Transparent display panel and splicing method thereof

Abstract

This application relates to the field of display technology, and its embodiments provide a transparent display panel and a splicing method thereof. In the aforementioned transparent display panel and splicing method, the transparent display panel includes multiple sub-panels. Splicing circuit contacts are set in the splicing area of ​​the sub-panels, and an adhesive layer is set in the target area formed by the splicing areas of two sub-panels to be spliced. Then, a thermosetting curing process is used to fix and electrically connect the two sub-panels to each other. Since the adhesive layer includes a thermosetting adhesive layer and multiple welding particles disposed within the thermosetting adhesive layer, the welding particles form a metal layer connected to the splicing circuit contacts, and a eutectic bond is formed between the metal layer and the splicing circuit contacts, thus electrically connecting the two sub-panels. Simultaneously, the thermosetting adhesive layer forms a protective bonding layer. Therefore, the obstruction at the splicing point of the sub-panels is improved, and the transparency effect of the transparent display panel is enhanced.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a transparent display panel and its splicing method. Background Technology

[0002] Large-sized transparent displays are typically composed of multiple smaller transparent displays pieced together. In related technologies, splicing structures are used at the joints of the smaller transparent displays to connect them. However, during this process, the splicing structures can cause obstruction, resulting in poor transparency and viewing effect of the transparent display. Summary of the Invention

[0003] Therefore, it is necessary to provide a transparent display panel and its splicing method to improve the transparency effect of the transparent display panel.

[0004] According to one aspect of this application, an embodiment of this application provides a method for splicing transparent display panels. The transparent display panel includes multiple sub-panels, each sub-panel having splicing line connections and a splicing area, wherein the splicing line connections are located within the splicing area. The splicing method includes:

[0005] Based on the splicing area of ​​the two sub-panels to be spliced, the two sub-panels are spliced ​​together, and an adhesive layer is provided in the target area formed by the splicing area of ​​the two sub-panels; the adhesive layer includes a thermosetting adhesive layer and a plurality of welding particles disposed in the thermosetting adhesive layer;

[0006] The welding particles are formed into a metal layer by a hot-press curing process, and the thermosetting adhesive layer forms a protective connection layer, so that the two sub-panels are fixed to each other and electrically connected; wherein, a eutectic bond is formed between the metal layer and the corresponding splicing line connection point in the target area, and the exposed surface of the metal layer can be encapsulated in the protective connection layer.

[0007] In one embodiment, the splicing area is located at the edge of the sub-panel; the sub-panel has a first surface and a second surface disposed opposite to each other, and a splicing sidewall located in the splicing area, the splicing sidewall connecting the first surface and the second surface, and the splicing line connection point being disposed on the first surface;

[0008] The process of splicing the two sub-panels together based on their splicing areas, and then applying an adhesive layer within the target area formed by the splicing areas of the two sub-panels, includes:

[0009] The two sub-panels are then joined together by splicing their sidewalls.

[0010] The adhesive layer is disposed within the target area; wherein the splicing line connection points corresponding to the two sub-panels are located within the target area.

[0011] In one embodiment, the orthographic projection of the splicing line connection points corresponding to the two sub-panels on the first surface is located within the orthographic projection of the adhesive layer on the first surface.

[0012] In one embodiment, along the splicing direction of the two sub-panels, the splicing line connections corresponding to the two sub-panels abut against each other.

[0013] In one embodiment, the first surface is located on the non-display side of the sub-panel.

[0014] In one embodiment, the splicing area is located at the edge of the sub-panel; the sub-panel includes a first sub-board and a second sub-board stacked together, the first sub-board and the second sub-board defining a stepped portion at the edge of the sub-panel located in the splicing area, and the splicing line connection point is located in the stepped portion;

[0015] The process of splicing the two sub-panels together based on their splicing areas, and then applying an adhesive layer within the target area formed by the splicing areas of the two sub-panels, includes:

[0016] The adhesive layer is provided on the stepped portion of at least one of the two sub-panels;

[0017] The two stepped portions of the two sub-panels are spliced ​​together; wherein the two stepped portions of the two sub-panels define the target area.

[0018] In one embodiment, the two stepped portions have splicing surfaces arranged opposite to each other, and the splicing line connection points corresponding to the two sub-panels are located on the corresponding splicing surfaces;

[0019] Wherein, the orthographic projection of the splicing line connection points corresponding to the two sub-panels on any of the splicing surfaces lies within the orthographic projection of the adhesive layer on the splicing surface; and / or

[0020] The splicing line connections corresponding to the two sub-panels have overlapping areas when projected onto either splicing surface.

[0021] In one embodiment, the stepped portion of one of the two sub-panels is formed on the first sub-panel, and the stepped portion of the other is formed on the second sub-panel.

