Elevator control cabinet

Abstract

The embodiment of the application discloses an elevator control cabinet, which comprises a shell, a first function plate, a second function plate, a third function plate and a fourth function plate, wherein the first function plate constitutes a first layer structure, the second function plate constitutes a second layer structure, the third function plate constitutes a third layer structure, and the fourth function plate constitutes a fourth layer structure; the second layer structure is located on one side of the first layer structure away from the bottom plate; the third layer structure is located on one side of the second layer structure away from the bottom plate; and the fourth layer structure is located on one side of the third layer structure away from the bottom plate. The embodiment of the application arranges the function plates in layers in the shell, which is conducive to realizing greater space utilization in the vertical direction of the bottom plate in the shell, and further reducing the size of the control cabinet.

Description

Technical Field

[0001] This application relates to the field of elevator equipment technology, and in particular to an elevator control cabinet. Background Technology

[0002] Elevators are becoming increasingly common in cities, especially in high-rise buildings where they are an indispensable part. To ensure the normal operation of elevators, they are generally equipped with an elevator control system, which is integrated into a control cabinet.

[0003] In related technologies, control cabinets are relatively large in size because the internal components are distributed in a relatively dispersed manner and the space utilization rate inside the control cabinet is low. Summary of the Invention

[0004] This application provides an elevator control cabinet to solve the problem in related technologies where the control cabinet is large in size due to the dispersed distribution of internal components and low space utilization.

[0005] This application provides an elevator control cabinet, including:

[0006] A housing having a receiving cavity and a bottom plate;

[0007] A first functional board is located in the receiving cavity, and the first functional board constitutes a first layer structure.

[0008] The second functional plate is located in the receiving cavity and forms a second layer structure. The second layer structure is located on the side of the first layer structure away from the bottom plate.

[0009] The third functional plate is located in the receiving cavity, and the third functional plate constitutes a third layer structure. The third layer structure is located on the side of the second layer structure opposite to the bottom plate.

[0010] The fourth functional plate is located in the receiving cavity and constitutes a fourth layer structure. The fourth layer structure is located on the side of the third layer structure opposite to the bottom plate.

[0011] In some embodiments, it also includes:

[0012] A control module is located in the receiving cavity, and the control module includes a control board;

[0013] A power module, located within the receiving cavity, comprising a power board; and

[0014] A drive module is located in the receiving cavity. The drive module, the control module, and the power module are electrically connected to each other. The drive module includes a drive board and a capacitor board, and the drive board and the capacitor board are electrically connected to each other.

[0015] The drive board forms the first layer structure, the capacitor board forms the second layer structure, the power board forms the third layer structure, and the control board forms the fourth layer structure.

[0016] In some embodiments, the control module further includes:

[0017] The UCMP board is located between the second layer structure and the fourth layer structure.

[0018] In some embodiments, the drive module further includes a module board located in the receiving cavity, the drive board, the capacitor board, and the module board being electrically connected to each other, and the module board being provided with a rectifier and an inverter.

[0019] The driver board, capacitor board, UCMP board and control board are all located on the same side of the module board, and the module board spans the first layer structure, the second layer structure, the third layer structure and the fourth layer structure.

[0020] In some embodiments, a first interval is defined between the side of the module board facing away from the drive board, the capacitor board, the UCMP board, and the control board and the inner wall surface of the housing. The rectifier and the inverter are both located within this first interval. The elevator control cabinet further includes:

[0021] A radiator, wherein the radiator is located in the first interval;

[0022] The first cooling fan is provided, and the housing also has a first air inlet and a first air outlet communicating with the first interval. The first air inlet and the first air outlet are respectively located on opposite sides of the first heat sink. The first cooling fan is provided and installed on the housing corresponding to the first air outlet.

[0023] In some embodiments, it also includes:

[0024] A circuit breaker is electrically connected to the drive board and is located in the receiving cavity. The base plate includes a first region and a second region connecting the first region. The projections of the drive board, the capacitor board, the power board, and the UCMP board onto the base plate are all located in the first region. The projection of the circuit breaker onto the base plate is located in the second region. The projection of the control board onto the base plate is located in both the first region and the second region.

[0025] In some embodiments, the surface of the base plate includes a first region, the first region comprising:

[0026] The first sub-region, wherein the projection of the drive plate onto the base plate is at least partially located in the first sub-region;

[0027] The second sub-region is connected to the first sub-region, and the projection of the capacitor plate onto the base plate is at least partially located in the first sub-region and the second sub-region.

[0028] In some embodiments, the housing has a second air inlet and a second air outlet disposed opposite to each other, both the second air inlet and the second air outlet being located between the second layer structure and the base plate; the elevator control cabinet further includes:

[0029] The second cooling fan is located in the receiving cavity and between the second layer structure and the base plate. The second cooling fan is disposed corresponding to the second air outlet and installed in the housing.

[0030] In some embodiments, it also includes:

[0031] The human-computer interaction module is electrically connected to the control module, the power supply module and the drive module. The human-computer interaction module constitutes a fifth layer structure, which is located on the side of the fourth layer structure away from the base plate.

[0032] In some embodiments, it also includes:

[0033] A first mounting bracket is located in the receiving cavity and is mounted on the housing. The drive board, the capacitor board, the power board, and the UCMP board are all mounted on the first mounting bracket.

[0034] The second mounting bracket is located in the receiving cavity and is mounted on the housing. The second mounting bracket is located on the side of the first mounting bracket away from the base plate. The drive board, the capacitor board, the power board, the UCMP board, and the control board are all located between the first mounting bracket and the second mounting bracket. The control board is mounted on the second mounting bracket.

[0035] In some embodiments, the elevator control cabinet includes two second mounting brackets, which are located on opposite sides of the control panel along a direction parallel to the surface of the base plate.

[0036] In some embodiments, it also includes:

[0037] A cover plate is connected between two second mounting brackets and covers the control board. The control board has multiple interface terminals, and the cover plate forms windows corresponding to each of the interface terminals.

[0038] The elevator control cabinet of this application embodiment arranges the functional boards in layers within the housing, which can maximize the space utilization in the direction perpendicular to the bottom plate within the housing, thereby reducing the size of the control cabinet. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a three-dimensional structural schematic diagram of the elevator control cabinet provided in the first embodiment of this application;

[0041] Figure 2 yes Figure 1 The diagram shows an exploded three-dimensional view of the elevator control cabinet.

[0042] Figure 3 yes Figure 1 A partial three-dimensional structural schematic diagram of the elevator control cabinet is shown;

[0043] Figure 4 yes Figure 3 A partial structural diagram of the connection between the drive board and the module board in the elevator control cabinet is shown.

[0044] Figure 5 This is a partial three-dimensional structural diagram of the elevator control cabinet provided in the second embodiment of this application;

[0045] Figure 6 This is a partial three-dimensional structural diagram of the module board in the elevator control cabinet provided in the third embodiment of this application;

[0046] Figure 7 yes Figure 6 The diagram shown is an exploded view of the module board in the elevator control cabinet.

[0047] Figure 8 yes Figure 6 A three-dimensional structural diagram of a single-tube IGBT assembly on a module board in an elevator control cabinet is shown.

[0048] Figure 9 This is a partial three-dimensional structural diagram of the elevator control cabinet provided in the fourth embodiment of this application;

[0049] Figure 10 yes Figure 9 Another partial three-dimensional structural schematic diagram of the elevator control cabinet is shown;

[0050] Figure 11 yes Figure 9 A partial three-dimensional structural diagram of the elevator control cabinet from another perspective is shown.

[0051] Figure 12 This is a schematic diagram of the plate surface area distribution of the base plate of the elevator control cabinet provided in the fifth embodiment of this application;

[0052] Figure 13 This is a partial three-dimensional structural schematic diagram of the elevator control cabinet provided in the sixth embodiment of this application;

[0053] Figure 14 yes Figure 13 A partial three-dimensional structural diagram of the elevator control cabinet from another perspective is shown.

[0054] Figure 15 yes Figure 13 A partial three-dimensional structural schematic diagram of the elevator control cabinet from another perspective is shown.

[0055] Figure 16 This is a partial three-dimensional structural diagram of the control board in the elevator control cabinet provided in the seventh embodiment of this application;

[0056] Figure 17 This is a partial three-dimensional structural diagram of the control board in the elevator control cabinet provided in the eighth embodiment of this application.

