises a display part, a bending part and a packaging part connected in sequence. The packaging part is bent to the back side of the light-out surface of the display part through the bending part. The packaging part comprises a first end and a second end. The first end is the end of the packaging part away from the bending part, and the second end is the end of the packaging part connected with the bending part. The flat cable circuit board is bound on the packaging part. The mainboard is located on the side of the packaging part away from the display part. One end of the flexible wire-out circuit board is connected to the wide side of the flat cable circuit board, and the other end is connected to the mainboard. The extension direction of the wide side of the flat cable circuit board is consistent with the direction in which the first end points to the second end.

[0007] The flexible wire-out circuit board is arranged to wire out from the wide side of the flat cable circuit board. Compared with the scheme of wiring out from the middle of the flat cable circuit board in the related art, the anti-cracking groove does not need to be arranged by damaging the flat cable circuit board, and the space of the electronic device for components and wiring is not wasted, thereby being conducive to improvement of the battery capacity. Moreover, the wide-side wire-out does not cause the middle frame to be broken, and therefore does not affect the strength of the whole machine, so the reliability of the electronic device can be improved.

[0008] In a possible implementation, the flat cable circuit board is a multi-layer printed circuit board or a multi-layer flexible circuit board, and the flexible wire-out circuit board is a single-layer flexible circuit board or a multi-layer flexible circuit board, and the flexible wire-out circuit board is wired out from any one layer or any multiple layers of the flat cable circuit board.

[0009] The flat cable circuit board is designed as a multi-layer circuit board, and the space on the packaging part can be utilized, that is, the space in the thickness direction of the electronic device is fully utilized, and when the area of the packaging part is small, the space utilization rate of the flat cable circuit board can be fully utilized by increasing the number of wiring layers. The flexible wire-out circuit board is a single-layer or multi-layer flexible circuit board, and the wiring area can be increased.

[0010] In a possible implementation, the flexible wire-out circuit board includes a connecting section and a main body section, the main body section is bent to the side of the flat cable circuit board away from the packaging part through the connecting section, and the main body section is connected to the main board.

[0011] In a possible implementation, a plurality of electronic devices are arranged on the surface of the flat cable circuit board away from the packaging part, and the height of the main body section relative to the flat cable circuit board is greater than the height of the electronic devices.

[0012] In this way, the flexible wire-out circuit board and the electronic devices can be prevented from interfering with each other.

[0013] In a possible implementation, the electronic device further includes a middle frame connected to the back side of the light-emitting surface of the display part, and the main board is connected to the side of the middle frame away from the packaging part; the middle frame and the main board are both provided with avoiding holes for avoiding the electronic devices.

[0014] The middle frame and the main board are designed to avoid the electronic devices, so that the electronic devices have more layout space in the thickness direction of the electronic device, and the flexible wire-out circuit board can be wired out from the flat cable circuit board and connected to the main board.

[0015] In a possible implementation, the end of the main body section is connected with a board-to-board connector, and the board-to-board connector is buckled on the surface of the main board away from the flat cable circuit board.

[0016] The flexible wire-out circuit board is buckled and connected to the main board through the half-to-half connector, so that the operability and reliability of the connection can be ensured.

[0017] In a possible implementation, the limit design value of the spacing between the main body section and the flat cable circuit board is the sum of the limit values of the gap, the thickness of the middle frame, the thickness of the main board, and the height of the board-to-board connector; and the limit value of the gap is 0, and the limit value of the thickness of the middle frame is 0.

[0018] The spacing between the main body section of the flexible wire-out circuit board and the flat cable circuit board affects the wire-out position and the bending radius of the flexible wire-out circuit board, and the limit design is beneficial to the thinness of the electronic device.

[0019] In a possible implementation, the flat cable circuit board is arranged on the side of the packaging portion away from the display portion, and is arranged between the first end and the second end. The first binding area is arranged on the packaging portion and located at the first end. The flat cable circuit board is bound in the first binding area.

[0020] In a possible implementation, part of the flat cable circuit board is bound in the first binding area on the packaging portion. Alternatively, the flat cable circuit board is bound in the first binding area through a flexible binding circuit board.

[0021] By binding the flat cable circuit board on the packaging portion of the display panel bent to the back side of the light-emitting surface, the length and width occupied by the flat cable circuit board can be reduced, thereby providing more space for the battery and improving the battery capacity of the electronic device.

[0022] In a possible implementation, the display module further includes a driving chip. The driving chip is arranged on the side of the packaging portion away from the display portion, and is bound on the packaging portion.

[0023] By binding the driving chip on the packaging portion of the display panel bent to the back side of the light-emitting surface, the length and width occupied by the flat cable circuit board can be reduced, thereby providing more space for the battery and improving the battery capacity of the electronic device.

[0024] In a possible implementation, the display module further includes a waterproof back adhesive. The waterproof back adhesive is arranged on the surface of the flat cable circuit board away from the packaging portion. The waterproof back adhesive is arranged at the end of the flat cable circuit board close to the bent portion and extends along the length direction of the flat cable circuit board. The waterproof back adhesive covers the entire length of the flat cable circuit board. The waterproof back adhesive is attached between the flat cable circuit board and the middle frame.

[0025] The waterproof back adhesive can be filled in the Z-direction space between the packaging portion and the middle frame, thereby preventing external liquid from entering the packaging portion and preventing the liquid from damaging the flat cable circuit board. Since the flexible wire-out circuit board is arranged on the wide side of the flat cable circuit board, the flexible wire-out circuit board does not affect the arrangement of the waterproof back adhesive. The waterproof back adhesive can be arranged in a straight line, thereby solving the defects caused by the part wire-out in the related art.

[0026] In another aspect, an embodiment of the present application provides a display module, comprising a display panel, a flat cable circuit board and a flexible wire-out circuit board; the display panel comprises a display part, a bending part and an encapsulation part, the encapsulation part is bent to the back side of the light-emitting surface of the display part through the bending part, the encapsulation part comprises a first end and a second end, the first end is the end of the encapsulation part away from the bending part, and the second end is the end of the encapsulation part connected with the bending part, the flat cable circuit board is bound on the encapsulation part; one end of the flexible wire-out circuit board is connected on the wide side of the flat cable circuit board, and the other end is used for connecting a mainboard, wherein the extension direction of the wide side of the flat cable circuit board is consistent with the direction in which the first end points to the second end.

[0027] An embodiment of the present application provides an electronic device and a display module, the flexible wire-out circuit board is arranged to wire out on the wide side of the flat cable circuit board, compared with the scheme of wiring out from the middle of the long side of the flat cable circuit board in the related art, the flat cable circuit board does not need to be arranged with a crack-preventing groove, and the electronic device is not wasted in the layout and wiring space, so that the battery capacity is improved. The wide side wire-out does not cause the middle frame to be designed with a hole, so that the overall strength is not affected, and the reliability of the electronic device is improved. The wide side wire-out scheme is also applicable to the scheme of binding the flat cable circuit board on the encapsulation part of the display panel bent to the back side of the light-emitting surface, the length and width dimensions occupied by the flat cable circuit board can be reduced, and compared with the scheme of wiring out from the middle of the long side, the flat cable circuit board does not interfere with subsequent processes in the assembly process, and the assembly difficulty is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 A structural schematic diagram of an electronic device provided by an embodiment of the present application is provided;

[0029] Figure 2 A structural schematic diagram of a display module, a middle frame, a mainboard and a battery after assembly provided by an embodiment of the present application is provided;

[0030] Figure 3 An exploded structural schematic diagram of a display module, a middle frame, a mainboard and a battery provided by an embodiment of the present application is provided;

[0031] Figure 4 A partial cross-sectional schematic diagram of a display module provided by an embodiment of the present application is provided;

[0032] Figure 5 A simplified structural schematic diagram of a display module provided by the related art is provided;

[0033] Figure 6 A simplified structural schematic diagram of a display module provided by an embodiment of the present application is provided;

[0034] Figure 7 A binding and wire-out structural schematic diagram of a flat cable circuit board provided by an embodiment of the present application is provided;

[0035] Figure 8A top view of a packaging part provided by an embodiment of the present application;

[0036] Figure 9 A schematic diagram of a flexible binding circuit board and a wire circuit board provided by an embodiment of the present application;

[0037] Figure 10 A top view of a waterproof structure of a display module provided by the related art;

[0038] Figure 11 A side view of a waterproof structure of a display module provided by the related art;

[0039] Figure 12 A schematic diagram of a waterproof structure of a display module provided by an embodiment of the present application;

[0040] Figure 13 A position diagram of a flexible wire-out circuit board provided by the related art;

[0041] Figure 14 A position diagram of a flexible wire-out circuit board provided by an embodiment of the present application;

[0042] Figure 15 An enlarged view of the structure in the dashed box in Figure 3 An enlarged view of the structure in the dashed box in

[0043] Figure 16 An enlarged view of the structure in the dashed box in Figure 2 An enlarged view of the structure in the dashed box in

[0044] Figure 17 A waterproof scheme diagram corresponding to a flexible wire-out circuit board provided by the related art;

[0045] Figure 18 A waterproof scheme diagram corresponding to a flexible wire-out circuit board provided by an embodiment of the present application;

[0046] Figure 19 An expanded structure diagram of a packaging part provided by the related art;

[0047] Figure 20 An expanded structure diagram of a packaging part provided by an embodiment of the present application;

[0048] Figure 21a A structure diagram of a display module provided by an embodiment of the present application;

[0049] Figure 21b A partial cross-sectional diagram of a display module provided by an embodiment of the present application;

[0050] Figure 21c A simplified structure diagram of a display module provided by an embodiment of the present application;

[0051] Figure 22a A structural schematic diagram of a display module according to an embodiment of the present application is shown in FIG. 1.

