Optical module

Abstract

The application discloses an optical module, which comprises a shell, a heat sink device arranged in the shell and in thermal conductive connection with the shell, and a printed circuit board partially arranged on the heat sink device, and further comprises a first optoelectronic chip and a second optoelectronic chip arranged on the heat sink device, wherein the first optoelectronic chip and the second optoelectronic chip are both in electrical connection with the printed circuit board, the second optoelectronic chip is arranged separately from the first optoelectronic chip, the first optoelectronic chip is located outside the printed circuit board, and the first optoelectronic chip is in electrical connection with the printed circuit board through gold wires. The optical module has high heat dissipation capacity and reduces the signal crosstalk influence between the first optoelectronic chip and the second optoelectronic chip.

Description

[0001] This divisional application is a divisional application based on the original Chinese patent application with application number 201710590788X, application date July 19, 2017, entitled "Optical Module". More specifically, it is a further divisional application based on the divisional application with application number 2022101293292, application date July 19, 2017, entitled "Optical Module". Technical Field

[0002] This invention relates to the field of optical communication component manufacturing technology, and in particular to an optical module. Background Technology

[0003] With the rapid development of 4G communication and the increasing demand for cloud computing, the market demand for high-speed optical modules is growing daily. To meet the market's need for high-bandwidth, high-speed data transmission, module design is increasingly moving towards miniaturization and high density. While highly integrated circuits are striving for miniaturization and low power consumption, the high thermal power consumption of modules has become a pressing issue due to the development of high-speed, high-bandwidth module technology. If adequate heat dissipation cannot be guaranteed, the performance of temperature-sensitive electro-optical / photoelectric conversion components and chips in the optical module will be significantly reduced, potentially leading to the entire module malfunctioning or failing. Therefore, more efficient heat dissipation structures are needed to ensure stable operation of the devices. Summary of the Invention

[0004] The purpose of this invention is to provide an optical module that has efficient heat dissipation capabilities and reduces signal crosstalk between the first optoelectronic chip and the second optoelectronic chip.

[0005] To achieve one of the above-mentioned objectives, one embodiment of the present invention provides an optical module, the optical module including a housing, a heat sink disposed within the housing and thermally connected to the housing, and a printed circuit board partially disposed on the heat sink. The optical module further includes a first photoelectric chip and a second photoelectric chip disposed on the heat sink. Both the first and second photoelectric chips are electrically connected to the printed circuit board, and the second photoelectric chip is disposed separately from the first photoelectric chip. The first photoelectric chip is located outside the printed circuit board and is electrically connected to the printed circuit board via gold wires.

[0006] As a further improvement to the embodiment of the present invention, the heat sink device is L-shaped.

[0007] As a further improvement to the embodiments of the present invention, the heat sink device includes a first heat sink and a second heat sink that is thermally connected to the first heat sink, the first photoelectric chip is disposed on the first heat sink, and the second photoelectric chip is thermally connected to the second heat sink.

[0008] As a further improvement to the embodiment of the present invention, the first optoelectronic chip and the second optoelectronic chip are staggered in the optical path transmission direction, and the first optoelectronic chip is a laser or a laser array.

[0009] As a further improvement to the embodiment of the present invention, the optical module includes an optical interface and an electrical interface, and the second heat sink is disposed on the end of the printed circuit board near the electrical interface.

[0010] As a further improvement to the embodiment of the present invention, the printed circuit board has a first surface and a second surface opposite to the first surface, the heat sink is fixed on the second surface, and the first optoelectronic chip is electrically connected to the first surface.

[0011] As a further improvement to the embodiments of the present invention, the optical module includes an optical interface, an electrical interface, and a receiving portion located on the first surface, and the heat sink device includes a first heat sink and a second heat sink thermally connected to the first heat sink, and the receiving portion is located at one end of the printed circuit board near the electrical interface.

[0012] As a further improvement to the embodiment of the present invention, the first heat sink has a first protrusion, the first photoelectric chip is disposed on the first protrusion, the second heat sink has a second protrusion, and the second protrusion portion is located in the accommodating portion.

[0013] As a further improvement to the embodiment of the present invention, the receiving portion is a receiving groove; or, the receiving portion is an opening penetrating the circuit board.

[0014] As a further improvement to the embodiment of the present invention, the first heat sink and the second heat sink are separately configured.

[0015] As a further improvement to the embodiment of the present invention, the optical module includes an optical interface and an electrical interface, the first heat sink and the second heat sink are L-shaped, the first heat sink is close to the end of the printed circuit board near the optical interface, and the second heat sink is close to the side of the printed circuit board perpendicular to the end.

[0016] As a further improvement to the embodiment of the present invention, the heat sink device is located on the outside of the printed circuit board and is in contact with the first optoelectronic chip.

[0017] As a further improvement of the embodiments of the present invention, the housing includes a first housing and a second housing connected to the first housing, the heat sink device is disposed adjacent to the second housing, and a heat dissipation pad or paste is provided between the heat sink device and the second housing to guide heat from the heat sink to the second housing.

[0018] As a further improvement of the embodiment of the present invention, the second housing is the main heat dissipation surface, the first housing is the secondary heat dissipation surface, and a first heat dissipation pad is provided between the heat sink device and the second housing. The projection of the first heat dissipation pad on the first surface at least partially overlaps with the projection of the first photoelectric chip on the first surface.

[0019] As a further improvement to the embodiment of the present invention, a first electrical isolation pad is provided between the first optoelectronic chip and the heat sink device, and the first electrical isolation pad is thermally connected to the heat sink device.

[0020] As a further improvement to the embodiment of the present invention, the heat sink device is bonded to the printed circuit board.

[0021] As a further improvement to the embodiment of the present invention, the circuit board is a rigid circuit board.

