A QFN electroplating clip design

Abstract

The application discloses a QFN electroplating hanging buckle design applied to the technical field of electroplating processing, a plurality of substrates can be processed at a time through a plurality of plating grooves formed in a main frame, processing efficiency is improved, stability during use is improved through a plurality of electroplating hanging openings which can be fixed with a hanging frame, when the main frame is connected with a negative power supply, the main frame can be made to have uniform current density during electroplating through discharge wires in a plurality of discharge grooves, electroplating quality is improved, and the uniformity of electroplating thickness is maintained, when the main frame is immersed in an electroplating liquid, the second floating plate will be moved upward due to the buoyancy of the electroplating liquid, so that the second floating plate will not extrude the second elastic air bag, the hard cleaning brush layer at the bottom is driven by the movable cleaning plate to clean the just-deposited plating layer, and at the same time of cleaning, the electroplating liquid in the elastic tube will flow out from the flushing holes to flush the cleaning brush layer and the discharge groove, so that the cleaning effect is improved, and the dirt cleaned can be effectively prevented from adhering to the cleaning brush layer.

Description

Technical Field

[0001] This application relates to the field of electroplating processing technology, and in particular to a QFN electroplating hook design. Background Technology

[0002] Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using the principle of electrolysis. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhancing aesthetics.

[0003] Traditional substrates use vertical line electroplating. During the electroplating process, only one cathode can be processed at a time, and the current distribution is uneven, resulting in uneven distribution of electric field lines. This prevents the current from being evenly transmitted to the parts for electroplating, leading to poor uniformity of the electroplating thickness.

[0004] Therefore, the applicant proposed that by opening multiple electroplating hangers with conductive filling holes and adding discharge tanks at the four corners of the frame body, the current density can be made uniform, thus solving the problem that the current cannot be evenly transmitted to the parts for electroplating, resulting in poor uniformity of electroplating thickness. Summary of the Invention

[0005] The purpose of this application is to solve the problem that traditional substrates using vertical line electroplating can only process one cathode at a time during the electroplating process, and the uneven current distribution leads to uneven electric field lines, which prevents the current from being evenly transmitted to the parts for electroplating, resulting in poor uniformity of electroplating thickness.

[0006] Compared with existing technologies, a QFN electroplating hook design is provided, including a main frame, a groove on the top of the main frame with multiple plating tanks in the groove, multiple symmetrically distributed discharge tanks on the top of the main frame, multiple electroplating hanging openings in the groove, and multiple conductive filling holes distributed around the center of the electroplating hanging openings on the outside of the electroplating hanging openings. The main frame is provided with multiple cleaning components corresponding to the discharge tanks one by one. The cleaning components include a movable cleaning plate, which is slidably connected to the main frame. A second power housing for driving the movable cleaning plate to move is installed at the bottom of the main frame. The bottom of the movable cleaning plate has rinsing holes for rinsing the discharge tanks.

[0007] This application improves processing efficiency by creating multiple plating tanks on the main frame, allowing for the simultaneous processing of multiple substrates. Multiple plating mounting points enable fixation to the mounting bracket, enhancing stability during use. When the main frame is connected to a negative power source, the discharge lines in the multiple discharge tanks ensure uniform current density during electroplating, improving plating quality and maintaining uniform plating thickness. Since the main frame is immersed in the plating solution during use, plating layers may accumulate in the discharge tanks after prolonged use, affecting current stability. A cleaning assembly can remove these accumulated plating layers, effectively ensuring the best electroplating results.

[0008] Optionally, the main frame is provided with a groove to accommodate the sliding of the movable cleaning plate, and a cleaning brush layer is fixed at the bottom of the movable cleaning plate.

[0009] Optionally, the active cleaning plate includes an initial position and a preset position. When the active cleaning plate is in the initial position, the cleaning brush layer and the discharge tank do not contact each other. When the active cleaning plate is in the preset position, the cleaning brush layer and the discharge tank contact each other.

