Probe card

Abstract

Provided is a probe card for high-temperature inspection at low cost. The probe card includes a wiring substrate (130) that supports a plurality of probes (15); a heat-generating coating film (3) formed on the wiring substrate (130); and a pair of electrode terminals (4) that supply current to the heat-generating coating film (3). The heat-generating coating film (3) is formed on the surface of the wiring substrate (130) by applying a heat-generating coating material in which fine carbon particles are dispersed in a binder.

Description

Technical Field

[0001] This invention relates to probe cards, and more specifically, to improvements in probe cards having a wiring substrate supporting a large number of probes. Background Technology

[0002] A probe card is an inspection device used to inspect the electrical characteristics of semiconductor devices formed on a semiconductor wafer. It has a large number of probes on a wiring substrate that contact the electrode pads on the semiconductor wafer.

[0003] The probe card is brought close to the semiconductor wafer, and the tip of the probe contacts the electrode pads on the semiconductor wafer. Through the probe and the wiring substrate, the test device is made conductive with the semiconductor device, thereby performing semiconductor device inspection. Therefore, the probe card and the semiconductor wafer are aligned (adjusted) before inspection to ensure that the tip of the probe contacts the electrode pads.

[0004] High-temperature testing is a test that applies thermal strain to semiconductor wafers to determine their electrical properties. A heater embedded in a stage on which the semiconductor wafer is placed is used to maintain the wafer at a high temperature. In such high-temperature tests, if the temperature difference between the probe card and the semiconductor wafer is large, heat from the semiconductor wafer is transferred to the probe card. During inspection, the probe card thermally expands, causing problems such as changes in the relative position of the probes and electrode pads.

[0005] To address this issue, the following method is employed: a heater is built into the wiring board of the probe card to heat the wiring board before and during inspection; the probe card is preheated by placing it opposite an external heater before inspection.

[0006] Prior art literature

[0007] Patent documents

[0008] Patent Document 1: JP Patent No. 5199859 Summary of the Invention

[0009] -The problem the invention aims to solve-

[0010] When heating is achieved through a built-in heater, an additional wiring layer for the heater needs to be added to the wiring substrate, which increases manufacturing costs. Furthermore, since the wiring pattern with narrow linewidths generates heat, the wiring pattern for the heater's heating wires is prone to breakage. In particular, if a wide area needs to be heated by the heater, a long, winding wiring pattern needs to be formed within that area, further increasing the likelihood of breakage and potentially reducing the reliability of the probe card.

[0011] Furthermore, when preheating is performed using an external heater, there is a problem of probe temperature drop during semiconductor wafer alignment after preheating. Additionally, the temperature at the outer periphery of the probe card tends to drop more easily than at the center, leading to a potential temperature gradient on the main surface.

[0012] The present invention was made in view of the above-mentioned situation, and its object is to provide a probe card for high-temperature inspection at low cost. Furthermore, it aims to improve the reliability of the probe card for high-temperature inspection. Moreover, it aims to suppress the generation of temperature gradients on the main surface of the probe card for high-temperature inspection.

[0013] -Methods for solving problems-

[0014] The probe card of the first embodiment of the present invention comprises: a wiring substrate supporting a plurality of probes; a heating coating formed on the wiring substrate; and a pair of electrode terminals supplying current to the heating coating, the heating coating being formed on the surface of the wiring substrate by coating a heating coating material comprising fine carbon particles and an adhesive.

[0015] By employing this structure, a heat-generating coating can be formed in any area on the surface of the wiring substrate, thereby heating the wiring substrate. Therefore, compared to existing methods that use heating wires to heat the wiring substrate, this method can more effectively heat the probe card.

[0016] The probe card of the second embodiment of the present invention is configured such that at least a portion of the heating coating is formed on the side of the wiring substrate.

[0017] By employing this structure, the wiring substrate can be heated from the side. Since the wiring substrate can be heated without occupying space on the main surface, the arrangement of circuit patterns, probes, etc., on the main surface is not restricted. Furthermore, since heating can be performed from the outside of a horizontal surface that is difficult to heat using existing methods, the generation of temperature gradients on the main surface of the wiring substrate can be suppressed.