[0057] Explanation of reference numerals in the attached diagram: 10. Elevator control cabinet;

[0058] 1. Drive module; 11. Drive board; 111. First electrical connection terminal; 1111. First pin portion; 1112. First connection portion; 12. Capacitor board; 13. Module board; 131. Rectifier; 132. Inverter; 1321. Single-tube IGBT assembly; 1322. Single-tube IGBT; 1323. Main body; 1324. Pin; 1325. Mounting base; 1326. First end face; 1327. Second end face; 1328. First mounting slot; 1329. Connector; 133. First board surface; 134. Second board surface; 135. Second electrical connection terminal; 1351. Second pin portion; 1352. Second connection portion; 136. Substrate; 1361. Second mounting slot; 14. Third electrical connection terminal;

[0059] 2. Control module;

[0060] 21. Control board; 211. First circuit board; 212. Second circuit board; 213. First interface terminal; 2131. First interface end face; 2132. First back face; 214. Second interface terminal; 2141. Second interface end face; 2142. Second back face;

[0061] 22. UCMP board;

[0062] 3. Power module; 31. Power board;

[0063] 41. Housing; 411. Receiving cavity; 412. First section; 4121. First heat dissipation channel; 413. First air inlet; 414. First air outlet; 415. Base plate; 4151. First area; 4152. Second area; 4153. First sub-area; 4154. Second sub-area; 4155. First sub-section; 4156. Second sub-section; 416. Side plate; 417. Cover plate; 4171. Operating window; 418. Second air inlet; 419. Second air outlet;

[0064] 51. Radiator; 511. First radiator; 512. Second radiator; 52. First cooling fan;

[0065] 61. First mounting bracket; 611. First plate; 6111. First through hole; 6112. Second through hole; 6113. Extension arm; 6114. First arm; 6115. Second arm; 612. Second plate; 6121. Support plate; 613. Third plate; 62. Second mounting bracket; 63. Cover plate; 631. First window; 632. Cable tie hole; 633. Second window; 635. First plate body; 636. Second plate body; 637. Third plate body; 638. Fourth plate body;

[0066] 7. Human-computer interaction module;

[0067] 81. Circuit breaker;

[0068] x, first direction; y, second direction; z, third direction. Detailed Implementation

[0069] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0070] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0071] See Figure 1 and Figure 2 This application provides an elevator control cabinet 10, which includes a drive module 1, a control module 2, and a power module 3. The drive module 1, control module 2, and power module 3 are electrically connected to each other.

[0072] See Figure 2 and Figure 3 The drive module 1 includes a drive board 11, a capacitor board 12, and a module board 13. The drive board 11, capacitor board 12, and module board 13 are electrically connected to each other. The module board 13 is equipped with a rectifier 131 and an inverter 132. By placing the rectifier 131 and inverter 132 on the module board 13, compared to related technologies where the rectifier and inverter are placed on the drive board and capacitor board, the number of electronic components on the module board 13 is relatively small. As a result, the heat generated by the electronic components on the module board 13 during operation is relatively small, which facilitates heat dissipation and avoids high heat affecting the normal operation of the rectifier 131 and inverter 132.

[0073] It should be noted that the rectifier 131 and inverter 132 in this embodiment can both be rectifiers and inverters in the control cabinet of the related technology. Compared with the related technology, only the carrier of rectifier 131 and inverter 132 is different, and there is no change in the circuit. For example, the input terminal of rectifier 131 can be connected to AC mains power, and the output terminal of rectifier 131 can be connected to inverter 132. Rectifier 131 is used to convert AC mains power into DC voltage and output it to inverter 132. The output terminal of inverter 132 is connected to elevator traction machine. Inverter 132 is used to convert DC voltage into AC voltage and output it to elevator traction machine, thereby driving the elevator car.

[0074] Furthermore, the input terminal of rectifier 131 can be connected to AC mains power via drive board 11, and the output terminal of rectifier 131 can be connected to inverter 132 via capacitor board 12. The AC voltage output by inverter 132 can then flow back through drive board 11 and be connected to the elevator traction machine. In this way, the drive circuit of drive module 1 can be distributed across drive board 11, capacitor board 12, and module board 13, rather than being concentrated on one or two circuit boards, thus improving the heat dissipation performance of drive module 1. The output terminal of rectifier 131 is connected to capacitor board 12, which can protect the entire circuit when elevator control cabinet 10 starts up, and can reduce voltage fluctuations and harmonics through discharge.

[0075] Furthermore, the module board 13 is set at an angle relative to at least one of the drive board 11 and capacitor board 12, so that the module board 13 can make reasonable use of the internal space of the elevator control cabinet 10, improve the internal space utilization rate of the elevator control cabinet 10, and reduce the size of the elevator control cabinet 10.

[0076] It should be noted that the module board 13 is set at an angle relative to at least one of the drive board 11 and the capacitor board 12. The angle between the module board 13 and at least one of the drive board 11 and the capacitor board 12 can be greater than 0° and less than or equal to 90°. For example, the acute angle can be 40°, 50°, 60°, 70°, 80°, 90°, etc. It can be reasonably designed in combination with the internal space margin of the elevator control cabinet 10, and there is no limitation on this.

[0077] In this embodiment, the module board 13 is arranged at an angle relative to the drive board 11 and at an angle relative to the capacitor board 12. The drive board 11 and the capacitor board 12 are positioned opposite each other and spaced apart. Specifically, the drive board 11 and the capacitor board 12 are approximately parallel, and the module board 13 is approximately perpendicular to both the drive board 11 and the capacitor board 12.

[0078] It should be noted that in this embodiment, one circuit board (e.g., module board 13) and another circuit board (e.g., at least one of driver board 11 and capacitor board 12) are arranged at an angle. This can mean that the surface of one circuit board is angled to the surface of the other circuit board. Since circuit boards are mostly thin plates, and the side surfaces are relatively narrow among their multiple surfaces, the surface of a circuit board can be roughly considered as the remaining surface excluding the side surfaces. Thus, each circuit board can be roughly considered as having two opposing surfaces, and at least one of the two surfaces of each circuit board can be provided with electronic components, etc. The two surfaces of each circuit board can be approximately parallel.

[0079] The electrical connection between the drive board 11 and the module board 13 can be any electrical connection method in the related art. In this embodiment, the drive board 11 is provided with a first electrical connection terminal 111, and the module board 13 is provided with a second electrical connection terminal 135. The materials used to prepare the second electrical connection terminal 135 and the first electrical connection terminal 111 are preferably copper. Of course, depending on actual needs, the materials used to prepare the second electrical connection terminal 135 and the first electrical connection terminal 111 can also be copper alloys, aluminum, aluminum alloys, or other materials with strong conductivity.

[0080] See Figure 4 The first electrical connection terminal 111 includes a first pin portion 1111 and a first connection portion 1112, the first connection portion 1112 being connected to the first pin portion 1111. The second electrical connection terminal 135 includes a second pin portion 1351 and a second connection portion 1352, the second connection portion 1352 being connected to the second pin portion 1351.

[0081] The first connecting part 1112 is used to contact the second connecting part 1352 and is detachably connected to the second connecting part 1352 to realize the electrical connection between the second pin part 1351 and the first pin part 1111. The first connecting part 1112 and the second connecting part 1352 can be connected by detachable connection methods such as threaded connection, snap-fit, snap-lock, screw connection, etc.

[0082] The first pin portion 1111 and the first connecting portion 1112 can be integrally formed, or they can be formed separately and then joined by welding, riveting, or threaded connection. The second pin portion 1351 and the second connecting portion 1352 can be integrally formed, or they can be formed separately and then joined by welding, riveting, or threaded connection. The structures of the first electrical connection terminal 111 and the second electrical connection terminal 135 can be the same or different.

[0083] It should be noted that when using the first electrical connection terminal 111 and the second electrical connection terminal 135 to realize the electrical connection between the driver board 11 and the module board 13, the second pin portion 1351 can be electrically connected to the module board 13 by means of soldering or the first pin portion 1111 can be electrically connected to the driver board 11 by means of soldering or the first pin portion 1112. When the second connection portion 1352 contacts the first connection portion 1112, the electrical connection between the driver board 11 and the module board 13 can be realized. This makes it easier to realize high current connection between the two circuit boards. Even when the installation space between the driver board 11 and the module board 13 is small, the overall volume of the second electrical connection terminal 135 and the first electrical connection terminal 111 can be designed to be small, without the need to bend the second electrical connection terminal 135 and the first electrical connection terminal 111. This solves the problem that the inconvenience of bending the cable will affect the installation of the circuit board in the housing 41.

[0084] The electrical connection between capacitor board 12 and module board 13 can be any electrical connection method in related technologies. In this embodiment, see... Figure 5 The capacitor plate 12 and the module plate 13 are electrically connected via a third electrical connection terminal 14. The third electrical connection terminal 14 includes a first electrical connection segment that is parallel to and electrically connected to the capacitor plate 12, a second electrical connection segment that is parallel to and electrically connected to the module plate 13, and a third electrical connection segment that is connected between the first electrical connection segment and the second electrical connection segment and electrically connected to both the first electrical connection segment and the second electrical connection segment. The third electrical connection segment can extend along a straight line or along a broken line, etc., and is not limited in this respect.

