Acoustic component and electronic device comprising the same

Abstract

An electronic device according to various embodiments of the disclosure can include a first housing structure including a first rear surface cover, a second housing structure providing a motion with respect to the first housing structure, a hinge structure pivotably connecting the first housing structure and the second housing structure from a folded state to an unfolded state, a flexible display configured to be changeable in response to the motion of the second housing structure with respect to the first housing structure, and an acoustic component disposed in the first housing structure and configured to output and input sound. The first housing structure can include at least one opening and a conduit extending from the acoustic component to the opening. The conduit can include a first conduit extending toward a first end portion of the first housing structure, a second conduit branched from the first conduit and extending toward at least a partial area of the first rear surface cover, and a third conduit branched from the first conduit and extending toward at least a partial area of the flexible display.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to acoustic components and electronic devices including such acoustic components. Background Technology

[0002] Due to significant advancements in information and communication technologies, semiconductor technologies, and other fields, the distribution and use of various electronic devices have increased rapidly. In particular, recent electronic devices are being developed that enable users to communicate with each other while carrying them.

[0003] Electronic devices refer to devices that perform specific functions according to programs installed within them, such as electronic dispatchers, portable multimedia players, mobile communication terminals, tablet PCs, image / sound devices, desktop / laptop PCs, vehicle navigation systems, and home appliances. For example, these electronic devices can output information stored within them as sound or images. With the increasing integration of electronic devices and the widespread adoption of ultra-high-speed and high-capacity wireless communications, recently, a single electronic device (e.g., a mobile communication terminal) can be equipped with a variety of functions. For example, in addition to communication functions, functions such as entertainment (e.g., gaming), multimedia (e.g., music / video playback), communication and security functions for mobile banking, schedule management, or e-wallet functions are integrated into a single electronic device. The size of these electronic devices is shrinking to facilitate user portability.

[0004] As mobile communication services expand into multimedia service areas, the size of electronic device displays can be increased to allow users to fully utilize multimedia services as well as voice calls or SMS services. Therefore, foldable displays can be positioned over the entire area of ​​a separate, foldable housing structure. Summary of the Invention

[0005] Technical issues

[0006] In typical mobile electronic devices, speakers and receivers can be mounted separately, or a structure integrating speakers and receivers can be installed. In foldable electronic devices, new structures may be required when applying speakers and receivers to a typical candybar mobile electronic device or integrated structure. For example, depending on the unfolded and folded state of the foldable electronic device, the speakers and receivers or integrated structure may not function when the openings designed for sound transmission are blocked.

[0007] Various embodiments of this disclosure enable the implementation of a speaker / receiver integration component and a structure surrounding the speaker / receiver integration component, which can be easily operated in the unfolded and / or folded state of the foldable electronics.

[0008] Technical solution

[0009] An electronic device according to various embodiments may include: a first housing structure including a first rear surface cover; a second housing structure configured to provide relative movement with respect to the first housing structure; a hinge structure configured to rotatably connect the first housing structure and the second housing structure from a folded state to an unfolded state; a flexible display configured to change in response to relative movement of the second housing structure relative to the first housing structure; and an acoustic component disposed within the first housing structure and configured to output and input sound. The first housing structure may include at least one opening and a conduit extending from the acoustic component to the opening. The conduit may include: a first conduit extending toward a first end of the first housing structure; a second conduit branching from the first conduit and extending toward at least a portion of the first rear surface cover; and a third conduit branching from the first conduit and extending toward at least a portion of the flexible display.

[0010] An electronic device according to various embodiments may include: a first housing structure; a second housing structure configured to provide relative movement with respect to the first housing structure; a hinge structure configured to rotatably connect the first housing structure and the second housing structure from a folded state to an unfolded state; a flexible display configured to change in response to relative movement of the second housing structure relative to the first housing structure; an acoustic component disposed in the first housing structure and configured to input and output sound; and an acoustic enclosure configured to receive the acoustic component and including a first through-hole. The first housing structure may include: a support structure including a second through-hole extending from the first through-hole; and a side frame structure connected to a portion of the support structure and defining an outer surface of the electronic device. The first through-hole and the second through-hole can define a first path through which the sound output from the acoustic component passes, at least a portion of a second path branching from the first path can be defined by the support structure and the side frame structure connected to the support structure, and a third path branching from the first path, different from the second path, can be defined by the support structure and the flexible display.

[0011] Technical effect

[0012] In electronic devices that include acoustic components according to various embodiments of the present disclosure, an acoustic component integrating a speaker / receiver can be provided that can be easily operated when the electronic device is in an unfolded and / or folded state.

[0013] In electronic devices that include acoustic components according to various embodiments of the present disclosure, the internal installation space of the electronic device can be improved and design freedom increased by implementing acoustic components that integrate speakers / receivers.

[0014] In electronic devices that include acoustic components according to various embodiments of the present disclosure, acoustic performance can be enhanced because the acoustic components are implemented in a structure capable of performing forward and / or backward emission relative to the electronic device.

[0015] The effects achievable by this disclosure are not limited to those described above, and based on the following description, those skilled in the art to which this disclosure pertains will clearly understand other effects not described above. Attached Figure Description

[0016] Figure 1 It is a block diagram of an electronic device in a network environment according to various embodiments.

[0017] Figure 2 This is a view showing the unfolded state of a foldable electronic device according to various embodiments of the present disclosure.

[0018] Figure 3 This is a view showing the folded state of a foldable electronic device according to various embodiments of the present disclosure.

[0019] Figure 4 This is an exploded perspective view showing a foldable electronic device according to various embodiments of the present disclosure.

[0020] Figure 5 This is a projection diagram showing acoustic components located in a first housing structure of a foldable electronic device according to various embodiments of the present disclosure.

[0021] Figure 6 This is a perspective view showing the unfolded state of a foldable electronic device in a folded state according to various embodiments of the present disclosure.

[0022] Figure 7 This is a cross-sectional view showing the acoustic component of a first housing structure in an unfolded state of a foldable electronic device according to various embodiments of the present disclosure, as well as the peripheral region of the acoustic component.

[0023] Figure 8 This is a perspective view showing a folded state of a foldable electronic device according to various embodiments of the present disclosure.

[0024] Figure 9 This is a cross-sectional view showing the connection relationship between a first housing structure and a second housing structure in a folded state of a foldable electronic device according to various embodiments of the present disclosure. Detailed Implementation

[0025] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments.

[0026] refer to Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of these components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (e.g., display module 160).

[0027] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) coupled to electronic device 101, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or application processor (AP)) and auxiliary processors 123 (e.g., a graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that are operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 can be adapted to consume less power than the main processor 121, or adapted to perform a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or as part of the main processor 121.

