An ultra-wideband millimeter-wave spread spectrum module

Abstract

This invention provides an ultra-wideband millimeter-wave spread spectrum module and presents a circuit scheme based on micro-coaxial devices for one of its architectures, belonging to the field of testing technology. The ultra-wideband millimeter-wave spread spectrum module is a six-port component containing low-frequency signal paths, high-frequency signal paths, and down-conversion signal paths. Low-frequency signals are transmitted through the main transmission line, while high-frequency signals are coupled to the main transmission line through several specially combined couplers. The down-conversion signal paths are used to down-convert the forward and reverse high-frequency signals sampled by the couplers to form intermediate-frequency signals. The sampling and processing of the forward and reverse low-frequency signals are completed in a vector network analyzer. The ultra-wideband millimeter-wave spread spectrum module can simultaneously test the performance of ultra-wideband devices under test in both the low-frequency band (e.g., 0.01-70GHz; 0.01-110GHz, etc.) and high-frequency band (e.g., 70-145GHz; 110-170GHz, etc.). It is easy to operate and effectively avoids the problem of needing to modify the hardware architecture when switching system frequency bands in traditional testing schemes.

Description

Technical Field

[0001] This invention belongs to the field of testing technology, and in particular relates to an ultra-wideband millimeter-wave spread spectrum module. Background Technology

[0002] With rapid societal development and continuous technological advancements, communication technologies are constantly evolving and upgrading. Compared to microwave communication, millimeter-wave communication offers advantages such as wide bandwidth, large capacity, high data rate, small device size, and good mobility. Compared to infrared and optical signals, millimeter waves have better atmospheric penetration and anti-interference capabilities, making them suitable for all-weather applications. Therefore, the millimeter-wave band is not only widely used in precision guidance and electronic warfare, but is also a research focus in civilian fields such as 5G communication, security imaging, radio astronomy, meteorological research, and biomedicine.

[0003] As powerful tools for evaluating the performance of millimeter-wave devices and systems, millimeter-wave measurement instruments such as vector network analyzers (VNAs) play a crucial role in the research and application of millimeter-wave technology. Currently, Keysight Technologies (USA), Rohde & Schwarz (Germany), and Ceyear (China) are the leading millimeter-wave VNA manufacturers both domestically and internationally. They have all launched a series of millimeter-wave VNAs and matching frequency extension modules, covering not only the entire millimeter-wave frequency band but also parts of the terahertz band.

[0004] Extending the application frequency band of vector network analyzers (VNAs) using spread spectrum modules is currently the mainstream solution to address the contradiction between the limited bandwidth of VNA internal components and the trend towards wider bandwidth in VNAs. However, using spread spectrum modules for high-frequency signal testing requires system setup, wiring, and calibration. In this case, the system can only test high-frequency signals. To test low-frequency signals, the spread spectrum module must be removed, and rewiring and calibration repeated, increasing the complexity of the testing process and reducing the lifespan of the system interfaces due to frequent rewiring and disconnection. This problem arises because current spread spectrum module components are composed of waveguide devices. The inherent high-pass characteristics of waveguides make them incompatible with low-frequency signals. Coaxial transmission lines, on the other hand, have wide bandwidth characteristics. Micro-coaxial transmission lines fabricated using copper as a raw material through micro-metal additive manufacturing (also known as copper-based MEMS technology) possess ultra-wide bandwidth characteristics, capable of transmitting both low-frequency and high-frequency signals. Therefore, this invention provides an ultra-wideband millimeter-wave spread spectrum module and presents a circuit scheme based on micro-coaxial devices for one such architecture. Summary of the Invention

[0005] To address the problems existing in the prior art, this invention provides an ultra-wideband millimeter-wave spread spectrum module that can test ultra-wideband devices (e.g., 0.01-145GHz; 0.01-170GHz, etc.) without modifying the hardware architecture. This aims to solve the problem that traditional testing methods require hardware architecture modifications when switching system frequency bands. The ultra-wideband millimeter-wave spread spectrum module provided by this invention can simultaneously test the performance of ultra-wideband devices under test in both low-frequency (e.g., 0.01-70GHz; 0.01-110GHz, etc.) and high-frequency (e.g., 70-145GHz; 110-170GHz, etc.) bands, simplifying the testing steps for millimeter-wave devices in different bands and reducing testing costs.

