Deposition fabrication of diffractive optical elements with variable refractive index profile by inkjet printing

Abstract

Various embodiments of this disclosure generally relate to optical devices. More specifically, the various embodiments described herein relate to optical devices and methods of manufacturing optical devices having an optical device structure with at least one of varying depth or refractive index across the surface of a substrate. According to some embodiments, inkjet processing is used to deposit a volume-variable optical device, which is etched to form a diffractive optical element (DOE). The volume variation may be related to the thickness of the optical device or the relative volumes of two or more diffractive materials deposited in combination. According to other various embodiments, a single-profile DOE is deposited on a substrate and a volume-variable organic material is deposited on top of the DOE using inkjet processing. The DOE and organic material are etched to modify the profile of the structure, and then the organic material is removed, leaving the modified-profile DOE.

Description

background Technical Field

[0002] The various embodiments of this disclosure generally relate to optical devices. More specifically, the various embodiments described herein relate to optical devices and methods of manufacturing optical devices, the optical devices having optical device structures with altered profiles and refractive indices. Background Technology

[0004] Diffractive optical elements (DOEs) are common optical components used to manipulate light in solutions such as combining, focusing, or otherwise functioning. Example applications of DOEs include virtual reality (VR) and augmented reality (AR) products, which enhance or alter the images seen through a user's field of vision. VR is generally considered a computer-generated simulation environment in which a physical entity with the user's appearance exists. VR experiences can be generated in 3D and viewed using head-mounted displays (HMDs), such as glasses or other wearable display devices, which have near-eye display panels as lenses to display the VR environment, visually replacing the actual environment in the user's field of vision.

[0005] However, augmented reality (AR) enables an experience where users can still see their surroundings through the display lenses of glasses or other HMD devices, while simultaneously seeing images of virtual objects used for the display and presenting them as part of the environment. AR can incorporate any type of input, such as audio and haptic input, as well as virtual images, graphics, and videos that amplify or enhance the user's experienced environment. As an emerging technology, AR faces many challenges and design limitations.

[0006] One challenge is displaying a virtual image superimposed on the surrounding environment. An enhancement waveguide combiner is used to assist in this image superposition. The generated light is coupled into the enhancement waveguide combiner, propagates through it, is coupled out of it, and is superimposed on the surrounding environment. Light is coupled into and out of the enhancement waveguide combiner using a surface-embossed grating. It may be difficult to adequately control the diffraction efficiency and directionality of the coupled light.

[0007] Therefore, there is a need in the art for improved systems and methods for DOE manufacturing. Summary of the Invention

[0008] Multiple embodiments of this disclosure generally relate to optical devices. More specifically, the multiple embodiments described herein relate to optical devices and methods of manufacturing optical devices having an optical device structure having at least one of varying depth or refractive index across a surface of a substrate. According to some embodiments, inkjet processing is used to deposit a volume-variable optical device, which is etched to form a diffractive optical element (DOE). The volume variation may be related to the thickness of the optical device or the relative volumes of two or more diffractive materials deposited in combination. According to other multiple embodiments, a single-profile DOE is deposited on a substrate and an inkjet process is used to deposit a volume-variable organic material on top of the DOE. The DOE and the organic material are etched to modify the profile of the structure, and then the organic material is removed, leaving the modified-profile DOE.

[0009] According to certain embodiments, a system for manufacturing diffractive optical elements (DOEs) is disclosed. This system includes one or more processors configured to receive a substrate and deposit a film layer of thickness onto a portion of the substrate using an inkjet process, thereby changing the volume of the film layer to alter its refractive properties.

[0010] In some embodiments, a non-transitory computer-readable storage medium is disclosed that stores instructions that, when executed by a processor of a processing system, cause the processing system to receive a substrate and deposit a film layer of thickness onto a portion of the substrate using inkjet processing, thereby changing the volume of the film layer to alter its refractive properties.