[0028] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 may control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) (but not the main processor 121), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor, or a communication processor) may be implemented as part of another component (e.g., camera module 180, or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware structures specifically for processing artificial intelligence models. Artificial intelligence can be generated through machine learning. Such learning can be performed, for example, by an electronic device 101 that performs artificial intelligence, or via a separate server (e.g., server 108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of these, but is not limited thereto. Additionally or alternatively, the artificial intelligence model can include software structures in addition to hardware structures.

[0029] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0030] The program 140 can be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0031] Input module 150 can receive commands or data from outside the electronic device 101 (e.g., from a user) that will be used by other components of the electronic device 101 (e.g., processor 120). Input module 150 may be, for example, a microphone, mouse, keyboard, keys or (or buttons), or digital pen (e.g., stylus).

[0032] The audio output module 155 can output audio signals to the outside of the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver can be implemented separately from the speaker, or as part of the speaker.

[0033] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuitry system for controlling one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch, or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0034] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) coupled to the electronic device 101 or wirelessly coupled to it.

[0035] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0036] Interface 177 may support one or more specific protocols for directly (e.g., wired) or wirelessly coupling electronic device 101 to external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0037] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0038] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0039] Camera module 180 can capture still or moving images. According to embodiments, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0040] The power management module 188 can manage the power supply to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0041] Battery 189 can power at least one component of electronic device 101. According to embodiments, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0042] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module, or power line communication (PLC) module). One of these communication modules can communicate via a first network 198 (e.g., a short-range communication network, such as Bluetooth). TMThe wireless communication module 192 can communicate with external electronic devices via a Wi-Fi Direct or Infrared Data Association (IrDA) network or a second network 199 (e.g., a long-range communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (e.g., a first network 198 or a second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0043] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable and low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance on high-frequency bands, such as beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or higher) for implementing eMBB, loss coverage (e.g., 164 dB or lower) for implementing mMTC, or U-plane delay (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for the round trip) for implementing URLLC.

[0044] Antenna module 197 can transmit signals or power to or from the exterior of an electronic device (e.g., an external electronic device) or receive signals or power from the exterior of an electronic device (e.g., an external electronic device). According to an embodiment, the antenna module may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (e.g., a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0045] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high-frequency band (e.g., millimeter-wave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving signals of the specified high-frequency band.

[0046] At least some of the aforementioned components can be coupled to each other via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)) and can communicatively transmit signals (e.g., commands or data) between them.

[0047] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 coupled to a second network 199. Each of electronic device 102 and electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic device 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 can request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 can request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. The one or more external electronic devices receiving the request may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0048] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0049] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions for the corresponding embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that, unless the relevant context clearly indicates otherwise, the singular form of a noun corresponding to a term may include one or more things. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items listed together with the corresponding phrase in the phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish corresponding components from one other component and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “coupled to another element (e.g., a second element),” “coupled to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) coupled to the other element, wirelessly coupled to the other element, or coupled to the other element via a third element.

[0050] As used in conjunction with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit system." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0051] The various embodiments set forth herein can be implemented as software (e.g., program 140) comprising one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0052] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (e.g., the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0053] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be run in a different order or omitted, or one or more other operations may be added.

[0054] Figure 2 This is a view showing the unfolded state of a foldable electronic device in a folded state according to various embodiments of the present disclosure. Figure 3 This is a view showing a folded state of a foldable electronic device according to various embodiments of the present disclosure.

[0055] refer to Figure 2 and Figure 3 In an embodiment, the foldable electronic device (hereinafter referred to as "electronic device 101") may include a foldable housing 300 and a hinged outer shell configured to cover the foldable portion of the foldable housing 300 (e.g., Figure 3 The hinge housing 330 (e.g., hinge cover) and the flexible display 200 or foldable display 200 (hereinafter simply referred to as "display 200") disposed in the space defined by the foldable housing 300 (e.g., Figure 1 (Display module 160 in the embodiment). According to the embodiment, the surface on which the display 200 is disposed is defined as the front surface of the electronic device 101. In addition, the surface opposite to the front surface is defined as the rear surface of the electronic device 101. In addition, the surface surrounding the space between the front surface and the rear surface is defined as the side surface of the electronic device 101.

[0056] According to various embodiments, the foldable housing 300 may include a first housing structure 310, a second housing structure 320 including a sensor region 324, a first rear surface cover 380, a second rear surface cover 390, and a hinge structure (e.g., Figure 4 (Hinge structure 510 in the middle). The foldable housing 300 of the electronic device 101 is not limited to... Figure 2 and Figure 3The shapes and components shown are not necessarily those of other parts, but can be achieved by combinations and / or components of different shapes or parts. For example, in another embodiment, the first housing structure 310 and the first rear surface cover 380 may be integral with each other, and the second housing structure 320 and the second rear surface cover 390 may be integral with each other.

[0057] According to various embodiments, the first housing structure 310 may be connected to a hinge structure (e.g., Figure 4 The first housing structure 310 (the hinge structure 510) may include a first surface facing a first direction and a second surface facing a second direction opposite to the first direction. A second housing structure 320 may be connected to the hinge structure 510 and may include a third surface facing a third direction and a fourth surface facing a fourth direction opposite to the third direction. The second housing structure 320 is rotatable relative to the first housing structure 310 about the hinge structure 510. Therefore, the electronic device 101 can be converted into a folded state or an unfolded state. In the folded state, the first surface may face the third surface, and in the unfolded state, the third direction may be the same as the first direction.

[0058] According to various embodiments, the first housing structure 310 and the second housing structure 320 may be positioned on opposite sides around a folding axis A and may have a generally symmetrical shape with respect to the folding axis A. As will be described later, the first housing structure 310 and the second housing structure 320 may have different angles or distances depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state where the electronic device is partially unfolded. According to embodiments, unlike the first housing structure 310, the second housing structure 320 may also include a sensor region 324 in which various sensors are disposed. However, the first housing structure 310 and the second housing structure 320 may have mutually symmetrical shapes in other areas.

[0059] According to various embodiments, such as Figure 2 As shown, the first housing structure 310 and the second housing structure 320 can define a recess therein for accommodating the display 200. According to an embodiment, due to the sensor region 324, the recess can have two or more different widths in a direction perpendicular to the folding axis A.