[0010] Optionally, the movable cleaning plate and the inner wall of the chute are fixed by a first spring, and the cleaning brush layer is made of hard bristles.

[0011] Optionally, a second float plate is slidably connected inside the second power housing, and a second elastic airbag is provided at the bottom of the second float plate. One end of the second elastic airbag is fixed to the inner wall of the second power housing, and the other end is fixed to the second float plate.

[0012] Optionally, the second float plate is fixed to the inner wall of the second power housing by a second spring, and the second float plate and the movable cleaning plate are connected by an elastic tube. Multiple flushing holes are provided, and the diameter of the multiple flushing holes is one-fifth of the diameter of the elastic tube.

[0013] Optionally, a stirring assembly is installed at the bottom of the main frame, and the stirring assembly includes a spiral stirring blade and a first power housing that drives the spiral stirring blade to rotate, the first power housing being fixed to the bottom of the main frame.

[0014] Optionally, a first float plate is slidably connected inside the first power housing, and a first elastic airbag is fixed to the top of the first float plate, while a third spring is fixed between the bottom of the first float plate and the inner wall of the first power housing.

[0015] Optionally, the main frame is provided with a sealing groove to accommodate the rotation of the spiral stirring blades, and the spiral stirring blades are provided with multiple outwardly protruding blades on the outside. The sealing groove is connected to an air inlet and outlet pipe, and the air inlet and outlet pipe includes a first pipe and a second pipe. The first pipe is connected to the first elastic airbag, and the second pipe is connected to the outside.

[0016] Optionally, multiple discharge lines are distributed in the discharge tank, and the discharge lines are evenly distributed in the groove.

[0017] Compared to existing technologies, the advantages of this application are:

[0018] (1) Multiple plating tanks are opened on the main frame to process multiple substrates at one time, which improves processing efficiency. Multiple electroplating hanging ports can be fixed with the hanger to improve stability during use. When the main frame is connected to the negative power supply, the discharge lines in multiple discharge tanks can make the current density of the main frame uniform during electroplating, improve the electroplating quality, and maintain the uniformity of the electroplating thickness. The main frame will be immersed in the electroplating solution during use. Therefore, after long-term use, the plating layer will be deposited in the discharge tank, affecting the current stability. The deposited plating layer can be cleaned by the cleaning component, which effectively ensures the electroplating effect.

[0019] (2) When the main frame is immersed in the electroplating solution, the second float will move upward due to the buoyancy of the electroplating solution. Therefore, the second float will not squeeze the second elastic airbag. The movable cleaning plate drives the hard cleaning brush layer at the bottom to clean the newly deposited plating layer. At the same time, the electroplating solution in the elastic tube will flow out from the flushing hole to flush the cleaning brush layer and the discharge tank. This not only improves the cleaning effect, but also effectively prevents the dirt removed from adhering to the cleaning brush layer and affecting the cleaning effect.

[0020] (3) When the first pipe flows into the sealing tank, the blade will be driven to rotate under the action of air pressure. During the rotation of the blade, the gas is discharged through the second pipe, thereby improving the continuity of the rotation of the spiral stirring blade. During the rotation of the spiral stirring blade, the electroplating solution will be stirred, so that the spiral stirring blade promotes the flow of the electroplating solution and accelerates the uniform mixing of the electroplating solution. This can avoid the problem of the electroplating solution concentration in the area to be electroplated decreasing during electroplating, which affects the subsequent electroplating quality.

[0021] (4) The first spring applies a pulling force to the movable cleaning plate, so that the cleaning brush layer will separate from the discharge tank during use, thus not affecting the normal use of the discharge tank.