[0022] In one embodiment, the provision of an adhesive layer within the target area formed by the splicing areas of the two sub-panels includes:

[0023] The adhesive layer is applied to the target area using a coating process.

[0024] In one embodiment, the welding particles are solder particles; and / or

[0025] The thermosetting adhesive layer is made of epoxy resin, thermosetting agent, and flux.

[0026] In one embodiment, the sub-panel is configured as a transparent OLED display panel.

[0027] According to another aspect of this application, an embodiment of this application provides a transparent display panel, which is spliced ​​together according to the splicing method of the transparent display panel described in any of the above embodiments.

[0028] In the aforementioned transparent display panel and its splicing method, the transparent display panel includes multiple sub-panels. Splicing circuit points are set in the splicing areas of the sub-panels, and an adhesive layer is applied to the target area formed by the splicing areas of the two sub-panels to be spliced. Then, a thermosetting curing process is used to fix and electrically connect the two sub-panels to each other. Since the adhesive layer includes a thermosetting adhesive layer and multiple welding particles within the thermosetting adhesive layer, and metals have the characteristic of homogeneous compatibility and aggregation, while metals and adhesives are incompatible, during the thermosetting curing process, the welding particles flow and aggregate towards the splicing circuit points in the heated and flowing adhesive. The welding particles form a metal layer connected to the splicing circuit points, and a eutectic bond is formed between the metal layer and the splicing circuit points, thus electrically connecting the two sub-panels. Simultaneously, the thermosetting adhesive layer forms a protective bonding layer, which not only fixes the two sub-panels to each other but also encapsulates the exposed surface of the metal layer. This improves the situation of occlusion at the splicing points of the sub-panels and enhances the transparency of the transparent display panel.

[0029] Additional aspects and advantages of embodiments of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of this application. Attached Figure Description

[0030] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0031] Figure 1This is a schematic diagram of the structure of a grille screen in one embodiment of the related technology.

[0032] Figure 2 This is a schematic diagram of the structure of a transparent display in one embodiment of the related technology.

[0033] Figure 3 This is a schematic diagram of the splicing structure of a transparent display in one embodiment of the related technology.

[0034] Figure 4 This is a flowchart illustrating a method for splicing transparent display panels according to an embodiment of this application.

[0035] Figure 5 This is a schematic diagram of the sub-panel structure in one embodiment of this application.

[0036] Figure 6 for Figure 5 The diagram shows the structure of the sub-panels being spliced ​​together.

[0037] Figure 7 for Figure 6 The diagram shows the structure of the spliced ​​sub-panel with an adhesive layer.

[0038] Figure 8 for Figure 7 The diagram shows the structure of the spliced ​​sub-panel and adhesive layer after the hot-press curing process.

[0039] Figure 9 This is a flowchart illustrating step S110 in one embodiment of this application.

[0040] Figure 10 This is a schematic diagram of the sub-panel structure in another embodiment of this application.

[0041] Figure 11 This is a schematic diagram of the sub-panel structure in another embodiment of this application.

[0042] Figure 12 This is a flowchart illustrating step S110 in another embodiment of this application.

[0043] Figure 13 for Figure 10 The diagram shows a sub-panel with an adhesive layer.

[0044] Figure 14 For splicing Figure 11 The sub-panels shown in the diagram and Figure 13 The diagram shows the structure of a sub-panel with an adhesive layer.

[0045] Figure 15 for Figure 14 The diagram shows the structure of the spliced ​​sub-panels after the hot-press curing process.

[0046] Figure 16 This is a schematic diagram of the process of splicing sub-panels in another embodiment of this application.

[0047] Figure 17 This is an electron microscope image of a transparent display panel in one embodiment of this application.

[0048] Figure 18 for Figure 17 A magnified schematic diagram of the structure at point G in the middle.

[0049] Explanation of reference numerals in the attached figures:

[0050] 1. Grille screen; 2. Transparent display; 3. Splicing structure; 4. Obstruction area z.

[0051] Sub-panel 100, substrate 110, first surface m1, first circuit pattern T1, second surface m2, second circuit pattern T2, splicing circuit connection point P, splicing sidewall c, splicing area r0, light-emitting element 120.

