A flat panel detector panel and a method of manufacturing the same

Abstract

The application provides a flat panel detector panel and a manufacturing method thereof, the flat panel detector panel comprising a light-emitting substrate and a chip, wherein the light-emitting substrate comprises a bearing substrate and a light-emitting layer, the light-emitting layer is fixed to the outer surface of the bearing substrate and comprises a plurality of light-emitting units, the light-emitting layer is woven by a first conductive fiber and a second conductive fiber, at least one of the first conductive fiber and the second conductive fiber comprises a light-emitting material, and the chip is electrically connected with the light-emitting layer. The application utilizes the first conductive fiber and the second conductive fiber to weave into a net shape to obtain the light-emitting layer, and fixes the light-emitting layer to the outer surface of the bearing substrate. Based on the chip, the free conversion of the light-emitting substrate to present an image can be realized through program control to meet different customer needs. The flat panel detector panel of the application has low cost and is environment-friendly.

Description

Technical Field

[0001] This invention belongs to the field of X-ray detector imaging and relates to a flat panel detector panel and its manufacturing method. Background Technology

[0002] Currently, X-ray flat panel detectors typically use ordinary carbon fiber plates for their exterior, secured to structural components with screws. A PET (Polyethylene terephthalate) film is then adhered to the carbon fiber plate to accommodate various pattern requirements from different clients. While this film-based method can handle complex patterns, it is relatively environmentally unfriendly, inconvenient for rework, and prone to leaving adhesive residue on the carbon fiber plate surface. Replacement is troublesome, and the residue can pollute the environment. Furthermore, the application of the film to the carbon fiber plate is affected by the pigment in the film itself. If there is a pattern within the active area (AA area), variations in ink density can create artifacts during detector imaging, affecting image quality. A small number of detectors use direct screen printing on the carbon fiber plate, but this is difficult, suitable only for simple patterns, and cannot meet the needs of customized clients. Additionally, the exposed pattern is at risk of wear and tear over time.

[0003] Therefore, there is an urgent need to find a flat panel detector that is environmentally friendly, suitable for various customer needs, does not affect detector imaging, and is easy to rework. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a flat panel detector panel and its manufacturing method, which solves the problems of inconvenient rework, environmental unfriendliness, impact on detector imaging, and inability to meet various customer needs in the prior art when applying film to ordinary detector panels.

[0005] To achieve the above and other related objectives, the present invention provides a method for manufacturing a flat panel detector panel, comprising the following steps:

[0006] A first conductive fiber and a second conductive fiber are provided, and the first conductive fiber and the second conductive fiber are woven into a web to form a light-emitting layer with multiple light-emitting units. At least one of the first conductive fiber and the second conductive fiber includes a light-emitting material.

[0007] A carrier substrate is provided, and the light-emitting layer is fixed to the outer surface of the carrier substrate to obtain a light-emitting substrate;

[0008] A chip is provided, and the chip is electrically connected to the light-emitting layer.

[0009] Optionally, the chip includes a processor and a memory, the memory storing a program that is executed by the processor to realize the conversion of the light emission pattern and / or the conversion of the light emission color of the light emission layer.

[0010] Optionally, the light-emitting unit is formed by the grid points of the mesh woven from the conductive yarn and the light-emitting yarn.

[0011] Optionally, the intersection of the first conductive fiber and the second conductive fiber constitutes the light-emitting unit.

[0012] Optionally, the carrier substrate includes a carbon plate.

[0013] Optionally, the method of fixing the light-emitting layer to the carrier substrate includes pressing.

[0014] Optionally, the method further includes the step of forming a protective layer on the side of the light-emitting substrate having the light-emitting layer, the protective layer including at least one of a water layer and an antibacterial layer.

[0015] Optionally, the method further includes the step of providing a detector housing and mounting the light-emitting substrate on the detector housing.

[0016] Optionally, the method further includes the step of placing the chip at the bottom of the carrier substrate or embedding it in the carrier substrate.

