Display substrate and display device

By introducing isolation grooves in the pixel definition layer of the OLED display substrate, the problem of lateral leakage current caused by the connection of the light-emitting layer is solved, the display effect is improved, crosstalk is prevented, and independent light emission is ensured.

CN116548084BActive Publication Date: 2026-04-03BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-05-31
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

The poor display effect of OLED display panels is mainly due to the fact that the light-emitting layer is formed by vapor deposition in one layer, which causes the charge generation layers in each light-emitting device to connect together, generating lateral leakage current and causing crosstalk.

Method used

An isolation trench is introduced in the pixel definition layer of the display substrate, with at least a portion of the organic material layer located inside the isolation trench and disconnected from the outside of the isolation trench, thus isolating the charge generation layer and other organic light-emitting layers and preventing lateral leakage current.

Benefits of technology

It effectively isolates leakage current between adjacent light-emitting devices, improves the display effect of the display substrate, reduces crosstalk, and ensures independent light emission of the light-emitting devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application discloses a display substrate and a display device, belonging to the field of display technology. The display substrate includes: a driving backplate, a first electrode layer, a pixel definition layer, an organic light-emitting layer, and a second electrode layer. Since at least a portion of the organic material layer located within the partition groove is disconnected from the portion located outside the partition groove, the organic material layer between any two adjacent light-emitting devices is disconnected by the partition groove. Thus, when a voltage is applied to the first electrode, the electric field formed between the first electrode and the second electrode layer causes the leakage current generated by a portion of the organic material layer in each light-emitting device to be isolated by the partition groove. That is, the leakage current generated by the organic material layer in the light-emitting device is not laterally guided to the organic material layer adjacent to this light-emitting device, thereby ensuring that the light emission of this light-emitting device does not affect the light emission of adjacent light-emitting devices. This ensures a better display effect of the display substrate.
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Description

[0001] This application claims priority to PCT application No. PCT / CN2022 / 088548, filed on April 22, 2022, entitled "Display Device, Display Panel and Method of Manufacturing Thereof", and PCT application No. PCT / CN2021 / 133886, filed on November 29, 2021, entitled "Display Substrate", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and in particular to a display substrate and a display device. Background Technology

[0003] With the development of display technology, display devices are being used more and more widely. Among them, organic light-emitting diode (OLED) display panels have received increasing attention.

[0004] An OLED display panel may include a driving backplane and multiple light-emitting devices located on the driving backplane. Each light-emitting device includes a first electrode, a light-emitting layer, and a second electrode sequentially stacked away from the driving backplane. The first electrode of each light-emitting device is electrically connected to the driving backplane. Thus, when a voltage is applied to the first electrode, an electric field is formed between the first and second electrodes. This electric field causes the light-emitting layer located between the first and second electrodes to generate photons and emit light outwards, thereby enabling the OLED display panel to display an image.

[0005] However, the light-emitting layer in an OLED display panel is usually formed by vapor deposition, which means that the light-emitting layers in each light-emitting device are connected together, resulting in a poor display effect of the OLED display panel. Summary of the Invention

[0006] This application provides a display substrate and a display device. It can solve the problem of poor display effect in existing display panels. The technical solution is as follows:

[0007] On one hand, a display substrate is provided, comprising:

[0008] A drive backplane; a first electrode layer located on one side of the drive backplane, the first electrode layer having a plurality of first electrodes, the first electrodes being electrically connected to the drive backplane;

[0009] A pixel definition layer is located on the side of the first electrode layer opposite to the driving backplate. The pixel definition layer has a plurality of pixel openings corresponding one-to-one with the plurality of first electrodes, and a partition groove located between two adjacent pixel openings. At least a portion of the first electrodes is located in the corresponding pixel opening.

[0010] An organic light-emitting layer located on the side of the pixel definition layer away from the driving backplate, the organic light-emitting layer comprising: a plurality of organic material layers stacked along a direction perpendicular to and away from the driving backplate, wherein at least a portion of the organic material layers located within the partition groove is disconnected from the portion located outside the partition groove;

[0011] And a second electrode layer located on the side of the organic light-emitting layer opposite to the driving backplate.

[0012] Optionally, the sidewall of the partition groove has a recessed structure.

[0013] Optionally, the pixel definition layer includes: a first sub-definition layer and a second sub-definition layer stacked along a direction perpendicular to and away from the driving substrate, the partition groove passing through the first definition layer and the second sub-definition layer, and the side of the second sub-definition layer near the partition groove protruding from the side of the first sub-definition layer near the partition groove.

[0014] Optionally, the partition groove includes: a first sub-partition groove located within the first sub-definition layer, and a second sub-partition groove located within the second sub-definition layer;

[0015] Wherein, the orthographic projection of the second sub-partition groove on the drive back plate is located within the orthographic projection of the first sub-partition groove on the drive back plate, and the outer boundary of the orthographic projection of the second sub-partition groove on the drive back plate does not coincide with the outer boundary of the orthographic projection of the first sub-partition groove on the drive back plate.

[0016] Optionally, the distance between the outer boundary of the orthographic projection of the second sub-partition groove on the drive back plate and the outer boundary of the orthographic projection of the first sub-partition groove on the drive back plate ranges from 0.05 micrometers to 0.1 micrometers.

[0017] Optionally, the pixel definition layer further includes a third sub-definition layer located on the side of the first sub-definition layer closer to the driving backplane;

[0018] Wherein, the orthographic projection of the partition groove on the drive back plate is located within the orthographic projection of the third sub-definition layer on the drive back plate;

[0019] Alternatively, the partition groove may further include a third sub-partition groove located within the third sub-definition layer, wherein the orthographic projection of the third sub-partition groove on the drive back panel is located within the orthographic projection of the first sub-partition groove on the drive back panel, and the outer boundary of the orthographic projection of the third sub-partition groove on the drive back panel does not coincide with the outer boundary of the orthographic projection of the first sub-partition groove on the drive back panel.