[0060] According to an embodiment, the recess may have a first width W1 between a first portion 310a of the first housing structure 310 parallel to the folding axis A and a first portion 320a of the second housing structure 320 disposed at the periphery of the sensor region 324. The recess may have a second width W2 defined by a second portion 310b of the first housing structure 310 and a second portion 320b of the second housing structure 320, which is parallel to the folding axis A but does not correspond to the sensor region 324. In this case, the second width W2 may be greater than the first width W1. As another example, the first portion 310a of the first housing structure 310 and the first portion 320a of the second housing structure 320, which are asymmetrical with each other, may define the first width W1 of the recess, and the second portion 310b of the first housing structure 310 and the second portion 320b of the second housing structure 320, which are symmetrical with each other, may define the second width W2 of the recess. According to an embodiment, the first portion 320a and the second portion 320b of the second housing structure 320 may each have different distances from the folding axis A. The width of the recess is not limited to the example shown. In another embodiment, the recess may have multiple widths depending on the shape of the sensor region 324 or on the asymmetrical portions of the first housing structure 310 and the second housing structure 320.

[0061] According to various embodiments, at least a portion of the first housing structure 310 and at least a portion of the second housing structure 320 may be made of a metallic or non-metallic material whose rigidity is selected to support the display 200. The portion made of a metallic material may provide a ground plane for the electronic device 101 and may be electrically connected to a circuit board (e.g., Figure 4 The grounding wire on the board unit 520 in the middle.

[0062] According to various embodiments, the sensor region 324 may be configured to have a predetermined area adjacent to a corner of the second housing structure 320. However, the arrangement, shape, and size of the sensor region 324 are not limited to those arrangements, shapes, and sizes shown in the examples. For example, in another embodiment, the sensor region 324 may be located at another corner of the second housing structure 320, or in any area between the upper and lower corners. In embodiments, components embedded in the electronic device 101 to perform various functions may be exposed on the front surface of the electronic device 101 through the sensor region 324 or through one or more openings provided in the sensor region 324. In various embodiments, the components may include various types of sensors. Sensors may include at least one of, for example, a front-facing camera, a receiver, or a proximity sensor.

[0063] According to various embodiments, a first rear surface cover 380 may be disposed on one side of the folding axis of the rear surface of the electronic device 101 and may have a substantially rectangular periphery, for example, which may be surrounded by a first housing structure 310. Similarly, a second rear surface cover 390 may be disposed on the other side of the folding axis of the rear surface of the electronic device 101, and the periphery of the second rear surface cover 390 may be surrounded by a second housing structure 320.

[0064] According to various embodiments, the first rear cover 380 and the second rear cover 390 may have substantially symmetrical shapes about a folding axis (axis A). However, the first rear cover 380 and the second rear cover 390 need not have mutually symmetrical shapes. In another embodiment, the electronic device 101 may include a first rear cover 380 and a second rear cover 390 having various shapes. In another embodiment, the first rear cover 380 may be integrally constructed with the first housing structure 310, and the second rear cover 390 may be integrally constructed with the second housing structure 320.

[0065] According to various embodiments, a first rear surface cover 380, a second rear surface cover 390, a first housing structure 310, and a second housing structure 320 may define spaces in which various components of the electronic device 101 (e.g., printed circuit boards, or batteries) may be arranged. According to embodiments, one or more components may be arranged on, or visually exposed on, the rear surface of the electronic device 101. For example, at least a portion of the secondary display may be visually exposed through a first rear surface region 382 of the first rear surface cover 380. In another embodiment, one or more components or sensors may be visually exposed through a second rear surface region 392 of the second rear surface cover 390. In various embodiments, the sensors may include a proximity sensor and / or a rear camera.

[0066] According to various embodiments, a front-facing camera visually exposed to the front surface of the electronic device 101 via one or more openings in sensor region 324, or a rear-facing camera exposed via a second rear surface region 392 of the second rear surface cover 390, may include one or more lenses, an image sensor, and / or an image signal processor. A flash may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (e.g., an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 101.

[0067] refer to Figure 3 The hinge housing 330 can be arranged between the first housing structure 310 and the second housing structure 320 to cover internal components (e.g., Figure 4(Hinge structure 510 in the embodiment). According to the embodiment, depending on the state of the electronic device 101 (expanded state, intermediate state, or folded state), the hinge housing 330 may be covered by a portion of the first housing structure 310 and a portion of the second housing structure 320, or may be exposed to the outside.

[0068] According to the embodiments, such as Figure 2 As shown, when the electronic device 101 is in the unfolded state, the hinge housing 330 is not exposed because it is covered by the first housing structure 310 and the second housing structure 320. As another example, such as... Figure 3 As shown, when the electronic device 101 is in a folded state (e.g., a fully folded state), the hinge housing 330 may be exposed to the outside between the first housing structure 310 and the second housing structure 320. As another example, when the first housing structure 310 and the second housing structure 320 are in an intermediate state folded at an angle therebetween, the hinge housing 330 may be partially exposed to the outside between the first housing structure 310 and the second housing structure 320. However, in this case, the exposed area may be smaller than the area exposed in the fully folded state. In embodiments, the hinge housing 330 may include a curved surface.

[0069] According to various embodiments, the display 200 can be arranged within a space defined by the foldable housing 300. For example, the display 200 can be situated in a recess defined by the foldable housing 300 and can constitute a large portion of the front surface of the electronic device 101. Therefore, the front surface of the electronic device 101 can include the display 200 and a portion of the first housing structure 310 adjacent to the display 200 and a portion of the second housing structure 320 adjacent to the display 200. Additionally, the rear surface of the electronic device 101 can include a first rear surface cover 380, a portion of the first housing structure 310 adjacent to the first rear surface cover 380, a second rear surface cover 390, and a portion of the second housing structure 320 adjacent to the second rear surface cover 390.

[0070] According to various embodiments, display 200 may refer to a display in which at least some area can be transformed into a flat surface or a curved surface. According to embodiments, display 200 may include a folded region 203, disposed on one side of the folded region 203 (e.g., Figure 2 The first region 201 on the left side of the folded region 203 shown, and the region on the other side of the folded region 203 (e.g., Figure 2 The second region 202 is located on the right side of the folded region 203 shown.

[0071] However, Figure 2The area division of the display 200 shown is exemplary, and the display 200 can be divided into multiple (e.g., four or more, or two) areas according to its structure or function. For example, in Figure 2 In the illustrated embodiment, the area of ​​display 200 may be divided by folded region 203 or a folding axis (axis A) extending parallel to the y-axis. However, in another embodiment, the area of ​​display 200 may be divided based on another folded region (e.g., a folded region parallel to the x-axis) or another folding axis (e.g., a folding axis parallel to the x-axis). According to embodiments, display 200 may be coupled to or arranged adjacent to touch sensing circuitry, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer capable of detecting a magnetic field type stylus.

[0072] According to various embodiments, the first region 201 and the second region 202 may have shapes that are substantially symmetrical about the folded region 203. However, unlike the first region 201, the second region 202 may include a notch cut due to the presence of the sensor region 324, but the second region 202 may have a shape symmetrical to the first region 201 in regions other than the sensor region. In other words, the first region 201 and the second region 202 may include portions with mutually symmetrical shapes and portions with mutually asymmetrical shapes.

