A Micro LED display

Abstract

The present application discloses a Micro LED display screen, which includes a light board and a driving substrate, wherein the light board is arranged opposite to the driving substrate; a first connector is arranged on the side of the light board close to the driving substrate; an isolation component is detachably arranged on the side of the light board close to the driving substrate and is arranged at intervals from the driving substrate; a plurality of supporting and positioning components are arranged at intervals on the side of the isolation component close to the driving substrate and are detachably connected to the driving substrate; a second connector is arranged on the side of the driving substrate close to the light board; the first connector passes through the isolation component and is plugged into and matched with the second connector to realize electrical connection between the light board and the driving substrate, so as to ensure that the light board displays normally while the heat generated on the driving substrate cannot be effectively transferred to the light board through the isolation component, thereby reducing the temperature of the light board.

Description

Technical Field

[0001] The present application relates to the field of display device technology, and in particular to a Micro LED display screen. Background Art

[0002] Micro LED is a next-generation display technology that boasts higher brightness and improved luminous efficiency while consuming less power than existing OLED technology. Micro LED technology, also known as LED miniaturization and matrixing, involves integrating a high-density array of tiny LEDs onto a single chip. Each pixel in an LED display can be addressed and individually illuminated. This can be considered a miniature version of an outdoor LED display, reducing the pixel spacing from millimeters to microns.

[0003] Existing Micro LED displays all use a single-lamp-driver solution, integrating the light board and driver substrate onto a single circuit board. This is driven by a driver IC mounted on the driver substrate, which drives the LED chips on the light board. Due to limitations in the existing light board PCB line width and spacing manufacturing process and the LED chip die bonding process, the significant heat generated by the driver substrate is directly transferred to the light board, causing the temperature of the exposed parts of the light board to exceed specification requirements.

[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0005] The technical problem to be solved by this application is to provide a Micro LED display screen in response to the above-mentioned defects of the prior art, aiming to solve the technical problem in the prior art that the heat generated by the driving substrate is accumulated on the lamp board, resulting in excessive temperature of the lamp board.

[0006] The technical solutions adopted by this application to solve the technical problems are as follows:

[0007] A Micro LED display screen includes a light board and a driving substrate, wherein the light board and the driving substrate are arranged opposite to each other, and further includes:

[0008] A first connector is provided on a side of the light board close to the driving substrate;

[0009] an isolation component, detachably disposed on a side of the lamp board close to the drive substrate and spaced apart from the drive substrate;

[0010] A plurality of supporting and positioning components are spaced apart and arranged on a side of the isolation component close to the driving substrate and are detachably connected to the driving substrate;

[0011] The second connector is arranged on a side of the driving substrate close to the lamp board; the first connector passes through the isolation component and is plugged into and matched with the second connector.

[0012] The Micro LED display screen, wherein the isolation component includes:

[0013] A rigid carrier plate is provided on a side of the lamp board close to the driving substrate and is in contact with the lamp board;

[0014] The insulating and heat-isolating layer is arranged on a side of the rigid carrier plate close to the driving substrate.

[0015] The Micro LED display further includes:

[0016] A first magnetic sheet is disposed on a side of the light board close to the isolation assembly;

[0017] The second magnetic sheet is arranged on a side of the isolation component close to the lamp board and is magnetically attracted to the first magnetic sheet.

[0018] The Micro LED display screen, wherein the first magnetic sheet is embedded in the light board, and the second magnetic sheet is embedded in the isolation component; when the first magnetic sheet and the second magnetic sheet are attracted to each other, the light board and the isolation component are in contact with each other.

[0019] The Micro LED display screen, wherein the light board comprises:

[0020] a circuit board, arranged opposite to the driving substrate;

[0021] A plurality of LED chip units are arranged on a side of the circuit board away from the driving substrate; the LED chip units include a red LED chip, a blue LED chip and a green LED chip.

[0022] The Micro LED display further includes:

[0023] A plurality of driver ICs are disposed on the driver substrate and distributed along a side of the driver substrate close to the circuit board and a side away from the circuit board;

[0024] Each driver IC is connected to at least one LED chip unit.

[0025] The Micro LED display screen, wherein the circuit board is a double-layer circuit board or a multi-layer circuit board.

