LED transparent display screen

Abstract

In order to overcome the problems of low reliability, high process requirement, not friendly to environment, easy to cause power line fracture due to thermal expansion and cold contraction, and low product yield and increased cost of the transparent LED display screen in the prior art, the present application provides a transparent LED display screen; the transparent LED display screen provided by the present application replaces the existing power supply line by adopting relay pads and thickening the binding wire between the relay pads to realize power supply; while ensuring the power supply capacity through the thickened binding wire in parallel, the overall transparency of the transparent LED display screen is further improved. Without forming a power supply line on the transparent substrate, the problem of poor adhesion of the power supply line does not need to be considered, and a complex chemical process is not needed for treatment, so that the process requirement is lower and the environment is more friendly. The stability of the power supply capacity is ensured, the yield is improved, and the cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of LEDs, and more particularly to the field of transparent LED displays. Background Technology

[0002] Transparent LED displays are gradually gaining widespread application in the market and have developed into various product forms. A technology for transparent LED displays that uses an array of LED beads distributed on a transparent substrate has begun to emerge.

[0003] For example, such as Figure 1 As shown, an improved transparent LED display screen is provided, comprising a transparent substrate 1', on which a printed circuit layer 3' is provided, and an array of LED beads 2' encapsulated with chips is mounted on the transparent substrate 1'; then, a potting layer 5' is formed by potting adhesive on the surface of the transparent substrate 1' where the LED beads 2' are arranged; then, a protective cover plate 4' is covered on the surface of the potting layer; as shown. Figure 2 As shown, specifically, the printed circuit layer 3' includes LED chip soldering areas 31', power pads 32', and signal pads 33'. Each LED chip soldering area 31' has two signal pin pads and two electrode pin pads. The signal pin pads are connected in series through printed signal lines, while the two electrode pin pads with opposite polarities are connected to the power pads 32' through metal meshes 30' printed on the transparent substrate 1' for power supply. The pins of the LED chip 2' are soldered to the aforementioned signal pin pads and electrode pin pads.

[0004] This method has certain advantages, namely that the power supply metal grid 30' can be directly formed on the transparent substrate 1' through the printing process to serve as the power supply circuit; however, since the thickness of the printed pattern layer 3' is generally only about 35 micrometers, the current that each metal wire on the formed metal grid 30' can carry is very small. Therefore, the area of ​​the metal grid 30' must be widened to meet the power supply requirements of the LED beads 2', and the spacing between each LED bead 2' cannot be reduced, so the resolution of the transparent LED display screen cannot be improved; moreover, the metal grid 30' will reduce the transparency of the transparent substrate 1' to some extent.

[0005] like Figure 3As shown, another type of transparent LED display screen uses a power supply line 6' directly connected to the electrode pin pads of the LED chip soldering area for power supply. The LED chips 2' are connected in series via a signal line 7'. The power supply line 6' is divided into a positive power supply line 6a' and a negative power supply line 6b'. One positive power supply line 6a' and one negative power supply line 6b' are respectively set on both sides of each row of LED chips 2'. This method can reduce the gap between LED chips 2' to some extent, but in actual production, it was found that forming power lines on the transparent substrate is not easy, especially when the transparent substrate is glass, resulting in weak adhesion and low reliability. Chemical treatment of the transparent substrate is required to form the power lines, which has higher process requirements and is environmentally unfriendly. Furthermore, due to thermal expansion and contraction between the transparent substrate and the power lines, the power lines are prone to breakage, causing the LED chips to lose power, resulting in low product yield and increased costs. Summary of the Invention

[0006] To overcome the problems of low reliability, high process requirements, environmental unfriendliness, and easy circuit breakage due to thermal expansion and contraction in existing transparent LED displays, resulting in low product yield and increased costs, this invention provides a transparent LED display.

[0007] This invention provides a transparent LED display screen, including a transparent substrate and LED beads arranged in an array on the transparent substrate; each of the LED beads is powered through a power supply line;

[0008] The power supply line includes a plurality of relay pads, the relay pads including first relay pads and second relay pads with opposite polarities; wherein the first relay pads are connected to each other by a plurality of thickened binding lines to form the first power supply line; the second relay pads are connected to each other by a plurality of thickened binding lines to form the second power supply line.

[0009] The LED beads are electrically connected to the first relay pad on the first power supply line and the second relay pad on the second power supply line to draw power from the first power supply line and the second power supply line.

[0010] The transparent LED display screen provided by this invention replaces existing power supply lines by using relay pads and thickened bonding lines between them to achieve power supply. While ensuring power supply capability through the thickened bonding lines, these lines are almost invisible to the naked eye, minimizing their impact on viewing angle and thus further improving the overall transparency of the transparent LED display screen. Since there is no need to form power lines on the transparent substrate, issues related to weak adhesion of power lines are eliminated, and complex chemical processes are not required, resulting in lower process requirements and greater environmental friendliness. Because the thickened bonding lines are arc-shaped during bonding, they possess a certain deformation buffering capacity. Even with thermal expansion and contraction of the transparent substrate, the thickened bonding lines will not break, ensuring stable power supply capability, improving yield, and reducing costs.

[0011] Furthermore, the first relay pads on the same row or column are connected by i thick binding lines to form the first power supply line; the second relay pads on the same row or column are connected by j thick binding lines to form the second power supply line; wherein i ≥ 3; and j ≥ 3.