[0006] To achieve the above objectives, the present invention employs an ultra-wideband millimeter-wave spread spectrum module, which is a six-port component. The six ports are a broadband low-frequency signal input port, a synthesized signal output port, a local oscillator port, a radio frequency (RF) port, a reference IF port, and a test IF port. The broadband low-frequency signal input port is used to connect to a vector network analyzer, the synthesized signal output port is used for connection to the device under test (DUT), and the local oscillator port, RF port, reference IF port, and test IF port are respectively used to connect to an extender. One end of the main transmission line is the broadband low-frequency signal input port, and the other end is the synthesized signal output port. The input end of the first directional coupler is connected to the first multiplier. A frequency source is used to acquire the forward high-frequency signal at the coupling end of the first directional coupler. The first mixer down-converts the sampled signal of the forward high-frequency signal to the intermediate frequency band, providing a reference intermediate frequency port. The second frequency harmonic source is connected to the first mixer, providing it with a local oscillator input signal. The other end of the second frequency harmonic source is the local oscillator port. The input end of the second directional coupler is connected to the main transmission line, and its purpose is to acquire the sampled signal of the reverse high-frequency signal at its coupling end. Its coupling end is connected to the second mixer. The second mixer down-converts the sampled signal of the reverse high-frequency signal to the intermediate frequency band, providing a test intermediate frequency port. The second frequency harmonic source is connected to the second mixer, providing it with a local oscillator input signal.

[0007] It includes a low-frequency signal path, a high-frequency signal path, and a down-conversion signal path; the low-frequency signal path runs from the broadband low-frequency signal input port through the main transmission line, the first directional coupler, and the second directional coupler to the synthesized signal output port; the high-frequency signal path runs from the RF port through the first frequency multiplier, the first directional coupler, and the second directional coupler to the synthesized signal output port; the down-conversion signal path refers to the path from the second directional coupler through the first mixer and the second mixer to the reference intermediate frequency port and the test intermediate frequency port.

[0008] The through-terminal of the first directional coupler is connected to the third directional coupler, which is used to acquire the sampling signal of the forward high-frequency signal; the coupling terminal of the third directional coupler is connected to the first mixer.

[0009] The through-hole of the first directional coupler is connected to one end of the adjustable attenuator to acquire the sampled signal of the forward high-frequency signal; the other end of the adjustable attenuator is connected to the first mixer.

[0010] The second directional coupler is a dual directional coupler, consisting of two single directional couplers. The input terminals of both single directional couplers are connected to the main transmission line, and their coupling terminals are connected to the first mixer and the second mixer, respectively, to acquire the sampled signals of the forward high-frequency signal and the reverse high-frequency signal.

[0011] This is a six-layer structure component, comprising a third frequency harmonic source, a first connection structure, a second connection structure, a third connection structure, and a fourth connection structure. The first connection structure provides a short-circuit path for signal transmission of the microcoaxial devices in the second layer and is located in the first layer. The main transmission line, the first directional coupler, and the second directional coupler are microcoaxial devices and are located in the second layer. The second connection structure connects the signals of the microcoaxial devices in the second and fourth layers and provides a short-circuit path for signal transmission of the microcoaxial devices in the fourth layer, and is located in the third layer. The third frequency harmonic source, the first mixer, and the second mixer are microcoaxial devices and are located in the fourth layer. The third connection structure connects the signals of the devices in the fourth and sixth layers and provides a short-circuit path for signal transmission of the microcoaxial devices in the fourth layer, and is located in the fifth layer. The first and second frequency harmonic sources are microstrip circuits integrated within the fourth connection structure and are located in the sixth layer.

[0012] The first, second, third, and fourth connection structures are fabricated using CNC technology. The main transmission line, the first directional coupler, the second directional coupler, the third frequency multiplier, the first mixer, and the second mixer are implemented using copper-based MEMS technology. The first and second frequency multipliers are implemented using quartz circuits or MMIC technology.

[0013] The copper-based MEMS process described is a layer-by-layer processing technology. The standard layer thickness of the first and last layers is 50 μm, and the standard layer thickness of the intermediate layers is 100 μm.

[0014] The broadband low-frequency signal input port, synthesized signal output port, local oscillator port, RF port, reference intermediate frequency port, and test intermediate frequency port all adopt the SMA interface form.

