A continuously formable plastic forming mold

Abstract

The application discloses a continuously-formable plastic forming die, which can realize water cooling of the forming die through a cooling pipe and a refrigeration box, and can independently cool a local high-temperature part of a finished product by using a cooling assembly, so that the purpose of effectively accelerating cooling of the injection-molded finished product is achieved. By detecting the local high-temperature part, the electric telescopic rod pushes the sealing bottom plate to drive the cooling sliding block to move downwards and stretch the telescopic bag until the sealing bottom plate completely covers the cooling groove, and part of the cooling water stays in the cooling groove. Then, the semiconductor refrigeration sheet is controlled to refrigerate, the cold energy is conducted to the cooling sliding block through the telescopic bag, and then the cold energy is introduced into the cooling water in the cooling groove by the cooling sliding block, so that the cooling water is cooled. The cooled cooling water is used for accelerating cooling of the local high-temperature part of the finished product, so that the finished product is sufficiently cooled. Therefore, the finished product can be continuously formed in the injection molding process, and the injection molding efficiency is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mold forming, more particularly, to a plastic forming mold capable of continuous forming. BACKGROUND

[0002] Injection molding technology is widely used in the forming of thermoplastic plastics. It can heat granular plastic raw materials into a flowing state in the heating cylinder of an injection molding machine, then inject them into a forming mold through the nozzle of an injection molding device, and after the product is cooled and solidified, the mold is opened and the product is ejected to become a single product with a specific structure.

[0003] Injection molding, also known as injection molding, is a molding method that combines injection and molding. The advantages of injection molding method are fast production speed, high efficiency, automatic operation, variety of colors and shapes, and accurate product size. The product can be easily updated and replaced, and can form complex parts. Injection molding is suitable for mass production and complex product molding fields. At a certain temperature, completely melted plastic materials are injected into the mold cavity under high pressure, and after cooling and solidification, the molded product is obtained. This method is suitable for batch production of complex parts and is one of the important processing methods.

[0004] Currently, the existing plastic forming mold still uses water circulation for cooling during the mold forming process. However, the water cooling method still has the problem of insufficient cooling when cooling the forming mold. The local temperature of the formed product is high, and the water cooling device needs to be started again for cooling, which makes the injection molding process incomplete and cannot be continuously formed. This not only increases the injection molding time, but also greatly reduces the injection molding efficiency.

[0005] Therefore, in view of the above technical problems, it is necessary to provide a plastic forming mold capable of continuous forming. SUMMARY

[0006] The present application aims to provide a plastic forming mold capable of continuous forming to solve the above problems.

[0007] To achieve the above-mentioned purpose, the technical solution provided by an embodiment of the present application is as follows:

[0008] The application discloses a continuously-formable plastic forming die which comprises a pair of die bodies, a plurality of cooling grooves, a cooling assembly, an electric telescopic rod, a liquid passing hole and a plurality of swing pushers, the die body is internally provided with a cooling hole, the cooling hole is fixedly provided with a cooling pipe, the outer end of the die body is fixedly connected with a refrigeration box, and the two ends of the cooling pipe are fixedly connected with the refrigeration box, the cooling groove is arranged on the inner wall of the cooling hole, the die body is internally provided with a mounting hole which is in communication with the cooling hole, the cooling assembly is fixedly connected in the mounting hole, the cooling assembly comprises a mounting block which is fixedly connected in the mounting hole, a sliding hole is arranged in the middle of the mounting block, a cooling sliding block is slidably connected in the sliding hole, a semiconductor refrigeration sheet is arranged on the upper end of the mounting block and is fixedly connected with the inner wall of the mounting hole, an elastic bag is fixedly connected between the cooling sliding block and the semiconductor refrigeration sheet, a sealing bottom plate is fixedly connected to the lower end of the cooling sliding block, a through hole which is matched with the sealing bottom plate is arranged in the middle of the cooling pipe and is in communication with the cooling groove and the sliding hole, the electric telescopic rod is fixedly connected to the side end of the cooling assembly, the lower end of the electric telescopic rod is fixedly connected with the sealing bottom plate, the liquid passing hole is arranged in the middle of the cooling sliding block, and the swing pusher is fixedly connected to the inner end of the liquid passing hole.

