Fixing temperature control method, image forming apparatus and chip

Abstract

This application proposes a fixing temperature control method, an image forming apparatus, and a chip, relating to the field of imaging technology. The fixing temperature control method includes: a temperature detection module detecting a first temperature of the fixing module and sending the first temperature to a fixing control module of a control chip. In response to the first temperature, the fixing control module obtains a pre-stored temperature threshold in a target register and compares the temperature threshold with the first temperature using a comparator. Upon determining that the first temperature is higher than the temperature threshold, the fixing control module stops enabling the fixing module. This solution utilizes the system-on-chip (SoC) integrated within the image forming apparatus to achieve over-temperature protection of the fixing apparatus, eliminating the need for a separate over-temperature protection circuit and saving hardware costs.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of imaging technology, in particular to a fixing temperature control method, an image forming device and a chip. BACKGROUND

[0002] The image forming device such as printer and copier contains a fixing device, also known as heating assembly. The fixing device can be used to fix the printing medium such as carbon powder on the paper by heating method, thereby completing the imaging. However, in the above fixing process, the fixing device will reach a very high temperature, in order to avoid causing safety accidents, it is necessary to carry out over-temperature protection for the fixing process. SUMMARY

[0003] The embodiment of the present application provides a fixing temperature control method, an image forming device and a chip, which can realize over-temperature protection of the fixing device by using the system on chip (SoC) built in the image forming device, without separately configuring an over-temperature protection circuit, thereby saving the hardware cost.

[0004] In a first aspect, the embodiment of the present application provides a fixing temperature control method applied to an image forming device, wherein the image forming device comprises a fixing module, a temperature detection module, a temperature acquisition module and a control chip, the output of the temperature detection module is connected with the input of the temperature acquisition module, the output of the temperature acquisition module is connected with the input of the control chip, the control chip is integrated with a fixing control module, and the fixing control module is provided with a target register and a comparator; the method comprises the following steps: the temperature detection module detects a first temperature of the fixing module, and sends the first temperature to the fixing control module through the temperature acquisition module; the fixing control module acquires a temperature threshold value pre-stored in the target register in response to the first temperature; the fixing control module compares the temperature threshold value with the first temperature by using the comparator and generates a comparison result; and the fixing control module controls the on-off of the fixing module based on the comparison result.

[0005] In one possible implementation, the fixing control module is further provided with a timing module; and the fixing control module controls the on-off of the fixing module based on the comparison result, which comprises: when the fixing control module determines that the first temperature is higher than the temperature threshold value, the timing module is started to begin timing; and the fixing control module determines that the first temperature is always higher than the temperature threshold value within a preset timing duration, and disconnects the heating of the fixing module.

[0006] In one possible implementation, the method further comprises: the fixing control module determines that the first temperature is lower than the temperature threshold value before the preset timing duration is reached, and initializes the timing module.

[0007] In one possible implementation, the control chip further integrates an analog-digital conversion module, and the analog-digital conversion module is connected to the fusing control module; the temperature detection module sends the first temperature to the fusing control module through the temperature collection module, including: the temperature detection module sends the first temperature to the analog-digital conversion module through the temperature collection module; the analog-digital conversion module converts the first temperature into a digital signal, and feeds back the converted digital signal to the fusing control module, so that the fusing control module controls the on-off of the heating of the fusing module based on the converted digital signal.

[0008] In one possible implementation, the control chip further integrates a filtering module, and the filtering module is connected to the analog-digital conversion module and the fusing control module respectively; the method further includes: the filtering module filters the digital signal converted by the analog-digital conversion module.