[0015] During testing, low-frequency and high-frequency signals can be tested simultaneously or separately; the low-frequency band is 0.01-70GHz or 0.01-110GHz, and the high-frequency band is 70-145GHz or 110-170GHz; for the low-frequency band device under test, connect the broadband low-frequency signal input port to the vector network analyzer and the synthesized signal output port to the device under test; for the high-frequency band device under test, connect the local oscillator port, RF port, reference IF port, and test IF port of the ultra-wideband millimeter-wave spread spectrum module to the expander, connect the expander to the vector network analyzer, and connect the synthesized signal output port to the device under test.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects:

[0017] The ultra-wideband millimeter-wave spread spectrum module of this invention can simultaneously test the performance of ultra-wideband devices under test (DUTs) in both low and high frequency bands. It is easy to operate and effectively avoids the hardware architecture modifications required when switching system frequency bands in traditional testing schemes. Furthermore, the low-frequency and high-frequency band tests are independent of each other, each with its own measurement channel, thus allowing for separate testing of low-frequency and high-frequency DUTs. In addition, the ultra-wideband millimeter-wave spread spectrum module provided by the circuit scheme is a six-port component, with each port capable of connecting to external devices via an SMA interface, making it compatible with existing commercial testing equipment such as vector network analyzers and extenders, thus exhibiting high versatility. Attached Figure Description

[0018] To more clearly illustrate the embodiments of the present invention or the prior art, the accompanying drawings used in the embodiments or the prior art will be briefly described below. It should be noted that the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0019] Figure 1 A schematic diagram of an ultra-wideband millimeter-wave spread spectrum module provided in an embodiment of the present invention;

[0020] Figure 2 A schematic diagram illustrating the connection between an ultra-wideband millimeter-wave spread spectrum module and a vector network analyzer and an extender during testing of an ultra-wideband device under test, provided in an embodiment of the present invention.

[0021] Figure 3 The following is a schematic diagram of the connection between an ultra-wideband millimeter-wave spread spectrum module and a vector network analyzer and an extender when testing a device under test (DUT) according to an embodiment of the present invention. (a) is a schematic diagram of the connection when testing a low-frequency DUT, and (b) is a schematic diagram of the connection when testing a high-frequency DUT.

[0022] Figure 4This is a circuit connection diagram of the first ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention when testing an ultra-wideband device under test;

[0023] Figure 5 The circuit connection diagrams for the first ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention when testing the device under test (DUT) are shown in (a) and (b) respectively.

[0024] Figure 6 This is a circuit connection diagram of the second ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention when testing an ultra-wideband device under test;

[0025] Figure 7 The circuit connection diagrams for the second ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention when testing the device under test (DUT) are shown in (a) and (b) respectively.

[0026] Figure 8 This is a circuit connection diagram of the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention when testing an ultra-wideband device under test;

[0027] Figure 9 The circuit connection diagrams for the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention when testing the device under test (DUT) are shown in (a) and (b) respectively.

[0028] Figure 10 A schematic diagram of the overall circuit scheme for the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention;

[0029] Figure 11 A cross-sectional schematic diagram of the circuit scheme for the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention;

[0030] Figure 12 A schematic diagram of the micro-coaxial devices included in the circuit scheme of the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention;

[0031] Figure 13 A schematic diagram of the circuit scheme with SMA connection structure for the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention;

[0032] Figure 14 A schematic diagram of the low-frequency signal path of the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention;

[0033] Figure 15 A schematic diagram of the high-frequency signal path for the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention;

[0034] Figure 16 This is a schematic diagram of the downconversion signal path for the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention.

[0035] In the attached diagram, 1-Wideband low-frequency signal input port, 2-Synthetic signal output port, 3-Local oscillator port, 4-RF port, 5-Reference intermediate frequency port, 6-Test intermediate frequency port, 7-First connection structure, 8-Second connection structure, 9-Third connection structure, 10-Fourth connection structure, 11-Main transmission line, 12-First directional coupler, 13-Second directional coupler, 14-Third directional coupler, 15-First mixer, 16-Second mixer, 17-First frequency harmonic source, 18-Second frequency harmonic source, 19-Adjustable attenuator, 20-Third frequency harmonic source. Detailed Implementation

[0036] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. It should be noted that the described embodiments are merely some embodiments of this invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0037] In the description of the embodiments of the present invention, it should be understood that the terms "top surface", "bottom surface", "left side", "right side", "horizontal direction" and "vertical direction" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and should not be regarded as indicating that the indicated element or device is a specific orientation.

