Workpiece grinding methods, devices and robots

Abstract

This application discloses a workpiece grinding method, apparatus, and robot, belonging to the field of automation technology. The method involves segmenting an image of each area to be ground on the workpiece to obtain at least two sub-images to be detected for each area; comparing the similarity of each of the at least two sub-images to be detected with a preset image to determine a target sub-image; determining a target grinding path for the workpiece based on a first grinding path corresponding to the target sub-image in the workpiece's first grinding path, wherein the first grinding path includes the grinding path corresponding to each sub-image to be detected; and grinding the workpiece according to the target grinding path. By comparing the sub-images to be detected with the preset image, areas corresponding to sub-images to be detected with a similarity higher than a preset threshold are identified as areas that do not need grinding, reducing the grinding paths for areas that do not need grinding, thereby improving the grinding efficiency of the workpiece.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automation, and in particular to a workpiece polishing method, device and robot. BACKGROUND

[0002] Polishing of a workpiece is an important link in the production process of the workpiece. At present, the workpiece is polished by recognizing contour features and generating a polishing path, and then the workpiece is polished according to the polishing path. The polishing path is usually a polishing path for the entire workpiece. However, sometimes an entire surface of a workpiece does not need to be polished, so that unnecessary places are polished, resulting in the problem of low workpiece polishing efficiency. SUMMARY

[0003] Embodiments of the present application provide a workpiece polishing method, device and robot to solve the problem of low workpiece polishing efficiency in the prior art.

[0004] In a first aspect, embodiments of the present application provide a workpiece polishing method, comprising the following steps:

[0005] segmenting an image of each polishing area of the workpiece to obtain at least two to-be-detected sub-images of each polishing area;

[0006] comparing the similarity of the at least two to-be-detected sub-images with a preset image respectively to determine a target sub-image, the target sub-image being a to-be-detected sub-image with a similarity less than a preset threshold to the preset image;

[0007] determining a target polishing path of the workpiece according to a first polishing sub-path corresponding to the target sub-image in a first polishing path of the workpiece, the first polishing path of the workpiece comprising a polishing path corresponding to each to-be-detected sub-image;

[0008] polishing the workpiece according to the target polishing path of the workpiece.

[0009] Optionally, before segmenting the image of each polishing area of the workpiece to obtain at least two to-be-detected sub-images of each polishing area, the method further comprises:

[0010] determining at least one polishing area of the workpiece according to polishing process requirements of the workpiece;

[0011] taking a photo of the workpiece according to a first coordinate of each polishing area to obtain an image of the polishing area of the workpiece.

[0012] Optionally, after determining at least one polishing area of the workpiece according to the polishing process of the workpiece, the method further comprises:

[0013] acquire a three-dimensional model of the workpiece;

[0014] determine a first polishing path of the workpiece according to the three-dimensional model of the workpiece, the polishing area to be polished, and the polishing process requirement.

[0015] Optionally, the determining the first polishing path of the workpiece according to the three-dimensional model of the workpiece, the at least one polishing area to be polished, and the polishing process requirement comprises:

[0016] determine an initial polishing path of the workpiece according to the three-dimensional model of the workpiece and the at least one polishing area to be polished;

[0017] determine a repeated polishing area of the workpiece and a repeated polishing times of the repeated polishing area according to the polishing process requirement and the at least one polishing area to be polished;

[0018] determine a second polishing sub-path from a part of the initial polishing path corresponding to the repeated polishing area;

[0019] determine the first polishing path according to the initial polishing path, the repeated polishing times of the repeated polishing area of the workpiece, and the second polishing sub-path.

[0020] Optionally, the photographing the workpiece according to the first coordinate of each polishing area to be polished to obtain an image of the polishing area to be polished of the workpiece comprises:

[0021] determine a second coordinate for photographing the polishing area according to the first coordinate of each polishing area to be polished;

[0022] control a polishing mechanical arm to move to the second coordinate to photograph the workpiece to obtain an image of each polishing area to be polished of the workpiece.

[0023] Optionally, the target polishing path is composed of a plurality of first polishing path points connected, and the polishing the workpiece according to the target polishing path of the workpiece comprises:

[0024] adjust a vertical distance between each first polishing path point and the surface of the workpiece to be within a preset distance range to obtain a plurality of second polishing path points;

[0025] connect adjacent second polishing path points in the plurality of second polishing path points to obtain a second polishing path;

[0026] polish the workpiece according to the second polishing path.