[0052] Figure 22b A partial cross-sectional schematic diagram of a display module according to an embodiment of the present application is shown in FIG. 2.

[0053] Figure 23 A simplified structural schematic diagram of a display module according to an embodiment of the present application is shown in FIG. 3.

[0054] Figure 24 A schematic diagram of a binding-outline structure of a flat cable circuit board according to an embodiment of the present application is shown in FIG. 4.

[0055] Figure 25 A top view of a packaging portion according to an embodiment of the present application is shown in FIG. 5.

[0056] Figure 26 A schematic diagram of a wiring on a flexible binding circuit board and a flat cable circuit board according to an embodiment of the present application is shown in FIG. 6.

[0057] Figure 27 A schematic diagram of a waterproof structure of a display module according to an embodiment of the present application is shown in FIG. 7.

[0058] Figure 28a A structural schematic diagram of a display module according to an embodiment of the present application is shown in FIG. 8.

[0059] Figure 28b A partial cross-sectional schematic diagram of a display module according to an embodiment of the present application is shown in FIG. 9.

[0060] Figure 28c A simplified structural schematic diagram of a display module according to an embodiment of the present application is shown in FIG. 10.

[0061] Figure 29a A structural schematic diagram of a display module according to an embodiment of the present application is shown in FIG. 11.

[0062] Figure 29b A partial cross-sectional schematic diagram of a display module according to an embodiment of the present application is shown in FIG. 12.

[0063] Figure 30 A simplified structural schematic diagram of a display module according to an embodiment of the present application is shown in FIG. 13.

[0064] Figure 31 A top view of a packaging portion according to an embodiment of the present application is shown in FIG. 14.

[0065] Figure 32a A schematic diagram of a wiring on a flexible binding circuit board and a flat cable circuit board according to an embodiment of the present application is shown in FIG. 15.

[0066] Figure 32b A schematic diagram of another wiring on a flat cable circuit board according to an embodiment of the present application is shown in FIG. 16.

[0067] Figure 33 A schematic view of a waterproof structure of a display module provided by an embodiment of the present application;

[0068] Figure 34a A top view of a display module in an unfolded state of a display panel provided by the related art;

[0069] Figure 34b A side sectional view of a display module in a folded state of a display panel provided by the related art;

[0070] Figure 35a A top view of a display module in an unfolded state of a display panel provided by an embodiment of the present application;

[0071] Figure 35b A side sectional view of a display module in a folded state of a display panel provided by an embodiment of the present application;

[0072] Figure 36a A top view of a display module in an unfolded state of a display panel provided by an embodiment of the present application;

[0073] Figure 36b A side sectional view of a display module in a folded state of a display panel provided by an embodiment of the present application;

[0074] Figure 37a A top view of a display module in an unfolded state of a display panel provided by an embodiment of the present application;

[0075] Figure 37b A side sectional view of a display module in a folded state of a display panel provided by an embodiment of the present application.

[0076] Explanation of reference signs:

[0077] 100 - display module; 11 - display panel; 111 - display part; 112 - folding part; 113 - packaging part; 1131 - first binding area; 1132 - second binding area;

[0078] 12 - driving chip; 13 - flat cable circuit board; 13a - first subarea; 13b - second subarea; 1301 - wiring layer; 1302 - insulating layer; 1303 - extension area; 131 - electronic device; 1321 - through hole; 1322 - blind hole;

[0079] 14 - flexible binding circuit board; 140 - binding pin; 141 - extension section; 142 - transition section; 143 - binding section; 144 - support; 15 - flexible flat cable circuit board; 151 - connection section; 152 - main body section; 16 - metal plate; 17 - cover plate;

[0080] 181 - waterproof point glue; 182 - waterproof back glue; 191 - grounding point; 192 - conductive connector; 193 - conductive wire;

[0081] 200 - middle frame; 21 - avoiding hole; 300 - back cover; 400 - battery; 500 - mainboard; 50 - board-to-board connector; 51 - avoiding hole. DETAILED DESCRIPTION

[0082] "Mobile office" can also be called "3A office", or mobile OA (Office Automation), that is, office workers can handle anything (Anything) related to business at any time (Anytime) and any place (Anywhere). This new office mode can free office workers from the constraints of time and space, and unit information can be smoothly interacted at any time and any place, work will be more relaxed and effective, and the overall operation will be more coordinated. At the same time, by using mobile information software on electronic devices such as mobile phones, a mobile information software application system can be established to realize interconnection between mobile phones and computers, to break through the limitations of time and place, to carry out on-the-spot company management and communication at any time, and to promote the growth of government and enterprise benefits.

[0083] No matter whether it is a straight phone, a folding screen phone or a tablet computer, these electronic devices should be as thin as possible to fully exert the advantages of mobile office. Limited by the bottleneck of current battery technology, the whole machine endurance will become the key bottleneck factor of the thinness of the electronic device. Therefore, how to maximize the battery capacity in a limited space to bring the best experience for mobile office has become a key link of the competitiveness of the whole electronic device.

[0084] In the related art, the display module of the electronic device often adopts a COP (Chip On Pi, chip binding on the polyimide film of the display panel) packaging process, and a flexible substrate is used to fold the packaging part on the display panel for binding the flat cable and the chip to the back side of the display part. In the related art, the size of the flexible circuit board region bound by COP is large, which largely occupies the length and width dimension space of the electronic device, and generates a lot of invalid space for the battery in the electronic device, which is the main factor of the loss of battery capacity.

[0085] Based on this problem, the display module and the electronic device provided by the embodiments of the present application bind the flat cable circuit board and the driving chip on the packaging part of the display panel folded to the back side of the light emitting surface, which can reduce the length and width dimensions occupied by the flat cable circuit board, thereby providing more space for the battery and improving the battery capacity of the electronic device.

[0086] The following embodiments of the application provide an electronic device, including but not limited to a mobile phone, a foldable screen mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a wearable device, a virtual reality device, a wireless U disk, a Bluetooth sound box, a Bluetooth headset, or a vehicle-mounted device, and the like, which is an electronic device with a display screen.

[0087] In the embodiments of the application, a mobile phone is taken as an example of the above-mentioned electronic device to specifically describe the structure of the electronic device.

[0088] It should be noted that in each of the drawings of the embodiments of the application, the X-axis can be defined as the length direction of the electronic device, the Y-axis can be defined as the width direction of the electronic device, and the Z-axis can be defined as the thickness direction of the electronic device, and more specifically, the light-out surface of the display screen of the electronic device can be defined as the positive direction of the Z-axis.

[0089] Figure 1 The structure schematic diagram of the electronic device provided by an embodiment of the application is shown in FIG. 1. Figure 1 As shown in FIG. 1, the electronic device can include a middle frame 200, and a display module 100 and a back cover 300 connected to the two sides of the middle frame 200 respectively, and the display module 100, the middle frame 200 and the back cover 300 collectively enclose a containing space, in which a mainboard, a battery, a camera module and other electronic devices can be arranged.

[0090] The display module 100 can include a liquid crystal display (LCD), an organic light emitting diode (OLED) display panel or other display panels. The middle frame 200 mainly plays a supporting role for the whole machine and can be made of metal, ceramic, glass, plastic or the like. The back cover 300 can be made of metal, ceramic, glass, plastic or the like, and the middle frame 200 and the back cover 300 can be separately formed and fixed by welding, clamping, bonding or the like.

[0091] Figure 2 The structure schematic diagram of the assembled display module, middle frame, mainboard and battery provided by an embodiment of the application is shown in FIG. 2. Figure 3 The exploded structure schematic diagram of the display module, middle frame, mainboard and battery provided by an embodiment of the application is shown in FIG. 3. Figure 2 Figure 3 ​As shown, the display module 100 can be connected on one side of the middle frame 200, for example, the lower side in the figure, and the display module 100 can be fixed on the middle frame 200 by bonding. The mainboard 500 and the battery 400 can be arranged on the side of the middle frame 200 away from the display module 100, i.e., between the middle frame 200 and the back cover 300.

[0092] The mainboard 500 can be fixed and connected on the middle frame 200 by bonding, screwing, etc., and the battery 400 can be fixed and connected on the middle frame 200 by bonding, etc. The display module 100 and the battery 400 can be electrically connected to the mainboard 500 by flexible circuit boards, cables, conductive parts, etc. The shape of the mainboard 500 and the positional relationship between the mainboard 500 and the battery 400 are not specifically limited in the embodiments of the present application. For example, the mainboard 500 can be arranged in the shape of a "U" around the battery 400.

