An epoxy resin composite material, its preparation method and application

Abstract

The present invention provides an epoxy resin composite material, a preparation method and an application thereof. The raw materials for preparing the epoxy resin composite material include epoxy resin, epoxy diluent, mica dust particles, short glass fibers, curing agent and accelerator. By adding mica dust particles and short glass fibers, the high-temperature resistance, electrical strength and mechanical strength at high temperature, as well as wear resistance and heat insulation of the epoxy resin composite material are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of composite materials, and particularly relates to an epoxy resin composite material, a preparation method thereof and an application thereof. Background Art

[0002] Epoxy resin has the characteristics of high strength, good chemical stability, easy processing and low cost, and is widely used. However, after curing, epoxy products have problems such as a decrease in mechanical strength, poor heat resistance and temperature resistance at high temperatures, and a significant decrease in electrical strength at high temperatures, which cannot meet the requirements of electrical component materials for high temperature resistance, mechanical strength and high insulation performance.

[0003] CN101565535 discloses a heat-resistant epoxy resin and a preparation method thereof. The heat-resistant epoxy resin is made of diatomite, epoxy resin and a curing agent, wherein the mass ratio of the epoxy resin to the curing agent is 15-35:8, the diatomite accounts for 1%-10% of the total mass of the heat-resistant epoxy resin, and the particle size of the diatomite is 2-2.5 μm. The heat-resistant epoxy resin provided by this technical solution has enhanced heat resistance and interfacial bonding performance, the thermal decomposition temperature is increased by more than 60 °C, and the interfacial mechanical strength is increased by more than 17%.

[0004] CN102643621A discloses an epoxy resin adhesive for impregnation with high heat resistance and a preparation method thereof. The epoxy resin adhesive is composed of a modified epoxy resin and a modified mixed maleic anhydride as a curing agent in a mass ratio of 1:0.5-1:1.2; the modified epoxy resin, by weight, includes the following components: a heat-resistant epoxy resin, a modifier, and a co-solvent; the curing agent, by weight, includes the following components: a liquid anhydride, a solid anhydride, a polyol, a promoter and a solvent. This technical solution enhances the mechanical strength and electrical properties of the epoxy resin adhesive by using a modified epoxy resin, has good heat resistance, and the glass transition temperature is 160 °C - 200 °C.

[0005] CN103694636A discloses an electrical insulating epoxy resin composition, a preparation method thereof and uses thereof. The electrical insulating epoxy resin composition includes the following components: (A) a mixture of at least two epoxy resins; (B) a mixture of at least two acid anhydride curing agents; (C) a micro-nano inorganic particle composition; the component (C) the micro-nano inorganic particle composition accounts for 63-73% by weight of the electrical insulating epoxy resin composition. The electrical insulating epoxy resin composition provided by this technical solution has excellent electrical properties such as breakdown strength, as well as heat resistance, mechanical properties and processability.

[0006] Although the above-mentioned solutions have all obtained epoxy resin composites with excellent performance, with the development of electrical components, the requirements for the high-temperature resistance, mechanical strength, and high insulation performance of materials are continuously increasing. The high-temperature resistance, electrical strength, and mechanical strength of epoxy resin composites at high temperatures still need to be further improved.

[0007] Therefore, it is necessary to prepare an epoxy resin composite material with high temperature resistance, excellent electrical strength, and mechanical strength at high temperatures. Summary of the Invention

[0008] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide an epoxy resin composite material, its preparation method, and application. The epoxy resin composite material has good high-temperature resistance, high electrical strength and mechanical strength at high temperatures, good wear resistance and heat insulation.

[0009] To achieve this purpose, the present invention adopts the following technical solutions:

[0010] In the first aspect, the present invention provides an epoxy resin composite material, and the preparation raw materials of the epoxy resin composite material include epoxy resin, epoxy diluent, mica dust particles, short glass fibers, curing agent, and accelerator.

[0011] The present invention improves the high-temperature resistance of the epoxy resin composite material by adding mica dust particles, improves the mechanical strength of the epoxy resin composite material by adding short glass fibers. The epoxy resin composite material prepared by the combination of mica dust particles and short glass fibers can maintain excellent electrical strength and mechanical strength at high temperatures, and at the same time improves wear resistance and heat insulation.

[0012] In the present invention, "high temperature" means 180°C - 220°C. If the following involves the same expression, it has the same meaning.