[0027] In a second aspect, the embodiments of the present application further provide a workpiece polishing device, comprising:

[0028] a segmentation module, configured to segment an image of each polishing area of the workpiece to obtain at least two to-be-detected sub-images of each polishing area;

[0029] a comparison module, configured to compare the at least two to-be-detected sub-images with preset images respectively to determine a target sub-image, the target sub-image being a to-be-detected sub-image having a similarity less than a preset threshold with the preset images;

[0030] a first determination module, configured to determine a target polishing path of the workpiece according to a first polishing sub-path corresponding to the target sub-image in a first polishing path of the workpiece, the first polishing path of the workpiece being a polishing path including a polishing sub-path corresponding to each to-be-detected sub-image;

[0031] a polishing module, configured to polish the workpiece according to the target polishing path of the workpiece.

[0032] Optionally, the workpiece polishing device further comprises:

[0033] a second determination module, configured to determine at least one polishing area of the workpiece according to a polishing process requirement of the workpiece;

[0034] a photographing module, configured to photograph the workpiece according to a first coordinate of each polishing area to obtain an image of the polishing area of the workpiece.

[0035] Optionally, the workpiece polishing device further comprises:

[0036] an acquisition module, configured to acquire a three-dimensional model of the workpiece;

[0037] a third determination module, configured to determine a first polishing path of the workpiece according to the three-dimensional model of the workpiece, the polishing area and the polishing process requirement.

[0038] Optionally, the third determination module comprises:

[0039] a first determination sub-module, configured to determine an initial polishing path of the workpiece according to the three-dimensional model of the workpiece and the at least one polishing area of the workpiece;

[0040] a second determination sub-module, configured to determine a repeated polishing area of the workpiece and a repeated polishing frequency of the repeated polishing area according to the polishing process requirement and the at least one polishing area of the workpiece;

[0041] a third determination sub-module, configured to determine a second polishing sub-path in the initial polishing path corresponding to the repeated polishing area as a second polishing sub-path;

[0042] A fourth determining sub-module is configured to determine the first polishing path according to the initial polishing path, the polishing times of the repeated polishing area of the workpiece, and the second polishing sub-path.

[0043] Optionally, the photographing module comprises:

[0044] A fifth determining sub-module is configured to determine a second coordinate for photographing the polishing area according to the first coordinate of each polishing area.

[0045] A photographing sub-module is configured to control the polishing robot to move to the second coordinate and photograph the workpiece to obtain an image of each polishing area of the workpiece.

[0046] Optionally, the polishing module comprises:

[0047] An adjusting sub-module is configured to adjust the vertical distance between each first polishing path point and the surface of the workpiece to be within a preset distance range to obtain a plurality of second polishing path points.

[0048] A connecting sub-module is configured to connect adjacent second polishing path points in the plurality of second polishing path points to obtain a second polishing path.

[0049] A polishing sub-module is configured to polish the workpiece according to the second polishing path.

[0050] In a third aspect, an embodiment of the present application provides a workpiece polishing robot, which comprises a processor, a memory, and a program or instruction stored in the memory and executable on the processor, and the program or instruction is executed by the processor to implement the steps of the method according to the first aspect.

[0051] In the embodiment of the present application, the image of each polishing area of the workpiece is segmented to obtain at least two to-be-detected sub-images of each polishing area, the at least two to-be-detected sub-images are compared with a preset image in similarity respectively to determine a target sub-image, the target sub-image is a to-be-detected sub-image with a similarity to the preset image less than a preset threshold, a target polishing path of the workpiece is determined according to a first polishing sub-path in the first polishing path of the workpiece corresponding to the target sub-image, the first polishing path of the workpiece comprises a polishing path corresponding to each to-be-detected sub-image, and the workpiece is polished according to the target polishing path of the workpiece. By comparing the to-be-detected sub-image with the preset image, the area corresponding to the to-be-detected sub-image with a similarity higher than the preset threshold is identified as an area that does not need to be polished, the polishing path of the area that does not need to be polished is reduced, and the polishing efficiency of the workpiece is improved. BRIEF DESCRIPTION OF DRAWINGS