[0022] As a further improvement to the embodiment of the present invention, the end of the circuit board away from the optical interface is provided with a gold finger for electrical connection with the outside.

[0023] As a further improvement to the embodiment of the present invention, the printed circuit board has a first surface, a second surface opposite to the first surface, and a side surface connected to the first surface, and the second photoelectric chip is disposed adjacent to the side surface.

[0024] Another embodiment of the present invention provides an optical module, the optical module including a housing, a heat sink device disposed inside the housing and thermally connected to the housing, and a printed circuit board partially disposed on the heat sink device. The optical module also includes a first photoelectric chip and a second photoelectric chip that are both thermally connected to the heat sink device, the first photoelectric chip and the second photoelectric chip being located on different sides of the heat sink device.

[0025] As a further improvement to the embodiment of the present invention, the first optoelectronic chip is electrically connected to one side of the printed circuit board, and the second optoelectronic chip is electrically connected to the other side of the printed circuit board.

[0026] As a further improvement to the embodiment of the present invention, the heat sink device is provided with holes or slots through which light can pass, so that the first optoelectronic chip and the second optoelectronic chip can establish an optical path connection.

[0027] As a further improvement to the embodiment of the present invention, the first optoelectronic chip and the second optoelectronic chip are optically connected via optical fiber.

[0028] As a further improvement to the embodiments of the present invention, the printed circuit board has a first surface and a second surface opposite to the first surface, the first optoelectronic chip is electrically connected to the second surface, and the second optoelectronic chip is electrically connected to the first surface.

[0029] As a further improvement to the embodiment of the present invention, the first optoelectronic chip is disposed on one side of the printed circuit board, and the second optoelectronic chip is disposed on the other side of the printed circuit board.

[0030] As a further improvement to the embodiment of the present invention, the heat sink device includes a first heat sink and a second heat sink that is thermally connected to the first heat sink, the first photoelectric chip is disposed in the first heat sink, and the second photoelectric chip is disposed in the second heat sink.

[0031] As a further improvement of the embodiments of the present invention, the printed circuit board has a first surface, a second surface opposite to the first surface, and a receiving portion located on the first surface, the second photoelectric chip is disposed in the receiving portion, and the heat sink device is at least partially disposed in the receiving portion.

[0032] As a further improvement to the embodiment of the present invention, the receiving portion is a receiving groove, and the heat sink device is located between the second optoelectronic chip and the printed circuit board.

[0033] As a further improvement to the embodiment of the present invention, the receiving portion is an opening that passes through the printed circuit board, the heat sink device is partially located in the receiving portion, and the second photoelectric chip is at least partially located in the receiving portion.

[0034] As a further improvement to the embodiment of the present invention, the optical module includes an optical interface and an electrical interface, the first heat sink and the second heat sink are L-shaped, the first heat sink is close to the end of the printed circuit board near the optical interface, and the second heat sink is close to the side of the printed circuit board perpendicular to the end.

[0035] As a further improvement to the embodiments of the present invention, the first heat sink and the second heat sink are either separate structures or integrated structures.

[0036] As a further improvement of the embodiment of the present invention, the first heat sink has a first protrusion, the second heat sink has a second protrusion flush with the first protrusion, the first photoelectric chip is disposed on the first protrusion, and the second photoelectric chip is located on the second protrusion.

[0037] As a further improvement to the embodiment of the present invention, the optical module includes an optical interface and an electrical interface, and a stepped circuit board is formed at the end of the printed circuit board near the optical interface, and the steps of the stepped circuit board form a receiving portion for accommodating the second optoelectronic chip.

[0038] As a further improvement to the embodiments of the present invention, the optical module includes an optical interface and an electrical interface, and a flexible circuit board is connected to the end of the printed circuit board near the optical interface. The ends of the flexible circuit board and the printed circuit board form a receiving portion for accommodating the second optoelectronic chip.

[0039] As a further improvement to the embodiment of the present invention, the first photoelectric chip is located on the outside of the printed circuit board, the first photoelectric chip is electrically connected to the printed circuit board through gold wire, and the heat sink device is bonded to the printed circuit board.

[0040] As a further improvement to the embodiments of the present invention, the first optoelectronic chip is a laser or a laser array, and the second optoelectronic chip is a photodetector or a photodetector array.

[0041] As a further improvement to the embodiment of the present invention, the first photoelectric chip is disposed on the heat sink device, and an electrical isolation pad is provided between the first photoelectric chip and the heat sink device. The electrical isolation pad is thermally connected to and electrically isolated from the heat sink device.

[0042] As a further improvement of the embodiments of the present invention, the housing includes a first housing and a second housing connected to the first housing, the second housing being the main heat dissipation surface and the first housing being the secondary heat dissipation surface, a first heat dissipation pad being provided between the heat sink device and the second housing, and the projection of the first heat dissipation pad on the first surface at least partially overlapping the projection of the photoelectric chip on the first surface.

[0043] As a further improvement to the embodiment of the present invention, the second photoelectric chip is disposed opposite to the second housing, and the first photoelectric chip is disposed opposite to the first housing.

[0044] Another embodiment of the present invention provides an optical module, the optical module including a housing, a heat sink device disposed inside the housing and thermally connected to the housing, and a printed circuit board partially disposed on the heat sink device. The optical module further includes a first photoelectric chip and a second photoelectric chip both disposed on the heat sink device, the first photoelectric chip and the second photoelectric chip being disposed separately, and the heat sink device having holes or slots for light to pass through, so that the first photoelectric chip and the second photoelectric chip can establish an optical path connection.

[0045] As a further improvement to the embodiment of the present invention, the heat sink device includes a first heat sink and a second heat sink that is thermally connected to the first heat sink, the first photoelectric chip is disposed in the first heat sink, and the second photoelectric chip is disposed in the second heat sink.