[0093] Figure 4 A partial cross-sectional view of a display module according to an embodiment of the present application is provided. Referring to Figure 3 and Figure 4 As shown, the display module 100 can include a display panel 11, a driver IC 12, a flat cable circuit board 13, a flexible bonding circuit board 14, and a flexible wire-out circuit board 15.

[0094] The driver IC 12 can be bonded on the display panel 11 to drive the display panel 11 to realize display functions. The flat cable circuit board 13 can be bonded on the display panel 11 through the flexible bonding circuit board 14, and various electronic devices 131 such as fingerprint module chips can be arranged on the flat cable circuit board 13. One end of the flexible wire-out circuit board 15 can extend from the side wall of the flat cable circuit board 13, and the other end can be connected to the mainboard 500, for example, can be buckled on the mainboard 500 through a board-to-board connector (BTB), so as to realize the electrical connection between the display module 100 and the mainboard 500. The driver IC 12, the flat cable circuit board 13, the flexible bonding circuit board 14, and the flexible wire-out circuit board 15 can be arranged on the back side of the light-out surface of the display panel 11, and the electronic devices 131 are arranged on the side of the flat cable circuit board 13 away from the display panel 11.

[0095] It should be understood that bonding, also known as bonding, refers to a wire bonding method in microelectronic device production and packaging processes, for example, using a metal wire (gold wire, etc.), using heat or ultrasonic energy to complete the connection of internal interconnection lines of solid-state circuits in microelectronic devices. The process can include pressure welding, wire bonding, bonding, ball welding, flat welding, etc. For example, the driver IC 12 is bonded on the display panel 11, i.e., the driver IC 12 is physically fixed and electrically connected to the display panel by welding, etc.

[0096] The middle frame 200 can be provided with a relief hole 21, and the main board 500 can be provided with a relief hole 51. The relief holes 21 and 51 correspond to the positions of the electronic device 131 and the flexible wire-out circuit board 15, so as to avoid the electronic device 131 and the flexible wire-out circuit board 15, so that the electronic device 131 has a larger layout space in the Z direction, and the flexible wire-out circuit board 15 can be extended from the wire-out circuit board 13 and connected to the main board 500.

[0097] The display panel 11 can include a display part 111, a bending part 112, and an encapsulation part 113. The encapsulation part 113 can be bent to the back side of the light-out surface of the display part 111 through the bending part 112. The display part 111 is used to provide a display picture for the electronic device, and the encapsulation part 113 is used to bind the driving chip 12 and the wire-out circuit board 13. The display panel 11 can be a flexible part made of a material such as a polyimide film, and the encapsulation part 113 can be bent to the back side of the light-out surface of the display part 111 to reduce the occupation of the length and width dimensions of the electronic device.

[0098] The encapsulation part 113 can include a first end and a second end. The first end is an end of the encapsulation part 113 away from the bending part 112, and the second end is an end of the encapsulation part 113 connected to the bending part 112. It should be understood that the direction from the first end of the encapsulation part 113 to the second end can be defined as the width direction of the encapsulation part 113, that is, the X direction in the figure.

[0099] It should be noted that the "first end" and the "second end" refer to two ends of a structure that are away from each other in a predetermined direction, that is, the "first end" and the "second end" are the concepts of one end and the other end, rather than the "end face" (that is, the side wall) of a structure. For example, the first end and the second end of the encapsulation part 113 are respectively an end away from the bending part 112 and an end connected to the bending part 112, rather than the end face (that is, the side wall) of the encapsulation part 113. In addition, it should be understood that the "first end" and the "second end" respectively refer to a length of the region at both ends of the structure, and do not limit the distance from the end face. For example, the first end of the encapsulation part 113 can refer to a range within a first threshold from the end face of the encapsulation part 113 away from the bending part 112. The first threshold can be, for example, 0-10 mm.

[0100] For ease of description, the width extension direction of the encapsulation part 113 can be defined as the direction from the first end to the second end of the encapsulation part 113, that is, the X direction in the figure. The opposite side of the encapsulation part 113 to the bending part 112 is the length direction, that is, the length direction of the wire-out circuit board 13 is the Y direction in the figure. At the same time, the length and width directions of the flexible binding circuit board 14 are consistent with the length and width directions of the encapsulation part 113, and the length direction is also the Y direction in the figure, and the width direction is the X direction in the figure.

[0101] The flat cable circuit board 13 can be arranged on the side of the packaging portion 113 opposite to the display portion 111, and the flat cable circuit board 13 can be arranged between the first end and the second end of the packaging portion 113, that is, the entire width of the flat cable circuit board 13 is located on the packaging portion 113.

[0102] The flat cable circuit board 13 can be adhered to the packaging portion 113 by adhesive, and the flat cable circuit board 13 can be bound to the packaging portion 113. The first binding area 1131 can be arranged on the surface of the packaging portion 113 opposite to the display portion 111, and the first binding area 1131 can be arranged at the first end of the packaging portion 113.

[0103] In an embodiment, the flat cable circuit board 13 can be bound in the first binding area 1131 by a flexible binding circuit board 14. One end of the flexible binding circuit board 14 can be connected to the flat cable circuit board 13, and the other end can be bound in the first binding area 1131. The second binding area 1132 can also be arranged on the surface of the packaging portion 113 opposite to the display portion 111, and the driving chip 12 can be bound in the second binding area 1132. The second binding area 1132 can be arranged between the first binding area 1131 and the bending portion 112, and the second binding area 1132 and the first binding area 1131 can have a spacing therebetween to avoid interference with each other.

[0104] In a possible implementation, the first binding area 1131 can be arranged in a long strip shape, and the length thereof can be as large as possible on the basis of being less than the length of the packaging portion 113, so as to have a smaller width to achieve the same binding area. The position of the second binding area 1132 can not be specifically limited, and for example, the second binding area 1132 can be arranged between the first binding area 1131 and the bending portion 112. The number of the second binding area 1132 can depend on the number of the driving chip 12, and for example, the number of the second binding area 1132 can be two.

[0105] The flat cable circuit board 13 can be a multi-layer printed circuit board (PCB) or a multi-layer flexible printed circuit (FPC). The flat cable circuit board 13 can have a plurality of wiring layers, and the number of the wiring layers can be greater than or equal to two, for example, the number of the wiring layers can be four or six. Increasing the number of the wiring layers is conducive to fully utilizing the space in the thickness direction of the electronic device and reducing the occupation of the length and width dimensions of the electronic device.

[0106] The flexible binding circuit board 14 can be a single-layer flexible circuit board to connect the flat cable circuit board 13 and the first binding area 1131. The flexible binding circuit board 14 can be connected from one of the wiring layers of the flat cable circuit board 13, and the flexible binding circuit board 14 can be connected from any one of the wiring layers on the side wall of the flat cable circuit board 13. The specific connection position can not be limited.

[0107] In one scenario, the height of the driver chip 12 relative to the package 113 (including the thickness of the driver chip 12 itself and the thickness of the bonding solder) is less than the height of the ribbon cable circuit board 13 relative to the package 113 (including the thickness of the ribbon cable circuit board 13 itself and the thickness of the adhesive).

[0108] At this time, the flexible bonding circuit board 14 extends from the upper part of the ribbon circuit board 13, so that the flexible bonding circuit board 14 can cover the driver chip 12. The position of the flexible bonding circuit board 14 on the ribbon circuit board 13 relative to the height of the package portion 113 is greater than or equal to the height of the driver chip 12 relative to the package portion 113. The driver chip 12 can be located between the flexible bonding circuit board 14 and the first bonding area 1131, and the driver chip 12 is located between the ribbon circuit board 13 and the package portion 113.

[0109] In one possible implementation, the flexible bonding circuit board 14 may include an extension section 141, a transition section 142, and a bonding section 143 connected in sequence. The extension section 141 is connected to one of the wiring layers of the ribbon cable circuit board 13, and the driver chip 12 is located below the extension section 141. The bonding section 143 is bonded within a first bonding area 1131. The transition section 142 is bent to allow for a smooth transition between the extension section 141 and the bonding section 143, ensuring the reliability of the bonding section 143 soldering.

[0110] In this embodiment, a support member 144 may also be provided. The support member 144 may be made of materials such as foam. The height of the support member 144 is greater than the height of the driver chip 12. The support member 144 is located between the driver chip 12 and the first bonding area 1131. The support member 144 is used to support the extension segment 141 to prevent the extension segment 141 from interfering with the driver chip 12. Furthermore, the height of the connection between the extension segment 141 and the ribbon circuit board 13 is the same as the height of the support member 144. The support member 144 can ensure that the extension segment 141 remains horizontal.

[0111] Continue to refer to Figure 4 As shown, the display module 100 may also include a metal plate 16 and a cover plate 17. The metal plate 16 may be attached to the back side of the light-emitting surface of the display unit 111 to support the display module 100, increase the structural strength of the display module 100, and serve as the grounding terminal of the display module 100. The cover plate 17 is attached to the light-emitting surface side of the display unit 111 to protect the display unit 111.