[0011] In some embodiments, a system for manufacturing diffractive optical elements (DOEs) is disclosed. This system includes one or more processors configured to receive a substrate on which a uniform DOE is provided, and to deposit a film layer of thickness using an inkjet process, the film layer being volumetrically altered on the DOE to form an encapsulated uniform DOE. Attached Figure Description

[0012] To gain a more detailed understanding of the structural features of this disclosure described above, a more specific description of the disclosure, which has been briefly summarized above, can be obtained by referring to several embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only a few exemplary embodiments and should not be construed as limiting the scope of this disclosure, and that other equivalent embodiments are permissible.

[0013] Figure 1 A system for manufacturing a diffractive optical element (DOE) with a variable refractive index (RI) profile, according to certain embodiments, is described.

[0014] Figure 2A flowchart depicting a method for manufacturing a diffractive optical element with a variable refractive index profile, according to certain embodiments.

[0015] Figure 3 A manufacturing process for producing a diffractive optical element with a variable refractive index profile is described according to certain embodiments.

[0016] Figure 4 A manufacturing process for producing a diffractive optical element with a variable refractive index profile is described according to certain embodiments.

[0017] Figure 5 A method for manufacturing a diffractive optical element having a variable refractive index profile, according to certain embodiments, is described.

[0018] Figure 6 A flowchart depicting a method for manufacturing a diffractive optical element with a variable refractive index profile, according to certain embodiments.

[0019] Figure 7 A manufacturing process for producing a diffractive optical element with a variable refractive index profile is described according to certain embodiments.

[0020] Figure 8 A method for manufacturing a diffractive optical element having a variable refractive index profile, according to certain embodiments, is described.

[0021] Figure 9 An example processing system according to certain embodiments is described, which can be used to operate a system and method for manufacturing diffractive optical elements with variable refractive index profiles.

[0022] To facilitate understanding, the same reference numerals are used where possible to refer to the same elements common in the figures. Elements and features of one embodiment are contemplated to be beneficially incorporated into several other embodiments without further description. Detailed Implementation

[0023] Various embodiments of this disclosure generally relate to optical devices. More specifically, the various embodiments described herein relate to optical devices and methods of manufacturing optical devices having an optical device structure having at least one of varying depth or refractive index across the surface of a substrate. According to some embodiments, inkjet processing is used to deposit a volume-variable optical device, which is etched to form a diffractive optical element (DOE). The volume variation may be related to the thickness of the optical device or the relative volumes of two or more diffractive materials deposited in combination. According to other various embodiments, a single-profile DOE is deposited on a substrate and an inkjet process is used to deposit a volume-variable organic material on top of the DOE. The DOE and the organic material are etched to modify the profile of the structure, and then the organic material is removed, leaving the modified-profile DOE.

[0024] Conventionally, DOEs with varying thickness profiles are developed through iterative processes that require multiple steps to define the variable profile of the DOE, including overcoating, photolithography, and etching. In addition to being time-consuming and expensive, each layer deposited and etched in each iteration introduces an additional risk of errors, whether through processing errors, contamination, misalignment, and similar problems.

[0025] According to some embodiments, the drawbacks of conventional methods can be at least partially avoided by using inkjet printing to deposit a variable profile structure onto a substrate and then etching this structure to obtain a DOE with the desired profile. In some embodiments, the variable profile structure is volumetrically variable to provide variable thickness by utilizing the variable flow characteristics of inkjet deposition during the deposition process. In several other embodiments, the variable profile structure is volumetrically variable to provide a changing volume of material with different refractive index (RI) properties while maintaining a constant thickness. According to some embodiments, in addition to the variable composition of materials with different RI properties, the profile may also have a variable thickness.