[0052] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0053] Figure 1 is one of the flow diagrams of the workpiece polishing method provided by the embodiments of the present application;

[0054] Figure 2 is another flow diagram of the workpiece polishing method provided by the embodiments of the present application;

[0055] Figure 3 is a structural diagram of the workpiece polishing device provided by the embodiments of the present application;

[0056] Figure 4 is a structural diagram of the workpiece polishing robot provided by the embodiments of the present application. DETAILED DESCRIPTION

[0057] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0058] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, not to describe a specific order or sequence. It should be understood that the structures used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally a category, not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0059] As shown in Figure 1 The embodiments of the present application provide a workpiece polishing method, comprising the following steps:

[0060] Step 101, the image of each polishing area of the workpiece is divided to obtain at least two detection sub-images of each polishing area;

[0061] It should be understood that the workpiece refers to a product component in a production manufacturing process, and can also be referred to as a product, a workpiece, a courseware, and a hardware, etc., which is not further limited here.

[0062] The area to be polished can be any one or more areas on the workpiece, or can include all areas on the workpiece.

[0063] It should be noted that the image of each area to be polished of the workpiece can be divided by any method, or can be divided according to the distribution of the first polishing path on the area to be polished.

[0064] For example, the total length of the corresponding part of the first polishing path on a certain area to be polished is 20 cm, and when the image of the area to be polished is divided into four sub-images to be detected, the polishing path length of the corresponding area of each sub-image to be detected is 5 cm.

[0065] In step 102, the at least two sub-images to be detected are respectively compared with the preset image in similarity, and a target sub-image is determined, the target sub-image being a sub-image to be detected with a similarity less than a preset threshold to the preset image;

[0066] It should be understood that the preset image is obtained by dividing the image of the workpiece after polishing.

[0067] Further, the division manner of the preset image should be the same as that of the image of the area to be polished.

[0068] It should be further noted that each sub-image to be detected has a corresponding preset image, and the sub-image to be detected and the preset image correspond to the same area on the workpiece.

[0069] In step 102, the similarity between the sub-image to be detected and the preset image is less than the preset threshold, that is, the sub-image to be detected is greatly different from the preset image, and the preset image is the image of the area after polishing, that is, there can be burrs, flash, and other unqualified phenomena on the sub-image to be detected, so the sub-image to be detected is identified as the target sub-image, and the area corresponding to the target sub-image is identified as needing to be polished.

[0070] It should be further noted that the preset threshold can be set according to experience, and can also be adjusted in real time during actual polishing operation; for example, when the preset threshold is set to 0.5, there are still many burrs and flash on the polished workpiece, and the preset threshold can be increased, for example, to 0.9.

[0071] It should be further explained that the similarity comparison between the at least two to-be-detected sub-images and the preset image is usually performed by using an image similarity comparison algorithm, for example, a structural similarity index measure (SSIM).

[0072] As shown in FIG. 2, which is a specific implementation of step 102. The similarity comparison between the at least two to-be-detected sub-images and the preset image is performed one by one, and the target sub-image is determined according to the obtained similarity. Figure 2

[0073] Step 103: determining the target polishing path of the workpiece according to a first polishing sub-path corresponding to the target sub-image in the first polishing path of the workpiece, the first polishing path of the workpiece being a polishing path including each to-be-detected sub-image.

[0074] It should be understood that the first polishing sub-path is a part of the first polishing path. Each first polishing sub-path corresponds to one to-be-detected sub-image.

[0075] It should be noted that the target polishing path includes a plurality of first polishing sub-paths, and each first polishing sub-path in the target polishing path corresponds to one target sub-image.

[0076] Step 104: polishing the workpiece according to the target polishing path of the workpiece.

[0077] It should be further explained that the workpiece is polished according to the plurality of first polishing sub-paths in the target polishing path of the workpiece. Further, the plurality of first polishing sub-paths can have an execution sequence or can not have an execution sequence.

