A flatness control method for LED module splicing

Abstract

The application provides a flatness control method for LED module splicing, which is used for controlling the flatness when two or more LED modules are spliced, and comprises the following steps: S1, dividing the to-be-milled area at the four peripheral edges of the bottom surface of the substrate in the LED module, so that the width of the to-be-milled area is less than or equal to half of the size of the box support part; S2, placing the LED module reversely on the milling machine, with the film adhesive layer in the LED module being in contact with the top surface of the milling machine, measuring the height of the to-be-milled area of the substrate in the LED module, recording the minimum value a1, and adjusting the milling machine reference so that the cutter is aligned with the to-be-milled area, and setting the minimum value a1 as the depth of the milling plane of the milling machine; S3, starting the milling machine to mill the plane of the to-be-milled area, taking down the LED module after the milling of the plane is completed, and splicing and packing the to-be-milled area and the corresponding support part of the box. The height difference of the splicing joint can be improved, so that the flatness of the module splicing is improved.

Description

Technical Field

[0001] This invention relates to the field of LED module splicing technology, and specifically to a method for controlling the flatness of LED module splicing. Background Technology

[0002] Currently, with the trend of electronic products becoming lighter, thinner, shorter, and smaller, Miniled display products have begun to be widely used in ultra-large high-definition displays, such as monitoring and command, high-definition broadcasting, high-end cinemas, medical diagnostics, advertising displays, conference and exhibition, office displays, virtual reality, and other commercial fields. These devices, used to display various information such as text, images, video, and recorded signals, can accommodate more Miniled LEDs on their circuit boards. However, when multiple LED modules are spliced ​​together, unevenness in the spliced ​​screen can easily occur, affecting the display effect. To address this technical problem, Chinese patent application number 202120211099.5, published on October 22, 2021, discloses an LED display method for improving installation flatness. The screen module installation structure includes: an LED display screen, a fixing plate, a connecting block, a motor, and a drive screw. A connecting block is installed on the rear end of the LED display screen, and fixing bolts are installed inside the connecting block. A fixing plate is installed on the rear end of the connecting block, and a driven screw and a drive screw are installed on the inner side of the fixing plate. A drive wheel is installed on the rear end of the drive screw. By adding the driven screw, drive screw, fixing plate, drive wheel, driven wheel, and motor, when the assembled LED display screen is uneven, the degree of protrusion and concavity of each LED display screen can be controlled by the motor, thereby readjusting the LED display screen assembly to make it flatter. It can also make specific LED displays more prominent, making it more convenient to use. However, this structure requires complex mechanisms such as motors and screws to control the flatness of the screen, and it has high requirements for the consistency of dimensions between multiple screws. Inconsistencies in the dimensions of multiple screws or inconsistencies in the dimensions after installation will lead to inconsistencies in the screen after adjustment. Summary of the Invention

[0003] The purpose of this invention is to provide a flatness control method for LED module splicing, which can improve the height difference of splicing seams, thereby improving the flatness of module splicing, and has good control accuracy.

[0004] To achieve the above objectives, the present invention provides a method for controlling the flatness of LED module splicing, used to control the flatness of two or more LED modules spliced ​​on a housing. Each LED module includes a substrate, an LED chip, and an adhesive film layer, the adhesive film layer being disposed on the LED chip. The housing is provided with two or more support parts, and the method includes the following steps:

[0005] S1. Divide the area to be milled at the four edges of the bottom surface of the substrate in the LED module, and make the width of the area to be milled less than or equal to half the size of the box support.

[0006] S2. Place the LED module upside down on the milling machine, with the adhesive layer in the LED module in contact with the top surface of the milling machine. Measure the height of the area to be milled on the substrate in the LED module and record the minimum value a1. Adjust the milling machine reference so that the tool is aligned with the area to be milled, and set the minimum value a1 as the depth of the milling plane of the milling machine.

[0007] S3. Start the milling machine to mill the plane of the area to be milled. After the plane is milled, remove the LED module and assemble the area to be milled with the support part of the box.

[0008] The above settings record the height of the area to be milled on the bottom surface of the substrate in the LED module and record the minimum value. Then, the area to be milled is milled according to the minimum value, so that the bottom surface of the substrate in the area to be milled is the same plane. Since the adhesive layer in the LED module is formed after cutting, it has a certain degree of flatness. Then, milling the plane with a milling machine can ensure the flatness of the contact position between the bottom surface of the substrate and the cabinet. In addition, the milling machine method can not only facilitate the milling of the plane, but also ensure the accuracy of adjustment. It is easy to operate, simple in structure, and does not require additional structures to achieve this.