[0112] Figure 5 A simplified structural diagram of a display module provided for related technologies, for reference. Figure 5As shown, in the related technology, the packaging section 113 can be bent to the back side of the display section 111 via the bending section 112. The driver chip 12 is bound to the side of the packaging section 113 facing away from the display section 111. The ribbon circuit board 13 is located beside the packaging section 113 and is bound to the packaging section 113 via a flexible circuit board. The ribbon circuit board 13 is located on the side of the packaging section 113 facing away from the bending section 112, extends in the positive direction of the X-axis, and can be fastened to the main board 500 via a board-to-board connector 50. At this time, the X-axis dimension occupied by the ribbon circuit board 13 is D1, and the presence of D1 significantly affects the space of the battery 400.

[0113] In one related technology, D1 is reduced by integrating the electronic components 131 on the ribbon cable circuit board 13, thereby reducing the board area. However, this solution requires custom development of components, which is costly and cannot utilize currently available mature components, necessitating extensive verification of reliability issues. In another related technology, D1 can be reduced by setting the ribbon cable circuit board 13 as a rigid-flex board; however, this solution not only increases cost but also presents significant manufacturing challenges. Overall, the solutions provided by these related technologies can only continuously reduce D1 at a high cost, with a design value of 6mm in extreme cases, making it impossible to reduce it to 0.

[0114] Figure 6 This is a simplified structural diagram of a display module provided in one embodiment of this application. (See reference...) Figure 6 As shown in this embodiment, the ribbon cable circuit board 13 is configured as a multilayer circuit board and is bonded to the first bonding area 1131 on the package portion 113 by a single-layer flexible bonding circuit board 14. By both the ribbon cable circuit board 13 and the flexible bonding circuit board 14 are disposed on the package portion 113, and both the ribbon cable circuit board 13 and the flexible bonding circuit board 14 are located between the first end and the second end of the package portion 113, it is equivalent to... Figure 5 In the related technology, the ribbon circuit board 13 is reverse-laid onto the package section 113 in the X direction, which can maximize the use of the space on the package section 113, compared to Figure 5 As can be seen, D1 is reduced to 0 in this embodiment of the application. Therefore, the solution provided by this embodiment of the application can significantly increase the layout space of the battery 400.

[0115] It should also be noted that the X-axis dimension occupied by the packaging section 113 is D2. With the size of the packaging section 113 remaining constant, the area that the ribbon cable circuit board 13 can occupy is limited. In this embodiment, the ribbon cable circuit board 13 is configured as a multi-layer board to increase the ribbon cable area; for example, this multi-layer board can be a four-layer board. In one possible implementation, the X-axis dimension occupied by the packaging section 113 can be further reduced to provide more space for the battery 400. In this case, the ribbon cable circuit board 13 can adaptively increase the number of layers, for example, by configuring it as a six-layer board, to ensure the ribbon cable area. It should be understood that the solution provided in this embodiment shows a more significant advantage in space utilization when the area of ​​the packaging section 113 is smaller.

[0116] Figure 7 This is a schematic diagram of the bonding wire output structure of a ribbon circuit board according to an embodiment of this application. (Reference) Figure 7 As shown, the overall width of the package 113 can be D2, the width of the ribbon circuit board 13 can be D3, and the width of the flexible bonding circuit board 14 can be D4. The ribbon circuit board 13 is a multilayer circuit board, including multiple wiring layers 1301 and an insulating layer 1302 disposed between two adjacent wiring layers 1301. The flexible bonding circuit board 14 can be formed by routing out one of the wiring layers 1301 in the ribbon circuit board 13. This wiring layer 1301 can be any wiring layer 1301 in the ribbon circuit board 13 that is higher than the driver chip 12, so as to ensure that the routing height is greater than the height of the driver chip 12 and prevent the flexible bonding circuit board 14 from interfering with the driver chip 12.

[0117] In addition, it should be understood that the lead-out height of the flexible bonding circuit board 14 is related to the height of each wiring layer 1301 of the ribbon circuit board 13. When the lead-out height of the flexible bonding circuit board 14 is slightly lower than the height of the driver chip 12, the height of the ribbon circuit board 13 can be increased by increasing the thickness of the adhesive between the ribbon circuit board 13 and the package 113 to avoid the flexible bonding circuit board 14 interfering with the driver chip 12.

[0118] Furthermore, the routing layer 1301, which serves as the outgoing trace, can be the layer closest in height to the driver chip 12 to reduce the gap between the extension section 141 and the bonding section 143, preventing excessive gaps from causing poor soldering. This solution is beneficial for effectively placing the driver chip 12 using the Z-axis space of the ribbon circuit board 13, resulting in a reasonable spatial layout.

[0119] The bonding scheme for the ribbon circuit board 13 provided in the above-described embodiments of this application can be applied to situations where the thickness of the ribbon circuit board 13 is greater than the height of the driver chip 12. In one specific embodiment, the ribbon circuit board 13 can be a six-layer board with a thickness of approximately 0.35 mm, and the driver chip 12 has a thickness of approximately 0.25 mm.

[0120] Figure 8 This is a top view of the packaging section provided in one embodiment of this application. Figure 9 This is a schematic diagram of the wiring on a flexible bonding circuit board and a ribbon cable circuit board provided in an embodiment of this application. Figure 9 for Figure 8 A magnified diagram of the internal wiring within the area enclosed by the dashed box. (Reference) Figure 8 and Figure 9 As shown, the bonding section 143 of the flexible bonding circuit board 14 is provided with bonding pins 140 for bonding with the first bonding area 1131. The remaining areas of the flexible bonding circuit board 14 are provided with traces connected to the bonding pins 140. The extension direction of the traces is consistent with the width direction of the flexible bonding circuit board 14. The traces can communicate with the vias and ribbon cables in the ribbon circuit board 13. Traces can be routed on the multiple layers of the ribbon circuit board 13.

[0121] Figure 10 A top view schematic diagram of the waterproof structure of a display module provided for related technologies. Figure 11 A side view of the waterproof structure of a display module provided for related technologies. (Reference) Figure 10 and Figure 11 As shown, in related technologies, waterproof protection of the ribbon cable circuit board 13 is achieved by providing positive adhesive 1801 and back adhesive 1802 on the front (light-emitting surface side) and back (light-emitting surface back side) of the first bonding area 1131, respectively.

[0122] Figure 12 This is a schematic diagram of the waterproof structure of a display module provided in one embodiment of this application. (Reference) Figure 12 As shown in this embodiment, waterproof adhesive 181 can be provided on the edges of three sides (excluding the side facing the bending portion 112) of the flexible bonding circuit board 14. The waterproof adhesive 181 can fill the gap (Z-direction space) between the flexible bonding circuit board 14 and the encapsulation portion 113, which can prevent liquid from entering below the flexible bonding circuit board 14 and prevent liquid from damaging the flexible bonding circuit board 14 and the driver chip 12.

[0123] Meanwhile, a waterproof adhesive 182 can be provided on one edge of the encapsulation part 113 near the bending part 112. The length of the waterproof adhesive 182 is the same as the length of the encapsulation part 113. The waterproof adhesive 182 can fill the Z-direction space between the encapsulation part 113 and the middle frame 200, which can prevent external liquid from entering the encapsulation part 113 and prevent liquid from damaging the ribbon circuit board 13.

[0124] The waterproof adhesive 182 can be applied to one end of the ribbon cable circuit board 13 near the bend 112 and extend along the length of the ribbon cable circuit board 13, covering the entire length of the ribbon cable circuit board 13. The projections of the waterproof adhesive 181 and the waterproof adhesive 182 on the encapsulation part 113 can form a closed shape, that is, the two can together form a complete sealed space, providing waterproof protection for the entire encapsulation part 113 of the display module 100.

[0125] It should be noted that the waterproof adhesive 182 in this embodiment is arranged in a straight line, which is due to the design of the flexible lead-out circuit board 15. The structure of the flexible lead-out circuit board 15 will be described below with reference to the accompanying drawings and specific embodiments.

[0126] Figure 13 A schematic diagram showing the location of the flexible outgoing circuit board provided for related technologies. (Reference) Figure 13 As shown, in the related technology, the flexible output circuit board 15 is located in the middle of the long side of the ribbon circuit board 13, and the long side of the ribbon circuit board 13 refers to the side opposite to the bent portion 112.

[0127] This design presents several problems: First, the cable exiting from the center of the ribbon circuit board 13 requires a break in the board and the addition of anti-crack grooves. This wastes space in the XY direction for component placement and wiring within the limited architectural space, resulting in a reduction in battery capacity. Second, when the flexible cable exiting circuit board 15 is located in the center of the ribbon circuit board 13, the board-to-board connector that it is attached to is also located in the middle of the entire device. This location necessitates a partial opening in the middle frame 200 to allow the flexible cable exiting circuit board 15 to engage with the board-to-board connector. Given the maximum wall thickness of the middle frame 200, the central opening significantly impacts the three-bar bending strength of the middle frame and the overall three-bar bending strength, weakening the overall strength and increasing reliability risks.