[0085] The first electrical connection segment is parallel to the surface of the capacitor board 12, facilitating electrical connection and installation between the first electrical connection segment and the capacitor board 12; the second electrical connection segment is parallel to the surface of the module board 13, facilitating electrical connection and installation between the second electrical connection segment and the module board 13. The third electrical connection segment can be an integrally formed structure with the first electrical connection segment and / or the second electrical connection segment, or it can be a detachable connection.

[0086] See Figures 6 to 8 The inverter 132 on module board 13 includes one or more single-tube IGBT components 1321.

[0087] The single-tube IGBT assembly 1321 includes a single IGBT 1322, a mounting base 1325, and a connector 1329. The single IGBT 1322 is disposed on the mounting base 1325, and the mounting base 1325 is connected to the connector 1329. The connector 1329 is used to connect the single-tube IGBT assembly 1321 to the substrate 136 of the module board 13. This embodiment assembles a single single-tube IGBT assembly 1321 to the substrate 136. Compared to assembling pre-packaged IGBT modules to the substrate in related technologies, the arrangement of each single-tube IGBT assembly 1321 is more flexible and can be added or removed according to usage requirements, thus having broader application prospects.

[0088] In this embodiment, a connector 1329 for connecting to a substrate 136 is provided on a single IGBT assembly 1321. When assembling the single IGBT assembly 1321 and the substrate 136, the connector 1329 can be connected to the substrate 136 before the single IGBT 1322 is electrically connected to the substrate 136, thereby achieving pre-fixation of the single IGBT assembly 1321 and the substrate 136. After the single IGBT assembly 1321 and the substrate 136 are pre-fixed, the single IGBT 1322 and the substrate 136 are electrically connected, which can improve the stability and reliability of the connection when the single IGBT 1322 and the substrate 136 are electrically connected.

[0089] Furthermore, the single-transistor IGBT 1322 includes a body 1323 and multiple pins 1324. The body 1323 is disposed on a mounting base 1325, and at least a portion of the multiple pins 1324 protrudes from the mounting base 1325 for electrical connection with the substrate 136. The pins 1324 can be straight or bent, allowing for flexible design based on actual needs.

[0090] The single IGBT 1322 can be mounted on the mounting base 1325 as follows: the mounting base 1325 has a first mounting groove 1328, at least a portion of the body 1323 of the single IGBT 1322 is located in the first mounting groove 1328, and the pins 1324 of the single IGBT 1322 are exposed in the first mounting groove 1328. By placing the body 1323 of the single IGBT 1322 in the first mounting groove 1328 of the mounting base 1325, compared to connecting the single IGBT 1322 to the mounting base 1325 through bonding, welding, or other connection methods, no auxiliary tools are needed for connection, making the connection more convenient.

[0091] The body 1323 of the single-tube IGBT 1322 and the first mounting groove 1328 can be clearance-fitted to improve the ease of installation between the single-tube IGBT 1322 and the mounting base 1325. It should be noted that the body 1323 of the single-tube IGBT 1322 and the first mounting groove 1328 can also be interference-fitted, etc., and there is no limitation on this.

[0092] Furthermore, the mounting base 1325 has a first end face 1326 and a second end face 1327 arranged opposite to each other. The first end face 1326 is provided with a first mounting groove 1328, and the second end face 1327 is connected to the connector 1329. That is, the main body 1323 of the single IGBT 1322 and the connector 1329 are generally distributed on opposite sides of the mounting base 1325, so that the assembly of the single IGBT 1322 and the mounting base 1325, and the assembly of the connector 1329 and the substrate 136 will not obstruct each other, and the assembly sequence can be flexibly adjusted.

[0093] It is worth mentioning that the connector 1329 of the connecting bracket 1325 can be assembled with the substrate 136 first. Since the single IGBT 1322 is not involved in this assembly process, there is no need to consider whether the pins 1324 of the single IGBT 1322 are aligned with the connection points on the substrate 136. Therefore, the assembly efficiency between the connector 1329 and the substrate 136 can be improved. After the connector 1329 and the bracket 1325 are assembled with the substrate 136, the single IGBT 1322 can be assembled with the bracket 1325, and the pins 1324 of the single IGBT 1322 can be aligned with the connection points on the substrate 136. If the body 1323 of the single IGBT 1322 and the first mounting groove 1328 are in clearance fit, the position of the body 1323 of the single IGBT 1322 in the first mounting groove 1328 can be finely adjusted during the alignment of the pins 1324 of the single IGBT 1322 with the connection points on the substrate 136, thereby improving the assembly accuracy.

[0094] The substrate 136 is provided with a second mounting groove 1361, and the connector 1329 is located in the second mounting groove 1361. By placing the connector 1329 in the second mounting groove 1361 of the substrate 136, the connection can be made without the need for auxiliary tools, which is more convenient than the connection between the connector 1329 and the substrate 136 by means of bonding, welding or other methods.

[0095] Furthermore, the second mounting groove 1361 is adapted to the connector 1329. This adaptation can be achieved by having the cross-section of the second mounting groove 1361 approximately the same as the cross-section of the connector 1329, thereby improving the installation stability of the connector 1329 within the second mounting groove 1361. For example, when the connector 1329 includes a connecting portion and a portion connecting the connecting portion and a limiting portion protruding beyond the connecting portion, the second mounting groove 1361 can include a first groove corresponding to the connecting portion and a second groove corresponding to the limiting portion, with the connecting portion located in the first groove and the limiting portion located in the second groove.

[0096] The second mounting groove 1361 and the connector 1329 can be clearance-fitted. The connector 1329 is placed within the second mounting groove 1361, mainly to pre-fix the connector 1329 to the substrate 136, facilitating the electrical connection between the single-tube IGBT assembly 1321 and the substrate 136. Of course, the second mounting groove 1361 and the connector 1329 can also be interference-fitted; this is not limited.

[0097] After the connector 1329 is placed in the second mounting slot 1361, the connector 1329 and the substrate 136 no longer need to be connected in any other way. The single IGBT assembly 1321 is fixed to the substrate 136 after the pin 1324 of the single IGBT assembly 1321 is electrically connected to the substrate 136.

[0098] The module board 13 may include one single IGBT assembly 1321 or multiple single IGBT assemblies 1321. When the module board 13 includes multiple single IGBT assemblies 1321, the multiple single IGBT assemblies 1321 can be arranged in an array along the second direction y and / or the third direction z. The first end face 1326 and the second end face 1327 can be arranged opposite each other along the first direction x. The first direction x, the second direction y, and the third direction z are perpendicular to each other, so that the multiple single IGBT assemblies 1321 are arranged neatly and the board space of the substrate 136 is used reasonably.

[0099] Furthermore, when the module board includes multiple single-tube IGBT components 1321, refer to... Figure 6 and Figure 7The mounting bases 1325 of at least two adjacent single-tube IGBT modules 1321 can be a single-piece structure to reduce the assembly steps between multiple single-tube IGBT modules 1321 and the substrate 136, thereby improving assembly efficiency. For example, the mounting bases 1325 of two adjacent single-tube IGBT modules 1321 can be a single-piece structure. Of course, the mounting bases 1325 of three, four, or five adjacent single-tube IGBT modules 1321 can also be designed as a single-piece structure, and there is no limitation on this.

[0100] Furthermore, the mounting base 1325 is an integral structure where at least two single-tube IGBT assemblies 1321 share the same connector 1329. Compared to each single-tube IGBT assembly 1321 having its own connector, this reduces the number of connectors 1329, simplifies the alignment of the connectors 1329 with the substrate 136, and improves the assembly efficiency of the connectors 1329 and the substrate 136. If at least two single-tube IGBT assemblies 1321 share the same connector 1329, the shared connector 1329 can be located in the middle of the at least two single-tube IGBT assemblies 1321.

[0101] It should be noted that when the mounting base 1325 of at least three adjacent single-tube IGBT assemblies 1321 is an integral structure, the at least three single-tube IGBT assemblies 1321 can share the same connector 1329, or they can share two connectors 1329 that are spaced apart, etc. Among them, when at least three single-tube IGBT assemblies 1321 share two connectors 1329 that are spaced apart, the connection stability between the at least three single-tube IGBT assemblies 1321 and the substrate 136 can be improved.

[0102] Please refer to it again. Figures 2 to 5 The elevator control cabinet 10 also includes a housing 41, a heat sink 51 and a first mounting bracket 61. The housing 41 forms a receiving cavity 411, and the drive module 1, control module 2, power module 3, heat sink 51 and first mounting bracket 61 are all located in the receiving cavity 411.