[0020] Optionally, the first sub-definition layer is made of silicon nitride, and the second and third sub-definition layers are both made of silicon oxide.

[0021] Optionally, when the orthographic projection of the partition groove on the driving backplate is located within the orthographic projection of the third sub-definition layer on the driving backplate, the pixel definition layer further includes: a protective layer located between the third sub-definition layer and the first sub-definition layer, wherein the orthographic projection of the partition groove on the driving backplate is located within the orthographic projection of the protective layer on the backplate.

[0022] Optionally, the angle between the sidewall of the partition groove and the side of the pixel definition layer near the driving backplate ranges from 70° to 110°.

[0023] Optionally, the display substrate further includes: an auxiliary support layer disposed in the same layer as the first electrode layer but made of a different material, wherein the thickness of the auxiliary support layer is less than or equal to the thickness of the first electrode layer;

[0024] The orthographic projection of the partition groove on the drive back plate is located within the orthographic projection of the auxiliary support layer on the drive back plate.

[0025] Optionally, the auxiliary support layer has a plurality of hollow structures corresponding one-to-one with the plurality of first electrodes, and the outer boundary of the hollow structure on the drive back plate coincides with the outer boundary of the first electrode on the drive back plate.

[0026] Optionally, the thickness of the auxiliary support layer is greater than or equal to half the thickness of the first electrode layer.

[0027] Optionally, the partition grooves are distributed around the periphery of each pixel opening.

[0028] Optionally, the depth of the partition groove ranges from 70 nanometers to 140 nanometers, and the minimum width of the partition groove ranges from 200 nanometers to 700 nanometers.

[0029] Optionally, the angle between the sidewall of the pixel opening and the side of the pixel definition layer near the driving backplate ranges from 70° to 90°.

[0030] Optionally, the orthographic projection of the pixel opening on the driving backplate is located within the orthographic projection of the corresponding first electrode on the driving backplate.

[0031] Optionally, the distance between the outer boundary of the pixel opening projected onto the driving backplate and the outer boundary of the corresponding first electrode projected onto the driving backplate is greater than or equal to 150 nanometers.

[0032] Optionally, the thickness of the organic light-emitting layer is greater than or equal to three times the thickness of the pixel definition layer.

[0033] Optionally, the display substrate further includes an encapsulation layer located on the side of the second electrode layer opposite to the driving backplate.

[0034] On the other hand, a display device is provided, characterized in that it includes: a driver chip and a display panel, wherein the display panel is any of the display panels described above, and the driver chip is used to apply control signals to the display panel.

[0035] The beneficial effects of the technical solutions provided in this application include at least the following:

[0036] A display substrate includes: a driving backplate, a first electrode layer, a pixel definition layer, an organic light-emitting layer, and a second electrode layer. The pixel definition layer has isolation grooves. Since at least a portion of the organic material layer located within the isolation grooves is disconnected from the portion located outside the isolation grooves, the organic material layers between any two adjacent light-emitting devices are separated by the isolation grooves. Thus, when a voltage is applied to the first electrode, the electric field formed between the first and second electrode layers isolates the leakage current generated by a portion of the organic material layer in each light-emitting device from the leakage current generated by the isolation grooves. That is, the leakage current generated by the organic material layer in one light-emitting device is not laterally guided to the organic material layer adjacent to that light-emitting device, thereby preventing the light emission of one light-emitting device from affecting the light emission of adjacent light-emitting devices. This ensures a better display effect for the display substrate. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a top view of a display substrate provided in an embodiment of this application;

[0039] Figure 2 yes Figure 1The diagram shows the membrane structure at point A-A'.

[0040] Figure 3 This is a schematic diagram of the film structure of a light-emitting device provided in an embodiment of this application;

[0041] Figure 4 This is a schematic diagram of the structure of a pixel definition layer provided in an embodiment of this application;

[0042] Figure 5 This is a schematic diagram of another pixel definition layer structure provided in an embodiment of this application;

[0043] Figure 6 This is a schematic diagram of a film structure for a pixel definition layer provided in an embodiment of this application;

[0044] Figure 7 This is a schematic diagram of another pixel definition layer film structure provided in an embodiment of this application;

[0045] Figure 8 This is a physical image of a display substrate provided in an embodiment of this application;

[0046] Figure 9 This is a schematic diagram of another pixel definition layer film structure provided in an embodiment of this application;

[0047] Figure 10 This is a schematic diagram of another pixel definition layer structure provided in the embodiments of this application;

[0048] Figure 11 yes Figure 1 The diagram shows a cross-section at point B-B'.

[0049] Figure 12 yes Figure 11 The actual object shown;

[0050] Figure 13 This is a schematic diagram of the film layer structure of a display substrate provided in an embodiment of this application. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0052] In related technologies, a silicon-based OLED display panel may include a driving backplane and multiple light-emitting devices located on the driving backplane. Each light-emitting device includes a first electrode, a light-emitting layer, and a second electrode sequentially stacked away from the driving backplane. The first electrode of each light-emitting device is electrically connected to the driving backplane. Thus, when a voltage is applied to the first electrode, an electric field is formed between the first and second electrodes. This electric field causes the light-emitting layer located between the first and second electrodes to generate photons, emitting light outwards, thereby enabling the OLED display panel to display an image.

[0053] The light-emitting layer can be composed of multiple stacked sub-light-emitting layers, connected in series via a charge-generating layer. Thus, the color of the light emitted by the light-emitting layer can be determined by these multiple sub-light-emitting layers. For example, if the light-emitting layer needs to emit white light, sub-light-emitting layers capable of emitting red, green, and blue light can be stacked to produce white light. Each sub-light-emitting layer can include a stacked hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer, and an electron injection layer. When a voltage is applied to the first electrode, the electric field formed between the first and second electrodes causes electrons and holes to combine into high-energy excitons. These high-energy excitons are unstable and easily transition to low-energy excitons, releasing energy and generating photons to emit light within a certain wavelength range. The charge-generating layer is typically made of a material with good conductivity to ensure that each sub-light-emitting layer can emit light, resulting in a better light-emitting effect.