[0026] Example System

[0027] Figure 1A system 100 for fabricating a diffractive optical element (DOE) having a variable refractive index (RI) profile is depicted according to certain embodiments. A pretreatment system 104 includes one or more systems for processing a substrate prior to depositing one or more structures using an inkjet deposition system 108 as described below. The pretreatment system 104 may include any type of deposition process, such as chemical vapor deposition (CVD), atomic layer deposition (ALD), physical vapor deposition (PVD), epitaxial-based processing systems or similar processes, or other systems capable of depositing or otherwise providing material built up on the substrate. The pretreatment system 104 may further include one or more systems capable of etching the substrate and / or the material deposited on the substrate, either alone or in combination with systems capable of performing deposition processes. The pretreatment system 104 may further include systems for applying one or more processing masks, such as etch-resistant masks for applying a desired pattern to the substrate or material provided on the substrate. As an example, a photoresist system may include a spin coating system, a photolithography system, a deposition system as described above, or other systems capable of applying processing masks, either alone or in combination with systems for deposition and etching as described above. As those skilled in the art will understand, other systems may exist for pre-treating the substrate, such as polishing, cleaning, or other treatments that may be required before deposition by the inkjet deposition system 108.

[0028] As a result of the preprocessing system 104, a substrate, which may contain one or more DOE structures or have no DOE structure, is provided for further processing by the inkjet deposition system 108.

[0029] The inkjet deposition system 108 is a system capable of providing a defined volume of fluid, a combination of fluids and particulate matter, or one or more of these (collectively, "fluid") encapsulated in droplets deposited into a nozzle. The inkjet deposition system 108 may include more than one nozzle. Example fluids include organic film fluids similar to organic films in photoresist masks and fluids selected based on their refractive index (RI) properties, which may include, for example, diamond particles or other materials with high RI properties. Examples of organic films include UV-curable epoxy resins, thermocurable epoxy resins, and / or acrylates; examples of refractive index materials include inorganic thin film materials, such as nanoparticle / nanodiamond inks, sol-gel inks. Examples of sol-gel materials include titanium isopropoxide and titanium(IV) butoxide. For materials containing nanoparticles, examples of such nanoparticles include TiO2 and ZrO2. In this context, an example of inkjet deposition system 108 includes the LP50 Advanced Research Inkjet Printer from SUSS MICROTEC.

[0030] One or more nozzles and associated pumps can provide a defined volume of fluid in each droplet and vary the number of droplets deposited per unit time, thereby enabling the inkjet deposition system 108 to vary the thickness of the material deposited on the substrate. By varying the number of droplets deposited per unit time, material with a variable profile shape, such as a wedge, can be deposited on the substrate. Alternatively, the relative volumes of two or more fluids contained in the droplets can be varied to achieve a consistent profile shape deposited on the substrate, the profile shape having variable refractive index properties that change linearly, exponentially, geometrically, or at a variable rate over the consistent profile shape. According to some embodiments, the relative volumes of the materials constituting the deposited fluids can be varied to achieve a variable profile structure that can further change as the relative volumes of the fluids change during deposition.

[0031] System 100 further includes a photoresist system 112 for depositing photoresist in the structure deposited by inkjet deposition system 108. The deposited photoresist can be an organic photoresist material such as a positive or negative photoresist, a metal-containing hard mold, a carbon-containing hard mold, an organic planarization layer, or other suitable photoresist mask. The deposited photoresist mask can be further patterned by suitable processing via photoresist system 112, suitable processing including one or more of photolithography, PVD, CVD, plasma-enhanced CVD (PECVD), flowable CVD (FCVD), ALD, and spin coating. In some embodiments, after deposition in inkjet deposition system 108, the substrate can optionally bypass photoresist system 112 for applications described below, wherein the material deposited by inkjet deposition system 108 is directly etched in etching system 116.

[0032] System 100 further includes an etching system 116 for etching the substrate after deposition via inkjet deposition system 108 and photoresist system 112 (if necessary). Suitable etching processes include, but are not limited to, wet etching, dry etching, reactive ion etching, and plasma etching. According to some embodiments, etching system 116 is used to etch the inkjet-deposited material according to a deposited patterned mask to form one or more DOE structures with a variable RI profile. The variable RI profile can have variable RI properties due to variations in thickness over the shape of the structure, variable relative volume concentrations of two or more deposited materials, or combinations thereof. The variable RI profile structure created by system 100 is further described below. Etching system 116 further includes one or more cleaning systems for removing debris and cleaning up structural anomalies caused by the etching process.