[0018] In the third embodiment of the present invention, the probe card is based on the above structure, wherein one of the pair of electrode terminals is formed on the main surface of one side of the wiring substrate, and the other of the pair of electrode terminals is formed on the main surface of the other side of the wiring substrate.

[0019] By adopting such a structure, heat can be generated over a wider area of ​​the heating film, thus effectively generating heat.

[0020] In the fourth embodiment of the present invention, the probe card is based on the above structure, wherein the pair of electrode terminals are respectively formed near a pair of end edges of the circumferentially opposed heating film.

[0021] By adopting such a structure, heat can be generated over a wider area of ​​the heating film, thus achieving effective heat generation.

[0022] The probe card of the fifth embodiment of the present invention is based on the above structure, wherein the heating coating is formed on the area of ​​the main surface of the wiring substrate adjacent to the outer periphery.

[0023] By employing this structure, a heat-generating coating can be formed in the area adjacent to the side surface of the main surface, effectively utilizing the unused space near the outer periphery of the main surface to heat the wiring substrate. Furthermore, since heating can be performed from the outside of a horizontal plane that is difficult to heat using existing heating methods, the generation of temperature gradients within the horizontal plane of the wiring substrate can be suppressed.

[0024] The probe card of the sixth embodiment of the present invention, based on the above structure, has a heater circuit in a region on the main surface of the wiring substrate that is separated from the side.

[0025] By employing this structure, the inner side of the wiring substrate can be heated by a heater circuit, and the outer side can be heated by a heating film on the main surface of the wiring substrate. This helps to suppress the generation of temperature gradients within the horizontal plane of the wiring substrate.

[0026] The probe card of the seventh embodiment of the present invention is based on the above structure, wherein the wiring substrate is divided into a circuit region having a circuit pattern formed thereon and a non-circuit region surrounding the circuit region in a plane parallel to the main surface, and at least a portion of the heating coating is formed in the non-circuit region.

[0027] By employing this structure, the non-circuit area can be efficiently used to heat the wiring substrate. Furthermore, since heating can be performed from the outside of a horizontal plane that is difficult to heat using existing heating methods, the generation of temperature gradients within the horizontal plane of the wiring substrate can be suppressed.

[0028] The probe card of the eighth embodiment of the present invention, based on the above structure, includes a heater circuit in the circuit area of ​​the wiring substrate.

[0029] By employing this structure, the inner side of the wiring substrate can be heated by a heater circuit, and the outer side can be heated by a heating film on the main surface of the wiring substrate. This helps to suppress the generation of temperature gradients within the horizontal plane of the wiring substrate.

[0030] The probe card of the ninth embodiment of the present invention is based on the above structure, wherein the pair of electrode terminals are formed in the circuit region.

[0031] By adopting such a structure, current can be supplied to the heating coating using the circuit pattern of the circuit area.

[0032] -Invention Effects-

[0033] According to the present invention, a probe card for high-temperature inspection can be provided inexpensively by forming a heat-generating coating on a wiring substrate. Furthermore, the reliability of the probe card for high-temperature inspection can be improved. Moreover, the generation of temperature gradients on the main surface of the probe card for high-temperature inspection can be suppressed. Attached Figure Description

[0034] Figure 1 This is a diagram illustrating an example of the schematic structure of the probe card 10 according to Embodiment 1 of the present invention.

[0035] Figure 2 This is a diagram showing the main parts of the probe card 10 according to Embodiment 2 of the present invention, and is a front view and a bottom view of the ST substrate 130.

[0036] Figure 3 yes Figure 2 The top view and cross-sectional view AA of the ST substrate 130 are shown.

[0037] Figure 4 This is a diagram showing the main parts of the probe card 10 according to Embodiment 3 of the present invention, and is a front view and a bottom view of the ST substrate 130.

[0038] Figure 5 yes Figure 4 The top view and BB cross-sectional view of the ST substrate 130 are shown.

[0039] Figure 6 This is a diagram showing the main parts of the probe card 10 according to Embodiment 4 of the present invention, and is a front view and a bottom view of the ST substrate 130.

[0040] Figure 7 yes Figure 6 The top view and CC cross-sectional view of the ST substrate 130 are shown.

