A mechanical property testing device for simulating uneven curing of epoxy

Abstract

The application provides a mechanical property test device for simulating uneven epoxy curing, comprising a tensile testing machine, a clamp, an epoxy pouring mold, a temperature controller, a mechanical sensor, a plurality of heat insulation sleeves and a plurality of independent heating sleeves; wherein the inner wall of the mold is provided with the plurality of mechanical sensors; the independent heating sleeves are sleeved on the epoxy pouring mold and used for heating the wrapped area according to a preset time-varying temperature curve; the heat insulation sleeves are arranged between the independent heating sleeves and are used for insulating the heat transfer between the wrapped areas; the temperature controller is used for setting the time-varying temperature curve; the tensile testing machine is used for realizing the test of the mechanical property; and the mechanical sensor is used for acquiring the mechanical property test data of the cured epoxy resin. Compared with the prior art, the heating temperature of the independent heating sleeves is controlled by the temperature controller, the curing rate of each part of the epoxy resin is controlled, the purpose of effectively simulating different epoxy curing shrinkage unevenness is achieved, and the simulation precision is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of epoxy mechanical property test, in particular to a mechanical property test device for simulating uneven epoxy curing. BACKGROUND

[0002] In the field of material engineering, mechanical engineering, etc., the study of the mechanical properties and durability of cured materials is very important. Among them, epoxy resin is a common high polymer material with high strength, heat resistance and stability. In the process of use, it is usually heated and cured to form a solid material structure. However, during the curing and use of epoxy materials, shrinkage may occur due to cross-linking of the resin and changes in temperature. When the shrinkage is uneven, internal stress may be generated in the material. Internal stress can cause changes in the size and shape of the part, and even cause cracks, which can degrade the performance of the material and cause material failure.

[0003] The traditional method of studying epoxy curing shrinkage mainly improves the components of the epoxy resin system to obtain the target curing degree. However, this method is difficult to simulate uneven curing conditions and difficult to effectively control the unevenness of curing, so it is difficult to accurately obtain the influence of uneven curing on the mechanical properties of the material. SUMMARY

[0004] The present application provides a mechanical property test device for simulating uneven epoxy curing, which solves the technical problem of how to effectively simulate uneven epoxy curing by temperature control, and improves the simulation accuracy.

[0005] To solve the above technical problems, the present application provides a mechanical property test device for simulating uneven epoxy curing, comprising a tensile testing machine, a clamp, an epoxy pouring mold, a temperature controller, a mechanical sensor, a plurality of heat insulation sleeves and a plurality of independent heating sleeves.

[0006] The clamp of the mechanical property test device is used to clamp the epoxy pouring mold and fix the epoxy pouring mold on the tensile testing machine.

[0007] The epoxy pouring mold is used for pouring epoxy resin, and the inner wall of the epoxy pouring mold is provided with a plurality of mechanical sensors. The plurality of mechanical sensors are used to measure the mechanical properties of each position during the curing process of the epoxy resin.

[0008] The independent heating sleeve is provided on the epoxy pouring mold and is used to heat the wrapped area according to a preset time-varying temperature curve.

[0009] The heat insulation sleeve is provided between the plurality of independent heating sleeves and is used to divide the wrapped area of the plurality of independent heating sleeves and isolate the heat transfer between the wrapped areas.

[0010] The temperature controller is used for setting the time-varying temperature curve to realize the adjustment of the temperature of the epoxy casting mold.

[0011] The tensile testing machine is used for applying a test force to the epoxy resin to realize the test of the mechanical property.

[0012] The mechanical sensor is used for acquiring the mechanical property test data of the cured epoxy resin.

[0013] As a preferred solution, the mechanical property test data includes the compressive strength, the tensile strength and the stress-strain curve.

[0014] As a preferred solution, the test force accuracy of the tensile testing machine is 0.5%, and the displacement accuracy of the clamp of the tensile testing machine is greater than 1mm.

[0015] As a preferred solution, the maximum test force that can be borne by the clamp of the mechanical property testing device is 25kN.

[0016] As a preferred solution, the independent heating jacket adopts a Grealum stainless steel heating jacket; the independent heating jacket adopts a 220V power supply; and the maximum heating power of the independent heating jacket is 950W.

[0017] As a preferred solution, the epoxy casting mold adopts an aluminum-plated stainless steel material, has a cylindrical shape, a height of 120cm and a diameter of 20cm.