[0026] The Micro LED display screen, wherein the supporting and positioning assembly comprises:

[0027] a stud, one end of which is connected to the isolation assembly and the other end of which extends toward the drive substrate;

[0028] The tail of the screw passes through the drive substrate and is threadedly connected to the stud; the head of the screw is located on the side of the drive substrate away from the isolation component.

[0029] The Micro LED display screen, wherein the driving substrate is provided with a threaded hole, and the threaded hole cooperates with the screw.

[0030] In the Micro LED display, the isolation component is provided with assembly holes, and the assembly holes correspond to the first connectors one by one and have clearance fit.

[0031] In the present application, the isolation component and the support and positioning component cooperate to isolate the lamp board from the driving substrate, and at the same time, support the lamp board and the driving substrate respectively, so that the lamp board and the driving substrate can be kept in a mutually isolated state; at the same time, the electrical connection between the light board and the driving substrate is achieved through the connection between the first connector and the second connector to ensure that the Micro LED display can display normally, and the heat generated on the driving substrate cannot be effectively transferred to the light board through the isolation component, thereby reducing the temperature of the light board, and solving the problem in the prior art that the heat of the driving substrate accumulates on the light board and causes the light board temperature to be too high. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Schematic diagram of the overall structure of the Micro LED display screen described in this application;

[0033] Figure 2 It is a structural diagram of the light board described in this application;

[0034] Figure 3 is a schematic structural diagram of the isolation assembly described in this application;

[0035] Figure 4 It is a structural schematic diagram of the driving substrate described in this application.

[0036] Description of reference numerals:

[0037] 1-light board; 11-circuit board; 12-LED chip unit; 121-red LED chip; 122-blue LED chip; 123-green LED chip; 2-driver substrate; 20-threaded hole; 3-first connector; 4-isolation component; 40-assembly hole; 41-rigid carrier board; 42-insulating and thermal insulation layer; 5-support and positioning component; 51-stud; 52-screw; 6-second connector; 7-first magnetic sheet; 8-second magnetic sheet; 9-driver IC; 10-central processing unit. DETAILED DESCRIPTION

[0038] To make the purpose, technical solutions and advantages of this application clearer and more explicit, the following further describes this application in detail with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are only used to explain this application and are not intended to limit this application.

[0039] This application provides a Micro LED display screen, such as Figure 1 As shown, the Micro LED display includes: a light board 1, a driving substrate 2, a first connector 3, an isolation component 4, a support and positioning component 5, and a second connector 6; the light board 1 and the driving substrate 2 are arranged opposite to each other, and the light board 1 and the driving substrate 2 are arranged at an interval (that is, a gap is reserved between the light board 1 and the driving substrate 2, and they are not in direct contact).

[0040] In order to isolate the light board 1 from the drive substrate 2, the present application provides the isolation assembly 4 and the support and positioning assembly 5. Specifically, the isolation assembly 4 is located between the light board 1 and the drive substrate 2 and is detachably disposed on the side of the light board 1 near the drive substrate 2. The isolation assembly 4 contacts the light board 1, thereby providing support for the light board 1. The isolation assembly 4 is also spaced apart from the drive substrate 2, so that heat generated by the drive substrate 2 cannot be effectively transferred to the light board 1 through the isolation assembly 4, thereby reducing the temperature of the light board 1.

[0041] The supporting and positioning component 5 is arranged on the side of the isolation component 4 close to the driving substrate 2 and is detachably connected to the driving substrate 2, so that the isolation component 4 and the driving substrate 2 are supported and positioned by the supporting and positioning component 5, so that the isolation component 4 and the driving substrate 2 are kept in a spaced arrangement (that is, a gap is reserved between the isolation component 4 and the driving substrate 2, and there is no direct contact).

[0042] Since the lamp board 1 and the driving substrate 2 are isolated from each other and have no direct contact, in order to achieve electrical connection between the lamp board 1 and the driving substrate 2, the present application also provides the first connector and the second connector 6; specifically, the first connector 3 is arranged on the side of the light board 1 close to the driving substrate 2, and the second connector 6 is arranged on the side of the driving substrate 2 close to the light board 1; the first connector 3 passes through the isolation component 4 and is plugged into and matched with the first connector 3, thereby achieving electrical connection between the light board 1 and the driving substrate 2.