[0013] Preferably, the epoxy resin composite material includes the following components by weight:

[0014]

[0015] The epoxy resin can be 65 parts, 67 parts, 69 parts, 72 parts, 74 parts, 75 parts, 78 parts, 80 parts, 83 parts, or 85 parts, etc.

[0016] The epoxy diluent can be 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts, 9.5 parts, or 10 parts, etc.

[0017] The mica dust particles can be 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, or 20 parts, etc.

[0018] The short glass fiber can be 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts or the like.

[0019] The curing agent can be 45 parts, 46 parts, 47 parts, 48 parts, 49 parts, 50 parts, 51 parts, 52 parts, 53 parts, 54 parts, 55 parts or the like.

[0020] The accelerator can be 0.02 parts, 0.03 parts, 0.04 parts, 0.05 parts, 0.06 parts, 0.07 parts, 0.08 parts, 0.09 parts, 0.1 parts or the like.

[0021] Preferably, the epoxy resin includes bisphenol A epoxy resin which is liquid at room temperature.

[0022] Preferably, the number average molecular weight of the bisphenol A epoxy resin is 300 - 500, such as 300, 320, 340, 360, 380, 400, 420, 450, 480, 500 or the like.

[0023] Preferably, the epoxy diluent includes aromatic epoxy diluent and / or aliphatic epoxy diluent.

[0024] Preferably, the epoxy diluent includes any one or a combination of at least two of epoxy diluent 501, epoxy diluent YHY - 692 or epoxy diluent H62.

[0025] Preferably, the mica dust particles include phlogopite and muscovite.

[0026] Preferably, the particle sizes of the phlogopite and muscovite are independently 0.1 - 0.5 mm, such as 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm or the like.

[0027] Preferably, the mass ratio of the phlogopite to the muscovite is 1.5 - 2.5:1, such as 1.5:1, 1.6:1, 1.7:1, 1.8:1, 1.9:1, 2.0:1, 2.2:1, 2.3:1, 2.4:1, 2.5:1 or the like.

[0028] Preferably, the length of the short glass fiber is 0.2 - 0.6 mm, such as 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm or the like.

[0029] Preferably, the curing agent includes any one or a combination of at least two of methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride or hexahydrophthalic anhydride.

[0030] Preferably, the accelerator includes benzyldimethylamine and / or 2-ethyl-4-methylimidazole.

[0031] In a second aspect, the present invention provides a method for preparing an epoxy resin composite material as described in the first aspect. The preparation method includes the following steps:

[0032] Mix epoxy resin, epoxy diluent, mica dust particles, short glass fibers, curing agent and accelerator, and perform hot pressing to obtain the epoxy resin composite material.

[0033] Preferably, the mixing includes the following steps:

[0034] (1) Stir and mix epoxy resin, epoxy diluent, mica dust particles and short glass fibers to obtain an epoxy resin mixture.

[0035] (2) Stir and mix the curing agent and accelerator to obtain a curing agent mixture.

[0036] (3) Stir and mix the epoxy resin mixture and the curing agent mixture.

[0037] Preferably, the rotation speed of the stirring in step (1) is 750 - 900 rpm / min, such as 750 rpm / min, 770 rpm / min, 790 rpm / min, 800 rpm / min, 820 rpm / min, 840 rpm / min, 860 rpm / min, 880 rpm / min or 900 rpm / min, etc., and the stirring time is 0.5 - 1 h, such as 0.5 h, 0.55 h, 0.6 h, 0.65 h, 0.7 h, 0.75 h, 0.8 h, 0.85 h, 0.9 h, 0.95 h or 1 h, etc.

[0038] Preferably, the rotation speed of the stirring in step (2) is 200 - 300 rpm / min, such as 200 rpm / min, 220 rpm / min, 240 rpm / min, 250 rpm / min, 260 rpm / min, 270 rpm / min, 280 rpm / min, 290 rpm / min or 300 rpm / min, etc., and the stirring time is 10 - 20 min, such as 10 min, 11 min, 12 min, 14 min, 15 min, 16 min, 18 min or 20 min, etc.