[0038] In the description of the embodiments of the present invention, the structural dimensions given are preferred parameters. Referring to the embodiments of the present invention, modifying the dimensional parameters of each component can further obtain the actual required performance.

[0039] This invention provides an ultra-wideband millimeter-wave spread spectrum module, including a low-frequency signal path, a high-frequency signal path, and a down-conversion signal path; it is a six-port component, with the six ports being a broadband low-frequency signal input port 1, a synthesized signal output port 2, a local oscillator port 3, an RF port 4, a reference IF port 5, and a test IF port 6; wherein the broadband low-frequency signal input port 1 is used to connect to a vector network analyzer, the synthesized signal output port 2 is used for connection to a device under test (DUT), and the local oscillator port 3, RF port 4, reference IF port 5, and test IF port 6 are respectively used to connect to an extender; one end of the main transmission line 11 is the broadband low-frequency signal input port, and the other end is the synthesized signal output port; the input end of the first directional coupler 12 is connected to the first frequency multiplier. Source 17 is used to acquire the forward high-frequency signal at the coupling end of the first directional coupler 12. The first mixer 15 down-converts the sampled signal of the forward high-frequency signal to the intermediate frequency band, providing a reference intermediate frequency port 5. The second frequency multiplier 18 is connected to the first mixer 15 to provide it with a local oscillator input signal. The other end of the second frequency multiplier 18 is the local oscillator port 3. The input end of the second directional coupler 13 is connected to the main transmission line 11, and its purpose is to acquire the sampled signal of the reverse high-frequency signal at its coupling end. Its coupling end is connected to the second mixer 16. The second mixer 16 down-converts the sampled signal of the reverse high-frequency signal to the intermediate frequency band, providing a test intermediate frequency port 6. The second frequency multiplier 18 is connected to the second mixer 16 to provide it with a local oscillator input signal.

[0040] The low-frequency signal path refers to the path from the broadband low-frequency signal input port 1 through the main transmission line 11, the first directional coupler 12, and the second directional coupler 13 to the synthesized signal output port 2, such as... Figure 14 The thick solid lines indicate the transmission of forward broadband low-frequency signals and reverse broadband low-frequency signals.

[0041] The high-frequency signal path refers to the path from RF port 4 through the first frequency multiplier 17, the first directional coupler 12, and the second directional coupler 13 to the synthesized signal output port 2, such as... Figure 15 The thick solid line indicates the transmission of forward narrowband high-frequency signals.

[0042] The downconversion signal path refers to the path from the second directional coupler 13 through the first mixer 15 and the second mixer 16 to the reference intermediate frequency port 5 and the test intermediate frequency port 6. The second frequency multiplier 18 is used to provide the local oscillator signal to the first mixer 15 and the second mixer 16, and its input port is the local oscillator port 3, such as... Figure 16 The thick solid line shows the sampling signals for transmitting forward narrowband high-frequency signals and reverse narrowband high-frequency signals.

[0043] Please see Figure 1 , Figure 2 and Figure 3 , Figure 1 A schematic diagram of an ultra-wideband millimeter-wave spread spectrum module provided in an embodiment of the present invention; Figure 2 A schematic diagram illustrating the connection between an ultra-wideband millimeter-wave spread spectrum module and a vector network analyzer and an extender during testing of an ultra-wideband device under test, provided in an embodiment of the present invention. Figure 3 The following is a schematic diagram of the connection between an ultra-wideband millimeter-wave spread spectrum module and a vector network analyzer and an extender when testing a device under test (DUT) according to an embodiment of the present invention. (a) is a schematic diagram of the connection when testing a low-frequency DUT, and (b) is a schematic diagram of the connection when testing a high-frequency DUT.