[0046] As a further improvement to the embodiment of the present invention, the first optoelectronic chip and the second optoelectronic chip are optically connected via optical fiber.

[0047] As a further improvement to the embodiment of the present invention, the optical module includes an optical interface and an electrical interface, and the first optoelectronic chip is located at the end of the printed circuit board near the optical interface.

[0048] As a further improvement to the embodiment of the present invention, the positions of the first optoelectronic chip and the second optoelectronic chip are staggered in the direction of the connection between the optical interface and the electrical interface.

[0049] As a further improvement of the embodiment of the present invention, the printed circuit board has a first surface, a second surface opposite to the first surface, and a receiving portion located on the first surface, wherein the second photoelectric chip is disposed in the receiving portion.

[0050] As a further improvement to the embodiment of the present invention, the receiving portion is a receiving groove; or an opening.

[0051] As a further improvement to the embodiments of the present invention, the first heat sink includes a portion connected to the first optoelectronic chip and a portion located above the second optoelectronic chip and connected to the second heat sink.

[0052] As a further improvement to the embodiment of the present invention, the portion of the first heat sink located above the first photoelectric chip and connected to the second heat sink is further provided with a window exposing the second photoelectric chip.

[0053] As a further improvement to the embodiment of the present invention, the first heat sink and the second heat sink are L-shaped.

[0054] As a further improvement to the embodiment of the present invention, one side of the first heat sink and one side of the second heat sink are located on the same straight line, and the two sides are close to the same side of the printed circuit board.

[0055] As a further improvement to the embodiment of the present invention, the first photoelectric chip is located on the outside of the printed circuit board and is electrically connected to the printed circuit board through gold wires; a portion of the heat sink device is located on the outside of the printed circuit board and is in contact with the first photoelectric chip.

[0056] As a further improvement to the embodiment of the present invention, the optical module includes an optical interface and an electrical interface, and a stepped circuit board is formed at the end of the printed circuit board near the optical interface, and the steps of the stepped circuit board form a receiving portion for accommodating the second optoelectronic chip.

[0057] As a further improvement to the embodiments of the present invention, the optical module includes an optical interface and an electrical interface, and a flexible circuit board is connected to the end of the printed circuit board near the optical interface. The ends of the flexible circuit board and the printed circuit board form a receiving portion for accommodating the second optoelectronic chip.

[0058] Compared with the prior art, the beneficial effects of the present invention are as follows: In the technical solution provided by the present invention, both the first optoelectronic chip and the second optoelectronic chip are disposed in a heat sink device. Therefore, the heat generated by the first optoelectronic chip and the second optoelectronic chip is dissipated to the housing through the heat sink device, which has a highly efficient heat dissipation capability. At the same time, the second optoelectronic chip and the first optoelectronic chip are disposed separately, thereby greatly reducing the signal crosstalk between the first optoelectronic chip and the second optoelectronic chip. Attached Figure Description

[0059] Figure 1 This is a three-dimensional schematic diagram of the optical module in the first embodiment of the present invention;

[0060] Figure 2 This is an exploded view of the optical module in the first embodiment of the present invention;

[0061] Figure 3 yes Figure 2 A three-dimensional schematic diagram of the printed circuit board of the optical module;

[0062] Figure 4 This is a three-dimensional schematic diagram of the printed circuit board, heat sink, and optoelectronic chip of the optical module in the first embodiment of the present invention.

[0063] Figure 5 yes Figure 4 A three-dimensional schematic diagram of the optical module from another direction;

[0064] Figure 6 yes Figure 4 Front view of the optical module;

[0065] Figure 7 This is a three-dimensional schematic diagram of the optical module in the second embodiment of the present invention;

[0066] Figure 8 This is an exploded view of the optical module in the second embodiment of the present invention;

[0067] Figure 9 yes Figure 8 A three-dimensional schematic diagram of the printed circuit board of the optical module;

[0068] Figure 10 This is a three-dimensional schematic diagram of the printed circuit board, heat sink, and optoelectronic chip of the optical module in the second embodiment of the present invention.

[0069] Figure 11 yes Figure 10A three-dimensional schematic diagram of the optical module from another direction;

[0070] Figure 12 yes Figure 10 Front view of the optical module;

[0071] Figure 13 This is an exploded view of the optical module in the third embodiment of the present invention;

[0072] Figure 14 yes Figure 13 A three-dimensional schematic diagram of the printed circuit board of the optical module. Detailed Implementation

[0073] The present application will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present application, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the scope of protection of this application.

[0074] In the various figures of this application, for ease of illustration, certain dimensions of structures or parts may be exaggerated relative to other structures or parts; therefore, they are only used to illustrate the basic structure of the subject matter of this application.

[0075] Furthermore, terms such as “above,” “over,” “below,” and “under” used herein to indicate spatial relative position are for illustrative purposes to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. The terms of spatial relative position may be intended to include different orientations of the device in use or operation other than those shown in the figures. For example, if the device in the figures is flipped, a unit described as being “below” or “under” other units or features would be located “above” other units or features. Therefore, the exemplary term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptive terms used herein shall be interpreted accordingly.

[0076] Furthermore, it should be understood that although the terms first, second, etc., can be used herein to describe various elements or structures, the objects described should not be limited by these terms. The terms are used only to distinguish these objects from one another. For example, a first surface can be referred to as a second surface, and similarly, a second surface can be referred to as a first surface, without departing from the scope of protection of this application.

