A wire cutting process for ring-shaped diamond wire cutting silicon rods

Abstract

This invention relates to the field of silicon rod cutting technology, specifically to a wire cutting process for silicon rods using a ring-shaped diamond wire cutter, comprising the following steps: S1, installing the ring-shaped diamond wire on the cutting wheel of the cutting machine, adjusting the cutting tension, and adjusting the cutting speed of the ring-shaped diamond wire; S2, calculating the parameters of the starting and ending positions of the silicon rod cutting based on the required silicon rod dimensions, and dividing the cutting process into 5 segments. This invention reduces the fatigue strength of the diamond wire by employing a reverse return technique during the cutting process, significantly improving the processing efficiency of the cutting machine compared to traditional diamond wire winding wire cutting processes, increasing the single-machine capacity of the cutting machine, reducing machining production costs, and eliminating abnormalities such as incomplete cutting and edge chipping caused by decreased wire cutting capability due to wire wear through the set position increments. This improves the end-face quality of the processed products, reduces end-face beveling, and increases the yield of short round monocrystalline silicon rods.

Description

Technical Field

[0001] This invention relates to the field of silicon rod cutting technology, and more particularly to a wire cutting process for annular diamond wire cutting of silicon rods. Background Technology

[0002] Currently, the domestic monocrystalline silicon wafer manufacturing is mainly divided into three major production and manufacturing links: crystal pulling, machining, and slicing. Among them, the field of monocrystalline silicon rod machining (referred to as machining) mainly involves dividing the long monocrystalline silicon rods pulled in the crystal pulling process into segments and then processing them with diamond wire saw equipment to cut the long monocrystalline silicon rods into fixed-length or non-fixed-length short monocrystalline silicon rods.

[0003] Currently, the cutting process in the machining stage generally uses diamond wire winding. When cutting silicon rods, the diamond wire slows down during the cutting process, resulting in a longer cutting time and thus a longer overall processing time and lower equipment processing efficiency. Summary of the Invention

[0004] In view of this, the purpose of this invention is to propose a wire cutting process for annular diamond wire cutting of silicon rods, so as to solve the problem of low cutting efficiency of existing diamond wire cutting of silicon rods.

[0005] To achieve the above objectives, the present invention provides a wire cutting process for a ring-shaped diamond wire cut silicon rod, the wire cutting process for the ring-shaped diamond wire cut silicon rod comprising the following steps:

[0006] S1. Install the ring-shaped diamond wire on the cutting wheel of the cutting machine, adjust the cutting tension, and adjust the cutting speed of the ring-shaped diamond wire.

[0007] S2. Calculate the parameters of the starting and ending positions of the silicon rod cutting based on the required silicon rod dimensions, and divide the cutting process into 5 segments;

[0008] S3. When cutting the first to third sections of the silicon rod, the feed rate (the speed at which the silicon rod moves towards the diamond wire) is 40-100 mm / min for rapid feed. When cutting the third section, a position increment (the increase in size of the silicon rod after cutting) is set, with a position increment of 0.12-0.2 mm. Since the wire cutting capability of the new wire is strong, but the cutting capability of the steel wire gradually weakens as the number of products cut increases, the position increment is set here to eliminate abnormalities such as the silicon rod not being cut through and edge chipping caused by the decrease in wire cutting capability due to steel wire wear.

[0009] S4. Adjust the difference between the starting and ending positions of the 3rd and 4th cutting segments to 10-15mm, with a position increment of 0.12-0.2mm. Adjust the difference between the starting and ending positions of the 3rd and 4th cutting segments to 10-15mm. This is used to eliminate abnormalities such as silicon rods not being cut through and edge chipping caused by the decrease in wire cutting capacity due to steel wire wear.

[0010] S5. When the wire cutting position moves from the 3rd segment to the 4th segment, the cutting head reverses its direction to cut and control the wire bow between 1-3mm. This reduces the fatigue strength of the steel wire, thereby reducing wire breakage, increasing the life of the loop wire, and reducing edge chipping at the exit point caused by high stress in the steel wire.

[0011] S6. Control the feed speed of the fifth segment cut within 5-10 mm / min, and set the starting and ending positions of the fifth segment to be greater than the ending position of the third segment; use the minimum wire bow to ensure that the silicon rod can be completely cut through;

[0012] S7. Push the monocrystalline silicon long cylindrical rod into the cutting machine, and repeat the above process to cut it.

[0013] Furthermore, in step S1, the cutting tension of the annular diamond wire is 90-120N, and the cutting speed of the annular diamond wire is 25-36m / s.

[0014] Furthermore, the reverse cutting speed in step S5 is 200-300 mm / min.

[0015] The beneficial effects of this invention are as follows: As can be seen from the above description, the wire cutting process for silicon rods using a ring-shaped diamond wire cutter provided by this invention reduces the fatigue strength of the diamond wire by employing a reverse return technique during the cutting process. Compared with the traditional diamond wire coiling wire cutting process, this significantly improves the processing efficiency of the cutting machine, increases the single-machine capacity of the cutting machine, and reduces machining production costs. Furthermore, by setting the position increment, it can eliminate abnormalities such as incomplete cutting and edge chipping caused by the decrease in wire cutting capability due to wire wear, thereby improving the end face quality of the processed products, reducing the end face beveling, and increasing the yield of short round monocrystalline silicon rods. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments.

