A hearing assistance device

Abstract

The present application discloses a hearing assistance device, which includes: at least one microphone configured to collect an external sound signal and convert the sound signal into an electrical signal; a signal processing circuit configured to process the electrical signal to generate a control signal; at least one vibrating speaker configured to convert the electrical signal into a vibration signal; and a housing structure configured to carry at least one of the at least one microphone, the signal processing circuit, and the at least one vibrating speaker; wherein, the sound signal includes an original signal and an air conduction leakage sound signal generated by the at least one vibrating speaker, and the difference in sound pressure level between the air conduction leakage sound signal received by the at least one microphone from the at least one vibrating speaker and the original signal is not greater than -33 dB.

Description

Technical Field

[0001] This application relates to the field of acoustics, and in particular to a hearing aid. Background Technology

[0002] Existing hearing aids are typically small amplifiers that amplify sounds that the user couldn't normally hear, then utilize the user's residual hearing to deliver the amplified sound to the auditory center of the brain. However, for users with hearing loss or deterioration, traditional ear-canal sound transmission methods are not ideal for improving hearing. Bone conduction can overcome the limitations of traditional ear-canal sound transmission methods, effectively improving the user's hearing. However, some bone conduction hearing aids can produce feedback (howling).

[0003] Therefore, it is desirable to provide a hearing aid that can improve the user's hearing, enabling the user to receive clearer and more stable sounds. Summary of the Invention

[0004] This application provides a hearing aid device, which includes at least one microphone configured to collect external sound signals and convert the sound signals into electrical signals; a signal processing circuit configured to process the electrical signals to generate control signals; at least one vibrating loudspeaker configured to convert the control signals into vibration signals; and a housing structure configured to carry at least one of the at least one microphone, the signal processing circuit, and the at least one vibrating loudspeaker; wherein the sound signals include an original signal and an air conduction leakage signal generated by the at least one vibrating loudspeaker, and the difference between the air conduction leakage signal received by the at least one microphone from the at least one vibrating loudspeaker and the original signal is not greater than -33dB.

[0005] In some embodiments, within a frequency range of 100Hz-2000Hz, the difference between the air conduction leakage signal received by the at least one microphone from the at least one vibrating loudspeaker and the original signal is no greater than -40dB.

[0006] In some embodiments, within a frequency range of 100Hz-2000Hz, the difference between the air conduction leakage signal received by the at least one microphone from the at least one vibrating loudspeaker and the original signal is no greater than -45dB.

[0007] In some embodiments, within a frequency range of 2000Hz-8000Hz, the difference between the air conduction leakage signal received by the at least one microphone from the at least one vibrating loudspeaker and the original signal is no greater than -33dB.

[0008] In some embodiments, within a frequency range of 2000Hz-8000Hz, the difference between the air conduction leakage signal received by the at least one microphone from the at least one vibrating loudspeaker and the original signal is no greater than -38dB.

[0009] In some embodiments, the distance between any of the at least one microphone and any of the at least one vibrating loudspeaker is not less than 7 mm.

[0010] In some embodiments, the distance between any of the at least one microphone and any of the at least one vibrating loudspeaker is not less than 20 mm.

[0011] In some embodiments, the distance between any of the at least one microphone and any of the at least one vibrating loudspeaker is not less than 36 mm.

[0012] In some embodiments, the distance between any of the at least one microphone and any of the at least one vibrating loudspeaker is not less than 45 mm.

[0013] In some embodiments, the at least one microphone and the at least one vibrating speaker are located on the same side or different sides of the user's auricle.

[0014] In some embodiments, a baffle structure is provided between the at least one microphone and the at least one vibrating loudspeaker, and the baffle structure is connected to the housing structure.

[0015] In some embodiments, the vibrating loudspeaker includes a first housing structure connected to the housing structure, the first housing structure including at least one hole communicating with the interior of the first housing structure.

[0016] In some embodiments, the at least one hole is located in the first housing structure of the at least one vibrating loudspeaker, facing the bottom sidewall of the first housing structure of the at least one microphone and the at least one vibrating loudspeaker.

[0017] In some embodiments, the at least one hole is located in the first housing structure of the at least one vibrating loudspeaker away from the sidewall of the at least one microphone.

[0018] In some embodiments, the at least one hole is located on the bottom sidewall of the first housing structure of the at least one vibrating loudspeaker.

[0019] In some embodiments, the at least one hole is located in the first housing structure of the at least one vibrating loudspeaker, on the sidewall facing the at least one microphone.

[0020] In some embodiments, a mesh structure is provided at the at least one hole, the mesh structure covering the at least one hole.

[0021] In some embodiments, the acoustic impedance of the mesh structure is not greater than 260 MKS Rayls.

[0022] In some embodiments, the acoustic impedance of the mesh structure is not greater than 160 MKS Rayls.

[0023] In some embodiments, the acoustic impedance of the mesh structure is not greater than 145 MKS Rayls.

[0024] In some embodiments, the acoustic impedance of the mesh structure is not greater than 75 MKS Rayls. Attached Figure Description

[0025] This application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0026] Figure 1 This is a frequency response characteristic curve diagram corresponding to the vibration signal and air conduction leakage sound signal of a hearing aid device provided according to some embodiments of this application;

[0027] Figure 2 This is an exemplary frame diagram of a hearing aid device provided according to some embodiments of this application;

[0028] Figure 3 This is a schematic diagram of a hearing aid device provided according to some embodiments of this application;

[0029] Figure 4 This is a schematic diagram of the structure of a vibration loudspeaker provided according to some embodiments of this application;

[0030] Figure 5 This is a schematic diagram of the structure of a microphone provided according to some embodiments of this application;

[0031] Figure 6 These are schematic diagrams illustrating a user wearing a hearing aid device according to some embodiments of this application;

[0032] Figure 7 These are schematic diagrams illustrating a user wearing a hearing aid device according to some embodiments of this application;

[0033] Figure 8 This is a frequency response curve of the air conduction leakage sound signal received by the microphone when the hole is in different positions in the first housing structure according to some embodiments of this application;

[0034] Figure 9 This is a comparison graph of the sound pressure level of the air conduction leakage signal received by the microphone at different positions of the hole in the first housing structure according to other embodiments of this application and when no hole is provided.

[0035] Figure 10 This is a comparison diagram of the sound pressure level of the air conduction leakage signal received by the microphone at different positions of the hole in the first housing structure according to other embodiments of this application and when no hole is provided;

[0036] Figure 11 This is a graph showing the difference between the leakage signal from a vibrating loudspeaker and the original signal for a mesh structure with different acoustic impedances according to some embodiments of this application.

[0037] Figure 12 This is a schematic diagram of the structure of a rear-mounted hearing aid device provided according to some embodiments of this application;

[0038] Figure 13 This is a schematic diagram of the structure of a glasses-type hearing aid device according to some embodiments of this application;

[0039] Figure 14 This is a schematic diagram of the structure of a wireless hearing aid device provided according to some embodiments of this application. Detailed Implementation

[0040] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0041] It should be understood that the terms “system,” “device,” “unit,” and / or “module” used herein are one way to distinguish different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0042] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0043] Flowcharts are used in this application to illustrate the operations performed by the system according to embodiments of this application. It should be understood that the preceding or following operations are not necessarily performed precisely in sequence. Instead, the steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes, or one or more steps can be removed from them.

