Semiconductor laser sintering fixture fastening device and method of use thereof

Abstract

The application relates to a semiconductor laser sintering clamp fastening device and a use method thereof, and belongs to the technical field of semiconductor laser manufacturing. The device comprises a sintering clamp, a C-shaped fixing base, a turbine, a worm, a camshaft and a fixing plate. The lower end of the C-shaped fixing base is sleeved with the sintering clamp in a sliding mode, one side of the inside of the C-shaped fixing base is provided with the camshaft, the two ends of the camshaft are slidably connected to the C-shaped fixing base through bearings, the one end of the camshaft is externally connected with the turbine, the turbine is connected with the worm, and the worm is fixedly arranged outside the C-shaped fixing base through the fixing plate. The application designs a novel fastening method, the sintering clamp is fastened by adopting the structure of the cam above the fastening structural member, the height difference during the rotation of the cam can generate a downward force to fix the sintering clamp, the axial rotation friction force direction of the cam is parallel to the direction of the bar light emitting surface, the bar is not deviated, and the phenomenon that one side of the sintered laser is shrunk and the other side is excessively protruded is avoided.

Description

TECHNICAL FIELD

[0001] The application relates to a semiconductor laser sintering clamp fastening device and a method thereof, and belongs to the technical field of semiconductor laser manufacturing. BACKGROUND

[0002] With the rapid development of semiconductor material technology and laser packaging process technology, high-power laser diode single-tube devices and array devices have been rapidly developed at home and abroad and have become the main direction of current laser industry application expansion. Semiconductor lasers have the advantages of small size, high efficiency and low cost, and are widely used in technical fields such as laser medical treatment, laser display, industrial processing, military weapons, solid-state lasers and fiber laser pumping.

[0003] At present, a laser bar array can greatly improve the power of a semiconductor laser, and packaging forms thereof mainly include a heat conduction cooling type, a macro-channel liquid cooling type and a micro-channel liquid cooling type. However, for high-power semiconductor lasers, the heat dissipation efficiency of the heat conduction cooling and the macro-channel cooling mode is relatively low, which affects the service life and reliability of the device. The micro-channel cooling has higher heat dissipation efficiency due to the built-in cooling liquid channel, and the semiconductor laser packaged by the micro-channel can work in the CW and high-duty-cycle QCW modes. Generally, the micro-channel packaging is mainly based on a chip mounter system and a reflow soldering process. However, the micro-channel packaging currently mainly adopts soft solder packaging (indium solder). The former is not in a vacuum environment during the welding process, which is easy to cause oxidation of the indium solder, which is not conducive to welding. The latter is carried out in a reflow oven, which ensures the oxygen-free environment during the welding process and prevents the oxidation of the solder during the welding process.

[0004] At present, the micro-channel packaging mainly uses a clamp to fix the bar, and the screw method is mainly used to fix the clamp. Chinese patent CN201920108825 discloses a high-power semiconductor laser packaging sintering clamp. The clamp structure adopts a positioning device to ensure structural cooperation. However, due to the existence of the cooperation gap of each structural part, the structural part for fixing the bar in the clamp is easy to slightly deviate when the clamp is fixed by tightening the screw, and the friction between the bar and the fixing structural part will cause the bar to deviate, which will show that one side is inwardly contracted and the other side is excessively protruded after sintering. Therefore, the application is proposed to improve the fixing method of the sintering clamp. SUMMARY

[0005] To address the shortcomings of existing technologies, this invention provides a semiconductor laser sintering fixture fastening device and designs a novel fastening method. A cam structure is used above the fastening structure to fasten the sintering fixture. The height difference when the cam rotates generates a downward force to fix the sintering fixture. Moreover, the axial rotational friction of the cam is parallel to the direction of the light-emitting surface of the bar, which will not cause the bar to deviate and avoid the phenomenon that the laser after sintering will have one side shrinking inward and the other side protruding too much.

[0006] The present invention also provides a method for using the above-described semiconductor laser sintering fixture fastening device.

[0007] The technical solution of the present invention is as follows:

[0008] A semiconductor laser sintering fixture fastening device includes a sintering fixture, a C-type fixing seat, a turbine, a worm gear, a camshaft, and a fixing plate, wherein...