[0077] like Figures 1 to 6 As shown, the first embodiment of the present invention discloses an optical module. Please refer to... Figure 1 and Figure 2The optical module includes a housing 20, an optical interface system 36 disposed within the housing 20, a connector 38 fixed to the housing 20, and a pull ring 40 disposed within the housing 20 for unlocking the optical module. A spring 42 is provided between the connector 38 and the optical interface system 36. The optical module also includes a heat sink 22 and a printed circuit board 24. The heat sink 22 is disposed within the housing 20 and is thermally connected to the housing 20, and the printed circuit board 24 is partially disposed on the heat sink 22. In this embodiment, the printed circuit board 24 is snap-fitted to the housing 20, and the heat sink 22 is adhesively fixed to the housing 20. Of course, the printed circuit board 24 can also be disposed within the housing 20 using other connection methods, and similarly, the heat sink 22 can also be disposed within the housing 20 using other connection methods.

[0078] Specifically, the optical module also includes a first optoelectronic chip 26 and a second optoelectronic chip 28, both disposed on the heat sink device 22. The first optoelectronic chip 26 and the second optoelectronic chip 28 can both be optoelectronic chip arrays, or they can be single chips or multiple single chips arranged together. Here, the first optoelectronic chip 26 is a laser array, and the second optoelectronic chip 28 is a photodetector array. The first optoelectronic chip 26 and the second optoelectronic chip 28 are electrically connected to the printed circuit board 24 via gold wire bonding or other high-speed signal electrical connections.

[0079] Please refer to Figure 3 The printed circuit board 24 has a first surface 30, a second surface 32 opposite to the first surface 30, and an opening 34 extending from the first surface 30 to the second surface 32. The second photoelectric chip 28 is disposed in the opening 34, and the second photoelectric chip 28 is disposed separately from the first photoelectric chip 26.

[0080] In this embodiment, since the printed circuit board 24 has an opening 34, the second photoelectric chip 28 is disposed in the opening 34, and both the first photoelectric chip 26 and the second photoelectric chip 28 are disposed on the heat sink device 22. Therefore, the heat generated by the first photoelectric chip 26 and the second photoelectric chip 28 is dissipated onto the housing 20 through the heat sink device 22, resulting in efficient heat dissipation. Simultaneously, the second photoelectric chip 28 and the first photoelectric chip 26 are disposed separately, thereby increasing the distance between the two photoelectric chips, which greatly reduces the signal crosstalk between the first photoelectric chip 26 and the second photoelectric chip 28, and further improves the heat dissipation effect.

[0081] Please refer to Figure 4 and Figure 5The heat sink device 22 includes a first heat sink 44 and a second heat sink 46 thermally connected to the first heat sink 44. A first optoelectronic chip 26 is disposed on the first heat sink 44, and the heat generated by the first optoelectronic chip 26 is dissipated to the housing 20 through the first heat sink 44. The second heat sink 46 is partially located in the opening 34, and a second optoelectronic chip 28 is disposed on the second heat sink 46. Both the first heat sink 44 and the second heat sink 46 are thermally connected to the housing 20. This ensures that the heat generated by the first optoelectronic chip 26 and the second optoelectronic chip 28 is dissipated to the housing 20 through the first heat sink 44 and the second heat sink 46 respectively, and that the first optoelectronic chip 26 and the second optoelectronic chip 28 are separately disposed. This ensures that the optical module has a highly efficient heat dissipation capability while further reducing the signal crosstalk between the first optoelectronic chip 26 and the second optoelectronic chip 28.

[0082] Please refer to Figure 2 The housing 20 includes a first housing 48 and a second housing 50 connected to the first housing 48. The first housing 48 and the second housing 50 can be fixed together with screws. A heat sink 22 is disposed adjacent to the second housing 50, so the heat generated by the first photoelectric chip 26 and the second photoelectric chip 28 is mainly transferred to the second housing 50, making the second housing 50 the primary heat dissipation surface. Additionally, only a portion of the heat is transferred to the first housing 48, making the first housing 48 a secondary heat dissipation surface. The second housing 50 has a special heat dissipation design to better dissipate heat outside the housing 20.

[0083] To further improve the heat dissipation capability of the optical module, a heat dissipation pad or grease is provided between the heat sink 22 and the housing 20, thereby better conducting the heat on the heat sink 22 to the housing 20. In this embodiment, the heat dissipation pad or grease is provided between the heat sink 22 and the second housing 50. Specifically, a first heat dissipation pad 52 is provided between the first heat sink 44 and the second housing 50, and a second heat dissipation pad 54 is provided between the second heat sink 46 and the second housing 50. The first heat dissipation pad 52 and the first optoelectronic chip 26 are located on opposite sides of the first heat sink 44, and their positions are correspondingly arranged, that is, the projection of the first heat dissipation pad 52 on the first surface 30 and the projection of the first optoelectronic chip 26 on the first surface 30 at least partially overlap; the second heat dissipation pad 54 and the second optoelectronic chip 28 are located on opposite sides of the second heat sink 46, and their positions are also correspondingly arranged, that is, the projection of the second heat dissipation pad 54 on the first surface 30 and the projection of the second optoelectronic chip 28 on the first surface 30 at least partially overlap.

[0084] In this embodiment, the first heat sink 44 and the second heat sink 46 are integrally formed. Of course, the first heat sink 44 and the second heat sink 46 can also be separate structures, thermally connected to each other or thermally connected to the housing 20 respectively. The heat sink device 22 formed by the first heat sink 44 and the second heat sink 46 is L-shaped. This structure allows the first optoelectronic chip 26 and the second optoelectronic chip 28 to be staggered in the optical path transmission direction, facilitating the isolation of optoelectronic signals. The L-shaped heat sink device 22 also saves on the use of heat sinks while ensuring heat dissipation, and also provides more board space for the printed circuit board 24, facilitating component layout.