[0054] However, the light-emitting layer in an OLED display panel is typically formed by a single-layer vapor deposition process. This means that the sub-light-emitting layers and charge-generating layers in each light-emitting device are connected together. Since the charge-generating layers in each light-emitting device are also connected, and these layers have good conductivity, a lateral leakage current may occur in the charge-generating layer of a particular light-emitting device during its emission. This leakage current may cause adjacent light-emitting devices to also emit light, potentially leading to a poor display effect on the OLED display panel.

[0055] Please refer to Figure 1 and Figure 2 , Figure 1 This is a top view of a display substrate provided in an embodiment of this application. Figure 2 yes Figure 1 The diagram shows the film structure at point A-A'. The display substrate 000 may include: a driving backplate 100, a first electrode layer 200, a pixel definition layer 300, an organic light-emitting layer 400, and a second electrode layer 500.

[0056] The first electrode layer 200 in the display substrate 000 is located on one side of the driving back plate 100. The first electrode layer 200 has a plurality of first electrodes 201, and the first electrodes 201 are electrically connected to the driving back plate 100.

[0057] The pixel definition layer 300 in the display substrate 000 is located on the side of the first electrode layer 200 facing away from the driving backplate 100. The pixel definition layer 300 has a plurality of pixel openings K corresponding one-to-one with a plurality of first electrodes 201, and a partition groove U located between two adjacent pixel openings K. At least a portion of the first electrodes 201 is located within the corresponding pixel opening K. Here, the portion of the first electrode 201 located within the pixel opening K, the portion of the organic light-emitting layer 400 located within the pixel opening K, and the portion of the second electrode layer 500 located within the pixel opening K can form a light-emitting device. For example, this light-emitting device can be an OLED light-emitting device.

[0058] The organic light-emitting layer 400 in the display substrate 000 is located on the side of the pixel definition layer 300 away from the driving back plate 100. The organic light-emitting layer 400 may include a plurality of organic material layers 400a stacked in a direction perpendicular to and away from the driving back plate 100, and at least a portion of the organic material layers 400a located in the partition groove U is disconnected from the portion located outside the partition groove U.

[0059] The second electrode layer 500 in the display substrate 000 is located on the side of the organic light-emitting layer 400 away from the driving backplate 100.

[0060] In this application, at least a portion of the organic material layer 400a located within the partition groove U is disconnected from the portion located outside the partition groove U. Therefore, the organic material layer 400a between any two adjacent light-emitting devices is disconnected by the partition groove U. Thus, when a voltage is applied to the first electrode 201, the electric field formed between the first electrode 201 and the second electrode layer 500 isolates the leakage current generated by a portion of the organic material layer 400a in each light-emitting device from the partition groove U. That is, the leakage current generated by the organic material layer 400a in one light-emitting device is not laterally guided to the organic material layer 400a adjacent to that light-emitting device, thereby ensuring that the light emission of this light-emitting device does not affect the light emission of adjacent light-emitting devices. This ensures a better display effect on the display substrate.

[0061] In summary, the display substrate provided in this application includes: a driving backplate, a first electrode layer, a pixel definition layer, an organic light-emitting layer, and a second electrode layer. The pixel definition layer has isolation grooves. Since at least a portion of the organic material layer located within the isolation grooves is disconnected from the portion located outside the isolation grooves, the organic material layers between any two adjacent light-emitting devices are disconnected by the isolation grooves. Thus, when a voltage is applied to the first electrode, the electric field formed between the first and second electrode layers isolates the leakage current generated by a portion of the organic material layer in each light-emitting device from the leakage current generated by the isolation grooves. That is, the leakage current generated by the organic material layer in one light-emitting device is not laterally guided to the organic material layer adjacent to that light-emitting device, thereby preventing the light emission of one light-emitting device from affecting the light emission of adjacent light-emitting devices. This ensures a better display effect for the display substrate.

[0062] In this application, as Figure 3 As shown, Figure 3 This is a schematic diagram of the film structure of a light-emitting device provided in an embodiment of this application. Each organic material layer 400a in the organic light-emitting layer 400 can be any one of the following: hole injection layer HIL, hole transport layer HTL, light-emitting material layer EML, electron transport layer ETL, electron injection layer EIL, and charge generation layer CGL. The hole injection layer HIL, hole transport layer HTL, light-emitting material layer EML, electron transport layer ETL, and electron injection layer EIL, stacked along the side away from the driving backplate 100, can form a sub-light-emitting layer. It should be noted that the example provided in this application illustrates the organic light-emitting layer 400 in the display substrate containing multiple sub-light-emitting layers. For example, the multiple sub-light-emitting layers included in the organic light-emitting layer 400 can be: a red sub-light-emitting layer 400R, a green sub-light-emitting layer 400G, and a blue sub-light-emitting layer 400B.

[0063] In this configuration, any two adjacent sub-emitting layers in the organic light-emitting layer 400 can be connected via the charge generation layer CGL. Thus, the display substrate 000 can connect the sub-emitting layers in series along the direction away from the driving backplate 100 via the charge generation layer CGL. Consequently, when a voltage is applied to the first electrode layer 200, the electric field formed between the first electrode layer 200 and the second electrode layer 500 allows each sub-emitting layer in the organic light-emitting layer 400 to emit light, and the light emitted by each sub-emitting layer can be mixed into white light before emission. However, since the charge generation layer CGL is typically made of a material with good conductivity, it generates a large lateral leakage current during the light-emitting process, and each organic material layer 400a in the organic light-emitting layer 400 is formed by a vapor deposition process. Therefore, the charge generation layer CGL needs to be isolated by the partition groove U in the pixel definition layer 300; for example, the portion of the charge generation layer CGL located inside the partition groove U is disconnected from the portion located outside the partition groove U. In this way, when a certain light-emitting device emits light, the lateral leakage current generated by the charge generation layer CGL will not be directed to the light-emitting device adjacent to this light-emitting device, thereby reducing the probability of crosstalk between any two adjacent light-emitting devices and thus making the display substrate have a better display effect.