[0009] A sintering fixture is slidably sleeved at the lower end of the C-shaped fixed seat. A camshaft is provided on one side inside the C-shaped fixed seat. Both ends of the camshaft are slidably connected to the C-shaped fixed seat through bearings. A turbine is connected to one end of the camshaft, and a worm gear is connected to the turbine. The worm gear is fixedly set on the outside of the C-shaped fixed seat through a fixing plate.

[0010] Preferably, the sintering fixture includes a pressure block and a base. The pressure block is provided on the base, and grooves are provided on both sides of the base. Bosses are provided on both sides of the lower end of the C-shaped fixing seat. The sliding adjustment of the base is realized by the cooperation of the grooves and the bosses.

[0011] In a further preferred embodiment, the camshaft is positioned above the pressure block, and the axial rotational friction of the camshaft is parallel to the direction of the light-emitting surface of the bar inside the sintering fixture. This will prevent the bar from becoming misaligned and avoid the phenomenon that the laser after sintering will have one side shrinking inward and the other side protruding excessively.

[0012] Preferably, the camshaft includes a cam and a drive shaft. The two ends of the rotating shaft are slidably connected to the C-shaped fixed seat through bearings, and the cam is fixedly mounted on the drive shaft.

[0013] In a further preferred embodiment, the cam is an eccentric wheel, and the thickness of the cam is the same as the width of the pressure block.

[0014] The operating steps for using the above-mentioned semiconductor laser sintering fixture fastening device are as follows:

[0015] (1) Insert the sintering fixture into the C-type fixed seat and adjust the position of the force-bearing point of the sintering fixture;

[0016] (2) Rotate the worm gear to drive the turbine and camshaft to rotate. When the camshaft rotates downward, the cam presses down on the sintering fixture to fix the sintering fixture.

[0017] (3) Place the sintering fixture and fastening device into the reflow oven for semiconductor laser sintering.

[0018] The beneficial effects of this invention are as follows:

[0019] 1. This invention designs a novel fastening method. A cam structure is used above the fastening structure to fasten the sintering fixture. The height difference when the cam rotates will generate a downward force to fix the sintering fixture. Moreover, the axial rotation friction of the cam is parallel to the direction of the light-emitting surface of the bar, which will not cause the bar to deviate and avoid the phenomenon that the laser after sintering will have one side shrinking inward and the other side protruding too much.

[0020] 2. This invention enables adjustment of the force point and the magnitude of the force during the fastening of the sintering fixture. The flexible position adjustment, controllable pressure, and consistent force direction improve the fault tolerance of the sintering fixture and avoid the defect rate caused by bar misalignment.

[0021] 3. This invention is also applicable to the fastening of other upper and lower modules with precision requirements, avoiding the defects of force concentration and inability to adjust the force point caused by traditional screw fixing, thus improving the precision. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the present invention;

[0023] Figure 2 This is a side sectional view of the present invention;

[0024] Figure 3 This is a rear view of the base of the present invention;

[0025] Figure 4 This is a schematic diagram of the C-type fixing base structure of the present invention;

[0026] The components are: 1. Turbine; 2. Worm gear; 3. C-type fixed seat; 4. Camshaft; 5. Pressure block; 6. Base; 7. Cam; 8. Heat sink; 9. Fixed plate; 10. Groove I; 11. Groove II; 12. Boss I; 13. Boss II; 14. Sintering fixture. Detailed Implementation

[0027] The present invention will be further described below with reference to the embodiments and accompanying drawings, but is not limited thereto.

[0028] Example 1:

[0029] like Figures 1-4 As shown, this embodiment provides a semiconductor laser sintering fixture fastening device, including a sintering fixture 14, a C-shaped fixing seat 3, a turbine 1, a worm gear 2, a camshaft 4, and a fixing plate 9, wherein...