[0103] The module board 13 (base plate 136) has a first plate surface 133 and a second plate surface 134 facing each other. The drive board 11 and the capacitor board 12 are both located on the side where the first plate surface 133 of the module board 13 is located, and the rectifier 131 and the inverter 132 are both located on the side where the second plate surface 134 of the module board 13 is located. A first interval 412 is defined between the second plate surface 134 of the module board 13 and the inner wall surface of the housing 41. The heat sink 51 is located in the first interval 412. The first interval 412 is formed on the side of the module board 13 where the rectifier 131 and the inverter 132 are located, and the heat sink 51 is provided in the first interval 412, so that the heat sink 51 can specifically dissipate heat from the rectifier 131 and the inverter 132, thereby improving the heat dissipation performance of the module board 13. Meanwhile, the first section 412 is located on the side of the elevator control cabinet 10, which saves more space required for heat dissipation of the module board 13 and reduces the size of the elevator control cabinet 10, especially the size of the elevator control cabinet 10 in the thickness direction (the third direction z in the figure).

[0104] Further, see Figure 9 and Figure 10 The first mounting bracket 61 is mounted on the housing 41. The first mounting bracket 61 includes a first plate 611, which is located in the first interval 412. The module plate 13 and the heat sink 51 are mounted on opposite sides of the first plate 611 along the first direction x, which is the direction determined by the first plate surface 133 to the second plate surface 134. The first plate 611 has a first through hole 6111 and a second through hole 6112. The rectifier 131 is set corresponding to the first through hole 6111, and the inverter 132 is set corresponding to the second through hole 6112. The first plate 611 serves as the mounting carrier for the module board 13 and the heat sink 51, facilitating their installation and fixation within the housing 41. The first plate 611 forms a first through hole 6111 corresponding to the rectifier 131 and a second through hole 6112 corresponding to the inverter 132, allowing the heat generated by the rectifier 131 to directly reach the heat sink 51 through the first through hole 6111 and the heat generated by the inverter 132 to directly reach the heat sink 51 through the second through hole 6112, thereby improving the heat dissipation effect.

[0105] The heat sink 51 can be configured to simultaneously power both the rectifier 131 and the inverter 132 to dissipate the heat generated by them in a timely manner. The heat sink 51 may include a first heat sink 511 and a second heat sink 512. The first heat sink 511 is configured to power the rectifier 131 and is primarily used to dissipate heat from it. The second heat sink 512 is configured to power the inverter 132 and is primarily used to dissipate heat from it.

[0106] The rectifier 131 on the module board 13 can be placed entirely on the side of the first plate 611 facing the module board 13. A portion of the rectifier 131 can also be placed in the first through hole 6111 to reduce the distance between the rectifier 131 and the first heat sink 511, which facilitates heat dissipation and improves the compactness of the arrangement of the module board 13, the first plate 611 and the first heat sink 511, thereby reducing the size of the elevator control cabinet 10.

[0107] In this embodiment, a portion of the rectifier 131 passes through the first through hole 6111 and protrudes from the first plate 611 to further improve the compactness of the arrangement of the module board 13, the first plate 611, and the first heat sink 511. To facilitate the installation of the heat sink 51 on the first plate 611, the first mounting bracket 61 further includes an extension arm 6113 corresponding to the first through hole 6111. The extension arm 6113 includes a first arm 6114 and a second arm 6115. The first arm 6114 is positioned corresponding to the edge of the first through hole 6111, with one end connected to the first plate 611 and the other end extending along a first direction x. One end of the second arm 6115 is connected to the end of the first arm 6114 away from the first plate 611, and the other end extends along a direction parallel to the first plate surface 133. The first heat sink 511 is positioned corresponding to the rectifier 131 and mounted on the second arm 6115. The installation of the first heat sink 511 on the first plate 611 is transformed into the installation of the first heat sink 511 on the extension arm 6113 at the first through hole 6111, which makes the installation more convenient. The first heat sink 511 and the second arm 6115 can be connected by screws or other means, and this is not limited.

[0108] It should be noted that the extension length of the first arm 6114 along the first direction x is greater than or equal to the length of the rectifier 131 protruding from the first plate 611 along the first direction x, so that the rectifier 131 will not obstruct the installation of the first heat sink 511 on the second arm 6115.

[0109] The first arm 6114 can be roughly in the shape of a thin plate to increase the connection area between the first arm 6114 and the first plate 611, thereby increasing the connection strength between the two. One end of the first arm 6114 that connects to the first plate 611 can be set along the edge of the first through hole 6111. The first arm 6114 and the first plate 611 can be integrally formed, for example, it can be formed by bending a single plate, etc., and there is no limitation thereto.

[0110] The second arm 6115 can be roughly plate-shaped, and the first heat sink 511 can be connected to the plate surface of the second arm 6115 to increase the connection area and improve the connection stability between the two. The second arm 6115 and the first arm 6114 can be integrally formed, for example, they can be formed by bending a single plate, etc., without limitation. The projection of the second arm 6115 onto the first plate 611 can be located inside or outside the first through hole 6111, which can be flexibly adjusted according to actual needs.

[0111] Furthermore, the first mounting bracket 61 may be provided with two extension arms 6113, which may be located on opposite sides of the first through hole 6111 and connected to the first plate 611 and the first heat sink 511, respectively, to improve the installation stability of the first heat sink 511 within the housing 41. The second arms 6115 of the two extension arms 6113 may be approximately parallel.

[0112] The inverter 132 on the module board 13 can be placed entirely on the side of the first board 611 facing the module board 13. Part of the inverter 132 can also be placed in the second through hole 6112 to reduce the distance between the inverter 132 and the second heat sink 512, which facilitates heat dissipation and improves the compactness of the arrangement of the module board 13, the first board 611 and the second heat sink 512, thereby reducing the size of the elevator control cabinet 10.

[0113] In this embodiment, the inverter 132 does not protrude from the side of the first plate 611 opposite to the second plate 134, and the second heat sink 512 is disposed corresponding to the inverter 132 and installed on the first plate 611. Directly installing the second heat sink 512 on the first plate 611 simplifies the design of the first mounting bracket 61 and reduces the design cost.

[0114] It should be noted that the receiving cavity 411 of the elevator control cabinet 10 is mostly of a regular shape. For example, the receiving cavity 411 of the elevator control cabinet 10 is mostly cuboid. The module plate 13 can be set roughly corresponding to one side wall of the cuboid shape, so that the first interval 412 formed between the module plate 13 and the shell 41 is roughly cuboid. The lengths of each part of the first interval 412 in the first direction x are roughly equal. In this way, the length of the rectifier 131 in the first direction x is greater than the length of the inverter 132 in the first direction x. Therefore, the length of the first heat sink 511 in the first direction x can be designed to be less than the length of the second heat sink 512 in the first direction x, so that the sum of the lengths of the rectifier 131 and the first heat sink 511 in the first direction x is roughly equal to the sum of the lengths of the inverter 132 and the second heat sink 512 in the first direction x, thus realizing the reasonable and full utilization of the first interval 412. Meanwhile, the sum of the lengths of the rectifier 131 and the first heat sink 511 in the first direction x is equal to the sum of the lengths of the inverter 132 and the second heat sink 512 in the first direction x, which can also make the end of the first heat sink 511 away from the module board 13 roughly flush with the end of the second heat sink 512 away from the module board 13.

[0115] Among them, the heat sink 51, the first heat sink 511, and the second heat sink 512 can be heat pipes, heat spreaders, etc., and there is no limitation on them.

[0116] Specifically, taking radiator 51 as an example, radiator 51 can have an evaporation end and a condensation end. Coolant is installed inside radiator 51. The evaporation end is located closer to rectifier 131 and inverter 132 than the condensation end. When elevator control cabinet 10 is working, the evaporation end is heated, and the coolant can change from a liquid phase to a gas phase. The gas phase of the coolant, after being cooled by the condensation end, can change back into a liquid phase and flow back to the evaporation end. During the process, the coolant absorbs heat and vaporizes, carrying heat with it. The vaporized coolant flows more flexibly, allowing it to reach the condensation end more quickly and dissipate heat outwards. This cycle repeats continuously, allowing radiator 51 to continuously diffuse heat outwards. Fluorinated liquid can be used as the coolant. The two-phase phase change of fluorinated liquid increases heat transfer efficiency, which is beneficial for improving the heat dissipation performance of radiator 51.

[0117] Further, see again Figure 2The elevator control cabinet 10 also includes a first cooling fan 52. The first section 412 includes a first heat dissipation channel 4121, which is formed on the side of the first plate 611 facing away from the second plate surface 134. The housing 41 also has a first air inlet 413 and a first air outlet 414 communicating with the first heat dissipation channel 4121. The first cooling fan 52 is disposed and installed on the housing 41, corresponding to the first air outlet 414. In accordance with the above description, the radiator 51 is placed in the first heat dissipation channel 4121. Thus, by setting the first cooling fan 52 at the first air outlet 414, the heat absorbed by the radiator 51 can be carried away by the external airflow, thereby increasing the heat dissipation speed in the first heat dissipation channel 4121.