[0043] In the present application, the isolation component 4 and the support and positioning component 5 cooperate to isolate the lamp board 1 from the driving substrate 2, and at the same time, support the lamp board 1 and the driving substrate 2 respectively, so that the lamp board 1 and the driving substrate 2 can be kept in a mutually isolated state; at the same time, the electrical connection between the lamp board 1 and the driving substrate 2 is achieved through the connection between the first connector 3 and the second connector 6 to ensure that the MicroLED display can display normally, and the heat generated on the driving substrate 2 cannot be effectively transferred to the lamp board 1 through the isolation component 4, thereby reducing the temperature of the lamp board 1, and solving the problem in the prior art that the heat of the driving substrate 2 accumulates to the lamp board 1 and causes the temperature of the lamp board 1 to be too high.

[0044] like Figure 1 and Figure 3 As shown, the isolation component 4 includes a rigid carrier plate 41; the rigid carrier plate 41 is arranged on the side of the lamp board 1 close to the driving substrate 2 and is in contact with the lamp board 1; the rigid carrier plate 41 is used to support the lamp board 1, thereby ensuring the flatness of the lamp board 1 and avoiding adverse effects on the display effect of the Micro LED display.

[0045] like Figure 1 and Figure 3 As shown, the isolation component 4 also includes an insulating heat-insulating layer 42; the insulating heat-insulating layer 42 is arranged on the side of the rigid carrier 41 close to the driving substrate 2, and is used to isolate the heat from the direction of the driving substrate 2, effectively reducing or even preventing the heat generated by the driving substrate 2 from being transferred to the rigid carrier 41, thereby achieving the purpose of reducing the accumulated heat from the driving substrate 2 to the lamp board 1.

[0046] In one embodiment of the present application, the thickness of the rigid carrier plate 41 is greater than the thickness of the lamp board 1, thereby increasing the distance between the lamp board 1 and the driving substrate 2 while enhancing the supporting force of the rigid carrier plate 41 on the lamp board 1, and further improving the rigid carrier plate 41's ability to isolate the heat transferred from the driving substrate 2 to the lamp board 1.

[0047] In one embodiment of the present application, the thickness of the insulating heat insulation layer 42 is less than the thickness of the rigid carrier 41, thereby isolating the heat transferred from the driving substrate 2 to the rigid carrier 41 while avoiding the insulating heat insulation layer 42 being too thick, which requires increasing the distance between the driving substrate 2 and the light board 1, thereby causing the entire Micro LED display to be too thick.

[0048] like Figure 1 、 Figure 2 and Figure 3As shown, the Micro LED display further includes a first magnetic sheet 7 and a second magnetic sheet 8; the first magnetic sheet 7 is arranged on the side of the light board 1 close to the isolation component 4, and the second magnetic sheet 8 is arranged on the side of the isolation component 4 close to the light board 1, and is magnetically attracted to the first magnetic sheet 7.

[0049] Specifically, there are multiple first magnetic sheets 7 and multiple second magnetic sheets 8, and the first magnetic sheets 7 and the second magnetic sheets 8 correspond one to one and are magnetically attracted to each other. In this application, the magnetic attraction between the first magnetic sheets 7 and the second magnetic sheets 8 enables the detachable assembly between the isolation assembly 4 and the light board 1; that is, under the action of an external pulling force, the isolation assembly 4 can be separated from the light board 1, thereby facilitating maintenance or replacement of the isolation assembly 4.

[0050] In one embodiment of the present application, the first magnetic sheet 7 is embedded in the lamp board 1, and the second magnetic sheet 8 is embedded in the isolation component 4; when the first magnetic sheet 7 and the second magnetic sheet 8 are attracted to each other, the lamp board 1 and the isolation component 4 are fitted together, so as to ensure the support strength of the isolation component 4 on the lamp board 1 while ensuring the flatness of the lamp board 1, thereby avoiding adverse effects on the display effect of the Micro LED display.