[0017] The present invention also provides a flat panel detector panel, comprising:

[0018] A light-emitting substrate includes a carrier substrate and a light-emitting layer. The light-emitting layer is fixed to the outer surface of the carrier substrate and includes a plurality of light-emitting units. The light-emitting layer is woven from a first conductive fiber and a second conductive fiber. At least one of the first conductive fiber and the second conductive fiber includes a light-emitting material.

[0019] The chip is electrically connected to the light-emitting layer.

[0020] Optionally, the intersection of the first conductive fiber and the second conductive fiber constitutes the light-emitting unit.

[0021] Optionally, the chip is placed at the bottom of the carrier substrate or embedded inside the carrier substrate.

[0022] Optionally, the chip includes a processor and a memory, the memory storing a program that is executed by the processor to realize the conversion of the light emission pattern and / or the conversion of the light emission color of the light emission layer.

[0023] Optionally, the light-emitting substrate has a protective layer on one side having the light-emitting layer, and the protective layer includes at least one of a waterproof layer and an antibacterial layer.

[0024] Optionally, the flat panel detector panel further includes a detector housing, and the light-emitting substrate is mounted on the detector housing.

[0025] As described above, the flat panel detector panel and its manufacturing method of the present invention use a mesh woven from the first conductive fiber and the second conductive fiber as the light-emitting layer having multiple light-emitting units. The light-emitting layer is pressed onto the outer surface of the carrier substrate to form the light-emitting substrate, making the light-emitting substrate easy to disassemble and rework. The light-emitting layer is electrically connected to the chip to control the light emission of each light-emitting unit, thereby realizing the display image of the panel. The program for controlling the light emission of the light-emitting units is written according to requirements and stored in the memory of the chip. The control program realizes the free transformation and switching of the display pattern, meeting the needs of various customers. It also has low power consumption, uniform density, and avoids artifacts that affect the detector imaging. The present invention also facilitates the rework of the detector, eliminates the generation of excess film waste, reduces costs, and is environmentally friendly. In addition, by forming the protective layer on the outer surface of the light-emitting layer and the carrier substrate, the circuit is protected, which has high industrial application value. Attached Figure Description

[0026] Figure 1 The diagram shown is a flowchart of the manufacturing method of the flat panel detector panel of the present invention.

[0027] Figure 2 The diagram shows a structural schematic of the flat panel detector panel of the present invention after the formation of the mesh light-emitting layer.

[0028] Figure 3 The diagram shows a cross-sectional structure after the light-emitting layer is fixed to the outer surface of the substrate, which is a method for manufacturing a flat panel detector panel according to the present invention.

[0029] Figure 4 The diagram shows a cross-sectional structure after the protective layer is formed, illustrating the manufacturing method of the flat panel detector panel of the present invention.

[0030] Figure 5 The image shown is a top view of the method for manufacturing a flat panel detector panel according to the present invention, after the chip is embedded in a carrier substrate.

[0031] Figure 6 The diagram shows a structural schematic of the method for manufacturing a flat panel detector panel according to the present invention, after the chip is embedded in a carrier substrate.

[0032] Figure 7 The diagram shows a cross-sectional view of the method for manufacturing a flat panel detector panel according to the present invention, after the light-emitting substrate is mounted on the detector housing.

[0033] Figure 8The image shown is a front view of the silkscreen and trademark image displayed on the panel of the flat panel detector of the present invention.

[0034] Figure 9 The diagram shows the silkscreen and trademark images displayed on the panel of the flat panel detector of the present invention.