[0009] In a second aspect, the embodiments of the present application provide an image forming apparatus, including: a fusing module, a temperature detection module, a temperature collection module, and a control chip, an output of the temperature detection module is connected to an input of the temperature collection module, an output of the temperature collection module is connected to an input of the control chip, the control chip integrates a fusing control module, and the fusing control module is provided with a target register and a comparator; the temperature detection module is configured to detect a first temperature of the fusing module, and send the first temperature to the fusing control module through the temperature collection module; the fusing control module is configured to, in response to the first temperature, acquire a temperature threshold value pre-stored in the target register, compare the temperature threshold value with the first temperature by using the comparator, and generate a comparison result, and control the on-off of the heating of the fusing module based on the comparison result.

[0010] In one possible implementation, the fusing control module further includes a timing module; the fusing control module is specifically configured to: when it is determined that the first temperature is higher than the temperature threshold value, start the timing module to begin timing; and when it is determined that the first temperature is always higher than the temperature threshold value within a preset timing duration, disconnect the heating of the fusing module.

[0011] In one possible implementation, the fusing control module is further configured to: when it is determined that the first temperature is lower than the temperature threshold value before the preset timing duration is reached, initialize the timing module.

[0012] In one possible implementation, the control chip further integrates an analog-to-digital conversion module, and the analog-to-digital conversion module is connected to the fixing control module; the temperature detection module is specifically configured to send the first temperature to the analog-to-digital conversion module through the temperature collection module; and the analog-to-digital conversion module is configured to perform analog-to-digital conversion on the first temperature, obtain a converted digital signal, and feed back the converted digital signal to the fixing control module, so that the fixing control module controls the fixing module to heat on and off based on the converted digital signal.

[0013] In one possible implementation, the control chip further integrates a filtering module, and the filtering module is connected to the analog-to-digital conversion module and the fixing control module respectively; and the filtering module is configured to filter the digital signal converted by the analog-to-digital conversion module.

[0014] In a third aspect, an embodiment of the present application provides a control chip, which comprises: a fixing control module, the fixing control module being provided with a target register and a comparator; an input of the fixing control module being connected to an output of a temperature collection module, and an output of the fixing control module being connected to a fixing module; the fixing control module being configured to receive a first temperature of the fixing module sent by a temperature detection module through the temperature collection module; obtain a temperature threshold value pre-stored in the target register; compare the temperature threshold value and the first temperature by using the comparator and generate a comparison result; and control the fixing module to heat on and off based on the comparison result.

[0015] In one possible implementation, the fixing control module further comprises a timing module; and the fixing control module is specifically configured to start the timing module to start timing when it is determined that the first temperature is higher than the temperature threshold value; and disconnect the heating of the fixing module when it is determined that the first temperature is always higher than the temperature threshold value within a preset timing duration.

[0016] In one possible implementation, the fixing control module is further configured to initialize the timing module when it is determined that the first temperature is lower than the temperature threshold value before the preset timing duration is reached.

[0017] In one possible implementation, the control chip further integrates an analog-to-digital conversion module, and the analog-to-digital conversion module is connected to the fixing control module; the fixing control module is specifically configured to receive a digital signal sent by the analog-to-digital conversion module, the digital signal being obtained by the analog-to-digital conversion module performing analog-to-digital conversion on the first temperature, and the first temperature being sent by the temperature detection module to the analog-to-digital conversion module through the temperature collection module.

[0018] In one possible implementation, the control chip further integrates a filtering module, which is connected to the analog-digital conversion module and the fixing control module respectively; and the fixing control module is specifically configured to receive a filtered signal sent by the filtering module, the filtered signal being obtained by filtering the digital signal sent by the analog-digital conversion module.

[0019] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising: at least one processor; and at least one memory connected to the processor in communication, wherein: the memory stores program instructions executable by the processor, and the processor invoking the program instructions can execute the method as described above.

[0020] In a fifth aspect, an embodiment of the present application provides a computer readable storage medium, which stores computer instructions, and the computer instructions make the computer execute the method as described above.