[0128] Figure 14 This is a schematic diagram showing the location of a flexible outgoing circuit board provided in one embodiment of this application. Figure 14 This illustrates the process by which the flexible lead-out circuit board 15 switches from an unfolded state to a bent state. Figure 15 for Figure 3 Enlarged view of the structure within the dashed box. (Reference) Figure 14 and Figure 15 As shown in the embodiment of this application, the flexible output circuit board 15 can be connected to the wide side of the ribbon circuit board 13. It should be understood that the long side of the ribbon circuit board 13 refers to the side opposite to the bend 112, and the wide side refers to the side connected between the two long sides. The extension direction of the wide side of the ribbon circuit board 13 refers to the direction from the side of the ribbon circuit board 13 near the bend 112 to the side away from the bend 112.

[0129] Various electronic devices 131, such as fingerprint module chips, can be arranged on the ribbon circuit board 13. One end of the flexible lead-out circuit board 15 can be connected to the ribbon circuit board 13, and the other end can be connected to the motherboard 500, thereby realizing the electrical connection between the display module 100 and the motherboard 500. The driver chip 12, ribbon circuit board 13, flexible bonding circuit board 14, and flexible lead-out circuit board 15 are all located on the back side of the light-emitting surface of the display panel 11, and the electronic devices 131 are located on the side of the ribbon circuit board 13 facing away from the packaging part 113.

[0130] In this embodiment, the flexible outgoing circuit board 15 can be configured as a single-layer flexible circuit board or a multi-layer flexible circuit board. The flexible outgoing circuit board 15 can output wires from any one or any multiple wiring layers (1301) of the cabling circuit board 13. For example, the flexible outgoing circuit board 15 can be a two-layer flexible circuit board. By configuring the flexible outgoing circuit board 15 as a multi-layer board, the outgoing area can be increased.

[0131] Figure 16 for Figure 2 Enlarged view of the structure within the dashed box. (Reference) Figure 15 and Figure 16 As shown, one end of the flexible output circuit board 15 can extend from the wide side of the ribbon circuit board 13, and the other end can be fastened to the motherboard 500 via BTB. The electronic device 131 may include a touch chip, auxiliary capacitors and other devices. The electronic device 131 contains solder and can be spot-welded to the upper surface of the ribbon circuit board 13 (the surface of the back package portion 113 of the ribbon circuit board 13).

[0132] The flexible lead-out circuit board 15 can lead out from any one or more wiring layers of the ribbon circuit board 13, for example, it can lead out from the third layer of the ribbon circuit board 13. The flexible lead-out circuit board 15 may include a connecting section 151 and a main body section 152. The main body section 152 is bent to the side of the ribbon circuit board 13 opposite to the package portion 113 through the connecting section 151. The connecting section 151 is in a bent state, and the main body section 152 is in a state parallel to the ribbon circuit board 13.

[0133] The height of the main body section 152 relative to the ribbon circuit board 13 can be greater than the height of the electronic device 131, so that the flexible outgoing circuit board 15 does not interfere with the electronic device 131 below it.

[0134] Additionally, the lower surface of the flexible outgoing circuit board 15 ( Figure 15 and Figure 16The maximum design value of the distance (Z-axis height dimension) between the surface of the flexible output circuit board 15 (facing the top surface of the ribbon circuit board 13) and the upper surface of the ribbon circuit board 13, i.e., the maximum design value of the spacing between the flexible output circuit board 15 and the ribbon circuit board 13, is the sum of the maximum design values ​​of the design gap, the thickness of the middle frame 200, the thickness of the main board 500, and the height of the BTB. The maximum design value of the design gap can be 0 or 0.2 mm. The maximum design value of the wall thickness of the middle frame 200 is 0. The maximum design value of the thickness of the main board 500 is 0.5 mm. The standard maximum working height of the BTB is 0.66 mm. Therefore, this maximum distance value is greater than or equal to 1.36 mm. This dimension determines the bending radius of the flexible output circuit board 15 (i.e., the dimension of the connecting section 151), and this dimension must not be less than the height of each electronic component 131.

[0135] In scenarios with extremely limited design space (overall thickness less than 5.5mm), the area on the motherboard 500 corresponding to the electronic device 131 requires a design that breaks the board, i.e., designing avoidance holes to prevent interference with the electronic device 131. In this embodiment, multiple electronic devices 131 can be designed in a clustered manner. For example, such as... Figure 14 The left and right ends of the ribbon circuit board 13 can be used to place some electronic components, while the rest are placed in the middle. The integrated design of the components allows the motherboard 500 to have the smallest breakage area and has the least impact on the wiring and component space on the motherboard 500.

[0136] Figure 17 A schematic diagram of a waterproofing solution for the flexible outgoing circuit board provided for related technologies. (Reference) Figure 17 As shown in the related technology, when the flexible cable exit circuit board 15 exits from the middle of the long side of the cable routing circuit board 13, the waterproof path of the entire device needs to be avoided at the middle cable exit position, as shown by the waterproof adhesive 182 in the figure. Since the waterproof adhesive 182 needs to avoid the cable exit position, the waterproof path needs to be curved instead of straight. According to the principle that the shortest distance between two points is a straight line, this results in wasted waterproof space, increased difficulty in applying adhesive, and increased cost. Therefore, the middle cable exit solution greatly affects the product's competitiveness.

[0137] Figure 18 This is a schematic diagram of a waterproofing solution for a flexible outgoing circuit board provided in one embodiment of this application. (Reference) Figure 19 As shown in the embodiment of this application, since the flexible lead-out circuit board 15 is set on the wide side of the ribbon cable circuit board 13, the flexible lead-out circuit board 15 will not affect the setting of the waterproof backing adhesive 182. The waterproof backing adhesive 182 can be set as a straight line, thereby solving the defects caused by the center lead-out of the related technology.

[0138] In addition, the central cabling solution provided by the related technology is not conducive to the assembly of the display module 100. Figure 19A schematic diagram of the unfolded structure of the packaging section provided for related technologies. (Reference) Figure 20 As shown, it should be understood that the assembly process of the display module 100 generally involves first bonding the driver chip 12 and the ribbon circuit board 13 to the encapsulation portion 113 of the display panel 11, and then attaching components such as optical adhesive and cover plate 17. After the ribbon circuit board 13 is bonded, the flexible lead-out circuit board 15 will enter the display portion 111, which will cause interference problems in subsequent processes and prevent them from being implemented, affecting the subsequent bonding process and the testing process of the display module 100.

[0139] Figure 20 This is a schematic diagram of the unfolded structure of the packaging section provided in one embodiment of this application. (See reference...) Figures 2-9 As shown in this embodiment, since the flexible lead-out circuit board 15 is disposed on the wide side of the ribbon circuit board 13, the flexible lead-out circuit board 15 will not enter the display section 111 during the assembly process of the display module 100, and therefore will not affect the assembly process of the display module 100.

[0140] Overall, the assembly process of the display module provided in this application embodiment may include the following steps: First, the driver chip 12 is bound in the second binding area 1132 within the package 113; then, the ribbon cable circuit board 13 is bonded to the package 113 with waterproof adhesive, and the flexible binding circuit board 14 is bound to the first binding area 1131; next, the cover plate 17 is attached to the light-emitting surface side of the display 111.

[0141] It should be understood that the encapsulation part 113 is bent to the back side of the light-emitting surface of the display part 111 via the bending part 112, and this process can be performed during the assembly of the display module 100 onto the mid-frame 200. The process of attaching the end of the flexible lead circuit board 15 to the main board 500 via BTB can be performed after the display module 100, mid-frame 200, and main board 500 are assembled.

[0142] The above Figure 21a In the provided embodiment, the multilayer ribbon circuit board 13 is bound to the first binding area 1131 by a single-layer flexible bonding circuit board 14. The driver chip 12 is located between the first binding area 1131 and the ribbon circuit board 13. The flexible bonding circuit board 14 extends from the upper part of the ribbon circuit board 13 and is raised above the driver chip 12 under the support of the support member 144.

[0143] In another embodiment, the multilayer ribbon circuit board 13 can also be bonded to the first bonding area 1131 by a single-layer flexible bonding circuit board 14. Through-holes or blind holes for accommodating the driver chip 12 can be provided on the ribbon circuit board 13 to make fuller use of the area of ​​the package portion 113 and increase the area of ​​the ribbon circuit board 13. Hereinafter, the solutions provided by the embodiments of this application will be described with reference to the specific accompanying drawings.