[0035] Component designation explanation

[0036] 1a First conductive fiber

[0037] 1b Second conductive fiber

[0038] 11 Light-emitting units

[0039] 12 Emissive Layers

[0040] 2. Supporting substrate

[0041] 3. Protective layer

[0042] 4 chips

[0043] 5. Light-emitting substrate

[0044] 51 Silkscreen

[0045] 52 trademarks

[0046] 6. Detector housing Detailed Implementation

[0047] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0048] Please see Figures 1 to 9 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0049] Example 1

[0050] This embodiment provides a flat panel detector panel and its manufacturing method, such as Figure 1 The diagram shown illustrates a method for manufacturing the flat panel detector panel, comprising the following steps:

[0051] S1: Provide a first conductive fiber and a second conductive fiber, and weave the first conductive fiber and the second conductive fiber into a web to form a light-emitting layer with multiple light-emitting units, wherein at least one of the first conductive fiber and the second conductive fiber includes a light-emitting material;

[0052] S2: A carrier substrate is provided, and the light-emitting layer is fixed to the outer surface of the carrier substrate to obtain a light-emitting substrate;

[0053] S3: Provide a chip and electrically connect the chip to the light-emitting layer.

[0054] Please see Figure 2 Perform step S1: Provide a first conductive fiber 1a and a second conductive fiber 1b, and weave the first conductive fiber 1a and the second conductive fiber 1b into a web to form a light-emitting layer 12 with a plurality of light-emitting units 11, wherein at least one of the first conductive fiber 1a and the second conductive fiber 1b includes a light-emitting material.

[0055] Specifically, the light-emitting layer 12 contains at least one first conductive fiber 1a and at least one second conductive fiber 1b.

[0056] As an example, such as Figure 2 As shown, this is a schematic diagram of the structure of the mesh-like light-emitting layer 12. The intersection of the first conductive fiber 1a and the second conductive fiber 1b constitutes the light-emitting unit 11.

[0057] Specifically, the light emission color of the light-emitting unit 11 is related to the material of the light-emitting material, and the light emission color of the light-emitting unit 11 can be selected from the first conductive fiber 1a and / or the second conductive fiber 1b according to actual needs.

[0058] Specifically, the thickness of the first conductive fiber 1a and the second conductive fiber 1b can be selected as needed. In this embodiment, the cross-sectional diameter of the first conductive fiber 1a and the second conductive fiber 1b is greater than 1 μm.

[0059] Specifically, the light emission of the light-emitting unit 11 is controlled by controlling the electric field between the intersection of the first conductive fiber 1a and the second conductive fiber 1b.

[0060] Specifically, the shape and size of the light-emitting layer 12, formed by the mesh of the first conductive fiber 1a and the second conductive fiber 1b, are determined according to actual needs and are not limited here. The shape of the mesh in the light-emitting layer 12 includes triangular, quadrilateral, or other suitable shapes. In this embodiment, the shape of the mesh in the light-emitting layer 12 is quadrilateral.

[0061] Please see again Figures 3 to 4Step S2 is performed: a carrier substrate 2 is provided, and the light-emitting layer 12 is fixed to the outer surface of the carrier substrate 2 to obtain the light-emitting substrate 5.

[0062] As an example, the carrier substrate 2 includes a carbon plate or other suitable material. In this embodiment, a carbon plate is used as the carrier substrate 2.

[0063] Specifically, the shape, size, and thickness of the carrier substrate 2 can be selected according to actual needs, and are not limited here.

[0064] As an example, such as Figure 3 The diagram shows a cross-sectional view of the light-emitting layer 12 after it has been fixed to the carrier substrate 2. Methods for fixing the light-emitting layer 12 to the carrier substrate 2 include pressing or other suitable methods. In this embodiment, a pressing technique is used to press the light-emitting layer 12 onto the outer surface of the carrier substrate 2. After pressing, the light-emitting layer 12 is pressed together with the ordinary flat panel detector 2, so that the light-emitting layer 12 and the carrier substrate 2 form a single unit to obtain the light-emitting substrate 5.

[0065] Specifically, in order to strengthen the structural strength of the first conductive fiber 1a and the second conductive fiber 1b and prevent damage to the electrical pathways in the light-emitting layer 12 during pressing, carbon fiber is also incorporated into the light-emitting layer 12 to increase its strength and ensure that the light-emitting layer 12 can be better pressed onto the outer surface of the carrier substrate 2 and bonded together with the carrier substrate 2.