[0041] Figure 8 This is a diagram showing the main parts of the probe card 10 according to Embodiment 5 of the present invention, and is a front view and a bottom view of the ST substrate 130.

[0042] Figure 9 yes Figure 8 The top view and DD cross-sectional view of the ST substrate 130 are shown. Detailed Implementation

[0043] Implementation Method 1

[0044] (1) Probe card 10

[0045] Figure 1This is a diagram illustrating an example of the schematic structure of the probe card 10 according to Embodiment 1 of the present invention. The probe card 10 is mounted on a wafer detector with the probes facing downwards, and is positioned opposite a semiconductor wafer 20 placed on a stage 200. By moving the stage 200 up and down, the probes 15 can contact the electrode pads 21 on the semiconductor wafer 20.

[0046] The probe card 10 includes a main substrate 100, a reinforcement plate 110, an interposer plate 120, an ST (Space Transformer) substrate 130, and two or more probes 15.

[0047] The main substrate 100 is a wiring substrate that can be detachably mounted on the wafer detector, such as a disc-shaped glass epoxy board. The lower surface periphery of the main substrate 100 is supported by the card holder 210 of the wafer detector, and it is arranged substantially horizontally. A reinforcing plate 110 for suppressing deformation of the main substrate 100 is mounted at the center of the upper surface of the main substrate 100. In addition, two or more external terminals 11 for connecting signal terminals of a test device (not shown) are provided on the upper surface of the main substrate 100.

[0048] The interposer 120 is disposed between the main substrate 100 and the ST substrate 130. It is a connection unit between the substrates that enables the wiring of the main substrate 100 and the wiring of the ST substrate 130 to be connected. For example, it has a large number of spring pins 12.

[0049] ST substrate 130 is a laminated board in which insulating multilayer wiring substrates, such as two or more ceramic plates, are bonded together for changing electrode spacing. ST substrate 130 is mounted on main substrate 100 via substrate holder 16 and is arranged approximately horizontally. The substrate holder 16 is fixed at one end to the lower surface of main substrate 100 and at the other end supports the periphery of the lower surface of ST substrate 130.

[0050] Two or more probe electrodes 13 for mounting probes 15 are formed on the lower surface of the ST substrate 130. Furthermore, two or more spring pin electrodes 14 for abutting the spring pins 12 of the inner insert plate 120 are formed on the upper surface of the ST substrate 130. The probe electrodes 13 are connected to the spring pin electrodes 14 via wiring patterns and through-holes within the ST substrate 130, enabling the probes 15 to be connected to the main substrate 100. The probe electrodes 13 and spring pin electrodes 14 are metal films formed using photolithography processes such as electroplating or etching. Additionally, a heat-generating coating 3 is formed on the surface of the ST substrate 130.

[0051] The probe 15 contains a conductive metal such as NiCo (nickel-cobalt alloy) that can be elastically deformed, and has a front end for contacting the electrode pad 21.

[0052] The stage 200 is a platform for mounting the semiconductor wafer 20, capable of horizontal movement, rotation, and vertical movement. The heater 201 is a high-temperature inspection heater built into the stage 200, capable of heating the semiconductor wafer 20.

[0053] (2) Heating film 3

[0054] The heating coating 3 has a composition of mixing fine carbon particles with an adhesive and is a coating that generates heat when electricity is applied. The heating coating 3 is formed on the surface of the ST substrate 130 by coating a heating coating material. By applying electricity to the heating coating 3 before or during inspection, the temperature of the ST substrate 130 during high-temperature inspection can be maintained at a given inspection temperature.

[0055] The heat-generating coating 3 can be formed on the lower surface, upper surface, or side surface of the ST substrate 130. Furthermore, the heat-generating coating 3 is formed in areas where the probe electrodes 13 and spring needle electrodes 14 are not formed. For example, if the heat-generating coating 3 is formed on the lower surface of the ST substrate 130, it is formed at the periphery of the ST substrate 130 where the probe electrodes 13 are not formed, and between adjacent probe electrodes 13. If the heat-generating coating 3 is formed on the upper surface of the ST substrate, it is formed at the periphery of the ST substrate 130 where the spring needle electrodes 14 are not formed, and between adjacent spring needle electrodes 14.