[0009] Furthermore, in step S2, only the substrate layer is set in the area to be milled.

[0010] The above settings only include the substrate layer and do not include the circuit layer, to prevent damage to the circuit lines in the substrate during milling.

[0011] Furthermore, the milling area in step S2 includes two transverse milling areas and two longitudinal milling areas, which are connected. The width of the transverse milling area and the width of the longitudinal milling area are less than or equal to 1 / 2 of the width of the support.

[0012] The above settings facilitate the milling of the two LED modules to form a new plane on the housing after milling, without affecting the splicing with other LED modules.

[0013] Furthermore, step S3 also includes first adjusting the milling machine reference so that the tool is aligned with the transverse milling area, and then setting the minimum value a1 to the depth of the milling plane of the milling machine, so that a new transverse plane is obtained after the transverse milling area is milled.

[0014] The above settings enable milling of a plane in the transverse milling area.

[0015] Furthermore, step S3 also includes setting the new transverse plane as the new reference for the milling machine after completing the milling of the transverse milling area, setting the minimum value a1 as the depth of the milling plane, adjusting the substrate direction, milling the plane of the longitudinal milling area, and obtaining a new longitudinal plane after completing the milling of the longitudinal milling area, and the new transverse plane and the new longitudinal plane are in the same plane.

[0016] The above settings ensure that the new longitudinal plane formed after milling the longitudinal area to be milled is in the same plane as the new transverse plane. This allows a new plane to be obtained by milling the plane, which can be used for installation on the box body, avoiding flatness issues during the splicing process.

[0017] Furthermore, in step S3, after milling the area to be milled, a new plane and a side surface are obtained, and one end of the side surface is perpendicularly connected to one end of the new plane.

[0018] The above settings, after the side engages with the cabinet support, can limit the movement of the LED module.

[0019] Furthermore, the height of the new plane obtained after milling is equal to or greater than the minimum value a1.

[0020] The above settings ensure that the LED module can be restricted from moving horizontally when it is installed on the cabinet.

[0021] Furthermore, step S1 also includes setting pads at intervals along the circumferential direction on the area to be milled, and setting corresponding pads on the pads; the pads are set correspondingly to the support on the housing. Step S2 also includes placing the LED module in reverse on the milling machine, with the adhesive layer in the LED module in contact with the top surface of the milling machine, measuring the height of the pads on the area to be milled in the LED module substrate, and recording the minimum value a1; and adjusting the milling machine reference so that the tool is aligned with the pads on the area to be milled to mill flat, while setting the minimum value a1 as the depth of the milling surface of the milling machine.

[0022] The above setup prevents damage to the substrate by placing shims on the milling area and protects the pads by placing shims on the milling area at the edge of the substrate. The structure is simple and ensures the flatness of the substrate while ensuring control accuracy.

[0023] Furthermore, the width range of the area to be milled is set to 2.5mm~4.5mm.

[0024] The above settings ensure that the width of the area to be milled is not too large, thus affecting the reliability of the area to be milled. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the LED module after it is placed on the box in one embodiment of the present invention.

[0026] Figure 2 This is a schematic diagram of the structure of an LED module in one embodiment of the present invention.

[0027] Figure 3 This is a schematic diagram of the structure of the LED module after it is placed on the box in another embodiment of the present invention.

[0028] Figure 4 This is a schematic diagram of the structure of an LED module in another embodiment of the present invention.

[0029] Figure 5 This is a schematic diagram of the housing used for splicing LED modules in this invention. Detailed Implementation

[0030] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation details.

[0031] Example 1.

[0032] like Figure 3-5 As shown, the present invention provides a flatness control method for splicing LED modules, which is used to control the flatness when two or more LED modules are spliced ​​on a housing 2. The LED module includes a substrate 1, an LED chip 11, and an adhesive film layer 12. The housing 2 includes a support part 21. In this embodiment, the support parts 21 are configured with a gap structure. A protrusion is provided in the middle of the housing 2. The height of the protrusion is lower than the height of the support part, so that the protrusion will not affect the support of the substrate.