[0073] In the following text, the operation of the first housing structure 310 and the second housing structure 320 and the various areas of the display 200 will be described depending on the state of the electronic device 101 (e.g., unfolded state, folded state, or intermediate state).

[0074] According to various embodiments, when the electronic device 101 is in an unfolded state (e.g., Figure 2 When the first housing structure 310 and the second housing structure 320 are arranged to form a 180-degree angle therebetween and face the same direction, the surfaces of the first region 201 and the second region 202 of the display 200 form a 180-degree angle relative to each other and can face the same direction (e.g., the forward direction of the electronic device). The folding region 203 can form a coplanar plane with the first region 201 and the second region 202.

[0075] According to various embodiments, when the electronic device 101 is in a folded state (e.g., Figure 3 When the first housing structure 310 and the second housing structure 320 are arranged to face each other, the surfaces of the first region 201 and the second region 202 of the display 200 may face each other when forming a narrow angle (e.g., between 0 and 10 degrees) relative to each other. At least a portion of the folded region 203 may form a curved surface with a predetermined curvature.

[0076] According to various embodiments, when the electronic device 101 is in an intermediate state, the first housing structure 310 and the second housing structure 320 can be arranged to form a predetermined angle relative to each other. The angle formed by the surfaces of the first region 201 and the second region 202 of the display 200 can be greater than the angle in the folded state and less than the angle in the unfolded state. At least a portion of the folded region 203 can form a curved surface with a predetermined curvature, and in this case, the curvature can be less than the curvature in the folded state.

[0077] According to various embodiments, the electronic device 101 may include an inward-folding type or an outward-folding type. An inward-folding type may refer to a state where the flexible display 200 is not exposed to the outside when fully folded. As another example, an inward-folding type may refer to a state where the flexible display 200 is folded forward. An outward-folding type may refer to a state where the flexible display 200 is exposed to the outside when fully folded. As another example, an outward-folding state may refer to a state where the flexible display 200 is folded backward.

[0078] Figure 4 This is an exploded perspective view showing a foldable electronic device according to various embodiments of the present disclosure.

[0079] refer to Figure 4 In various embodiments, the foldable electronic device (hereinafter referred to as "electronic device" 101) may include a foldable housing, a flexible display (hereinafter referred to as "display" 200), and a board unit 520. The foldable housing may include a first housing structure 310, a second housing structure 320, a first rear surface cover 380, a second rear surface cover 390, a support assembly 40, and a hinge structure 510. The first housing structure 310 may include a first housing 312 and a portion of the support assembly 40 (e.g., a first support 40a), and the second housing structure 320 may include a second housing 322 and a portion of the support assembly 40 (e.g., a second support 40b).

[0080] According to various embodiments, the display 200 may include a display panel 200b (e.g., a flexible display panel) and at least one plate or layer (e.g., a support plate 240) on which the display panel 200b is situated. In embodiments, the support plate 240 may be disposed between the display panel 200b and the support assembly 40. An adhesive structure (not shown) may be located between the support plate 240 and the support assembly 40, and may bond the support plate 240 to the support assembly 40.

[0081] According to various embodiments, the support assembly 40 may include a first support 40a and a second support 40b, and a hinge structure 510 may be disposed between the first support 40a and the second support 40b. The hinge structure 510 may include a hinge housing 330 to cover the hinge disposed therein. As another example, a printed circuit board (e.g., a flexible printed circuit board (FPC)) may be disposed across the first support 40a and the second support 40b.

[0082] According to various embodiments, board unit 520 may include a first main circuit board 521 disposed on the side of the first bracket 40a and a second main circuit board 522 disposed on the side of the second bracket 40b. The first main circuit board 521 and the second main circuit board 522 may be arranged within a space defined by bracket assembly 40, first housing structure 310, second housing structure 320, first rear surface cover 380 and second rear surface cover 390. Components for implementing various functions of electronic device 101 may be mounted on the first main circuit board 521 and the second main circuit board 522.

[0083] According to various embodiments, the first housing 312 and the second housing 322 can be assembled to be coupled to opposite sides of the support assembly 40 when the display 200 is coupled to the support assembly 40. For example, the first housing 312 can be coupled by sliding from one side of the first support 40a, and the second housing 322 can be coupled by sliding from one side of the second support 40b.

[0084] According to an embodiment, the first housing structure 310 may include a first rotary support surface 311 disposed at one end of the first housing 312, and the second housing structure 320 may include a second rotary support surface 321 disposed at one end of the second housing 322 and corresponding to the first rotary support surface 311. The first rotary support surface 311 and the second rotary support surface 321 may include curved surfaces, each curved surface corresponding to a curved surface included in the hinge housing 330.

[0085] According to an embodiment, when the electronic device 101 is in an unfolded state (e.g., Figure 2 When the electronic device 101 is folded (e.g., in the case of an electronic device 101), the first rotary support surface 311 and the second rotary support surface 321 can cover the hinge housing 330, so that the hinge housing 330 is not exposed to the rear surface of the electronic device 101, or is minimally exposed to the rear surface of the electronic device 101. As another example, when the electronic device 101 is in a folded state (e.g., in the case of an electronic device 101), the first rotary support surface 311 and the second rotary support surface 321 can cover the hinge housing 330, so that the hinge housing 330 is not exposed to the rear surface of the electronic device 101, or is minimally exposed to the rear surface of the electronic device 101. Figure 3 When the electronic device is in use, the first rotating support surface 311 and the second rotating support surface 321 can rotate along the curved surface included in the hinge housing 330, so that the hinge housing 330 can be exposed to the rear surface of the electronic device 101 to the greatest extent.

[0086] Figure 5 This is a projection diagram showing acoustic components located in a first housing structure of a foldable electronic device according to various embodiments of the present disclosure.

[0087] According to various embodiments, electronic devices (e.g., Figures 1 to 4 The electronic device 101 in the middle may include a first housing structure 310 and a second housing structure (e.g., Figure 2 and Figure 3 The second housing structure 320 in the middle) and the acoustic component 410. According to an embodiment, in the electronic device 101, a flexible display (e.g., Figure 2 and Figure 3 The flexible display 200 can be positioned facing the front of the electronic device 101, and the first housing structure 310 (and / or the second housing structure 320) can be positioned facing the back and sides of the electronic device 101. The first housing structure 310 may include a support structure 430 configured to provide seating space for the acoustic components 410 and the soundproof enclosure 420, and a side frame structure 440 defining the outer surface of the first housing structure 310.

[0088] Figure 5 The configuration of the first housing structure 310 and the acoustic component 410 can be wholly or partially integrated with... Figures 2 to 4 The configuration of the first shell structure 310 and Figure 1 The configuration of the audio module 170 is the same.