[0052] Sub-panel 100a, first sub-board 101a, first sub-substrate 111a, first surface a11, second surface a12, second sub-board 102a, second sub-substrate 112a, third surface a21, fourth surface a22, stepped portion fa, first circuit pattern T1a, second circuit pattern T2a, splicing surface ca, splicing area ra, splicing circuit connection point Pa;

[0053] Sub-panel 100b, first sub-board 101b, first sub-substrate 111b, first surface b11, second surface b12, second sub-board 102b, second sub-substrate 112b, third surface b21, fourth surface b22, stepped portion fb, first circuit pattern T1b, second circuit pattern T2b, splicing surface cb, splicing area rb, splicing circuit connection point Pb;

[0054] Colloidal layer A;

[0055] Adhesive layer 200, thermosetting adhesive layer 201, welding particles 202, metal layer M, protective bonding layer B;

[0056] Display side s1, non-display side s2;

[0057] Splicing direction F1, thickness direction F2, via k;

[0058] Dimensions d1, d2, d3, d4, spacing L;

[0059] Steps S110, S111a, S112a, S111b, S112b, S120. Detailed Implementation

[0060] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0061] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0062] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0063] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0064] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0065] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0066] Figure 1 A schematic diagram of the structure of the grille screen 1 in one embodiment of the related technology is shown; for ease of explanation, only the content related to the embodiment of the related technology is shown.

[0067] Please refer to Figure 1 One embodiment of the related technology provides a transparent LED display grid screen 1. The LED beads are mounted on a hollowed-out PCB (Printed Circuit Board) using an SMT (Surface Mount Technology) process. This PCB is opaque, resulting in poor visual transmission. To improve the visual effect, another embodiment of the related technology uses a transparent OLED (Organic Electroluminescence Display). However, transparent OLED displays generally suffer from insufficient brightness, low transmittance, high cost, and poor reliability. Reducing the pixel pitch to improve resolution and display effect results in greater transparency. Conversely, increasing the pixel pitch to achieve better transmission visual effect increases transparency, but this reduces resolution and display quality.

[0068] Figure 2 A schematic diagram of the structure of a transparent display 2 in one embodiment of the related technology is shown; Figure 3 A schematic diagram of the splicing structure 3 of the transparent display 2 in one embodiment of the related technology is shown; for ease of explanation, only the content related to the embodiment of the related technology is shown.

[0069] Please refer to Figure 2 In one embodiment of the related technology, a transparent display 2 uses transparent PET (polyethylene glycol terephthalate) as a flexible substrate. Thick-film metal is used to etch circuitry onto the flexible substrate, and optical matching of the overall structure is employed to make the circuitry invisible, thereby achieving a highly transparent visual effect and improving some of the aforementioned problems. However, for large-size transparent displays 2, multiple small-size transparent displays 2 need to be spliced ​​together. Please refer to... Figure 3 Typically, a splicing structure 3 is set on a small transparent display 2, and two small transparent displays 2 are connected by corresponding splicing structures 3. In this process, the splicing structure 3 will cause obstruction, forming an obstruction area z, which will result in poor transparency of the transparent display 2.

[0070] Based on this, in order to improve at least some of the problems mentioned above, the embodiments of this application improve the splicing method and splicing structure to improve the problem of occlusion at the splicing point in the aforementioned situation, and improve the transparency effect of the transparent display panel.

[0071] The splicing method of the transparent display panel provided in the embodiments of this application will be further described below with reference to the relevant accompanying drawings and some content of the embodiments of this application.

[0072] Figure 4 A flowchart illustrating a method for splicing transparent display panels according to an embodiment of this application is shown; Figure 5 A schematic diagram of the structure of the sub-panel 100 in one embodiment of this application is shown; Figure 6 It shows Figure 5 A schematic diagram showing the structure of the sub-panels 100 being spliced ​​together; Figure 7 It shows Figure 6 The diagram shows the structure of the spliced ​​sub-panel 100 with the adhesive layer 200 provided; Figure 8 It shows Figure 7 The schematic diagram of the spliced ​​sub-panel 100 and adhesive layer 200 after the hot-press curing process is shown in the figure for ease of explanation, and only the content related to the embodiments of this application is shown.

[0073] Please refer to Figure 4 and Figure 5In some embodiments, this application provides a method for splicing a transparent display panel. The transparent display panel includes multiple sub-panels 100, each sub-panel 100 having a splicing line connection point P and a splicing area r0, with the splicing line connection point P located within the splicing area r0. It is understood that the sub-panels 100 can have the same or different structures, and their sizes can be the same or different, depending on the specific application. This application does not impose specific limitations in this regard. The splicing method includes the following steps:

[0074] Step S110: Based on the splicing area r0 of the two sub-panels 100 to be spliced, the two sub-panels 100 are spliced ​​together, and an adhesive layer 200 is set in the target area formed by the splicing area r0 of the two sub-panels 100; the adhesive layer 200 includes a thermosetting adhesive layer 201 and a plurality of welding particles 202 disposed in the thermosetting adhesive layer 201.