[0118] The first air outlet 414 and the first air inlet 413 are located on opposite sides of the heat sink 51, respectively. This allows the airflow entering through the first air inlet 413 to fully flow through the heat sink 51 and then be blown out through the first air outlet 414 when the first cooling fan 52 is working, thus improving the heat dissipation effect. Specifically, the first air outlet 414 and the first air inlet 413 are located on opposite sides of the heat sink 51 along the second direction y. The second direction y is parallel to the second surface 134 of the module board 13 and the surface of the drive board 11, and the second direction y is perpendicular to the first direction x.

[0119] Furthermore, the radiator 51 can form at least one heat dissipation channel, with its two ends corresponding to the first air inlet 413 and the first air outlet 414, respectively, to increase the heat dissipation area of ​​the radiator 51 and improve its heat dissipation performance. The radiator 51 may include multiple heat dissipation fins, and heat dissipation channels can be formed between adjacent heat dissipation fins; this is not limited. Each heat dissipation fin can have a chamber for coolant flow; the chambers within each heat dissipation fin can be interconnected or independent; this is not limited.

[0120] The first mounting bracket 61 also includes a second plate 612. One end of the second plate 612 is connected to the first plate 611, and the other end of the second plate 612 extends in the opposite direction of the first direction x. The drive plate 11 and the capacitor plate 12 are both mounted on the second plate 612. That is, the first plate 611, which mounts the module plate 13, and the second plate 612, which mounts the drive plate 11 and the capacitor plate 12, are set at an angle, which can make full use of the internal space of the housing 41 and reduce the size of the elevator control cabinet 10. The other end of the second plate 612 extends in the opposite direction of the first direction x, which makes the first heat dissipation channel 4121 formed between the first plate 611 and the housing 41 relatively independent, and provides better heat dissipation for the rectifier 131 and the inverter 132 connected to the first heat dissipation channel 4121.

[0121] The second plate 612 can be positioned close to the bottom plate 415 of the housing 41 relative to the drive plate 11 and the capacitor plate 12, so that the second plate 612 can be connected and fixed to the housing 41. Specifically, the edge of the second plate 612 is provided with a flange, and the second plate 612 is connected and fixed to the housing 41 via the flange provided on its edge. Further, the flange on the second plate 612 can be connected and fixed to the side plate 416 of the housing 41 by screws or other means, which is not limited.

[0122] Furthermore, both the control module 2 and the power module 3 are mounted on the second plate 612, which is positioned relative to the control module 2 and the power module 3 near the bottom plate 415 of the housing 41. Thus, during the assembly of the elevator control cabinet 10, the drive module 1, control module 2, and power module 3 can be first installed on the first mounting bracket 61, and then installed together in the receiving cavity 411 of the housing 41, facilitating assembly.

[0123] See Figure 11 The control module 2 includes a control board 21 and a UCMP (Unintended Car Movement Protection System) board 22, and the power module 3 includes a power board 31. The power module 3 draws power from the drive board 11 and converts it into power supplies of various voltage levels to power the various electrical components. The control module 2 draws power from the power module 3 via a wiring harness. The control board 21 in the control module 2 is the core of the control module 2. It controls the drive module 1 to drive the elevator traction machine, thereby realizing the control functions of elevator car rising, falling, stopping, opening doors, and shock absorption. The UCMP board 22 in the control module 2 is connected to the elevator car via a wiring harness to realize the functions of early door opening and detecting door lock short circuits. The control board 21 and the UCMP board 22 in the control module 2 are connected by a wiring harness.

[0124] It should be noted that the control board 21, UCMP board 22 and power board 31 in this embodiment can all be the control board, UCMP board and power board in the control cabinet in the related technology. Compared with the related technology, only the installation position in the housing 41 is changed and there is no change in the circuit.

[0125] In this embodiment of the application, the functional boards in the elevator control cabinet 10 can form at least four layers, that is, at least some functional boards (such as the first functional board) form the first layer, at least some functional boards (such as the second functional board) form the second layer, at least some functional boards (such as the third functional board) form the third layer, at least some functional boards (such as the fourth functional board) form the fourth layer, and so on. The second layer is located on the side of the first layer away from the bottom plate 415, the third layer is located on the side of the second layer away from the bottom plate 415, and the fourth layer is located on the side of the third layer away from the bottom plate 415, so that the arrangement of each functional board in the housing 41 is reasonable.

[0126] Optionally, the drive board 11 constitutes the first layer structure, the capacitor board 12 constitutes the second layer structure, the power supply board 31 constitutes the third layer structure, and the control board 21 constitutes the fourth layer structure. The UCMP board 22 can be located between the second and fourth layers; for example, the UCMP board 22 can be located in the third layer structure, etc., without limitation. In this embodiment, the number of circuit boards included in each layer structure is designed according to the size of each circuit board. For example, the UCMP board 22 is relatively small; designing it in the same layer structure as the power supply board 31 maximizes space utilization within the housing 41 compared to a single-layer design for the UCMP board 22, thereby reducing the size of the elevator control cabinet 10.

[0127] Further, see Figure 11 and Figure 12 The base plate 415 includes a first region 4151 and a second region 4152 connecting the first region 4151. The projections of the drive board 11, capacitor board 12, power board 31, and UCMP board 22 onto the base plate 415 are all located in the first region 4151. That is, the first, second, and third layer structures are all set away from the second region 4152. In this way, a certain installation space can be reserved in the second region 4152 within the receiving cavity 411. A circuit breaker 81 can be installed in this installation space. The circuit breaker 81 is electrically connected to the drive board 11. The projection of the circuit breaker 81 onto the base plate 415 is located in the second region 4152. Placing the circuit breaker 81 inside the elevator control cabinet 10, compared to related technologies where the circuit breaker is placed externally in the control cabinet, allows the wiring of the circuit breaker 81 and electronic components such as the drive board 11 inside the elevator control cabinet 10 to be completed directly before the elevator control cabinet 10 is sold. This reduces the wiring burden on operators and enhances the product competitiveness of the elevator control cabinet 10. Specifically, the drive board 11 can be connected to AC mains power via the circuit breaker 81, for example, via the R, S, T and N interfaces on the circuit breaker 81. In this embodiment, the circuit breaker 81 can be the circuit breaker connected to the control cabinet in the related art, and compared with the related art, only the setting position of the circuit breaker 81 is changed without any change in the circuit.

[0128] The circuit breaker 81 is located on the side of the second plate 612 opposite to the base plate 415 and is mounted on the second plate 612. This allows the circuit breaker 81, along with the drive module 1, control module 2, and power module 3, to be installed on the first mounting bracket 61 and then together in the receiving cavity 411 of the housing 41, facilitating assembly. The circuit breaker 81 can span the first, second, and third layers of the structure. It should be noted that the circuit breaker 81 can also span only the first and second layers, or only the second and third layers, etc., and can be flexibly adjusted according to the actual situation.

[0129] Furthermore, the first region 4151 includes a first sub-region 4153 and a second sub-region 4154 connecting the first sub-region 4153. The projection of the drive board 11 onto the base plate 415 is located in the first sub-region 4153; the projection of the capacitor board 12 onto the base plate 415 is located in the first sub-region 4153 and the second sub-region 4154. Thus, the portion of capacitor plate 12 corresponding to the second sub-region 4154 will be offset relative to the drive plate 11, allowing a larger first gap between the portion of capacitor plate 12 corresponding to the second sub-region 4154 and the second plate 612, while a smaller second gap is left between the portion of capacitor plate 12 corresponding to the first sub-region 4153 and the drive plate 11. In this way, the electronic components on capacitor plate 12 can be mainly arranged on the surface of capacitor plate 12 facing the base plate 415, with larger electronic components on capacitor plate 12 placed in the larger first gap and smaller electronic components on capacitor plate 12 placed in the smaller second gap. This achieves a reasonable distribution of electronic components on capacitor plate 12, improves the space utilization rate of the first and second layer structures within the accommodating cavity 411, and reduces the size of elevator control cabinet 10.