[0078] In the embodiments of the present application, the image of each to-be-polished region of the workpiece is segmented to obtain at least two to-be-detected sub-images of each to-be-polished region; the similarity comparison between the at least two to-be-detected sub-images and the preset image is performed to determine a target sub-image, the target sub-image being a to-be-detected sub-image having a similarity to the preset image less than a preset threshold; the target polishing path of the workpiece is determined according to a first polishing sub-path corresponding to the target sub-image in the first polishing path of the workpiece, the first polishing path of the workpiece being a polishing path including each to-be-detected sub-image; and the workpiece is polished according to the target polishing path of the workpiece. By comparing the to-be-detected sub-images with the preset image, the region corresponding to the to-be-detected sub-image having a similarity higher than the preset threshold is identified as a region that does not need to be polished, thereby reducing the polishing path of the region that does not need to be polished, and improving the polishing efficiency of the workpiece.

[0079] ​Optionally, in some embodiments, the workpiece polishing method further comprises:

[0080] Step 105, determining at least one polishing area of the workpiece according to polishing process requirements of the workpiece;

[0081] It should be understood that the polishing process requirements can be determined according to the use of the workpiece, or according to the design criteria of the workpiece, or according to the manufacturing method of the workpiece, which is not limited further herein.

[0082] Step 106, photographing the workpiece according to the first coordinates of each polishing area to obtain an image of the polishing area of the workpiece.

[0083] It should be understood that the first coordinates can be a coordinate range or the coordinates of the center point of the polishing area.

[0084] In the embodiments of the present application, the polishing area of the workpiece is determined in advance according to the polishing process requirements, which can reduce the polishing of the area of the workpiece that does not need to be polished, thereby improving the polishing efficiency of the workpiece.

[0085] Optionally, in some embodiments, the workpiece polishing method further comprises:

[0086] Step 107, obtaining a three-dimensional model of the workpiece;

[0087] It should be understood that the three-dimensional model of the workpiece can refer to the workpiece model provided by three-dimensional drawing software such as Solidworks.

[0088] Step 108, determining a first polishing path of the workpiece according to the three-dimensional model of the workpiece, the polishing area, and the polishing process requirements.

[0089] In step 108, the first polishing path is a corresponding polishing path including all polishing areas on the workpiece.

[0090] In the embodiments of the present application, by obtaining the three-dimensional model of the workpiece, the three-dimensional coordinate information of the workpiece can be obtained, so that the three-dimensional coordinate information of the workpiece does not need to be obtained by contour feature recognition, thereby simplifying the polishing steps of the workpiece.

[0091] Optionally, in some embodiments, step 108 comprises:

[0092] Step 1081, determining an initial polishing path of the workpiece according to the three-dimensional model of the workpiece and the at least one polishing area of the workpiece;

[0093] It should be understood that the initial polishing path refers to a path of polishing only once for all the areas to be polished.

[0094] In step 1082, a repeated polishing area of the workpiece and a repeated polishing number of the repeated polishing area are determined according to the polishing process requirement and at least one area to be polished of the workpiece.

[0095] It should be understood that the repeated polishing area can refer to a pouring opening or other area of the workpiece, which needs to be polished repeatedly to ensure its accuracy.

[0096] It should be noted that the repeated polishing number can be twice or multiple times, which is not further described herein.

[0097] In step 1083, a part path corresponding to the repeated polishing area in the initial polishing path is determined as a second polishing sub-path.

[0098] It should be understood that the second polishing sub-path is a path of polishing the repeated polishing area.

[0099] In step 1084, the first polishing path is determined according to the initial polishing path, the polishing number of the repeated polishing area of the workpiece and the second polishing sub-path.

[0100] It should be noted that the first polishing path can be performing the initial polishing path and then performing the corresponding number of second polishing sub-paths, or can be performing the initial polishing path again, and when the repeated polishing area is encountered, performing the corresponding number of polishings directly on the repeated polishing area.

[0101] In the embodiment of the present application, by determining whether there is a repeated polishing area according to the polishing process requirement, the polishing accuracy of the workpiece can be improved.

[0102] Optionally, in some embodiments, after polishing the repeated polishing area once, the repeated polishing area can be photographed to obtain an image of the repeated polishing area, and the similarity between the image and a corresponding preset image is compared to obtain a similarity value, and then whether to polish the repeated polishing area again is determined according to the similarity value.