[0075] Specifically, in conjunction with reference Figure 6 The number of splicing areas r0 of sub-panel 100 is determined by the number of other sub-panels 100 spliced ​​with it. For example, if sub-panel 100 is spliced ​​with only one other sub-panel 100, then the splicing area r0 of sub-panel 100 is only one. If sub-panel 100 is spliced ​​with only two other sub-panels 100 respectively, then the splicing area r0 of sub-panel 100 is two. A corresponding splicing area r0 can be set according to the splicing situation of each sub-panel 100; this embodiment does not impose specific limitations on this. It can be understood that the splicing areas r0 of the two sub-panels 100 to be spliced ​​are one-to-one corresponding. The target area is determined by the corresponding two splicing areas r0, and the corresponding splicing line connection point P is at least partially located within the target area. An adhesive layer 200 can be applied to the target area using a coating process.

[0076] The thermosetting adhesive layer 201 refers to a layer whose viscosity changes in response to temperature variations, thereby altering its flowability. For example, when the thermosetting adhesive layer 201 is heated, its viscosity decreases and its flowability increases. The welding particles 202 refer to particles that can molten in response to temperature variations and form a eutectic interface with the splicing circuit connection point P. The welding particles 202 can be spherical or other shapes; this embodiment does not impose specific limitations on their shape.

[0077] Step S120: The welding particles 202 form a metal layer M and the thermosetting adhesive layer 201 form a protective connection layer B through a hot-press curing process, so that the two sub-panels 100 are fixed to each other and electrically connected; wherein, a eutectic bond is formed between the metal layer M and the corresponding splicing line connection point P in the target area, and the exposed surface of the metal layer M can be encapsulated in the protective connection layer B.

[0078] Specifically, in conjunction with reference Figure 7 and Figure 8 The heating temperature in the hot-press curing process is determined based on the temperature required for the welding particles 202 to be in a molten state and the heat curing temperature of the thermosetting adhesive layer 201. This embodiment does not impose specific limitations on this. The pressure can be determined based on the ability to electrically connect the two sub-panels 100. It is understood that during heating, the viscosity of the thermosetting adhesive layer 201 decreases, and the internal fluidity of the thermosetting adhesive layer 201 improves. Since the welding particles 202 are made of metal and the splicing circuit contact P is also made of metal, their polarities are similar, and they have the characteristic of homogeneous compatibility and aggregation. However, metal and thermosetting adhesive layer 201 are incompatible. Therefore, the welding particles 202 can flow and aggregate towards the splicing circuit contact P within the thermosetting adhesive layer 201. The welding particles 202 become molten in response to temperature changes, forming a eutectic bond with the splicing circuit contact P. A eutectic interface exists between the welding particles 202 and the splicing circuit contact P, thereby achieving electrical conductivity between the two sub-panels 100. Subsequently, the thermosetting adhesive layer 201 gradually cures to form a protective bonding layer B, which is non-flowable and protects the metal layer M and the splicing circuit connection point P. At the same time, the cured protective bonding layer B can fix the two sub-panels 100 together.

[0079] By using an adhesive layer 200 comprising a thermosetting adhesive layer 201 and welding particles 202, and a thermosetting curing process, two sub-panels 100 can be electrically connected via eutectic bonding and fixed together by a protective connection layer B, which also protects the metal layer M and the splicing circuit contact P. This improves the situation where the splicing points of the sub-panels 100 are obstructed, and enhances the transparency of the transparent display panel.

[0080] In some embodiments, please continue to refer to Figure 5 The splicing area r0 is located at the edge of the sub-panel 100. The sub-panel 100 has a first surface m1 and a second surface m2 that are disposed opposite to each other, and a splicing sidewall c located in the splicing area r0. The splicing sidewall c connects the first surface m1 and the second surface m2, and the splicing line connection point P is located on the first surface m1.

[0081] For example, the sub-panel 100 includes a substrate 110 and a light-emitting element 120. The substrate 110 can be made of transparent PET. A first surface m1 and a second surface m2 are formed on the substrate 110. A first circuit pattern T1 is provided on the first surface m1, and a second circuit pattern T2 is provided on the second surface m2. The first circuit pattern T1 and the second circuit pattern T2 can be electrically connected via via k. The first circuit pattern T1 and the splicing circuit contact P can be fabricated in the same process or in different processes. The first circuit pattern T1 and the splicing circuit contact are electrically connected. The light-emitting element 120 can be surface-mounted onto the second circuit pattern T2 using an SMT process. The light-emitting element 120 can be an LED. The side containing the second surface m2 is the display side s1, and the side containing the first surface m1 is the non-display side s2.

[0082] It should be noted that the materials of the first line pattern T1, the second line pattern T2, and the splicing line contact P can be any of gold, silver, or copper, and can be set according to the actual use. This application embodiment does not impose specific limitations on this, and the materials of the relevant line patterns and splicing line contact P involved in some later embodiments will not be described again. In other embodiments, the splicing line contact P can also be located on the second surface m2, which can be set according to the specific use. This application embodiment does not impose specific limitations on this. When the splicing line contact P is located on the non-display side s2, it not only facilitates splicing but also further improves the penetration effect.