[0022] (5) Both the bottom of the first power housing and the second power housing are provided with through holes so that the electroplating solution can flow into the interior of the first power housing and the second power housing, and then use the buoyancy generated by the electroplating solution as power to realize the cleaning and stirring operation. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the present application;

[0024] Figure 2 This is a top view of the structure of this application;

[0025] Figure 3 This is a bottom-view three-dimensional structural diagram of this application;

[0026] Figure 4This is a schematic diagram of the exploded structure of the second power casing of this application;

[0027] Figure 5 This is a schematic diagram of the movable structure of the active cleaning plate in this application;

[0028] Figure 6 For the purposes of this application Figure 5 Enlarged structural diagram of section A in the middle;

[0029] Figure 7 This is a three-dimensional structural diagram of the active cleaning plate in this application;

[0030] Figure 8 This is a front view structural diagram of the active cleaning plate of this application;

[0031] Figure 9 This is a schematic diagram of the exploded structure of the first power casing of this application;

[0032] Figure 10 This is a schematic diagram of the cross-sectional structure of the sealing groove and the spiral stirring blades of this application.

[0033] Explanation of the labels in the diagram:

[0034] 1. Main frame; 2. Plating tank; 3. Discharge tank; 4. Electroplating hanger; 5. Conductive filling hole; 6. First power housing; 7. Second power housing; 8. Spiral stirring blade; 9. First elastic airbag; 10. First float plate; 11. Movable cleaning plate; 12. Elastic tube; 13. Cleaning brush layer; 14. Flushing hole; 15. Second float plate; 16. Second elastic airbag; 18. Inlet and outlet air pipes. Detailed Implementation

[0035] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0036] Example 1:

[0037] Please see Figure 1-2 and Figure 4-6 This application discloses a QFN electroplating hook design, including a main frame 1, a groove on the top of the main frame 1, and multiple plating tanks 2 in the groove, multiple symmetrically distributed discharge tanks 3 on the top of the main frame 1, multiple electroplating hanging openings 4 in the groove, and multiple conductive filling holes 5 distributed around the center of the electroplating hanging opening 4 on the outside of the electroplating hanging opening 4, and multiple cleaning components corresponding to the discharge tanks 3 on the main frame 1.

[0038] The cleaning assembly includes a movable cleaning plate 11, which is slidably connected to the main frame 1. A second power housing 7, which drives the movable cleaning plate 11 to move, is installed at the bottom of the main frame 1. The bottom of the movable cleaning plate 11 has a rinsing hole 14 for rinsing the discharge tank 3. Multiple discharge wires are distributed in the discharge tank 3, and the discharge wires are evenly distributed in the groove. The bottom of both the first power housing 6 and the second power housing 7 has through holes so that the electroplating solution can flow into the interior of the first power housing 6 and the second power housing 7, and then use the buoyancy generated by the electroplating solution as power to realize the cleaning and stirring operations.

[0039] In use, multiple plating tanks 2 can be opened on the main frame 1 to process multiple substrates at once, improving processing efficiency. Multiple electroplating hanging ports 4 can be used to fix it to the hanger, improving stability during use. When the main frame 1 is connected to the negative power supply, the discharge lines in the multiple discharge tanks 3 can make the current density of the main frame 1 uniform during electroplating, improving the electroplating quality and maintaining the uniformity of the electroplating thickness. The main frame 1 is made of ceramic material. The main frame 1 is immersed in the electroplating solution during use, so after a long period of use, a plating layer will be deposited in the discharge tanks 3, affecting the current stability. The cleaning component can clean the deposited plating layer, effectively ensuring the electroplating effect.

[0040] Example 2:

[0041] Please see Figure 3-8 Compared to Embodiment 1, Embodiment 2 of this application has a sliding groove on the main frame 1 to accommodate the sliding of the movable cleaning plate 11, and a cleaning brush layer 13 is fixed to the bottom of the movable cleaning plate 11. The movable cleaning plate 11 has an initial position and a preset position. When the movable cleaning plate 11 is in the initial position, the cleaning brush layer 13 and the discharge tank 3 are not in contact. When the movable cleaning plate 11 is in the preset position, the cleaning brush layer 13 and the discharge tank 3 are in contact. The movable cleaning plate 11 and the inner wall of the sliding groove are fixed by a first spring, and the cleaning brush layer 13 is made of hard bristles. The brush has a second float plate 15 slidably connected inside the second power housing 7, and a second elastic airbag 16 is provided at the bottom of the second float plate 15. One end of the second elastic airbag 16 is fixed to the inner wall of the second power housing 7, and the other end is fixed to the second float plate 15. The second float plate 15 is fixed to the inner wall of the second power housing 7 by a second spring. The second float plate 15 and the movable cleaning plate 11 are connected by an elastic tube 12. There are multiple flushing holes 14, and the diameter of the multiple flushing holes 14 is one-fifth of the diameter of the elastic tube 12.