[0018] As a preferred solution, the temperature controller adopts a PID feedback system for temperature control, and the temperature range set by the temperature controller is 30-300 degrees Celsius.

[0019] As a preferred solution, the heat insulation jacket adopts a polyimide foam material.

[0020] As a preferred solution, the mechanical property testing device further includes a display, which is used for visually displaying the mechanical property test data, the measurement results of the mechanical properties and the test results of the mechanical properties of the epoxy resin.

[0021] Compared with the prior art, the embodiment of the present application has the following beneficial effects:

[0022] The embodiment of the present application provides a mechanical property test device for simulating uneven epoxy curing, which comprises a tensile testing machine, a clamp, an epoxy pouring mold, a temperature controller, a mechanical sensor, a plurality of heat insulation sleeves and a plurality of independent heating sleeves. The clamp of the mechanical property test device is used for clamping the epoxy pouring mold and fixing the epoxy pouring mold on the tensile testing machine. The epoxy pouring mold is used for pouring epoxy resin, and the inner wall of the epoxy pouring mold is provided with the plurality of mechanical sensors. The plurality of mechanical sensors are used for measuring the mechanical properties of each position in the curing process of the epoxy resin. The independent heating sleeve is sleeved on the epoxy pouring mold and is used for heating the wrapped area according to a preset time-varying temperature curve. The heat insulation sleeve is arranged between the plurality of independent heating sleeves and is used for dividing the areas wrapped by the plurality of independent heating sleeves and isolating the heat transfer between the wrapped areas. The temperature controller is used for setting the time-varying temperature curve to realize the adjustment of the temperature of the epoxy pouring mold. The tensile testing machine is used for applying a test force to the epoxy resin to realize the test of the mechanical properties. The mechanical sensor is used for acquiring the mechanical property test data of the cured epoxy resin. Compared with the prior art, the heating temperature of the independent heating sleeve is controlled by the temperature controller, the curing rate of each part of the epoxy resin is controlled, the purpose of effectively simulating different epoxy curing shrinkage unevenness is achieved, the simulation precision is improved, and guidance basis can be provided for accurately obtaining and weakening the influence of curing unevenness on the mechanical properties of materials in engineering. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 Fig. 1 is a structural schematic view of one embodiment of the mechanical property test device for simulating uneven epoxy curing provided by the present application.

[0024] In the drawings, the reference signs in the drawings of the specification are as follows: 1-tensile testing machine; 2-clamp; 3-independent heating sleeve; 4-heat insulation sleeve; 5-epoxy pouring mold; 6-temperature controller; 7-mechanical sensor; 8-display. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] Embodiment one

[0027] Please refer to Figure 1The mechanical property testing device for simulating the curing unevenness of epoxy resin provided by the embodiment of the present application comprises a tensile testing machine 1, a clamp 2, a plurality of independent heating jackets 3, a plurality of heat insulation jackets 4, an epoxy resin pouring mold 5, a temperature controller 6, a mechanical sensor 7 and a display 8. The clamp 2 of the mechanical property testing device is used to clamp the epoxy resin pouring mold 5 and fix the epoxy resin pouring mold 5 on the tensile testing machine 1. The tensile testing machine 1 can provide a plane or a space for the epoxy resin pouring mold 5 to facilitate the provision of a test force to the epoxy resin. Preferably, the maximum test force that can be borne by the clamp is 25 kN.

[0028] The clamp 2 of the mechanical property testing device is used to clamp the epoxy resin pouring mold 5 and fix the epoxy resin pouring mold 5 on the tensile testing machine 1. The tensile testing machine 1 can provide a plane or a space for the epoxy resin pouring mold 5 to facilitate the provision of a test force to the epoxy resin. Preferably, the maximum test force that can be borne by the clamp is 25 kN.

[0029] The epoxy resin pouring mold 5 is used for the pouring of epoxy resin, and the inner wall of the epoxy resin pouring mold 5 is provided with a plurality of mechanical sensors. The plurality of mechanical sensors are used to measure the mechanical properties of each position during the curing process of the epoxy resin. Specifically, the maximum testable force of the mechanical sensor used is 10 kN.

[0030] In the embodiment, the epoxy resin pouring mold 5 can be a large-size epoxy resin pouring mold, for example, designed as a cylinder with a height of 120 cm and a diameter of 20 cm. For large-size epoxy resin, the phenomenon of curing shrinkage unevenness is more likely to occur in actual engineering applications, so the embodiment can simulate large-size epoxy resin and match the corresponding size of the epoxy resin pouring mold 5. In addition, considering the heat conductivity during the test process, the epoxy resin pouring mold 5 of the embodiment is made of aluminized stainless steel.