[0066] As an example, the method also includes the step of forming a protective layer 3 on the side of the light-emitting substrate 5 having the light-emitting layer 12. The protective layer 3 includes at least one of a waterproof layer and an antibacterial layer, or other suitable materials. In this embodiment, a polymer waterproof coating with waterproof, crack-resistant, and good temperature adaptability is used as the protective layer 3. This protects the light-emitting layer 12 while also providing waterproofing to prevent short circuits between the light-emitting layer 12 and the chip 4 and external power supply caused by a humid environment.

[0067] Specifically, such as Figure 4 The diagram shown is a cross-sectional view of the protective layer 3 after its formation. The method for forming the protective layer 3 includes spin coating or other suitable methods.

[0068] Specifically, the protective layer 3 includes a single-layer film or multiple-layer films, and the protective layer 3 is made of a transparent material.

[0069] Specifically, when the protective layer 3 includes an antibacterial coating, it can meet the requirements of biocompatibility, that is, the material can elicit an appropriate response at a specific part of the body.

[0070] Please see again Figures 5 to 7 Then, perform step S3: provide a chip 4 and electrically connect the chip 4 to the light-emitting layer 12.

[0071] As an example, the chip 4 includes a processor and memory.

[0072] Specifically, the chip 4 includes electronic circuitry and related devices for controlling the light-emitting layer 12.

[0073] Specifically, the chip 4 can control the working state of any one or more of the light-emitting units 11 in the light-emitting layer 12, that is, simultaneously control the light emission and extinguishing of one or more light-emitting units 11.

[0074] As an example, such as Figure 5 and Figure 6 The figures show a top view and a schematic diagram of the chip 4 embedded in the back of the carrier substrate 2. The chip 4 can be placed at the bottom of the carrier substrate 2, embedded within it, or in other suitable positions. In this embodiment, the chip 4 is placed on the back of the carrier substrate 2 and embedded therein to secure it.

[0075] Specifically, the light-emitting substrate 5 is also provided with a circuit port (not shown) that is electrically connected to the chip and used to connect to an external circuit.

[0076] As an example, the method also includes providing a detector housing 6 and mounting the light-emitting substrate 5 onto the detector housing 6.

[0077] Specifically, such as Figure 7 The diagram shows a cross-sectional view of the light-emitting substrate 5 after it has been mounted on the detector housing 6. Methods for mounting the panel 5 to the detector housing 6 include screw fastening, rivet engagement, bonding, or other suitable methods. In this embodiment, the panel 5 is fixed to the detector housing 6 using screw fastening.

[0078] Specifically, after the light-emitting substrate 5 is installed on the detector housing 6, the circuit composed of the light-emitting layer 12 and the chip 4 needs to be programmed as needed, and the programmed program is stored in the memory of the chip 4.

[0079] As an example, the program in the memory is executed by the processor to realize the emission pattern conversion and / or emission color conversion of the emission layer 12.

[0080] The method for manufacturing the flat panel detector panel in this embodiment involves weaving the first conductive fiber 1a and the second conductive fiber 1b into a mesh-like light-emitting layer 12, fixing the light-emitting layer 12 to the outer surface of the carrier substrate 2 to obtain the light-emitting substrate 5, and forming a protective layer 3 covering the light-emitting layer 12 and the outer surface of the carrier substrate 2 to protect the light-emitting layer 12. The light-emitting layer 12 is electrically connected to the chip 4, and the processor in the chip 4 executes the program to control the light emission of the light-emitting unit 11 in the light-emitting layer 12, thereby realizing the image display of the light-emitting substrate 5.

[0081] Example 2

[0082] This embodiment provides a flat panel detector panel, such as Figure 7 The diagram shows a cross-sectional view of the flat panel detector, which includes a light-emitting substrate 5 and a chip 4. The light-emitting substrate 5 includes a carrier substrate 2 and a light-emitting layer 12. The light-emitting layer 12 is fixed to the outer surface of the carrier substrate 2 and includes a plurality of light-emitting units 11. The light-emitting layer 12 is woven from a first conductive fiber 1a and a second conductive fiber 1b. At least one of the first conductive fiber 1a and the second conductive fiber 1b includes a light-emitting material. The chip 4 is electrically connected to the light-emitting layer 12.