[0103] In the embodiment of the present application, some repeated polishing areas can have good polishing accuracy after the first polishing or less than the repeated polishing number, and if the repeated polishing area is still polished according to the determined repeated polishing number, the polishing resource will be wasted. The embodiment of the present application reduces the possible useless polishing number by photographing and comparing the similarity, thereby improving the polishing efficiency.

[0104] Optionally, in some embodiments, the step 106 comprises:

[0105] Step 1061, determining a second coordinate for photographing the polishing area according to the first coordinate of each polishing area;

[0106] It should be understood that the connecting line of the first coordinate and the second coordinate can be perpendicular to the polishing area or not perpendicular to the polishing area.

[0107] It should be noted that the second coordinate is outside the three-dimensional coordinate of the workpiece.

[0108] Step 1062, controlling the polishing mechanical arm to move to the second coordinate to photograph the workpiece to obtain an image of each polishing area of the workpiece.

[0109] It should be noted that the workpiece polishing robot has a polishing mechanical arm, and the polishing mechanical arm has a camera. When the polishing mechanical arm moves to the second coordinate, the camera on the polishing mechanical arm photographs the polishing area.

[0110] In the embodiment of the present application, by the above-mentioned manner, a relatively clear image of the polishing area of the workpiece can be obtained, so that a relatively accurate similarity value can be obtained when the similarity comparison is performed, thereby improving the polishing precision of the workpiece.

[0111] Optionally, in some embodiments, the target polishing path is composed of a plurality of first polishing path points connected, and the step 104 comprises:

[0112] Step 1041, adjusting the vertical distance between each first polishing path point and the surface of the workpiece to be within a preset distance range to obtain a plurality of second polishing path points;

[0113] It should be understood that the preset distance range can be set as required, for example, the preset distance range is set to 1-2 mm.

[0114] For example, the vertical distance between a polishing path point and the surface of the workpiece is 0.5 mm, and the vertical distance between the polishing path point and the surface of the workpiece needs to be adjusted to 1-2 mm.

[0115] In another embodiment, the vertical distance between a polishing path point and the surface of the workpiece is 3, and the vertical distance between the polishing path point and the surface of the workpiece needs to be adjusted to 1-2 mm.

[0116] Step 1042, connecting adjacent second polishing path points in the plurality of second polishing path points to obtain a second polishing path;

[0117] It should be noted that the second polishing path is connected by a plurality of second polishing path points.

[0118] In step 1043, the workpiece is polished according to the second polishing path.

[0119] In the embodiment of the application, the precision of the polishing path point in the target polishing path is adjusted, and better polishing precision is obtained.

[0120] It should be noted that the workpiece polishing method provided in the embodiment of the application can be executed by a workpiece polishing device, or a control module in the workpiece polishing device for executing the workpiece polishing method. In the embodiment of the application, the workpiece polishing device is taken as an example to illustrate the workpiece polishing method provided in the embodiment of the application.

[0121] As shown in Figure 3 The embodiment of the application further provides a workpiece polishing device 300, which comprises:

[0122] The segmentation module 301 is configured to segment the image of each polishing area of the workpiece to obtain at least two to-be-detected sub-images of each polishing area.

[0123] The comparison module 302 is configured to compare the similarity of the at least two to-be-detected sub-images with a preset image respectively to determine a target sub-image, wherein the target sub-image is a to-be-detected sub-image with a similarity less than a preset threshold to the preset image.

[0124] The first determination module 303 is configured to determine a target polishing path of the workpiece according to a first polishing sub-path corresponding to the target sub-image in a first polishing path of the workpiece, wherein the first polishing path of the workpiece comprises a polishing path corresponding to each to-be-detected sub-image.

[0125] The polishing module 304 is configured to polish the workpiece according to the target polishing path of the workpiece.

[0126] Optionally, the workpiece polishing device further comprises:

[0127] The second determination module is configured to determine at least one polishing area of the workpiece according to the polishing process requirement of the workpiece.

[0128] The photographing module is configured to photograph the workpiece according to the first coordinates of each polishing area to obtain the image of the polishing area of the workpiece.

[0129] Optionally, the workpiece polishing device further comprises:

[0130] an acquisition module, configured to acquire a three-dimensional model of the workpiece;

[0131] a third determination module, configured to determine a first polishing path of the workpiece according to the three-dimensional model of the workpiece, the to-be-polished region, and the polishing process requirement.