[0083] The following is combined with Figure 9 For example Figure 5 The splicing process of the sub-panel 100 shown will be further explained. Figure 9 A flowchart of step S110 in one embodiment of this application is shown; for ease of explanation, only the content related to the embodiment of this application is shown.

[0084] Further, please refer to Figure 9 Step S110 includes:

[0085] Step S111a: Join the splicing sidewalls c of the two sub-panels 100;

[0086] Specifically, with Figure 6 For example, two sub-panels 100 are spliced ​​along the splicing direction F1, with their splicing sidewalls c abutting against each other. Of course, in some other embodiments, the two splicing sidewalls c may not abut. When the splicing sidewalls c of the two sub-panels 100 abut, the protective connection layer B formed in subsequent steps can improve the connection reliability of the two sub-panels 100. It can be understood that in... Figure 5In the illustrated scenario, the splicing direction F1 and the thickness direction F2 are perpendicular to each other. For example, alignment marks can be provided on the sub-panels 100 to align the two sub-panels 100. Specifically, in some embodiments, along the splicing direction F1, the corresponding splicing line contacts P of the two sub-panels 100 abut against each other. This makes the electrical connection between the two sub-panels 100 more reliable.

[0087] Step S112a: Set an adhesive layer 200 in the target area; wherein the splicing line connection point P corresponding to the two sub-panels 100 is located in the target area.

[0088] Specifically, such as Figure 7 As shown, the target area is composed of the splicing area r0. In this case, the target area includes the area where splicing line contacts P are provided on the first surfaces m1 of the two sub-panels 100. Specifically, in some embodiments, the orthographic projections of the splicing line contacts P corresponding to the two sub-panels 100 on the first surface m1 are all located within the orthographic projection of the adhesive layer 200 on the first surface m1. That is, the splicing line contacts P can be completely covered by the adhesive layer 200. Of course, in other embodiments, the splicing line contacts P can also be partially covered by the adhesive layer 200. When the splicing line contacts P can be completely covered by the adhesive layer 200, a more reliable connection method can be obtained. For example... Figure 8 As shown, by step S120, two spliced ​​sub-panels 100 can be obtained.

[0089] In some embodiments, the splicing area is located at the edge of the sub-panel. The sub-panel includes a first sub-board and a second sub-board stacked together. The first and second sub-boards define a stepped portion at the edge of the sub-panel, forming the splicing area, and the splicing wiring connection point is located in the stepped portion. It is understood that the stepped portions of the two sub-panels to be spliced ​​are corresponding. For example, the stepped portion of one of the two sub-panels is formed on the first sub-board, and the stepped portion of the other is formed on the second sub-board.

[0090] The following description, in conjunction with the accompanying drawings, provides an exemplary illustration of the splicing of sub-panels with stepped sections.

[0091] Figure 10 A schematic diagram of the structure of sub-panel 100a in another embodiment of this application is shown; Figure 11 A schematic diagram of the sub-panel 100a in another embodiment of this application is shown. For ease of explanation, only the content relevant to the embodiment of this application is shown.

[0092] by Figure 10For example, sub-panel 100a includes a first sub-board 101a and a second sub-board 102a stacked together. The first sub-board 101a includes a first sub-substrate 111a, which has a first surface a11 and a second surface a12 disposed opposite to each other. The second sub-board 102a includes a second sub-substrate 112a, which has a third surface a21 and a fourth surface a22 disposed opposite to each other. A first circuit pattern T1a is provided on the third surface a21 of the second sub-substrate 112a, and a second circuit pattern T2a is provided on the fourth surface a22 of the second sub-substrate 112a. The first circuit pattern T1a and the second circuit pattern T2a are electrically connected via a via k. The second surface a12 of the first sub-substrate 111a and the third surface a21 of the second sub-substrate 112a are opposite to each other, and the first sub-substrate 111a and the second sub-substrate 112a are bonded together by an adhesive layer A. In the splicing direction F1, the size d1 of the first sub-substrate 111a is smaller than the size d2 of the second sub-substrate 112a, so that the portion of the second sub-substrate 112a extending beyond the first sub-substrate 111a forms a stepped portion fa located in the splicing area ra. The splicing line contact Pa is provided in the stepped portion fa, that is, the splicing line contact Pa is provided on the third surface a21 of the second sub-substrate 112a and is electrically connected to the first circuit pattern T1a.