[0056] The heating coating 3 is connected to a pair of coating electrodes (not shown) and is supplied with current flowing through the heating coating 3. By arranging the pair of coating electrodes so that current flows through the entire heating coating 3, the heating coating 3 can be heated efficiently. For example, if the forming area of ​​the heating coating 3 is rectangular, it is desirable to provide connecting electrodes at or near a pair of opposite vertices, or at or near a pair of opposite sides.

[0057] The heat-generating coating material is a suspension containing a binder, solvent or water as a dispersion medium, and fine carbon particles as the dispersed phase, which is coated onto the surface of the ST substrate 130. The binder can be polyurethane-based resin, polyolefin-based resin, fluororubber, silicone rubber, or other synthetic resins. The dispersion medium is a liquid that dissolves or disperses such resin in a solvent, or a liquid that emulsifies water. The fine carbon particles are, for example, carbon-based powders, such as a mixture of graphite and carbon nanotubes. The graphite is preferably 30 μm or less in particle size, and the carbon nanotubes are preferably 1 μm or less in outer diameter and 50 μm or less in length.

[0058] A heat-generating coating material is obtained by dispersing a mixture of graphite and carbon nanotubes in a solvent in which fluorinated rubber is dissolved. After such a heat-generating coating agent is applied to a given area of ​​ST substrate 130, a heat-generating film 3 is formed by evaporating the solvent or water to remove it.

[0059] The heat-generating coating material can be applied to the surface of the ST substrate 130 by spin coating, brush application, flow dipping, or any other method. When applying the heat-generating coating material, it is desirable to mask areas where the heat-generating film 3 will not form. For example, photoresist can be pre-formed in areas where the heat-generating film 3 will not form and removed after the heat-generating film 3 is formed, thereby allowing the heat-generating film 3 to form in any area. Furthermore, when the heat-generating film 3 is formed on a conductive component, an insulating film can be formed therein.

[0060] Since the heating coating 3 is formed by coating a heating material, it can be easily formed even in areas where heating wires constituting conventional heaters cannot be formed. For example, in areas with uneven surfaces, curved or bent surfaces, or narrow areas where heating wire patterns cannot be formed, conventional heaters cannot be installed. However, since the heating coating 3 is formed by coating, it can be formed even in such areas.

[0061] For example, heating wires cannot be formed on the periphery or sides of the ST substrate 130. The periphery is supported by the substrate holder 16, and circuits cannot be formed therefore for manufacturing process reasons. Furthermore, circuits cannot be formed on the sides of the ST substrate 130 either. However, if a heating coating 3 is used, it can be formed in such areas.

[0062] Furthermore, the heating coating 3 can be formed in either wide or narrow areas. When formed in a wide area, it can heat the area more uniformly compared to conventional heaters (resistance wires). Moreover, it can function as a heating element even if a through-hole is provided in a portion of the wide area. Therefore, compared to conventional heaters that bend the resistance wire to cover a wide area, the possibility of failure due to wire breakage is lower, improving reliability.

[0063] Furthermore, the probe card 10 is easy to heat in the horizontal plane and in the center, but difficult to heat in the peripheral area. To address this, by forming a heat-generating coating 3 on the peripheral or side surfaces of the upper and lower surfaces of the ST substrate 130, the generation of a temperature gradient in the horizontal plane of the ST substrate 130 can be suppressed.

[0064] In this embodiment, an example of forming a heat-generating coating 3 on the ST substrate 130 is described, but the present invention is not limited to this case. For example, the heat-generating coating 3 can also be formed on the main substrate 100 that supports the probe 15 across the ST substrate 130 and the substrate holder 16. Furthermore, the heat-generating coating 3 can also be formed on the reinforcing plate 110.

[0065] Implementation method 2.

[0066] In this embodiment, an example of the specific structure of the heating coating 3 will be described.

[0067] Figure 2as well as Figure 3 Figures (a) to (d) are diagrams showing the main parts of the probe card 10 according to Embodiment 2 of the present invention. Figure 1 An example of the detailed structure of the ST substrate 130 is shown. Figures (a) to (c) show the front view, bottom view, and top view of the ST substrate 130, respectively. Furthermore, figure (d) shows the cross-section (AA cut surface) when cut in the vertical plane passing through the AA cut line in (c).