[0033] System 100 further includes a permeation system 120. As a result of etching and annealing (not shown) associated with other parts of system 100, voids or gaps may be formed in the resulting DOE structure. According to some embodiments, annealing may be performed after the deposition of the structure that will become the DOE, before or after the etching used to form the DOE. To mitigate the effects on the refractive properties of the DOE, the DOE formed on the substrate may optionally be provided to the permeation system 120. Examples of permeation processes include ALD or chemical vapor deposition (CVD), and example permeation precursors include [Ti(NMe2)4](TDMAT), TiCl4, and [Ti(iOPr)4](TTIP). In this context, the permeation process provides the permeation precursor to the optical structure to fill gaps within the structure. In some embodiments, the permeation process may leave a film layer on top of the optical structure, which can be removed.

[0034] Figure 2A flowchart 200 depicts a process for manufacturing a diffractive optical element with a variable refractive index profile, according to certain embodiments. In block 204, for example, via... Figure 1 The preprocessing system 104 processes the substrate, for example in Figure 3 The processing 308 depicts the substrate 304. In block 208, the inkjet deposition system 108 uses inkjet nozzles 324 to deposit an optical structure 314 with a variable RI gradient on the substrate 304, as shown in... Figure 3 The process described in 312. A variable RI gradient can create structures with variable thickness profiles by changing the volume of the deposited droplets (e.g., Figure 3 (The wedge shape depicted in the text) is used to complete this task.

[0035] In block 212, photoresist system 112 applies photoresist mask 328 to optical structure 314, as in Figure 3 The process 316 is depicted. According to some embodiments, the photoresist mask 328 may include a pattern 332.

[0036] In block 216, etching system 116 etches optical structure 314 and photoresist mask 328, thereby creating optical structure 314 as a DOE with a desired variable RI profile, as in Figure 3 The process 320 is described. In this context, etching system 116 may comprise an ion beam etching system, while in other embodiments a dry etching system is utilized. In block 220, optical structure 314 and substrate 304 are cleaned, and in some embodiments, optical structure 314 and substrate 304 are provided to penetration system 120 to mitigate gaps formed in optical structure 314. In some embodiments, the cleaning process utilizes an O2 ash process, while in other embodiments a wet cleaning process may be utilized.

[0037] Alternatively, in block 204, for example via Figure 1 The preprocessing system 104 processes the substrate, for example in Figure 4 The processing 408 depicts the substrate 404. In block 208, the inkjet deposition system 108 uses inkjet nozzles 424A and 424B to deposit an optical structure 414 with a variable RI gradient on the substrate 404, as shown in... Figure 4 The processing described in 412.

[0038] According to some embodiments, the inkjet nozzle 424A deposits a first solution. The first solution may be a sol-gel solution or a nanoparticle solution. The first solution may contain silicon dioxide (SiO2), silicon oxycarbide (SiOC), zirconium dioxide (ZrO2), and / or titanium dioxide (TiO2). The proportions of SiO2, SiOC, ZrO2, and / or TiO2 in the first solution are controlled to create a first refractive index. For example, the first solution may contain a first ratio of TiO2 to SiO2, SiOC, and / or ZrO2. In one embodiment, the sol-gel precursor for SiO2 may contain tetramethyl orthosilicate (TMOS), methyl-tri-methoxy-silane (MTMS), and tetraethylorthosilicate (TEOS).

[0039] According to some embodiments, the inkjet nozzle 424B deposits a second solution. The second solution can be a sol-gel solution or a nanoparticle solution. The second solution may contain SiO2, SiOC, ZrO2, and / or TiO2. The proportions of SiO2, SiOC, ZrO2, and / or TiO2 in the second solution are controlled to create a second refractive index. The second refractive index may differ from the first refractive index. For example, the second solution may contain a second ratio having a higher ratio of TiO2 to SiO2, SiOC, and / or ZrO2 than the first ratio to create a second refractive index that is higher than the first refractive index, or the second ratio may have a lower ratio of TiO2 to SiO2, SiOC, and / or ZrO2 than the first ratio to create a second refractive index that is lower than the first refractive index.