[0044] This specification describes a hearing aid. A hearing aid is used to collect and amplify external sounds to compensate for the hearing loss of a person with hearing impairment. In some embodiments, the hearing aid may include an air conduction hearing aid and a bone conduction hearing aid. An air conduction hearing aid is a device that transmits amplified sound signals from the outer ear and middle ear to the eardrum via air conduction. When a person with hearing impairment has severe hearing loss or deterioration, an air conduction hearing aid cannot effectively improve the user's hearing. A bone conduction hearing aid is a device that generates bone conduction sound waves through a vibrating component. When a person with hearing impairment wears a bone conduction hearing aid, the bone conduction sound waves generated by the vibrating component are transmitted through the human skeleton to the user's auditory nerve. Bone conduction hearing aids have a better effect on improving hearing for people with hearing loss due to problems in the outer and middle ears. In some embodiments, the vibrating component of the bone conduction hearing aid transmits mechanical vibrations to the housing structure through a connector, causing the housing structure to vibrate. The vibration of the housing structure pushes the surrounding air, thereby generating air conduction sound leakage. In some embodiments, the microphone (e.g., a microphone) of the hearing aid device collects external sounds along with air conduction leakage sound generated by the vibration of the housing structure. When the volume of this air conduction leakage sound is large, it can cause the hearing aid device to emit a whistling sound. The hearing aid device described in the embodiments of this specification includes at least one microphone, a signal processing circuit, at least one vibrating speaker, and a housing structure. The microphone can be configured to collect external sound signals and convert them into electrical signals. The vibrating speaker can be configured to convert control signals into vibration signals. The housing structure can be configured to carry at least one of the at least one microphone, the signal processing circuit, and the at least one vibrating speaker. The control signal includes an original signal and an air conduction leakage sound signal generated by the at least one vibrating speaker. The original signal refers to the control signal generated by the signal processing circuit after processing the external sound signal; this control signal does not include the air conduction leakage sound signal generated by the vibration of the vibrating speaker. The difference between the air conduction leakage sound signal received by the at least one microphone from the at least one vibrating speaker and the original signal is no greater than -33 dB. In some embodiments, within the frequency range of 100Hz-2000Hz, the difference between the air conduction leakage signal received by at least one microphone from at least one vibrating loudspeaker and the original signal is no greater than -40dB. In some embodiments, within the frequency range of 2000Hz-8000Hz, the difference between the air conduction leakage signal received by at least one microphone from at least one vibrating loudspeaker and the original signal is no greater than -33dB. In some embodiments, within the frequency range of 100Hz-2000Hz, the difference between the air conduction leakage signal received by at least one microphone from at least one vibrating loudspeaker and the original signal is no greater than -45dB.In some embodiments, within a frequency range of 2000Hz-8000Hz, the difference between the air conduction leakage signal received by at least one microphone from at least one vibrating loudspeaker and the original signal is no greater than -38dB. In some embodiments, the difference between the air conduction leakage signal received by the microphone and the original signal can be made no greater than -33dB by adjusting the distance between the vibrating loudspeaker and the microphone. In some embodiments, the difference between the air conduction leakage signal received by the microphone and the original signal can be made no greater than -33dB by providing a baffle structure between the vibrating loudspeaker and the microphone or by positioning the vibrating loudspeaker and the microphone on both sides of the user's auricle. In some embodiments, the difference between the air conduction leakage signal received by the microphone and the original signal can also be made no greater than -33dB by opening a hole in the side wall of the first housing structure of the vibrating microphone. In the embodiments described in this specification, by reducing the magnitude of the air conduction leakage signal received at the microphone through the above-described embodiments, the absolute value of the difference (also known as attenuation) between the air conduction leakage signal received from the microphone and the original signal is made greater than the difference (also known as gain) between the original signal and the sound signal. This can increase the maximum output volume of the hearing aid device while suppressing feedback. It should be noted that the air conduction leakage signal from the vibrating speaker and the original signal in the control signal refer to the electrical signals after being processed by the signal processing circuit.

[0045] Figure 1 This is a frequency response characteristic curve diagram corresponding to the vibration signal and air conduction sound leakage signal of a hearing aid device provided according to some embodiments of this application. For example... Figure 1 As shown, Figure 1 The horizontal axis in the graph represents the frequency of the signal. Figure 1 The vertical axis in the graph represents the sound pressure level of the signal at different frequencies, derived from the frequency response characteristic curve of the vibration signal. Figure 1 The curve marked with "vibration" in the middle) and the frequency response characteristic curve corresponding to the air conduction leakage sound signal ( Figure 1The comparison results (indicated by the curves marked "air conduction leakage") show that within a specific frequency range (e.g., 20Hz-4000Hz), the higher the sound pressure level of the vibration signal from the hearing aid device, the higher the sound pressure level of the corresponding air conduction leakage signal. Therefore, within a specific frequency range of the vibration signal, the strength of the air conduction leakage signal from the hearing aid device is positively correlated with the strength of the vibration signal. In some embodiments, the main operating frequency band of the hearing aid device can be the human voice frequency range of 200Hz-4000Hz. This human voice frequency range falls within the aforementioned specific frequency range. With the vibration signal remaining constant, suppressing the air conduction leakage signal within this human voice frequency range can effectively suppress the whistling of the hearing aid device. It should be noted that the operating frequency band of the hearing aid device is not limited to the aforementioned 200Hz-4000Hz and can be adjusted according to the application scenario of the hearing aid device. For example, hearing aids can also operate in frequency bands of 20Hz-4000 Hz, 80Hz-6000 Hz, 100Hz-8000 Hz, or other ranges.

[0046] To suppress feedback from hearing aids and further improve the user's hearing experience, enabling them to receive clearer and more stable sound, in some embodiments, the distance between the vibrating speaker and the microphone can be adjusted so that the difference between the air conduction leakage signal received by the microphone from the vibrating speaker and the original signal is no greater than -33 dB. For example, in some embodiments, the distance between the microphone and the vibrating speaker can be increased, causing energy loss of the air conduction leakage signal in the transmission path from the vibrating speaker to the microphone, thereby reducing the volume of the air conduction leakage signal received at the microphone. In some implementations, a baffle structure can be provided between the vibrating speaker and the microphone to ensure that the difference between the air conduction leakage signal received by the microphone from the vibrating speaker and the original signal is no greater than -33 dB. For example, in some embodiments, the microphone and the vibrating speaker can be positioned on either side of the user's auricle (the user's auricle is approximated as a baffle structure) to reduce the volume of the air conduction leakage signal received at the microphone. As another example, a baffle structure can also be provided between the vibrating speaker and the speaker. For example, the microphone and the vibrating loudspeaker are located on opposite sides of the housing structure, which can be approximated as a baffle structure. In some embodiments, the air conduction leakage generated by the vibrating loudspeaker itself can be reduced so that the difference between the air conduction leakage signal received by the microphone from the vibrating loudspeaker and the original signal is no greater than -33dB. For example, at least one hole can be provided on the first housing structure of the vibrating loudspeaker in the hearing aid device. The at least one hole can lead the air vibration inside the first housing structure to the outside and cancel out the air conduction leakage signal outside the first housing structure, thereby reducing the air conduction leakage signal received by the microphone. In the embodiments of this specification, by reducing the air conduction leakage signal received by the microphone in the above manner, the hearing aid device can effectively avoid generating feedback. In some embodiments, the reduced air conduction leakage signal can be used as the gain of the hearing aid device, thereby improving the overall gain effect of the hearing aid device.

[0047] In some embodiments, hearing aids can be integrated with products such as eyeglasses, headphones (e.g., wired and wireless headphones), head-mounted displays, and AR / VR headsets. For example, hearing aids can be applied to eyeglasses. Specifically, the hearing aid can be positioned on the temple of the eyeglasses near the user's ear, so that the hearing aid is located around the user's ear when the user wears the eyeglasses. As another example, hearing aids can be applied to VR headsets. Specifically, the hearing aid can be positioned on the VR headset shell near the user's ear.

[0048] Figure 2 This is an exemplary frame diagram of a hearing aid device provided according to some embodiments of this application. Figure 2As shown, the hearing aid 200 may include a microphone 210, a signal processing circuit 220, and a vibrating speaker 240. The microphone 210 can collect sound signals from the external environment and convert the collected sound signals into electrical signals. In some embodiments, the microphone 210 may be a dynamic microphone, a ribbon microphone, a condenser microphone, an electret microphone, an electromagnetic microphone, a carbon microphone, or any combination thereof. In some embodiments, based on the sound acquisition method, the microphone 210 may include a bone conduction microphone and an air conduction microphone.

[0049] The signal processing circuit 220 can process the electrical signal converted by the microphone 210 to generate a control signal. The signal processing described herein may include, but is not limited to, at least one of signal amplification, phase adjustment, and filtering. In some embodiments, the signal processing circuit 220 may include, but is not limited to, an equalizer (EQ), a dynamic range controller (DRC), and a phase processor (GAIN).

[0050] The vibrating speaker 240 can be electrically connected to the signal processing circuit 220 to receive control signals and generate corresponding bone conduction sound waves based on the control signals. These bone conduction sound waves can be transmitted to the user's auditory nerve through the human skeleton. Here, bone conduction sound waves refer to sound waves transmitted to the user's ear via mechanical vibration through the human skeleton. In some embodiments, the vibrating speaker 240 can be an electrodynamic speaker (e.g., a moving-coil speaker), a magnetic speaker, an ion speaker, an electrostatic speaker (or a capacitive speaker), a piezoelectric speaker, etc. In some embodiments, the vibrating speaker 240 can be a standalone functional device or part of a single device capable of performing multiple functions. In some embodiments, the signal processing circuit 220 can be integrated with and / or formed as a single unit of the vibrating speaker 240.

[0051] In some embodiments, the hearing aid 200 may further include a housing structure. Figure 2(Not shown in the image). In some embodiments, the housing structure can be used to house one or more of a microphone, signal processing circuitry, and a vibrating speaker. For example, a microphone can be disposed at one end of the mounting cavity inside the housing structure, and a vibrating speaker can be disposed at the end of the mounting cavity opposite to the microphone end. In some embodiments, the microphone and the vibrating speaker can be located simultaneously in one mounting cavity of the housing structure. In other embodiments, the housing structure may include a first mounting cavity and a second mounting cavity, wherein the first mounting cavity and the second mounting cavity may be connected or not connected, the microphone is located in the first mounting cavity, and the vibrating speaker is located in the second mounting cavity. In some embodiments, when the vibrating speaker and the microphone are located in the mounting cavity inside the housing structure, a baffle structure can be provided in the mounting cavity inside the housing structure. This baffle structure is fixedly connected to the housing structure of the hearing aid device. The baffle structure can block the air conduction leakage signal generated at the vibrating speaker from being transmitted to the microphone, thereby effectively reducing the air conduction leakage signal received by the microphone from the vibrating speaker and preventing the hearing aid device from whistling during operation. It is important to note that the vibrating speaker and microphone are not limited to being located in a mounting cavity within the housing structure. In some embodiments, all or part of the structure of the vibrating speaker and microphone can be located on the outer surface of the housing structure. For example, the portion of the vibrating speaker that contacts the user's body can protrude relative to the outer surface of the housing structure. When the vibrating speaker and microphone are located on either side of the exterior of the housing structure, the housing structure can act as a baffle structure. As a baffle structure, the housing structure can effectively reduce the air conduction leakage signal received by the microphone from the vibrating speaker, thereby preventing feedback from the hearing aid device during operation. It is also important to note that the vibrating speaker or microphone may not be located within the housing structure. For example, the vibrating speaker may be located within the housing structure, while the microphone may be located within the structure of other devices (e.g., eyeglass temples, ear hooks, etc.).

