Breathable liquid-proof microphone assembly

Abstract

This disclosure relates to a ventilated, liquid-resistant microphone assembly. Aspects of this subject matter relate to a liquid-resistant microphone module for an electronic device. The microphone module can include a non-porous membrane that seals and isolates the front volume of the microphone module from the external environment of the electronic device. The microphone module can also include a substrate with an opening that allows airflow between the front volume and an internal cavity within the housing of the electronic device. In various embodiments, an inductive vent and / or a resistive vent can be disposed above the opening in the substrate.

Description

Technical Field

[0001] This manual relates in its entirety to acoustic devices including ventilated liquid-proof microphone assemblies. Background Technology

[0002] Electronic devices such as computers, media players, cellular phones, and other electronic equipment often have acoustic components such as microphones. Integrating acoustic components into electronic devices, such as in compact devices including portable electronic devices, can be challenging. Attached Figure Description

[0003] Some features of this subject matter are set forth in the appended claims. However, for illustrative purposes, several aspects of this subject matter are illustrated in the following figures.

[0004] Figure 1 A perspective view of an exemplary electronic device with a microphone, according to various aspects of the subject matter, is shown.

[0005] Figure 2 A cross-sectional side view of a portion of an electronic device according to various aspects of the subject matter is shown, the electronic device including a ventilated liquid-proof microphone adjacent to an opening in the housing of the device.

[0006] Figure 3 A cross-sectional side view of a ventilated liquid-proof microphone module according to various aspects of the subject matter is shown.

[0007] Figure 4 A cross-sectional side view of a ventilated liquid-proof microphone module with a resistive vent is shown, according to various aspects of the subject matter.

[0008] Figure 5 A cross-sectional side view of a portion of another ventilated liquid-proof microphone module with a resistive vent is shown, according to various aspects of the subject matter.

[0009] Figure 6 A cross-sectional side view of a ventilated liquid-proof microphone module with an inductive vent is shown, according to various aspects of the subject matter.

[0010] Figure 7 A cross-sectional side view of a portion of another ventilated liquid-proof microphone module with an inductive vent is shown, according to various aspects of the subject matter.

[0011] Figure 8 A cross-sectional side view of another ventilated liquid-proof microphone module with an inductive vent is shown, according to various aspects of the subject matter.

[0012] Figure 9 A cross-sectional side view of a portion of a ventilated liquid-proof microphone module having resistive and inductive vents, according to various aspects of the subject matter, is shown.

[0013] Figure 10 A cross-sectional side view of a ventilated liquid-proof microphone module having a resistive vent disposed in a circuit block is shown, according to various aspects of the subject matter.

[0014] Figure 11 A cross-sectional side view of a portion of another ventilated liquid-proof microphone module having resistive and inductive vents, according to various aspects of the subject matter, is shown.

[0015] Figure 12 A cross-sectional side view of a portion of another ventilated liquid-proof microphone module having resistive and inductive vents, according to various aspects of the subject matter, is shown.

[0016] Figure 13 A cross-sectional side view of a portion of another ventilated liquid-proof microphone module having resistive and inductive vents, according to various aspects of the subject matter, is shown.

[0017] Figure 14 A cross-sectional side view of a portion of a ventilated liquid-proof microphone module having an inductive vent and a resistive vent disposed in a circuit block, according to various aspects of the subject matter, is shown.

[0018] Figure 15 A cross-sectional side view of a portion of a ventilated liquid-proof microphone module having an inductive vent and an additional vent to the rear volume, according to various aspects of the subject matter, is shown.

[0019] Figure 16 A cross-sectional side view of a portion of a ventilated liquid-resistant microphone module having an inductive vent at least partially disposed in a microphone substrate, according to various aspects of the subject matter, is shown.

[0020] Figure 17 A cross-sectional side view of a resistive ventilator according to various aspects of the subject matter is shown.

[0021] Figure 18 Various aspects of a circuit block including a resistive venting element are shown according to various aspects of the subject matter technology.

[0022] Figure 19 A simplified cross-sectional side view of an inductive ventilator having a first port on a first side and a second port on an opposing second side, according to various aspects of the subject matter, is shown.

[0023] Figure 20 A simplified cross-sectional side view of an inductive ventilator having a first port and a second port on a first side is shown, according to various aspects of the subject matter.

[0024] Figure 21 A simplified cross-sectional side view of an inductive ventilator having a first port on the edge and a second port on the side, according to various aspects of the subject matter, is shown.

[0025] Figure 22 A cross-sectional top view is shown of an inductive ventilator having a first port and a second port on one or more sides and a serpentine fluid passage between the first port and the second port, according to various aspects of the subject matter.

[0026] Figure 23 A top-side cross-sectional view of an inductive ventilator having a first port at the edge, a second port on the side, and a serpentine fluid passage between the first and second ports, according to various aspects of the subject matter, is shown.

[0027] Figure 24 A side view of an inductive ventilator having a first port on the edge and a second port on the side, and a serpentine fluid passage between the first port and the second port, is shown according to various aspects of the subject matter.

[0028] Figure 25 A cross-sectional side view of an inductive ventilator according to various aspects of the subject matter is shown.

[0029] Figure 26 A top perspective view of the fluid passage of an inductive ventilator according to various aspects of the subject matter is shown.

[0030] Figure 27 A cross-sectional side view of a microphone substrate including an embedded inductive vent is shown, according to various aspects of the subject matter.

[0031] Figure 28 Various aspects of the metal layer of a microphone substrate including an embedded inductive venting element are shown according to various aspects of the subject matter.

[0032] Figure 29 A flowchart illustrating exemplary operations for operating a ventilated liquid-proof microphone, according to various aspects of the subject matter, is shown. Detailed Implementation

[0033] The specific embodiments shown below are intended to describe various configurations of the subject matter and are not intended to represent the only configuration in which the subject matter can be practiced. The accompanying drawings are incorporated herein and form part of the detailed description. The detailed description includes specific details intended to provide a thorough understanding of the subject matter. However, it will be clear and apparent to those skilled in the art that the subject matter is not limited to the specific details shown herein and can be practiced without such specific details. In some cases, well-known structures and components are shown in block diagram form in order to avoid obscuring the concepts of the subject matter.

[0034] Electronic devices such as desktop computers, televisions, set-top boxes, Internet of Things (IoT) devices, and portable electronic devices (including mobile phones, portable music players, smartwatches, tablets, smart speakers, remote controllers for other electronic devices, headphones, earbuds, and laptops) typically include one or more sensors and / or one or more components that convert signals in response to air movement and / or acoustic signals (such as sound, for example, from outside the device's housing), and that include components such as speakers that move air based on received signals. As an example, sensors may include acoustic sensors, pressure sensors, and / or ultrasonic sensors, and acoustic sensors may include microphones for inputting sound to the device.

[0035] For example, sensors such as pressure sensors or acoustic sensors, or any combination thereof, may be housed within the enclosure of an electronic device and configured to receive input from outside the enclosure, partly due to airflow from outside to inside the enclosure at various openings or ports. However, it is also desirable to prevent liquid from entering the enclosure of the electronic device and / or into the sensor module (such as a microphone module, ultrasonic sensor module, pressure sensor module, or any combination thereof). In some sensor modules, a porous membrane may be included to provide liquid resistance to the sensor module, allowing airflow to pass through it. To achieve low acoustic loss through the porous membrane, the membrane may be thin and flexible, which typically results in the membrane being less robust to high ingress pressures caused by immersion in deep liquids (such as water, such as immersion at depths greater than approximately six meters).

[0036] According to various aspects of the invention, sensor modules, such as microphone modules or ultrasonic sensor modules, may be provided with a non-porous membrane extending above the acoustic port and preventing liquid from entering the sensor module. For example, the non-porous membrane may be positioned such that it forms the boundary between the front volume of the microphone module and the external environment of the microphone module, and prevents liquid and air from entering the microphone module. To achieve low acoustic loss through the non-porous membrane, the non-porous membrane can be thin and relatively rigid, which helps to provide a more robust membrane structure than porous membranes and can resist large liquid ingress pressures caused by immersion of deep liquids (e.g., water) to depths up to, for example, one hundred meters. However, while a (e.g., thin and relatively rigid) non-porous membrane allows sound to pass through the membrane from the external environment to the acoustic response elements of the microphone module, the non-porous membrane can restrict or prevent airflow between the front volume and the external environment, which can be detrimental to the function of acoustic components such as microphones or ultrasonic sensors.

[0037] For example, in order to obtain the liquid-proof benefits of a microphone module with a non-porous diaphragm above the acoustic port while maintaining microphone functionality, the microphone module may be provided with a leakage port to allow airflow into and out of the front volume sealed off from the external environment by the non-porous diaphragm.

[0038] In one or more embodiments, an opening may be provided in the substrate of the sensor module (such as a microphone module with a non-porous membrane). The opening may extend from a sealed volume to another environment outside the microphone module, such as an external environment on an opposing second side of the substrate, the sealed volume being on a first side of the substrate and fluidly coupled to the front volume and sealed by the non-porous membrane. In one or more embodiments, the sensor module with a non-porous membrane and a leakage port may be implemented in an electronic device such as a smartphone, smartwatch, or tablet, the electronic device having a housing defining an internal volume in which the microphone module is disposed. In one or more embodiments, a leakage port through the substrate of the microphone module fluidly couples the sealed volume on the first side of the substrate to the internal volume of the electronic device, the sealed volume being fluidly coupled to the front volume and sealed by the non-porous membrane. In this way, the internal volume of the electronic device can act as an air reservoir for ventilation from the front volume of the microphone module. In one or more embodiments, a resistive vent or resistive filter and / or an inductive vent or inductive filter may be disposed above the leakage port to prevent sound from inside the cavity from reaching the microphone's acoustic response element.