[0009] As a further improvement of the application, the cooling sliding block comprises a temperature insulation plate which is slidably connected in the sliding hole, and a temperature guide block which is fixedly connected in the middle of the temperature insulation plate.

[0010] As a further improvement of the application, the temperature insulation plate is made of heat preservation material, and the temperature guide block is made of material with high heat conductivity.

[0011] As a further improvement of the application, the elastic bag comprises a tightness bag which is fixedly connected between the cooling sliding block and the semiconductor refrigeration sheet, the tightness bag is filled with temperature guide liquid, a plurality of tightness ropes are fixedly connected in the middle of the tightness bag, and a plurality of push balls are fixedly connected in the middle of the tightness ropes.

[0012] As a further improvement of the application, the tightness bag and the tightness rope are made of high toughness material.

[0013] As a further improvement of the application, the push ball comprises a hollow ball which is fixedly connected in the middle of the tightness rope, the hollow ball is filled with iron powder, and a plurality of push sheets are fixedly connected to the outer end of the hollow ball.

[0014] As a further improvement of the application, the swing pusher comprises a toughness block which is fixedly connected to the inner wall of the liquid passing hole, and a magnetic block which is fixedly connected to the end of the toughness block away from the cooling assembly.

[0015] As a further improvement of the application, the toughness block is made of high elasticity material.

[0016] As a further improvement of the present application, the cooling pipe is fixedly connected with a sealing pad at the connection between the cooling pipe and the cooling tank and at the connection between the cooling pipe and the cooling assembly.

[0017] As a further improvement of the present application, the through hole is fixedly connected with a heat preservation pad at the inner end.

[0018] Compared with the prior art, the present application has the following advantages:

[0019] The present application can realize water cooling of the molding mold through the cooling pipe and the refrigeration tank, and independently cool the local high temperature part of the finished product through the cooling assembly, thereby effectively accelerating the cooling of the injection molded product. By detecting the local high temperature part, the electric telescopic rod pushes the sealing bottom plate to drive the cooling slider to move downward and stretch the telescopic bag until the sealing bottom plate completely covers the cooling tank, and part of the cooling water stays in the cooling tank. Then the semiconductor refrigeration sheet is controlled to refrigerate, and the cold quantity is conducted to the cooling slider through the telescopic bag, and then the cooling slider conducts the cold quantity into the cooling water in the cooling tank to make it cold. The cold cooling water is used to accelerate the cooling of the local high temperature part of the finished product, so that the finished product is fully cooled. In this way, the finished product can be continuously formed in the injection molding process, thereby effectively improving the injection efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a schematic diagram of the overall structure of the present application;

[0021] Figure 2 is a schematic diagram of the top view of the present application;

[0022] Figure 3 is a schematic diagram of the side view of the present application;

[0023] Figure 4 is a schematic diagram of the present application Figure 3 is an enlarged structure diagram of position A in the present application;

[0024] Figure 5 is an enlarged structure diagram of position B in the present application Figure 4 is an enlarged structure diagram of position B in the present application

[0025] Figure 6 is a schematic diagram of the front view of the present application

[0026] Figure 7 is an enlarged structure diagram of position C in the present application Figure 3

[0027] is a schematic diagram of part of the cooling assembly of the present application; Figure 8

[0028] is a schematic diagram of the front view of the present application Figure 9 is a schematic diagram of the front view of the present application

[0029] Explanation of reference numerals in the drawings:

[0030] 1, mold body; 2, cooling pipe; 3, refrigeration box; 4, cooling tank; 5, cooling assembly; 51, mounting block; 52, cooling sliding block; 521, temperature insulation plate; 522, temperature guide block; 53, semiconductor refrigeration sheet; 54, elastic bag; 541, elastic bag; 542, temperature guide liquid; 543, elastic rope; 544, push ball; 5441, hollow ball; 5442, iron powder; 5443, push piece; 55, sealing bottom plate; 6, electric telescopic rod; 7, liquid passing hole; 8, swing push piece; 81, toughness block; 82, magnetic block. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the protection scope of the present application.