[0031] The independent heating jacket 3 is provided on the epoxy resin pouring mold 5 and is used to heat the wrapped area according to a preset time-varying temperature curve. Preferably, the independent heating jacket 3 adopts a Greal aluminum plate stainless steel heating jacket; the independent heating jacket 3 adopts a 220V power supply; and the maximum heating power of the independent heating jacket 3 is 950W.

[0032] The heat insulation jacket 4 is made of polyimide foam material and is arranged between the plurality of independent heating jackets 3. The heat insulation jacket 4 is made of high-performance heat insulation polyimide foam and is used to divide the wrapped area of the plurality of independent heating jackets 3 and insulate the heat transfer between the wrapped areas. As an example of the embodiment, the independent heating jackets 3 include A1, A2, A3…AN. The heat insulation jackets 4 include B1, B2, B3…BM. Each heat insulation jacket 4 is arranged between the independent heating jackets 3, for example, B1 can be arranged between A1 and A2, and so on.

[0033] The temperature controller 6 is used to set the time-varying temperature curve to achieve the adjustment of the temperature of the epoxy casting mold 5. As a preferred embodiment of the present embodiment, the temperature controller 6 can adopt a PID feedback system for temperature control, the temperature range set by the temperature controller 6 is 30-300 degrees Celsius, and the time length of the temperature curve can be set to 400 min to match the time consumption of the mechanical property test.

[0034] The tensile testing machine 1 is used to apply a test force to the epoxy resin to realize the test of mechanical properties. In the present embodiment, the model of the tensile testing machine 1 can adopt Wenteng WDW-100E, which can apply a maximum test force of 20 kN with a test force accuracy of 0.5%, and the displacement accuracy of the clamp of the tensile testing machine 1 is greater than 1 mm. In this way, a suitable test force can be applied to the epoxy resin to support the mechanical property test, and the mechanical property test data and mechanical properties can be easily tested.

[0035] In addition, the mechanical property test device also includes a display 8 for visually displaying the mechanical property test data, the measurement results of the mechanical properties, and the test results of the mechanical properties of the epoxy resin.

[0036] It should be noted that the mechanical sensor 7 is used to obtain the mechanical property test data of the cured epoxy resin. The mechanical sensor 7 can adopt a mechanical sensor 7 of Bangchuan, which can test a maximum force of 25 kN. The mechanical property test data includes but is not limited to compressive strength, tensile strength, and stress-strain curve, etc. The mechanical properties are obtained by the mechanical sensor, and the difference between them is that the mechanical sensor 7 is mainly used to measure the mechanical properties of the cured epoxy resin sample, while the mechanical sensor is mainly used to measure the mechanical properties of the epoxy resin at each position in the curing process. Moreover, as an example of the present embodiment, the mechanical sensor can correspond to each part of the independent heating jacket 3, for example, one or more mechanical sensors are respectively arranged for A1, A2…AN; according to the measurement results of the mechanical sensors at each position, combined with the compressive strength, tensile strength, and stress-strain curve measured by the mechanical sensor 7, the curing non-uniformity of the epoxy resin sample and the influence law of the curing non-uniformity on the mechanical properties of the epoxy resin material can be obtained; and by simulating the temperature, comparing and analyzing the temperature data and the mechanical property test data, the curing shrinkage non-uniformity of the whole epoxy resin can be accurately judged, which provides a guidance basis for how to adopt a temperature control scheme when casting a large-size epoxy resin to meet the mechanical property requirements of the test product. In actual engineering, the technical solution of the present embodiment can also provide data support for reducing or eliminating the adverse effects of epoxy curing shrinkage non-uniformity.