[0130] It should be noted that, since a relatively large first gap can be left between the portion of capacitor plate 12 corresponding to the second sub-region 4154 and the second plate 612, the mounting of the portion of capacitor plate 12 corresponding to the second sub-region 4154 on the second plate 612 can be converted into mounting the portion of capacitor plate 12 corresponding to the second sub-region 4154 on a support plate 6121 on the second plate 612. One end of the support plate 6121 is connected to the second plate 612, and the other end extends along a third direction z away from the base plate 415. The first direction x, the second direction y, and the third direction z are perpendicular to each other. A flange is provided at the end of the support plate 6121 away from the second plate 612, and the capacitor plate 12 and the support plate 6121 can be connected via the flange. Mounting the portion of capacitor plate 12 corresponding to the second sub-region 4154 on the support plate 6121 results in a shorter installation path and better installation stability compared to mounting it on the second plate 612. Since there is a small second gap between the part of capacitor plate 12 corresponding to the first sub-region 4153 and the drive plate 11, the part of capacitor plate 12 corresponding to the first sub-region 4153 that is mounted on the second plate 612 can be converted into the part of capacitor plate 12 corresponding to the first sub-region 4153 that is mounted on the drive plate 11.

[0131] See again Figure 1 and Figure 2 The housing 41 is also provided with a second air inlet 418 and a second air outlet 419, both of which are connected to the larger first gap. The elevator control cabinet 10 also includes a second cooling fan 53 located at the second air outlet 419 to dissipate the heat generated at the first gap.

[0132] See again Figure 11 and Figure 12 The first sub-region 4153 and the second sub-region 4152 are distributed along the second direction y. The second sub-region 4154 includes a first sub-part 4155 and a second sub-part 4156 distributed along the second direction y. The first sub-part 4155 and the first sub-region 4153 are distributed along the first direction x, and the second sub-part 4156 and the second sub-region 4152 are distributed along the first direction x. The projection of the capacitor plate 12 onto the base plate 415 can be located in the first sub-region 4153, the first sub-part 4155, and the second sub-part 4156. For example... Figure 3 As shown; the projection of capacitor plate 12 onto base plate 415 can also be located in the first sub-region 4153 and the first sub-section 4155, for example Figure 5 As shown, it can be flexibly adjusted according to actual needs.

[0133] Furthermore, the projection of the UCMP board 22 located in the third layer structure onto the base plate 415 is located in the first sub-region 4153, and the projection of the power board 31 located in the third layer structure onto the base plate 415 is located in the second sub-region 4154, so as to realize the partitioning of the UCMP board 22 and the power board 31 in the third layer structure and make reasonable use of the space in the accommodating cavity 411 in the third layer structure.

[0134] The projections of the UCMP board 22 onto the base plate 415 and the power board 31 onto the base plate 415 can both be located within the projection of the capacitor board 12 onto the base plate 415. Thus, mounting the UCMP board 22 on the second plate 612 can be converted to mounting the UCMP board 22 on the capacitor board 12, and mounting the power board 31 on the second plate 612 can be converted to mounting the power board 31 on the capacitor board 12. Compared to mounting both the UCMP board 22 and the power board 31 on the second plate 612, the connection paths between the UCMP board 22 and the power board 31 and the capacitor board 12 are shorter, resulting in better installation stability and lower installation difficulty.

[0135] The electronic components on the UCMP board 22 can be located on the surface of the UCMP board 22 facing away from the capacitor board 12, and the electronic components on the capacitor board 12 can be located on the side of the capacitor board 12 facing away from the UCMP board 22. This eliminates the need for electronic components between the UCMP board 22 and the capacitor board 12, thereby reducing the distance between them, shortening the connection path, and preventing heat accumulation between the UCMP board 22 and the capacitor board 12. It is understood that in other embodiments, electronic components may also be located on the side of the UCMP board 22 facing the capacitor board 12, and vice versa; this application does not limit this.

[0136] The electronic components on the power board 31 can be located on the side of the power board 31 facing away from the capacitor board 12, and the electronic components on the capacitor board 12 can be located on the side of the capacitor board 12 facing away from the power board 31. This eliminates the need for electronic components between the power board 31 and the capacitor board 12, thereby reducing the distance between them, shortening the connection path, and preventing heat accumulation between the power board 31 and the capacitor board 12. It is understood that in other embodiments, electronic components may also be located on the side of the power board 31 facing the capacitor board 12, and vice versa; this application does not limit this.

[0137] The projection of the power board 31 onto the base plate 415 can be located in the first sub-part 4155 and the second sub-part 4156, or it can be located only in the first sub-part 4155. If the projection of the capacitor board 12 onto the base plate 415 is located in the first sub-region 4153, the first sub-part 4155, and the second sub-part 4156, then the projection of the power board 31 onto the base plate 415 can be located in the first sub-part 4155 and the second sub-part 4156, or it can be located only in the first sub-part 4155, so that the power board 31 can be mounted on the capacitor board 12; if the projection of the capacitor board 12 onto the base plate 415 is located in the first sub-region 4153 and the first sub-part 4155, then the projection of the power board 31 onto the base plate 415 can be located in the first sub-part 4155, so that the power board 31 can be mounted on the capacitor board 12.

[0138] It should be noted that, in combination Figure 11 If the projection of capacitor plate 12 onto base plate 415 is located in first sub-region 4153 and first sub-part 4155, the projection of power board 31 onto base plate 415 can also be located in first sub-part 4155 and second sub-part 4156. In this case, the part of power board 31 corresponding to first sub-part 4155 can be installed on capacitor plate 12, and the part of power board 31 corresponding to second sub-part 4156 can be installed on support plate 6121.

[0139] The projection of the control board 21 onto the base plate 415 is located in the first region 4151 and the second region 4152, thereby improving the space utilization of the receiving cavity 411 in the fourth layer structure. The electronic components on the control board 21 can be located on the side of the control board 21 opposite to the UCMP board 22 and the power board 31, ensuring that the electronic components on the control board 21 are positioned opposite to the electronic components on the UCMP board 22 and the power board 31, preventing mutual interference and facilitating smooth assembly.

[0140] The first, second, third, and fourth layers are distributed sequentially along the third direction z. In this embodiment, each circuit board (e.g., driver board 11, capacitor board 12, UCMP board 22, power board 31, control board 21) is located in a certain layer, meaning that the substrate of the circuit board is located in a certain layer, and the projections of the electronic components on the circuit board and the electronic components on the circuit boards of adjacent layers onto the module board 13 can be located on the same straight line parallel to the second direction y.

[0141] Furthermore, the drive board 11, capacitor board 12, UCMP board 22, power board 31 and control board 21 are all located on the same side of the first board surface 133 of the module board 13. The module board 13 spans the first layer structure, the second layer structure, the third layer structure and the fourth layer structure, so that the module board 13 located on one side can make full use of the space of the receiving cavity 411 in the first layer structure to the fourth layer structure.

[0142] The first mounting bracket 61 also includes a third plate 613. The second plate 612 and the third plate 613 are located on opposite sides of the first plate 611 along the first direction x, and the second plate 612 and the third plate 613 are located on opposite sides of the first plate 611 along the third direction z. The third plate 613 is connected to the first plate 611, so that after the first mounting bracket 61 is installed in the housing 41, the first plate 611, the third plate 613 of the first mounting bracket 61 and the bottom plate 415 and the side plate 416 of the housing 41 can roughly form a first heat dissipation channel 4121.

[0143] See Figures 13 to 15 The elevator control cabinet 10 also includes a second mounting bracket 62, which is located in the receiving cavity 411 and connected to the housing 41. The first mounting bracket 61 and the second mounting bracket 62 are distributed along the third direction z. The drive board 11, capacitor board 12, UCMP board 22, power board 31, and control board 21 are all located between the first mounting bracket 61 and the second mounting bracket 62. The drive board 11, capacitor board 12, UCMP board 22, and power board 31 are all mounted on the first mounting bracket 61, and the control board 21 is mounted on the second mounting bracket 62. Compared to mounting the control board 21 on the second plate 612 of the first mounting bracket 61 near the base plate 415, mounting the control board 21 on the second mounting bracket 62 results in a shorter installation path and a more stable installation. Meanwhile, the control board 21 is mounted on the second mounting bracket 62. Compared with the second board 612 or the drive board 11, capacitor board 12, UCMP board 22 and power board 31 mounted on the second board 612, the load on the second board 612 can be reduced, and problems such as bending and deformation of the first mounting bracket 61 can be avoided.

[0144] Furthermore, there can be two second mounting brackets 62, located on opposite sides of the control board 21 along the first direction x. One of the second mounting brackets 62 adjacent to the module board 13 is connected to the third plate 613 of the first mounting bracket 61. By providing two second mounting brackets 62, the stability of the control board 21 within the housing 41 can be improved. The connection between the second mounting bracket 62 adjacent to the module board 13 and the third plate 613 of the first mounting bracket 61 reduces the design cost of the second mounting bracket 62 compared to its connection to the side wall of the housing 41.

[0145] The elevator control cabinet 10 also includes a cover plate 63, which is located between and connected to two second mounting brackets 62. The cover plate 63 covers the control board 21, which has multiple interface terminals. The cover plate 63 forms windows corresponding to each interface terminal. The cover plate 63 can shield the control board 21, solving safety regulations. The cover plate 63 can be made of materials such as metal or plastic, and there is no limitation on its materials.