[0021] In the above technical solution, the fixing control module can be integrated in the control chip of the image forming device, the fixing control module can be used to determine the fixing temperature, and when it is determined that the fixing temperature exceeds the temperature threshold, the fixing control module can be used to stop enabling the fixing module, so as to stop heating and complete the over-temperature protection. In addition, since the comparator circuit and the register are included in the fixing control module, the above solution can realize the fixing over-temperature protection based on the control chip, without the need to configure a separate hardware protection circuit and a comparator circuit, thereby saving the hardware cost. In addition, the above solution directly controls the shutdown of the fixing module by the fixing control module in the control chip, thereby accelerating the response speed of the over-temperature protection, and the over-temperature protection can still be realized in the case of a dead firmware program, thereby being more reliable. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0023] Figure 1 A structural schematic diagram of an image forming device is provided for the embodiments of the present application;

[0024] Figure 2 A flowchart of a fixing temperature control method is provided for the embodiments of the present application;

[0025] Figure 3 A structural schematic diagram of a fixing control module is provided for the embodiments of the present application;

[0026] Figure 4 Another structure diagram of a fixing control module provided by an embodiment of the present application is shown in FIG. 6.

[0027] Figure 5 Another structure diagram of an image forming device provided by an embodiment of the present application is shown in FIG. 7.

[0028] Figure 6 A flow chart of another fixing temperature control method provided by an embodiment of the present application is shown in FIG. 8.

[0029] Figure 7 Another structure diagram of an image forming device provided by an embodiment of the present application is shown in FIG. 9.

[0030] Figure 8 A flow chart of another fixing temperature control method provided by an embodiment of the present application is shown in FIG. 10.

[0031] Figure 9 A structure diagram of an electronic device provided by an embodiment of the present application is shown in FIG. 11.

DETAILED DESCRIPTION

[0032] In order to better understand the technical solutions of the present application, the embodiments of the present application are described in detail below with reference to the drawings.

[0033] It should be clear that the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] The terms used in the embodiments of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application. The singular forms "a", "an" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0035] The present application can provide an image forming device, which can be in the form of an apparatus including but not limited to a printer, a copier, a multifunctional peripheral (MFP) integrating the functions of printing, copying, faxing, scanning, etc. in a single device, and a multi-functional peripheral (MFP) performing the above functions in a single device. The image forming device provided by the present application can be used to print images or characters on an imaging medium.

[0036] Specifically, the image forming device can include a fixing module, which can be used to fix a print medium on an imaging medium by heating. In order to prevent the fixing module from causing device failure or leading to a safety accident due to high temperature during heating, it is necessary to perform over-temperature protection on the fixing process.

[0037] Common technical solutions typically include a hardware protection circuit. When the fixing temperature exceeds a set threshold, the hardware protection circuit sends a signal to the SoC (System-on-a-Chip) of the image forming apparatus. The SoC then controls the firmware to shut down the fuser. However, this approach requires additional hardware, resulting in higher costs. Furthermore, the firmware-based fuser shutdown relies on the firmware's processing speed, which can lead to delayed responses. Additionally, if the firmware crashes, over-temperature protection will be unavailable.

[0038] This application is submitted to address the aforementioned issues.

[0039] Figure 1 This is a schematic diagram of the structure of an image forming apparatus provided in an embodiment of this application. Figure 1 As shown, the image forming apparatus provided in this application embodiment may include: a fixing module 110, a temperature detection module 120, a temperature acquisition module 130, and a control chip 140.

[0040] The temperature detection module 120 can be used to detect the operating temperature of the fixing module 110. The temperature detection module 120 can be, for example, a temperature sensor. To improve the accuracy of the temperature detection results, the temperature detection module 120 can be positioned close to the fixing module 110.

[0041] The temperature acquisition module 130 can receive the temperature data detected by the temperature detection module 120 and feed the temperature data back to the control chip 140.

[0042] The control chip 140 may integrate a fixing control module 141, which can be used to send an enable signal to the fixing module 110 to control the operation of the fixing module 110. In this embodiment, the fixing control module 141 may be configured with a target register 1411 and a comparator 1412. The target register 1411 may pre-store a temperature threshold.