[0064] It should also be noted that the isolation groove U can isolate not only the charge generation layer CGL, but also other organic light-emitting layers. For example, the isolation groove U can isolate at least one of the hole injection layer HIL, hole transport layer HTL, light-emitting material layer EML, electron transport layer ETL, and electron injection layer EIL. In this way, the probability of crosstalk between any two adjacent light-emitting devices can be further reduced.

[0065] In this application, the pixel definition layer 300 has multiple structures. The embodiments of this application only illustrate the following two optional implementation methods as examples.

[0066] For the first optional implementation method, please refer to... Figure 4 , Figure 4This is a schematic diagram of a pixel definition layer provided in an embodiment of this application. The partition groove U in the pixel definition layer 300 has a recessed structure O on its sidewall. Thus, during the process of forming the organic material layer 400a on the display substrate 000 through a vapor deposition process, the portion of the organic material layer 400a deposited within the partition groove U can be located within the recessed structure O, while the portion of the organic material layer 400a deposited outside the partition groove U is located on the pixel definition layer 300. Therefore, because the partition groove U has a recessed structure O on its sidewall, the organic material layer 400a deposited within the recessed structure O is separated from the organic material layer 400a deposited on the pixel definition layer image layer 300 at the sidewall of the partition groove U. That is, the portion of the organic material layer 400a located within the partition groove U is separated from the portion located outside the partition groove U.

[0067] In the embodiments of this application, please refer to Figure 5 , Figure 5 This is a schematic diagram of another pixel definition layer structure provided in an embodiment of this application. The pixel definition layer 300 may include a first sub-definition layer 301 and a second sub-definition layer 302 stacked along a direction perpendicular to and away from the driving substrate 100, with a partition groove U penetrating the first definition layer 301 and the second sub-definition layer 302. The side of the second sub-definition layer 302 closest to the partition groove U protrudes from the side of the first sub-definition layer 301 closest to the partition groove U. Thus, the portion of the second sub-definition layer 302 protruding relative to the first sub-definition layer 301, together with the side surface of the first sub-definition layer 301 and the driving backplate 100, can form a recessed structure O. Here, to ensure that the recessed structure O can be formed in the pixel definition layer 300, the first sub-definition layer 301 and the second sub-definition layer 302 can be made of different materials. In this way, the display substrate 000 can form the recessed structure O within the pixel definition layer 300 depending on the different etching rates of the etching material on the first sub-definition layer 301 and the second sub-definition layer 302. For example, the first sub-definition layer 301 can be made of silicon nitride material, and the second sub-definition layer 302 can be made of silicon oxide material.

[0068] In this application, the partition groove U in the pixel definition layer 300 may include: a first sub-partition groove U1 located in the first sub-definition layer 301, and a second sub-partition groove U2 located in the second sub-definition layer 302.

[0069] Specifically, the orthographic projection of the second sub-partition groove U2 on the drive back plate 100 lies within the orthographic projection of the first sub-partition groove U1 on the drive back plate 100, and the outer boundary of the orthographic projection of the second sub-partition groove U2 on the drive back plate 100 does not coincide with the outer boundary of the orthographic projection of the first sub-partition groove U1 on the drive back plate 100. Thus, the second sub-partition groove U2 within the second sub-definition layer 302 protrudes beyond the first sub-partition groove U1 within the first sub-definition layer 301, that is, a recessed structure O is formed within the partition groove U.

[0070] In this embodiment, the distance between the outer boundary of the orthographic projection of the second sub-partition groove U2 on the driving backplate 100 and the outer boundary of the orthographic projection of the first sub-partition groove U1 on the driving backplate 100 ranges from 0.05 micrometers to 0.1 micrometers. Thus, after the first sub-partition groove U1 and the second sub-partition groove U2 are formed by etching, the second sub-partition groove U2 protrudes less relative to the first sub-partition groove U1, preventing the portion of the pixel definition layer 300 near the second sub-partition groove U2 within the second sub-definition layer 302 from collapsing. This effectively ensures that while the structure of the partition groove U is relatively stable, at least a portion of the organic material light-emitting layer 400a in the organic light-emitting layer 400 deposited on the pixel definition layer 300 is broken by the partition groove.

[0071] Please refer to the following in this application: Figure 6 , Figure 6 This is a schematic diagram of a film structure for a pixel definition layer provided in an embodiment of this application. The pixel definition layer 300 may further include a third sub-definition layer 303 located on the side of the first sub-definition layer 301 near the driving backplane 100. It should be noted that the structure of the pixel definition layer 300 can have various forms. This embodiment of the application illustrates the following two cases as examples:

[0072] The first case, such as Figure 6 As shown, the orthographic projection of the partition groove U in the pixel definition layer 300 onto the driving backplate 100 lies within the orthographic projection of the third sub-definition layer 303 onto the driving backplate 100. This ensures that the partition groove U can effectively isolate the organic material layer 400a while maintaining a shallow depth, thus ensuring a relatively smooth second electrode layer 500. Consequently, when an electric field is formed between the first electrode 201 and the second electrode layer 500, the probability of longitudinal leakage between the smooth second electrode layer 500 and the first electrode 201 is low.

[0073] Please refer to the following in this application: Figure 7 , Figure 7This is a schematic diagram of another pixel definition layer film structure provided in an embodiment of this application. When the orthographic projection of the partition groove U on the driving backplate 100 is located within the orthographic projection of the third sub-definition layer 303 on the driving backplate 100, the pixel definition layer 300 may further include a protective layer 304 located between the third sub-definition layer 303 and the first sub-definition layer 301, and the orthographic projection of the partition groove U on the driving backplate 100 is located within the orthographic projection of the protective layer 304 on the backplate. Here, the protective layer 304 in the pixel definition layer 300 may be made of aluminum oxide. In this way, when the first sub-definition layer 301 is etched by an etching substance, the third sub-definition layer 303 can be protected by the protective layer 304 to prevent the third sub-definition layer 303 from being etched away by the etching substance. Therefore, even if the etching time of the etching substance on the first sub-definition layer 301 is long, the etching substance will not etch the third sub-definition layer 303, so as to ensure that no groove communicating with the partition groove U appears in the third sub-definition layer 303.