[0044] The ultra-wideband millimeter-wave spread spectrum module proposed in this invention belongs to a six-port component, such as... Figure 1 As shown, the six ports are: wideband low-frequency signal input port 1, synthesized signal output port 2, local oscillator port 3, RF port 4, reference IF port 5, and test IF port 6. In actual use, wideband low-frequency signal input port 1 is connected to a vector network analyzer, synthesized signal output port 2 is connected to the device under test (DUT), and local oscillator port 3, RF port 4, reference IF port 5, and test IF port 6 are connected to an expansion unit. Figure 2 As shown. The ultra-wideband millimeter-wave spread spectrum module can simultaneously test the performance of ultra-wideband devices under test in both low-frequency bands (e.g., 0.01-70GHz; 0.01-110GHz, etc.) and high-frequency bands (e.g., 70-145GHz; 110-170GHz, etc.). It is easy to operate and effectively avoids the problem of needing to modify the hardware architecture when switching system frequency bands in traditional testing schemes.

[0045] Furthermore, low-frequency and high-frequency signal tests can be performed simultaneously or separately. For low-frequency band (e.g., 0.01-70GHz; 0.01-110GHz, etc.) devices under test, simply connect the broadband low-frequency signal input port 1 of the ultra-wideband millimeter-wave spread spectrum module to the vector network analyzer, and the synthesized signal output port 2 to the device under test to perform the test. Figure 3 As shown in (a), solid lines in the figure represent connections, and dashed lines represent no connections. For high-frequency bands (e.g., 70-145GHz; 110-170GHz, etc.) of the device under test (DUT), connect the local oscillator port 3, RF port 4, reference IF port 5, and test IF port 6 of the ultra-wideband millimeter-wave spread spectrum module to the expander, connect the expander to the vector network analyzer, and connect the synthesized signal output port 2 to the DUT to perform the test. Figure 3 As shown in (b), solid lines in the figure represent connecting lines, and dashed lines represent no connecting lines.

[0046] Figure 4 This is a circuit connection diagram of the first ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention when testing an ultra-wideband device under test; Figure 5The circuit connection diagrams for the first ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention when testing the device under test (DUT) are shown in (a) and (b) respectively.

[0047] The first ultra-wideband millimeter-wave spread spectrum module system architecture includes a main transmission line 11, a first directional coupler 12, a second directional coupler 13, a third directional coupler 14, a first mixer 15, a second mixer 16, a first frequency harmonic source 17, and a second frequency harmonic source 18, as follows: Figure 4 As shown. One end of the main transmission line 11 is a broadband low-frequency signal input port 1, and the other end is a synthesized signal output port 2. The input end of the first directional coupler 12 is connected to the first frequency multiplier 17, which provides a narrowband high-frequency signal. The other end of the first frequency multiplier 17 is an RF port 4. The coupling end of the first directional coupler 12 is connected to the main transmission line 11 to couple the high-frequency signal onto the main transmission line 11. The through end of the first directional coupler 12 is connected to the third directional coupler 14 to obtain the sampling signal of the forward high-frequency signal at its coupling end. The coupling end of the third directional coupler 14 is connected to the first mixer 15, which down-converts the sampling signal of the forward high-frequency signal to the intermediate frequency band, providing a reference intermediate frequency port 5. The second frequency multiplier 18 is connected to the first mixer 15 to provide it with a local oscillator input signal. The other end of the second frequency multiplier 18 is a local oscillator port 3. The input of the second directional coupler 13 is connected to the main transmission line 11 to obtain a sampled signal of the reverse high-frequency signal at its coupling end, which is also connected to the second mixer 16. The second mixer 16 down-converts the sampled signal of the reverse high-frequency signal to the intermediate frequency band, providing the test intermediate frequency port 6. The second frequency multiplier 18 is also connected to the second mixer 16, providing it with the local oscillator input signal.

[0048] Furthermore, the first ultra-wideband millimeter-wave spread spectrum module system architecture can satisfy both simultaneous testing of low-frequency and high-frequency signals, as well as separate testing of low-frequency and high-frequency signals. Figure 5 (a) and 5(b) show the signal flow in the circuit when testing the low-frequency and high-frequency devices under test, respectively.

[0049] Figure 6 This is a circuit connection diagram of the second ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention when testing an ultra-wideband device under test; Figure 7 The circuit connection diagrams for the second ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention when testing the device under test (DUT) are shown in (a) and (b) respectively.