[0144] Figure 21b This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 21a This is a partial cross-sectional schematic diagram of a display module provided in one embodiment of this application. (See reference...) Figure 21b and Figure 21c As shown, the display module 100 may include a display panel 11, a driver chip 12, a ribbon cable circuit board 13, a flexible bonding circuit board 14, and a flexible outgoing circuit board 15. The specific structures of the display panel 11 and the flexible outgoing circuit board 15 can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0145] In this embodiment, the ribbon cable circuit board 13 can be a multilayer printed circuit board or a multilayer flexible circuit board, and the flexible bonding circuit board 14 can be a single-layer flexible circuit board. One end of the flexible bonding circuit board 14 can be connected to the ribbon cable circuit board 13, and the other end is bonded to the first bonding area 1131 on the package portion 113. A through hole 1321 can be formed on the ribbon cable circuit board 13, and a second bonding area 1132 is provided on the package portion 113 in the area corresponding to the through hole 1321. The driver chip 12 can be disposed in the through hole 1321 and bonded to the second bonding area 1132.

[0146] The first bonding area 1131 can be located at the end of the package portion 113 away from the bending portion 112, and the first bonding area 1131 can be elongated. There can be two second bonding areas 1132. The area of ​​the through-hole 1321 can be slightly larger than the area of ​​the driver chip 12 to avoid interference between the driver chip 12 and the ribbon circuit board 13. By providing through-holes 1321 on the ribbon circuit board 13 to arrange the driver chip 12, it is advantageous to increase the area of ​​the ribbon circuit board 13 or reduce the area of ​​the package portion 113.

[0147] Figure 21c This is a simplified structural diagram of a display module provided in one embodiment of this application. (See reference...) Figure 5 As shown, in this embodiment of the application, the ribbon cable circuit board 13 is configured as a multilayer circuit board and is bonded to the first bonding area 1131 on the package portion 113 by a single-layer flexible bonding circuit board 14. By both the ribbon cable circuit board 13 and the flexible bonding circuit board 14 are disposed between the first end and the second end of the package portion 113, the space on the package portion 113 can be utilized to the maximum extent, compared to Figures 21a-21c As can be seen, D1 is reduced to 0 in this embodiment of the application. Therefore, the solution provided by this embodiment of the application can significantly increase the layout space of the battery 400.

[0148] Figure 22aThe embodiments shown are applicable to a wide range of scenarios, and the relationship between the height of the driver chip 12 relative to the package portion 113 (including the thickness of the driver chip 12 itself and the thickness of the bonding solder) and the height of the ribbon cable circuit board 13 relative to the package portion 113 (including the thickness of the ribbon cable circuit board 13 itself and the thickness of the adhesive) is not limited.

[0149] Figure 22b This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 23 This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application. Figures 22a-23 This is a simplified structural diagram of a display module provided in one embodiment of this application. (See reference...) Figure 23 As shown, in another embodiment of the scheme of using a flexible bonding circuit board 14 to bond and making holes in the ribbon cable circuit board 13, a blind hole 1322 can be made in the ribbon cable circuit board 13, the driver chip 12 is located in the blind hole 1322, and the opening of the blind hole 1322 faces the ribbon cable circuit board 13.

[0150] refer to Figures 22a-30 It can be seen that the sum of the depth of the blind via 1322 and the thickness of the adhesive (the black filled area in the figure) is greater than or equal to the height of the driver chip 12 relative to the package portion 113, in order to avoid interference between the bottom wall of the blind via 1322 and the driver chip 12. It should be understood that the depth of the blind via 1322 is related to the height of each wiring layer 1301 of the ribbon circuit board 13. When the depth of the blind via 1322 is slightly lower than the height of the driver chip 12, the height of the ribbon circuit board 13 can be increased by increasing the thickness of the adhesive between the ribbon circuit board 13 and the package portion 113, thereby preventing the flexible bonding circuit board 14 from interfering with the driver chip 12.

[0151] It should be understood that the use of blind via 1322 to house the driver chip 12 is more suitable for solutions where the thickness of the driver chip 12 is less than the thickness of the ribbon circuit board 13. By using blind via 1322 to house the driver chip 12, a trace layer can still be arranged in the area above the blind via 1322, thereby increasing the trace area.

[0152] Figure 24 The illustrated embodiment is applicable to scenarios where the height of the driver chip 12 relative to the package portion 113 (including the thickness of the driver chip 12 itself and the thickness of the bonding solder) is less than the height of the ribbon cable circuit board 13 relative to the package portion 113 (including the thickness of the ribbon cable circuit board 13 itself and the thickness of the adhesive).

[0153] Figure 24 This is a schematic diagram of the bonding wire output structure of a ribbon circuit board according to an embodiment of this application. (Reference) Figure 25As shown, the overall width of the package 113 can be D2, the width of the ribbon circuit board 13 can be D3, and the width of the flexible bonding circuit board 14 can be D4. The ribbon circuit board 13 is a multilayer circuit board, including multiple wiring layers 1301 and insulating layers 1302. The flexible bonding circuit board 14 can be formed by routing wires from one of the wiring layers 1301 in the ribbon circuit board 13. This wiring layer 1301 can be the bottom wiring layer of the ribbon circuit board 13 (the wiring layer 1301 closest to the package 113) to prevent the problem of poor soldering caused by excessive discontinuity.

[0154] This solution effectively utilizes the Z-axis space of the ribbon circuit board 13 to place the driver chip 12, resulting in a reasonable spatial layout. The through-hole solution for the ribbon circuit board 13 provided in this application embodiment is suitable when the thickness of the ribbon circuit board 13 is less than or equal to the height of the driver chip 12. The blind via solution for the ribbon circuit board 13 provided in this application embodiment is suitable when the thickness of the ribbon circuit board 13 is greater than the height of the driver chip 12. Simultaneously, the ribbon circuit board 13 has a relatively wide width, which is beneficial for wiring and components. In one specific embodiment, the ribbon circuit board 13 can be a four-layer board with a thickness of approximately 0.35 mm, and the driver chip 12 has a thickness of approximately 0.25 mm.

[0155] Figure 26 This is a top view of the packaging section provided in one embodiment of this application. Figure 26 This is a schematic diagram of the wiring on a flexible bonding circuit board and a ribbon cable circuit board provided in an embodiment of this application. Figure 25 for Figure 25 A magnified diagram of the internal wiring within the area enclosed by the dashed box. (Reference) Figure 26 and Figure 27 As shown, the flexible bonding circuit board 14 may be provided with bonding pins 140 for bonding with the first bonding area 1131. The remaining areas of the flexible bonding circuit board 14 are provided with traces connected to the bonding pins 140. The extension direction of the traces is consistent with the width direction of the flexible bonding circuit board 140. The traces can communicate with the vias and ribbon cables in the ribbon circuit board 13. Traces can be routed on the multiple layers of the ribbon circuit board 13.

[0156] Figure 27 This is a schematic diagram of the waterproof structure of a display module provided in one embodiment of this application. (Reference) Figure 27 As shown in this embodiment, waterproof adhesive 181 can be provided on the edges of three sides (excluding the side facing the bending portion 112) of the flexible bonding circuit board 14. The waterproof adhesive 181 can fill the Z-direction space between the flexible bonding circuit board 14 and the encapsulation portion 113, which can prevent liquid from entering under the flexible bonding circuit board 14 and prevent liquid from damaging the flexible bonding circuit board 14.

[0157] Meanwhile, a waterproof adhesive 182 can be provided on one edge of the encapsulation part 113 near the bending part 112. The length of the waterproof adhesive 182 is the same as the length of the encapsulation part 113. The waterproof adhesive 182 can fill the Z-direction space between the encapsulation part 113 and the middle frame 200, which can prevent external liquids from entering the encapsulation part 113 and prevent liquids from damaging the ribbon circuit board 13 and the driver chip 12. The waterproof adhesive 181 and the waterproof adhesive 182 can together form a complete sealed space, which provides waterproof protection for the entire encapsulation part 113 of the display module 100.

[0158] It should be noted that the waterproof adhesive 182 in this embodiment is arranged in a straight line, which is due to the design of the flexible lead-out circuit board 15. The structure of the flexible lead-out circuit board 15 can be referred to the previous description, and will not be repeated here.

[0159] Figure 21 above Figure 28a In the provided embodiment, the multilayer ribbon circuit board 13 is bound to the first binding area 1131 by a single-layer flexible bonding circuit board 14. The flexible bonding circuit board 14 extends from the lower part of the ribbon circuit board 13, and the driving chip 12 is located in the through hole 1321 in the ribbon circuit board 13.

[0160] In another embodiment, the multilayer ribbon circuit board 13 can be bonded to the first bonding area 1131 by a wiring layer covering a portion of its own area. The solution provided by the embodiments of this application will now be described with reference to the specific accompanying drawings.

[0161] Figure 28b This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 28a This is a partial cross-sectional schematic diagram of a display module provided in one embodiment of this application. (See reference...) Figure 28b and Figure 28c As shown in the embodiments of this application, the display module 100 may include a display panel 11, a driver chip 12, a ribbon cable circuit board 13, and a flexible cable output circuit board 15. The specific structures of the display panel 11 and the flexible cable output circuit board 15 can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0162] In this embodiment, a first bonding area 1131 may be provided on the surface of the back display portion 111 of the encapsulation portion 113. The first bonding area 1131 may be located at the first end of the encapsulation portion 113, and the ribbon circuit board 13 may be located between the first end and the second end of the encapsulation portion 113. A portion of the ribbon circuit board 13 itself may be bonded to the encapsulation portion 113 through the first bonding area 1131. Except for the area bonded to the first bonding area 1131, the ribbon circuit board 13 may be adhered to the encapsulation portion 113 by adhesive. The ribbon circuit board 13 may be a multilayer printed circuit board or a multilayer flexible circuit board to fully utilize the space in the thickness direction of the electronic device and reduce the occupancy of the length and width dimensions of the electronic device.