[0043] The following is based on Figure 1 Taking the image forming apparatus shown as an example, the fixing temperature control method provided in this application will be described.

[0044] Figure 2 A flowchart illustrating a fixing temperature control method provided in an embodiment of this application. Figure 2 As shown, the fixing temperature control method provided in this application embodiment may include:

[0045] Step 101: The temperature detection module detects the first temperature of the fixing module.

[0046] Step 102: The temperature detection module sends the first temperature to the temperature acquisition module.

[0047] Step 103, the temperature collection module sends the first temperature to the fixing control module.

[0048] Step 104, the fixing control module acquires the pre-stored temperature threshold in the target register in response to the first temperature.

[0049] Step 105, the fixing control module compares the temperature threshold and the first temperature by using the comparator and generates a comparison result.

[0050] Step 106, the fixing control module controls the on-off of the heating of the fixing module based on the comparison result.

[0051] In the embodiment of the present application, when the image forming device is turned on and the fixing module 110 starts to run, the temperature detection module 120 can detect the running temperature of the fixing module 110 according to a set period, and the detected temperature value is expressed as the first temperature. Further, the temperature detection module 120 can send the detected first temperature to the temperature collection module 130, and the temperature collection module 130 sends the first temperature to the fixing control module 141 of the control chip 140. Alternatively, in another implementation manner, the temperature detection module 120 can also directly send the detected first temperature to the fixing control module 141 of the control chip 140.

[0052] Figure 3 A structure schematic diagram of the fixing control module 141 provided in the embodiment of the present application is shown in FIG. 2. As shown in FIG. 2, the fixing control module 141 can include an over-temperature detection unit 150 and an output control unit 160. The target register 1411 and the comparator 1412 can be located in the over-temperature detection unit 150. The fixing control module 141 can send an enable signal to the fixing module 110 through the output control unit 160 to control the fixing module 110 to be enabled. Figure 3

[0053] After the fixing control module 141 receives the first temperature, the pre-stored temperature threshold Vth can be read from the target register 1411, and then the first temperature and the temperature threshold Vth can be compared by using the comparator 1412. Specifically, the fixing control module 141 can input the first temperature and the temperature threshold Vth into the comparator 1412 respectively, and according to the output result of the comparator 1412, the comparison result of the first temperature and the temperature threshold Vth can be determined.

[0054] In the case that the first temperature is higher than the temperature threshold Vth according to the comparison result, the fixing control module 141 can stop sending the enable signal to the fixing module 110 through the output control unit 160, so as to stop enabling the fixing module 110, and the fixing module 110 stops heating, thereby realizing over-temperature protection.

[0055] ​In a possible implementation manner, after determining that the first temperature is higher than the temperature threshold Vth, the fixing control module 141 can immediately stop enabling the fixing module 110. Based on this implementation manner, the fixing module 110 can be stopped from continuing to heat at the first time when the over-temperature condition occurs, thereby improving safety.

[0056] Figure 4 Another structural diagram of the fixing control module 141 provided by the embodiment of the present application is provided. As shown in the figure, Figure 4 the fixing control module 141 provided by the embodiment of the present application can further be configured with a timing module 1413, and the number of comparators 1412 can be two, that is, a first comparator 14121 and a second comparator 14122.

[0057] Based on the fixing control module 141 shown in the figure, Figure 4 in another possible implementation manner of the embodiment of the present application, the fixing control module 141 can input the first temperature and the temperature threshold Vth into the first comparator 14121 respectively, after determining that the first temperature is higher than the temperature threshold Vth by using the first comparator 14121, the timing module 1413 can be started, and the time threshold T can be obtained from the target register 1411. Further, the fixing control module 141 can input the timing value of the timing module 1413 and the time threshold T into the second comparator 14122 respectively, to determine whether the first temperature is always higher than the temperature threshold Vth within the time threshold T. In the case of determining that the first temperature is always higher than the temperature threshold Vth within the time threshold T by using the second comparator 14122, the fixing control module 141 can stop enabling the fixing module 110. In the case of determining that the first temperature drops below the temperature threshold Vth before the time threshold T is reached, the fixing control module 141 can keep enabling the fixing module 110, and initialize the timing module 1413. The initialization of the timing module 1413 includes stopping timing and clearing timing data. Based on this implementation manner, the fixing module 110 can be prevented from being frequently turned off and turned on, which is beneficial to making the image forming apparatus run more smoothly and improving user experience.