[0039] Figure 1 The image shows an exemplary electronic device that includes sensor modules such as a microphone module. Figure 1 In the example, the electronic device 100 has been implemented using a housing 106, which is small enough to be portable and carried or worn by the user (e.g., Figure 1The electronic device 100 may be a handheld electronic device such as a tablet computer, cellular phone, or smartphone, or a wearable device such as a smartwatch, headset, or earphone. Figure 1 In the example, electronic device 100 includes a display such as display 110 mounted on the front of housing 106. Electronic device 100 includes one or more input / output devices (such as a touchscreen integrated into display 110), virtual or mechanical buttons or switches, and / or other input / output components disposed above or behind display 110 or on or behind other portions of housing 106. Display 110 and / or housing 106 may form a housing within which components of electronic device 100 (e.g., one or more processors, volatile or non-volatile memory, battery, one or more integrated circuits, one or more speakers, or other components) are housed. Display 110 and / or housing 106 may include one or more openings to accommodate buttons, switches, speakers, light sources, sensors such as microphones, and / or cameras (as an example).

[0040] exist Figure 1 In this example, housing 106 includes an opening 108 within housing 106. In this example, opening 108 forms a port for a sensor (e.g., a microphone) that receives acoustic input (such as sound from the external environment outside housing 106). For example, opening 108 may form a sensor port for a sensor module disposed within housing 106, such as a microphone port for a microphone module disposed within housing 106 and / or an ultrasonic sensor port for an ultrasonic sensor disposed within housing 106. One or more additional openings in housing 106 and / or display 110 (although in...) Figure 1 (Not explicitly shown) can form a speaker port for a speaker disposed within the housing 106.

[0041] The opening 108 can be an open port, or it can be completely or partially covered by a breathable membrane and / or mesh structure that allows air and sound to pass through the opening. Although in Figure 1 An opening 108 is shown, but this is merely illustrative. One opening 108, two openings 108, or more than two openings 108 may be provided on the top edge and / or bottom edge of the housing 106, and / or one or more openings may be formed on the sidewalls (e.g., the left side wall or the right side wall). Although in Figure 1 An opening 108 is depicted on the edge of housing 106, but one or more additional openings for acoustic components and / or sensors may be formed on the rear surface of housing 106 and / or the front surface of housing 106 or the display 110. In some embodiments, one or more sets of openings 108 in housing 106 may be aligned with the acoustic ports of acoustic components and / or sensors within housing 106.

[0042] The housing 106, sometimes referred to as a enclosure, may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or any combination of two or more of these materials. In one example, the housing 106 may be formed of a metal peripheral portion and / or a metal or glass rear panel mounted to the metal peripheral portion, which extends around the periphery of the electronic device 100 (e.g., continuously or in sheets) to form a top edge, a bottom edge, and sidewalls extending therebetween. In this example, the enclosure may be formed of the metal peripheral portion, the rear panel, and the display 110, and device circuitry such as a battery, one or more processors, memory, application-specific integrated circuits, sensors, antennas, acoustic components, etc., are housed within the enclosure.

[0043] However, it should be understood that Figure 1 The configuration of the electronic device 100 is merely illustrative. In other specific embodiments, the electronic device 100 may be a computer (e.g., a smartwatch, a pendant device, or other wearable or micro-device), a media player, a gaming device, a navigation device, a computer monitor, a television, a headset, or a slightly larger device (e.g., a computer integrated into a display (such as a computer monitor, laptop computer, or other electronic equipment)).

[0044] For example, in some specific embodiments, the housing 106 may be formed using a one-piece configuration in which some or all of the housings in the housing 106 are machined or molded into a single structure, or the housing may be formed using multiple structures (e.g., an internal frame structure, one or more structures forming the surface of the outer housing, etc.). Although Figure 1 The housing 106 is shown as a single structure, but it may have multiple parts. For example, in other embodiments, the housing 106 may have an upper and a lower portion, the lower portion being hinged to the upper portion, the hinge allowing the upper portion to rotate relative to the lower portion about a rotation axis. In some embodiments, a keyboard, such as a QWERTY keyboard and a touchpad, may be mounted in the lower housing portion.

[0045] In some embodiments, electronic device 100 may be provided in the form of a wearable device such as a smartwatch. For example, in some embodiments, housing 106 may include one or more interfaces for mechanically attaching housing 106 to a strap or for securing housing 106 to other structures of the wearer. In some embodiments, electronic device 100 may be mechanical or other non-electronic, wherein a microphone may be mounted within the housing, such as a pen, or a support structure such as a monitor stand for a computer monitor. In any of these exemplary embodiments, housing 106 includes an opening 108 associated with a microphone module. In some embodiments, electronic device 100 may be provided in the form of a computer integrated into a computer monitor and / or other display (such as a television). Display 110 may be mounted on the front surface of housing 106, and optionally a stand may be provided to support housing 106 (e.g., on a desktop computer) and / or housing 106 may be mounted on a surface such as a wall.

[0046] The sensor module disposed within the housing 106 receives sound through at least one associated opening 108. Figure 2 A cross-sectional view of a portion of an electronic device 100 in which a sensor module is mounted is shown. For illustrative purposes, the sensor module is described herein as being implemented as a microphone module 202. However, it should be understood that the microphone module 202 can operate as another type of sensor module (e.g., an ultrasonic sensor module) by providing a sound-response element that responds to acoustic signals having frequencies greater than 20 kHz.

[0047] exist Figure 2 In one example, the electronic device 100 includes a sensor module implemented as a microphone module 202 mounted within a housing 106, the microphone module being adjacent to and aligned with an opening 108 in the housing 106. In this example, the microphone module 202 is mounted to an inner surface 221 of the housing 106, such as when mounted on the surface formed by the housing 106 and... Figure 1 The display 110 is housed within the casing.

[0048] As shown, the microphone module 202 may include a substrate 204 (e.g., a printed circuit board (PCB) substrate, such as a multilayer PCB) attached to an inner surface 221 via an adhesive 212. The adhesive 212 may be, for example, a pressure-sensitive adhesive (PSA) or another adhesive or attachment mechanism that attaches the substrate 204 to the inner surface 221, thereby sealing the mounting interface to prevent moisture or other contaminants from entering the housing 106 via the passage between the substrate 204 and the inner surface 221. Figure 2In the example, an opening 215 (e.g., a first opening) in substrate 204 is aligned with an opening 108 in housing 106 to allow sound to be transmitted from an environment 219 outside housing 106 to a sensor assembly 218 mounted on substrate 204. In this way, sensor assembly 218 is in fluid and acoustic communication with opening 215 in substrate 204 (and acoustically with opening 108 in housing 106). Sensor assembly 218 may include, for example, a microelectromechanical system (MEMS) microphone assembly having a movable or flexible diaphragm that, when moved or flexed by an incoming sound, causes the MEMS microphone to generate an electrical signal corresponding to the incoming sound. As another example, sensor assembly 218 may include a movable or flexible diaphragm attached to a voice coil, wherein a current is generated in the voice coil when the diaphragm moves and / or bends. As discussed in further detail below, sensor assembly 218 may include additional microphone circuitry coupled to substrate 204.

[0049] like Figure 2 As shown, the sensor assembly 218 of the microphone module 202 is disposed below a cover 208 (sometimes referred to as a cover, shroud, or shield), which is mounted on a substrate 204 above the sensor assembly 218. In this configuration, a cavity formed between the sensor assembly 218 and the cover 208 defines a rear volume 210 for the sensor assembly 218.

[0050] like Figure 2 As shown, microphone module 202 may include a non-porous membrane 216. As illustrated, the non-porous membrane 216 may span an opening 215 in the substrate and fluidly separate a sealed volume within the microphone module from the environment 219 outside the housing 106 (e.g., on a first side of the substrate 204). For example, the non-porous membrane 216 prevents air and fluid from flowing through the membrane and still functions as a low-loss acoustic diaphragm. Figure 2 In the example, the non-porous membrane 216 is mounted within a recess 214 in the substrate 204. As discussed in further detail below, the non-porous membrane 216 seals the front volume of the microphone module away from the external environment 219 of the housing 106. In this way, a liquid-resistant microphone module can be provided.

[0051] For example, to provide ventilation for a liquid-resistant microphone module having a non-porous membrane 216 that seals the front volume of the microphone from the environment 219, an opening 209 (e.g., a second opening) may be provided in the substrate 204. The opening 209 provides a leakage port from the front volume of the microphone module 202 to another environment outside the microphone module (such as the internal volume 222 of the electronic device 100). Figure 2As shown, the internal volume 222 within the electronic device 100 implementing the microphone module 202 can be separated from the rear volume 210 by a cover 208. In this way, the internal volume 222 can be sealed and separated from the rear volume 210 and can be used as an air reservoir for the microphone module 202.

[0052] According to the various embodiments described herein, the microphone module 202 may also include various arrangements of resistive and / or inductive acoustic vents and / or filters above the opening 209 in the substrate 204 to allow airflow through the opening 209 while preventing sound leakage through the opening 209 (e.g., from the internal volume 222) to the sensor assembly 218. In one or more embodiments, an additional leakage path from the front volume to the rear volume 210 may also be provided via the substrate 204.

[0053] In one or more embodiments described in further detail below, a resistive vent may be provided at an opening 209 in the substrate 204. In one or more embodiments described in further detail below, an inductive vent may be provided at an opening 209 in the substrate 204. The inductive vent may include a first port coupled to the front volume of the microphone module 202, a second port coupled to the opening 209 in the substrate 204, and a fluid passage, such as a serpentine fluid passage from the first port to the second port. Various embodiments and arrangements of the inductive and resistive vents are also disclosed herein.

[0054] Figure 3 A cross-sectional side view of a microphone module 202 in an exemplary specific embodiment is shown. Figure 3 In one example, microphone module 202 includes a substrate 204 having a side 311 (e.g., a first side) and a side 313 opposite the first side (e.g., an opposite second side). As shown, a cover 208 can be mounted to side 311 of substrate 204 and can at least partially define (e.g., together with a portion of substrate 204 and a portion of sensor circuitry) the rear volume 210 of microphone module 202. For example, conductive adhesive 302 (such as soldering material) can be used to attach cover 208 to a surface on side 311 of substrate 204. In one or more embodiments, the soldering material may also fluidly seal and isolate the rear volume 210 from the environment outside the cover (such as the internal volume 222 of electronic device 100). Figure 3 In the cross-sectional side view, it can be seen that the front volume 300 is separated from the rear volume 210 by the sound response element 316. As shown, the front volume 300 is fluidly coupled to the opening 215 in the substrate 204.