[0032] Embodiment 1:

[0033] Please refer to Figures 1-4 A continuously formable plastic forming mold, comprising a pair of mold bodies 1, a plurality of cooling tanks 4, a cooling assembly 5, an electric telescopic rod 6, a liquid passing hole 7 and a plurality of swing push pieces 8, the mold body 1 is provided with a cooling hole, the cooling hole is fixedly provided with a cooling pipe 2, the outer end of the mold body 1 is fixedly connected with a refrigeration box 3, and the two ends of the cooling pipe 2 are fixedly connected with the refrigeration box 3. The cooling water in the cooling pipe 2 is circulated to cool the mold body 1, and the refrigeration box 3 is used to cool the high-temperature cooling water flowing back in the cooling pipe 2, so as to achieve the effect of circulating cooling. The cooling tank 4 is provided on the inner wall of the cooling hole, the mold body 1 is provided with a mounting hole, the mounting hole is communicated with the cooling hole, and the cooling assembly 5 is fixedly connected in the mounting hole. The cooling water in the cooling pipe 2 at the local high-temperature position is introduced into the cooling tank 4 through the cooling assembly 5, so that part of the cooling water in the cooling pipe 2 stays in the cooling tank 4, thereby effectively cooling the local high temperature. The connection between the cooling pipe 2 and the cooling tank 4 and the connection between the cooling pipe 2 and the cooling assembly 5 are fixedly connected with sealing pads. The sealing pads can prevent the cooling water from flowing out of the cooling tank 4 and flowing into the cooling assembly 5.

[0034] Please continue to refer to Figure 4The cooling assembly 5 comprises a mounting block 51 fixedly connected in the mounting hole, a sliding hole is formed in the middle of the mounting block 51, a cooling sliding block 52 is slidingly connected in the sliding hole, a semiconductor refrigeration sheet 53 is mounted on the upper end of the mounting block 51 and fixedly connected to the inner wall of the mounting hole, the semiconductor refrigeration sheet 53 is formed by a piece of N-type semiconductor material and a piece of P-type semiconductor material, when current passes through the thermoelectric couple, heat transfer occurs between the two ends, the heat is transferred from one end to the other end, thereby generating temperature difference to form cold and hot ends, the cold end of the semiconductor refrigeration sheet 53 is used for refrigeration, and the other hot end is located at the outer end of the mold body 1 to dissipate heat, a telescopic bag 54 is fixedly connected between the cooling sliding block 52 and the semiconductor refrigeration sheet 53, a sealing bottom plate 55 is fixedly connected to the lower end of the cooling sliding block 52, a through hole is formed in the middle of the cooling pipe 2 and matched with the sealing bottom plate 55, and the through hole is respectively communicated with the cooling groove 4 and the sliding hole, an electric telescopic rod 6 is fixedly connected to the side end of the cooling assembly 5, the lower end of the electric telescopic rod 6 is fixedly connected with the sealing bottom plate 55, the sealing bottom plate 55 drives the cooling sliding block 52 to move downward by controlling the extension and contraction of the electric telescopic rod 6, and the telescopic bag 54 is stretched to divide the water in the cooling pipe 2 into the cooling groove 4, so that the cooling water stays in the cooling groove 4, at the same time, the sealing bottom plate 55 seals the cooling groove 4, then the semiconductor refrigeration sheet 53 is controlled to refrigerate, the cold quantity is conducted to the cooling sliding block 52 through the telescopic bag 54, and then the cooling sliding block 52 conducts the cold quantity into the cooling water in the cooling groove 4, so that the cooling and cooling effect is achieved.

[0035] Please refer to Figure 5 The cooling sliding block 52 comprises a temperature insulation plate 521 slidingly connected in the sliding hole, a temperature conducting block 522 is fixedly connected in the middle of the temperature insulation plate 521, the temperature insulation plate 521 is made of heat preservation material, the temperature conducting block 522 is made of material with high thermal conductivity, the material with high thermal conductivity can be graphite synthetic material, the temperature insulation plate 521 can effectively prevent the cooling water from absorbing and taking away the cold quantity of the temperature conducting block 522 when contacting the cooling assembly 5, and the sealing bottom plate 55 is made of material with high thermal conductivity, which can greatly improve the temperature transfer efficiency.