[0089] According to various embodiments, the electronic device 101 may include an acoustic component 410. The acoustic component 410 may be disposed within a first housing structure 310 (or a second housing structure 320). The acoustic component 410 may have a structure in which a speaker structure and a receiver structure are integrated, and may be arranged adjacent to one end of the first housing structure 310. For example, the acoustic component 410 may include components configured to generate sound based on electrical signals and / or components configured to convert sound into electrical signals. As another example, multiple acoustic components 410 may be manufactured, and the multiple acoustic components 410 may be arranged adjacent to the upper and / or lower ends of the electronic device 101.

[0090] According to various embodiments, electronic device 101 may include a soundproof enclosure 420 housing acoustic components 410. The soundproof enclosure 420 may include a resonant space configured to provide sound resonance (e.g., Figure 7 The resonant space 421 in the acoustic component 410 and the sound-emitting hole configured to transmit vibrations generated in the acoustic component 410 to the external sound-emitting hole (e.g., Figure 6 and Figure 7 The first opening 451) of the conduit (not shown) and the through hole (e.g., Figure 7 The first through hole 601a in the first housing structure 310). The radiation hole can also be connected to the acoustic emission hole which is set adjacent to the side frame structure 440 of the first housing structure 310 to emit sound generated by the acoustic component 410 or to transmit sound supplied from the outside to the acoustic component 410.

[0091] Figure 6 This is a perspective view showing the unfolded state of a foldable electronic device in a folded state according to various embodiments of the present disclosure. Figure 7 This is a cross-sectional view showing the acoustic component of a first housing structure in an unfolded state of a foldable electronic device according to various embodiments of the present disclosure, as well as the peripheral region of the acoustic component. Figure 7 yes Figure 6 A cross-sectional view of the lower region S1 of the foldable electronic device along line A-A'.

[0092] According to various embodiments, electronic devices (e.g., Figures 1 to 4 The electronic device 101 may include a first housing structure 310, a second housing structure 320, a flexible display 200, and an acoustic component 410. According to an embodiment, in the electronic device 101, the flexible display 200 may be positioned facing the front of the electronic device 101, and the first housing structure 310 (and / or the second housing structure 320) may be positioned facing the back and sides of the electronic device 101. For example, the first housing structure 310 may include a first rear surface cover 380 positioned facing the back of the electronic device 101 and a side frame structure 440 disposed along the side surface of the electronic device 101.

[0093] Figure 6 and Figure 7 The construction of the first housing structure 310, the second housing structure 320, the flexible display 200, and the acoustic component 410 can be wholly or partially integrated with... Figure 5 The first housing structure 310, the second housing structure 320, the flexible display 200, and the acoustic component 410 have the same structure.

[0094] According to various embodiments, electronic device 101 may include acoustic component 410. Electronic device 101 may also include a soundproof enclosure 420 configured to emit sound generated by acoustic component 410, and some structures of first housing structure 310 (e.g., support structure 430 and side frame structure 440). First housing structure 310 may include first housing 312 (e.g., Figure 4 The first housing 312) and the first support 40a (e.g., Figure 4 The first bracket 40a), wherein the support structure 430 can be a part of the first bracket 40a, and the side frame structure 440 can be a part of the first housing 312.

[0095] According to an embodiment, the acoustic component 410 may be disposed within the first housing structure 310 (or the second housing structure 320). The acoustic component 410 may have a configuration in which a speaker structure and a receiver structure are integrated, and may be disposed in a region (e.g., a side frame structure 440) adjacent to the periphery of the first housing structure 310 and in which an opening is provided, to emit sound to the outside or receive sound generated by the outside.

[0096] According to various embodiments, a soundproof enclosure 420 may be disposed within a first housing 312, may accommodate acoustic components 410, and may include a first through-hole 601a configured to provide a sound channel. A support structure 430 may be disposed within the first housing 312 to integrally support the electronic device 101, and a portion of the support structure 430 may include a second through-hole 601b extending from the first through-hole 601a. ​​At least a portion of the support structure 430 may be disposed between the soundproof enclosure 420 and the flexible display 200, and may provide a surface thereon on which the soundproof enclosure 420 is disposed.

[0097] According to various embodiments, the electronic device 101 may further include a gasket 470 disposed between the soundproof enclosure 420 and the support structure 430. For example, a first through-hole 601a of the soundproof enclosure 420 and a second through-hole 601b of the support structure 430 may be connected to each other to define a first conduit 601, and the gasket 470 may be located between the first through-hole 601a of the soundproof enclosure 420 and the second through-hole 601b of the support structure 430. On one surface of the gasket 470, an adhesive member 480 (and / or a membrane member) may be configured to engage with the soundproof enclosure 420 and / or the support structure 430.

[0098] According to various embodiments, the soundproof enclosure 420 may include a resonant space 421 extending into it along a first through-hole 601a, and a seating surface 422 on which a pad 470 sits along the periphery of the first through-hole 601a. ​​According to embodiments, the resonant space 421 is configured as an empty space adjacent to the acoustic component 410 and can generate sound resonance. For example, based on the size (e.g., volume) of the resonant space 421, the performance of the acoustic module can be improved in the bass frequency band (e.g., the 200 to 800 Hz band). As another example, the volume in the bass frequency band can be increased based on the size of the resonant space 421. According to embodiments, the seating surface 422 may be configured in a closed-loop shape such that a peripheral area of ​​the pad 470 can sit thereon. The seating surface 422 is a circumferential surface adjacent to the first through-hole 601a and may be provided as a sloped surface. For example, the inclined surface may provide a first predetermined slope (e.g., between 0 and 90 degrees) relative to the flexible display 200 (or the first rear surface cover 380), and the pad 470 situated on the inclined surface may also be positioned while providing the first predetermined slope. According to another embodiment, at least a portion of the inner wall of the soundproof enclosure 420 for the first through-hole 601a may provide an inclined surface corresponding to the first predetermined slope.

[0099] According to various embodiments, a gasket 470 may be disposed on and engaged with the mounting surface 422 of the soundproof enclosure 420, and the interior of the soundproof enclosure 420 may be sealed from the exterior of the electronic device 101 (e.g., from the exterior direction of the support structure 430) to prevent the transmission of externally applied foreign matter to the acoustic component 410. According to embodiments, the gasket 470 may comprise a flexible material to provide variability (e.g., elasticity) relative to external pressure. According to embodiments, the gasket 470 may comprise a plurality of openings (not shown). The plurality of openings may provide ventilation to the exterior of the electronic device 101, and channel function for the propagation or introduction of sound from the speaker / receiver to or from the exterior via the first conduit 601. According to embodiments, an adhesive member 480 may be disposed along the periphery of the gasket 470 and engaged with a surface of the support structure 430 corresponding to the mounting surface 422 of the soundproof enclosure 420. The adhesive member 480 can provide a function of sealing the internal space from the outside by shielding the fluid entering the gap between the gasket 470 and the support structure 430.