[0132] Optionally, the third determination module comprises:

[0133] a first determination submodule, configured to determine an initial polishing path of the workpiece according to the three-dimensional model of the workpiece and the at least one to-be-polished region of the workpiece;

[0134] a second determination submodule, configured to determine a repeated polishing region of the workpiece and a repeated polishing times of the repeated polishing region according to the polishing process requirement and the at least one to-be-polished region of the workpiece;

[0135] a third determination submodule, configured to determine a second polishing sub-path in the initial polishing path corresponding to the repeated polishing region as a second polishing sub-path;

[0136] a fourth determination submodule, configured to determine the first polishing path according to the initial polishing path, the repeated polishing times of the repeated polishing region of the workpiece, and the second polishing sub-path.

[0137] Optionally, the photographing module comprises:

[0138] a fifth determination submodule, configured to determine a second coordinate for photographing the to-be-polished region according to the first coordinate of each to-be-polished region;

[0139] a photographing submodule, configured to control the polishing mechanical arm to move to the second coordinate, and photograph the workpiece to obtain an image of each to-be-polished region of the workpiece.

[0140] Optionally, the polishing module 304 comprises:

[0141] an adjusting submodule, configured to adjust a vertical distance between each first polishing path point and the surface of the workpiece to be within a preset distance range, to obtain a plurality of second polishing path points;

[0142] a connecting submodule, configured to connect adjacent second polishing path points in the plurality of second polishing path points to obtain a second polishing path;

[0143] a polishing submodule, configured to polish the workpiece according to the second polishing path.

[0144] The workpiece polishing device in the embodiments of the present application can be a device, or a component, integrated circuit, or chip in a terminal. The device can be a mobile electronic device, or a non-mobile electronic device. Exemplarily, the mobile electronic device can be a mobile phone, tablet computer, notebook computer, palm computer, vehicle-mounted electronic device, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc., and the non-mobile electronic device can be a server, network attached storage (NAS), personal computer (PC), television (TV), teller machine, or self-service machine, etc., and the embodiments of the present application are not limited in this regard.

[0145] The workpiece polishing device in the embodiments of the present application can be a device with an operating system. The operating system can be an Android operating system, an ios operating system, or other possible operating system, and the embodiments of the present application are not limited in this regard.

[0146] The workpiece polishing device provided in the embodiments of the present application can implement the method embodiments. Figure 1 The processes implemented by the workpiece polishing device in the method embodiments are not repeated here to avoid repetition.

[0147] Optionally, as shown in Figure 4 the embodiments of the present application also provide a workpiece polishing robot, which includes a processor 401, a memory 402, a program 4021 or instructions stored in the memory 402 and executable on the processor 401. The program 4021 or instructions, when executed by the processor 401, implement the processes of the workpiece polishing method embodiments described above and achieve the same technical effects. To avoid repetition, the processes are not repeated here.

[0148] It should be noted that the workpiece polishing robot in the embodiments of the present application includes the mobile electronic device and the non-mobile electronic device described above.

[0149] Those skilled in the art can clearly understand the above-mentioned embodiment method can be realized by means of software and the necessary general hardware platform, of course, also can be through hardware, but many cases the former is the better embodiment. Based on such understanding, the technical solutions of the present application essentially or say the part of the contribution to the prior art can be embodied in the form of software products, the computer software product is stored in a storage medium (such as ROM / RAM, magnetic disc, optical disc), including a number of instructions to make a terminal (may be a mobile phone, computer, server, air conditioner, or network equipment, etc.) executes the method described in various embodiments of the present application.

[0150] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above-mentioned specific embodiments, the above-mentioned specific embodiments are only illustrative, but not limited, those skilled in the art can make many forms without departing from the purpose of the present application and the scope protected by the claims under the inspiration of the present application, all belong to the protection of the present application.