[0146] See Figure 16 The control board 21 includes a first circuit board 211, a second circuit board 212, a first interface terminal 213, and a second interface terminal 214.

[0147] The surface of the second circuit board 212 is set at an angle to the surface of the first circuit board 211. The second circuit board 212 is mounted on the first circuit board 211 and is electrically connected to the first circuit board 211. The first interface terminal 213 is mounted on the surface of the first circuit board 211 and is electrically connected to the first circuit board 211. The second interface terminal 214 is mounted on the surface of the second circuit board 212 and is electrically connected to the second circuit board 212.

[0148] It should be noted that circuit boards (e.g., the first circuit board 211 and the second circuit board 212) are mostly thin plates. Among the multiple surfaces of a circuit board, the side surfaces are relatively narrow. Therefore, the board surface can be roughly regarded as the remaining surfaces excluding the side surfaces. Thus, the circuit board can be roughly regarded as having two boards with opposite orientations. Each of the two boards can be provided with interface terminals, electronic components, etc. The two boards can be roughly parallel.

[0149] Interface terminals (e.g., first interface terminal 213, second interface terminal 214) are used to connect to devices outside the control board 21. The control board 21 may include one or more first interface terminals 213, and the control board 21 may include one or more second interface terminals 214, without limitation.

[0150] In this embodiment, the control board 21 is designed to include a first circuit board 211 and a second circuit board 212 mounted on the first circuit board 211. The first circuit board 211 is provided with a first interface terminal 213, and the second circuit board 212 is provided with a second interface terminal 214. Compared with the related technology where the control board only includes a single circuit board and the interface terminal is only provided on a single circuit board, the area available for the interface terminal on the control board 21 can be increased.

[0151] In this circuit board, the first circuit board 211 can be the main circuit board, and the second circuit board 212 can be the expansion circuit board. The first circuit board 211 can be equivalent to a control board consisting of only a single circuit board in related technologies. The size of the first circuit board 211 is larger than the size of the second circuit board 212.

[0152] The second circuit board 212 is set at an angle to the first circuit board 211, which makes it easier to distinguish the second circuit board 212 from the first circuit board 211, and further makes it easier to distinguish the first interface terminal 213 on the first circuit board 211 from the second interface terminal 214 on the second circuit board 212, which facilitates wiring work and makes it easier to check the wires.

[0153] For example, the first interface terminal 213 can be a high-voltage interface terminal, and the second interface terminal 214 can be a low-voltage interface terminal. That is, the high-voltage interface terminal is arranged on the first circuit board 211, and the low-voltage interface terminal is arranged on the second circuit board 212, so as to distinguish the setting areas of the high-voltage interface terminal and the low-voltage interface terminal, reduce the risk of errors in the wiring process, and reduce interference between high-voltage and low-voltage circuits. Among them, the high-voltage interface terminal is used to connect high-voltage devices, and the low-voltage interface terminal is used to connect low-voltage devices. High-voltage devices and low-voltage devices can be roughly distinguished by the magnitude of the voltage signal when the device is operating; for example, high-voltage devices can correspond to devices with a voltage signal greater than or equal to 48V and less than or equal to 220V when operating, and low-voltage devices can correspond to devices with a voltage signal less than 48V when operating, without limitation.

[0154] It should be noted that the arrangement of the high-voltage interface terminal is not limited to the above-mentioned arrangement. The high-voltage interface terminal may be arranged only on the first circuit board 211 of the first circuit board 211 and the second circuit board 212 (that is, the first interface terminal 213 includes the high-voltage interface terminal, and the second interface terminal 214 does not include the high-voltage interface terminal), or the high-voltage interface terminal may be arranged only on the second circuit board 212 of the first circuit board 211 and the second circuit board 212 (that is, the first interface terminal 213 does not include the high-voltage interface terminal, and the second interface terminal 214 includes the high-voltage interface terminal), or the high-voltage interface terminal may be arranged on both the first circuit board 211 and the second circuit board 212 (that is, the second interface terminal 214 includes the high-voltage interface terminal).

[0155] It should be noted that the arrangement of the low-voltage interface terminals is not limited to the above-mentioned forms. The low-voltage interface terminals may be arranged only on the first circuit board 211 of the first circuit board 211 and the second circuit board 212 (that is, the first interface terminal 213 includes the low-voltage interface terminal, and the second interface terminal 214 does not include the low-voltage interface terminal), or the low-voltage interface terminals may be arranged only on the second circuit board 212 of the first circuit board 211 and the second circuit board 212 (that is, the first interface terminal 213 does not include the low-voltage interface terminal, and the second interface terminal 214 includes the low-voltage interface terminal), or the low-voltage interface terminals may be arranged on both the first circuit board 211 and the second circuit board 212 (that is, the second interface terminal 214 includes the low-voltage interface terminal).

[0156] In the first interface terminal 213 and the second interface terminal 214, the interface of the corresponding high-voltage interface terminal can be larger than that of the corresponding low-voltage interface terminal. This allows for differentiation between the high-voltage and low-voltage interface terminals based on their interface dimensions, reducing the risk of incorrect wiring. Specifically, since the high-voltage interface terminal's interface is larger than the low-voltage interface terminal's interface, the connector of the high-voltage wire corresponding to the high-voltage interface terminal will also be larger than the connector of the low-voltage wire corresponding to the low-voltage interface terminal. This ensures that the larger connector of the high-voltage wire connects to the larger interface of the high-voltage interface terminal, and the smaller connector of the low-voltage wire connects to the smaller interface of the low-voltage interface terminal.

[0157] The interface orientation of the first interface terminal 213 is the same as that of the second interface terminal 214, so that the insertion direction when the first interface terminal 213 is connected to its corresponding wire is the same as that when the second interface terminal 214 is connected to its corresponding wire. This makes it easier to complete the wiring of the first interface terminal 213 and the second interface terminal 214 in the same position on the control board 21, making the operation more convenient.

[0158] The first interface terminal 213 has a first interface end face 2131 and a first back face 2132 opposite to the first interface end face 2131. The interface of the first interface terminal 213 is disposed on the first interface end face 2131, and the interface orientation of the first interface terminal 213 is approximately the direction defined by the first back face 2132 to the first interface end face 2131. The second interface terminal 214 has a second interface end face 2141 and a second back face 2142 opposite to the second interface end face 2141. The interface of the second interface terminal 214 is disposed on the second interface end face 2141, and the interface orientation of the second interface terminal 214 is approximately the direction defined by the second back face 2142 to the second interface end face 2141.

[0159] The interface orientation of the first interface terminal 213 and the second interface terminal 214 can be parallel to the surface of the first circuit board 211 or at an angle to the surface of the first circuit board 211, and there is no limitation thereto.

[0160] In this embodiment, the interfaces of the first interface terminal 213 and the second interface terminal 214 are parallel to the surface of the first circuit board 211. The connectors of the wires can be plugged into the first interface terminal 213 and the second interface terminal 214 in a direction parallel to the surface of the first circuit board 211, which can improve the space utilization of the control board 21 in the direction parallel to the surface of the first circuit board 211.

[0161] If the control board 21 includes multiple first interface terminals 213, the first projections corresponding to the multiple first interface terminals 213 can be located on the same side of the second projection, and / or, if the control board 21 includes multiple second interface terminals 214, the second projections corresponding to the multiple second interface terminals 214 can be located on the same side of the first projection. This allows for a layered arrangement of the first interface terminals 213 and the second interface terminals 214, which is more conducive to distinguishing between the first interface terminals 213 and the second interface terminals 214 and facilitating wiring. Specifically, the first projection can be located on the side closer to the first circuit board 211, and the second projection can be located on the side of the first projection away from the first circuit board 211.

[0162] Specifically, the angle between the surface of the second circuit board 212 and the surface of the first circuit board 211 is greater than 0° and less than 180°. Further, the acute angle between the surface of the second circuit board 212 and the surface of the first circuit board 211 can be greater than or equal to 60° and less than or equal to 90°, for example, 60°, 65°, 70°, 75°, 80°, 85°, 90°, etc. In this embodiment, the surface of the second circuit board 212 is approximately perpendicular to the surface of the first circuit board 211, that is, the angle between the surface of the second circuit board 212 and the surface of the first circuit board 211 is approximately 90°. Compared to the second circuit board 212 being inclined relative to the surface of the first circuit board 211, this facilitates the installation and fixation of the second circuit board 212 and the first circuit board 211.

[0163] Specifically, the mounting and fixing methods between the second circuit board 212 and the first circuit board 211 can be welding, gluing, snap-fit ​​connection, etc., and there is no limitation on this.