[0012] Furthermore, at least some of the LED beads are directly or indirectly bonded to the first relay pad on the first power supply line and the second relay pad on the second power supply line via power jumpers.

[0013] Furthermore, the LED beads are of TOP type or CHIP type structure.

[0014] Furthermore, the transparent substrate is provided with a circuit pattern; the circuit pattern includes power pads, signal pads and LED chip soldering areas arranged in an array, and the LED chips are soldered on the LED chip soldering areas;

[0015] Each of the LED chip soldering areas is provided with a pin pad corresponding to the pin of the LED chip; the pin pad includes a signal pin pad and an electrode pin pad; the electrode pin pad includes a first electrode pin pad and a second electrode pin pad with opposite polarities;

[0016] The signal pads and signal pin pads on the LED chip solder area are connected by signal lines to realize the series connection of the LED chips. This allows the control signal for controlling the on / off state of each LED chip to be input from the signal pads through the signal lines and then transmitted sequentially through each series-connected LED chip.

[0017] The first electrode pin pad on the lamp bead soldering area is directly or indirectly connected to the first relay pad on the first power supply line; the second electrode pin pad on the lamp bead soldering area is directly or indirectly connected to the second relay pad on the second power supply line.

[0018] Furthermore, at least some of the first electrode pin pads on the lamp bead soldering area are directly or indirectly connected to the first relay pad corresponding to the lamp bead soldering area via power jumpers; the second electrode pin pads on the lamp bead soldering area are directly or indirectly connected to the second relay pad corresponding to the lamp bead soldering area via power jumpers.

[0019] Furthermore, the diameter of the thickened binding line is 50-200 μm.

[0020] Furthermore, the relay pad is a metal sheet adhered to the transparent substrate; the thickness of the metal sheet is 0.1-1 mm; and the area of ​​the metal sheet is 0.25-10 square millimeters.

[0021] Furthermore, the transparent substrate is a flexible transparent substrate.

[0022] Furthermore, the LED bead is a bare LED bead without a casing; the bare LED bead without a casing includes a driver chip and a light-emitting chip; the light-emitting chip is mounted on the driver chip.

[0023] Furthermore, the circuit pattern has N rows * M columns of LED bead soldering areas;

[0024] The circuit pattern has M signal pads arranged on it; the M signal pads are connected in series with the signal pin pads in the N LED chip solder areas in the same column through signal lines.

[0025] Alternatively, the circuit pattern has N signal pads arranged on it; the N signal pads are connected in series with the signal pin pads in the M LED chip soldering areas on the same row through signal lines.

[0026] Furthermore, the circuit pattern is provided with 2M power pads or 2N power pads.

[0027] Each column or row of the lamp bead soldering area is provided with a first power supply line and a second power supply line on each side;

[0028] The first electrode pin pad on each column or row of the lamp bead soldering area is connected to the first relay pad on its corresponding first power supply line via a power jumper; the second electrode pin pad on the lamp bead soldering area is connected to the second relay pad on its corresponding second power supply line via a power jumper.

[0029] Furthermore, the circuit pattern is provided with M+1 power pads or N+1 power pads.

[0030] The M+1 power pads or N+1 power pads include first power pads and second power pads with opposite polarities that are spaced apart.

[0031] The power supply line includes a plurality of first power supply lines and second power supply lines arranged in a column or row at intervals; each first power pad is electrically connected to the first power supply line, and each second power pad is electrically connected to the second power supply line.

[0032] The first and second power supply lines arranged in a column are arranged side-by-side with the LED beads in each column at intervals; or the first and second power supply lines arranged in a row are arranged side-by-side with the LED beads in each row at intervals.

[0033] The first electrode pin pad on the lamp bead soldering area is connected to the first relay pad on the nearest first power supply line via a power jumper; the second electrode pin pad on the lamp bead soldering area is connected to the second relay pad on the nearest second power supply line via a power jumper.

[0034] This method can improve the transparency of the transparent LED display to a certain extent. At the same time, each LED can be bonded to the relay pad on the nearby power supply line, which makes the bonding process simpler and more efficient.

[0035] Furthermore, the positions of the first electrode pin pads and the second electrode pin pads on the lamp bead solder areas of adjacent rows or adjacent columns are opposite;

[0036] The LEDs on adjacent rows or columns are installed at angles that differ by 180°. This method allows for a more uniform spacing between the first and second power supply lines.

[0037] Furthermore, the positions of the first electrode pin pads and the second electrode pin pads on the lamp bead solder areas of adjacent rows or adjacent columns are opposite;

[0038] In this design, first and second LEDs with oppositely arranged electrode pins are installed on the LED soldering areas of adjacent rows or columns. This structure ensures that the positions of the light-emitting chips in the specially designed first and second LEDs are relatively fixed, preventing color differences among the LEDs due to pin variations.

[0039] Furthermore, the power supply line includes a row or column of the first power supply line and a row or column of the second power supply line;

[0040] At least some of the first electrode pin pads on the lamp chip soldering area are connected to the first relay pad on the first power supply line via power jumpers, and some of the first electrode pin pads on the lamp chip soldering area are connected to the first electrode pin pads on adjacent lamp chip soldering areas via power jumpers.