[0042] Secondly, the main frame 1 is immersed in the electroplating solution during use. Therefore, after prolonged use, a plating layer will accumulate in the discharge tank 3, affecting current stability. The cleaning assembly can remove this accumulated plating layer, effectively ensuring the electroplating effect. Specifically, when the main frame 1 is immersed in the electroplating solution, the second float 15 moves upward due to the buoyancy of the solution. Therefore, the second float 15 will not compress the second elastic airbag 16. The second elastic airbag 16 will absorb and store some of the electroplating solution through the inlet. When the main frame 1 completes the electroplating process and separates from the electroplating solution, the second float 15, under the action of the second spring... The second elastic airbag 16 is squeezed, and the second elastic airbag 16 transports the electroplating solution through the elastic tube 12. Due to the small diameter of the flushing hole 14, the elastic tube 12 deforms under pressure and pushes the movable cleaning plate 11 to move. The movable cleaning plate 11 drives the hard cleaning brush layer 13 at the bottom to clean the newly deposited plating layer. At the same time, the electroplating solution in the elastic tube 12 flows out from the flushing hole 14 to flush the cleaning brush layer 13 and the discharge tank 3. This not only improves the cleaning effect, but also effectively prevents the dirt removed from adhering to the cleaning brush layer 13 and affecting the cleaning effect.

[0043] Example 3:

[0044] Please see Figure 3 and 9 -10, A stirring assembly is installed at the bottom of the main frame 1, and the stirring assembly includes a spiral stirring blade 8 and a first power housing 6 for driving the spiral stirring blade 8 to rotate. The first power housing 6 is fixed to the bottom of the main frame 1. A first float plate 10 is slidably connected inside the first power housing 6, and a first elastic airbag 9 is fixed at the top of the first float plate 10. A third spring is fixed between the bottom of the first float plate 10 and the inner wall of the first power housing 6. A sealing groove is opened on the main frame 1 to accommodate the rotation of the spiral stirring blade 8, and multiple outwardly protruding blades are provided on the outer side of the spiral stirring blade 8. An air inlet and outlet pipe 18 is connected to the sealing groove, and the air inlet and outlet pipe 18 includes a first pipe and a second pipe. The first pipe is connected to the first elastic airbag 9, and the second pipe is connected to the outside.

[0045] Secondly, the buoyancy generated by the electroplating solution can push the first float plate 10 upward to compress the first elastic airbag 9. The gas inside the first elastic airbag 9 will continue to flow due to the limited air output of the first pipe in the inlet and outlet pipe 18. When the gas flows into the sealing tank through the first pipe, it will push the blades to rotate under the action of air pressure. During the rotation of the blades, the gas will be discharged through the second pipe, thereby improving the continuity of the rotation of the spiral stirring blades 8. During the rotation of the spiral stirring blades 8, the electroplating solution will be stirred, which will promote the flow of the electroplating solution and accelerate the uniform mixing of the electroplating solution. This can avoid the problem of the electroplating solution concentration in the area to be electroplated decreasing during electroplating, which will affect the subsequent electroplating quality.

[0046] Multiple plating tanks 2 are provided on the main frame 1, which can process multiple substrates at one time, improving processing efficiency. Multiple electroplating hanging ports 4 can be fixed with the hanger to improve stability during use. When the main frame 1 is connected to the negative power supply, the discharge lines in the multiple discharge tanks 3 can make the current density of the main frame 1 uniform during electroplating, improving the electroplating quality and maintaining the uniformity of the electroplating thickness. The main frame 1 is immersed in the electroplating solution during use, so after a long period of use, a plating layer will be deposited in the discharge tanks 3, affecting the current stability. The cleaning component can clean the deposited plating layer, effectively ensuring the electroplating effect.