[0100] According to various embodiments, the support structure 430 may include a second through-hole 601b extending from the first through-hole 601a, and the second through-hole 601b may branch into a second conduit 602 and a third conduit 603 pointing in different directions. At least a portion of the inner wall of the support structure 430 for the second through-hole 601b may provide a second predetermined slope different from the first predetermined slope. For example, the second predetermined slope may be provided in a direction parallel to the flexible display 200 (or the first rear surface cover 380).

[0101] According to an embodiment, the second conduit 602 may be a channel configured to extend from the first conduit 601 toward the side of the first rear surface cover 380 of the first housing structure 310. For example, the inner wall defining the second conduit 602 may be configured using a support structure 430 and / or a side frame structure 440 connected to the support structure 430, and the first opening 451 located at the outermost end of the second conduit 602 may be defined by a recessed region R of the first rear surface cover 380 and a first end E1 of the side frame structure 440 (e.g., a portion adjacent to the first rear surface cover 380). For example, a portion of the inner wall of the second conduit 602 may be a portion of the support structure 430, and another portion of the inner wall may be a portion of the side frame structure 440 connected to the support structure 430. Sound generated by the acoustic component 410 may pass through the first through-hole 601a and the second through-hole 601b of the first conduit 601, may move along the second conduit 602, and may then be emitted through the first opening 451.

[0102] According to an embodiment, the third conduit 603 may be a channel extending from the first conduit 601 toward the flexible display 200 side of the electronic device 101. For example, the inner wall defining the third conduit 603 may be configured using a support structure 430 and / or a side frame structure 440, and a second opening 452 located at the outermost end of the third conduit 603 may be defined by a second end E2 of the side frame structure 440 (e.g., the portion adjacent to the flexible display 200). For example, the third conduit 603 may have a structure that penetrates at least a portion of the support structure 430 and then extends to the second opening 452, which penetrates the side frame structure 440. As another example, at least a portion of the third conduit 603 may be configured to be adjacent to the flexible display 200, or a portion of the inner wall of the third conduit 603 may be configured using the flexible display 200. Sound generated by the acoustic component 410 may pass through the first through-hole 601a and the second through-hole 601b of the first conduit 601, may move along the third conduit 603, and may then be emitted through the second opening 452.

[0103] According to various embodiments, when the electronic device 101 is in the deployed state, the sound generated by the acoustic component 410 can be emitted forward P1 and backward P2. For example, the first sound generated by the acoustic component 410 can pass through a first path (e.g., a path extending from the first conduit 601 to the first opening 451 via the first conduit 601 and the second conduit 602) and can be emitted to the outside of the first rear surface cover 380 side (e.g., emitted backward P2). As another example, the second sound generated by the acoustic component 410 can pass through a second path (e.g., a path extending from the first conduit 601 and the third conduit 603 to the second opening 452) and can be emitted to the outside of the flexible display 200 side (e.g., emitted forward P1).

[0104] According to various embodiments, the electronic device 101 may include multiple acoustic components. For example, the electronic device 101 may include an acoustic component 410 disposed inside the lower end region S1 of the first housing structure 310 and another acoustic component (not shown) disposed inside the upper end region S2. The above description of the acoustic component 410 refers to one acoustic component 410 disposed at the lower end of the electronic device 101, but it can be applied to another acoustic component. According to an embodiment, in the unfolded state of the electronic device 101, the sound generated by the acoustic component 410 and the sound generated by the other acoustic component can be emitted forward P1 and backward P2, respectively.

[0105] Figure 8 This is a perspective view showing a folded state of a foldable electronic device according to various embodiments of the present disclosure.

[0106] Figure 9 This is a cross-sectional view showing the connection relationship between a first housing structure and a second housing structure in a folded state of a foldable electronic device according to various embodiments of the present disclosure. Figure 9 yes Figure 8 A cross-sectional view of the lower region S1 of the foldable electronic device along line B-B'.

[0107] According to various embodiments, electronic devices (e.g., Figures 1 to 4 The electronic device 101 may include a first housing structure 310, a second housing structure 320, a flexible display 200, and an acoustic component 410. According to an embodiment, in the electronic device 101, the flexible display 200 is bent such that at least some portions of the flexible display 200 are positioned facing each other, and the first housing structure 310 (and / or the second housing structure 320) may be positioned facing the back (or front) and sides of the electronic device 101.

[0108] Figure 8 and Figure 9The construction of the first housing structure 310, the second housing structure 320, and the flexible display 200 can be consistent with... Figures 2 to 4 The first housing structure 310, the second housing structure 320 and the flexible display 200 are completely or partially identical in construction.

[0109] Figure 8 and Figure 9 The acoustic components, soundproof enclosure 420, support structure 430, and side frame structure 440 can be constructed in accordance with... Figures 5 to 7 The acoustic components, soundproof enclosure 420, support structure 430, and side frame structure 440 are constructed in a manner that is completely or partially identical. The differences will be described below.

[0110] According to various embodiments, when the foldable electronic device is in a folded state, the first housing structure 310 and the second housing structure 320 can be configured to face each other at least partially. For example, the first region 201 of the flexible display 200 corresponding to the first housing structure 310 and the second region 202 of the flexible display 200 corresponding to the second housing structure 320 can be configured to face each other, and the first rear surface cover 380 of the first housing structure 310 and the second rear surface cover 390 of the second housing structure 320 can be configured to face each other.

[0111] According to various embodiments, the damper structure 490 may be disposed in a portion of the side frame structure 440a of the second housing structure 320. When the foldable electronics is in a folded state, the damper structure 490 may be located in a region corresponding to the second opening 452 of the first housing structure 310. Compared to other regions of the side frame structure 440a of the second housing structure 320, the damper structure 490 may protrude to the outside and may include a flexible material to provide variability (e.g., elasticity) relative to external pressure.

[0112] According to various embodiments, the damper structure 490 can be designed to restrict the function of the third conduit 603 extending from the acoustic component 410 through the first conduit 601 when the foldable electronics are in a folded state. According to an embodiment, when the foldable electronics are in a folded state, the damper structure 490 of the second housing structure 320 can be configured to surround the second opening 452 of the first housing structure 310. For example, the damper structure 490 can have a closed-loop shape projecting toward the first housing structure 310 and can be configured to press against the periphery of the second opening 452 and shield the second opening 452 from the outside due to elasticity. According to another embodiment, when the foldable electronics are in a folded state, the damper structure 490 of the second housing structure 320 can be configured to be inserted into the second opening 452 of the first housing structure 310. For example, the damper structure 490 can be designed to project toward the first housing structure 310 and have dimensions corresponding to the size of the second opening 452 so as to shield the second opening 452 from the outside when inserted into it.