[0040] The variable RI gradient can be achieved by changing the relative volume of droplets deposited from inkjet nozzles 424A and 424B during deposition in the optical structure 414, and by adjusting the volume deposited by each nozzle to change the relative concentration of each material supplied by each nozzle, thereby causing, for example... Figure 4 The structure depicted in the image has a variable RI gradient profile. According to certain embodiments, the variable RI gradient can be combined... Figure 3 and Figure 4 The technology described in the text is used to complete this task.

[0041] Continuing with the alternative example, in block 212, photoresist system 112 applies photoresist mask 428 onto optical structure 414, as in... Figure 4 The process 416 is depicted. According to some embodiments, the photoresist mask 428 may include a pattern 432.

[0042] Continuing with the alternative example, in block 216, etching system 116 etches optical structure 414 and photoresist mask 428, thereby causing optical structure 414 to be a DOE with a desired variable RI profile, as in Figure 4 The process 420 is depicted. In block 220, the optical structure 414 and the substrate 404 are cleaned, and in some embodiments, the optical structure 414 and the substrate 404 are provided to the permeation system 120 to mitigate gaps formed in the optical structure 414.

[0043] Figure 5 A method 500 for manufacturing a diffractive optical element having a variable refractive index profile is depicted according to certain embodiments. In block 504, an inkjet deposition system 108 receives a substrate 304.

[0044] In block 508, inkjet deposition system 108 uses inkjet processing to deposit an optical structure of thickness on substrate 304 or a portion of substrate 404, for example... Figure 3 Optical structure 314 or Figure 4 The optical structure 414 is used to change the volume of the optical structure in order to change the refractive properties of the optical structure.

[0045] Figure 6 A flowchart 600 depicts a process for manufacturing a diffractive optical element with a variable refractive index profile, according to certain embodiments. In block 604, a substrate is processed in preprocessing system 104, for example... Figure 7 The substrate 704 is depicted in the image, and in block 608, DOE 708 is deposited on the substrate by the pretreatment system 104, as shown in the image. Figure 7 The processing described in 710.

[0046] In block 612, the inkjet deposition system 108 deposits an organic film 712 onto the DOE 708 using inkjet nozzles 714 to form an encapsulated DOE, such as... Figure 7 The process 716 is depicted. Although the organic film 712 has an irregularly shaped profile similar to a wedge (or other shapes with an upper surface that is not parallel to the upper or lower surface of the substrate 704), it can be deposited by the inkjet nozzle 714 in any shape with variable thickness. For example, the organic film 712 may have a triangular profile or a shape with more than four sides. In some embodiments, the organic film 712 has a profile such as a rectangle, a square, etc.

[0047] In block 616, etching system 116 etches DOE 708 and organic film 712 to give DOE 708 a profile with a refractive index change, thereby forming the profile of the packaged DOE, such as... Figure 7 The processing described in 718.

[0048] In block 620, clean substrate 704 and DOE 708, thereby removing organic film 712, as shown. Figure 7 The process 720 is depicted. According to some embodiments, substrate 704 and DOE 708 may be further processed by permeation system 120.

[0049] Figure 8 A method 800 for manufacturing a diffractive optical element having a variable refractive index profile, according to certain embodiments, is described.

[0050] In block 804, inkjet deposition system 108 receives a substrate on which uniform DOE is provided.

[0051] In block 808, inkjet deposition system 108 uses inkjet processing to deposit a film layer of thickness, which undergoes volume change on the DOE to form a uniform DOE for encapsulation.

[0052] Example processing system

[0053] Figure 9 Depicting according to certain implementations, such as regarding Figures 1 to 8 The example processing system 900 described in the embodiments can be used to operate systems and methods for manufacturing diffractive optical elements with variable refractive index profiles.