[0074] In this case, please refer to Figure 8 , Figure 8 This is a physical diagram of a display substrate provided in an embodiment of this application. After the organic light-emitting layer 400 and the second electrode layer 500 are subsequently formed on the pixel definition layer 300, the portion of the second electrode layer 500 corresponding to the partition groove U in the display substrate 00 is relatively flat.

[0075] For the second scenario, please refer to [the relevant documentation / reference]. Figure 9 , Figure 9 This is a schematic diagram of another pixel definition layer film structure provided in an embodiment of this application. The partition groove U in the pixel definition layer 300 may further include a third sub-partition groove U3 located within the third sub-definition layer 303. The orthographic projection of the third sub-partition groove U3 on the driving backplate 100 is located within the orthographic projection of the first sub-partition groove U1 on the driving backplate 100, and the outer boundary of the orthographic projection of the third sub-partition groove U3 on the driving backplate 100 does not coincide with the outer boundary of the orthographic projection of the first sub-partition groove U1 on the driving backplate 100. In this way, since the partition groove U has the third sub-partition groove U3, the partition groove U can accommodate more organic material layers 400a, making the partition groove U more effective at separating the portions of the organic light-emitting layers 400 corresponding to any two adjacent light-emitting devices.

[0076] It should be noted that, as Figure 9As shown, the outer boundary of the orthographic projection of the third sub-partition groove U3 on the drive back plate 100 can completely coincide with the outer boundary of the orthographic projection of the second sub-partition groove U2 on the drive back plate 100. In other possible implementations, the outer boundary of the orthographic projection of the third sub-partition groove U3 on the drive back plate 100 can at least partially not coincide with the outer boundary of the orthographic projection of the second sub-partition groove U2 on the drive back plate 100. However, it is necessary to ensure that the orthographic projection of the third sub-partition groove U3 on the drive back plate 100 is located within the orthographic projection of the second sub-partition groove U2 on the drive back plate 100, or that the orthographic projection of the second sub-partition groove U2 on the drive back plate 100 is located within the orthographic projection of the third sub-partition groove U3 on the drive back plate 100. This application embodiment does not limit this.

[0077] In this embodiment, the first sub-definition layer 301 in the pixel definition layer 300 can be made of silicon nitride, and the second sub-definition layer 302 and the third sub-definition layer 303 can be made of silicon oxide. Thus, the display substrate 000 can form a recessed structure O within the pixel definition layer 300 according to the different etching rates of the etching material on silicon nitride and silicon oxide. For example, as... Figure 5 As shown, when the etching rate of the etching material on silicon nitride is faster and the etching rate of the etching material on silicon oxide is slower, the first sub-definition layer 301 is easily etched, while the second sub-definition layer 302 is not easily etched. This causes the side of the second sub-definition layer 302 near the partition groove U to protrude from the side of the first sub-definition layer 301 near the partition groove U, thereby forming a recessed structure O in the pixel definition layer 300.

[0078] For the second optional implementation method, please refer to... Figure 10 , Figure 10 This is a schematic diagram of another pixel definition layer provided in this application embodiment. The angle α1 between the sidewall of the partition groove U in the pixel definition layer 300 and the side of the pixel definition layer 300 near the driving back plate 100 ranges from 70° to 110°. Figure 10 The diagram shows the case where the angle α1 between the sidewall of the partition groove U and the side of the pixel definition layer 300 near the drive backplate 100 is an obtuse angle.

[0079] In this embodiment, when the angle α1 between the sidewall of the partition groove U in the pixel definition layer 300 and the side of the pixel definition layer 300 near the driving backplate 100 is 70° to 90°, the slope of the angle between the sidewall of the partition groove U and the side of the pixel definition layer 300 near the driving backplate 100 is relatively large. This causes the organic material layers 400a on both sides of the sidewall of the partition groove U to be staggered, that is, the organic material layers 400a are broken by the partition groove U. In this way, crosstalk will not occur between the portions of the organic light-emitting layers 400 corresponding to any two adjacent light-emitting devices. When the angle α1 between the sidewall of the partition groove U in the pixel definition layer 300 and the side of the pixel definition layer 300 near the driving backplate 100 is 90° to 110°, the width of the partition groove U on the side near the driving backplate 100 is larger, and the width of the partition groove U on the side away from the driving backplate 100 is smaller. This makes the organic material layers 400a on both sides of the sidewall of the partition groove U more effectively separated by the partition groove U. In this way, the probability of crosstalk occurring in the organic light-emitting layers 400 corresponding to any two adjacent light-emitting devices is lower.

[0080] Regarding the two optional implementation methods mentioned above, such as Figure 5 , Figure 6 , Figure 7 , Figure 9 and Figure 10 As shown, the display substrate 000 may further include: an auxiliary support layer 600 disposed on the same layer as the first electrode layer 200 but made of a different material, wherein the thickness of the auxiliary support layer 600 is less than or equal to the thickness of the first electrode layer 200. Here, as... Figure 5 , Figure 6 , Figure 7 , Figure 9 and Figure 10 As shown, the thickness of the auxiliary support layer 600 is less than the thickness of the first electrode layer 200. In other possible implementations, the thickness of the auxiliary support layer 600 may also be equal to the thickness of the first electrode layer 200, and this embodiment of the application does not limit this.

[0081] The orthographic projection of the partition groove U on the drive back plate 100 lies within the orthographic projection of the auxiliary support layer 600 on the drive back plate 100. This allows the auxiliary support layer 600 to make the partition groove U higher than the first electrode layer 200. Thus, even though the region between the two first electrodes 201 has the partition groove U, it does not cause a large slope in the portion of the second electrode layer 500 located within the region of the partition groove U, resulting in a gentler overall slope and a flatter surface for the second electrode layer 500. Consequently, when an electric field is formed between the first electrode 201 and the second electrode layer 500, the second electrode layer 500 remains relatively flat, making longitudinal leakage less likely between the second electrode layer 500 and the first electrode 201.