[0093] by Figure 11 For example, sub-panel 100b includes a first sub-board 101b and a second sub-board 102b stacked together. The first sub-board 101b includes a first sub-substrate 111b, which has a first surface b11 and a second surface b12 disposed opposite to each other. A first circuit pattern T1b is provided on the second surface b12 of the first sub-substrate 111b. The second sub-board 102b includes a second sub-substrate 112b, which has a third surface b21 and a fourth surface b22 disposed opposite to each other. A second circuit pattern T2b is provided on the fourth surface b22 of the second sub-substrate 112b. The first circuit pattern T1b and the second circuit pattern T2b are electrically connected via a via k. The second surface b12 of the first sub-substrate 111b and the third surface b21 of the second sub-substrate 112b are opposite to each other, and the first sub-substrate 111b and the second sub-substrate 112b are bonded together by an adhesive layer A. In the splicing direction F1, the dimension d3 of the first sub-substrate 111b is larger than the dimension d4 of the second sub-substrate 112b, so that the portion of the first sub-substrate 111b extending beyond the second sub-substrate 112b forms a stepped portion fb located in the splicing area rb. The splicing line contact Pb is provided in the stepped portion fb, that is, the splicing line contact Pb is provided on the second surface b12 of the first sub-substrate 111b and is electrically connected to the first circuit pattern T1b.

[0094] As you can see, Figure 10 The stepped portion fa of sub-panel 100a shown in the diagram and Figure 11The stepped portion fb of sub-panel 100b shown in the diagram is compatible and can be spliced ​​together. Figure 10 and Figure 11 In the illustrated scenario, the splicing direction F1 is the thickness direction F2. The following will use... Figure 10 and Figure 11 The illustration further explains the splicing process.

[0095] Figure 12 A flowchart of step S110 in another embodiment of this application is shown; Figure 13 It shows Figure 10 A schematic diagram showing the structure of the sub-panel 100a with the adhesive layer 200 provided; Figure 14 The splicing is shown Figure 11 The sub-panel 100b shown in the diagram and Figure 13 A schematic diagram of the structure of the sub-panel 100a with the adhesive layer 200 shown in the figure; Figure 15 It shows Figure 14 The diagram shows the structure of the spliced ​​sub-panels 100a and 100b after the hot-press curing process; for ease of explanation, only the content related to the embodiments of this application is shown.

[0096] In some embodiments, please refer to Figure 12 Step S110 includes:

[0097] Step S111b: Apply an adhesive layer 200 to the stepped portion of at least one of the two sub-panels;

[0098] Specifically, refer to Figure 10 and Figure 11 The stepped section fa has a splicing surface ca and the splicing line connection point Pa is located on the splicing surface ca, and the stepped section fb has a splicing surface cb and the splicing line connection point Pb is located on the splicing surface cb. The splicing surfaces ca and cb are arranged opposite to each other. Figure 13 As shown, an adhesive layer 200 can be provided on the splicing surface ca of the stepped portion fa. Alternatively, the adhesive layer 200 can be provided on the splicing surface cb of the stepped portion fb, or it can be provided on both the splicing surface ca of the stepped portion fa and the splicing surface cb of the stepped portion fb. The specific configuration can be determined according to the application, and this embodiment does not impose any particular limitations on this.

[0099] Step S112b: Join the two stepped portions of the two sub-panels together; wherein the two stepped portions of the two sub-panels define the target area.

[0100] Specifically, such as Figure 14 As shown, the stepped section fa and the stepped section fb are spliced ​​together. Figure 15As shown, by step S120, the spliced ​​sub-panel 100a and sub-panel 100b can be obtained.

[0101] Figure 16 A flowchart illustrating the splicing of sub-panels in another embodiment of this application is shown; for ease of explanation, only content related to the embodiments of this application is shown. Figure 16 The two sub-panels are respectively Figure 10 The sub-panel 100a shown is... Figure 11 The sub-panel 100b shown is... Figure 10 and Figure 11 A top view. For example, splicing line contacts Pa, adhesive layer 200, and protective connection layer B are shown in dashed lines, and metal layer M is shown in black blocky portions.

[0102] In some embodiments, the orthographic projection of the splicing line contacts corresponding to the two sub-panels on either splicing surface lies within the orthographic projection of the adhesive layer 200 on that splicing surface; and / or, the orthographic projections of the splicing line contacts corresponding to the two sub-panels on either splicing surface have an overlapping area. Specifically, referring to reference... Figure 16 This illustrates that the adhesive layer 200 covers at least a portion of the splicing circuit contact Pa and at least a portion of the splicing circuit contact Pb. Specifically, the adhesive layer 200 can also completely cover both splicing circuit contact Pa and Pb, resulting in a more reliable connection. Of course, Figure 16 It also illustrates the one-to-one correspondence between the splicing line contact Pa of sub-panel 100a and the splicing line contact Pb of sub-panel 100b.

