A silicone resin modified polyphenylene sulfide composite material and its preparation and use method

Abstract

The present invention relates to a silicone resin modified polyphenylene sulfide composite material and a preparation and use method thereof, and a silicone resin modified polyphenylene sulfide is prepared, wherein the components include polyphenylene sulfide resin powder, polydimethylsiloxane and 3-(methacryloyloxy)propyltrimethoxysilane. By regulating the ratio of the added silicone monomer to the polyphenylene sulfide resin powder, a polymer gel with good transparency, excellent solvent resistance and excellent bonding performance is prepared. The synthesized silicone resin modified flame retardant polyphenylene sulfide is then stirred and mixed with an inorganic thermally conductive filler boron nitride to form a thermally conductive composite material, which undergoes cross-linking and curing between silicone resin chain segments at room temperature to achieve the encapsulation of solar cells. This silicone resin modified polyphenylene sulfide composite material has the characteristics of flame retardancy, thermal conductivity, good aging resistance and excellent sealing. The packaging process can meet the requirements of the commercial production process of photovoltaic devices and help to improve the service life of solar cells.

Description

Technical Field

[0001] The present invention relates to a research on packaging materials in solar photovoltaic research, and relates to a silicone resin modified polyphenylene sulfide composite material and a preparation and use method thereof, and in particular to a silicone resin modified polyphenylene sulfide composite material and its application in the field of solar cell packaging. Background Art

[0002] Solar photovoltaic cells have experienced rapid development in recent years, with global installed capacity continuing to rise. This has led to an urgent need for innovation in related packaging materials and technologies. Encapsulation effectively isolates devices from the external environment, preventing damage to photovoltaic devices and is crucial for the long-term stable operation of solar cells. Currently, commonly used packaging materials include films such as ethylene-vinyl acetate copolymer, polyvinyl butyral, and polyolefins, and adhesives such as epoxy resins, acrylic resins, and silicone rubbers. Among these, the encapsulation films used for solar cells are typically hot-melt adhesive films, which require a vacuum hot-pressing process during the encapsulation process, significantly increasing packaging costs. Furthermore, the commonly used ethylene-vinyl acetate copolymer exhibits issues such as yellowing and oxidation. Furthermore, commonly used adhesives such as epoxy resins require UV curing and suffer from high internal stress and poor flexibility. Therefore, the photovoltaic cell industry urgently needs to develop new packaging materials to improve material performance, simplify the encapsulation process, and reduce packaging costs.

[0003] For encapsulation polymers, they must not only have excellent water and oxygen barrier properties, but also ensure good light transmittance and thermal conductivity to alleviate the heat accumulation of solar cell devices during operation. Polyphenylene sulfide is a thermoplastic resin composed of an alternating structure of benzene ring groups and sulfide bonds. This neat configuration is conducive to the formation of a crystalline structure with high thermal stability, giving it high rigidity and excellent heat resistance. At the same time, the large amount of sulfur in the polymer structure also gives it outstanding flame retardant properties. In addition, polyphenylene sulfide also has the characteristics of low water absorption, good chemical corrosion resistance, and low dielectric constant. It has been widely used in transportation and electronic and electrical packaging. Although polyphenylene sulfide has outstanding comprehensive advantages in mechanical properties, thermal stability, flame retardancy, electrical properties and resistance to humid and hot environments, it has defects such as high brittleness, poor impact resistance, and low thermal conductivity. It needs to be modified to meet the performance requirements of solar cell encapsulation materials. Silicone resins offer advantages such as high light transmittance, strong UV resistance, and low internal stress. Their flexible siloxane segments effectively mitigate stress accumulation within the polymer, while their abundant active end groups help increase the degree of crosslinking within the polymer system. These resins can enhance toughness and strength within the polyphenylene sulfide matrix, effectively improving the mechanical properties of polyphenylene sulfide at the chemical structural level. However, there are currently few reports on the use of silicone-modified polyphenylene sulfide composites for solar photovoltaic cell encapsulation. Summary of the Invention

[0004] Technical problems to be solved

[0005] In order to overcome the deficiencies of the prior art, the present invention provides a silicone resin modified polyphenylene sulfide composite material and a preparation and use method thereof.

[0006] Technical Solution

[0007] The invention discloses a polyphenylene sulfide composite material modified with an organic silicon resin, which is characterized in that the components include polyphenylene sulfide resin powder, polydimethylsiloxane and 3-(methacryloyloxy)propyltrimethoxysilane.

[0008] The weight proportions of the components are: 10-30 g of polyphenylene sulfide resin powder, 50-100 g of polydimethylsiloxane and 10-30 g of 3-(methacryloyloxy)propyltrimethoxysilane.

[0009] The polyphenylene sulfide resin powder is linear low molecular weight polyphenylene sulfide.