[0055] exist Figure 3In the example, the non-porous membrane 216 is attached to a side 313 of the substrate within a groove 214 in the substrate and generally spans the groove 214. In various embodiments, the non-porous membrane 216 may be formed of a polytetrafluoroethylene (PTFE) membrane (such as a non-expanded PTFE membrane) or a polyimide membrane. In various embodiments, the non-porous membrane may have a thickness, for example, between one micrometer and twenty micrometers.

[0056] like Figure 3 As shown, a non-porous membrane 216 defines a sealed volume 301 that is fluidly coupled to a front volume 300 via an opening 215. In this configuration, the non-porous membrane 216 provides a liquid-resistant seal between the front volume 300 and a first environment (e.g., in one or more embodiments, the environment 219 outside the electronic device 100) outside the microphone module 202 on side 313 of the substrate 204, as shown. An opening 209 in the substrate 204 extends from the sealed volume 301 defined by the non-porous membrane 216 through the substrate 204 to a second environment (e.g., in one or more embodiments, a second environment formed by or including the internal volume 222 of the electronic device 100) outside the microphone module on side 311 of the substrate 204. In this way, the opening 209 allows an airflow 333 (e.g., due to movement of the sound response element 316) to pass through the opening 209 between the sealed volume 301 and the environment outside the microphone module on side 311 of the substrate 204.

[0057] exist Figure 3 In the example, microphone module 202 includes a sound response element 316. In various specific implementations, the sound response element may be a movable diaphragm or an actuable MEMS structure. The sound response element 316 may move and / or vibrate in response to sound passing through the non-porous diaphragm 216. Movement of the sound response element 316 may induce an electrical response, which is transmitted to microphone circuitry, such as an integrated circuit 318 (e.g., an application-specific integrated circuit) also disposed below the cover 208 and within the rear volume 210, for processing the microphone signal generated by the sound response element 316. For example, the sound response element 316 and integrated circuit 318 may form... Figure 2 All or part of the sensor assembly 218. Microphone signals generated by the sound response element 316 and / or processed by the integrated circuit 318 can be transmitted (e.g., via a conductive structure including a metal layer in the substrate 204) to one or more conductive contacts on the substrate 204 (e.g., conductive contacts 304 and / or conductive contacts 306 on side 313 of the substrate and / or one or more conductive contacts (e.g., conductive contacts 312) on side 311 of the substrate) for output to other devices and / or components (e.g., via connectors, such as flexible printed circuits, attached to one or more of the conductive contacts).

[0058] In one or more embodiments, the microphone module 202 may further include a circuit block 308. For example, the circuit block 308 may be coupled to conductive contacts 312 on a side 311 of the substrate 204, and may include one or more conductive vias 310 extending vertically away from the substrate 204 and onto one or more conductive contacts (e.g., conductive contacts 314 on the top surface of the circuit block 308). In various embodiments, the microphone module may be provided with… Figure 3 The microphone module 202 may include any subset or all of the conductive contacts, and / or one or more other conductive contacts or mechanisms (such as solder balls). For example, in one or more embodiments in which the microphone module 202 includes circuit block 308 on conductive contact 304, conductive contact 312 and conductive contact 306 may be omitted. In other examples, the microphone module 202 may include conductive contact 304 and conductive contact 306 and omit conductive contact 312 and / or circuit block 308. Figure 3 Any or all of the conductive contacts may be electrically coupled to the device circuitry of the electronic device 100 (e.g., volatile and / or non-volatile memory, one or more processors, etc.) via a connector (such as a flexible printed circuit attached to one or more of the conductive contacts).

[0059] Figure 4 An example of a microphone module 202 is shown, wherein a resistive vent 400 (also referred to herein as a resistive filter) is disposed above an opening 209 on side 311 of substrate 204. For example, Figure 4 The resistive vent 400 includes a porous membrane that spans over the opening 209 and allows airflow through it while preventing sound from passing through. In this example, the resistive vent 400 is attached to the substrate 204 on side 311. Figure 4 As shown, a resistive vent 400 spans over the opening 209, and an airflow 333 can (e.g., due to the movement of the sound response element 316) flow between the sealed volume 301 and the environment outside the microphone module on the side 311 of the substrate 204 (e.g., within the internal volume 222 of the electronic device 100 in one or more embodiments) through the opening 209 and through the resistive vent 400. Figure 4 In the example, the resistive vent 400 is disposed on side 311 of the substrate. However, as... Figure 5 As shown, in one or more embodiments, the resistive vent 400 may be disposed above the opening 209 on the side 313 of the substrate 204 (e.g., attached to the surface of the substrate 204 on the side 313).

[0060] exist Figure 4 and Figure 5In the example, a resistive vent 400 is positioned above the opening 209. In one or more embodiments, the microphone module 202 may also (or alternatively) include an inductive vent (sometimes referred to as an inductive filter) above the opening 209. As an example, Figure 6 The illustration shows a specific embodiment in which the microphone module 202 includes an inductive vent 600 above an opening 209 on side 311 of the substrate 204, and Figure 7 A specific embodiment of which the microphone module 202 includes an inductive vent 600 above an opening 209 on side 313 of the substrate 204 is shown. Figure 6 and Figure 7 In the example, the inductive vent 600 is attached to the surface of the substrate 204 (e.g., to sides 311 and 313, respectively) and covers the opening 209. As discussed in further detail below, the inductive vent 600 may include a channel within the substrate having a length substantially greater than the width of the channel, such that the inductive vent 600 acts as a low-pass acoustic filter.

[0061] like Figure 4 and Figure 5 As shown, the airflow 333 can pass directly through the resistive vent 400 (e.g., through the porous membrane of the resistive vent). For example... Figure 6 and Figure 7 As shown, in a specific embodiment in which an inductive vent 600 is provided, the airflow 333 may include a portion of the inductive vent 600 that travels laterally in a direction generally parallel to the surface of the substrate 204 (e.g., through a serpentine fluid passage or channel in the inductive vent, as described in further detail below) for at least a portion of the passage.

[0062] In these examples, the non-porous membrane is mounted on side 313 of substrate 204 (e.g., in...). Figure 7 The microphone module 202 may be directly mounted on the surface of the substrate 204 on side 313 and outward from the inductive vent 600. In one or more other embodiments, the microphone module 202 may include the inductive vent 600 above the opening 209 on side 313 of the substrate 204, and the non-porous membrane 216 may be mounted to the inductive vent 600.

[0063] For example, Figure 8 A specific embodiment is shown in which the inductive vent 600 generally spans the recess 214 in the substrate 204 and the non-porous membrane 216 is attached to the inductive vent 600 (e.g., attached to the substrate 204 via the inductive vent 600). Figure 8A broader embodiment of the inductive vent 600 may allow a relatively longer internal fluid passage to extend between a first port coupled to the front volume 300 and a second port coupled to the opening 209. As shown, the inductive vent 600 may include an opening 800 aligned with an opening 215 in the substrate 204 to allow sound to reach the sound response element 316 through openings 215 and 800. In one or more embodiments, the inductive vent 600 includes a fluid passage, such as a serpentine fluid passage. In one or more embodiments, the fluid passage in the inductive vent 600 may include a first portion formed on a first side of the opening 215 and a second portion formed on a second side of the opening 215. In one or more embodiments, the fluid passage may extend around the opening 800. For example, in a serpentine fluid passage, two or more segments of the serpentine fluid passage may be spaced apart by a distance wider than the width of the opening 800, or one or more segments of the serpentine fluid passage may include curves or bends that pass around the opening 800 without being fluidly coupled to the opening 800. In one or more embodiments, a port or segment of the serpentine fluid passage may be fluidly coupled to the opening 800.

[0064] like Figure 8 As shown, in one or more embodiments, the inductive vent 600 may be formed from a substrate 802 and a cover layer. For example, the substrate 802 may be a patterned substrate in which etched channels partially define fluid pathways, such as serpentine fluid pathways. For example, the etched channels may define two opposing sidewalls and a bottom wall extending between the two opposing sidewalls, and the substrate 802 (e.g., before being attached to the substrate 204) may define an open channel without a top wall. Figure 8 As shown, adhesive layer 804 can attach substrate 802 of inductive vent 600 to substrate 204 of microphone module 202. In this way, substrate 204 and / or adhesive layer 804 can form a cover layer for inductive vent 600. In one or more embodiments, adhesive layer 804 can cover fluid passages and (e.g., in combination with substrate 204) define walls, such as top walls of fluid passages formed by etched patterns in substrate 802. Adhesive layer 804 can be formed of, for example, a thermally activated film, pressure-sensitive adhesive, curable liquid adhesive, or another adhesive material. In one or more other embodiments described herein, the cover layer forming the top walls of etched patterns in the substrate of the inductive vent can include or incorporate a polymer layer, such as a polyimide tape adhesively attached to the substrate of the inductive vent. Figure 8 As shown, the adhesive layer 804 can adhesively attach the substrate 204 to the side 313 of the substrate 204 within the groove 214. In this example, the non-porous membrane 216 is attached to the substrate 204 of the inductive vent 600.

[0065] exist Figure 8 In the example, the inductive vent 600 is disposed on side 313 of the substrate 204, and the microphone module 202 does not have a resistive vent. However, in one or more other embodiments, the microphone module 202 may include the inductive vent 600 disposed on side 313 of the substrate 204 and a resistive vent above the opening 209.

[0066] For example, Figure 9 An exemplary embodiment of a microphone module 202 is shown, wherein the microphone module 202 includes an inductive vent 600 disposed above an opening 209 on side 313 of a substrate 204 and a resistive vent 400 disposed above an opening 209 on side 311 of the substrate 204. In this example, airflow 333 passes directly through the resistive vent 400, through the opening 209, and laterally through the inductive vent 600 in a direction generally parallel to the surface of the substrate 204. In this example, a non-porous membrane 216 is attached to the inductive vent 600.

[0067] Figure 10 Another example embodiment is shown in which the microphone module 202 includes a resistive vent above an opening 209 on side 311 of a substrate 204. Figure 10 In this example, circuit block 1000 (e.g., an input / output (I / O) block) is disposed above opening 209 on side 311 of substrate 204. In this example, circuit block 1000 includes conductive via 1002 extending from conductive contact 312 to conductive contact 1004 on the top surface of circuit block 1000. In this example, circuit block 1000 also forms a resistive vent above opening 209. In this example, the resistive vent is disposed within the circuit block. For example, the resistive vent may be formed from a membrane 1006 (e.g., a porous membrane) spanning a central opening 1008 in circuit block 1000.