[0103] Understandable, with Figures 5 to 9 For example, the two sub-panels 100 after splicing are connected in the left-right direction as shown in the diagram (i.e., connected on the same side). Figures 10 to 16 For example, the spliced ​​sub-panels 100a and 100b are vertically and horizontally connected as shown in the figure. Thus, combining the scenarios illustrated in the above embodiments, different splicing structures can be flexibly configured, and this application does not impose any limitations on this.

[0104] In some embodiments, in conjunction with reference Figure 7 and Figure 13The welding particles 202 are solder particles. The solder particles can be made of tin alloys such as tin-silver alloy, tin-copper alloy, and tin-bismuth alloy. In other embodiments, the thermosetting adhesive layer 201 is made of epoxy resin, a thermosetting agent, and flux. The flux can be made of ethylene propionic acid, glutaric acid, glycolic acid, etc. The flux can be applied to the outer surface of the welding particles 202, or it can be applied to the outside of the welding particles 202 or dispersed within the thermosetting adhesive layer 201. The application can be configured according to specific usage conditions, and this embodiment does not impose specific limitations on this. Specifically, the heating temperature can be 120℃-200℃, which is beneficial not only for the welding particles 202 to reach a molten state but also for maintaining... Figure 5 Sub-panel 100 Figure 10 Sub-panel 100a and Figure 11 The shape of sub-panel 100b in the middle.

[0105] In some embodiments, the sub-panel is configured as a transparent OLED display panel. That is, Figure 5 Sub-panel 100 Figure 10 Sub-panel 100a and Figure 11 The sub-panel 100b can be configured as a transparent OLED display panel. Of course, the sub-panel can also be other types of transparent display panels, and this application embodiment does not impose specific limitations on this.

[0106] It should be noted that some of the technical solutions described above can be implemented as independent embodiments in actual implementation, or they can be combined with each other as combined embodiments. For example, the splicing step may include both... Figure 9 It can also include Figure 12 That is, the splicing of a portion of the transparent display panel can be done using... Figures 5 to 9 The illustrated splicing process shows that another part of the splicing can be done using... Figures 10 to 16 The illustration shows the splicing process. The technical solutions described above are exemplary; the specific combinations and implementations can be chosen according to actual needs, and this application does not impose specific limitations. Furthermore, the description of the embodiments of this application is based solely on ease of explanation, following a corresponding order, such as the order preset according to the requirements of the actual implementation process, and does not limit the execution order between different embodiments. Accordingly, in actual implementation, if multiple embodiments provided by this application need to be implemented, it is not necessary to follow the execution order provided in the description of the embodiments; instead, the execution order between different embodiments can be arranged according to requirements.

[0107] It should be understood that although the steps in the relevant flowcharts are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the relevant flowcharts may include multiple steps or stages, which are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0108] Based on the same inventive concept, this application also provides a transparent display panel, which is assembled according to the splicing method of the transparent display panel in any of the above embodiments. The advantages of any of the above embodiments are also present in the transparent display panel of this application, and will not be repeated here.

[0109] Understandably, as the number of light-emitting elements 120 increases or the length of the connected sub-panels increases, the end impedance will be greater, which may cause insufficient voltage or current to drive the light-emitting elements 120, resulting in color shift or insufficient brightness. However, when using the above splicing method, the maximum length of seamless splicing can be achieved according to the system's driving limit, improving the end impedance problem and thus obtaining a larger transparent display panel.

[0110] For example, when the spacing L between adjacent light-emitting elements 120 is greater than 2.5 mm, it can be adopted that... Figures 5 to 9 The illustrated splicing process produces a transparent display panel. When the spacing L between adjacent light-emitting elements 120 is less than 2.5 mm, a method can be used... Figures 10 to 16 The illustrated splicing process creates a transparent display panel. The specific configuration can be adjusted according to the application; this embodiment does not impose any particular limitations.

[0111] Figure 17 An electron microscope image of a transparent display panel according to an embodiment of this application is shown; Figure 18 It shows Figure 17 A magnified schematic diagram of a portion of the structure at point G; for ease of explanation, only the content relevant to the embodiments of this application is shown. Figure 17 The electron microscope image shown is an SEM (Scanning Electron Microscope) image.

[0112] by Figures 10 to 16 For example, an electron microscope image of the splicing area of ​​the fabricated transparent display panel is taken, such as... Figure 17 and Figure 18As shown, the metal layer M is well connected to the splicing line contacts Pa and Pb, demonstrating a certain degree of reliability.