[0054] Processing system 900 includes a central processing unit (CPU) 902 connected to a data bus 916. CPU 902 is configured to process computer-executable instructions, for example, stored in memory 908 or storage 910, and to cause processing system 900 to perform the methods described herein, for example, regarding... Figure 2 , Figure 5 , Figure 6 and Figure 8 The method described herein includes CPU 902 to represent a single CPU, multiple CPUs, a single CPU with multiple processing cores, and other forms of processing architecture capable of executing computer-executable instructions.

[0055] The processing system 900 further includes one or more input / output (I / O) devices 912 and interfaces 904, which allow the processing system 900 to interface with the input / output devices 912, such as, for example, a keyboard, display, mouse device, pen input, and other devices that allow interaction with the processing system 900. It should be noted that the processing system 900 may connect to external I / O devices (e.g., external display devices) via physical and wireless connections.

[0056] The processing system 900 further includes a network interface 906, which provides the processing system 900 with access to an external network 914, thereby providing access to an external computing device.

[0057] The processing system 900 further includes a memory 908, which in this example includes a receiving unit 918, a deposition unit 920, a deposition unit 922, a photoresist unit 924, and a penetration unit 926, for performing... Figure 2 , Figure 5 , Figure 6 and Figure 8 The operations described herein.

[0058] It should be noted that, although for simplicity... Figure 9 The diagram shows a single memory 908, but various aspects stored in memory 908 can be stored in different physical memories, including memories far from the processing system 900, but the CPU 902 can access them all via internal data connections such as bus 916.

[0059] The memory 910 further includes substrate data 928, optical structure data 930, volumetric data 932, DOE data 934, deposition data 936, photoresist data 938, etching data 940, and penetration data 942, as combined Figures 1 to 8 As stated above.

[0060] Despite Figure 9 It is not depicted in the text, but other data can be included in storage 910.

[0061] Like the 908 memory, for simplicity... Figure 9 A single memory 910 is depicted, but various aspects stored in memory 910 may be stored in different physical memory locations, all of which can be accessed by CPU 902 via internal data connections (e.g., bus 916) or external connections (e.g., network interface 906). Those skilled in the art will understand that one or more components of the processing system 900 may be located remotely and accessed via network 914.

[0062] The foregoing description is provided to enable those skilled in the art to practice the various embodiments described herein. The examples discussed herein do not limit the scope, applicability, or implementation of the claims. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to many other embodiments. For example, the function and arrangement of the discussed elements may be modified without departing from the scope of this disclosure. Various procedures or components may be omitted, substituted, or added where appropriate in various examples. For example, the methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Furthermore, the characteristic structures described with respect to some examples may be combined in some other examples. For example, any number of aspects described herein may be used to implement the apparatus or practice the method. Furthermore, the scope of this disclosure is intended to cover an apparatus or method practiced using structures, functions, or structures and functions other than or not related to the various aspects of the disclosure described herein. It should be understood that any aspect of the disclosure herein may be implemented by one or more elements of the claims.

[0063] As used herein, the term "exemplary" means "as an example, illustration, or explanation." Any aspect described herein as "exemplary" is not necessarily to be construed as preferred or superior to others.

[0064] As used herein, the phrase “at least one of” in a list of items refers to any combination of those items containing a single member. For example, “at least one of a, b, or c” is intended to cover a, b, c, ab, ac, bc, and abc, as well as any combination with multiple identical elements (e.g., aa, aaa, aab, aac, abb, acc, bb, bbb, bbc, cc, and ccc, or any other order of a, b, and c).

[0065] As used herein, the term "determining" encompasses a wide range of actions. For example, "determining" can include calculation, operation, processing, deduction, investigation, searching (e.g., looking in a table, database, or another data structure), confirming, and similar actions. Furthermore, "determining" can include receiving (e.g., receiving information), accessing (e.g., accessing data in memory), etc. Additionally, "determining" can include parsing, selecting, picking, building, etc.