[0082] In this embodiment, the auxiliary support layer 600 has multiple hollow structures corresponding one-to-one with the multiple first electrodes 201. The outer boundary of the orthographic projection of the hollow structure on the drive back plate 100 coincides with the outer boundary of the orthographic projection of the first electrode 201 on the drive back plate 100. Here, the hollow structure is disposed in contact with the first electrode 201 between any two first electrodes 201. In this way, the area between any two first electrodes 201 is filled by the auxiliary support layer 600, which can further improve the flatness of the second electrode layer 500.

[0083] In this application, the thickness of the auxiliary support layer 600 is greater than or equal to half the thickness of the first electrode layer 200. Thus, after the pixel definition layer 300 is formed on the auxiliary support layer 600, the portion of the pixel definition layer 300 located near the partition groove U of the first electrode 201 is relatively flat. Because this portion of the pixel definition layer 300 near the partition groove U of the first electrode 201 is relatively flat, the subsequent formation of the organic light-emitting layer 400 and the second electrode layer 500 on the pixel definition layer 300 will not exhibit a large slope in the second electrode layer 500 corresponding to the portion of the pixel definition layer 300 near the partition groove U of the first electrode 201; that is, this portion of the second electrode layer 500 is relatively flat.

[0084] In the embodiments of this application, such as Figure 1 As shown, the partition grooves U in the pixel definition layer 300 are distributed around the periphery of each pixel opening K. Here, one pixel opening K can correspond to one light-emitting device. The partition grooves U in the pixel definition layer 300 can separate the organic material layer 400a in each light-emitting device in the display substrate 000, so that there is no crosstalk between the light-emitting devices in the display substrate 000.

[0085] In this application, as Figure 8 As shown, the depth H1 of the partition groove U in the pixel definition layer 300 ranges from 70 nanometers to 140 nanometers, and the minimum width D1 of the partition groove U ranges from 200 nanometers to 700 nanometers. Here, the depth H1 of the partition groove U is less than or equal to the thickness of the pixel definition layer 300. In this way, it can be ensured that the partition groove U can effectively isolate the organic material layer 400a.

[0086] In the embodiments of this application, please refer to Figure 11 , Figure 11 yes Figure 1The diagram shows a cross-sectional view at point B-B'. The angle α2 between the sidewall of the pixel aperture K and the side of the pixel definition layer 300 near the driving backplate 100 ranges from 70° to 90°. Here, because the angle α2 between the sidewall of the pixel aperture K and the side of the pixel definition layer 300 near the driving backplate 100 is relatively large, at least a portion of the organic material layer 400a in the organic light-emitting layer 400 formed at the sidewall of the pixel aperture K will also be broken. That is, the organic material layer 400a corresponding to a portion of the area inside the pixel aperture K is broken from the organic material layer 400a corresponding to a portion of the area on the sidewall of the pixel aperture K away from the pixel aperture K. In this way, the effective light-emitting area of ​​each light-emitting device is ensured to be equal to the area of ​​the pixel aperture K where the light-emitting device is located projected onto the driving backplate 100, thereby ensuring that the effective light-emitting area of ​​each light-emitting device is controllable, and thus further improving the display effect of the display substrate.

[0087] It should be noted that, here, the angle α2 between the sidewall of the pixel opening K and the side of the pixel definition layer 300 near the driving back plate 100, and the partition groove U in the above embodiment, can further ensure that there will be no lateral leakage current in the organic material layer 400a between any two adjacent light-emitting devices.

[0088] In this embodiment, the plurality of second electrodes 201 in the second electrode layer 200 are each composed of a first sub-electrode 201a, a second sub-electrode 201b, a third sub-electrode 201c, and a fourth sub-electrode 201d, sequentially stacked along a direction away from the driving backplate 100. The first sub-electrode 201a and the third sub-electrode 201c can both be made of at least one of titanium or titanium nitride, the second sub-electrode 201b can be made of aluminum, and the fourth sub-electrode 201d can be made of indium tin oxide (ITO). Figure 11 The outer boundary of the orthographic projection of the fourth sub-electrode 201d onto the drive backplate 100 coincides with the outer boundaries of the orthographic projections of the first sub-electrode 201a, the second sub-electrode 201b, and the third sub-electrode 201c onto the drive backplate 100. In other possible implementations, the orthographic projections of the first sub-electrode 201a, the second sub-electrode 201b, and the third sub-electrode 201c onto the drive backplate 100 lie within the orthographic projection of the fourth sub-electrode 201d onto the drive backplate 100, such that the fourth sub-electrode 201d can cover the sidewalls of the first sub-electrode 201a, the second sub-electrode 201b, and the third sub-electrode 201c. This application does not limit this aspect.

[0089] It should be noted that, in order to ensure that the light emitted by the light-emitting device can pass through the second electrode layer 500, the second electrode layer 500 is made of at least one of a transparent conductive material or a semi-transparent conductive material. For example, the second electrode layer 500 can be made of indium zinc oxide (IZO).

[0090] Please refer to the following in this application: Figure 12 , Figure 12 yes Figure 11 The diagram shows the actual object. The orthographic projection of the pixel opening K in the pixel definition layer 300 onto the driving backplate 100 lies within the orthographic projection of the corresponding first electrode 201 onto the driving backplate 100. That is, the pixel definition layer 300 covers the edge portion of the first electrode 201. Here, normally, during the formation of the patterned first electrode layer 200 on the driving backplate 100, defects such as burrs or dents may appear on the sidewalls of the first electrode 201. Thus, this portion of the pixel definition layer 300 covering the edge of the first electrode 201 protects the first electrode 201 near the partition groove U. In this way, after voltage is applied to the first electrode 201 and the second electrode layer 500, this portion of the pixel definition layer 300 covering the edge of the first electrode 201 effectively prevents the first electrode 201 with burrs from experiencing tip discharge with the second electrode layer 500, thereby preventing the light-emitting devices in the display substrate 000 from being damaged.