[0113] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0114] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for splicing transparent display panels, characterized by, The transparent display panel includes multiple sub-panels. Each sub-panel has splicing line contacts and a splicing area located at its edge. The splicing line contacts are located within this splicing area. Each sub-panel has a display side and a non-display side arranged opposite each other along its thickness direction. The splicing area is located on the non-display side of the sub-panel. The light-emitting elements of the sub-panel are located on its display side. Each sub-panel has a first surface and a second surface arranged opposite each other, and a splicing sidewall located within the splicing area. The splicing sidewall connects the first surface and the second surface. The splicing line contacts are located on the first surface, which is located on the non-display side of the sub-panel. The splicing method includes: Based on the splicing area of ​​the two sub-panels to be spliced, the splicing sidewalls of the two sub-panels are spliced ​​together, and an adhesive layer is provided in the target area formed by the splicing area of ​​the two sub-panels; the adhesive layer includes a thermosetting adhesive layer and a plurality of welding particles disposed in the thermosetting adhesive layer, and the material of the thermosetting adhesive layer includes epoxy resin, thermosetting agent and flux. The welding particles are formed into a metal layer by a hot-press curing process, and the thermosetting adhesive layer forms a protective connection layer, so that the two sub-panels are fixed to each other and electrically connected; wherein, a eutectic bond is formed between the metal layer and the corresponding splicing line connection point in the target area, and the exposed surface of the metal layer can be encapsulated in the protective connection layer.

2. The method for splicing transparent display panels according to claim 1, characterized in that, The splicing line connection points corresponding to the two sub-panels are located within the target area.

3. The method for splicing transparent display panels according to claim 2, characterized in that, The orthographic projections of the splicing line contacts corresponding to the two sub-panels on the first surface are both located within the orthographic projection of the adhesive layer on the first surface.

4. The method for splicing transparent display panels according to claim 2, characterized in that, Along the splicing direction of the two sub-panels, the splicing line connections corresponding to the two sub-panels abut against each other.

5. A method for splicing transparent display panels, characterized in that, The transparent display panel includes multiple sub-panels. Each sub-panel has splicing line contacts and a splicing area located at its edge. The splicing line contacts are located within this splicing area. Each sub-panel has a display side and a non-display side arranged opposite each other along its thickness direction. The light-emitting element of the sub-panel is located on the display side. The sub-panel includes a first sub-board and a second sub-board stacked together. The first and second sub-boards define a stepped portion at the edge of the sub-panel, located within the splicing area. The splicing line contacts are located on the stepped portion. Two stepped portions have splicing surfaces arranged opposite each other. The splicing line contacts corresponding to the two sub-panels are located on their respective splicing surfaces. The stepped portion of one of the two sub-panels is formed on the first sub-board, and the stepped portion of the other sub-panel is formed on the second sub-board. The splicing method includes: Based on the splicing area of ​​the two sub-panels to be spliced, the two sub-panels are spliced ​​together, and an adhesive layer is provided in the target area formed by the splicing area of ​​the two sub-panels; the adhesive layer includes a thermosetting adhesive layer and a plurality of welding particles disposed in the thermosetting adhesive layer, and the material of the thermosetting adhesive layer includes epoxy resin, thermosetting agent and flux. The welding particles are formed into a metal layer and the thermosetting adhesive layer is formed into a protective connection layer through a hot-press curing process, so that the two sub-panels are fixed to each other and electrically connected; wherein, a eutectic bond is formed between the metal layer and the corresponding splicing line connection point in the target area, and the exposed surface of the metal layer can be encapsulated in the protective connection layer. The step of splicing the two sub-panels together based on their splicing areas, and then setting an adhesive layer within the target area formed by the splicing areas of the two sub-panels, includes: The adhesive layer is provided on the stepped portion of at least one of the two sub-panels; The two stepped portions of the two sub-panels are spliced ​​together; wherein the two stepped portions of the two sub-panels define the target area.

6. The method for splicing transparent display panels according to claim 5, characterized in that, The orthographic projection of the splicing line connection points corresponding to the two sub-panels on either splicing surface lies within the orthographic projection of the adhesive layer on that splicing surface; and / or The splicing line connections corresponding to the two sub-panels have overlapping areas when projected onto either splicing surface.

7. The method for splicing transparent display panels according to any one of claims 1-6, characterized in that, The provision of an adhesive layer within the target area formed by the splicing areas of the two sub-panels includes: The adhesive layer is applied to the target area using a coating process.

8. The method for splicing transparent display panels according to any one of claims 1-6, characterized in that, The welding particles are solder particles; and / or The flux material includes ethylene propionic acid, glutaric acid, or glycolic acid; and / or In the adhesive layer, the flux is disposed on the outer surface of the welding particles, or the flux is disposed on the outside of the welding particles or dispersed within the thermosetting adhesive layer.

9. The method for splicing transparent display panels according to any one of claims 1-6, characterized in that, The sub-panel is configured as a transparent OLED display panel.

10. A transparent display panel, characterized in that, The transparent display panel is assembled using the splicing method according to any one of claims 1 to 9.

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