[0068] The ST substrate 130 is divided in a horizontal plane into a circuit region 131 with a circuit pattern and a non-circuit region 132 without a circuit pattern. The circuit region 131 is the region encompassing the central portion of the ST substrate 130 and is formed separately from the outer periphery 134 of the ST substrate 130. The non-circuit region 132 is the region adjacent to the outer periphery 134 and is a ring-shaped region formed surrounding the circuit region 131 and extending outward from the circuit region 131. The boundary line 133 of the circuit region 131 and the non-circuit region 132 extends along the outer periphery 134 of the ST substrate 130, with the circuit region 131 being further inward than the boundary line 133 and the non-circuit region 132 being further outward from the boundary line 133.

[0069] The probe electrode 13, the spring pin electrode 14, the through-hole (not shown), the wiring pattern, and other circuit patterns are all formed within the circuit region 131, and not within the non-circuit region 132. The probe region 15A in the figure is the region where one or more probe electrodes 13 are formed, and a large number of probe regions 15A are formed within the circuit region 131 on the lower surface. Furthermore, the spring pin region 12A in the figure is the region where one or more spring pin electrodes 14 are formed, and a large number of spring pin regions 12A are formed within the circuit region 131 on the upper surface.

[0070] Four heating films 3 are formed in the non-circuit region 132. Each heating film 3 is formed in a region that separates the non-circuit region 132 in the circumferential direction. That is, two or more heating films 3 are arranged adjacent to each other in the circumferential direction, and each heating film 3 has an elongated shape extending along the outer periphery 134.

[0071] The heating coating 3 comprises: a main body coating 30 for generating heat; and a pair of lead coatings 31 for supplying current. The main body coating 30 has a wide area occupying most of the heating coating 3 and is formed within a non-circuit region 132. The pair of lead coatings 31 are respectively connected to or near a pair of circumferentially opposite sides of the main body coating 30, extend across the boundary line 133 into the circuit region 131, and are connected to the coating electrode 4.

[0072] The coating electrode 4 is an electrode terminal for supplying current to the heating coating 3, and is formed in the circuit region 131. The coating electrode 4 is connected to the external terminal 11 on the main substrate 100 via the inner insert plate 120.

[0073] The heater 5 is a well-known heating unit, consisting of heating wires formed in the circuit region 131 on the lower surface, upper surface, or inner layer of the ST substrate 130. By heating the circuit region 131 with the heater 5 and heating the non-circuit region 132 with the heating film 3, the generation of temperature gradients in the horizontal plane of the ST substrate 130 can be suppressed.

[0074] In this embodiment, the heating coating 3 is described as being formed on both the upper and lower surfaces of the ST substrate 130, but the present invention is not limited to this. For example, it can also be formed only on the lower surface or only on the upper surface.

[0075] Furthermore, in this embodiment, the ST substrate 130 is described as having a heater 5, but the present invention is not limited to this case, and the heater 5 can also be omitted. The temperature of the peripheral portion of the ST substrate 130 is more likely to decrease compared to the central portion. For this reason, by forming a heat-generating coating 3 in the non-circuit region 132 adjacent to the outer periphery 134, the generation of a temperature gradient in the horizontal plane of the ST substrate 130 can be suppressed.

[0076] Furthermore, in this embodiment, the case where four heating films 3 are formed along the outer periphery 134 is described, but the present invention is not limited to this case. For example, one or more heating films 3 can also be formed along the outer periphery 134. In the case where only one heating film 3 is formed along the outer periphery 134, it is formed as a C-shape that is partially separated in the circumferential direction.

[0077] Furthermore, in this embodiment, the heating coating 3 is described as being formed in a region adjacent to the outer periphery 134, but the present invention is not limited to this case. For example, the heating coating 3 can also be formed in a region within the non-circuit region 132 that is separate from the outer periphery 134.

[0078] Implementation method 3.

[0079] In Embodiment 2, an example was described in which a heat-generating coating 3 was formed in the non-circuit region 132 of the ST substrate 130. In contrast, in this embodiment, a case was described in which a heat-generating coating 3 was formed in the circuit region 131 in addition to the non-circuit region 132.