[0068] exist Figure 10 In the example, circuit block 1000 is disposed on side 311 of the substrate, and microphone module 202 may not have inductive vent 600, or may include inductive vent 600 above opening 209 on side 313 of substrate 204 (e.g., as shown in the example). Figure 7 The inductive venting device shown or such Figure 8 (The inductive vent across cavity 214 is shown). For example, in one or more embodiments, microphone module 202 may include circuit block 1000, which includes a resistive vent mounted above opening 209 on side 313 of substrate 204 and an inductive vent 600 above opening 209 on side 313 of substrate 204. Figure 10In the example, the microphone module 202 may have a circuit block 1000 above the opening 209 and may not have a circuit block 308 (see, for example, [reference needed]). Figure 3 Alternatively, it may include both the circuit block 1000 above the opening 209 and the circuit block 308 on the side 311 of the substrate 204. For example, in an embodiment where the microphone module 202 includes both the circuit block 1000 above the opening 209 and the circuit block 308 on the side 311 of the substrate 204, the circuit block 1000 may be used to route electrical signals from the microphone circuitry to conductive contacts 1004 on top of the circuit block 1000 (e.g., for transmission to other device circuitry (e.g., a processor) via an interface (e.g., a flexible printed circuit), and the circuit block 308 may provide additional input / output (I / O) blocks for embedding functional silicon dies (e.g., for providing RF filtering or other processing for microphone signals from the microphone module 202).

[0069] Return to reference Figure 9 For example, microphone module 202 includes an inductive vent 600 disposed above an opening 209 on side 313 of substrate 204, a resistive vent 400 disposed above an opening 209 on side 311 of substrate 204, and a non-porous membrane 216 attached to the inductive vent 600 (e.g., substrate 802 attached to the inductive vent 600). In another example, Figure 11 The illustration shows a specific implementation in which the microphone module 202 includes an inductive vent 600 disposed above an opening 209 on side 313 of substrate 204, a resistive vent 400 disposed above an opening 209 on side 311 of substrate 204, and a non-porous membrane 216 directly attached to substrate 204 (e.g., laterally outward from the position where the inductive vent 600 is attached to substrate 204).

[0070] exist Figure 11 In the example, a resistive vent 400 is disposed on side 311 of substrate 204 (e.g., in an environment on that side of substrate 204, such as within the internal volume 222 of electronic device 100), and an inductive vent 600 is disposed on side 313 of substrate 204 (e.g., within a sealed volume 301). Figure 9 and Figure 11 In the example, microphone module 202 includes a resistive vent 400 above an opening 209 on side 311 of substrate 204, and an inductive vent 600 above an opening 209 on side 313 of substrate 204. Figure 9 and Figure 11In the example, the ventilation path (e.g., pressure equalization path) through the inductive vent 600 and the resistive vent 400 is shown by the airflow 333, which flows between the front volume 300, through the channel in the inductive vent 600 and through the porous membrane in the resistive vent 400, and the environment outside the microphone module on the side 311 of the substrate (e.g., an air reservoir formed by the internal volume 222 within the housing 106 of the electronic device 100).

[0071] Figure 12 Another specific embodiment of the microphone module 202 is shown, wherein a resistive vent 400 is disposed above an opening 209 on side 313 of the substrate 204 (e.g., disposed within a sealed volume 301) and an inductive vent 600 is disposed above an opening 209 on side 311 of the substrate 204 (e.g., disposed on side 311 of the substrate within an environment outside the microphone module, such as within an internal volume 222 disposed within the housing 106 of the electronic device 100). Figure 12 In the example, the microphone module 202 includes an inductive vent 600 above an opening 209 on side 311 of the substrate 204 and a resistive vent 400 above an opening 209 on side 313 of the substrate 204.

[0072] In the various examples described herein, a resistive vent 400 is disposed on one side of the substrate 204, and an inductive vent 600 is disposed on the opposite side of the substrate 204. In one or more other embodiments, both the inductive and resistive vents may be formed on the same side of the substrate 204. For example, Figure 13A specific implementation is shown in which an inductive vent 600 is attached to the substrate 204 on side 311 and a resistive vent 400 is attached to the inductive vent 600 (e.g., on the side of the inductive vent opposite to the side of the inductive vent 600 attached to the substrate 204). As shown, in this arrangement, airflow 333 can flow between the opening 209, a first port on the bottom of the inductive vent 600 adjacent to the opening 209, a fluid channel within the inductive vent 600 (e.g., including a portion extending in a direction parallel to the surface of the substrate 204), a port on the top surface of the inductive vent 600, and a sealed volume 301 of the resistive vent 400 on side 313 of the substrate 204 and the environment on side 311 of the substrate (e.g., the internal volume 222 of the electronic device 100). In this arrangement, the inductive vent 600 may be adhesively attached to the substrate 204, and the resistive vent 400 may be (e.g., adhesively) attached to the inductive vent 600. In this arrangement, the inductive vent 600 may have a first port on a first side and fluidly coupled to the opening 209, and a second port on an opposing second side and fluidly coupled to the resistive vent 400. Figure 13 In the example, the microphone module 202 includes an inductive vent 600 mounted above an opening 209 on a side 313 of a substrate 204, and a resistive vent 400 mounted on the inductive vent 600.

[0073] Figure 14 Another embodiment is shown in which the inductive vent and the resistive vent are formed on the same side of the substrate 204. Figure 14 In this example, the microphone module 202 includes a circuit block 1000 having a central opening 1008 and a diaphragm 1006 on a side 311 of a substrate, and also includes an inductive vent 600 disposed above an opening 209 on the side 311 of the substrate. In this example, the inductive vent 600 is disposed within the central opening 1008 in the circuit block 1000. Figure 14 In the example, the microphone module 202 includes a circuit block 1000 mounted above an opening 209 on a side 311 of a substrate 204, a resistive vent across an opening (e.g., a central opening 1008) in the circuit block, and an inductive vent 600 mounted above the opening 209 on a side 311 of the substrate 204 and within an opening in the circuit block 1000.

[0074] In this article Figures 2 to 14In the various examples described, microphone module 202 includes opening 215 (e.g., a first opening) which may be an acoustic port for the microphone module, and opening 209 (e.g., a second opening) which provides a leakage port from the front volume 300 to the environment on the side 311 of substrate 204 (e.g., the internal volume 222 of the electronics 100 outside and fluidly separated from the rear volume 210 of the microphone module). In one or more specific embodiments, the microphone module may include another leakage port located between the front volume 300 and the rear volume 210. The other leakage port may be formed by another opening (e.g., a third opening) in substrate 204, such as generally between opening 215 and opening 209.

[0075] For example, Figure 15 A specific implementation is shown in which the microphone module 202 includes an inductive vent 600 mounted above an opening 209 on a side 313 of a substrate 204 and an opening 1500 (e.g., a third opening) in the substrate 204. Figure 15 In the example, the inductive vent 600 also includes an opening 1502. As shown, the opening 1502 in the inductive vent 600 can be aligned with an opening 1500 in the substrate 204 to fluidly couple the front volume 300 to the rear volume 210. In one or more embodiments, the opening 1502 extends through the inductive vent 600, and the inductive filter also includes a fluid passage (e.g., a serpentine fluid passage) located therein, which extends around the opening 1502 without being fluidly coupled to the opening 1502. In this way, the substrate 204 may include an opening 209 covered by the inductive vent 600 and an uncovered opening 1502. Figure 15 As shown, the microphone module 202 may include an airflow passage 1501, which includes a portion of direct flow between the sealed volume 301 and the rear volume 210 (e.g., to provide another leakage port between the front volume 300 and the rear volume 210, thereby achieving a linear frequency response for the microphone module), and a portion of flow via opening 209 within the inductive vent 600 (e.g., within a serpentine fluid passage extending around openings 215 and 1502) and between the sealed volume 301 and the environment on the side 311 of the substrate.

[0076] exist Figure 15 In the specific implementation shown, the microphone module 202, which has an opening 1500 in the substrate 204 and an opening 1502 in the inductive vent 600, may not have a resistive vent above the opening 209, or may include a resistive vent 400, a circuit block 1000 including the resistive vent, and / or a circuit block 308, as described herein. Figure 3 , Figure 4 , Figure 5 , Figure 8 , Figure 9 , Figure 10 and / or Figure 11 The specific implementation is described in any of the specific embodiments. For example, in one or more embodiments, a microphone module 202 having an opening 1500 in substrate 204 and an opening 1502 in inductive vent 600 may include a resistive vent 400 above an opening 209 on side 311 of substrate 204. As another example, in one or more embodiments, a microphone module 202 having an opening 1500 in substrate 204 and an opening 1502 in inductive vent 600 may include a resistive vent disposed within a circuit block 1000 attached to side 311 of substrate 204.

[0077] exist Figures 6 to 14 In one example, microphone module 202 may include an inductive vent attached to substrate 204 via an adhesive material (e.g., an adhesive material for attaching a cover layer of an inductive vent to substrate 204). In one or more other embodiments, microphone module 202 may include an inductive filter at least partially formed within the microphone substrate 204 (also referred to herein as a microphone substrate). For example, Figure 16 A specific embodiment is shown in which an inductive filter 1600 (also referred to herein as an inductive vent) is disposed in a substrate 204 and extends from an opening 215 to an opening 209.

[0078] like Figure 16 As shown, the inductive filter 1600 may include a channel 1602 formed in the substrate 204. For example, the channel 1602 may be an etched channel (e.g., a laser-etched channel, a chemically etched channel, etc.) that follows a path within the substrate 204, such as a serpentine path. In one or more embodiments, the channel 1602 may be an open channel having three sides formed by recesses in the substrate 204 and may be closed by a cover layer attached to the substrate 204. For example, the cover layer may include a cover 1604 (e.g., an outer layer or outer cover layer, such as a polyimide or other polymer layer) attached to the substrate 204 via an adhesive layer 1606. For example, the adhesive layer 1606 may be a thermally activated film, a pressure-sensitive adhesive, a curable liquid adhesive, or other adhesive material. The channel 1602 may be, for example, a serpentine channel having one or more fold-back sections and may have a channel width and a channel length substantially greater than the channel width (e.g., many times greater), as discussed in further detail below.