[0083] As an example, the intersection of the first conductive fiber 1a and the second conductive fiber 1b constitutes the light-emitting unit 11.

[0084] Specifically, when the first conductive fiber 1a and the second conductive fiber 1b are energized, the electric field at the intersection point between the first conductive fiber 1a and the second conductive fiber 1b changes, and the light-emitting material is affected by the electric field to produce electroluminescence, thus forming the light-emitting unit 11. This light-emitting principle is similar to that of a flexible light-emitting diode, and it has low power consumption.

[0085] As an example, the chip 4 is placed at the bottom of the carrier substrate 2 or embedded inside the carrier substrate 2.

[0086] As an example, the chip 4 includes a processor and a memory, the memory storing a program that is executed by the processor to realize the conversion of the light emission pattern and / or the conversion of the light emission color of the light emission layer 12.

[0087] As an example, the light-emitting substrate 5 has a protective layer 3 on one side of the light-emitting layer 12, and the protective layer 3 includes at least one of a waterproof layer and an antibacterial layer.

[0088] Specifically, the light-emitting layer 12 can display silkscreen 51, trademark 52, or other images and fonts composed of available dots.

[0089] Specifically, such as Figure 8 This is a schematic diagram of the silkscreen 51 and the trademark 52 (logotype, abbreviated as LOGO) displayed on the light-emitting substrate 5. The chip 4 controls the light emission of the light-emitting unit 11 to control the image display of the light-emitting substrate 5.

[0090] Specifically, such as Figure 9 The image shown is a front view of the silkscreen 51 and the trademark 52 displayed on the light-emitting substrate 5. When the light-emitting substrate 5 displays an image, it only displays the silkscreen 51 and no artifacts appear, thus avoiding the influence of artifacts on the imaging quality of the detector.

[0091] Specifically, the size, shape, color, and position information of the trademark 52 displayed on the light-emitting substrate 5 can be controlled by the program.

[0092] Specifically, the width, position, and operable area information of the silkscreen 51 displayed on the light-emitting substrate 5 can be set according to the machine's specifications and remain unchanged after the settings are completed.

[0093] Specifically, the light-emitting substrate 5 is provided with a circuit port for connection to an external circuit. The pins of the chip 4 are electrically connected to an external power supply circuit through the circuit port. The chip 4 executes the program to control some of the light-emitting units 11 in the light-emitting layer 12 to emit light, thereby forming a visible light-emitting pattern in the light-emitting layer 12, thereby realizing the free switching of the displayed image on the light-emitting layer 12 in the light-emitting substrate 5.

[0094] Specifically, the light-emitting substrate 5 is also provided with a master switch for controlling the light-emitting layer 12 to emit light. When the light source is not needed, the switch is controlled to turn off the power supply to the light-emitting layer 12 so that the light-emitting layer 12 does not work.

[0095] As an example, the flat panel detector panel also includes a detector housing 6, and the light-emitting substrate 5 is mounted on the detector housing 6.

[0096] In this embodiment, the flat panel detector panel forms the light-emitting substrate 5 by fixing the light-emitting layer 12, woven from the first conductive fiber 1a and the second conductive fiber 1b, onto the carrier substrate 2. This makes the panel 5 easy to disassemble and rework, and eliminates excess film waste, reducing costs and being environmentally friendly. The light-emitting layer 12 emits light using the principle of electroluminescence, resulting in low power consumption, uniform density, and displaying only the luminescent silkscreen, thus avoiding artifacts and improving image detection. Furthermore, the chip 4 controls the operation of the light-emitting units 11 in the light-emitting layer 12. A program is written for the circuit composed of the chip 4 and the light-emitting layer 12 and stored in the memory of the chip 4. This program enables simple and free transformation of the displayed pattern on the light-emitting substrate 5, meeting different customer needs.