[0085] The first heat sink 44 has a substrate 56 and a first protrusion 58. A first photoelectric chip 26 is disposed on the first protrusion 58, adjacent to one end of the printed circuit board 24, and is electrically connected to the printed circuit board 24. The second heat sink 46 has a second protrusion 60, at least partially located in the opening 34. A second photoelectric chip 28 is disposed on the second protrusion 60 and is electrically connected to the printed circuit board 24. Additionally, the end of the printed circuit board 24 furthest from the first photoelectric chip 26 has a peripheral electrical interface for electrical connection to the outside; this is a gold finger.

[0086] In addition, the optical module includes an optical interface and an electrical interface, and the first optoelectronic chip 26 is located at the end of the printed circuit board 24 near the optical interface. Specifically, the positions of the first optoelectronic chip 26 and the second optoelectronic chip 28 are offset from each other in the direction of the connection between the optical interface and the electrical interface.

[0087] Specifically, in this embodiment, the first optoelectronic chip 26 is a laser, and the second optoelectronic chip 28 is a photodetector. Of course, the first optoelectronic chip 26 can also be a photodetector, and the second optoelectronic chip 28 can be a laser. Alternatively, both the first optoelectronic chip 26 and the second optoelectronic chip 28 can be photodetectors, or both can be photodetectors. When the first optoelectronic chip 26 and the second optoelectronic chip 28 are lasers or photodetectors, they can also simultaneously have components such as drivers or photoelectric signal detectors. Here, the first optoelectronic chip 26 is a laser, and the second optoelectronic chip 28 is a photodetector. In this way, the laser, as a high-heat-generating element, is positioned close to the center of the heat sink device 22, resulting in better heat dissipation. Furthermore, placing the laser on one side of the printed circuit board 24, rather than in the center, facilitates optical path design and makes assembly easier.

[0088] The opening 34 has a closed cross-section in the direction parallel to the first surface 30. That is, the opening 34 is a through hole with a closed outer perimeter. Preferably, the cross-section of the opening 34 in the direction parallel to the first surface 30 is square. Of course, the cross-section of the opening 34 in the direction parallel to the first surface 30 can also be set to other shapes.

[0089] Furthermore, the cross-section of the opening 34 in the direction parallel to the first surface 30 can also be configured to be open. For example, the cross-section of the opening 34 in the direction parallel to the first surface 30 can be configured to be U-shaped or L-shaped. Of course, it can also be configured to other open shapes.

[0090] The printed circuit board 24 is bonded to the heat sink 22. Alternatively, other connection methods can be used to fix the printed circuit board 24 to the heat sink 22. The printed circuit board 24 can be directly bonded to the heat sink 22 or indirectly bonded to it. In this case, a heat-conducting or conductive medium can be provided between the printed circuit board 24 and the heat sink 22. In this embodiment, the first photoelectric chip 26 and the second photoelectric chip 28 are located on the same side of the heat sink 22. That is, the first photoelectric chip 26 and the second photoelectric chip 28 are disposed on the same surface of the heat sink 22, and are electrically connected to the same side of the printed circuit board 24. Alternatively, the first photoelectric chip 26 and the second photoelectric chip 28 can be disposed on different sides of the heat sink 22, such as on opposite sides of the heat sink 22. When the first photoelectric chip 26 and the second photoelectric chip 28 are disposed on different sides of the heat sink 22, the first photoelectric chip 26 is electrically connected to one side of the printed circuit board 24, and the second photoelectric chip 28 is electrically connected to the other side of the printed circuit board 24. This reduces crosstalk and improves signal transmission quality. Specifically, when the first photoelectric chip 26 and the second photoelectric chip 28 are located on different sides of the heat sink device, the first heat sink 44 is provided with holes or slots for light to pass through. Of course, optical fibers can also be used to connect the optical paths.

[0091] In addition, a first electrical isolation pad 62 is provided between the first optoelectronic chip 26 and the heat sink device 22. The first electrical isolation pad 62 is thermally connected to the heat sink device 22 and has an electrical isolation effect, so that the heat generated by the first optoelectronic chip 26 can be transferred to the housing 20 through the heat sink device 22 for heat dissipation, while achieving electrical isolation between the housing 20, the heat sink device 22 and the first optoelectronic chip 26. This makes the optical module perform stably and is safe to use. The upper surface of the first electrical isolation pad 62 is made of a low conductivity material and is electrically connected to the printed circuit board 24, while the substrate and lower surface of the first electrical isolation pad 62 are made of insulating material and are electrically isolated from the heat sink device 22.

[0092] A second electrical isolation pad 64 is provided between the second optoelectronic chip 28 and the heat sink device 22. The second electrical isolation pad 64 is thermally connected to the heat sink device 22 while being electrically isolated. Similarly, the heat generated by the second optoelectronic chip 28 can be transferred to the housing 20 through the heat sink device 22 for heat dissipation, while simultaneously achieving electrical isolation between the housing 20, the heat sink device 22, and the second optoelectronic chip 28. This makes the optical module more stable in performance and safer to use.

[0093] Of course, in other embodiments, the heat sink device 22 itself may also be made of a material with electrical isolation and good thermal conductivity, thereby eliminating the need for an electrical isolation pad.

[0094] See Figures 7 to 12 The second embodiment of the present invention discloses an optical module.

[0095] Please refer to Figure 7 and Figure 8 The optical module includes a housing 68, an optical interface system 88 disposed within the housing 68, a connector 90 plugged into the optical interface system 88, and a pull ring 92 disposed within the housing 68 for unlocking the optical module. Additionally, the optical module includes a heat sink 70 and a printed circuit board 72. The heat sink 70 is disposed within the housing 68 and thermally connected to it, and the printed circuit board 72 is also disposed within the housing 68. Similar to the first embodiment, in this embodiment, the printed circuit board 72 is snap-fitted to the housing 68, and the heat sink 70 is adhesively fixed to the housing 68. Of course, the printed circuit board 72 can also be disposed within the housing 68 using other connection methods, and similarly, the heat sink 70 can also be disposed within the housing 68 using other connection methods.