[0113] When a user makes a call using the foldable electronic device, the device is typically in a folded state. In this case, the second opening 452, which is one of the sound channels in the first housing structure 310, can be configured to be substantially adjacent to the side frame structure 440a of the second housing structure 320. Therefore, when the foldable electronic device is in a folded state, noise may be generated in the sound to be transmitted or provided to the acoustic component 410 due to the unnecessary second opening 452. In the foldable electronic device according to this disclosure, sound quality can be improved by designing the damper structure 490 on the side frame structure 440a of the second housing structure 320 to limit the use of the third conduit 603 in the first housing structure 310 (e.g., shielding the sound path).

[0114] According to various embodiments, the electronic device 101 may include multiple acoustic components. For example, the electronic device 101 may include an acoustic component 410 disposed inside the lower end region S1 of the first housing structure 310 and another acoustic component (not shown) disposed inside the upper end region S2. The above description of the acoustic component 410 refers to one acoustic component 410 disposed at the lower end of the electronic device 101, but it can be applied to another acoustic component. According to an embodiment, in the folded state of the electronic device 101, the sound generated by each of the acoustic component 410 and the other acoustic component is emitted rearward P2 (e.g., in the direction facing the first rear surface cover 380), and the emission forward P1 can be limited.

[0115] According to various embodiments, depending on the unfolded state (e.g., see...), Figure 6 and Figure 7 ) and folded state (for example, see Figure 8 and 9 The electronic device 101 can provide different acoustic operating modes. For example, when the electronic device 101 is unfolded, the acoustic component 410 can operate in speaker mode, and when the electronic device 101 is folded, the acoustic component 410 can operate in speaker mode or receiver mode according to the user's selection. According to another embodiment, the speaker mode and / or receiver mode can provide different output voltages.

[0116] According to various embodiments, when the electronic device 101 is folded for making calls, the user can send and receive calls in any direction via integrated acoustic components located in the lower region S1 and the upper region S2. The electronic device 101 can determine its state (e.g., location) via sensor modules (e.g., accelerometers and / or geomagnetic sensors) disposed therein, and can provide short-range sending / receiving suitable for the user. For example, when the user's mouth is in the lower region S1 and the user's ear is in the upper region S2, the sensor module can determine the state of the electronic device such that the acoustic component in the lower region S1 can operate as a microphone, and the acoustic component in the upper region S2 can operate as a speaker. As another example, when the user's ear is in the lower region S1 and the user's mouth is in the upper region S2, the sensor module can determine the state of the electronic device such that the acoustic component in the lower region S1 can operate as a speaker, and the acoustic component in the upper region S2 can operate as a microphone.

[0117] Electronic devices according to various embodiments of the present disclosure (e.g., Figures 1 to 4 The electronic device 101 in the middle may include: a first housing structure (e.g., Figure 2 and Figure 3 The first housing structure 310 in the first housing structure includes a first rear surface cover (e.g., Figure 7 The first rear surface cover 380); the second housing structure (e.g., Figure 2 and Figure 3 The second housing structure 320 in the first housing structure is configured to provide relative movement with respect to the first housing structure; a hinge structure (e.g., Figure 4 The hinge structure 510 in the figure is configured to rotatably connect the first housing structure and the second housing structure from a folded state to an unfolded state; flexible display (e.g., Figure 4 The flexible display 200 is configured to change in response to relative movement of the second housing structure relative to the first housing structure; and acoustic components (e.g., Figure 7The acoustic component 410 is disposed within the first housing structure and configured to output and input sound. The first housing structure may include at least one opening and a conduit extending from the acoustic component to the opening, and the conduit may include: a first conduit extending toward a first end of the first housing structure (e.g., Figure 7 The first conduit 601 in the middle), and the second conduit branching out from the first conduit and extending toward at least a portion of the first rear surface cover (e.g., Figure 7 The second conduit 602 in the first conduit, and a third conduit branching from the first conduit and extending toward at least a portion of the flexible display (e.g., Figure 7 The third catheter 603 in the middle.

[0118] According to various embodiments, in the unfolded state, the radiation direction of the first sound generated by the acoustic component can be set to point outward along the second conduit toward the rear surface cover side, and the radiation direction of the second sound generated by the acoustic component is set to point outward along the third conduit toward the flexible display side.

[0119] According to various embodiments, in the folded state, the radiation direction of the first sound generated by the acoustic component is directed outward along the second conduit towards the rear surface cover side, and the path leading outward along the third conduit is restricted.

[0120] According to various embodiments, the acoustic component is designed in a manner that integrates a speaker structure and a receiver structure.

[0121] According to various embodiments, the electronic device may also include a soundproof enclosure (e.g., Figure 7 The soundproof enclosure 420 is configured to provide space for accommodating the acoustic components and includes a first through-hole configured as a channel for providing sound generated by the acoustic components (e.g., Figure 7 The first through hole 601a in the middle).

[0122] According to various embodiments, the first housing structure may include: a side frame structure (e.g., Figure 7 The side bezel structure 440 is configured such that at least a portion of it covers the outer surface of the electronic device; and the support structure (e.g., Figure 7 The support structure 430 is configured to be adjacent to the side frame structure and includes a second through hole extending from the first through hole (e.g., ...). Figure 7 (Second through hole 601b in the middle).

[0123] According to various embodiments, the first through-hole in the soundproof enclosure and the second through-hole in the support structure can be connected to each other to provide the first conduit, and the electronic device may also include a gasket (e.g., Figure 7 The gasket 470 is disposed between the first through hole in the soundproof enclosure and the second through hole in the support structure.

[0124] According to various embodiments, the inner wall of the second conduit may be provided by a portion of the support structure and / or a portion of the side frame structure.

[0125] According to various embodiments, the first opening at the outermost end of the second conduit may be defined by a recessed area of ​​the rear surface cover and a first end of the side frame structure. A first path for sound generated by the acoustic component may be configured such that the sound passes through the first and second through-holes in the first conduit, moves along the second conduit, and is then emitted to the outside through the first opening.

[0126] According to various embodiments, the inner wall of the third conduit may be provided by a portion of the support structure and / or a portion of the side frame structure.

[0127] According to various embodiments, a second opening located at the outermost end of the third conduit can be defined in a second end of the side frame structure adjacent to the flexible display. A second path for sound generated by the acoustic component can be configured such that the sound passes through the first and second through-holes in the first conduit, moves along the third conduit, and is then emitted to the outside through the second opening.