[0058] In the above technical solution, the over-temperature protection is directly implemented by the control chip inside the image forming apparatus, without the need of separately setting an external hardware circuit, thereby saving the cost of the hardware circuit; and the fixing module is directly controlled by the fixing control module to turn off, which can accelerate the response speed of the over-temperature protection and improve the reliability of the over-temperature protection.

[0059] Figure 5 Another structural diagram of the image forming apparatus provided by the embodiment of the present application is provided. As shown in the figure, Figure 5 in the image forming apparatus provided by the embodiment of the present application, the control chip 140 further integrates an analog-digital conversion module 142, and the analog-digital conversion module 142 can be connected to the fixing control module 141.

[0060] Based on Figure 5 The image forming apparatus shown in the figure, such as Figure 6 As shown in the figure, in the embodiment of the present application, the above step 103 can be implemented as:

[0061] Step 201, the temperature acquisition module sends the first temperature to the analog-digital conversion module.

[0062] Step 202, the analog-digital conversion module converts the first temperature into a digital signal.

[0063] Step 203, the analog-digital conversion module sends the digital signal to the fixing control module.

[0064] In the embodiment of the present application, the temperature acquisition module 130 sends the first temperature to the analog-digital conversion module 142, and the first temperature can be an analog signal. The analog-digital conversion module 142 can be used to convert the first temperature into a second temperature, which can be a digital signal. Further, the analog-digital conversion module 142 can feed back the second temperature in the form of a digital signal to the fixing control module 141.

[0065] Figure 7 Another structure schematic diagram of an image forming apparatus provided by the embodiment of the present application is shown in the figure. Figure 7 As shown in the figure, in the image forming apparatus provided by the embodiment of the present application, the control chip 140 further integrates a filtering module 143, which can be connected to the analog-digital conversion module 142 and the fixing control module 141.

[0066] Based on Figure 7 The image forming apparatus shown in the figure, such as Figure 8 As shown in the figure, in the embodiment of the present application, the above step 203 can be implemented as:

[0067] Step 301, the analog-digital conversion module sends the converted digital signal to the filtering module.

[0068] Step 302, the filtering module filters the digital signal to obtain a filtered signal.

[0069] Step 303, the filtering module sends the filtered signal to the fixing control module.

[0070] In the embodiment of the present application, the analog-digital conversion module 142 can send the second temperature in the form of a digital signal to the filtering module 143. The filtering module 143 can be used to filter the digital signal to obtain a third temperature. Further, the filtering module 143 can feed back the third temperature after filtering to the fixing control module 141.

[0071] Further, in another embodiment of the present application, the control chip 140 further comprises a firmware, and after the fixing control module 141 stops enabling the fixing module 110, the firmware can also be sent an interrupt signal, and the interrupt signal can be used to inform the firmware of the over-temperature protection.

[0072] Figure 9 A structural schematic diagram of an electronic device provided by an embodiment of the present application is shown. Figure 9 As shown, the electronic device can include at least one processor, and at least one memory in communication with the processor, wherein the memory stores program instructions executable by the processor, and the processor invoking the program instructions can execute the fixing temperature control method provided by the embodiment of the present application.

[0073] The electronic device can be any image forming device such as a printing device or a copying device, and can also be a PC device, and the embodiment is not limited to the specific form of the electronic device.