[0039] Preferably, the rotation speed of the stirring in step (3) is 450 - 550 rpm / min, such as 450 rpm / min, 460 rpm / min, 470 rpm / min, 480 rpm / min, 490 rpm / min, 500 rpm / min, 510 rpm / min, 520 rpm / min or 550 rpm / min, etc., and the stirring time is 0.5 - 1 h, such as 0.5 h, 0.55 h, 0.6 h, 0.65 h, 0.7 h, 0.75 h, 0.8 h, 0.85 h, 0.9 h, 0.95 h or 1 h, etc.

[0040] Preferably, the temperature of the hot pressing is 160 - 180 °C, such as 160 °C, 162 °C, 164 °C, 166 °C, 168 °C, 170 °C, 172 °C, 175 °C, 178 °C or 180 °C, etc., the pressure of the hot pressing is 0.2 - 0.5 Mpa, such as 0.2 Mpa, 0.25 Mpa, 0.3 Mpa, 0.35 Mpa, 0.4 Mpa, 0.45 Mpa or 0.5 Mpa, etc., and the time of the hot pressing is 0.5 - 2 h, such as 0.5 h, 0.6 h, 0.8 h, 1 h, 1.2 h, 1.5 h, 1.7 h, 1.8 h, 1.9 h or 2 h, etc.

[0041] In the third aspect, the present invention provides an application of the epoxy resin composite material as described in the first aspect in battery protection materials or high - temperature protection materials.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] Through the compounding of epoxy resin, epoxy diluent, mica dust particles, short glass fibers, curing agent and accelerator, the obtained epoxy resin composite material has good high - temperature resistance, high mechanical strength, and still has good insulation at high temperatures. At 180 °C, the tensile strength ≥ 120 Mpa, the electrical strength ≥ 11.2 kV / mm, and the impact strength ≥ 6.9 kJ / m 2 ; preferably, at 220 °C, the electrical strength ≥ 10 kV / mm. At the same time, by adding mica dust particles and short glass fibers, the wear resistance and heat insulation of the epoxy resin composite material are improved. Specific Embodiments

[0044] The technical solutions of the present invention will be further described below through specific embodiments. Those skilled in the art should understand that the embodiments are only for helping to understand the present invention and should not be regarded as specific limitations on the present invention.

[0045] Example 1

[0046] This embodiment provides an epoxy resin composite material and a preparation method thereof. The epoxy resin composite material comprises the following components by weight: 70 parts of epoxy resin (bisphenol A epoxy resin, number average molecular weight is 380), 7 parts of epoxy diluent (epoxy diluent 501), 15 parts of mica dust particles (phlogopite with a particle size of 0.2 mm and muscovite with a particle size of 0.2 mm, mass ratio is 2:1), 5 parts of short glass fibers (length is 0.4 mm), 50 parts of curing agent (methyltetrahydrophthalic anhydride) and 0.5 part of accelerator (benzyldimethylamine).

[0047] The preparation method comprises the following steps:

[0048] (1) Stir and mix the epoxy resin, epoxy diluent, mica dust particles and short glass fibers at a stirring speed of 850 rpm / min for 0.8 h to obtain an epoxy resin mixture.

[0049] (2) Stir and mix the curing agent and accelerator at a stirring speed of 250 rpm / min for 15 min to obtain a curing agent mixture.

[0050] (3) Stir and mix the epoxy resin mixture and the curing agent mixture at a stirring speed of 500 rpm / min for 0.5 h, and hot press at 170 °C with a pressure of 0.3 Mpa for 1.5 h to obtain the epoxy resin composite material.

[0051] Example 2

[0052] This embodiment provides an epoxy resin composite material and a preparation method thereof. The epoxy resin composite material comprises the following components by weight: 85 parts of epoxy resin (bisphenol A epoxy resin, number average molecular weight is 500), 10 parts of epoxy diluent (epoxy diluent YHY-692), 20 parts of mica dust particles (phlogopite with a particle size of 0.5 mm and muscovite with a particle size of 0.5 mm, mass ratio is 2.5:1), 8 parts of short glass fibers (length is 0.6 mm), 55 parts of curing agent (methylhexahydrophthalic anhydride) and 0.1 part of accelerator (2-ethyl-4-methylimidazole).

[0053] The preparation method comprises the following steps:

[0054] (1) Stir and mix the epoxy resin, epoxy diluent, mica dust particles and short glass fibers at a stirring speed of 900 rpm / min for 0.5 h to obtain an epoxy resin mixture.