[0033] The specific steps include:

[0034] S1. A milling area is defined at the four edges of the driving surface 11 of the substrate 1 in the LED module. No circuit lines are set in the milling area. The milling area includes two horizontal milling areas 41 and two vertical milling areas 42. The width of the horizontal milling area 41 and the width of the vertical milling area 42 are less than or equal to 1 / 2 of the width of the support 21. In this embodiment, the width of the horizontal milling area 41 and the width of the vertical milling area 42 are both set to 2.5mm.

[0035] S2. Place the LED module upside down on the milling machine, with the adhesive layer 12 in the LED module in contact with the top surface of the milling machine. Measure the height of the area to be milled on the substrate 1 of the LED module and record the minimum value a1. Adjust the milling machine reference so that the tool is aligned with the area to be milled, and set the minimum value a1 as the depth of the milling plane. In this embodiment, the height of the area to be milled on the substrate 1 can be measured by a rangefinder mounted on the milling machine. In another embodiment, the minimum thickness of the area to be milled can also be determined by measuring the thickness from the bottom surface of the substrate 1 on the milling machine to the top surface of the adhesive layer. Then, determine the height of the milling area at the minimum thickness position and record the minimum value a1. Then start the milling machine to mill the transverse milling area 41. After the transverse milling area 41 is milled, a new transverse plane 411 is obtained. The new transverse plane 411 is reset as the new reference of the milling machine. At the same time, the milling depth of the milling plane remains unchanged. Adjust the substrate direction and align it with the longitudinal milling area 42 to mill. After the longitudinal milling area 42 is milled, a new longitudinal plane 422 is obtained. The new transverse plane 411 and the new longitudinal plane 422 are in the same plane.

[0036] S3. After milling the transverse milling area 41 and the longitudinal milling area 42, a new plane 5 and a side surface 6 are obtained. One end of the side surface 6 is perpendicularly connected to one end of the new plane 5, and the height of the new plane 5 to the driving surface 11 of the substrate 1 is equal to or greater than the minimum value a1 recorded in step S1. The LED module is removed from the milling machine. When splicing and packing the LED module, the new plane 5 of the two LED modules is made to make smooth contact with the top surface of the support 21, and the side surface 6 is engaged with the inner side wall of the support 21, which can restrict the movement of the LED module in the horizontal direction.

[0037] The working principle of this invention is as follows: By recording the height of the area to be milled on the bottom surface of the substrate 1 in the LED module and recording the minimum value, the area to be milled is then milled according to the minimum value standard, so that the bottom surface of the substrate 1 in the area to be milled is the same plane. Since the adhesive film layer 13 in the LED module is formed after cutting, it has a certain flatness. Then, by milling the plane with a milling machine, the flatness of the contact position between the bottom surface of the substrate and the housing can be ensured. In addition, the milling machine method can not only facilitate the milling of the plane, but also ensure the accuracy of adjustment. It is easy to operate, simple in structure, and does not require additional structures to achieve this.

[0038] Example 2.

[0039] like Figure 1 , 2As shown in Figure 5, this invention provides a method for controlling the flatness of LED module splicing, used to control the flatness of two or more LED modules spliced ​​on a housing 2. The LED module includes a substrate 1, LED chips 11, and an adhesive film layer 12. It also includes milling areas set around the perimeter of the LED module substrate 1, with pads 13 on the milling areas and matching spacers 3 on the pads 13. The housing 2 includes support portions 21. In this embodiment, the support portions 21 are spaced apart. Eight spacers 3 are provided. Pads (not shown in the figure) are provided at the contact points between the LED module substrate 1 and the support portions 21. The spacers 3 are correspondingly located at these contact points. One end of each spacer 3 is fixed to the bottom surface of the LED module substrate 1. In this embodiment, the spacers 3 are fixed to the bottom surface of the LED module substrate 1 by welding. The specific steps of the method include:

[0040] S1. Step S1 also includes setting pads at intervals along the edge direction on the area to be milled, and setting pads on the pads accordingly; the pads are set correspondingly to the support on the housing; in this embodiment, the pads 3 are mounted on the pads (not shown in the figure) at the support by the SMT placement process.

[0041] S2. The LED module is placed upside down on a milling machine, with the adhesive layer 12 in the LED module in contact with the top surface of the milling machine. The height of the pad 3 on the area to be milled in the substrate of the LED module is measured, and the minimum value a1 is recorded. The milling machine reference is adjusted so that the tool is aligned with the pad 3 on the area to be milled and milled flat. At the same time, the minimum value a1 is set as the depth of the milling plane. In this embodiment, the milling machine is started to mill the pad 3 flat. After the first pad 3 is milled flat, a new pad flat is obtained. The new pad flat is reset as the new reference of the milling machine. The other pads 3 are milled flat in sequence. After the new pad flat is completed, the new pad flats on the bottom surface 11 of the LED module substrate 1 are on the same plane.