[0096] Please refer to Figure 9 and Figure 10 The printed circuit board 72 has a first surface 74, a second surface 76, and a receiving portion 82 located on the first surface 74, wherein the first surface 74 and the second surface 76 are opposite to each other. Specifically, the printed circuit board 72 also includes a third surface 78 and a side surface 80 connecting the first surface 74 and the third surface 78. The third surface 78 is located between the first surface 74 and the second surface 76 and has a certain height difference from the first surface 74. The third surface 78 and the side surface 80 constitute the receiving portion 82, and the heat sink device 70 is partially located in the receiving portion 82. Specifically, the receiving portion 82 is a receiving groove. The optical module also includes a first photoelectric chip 84 and a second photoelectric chip 86, both disposed on the heat sink device 70, and both the first photoelectric chip 84 and the second photoelectric chip 86 are electrically connected to the printed circuit board 72. In addition, the second photoelectric chip 86 is at least partially located in the receiving portion 82, and the second photoelectric chip 86 and the first photoelectric chip 84 are disposed separately from each other.

[0097] In this embodiment, since the printed circuit board 72 has a receiving portion 82 formed by the third surface 78 and the side surface 80, the heat sink device 70 is partially located in the receiving portion 82, and the second photoelectric chip 86 is at least partially located in the receiving portion 82. The heat sink device 70 is located between the second photoelectric chip 86 and the printed circuit board 72, so the heat generated by the first photoelectric chip 84 and the second photoelectric chip 86 is dissipated to the housing 68 through the heat sink device 70, which has a highly efficient heat dissipation capability. At the same time, the second photoelectric chip 86 is far away from the first photoelectric chip 84, thereby increasing the distance between the two photoelectric chips, which greatly reduces the signal crosstalk between the first photoelectric chip 84 and the second photoelectric chip 86, and makes the heat dissipation effect better.

[0098] The heat sink device 70 includes a first heat sink 94 and a second heat sink 96 thermally connected to the first heat sink 94. A first photoelectric chip 84 is disposed in the first heat sink 94, and the second heat sink 96 is at least partially located in the accommodating portion 82. The second photoelectric chip 86 is thermally connected to the second heat sink 96. In this way, the heat generated by the first photoelectric chip 84 and the second photoelectric chip 86 is dissipated to the housing 68 through the first heat sink 94 and the second heat sink 96, respectively, and the first photoelectric chip 84 is far away from the second photoelectric chip 86. This ensures efficient heat dissipation while further reducing signal crosstalk between the first photoelectric chip 84 and the second photoelectric chip 86.

[0099] In this embodiment, the first heat sink 94 and the second heat sink 96 are separately configured, with the second heat sink 96 glued to the first heat sink 94 and thermally connected. Of course, the first heat sink 94 and the second heat sink 96 can also be integrally molded.

[0100] The housing 68 includes a first housing 98 and a second housing 99 connected to the first housing 98. The heat sink device 70 is disposed adjacent to the second housing 99. Therefore, the heat generated by the first photoelectric chip 84 and the second photoelectric chip 86 is mainly transferred to the second housing 99, making the second housing 99 the main heat dissipation surface. In addition, only a portion of the heat is transferred to the first housing 98, thus the first housing 98 is the secondary heat dissipation surface.

[0101] To further improve the heat dissipation capability of the optical module, a heat dissipation pad (not shown) or grease can also be placed between the heat sink 70 and the housing 68 to better conduct the heat on the heat sink 70 to the housing 68.

[0102] In this embodiment, the accommodating portion 82 has a closed cross-section in the direction parallel to the first surface 74. That is, the accommodating portion 82 is a closed, non-transparent groove provided on the printed circuit board 72. Preferably, the cross-section of the accommodating portion 82 in the direction parallel to the first surface 74 is square. Of course, the cross-section of the accommodating portion 82 in the direction parallel to the first surface 74 can also be set to other shapes.

[0103] Alternatively, the accommodating portion 82 may be configured with an open cross-section in the direction parallel to the first surface 74. For example, the accommodating portion 82 may be configured with a U-shaped or L-shaped cross-section in the direction parallel to the first surface 74. Correspondingly, there may be three or two side surfaces 80. Of course, other open shapes may also be provided.

[0104] In this embodiment, the first optoelectronic chip 84 is a transmitter chipset, and the second optoelectronic chip 86 is a receiver chipset. Of course, the first optoelectronic chip 84 can also be configured as a receiver chipset, and the second optoelectronic chip 86 as a transmitter chipset. Alternatively, both the first optoelectronic chip 84 and the second optoelectronic chip 86 can be configured as transmitter chipsets, or both can be configured as receiver chipsets.

[0105] The printed circuit board 72 is bonded to the heat sink device 70. Of course, other connection methods can also be used to connect the printed circuit board 72 to the heat sink device 70. In this embodiment, the first photoelectric chip 84 and the second photoelectric chip 86 are located on different sides of the heat sink device 70. Specifically, the first photoelectric chip 84 and the second photoelectric chip 86 are disposed on opposite sides of the heat sink device 70. Of course, the first photoelectric chip 84 and the second photoelectric chip 86 can also be disposed on the same side of the heat sink device 70. Specifically, when the first photoelectric chip 84 and the second photoelectric chip 86 are located on different sides of the heat sink device 70, the first heat sink 94 is provided with holes or slots for light to pass through; of course, optical fibers can also be used to connect the optical path, etc.