[0163] A second bonding area 1132 may also be provided on the surface of the packaging portion 113 facing away from the display portion 111, and the driver chip 12 may be bonded within the second bonding area 1132. In one possible embodiment, the first bonding area 1131 may be provided at the end of the packaging portion 113 away from the bend portion 112, and the first bonding area 1131 may be elongated. A through hole 1321 may be provided on the ribbon circuit board 13, and the second bonding area 1132 is provided in the area corresponding to the through hole 1321, and the driver chip 12 may be disposed within the through hole 1321.

[0164] The area of ​​the through-hole 1321 is slightly larger than the area of ​​the driver chip 12 to avoid interference between the driver chip 12 and the ribbon circuit board 13. By setting the through-hole 1321 on the ribbon circuit board 13 to arrange the driver chip 12, the layout is more compact than other layout methods such as arranging the ribbon circuit board 13 and the driver chip 12 side by side, which helps to reduce the area of ​​the package portion 113.

[0165] Figure 5 This is a simplified structural diagram of a display module provided in an embodiment of this application. In this embodiment, the entire width of the ribbon circuit board 13 is correspondingly disposed on the encapsulation portion 113, and a portion of the end of the ribbon circuit board 13 is used to bind it within the first binding area 1131 on the encapsulation portion 113. By utilizing a portion of the ribbon circuit board 13 for binding, the space on the encapsulation portion 113 can be utilized to the maximum extent, compared to Figure 29a As can be seen, D1 is reduced to 0 in this embodiment of the application. Therefore, the solution provided by this embodiment of the application can significantly increase the layout space of the battery 400.

[0166] It should also be noted that the X-axis dimension occupied by the packaging section 113 is D2. With the size of the packaging section 113 remaining constant, the area that the ribbon cable circuit board 13 can occupy is limited. In this embodiment, the ribbon cable circuit board 13 is configured as a multilayer board to increase the ribbon cable area. This multilayer board can be, for example, a four-layer board or a six-layer board. In one possible implementation, the X-axis dimension occupied by the packaging section 113 can be further reduced to provide more space for the battery 400. In this case, the ribbon cable circuit board 13 can adaptively increase the number of layers to ensure the ribbon cable area. Therefore, the solution provided in this embodiment shows a more significant advantage in space utilization when the area of ​​the packaging section 113 is smaller.

[0167] In this embodiment, the ribbon circuit board 13 is configured as a multi-layer circuit board, and the ribbon circuit board 13 itself is used for bonding. Compared with the solution of setting an additional single-layer circuit board for bonding, the wiring area of ​​the ribbon circuit board 13 can be further increased, and the space utilization rate can be improved.

[0168] Figure 29b This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 30 This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application. Figures 29a-30 This is a simplified structural diagram of a display module provided in one embodiment of this application. (See reference...) Figure 30 As shown, in another embodiment of the solution that uses a portion of the ribbon circuit board 13 itself for bonding, a blind hole 1322 can be formed on the ribbon circuit board 13, and the driver chip 12 is located in the blind hole 1322.

[0169] refer to Figure 31 It can be seen that the sum of the depth of the blind via 1322 and the thickness of the adhesive (the black filled area in the figure) is greater than or equal to the height of the driver chip 12 relative to the package portion 113, in order to avoid interference between the bottom wall of the blind via 1322 and the driver chip 12. It should be understood that the depth of the blind via 1322 is related to the height of each wiring layer 1301 of the ribbon circuit board 13. When the depth of the blind via 1322 is slightly lower than the height of the driver chip 12, the height of the ribbon circuit board 13 can be increased by increasing the thickness of the adhesive between the ribbon circuit board 13 and the package portion 113, thereby preventing the flexible bonding circuit board 14 from interfering with the driver chip 12.

[0170] It should be understood that the use of blind via 1322 to house the driver chip 12 is more suitable for solutions where the thickness of the driver chip 12 is less than the thickness of the ribbon circuit board 13. By using blind via 1322 to house the driver chip 12, a trace layer can still be arranged in the area above the blind via 1322, thereby increasing the trace area.

[0171] Figure 32a This is a top view of the packaging section provided in one embodiment of this application.Figure 32a This is a schematic diagram of the wiring on a flexible bonding circuit board and a ribbon cable circuit board provided in an embodiment of this application. Figure 31 for Figure 31 A magnified diagram of the internal wiring within the area enclosed by the dashed box. (Reference) Figure 32a and Figure 32b As shown, the ribbon cable circuit board 13 can be divided into a first partition 13a and a second partition 13b. The first partition 13a corresponds to the first bonding area 1131. A bonding pin 140 can be provided in the first partition 13a for bonding with the first bonding area 1131. The bonding pin 140 is located on the wiring layer of the ribbon cable circuit board 13 closest to the package portion 113, that is, on the bottom wiring layer of the ribbon cable circuit board 13. The second partition 13b can be attached to the package portion 113 with adhesive.

[0172] In one possible implementation, only bonding pins 140 are provided in the first partition 13a of the ribbon circuit board 13 corresponding to the first bonding area 1131, without any other traces or vias. Traces and vias can be provided in the second partition 13b of the ribbon circuit board 13, excluding the area corresponding to the first bonding area 1131, and the trace paths must avoid the driver chip 12. In this case, the bonding pins 140 can be connected to traces on the bottom layer of the second partition 13b.

[0173] Figure 32b This is another schematic diagram of the wiring on a ribbon cable circuit board provided in one embodiment of this application. Figure 31 for Figure 32b A magnified diagram of the internal wiring within the area enclosed by the dashed box. (Reference) Figure 33 As shown, in another possible implementation, the ribbon cable circuit board 13 can be divided into a first partition 13a and a second partition 13b. The first partition 13a corresponds to the first bonding area 1131. A bonding pin 140 is provided on the first partition 13a for bonding with the first bonding area 1131. The bonding pin 140 is located on the layer of the ribbon cable circuit board 13 closest to the package portion 113, that is, on the bottom layer of the ribbon cable circuit board 13.

[0174] Meanwhile, traces and vias can be set on the other trace layers in the first partition 13a, except for the bottom trace layer. In this case, the bonding pin 140 can be connected to traces on non-bottom trace layers in the first partition 13a via vias or other means. This fully utilizes the area of ​​the trace layers on the ribbon circuit board 13, increasing wiring space. Similarly, traces and vias on the second partition 13b should avoid the driver chip 12.

[0175] Figure 33 This is a schematic diagram of the waterproof structure of a display module provided in one embodiment of this application. (Reference) Figure 34aAs shown in this embodiment, waterproof adhesive 181 can be provided on the edges of three sides (excluding the side facing the bend 112) of the first bonding area 1131. The waterproof adhesive 181 can fill the Z-direction space between the ribbon circuit board 13 and the encapsulation part 113, preventing liquid from entering the first bonding area 1131 and preventing liquid from damaging the first bonding area 1131. It should be understood that the waterproof adhesive 181 can also cover the other three edges of the ribbon circuit board 13, excluding the side facing the bend 112.

[0176] Meanwhile, a waterproof adhesive 182 can be provided on one edge of the encapsulation part 113 near the bending part 112. The length of the waterproof adhesive 182 is the same as the length of the encapsulation part 113. The waterproof adhesive 182 can fill the Z-direction space between the encapsulation part 113 and the middle frame 200, which can prevent external liquids from entering the encapsulation part 113 and prevent liquids from damaging the ribbon circuit board 13 and the driver chip 12. The waterproof adhesive 181 and the waterproof adhesive 182 can together form a complete sealed space, which provides waterproof protection for the entire encapsulation part 113 of the display module 100.

[0177] It should be noted that the waterproof adhesive 182 in this embodiment is arranged in a straight line, which is due to the design of the flexible lead-out circuit board 15. The structure of the flexible lead-out circuit board 15 can be referred to the previous description, and will not be repeated here.

[0178] Based on the above embodiments of this application, this application also provides several implementation methods for the grounding structure of the display module 100. Hereinafter, the grounding structure of the display module 100 provided in the embodiments of this application will be described with reference to the accompanying drawings.

[0179] Figure 34b A top view of a display module with its display panel in an unfolded state, provided for related technologies. Figure 34a A side cross-sectional view of a display module with its display panel in a bent state, provided for related technologies. (Reference) Figure 34b and Figure 35a As shown, in the related technology, a grounding point 191 can be provided on the side of the ribbon circuit board 13 facing the light-emitting surface of the display section (based on the bent state). The grounding point 191 can be formed by making a copper leakage design on the surface of the ribbon circuit board 13. After the display panel 11 is bent, the grounding point 191 can contact and conduct with the metal plate 16, thereby achieving grounding.