Claims

1. A method of polishing a workpiece, comprising: The workpiece polishing method comprises: segmenting the image of each polishing area of the workpiece to obtain at least two to-be-detected sub-images of each polishing area; comparing the similarity of the at least two to-be-detected sub-images with a preset image respectively to determine a target sub-image, wherein the target sub-image is a to-be-detected sub-image with a similarity less than a preset threshold to the preset image; determining a target polishing path of the workpiece according to a first polishing sub-path corresponding to the target sub-image in a first polishing path of the workpiece, wherein the first polishing path of the workpiece comprises a polishing path corresponding to each to-be-detected sub-image; polishing the workpiece according to the target polishing path of the workpiece; before segmenting the image of each polishing area of the workpiece to obtain at least two to-be-detected sub-images of each polishing area, the method further comprises: determining at least one polishing area of the workpiece according to polishing process requirements of the workpiece; taking a photo of the workpiece according to a first coordinate of each polishing area to obtain an image of the polishing area of the workpiece; after determining at least one polishing area of the workpiece according to polishing process requirements of the workpiece, the method further comprises: obtaining a three-dimensional model of the workpiece; determining a first polishing path of the workpiece according to the three-dimensional model of the workpiece, the polishing area and the polishing process requirements; determining a first polishing path of the workpiece according to the three-dimensional model of the workpiece, the polishing area and the polishing process requirements comprises: determining an initial polishing path of the workpiece according to the three-dimensional model of the workpiece and at least one polishing area of the workpiece; determining a repeated polishing area of the workpiece and a repeated polishing frequency of the repeated polishing area according to the polishing process requirements and at least one polishing area of the workpiece; determining a second polishing sub-path from a part of the initial polishing path corresponding to the repeated polishing area; determining the first polishing path according to the initial polishing path, the repeated polishing frequency of the repeated polishing area of the workpiece and the second polishing sub-path.

2. The workpiece polishing method of claim 1, wherein, determining a first coordinate for taking a photo of the polishing area according to a first coordinate of each polishing area; controlling a polishing robot arm to move to the first coordinate to take a photo of the workpiece and obtain an image of each polishing area of the workpiece. The target polishing path is composed of a plurality of first polishing path points connected together, and the polishing of the workpiece according to the target polishing path of the workpiece comprises:

3. The method of claim 1, wherein, adjusting the vertical distance between each first polishing path point and the surface of the workpiece to be within a preset distance range to obtain a plurality of second polishing path points; connecting adjacent second polishing path points in the plurality of second polishing path points to obtain a second polishing path; polishing the workpiece according to the second polishing path. The workpiece polishing device comprises:

4. A workpiece polishing apparatus characterized by comprising: ​ The segmentation module is configured to segment the image of each polishing area of the workpiece to obtain at least two to-be-detected sub-images of each polishing area; The comparison module is configured to compare the similarity of the at least two to-be-detected sub-images with a preset image respectively to determine a target sub-image, wherein the target sub-image is a to-be-detected sub-image with a similarity less than a preset threshold to the preset image; The first determination module is configured to determine a target polishing path of the workpiece according to a first polishing sub-path corresponding to the target sub-image in a first polishing path of the workpiece, wherein the first polishing path of the workpiece comprises a polishing path corresponding to each to-be-detected sub-image; The polishing module is configured to polish the workpiece according to the target polishing path of the workpiece; The second determination module is configured to determine at least one polishing area of the workpiece according to a polishing process requirement of the workpiece; The photographing module is configured to photograph the workpiece according to a first coordinate of each polishing area to obtain an image of the polishing area of the workpiece; The acquisition module is configured to acquire a three-dimensional model of the workpiece; The third determination module is configured to determine a first polishing path of the workpiece according to the three-dimensional model of the workpiece, the polishing area, and the polishing process requirement; The third determination module comprises: The first determination submodule is configured to determine an initial polishing path of the workpiece according to the three-dimensional model of the workpiece and the at least one polishing area of the workpiece; The second determination submodule is configured to determine a repeated polishing area of the workpiece and a repeated polishing frequency of the repeated polishing area according to the polishing process requirement and the at least one polishing area of the workpiece; The third determination submodule is configured to determine a second polishing sub-path according to a part of the initial polishing path corresponding to the repeated polishing area; The fourth determination submodule is configured to determine the first polishing path according to the initial polishing path, the polishing frequency of the repeated polishing area of the workpiece, and the second polishing sub-path.

5. A workpiece polishing robot characterized by, The processor, the memory, and the program or instructions stored in the memory and executable on the processor are provided, and the program or instructions are executed by the processor to implement the steps of the workpiece polishing method according to any one of claims 1-3.

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