[0052] In some embodiments, the housing structure may be a hollow, closed housing structure. In some embodiments, the microphone and the vibrating speaker may be fixedly connected to the housing structure. As an example only, when a hearing aid is applied to eyeglasses, the housing structure of the hearing aid may be mounted on the end of the temple of the eyeglasses, where the end of the temple can be understood as the end of the temple closest to the user's ear when the user wears the eyeglasses. In this case, the housing structure of the hearing aid may be located near the auricle (e.g., in front of the auricle, behind the auricle, etc.). Further, the position of the housing structure relative to the temple of the eyeglasses or the shape of the housing structure can be changed so that the vibrating speaker and the microphone in the housing structure are located on the same side or different sides of the auricle. As another example, when a hearing aid is applied to behind-the-ear headphones, the housing structure may also be mounted on the end of the ear hook structure of the behind-the-ear headphones. When the user wears the behind-the-ear headphones, the end of the ear hook structure may be located near the user's auricle. Further, the position of the housing structure relative to the ear hook structure or the shape of the housing structure can be changed so that the vibrating speaker and the microphone in the housing structure are located on the same side or different sides of the auricle.

[0053] In some embodiments, the hearing aid 200 can be worn on a user's body (e.g., the head, neck, or upper torso) via a housing structure. The housing structure and the vibrating speaker 240 can be close to but not obstruct the ear canal, keeping the user's ear open and improving wearing comfort. For example, the hearing aid 200 can be positioned around or partially around the user's ear. In some embodiments, the hearing aid 200 can be integrated with products such as glasses, headphones, head-mounted displays, and AR / VR headsets. In this case, the housing structure can be suspended or clipped to the vicinity of the user's ear. In some alternative embodiments, the housing structure can be provided with hooks, the shape of which matches the shape of the auricle, allowing the hearing aid 200 to be worn independently on the user's ear. The independently worn hearing aid 200 can communicate with a signal source (e.g., a computer, mobile phone, or other mobile device) via wired or wireless (e.g., Bluetooth). For example, both the left and right hearing aids 200 can be directly connected to the signal source wirelessly. For example, the hearing aids 200 for the left and right ears may include a first output device and a second output device. The first output device can communicate with a signal source, and the second output device can wirelessly connect to the first output device. The first and second output devices can synchronize audio playback through one or more synchronization signals. The wireless connection method may include, but is not limited to, Bluetooth, local area network, wide area network, wireless personal area network, near field communication, or any combination thereof.

[0054] In some embodiments, the housing structure may be a housing structure with a shape adapted to the human ear, such as a ring, ellipse, polygon (regular or irregular), U-shaped, V-shaped, or semi-circular shape, so that the housing structure can be directly attached to the user's ear. In some embodiments, the housing structure may also include one or more fixing structures. In some embodiments, the fixing structure may include an ear hook structure, a headband, or an elastic band, so that the hearing aid 200 can be better secured to the user and prevent it from falling off during use. As an example only, for example, the elastic band may be a headband, which may be configured to be worn around the head area. As another example, the elastic band may be a neck strap, configured to be worn around the neck / shoulder area. In some embodiments, the elastic band may be a continuous strip and may be elastically stretched to be worn on the user's head, while the elastic band may also apply pressure to the user's head, so that the hearing aid 200 is securely fixed in a specific position on the user's head. In some embodiments, the elastic band may be a discontinuous strip. For example, the elastic band may include a rigid portion and a flexible portion, wherein the rigid portion may be made of a rigid material (e.g., plastic or metal) and may be secured to the housing structure of the hearing aid 200 by a physical connection (e.g., snap-fit, threaded connection, etc.). The flexible portion may be made of an elastic material (e.g., fabric, composite material, and / or neoprene).

[0055] It should be noted that in some embodiments, the hearing aid may not include a housing structure for supporting the microphone and speaker. For example, the microphone and speaker may be fixed to the structure of another device (e.g., eyeglasses), and the structure of the other device may serve as the housing structure for the microphone and speaker. As another example, when the microphone and speaker are located at the structure of another device, the microphone and speaker can be positioned on the same or different sides of the user's auricle by adjusting the structure of the other device (e.g., changing the shape, size, etc. of the other device structure) or by adjusting the position of the microphone and speaker at the structure of the other device. Furthermore, the spacing between the microphone and speaker can be adjusted by adjusting the position of the microphone and speaker on the other device.

[0056] Figure 3 This is a schematic diagram of a hearing aid device provided according to some embodiments of this application. For example... Figure 3As shown, the hearing aid 200 may include a microphone 210, a signal processing circuit 220, a power amplifier 230, and a vibrating speaker 240. The signal processing circuit 220 may include an equalizer (EQ) 221, a dynamic range controller (DRC) 222, and a phase processor (GAIN) 223. The sound emitted by the vibrating speaker 240 may include a vibration signal 241 and an air conduction leakage signal 242. The vibration signal 241 corresponds to bone conduction sound waves, and the air conduction leakage signal 242 corresponds to air conduction sound waves. In some embodiments, the vibration signal 241 may be transmitted to the user's auditory nerve via the human skeleton, and the air conduction leakage signal 242 may be transmitted to the user's auditory nerve via air.

[0057] In some embodiments, equalizer 221 can be configured to gain and / or attenuate the electrical signal output from microphone 210 according to specific frequency bands (e.g., high, mid, and low frequencies). Gaining the electrical signal means increasing the amplification of the electrical signal; attenuating the electrical signal means decreasing the amplification of the electrical signal. Equalizer 221 can compensate for deficiencies in the loudspeaker and sound field by adjusting the electrical signal at different frequencies (e.g., gain, attenuation). In some embodiments, dynamic range controller (DRC) 222 can be configured to compress and / or amplify the electrical signal. Compressing and / or amplifying the electrical signal means decreasing and / or increasing the ratio between the electrical signal input to and output from microphone 210. For example, dynamic range controller (DRC) 222 can make the sound sound softer or louder. In some embodiments, phase processor 223 can be configured to adjust the phase of the electrical signal. The electrical signal is processed by signal processing circuit 220 to generate a corresponding control signal. The control signal can be further transmitted to the power amplifier 230, which can be configured to amplify the amplitude of the control signal. In some embodiments, the vibrating speaker 240 can receive and process the amplified control signal and generate a vibration signal based on the control signal. In some applications, the microphone 210 converts external sound signals into electrical signals and transmits them to the signal processing circuit 220. The signal processing circuit 220 processes the electrical signals to obtain a raw signal with an amplitude of V1, which is then amplified by the power amplifier 230 and sent to the vibrating speaker 240. Part of the air conduction leakage signal and vibration signal generated by the vibrating speaker 240 are received by the microphone 210. Based on the part of the air conduction leakage signal and vibration signal generated by the vibrating speaker 240, the microphone 210 generates a signal with an amplitude of V2. At this time, the attenuation magnitude x can be calculated by the following formula:

[0058] x = 20 × log(V2 / V1); (1)

[0059] Since the hearing aid amplifies the sound signal, the signal processing circuit 220 needs to generate a certain gain G on the input signal to amplify the sound signal. For example, if the gain of the signal processing circuit 220 is set to G = 40dB, this can be understood as the electrical signal transmitted from the microphone 210 to the signal processing circuit 220 being increased by 40dB after processing and outputting the corresponding control signal. The sound signal with amplitude V2 generated by the microphone 210 due to receiving part of the air conduction leakage signal and vibration signal from the vibrating speaker 240 will have its amplitude increased by 40dB after passing through the signal processing circuit 220. For illustrative purposes only, if the attenuation x = -30dB, the amplitude V1' of the control signal output by the signal processing circuit 220 will be 10dB greater than the amplitude V1 of the original signal, creating positive feedback and causing howling. Therefore, the hearing aid can reduce the air conduction leakage signal so that the attenuation |x| is greater than the gain G, thus avoiding howling.