[0037] Compared with the prior art, the embodiment of the present application has the following beneficial effects:

[0038] The embodiment of the present application provides a mechanical property test device for simulating uneven epoxy curing, comprising a tensile testing machine, a clamp, an epoxy pouring mold, a temperature controller, a mechanical sensor, a plurality of heat insulation sleeves and a plurality of independent heating sleeves; wherein the clamp of the mechanical property test device is used for clamping the epoxy pouring mold and fixing the epoxy pouring mold on the tensile testing machine; the epoxy pouring mold is used for pouring of the epoxy resin, and the inner wall of the epoxy pouring mold is provided with the plurality of mechanical sensors; the plurality of mechanical sensors are used for measuring the mechanical properties of each position in the curing process of the epoxy resin; the independent heating sleeve is sleeved on the epoxy pouring mold and is used for heating the wrapped area according to a preset time-varying temperature curve; the heat insulation sleeve is arranged between the plurality of independent heating sleeves and is used for dividing the areas wrapped by the plurality of independent heating sleeves and isolating heat transfer between the wrapped areas; the temperature controller is used for setting the time-varying temperature curve to realize adjustment of the temperature of the epoxy pouring mold; the tensile testing machine is used for applying a test force to the epoxy resin to realize testing of the mechanical properties; and the mechanical sensor is used for acquiring the mechanical property test data of the cured epoxy resin. Compared with the prior art, the present application controls the heating temperature of the independent heating sleeve through the temperature controller, realizes control of the curing rate of each part of the epoxy resin, so as to achieve the purpose of effectively simulating different epoxy curing shrinkage unevenness, improves the simulation precision, and can provide guidance basis for accurately obtaining and weakening the influence of curing unevenness on the mechanical properties of the material in engineering.

[0039] The above specific embodiments further illustrate the purpose, technical solutions and beneficial effects of the present application, and it should be understood that the above description is only for specific embodiments of the present application and is not used to limit the protection scope of the present application. It is particularly pointed out that any modification, equivalent replacement, improvement, etc. made by those skilled in the art within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A mechanical property testing device for simulating uneven curing of epoxy resin, characterized in that, Includes a tensile and compressive testing machine, fixtures, epoxy casting molds, temperature controller, mechanical sensors, several heat insulation sleeves, and several independent heating sleeves; The clamp of the mechanical property testing device is used to hold the epoxy casting mold and fix the epoxy casting mold on the tensile and compressive testing machine. The epoxy casting mold is used for casting epoxy resin, and the inner wall of the epoxy casting mold is provided with a plurality of mechanical sensors; the plurality of mechanical sensors are used to measure the mechanical properties at various locations during the curing process of the epoxy resin. The independent heating sleeve is fitted onto the epoxy casting mold and is used to heat the wrapped area according to a preset time-varying temperature curve. The heat insulation sleeve is disposed between the plurality of independent heating sleeves to divide the area wrapped by the plurality of independent heating sleeves and to isolate the heat transfer between the wrapped areas. The temperature controller is used to set the time-varying temperature curve to adjust the temperature of the epoxy casting mold. The tensile and compressive testing machine is used to apply test force to the epoxy resin to test its mechanical properties; The mechanical sensor is used to acquire test data on the mechanical properties of the epoxy resin after curing.

2. The mechanical property testing device for simulating uneven epoxy curing as described in claim 1, characterized in that, The mechanical property test data include compressive strength, tensile strength, and stress-strain curves.

3. The mechanical property testing device for simulating uneven epoxy curing as described in claim 2, characterized in that, The test force accuracy of the tensile and compressive testing machine is 0.5%, and the displacement accuracy of the clamps of the tensile and compressive testing machine is greater than 1 mm.

4. The mechanical property testing device for simulating uneven epoxy curing as described in claim 3, characterized in that, The maximum test force that the clamps of the mechanical property testing device can withstand is 25 kN.

5. The mechanical property testing device for simulating uneven epoxy curing as described in claim 4, characterized in that, The independent heating jacket is made of Gree aluminum plate stainless steel; the independent heating jacket is powered by a 220V power supply; the maximum heating power of the independent heating jacket is 950W.

6. The mechanical property testing device for simulating uneven epoxy curing as described in claim 5, characterized in that, The epoxy casting mold is made of aluminum-plated stainless steel, and is cylindrical in shape with a height of 120cm and a diameter of 20cm.

7. The mechanical property testing device for simulating uneven epoxy curing as described in claim 6, characterized in that, The temperature controller uses a PID feedback system for temperature control, and the temperature range set by the temperature controller is 30 to 300 degrees Celsius.

8. The mechanical property testing device for simulating uneven epoxy curing as described in claim 7, characterized in that, The heat insulation sleeve is made of polyimide foam material.

9. A mechanical property testing device for simulating uneven epoxy curing as described in any one of claims 1 to 8, characterized in that, The mechanical property testing device also includes a display, which is used to visually display the mechanical property test data, the measurement results of the mechanical properties, and the test results of the mechanical properties of the epoxy resin.

Images