[0079] exist Figure 16In a specific implementation, the microphone module 202 with an inductive filter 1600 disposed in the substrate 204 may not have a resistive vent above the opening 209, or may include a resistive vent 400, a circuit block 1000 including the resistive vent, and / or a circuit block 308, such as in Figure 3 , Figure 4 , Figure 5 , Figure 8 , Figure 9 , Figure 10 and / or Figure 11 In any specific embodiment, for example, a microphone module 202 having an inductive filter 1600 disposed in a substrate 204 may include a resistive vent 400 above an opening 209 on a side 311 of the substrate 204. In one or more embodiments, the resistive vent may be a resistive vent disposed in a circuit block 1000 mounted to a side 311 of the substrate 204.

[0080] exist Figure 16 In one example, the non-porous membrane 216 is mounted on the cover 1604 of the inductive filter 1600. In other examples, the non-porous membrane 216 may be directly mounted to side 313 of the substrate 204. For example, as in Figure 16 In the example, the inductive filter 1600 may substantially span the width of the recess 214, or the inductive filter 1600 may have a short lateral extent within the substrate 204, and the non-porous membrane 216 may be directly attached to the substrate 204 laterally outside the distal end of the cover 1604 of the inductive filter 1600.

[0081] exist Figure 16 In the example, substrate 204 does not have an additional opening between the front volume 300 and the rear volume 210. However, in other embodiments, microphone module 202 having an inductive filter 1600 disposed in substrate 204 and / or having a resistive vent and / or circuit block disposed thereon may include additional openings, such as... Figure 15 An opening 1500 extends between the sealed volume 301 and the rear volume 210. In these specific embodiments, the opening 1500 may pass through the inductive filter 1600 without being fluidly coupled to the channel 1602. For example, one or more segments of the channel 1602 may be spaced apart, bent, and / or folded to bypass the opening 1500 without being fluidly coupled to the channel 1602.

[0082] Figure 17 A cross-sectional side view of a resistive vent 400 according to one or more specific embodiments is shown. Figure 17As shown, the resistive vent 400 may include a frame 1700 having a central opening 1701. In one or more embodiments, the central opening 1701 may be aligned with an opening 209 in the substrate 204 of the microphone module 202. As shown, the resistive vent 400 may also include a membrane 1702, such as a porous membrane (e.g., an expanded PTFE membrane) spanning the central opening 1701 in the frame 1700. For example, the membrane 1702 may be a porous membrane that allows airflow but has a large acoustic impedance. When implemented in the microphone module 202, the porous membrane 1702 may extend over the opening 209 in the substrate 204, as described herein in conjunction with various examples. Depending on the direction of the airflow (e.g., airflow 333) passing through the membrane 1702 when mounted over the opening 1702, a portion of the central opening 1701 on a first side of the membrane 209 may form a first inlet or outlet orifice 1706, and a portion of the central opening 1701 on a second side of the membrane 1702 may form a second inlet or outlet orifice 1708. In one or more embodiments, the frame 1700 may be formed of plastic or another substrate (such as a printed circuit board material (e.g., a glass-reinforced epoxy such as FR4)).

[0083] Figure 18 A cross-sectional side view of a circuit block 1000 according to one or more specific implementations is shown. Figure 18 The diagram also shows a top view of circuit block 1000. (As shown...) Figure 18 As shown, circuit block 1000 may include frame 1800. In one or more embodiments, frame 1800 may be formed of plastic or another substrate, such as a printed circuit board (e.g., glass-reinforced epoxy, such as FR4)). As shown, film 1006 may span a central opening 1008 in frame 1800. As shown, conductive vias 1002 may be formed in frame 1800. Conductive vias 1002 may each extend from conductive contacts (e.g., solder pads) 1806 on a first side of frame 1800 to conductive contacts 1004 (e.g., solder pads) on an opposite second side of frame 1800. Figure 18 In the cross-sectional view, two conductive vias 1002 are visible. However, in the top view, six conductive contacts 1004 are shown, indicating six corresponding conductive vias within the frame. This is merely illustrative, and the circuit block 1000 may be provided with any suitable number of conductive vias and corresponding contact pads. Depending on the direction of the airflow (e.g., airflow 333) passing through the membrane 1006 when mounted above the opening 1006, a portion of the central opening 1008 on the first side of the membrane 209 may form a first inlet or outlet orifice 1802, and a portion of the central opening 1008 on the second side of the membrane 1006 may form a second inlet or outlet orifice 1804.

[0084] like Figure 18As illustrated in the examples, in one or more specific embodiments, when implemented in microphone module 202, circuit block 1000 may include at least one conductive via 1002 extending from a first contact pad (e.g., conductive contact 312) on a first side (e.g., side 311) of substrate 204 away from substrate 204 to a second contact pad (e.g., conductive contact 1004) on the top surface of circuit block 1000. In this example, circuit block 1000 includes a body forming a frame 1800 of a resistive filter and surrounding at least one conductive via 1002.

[0085] Figures 19 to 21 Various simplified cross-sectional side views of the inductive filter 1900 are shown. As an example, Figure 19 , Figure 20 or Figure 21 The inductive filter 1900 can be a specific implementation of the inductive vent 600 or the inductive filter 1600 described herein. For example... Figure 19 As indicated, the inductive filter 1900 may include a first port 1902 formed on side 1903 (e.g., a first side) of the inductive filter 1900 and a second port 1904 formed on side 1905 (e.g., an opposing second side) of the inductive filter 1900. As shown, channel 1906 (e.g., Figure 16 The specific implementation of channel 1602 or such Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and / or Figure 15 (Specific implementation of the channel within a separate substrate in the example) extends through substrate 1909 (e.g., substrate 204 or a separate inductive filter substrate) between first port 1902 and second port 1904. For example, first port 1902 may be coupled to the front volume 300 of a microphone module, and second port 1904 may be coupled to an opening 209 in substrate 204.

[0086] exist Figure 20 In the example, the first port 1902 and the second port 1904 of the inductive filter 1900 are both formed on the common side of the inductive filter 1900 (e.g., side 1905 in this example). Figure 21 In the example, the first port 1902 of the inductive filter 1900 is formed on the edge 2100 of the inductive filter 1900, and the second port 1904 of the inductive filter is formed on the side 1905 of the inductive filter 1900. Figure 19 , Figure 20 and Figure 21 The inductive filter can be implemented as Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and / or Figure 15 Inductive vents / filters from any of the examples. Although in Figures 19 to 20 In the example, channel 1906 is shown as a single linear channel segment; however, it should be understood that channel 1906 can be a serpentine channel or any other arrangement of channels with a channel length that extends relative to the width of the channel.

[0087] For example, Figure 22 It shows Figure 20 A top cross-sectional view of an inductive filter 1900 in an arrangement, wherein the first port 1902 and the second port 1904 of the inductive filter 1900 are both formed on the side of the inductive filter 1900 (e.g., both are formed together on a side such as side 1905 or on opposite sides such as sides 1903 and 1905). Figure 23 A cross-sectional top view is shown of an example in which a first port 1902 of an inductive filter 1900 is formed on an edge 2100 of the inductive filter 1900 and a second port 1904 of the inductive filter is formed on a side 1905 of the inductive filter 1900.

[0088] like Figure 22 and Figure 23 As shown, channel 1906 can be a serpentine channel, which includes a plurality of parallel segments 2200 extending between bends 2202 and / or bends 2204 to form foldback sections within substrate 1909. Figure 22 and Figure 23 In the example, the first port 1902 can be an inlet port configured to be fluidly coupled to an opening 215 in the substrate 204 of the microphone module 202. Figure 22 and Figure 23 In the example, the second port 1904 can be an outlet port configured to be fluidly coupled to an opening 209 in the substrate 204 of the microphone module 202. Figure 22 As shown in the example, the first port 1902 may include a plurality of input channels 2206, each fluidly positioned between channel 1906 and the first port 1902. Figure 22 and Figure 23As shown in the example, the second port 1904 may include a plurality of output channels 2208, each of which is fluidly coupled between channel 1906 and the second port 1904.

[0089] Figure 24 It shows Figure 21 and Figure 23 A side view of the inductive filter 1900, where channel 1906 is simply represented by dashed lines. Figure 24 The side view illustrates how an inductive filter 1900 can be formed from a substrate 1909 in which channels 1906 are formed and a cover 2400. As an example, the cover 2400 can be a combination of the above. Figure 8 The described cover layer or Figure 16 A specific implementation of the cover 1604 is shown. As illustrated, the cover 2400 can be attached to side 1905 of the substrate 1909 via an adhesive material 2401. As an example, the adhesive material 2401 can be... Figure 16 The specific implementation of adhesive layer 1606.

[0090] Figure 25 It shows Figures 19 to 24 A cross-sectional side view of an inductive filter 1900 in any specific embodiment, showing the cross-section of several segments 2200 of channel 1906. For example, Figure 25 The sectional view can be along Figure 22 or Figure 23 The cross section AA of either of them is cut off. Although in Figure 25 Not visible in the cross-section, but the substrate 1909 includes the same surface, different surfaces and / or edges of the substrate 1909 (e.g., as shown in the image). Figures 19 to 21 The channel 1906 has at least one inlet port (e.g., first port 1902) and at least one outlet port (e.g., second port 1904). The adhesive material 2401 may be patterned such that the inlet and outlet ports of the channel 1906 are not blocked by the adhesive material. In one or more embodiments, the channel 1906 may have a cross-sectional width 2409 between 10 micrometers and 100 micrometers (e.g., between two opposing sidewalls 2500), and may have a depth between 10 micrometers and 100 micrometers (e.g., between a side 1905 of the substrate 1909 and the bottom surface 2502 of the channel 1906). In one or more embodiments, the total length of the channel 1906 may be between 10 mm and 50 mm. Figure 25In one example, the inductive filter 1900 includes a patterned substrate (e.g., substrate 1909) and a cover layer attached to the patterned substrate, the cover layer defining the surface of a serpentine fluid passage defined by channel 1906. In one or more embodiments, the cover layer includes an outer layer (e.g., cover 2400) and an adhesive material 2401, the adhesive material 2401 extending into and partially defining a portion of the serpentine fluid passage. Figure 25 In the example, a portion of adhesive material 2401 contacts the surface of substrate 1909 on side 1905, and a portion 2503 of adhesive material 2401 extends partially into segment 2200 of channel 1906.