[0042] S3. Remove the LED module from the milling machine. When assembling and packing the LED module, ensure that the new plane of the gasket makes smooth contact with the top surface of the support 21.

[0043] The working principle of this invention is as follows: By recording the height of the milling area on the bottom surface of the substrate 1 in the LED module and recording the minimum value, the pads on the milling area are milled according to the minimum value standard, so that the bottom surface of the substrate 1 in the milling area and the support part are the same plane after contact. Since the adhesive film layer 13 in the LED module is formed after cutting, it has a certain flatness. Then, by milling the plane with a milling machine, the flatness of the contact position between the bottom surface of the substrate and the housing can be ensured. In addition, the milling machine method can not only facilitate the milling of the plane, but also ensure the adjustment accuracy. It is easy to operate, simple in structure, and does not require additional structures to achieve this. In addition, the pads can be set on the milling area without damaging the substrate and ensuring the stability of the pads.

Claims

1. A method for controlling the flatness of LED module splicing, used to control the flatness of two or more LED modules spliced ​​on a housing, each LED module including a substrate, an LED chip, and an adhesive film layer, the adhesive film layer being disposed on the LED chip, and the housing being provided with two or more support parts, characterized in that: Includes the following steps: S1. Divide the area to be milled at the four edges of the bottom surface of the substrate in the LED module, and make the width of the area to be milled less than or equal to half the size of the box support. S2. Place the LED module upside down on the milling machine, with the adhesive film layer in the LED module in contact with the top surface of the milling machine. Measure the height of the area to be milled on the substrate in the LED module and record the minimum value a1. Adjust the milling machine reference so that the tool is aligned with the area to be milled. At the same time, set the minimum value a1 to the depth of the milling plane of the milling machine so that the bottom surface of the substrate on the area to be milled is the same plane. S3. Start the milling machine to mill the plane of the area to be milled. After the plane is milled, remove the LED module and assemble the area to be milled with the support part of the box. 2.The flatness control method for LED module splicing according to claim 1, characterized in that: In step S2, only the substrate layer is set in the area to be milled.

3. The flatness control method for LED module splicing according to claim 1, characterized in that: The milling area in step S2 includes two transverse milling areas and two longitudinal milling areas. The two transverse milling areas and the two longitudinal milling areas are connected. The width of the transverse milling area and the width of the longitudinal milling area are less than or equal to 1 / 2 of the width of the support.

4. The method for controlling the flatness of LED module splicing according to claim 1, characterized in that: Step S3 also includes first adjusting the milling machine reference so that the tool is aligned with the transverse milling area, and then setting the minimum value a1 to the depth of the milling plane of the milling machine. After the transverse milling area is completed, a new transverse plane is obtained.

5. The method for controlling the flatness of LED module splicing according to claim 4, characterized in that: Step S3 also includes setting the new horizontal plane as the new reference for the milling machine after completing the milling of the horizontal milling area, setting the minimum value a1 as the depth of the milling plane, adjusting the substrate direction, milling the plane of the vertical milling area, and obtaining a new vertical plane after completing the milling of the vertical milling area, and the new horizontal plane and the new vertical plane are in the same plane.

6. The method for controlling the flatness of LED module splicing according to claim 1, characterized in that: In step S3, after milling the plane of the area to be milled, a new plane and a side surface are obtained, and one end of the side surface is perpendicularly connected to one end of the new plane.

7. The method for controlling the flatness of LED module splicing according to claim 6, characterized in that: The height of the new plane obtained after milling is equal to or greater than the minimum value a1.

8. The flatness control method for LED module splicing according to claim 1, characterized in that: Step S1 also includes setting pads at intervals along the edge direction on the area to be milled, and setting pads on the pads accordingly; the pads are set correspondingly to the support on the housing. Step S2 also includes placing the LED module in reverse on the milling machine, with the adhesive film layer in the LED module in contact with the top surface of the milling machine, measuring the height of the pads on the area to be milled on the substrate of the LED module, and recording the minimum value a1. The milling machine reference is adjusted so that the tool is aligned with the shim on the area to be milled and milled flat, while the minimum value a1 is set as the depth of the milling surface.

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