[0030] A sintering fixture 14 is slidably sleeved at the lower end of the C-shaped fixing seat 3. A camshaft 4 is provided on one side inside the C-shaped fixing seat 3. Both ends of the camshaft 4 are slidably connected to the C-shaped fixing seat 3 through bearings. A turbine 1 is connected to one end of the camshaft 4. The turbine 1 is connected to a worm gear 2. The worm gear 2 is fixed to the outside of the C-shaped fixing seat 3 through a fixing plate 9. The turbine and worm gear are existing structures with self-locking fastening.

[0031] The sintering fixture 14 includes a pressure block 5 and a base 6. The pressure block 5 is mounted on the base 6. Grooves I 10 and II 11 are respectively provided on both sides of the base 6. Bosses I 12 and II 13 are respectively provided on both sides of the lower end of the C-shaped fixing seat 3. The sliding adjustment of the base is achieved through the cooperation of the grooves and bosses. The sintering fixture adopts the fixture disclosed in Chinese Patent CN201920108825. Only the pressure block and base are described and drawn; other structures (such as the heat sink 8, bar strips, etc.) are not described in detail.

[0032] The camshaft 4 includes a cam 7 and a drive shaft. The two ends of the rotating shaft are slidably connected to the C-shaped fixed seat through bearings, and the cam 7 is fixedly mounted on the drive shaft.

[0033] The operating steps for using the above-mentioned semiconductor laser sintering fixture fastening device are as follows:

[0034] (1) Insert the sintering fixture 14 into the C-type fixing seat 3 and adjust the position of the force-bearing point of the sintering fixture 14;

[0035] (2) Rotate the worm gear 2 to drive the turbine 1 and camshaft 4 to rotate. When the camshaft 4 rotates downward, the cam 7 presses down on the sintering fixture 14 to fix the sintering fixture 14.

[0036] (3) Place the sintering fixture 14 together with the fastening device into the reflow oven for semiconductor laser sintering.

[0037] Example 2:

[0038] A semiconductor laser sintering fixture fastening device, with the structure as described in Embodiment 1, differs in that the camshaft 4 is positioned above the pressure block 5, and the axial rotational friction of the camshaft 4 is parallel to the direction of the light-emitting surface of the bar inside the sintering fixture 14, which will not cause the bar to be misaligned, thus avoiding the phenomenon that the laser after sintering will have one side shrinking inward and the other side protruding too much.

[0039] Example 3:

[0040] A semiconductor laser sintering fixture fastening device, with the structure as described in Example 1, except that the cam 7 is an eccentric wheel, and the thickness of the cam 7 is the same as the width of the pressure block 5.

Claims

1. A fastening device for a semiconductor laser sintering fixture, characterized in that, It includes a sintering fixture, a C-type mounting base, a turbine, a worm gear, a camshaft, and a mounting plate, among which, A sintering fixture is slidably sleeved at the lower end of the C-type fixed seat. A camshaft is provided on one side inside the C-type fixed seat. Both ends of the camshaft are slidably connected to the C-type fixed seat through bearings. A turbine is connected to one end of the camshaft. The turbine is connected to a worm gear. The worm gear is fixedly set on the outside of the C-type fixed seat through a fixing plate. The camshaft is positioned above the pressure block, and the axial rotational friction of the camshaft is parallel to the direction of the light-emitting surface of the bar inside the sintering fixture. The camshaft includes a cam and a drive shaft. The two ends of the drive shaft are slidably connected to the C-shaped fixed seat through bearings. The cam is fixedly mounted on the drive shaft. The cam is an eccentric wheel, and the thickness of the cam is the same as the width of the pressure block.

2. The semiconductor laser sintering fixture fastening device as described in claim 1, characterized in that, The sintering fixture includes a pressure block and a base. The pressure block is provided on the base, and grooves are provided on both sides of the base. Bosses are provided on both sides of the lower end of the C-shaped fixing seat.

3. A method of using the semiconductor laser sintering fixture fastening device as described in claim 2, characterized in that, The operation steps are as follows: (1) Insert the sintering fixture into the C-type fixed seat and adjust the position of the force-bearing point of the sintering fixture; (2) Rotate the worm gear to drive the turbine and camshaft to rotate. When the camshaft rotates downward, the cam presses down on the sintering fixture to fix the sintering fixture. (3) Place the sintering fixture and fastening device into the reflow oven for semiconductor laser sintering.

Images