[0050] The second type of ultra-wideband millimeter-wave spread spectrum module system architecture includes a main transmission line 11, a first directional coupler 12, a second directional coupler 13, an adjustable attenuator 19, a first mixer 15, a second mixer 16, a first harmonic source 17, and a second harmonic source 18, as follows: Figure 6 As shown. Similar to the first system architecture, the difference is that the through end of the first directional coupler 12 is not connected to the directional coupler, but to the adjustable attenuator 19, which can also obtain the sampling signal of the forward high-frequency signal. The function of the adjustable attenuator 19 is to control the power of the sampling signal of the forward high-frequency signal within a suitable range. The other end of the adjustable attenuator 19 is connected to the first mixer 15. Compared with the first system architecture, the second system architecture reduces the use of directional couplers, thus reducing system complexity. However, due to the addition of attenuators, higher performance requirements are placed on the attenuators.

[0051] Similarly, the second ultra-wideband millimeter-wave spread spectrum module system architecture can satisfy both simultaneous testing of low-frequency and high-frequency signals, as well as separate testing of low-frequency and high-frequency signals. Figure 7 (a) and 7(b) show the signal flow in the circuit when testing the low-frequency and high-frequency devices under test, respectively.

[0052] Figure 8 This is a circuit connection diagram of the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention when testing an ultra-wideband device under test; Figure 9 The circuit connection diagrams for the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention when testing the device under test (DUT) are shown in (a) and (b) respectively.

[0053] The third type of ultra-wideband millimeter-wave spread spectrum module system architecture includes a main transmission line 11, a first directional coupler 12, a second directional coupler 13, a first mixer 15, a second mixer 16, a first frequency harmonic source 17, and a second frequency harmonic source 18, such as... Figure 8As shown. Similar to the first system architecture, the difference is that the sampling signal of the forward high-frequency signal is not obtained through the first directional coupler 12, but through the second directional coupler 13. The second directional coupler 13 is a dual directional coupler, composed of two single directional couplers. The input terminals of both single directional couplers are connected to the main transmission line 11, with the purpose of obtaining the sampling signals of the forward high-frequency signal and the reverse high-frequency signal respectively at their coupling terminals. Their coupling terminals are connected to the first mixer 15 and the second mixer 16 respectively. The first mixer 15 and the second mixer 16 down-convert the sampling signals of the forward high-frequency signal and the reverse high-frequency signal to the intermediate frequency band, respectively, providing the reference intermediate frequency port 5 and the test intermediate frequency port 6. Compared with the first system architecture, the third system architecture is relatively simple in structure, but the first mixer 15 and the second mixer 16 are closer together, resulting in lower directivity.

[0054] Similarly, the third ultra-wideband millimeter-wave spread spectrum module system architecture can satisfy both simultaneous testing of low-frequency and high-frequency signals, as well as separate testing of low-frequency and high-frequency signals. Figure 9 (a) and 9(b) show the signal flow in the circuit when testing the low-frequency and high-frequency devices under test, respectively.

[0055] Figure 10 A schematic diagram of the overall circuit scheme for the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in this embodiment of the invention; Figure 11 A cross-sectional schematic diagram of the circuit scheme for the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention.

[0056] When implementing specific circuit schemes, the first frequency multiplier 17 in the above three ultra-wideband millimeter-wave spread spectrum module system architectures needs to be cascaded with the third frequency multiplier 20 to achieve the final frequency multiplication effect.

[0057] To further illustrate the feasibility of the ultra-wideband millimeter-wave spread spectrum module system architecture, this invention presents a third circuit scheme for an ultra-wideband millimeter-wave spread spectrum module system architecture. The other two schemes are similar and will not be described in detail here. The ultra-wideband millimeter-wave spread spectrum module provided by this circuit scheme is a multi-layer structure component with six layers, including a main transmission line 11, a first directional coupler 12, a second directional coupler 13, a third frequency harmonic source 20, a first mixer 15, a second mixer 16, a first frequency harmonic source 17, a second frequency harmonic source 18, a first connection structure 7, a second connection structure 8, a third connection structure 9, and a fourth connection structure 10.

[0058] The first connection structure 7 is located in the first layer and serves to provide a suitable short path for signal transmission of the micro coaxial devices in the second layer.

[0059] The main transmission line 11, the first directional coupler 12, and the second directional coupler 13 are micro-coaxial devices located on the second layer.

[0060] The function of the second connection structure 8 is to connect the signals of the micro coaxial devices of the second layer and the fourth layer, and at the same time provide a suitable short-circuit path for the signal transmission of the micro coaxial devices of the fourth layer. In addition, the load structure required by the micro coaxial devices of the second layer is also located in the second connection structure 8, which is located in the third layer.