[0080] Figure 4 as well as Figure 5 Figures (a) to (d) are diagrams showing the main parts of the probe card 10 according to Embodiment 3 of the present invention, illustrating... Figure 1An example of the detailed structure of the ST substrate 130 is shown. Figures (a) to (c) show the front view, bottom view, and top view of the ST substrate 130, respectively. Furthermore, figure (d) shows the cross-section (BB cut surface) when cut in the vertical plane passing through the BB cut line in (c). Additionally, regarding... Figure 2 as well as Figure 3 The constituent elements shown are labeled with the same reference numerals, and repeated descriptions are omitted.

[0081] If with Figure 2 as well as Figure 3 Compared to the ST substrate 130 (Embodiment 2), the main body coating 30 is formed across the boundary line 133, and is formed not only in the non-circuit region 132 but also in the circuit region 131, which is different. Along with this, it also differs in that it does not have a lead coating 31. Furthermore, it differs in that two heat-generating coatings 3 are formed along the outer periphery 134.

[0082] By forming the heating coating 3 along the circumferential direction not only in the non-circuit region 132 of the ST substrate 130 but also in the circuit region 131, a region on the main surface of the ST substrate 130 can be effectively utilized. Therefore, the heating coating 3 can be formed over a wider area, enabling effective heating.

[0083] Implementation method 4.

[0084] In embodiments 2 and 3, examples were described where a heat-generating coating 3 was formed on the lower or upper surface of the ST substrate 130. In contrast, in this embodiment, a case where a heat-generating coating 3 is formed on the side surface of the ST substrate 130 is described.

[0085] Figure 6 as well as Figure 7 Figures (a) to (d) are diagrams showing the main parts of the probe card 10 according to Embodiment 4 of the present invention. Figure 1 An example of the detailed structure of the ST substrate 130 is shown. Figures (a) to (c) show the front view, bottom view, and top view of the ST substrate 130, respectively. Furthermore, figure (d) shows the cross-section (CC cut surface) when cut in the vertical plane passing through the CC cut line in (c). Additionally, regarding... Figures 2-5 The constituent elements shown are labeled with the same reference numerals, and repeated descriptions are omitted.

[0086] The heating coating 3 includes: a main coating 30 for generating heat; and a pair of lead coatings 31 for supplying current. The main coating 30 has a wide area occupying most of the heating coating 3 and is formed on the side of the ST substrate 130. The pair of lead coatings 31 are formed on the main surface of the ST substrate 130, with one end connected to or near a pair of circumferentially opposite sides of the main coating 30, and the other end extending across the boundary line 133 into the circuit region 131 and connected to the coating electrode 4.

[0087] Furthermore, one of the two coated electrodes 4 is formed on the lower surface and the other on the upper surface. Similarly, one of the two lead coatings 31 is formed on the lower surface and the other on the upper surface. By employing this structure, a pair of lead coatings 31 can be connected to or near a pair of opposite vertices along the diagonal direction of the main body coating 30, which comprises a generally rectangular shape, thereby effectively generating heat using the approximately entire main body coating 30.

[0088] Implementation method 5.

[0089] In Embodiment 4, an example was described in which a heat-generating coating 3 was formed on the side surface of the ST substrate 130. In contrast, in this embodiment, a case was described in which a heat-generating coating 3 was formed in the non-circuit region 132 on the main surface of the ST substrate 130 in addition to the side surface of the ST substrate 130.

[0090] Figure 8 as well as Figure 9 Figures (a) to (d) are diagrams showing the main parts of the probe card 10 according to Embodiment 5 of the present invention. Figure 1 An example of the detailed structure of the ST substrate 130 is shown. Figures (a) to (c) show the front view, bottom view, and top view of the ST substrate 130, respectively. Furthermore, figure (d) shows the cross-section (DD cut surface) when cut in the vertical plane passing through the DD cut line in (c). Additionally, regarding... Figures 2-7 The constituent elements shown are labeled with the same reference numerals, and repeated descriptions are omitted.