[0055] (2) Stir and mix the curing agent and accelerator at a stirring speed of 300 rpm / min for 20 min to obtain a curing agent mixture.

[0056] (3) Mix the epoxy resin mixture and the curing agent mixture by stirring at a rotation speed of 550 rpm / min for 0.5 h, and then hot press at 180 °C under a pressure of 0.5 Mpa for 2 h to obtain the epoxy resin composite material.

[0057] Example 3

[0058] This example provides an epoxy resin composite material and a preparation method thereof. The epoxy resin composite material comprises the following components by weight: 65 parts of epoxy resin (bisphenol A epoxy resin, number average molecular weight is 300), 5 parts of epoxy diluent (epoxy diluent H62), 10 parts of mica dust particles (phlogopite with a particle size of 0.1 mm and muscovite with a particle size of 0.1 mm, mass ratio is 1.5:1), 3 parts of short glass fibers (length is 0.2 mm), 45 parts of curing agent (hexahydrophthalic anhydride), and 0.02 part of accelerator (benzyldimethylamine).

[0059] The preparation method comprises the following steps:

[0060] (1) Stir and mix the epoxy resin, epoxy diluent, mica dust particles and short glass fibers at a rotation speed of 750 rpm / min for 1 h to obtain an epoxy resin mixture.

[0061] (2) Stir and mix the curing agent and the accelerator at a rotation speed of 200 rpm / min for 10 min to obtain a curing agent mixture;

[0062] (3) Stir and mix the epoxy resin mixture and the curing agent mixture at a rotation speed of 450 rpm / min for 0.5 h, and then hot press at 160 °C under a pressure of 0.5 Mpa for 0.5 h to obtain the epoxy resin composite material.

[0063] Example 4

[0064] This example provides an epoxy resin composite material and a preparation method thereof. The difference from Example 1 is only that the mica dust particles (phlogopite with a particle size of 0.2 mm and muscovite with a particle size of 0.2 mm, mass ratio is 2:1) are replaced with phlogopite with the same mass and a particle size of 0.2 mm, and the other raw materials, dosages and preparation methods are the same as those in Example 1.

[0065] Example 5

[0066] This embodiment provides an epoxy resin composite material and a preparation method thereof. The difference from Embodiment 1 is only that mica dust particles (phlogopite with a particle size of 0.2 mm and muscovite with a particle size of 0.2 mm, with a mass ratio of 2:1) are replaced with muscovite with the same mass and a particle size of 0.2 mm. Other raw materials, dosages, and preparation methods are the same as those in Embodiment 1.

[0067] Example 6

[0068] This embodiment provides an epoxy resin composite material and a preparation method thereof. The difference from Embodiment 1 is only that mica dust particles (phlogopite with a particle size of 0.2 mm and muscovite with a particle size of 0.2 mm, with a mass ratio of 2:1) are replaced with mica dust particles with the same mass (phlogopite with a particle size of 0.2 mm and muscovite with a particle size of 0.2 mm, with a mass ratio of 0.5:1). Other raw materials, dosages, and preparation methods are the same as those in Embodiment 1.

[0069] Example 7

[0070] This embodiment provides an epoxy resin composite material and a preparation method thereof. The difference from Embodiment 1 is only that the weight portion of mica dust particles (phlogopite with a particle size of 0.2 mm and muscovite with a particle size of 0.2 mm, with a mass ratio of 2:1) is adjusted to 30 parts. Other raw materials, dosages, and preparation methods are the same as those in Embodiment 1.

[0071] Example 8

[0072] This embodiment provides an epoxy resin composite material and a preparation method thereof. The difference from Embodiment 1 is only that the weight portion of mica dust particles (phlogopite with a particle size of 0.2 mm and muscovite with a particle size of 0.2 mm, with a mass ratio of 2:1) is adjusted to 5 parts. Other raw materials, dosages, and preparation methods are the same as those in Embodiment 1.

[0073] Example 9

[0074] This embodiment provides an epoxy resin composite material and a preparation method thereof. The difference from Embodiment 1 is only that short glass fibers (with a length of 0.4 mm) are replaced with short glass fibers with the same mass (with a length of 0.18 mm). Other raw materials, dosages, and preparation methods are the same as those in Embodiment 1.

[0075] Example 10

[0076] This embodiment provides an epoxy resin composite material and a preparation method thereof. The difference from Embodiment 1 is only that the weight portion of short glass fibers (with a length of 0.4 mm) is adjusted to 1 part. Other raw materials, dosages, and preparation methods are the same as those in Embodiment 1.