[0097] In summary, the flat panel detector panel and its manufacturing method of the present invention utilize a mesh-like light-emitting layer woven from first conductive fibers and second conductive wire fibers, and fix the light-emitting layer onto a carrier substrate to form a light-emitting substrate. This facilitates panel disassembly and simplifies rework. A protective layer protects the circuitry between the light-emitting layer and the chip in the light-emitting substrate, preventing short circuits. The chip controls each light-emitting unit in the light-emitting layer, enabling the light-emitting substrate to display images and allowing for free transformation of the displayed pattern to meet various customer needs. Furthermore, the light-emitting layer utilizes the electroluminescence principle, resulting in low power consumption, uniform density, good screen printing effect, no artifacts, and high image quality. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0098] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A method for manufacturing a flat panel detector panel, characterized in that, Includes the following steps: A first conductive fiber and a second conductive fiber are provided, and the first conductive fiber and the second conductive fiber are woven into a web to form a light-emitting layer with multiple light-emitting units. At least one of the first conductive fiber and the second conductive fiber includes a light-emitting material, and the light-emitting layer is doped with carbon fiber. A carrier substrate is provided, and the light-emitting layer is fixed to the outer surface of the carrier substrate to obtain a light-emitting substrate. The method of fixing the light-emitting layer to the carrier substrate includes a pressing method. A chip is provided, and the chip is electrically connected to the light-emitting layer; A detector housing is provided, and the light-emitting substrate is mounted on the detector housing.

2. The method for manufacturing a flat panel detector according to claim 1, characterized in that: The chip includes a processor and a memory. The memory stores a program, which is executed by the processor to realize the conversion of the light emission pattern and / or the conversion of the light emission color of the light emission layer.

3. The method for manufacturing a flat panel detector according to claim 1, characterized in that: The intersection of the first conductive fiber and the second conductive fiber constitutes the light-emitting unit.

4. The method for manufacturing a flat panel detector according to claim 1, characterized in that: The substrate includes a carbon plate.

5. The method for manufacturing a flat panel detector according to claim 1, characterized in that, It also includes the following steps: A protective layer is formed on the side of the light-emitting substrate having the light-emitting layer, the protective layer including at least one of a waterproof layer and an antibacterial layer.

6. The method for manufacturing a flat panel detector according to claim 1, characterized in that, It also includes the following steps: The chip is placed at the bottom of the carrier substrate or embedded in the carrier substrate.

7. A flat panel detector panel, characterized in that, The flat panel detector panel is manufactured using the method for manufacturing a flat panel detector panel as described in any one of claims 1 to 6, comprising: Detector housing; A light-emitting substrate includes a carrier substrate and a light-emitting layer. The light-emitting layer is fixed to the outer surface of the carrier substrate and includes a plurality of light-emitting units. The light-emitting layer is woven from a first conductive fiber and a second conductive fiber. At least one of the first conductive fiber and the second conductive fiber includes a light-emitting material. The light-emitting substrate is mounted on the detector housing. The light-emitting layer contains carbon fiber. The chip is electrically connected to the light-emitting layer.

8. The flat panel detector panel according to claim 7, characterized in that: The intersection of the first conductive fiber and the second conductive fiber constitutes the light-emitting unit.

9. The flat panel detector panel according to claim 7, characterized in that: The chip is placed at the bottom of the carrier substrate or embedded inside the carrier substrate.

10. The flat panel detector panel according to claim 7, characterized in that: The chip includes a processor and a memory. The memory stores a program, which is executed by the processor to realize the conversion of the light emission pattern and / or the conversion of the light emission color of the light emission layer.

11. The flat panel detector panel according to claim 7, characterized in that: The light-emitting substrate has a protective layer on one side having the light-emitting layer, and the protective layer includes at least one of a waterproof layer and an antibacterial layer.

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