[0106] In addition, a first electrical isolation pad 100 is provided between the first optoelectronic chip 84 and the heat sink device 70. The first electrical isolation pad 100 is thermally connected to the heat sink device 70 and electrically isolated, so that the heat generated by the first optoelectronic chip 84 can be transferred to the housing 68 through the heat sink device 70 for heat dissipation, while achieving electrical isolation between the housing 68, the heat sink device 70 and the first optoelectronic chip 84. This makes the optical module perform stably and is safe to use.

[0107] A second electrical isolation pad (not shown) is provided between the second optoelectronic chip 86 and the heat sink device 70. The second electrical isolation pad is thermally connected to the heat sink device 70 while providing electrical isolation. Similarly, the heat generated by the second optoelectronic chip 86 can be transferred to the housing 68 through the heat sink device 70 for heat dissipation, while simultaneously achieving electrical isolation between the housing 68, the heat sink device 70, and the second optoelectronic chip 86. This makes the optical module more stable in performance and safer to use.

[0108] Specifically, the first electrical isolation pad 100 is disposed between the first optoelectronic chip 84 and the first heat sink 94, and the second electrical isolation pad is disposed between the second optoelectronic chip 86 and the second heat sink 96.

[0109] See Figures 13 to 14The third embodiment of the present invention has a different configuration of the printed circuit board 103 and the accommodating portion 104 from the second embodiment, but the other configurations are the same as those in the second embodiment. The different parts will be described in detail below, while the same parts will not be described in detail.

[0110] In this embodiment, the accommodating portion 104 has an open cross-section in the direction parallel to the first surface 106. Specifically, the cross-section of the accommodating portion 104 in the direction parallel to the first surface 106 is arranged as a straight line. Correspondingly, there is one side. That is, the printed circuit board 103 has steps to form the accommodating portion 104.

[0111] The optical module includes an optical interface and an electrical interface. A stepped circuit board 110 is formed at the end of the printed circuit board 103 near the optical interface. The steps of the stepped circuit board 110 form a receiving portion 104 for accommodating the second optoelectronic chip 114. The stepped circuit board 110 can be a rigid circuit board or a flexible circuit board. That is, a flexible circuit board can be connected to the end of the printed circuit board 103 near the optical interface, and the flexible circuit board and the end of the printed circuit board 103 together form the receiving portion 104 for accommodating the second optoelectronic chip 114.

[0112] In this embodiment, the first photoelectric chip 112 is close to and electrically connected to the printed circuit board 103, and the second photoelectric chip 114 is close to and electrically connected to the stepped circuit board 110. Alternatively, the first photoelectric chip 112 can be positioned close to and electrically connected to the stepped circuit board 110, and correspondingly, the second photoelectric chip 114 can be positioned close to and electrically connected to the printed circuit board 103.

[0113] Similarly, the first optoelectronic chip 112 is a transmitter chipset, and the second optoelectronic chip 114 is a receiver chipset. Of course, the first optoelectronic chip 112 can also be configured as a receiver chipset, and the second optoelectronic chip 114 as a transmitter chipset. Alternatively, both the first optoelectronic chip 112 and the second optoelectronic chip 114 can be configured as transmitter chipsets, or both can be configured as receiver chipsets.

[0114] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0115] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. An optical module, characterized in that, The optical module includes a housing, a heat sink disposed within the housing and thermally connected to the housing, and a printed circuit board partially disposed on the heat sink. The optical module also includes a first photoelectric chip and a second photoelectric chip thermally connected to the heat sink, the first photoelectric chip and the second photoelectric chip being located on different sides of the heat sink; the first photoelectric chip is electrically connected to one side of the printed circuit board, and the second photoelectric chip is electrically connected to the other side of the printed circuit board.

2. The optical module according to claim 1, characterized in that, The heat sink device is provided with holes or slots that allow light to pass through, so that the first optoelectronic chip and the second optoelectronic chip can establish an optical path connection.

3. The optical module according to claim 1, characterized in that, The first optoelectronic chip and the second optoelectronic chip are connected by optical fiber.

4. The optical module according to claim 1, characterized in that, The printed circuit board has a first surface and a second surface opposite to the first surface, the first optoelectronic chip is electrically connected to the second surface, and the second optoelectronic chip is electrically connected to the first surface.

5. The optical module according to claim 4, characterized in that, The first optoelectronic chip is disposed on one side of the printed circuit board, and the second optoelectronic chip is disposed on the other side of the printed circuit board.

6. The optical module according to claim 4, characterized in that, The heat sink device includes a first heat sink and a second heat sink that is thermally connected to the first heat sink. The first photoelectric chip is disposed in the first heat sink, and the second photoelectric chip is disposed in the second heat sink.

7. The optical module according to any one of claims 1 to 6, characterized in that, The printed circuit board has a first surface, a second surface opposite to the first surface, and a receiving portion located on the first surface. The second photoelectric chip is disposed in the receiving portion, and the heat sink is at least partially disposed in the receiving portion.

8. The optical module according to claim 7, characterized in that, The receiving portion is a receiving groove, and the heat sink device is located between the second optoelectronic chip and the printed circuit board.

9. The optical module according to claim 7, characterized in that, The receiving portion is an opening that passes through the printed circuit board, the heat sink is partially located in the receiving portion, and the second optoelectronic chip is at least partially located in the receiving portion.

10. The optical module according to claim 6, characterized in that, The optical module includes an optical interface and an electrical interface. The first heat sink and the second heat sink are L-shaped. The first heat sink is located near the end of the printed circuit board adjacent to the optical interface, and the second heat sink is located near the side of the printed circuit board perpendicular to the end.

11. The optical module according to claim 6, characterized in that, The first heat sink and the second heat sink are either separate structures or integrated structures.