[0077] Comparative Example 1

[0078] This comparative example provides an epoxy resin composite material and a preparation method thereof. The difference from Example 1 is only that the raw materials for preparing the epoxy resin composite material do not include mica dust particles, and the other raw materials, dosages, and preparation methods are the same as those in Example 1.

[0079] Comparative Example 2

[0080] This comparative example provides an epoxy resin composite material and a preparation method thereof. The difference from Example 1 is only that the raw materials for preparing the epoxy resin composite material do not include short glass fibers, and the other raw materials, dosages, and preparation methods are the same as those in Example 1.

[0081] Comparative Example 3

[0082] This comparative example provides an epoxy resin composite material and a preparation method thereof. The difference from Example 1 is only that the raw materials for preparing the epoxy resin composite material do not include short glass fibers and mica dust particles, and the other raw materials, dosages, and preparation methods are the same as those in Example 1.

[0083] The following performance tests were carried out on the epoxy resin composite materials provided in the examples and comparative examples:

[0084] (1) Electrical strength: Refer to GB / T1408.1-2016 Test Method for Electrical Strength of Insulating Materials to test the electrical strength at 25 °C, 180 °C, and 220 °C.

[0085] (2) Impact strength: Refer to GB / T1043.1-2008 Determination of Charpy Impact Properties to test the impact strength at 25 °C and 180 °C.

[0086] (3) Tensile strength: Refer to GB / T 1040.4-2006 Determination of Tensile Properties of Plastics to test the tensile strength at 25 °C and 180 °C.

[0087] The test results are shown in Table 1.

[0088] Table 1

[0089]

[0090]

[0091] According to the test results in Table 1, it can be seen that the epoxy resin composite material provided by the present invention has good high-temperature resistance. In Examples 1-10, as the temperature increases, the electrical strength of the prepared epoxy resin composite material decreases. At 180 °C, the electrical strength ≥ 11.2 kV / mm, and it still has good insulation at high temperatures; at 180 °C, the impact strength ≥ 6.9 kJ / m 2, the decrease is no more than 50% compared with 25°C, the tensile strength ≥ 120 Mpa, and the decrease is no more than 50% compared with 25°C. At 220°C, the electrical strength of the epoxy resin composites prepared in Examples 1-3 and Examples 7-10 is 10.4-11.5 kV / mm; for Examples 5 and 6, the electrical strength of the epoxy resin composites prepared is 6.2-7.8 kV / mm.

[0092] Comparing with Example 1, it can be seen that if the combination of phlogopite and muscovite is replaced with the same mass of phlogopite (Example 4), the tensile strength and impact strength of the prepared epoxy resin composite decrease; if the combination of phlogopite and muscovite is replaced with the same mass of muscovite (Example 5), the impact strength of the prepared epoxy resin composite decreases, and the electrical strength decreases significantly at high temperature, proving that the combination of phlogopite and muscovite for mica dust particles has better performance.

[0093] Comparing Example 6 with Example 1, it can be seen that if the mass ratio of phlogopite and muscovite is adjusted to reduce the mass proportion of phlogopite, the tensile strength and impact strength of the prepared epoxy resin composite decrease, and the electrical strength decreases significantly at high temperature, proving that when the mica dust particles are a combination of phlogopite and muscovite in a specific ratio, the performance is better.

[0094] Comparing with Example 1, it can be seen that if the weight fraction of mica dust particles is increased (Example 7), the electrical strength of the prepared epoxy resin composite decreases; if the weight fraction of mica dust particles is reduced (Example 8), the tensile strength, impact strength and electrical strength of the prepared epoxy resin composite all decrease, proving that when a specific weight fraction of mica dust particles is added to the epoxy resin composite, the performance is better.

[0095] Comparing with Example 1, it can be seen that if shorter short glass fibers are used (Example 9), the tensile strength of the prepared epoxy resin composite decreases, and the electrical strength decreases slightly; if the weight fraction of short glass fibers is reduced (Example 10), the tensile strength, impact strength and electrical strength of the prepared epoxy resin composite all decrease, proving that when specific length and specific weight fraction of short glass fibers are added to the epoxy resin composite, the performance is better.