[0051] In one embodiment of the present invention, a first magnetic sheet 7 receiving groove is provided on the side of the lamp board 1 close to the isolation component 4. The first magnetic sheet 7 is assembled in the first magnetic sheet 7 receiving groove, and the first magnetic sheet 7 is flush with the surface of the lamp board 1. A second magnetic sheet 8 receiving groove is provided on the side of the isolation component 4 close to the lamp board 1. The second magnetic sheet 8 is assembled in the second magnetic sheet 8 receiving groove, and the second magnetic sheet 8 is flush with the surface of the isolation component 4. When the isolation component 4 is placed on the side of the lamp board 1 close to the drive substrate 2, the first magnetic sheet 7 and the second magnetic sheet 8 are attracted to each other in a one-to-one correspondence, and the surface of the light board 1 and the surface of the isolation component 4 are in contact with each other.

[0052] like Figure 1 and Figure 2 As shown, the light board 1 includes a circuit board 11 and multiple LED chip units 12. The circuit board 11 is arranged opposite the driver substrate 2 and is used to be attached to the isolation component 4. The multiple LED chip units 12 are arranged on the side of the circuit board 11 away from the driver substrate 2. The LED chip units 12 include a red LED chip 121, a blue LED chip 122, and a green LED chip 123. The circuit board 11 is a double-layer circuit board or a multi-layer circuit board.

[0053] like Figure 1 and Figure 4As shown, the Micro LED display further includes a plurality of driver ICs 9 disposed on the driver substrate 2. Each driver IC 9 is connected to at least one LED chip unit 12, thereby controlling the current of at least one LED chip unit 12 and the luminous intensity of the LED chip unit 12. Specifically, the circuit board 11 and the rigid carrier 41 are bonded to each other, the first magnetic sheet 7 is embedded in the side of the circuit board 11 close to the rigid carrier 41, and the second magnetic sheet 8 is embedded in the side of the rigid carrier 41 close to the circuit board 11.

[0054] Because the plurality of support and positioning components 5 are arranged at intervals along the surface of the isolation component 4, and the isolation component 4 is spaced apart from the drive substrate 2, the driver IC 9 can be arranged in any portion of the drive substrate 2 near the circuit board 11 that is not connected to the support and positioning components 5. Specifically, the plurality of driver ICs 9 are distributed along the side of the drive substrate 2 near the circuit board 11 and the side facing away from the circuit board 11.

[0055] In this application, with the cooperation of the isolation component 4 and the support and positioning component 5, the driving substrate 2 and the light board 1 can be arranged at intervals, so that the side of the driving substrate 2 close to the light board 1 is exposed, so that the driving IC 9 can be installed on the side of the driving substrate 2 close to the circuit board 11 and the side away from the circuit board 11; therefore, the number of driving ICs 9 that can be set on the driving substrate 2 corresponding to the area of ​​the circuit board 11 is greatly increased, meeting the high-density driving IC9 placement requirements corresponding to the high-pixel density light board 1, so that the number of LED chips that can be arranged on the circuit board 11 is increased, thereby doubling the display pixel density of the Micro ELD display screen.

[0056] like Figure 1 and Figure 3 As shown, the support and positioning assembly 5 includes a stud 51 and a screw 52. The stud 51 is disposed on the side of the isolation assembly 4 near the drive substrate 2, with one end of the stud 51 connected to the isolation assembly 4 and the other end extending toward the drive substrate 2. The tail of the screw 52 passes through the drive substrate 2 and is threadedly engaged with the stud 51. The head of the screw 52 is located on the side of the drive substrate 2 facing away from the isolation assembly 4. The threaded engagement of the screw 52 and the stud 51 allows for a detachable connection between the drive substrate 2 and the support and positioning assembly 5 while maintaining a sufficient spacing between the drive substrate 2 and the isolation assembly 4.

[0057] Specifically, the stud 51 is disposed on the side of the rigid carrier plate 41 near the insulating layer 42, passes through the insulating layer 42, and extends toward the drive substrate 2. In one embodiment of the present application, the drive substrate 2 is provided with a threaded hole 20 that mates with the screw 52. The outer diameter of the stud 51 is larger than the inner diameter of the threaded hole 20, so that the stud 51 can support the drive substrate 2 and prevent the distance between the drive substrate 2 and the isolation assembly 4 from changing.