[0036] Please continue to refer to Figure 5, the telescopic bag 54 includes a tight bag 541, the tight bag 541 is fixedly connected between the cooling sliding block 52 and the semiconductor refrigeration piece 53, the tight bag 541 is filled with temperature-guiding liquid 542, the temperature-guiding liquid 542 can be selected from one of water, cooling liquid and heat-conducting oil, a plurality of tight ropes 543 are fixedly connected in the middle of the tight bag 541, a plurality of poking balls 544 are fixedly connected in the middle of the tight rope 543, the tight bag 541 and the tight rope 543 are made of high toughness material, the cold energy generated by the semiconductor refrigeration piece 53 is conducted to the temperature-guiding block 522 in a large amount through the stretching of the tight bag 541 combined with the temperature-guiding liquid 542 in the tight bag 541, and the temperature-guiding effect of the temperature-guiding liquid 542 can be better through the swinging of the plurality of poking balls 544 arranged in the middle of the tight rope 543.

[0037] Please refer to Figure 5 and Figure 6 , the poking ball 544 includes a hollow ball 5441, the hollow ball 5441 is fixedly connected in the middle of the tight rope 543, the hollow ball 5441 is filled with iron powder 5442, a plurality of poking pieces 5443 are fixedly connected to the outer end of the hollow ball 5441, the hollow ball 5441 is swung through the influence of the magnetic force of the swinging poking piece 8 on the iron powder 5442, and the temperature-guiding liquid 542 in the tight bag 541 can flow under the poking action of the poking piece 5443, so that the temperature-guiding liquid 542 is cooled faster, thereby effectively accelerating the conduction of cold energy, and the cold energy is better conducted to the temperature-guiding block 522 and introduced into the cooling water in the cooling groove 4.

[0038] Please refer to Figure 7 and Figure 8 , the liquid passing hole 7 is arranged in the middle of the cooling sliding block 52, and a heat preservation pad is fixedly connected to the inner end of the liquid passing hole 7, the heat preservation pad can play a heat insulation and heat preservation role through the installation, and can effectively prevent the cold energy in the temperature-guiding block 522 from being absorbed and taken away by the cooling water when passing through the liquid passing hole 7.

[0039] Please refer to Figure 8 , the swinging poking piece 8 is fixedly connected to the inner end of the liquid passing hole 7, and the swinging poking piece 8 includes a toughness block 81, the toughness block 81 is fixedly connected to the inner wall of the liquid passing hole 7, a magnetic block 82 is fixedly connected to the end of the toughness block 81 away from the cooling assembly 5, the toughness block 81 is made of high elasticity material, and the high elasticity material can be selected from one of high-temperature-resistant silica gel and high-temperature-resistant rubber, the swinging poking piece 8 is swung as a whole through the toughness block 81 when the cooling water passes through the liquid passing hole 7, the swinging is affected by the flow of water, the magnetic block 82 also swings, and the swinging amplitude of the magnetic block 82 directly affects the swinging of the poking ball 544, and the poking ball 544 swings back and forth.

[0040] Working principle:

[0041] After the mold is injection molded, the staff cools the cooling pipe 2 and the refrigeration box 3 by circulating cooling water in the cooling pipe 2, and the refrigeration box 3 cools the high-temperature cooling water, then detects the uncooled part of the finished product by the prior art, and cools and cools the local high-temperature part by the cooling assembly 5, controls the electric telescopic rod 6 to drive the sealing bottom plate 55 to move downward, and drives the cooling slider 52 to move downward and stretch the telescopic bag 54, and the cooling water in the cooling pipe 2 enters the cooling groove 4 and is sealed by the sealing bottom plate 55, then controls the semiconductor refrigeration piece 53 to cool, and the cold quantity is conducted to the telescopic bag 54, and when the cooling water in the cooling pipe 2 passes through the liquid hole 7, the oscillating paddle 8 is oscillated, the magnetic block 82 is driven to oscillate by the magnetic force, so that the telescopic bag 54 can be fully cooled, then the cold quantity of the telescopic bag 54 is conducted to the temperature guide block 522, and the cold quantity is conducted into the cooling water in the cooling groove 4 by the temperature guide block 522, and the local high temperature is cooled by the low-temperature cooling water.