[0096] Compared with Example 1, if no mica dust particles are added (Comparative Example 1), the tensile strength, impact strength and electrical strength all decrease at high temperature.

[0097] Compared with Example 1, if no short glass fibers are added (Comparative Example 2), the tensile strength and impact strength decrease significantly at 25°C, the electrical strength at 25°C is not much different, but the electrical strength decreases significantly at high temperature.

[0098] Compared with Example 1, if short glass fibers and mica dust particles are not added (Comparative Example 3), the tensile strength, impact strength and electrical strength are all lower at 25°C and high temperature; as the temperature increases, both the tensile strength and electrical strength decrease significantly.

[0099] The applicant declares that the present invention uses the above embodiments to illustrate an epoxy resin composite material, its preparation method and application of the present invention, but the present invention is not limited to the above embodiments, that is, it does not mean that the present invention must rely on the above embodiments to be implemented. Those skilled in the art should understand that any improvement to the present invention, the equivalent replacement of each raw material of the product of the present invention, the addition of auxiliary components, the selection of specific methods, etc. all fall within the protection scope and public scope of the present invention.

Claims

1. An epoxy resin composite material, characterized in that, The raw materials for preparing the epoxy resin composite material include epoxy resin, epoxy diluent, mica dust particles, short glass fibers, curing agent and accelerator; The epoxy resin composite material includes the following components by weight: Epoxy resin 65 - 85 parts Epoxy diluent 5 - 10 parts Mica dust particles 10 - 20 parts Short glass fibers 3 - 8 parts Curing agent 45 - 55 parts Accelerator 0.02 - 0.1 part; The length of the short glass fibers is 0.2 - 0.6 mm.

2. The epoxy resin composite material according to claim 1, wherein The epoxy resin includes bisphenol A epoxy resin which is liquid at room temperature.

3. The epoxy resin composite material according to claim 1, wherein, The epoxy diluent includes aromatic epoxy diluent and / or aliphatic epoxy diluent.

4. The epoxy resin composite material according to claim 1, characterized in that, The epoxy diluent includes any one or a combination of at least two of epoxy diluent 501, epoxy diluent YHY - 692 or epoxy diluent H62.

5. The epoxy resin composite material according to claim 1, wherein, The mica dust particles include phlogopite and muscovite.

6. The epoxy resin composite material according to claim 5, wherein, The particle sizes of the phlogopite and muscovite are independently 0.1 - 0.5 mm.

7. The epoxy resin composite material according to claim 5, characterized in that, The mass ratio of the phlogopite to the muscovite is 1.5 - 2.5:

1.

8. The epoxy resin composite material according to claim 1, wherein, The curing agent includes any one or a combination of at least two of methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride or hexahydrophthalic anhydride.

9. The epoxy resin composite material according to claim 1, characterized in that, The accelerator includes benzyldimethylamine and / or 2 - ethyl - 4 - methylimidazole.

10. The preparation method of the epoxy resin composite material according to any one of claims 1-9, characterized in that, The preparation method includes the following steps: Mix epoxy resin, epoxy diluent, mica dust particles, short glass fibers, curing agent and accelerator, and perform hot pressing to obtain the epoxy resin composite material.

11. The preparation method according to claim 10, characterized in that, The mixing includes the following steps: (1) Stir and mix epoxy resin, epoxy diluent, mica dust particles and short glass fibers to obtain an epoxy resin mixture; (2) Stir and mix the curing agent and accelerator to obtain a curing agent mixture; (3) Stir and mix the epoxy resin mixture and the curing agent mixture.

12. The preparation method according to claim 11, wherein, The rotation speed of the stirring in step (1) is 750 - 900 rpm / min, and the stirring time is 0.5 - 1 h.

13. The preparation method according to claim 11, characterized in that, The rotation speed of the stirring in step (2) is 200 - 300 rpm / min, and the stirring time is 10 - 20 min.

14. The preparation method according to claim 11, wherein The rotation speed of the stirring in step (3) is 450 - 550 rpm / min, and the stirring time is 0.5 - 1 h.

15. The preparation method according to claim 10, characterized in that, The temperature of the hot pressing is 160 - 180 °C, the pressure of the hot pressing is 0.2 - 0.5 Mpa, and the time of the hot pressing is 0.5 - 2 h.

16. The application of the epoxy resin composite material according to any one of claims 1 - 9 in battery protection materials or high - temperature protection materials.

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