[0058] In one embodiment of this application, Figure 3 As shown, the isolation assembly 4 is provided with an assembly hole 40 that passes through the rigid carrier plate 41 and the insulating layer 42. The assembly hole 40 corresponds one-to-one with the first connector 3. One end of the first connector 3 is fixedly connected to the side of the light board 1 near the rigid carrier plate 41, and the other end passes through the assembly hole 40 and extends outside the assembly hole 40, so that a portion of the first connector 3 protrudes from the surface of the insulating layer 42, thereby facilitating the docking of the first connector 3 with the second connector 6 and improving the convenience of docking between the first connector 3 and the second connector 6.

[0059] In one implementation of the present embodiment, the first connector 3 is clearance-fitted with the assembly hole 40 to prevent the isolation component 4 from contacting and rubbing the first connector 3 during the assembly of the isolation component 4 and the first connector 3, thereby preventing the first connector 3 from being damaged.

[0060] like Figure 1 and Figure 4 As shown, the Micro LED display further includes a central processing unit 10, which is arranged on the driving substrate 2 and located on the side of the driving substrate 2 away from the light board 1; the central processing unit 10 is connected to the driving IC 9.

[0061] In summary, the present application provides a Micro LED display screen, which cooperates with the isolation component and the support and positioning component to isolate the lamp board from the driving substrate, while supporting the lamp board and the driving substrate respectively, so that the lamp board and the driving substrate can be kept in a mutually isolated state; at the same time, through the connection between the first connector and the second connector, the electrical connection between the light board and the driving substrate is realized to ensure that the Micro LED display screen can display normally, and the heat generated on the driving substrate cannot be effectively transferred to the light board through the isolation component, thereby reducing the temperature of the light board, and solving the problem in the prior art that the heat of the driving substrate accumulates on the light board and causes the light board temperature to be too high.

[0062] It should be understood that the application of this application is not limited to the above examples. For ordinary technicians in this field, they can make improvements or changes based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A Micro LED display comprising a light board and a drive substrate, wherein the light board and the drive substrate are arranged opposite to each other, characterized in that: It also includes: A first connector is provided on a side of the light board close to the driver substrate; the light board includes a circuit board and a plurality of LED chip units; the circuit board is arranged opposite to the driver substrate; the plurality of LED chip units are provided on a side of the circuit board away from the driver substrate; the LED chip units include a red LED chip, a blue LED chip, and a green LED chip; an isolation component, detachably disposed on a side of the lamp board close to the drive substrate and spaced apart from the drive substrate; A plurality of supporting and positioning components are spaced apart and arranged on a side of the isolation component close to the driving substrate and are detachably connected to the driving substrate; A second connector is provided on a side of the driving substrate close to the lamp board; the first connector passes through the isolation component and is plugged into and mated with the second connector; A plurality of driver ICs are disposed on the driver substrate and distributed along a side of the driver substrate close to the circuit board and a side away from the circuit board; Each driver IC is connected to at least one LED chip unit.

2. The Micro LED display according to claim 1, wherein: The isolation assembly includes: A rigid carrier plate is provided on a side of the lamp board close to the driving substrate and is in contact with the lamp board; The insulating and heat-isolating layer is arranged on a side of the rigid carrier plate close to the driving substrate.

3. The Micro LED display according to claim 1, wherein: It also includes: A first magnetic sheet is disposed on a side of the light board close to the isolation assembly; The second magnetic sheet is arranged on a side of the isolation component close to the lamp board and is magnetically attracted to the first magnetic sheet.

4. The Micro LED display according to claim 3, wherein: The first magnetic sheet is embedded in the lamp board, and the second magnetic sheet is embedded in the isolation component. When the first magnetic sheet and the second magnetic sheet are attracted to each other, the lamp board and the isolation component are in contact with each other.

5. The Micro LED display according to claim 1, wherein: The circuit board is a double-layer circuit board or a multi-layer circuit board.

6. The Micro LED display according to claim 1, wherein: The support and positioning assembly includes: a stud, one end of which is connected to the isolation assembly and the other end of which extends toward the drive substrate; The tail of the screw passes through the drive substrate and is threadedly connected to the stud; the head of the screw is located on the side of the drive substrate away from the isolation component.

7. The Micro LED display according to claim 6, wherein: The driving substrate is provided with a threaded hole, and the threaded hole matches the screw.

8. The Micro LED display according to claim 1, wherein: The isolation component is provided with an assembly hole, and the assembly hole corresponds to the first connector one by one and has clearance fit.

Images