[0060] Figure 4 This is a schematic diagram of the structure of a vibration loudspeaker provided according to some embodiments of this application. For example... Figure 4 As shown, the vibrating speaker 400 may include a first housing structure 410, a connector 420, and a vibration assembly 430. The first housing structure 410 is the outer shell of the vibrating speaker 400, used to house the connector 420 and the vibration assembly 430. The vibration assembly 430 can be connected to the first housing structure 410 via the connector 420. In some embodiments, the vibration assembly 430 can be electrically connected to a signal processing circuit to receive a control signal and generate bone conduction sound waves based on the control signal. For example, the vibration assembly 430 can be any element (e.g., a vibrating motor, electromagnetic vibration device, etc.) that converts an electrical signal (e.g., a control signal from the signal processing circuit 220) into a mechanical vibration signal. The signal conversion method may include, but is not limited to, electromagnetic (moving coil, moving iron, magnetostrictive, etc.), piezoelectric, electrostatic, etc. In some embodiments, the internal structure of the vibration assembly 430 can be a single resonant system or a composite resonant system. In some embodiments, the vibration assembly 430 can mechanically vibrate according to a control signal, and this mechanical vibration can generate bone conduction sound waves (…). Figure 4 The vibration component 430 may include a contact portion (as indicated by the vibration arrow in the middle). In some embodiments, the vibration component 430 may include a contact portion ( Figure 4 (Not shown in the image), the contact portion can be used to conform to the user's skin when the user wears the hearing aid 200, so that bone conduction sound waves can be transmitted through the user's body to the user's cochlea.

[0061] In some embodiments, the first housing structure 410 and the vibration component 430 may be coupled, and the first housing structure 410 may be based on bone conduction sound waves (…). Figure 4 The sound wave indicated by the vibration arrow in the middle) generates air-conducted sound waves ( Figure 4 (The sound wave is indicated by the sound arrow in the middle). In some embodiments, the first housing structure 410 can be connected to the vibration component 430 via a connector 420. The first housing structure 410 can serve as a secondary resonant system for the first mechanical vibration. On one hand, the first housing structure 410 itself can act as a mechanical system that generates a second mechanical vibration under the excitation of the first mechanical vibration; on the other hand, after the second mechanical vibration is conducted into the air to form sound (i.e., air-conducted sound wave), the internal space of the first housing structure 410 can serve as a resonant cavity to amplify the sound. In some embodiments, the frequency response of the first housing structure 410 can be adjusted by adjusting the connector 420 between the first housing structure 410 and the vibration component 430. For example, the connector 420 can be a rigid member or an elastic member. In some embodiments, the connector 420 can be an elastic member, such as a spring, a sheet, etc. In some embodiments, systems with different elastic coefficients may respond differently in amplitude to the same frequency input. Therefore, by changing the elastic coefficient of the connector 420 and / or the elastic coefficient and mass of the first housing structure 410, the amplitude response of the second mechanical vibration to different frequency excitations can be adjusted.

[0062] In some embodiments, Figure 2 The hearing aid 200 shown can directly output bone conduction sound waves when the vibration component 430 is working. For example, bone conduction sound waves can be transmitted to the auditory nerve by fitting against the skin. Simultaneously, the first mechanical vibration generated by the vibration component 430 is transmitted to the first housing structure 410 through the connector 420, causing the first housing structure 410 to also vibrate, i.e., a second mechanical vibration. This second mechanical vibration can act as a sound source for air conduction sound waves, radiating sound to the outside, thus enabling a single device to simultaneously output bone conduction sound waves and air conduction sound waves.

[0063] It should be noted that, Figure 4 The vibrating speaker shown can be a cuboid structure. In some embodiments, the vibrating speaker can also be other shapes, such as polygonal (regular and / or irregular) solid structures, cylinders, frustums, cones, and other geometric structures.

[0064] Figure 5 This is a schematic diagram of a microphone provided according to some embodiments of this application. To further describe the microphone, a bone conduction microphone will be used as an example below. Figure 5As shown, the microphone 500 may include a second housing structure 510, an acoustic transducer 520, and a vibration unit 530. The second housing structure 510 is the outer shell of the microphone 500. In some embodiments, the second housing structure 510 is used to carry the acoustic transducer 520 and the vibration unit 530. In some embodiments, the second housing structure 510 may contact human skin and receive vibration signals from muscles when a person speaks. The vibration unit 530 may vibrate in response to the vibration signal of the second housing structure 510. Since the vibration phase of the vibration unit 530 is different from the vibration phase of the second housing structure 510 and the acoustic transducer 520, the vibration of the vibration unit 530 may cause a volume change in the cavity (e.g., the second acoustic cavity 542) inside the second housing structure 510, thereby causing a change in the sound pressure inside the cavity of the second housing structure 510. The acoustic transducer 520 may convert the sound pressure change inside the cavity of the second housing structure 510 into an electrical signal. In some embodiments, the shape of the microphone 500 may include, but is not limited to, a cuboid, a cylinder, or other regular or irregular structures. In some embodiments, the second housing structure 510 and the acoustic transducer 520 may be physically connected, and this physical connection may include, but is not limited to, welding, snap-fitting, bonding, or integral molding. In some embodiments, the second housing structure 510 and the acoustic transducer 520 form an encapsulation structure having a first acoustic cavity 540, wherein the vibration unit 530 may be located within the first acoustic cavity 540 of the encapsulation structure. In some embodiments, the second housing structure 510 may independently form an encapsulation structure having a first acoustic cavity 540, wherein the vibration unit 530 and the acoustic transducer 520 may be located within the first acoustic cavity 540 of the encapsulation structure. In some embodiments, the vibration unit 530 may divide the first acoustic cavity 540 into a second acoustic cavity 542 and a third acoustic cavity 541. The second acoustic cavity 542 is acoustically connected to the acoustic transducer 520. In some embodiments, the third acoustic cavity 541 may be an acoustically sealed cavity structure.

[0065] In some embodiments, the vibration unit 530 may include a mass element 531 and an elastic element 532. In some embodiments, the elastic element 532 is used to connect the mass element 531 to the second housing structure 510 or the acoustic transducer 520, and deforms when the second housing structure 510 vibrates, causing relative movement between the mass element 531 and the second housing structure 510. In some embodiments, the mass element 531 may be connected to the second housing structure 510 via the elastic element 532. For example, the elastic element 532 may be located on the side of the mass element 531 away from the acoustic transducer 520, with one end of the elastic element 532 connected to the second housing structure 510 and the other end of the elastic element 532 connected to the mass element 531.

[0066] In some embodiments, the elastic element 532 may also be located around the periphery of the mass element 531, wherein the inner side of the elastic element 532 is connected to the periphery of the mass element 531, and the outer side of the elastic element 532 or the side away from the acoustic transducer 520 is connected to the housing structure 510. The periphery of the mass element 531 referred to here is relative to the vibration direction of the mass element 531. For convenience, the vibration direction of the mass element 531 relative to the housing structure 510 can be considered as the axial direction. In this case, the periphery of the mass element 531 can refer to the side of the mass element 531 arranged around the axis. In some embodiments, the mass element 531 may also be connected to the acoustic transducer 520 via the elastic element 532. Exemplary elastic elements 532 may be cylindrical, square, irregularly shaped, annular, flat, etc. In some embodiments, the elastic element 532 may have a structure that readily undergoes elastic deformation (e.g., a spring structure, a metal ring, etc.), and its material may be a material that readily undergoes elastic deformation, such as silicone, rubber, etc. In the embodiments described in this specification, the elastic element 532 is more prone to elastic deformation than the second housing structure 510, so that the vibration unit 530 can move relative to the second housing structure 510.

[0067] It should be noted that in some embodiments, the mass element 531 and the elastic element 532 may be independent components, which are assembled together to form the vibration unit 530. In some embodiments, the mass element 531 and the elastic element 532 may also be a one-piece molded structure. In some embodiments, the mass element 531 and the elastic element 532 may also be composed of the same or different materials.

[0068] Microphone 500 can convert external vibration signals into electrical signals. In some embodiments, external vibration signals may include vibration signals from a person speaking, vibration signals generated by skin movement or the operation of a speaker near the skin, vibration signals generated by an object in contact with the microphone or by the air, or any combination thereof. Further, the electrical signals generated by microphone 500 can be input to a signal processing circuit for processing, and amplified by a power amplifier, and then used to control a vibrating speaker (e.g., Figure 4 The vibrating speaker 400 shown generates a vibration signal.

[0069] In some embodiments, when the microphone 500 is operating, external vibration signals can be transmitted to the vibration unit 530 through the second housing structure 510, and the vibration unit 530 vibrates in response to the vibration of the second housing structure 510. Since the vibration phase of the vibration unit 530 differs from the vibration phase of the second housing structure 510 and the acoustic transducer 520, the vibration of the vibration unit 530 can cause a volume change in the second acoustic cavity 542, thereby causing a change in the sound pressure of the second acoustic cavity 542. The acoustic transducer 520 can detect the change in sound pressure of the second acoustic cavity 542 and convert it into an electrical signal, which is then transmitted to the vibrating speaker via wired or wireless means. In some embodiments, the acoustic transducer 520 may include a diaphragm (…). Figure 5 (Not shown in the image) When the sound pressure of the second acoustic cavity 542 changes, the air inside the second acoustic cavity 542 vibrates and acts on the diaphragm, causing the diaphragm to deform. The acoustic transducer 520 converts the vibration signal of the diaphragm into an electrical signal.