[0164] See Figure 17The cover plate 63 may include a first plate 635, a second plate 636, a third plate 637, and a fourth plate 638. The first plate 635 is located on the side of the second circuit board 212 away from the first circuit board 211 and is used to cover the second interface terminal 214. The second plate 636 is located on the side of the first interface terminal 213 away from the first circuit board 211 and is located between the first plate 635 and the first circuit board 211. The second plate 636 is used to cover the second interface terminal 214. The third plate 637 is connected between the first plate 635 and the second plate 636 and is located on the side where the interface end face of the second interface terminal 214 is located. The third plate 637 is provided with a second window 633. The fourth plate 638 is located between the second plate 636 and the first circuit board 211 and is connected to the second plate 636. The fourth plate 638 is located on the side where the interface end face of the first interface terminal 213 is located. The fourth plate 638 is provided with a first window 631. The stepped design of the cover plate 63 covers the first interface terminal 213 and the second interface terminal 214, making the structure between the control board 21 and the cover plate 63 more compact, which is beneficial to reducing the size of the elevator control cabinet 1.

[0165] The first plate 635 can be parallel to the second plate 636, and the first plate 635 can be perpendicular to the third plate 637 and the fourth plate 638.

[0166] Among them, the first plate 635, the second plate 636, the third plate 637 and the fourth plate 638 of the cover plate 63 can be formed by bending a single plate, integrally formed by injection molding or other processes, or formed by welding individual plates, etc., and there is no limitation in this regard.

[0167] Furthermore, the cover plate 63 may be provided with at least one cable tie hole 632, which is used to fix cable ties, thereby enabling the wires connected to the interface terminal 221 to be fixed by the cable ties.

[0168] See again Figure 1 and Figure 2 The elevator control cabinet 10 also includes a human-machine interface module 7, which is electrically connected to the drive module 1, control module 2, and power supply module 3. Specifically, the human-machine interface module 7 includes an emergency stop button, a selector switch, and a button board. The human-machine interface module 7 draws power from the power supply module 3 via a wiring harness. The emergency stop button in the human-machine interface module 7 is connected to the elevator safety circuit via a wiring harness to stop the elevator in an emergency. The selector switch in the human-machine interface module 7 is connected to the elevator safety circuit via a wiring harness to switch between different operating states of the elevator. The button board in the human-machine interface module 7 is connected to the control board 21 in the control module 2 via a ribbon cable to execute human-machine interface commands.

[0169] It should be noted that the human-computer interaction module 7 in this embodiment can be a human-computer interaction module in the related technology, and compared with the related technology, only the setting position in the housing 41 is changed without any change in the circuit.

[0170] Specifically, the human-computer interaction module 7 constitutes the fifth layer structure, which is located on the side of the fourth layer structure away from the base plate 415. That is, the human-computer interaction module 7 is located in the layer structure furthest from the base plate 415 among the first to fifth layers, making it convenient for operators to operate.

[0171] Furthermore, the housing 41 also includes a cover plate 417 opposite to the base plate 415 and a side plate 416 connected to the base plate 415 near the cover plate 417. The cover plate 417 and the side plate 416 are movably connected. Compared with other layers, the fifth layer structure is located adjacent to the cover plate 417. The cover plate 417 is designed to be movably connected to the side plate 416, which facilitates the operator to operate the human-machine interaction module 7 of the fifth layer structure by changing the position of the cover plate 417 relative to the side plate 416. The movable connection between the cover plate 417 and the side plate 416 can be a rotatable connection, a movable connection, etc., and is not limited thereto.

[0172] An operation window 4171 can be formed on the cover plate 417. The human-machine interface module 7 can be set corresponding to the operation window 4171, so that the operator can operate the human-machine interface module 7 without opening the cover plate 417, which facilitates debugging and maintenance. Furthermore, a part of the human-machine interface module 7 can extend into the operation window 4171 and be flush with the outer surface of the cover plate 417 to improve the structural regularity of the elevator control cabinet 10.

[0173] It should be noted that, compared with the control cabinets in related technologies, the elevator control cabinet 10 of this application embodiment can be reduced in size by about 50% after the above-mentioned optimization design of the distribution of each circuit board in the housing 41, and has broad application prospects.

[0174] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" means at least two, for example, two, three, four, etc. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0175] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.

Claims

1. An elevator control cabinet, characterized in that The application relates to a shell, a first functional plate, a second functional plate, a third functional plate, a fourth functional plate, a control module, a power module and a driving module. The shell is formed with a containing cavity and has a bottom plate. The first functional plate is located in the containing cavity and constitutes a first layer structure. The second functional plate is located in the containing cavity and constitutes a second layer structure, which is located on the side, away from the bottom plate, of the first layer structure. The third functional plate is located in the containing cavity and constitutes a third layer structure, which is located on the side, away from the bottom plate, of the second layer structure. The fourth functional plate is located in the containing cavity and constitutes a fourth layer structure, which is located on the side, away from the bottom plate, of the third layer structure. The control module is located in the containing cavity and comprises a control plate and a UCMP plate. The power module is located in the containing cavity and comprises a power supply plate. The driving module is located in the containing cavity and is electrically connected with the control module and the power module, and comprises a driving plate, a capacitor plate and a module plate. The module plate is arranged at an angle with respect to at least one of the driving plate and the capacitor plate. A radiator is arranged in the first interval. A first mounting bracket is arranged in the containing cavity and is mounted on the shell. The first mounting bracket comprises a first plate and a second plate, the second plate is connected to the first plate, the module plate is mounted on the first plate, the driving plate, the capacitor plate, the control module and the power module are mounted on the second plate, and the first plate and the second plate are arranged at an angle. The driving plate constitutes the first layer structure, the capacitor plate constitutes the second layer structure, the power supply plate constitutes the third layer structure, and the control plate constitutes the fourth layer structure.

2. The elevator control cabinet of claim 1, wherein, The driving plate, the capacitor plate, the UCMP plate and the control plate are located on the same side of the module plate, and the module plate spans the first layer structure, the second layer structure, the third layer structure and the fourth layer structure.

3. The elevator control cabinet of claim 1, wherein, The side, away from the driving plate, the capacitor plate, the UCMP plate and the control plate, of the module plate defines a first interval with the inner wall of the shell. The radiator is arranged in the first interval.

4. The elevator control cabinet of claim 1, wherein, The shell is further formed with a first air inlet and a first air outlet which are in communication with the first interval, and the first air inlet and the first air outlet are respectively arranged on the opposite sides of the radiator. The UCMP plate is located between the second layer structure and the fourth layer structure. The application further comprises a first cooling fan which is arranged corresponding to the first air outlet and is mounted on the shell. The application further comprises A circuit breaker is electrically connected with the drive board, and is located in the accommodating cavity. A surface of the bottom plate includes a first region and a second region connected with the first region. Projections of the drive board, the capacitor board, the power supply board and the UCMP board on the bottom plate are located in the first region, a projection of the circuit breaker on the bottom plate is located in the second region, and a projection of the control board on the bottom plate is located in the first region and the second region.

5. The elevator control cabinet of claim 1, wherein, The surface of the bottom plate includes a first region, and the first region includes: a first sub-region, in which a projection of the drive board on the bottom plate is at least partially located; a second sub-region connected with the first sub-region, in which a projection of the capacitor board on the bottom plate is at least partially located.

6. The elevator control cabinet of claim 1, wherein, The shell is formed with oppositely arranged second air inlets and second air outlets, and the second air inlets and the second air outlets are located between the second layer structure and the bottom plate. The elevator control cabinet further includes: A second heat dissipation fan is located in the accommodating cavity and between the second layer structure and the bottom plate, is arranged corresponding to the second air outlet and is installed on the shell.

7. The elevator control cabinet of claim 1, wherein, Further comprising: A human-computer interaction module is electrically connected with the control module, the power supply module and the drive module, and constitutes a fifth layer structure. The fifth layer structure is located on a side of the fourth layer structure away from the bottom plate.

8. The elevator control cabinet of claim 1, wherein, Further comprising: A second mounting bracket is located in the accommodating cavity, is installed on the shell, and is located on a side of the first mounting bracket away from the bottom plate. The drive board, the capacitor board, the power supply board, the UCMP board and the control board are located between the first mounting bracket and the second mounting bracket, and the control board is installed on the second mounting bracket.

9. The elevator control cabinet of claim 8, wherein, The elevator control cabinet includes two second mounting brackets, and the two second mounting brackets are respectively located on opposite sides of the control board in a direction parallel to the surface of the bottom plate.

10. The elevator control cabinet of claim 9, wherein, Further comprising: A cover plate is connected between the two second mounting brackets, covers the control board, and is formed with windows corresponding to the interface terminals.

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