[0047] The above are merely preferred embodiments of this application, but the scope of protection of this application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this application, based on the technical solution and its improved concept, should be covered within the scope of protection of this application.

Claims

1. A QFN electroplated hook design, comprising a main frame (1), characterized in that, The main frame (1) has a groove at the top, and multiple plating tanks (2) are provided in the groove. The main frame (1) has multiple symmetrically distributed discharge tanks (3) at the top. Multiple electroplating hangers (4) are provided in the groove. Multiple conductive filling holes (5) are provided around the center of the electroplating hanger (4) on the outside of the electroplating hanger (4). The main frame (1) has multiple cleaning components that correspond one-to-one with the discharge tanks (3). The cleaning assembly includes a movable cleaning plate (11), which is slidably connected to the main frame (1). A second power housing (7) for driving the movable cleaning plate (11) to move is installed at the bottom of the main frame (1). A rinsing hole (14) for rinsing the discharge tank (3) is opened at the bottom of the movable cleaning plate (11).

2. The QFN electroplated hook design according to claim 1, characterized in that, The main frame (1) is provided with a sliding groove to accommodate the sliding of the movable cleaning plate (11), and a cleaning brush layer (13) is fixed at the bottom of the movable cleaning plate (11).

3. The QFN electroplated hook design according to claim 2, characterized in that, The movable cleaning plate (11) includes an initial position and a preset position. When the movable cleaning plate (11) is in the initial position, the cleaning brush layer (13) and the discharge tank (3) do not contact each other. When the movable cleaning plate (11) is in the preset position, the cleaning brush layer (13) and the discharge tank (3) contact each other.

4. The QFN electroplated hook design according to claim 3, characterized in that, The movable cleaning plate (11) and the inner wall of the chute are fixed by a first spring, and the cleaning brush layer (13) is made of hard bristles.

5. The QFN electroplated hook design according to claim 1, characterized in that, The second power housing (7) is slidably connected to a second float plate (15), and the bottom of the second float plate (15) is provided with a second elastic airbag (16). One end of the second elastic airbag (16) is fixed to the inner wall of the second power housing (7), and the other end is fixed to the second float plate (15).

6. The QFN electroplated hook design according to claim 5, characterized in that, The second float plate (15) is fixed to the inner wall of the second power housing (7) by a second spring. The second float plate (15) and the movable cleaning plate (11) are connected by an elastic tube (12). The flushing holes (14) are configured to be multiple, and the diameter of the multiple flushing holes (14) is one-fifth of the diameter of the elastic tube (12).

7. The QFN electroplated hook design according to claim 1, characterized in that, The bottom of the main frame (1) is equipped with a stirring assembly, which includes a spiral stirring blade (8) and a first power housing (6) for driving the spiral stirring blade (8) to rotate. The first power housing (6) is fixed to the bottom of the main frame (1).

8. The QFN electroplated hook design according to claim 7, characterized in that, The first power housing (6) is slidably connected to a first float plate (10), and a first elastic airbag (9) is fixed to the top of the first float plate (10). A third spring is fixed between the bottom of the first float plate (10) and the inner wall of the first power housing (6).

9. The QFN electroplated hook design according to claim 8, characterized in that, The main frame (1) is provided with a sealing groove to accommodate the rotation of the spiral stirring blade (8), and the spiral stirring blade (8) is provided with multiple outward protruding blades on the outside. The sealing groove is connected to an air inlet and outlet pipe (18), and the air inlet and outlet pipe (18) includes a first pipe and a second pipe. The first pipe is connected to the first elastic airbag (9), and the second pipe is connected to the outside.

10. The QFN electroplated hook design according to claim 1, characterized in that, The discharge groove (3) contains multiple discharge lines, which are evenly distributed in the groove.

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