[0091] Figure 26 A perspective view of a fluid passage including channel 1906 of an inductive filter 1900 according to one or more embodiments is shown, wherein substrate 1909, cover 2400, and adhesive material 2401 have been removed for clarity. Figure 26 As shown, channel 1906 can form a serpentine fluid passage having multiple folds formed by segments 2200, each fold extending between bends 2202 and bends 2204. As shown, multiple input channels 2206 can extend parallel to each other between the first port 1902 and channel 1906. As shown, a portion 2600 of channel 1906 can extend around the first port 1902 (e.g., therefore around...). Figure 8 The opening 800 is non-fluidly coupled to the first port 1902. In one or more specific embodiments, the first port 1902 may correspond to... Figure 8 The opening is 800. In Figure 26 In the example, the serpentine sections 2200 of channel 1906 are evenly spaced and linear. However, the inductive filter 1900 has another opening (such as...) Figure 15 In one or more embodiments of the opening 1502, one or more of the segments 2200 may have different spacings and / or may include curves or bends around the other opening 1502 without being fluidly coupled to the opening 1502. Figure 26 In the example, the first port 1902 is fluidly coupled to an opening 215 in the substrate 204 of the microphone module 202, and the second port 1904 is fluidly coupled to an opening 209 in the substrate 204. It should be understood that... Figure 26 The number of segments 2200 shown is illustrative, and more or fewer segments 2200 may be used.

[0092] As this article combines various examples (such as...) Figure 16As discussed in the example), in one or more specific embodiments, an inductive filter (e.g., inductive vent 600, inductive filter 1600 and / or inductive filter 1900) may be at least partially defined in the substrate 204 of the microphone module 202. Figure 27 A cross-sectional side view of a substrate 204 is shown in one or more embodiments in which an inductive filter 1600 is partially defined in a substrate 204.

[0093] like Figure 27 As shown, substrate 204 can be a multilayer substrate having one or more metal layers 2700, one or more insulating layers 2702, insulating layer 2706, and metal layer 2704. For example, the metal layers 2700 can be interconnected with each other (e.g., through one or more internal vias in the substrate) to form conductive paths for operation of microphone module 202. In one or more embodiments, metal layer 2704 can be electrically isolated from metal layer 2700 by insulating layer 2706, and a mask for forming channel 1906 in insulating layer 2706 can be formed. For example, metal layer 2704 can be a patterned metal layer forming an etching mask for etching (e.g., laser etching) the channel into insulating layer 2706. Figure 26 As illustrated in the examples, in one or more embodiments, substrate 204 can be formed by a combination of patterning and laminating printed circuit board material, such that a channel 1906 (e.g., an embedded serpentine channel) is formed therein. For example, channel 1906 can be formed by a combination of patterning and laminating PCB material, such that an embedded serpentine channel is formed in the resulting substrate. For example, metal layer 2704 can be patterned and used as a mask for an etching process (e.g., laser etching or other etching processes) that removes unmasked portions of insulating layer 2706 and / or insulating layer 2702.

[0094] As shown, a cover 2400 (which may be a specific embodiment of cover 1604) may be attached to a metal layer 2704. For example, an adhesive material 2401 (which may be a specific embodiment of adhesive layer 1606) may be attached to the metal layer 2704 of the substrate 204 and the cover 2400 may be attached thereto. In one or more embodiments, the adhesive material 2401 may partially extend into channels 1906 formed in the metal layer 2704 and the insulating layer 2706, such as (for example) Figure 25 As shown in the figure, openings 215 and 209 in substrate 204 can pass through one or more metal layers 2700, one or more insulating layers 2702, metal layer 2704, and insulating layer 2706. In one or more embodiments, insulating layer 2702 and / or insulating layer 2706 may be formed of, for example, a glass-reinforced epoxy resin laminate (such as FR4). Figure 27 In the example, the first port 1902 is fluidly coupled to the opening 215 and the second port 1904 is fluidly coupled to the opening 209.

[0095] Figure 28 An example of a partial manufacturing state 204' of the substrate 204 is shown before the insulating layer 2702 has been removed to form openings 215 and 209. Figure 28 The figure also shows a bottom view of the metal layer 2704, highlighting the opening 2800 in the metal layer 2704, which forms an opening in the channel 1906 that can be covered by the cover 2400. As shown, the metal layer 2704 of the substrate 204 may also define a plurality of parallel input channels 2206 extending from the first port 1902 to the serpentine fluid pathway formed by the channel 1906. Figure 28 The example also shows a bottom view of the insulating layer 2706, and a portion of the metal layer 2802 of the substrate 204 can be seen through the etched channels in the insulating layer 2706.

[0096] According to one or more embodiments, an inductive acoustic filter (e.g., vent 600, inductive filter 1600, or inductive filter 1900) is provided, comprising a substrate (e.g., substrate 204 or substrate 1909), an etched serpentine channel (e.g., channel 1602 or channel 1906) extending from a first port 1902 in substrate 204 to a second port 1904 in substrate 204 in the surface of the substrate and within the substrate, and a polymer overlay layer (e.g., overlay 1604 or overlay 2400) adhesively attached to the surface of the substrate over the etched serpentine channel. In one or more embodiments, the polymer overlay layer is adhesively attached to the surface of the substrate by an adhesive material (e.g., adhesive layer 1606 or adhesive material 2401) comprising a first portion of a surface contacting the substrate (e.g., a surface on side 1905) and a second portion extending into a portion of the etched serpentine channel (e.g., as shown in the image). Figure 25 (As shown). In one or more embodiments, the adhesive material includes a thermally activated film. In one or more embodiments, the polymer overlay layer is formed of polyimide. In one or more embodiments, the etched serpentine channel has a cross-sectional width 2409 and a length substantially greater than the cross-sectional width 2409. In this way, the inductive filter 1900 can function as a low-pass acoustic filter.

[0097] In one or more embodiments, the polymer overlay layer includes an opening fluidly coupled to a second port 1904 in the substrate. In one or more embodiments, the polymer overlay layer is configured for attachment to a microphone substrate (e.g., substrate 204) of the microphone module 202, wherein the opening is aligned with a leakage port (e.g., opening 209) in the microphone substrate. In one or more other embodiments, the substrate is the microphone substrate (e.g., substrate 204) of the microphone module 202. In one or more embodiments, the inductive acoustic filter also includes a plurality of parallel input channels 2206 extending from the first port 1902 to an etched serpentine channel.

[0098] In one or more embodiments, the electronic device 100 includes a housing 106 defining an internal volume 222 and a microphone module 202 disposed within the internal volume 222. In one or more embodiments, the microphone module 202 includes a substrate 204 and a cover 208 mounted to the substrate 204, wherein the cover 208 separates a rear volume 210 of the microphone module 202 from the internal volume 222. In one or more embodiments, the microphone module 202 also includes a front volume 300 separated from the rear volume 210 by a sound response element 316 and fluidly coupled to a first opening (e.g., opening 215) in the substrate 204. In one or more embodiments, the microphone module also includes a non-porous membrane 216 defining a sealed volume 301 fluidly coupled to the front volume 300 via the first opening and providing a liquid-resistant seal between the front volume 300 and an environment 219 outside the housing 106. In one or more embodiments, the microphone module further includes a second opening in the substrate (e.g., opening 209) extending through the substrate 204 from a sealed volume 301 defined by a non-porous membrane 216 to an internal volume 222 outside the cover 208 of the housing 106. In one or more embodiments, the electronic device 100 also includes at least one of a resistive filter (e.g., a resistive vent 400 or a resistive filter disposed in the circuit block 1000) or an inductive filter (e.g., an inductive vent 600, an inductive filter 1600, or an inductive filter 1900) mounted above the second opening in the substrate.

[0099] In one or more embodiments, the microphone module 202 includes a substrate 204, a cover 208 mounted to the substrate 204 and at least partially defining a rear volume 210 of the microphone module 202, and a front volume 300 separated from the rear volume 210 by a sound response element 316 and fluidly coupled to a first opening (e.g., opening 215) in the substrate 204. In one or more embodiments, the microphone module 202 also includes a non-porous membrane 216 defining a sealed volume 301 fluidly coupled to the front volume 300 via the first opening and providing a liquid-resistant seal between the front volume 300 and a first environment (e.g., environment 219) outside the microphone module 202 on a first side (e.g., side 313) of the substrate 204. In one or more embodiments, the microphone module 202 further includes a second opening (e.g., opening 209) in the substrate 204 that extends from a sealed volume 301 defined by the non-porous membrane 216 through the substrate 204 to a second environment (e.g., internal volume 222) outside the microphone module on an opposing second side (e.g., side 311) of the substrate 204. In one or more embodiments, the microphone module 202 includes an inductive filter (e.g., inductive vent 600, inductive filter 1600, or inductive filter 1900) disposed between at least a portion of the non-porous membrane 216 and at least a portion of the substrate 204, the inductive filter having a first port 1902 coupled to the front volume 300, a second port 1904 coupled to the second opening in the substrate 204, and a serpentine fluid passage (e.g., formed by channel 1906) from the first port 1902 to the second port 1904.

[0100] In one or more embodiments, the inductive filter is attached to an opposing second side (e.g., side 311) of the substrate via an adhesive material (e.g., adhesive material 2401). In one or more embodiments, the inductive filter is entirely disposed within a sealed volume 301 defined by a non-porous membrane 216 (e.g., as shown in the image). Figure 7 and Figure 11 (As shown). In one or more embodiments, substrate 204 includes a recess 214, an inductive filter is attached to substrate 204 within the recess 214, and the inductive filter substantially spans the entire width of the recess 214 (e.g., as shown in...). Figure 8 , Figure 9 , Figure 15 , Figure 16 and Figure 27 (as in the example). In one or more specific implementations, the inductive filter also includes a plurality of parallel input channels 2206 extending from the first port 1902 to the serpentine fluid path.