[0041] At least some of the second electrode pin pads on the lamp chip soldering area are connected to the second relay pad on the second power supply line via power jumpers, and some of the second electrode pin pads on the lamp chip soldering area are connected to the second electrode pin pad on the adjacent lamp chip soldering area via power jumpers.

[0042] By adopting the above-mentioned optimized structure, the number of power supply lines can be reduced as much as possible, while power jumpers can be added to power the LED beads. This method can further improve their transparency.

[0043] Furthermore, the signal lines are signal jumpers, which are used to bond the signal pin pads and the individual LED beads. Using jumpers in this way further improves the transparency of the signal lines.

[0044] Furthermore, a potting layer is provided on the transparent substrate on which the LED beads are mounted, and the potting layer cures each LED bead therein; a protective cover plate is provided on the upper surface of the potting layer. Attached Figure Description

[0045] Figure 1 This is a cross-sectional schematic diagram of a transparent LED display screen provided in the prior art;

[0046] Figure 2 This is a top view schematic diagram of an existing LED transparent display screen;

[0047] Figure 3 This is a top view of the second type of transparent LED display screen provided in the prior art;

[0048] Figure 4 This is a first-view cross-sectional schematic diagram of the first type of LED transparent display screen provided in a specific embodiment of the present invention;

[0049] Figure 5 This is a second-view cross-sectional schematic diagram of the first type of LED transparent display screen provided in a specific embodiment of the present invention;

[0050] Figure 6 This is a top view schematic diagram of the first type of LED transparent display screen (before LED beads are installed) provided in a specific embodiment of the present invention;

[0051] Figure 7 yes Figure 6 Enlarged view of point A in the middle;

[0052] Figure 8 This is a top view schematic diagram of the first type of LED transparent display screen (after installing LED beads) provided in a specific embodiment of the present invention;

[0053] Figure 9This is a three-dimensional schematic diagram of LED beads provided in a specific embodiment of the present invention;

[0054] Figure 10 This is a top view schematic diagram of the second type of LED transparent display screen (before installing LED beads) provided in a specific embodiment of the present invention;

[0055] Figure 11 yes Figure 10 Enlarged view of point B in the middle;

[0056] Figure 12 This is a top view schematic diagram of the second type of LED transparent display screen (after installing LED beads) provided in a specific embodiment of the present invention; Figure 13a This is a top view schematic diagram of the first LED bead provided in a specific embodiment of the present invention;

[0057] Figure 13b This is a top view schematic diagram of the second LED provided in a specific embodiment of the present invention;

[0058] Figure 14 This is a cross-sectional schematic diagram of the third type of LED transparent display screen provided in a specific embodiment of the present invention;

[0059] Figure 15 This is a top view schematic diagram of the third type of LED transparent display screen provided in a specific embodiment of the present invention;

[0060] Figure 16 This is a top view schematic diagram of the fourth type of LED transparent display screen provided in a specific embodiment of the present invention.

[0061] The reference numerals in the background section are as follows:

[0062] 1' Transparent substrate; 2' LED beads; 3' Printed circuit layer; 4' Protective cover; 5' Encapsulation layer; 6' Power supply line; 7' Signal line; 6a' Positive power supply line; 6b' Positive power supply line;

[0063] 30', Metal mesh; 31', LED chip soldering area; 32', Power pad; 33', Signal pad;

[0064] The reference numerals in the accompanying drawings are as follows:

[0065] 1. Transparent substrate; 2. LED beads; 3. Circuit pattern; 4. Protective cover; 5. Encapsulation layer; 2a. First LED bead; 2b. Second LED bead; 20. Light-emitting chip; 21. Driver chip; 22. Housing; 23. Pins; 20r. Red light-emitting chip; 20g. Green light-emitting chip; 20b. Blue light-emitting chip; 231. Input signal pin; 232. Output signal pin; 233. First electrode pin; 234. Second electrode pin; 30. LED bead solder pad; 30a. First electrode pin pad 30b, Second electrode pin pad; 30c, Input signal pin pad; 30d, Output signal pin pad; 31, Power supply line; 31a, First power supply line; 31b, Second power supply line; 32, Signal line; 33, Signal pad; 34, Power pad; 34a, First power pad; 34b, Second power pad; 311, Power jumper; 312, Bold bonding wire; 313, Relay pad; 313a, First relay pad; 313b, Second relay pad; 321, Signal jumper. Detailed Implementation

[0066] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0067] In the description of this invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0068] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0069] Example

[0070] Please combine Figures 4-8To understand, the transparent LED display provided in this example, like the prior art, also includes a transparent substrate 1 and LED beads 2 arranged in an array on the transparent substrate 1; each of the LED beads 2 is powered through a power supply line 31;

[0071] The key point in this example lies in the design of the power supply line 31. In this example, the power supply line 31 includes several relay pads 313, and the relay pads 313 include first relay pads 313a and second relay pads 313b with opposite polarities. The first relay pads 313a are connected to each other by several thickened binding lines 312 to form the first power supply line 31a; the second relay pads 313b are connected to each other by several thickened binding lines 312 to form the second power supply line 31b.

[0072] The LED beads 2 are electrically connected to the first relay pad 313a on the first power supply line 31a and the second relay pad 313b on the second power supply line 31b, so as to draw power from the first power supply line and the second power supply line.