[0010] The polydimethylsiloxane is selected from hydroxyl-terminated polydimethylsiloxane.

[0011] A method for preparing the silicone resin modified polyphenylene sulfide composite material is characterized by the following steps:

[0012] Step 1: Dissolve polyphenylene sulfide resin powder and polydimethylsiloxane in tetrahydrofuran at room temperature and stir to react;

[0013] Step 2: 3-(methacryloyloxy)propyltrimethoxysilane is then added to the system and stirred to carry out polymerization reaction;

[0014] Step 3: Ethanol was added to the reaction system to terminate the reaction, and residual tetrahydrofuran was removed by vacuum to obtain a colorless viscous liquid silicone resin modified polyphenylene sulfide SPS.

[0015] The stirring reaction conditions of step 1 are: stirring the reaction at 120-140° C. for 2-3 hours.

[0016] The polymerization reaction conditions of step 2 are: heating to 80-100° C. and stirring the polymerization reaction for 1-2 hours.

[0017] A method for using the organosilicon resin modified polyphenylene sulfide composite material is characterized by being applied in the field of solar cell packaging.

[0018] The solar cell encapsulation process comprises: mixing flame-retardant polyphenylene sulfide modified with silicone resin and boron nitride, an inorganic thermally conductive filler, to form a thermally conductive composite material; spin-coating the thermally conductive composite material onto a cover glass and then covering the surface of a perovskite device; and cross-linking and curing between the silicone resin segments at room temperature to achieve solar cell encapsulation.

[0019] The solar photovoltaic cells include but are not limited to single crystal silicon solar cells, cadmium telluride thin film cells, organic solar cells, dye-sensitized nano solar cells or perovskite solar cells.

[0020] Beneficial effects

[0021] The present invention proposes a silicone resin-modified polyphenylene sulfide composite material and a preparation and use method. A silicone resin-modified polyphenylene sulfide is prepared. By adjusting the ratio of the added silicone monomer to the polyphenylene sulfide resin powder, a polymer gel with good transparency, solvent resistance, and excellent bonding properties is prepared. The synthesized silicone resin-modified flame-retardant polyphenylene sulfide is then stirred and mixed with the inorganic thermally conductive filler boron nitride to form a thermally conductive composite material. The composite material is spin-coated on a cover glass and then covered on the surface of a perovskite device. At room temperature, cross-linking and curing occur between the silicone resin segments to achieve solar cell encapsulation. This silicone resin-modified polyphenylene sulfide composite material has the characteristics of flame retardancy, thermal conductivity, good aging resistance, and excellent sealing. The encapsulation process can meet the requirements of the commercial production process of photovoltaic devices and help to increase the service life of solar cells.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] (1) Compared with the existing ethylene-vinyl acetate packaging materials with inherent problems such as high moisture absorption rate, poor anti-yellowing performance, and severe thermal expansion and contraction behavior, the silicone-modified polyphenylene sulfide composite material has the advantages of high transparency, low internal stress, and strong anti-yellowing performance. The silicone resin effectively improves the toughness of the polyphenylene sulfide cross-linked network and maintains excellent solvent resistance and flame retardancy. In addition, the addition of inorganic filler boron nitride significantly improves the thermal conductivity of the packaging material and reduces the degree of heat accumulation during the operation of photovoltaic devices, thereby significantly improving the operating stability of perovskite solar cells while maintaining high conversion efficiency. At the same time, the synthesis steps of the packaging material are simple, the cost is low, and the raw materials are widely available.

[0024] (2) Compared with the damage to perovskite caused by degassing steam during UV curing packaging and vacuum high pressure environment during vacuum hot pressing packaging, the silicone modified polyphenylene sulfide composite material can achieve rapid cross-linking and curing at room temperature. The packaging process is simple and efficient, and there is no need to use vacuum hot pressing equipment, which causes less performance loss to solar photovoltaic devices.

[0025] Application research has found that the efficiency loss of encapsulated solar cells is ≤0.6%. Furthermore, the encapsulated devices maintain 93% to 95% of their initial efficiency after 1000 hours of operation under maximum power point tracking at 50-60°C, compared to 2% to 4% efficiency loss with conventional encapsulation processes. Furthermore, the encapsulated devices maintain only 80% to 90% of their initial efficiency after 1000 hours of operation under maximum power point tracking at 50-60°C. This encapsulation material has promising commercial prospects and will help further promote the industrial application of solar photovoltaic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of packaged solar cells

[0027] Cover glass 1, inner layer packaging SPS composite material 2, outer layer packaging material epoxy resin 3, conductive substrate 4, substrate glass 5, metal electrode 6, solar cell functional layer 7

[0028] Figure 2 This is the photoelectric conversion efficiency test curve of solar cells before and after packaging