[0074] Figure 9 A block diagram of an exemplary electronic device suitable for implementing the embodiments of the present application is shown. Figure 9 The electronic device shown is merely an example, and should not impose any limitation on the functions and use range of the embodiments of the present application.

[0075] As shown, Figure 9 The electronic device is in the form of a general computing device. The components of the electronic device can include, but are not limited to, one or more processors 410, a memory 430, and a communication bus 440 connecting different system components including the memory 430 and the processor 410.

[0076] The communication bus 440 represents one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, a graphics acceleration bus, a processor or local bus using any of a variety of bus architectures including, for example, an Industry Standard Architecture (ISA), Micro Channel Architecture (MCA) bus, Enhanced ISA bus, Video Electronics Standards Association (VESA) local bus, and a Peripheral Component Interconnect (PCI) bus.

[0077] Electronic devices typically include a variety of computer system readable media. These media can be any available media that is located either internally or externally to an electronic device. It includes storage of all types of computer system readable media, in both volatile and non-volatile versions, with removable and non-removable versions.

[0078] Memory 430 can include computer system readable media in the form of volatile memory, such as random access memory (RAM) and / or cache memory. Electronic device can further include other removable / non-removable, volatile / non-volatile computer system storage media. Although Figure 9 Although not shown in FIG. 4, as stated above, electronic device can also include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example, FIG. 4 illustrates a magnetic floppy diskette (hereinafter "floppy disk") 452 and a magnetic hard disk drive (hereinafter "hard disk drive") 454, which can be used for the non-volatile storage of data and data structures in some embodiments. Such computer system storage media, when it is not in use, can be transported for use in other computer systems via a removable storage media interface 452. In some embodiments, the floppy disk 452 can be used for the non-volatile storage of data and data structures. Although the floppy disk 452 is shown as a separate entity from the bus 440, in some embodiments, it could be integrated in the bus 440 or in the electronic device. In some embodiments, the hard disk drive 454 can be used for the non-volatile storage of data and data structures. Although the hard disk drive 454 is shown as a separate entity from the bus 440, in some embodiments, it could be integrated in the bus 440 or in the electronic device. The storage media 452, 454 described above and illustrated in FIG. 4, can be either one of several possible available data storage media implementation (e.g., a magnetic tape, several floppy diskettes, several hard disk drives, or a optical storage media such as a Compact Disc (CD), a Digital Video Disc (DVD), a Blu-ray Disc (BD), and / or any other storage media). The memory 430 can include at least one program product having a set (e.g., at least one) of program modules that are configured to carry out the functions of embodiments of the application.

[0079] The program / utility, having a set (at least one) of program modules, can be stored in memory 430 by way of example, and not limitation, an operating system, one or more application programs, other program modules, and program data. Each of the operating system, one or more application programs, other program modules, and program data, or some combination thereof, can include an implementation of a networking environment. Program modules generally carry out the functions and / or methodologies of embodiments of the application as described herein.

[0080] Electronic device can also communicate with one or more external devices such as a keyboard or a pointing device, displays, etc. via the communication interface 420 and with one or more devices that enable a user to interact with electronic device and / or one or more devices that enable electronic device to communicate with one or more other computing devices. Such communication can occur via the I / O interface 420. Still yet, electronic device can communicate with one or more networks such as a personal area network (PAN), a local area network (LAN), a metropolitan area network (MAN), and / or a wide area network (WAN) including the Internet via the network adapter (not shown). Figure 9The network adapter can communicate with the other modules of the electronic device through the communication bus 440. It should be understood that although Figure 9 Other hardware and / or software modules can be used in conjunction with the electronic device, as shown in FIG. 1, including, but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, redundant arrays of independent drives (RAID) systems, tape drives, and data archival storage systems, etc.

[0081] The processor 410 performs various functional applications and data processing by running programs stored in the memory 430, such as implementing the fixing temperature control method provided by the embodiments of the present application.

[0082] The embodiments of the present application also provide a computer readable storage medium, which stores computer instructions, and the computer instructions make the computer execute the fixing temperature control method provided by the embodiments of the present application.