[0073] When the LED bead 2 draws power from the first relay pad 313a and the second relay pad 313b, various methods known to those skilled in the art can be used. For example, as described in several patents previously filed by the applicant, a circuit pattern can be etched on the transparent substrate 1, and then the LED bead 2 can be soldered onto the circuit pattern to draw power. Alternatively, power can be drawn through a jumper connection. Specific examples of this embodiment will be provided below.

[0074] The LED bead 2 can be a conventional LED bead 2 well known to those skilled in the art, such as a common TOP-type or CHIP-type LED bead with a housing. Alternatively, it can be a bare LED bead as described in the applicant's previous patent applications. A bare LED bead has no housing and only a driver chip and a light-emitting chip. That is, the housing-less bare LED bead includes a driver chip and a light-emitting chip; the light-emitting chip is mounted on the driver chip.

[0075] Conventional LED beads 2 and bare LED beads can also be fixed to the transparent substrate 1 by adhesive, and then power is drawn from the first relay pad 313a and the second relay pad 313b by jumper wire bonding. Alternatively, mounting pads can be provided on the transparent substrate 1, the LED beads 2 can be soldered to the mounting pads, and connected to the mounting pads on the transparent substrate 1 by jumper wire bonding.

[0076] Regarding the number of thickened binding lines 312, if the power supply capacity is sufficient, it is also possible to set one thickened binding line 312 between relay pads 313. As a preferred method, it is preferable that the first relay pads 313a on the same row or column are connected by i thickened binding lines 312 to form the first power supply line 31a; the second relay pads 313b on the same row or column are connected by j thickened binding lines 312 to form the second power supply line 31b; wherein i ≥ 3; and j ≥ 3.

[0077] The following will use conventional LED beads as an example, with reference to the accompanying drawings, to further explain and illustrate the transparent LED display screen disclosed in this invention. Figures 4-8 As shown, it includes a transparent substrate 1 and LED beads 2; the transparent substrate 1 is provided with a circuit pattern 3; the circuit pattern 3 includes a power pad 34, a signal pad 33 and an array of LED bead soldering areas 30 for mounting the LED beads 2.

[0078] A potting layer 5 is provided on the transparent substrate 1 on which the LED beads 2 are arranged, and the potting layer 5 cures each LED bead 2 therein; a protective cover plate 4 is provided on the upper surface of the potting layer 5. The above-mentioned potting encapsulation to form the potting layer 5 and the provision of the protective cover plate 4 are known to the public and will not be described in detail here.

[0079] Each of the LED chip soldering areas 30 is provided with a pin pad corresponding to the pin 23 of the LED chip 2; the pin pad includes a signal pin pad and an electrode pin pad; the electrode pin pad includes a first electrode pin pad 30a and a second electrode pin pad 30b with opposite polarities; the signal pin pad includes an input signal pin pad 30c and an output signal pin pad 30d.

[0080] The circuit pattern 3 also includes several power supply lines 31 and signal lines 32; the power pads 34 are also divided into first power pads 34a and second power pads 34b according to polarity; the power supply lines 31 include first power supply lines 31a and second power supply lines 31b with opposite polarities; the first power supply line 31a is connected to the first power pad 34a; the second power supply line 31b is connected to the second power pad 34b. That is, the first power supply line 31a and the first power pad 34a have the same polarity, and the second power supply line 31b and the second power pad 34b have the same polarity. If the first power supply line 31a and the first power pad 34a are positive, then the second power supply line 31b and the second power pad 34b are negative. Conversely, if the first power supply line 31a and the first power pad 34a are negative, then the second power supply line 31b and the second power pad 34b are positive.

[0081] The number of first power supply lines 31a and second power supply lines 31b can be one or more, and the number of first power supply lines 31a and second power supply lines 31b can be the same or different. The specific number of first power supply lines 31a and second power supply lines 31b can also be determined according to the specific number of LED beads 2. The form of the power supply lines 31 can be straight, curved, or serpentine, etc. Preferably, each power supply line 31 is arranged in a row or column, and the implementation method is not limited, as long as it can provide power.

[0082] The signal pad 33 and the signal pin pad on the lamp bead soldering area 30 are connected in series through the signal line 32 to realize the series connection of LED lamp beads 2, so that the control signal for controlling the on and off of each LED lamp bead 2 can be input from the signal pad 33 through the signal line 32 and then transmitted sequentially through each series-connected LED lamp bead 2.

[0083] In this example, specifically, the signal line 32 is set between the signal pad 33 and the signal pin pad in the lamp bead soldering area 30, and between the signal pin pads in adjacent lamp bead soldering areas 30 in the same row or column. The LED lamp beads 2 are connected in series through the signal line 32, so that the control signal for controlling the on and off of each LED lamp bead 2 can be input from the signal pad 33 through the signal line 32 and then transmitted sequentially through each connected LED lamp bead 2.

[0084] In this example, the signal line 32 can be implemented in a publicly known manner, and the implementation method of the signal line 32 is not limited. Besides the conventional implementation of the signal line 32, signal transmission can also be achieved using jumpers. For distinction, the jumper used to implement the signal line 32 is referred to as signal jumper 321, that is, the bonding connection between the signal pin pads and each LED bead 2 is achieved using signal jumper 321. Using this method, and also employing jumpers for the signal line 32, further enhances its transparency.