[0091] If with Figure 6 as well as Figure 7 Compared to the ST substrate 130 (Embodiment 4), the heating coating 3 is formed across the outer periphery 134 of the lower surface and the outer periphery 134 of the upper surface, and extends circumferentially not only on the side surface of the ST substrate 130 but also on the lower and upper surfaces, which is different. Furthermore, the heating coating 3 formed on the upper and lower surfaces is formed across the boundary line 133, and extends circumferentially not only in the non-circuit region 132 but also in the circuit region 131. Therefore, the heating coating 3 is also different in that it is not connected to the coating electrode 4 with a lead coating 31.

[0092] By forming a heat-generating coating 3 not only on the sides of the ST substrate 130 but also on the non-circuit regions 132 of the main surface, both the sides and the non-circuit regions 132 are heated together, thereby effectively utilizing the free space on the ST substrate 130 for heating. Furthermore, by forming the coating not only on the non-circuit regions 132 but also on the circuit regions 131, and heating the circuit regions 131 as well, the free space on the ST substrate 130 can be further effectively utilized for heating. Therefore, a heat-generating coating 3 can be formed over a wider area, effectively heating the ST substrate 130.

[0093] A pair of coating electrodes 4 are disposed at or near the opposite vertices in the diagonal direction of the heating coating 3. That is, one coating electrode 4 is formed in the circuit region 131 on the lower surface of the ST substrate 130, and the other coating electrode 4 is formed in the circuit region 131 on the upper surface of the ST substrate 130. Furthermore, these coating electrodes 4 are connected near a pair of opposite sides in the circumferential direction of the heating coating 3. For this purpose, heating can be effectively achieved using the substantially entire heating coating 3.

[0094] -Symbol Explanation-

[0095] 3 Heating film

[0096] 4. Electrode (electrode terminal) for coating

[0097] 5 heaters

[0098] 10 probe cards

[0099] 11 External terminals

[0100] 12 spring pins

[0101] 12A Spring Pin Area

[0102] 13. Electrodes for probes

[0103] 14. Electrode for spring needle

[0104] 15 probes

[0105] 15A probe area

[0106] 16. Baseboard frame

[0107] 20 Semiconductor wafers

[0108] 21 Electrode pads

[0109] 30. Main body coating

[0110] 31 Lead Coating

[0111] 100 main base board

[0112] 110 Reinforcement Plate

[0113] 120 Internal Insertion Board

[0114] 130 ST base plate

[0115] 131 Circuit Region

[0116] 132 Non-circuit region

[0117] 133 Boundary Line

[0118] 134 Peripheral edge

[0119] 200 platforms

[0120] 201 Heater

[0121] 210 booths.

Claims

1. A probe card, characterized in that, have: Wiring substrate, which supports a large number of probes; A heat-generating coating is formed on the wiring substrate; and A pair of electrode terminals that supply current to the heating coating. The heating coating is formed on the surface of the wiring substrate by coating a heating coating material containing fine carbon particles and an adhesive. At least a portion of the heat-generating coating is formed on the side of the wiring substrate.

2. The probe card according to claim 1, wherein, One of the pair of electrode terminals is formed on one side of the wiring substrate, and the other of the pair of electrode terminals is formed on the other side of the wiring substrate.

3. The probe card according to claim 1 or 2, wherein, The pair of electrode terminals are respectively formed near a pair of circumferentially opposed ends of the heating coating.

4. A probe card, characterized in that, have: Wiring substrate, which supports a large number of probes; A heat-generating coating is formed on the wiring substrate; and A pair of electrode terminals that supply current to the heating coating. The wiring substrate is divided into circuit regions and non-circuit regions in a plane parallel to the main surface. The circuit regions are formed with circuit patterns, and the non-circuit regions are areas surrounding the circuit regions and adjacent to the outer periphery of the wiring substrate, which are not formed with circuit patterns. The heating coating is formed on the main surface of the non-circuit area by coating a heating coating material containing fine carbon particles and an adhesive.

5. The probe card according to claim 4, wherein, A heater circuit is provided in the area of ​​the wiring substrate that is separated from the outer periphery.

6. The probe card according to claim 4, wherein, A heater circuit is provided in the circuit area of ​​the wiring substrate.

7. The probe card according to claim 4 or 6, wherein, The pair of electrode terminals are formed in the circuit region.

Images