[0070] It should be noted that microphones are not limited to those mentioned above. Figure 5 The bone conduction microphone shown can also be an air conduction microphone. The structure of the air conduction microphone is similar to... Figure 5 The difference in the structure of the bone conduction microphone shown is that it does not include Figure 5 The vibration unit 530 shown in the figure can transmit external sound information (e.g., air-conducted sound waves) by opening one or more holes (not shown in the figure) on the second housing structure 510 of the air-conducted microphone. The air-conducted sound waves act on the diaphragm of the acoustic transducer 520, causing the diaphragm to deform. The acoustic transducer 520 can convert the vibration signal of the diaphragm into an electrical signal.

[0071] A vibrating loudspeaker (e.g., vibrating loudspeaker 400) generates air-conducted sound waves (air-conducted sound leakage signal) in addition to bone-conducted sound waves. These air-conducted sound waves are received by a microphone (e.g., microphone 500). When the volume of the air-conducted sound waves is high, it causes feedback in hearing aids. To effectively solve the feedback problem of hearing aids, in some embodiments, the spacing between the microphone and the vibrating loudspeaker, or their position relative to the user's auricle, can be adjusted. For example, in some embodiments, the microphone and the vibrating loudspeaker can be located on the front and back sides of the user's auricle, respectively. The user's auricle can block the propagation of the air-conducted sound waves, increasing the effective transmission path length of the air-conducted sound waves, thereby reducing the volume of the air-conducted sound waves received by the microphone. Figure 6 This is a schematic diagram illustrating a user wearing a hearing aid device according to some embodiments of this application. As an example only, when a user wears the hearing aid device, the microphone and vibrating speaker are located on either side of the user's auricle, such as... Figure 6As shown, when a user wears a hearing aid, the microphone 610 is located behind the user's auricle, and the vibrating speaker 620 is located in front of the user's auricle. The front of the auricle refers to the side of the auricle facing the front of the body (e.g., the face). The back of the auricle refers to the side facing the opposite direction, i.e., the back of the body (e.g., the back of the head). In this case, due to the presence of the user's auricle, the effective transmission path length of the air-conducted sound waves generated by the vibrating speaker 620 is increased during transmission to the microphone 610, thereby reducing the volume of the air-conducted sound waves received by the microphone 610 and effectively suppressing the whistling of the hearing aid.

[0072] It should be noted that the positions of the microphone 610 and the vibrating speaker 620 are not limited to the aforementioned location of the microphone 610 behind the user's auricle and the vibrating speaker 620 behind the user's auricle. For example, in some embodiments, the microphone 610 may also be located in front of the user's auricle, and the vibrating speaker 620 may be located behind the user's auricle. Furthermore, in some embodiments, when the user wears a hearing aid, the microphone 610 and the vibrating speaker 620 may be simultaneously located on the same side of the user's auricle (e.g., in front of and / or behind the auricle). It should be explained that the microphone 610 and the vibrating speaker 620 may be simultaneously located in front of and / or behind the user's auricle; the location of "front" and / or "back" can refer to being directly in front of and / or directly behind the user's auricle, or it can refer to being diagonally in front of and / or diagonally behind the user's auricle. It should be noted that the microphone 610 and the vibrating speaker 620 can also be located on the same side of the user's auricle (e.g., the front or back side of the user's auricle). When the microphone 610 and the vibrating speaker 620 are located on the same side of the auricle, the housing structure can be provided with a baffle structure, and the microphone 610 and the vibrating speaker 620 can be located on both sides of the baffle structure. In some embodiments, the microphone 610 and the vibrating speaker 620 can be located on both sides of the housing structure. Furthermore, when the vibrating speaker 620 on one side of the housing structure generates air-conducted sound waves, the air-conducted sound waves need to bypass the housing structure to be transmitted to the microphone 610 on the other side of the housing structure. At this time, the housing structure itself can also act as a baffle structure.

[0073] In some embodiments, the air-conducted sound waves received by the microphone can also be reduced by adjusting the distance d between the vibrating loudspeaker and the microphone. The distance between the vibrating loudspeaker and the microphone refers to the minimum distance between them. Further, the distance between the vibrating loudspeaker and the microphone refers to the minimum distance between the first housing structure in the vibrating loudspeaker and the second housing structure in the microphone. Air-conducted sound waves attenuate during their transmission path from the vibrating loudspeaker to the microphone. By increasing the distance between the microphone and the vibrating loudspeaker, the magnitude of the air-conducted sound waves received by the microphone from the vibrating loudspeaker can be effectively reduced, thereby suppressing feedback from the hearing aid.

[0074] [1] For illustrative purposes only, the hearing loss of a person with mild hearing impairment is 26dB-40dB. To ensure that the maximum internal gain of the hearing aid device (hereinafter referred to as the maximum non-feedback internal gain) is not less than 26dB without feedback, the internal gain refers to the difference between the output sound pressure level and the input sound pressure level of the hearing aid device. The internal gain of the hearing aid device must be greater than the hearing loss of the person with mild hearing impairment in order to provide hearing assistance. When the distance between the vibrating speaker and the microphone is about 7mm, the measured maximum non-feedback internal gain is about 26dB. When the distance between the microphone and the vibrating speaker is about 40mm, the maximum non-feedback internal gain of the hearing aid device is about 40dB. When the distance between the microphone and the vibrating speaker is about 45mm, the maximum non-feedback internal gain of the hearing aid device is about 42dB.

[0075] To ensure that the hearing aid does not experience feedback, in some embodiments, the distance between the microphone and the vibrating speaker can be no less than 7 mm. Preferably, the distance between the microphone and the vibrating speaker can be no less than 20 mm. More preferably, the distance between the microphone and the vibrating speaker can be no less than 36 mm. Even more preferably, the distance between the microphone and the vibrating speaker can be no less than 45 mm. It should be noted that when there are multiple microphones, the distance between each microphone and the vibrating speaker is also within the above range. When there are multiple microphones and multiple vibrating speakers, the distance between each microphone and each vibrating speaker is also within the above range. Furthermore, it should be noted that when the hearing aid is applied to hearing-impaired individuals with different levels of hearing loss, the distance between the vibrating speaker and the microphone can be adjusted adaptively.

[0076] In order to suppress the whistling of hearing aids and further improve the user's hearing effect so that the user can receive clearer and more stable sound, the embodiments of this application can reduce the air conduction leakage signal generated by the vibrating speaker itself, thereby reducing the air conduction leakage signal received by the microphone and effectively suppressing the whistling of hearing aids.

[0077] In some embodiments, the vibrating loudspeaker may include at least one hole, which may be located on the sidewall of the first housing structure and communicate with the interior of the first housing structure. The hole allows air vibrations from inside the first housing structure to be drawn out, and these air vibrations can cancel out air-conducted sound leakage from outside the first housing structure. The phase of the air vibrations drawn out from inside the first housing structure is opposite to the phase of the air-conducted sound leakage from outside the vibrating loudspeaker, thus achieving anti-phase cancellation and reducing air-conducted sound leakage. In some embodiments, the shape of the hole may be a regular or irregular shape such as a circle, semi-circle, ellipse, semi-ellipse, triangle, quadrilateral, or pentagon. In some embodiments, when there are multiple holes, the shapes of the holes may be the same or different.

[0078] In some embodiments, by adjusting the position of the hole in the first housing structure, the magnitude of the air conduction leakage signal generated by the vibrating speaker can be further reduced, thereby reducing the magnitude of the air conduction leakage signal received by the microphone. Figure 7 This is a schematic diagram illustrating a user wearing a hearing aid device according to some embodiments of this application. Figure 7 As shown, when a user wears a hearing aid, the microphone 710 can be located behind the user's ear, and the vibrating speaker 720 can be located in front of the user's ear. Figure 7 The wearing method shown can be achieved through various means such as eyeglass temples, back-hook structure, ear hooks, and head-mounted devices. For example, the back-hook hearing aid worn by the user can wrap around or partially wrap around the user's head or neck to fix the hearing aid, the microphone 710 can be set at the back near the back of the user's ear, and the vibrating speaker 720 can be set at the front of the user's ear.

[0079] The following will be based on Figure 7 The method of a user wearing a hearing aid device is shown as an example to illustrate the position of the hole. For example... Figure 7As shown, at least one hole (not shown) can be located at at least one side of the first housing structure 7200 in the vibrating speaker 720. For example, when there is only one hole, the hole can be located on any side of the first housing structure 7200. Alternatively, when there are multiple holes, the multiple holes can be located on different sides of the first housing structure 7200. Furthermore, the multiple holes can also be located simultaneously on one side of the first housing structure 7200. Further, in some embodiments, the multiple holes can be located on a specific side of the first housing structure 7200. When the multiple holes are located on a specific side of the first housing structure 7200, the effect of reducing air conduction leakage can be further improved. In some embodiments, the specific side may include the rear side 723 of the housing, the front side 721 of the housing, and the bottom side 722 of the housing. The rear side 723 of the housing may refer to the side of the first housing structure 7200 of the vibrating speaker 720 facing the microphone 710. The front side 721 of the housing may refer to the side of the housing structure corresponding to the vibrating speaker 720 away from the microphone 710. The bottom of the housing 722 may refer to the bottom side wall of the housing structure corresponding to the vibrating speaker 720.