[0091] In the embodiments of this application, such as Figure 8 and Figure 12 As shown, the distance D2 between the outer boundary of the orthographic projection of the pixel opening K in the pixel definition layer 300 onto the driving backplate 100 and the outer boundary of the orthographic projection of the corresponding first electrode 201 onto the driving backplate 100 is greater than or equal to 150 nanometers. Here, because the pixel definition layer 300 has a partition groove U, the morphology of the portion of the second electrode layer 500 corresponding to the partition groove U is poor, and this portion of the second electrode layer 500 may have a large slope angle (e.g., Figure 8 (As shown in the diagram). In this case, to avoid the possibility of a point discharge between the second electrode layer 500 and the first electrode 201 due to a poor morphology of the second electrode layer 500, which could lead to the breakdown of the light-emitting devices in the display substrate 000, the pixel definition layer 300 of the display substrate 000 needs to cover the edge of the first electrode 201 by at least 150 nanometers. This ensures that the distance between the portion of the first electrode 201 within the pixel opening K and the second electrode layer 500 is relatively large. This effectively reduces the probability of a point discharge between the second electrode layer 500 and the first electrode 201, which could lead to the breakdown of the light-emitting devices in the display substrate 000.

[0092] In this application, the thickness H2 of the organic light-emitting layer 400 is greater than or equal to three times the thickness H3 of the pixel definition layer 300. This results in a relatively gentle slope on the side of the organic light-emitting layer 400 facing away from the driving backplate 100, making the subsequent formation of the second electrode layer 500 on this organic light-emitting layer 400 also relatively gentle. Consequently, the probability of vertical leakage between the second electrode layer 500 and the first electrode 201 is low. For example, as... Figure 12 As shown, after the organic light-emitting layer 400 is formed on the portion of the pixel definition layer 300 covering the edge of the first electrode 201, this portion of the organic light-emitting layer 400 is relatively flat, making the corresponding second electrode layer 500 also relatively flat. Furthermore, since both the thickness H2 of the organic light-emitting layer 400 and the thickness H3 of the pixel definition layer 300 are relatively large, the distance between the second electrode layer 500 and the first electrode 201 is relatively large at the edge position of the pixel definition layer 300 covering the first electrode 201. Thus, the probability of vertical leakage between the second electrode layer 500 and the first electrode 201 is also low.

[0093] It should be noted that the thickness H2 of the organic light-emitting layer 400 can range from 250 nanometers to 450 nanometers, and the thickness H3 of the pixel definition layer 300 can range from 70 nanometers to 140 nanometers. For example, when the thickness H3 of the pixel definition layer 300 is 89 nanometers, the thickness H2 of the organic light-emitting layer 400 can be 333 nanometers.

[0094] In the embodiments of this application, please refer to Figure 13 , Figure 13 This is a schematic diagram of the film layer structure of a display substrate provided in an embodiment of this application. The display substrate 000 may further include an encapsulation layer 700 located on the side of the second electrode layer 500 opposite to the driving backplate 100.

[0095] In this application, the driving backplane 100 has multiple pixel driving circuits T, all of which are located on the substrate 101. Each pixel driving circuit T may include an active layer t1, a gate t2, a source t3, a drain t4, and a transition electrode t5. Here, the multiple pixel driving circuits T can be electrically connected one-to-one with the first electrode 201 in the light-emitting device.

[0096] The active layer t1 is insulated from the gate t2 by a first gate insulating layer 800, and the active layer t1 is electrically connected to both the source t3 and the drain t4. Typically, the source t3 and drain t4 are disposed on the same layer, meaning they belong to the same conductive pattern. The conductive pattern containing the source t3 and drain t4 is insulated from the gate t2 by a second insulating layer 900.

[0097] It should be noted that the active layer t1, gate t2, source t3, and drain t4 can form a thin-film transistor, and the embodiments of this application are illustrated using a low-gate thin-film transistor as an example. In other optional implementations, the thin-film transistor can also be a top-gate thin-film transistor, and the embodiments of this application do not limit this to that.

[0098] One of the source electrode t3 and drain electrode t4 in the driving backplane 100 can be electrically connected to the first electrode 201 via a transition electrode t5. For example, the transition electrode t5 and drain electrode t4 are insulated from each other by a second insulating layer 1000. Here, each pixel driving circuit T can be electrically connected to the first electrode 201 in the corresponding light-emitting device via the transition electrode t5. For example, a first planarization layer 1100 is provided between the transition electrode t5 and the first electrode layer 200.

[0099] The encapsulation layer 700 may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked together. The encapsulation layer 700 is used to encapsulate the display substrate 000 to prevent the organic light-emitting layer 400 in the display substrate 000 from being corroded by components such as moisture and oxygen in the air, thus preventing damage. In this way, the encapsulation layer 700 can effectively improve the lifespan of the light-emitting device.

[0100] In summary, the display substrate provided in this application includes: a driving backplate, a first electrode layer, a pixel definition layer, an organic light-emitting layer, and a second electrode layer. The pixel definition layer has isolation grooves. Since at least a portion of the organic material layer located within the isolation grooves is disconnected from the portion located outside the isolation grooves, the organic material layers between any two adjacent light-emitting devices are disconnected by the isolation grooves. Thus, when a voltage is applied to the first electrode, the electric field formed between the first and second electrode layers isolates the leakage current generated by a portion of the organic material layer in each light-emitting device from the leakage current generated by the isolation grooves. That is, the leakage current generated by the organic material layer in one light-emitting device is not laterally guided to the organic material layer adjacent to that light-emitting device, thereby preventing the light emission of one light-emitting device from affecting the light emission of adjacent light-emitting devices. This ensures a better display effect for the display substrate.

[0101] This application also provides a display device. The display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. The display device can include a driver chip and a display substrate. The display substrate can be an OLED display substrate or an active matrix organic light-emitting diode (AM-OLED) display substrate.