[0061] The third frequency harmonic source 20, the first mixer 15, and the second mixer 16 are also micro-coaxial devices located on the fourth layer.

[0062] The function of the third connection structure 9 is to connect the signals of the devices in the fourth and sixth layers, and at the same time provide a suitable short path for the signal transmission of the micro coaxial devices in the fourth layer. In addition, some cavity structures required by the devices in the sixth layer are also located in the third connection structure 9, which is located in the fifth layer.

[0063] The first frequency harmonic source 17 and the second frequency harmonic source 18 are microstrip circuits integrated within the fourth connection structure 10, located on the sixth layer.

[0064] Furthermore, the first connection structure 7, the second connection structure 8, the third connection structure 9, and the fourth connection structure 10 can be fabricated using CNC technology. The main transmission line 11, the first directional coupler 12, the second directional coupler 13, the third frequency multiplier 20, the first mixer 15, and the second mixer 16 can be fabricated using micro-metal additive manufacturing technology with copper as the raw material. The first frequency multiplier 17 and the second frequency multiplier 18 can be fabricated using quartz circuits or MMIC technology.

[0065] Figure 12 A schematic diagram of the micro-coaxial devices included in the circuit scheme of the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention; Figure 13 A schematic diagram of the circuit scheme with SMA connection structure for the third ultra-wideband millimeter-wave spread spectrum module system architecture provided in the embodiments of the present invention.

[0066] A schematic diagram of a micro-coaxial device designed based on a copper-based micro-metal additive manufacturing process is shown below. Figure 12 As shown, this process is a layer-by-layer processing method. The standard layer thickness of the first and last layers is 50 μm, and the standard layer thickness of the intermediate layers is 100 μm. Figure 12 The provided device prototype conforms to both the process specifications and the requirements of the spread spectrum module system.

[0067] Furthermore, the ultra-wideband millimeter-wave spread spectrum module provided by the circuit scheme is a six-port component, and each port can be connected to the outside via an SMA interface, such as... Figure 13As shown, it is compatible with existing commercial testing equipment such as vector network analyzers and extenders, and has a high degree of versatility.

[0068] The above describes the system architecture of the ultra-wideband millimeter-wave spread spectrum module and the circuit scheme based on micro-coaxial devices provided by this invention. For those skilled in the art, based on the ideas of the embodiments of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. An ultra-wideband millimeter-wave spread spectrum module, characterized in that, This is a six-port component, with six ports being a broadband low-frequency signal input port (1), a synthesized signal output port (2), a local oscillator port (3), a radio frequency port (4), a reference intermediate frequency port (5), and a test intermediate frequency port (6). The broadband low-frequency signal input port (1) is used to connect to a vector network analyzer, the synthesized signal output port (2) is used to connect to the device under test (DUT), and the local oscillator port (3), radio frequency port (4), reference intermediate frequency port (5), and test intermediate frequency port (6) are used to connect to an expansion unit. One end of the main transmission line (11) is the broadband low-frequency signal input port, and the other end is the synthesized signal output port. The input end of the first directional coupler (12) is connected to the first frequency harmonic source (17) for coupling within the first directional coupler (12). The first mixer (15) downconverts the sampled signal of the forward high-frequency signal to the intermediate frequency band and provides a reference intermediate frequency port (5). The second frequency multiplier (18) is connected to the first mixer (15) to provide it with a local oscillator input signal. The other end of the second frequency multiplier (18) is the local oscillator port (3). The input end of the second directional coupler (13) is connected to the main transmission line (11) to obtain the sampled signal of the reverse high-frequency signal at its coupling end. Its coupling end is connected to the second mixer (16). The second mixer (16) downconverts the sampled signal of the reverse high-frequency signal to the intermediate frequency band and provides a test intermediate frequency port (6). The second frequency multiplier (18) is connected to the second mixer (16) to provide it with a local oscillator input signal.

2. The ultra-wideband millimeter-wave spread spectrum module according to claim 1, characterized in that, It includes a low-frequency signal path, a high-frequency signal path, and a down-conversion signal path; the low-frequency signal path runs from the broadband low-frequency signal input port (1) through the main transmission line (11), the first directional coupler (12), and the second directional coupler (13) to the synthesized signal output port (2); the high-frequency signal path runs from the radio frequency port (4) through the first frequency multiplier (17), the first directional coupler (12), and the second directional coupler (13) to the synthesized signal output port (2); the down-conversion signal path refers to the path from the second directional coupler (13) through the first mixer (15) and the second mixer (16) to the reference intermediate frequency port (5) and the test intermediate frequency port (6).