[0180] It is easy to understand that, in this embodiment, after the display panel 11 is bent, the ribbon cable circuit board 13 and the metal plate 16 are separated by the encapsulation portion 113. Therefore, if a grounding point 191 is directly provided on the side of the ribbon cable circuit board 13 facing the light-emitting surface of the display section, the grounding point 191 cannot be directly connected to the metal plate 16. Therefore, the grounding structure of the display module 100 provided by related technologies is not applicable to this application.

[0181] Figure 35b This is a top view of a display module with its display panel in an unfolded state, according to an embodiment of this application. Figure 35a This is a side cross-sectional view of a display module with its display panel in a bent state, according to an embodiment of this application. (See reference...) Figure 35b and Figure 36a As shown, in one possible implementation, the ribbon cable circuit board 13 can extend beyond the wide side of the encapsulation portion 113, with the extended length forming an extension area 1303. A grounding point 191 can be disposed on the extension area 1303. That is, the length L2 of the ribbon cable circuit board 13 can be greater than the length of the encapsulation portion 113, while the length L2 of the ribbon cable circuit board 13 is less than the length L3 of the display portion 111 (excluding the flexible lead-out circuit board 15). In this case, the grounding point 191 can be disposed on the side of the ribbon cable circuit board 13 facing the light-emitting surface of the display portion, and located in the area of ​​the ribbon cable circuit board 13 extending beyond the encapsulation portion 113. The grounding point 191 can be formed by performing a copper-exposed design on the surface of the ribbon cable circuit board 13. After the display panel 11 is bent, the grounding point 191 can contact and conduct with the metal plate 16, thereby achieving grounding.

[0182] Figure 36b This is a top view of a display module with its display panel in an unfolded state, according to an embodiment of this application. Figure 36a This is a side cross-sectional view of a display module with its display panel in a bent state, according to an embodiment of this application. (See reference...) Figure 36b and Figure 37a As shown, in another possible implementation, the grounding point 191 can be set on the side of the ribbon circuit board 13 facing away from the display part 11. In this case, a conductive connector 192 can also be set, which can be connected between the grounding point 191 and the middle frame 200 to achieve grounding.

[0183] Figure 37b This is a top view of a display module with its display panel in an unfolded state, according to an embodiment of this application. Figure 37a This is a side cross-sectional view of a display module with its display panel in a bent state, according to an embodiment of this application. (See reference...) Figure 37b and Figure 5As shown, in another possible implementation, the grounding point 191 can be set on the side of the ribbon circuit board 13 facing away from the display part 11. In this case, a conductive line 193 can also be provided. The conductive line 193 can be, for example, copper foil, cable, flexible circuit board, etc. The conductive line 193 can be connected between the grounding point 191 and the metal plate 16 to achieve grounding.

[0184] It should be understood that the ribbon circuit board 13 can be connected to the middle frame 200 or the metal plate 16 to achieve grounding. In addition to the above three grounding structures, there are many other ways to achieve this, and this application embodiment does not impose specific limitations on them.

[0185] In summary, the embodiments of this application provide a display module and an electronic device. By binding both the ribbon cable circuit board and the driver chip to the encapsulation part that is bent to the back side of the light-emitting surface of the display panel, the length and width dimensions occupied by the ribbon cable circuit board can be reduced, thereby providing more space for the battery and increasing the battery capacity of the electronic device.

[0186] Combination Figure 6 As shown, in related technologies, the maximum design size of the X-axis dimension D1 occupied by the ribbon cable circuit board 13 is 6mm, referring to... Figure 23 , Figure 30 , ​ All three embodiments provided in this application can reduce D1 to 0, thus increasing the length or width of the battery 400 by 6 mm. In one specific embodiment, while keeping the battery thickness and length unchanged, increasing the width by 6 mm can increase the battery capacity by 311.92 mAh compared to related technologies. Specific data can be found in Table 1 below:

[0187] Table 1

[0188]

[0189] The display module and electronic device provided in this application embodiment can effectively increase battery capacity, and also provide multiple arrangement methods and bonding structures for the ribbon circuit board 13 and the driver chip 12, and adaptively provide waterproof and grounding solutions, making the display module more flexible and mobile in overall space design.

[0190] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, comprising: The display module (100) and the mainboard (500) are included. The display module (100) includes a display panel (11), a flat cable circuit board (13) and a flexible wire-out circuit board (15), the display panel (11) includes a display part (111), a bending part (112) and a packaging part (113) connected in sequence, the packaging part (113) is bent to the back side of the light-out surface of the display part (111) through the bending part (112), the packaging part (113) includes a first end and a second end, the first end is the end of the packaging part (113) away from the bending part (112), and the second end is the end of the packaging part (113) connected with the bending part (112), and the flat cable circuit board (13) is bound on the packaging part (113). The mainboard (500) is located on the side of the packaging part (113) away from the display part (111), one end of the flexible wire-out circuit board (15) is connected on the wide edge of the flat cable circuit board (13), and the other end is connected on the mainboard (500). The wide edge extension direction of the flat cable circuit board (13) is consistent with the direction in which the first end points to the second end. The flat cable circuit board (13) is a multi-layer printed circuit board or a multi-layer flexible circuit board, the flexible wire-out circuit board (15) is a single-layer flexible circuit board or a multi-layer flexible circuit board, and the flexible wire-out circuit board (15) is wired from any layer or any multiple layers (1301) of the flat cable circuit board (13).

2. The electronic device of claim 1, wherein, The flexible wire-out circuit board (15) includes a connecting section (151) and a main body section (152), the main body section (152) is bent to the side of the flat cable circuit board (13) away from the packaging part (113) through the connecting section (151), and the main body section (152) is connected with the mainboard (500).

3. The electronic device of claim 1 or 2, wherein, A plurality of electronic devices (131) are arranged on the surface of the flat cable circuit board (13) away from the packaging part (113), and the height of the main body section (152) relative to the flat cable circuit board (13) is greater than the height of the electronic devices (131).

4. The electronic device of claim 3, wherein, The electronic device further includes a middle frame (200), the middle frame (200) is connected on the back side of the light-out surface of the display part (111), and the mainboard (500) is connected on the side of the middle frame (200) away from the packaging part (113); the middle frame (200) and the mainboard (500) are both provided with avoiding holes for avoiding the electronic devices (131).

5. The electronic device of claim 4, wherein, The end of the main body section (152) is connected with a board-to-board connector, and the board-to-board connector is buckled on the surface of the mainboard (500) away from the flat cable circuit board (13).

6. The electronic device of claim 5, wherein, The limit design value of the spacing between the main body section (152) and the flat cable circuit board (13) is the sum of the limit values of the gap, the thickness of the middle frame (200), the thickness of the mainboard (500) and the height of the board-to-board connector.

7. The electronic device of claim 6, wherein, The limit value of the gap is 0, and the limit value of the thickness of the middle frame (200) is 0. ​ 8. The electronic device of any of claims 1-7, wherein, The flat cable circuit board (13) is arranged on the side of the packaging portion (113) away from the display portion (111), is located between the first end and the second end, and is arranged in a first binding area (1131) on the packaging portion (113), the first binding area (1131) being located at the first end.

9. The electronic device of claim 8, wherein, Part of the flat cable circuit board (13) is arranged in the first binding area (1131), or the flat cable circuit board (13) is arranged in the first binding area (1131) through a flexible binding circuit board (14).

10. The electronic device of claim 8, wherein, The display module (100) further comprises a driving chip (12) arranged on the side of the packaging portion (113) away from the display portion (111), the driving chip (12) being arranged in a second binding area (1132) on the packaging portion (113), the second binding area (1132) being located between the first binding area (1131) and the bending portion (112).

11. The electronic device of any of claims 5-7, wherein, The display module (100) further comprises a waterproof back adhesive (182) arranged on the surface of the flat cable circuit board (13) away from the packaging portion (113), the waterproof back adhesive (182) being located at one end of the flat cable circuit board (13) close to the bending portion (112) and extending along the length direction of the flat cable circuit board (13), the waterproof back adhesive (182) covering the entire length of the flat cable circuit board (13), and the waterproof back adhesive (182) being bonded between the flat cable circuit board (13) and the middle frame (200).

12. A display module, characterized by The display module (100) comprises a display panel (11), a flat cable circuit board (13), and a flexible wire-out circuit board (15). The display panel (11) comprises a display portion (111), a bending portion (112), and a packaging portion (113) connected in sequence, the packaging portion (113) being bent to the back side of the light exit surface of the display portion (111) through the bending portion (112), the packaging portion (113) comprising a first end and a second end, the first end being the end of the packaging portion (113) away from the bending portion (112), and the second end being the end of the packaging portion (113) connected to the bending portion (112), the flat cable circuit board (13) being arranged on the packaging portion (113). One end of the flexible wire-out circuit board (15) is connected to the wide side of the flat cable circuit board (13), and the other end is used for connecting a main board (500). The extension direction of the wide side of the flat cable circuit board (13) is consistent with the direction in which the first end points to the second end.

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