[0083] The computer readable storage medium can adopt any combination of one or more computer readable media. The computer readable medium can be a computer readable signal medium or a computer readable storage medium. The computer readable storage medium can be, for example, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or apparatus, or any combination of the above. More specific examples (a non-exhaustive list) of the computer readable storage medium include: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM) or a flash memory, an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this document, the computer readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device or apparatus.

[0084] A computer readable signal medium can include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated signal can take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium can be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate or transport programming code.

[0085] Program code embodied on a computer readable medium can be transmitted using any appropriate medium, including but not limited to wireless, wire line, optical fiber cable, R.F, etc., or any suitable combination of the foregoing.

[0086] Computer program code for carrying out operations for aspects of the present application can be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C++ or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code can execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection can be made to an external computer (for example, through the Internet using an Internet Service Provider). In some embodiments, electronic circuitry including, for example, programmable logic circuitry, application specific circuitry, or field programmable gate array (FPGA) circuitry can execute the program code. Generally, program

[0087] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0088] Any processes or methods described in the flow charts or elsewhere in this application can be understood as representing code modules, segments, or portions of code which include one or more executable instructions for implementing specific logic functions (or steps) of the application, and / or that the various processes, methods, or algorithms described in this application can be understood as representing code modules, segments, or portions of code that include one or more executable instructions for implementing specific logic functions (or steps) of the application, and / or that the various processes, methods, or algorithms described in this application can be understood as being implemented by one or more code modules, segments, or portions of code.

[0089] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the above-described device embodiments are merely illustrative, for example, the division of the units is only a logical function division, and in actual implementation, another division manner can be adopted, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or other forms.

[0090] In addition, each functional unit in the various embodiments of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of hardware plus software functional unit.

[0091] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A fixing temperature control method characterized by, The application is applied to an image forming device, which comprises a fixing module, a temperature detecting module, a temperature collecting module and a control chip, the output of the temperature detecting module is connected with the input of the temperature collecting module, the output of the temperature collecting module is connected with the input of the control chip, the control chip is integrated with a fixing control module, the fixing control module is provided with a target register and a comparator, and the method comprises the following steps: The temperature detecting module detects the first temperature of the fixing module and sends the first temperature to the fixing control module through the temperature collecting module; the temperature collecting module receives the temperature data detected by the temperature detecting module and feeds back the temperature data to the control chip; The fixing control module acquires the pre-stored temperature threshold in the target register in response to the first temperature; The fixing control module compares the temperature threshold with the first temperature by using the comparator and generates a comparison result; The fixing control module controls the on-off of the heating of the fixing module based on the comparison result; The fixing control module is also provided with a timing module; the fixing control module controls the on-off of the fixing module based on the comparison result, which comprises the following steps: When the fixing control module determines that the first temperature is higher than the temperature threshold, the timing module is started to begin timing; The fixing control module determines that the first temperature is always higher than the temperature threshold within the pre-designed timing duration, and the heating of the fixing module is turned off; The method further comprises the following steps: The fixing control module determines that the first temperature is lower than the temperature threshold before the pre-designed timing duration is reached, and the timing module is initialized.

2. The method of claim 1, wherein, The control chip is also integrated with an analog-digital conversion module, and the analog-digital conversion module is connected with the fixing control module; The temperature detecting module sends the first temperature to the fixing control module through the temperature collecting module, which comprises the following steps: The temperature detecting module sends the first temperature to the analog-digital conversion module through the temperature collecting module; The analog-digital conversion module performs analog-digital conversion on the first temperature, obtains a converted digital signal and feeds back the converted digital signal to the fixing control module, so that the fixing control module controls the on-off of the heating of the fixing module based on the converted digital signal.

3. The method of claim 2, wherein, The control chip is also integrated with a filtering module, and the filtering module is connected with the analog-digital conversion module and the fixing control module respectively, and the method further comprises the following steps: The filtering module filters the digital signal converted by the analog-digital conversion module.