12. The optical module according to claim 6, characterized in that, The first heat sink has a first protrusion, the second heat sink has a second protrusion parallel to the first protrusion, the first photoelectric chip is disposed on the first protrusion, and the second photoelectric chip is located on the second protrusion.

13. The optical module according to claim 1, characterized in that, The optical module includes an optical interface and an electrical interface. The printed circuit board near the end of the optical interface forms a stepped circuit board, and the steps of the stepped circuit board form a receiving portion for accommodating the second optoelectronic chip.

14. The optical module according to claim 1, characterized in that, The optical module includes an optical interface and an electrical interface. A flexible circuit board is connected to the end of the printed circuit board near the optical interface. The ends of the flexible circuit board and the printed circuit board form a accommodating portion for housing the second optoelectronic chip.

15. The optical module according to claim 1, characterized in that, The first photoelectric chip is located on the outside of the printed circuit board. The first photoelectric chip is electrically connected to the printed circuit board through gold wires. The heat sink device is bonded to the printed circuit board.

16. The optical module according to claim 1, characterized in that, The first optoelectronic chip is a laser or a laser array, and the second optoelectronic chip is a photodetector or a photodetector array, and the second optoelectronic chip is disposed on the heat sink.

17. The optical module according to claim 1, characterized in that, The first photoelectric chip is disposed on the heat sink device, and an electrical isolation pad is provided between the first photoelectric chip and the heat sink device. The electrical isolation pad is thermally connected to the heat sink device and electrically isolated.

18. The optical module according to claim 4, characterized in that, The housing includes a first housing and a second housing connected to the first housing. The second housing is the main heat dissipation surface, and the first housing is the secondary heat dissipation surface. A first heat dissipation pad is provided between the heat sink and the second housing. The projection of the first heat dissipation pad on the first surface at least partially overlaps with the projection of the photoelectric chip on the first surface.

19. The optical module according to claim 18, characterized in that, The second photoelectric chip is disposed opposite to the second housing, and the first photoelectric chip is disposed opposite to the first housing.

20. The optical module according to claim 1, wherein the circuit board is a rigid circuit board.

21. The optical module according to claim 1, characterized in that, The optical module includes an optical interface and an electrical interface, and the circuit board has a gold finger at one end near the electrical interface for electrical connection with the outside.

22. An optical module, the optical module comprising a housing, a heat sink disposed within the housing and thermally connected to the housing, and a printed circuit board partially disposed on the heat sink, the optical module further comprising a first photoelectric chip and a second photoelectric chip disposed on the heat sink, the first photoelectric chip and the second photoelectric chip being separately disposed, the heat sink being provided with a hole or groove for light to pass through, so that the first photoelectric chip and the second photoelectric chip can establish an optical path connection; the first photoelectric chip is electrically connected to one side of the printed circuit board, and the second photoelectric chip is electrically connected to the other side of the printed circuit board.

23. The optical module according to claim 22, characterized in that, The heat sink device includes a first heat sink and a second heat sink that is thermally connected to the first heat sink. The first photoelectric chip is disposed in the first heat sink, and the second photoelectric chip is disposed in the second heat sink.

24. The optical module according to claim 22, characterized in that, The first optoelectronic chip and the second optoelectronic chip are connected by optical fiber.

25. The optical module according to any one of claims 22-24, characterized in that, The optical module includes an optical interface and an electrical interface, and the first optoelectronic chip is located at the end of the printed circuit board near the optical interface.

26. The optical module according to claim 25, characterized in that, The positions of the first optoelectronic chip and the second optoelectronic chip are offset from each other in the direction of the connection between the optical interface and the electrical interface.

27. The optical module according to claim 23, characterized in that, The printed circuit board has a first surface, a second surface opposite to the first surface, and a receiving portion located on the first surface, wherein the second photoelectric chip is disposed in the receiving portion.

28. The optical module according to claim 27, characterized in that, The receiving portion is a receiving groove; or an opening.

29. The optical module according to claim 28, characterized in that, The first heat sink includes a portion connected to the first optoelectronic chip and a portion located above the second optoelectronic chip and connected to the second heat sink.

30. The optical module according to claim 29, characterized in that, The portion of the first heat sink located above the first photoelectric chip and connected to the second heat sink also has a window that exposes the second photoelectric chip.

31. The optical module according to claim 27, characterized in that, The first heat sink and the second heat sink are L-shaped.

32. The optical module according to claim 31, characterized in that, One side of the first heat sink and one side of the second heat sink are on the same straight line, and the two sides are close to the same side of the printed circuit board.

33. The optical module according to claim 22, characterized in that, The first photoelectric chip is located on the outside of the printed circuit board and is electrically connected to the printed circuit board via gold wires; part of the heat sink device is located on the outside of the printed circuit board and is in contact with the first photoelectric chip.

34. The optical module according to claim 22, characterized in that, The optical module includes an optical interface and an electrical interface. The printed circuit board near the end of the optical interface forms a stepped circuit board, and the steps of the stepped circuit board form a receiving portion for accommodating the second optoelectronic chip.

35. The optical module according to claim 22, characterized in that, The optical module includes an optical interface and an electrical interface. A flexible circuit board is connected to the end of the printed circuit board near the optical interface. The ends of the flexible circuit board and the printed circuit board form a accommodating portion for housing the second optoelectronic chip.

36. The optical module according to claim 22, characterized in that, The heat sink is bonded to the printed circuit board, and the second optoelectronic chip is disposed on the heat sink.

37. The optical module according to claim 22, wherein the circuit board is a rigid circuit board.

38. The optical module according to claim 22, characterized in that, The optical module includes an optical interface and an electrical interface, and the circuit board has a gold finger at one end near the electrical interface for electrical connection with the outside.

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