[0085] The power supply line 31 includes a plurality of relay pads 313 corresponding to the lamp bead soldering area 30. The relay pads 313 include a first relay pad 313a and a second relay pad 313b with opposite polarities. The first relay pads 313a on the same row or column are connected by i thickened binding lines 312 and electrically connected to the first power pad 34a to form a first power supply line 31a. The second relay pads 313b on the same row or column are connected by j thickened binding lines 312 and electrically connected to the second power pad 34b to form a second power supply line 31b. The i ≥ 3 and the j ≥ 3. The i and j can be the same or different.

[0086] The relay pad 313 and the power pad 34 can be electrically connected via printed circuitry or via the thickened bonding lines 312. In this example, the first power pad 34a and the first relay pad 313a are also electrically connected via i thickened bonding lines 312, and the second power pad 34b and the second relay pad 313b are also electrically connected via j thickened bonding lines 312.

[0087] The first electrode pin pad 30a on the LED chip soldering area 30 is directly or indirectly connected to the first relay pad 313a on the first power supply line 31a; the second electrode pin pad 30b on the LED chip soldering area 30 is directly or indirectly connected to the second relay pad 313b on the second power supply line 31b. All electrical connections referred to here ultimately connect to the relay pad 313, drawing power from it. A direct electrical connection means a direct connection to the relay pad 313 via a line, while an indirect electrical connection may not necessarily be a direct connection to the relay pad 313, but can instead connect to an electrode pin pad of the same polarity on another LED chip soldering area 30, also achieving power drawing.

[0088] There are many ways to make electrical connections. Electrical connections can be made by connecting relay pads 313 through etched lines on the LED chip solder area 30, or by using power jumpers 311. Preferably, at least a portion of the first electrode pin pads 30a on the LED chip solder area 30 are directly or indirectly connected to the corresponding first relay pads 313a of the LED chip solder area 30 via power jumpers 311; the second electrode pin pads 30b on the LED chip solder area 30 are directly or indirectly connected to the corresponding second relay pads 313b of the LED chip solder area 30 via power jumpers 311.

[0089] Preferably, the relay pad 313 is a metal sheet adhered to the transparent substrate 1; the thickness of the metal sheet is 0.1-1 mm; the area of ​​the metal sheet is 0.25-10 square millimeters. The metal sheet can be made of copper, nickel, aluminum, or other alloy materials.

[0090] Regarding the transparent substrate 1, a transparent glass substrate 1 or a flexible transparent substrate can be selected. Flexible transparent substrates are generally made of transparent materials such as PC (Polycarbonate), PET (Polyethylene terephthalate), and PMMA (polymethyl methacrylate). The solution in this application performs better when applied to a flexible transparent substrate.

[0091] For the sake of distinction, the jumper that implements signal line 32 is called signal jumper 321. That is, signal jumper 321 is used to achieve the bonding connection between signal pin pads and each LED bead 2. By using this method, signal line 32 can also be made transparent by using jumpers.

[0092] The signal jumper 321, power jumper 311, and thickened bonding wire 312 mentioned in this application are essentially all bonding wires or jumpers, but they differ in parameters, resulting in different diameters. The diameters of power jumper 311 and signal jumper 321 are generally relatively small, typically between 17.5-50 μm. The diameter of the thickened bonding wire 312 in this application is preferably 50-200 μm. Regarding the method of using jumpers to achieve bonding connections, it can be referenced from the method used in LED beads 2, requiring no further inventive effort from those skilled in the art. Jumpers, also generally called bonding wires or bonding wires, typically include gold wire, copper wire, palladium-plated copper wire, and alloy wire, etc.

[0093] Among them, such as Figures 4-8 As shown, the circuit pattern 3 has N rows * M columns of LED bead soldering areas 30; in this example, it is assumed that N = 4 and M = 4. Of course, this application is not limited to a regular arrangement of LED beads 2, and it can also be an irregular transparent LED display screen.

[0094] The circuit pattern 3 has M signal pads 33 arranged on it; the M signal pads 33 and the signal pin pads in the N lamp bead soldering areas 30 in the same column are connected in series by signal lines 32.

[0095] Alternatively, N signal pads 33 are arranged on the circuit pattern 3; the N signal pads 33 are connected in series with the signal pin pads in the M LED chip soldering areas 30 on the same row through signal lines 32.

[0096] In the above method, a signal pad 33 is applied to each row or column. However, multiple rows or columns can also be connected to a single signal pad 33, and the LED beads 2 on the row or column can be connected in a serpentine manner, for example.

[0097] like Figures 4-8 As shown, in one implementation, the circuit pattern has 2M power pads (or 2N power pads); in this example, the power supply line 31 includes 4 columns of the first power supply line 31a and 4 columns of the second power supply line 31b.

[0098] Each column (or each row) of the lamp bead soldering area 30 is provided with a first power supply line 31a and a second power supply line 31b on each side respectively;

[0099] The first electrode pin pad 30a on each column (or each row) of the lamp bead soldering area 30 is connected to the first relay pad 313a on its corresponding first power supply line 31a via a power jumper 311; the second electrode pin pad 30b on the lamp bead soldering area 30 is connected to the second relay pad 313b on its corresponding second power supply line 31b via a power jumper 311.