[0066] The methods disclosed herein include one or more steps or actions for achieving the methods. The method steps and / or actions may be interchanged without departing from the scope of the claims. In other words, unless a specific order of steps or actions is specified, the order and / or use of a particular step and / or action may be modified without departing from the scope of the claims. Furthermore, the various operations of the methods described above can be performed by any suitable means capable of performing the corresponding functions. Such means may include various hardware and / or one or more software components and / or one or more modules, including but not limited to circuits, application-specific integrated circuits (ASICs), or processors. Typically, when operations are illustrated in the figures, these operations may have corresponding means-plus-function components with similar reference numerals.

[0067] The appended claims are not intended to be limited to the multiple embodiments shown herein, but rather to encompass the entire scope consistent with the language of the claims. Within the claims, unless specifically stated otherwise, reference to components in the singular is not intended to mean “one and only one,” but rather “one or more.” Unless otherwise specifically stated, the term “some” refers to one or more. Elements not in the claims are interpreted according to patent law unless the element is explicitly stated using the phrase “means for,” or, in the case of a method claim, using the phrase “step for.” All structural and functional equivalents of the elements throughout the various aspects described in this disclosure are known to those skilled in the art or subsequently known, are expressly incorporated herein by reference, and are intended to be covered by the claims. Furthermore, nothing disclosed herein is intended for public use only, whether or not such disclosure is expressly stated in the claims.

[0068] Although the foregoing is an example of the present disclosure, many other and further examples of the present disclosure may be devised without departing from the basic scope of the present disclosure, and the scope of the present disclosure is determined by the appended claims.

Claims

1. A system for manufacturing diffractive optical elements, the system comprising: One or more processors, said one or more processors being configured to enable the system to: Receiving substrate; An optical structural material is deposited on a portion of the substrate using an inkjet printing process, wherein depositing the optical structural material includes: A first solution having a first refractive index is deposited on a first portion of the substrate using a first nozzle; A second solution having a second refractive index, different from the first refractive index, is deposited on the first portion of the substrate using a second nozzle. During the deposition of the optical structural material, the volume of the first solution and the volume of the second solution are adjusted to change the thickness of the optical structural material; A mask is formed on the first portion of the substrate, the mask having a pattern corresponding to the diffractive optical element to be formed; and An etching process is performed to form the diffractive optical element with a structure having different depths.

2. The system of claim 1, wherein the optical structural material is an inorganic optical structural material.

3. The system of claim 1, wherein the refractive properties of the optical structural material are changed by altering the thickness of the optical structural material.

4. A non-transitory computer-readable storage medium storing instructions, which, when executed by a processor of a processing system, cause the processing system to: Receiving substrate; An optical structural material is deposited on a portion of the substrate using an inkjet printing process, wherein depositing the optical structural material includes: A first solution having a first refractive index is deposited on a first portion of the substrate using a first nozzle; A second solution having a second refractive index, different from the first refractive index, is deposited on the first portion of the substrate using a second nozzle. During the deposition of the optical structural material, the volume of the first solution and the volume of the second solution are adjusted to change the thickness of the optical structural material; A mask is formed on the first portion of the substrate, the mask having a pattern corresponding to the diffractive optical element to be formed; and An etching process is performed to form the diffractive optical element with a structure having different depths.

5. The non-transitory computer-readable storage medium of claim 4, wherein the refractive properties of the optical structural material are changed by altering the thickness of the optical structural material.

6. A system for manufacturing diffractive optical elements, the system comprising: One or more processors, said one or more processors being configured to enable the system to: A receiving substrate, wherein diffractive optical elements are provided on the substrate; Inkjet processing is used to deposit a film layer with thickness and volume variation on the diffractive optical element to form an encapsulated diffractive optical element. Etch at least a portion of the film layer and the diffractive optical element to form a diffractive optical element with an encapsulated outline; and Remove the membrane layer.

7. The system of claim 6, wherein the material of the membrane layer is an organic membrane material.

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