[0080] Figure 8 This is a comparison diagram of the sound pressure level of the air conduction leakage signal received by the microphone when the hole is located at different positions in the first housing structure according to some embodiments of this application and when the hole is not made. Figure 8 The horizontal axis in the graph represents the frequency of the air conduction leakage signal received by the microphone. Figure 8 The vertical axis represents the sound pressure level of the air conduction leakage signal at different frequencies. It is important to note that... Figure 8 The vertical axis value is the sound pressure level of the air conduction leakage signal received by the microphone when the first housing structure has no holes. Figure 8 The relative value was measured using the frequency response curve corresponding to the "no aperture" shown as a reference value. Figure 8 As can be seen, within a specific frequency range (e.g., 100Hz-3000 Hz), the sound pressure level of air conduction leakage measured when holes are provided on the front, rear, and bottom sides of the first housing structure is ( Figure 8 The frequency response curves corresponding to the "front, rear, and bottom openings" shown in the figure are compared with the sound pressure levels of air conduction leakage measured when openings are provided on the rear side and bottom of the first housing structure. Figure 8 The frequency response curve corresponding to the "rear and bottom openings" shown in the figure represents the sound pressure level of air conduction leakage measured relative to the first housing structure when no openings are provided. Figure 8The frequency response curve corresponding to the "no hole" shown in the figure exhibits a significant reduction. In some embodiments, the hearing aid device, within a specific operating frequency band (e.g., the human voice frequency band of 200Hz-4000 Hz), can effectively reduce the sound pressure level of the leakage signal received by the microphone within the human voice frequency band by providing holes on different sides of the first housing structure of the vibrating speaker, thereby suppressing the feedback of the hearing aid device. Furthermore, air conduction leakage can also improve the sound gain effect of the hearing aid device without feedback, thereby increasing the maximum output volume of the hearing aid device to meet the needs of users with more severe hearing loss.

[0081] Continue to refer to Figure 8 The sound pressure level of air conduction leakage measured when holes are provided on the front, rear, and bottom sides of the first housing structure within a specific frequency range (e.g., 100Hz-3000 Hz). Figure 8 The frequency response curves corresponding to the "front, rear, and bottom openings" shown are relative to the sound pressure level of air conduction leakage measured when openings are provided on both the rear and bottom sides of the first housing structure. Figure 8 The frequency response curve corresponding to the "rear and bottom openings" shown in the figure has a more obvious reduction. It should be noted that by setting holes on the front, rear and bottom of the first housing structure, and setting holes on the rear and bottom of the first housing structure, the sound pressure level of the air conduction leakage signal received by the microphone can be effectively reduced, thereby reducing the air conduction leakage signal from the vibrating speaker in the control signal (e.g., V2 in formula (1)), so that the difference between the air conduction leakage signal from the vibrating speaker received by the microphone and the original signal is not greater than -33dB.

[0082] Figure 9 This is a comparison diagram of the sound pressure level of the air conduction leakage signal received by the microphone when the hole is located at different positions in the first housing structure according to other embodiments of this application and when no hole is provided. Figure 9 The horizontal axis in the graph represents the frequency of the air conduction leakage signal received by the microphone. Figure 9 The vertical axis in the figure represents the sound pressure level of the air conduction leakage signal at different frequencies. Figure 9 The vertical axis value is the sound pressure level of the air conduction leakage signal received by the microphone when the first housing structure has no holes. Figure 9 The relative value was measured using the frequency response curve corresponding to the "no aperture" shown as a reference value. Figure 9 As can be seen, within a specific frequency range (e.g., 100Hz-3000 Hz), the sound pressure level of air conduction leakage measured when holes are provided on the front, rear, and bottom sides of the first housing structure is ( Figure 9The frequency response curves corresponding to the "front, rear, and bottom openings" shown in the figure are compared with the sound pressure levels of air conduction leakage measured when openings are provided on both the front and rear sides of the first housing structure. Figure 9 The frequency response curves corresponding to the "front and rear openings" shown in the figure represent the sound pressure level of air conduction leakage measured relative to the first housing structure when no openings are provided. Figure 9 The frequency response curve corresponding to the "no hole" shown in the figure exhibits a significant reduction. In some embodiments, the hearing aid device, within a specific operating frequency band (e.g., the human voice frequency band of 200Hz-4000 Hz), can effectively reduce the sound pressure level of the leakage signal received by the microphone within the human voice frequency band by providing holes on different sides of the first housing structure of the vibrating speaker, thereby suppressing the feedback of the hearing aid device. Furthermore, air conduction leakage can also improve the sound gain effect of the hearing aid device without feedback, thereby increasing the maximum output volume of the hearing aid device to meet the needs of users with more severe hearing loss.

[0083] Continue to refer to Figure 9 The sound pressure level of air conduction leakage measured when holes are provided on the front, rear, and bottom sides of the first housing structure within a specific frequency range (e.g., 100Hz-600Hz). Figure 9 The frequency response curves corresponding to the "front, rear, and bottom openings" shown are relative to the sound pressure level of air conduction leakage measured when openings are provided on both the front and rear sides of the first housing structure. Figure 9 The frequency response curves corresponding to the "front and rear openings" shown in the figure show a significant reduction. It should be noted that by setting holes on the front, rear, and bottom of the first housing structure and on the front and rear of the first housing structure, the sound pressure level of the air conduction leakage signal received by the microphone can be effectively reduced, thereby reducing the air conduction leakage signal from the vibrating speaker in the control signal (e.g., V2 in formula (1)), so that the difference between the air conduction leakage signal from the vibrating speaker received by the microphone and the original signal is not greater than -33dB.

[0084] Figure 10 This is a comparison diagram of the sound pressure level of the air conduction leakage signal received by the microphone at different positions of the hole in the first housing structure according to other embodiments of this application and when no hole is provided. Figure 10 The horizontal axis in the graph represents the frequency of the air conduction leakage signal received by the microphone. Figure 10 The vertical axis in the figure represents the sound pressure level of the air conduction leakage signal at different frequencies. Figure 10 The vertical axis value is the sound pressure level of the air conduction leakage signal received by the microphone when the first housing structure has no holes. Figure 10The relative value was measured using the frequency response curve corresponding to the "no aperture" shown as a reference value. Figure 10 As can be seen, within a specific frequency range (e.g., 100Hz-3000 Hz), the sound pressure level of air conduction leakage measured when holes are provided on the front, rear, and bottom sides of the first housing structure is ( Figure 10 The frequency response curves corresponding to the "front, rear, and bottom openings" shown in the figure are compared with the sound pressure levels of air conduction leakage measured when openings are provided on both the front and bottom sides of the first housing structure. Figure 10 The frequency response curves corresponding to the "front and bottom openings" shown in the diagram represent the sound pressure level of air conduction leakage measured relative to the first housing structure when no openings are provided. Figure 10 The frequency response curve corresponding to the "no hole" shown in the figure exhibits a significant reduction. In some embodiments, the hearing aid device, within a specific operating frequency band (e.g., the human voice frequency band of 200Hz-4000 Hz), can effectively reduce the sound pressure level of the leakage signal received by the microphone within the human voice frequency band by providing holes on different sides of the first housing structure of the vibrating speaker, thereby suppressing the feedback of the hearing aid device. Furthermore, air conduction leakage can also improve the sound gain effect of the hearing aid device without feedback, thereby increasing the maximum output volume of the hearing aid device to meet the needs of users with more severe hearing loss.

[0085] Continue to refer to Figure 10 The sound pressure level of air conduction leakage measured when holes are provided on both the front and rear sides of the first housing structure within a specific frequency range (e.g., 3500Hz-5000 Hz). Figure 9 The frequency response curves corresponding to the "front and rear openings" shown are relative to the sound pressure level of air conduction leakage measured when openings are provided on the front, rear, and bottom sides of the first housing structure. Figure 9 The frequency response curves corresponding to the "front, rear and bottom openings" shown in the figure show a significant reduction. It should be noted that by setting holes on the front, rear and bottom of the first housing structure and on the front and rear of the first housing structure, the sound pressure level of the air conduction leakage signal received by the microphone can be effectively reduced, thereby reducing the air conduction leakage signal in the control signal (e.g., V2 in formula (1)). This ensures that the difference between the air conduction leakage signal received by the microphone from the vibrating speaker and the original signal is no greater than -33dB, thereby effectively avoiding the howling problem.

[0086] The location of the holes in the first housing structure of the vibrating loudspeaker can affect the magnitude of the leakage signal received by the microphone. In some embodiments, the holes may be located on the rear side and bottom of the housing of the first housing structure of the vibrating loudspeaker. Preferably, the holes may be located on the rear side and front side of the housing of the first housing structure of the vibrating loudspeaker. More preferably, the holes may be located on the front side of the housing of the first housing structure of the vibrating loudspeaker. More preferably, the holes may be located on the rear side, front side, and bottom of the housing of the first housing structure of the vibrating loudspeaker. Even more preferably, the holes may be located on the bottom and front side of the housing of the first housing structure of the vibrating loudspeaker.