4. An image forming apparatus characterized by comprising: The application further provides an image forming device, which comprises a fixing module, a temperature detecting module, a temperature collecting module and a control chip, the output of the temperature detecting module is connected with the input of the temperature collecting module, the output of the temperature collecting module is connected with the input of the control chip, the control chip is integrated with a fixing control module, the fixing control module is provided with a target register and a comparator, and the method comprises the following steps: The temperature detecting module is used for detecting the first temperature of the fixing module and sending the first temperature to the fixing control module through the temperature collecting module; ​ The fixing control module is configured to obtain a temperature threshold pre-stored in the target register in response to the first temperature; The comparator is configured to compare the temperature threshold with the first temperature and generate a comparison result; The fixing control module is configured to control the on-off of the heating of the fixing module based on the comparison result; The fixing control module is further provided with a timing module; and the fixing control module is specifically configured to: start the timing module to start timing when it is determined that the first temperature is higher than the temperature threshold; turn off the heating of the fixing module when it is determined that the first temperature is always higher than the temperature threshold within a preset timing duration; The fixing control module is further configured to: initialize the timing module when it is determined that the first temperature is lower than the temperature threshold before the preset timing duration is reached.

5. The apparatus of claim 4, wherein, The control chip is further integrated with an analog-digital conversion module, and the analog-digital conversion module is connected to the fixing control module; The temperature detection module is specifically configured to: send the first temperature to the analog-digital conversion module through the temperature acquisition module; The analog-digital conversion module is configured to: perform analog-digital conversion on the first temperature, obtain a converted digital signal, and feed back the converted digital signal to the fixing control module, so that the fixing control module controls the on-off of the heating of the fixing module based on the converted digital signal.

6. The apparatus of claim 5, wherein, The control chip is further integrated with a filtering module, and the filtering module is connected to the analog-digital conversion module and the fixing control module respectively; The filtering module is configured to: filter the digital signal converted by the analog-digital conversion module.

7. A control chip, characterized by The fixing control module is provided with a target register and a comparator; an input of the fixing control module is connected to an output of a temperature acquisition module, and an output of the fixing control module is connected to a fixing module; The fixing control module is configured to receive a first temperature of the fixing module sent by a temperature detection module through a temperature acquisition module; obtain a temperature threshold pre-stored in the target register; The comparator is configured to compare the temperature threshold with the first temperature and generate a comparison result; The fixing control module is configured to control the on-off of the heating of the fixing module based on the comparison result; The fixing control module is further provided with a timing module; and the fixing control module is specifically configured to: start the timing module to start timing when it is determined that the first temperature is higher than the temperature threshold; turn off the heating of the fixing module when it is determined that the first temperature is always higher than the temperature threshold within a preset timing duration; The fixing control module is further configured to: initialize the timing module when it is determined that the first temperature is lower than the temperature threshold before the preset timing duration is reached. The control chip is further integrated with an analog-digital conversion module, and the analog-digital conversion module is connected to the fixing control module; and the fixing control module is specifically configured to:

8. The chip of claim 7, wherein, receive a digital signal sent by the analog-digital conversion module, the digital signal being obtained by the analog-digital conversion module performing analog-digital conversion on the first temperature, the first temperature being sent by the temperature detection module to the analog-digital conversion module through the temperature acquisition module. ​ 9. The chip of claim 8, wherein, The control chip is also integrated with a filtering module, which is connected with the A / D conversion module and the fixing control module respectively; the fixing control module is specifically used for: receiving the filtered signal sent by the filtering module, wherein the filtered signal is obtained by filtering the digital signal sent by the A / D conversion module to the filtering module.

10. An electronic device, comprising: comprise: at least one processor; and at least one memory connected with the processor in communication, wherein: the memory stores program instructions executable by the processor, and the processor calling the program instructions can execute the method of any one of claims 1 to 3.

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