[0101] In one or more embodiments, the microphone module 202 may include: a substrate 204; a cover 208 mounted to the substrate 204 and at least partially defining a rear volume 210 of the microphone module 202; a front volume 300 separated from the rear volume 210 by a sound response element 316 and fluidly coupled to a first opening (e.g., opening 215) in the substrate 204; a non-porous membrane 216 defining a sealed volume 301 fluidly coupled to the front volume 300 via the first opening and providing a liquid-resistant seal between the front volume 300 and a first environment (e.g., environment 219) outside the microphone module on a first side (e.g., side 313) of the substrate 204; and a first... A second opening (e.g., opening 209) extends from a sealed volume 301 defined by a non-porous membrane 216 through the substrate 204 to a second environment (e.g., the internal volume 222 of the electronic device 100) outside the microphone module 202 on an opposing second side (e.g., side 311) of the substrate; and an inductive filter (e.g., inductive filter 1600 or inductive filter 1900) at least partially defined in the substrate 204, the inductive filter having a first port 1902 coupled to the second opening, a second port 1904 coupled to the second environment, and a serpentine fluid passage (e.g., defined by channel 1906) within the substrate 204 from the first port 1902 to the second port 1904.

[0102] In one or more embodiments, the serpentine fluid pathway is partially defined by a cover layer (e.g., cover 1604 or cover 2400) attached to the substrate 204 by an adhesive material (e.g., adhesive layer 1606 or adhesive material 2401). In one or more embodiments, the adhesive material extends at least partially into the serpentine fluid pathway (e.g., as shown in the image). Figure 25 (As shown). In one or more embodiments, substrate 204 is a multilayer substrate having a metal layer 2704, and an adhesive material (e.g., adhesive layer 1606 or adhesive material 2401) is attached to the metal layer 2704 of substrate 204. In one or more embodiments, the metal layer 2704 of substrate 204 also defines a plurality of parallel input channels 2206 extending from the first port 1902 to the serpentine fluid pathway.

[0103] In one or more embodiments, the electronic device 100 includes a housing 106 defining an internal volume 222 and a microphone module 202 disposed within the internal volume 222. In one or more embodiments, the microphone module 202 includes: a substrate 204; a cover 208 mounted to the substrate 204, the cover 208 separating a rear volume 210 of the microphone module 202 from the internal volume 222; a front volume 300 separated from the rear volume 210 by a sound-response element 316 and fluidly coupled to a first opening (e.g., opening 215) in the substrate 204; a non-porous membrane 216 defining a sealed volume 301 fluidly coupled to the front volume 300 via the first opening and providing a liquid-resistant seal between the front volume 300 and an environment 219 outside the housing 106; and a second opening in the substrate 204. The second opening extends from the sealed volume 301 defined by the non-porous membrane 216 through the substrate 204 to the inner volume 222 outside the cover 208 of the housing; and an inductive filter (e.g., inductive vent 600, inductive filter 1600, or inductive filter 1900) disposed between at least a portion of the non-porous membrane 216 and at least a portion of the substrate 204, the inductive filter having a first port 1902 coupled to the front volume 300, a second port 1904 coupled to the second opening in the substrate 204, and a serpentine fluid passage (e.g., defined by channel 1906) from the first port to the second port.

[0104] Figure 29 A flowchart illustrating an exemplary process for operating an electronic device using a ventilated, liquid-resistant microphone according to one or more specific embodiments is shown. For purposes of explanation, this document primarily refers to... Figures 1 to 28 The process 2900 is described using electronic device 100 and microphone module 202. However, the process 2900 is not limited to... Figures 1 to 28 The electronic device 100 and microphone module 202 are included, and one or more blocks (or operations) of process 2900 may be performed by one or more other components and other suitable devices. Further, for illustrative purposes, the blocks of process 2900 are described herein as occurring sequentially or linearly. However, multiple blocks of process 2900 may occur in parallel. Furthermore, the blocks of process 2900 need not be performed in the order shown, and / or one or more blocks of process 2900 need not be performed and / or may be replaced by other operations.

[0105] exist Figure 29In the example, at block 2902, sound can be received from the environment (e.g., environment 219) outside the electronic device (e.g., electronic device 100) at the sound response element (e.g., sound response element 316) of the liquid-resistant microphone (e.g., non-porous membrane 216) and through a first opening (e.g., opening 215) in the substrate (e.g., substrate 204) of the liquid-resistant microphone.

[0106] At frame 2904, an electronic signal can be generated based on the movement of the sound-response element caused by the received sound. In one or more embodiments, the movement of the sound-response element caused by the received sound causes an airflow (e.g., airflow 333) to pass through a second opening (e.g., opening 209) in the substrate, which is located between the front volume (e.g., front volume 300) of the liquid-resistant microphone, which is at least partially defined by a non-porous membrane, and the interior cavity of the electronic device (e.g., internal volume 222 within housing 106), which is separated from the rear volume (e.g., rear volume 210) of the liquid-resistant microphone by a cover (e.g., cover 208) mounted to the substrate.

[0107] In various specific embodiments, the airflow passes through at least one of a resistive filter (e.g., a resistive vent 400 or a resistive filter mounted in the circuit block 1000) or an inductive filter (e.g., an inductive vent 600, an inductive filter 1600, and / or an inductive filter 1900) mounted above a second opening in the substrate, such as, for example Figures 3 to 16 As shown in any of the figures. In one or more embodiments, a portion of the airflow may also pass through a third opening in the substrate (e.g., opening 1500), which fluidly couples the rear volume and the front volume (e.g., as combined) Figure 15 The above).

[0108] According to various aspects of the present invention, a microphone module is disclosed, the microphone module comprising a substrate having a first side and an opposing second side; a cover attached to the first side of the substrate and at least partially defining a rear volume of the microphone module; a front volume separated from the rear volume by a sound response element and fluidly coupled to a first opening in the substrate; a non-porous membrane defining a sealed volume fluidly coupled to the front volume via the first opening and providing a liquid-resistant seal between the front volume and a first environment outside the microphone module on the opposing second side of the substrate; and a second opening located in the substrate extending from the sealed volume defined by the non-porous membrane through the substrate to a second environment outside the microphone module on the first side of the substrate.

[0109] According to other aspects disclosed in this subject matter, an electronic device is provided, the electronic device comprising: a housing defining an internal volume; a microphone module disposed within the internal volume, the microphone module including: a substrate; a cover mounted to the substrate, wherein the cover separates a rear volume of the microphone module from the internal volume; a front volume separated from the rear volume by a sound-response element and fluidly coupled to a first opening in the substrate; a non-porous membrane defining a sealed volume fluidly coupled to the front volume via the first opening and providing a liquid-resistant seal between the front volume and an environment outside the housing; and a second opening located in the substrate, the second opening extending from the sealed volume defined by the non-porous membrane through the substrate to the internal volume of the housing outside the cover.

[0110] According to another aspect of the invention, a method is provided for operating a liquid-resistant microphone for an electronic device, the method comprising: receiving sound from an environment outside the electronic device at a sound response element of the liquid-resistant microphone through a non-porous membrane of the liquid-resistant microphone and through a first opening in a substrate of the liquid-resistant microphone; and generating an electronic signal based on movement of the sound response element caused by the received sound. The movement of the sound response element caused by the received sound causes airflow through a second opening in the substrate, the second opening being located between a front volume of the liquid-resistant microphone at least partially defined by the non-porous membrane and an inner cavity of the electronic device, the inner cavity being separated from a rear volume of the liquid-resistant microphone by a cover mounted to the substrate.

[0111] The various functions described above can be implemented in digital electronic circuits, computer software, firmware, or hardware. This technology can be implemented using one or more computer program products. Programmable processors and computers can be included in or packaged as mobile devices. The process and logic flow can be executed by one or more programmable processors and one or more programmable logic circuits. General-purpose and special-purpose computing devices, as well as storage devices, can be interconnected via communication networks.

[0112] Some specific implementations include electronic components, such as microprocessors, storage devices, and memories, that store computer program instructions in machine-readable or computer-readable media (or computer-readable storage media, machine-readable media, or machine-readable storage media). Examples of such computer-readable media include RAM, ROM, read-only optical discs (CD-ROM), recordable optical discs (CD-R), rewritable optical discs (CD-RW), read-only digital versatile optical discs (e.g., DVD-ROM, dual-layer DVD-ROM), various recordable / rewritable DVDs (e.g., DVD-RAM, DVD-RW, DVD+RW, etc.), flash memory (e.g., SD cards, mini-SD cards, micro-SD cards, etc.), magnetic and / or solid-state hard disk drives, high-density optical discs, any other optical or magnetic media, and floppy disks. Computer-readable media may store computer programs that can be executed by at least one processing unit and include a set of instructions for performing various operations. Examples of computer programs or computer code include machine code, such as machine code generated by a compiler, and files that include higher-level code that can be executed by a computer, electronic components, or microprocessor using an interpreter.

[0113] While the above discussion primarily concerns microprocessors or multi-core processors that execute software, some implementations are performed by one or more integrated circuits such as application-specific integrated circuits (ASICs) or field-programmable gate arrays (FPGAs). In some implementations, such integrated circuits execute instructions stored on the circuit itself.

[0114] As used in this specification and any claim of this patent application, the terms "computer," "processor," and "memory" refer to electronic or other technical devices. These terms exclude persons or groups of persons. As used in this specification and any claim of this patent application, the terms "computer-readable medium" and "computer-readable media" are limited entirely to tangible, touchable objects that store information in a form readable by a computer. These terms do not include any wireless signals, wired download signals, or any other transient signals.

[0115] To provide interaction with the user, specific implementations of the subject matter described herein can be implemented on a computer having a display device for displaying information to the user, as well as keyboards and pointing devices that the user can use to provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user can be received in any form, including acoustic, speech, or tactile input.

[0116] Many of the features and applications described above can be implemented as software processes that specify a set of instructions to be recorded on a computer-readable storage medium (also referred to as a computer-readable medium). When these instructions are executed by one or more processing units (e.g., one or more processors, processor cores, or other processing units), the instructions cause the one or more processing units to perform the actions indicated in the instructions. Examples of computer-readable media include, but are not limited to, CD-ROMs, flash drives, RAM chips, hard disk drives, EPROMs, etc. Computer-readable media do not include carrier waves and electrical signals transmitted wirelessly or via wired connections.