[0100] Among them, the LED lamp beads 2 are as follows Figure 9 As shown, an LED bead 2 generally includes a housing 22, a driver chip 21, and a light-emitting chip 20; wherein, the light-emitting chip 20 includes a first light-emitting chip, a second light-emitting chip, and a third light-emitting chip;

[0101] A chip mounting surface is formed on the housing 22, and pins 23 are led out from the chip mounting surface; the driver chip 21 is mounted on the housing 22; the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are mounted on the driver chip 21; the first electrode pin 233 and the second electrode pin 234 are soldered to the electrode pin pads on the lamp bead soldering area 30; the input signal pin 231 and the output signal pin 232 are respectively soldered to the signal pin pads on the lamp bead soldering area 30.

[0102] For example, in this case, the first light-emitting chip is a red light-emitting chip 20r, the second light-emitting chip is a green light-emitting chip 20g, and the third light-emitting chip is a blue light-emitting chip 20b. As shown in the figure, the red light-emitting chip 20r, the green light-emitting chip 20g, and the blue light-emitting chip 20b are sequentially mounted on the driver chip 21. If the LED bead 2 is rotated 180 degrees, the order of the light-emitting chips in the LED bead 2 will change to: blue light-emitting chip 20b, green light-emitting chip 20g, and red light-emitting chip 20r. This will result in a slight color difference.

[0103] In this example, the LED bead 2 is a TOP-type structure. A TOP-type structure refers to a structure that uses a PLCC (Plastic Leaded Chip Carrier) plastic bracket as the housing (also called a bracket or base) 22. The leads 23 of the PLCC plastic bracket package structure are bent inwards at the bottom. The manufacturing process is publicly known and generally includes metal strip punching, electroplating, PPA (polyphthalamide) injection molding, bending, and five-sided inkjet printing. The core process involves forming a chip mounting surface (not marked in the diagram) on the surface of the plastic bracket using metal strip; and the leads 23 extend from the chip mounting surface and are bent inwards at the bottom before being attached to the bottom of the plastic bracket for subsequent surface mount soldering.

[0104] In this example, the chip mounting surface is used to mount the driver chip 21 and the light-emitting chip; it includes isolation channels and pads that are isolated from each other by the isolation channels, with pins 23 leading out from the pads; in this example, the pads are actually metal sheets of the same material as the pins 23, which are stamped and the empty spaces are filled by injection molding to form the isolation channels. The isolation channels are actually insulating plastic materials that separate the pins 23 and also serve to fix the outer casing 22. Specifically, the pads include electrode pads and input / output pads; the electrode pads include cathode pads and anode pads; the input / output pads include input pads and output pads; the pins 23 include electrode pins and signal pins, wherein the electrode pins include positive pins and negative pins; the signal pins include signal input pins and signal output pins; positive pins are led out from the cathode pad; negative pins are led out from the anode pad. Signal input pins are led out from the input pads, and signal output pins are led out from the output pads. The aforementioned electrode pins are soldered to electrode pin pads, and signal pins are soldered to signal pin pads, thereby soldering the LED bead 2 onto the bead soldering area 30.

[0105] The driver chip 21 is publicly known. Generally, the driver chip 21 integrates a driver circuit and has a passivation layer, which is a surface insulating layer formed during the manufacturing process of the driver chip 21. The driver chip 21 has several pins (or terminals), which are electrically connected to the chip mounting surface and the light-emitting wafer via direct soldering or bonding wires. Pins (English name: PAD) are generally located on the passivation layer and are terminals inside the chip.

[0106] The TOP-type package structure in this example can also be replaced with a CHIP-type package structure. Its outer shell 22 is formed by a circuit board (PCB). The copper foil on the front side of the PCB is etched to form the chip mounting surface; that is, after the PCB is etched, the etched areas form isolation channels, and the unetched areas form pads. Pins 23 are formed on its back side; these pins 23 are electrically connected to the chip mounting surface (i.e., the pads) through conductive vias. The circuit board typically uses insulating materials such as glass epoxy resin or polyimide as a substrate, forming conductive patterns and printed wiring on the surface and underside of the circuit board. The CHIP-type package structure is publicly known and will not be described further.

[0107] Figure 6 The schematic diagram shown illustrates the installation of LED bead 2 on the LED bead soldering area 30. When binding the power jumper 311, it can be done first, followed by the installation of the LED bead 2. Preferably, the LED bead 2 is installed first, followed by the binding of the power jumper 311. When binding the power jumper 311, the binding point should be on top of the power supply line 31. Simultaneously, the binding point on the electrode pin pad should not overlap with the projection of the LED bead 2. The binding point should be on the exposed portion of the electrode pin pad, and the machine can bond and solder within a 0.1-0.5mm area.

[0108] As a preferred approach, the power supply line 31 can be arranged in an intermittent manner. For example, several columns or rows of LED bead soldering areas 30 (i.e., several columns or rows of LED beads 2) can share a single power supply line 31. The specific arrangement depends on the number of LED beads 2 that the power supply line 31 can power.

[0109] As a preferred method, such as Figures 10-12 As shown, the circuit pattern 3 has M+1 power pads or N+1 power pads 34 arranged on it; in this example, M=4, with a total of 5 columns of power pads 34 are arranged.