[0017] It should be noted that, unless otherwise defined, the technical or scientific terms used in this invention should have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0018] Example 1

[0019] A wire cutting process for a ring-shaped diamond wire cut silicon rod, comprising the following steps:

[0020] S1. Install the ring-shaped diamond wire on the cutting wheel of the cutting machine, adjust the cutting tension of the ring-shaped diamond wire to 90N, and adjust the cutting speed of the ring-shaped diamond wire to 36m / s;

[0021] S2. Calculate the parameters of the starting and ending positions of the silicon rod cutting based on the required silicon rod dimensions, and divide the cutting process into 5 segments;

[0022] S3. When cutting the first to third sections of the silicon rod, the feed rate is 40 mm / min for rapid feed. When cutting the third section, a position increment is set, which is 0.12 mm.

[0023] S4. Adjust the difference between the starting and ending positions of the 3rd and 4th segments by 10mm, with a position increment of 0.12mm. Adjust the difference between the starting and ending positions of the 3rd and 4th segments by 10mm.

[0024] S5. When the wire cutting position moves from the 3rd segment to the 4th segment, the cutting head reverses the cutting direction. The reverse cutting speed is 200mm / min, and the wire bow is controlled between 1-3mm.

[0025] S6. Control the feed speed of the fifth segment cut to within 5 mm / min and set the starting and ending positions of the fifth segment to be greater than the ending position of the third segment.

[0026] S7. Push the monocrystalline silicon long cylindrical rod into the cutting machine, and repeat the above process to cut it.

[0027] The silicon rod was cut using the wire cutting process described in this embodiment, and the data was statistically analyzed. The results are as follows:

[0028] As shown in Table 1:

[0029]

[0030] Example 2

[0031] A wire cutting process for a ring-shaped diamond wire cut silicon rod, comprising the following steps:

[0032] S1. Install the ring-shaped diamond wire on the cutting wheel of the cutting machine, adjust the cutting tension of the ring-shaped diamond wire to 90N, and adjust the cutting speed of the ring-shaped diamond wire to 25m / s;

[0033] S2. Calculate the parameters of the starting and ending positions of the silicon rod cutting based on the required silicon rod dimensions, and divide the cutting process into 5 segments;

[0034] S3. When cutting the first to third sections of the silicon rod, the feed rate is 100 mm / min for rapid feed. When cutting the third section, a position increment is set, which is 0.2 mm.

[0035] S4. Adjust the difference between the starting and ending positions of the 3rd and 4th segments by 15mm, with a position increment of 0.2mm. Adjust the difference between the starting and ending positions of the 3rd and 4th segments by 15mm.

[0036] S5. When the wire cutting position moves from the 3rd segment to the 4th segment, the cutting head reverses the cutting direction at a speed of 300mm / min, keeping the wire bow between 1-3mm.

[0037] S6. Control the feed speed of the fifth segment cut to within 10 mm / min and set the starting and ending positions of the fifth segment to be greater than the ending position of the third segment.

[0038] S7. Push the monocrystalline silicon long cylindrical rod into the cutting machine, call the secondary processing formula, start the automatic processing program, and the loop cutting equipment will process it according to the above process.

[0039] The silicon rod was cut using the wire cutting process described in this embodiment, and the data was statistically analyzed. The results are as follows:

[0040] As shown in Table 2:

[0041]

[0042] The toroidal diamond wire cutting process for silicon rods provided by this invention reduces wire fatigue by employing reverse return technology during the wire exit. Compared with the traditional diamond wire winding and cutting process, this significantly improves the processing efficiency of the cutting machine, increases the single-machine capacity of the cutting machine, and reduces machining production costs. Furthermore, by setting position increments, it can eliminate abnormalities such as incomplete cutting and edge chipping caused by decreased wire cutting capability due to wire wear, thereby improving the end face quality of the processed products, reducing end face beveling, and increasing the yield of short round monocrystalline silicon rods.

[0043] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the invention (including the claims) is limited to these examples; within the framework of the invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in the details for the sake of brevity.

[0044] This invention is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A wire cutting process for a ring-shaped diamond wire-cut silicon rod, characterized in that, The wire cutting process for the annular diamond wire-cut silicon rod includes the following steps: S1. Install the ring-shaped diamond wire on the cutting wheel of the cutting machine, adjust the cutting tension, and adjust the cutting speed of the ring-shaped diamond wire. S2. Calculate the parameters of the starting and ending positions for cutting the silicon rod based on the required silicon rod dimensions, and divide the cutting process into 5 segments; S3. When cutting the first to third sections of the silicon rod, the feed rate is 40-100 mm / min for rapid feed. When cutting the third section, a position increment is set, which is 0.12-0.2 mm. S4. Adjust the difference between the starting and ending positions of the 3rd and 4th cuts to 10-15mm, with a position increment of 0.12-0.2mm. Adjust the difference between the starting and ending positions of the 3rd and 4th cuts to 10-15mm. S5. When the wire cutting position moves from the 3rd segment to the 4th segment, the cutting head reverses the cutting direction to control the wire bow between 1-3mm. S6. Control the feed speed of the fifth segment cut within 5-10 mm / min and set the starting and ending positions of the fifth segment to be greater than the ending position of the third segment. S7. Push the monocrystalline silicon long cylindrical rod into the cutting machine, and repeat the above process to cut it.

2. The wire cutting process for annular diamond wire-cut silicon rods according to claim 1, characterized in that, In step S1, the tension of the annular diamond wire cutting is 90-120N, and the cutting speed of the annular diamond wire cutting is 25-36m / s.

3. The wire cutting process for annular diamond wire-cut silicon rods according to claim 1, characterized in that, The reverse cutting speed in step S5 is 200-300 mm / min.

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