3. The ultra-wideband millimeter-wave spread spectrum module according to claim 1, characterized in that, The first directional coupler (12) has a direct-through end connected to a third directional coupler (14) for acquiring the sampling signal of the forward high-frequency signal; the coupling end of the third directional coupler (14) is connected to the first mixer (15).

4. The ultra-wideband millimeter-wave spread spectrum module according to claim 1, characterized in that, The through end of the first directional coupler (12) is connected to one end of the adjustable attenuator (19) to obtain the sampling signal of the forward high frequency signal; the other end of the adjustable attenuator (19) is connected to the first mixer (15).

5. The ultra-wideband millimeter-wave spread spectrum module according to claim 1, characterized in that, The second directional coupler (13) is a dual directional coupler, consisting of two single directional couplers. The input ends of the two single directional couplers are connected to the main transmission line (11), and their coupling ends are connected to the first mixer (15) and the second mixer (16) respectively to obtain the sampling signals of the forward high-frequency signal and the reverse high-frequency signal.

6. The ultra-wideband millimeter-wave spread spectrum module according to claim 1, characterized in that, The six-layer structure includes a third frequency harmonic source (20), a first connection structure (7), a second connection structure (8), a third connection structure (9), and a fourth connection structure (10). The first connection structure (7) provides a short-circuit path for signal transmission of the micro-coaxial devices in the second layer and is located in the first layer. The main transmission line (11), the first directional coupler (12), and the second directional coupler (13) are micro-coaxial devices and are located in the second layer. The second connection structure (8) is used to connect the signals of the micro-coaxial devices in the second and fourth layers and provides a short-circuit path for signal transmission of the micro-coaxial devices in the fourth layer and is located in the third layer. The third frequency harmonic source (20), the first mixer (15), and the second mixer (16) are micro-coaxial devices and are located in the fourth layer. The third connection structure (9) is used to connect the signals of the devices in the fourth and sixth layers and provides a short-circuit path for signal transmission of the micro-coaxial devices in the fourth layer and is located in the fifth layer. The first frequency harmonic source (17) and the second frequency harmonic source (18) are microstrip circuits integrated in the fourth connection structure (10) and are located in the sixth layer.

7. The ultra-wideband millimeter-wave spread spectrum module according to claim 6, characterized in that, The first connection structure (7), the second connection structure (8), the third connection structure (9) and the fourth connection structure (10) are fabricated using CNC technology. The main transmission line (11), the first directional coupler (12), the second directional coupler (13), the third frequency multiplier (20), the first mixer (15) and the second mixer (16) are implemented using copper-based MEMS technology. The first frequency multiplier (17) and the second frequency multiplier (18) are implemented using quartz circuits or MMIC technology.

8. The ultra-wideband millimeter-wave spread spectrum module according to claim 7, characterized in that, The copper-based MEMS process described is a layer-by-layer processing technology. The standard layer thickness of the first and last layers is 50 μm, and the standard layer thickness of the intermediate layers is 100 μm.

9. The ultra-wideband millimeter-wave spread spectrum module according to claim 1, characterized in that, The broadband low-frequency signal input port (1), the synthesized signal output port (2), the local oscillator port (3), the radio frequency port (4), the reference intermediate frequency port (5), and the test intermediate frequency port (6) all adopt the SMA interface form.

10. The ultra-wideband millimeter-wave spread spectrum module according to claim 1, characterized in that, During testing, low-frequency and high-frequency signals are tested simultaneously or separately; the low-frequency band is 0.01-70GHz or 0.01-110GHz, and the high-frequency band is 70-145GHz or 110-170GHz; for the low-frequency band device under test, the broadband low-frequency signal input port (1) is connected to the vector network analyzer, and the synthesized signal output port (2) is connected to the device under test; for the high-frequency band device under test, the local oscillator port (3), RF port (4), reference intermediate frequency port (5), and test intermediate frequency port (6) of the ultra-wideband millimeter-wave spread spectrum module are connected to the expander, the expander is connected to the vector network analyzer, and the synthesized signal output port (2) is connected to the device under test.

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