[0110] The M+1 power pads 34 or N+1 power pads include first power pads 34a and second power pads 34b with opposite polarities, which are spaced apart; in this example, there are 3 first power pads 34a and 2 second power pads 34b.

[0111] The power supply line 31 includes a plurality of first power supply lines 31a (e.g., 3 columns) and second power supply lines 31b (e.g., 2 columns) arranged in a row at intervals; each first power pad 34a is electrically connected to the first power supply line 31a, and each second power pad 34b is electrically connected to the second power supply line 31b.

[0112] The first power supply line 31a and the second power supply line 31b arranged in a row are arranged side by side with the LED beads 2 in each row at intervals; (the first power supply line 31a and the second power supply line 31b arranged in a row are also arranged side by side with the LED beads 2 in each row at intervals).

[0113] The first electrode pin pad on the lamp bead soldering area 30 is connected to the first relay pad 313a on the nearest first power supply line 31a via a power jumper 311; the second electrode pin pad on the lamp bead soldering area 30 is connected to the second relay pad 313b on the nearest second power supply line 31b via a power jumper 311.

[0114] This method can improve the transparency of the transparent LED display to a certain extent. Simultaneously, each LED bead 2 can be bonded to a nearby power supply line 31, making the bonding process simpler and more efficient. Taking a transparent LED display with a pixel pitch of 10mm as an example, if the line width of the power supply line 31 is 1mm, if the original row of LED beads 2 is connected to two power supply lines 31 with opposite polarities (such as...)... Figure 3 If the pixel pitch is reduced to a single power supply line 31 (as shown), the transparency will increase by 1 / 10, or 10%. If the pixel pitch is even smaller, such as 5mm, it will increase by 1 / 5, or 20%, which is a very noticeable effect.

[0115] Regarding the aforementioned method of spacing the power supply lines 31, to minimize the thread length, it is preferable to reverse the positions of the first electrode pin pads 30a and second electrode pin pads 30b on the lamp bead soldering areas 30 of adjacent columns; and when installing identical LED beads 2, the installation angles of the LED beads 2 on the lamp bead soldering areas 30 of adjacent columns should differ by 180°. That is, each LED bead 2 should be rotated 180 degrees before installation. This method allows for a more uniform spacing between the first power supply lines 31a and the second power supply lines 31b. However, this method also has minor drawbacks.

[0116] The applicant devised a method to solve the color difference of LED beads 2 by reversing the positions of the first electrode pin pad 30a and the second electrode pin pad 30b on the LED bead soldering areas 30 in adjacent rows or columns; simultaneously, installing the first LED bead 2a and the second LED bead 2b with opposite electrode pin arrangements on the LED bead soldering areas 30 in adjacent rows or columns. Figure 13a , Figure 13b The illustration shows two types of LED beads 2. The difference between these two types of LED beads 2 is that their electrode pins are reversed, but the positions of the first, second, and third light-emitting chips remain unchanged. Figure 13a As shown in the diagram, input signal pins 231 and output signal pins 232 are arranged vertically on the paper, a first electrode pin 233 is arranged on the left, and a second electrode pin 234 is arranged on the right; wherein, red light-emitting chip 20r, green light-emitting chip 20g, and blue light-emitting chip 20b are arranged sequentially from top to bottom. Figure 13b As shown in the diagram, input signal pins 231 and output signal pins 232 are arranged vertically on the paper, a second electrode pin 234 is arranged on the left, and a first electrode pin 233 is arranged on the right. The red light-emitting chip 20r, green light-emitting chip 20g, and blue light-emitting chip 20b are arranged sequentially from top to bottom. This structure ensures that the positions of the light-emitting chips in the specially designed first LED bead 2a and second LED bead 2b are relatively fixed, preventing color differences among the LED beads 2 due to pin variations.

[0117] As a preferred method, such as Figure 14 , Figure 15 As shown, the power supply line 31 includes a row or column of the first power supply line 31a and a row or column of the second power supply line 31b;

[0118] The first electrode pin pads 30a on some of the lamp chip soldering areas 30 are connected to the first relay pads 313a on the first power supply line 31a via power jumpers 311. The first electrode pin pads 30a on some of the lamp chip soldering areas 30 are also connected to the first electrode pin pads 30a on adjacent lamp chip soldering areas 30 via power jumpers 311. For example, the first electrode pin pads 30a on the first column of the four lamp chip soldering areas 30 shown in the figure are connected to the first relay pads 313a on the first power supply line 31a via power jumpers 311. The remaining second to fourth columns of lamp chip soldering areas 30 are respectively connected to the first electrode pin pads 30a on the previous column of lamp chip soldering areas 30 via power jumpers 311.

[0119] At least some of the second electrode pin pads 30b on the LED chip soldering areas 30 are connected to the second relay pads 313b on the second power supply line 31b via power jumpers 311, and some of the second electrode pin pads 30b on the LED chip soldering areas 30 are connected to the second electrode pin pads 30b on adjacent LED chip soldering areas 30 via power jumpers 311. For example, the second electrode pin pads 30b on the fourth column of the four LED chip soldering areas 30 shown in the figure are connected to the second relay pads 313b on the second power supply line 31b via power jumpers 311, and the remaining first to third columns of LED chip soldering areas 30 are respectively connected to the second electrode pin pads 30b on the next column of LED chip soldering areas 30 via power jumpers 311.