[0029] Figure 3 This is the stability test curve of solar cells before and after packaging DETAILED DESCRIPTION

[0030] The present invention will now be further described with reference to the embodiments and accompanying drawings:

[0031] The present invention provides a silicone resin modified polyphenylene sulfide composite material, and applies the composite material to the field of solar cell packaging. The main steps are as follows:

[0032] Step 1, preparation of polymer materials: The silicone resin modified polyphenylene sulfide is mainly prepared by polymerization reaction of polyphenylene sulfide resin powder (PPS, 10-30g), polydimethylsiloxane (HTPS, 50-100g) and 3-(methacryloyloxy)propyltrimethoxysilane (10-30g), wherein the polyphenylene sulfide resin powder is preferably linear low molecular weight polyphenylene sulfide, and the polydimethylsiloxane is preferably hydroxyl-terminated polydimethylsiloxane.

[0033] Polyphenylene sulfide resin powder (PPS, 10-30g) and hydroxyl-terminated polydimethylsiloxane (HTPS, 50-100g) were dissolved in 50mL of tetrahydrofuran at room temperature and stirred at 120°C for 2h. 3-(Methacryloxy)propyltrimethoxysilane (10-30g) was then added to the system, and the polymerization reaction was stirred at 80°C for 1h. The reaction was terminated by adding 0.5mL of ethanol, and the residual tetrahydrofuran was removed by vacuum to obtain a colorless, viscous liquid silicone resin-modified polyphenylene sulfide (SPS).

[0034] Step 2, photovoltaic device packaging: 2-5g SPS, 0.1-0.6g inorganic thermal conductive filler boron nitride and 40-80mg catalyst dibutyltin dilaurate are mixed in a glass bottle, stirred at room temperature for 3-5 minutes, and then the SPS composite material is spin-coated on the cover glass at a speed of 2000-4000rpm. The cover glass is then pressed onto the surface of the solar cell, and epoxy resin is applied around the packaged device. Wait for 3-6 hours at room temperature. After the polymer material is completely cured, the solar cell packaging is completed.

[0035] Example 1:

[0036] Polyphenylene sulfide resin powder (PPS, 20g) and hydroxyl-terminated polydimethylsiloxane (HTPS, 80g) were dissolved in 50mL of tetrahydrofuran at room temperature and stirred at 120°C for 2h. 3-(Methacryloxy)propyltrimethoxysilane (10g) was then added to the system, and the temperature was raised to 80°C and stirred for 1h. The reaction was terminated by adding 0.5mL of ethanol. After vacuum removal of the residual tetrahydrofuran, a colorless, viscous liquid silicone resin-modified polyphenylene sulfide (SPS) was obtained.

[0037] Mix 3g of SPS, 0.2g of inorganic thermal conductive filler boron nitride, and 40mg of catalyst dibutyltin dilaurate in a glass bottle. After stirring at room temperature for 4 minutes, the SPS composite material is spin-coated on the cover glass at a speed of 2000 rpm. The cover glass is then pressed onto the surface of the solar cell. Epoxy resin is applied around the encapsulated device and waited at room temperature for 4 hours.

[0038] Test results: The photoelectric conversion efficiency of the encapsulated solar cell is 22.5%, which is 0.4% lower than that of the unencapsulated solar cell. The encapsulated device maintains 93.8% of its initial efficiency after 1000 hours of operation under maximum power point tracking at 50-60°C.

[0039] Example 2:

[0040] Polyphenylene sulfide resin powder (PPS, 30g) and hydroxyl-terminated polydimethylsiloxane (HTPS, 60g) were dissolved in 50mL of tetrahydrofuran at room temperature and stirred at 120°C for 2h. 3-(Methacryloxy)propyltrimethoxysilane (20g) was then added to the system, and the temperature was raised to 80°C and stirred for polymerization for 1h. The reaction was terminated by adding 0.5mL of ethanol, and the residual tetrahydrofuran was removed by vacuum to obtain a colorless, viscous liquid silicone resin-modified polyphenylene sulfide (SPS).

[0041] Mix 5g of SPS, 0.4g of inorganic thermal conductive filler boron nitride, and 80mg of catalyst dibutyltin dilaurate in a glass bottle. After stirring at room temperature for 5 minutes, the SPS composite material is spin-coated on the cover glass at a speed of 3000 rpm. The cover glass is then pressed onto the surface of the solar cell. Epoxy resin is applied around the encapsulated device and waited at room temperature for 5 hours.

[0042] Test results: The photoelectric conversion efficiency of the encapsulated solar cell is 22.1%, which is 0.6% lower than that of the unencapsulated solar cell. The encapsulated device maintains 95.0% of its initial efficiency after 1000 hours of operation under maximum power point tracking at 50-60°C.

