Composite thermal interface material and method of making, and method of interfacing

CN116587710BActive Publication Date: 2026-07-07CHONGQING CHANGAN AUTOMOBILE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHONGQING CHANGAN AUTOMOBILE CO LTD
Filing Date
2023-05-16
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Existing thermal interface materials have low thermal conductivity, which cannot meet the large-area heat dissipation requirements of high-performance integrated circuit chips, and the thermal stress problem caused by the difference in CTE of the materials has not been effectively solved.

Method used

A composite thermal interface material is used, including a base layer, a metal skeleton layer and a connecting layer. The metal skeleton layer consists of a porous metal layer and a dense metal layer, filled with polymer material and connected by a solder layer to form an all-metal thermal conduction path. The porous metal skeleton structure is formed by pulsed laser deposition and sintering.

Benefits of technology

While achieving high thermal conductivity, it reduced Young's modulus, alleviated thermal stress, improved heat dissipation efficiency, and protected the porous metal skeleton from oxidation, thus avoiding degradation of mechanical properties.

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    Figure CN116587710B_ABST
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Abstract

The present application relates to a composite thermal interface material and a preparation method and an interface connecting method thereof. The composite thermal interface material comprises a base layer, a metal skeleton layer, a first connecting layer and a second connecting layer. The metal skeleton layer is formed on the base layer, and the metal skeleton layer comprises a porous metal layer and first and second dense metal layers located on both sides of the porous metal layer. The metal skeleton layer is filled with a polymer material. The first connecting layer is located on the side of the base layer opposite to the metal skeleton layer, and the second connecting layer is located on the side of the metal skeleton layer opposite to the base layer. The composite thermal interface material can realize a full-metal thermal conduction path and obtain a higher thermal conductivity. The polymer material filled in the metal skeleton layer can support the porous metal skeleton and protect the porous metal skeleton from oxidation. In addition, the polymer material can hinder the penetration of solder into the metal skeleton layer, thereby avoiding the gradual degradation of the mechanical properties of the composite thermal interface material during subsequent manufacturing and normal operation.
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