[0120] By adopting the above-mentioned optimized structure, several rows or columns of LED beads 2 can share the power supply line 31, which can minimize the number of power supply lines 31. In addition, power jumpers 311 are added to power the LED beads 2, which can further improve their transparency.

[0121] like Figure 7 , Figure 11 The enlarged view shown illustrates the specific connection method of signal line 32, which is described as follows: the input signal pin pad 30c of the first LED chip soldering area 30 is connected to the signal pad 33 through signal line 32; the input signal pin pad 30c on the next LED chip soldering area 30 of the adjacent series-connected LED chip soldering areas 30 is connected to the output signal pin pad 30d on the previous LED chip soldering area 30.

[0122] like Figure 16 As shown, in a preferred manner, Figure 15 Based on this, repeat the above process, with several rows of LED beads 2 sharing the same polarity power supply line 31, and arrange them in this cyclical manner to make a large-area transparent LED display screen.

[0123] The transparent LED display provided in this example replaces the existing power supply line 31 by using relay pads 313 and thickened bonding lines 312 between the relay pads 313 to achieve power supply. While ensuring power supply capability through the thickened bonding lines 312, these lines are almost invisible to the naked eye, having minimal impact on the viewing experience, thus further improving the overall transparency of the transparent LED display. Since there is no need to form power lines on the transparent substrate, there is no need to consider issues with weak adhesion of the power lines, nor is there a need for complex chemical processes, resulting in lower process requirements and greater environmental friendliness. Because the thickened bonding lines 312 are arc-shaped during bonding, they have a certain deformation buffering capacity. Even if the transparent substrate experiences thermal expansion and contraction, the thickened bonding lines 312 will not break, ensuring the stability of the power supply capability, improving yield, and reducing costs.

[0124] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A transparent LED display screen, comprising a transparent substrate and an array of LED lamp beads arranged on the transparent substrate; each of the LED lamp beads is powered by a power supply line; characterized in that the power supply line comprises a plurality of relay pads, the relay pads comprising first relay pads and second relay pads with opposite polarities; wherein the first relay pads are connected by a plurality of thick binding lines to form a first power supply line; the second relay pads are connected by a plurality of thick binding lines to form a second power supply line; the relay pads are metal sheets adhered to the transparent substrate; the thickness of the metal sheet is 0.1-1mm; the area of the metal sheet is 0.25-10 square millimeters; the LED lamp beads are electrically connected to the first relay pads on the first power supply line and the second relay pads on the second power supply line to realize power supply from the first power supply line and the second power supply line; the transparent substrate is provided with a circuit pattern; the circuit pattern comprises power supply pads, signal pads and lamp bead pads arranged in an array, and the LED lamp beads are welded on the lamp bead pads; each of the lamp bead pads is provided with pin pads corresponding to the pins of the LED lamp beads; the pin pads comprise signal pin pads and electrode pin pads; the electrode pin pads comprise first electrode pin pads and second electrode pin pads with opposite polarities; the power supply line comprises a plurality of rows or columns of the first power supply lines and the second power supply lines arranged at intervals, and a plurality of rows or columns of LED lamp beads are arranged between the first power supply lines and the second power supply lines, and the LED lamp beads share the first power supply lines and the second power supply lines; in the same row or column, the first electrode pin pad on the first lamp bead pad is connected to the first relay pad on the first power supply line by a power supply jumper, the second electrode pin pad on the last lamp bead pad is connected to the second relay pad on the second power supply line by a power supply jumper, the first electrode pin pad on each of the remaining lamp bead pads is connected to the first electrode pin pad on the previous lamp bead pad by a power supply jumper, and the second electrode pin pad on each of the remaining lamp bead pads is connected to the second electrode pin pad on the next lamp bead pad by a power supply jumper.

2. The transparent LED display of claim 1, wherein, the first relay pads in the same row or column are connected by i thick binding lines to form the first power supply line; the second relay pads in the same row or column are connected by j thick binding lines to form the second power supply line; wherein i≥3; j≥3.

3. The transparent LED display of claim 2, wherein, at least part of the LED lamp beads are directly or indirectly connected to the first relay pads on the first power supply line and the second relay pads on the second power supply line by power supply jumpers.

4. The transparent LED display of claim 3, wherein, the LED lamp beads are of TOP type structure or CHIP type structure.

5. The transparent LED display of claim 4, wherein, The signal pin pads on the lamp bead bonding areas are connected with the signal pads through signal lines to realize the series connection of the LED lamp beads, so that the control signals for controlling the on-off of each LED lamp bead can be input from the signal pads through the signal lines and then transmitted through each series connected LED lamp bead in turn.

6. The transparent LED display of claim 1, wherein, The diameter of the thickened bonding wire is 50-200 μm.

7. The transparent LED display of claim 1, wherein, The transparent substrate is a flexible transparent substrate.

8. The transparent LED display of claim 3, wherein, The LED lamp bead is a bare lamp bead without a shell; the bare lamp bead without a shell comprises a driving chip and a light-emitting wafer; the light-emitting wafer is mounted on the driving chip.

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