[0102] In this embodiment, the display substrate can be the display substrate described in the above embodiments. For example, it can be... Figure 2 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 9 , Figure 10 , Figure 11 or Figure 13 The display substrate is shown. The driver chip is connected to the display substrate and is used to provide electrical signals to the display substrate so that the display substrate can display images.

[0103] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0104] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0105] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display substrate, characterized in that, include: Drive backplane; A first electrode layer located on one side of the drive backplate, the first electrode layer having a plurality of first electrodes, the first electrodes being electrically connected to the drive backplate; A pixel definition layer is located on the side of the first electrode layer opposite to the driving backplate. The pixel definition layer has a plurality of pixel openings corresponding one-to-one with the plurality of first electrodes, and a partition groove located between two adjacent pixel openings. At least a portion of the first electrodes is located within the corresponding pixel opening. The partition groove has a recessed structure on its sidewall. The pixel definition layer includes a first sub-definition layer and a second sub-definition layer stacked in a direction perpendicular to and away from the driving backplate. The partition groove penetrates the first sub-definition layer and the second sub-definition layer. The side of the second sub-definition layer closest to the partition groove protrudes from the side of the first sub-definition layer closest to the partition groove. The first sub-definition layer is made of silicon nitride, and the second sub-definition layer is made of silicon oxide. An organic light-emitting layer located on the side of the pixel definition layer away from the driving backplate, the organic light-emitting layer comprising: a plurality of organic material layers stacked along a direction perpendicular to and away from the driving backplate, wherein at least a portion of the organic material layers located within the partition groove is disconnected from the portion located outside the partition groove; And a second electrode layer located on the side of the organic light-emitting layer opposite to the driving backplate.

2. The display substrate according to claim 1, characterized in that, The partition groove includes: a first sub-partition groove located within the first sub-definition layer, and a second sub-partition groove located within the second sub-definition layer; Wherein, the orthographic projection of the second sub-partition groove on the drive back plate is located within the orthographic projection of the first sub-partition groove on the drive back plate, and the outer boundary of the orthographic projection of the second sub-partition groove on the drive back plate does not coincide with the outer boundary of the orthographic projection of the first sub-partition groove on the drive back plate.

3. The display substrate according to claim 2, characterized in that, The distance between the outer boundary of the second sub-partition groove's orthographic projection on the drive back plate and the outer boundary of the first sub-partition groove's orthographic projection on the drive back plate ranges from 0.05 micrometers to 0.1 micrometers.

4. The display substrate according to claim 2, characterized in that, The pixel definition layer further includes a third sub-definition layer located on the side of the first sub-definition layer closer to the driving backplane; Wherein, the orthographic projection of the partition groove on the drive back plate is located within the orthographic projection of the third sub-definition layer on the drive back plate; Alternatively, the partition groove may further include a third sub-partition groove located within the third sub-definition layer, wherein the orthographic projection of the third sub-partition groove on the drive back panel is located within the orthographic projection of the first sub-partition groove on the drive back panel, and the outer boundary of the orthographic projection of the third sub-partition groove on the drive back panel does not coincide with the outer boundary of the orthographic projection of the first sub-partition groove on the drive back panel.

5. The display substrate according to claim 4, characterized in that, The third sub-definition layer is made of silicon oxide material.

6. The display substrate according to claim 5, characterized in that, When the orthographic projection of the partition groove on the drive backplane is located within the orthographic projection of the third sub-definition layer on the drive backplane, the pixel definition layer further includes: a protective layer located between the third sub-definition layer and the first sub-definition layer, and the orthographic projection of the partition groove on the drive backplane is located within the orthographic projection of the protective layer on the backplane.

7. The display substrate according to any one of claims 1 to 6, characterized in that, The display substrate further includes: an auxiliary support layer disposed in the same layer as the first electrode layer but made of a different material, wherein the thickness of the auxiliary support layer is less than or equal to the thickness of the first electrode layer; The orthographic projection of the partition groove on the drive back plate is located within the orthographic projection of the auxiliary support layer on the drive back plate.

8. The display substrate according to claim 7, characterized in that, The auxiliary support layer has multiple hollow structures that correspond one-to-one with the plurality of first electrodes, and the outer boundary of the hollow structure's orthographic projection on the drive back plate coincides with the outer boundary of the first electrode's orthographic projection on the drive back plate.

9. The display substrate according to claim 7, characterized in that, The thickness of the auxiliary support layer is greater than or equal to half the thickness of the first electrode layer.

10. The display substrate according to any one of claims 1 to 6, characterized in that, The partition grooves are distributed around the periphery of each pixel opening.

11. The display substrate according to any one of claims 1 to 6, characterized in that, The depth of the partition groove ranges from 70 nanometers to 140 nanometers, and the minimum width of the partition groove ranges from 200 nanometers to 700 nanometers.

12. The display substrate according to any one of claims 1 to 6, characterized in that, The angle between the sidewall of the pixel opening and the side of the pixel definition layer near the driving backplate ranges from 70° to 90°.

13. The display substrate according to any one of claims 1 to 6, characterized in that, The orthographic projection of the pixel opening on the driving backplate is located within the orthographic projection of the corresponding first electrode on the driving backplate.

14. The display substrate according to claim 13, characterized in that, The distance between the outer boundary of the pixel opening projected onto the driving backplate and the outer boundary of the corresponding first electrode projected onto the driving backplate is greater than or equal to 150 nanometers.

15. The display substrate according to any one of claims 1 to 6, characterized in that, The thickness of the organic light-emitting layer is greater than or equal to three times the thickness of the pixel definition layer.

16. The display substrate according to any one of claims 1 to 6, characterized in that, The display substrate further includes an encapsulation layer located on the side of the second electrode layer opposite to the driving backplate.

17. A display device, characterized in that, include: A driver chip and a display panel, wherein the display panel is the display panel according to any one of claims 1 to 16, and the driver chip is used to apply control signals to the display panel.

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