[0087] It should be noted that the location of the hole in the first housing structure is not limited to the front side, rear side, and / or bottom of the housing as described above. It can also be located on other sides of the first housing structure; for example, the hole can also be located on the upper side or other sides of the first housing structure. It should also be noted that... Figure 8 , Figure 9 , Figure 10 The location of the hole shown in the first housing structure is based on Figure 7 The illustration shows a user wearing a hearing aid device (the microphone is positioned behind the user's auricle, and the vibrating speaker is positioned in front of the user's auricle). In other embodiments, the hearing aid device can also be worn with the microphone positioned in front of the user's auricle and the vibrating speaker positioned behind the user's auricle. In this case, the position of the hole in the first housing structure can be adaptively adjusted according to the relative positions of the vibrating speaker and the microphone. In some embodiments, the hearing aid device can also be worn with the microphone and the vibrating speaker positioned on the same side of the user's auricle (e.g., in front or behind the user's auricle). The hole position varies depending on the different wearing methods of the hearing aid device. Figure 8 , Figure 9 , Figure 10 The descriptions are largely the same, so I will not repeat them here.

[0088] In some embodiments, a mesh structure may be provided at at least one hole of the hearing aid device, and the mesh structure may cover the corresponding hole, thereby improving the waterproof and breathable performance of the hearing aid device. In some embodiments, the mesh structure may be a porous mesh structure, and the material of the porous mesh structure has a certain acoustic impedance. In some embodiments, adjusting the acoustic impedance of the mesh structure can reduce the magnitude of sound leakage signal from the vibrating speaker.

[0089] Figure 11 This is a graph showing the difference between the air conduction leakage signal from a vibrating loudspeaker and the original signal for a mesh structure with different acoustic impedances according to some embodiments of this application. Figure 11 The horizontal axis in the graph represents the frequency of the air conduction leakage sound signal. Figure 11The vertical axis represents the difference between the air conduction leakage signal from the vibrating loudspeaker and the original signal. The solid black line represents the difference between the air conduction leakage signal from the vibrating loudspeaker and the original signal in a mesh structure with an acoustic impedance of 75 MKS Rayls. Figure 11 The black dashed line indicates the difference between the air-conducted leakage signal from the vibrating loudspeaker and the original signal in a mesh structure with an acoustic impedance of 145 MKS Rayls (represented by "acoustic impedance 75"). Figure 11 The difference between the air-conducted leakage signal from the vibrating loudspeaker and the original signal is represented by "acoustic impedance 145" (indicated by black dotted lines) and the black dotted lines represent the acoustic impedance of 160 MKS Rayls mesh structure. Figure 11 (Used as "acoustic resistance 160" in Chinese). From Figure 11 As can be seen, within the frequency range of 100Hz-4000Hz, the sound pressure levels of the air conduction leakage signal from the vibrating loudspeaker and the original signal for the three mesh structures with different acoustic impedances, arranged from largest to smallest, are 160MKS Rayls, 145MKS Rayls, and 75MKS Rayls. This can be understood as follows: within the 100Hz-4000Hz frequency range, the greater the acoustic impedance of the mesh structure, the greater the difference between the air conduction leakage signal from the vibrating loudspeaker and the original signal. By setting up the mesh structure, the sound pressure level of the air conduction leakage signal received by the microphone is further reduced, ensuring that the difference between the air conduction leakage signal from the vibrating loudspeaker and the control signal received by the microphone is no greater than -33dB, effectively avoiding the feedback problem.

[0090] In some embodiments, while meeting the waterproof and dustproof requirements of the hearing aid device, a mesh structure with low acoustic impedance can be selected to reduce sound leakage signals generated by the vibrating speaker. Preferably, the acoustic impedance of the mesh structure is no greater than 260 MKS Rayls. More preferably, the acoustic impedance of the mesh structure is no greater than 160 MKS Rayls. More preferably, the acoustic impedance of the mesh structure is no greater than 145 MKS Rayls. Even more preferably, the acoustic impedance of the mesh structure is no greater than 75 MKS Rayls. In some embodiments, the material of the mesh structure can be one or more of metallic materials and polymeric materials. In some embodiments, metallic materials can include one or more of copper, zinc, aluminum, iron, molybdenum, chromium, manganese, and copper. In some embodiments, polymeric materials can include, but are not limited to, one or more of isobutyl, acrylate, polysulfide, nitrile, silicone rubber, polyurethane, polyvinyl chloride, and epoxy resin.

[0091] Figure 12 This is a structural schematic diagram of a rear-mounted hearing aid device provided according to some embodiments of this application. For example... Figure 12The illustrated behind-the-ear hearing aid may include a behind-the-ear structure 1210 and a hearing aid device 1220. The hearing aid device 1220 may include a microphone 1222, a vibrating speaker 1221, and a housing structure 1223. The behind-the-ear structure 1210 is worn on the user's head or neck and has two ends. When the user wears the behind-the-ear structure 1210, both ends can be located near the user's auricle. In some embodiments, the hearing aid device 1220 may be located at one end of the behind-the-ear structure 1210, so that when the user wears the behind-the-ear hearing aid device, the hearing aid device 1220 can be located near one of the user's auricles. For example, the hearing aid device 1220 may also be located at both ends of the behind-the-ear structure 1210, so that when the user wears the behind-the-ear hearing aid device, the hearing aid devices 1220 at both ends of the behind-the-ear structure 1210 can be located near the left and right auricles, respectively. In some embodiments, the hearing aid 1220 can be fixedly connected to the rear-mounted structure 1210. This fixed connection can refer to methods such as bonding, riveting, or integral forming. In some embodiments, the hearing aid 1220 can also be detachably connected to the rear-mounted structure 1210. This detachable connection can refer to methods such as snap-fit ​​connection or threaded connection.

[0092] Continue to refer to Figure 12 The microphone 1222 and the vibrating speaker 1221 can be simultaneously fixed in the housing structure 1223. When the user wears this behind-the-ear hearing aid, the microphone 1222 and the vibrating speaker 1221 can be located simultaneously on the front side of the user's auricle. When the user wears this behind-the-ear hearing aid, the behind-the-ear structure 1210 can wrap around or partially wrap around a specific part of the user's body (e.g., head, neck, etc.). The behind-the-ear structure 1210 exerts a certain pressure on the specific part of the body (e.g., head, neck, etc.), so that the behind-the-ear hearing aid can maintain contact with the user and avoid falling off during wear. In some embodiments, the behind-the-ear hearing aid may also include a core housing 1230 for carrying a power module and a control module. The core housing 1230 may be part of the behind-the-ear structure 1210 or a separate structure relative to the behind-the-ear structure 1210.

[0093] In some embodiments, the shape and / or position of the housing structure 1223 can be changed so that the microphone 1222 is located behind the user's auricle and the vibrating speaker 1221 is located in front of the user's auricle. For example, the housing structure 1223 can be designed to surround the user's auricle, and the housing structure 1223 can be suspended on the user's auricle. The microphone 1222 can be located at one end of the housing structure 1223 that contacts the back of the user's auricle, and the vibrating speaker 1221 can be located at the other end of the housing structure 1223 that contacts the front of the user's auricle. In this case, when the user wears the behind-the-ear hearing aid, the microphone 1222 is located behind the user's auricle, and the vibrating speaker 1221 is located in front of the user's auricle. It should be noted that the positions of the microphone 1222 and the vibrating speaker 1221 can be interchanged in this embodiment, that is, the microphone 1222 is located in front of the user's auricle, and the vibrating speaker 1221 is located behind the user's auricle. In some embodiments, the microphone 1222 may not be located at the housing structure 1223. For example, the microphone 1222 may also be located at the housing 1230 and / or the rear mount structure 1210. Alternatively, when there are multiple microphones, they may be located simultaneously at the housing structure 1223, the housing 1230, and / or the rear mount structure 1210.

[0094] Figure 13 This is a structural schematic diagram of a glasses-type hearing aid device provided according to some embodiments of this application. For example... Figure 13 The illustrated glasses-style hearing aid device may include temples 1310 and a hearing aid device 1320. The hearing aid device 1320 may include a microphone 1322, a vibrating speaker 1321, and a housing structure 1323. In some embodiments, the hearing aid device 1320 may be fixedly connected to the temples 1310. This fixed connection can refer to methods such as bonding, riveting, or integral forming. In some embodiments, the hearing aid device 1320 may also be detachably connected to the temples 1310. This detachable connection can refer to methods such as snap-fit ​​connection or threaded connection.

[0095] Continue to refer to Figure 13 The microphone 1322 and the vibrating speaker 1321 can be simultaneously fixed in the housing structure 1323. When the user wears this glasses-type hearing aid, the microphone 1322 and the vibrating speaker 1321 can be located simultaneously on the front side of the user's auricle. When the user wears this glasses-type hearing aid, the temples 1310 can wrap around the user's auricle, and the temples 1310 exert a certain pressure on the user's head, so that the glasses-type hearing aid can maintain contact with the user and avoid falling off during wear.