[0042] Compared with the prior art, the advantages of the present application are:

[0043] The present application can realize water cooling of the molding mold by the cooling pipe 2 and the refrigeration box 3, and independently cool the local high-temperature part of the finished product by the cooling assembly 5, so as to effectively accelerate the cooling of the injection molded product, detect the local high-temperature part, control the electric telescopic rod 6 to push the sealing bottom plate 55 to drive the cooling slider 52 to move downward and stretch the telescopic bag 54 until the sealing bottom plate 55 completely covers the cooling groove 4, and part of the cooling water stays in the cooling groove 4, then controls the semiconductor refrigeration piece 53 to cool, and the cold quantity is conducted to the cooling slider 52 through the telescopic bag 54, and the cold quantity is conducted into the cooling water in the cooling groove 4 by the cooling slider 52 to make it cold, and the local high-temperature part of the finished product is cooled by the cold cooling water, so that the molded product is fully cooled, so that the finished product can be continuously molded in the injection molding process, and the injection molding efficiency is effectively improved.

[0044] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0045] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment exhibits only one independent technical solution, and the present specification is described in this manner only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. A continuously formable plastic forming mold characterized by: Including: The mold body (1) is one pair, the cooling hole is fixedly installed in the cooling hole, the cooling pipe (2) is fixedly connected with the refrigeration box (3), and the cooling pipe (2) is fixedly connected with the refrigeration box (3). The cooling tank (4) is provided with a cooling tank (4), and the cooling tank (4) is provided with a cooling tank (4). The cooling assembly (5) is located in the mold body (1), the installation hole is communicated with the cooling hole, and the cooling assembly (5) is fixedly connected in the installation hole. The cooling assembly (5) includes an installation block (51), the installation block (51) is fixedly connected in the installation hole, the installation block (51) is provided with a sliding hole in the middle, the sliding hole is slidably connected with a cooling sliding block (52), the installation block (51) is provided with a semiconductor refrigeration piece (53) on the upper end, and the semiconductor refrigeration piece (53) is fixedly connected to the inner wall of the installation hole. The cooling pipe (2) is provided with a through hole matched with the sealing bottom plate (55), and the through hole is communicated with the cooling tank (4) and the sliding hole. The electric telescopic rod (6) is located in the installation hole, the electric telescopic rod (6) is fixedly connected to the side end of the cooling assembly (5), and the electric telescopic rod (6) is fixedly connected to the sealing bottom plate (55). The liquid passing hole (7) is provided in the middle of the cooling sliding block (52). The swing push piece (8) is provided with a plurality of swing push pieces (8), and the swing push piece (8) is fixedly connected to the inner end of the liquid passing hole (7).

2. A continuously formable plastic forming mold as defined in claim 1, characterized in that: The cooling sliding block (52) includes a temperature insulation plate (521), and the temperature insulation plate (521) is slidably connected in the sliding hole.

3. A continuously formable plastic forming mold as defined in claim 2, wherein: The temperature insulation plate (521) is made of heat preservation material, and the temperature insulation plate (521) is made of material with high thermal conductivity.

4. A continuously formable plastic forming mold as defined in claim 1, wherein: The elastic bag (541) is fixedly connected between the cooling sliding block (52) and the semiconductor refrigeration piece (53), the elastic bag (541) is filled with temperature guide liquid (542), and the elastic bag (541) is fixedly connected with a plurality of elastic ropes (543) in the middle.

5. A continuously formable plastic forming mold as defined in claim 4, wherein: The elastic bag (541) and the elastic rope (543) are made of high toughness material.

6. A continuously formable plastic forming mold as defined in claim 4, wherein: The push ball (544) includes a hollow ball (5441), the hollow ball (5441) is fixedly connected in the middle of the elastic rope (543), the hollow ball (5441) is filled with iron powder (5442), and the hollow ball (5441) is fixedly connected with a plurality of push pieces (5443) on the outer end.

7. A continuously formable plastic forming mold as defined in claim 1, wherein: The swing knob (8) comprises a flexible block (81) fixedly connected to the inner wall of the liquid passing hole (7), and a magnetic block (82) fixedly connected to the end of the flexible block (81) away from the cooling assembly (5).

8. A continuously formable plastic forming mold as defined in claim 7, wherein: The flexible block (81) is made of high-elasticity material.

9. A continuously formable plastic forming mold as defined in claim 1, wherein: The cooling pipe (2) is fixedly connected with a sealing gasket at the connection with the cooling groove (4) and the connection with the cooling assembly (5).

10. A continuously formable plastic forming mold as defined in claim 1, wherein: The inner end of the liquid passing hole (7) is fixedly connected with a heat preservation pad.

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