[0128] According to various embodiments, the third conduit may have a structure that penetrates at least a portion of the support structure and then extends to the second opening that penetrates the side frame structure.

[0129] According to various embodiments, the first housing structure may include a second opening configured adjacent to the flexible display and located at the outermost end of the third conduit. The second housing structure may include a damper structure disposed in a region corresponding to the second opening in the first housing structure when the electronic device is in the folded state.

[0130] According to various embodiments, the damper structure may be configured to surround the second opening, or to protrude from a surface of the second housing structure and be inserted into the second opening, to shield the second opening from the external environment of the electronic device.

[0131] According to various embodiments, the soundproof cover may include an inclined surface disposed along a circumferential surface adjacent to the first through hole, the inclined surface providing a first predetermined slope relative to the first rear surface cover, and the gasket may be disposed on the inclined surface.

[0132] An electronic device according to various embodiments may include: a first housing structure; a second housing structure configured to provide relative movement with respect to the first housing structure; a hinge structure configured to rotatably connect the first housing structure and the second housing structure from a folded state to an unfolded state; a flexible display configured to change in response to relative movement of the second housing structure relative to the first housing structure; an acoustic component disposed in the first housing structure and configured to input and output sound; and a soundproof enclosure configured to receive the acoustic component and including a first through-hole. The first housing structure may include: a support structure including a second through-hole extending from the first through-hole; and a side frame structure connected to a portion of the support structure and defining an outer surface of the electronic device. The first through-hole and the second through-hole may define a first path through which sound output from the acoustic component travels, at least a portion of a second path branching from the first path may be defined by the support structure and the side frame structure connected to the support structure, and a third path branching from the first path, different from the second path, may be defined by the support structure and the flexible display.

[0133] According to various embodiments, in the unfolded state, the radiation direction of the first sound generated by the acoustic component can be directed along the second path to the outside of the rear surface cover side of the electronic device, and the radiation direction of the second sound generated by the acoustic component can be directed along the third path to the outside of the flexible display side.

[0134] According to various embodiments, in the folded state, the radiation direction of the first sound generated by the acoustic component is directed outward along the second conduit towards the rear surface cover side, and the path directed outward along the third conduit is restricted.

[0135] According to various embodiments, the acoustic component may be designed in a manner that integrates a speaker structure and a receiver structure.

[0136] According to various embodiments, the first housing structure may include an opening configured to be adjacent to and connected to the outside of the flexible display. The second housing structure may include a damper structure disposed in a region corresponding to the opening of the first housing structure when the electronic device is in the folded state, and configured to shield the opening.

[0137] It will be clear to those skilled in the art to which this disclosure pertains that the acoustic components and electronic devices including the acoustic components according to various embodiments are not limited to the above embodiments and drawings, and that various substitutions, modifications and changes can be made within the scope of the technology disclosed.

Claims

1. An electronic device, the electronic device comprising: A first housing structure, the first housing structure including a first rear surface cover; A second housing structure is configured to provide relative movement with respect to the first housing structure, such that the electronic device can be switched to a folded or unfolded state. A hinge structure configured to rotatably connect the first housing structure and the second housing structure from the folded state to the unfolded state; A flexible display, the flexible display being configured to change in response to relative movement of the second housing structure relative to the first housing structure; as well as An acoustic component, disposed within the first housing structure, is configured to output and input sound. The first housing structure includes at least one opening and a conduit extending from the acoustic component to the at least one opening. The conduit includes: a first conduit extending toward a first end of the first housing structure; a second conduit branching off from the first conduit and extending toward at least a portion of the first rear surface cover; and a third conduit branching off from the first conduit and extending toward at least a portion of the flexible display. In the unfolded state, the radiation direction of the first sound generated by the acoustic component points outward along the second conduit toward the outside of the first rear surface cover side, and the radiation direction of the second sound generated by the acoustic component points outward along the third conduit toward the outside of the flexible display side. In the folded state, the radiation direction of the first sound generated by the acoustic component is directed outward along the second conduit towards the side of the first rear surface cover, and the path leading outward along the third conduit is restricted.

2. The electronic device according to claim 1, wherein, The acoustic component is formed by integrating a loudspeaker structure and a receiver structure.

3. The electronic device according to claim 1, further comprising: A soundproof enclosure, the soundproof enclosure being configured to provide space for accommodating the acoustic components, and including a first through-hole providing a channel for sound generated by the acoustic components.

4. The electronic device according to claim 3, wherein, The first housing structure includes: A side bezel structure, the side bezel structure being configured such that at least a portion thereof covers the outer surface of the electronic device; and A support structure is configured to be adjacent to the side frame structure and includes a second through hole extending from the first through hole.

5. The electronic device according to claim 4, wherein, The first through-hole of the soundproof enclosure and the second through-hole of the supporting structure are connected to each other to form the first conduit; and The electronic device also includes a gasket disposed between the first through-hole in the soundproof enclosure and the second through-hole in the support structure.

6. The electronic device according to claim 4, wherein, The inner wall defining the second conduit is provided by a portion of the support structure and / or a portion of the side frame structure.

7. The electronic device according to claim 6, wherein, The first opening formed at the outermost end of the second conduit is defined by the recessed area in the first rear surface cover and the first end of the side frame structure; and The first path of the sound generated by the acoustic component is configured such that the sound passes through the first through hole and the second through hole in the first conduit, moves along the second conduit, and is then emitted to the outside through the first opening.

8. The electronic device according to claim 4, wherein, The inner wall defining the third conduit is provided by a portion of the support structure and / or a portion of the side frame structure.

9. The electronic device according to claim 8, wherein, A second opening formed at the outermost end of the third conduit is defined in the second end of the side frame structure adjacent to the flexible display. and The second path of the sound generated by the acoustic component is configured such that the sound passes through the first and second through holes in the first conduit, moves along the third conduit, and is then emitted to the outside through the second opening.

10. The electronic device according to claim 9, wherein, The third conduit has a structure that penetrates at least a portion of the support structure and then extends to the second opening that penetrates the side frame structure.

11. The electronic device according to claim 1, wherein, The first housing structure includes a second opening, which is positioned adjacent to the flexible display and formed at the outermost end of the third conduit; and The second housing structure includes a damper structure, which is disposed in the region corresponding to the second opening in the first housing structure when the electronic device is in the folded state.

12. The electronic device according to claim 11, wherein, The damper structure is configured to surround the second opening, or to protrude from one surface of the second housing structure and be inserted into the second opening, to shield the second opening from the external environment of the electronic device.

13. The electronic device according to claim 5, wherein, The soundproof enclosure includes an inclined surface formed along a circumferential surface adjacent to the first through-hole, the inclined surface forming a first predetermined slope relative to the first rear surface cover, and The gasket is disposed on the inclined surface.

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