[0096] In some embodiments, the shape and / or position of the housing structure 1323 can be changed so that the microphone 1322 is located behind the user's auricle and the vibrating speaker 1321 is located in front of the user's auricle. For example, the housing structure 1323 can be designed to surround the user's auricle, and the housing structure 1323 can be suspended on the user's auricle. The microphone 1322 can be located at one end of the housing structure 1323 that contacts the back of the user's auricle, and the vibrating speaker 1321 can be located at the other end of the housing structure 1323 that contacts the front of the user's auricle. In this case, when the user wears the glasses-type hearing aid device, the microphone 1322 is located behind the user's auricle, and the vibrating speaker 1321 is located in front of the user's auricle. It should be noted that the positions of the microphone 1322 and the vibrating speaker 1321 can be interchanged in this embodiment, that is, the microphone 1322 is located in front of the user's auricle, and the vibrating speaker 1321 is located behind the user's auricle. In some embodiments, the microphone may not be located at the housing structure 1323. For example, the microphone can also be located at the temple 1310. Or, for example, when there are multiple microphones, the microphones can also be located at both the housing structure 1323 and the temple 1310.

[0097] Figure 14 This is a schematic diagram of the structure of a wireless hearing aid device provided according to some embodiments of this application. For example... Figure 14 The wireless hearing aid device shown may include an ear hook structure 1410 and a hearing aid device 1420. The hearing aid device 1420 may include a microphone 1422, a vibrating speaker 1421, and a housing structure 1423. In some embodiments, the hearing aid device 1420 may be fixedly connected to the ear hook structure 1410. This fixed connection can refer to methods such as bonding, riveting, or integral forming. In some embodiments, the hearing aid device 1420 may also be detachably connected to the ear hook structure 1410. This detachable connection can refer to methods such as snap-fit ​​connection or threaded connection.

[0098] Continue to refer to Figure 14 The microphone 1422 and the vibrating speaker 1421 can be simultaneously fixed in the housing structure 1423. When the user wears the wireless hearing aid, the microphone 1422 and the vibrating speaker 1421 can be located simultaneously on the front side of the user's auricle. When the user wears the wireless hearing aid, the ear hook structure 1410 can wrap around the user's auricle. The ear hook structure 1410 exerts a certain pressure on a specific part of the human body (e.g., the ear), so that the wireless hearing aid can maintain contact with the user and avoid falling off during wear.

[0099] In some embodiments, the shape and / or position of the housing structure 1423 can be changed so that the microphone 1422 is located behind the user's auricle and the vibrating speaker 1421 is located in front of the user's auricle. For example, the housing structure 1423 can be designed to clamp the user's auricle. This clamping housing structure may include two clip structures, which can be located in front of and behind the user's auricle respectively when the clamping housing structure is clamped on the user's ear. The microphone 1422 can be placed in the clip structure located behind the user's auricle, and the vibrating speaker 1421 can be placed in the clip structure located in front of the user's auricle. This allows the microphone 1422 to be located behind the user's auricle and the vibrating speaker 1421 to be located in front of the user's auricle when the user wears the wireless hearing aid device. It should be noted that the positions of the microphone 1422 and the vibrating speaker 1421 can be interchanged in this embodiment, that is, the microphone 1422 is located in front of the user's auricle and the vibrating speaker 1421 is located behind the user's auricle. In some embodiments, the microphone may not be located at the housing structure 1423. For example, the microphone may also be located at the ear hook structure 1410. As another example, when there are multiple microphones, the microphones may be located at both the housing structure 1423 and the ear hook structure 1410.

[0100] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0101] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0102] Furthermore, those skilled in the art will understand that aspects of this application can be described and illustrated through several patentable types or situations, including any new and useful combination of processes, machines, products, or substances, or any new and useful improvements thereof. Accordingly, aspects of this application can be implemented entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. All of the above hardware or software may be referred to as a “data block,” “module,” “engine,” “unit,” “component,” or “system.” Furthermore, aspects of this application may manifest as a computer product located on one or more computer-readable media, the product including computer-readable program code.

[0103] Computer storage media may contain a propagated data signal containing computer program code, for example, on baseband or as part of a carrier wave. This propagated signal may take various forms, including electromagnetic, optical, and suitable combinations thereof. Computer storage media can be any computer-readable medium other than a computer-readable storage medium, which can be connected to an instruction execution system, apparatus, or device to enable communication, propagation, or transmission of a program for use. The program code located on the computer storage medium can be propagated through any suitable medium, including radio, cable, fiber optic cable, RF, or similar media, or any combination of the above media.

[0104] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this application are not intended to limit the order of the processes and methods of this application. Although the foregoing disclosure has discussed some currently considered useful embodiments of the invention through various examples, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments; rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments of this application. For example, while the system components described above can be implemented using hardware devices, they can also be implemented solely through software solutions, such as installing the described system on existing servers or mobile devices.

[0105] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0106] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0107] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that patent are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this application, as well as documents that limit the broadest scope of the claims in this application (currently or subsequently appended to this application). It should be noted that if there are any inconsistencies or conflicts between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

[0108] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.

Claims

1. A hearing assistance device, characterized in that include: At least one microphone is configured to acquire external sound signals and convert the sound signals into electrical signals; A signal processing circuit is configured to process the electrical signal to generate a control signal; At least one vibration loudspeaker is configured to convert the control signal into a vibration signal; as well as The housing structure is configured to carry at least one of the at least one microphone, the signal processing circuit, and the at least one vibrating loudspeaker; The control signal includes an original signal and an air conduction leakage signal from the at least one vibrating loudspeaker, wherein the difference between the air conduction leakage signal received by the at least one microphone from the at least one vibrating loudspeaker and the original signal is no greater than -33dB.

2. The hearing assistance device of claim 1, wherein, Within the frequency range of 100Hz-2000Hz, the difference between the air conduction leakage signal received by the at least one microphone from the at least one vibrating loudspeaker and the original signal is no greater than -40dB.

3. The hearing assistance device of claim 1, wherein, Within the frequency range of 100Hz-2000Hz, the difference between the air conduction leakage signal received by the at least one microphone from the at least one vibrating loudspeaker and the original signal is no greater than -45dB.

4. The hearing assistance device of claim 1, wherein, Within the frequency range of 2000Hz-8000Hz, the difference between the air conduction leakage signal received by the at least one microphone from the at least one vibrating loudspeaker and the original signal is no greater than -33dB.

5. The hearing assistance device of claim 1, wherein, Within the frequency range of 2000Hz-8000Hz, the difference between the air conduction leakage signal received by the at least one microphone from the at least one vibrating loudspeaker and the original signal is no greater than -38dB.

6. The hearing assistance device of claim 1, wherein, The distance between any of the at least one microphone and any of the at least one vibrating loudspeaker shall not be less than 7 mm.

7. The hearing aid device according to claim 1, characterized in that, The distance between any of the at least one microphone and any of the at least one vibrating loudspeaker shall not be less than 20 mm.

8. The hearing aid device according to claim 1, characterized in that, The distance between any of the at least one microphone and any of the at least one vibrating loudspeaker shall not be less than 36 mm.

9. The hearing aid device according to claim 1, characterized in that, The distance between any of the at least one microphone and any of the at least one vibrating loudspeaker shall not be less than 45 mm.

10. The hearing aid device according to claim 1, characterized in that, The at least one microphone and the at least one vibrating speaker are located on the same side or different sides of the user's auricle.

11. The hearing aid device according to claim 1, characterized in that, A baffle structure is provided between the at least one microphone and the at least one vibrating loudspeaker, and the baffle structure is connected to the housing structure.

12. The hearing aid device according to claim 1, characterized in that, The vibrating loudspeaker includes a first housing structure connected to the housing structure, the first housing structure including at least one hole communicating with the interior of the first housing structure.

13. The hearing aid device according to claim 12, characterized in that, The at least one hole is located in the first housing structure of the at least one vibrating loudspeaker, facing the bottom sidewall of the first housing structure of the at least one microphone and the at least one vibrating loudspeaker.

14. The hearing aid device according to claim 12, characterized in that, The at least one hole is located in the first housing structure of the at least one vibrating loudspeaker, away from the sidewall of the at least one microphone.

15. The hearing aid device according to claim 14, characterized in that, The at least one hole is located on the bottom sidewall of the first housing structure of the at least one vibrating loudspeaker.

16. The hearing aid device according to claim 15, characterized in that, The at least one hole is located in the first housing structure of the at least one vibrating loudspeaker, on the side wall facing the at least one microphone.

17. The hearing aid device according to any one of claims 12-16, characterized in that, A mesh structure is provided at the at least one hole, and the mesh structure covers the at least one hole.

18. The hearing aid device according to claim 17, characterized in that, The acoustic impedance of the mesh structure is no greater than 260 MKS Rayls.

19. The hearing aid device according to claim 17, characterized in that, The acoustic impedance of the mesh structure is no greater than 160 MKS Rayls.

20. The hearing aid device according to claim 17, characterized in that, The acoustic impedance of the mesh structure is no greater than 145 MKS Rayls.

21. The hearing aid device according to claim 17, characterized in that, The acoustic impedance of the mesh structure is no greater than 75 MKS Rayls.

Images