[0117] In this specification, the term "software" is intended to include firmware residing in read-only memory or applications stored in magnetic storage devices, which can be read into memory for processing by a processor. Similarly, in some embodiments, multiple software aspects disclosed herein may be implemented as sub-parts of a larger program while retaining the different software aspects disclosed herein. In some embodiments, multiple software aspects may also be implemented as independent programs. Finally, any combination of independent programs that collectively implement the software aspects described herein is within the scope of this disclosure. In some embodiments, when installed to run on one or more electronic systems, a software program defines one or more specific machine implementations that execute and perform the operations of the software program.

[0118] Computer programs (also known as programs, software, software applications, scripts, or code) can be written in any programming language, including compiled or interpreted languages, declarative or procedural languages, and can be deployed in any form, including as standalone programs or as modules, components, subroutines, objects, or other units suitable for use in a computing environment. Computer programs may, but do not necessarily, correspond to files in a file system. A program may be stored as a part of a file containing other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to the program in its description, or in multiple coordinating files (e.g., a file storing one or more modules, subroutines, or code sections). Computer programs can be deployed to execute on a single computer or on multiple computers located at the same site or distributed across multiple sites and interconnected via a communication network.

[0119] It should be understood that the specific order or hierarchy of the boxes in the process disclosed in this invention is an example of an exemplary method. Based on design preferences, it should be understood that the specific order or hierarchy of the boxes in the process may be rearranged or all shown boxes may be executed. Some boxes within these boxes may be executed simultaneously. For example, in some cases, multitasking and parallel processing may be advantageous. Furthermore, the division of various system components in the foregoing aspects should not be construed as requiring such division in all aspects, and it should be understood that program components and systems may generally be integrated together in a single software product or packaged into multiple software products.

[0120] On one hand, the term "coupled" can refer to direct coupling. On the other hand, the term "connection" can refer to indirect connection.

[0121] Terms such as top, bottom, front, back, side, horizontal, and vertical refer to any frame of reference, not the usual gravitational frame of reference. Therefore, such terms can extend upward, downward, diagonally, or horizontally within a gravitational frame of reference.

[0122] The preceding descriptions are provided to enable those skilled in the art to practice the various aspects described herein. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects. Therefore, this claim is not intended to be limited to the aspects shown herein, but rather to be consistent with the language of the claim, wherein references to elements in singular values ​​are not intended to mean “one and only one,” but rather “one or more,” unless specifically indicated. Unless otherwise specifically stated, the term “some” means one or more. Male pronouns (e.g., his) include female and neutral pronouns (e.g., her and its), and vice versa. Titles and subtitles (if any) are used for convenience only and do not limit the disclosure of this subject matter.

[0123] The predicates “configured to,” “capable of operating,” and “programmed to” do not imply any specific tangible or intangible modification to a particular subject but are intended to be used interchangeably. For example, a component or a processor configured to monitor and control operations may also mean that the processor is programmed to monitor and control operations or that the processor is operable to monitor and control operations. Similarly, a processor configured to execute code can be interpreted as either programmed to execute code or operable to execute code.

[0124] The phrase "aspect" does not imply that this aspect is essential to the present subject matter or that this aspect applies to all configurations of the present subject matter. Disclosures relating to an aspect may apply to all configurations, or one or more configurations. The phrase "aspect" may refer to one or more aspects, and vice versa. The phrase "configuration" does not imply that this configuration is essential to the present subject matter or that this configuration applies to all configurations of the present subject matter. Disclosures relating to a configuration may apply to all configurations, or one or more configurations. The phrase "configuration" may refer to one or more configurations, and vice versa.

[0125] The word “example” is used in this document to mean “used as an example or illustration.” Any aspect or design described in this document as an “example” is not necessarily to be construed as superior or advantageous to any other aspect or design.

[0126] All structural and functional equivalents of elements throughout the various aspects described herein that are known or later become apparent to those skilled in the art are expressly incorporated herein by reference and are intended to be covered by the claims. Furthermore, nothing disclosed herein is intended to be made public, regardless of whether such disclosure is expressly stated in the claims. No claim element should be interpreted in accordance with 35 U.S.SC §112(f) unless the element is expressly stated using the phrase “means for…” or, in the case of a method claim, using the phrase “steps for…”. Furthermore, terms such as “comprising,” “having,” etc., are used to a certain extent in the specification or claims, and such terms are intended to be included in a manner similar to how the term “comprising” is interpreted when used as a transitional word in a claim.

Claims

1. A microphone module, comprising: A substrate having a first side and an opposing second side; A cover, the cover being mounted to the first side of the substrate and at least partially defining the rear volume of the microphone module; A front volume, which is separated from the rear volume by a sound-response element and fluidly coupled to a first opening in the substrate; A non-porous membrane defines a sealed volume fluidly coupled to the front volume via a first opening and provides a liquid-resistant seal between the front volume and a first environment located on the opposite second side of the substrate and outside the microphone module; as well as A second opening is located in the substrate and extends from the sealed volume defined by the non-porous membrane through the substrate to a second environment located on the first side of the substrate and outside the microphone module.

2. The microphone module according to claim 1 further includes a resistive vent located on the first side of the substrate and above the second opening.

3. The microphone module of claim 1 further includes a resistive vent located on the opposite second side of the substrate and above the second opening.

4. The microphone module according to claim 1 further includes an inductive vent located on the first side of the substrate and above the second opening.

5. The microphone module of claim 1, further comprising an inductive vent located on the opposite second side of the substrate and above the second opening, wherein, The non-porous membrane is mounted to the opposite second side of the substrate.

6. The microphone module of claim 1, further comprising an inductive vent located on the opposite second side of the substrate and above the second opening, wherein, The non-porous membrane is installed on the inductive vent.

7. The microphone module according to claim 6 further includes a circuit block located on the first side of the substrate.

8. The microphone module of claim 7 further includes a resistive venting element mounted on the first side of the substrate and above the second opening.

9. The microphone module according to claim 8, wherein, The resistive vent is disposed in the circuit block.

10. The microphone module according to claim 1, further comprising: A circuit block located on the first side of the substrate; as well as A resistive vent is disposed in the circuit block.

11. The microphone module of claim 10, further comprising an additional circuit block mounted on the first side of the substrate.

12. The microphone module according to claim 1, further comprising: A resistive vent, wherein the resistive vent is located on the first side of the substrate and above the second opening; as well as An inductive vent is located on the opposite second side of the substrate and above the second opening.

13. The microphone module according to claim 1, further comprising: An inductive vent is located on the first side of the substrate and above the second opening; as well as A resistive vent is located on the opposite second side of the substrate and above the second opening.

14. The microphone module according to claim 1, further comprising: A circuit block, the circuit block including a resistive vent mounted on the first side of the substrate and above the second opening; as well as An inductive vent is located on the opposite second side of the substrate and above the second opening.

15. The microphone module according to claim 1, further comprising: An inductive vent is mounted on the first side of the substrate and above the second opening; as well as A resistive vent is mounted on the inductive vent.

16. The microphone module according to claim 1, further comprising: A circuit block, the circuit block being mounted on the first side of the substrate and above the second opening; A resistive vent that spans an opening on the circuit block; as well as An inductive vent is mounted on the first side of the substrate and above the second opening and located within the opening in the circuit block.

17. The microphone module according to claim 1, further comprising: An inductive vent is mounted on the opposite second side of the substrate and above the second opening; A third opening, wherein the third opening is located in the substrate; as well as The opening in the inductive vent is aligned with the third opening in the substrate to fluidly couple the front volume and the rear volume.

18. The microphone module of claim 17, further comprising a resistive vent located on the first side of the substrate and above the second opening.

19. The microphone module according to claim 18, wherein, The resistive vent is disposed within the circuit block, which is attached to the first side of the substrate.

20. The microphone module of claim 1, further comprising an inductive filter disposed in the substrate and extending from the first opening to the second opening.

21. The microphone module according to claim 20, wherein, The non-porous membrane is mounted to the opposite second side of the substrate or to a cover for the inductive filter.

22. The microphone module of claim 21, further comprising a third opening located in the substrate and fluidly coupled to the front volume and the rear volume.

23. The microphone module of claim 20, further comprising a resistive vent located on the first side of the substrate and above the second opening.

24. The microphone module according to claim 23, wherein, The non-porous membrane is mounted to the opposite second side of the substrate or to a cover for the inductive filter.

25. The microphone module of claim 24, further comprising a third opening located in the substrate, the third opening being fluidly coupled to the front volume and the rear volume.

26. The microphone module according to claim 23, wherein, The resistive vent is disposed in the circuit block, which is mounted to the first side of the substrate.

27. The microphone module according to claim 26, wherein, The non-porous membrane is mounted to the opposite second side of the substrate or to a cover for the inductive filter.

28. The microphone module of claim 27, further comprising a third opening located in the substrate and fluidly coupled to the front volume and the rear volume.

29. An electronic device comprising: The housing defines an internal volume; A microphone module, disposed within the internal volume, comprises: substrate; A cover, mounted to the substrate, wherein the cover separates the rear volume of the microphone module from the internal volume. A front volume, which is separated from the rear volume by a sound-response element and fluidly coupled to a first opening in the substrate; A non-porous membrane, defining a sealed volume fluidly coupled to the front volume via the first opening, and providing a liquid-resistant seal between the front volume and the environment outside the housing; and The second opening is located in the substrate and extends from the sealed volume defined by the non-porous membrane through the substrate to the inner volume of the housing outside the cover.

30. The electronic device of claim 29, further comprising at least one of a resistive filter or an inductive filter mounted above the second opening in the substrate.

31. A method for operating a liquid-resistant microphone in an electronic device, the method comprising: Sound is received from the environment outside the electronic device at the sound response element of the liquid-proof microphone through the non-porous diaphragm of the liquid-proof microphone and through a first opening in the substrate of the liquid-proof microphone; as well as Electronic signals are generated based on the motion caused by the received sound from the sound response element. The motion of the sound response element caused by the received sound causes airflow through a second opening in the substrate, the second opening being located between the front volume of the liquid-resistant microphone, which is at least partially defined by the non-porous membrane, and the inner cavity of the electronic device, the inner cavity being separated from the rear volume of the liquid-resistant microphone by a cover mounted to the substrate.

32. The method according to claim 31, wherein, The airflow passes through at least one of a resistive filter or an inductive filter mounted above the second opening in the substrate.

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