[0043] Example 3:

[0044] Polyphenylene sulfide resin powder (PPS, 10g) and hydroxyl-terminated polydimethylsiloxane (HTPS, 40g) were dissolved in 50mL of tetrahydrofuran at room temperature and stirred at 120°C for 2h. 3-(Methacryloxy)propyltrimethoxysilane (30g) was then added to the system, and the temperature was raised to 80°C and stirred for 1h. The reaction was terminated by adding 0.5mL of ethanol. After vacuum removal of the residual tetrahydrofuran, a colorless, viscous liquid silicone resin-modified polyphenylene sulfide (SPS) was obtained.

[0045] Mix 4g of SPS, 0.6g of inorganic thermal conductive filler boron nitride, and 60mg of catalyst dibutyltin dilaurate in a glass bottle. After stirring at room temperature for 3 minutes, the SPS composite material is spin-coated on the cover glass at a speed of 4000 rpm. The cover glass is then pressed onto the surface of the solar cell. Epoxy resin is applied around the encapsulated device and waited at room temperature for 6 hours.

[0046] Test results: The photoelectric conversion efficiency of the encapsulated solar cell is 22.2%, which is 0.5% lower than that of the unencapsulated solar cell. The encapsulated device maintains 94.3% of its initial efficiency after 1000 hours of operation under maximum power point tracking at 50-60°C.

[0047] Example control group:

[0048] In a nitrogen glove box, conductive tape is tightly applied to the electrodes of a perovskite solar cell. A clean, contaminated cover glass is then pressed directly onto the surface of the perovskite solar cell and allowed to stand for 5 minutes. Once contact between the cover glass and the perovskite device surface stabilizes, a perovskite solar cell without encapsulant protection is obtained.

[0049] Figure 2The perovskite device was encapsulated using a silicone resin-modified polyphenylene sulfide composite material. There was no obvious attenuation in the performance of the perovskite device before and after encapsulation, indicating that the silicone resin-modified polyphenylene sulfide composite material can achieve efficient and lossless encapsulation of perovskite devices.

[0050] Figure 3 The operational stability of unencapsulated and silicone resin modified polyphenylene sulfide composite encapsulated perovskite cells was tested. The efficiency of the unencapsulated perovskite device decayed to 59% of the initial efficiency after 600 hours, while the perovskite cell encapsulated based on silicone resin modified polyphenylene sulfide composite material still maintained 95% of the initial efficiency after 1000 hours of operation, indicating that the use of silicone resin modified polyphenylene sulfide composite material encapsulation can achieve excellent operational stability of perovskite devices.

[0051] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description is not intended to limit the present invention. After reading the above description, various modifications and substitutions of the present invention will become apparent to those skilled in the art. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A silicone resin modified polyphenylene sulfide composite material, characterized in that The components include polyphenylene sulfide resin powder, polydimethylsiloxane and 3-(methacryloyloxy)propyltrimethoxysilane; The weight proportions of the components are: 10-30 g of polyphenylene sulfide resin powder, 50-100 g of polydimethylsiloxane and 10-30 g of 3-(methacryloyloxy)propyltrimethoxysilane; The polyphenylene sulfide resin powder is linear low molecular weight polyphenylene sulfide; The polydimethylsiloxane is selected from hydroxyl-terminated polydimethylsiloxane; The organosilicon resin modified polyphenylene sulfide composite material is prepared according to the following steps: Step 1: Dissolve polyphenylene sulfide resin powder and polydimethylsiloxane in tetrahydrofuran at room temperature and stir to react; Step 2: 3-(methacryloyloxy)propyltrimethoxysilane is then added to the system and stirred to carry out polymerization reaction; Step 3: Add ethanol to the reaction system to terminate the reaction, and remove the residual tetrahydrofuran in vacuo to obtain a colorless viscous liquid silicone resin modified polyphenylene sulfide SPS; The stirring reaction conditions of step 1 are: stirring the reaction at 120-140°C for 2-3 hours; The polymerization reaction conditions of step 2 are: heating to 80-100°C and stirring the polymerization reaction for 1-2 hours.

2. A method for using the silicone resin modified polyphenylene sulfide composite material according to claim 1, characterized in that Used in the field of solar cell packaging.

3. The method of use according to claim 2, wherein: The solar cell encapsulation process comprises: mixing flame-retardant polyphenylene sulfide modified with silicone resin and boron nitride, an inorganic thermally conductive filler, to form a thermally conductive composite material; spin-coating the thermally conductive composite material onto a cover glass and then covering the surface of a perovskite device; and cross-linking and curing between the silicone resin segments at room temperature to achieve solar cell encapsulation.

4. The method of use according to claim 2 or 3, characterized in that: The solar photovoltaic cell includes a single crystal silicon solar cell, a cadmium telluride thin film cell, an organic solar cell, a dye-sensitized nano solar cell or a perovskite solar cell.

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