Heat dissipation device and display panel

Abstract

This application belongs to the field of display technology, specifically relating to heat dissipation devices and display panels. The heat dissipation device includes: a heat-conducting component, which includes a heat-conducting plate and a heat-conducting element protruding from the heat-conducting plate; and a heat dissipation assembly, which includes a coolant inlet, heat dissipation holes, and a coolant outlet. The heat dissipation holes correspond to the heat-conducting elements, and the heat-conducting elements are inserted into the heat dissipation holes. The coolant inlet and outlet are interconnected with the heat dissipation holes, allowing coolant to flow from the coolant inlet into the heat dissipation holes to absorb heat from the heat-conducting elements. The coolant then flows out through the coolant outlet. This solution uses a heat-conducting plate to conduct away the high temperature generated by the light source during operation, concentrating the heat on the heat-conducting plate and the heat-conducting elements. By introducing coolant into the heat dissipation holes containing the heat-conducting elements, the heat on the heat-conducting elements and the heat-conducting plate is carried away, reducing the high temperature generated by the light source, increasing the lifespan of the light source, and consequently, increasing the lifespan of the display panel.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of display, and particularly relates to a heat dissipation device and a display panel. BACKGROUND

[0002] With the slow penetration of the application of unmanned driving caused by the 5G network, more entertainment demands of the vehicle display appear. From this point of view, the vehicle display will not be limited to expanding the development space in the original large screen, multi-screen, high contrast and clarity, and will also begin to focus on the improvement of picture quality, such as integral black and high color gamut.

[0003] The direct type backlight can realize the multi-partition area dimming and the curved backlight, and the direct type backlight based on the Mini-LED technology can make the backlight design more compact and thin. Just because of these potential advantages, various use case developers, including vehicle display, pay more and more attention to the Mini-LED direct type backlight scheme. However, since the Mini-LED backlight will generate high temperature when used, the high temperature will reduce the service life of the lamp beads on the Mini-LED backlight, and then will reduce the service life of the Mini-LED display panel. SUMMARY

[0004] The purpose of the application is to provide a heat dissipation device and a display panel, which can reduce the high temperature generated by the light source when working, improve the service life of the light source, and then improve the service life of the display panel.

[0005] The first aspect of the application provides a heat dissipation device, which comprises:

[0006] A heat conduction assembly, which comprises a heat conduction plate and a heat conduction piece protruding on the heat conduction plate;

[0007] A heat dissipation assembly, which comprises a cooling liquid inlet, a heat dissipation hole and a cooling liquid outlet, the heat dissipation hole corresponds to the heat conduction piece, and the heat conduction piece is inserted into the heat dissipation hole;

[0008] The cooling liquid inlet and the cooling liquid outlet are in communication with the heat dissipation hole, the cooling liquid can flow into the heat dissipation hole from the cooling liquid inlet to absorb heat from the heat conduction piece, and the cooling liquid after absorbing heat flows out through the cooling liquid outlet.

[0009] In an exemplary embodiment of the application, the heat conduction assembly comprises a plurality of heat conduction pieces, the plurality of heat conduction pieces are arranged in an array on the heat conduction plate, the heat dissipation assembly comprises a plurality of heat dissipation holes, and the heat dissipation holes correspond to the heat conduction pieces one by one;

[0010] The heat dissipation assembly further comprises a heat dissipation channel, the heat dissipation channel is communicated with adjacent heat dissipation holes, and the heat dissipation channel is communicated with the cooling liquid inlet and the cooling liquid outlet.

[0011] In an exemplary embodiment of the present application, the heat exchange member comprises a heat exchange wheel, the heat exchange wheel is provided with a heat conduction hole, and the heat conduction member is tightly inserted into the heat conduction hole.

[0012] In an exemplary embodiment of the present application, the heat exchange member further comprises a heat conduction block, the heat conduction block is arranged between the inner wall of the heat conduction hole and the heat conduction member, and the heat conduction block is in abutting connection with the inner wall of the heat conduction hole and the heat conduction member.

[0013] In an exemplary embodiment of the present application, the heat exchange member further comprises a first sealing ring, the first sealing ring is sleeved on the outer contour of the heat exchange wheel, and the first sealing ring is in abutting connection with the inner wall of the heat dissipation hole away from the heat exchange wheel.

[0014] In an exemplary embodiment of the present application, the heat dissipation assembly comprises:

[0015] A first layer plate, the first layer plate is provided with a first through hole, the first through hole corresponds to the heat conduction member;

[0016] A second layer plate, the second layer plate is arranged on the side of the first layer plate away from the heat conduction plate, the second layer plate is provided with the heat dissipation hole and the heat dissipation channel, the heat exchange member is arranged in the heat dissipation hole on the second layer plate, and the first layer plate covers the heat dissipation channel.

[0017] The heat exchange wheel comprises a base and a first boss, the first boss is protrusively arranged on the side of the base close to the first layer plate, the first boss is inserted into the first through hole, and a second sealing ring is arranged between the first boss and the first through hole.

[0018] In an exemplary embodiment of the present application, the heat dissipation assembly further comprises a third layer plate, the third layer plate is arranged on the side of the second layer plate away from the first layer plate, the third layer plate is provided with a second through hole, the second through hole corresponds to the heat conduction member, the side of the second layer plate close to the third layer plate is provided with the heat dissipation channel, the third layer plate covers the heat dissipation channel of the second layer plate close to the third layer plate, the heat exchange wheel further comprises a second boss, the second boss is protrusively arranged on the side of the base away from the first layer plate, the second boss is inserted into the second through hole, and a third sealing ring is arranged between the second boss and the second through hole.

[0019] The base is provided with flow-through holes for the cooling liquid to flow through, and the flow-through holes communicate the heat dissipation channels of the second layer plate close to the first layer plate and the heat dissipation channels of the second layer plate close to the third layer plate.

[0020] In an exemplary embodiment of the present application, the heat dissipation device further comprises:

[0021] A cooling liquid containing tank;

[0022] A cooling liquid radiator, an inlet of the cooling liquid radiator being in communication with the cooling liquid outlet;

[0023] A hydraulic assembly, the hydraulic assembly comprising a hydraulic cylinder, a movable part and a piston rod, the hydraulic cylinder comprising a first hydraulic inlet, a second hydraulic inlet, a first hydraulic outlet and a second hydraulic outlet, the first hydraulic inlet and the first hydraulic outlet being arranged on the same side of the hydraulic cylinder, the second hydraulic inlet and the second hydraulic outlet being arranged on the same side of the hydraulic cylinder, and the first hydraulic inlet being arranged on the side of the hydraulic cylinder close to the movable part, the second hydraulic inlet being arranged on the side of the hydraulic cylinder away from the movable part, the first hydraulic inlet being in communication with the outlet of the cooling liquid containing tank, the second hydraulic inlet being in communication with the outlet of the cooling liquid radiator, the first hydraulic outlet being in communication with the cooling liquid inlet, and the second hydraulic outlet being in communication with the inlet of the cooling liquid containing tank; the piston rod being movable in the hydraulic cylinder, and when the piston rod moves towards the first hydraulic inlet, the cooling liquid in the hydraulic cylinder is pressed into the cooling liquid inlet, and the cooling liquid in the cooling liquid radiator is collected into the hydraulic cylinder; when the piston rod moves towards the second hydraulic inlet, the cooling liquid in the hydraulic cylinder is pressed into the cooling liquid containing tank, and the cooling liquid in the cooling liquid containing tank is pressed into the hydraulic cylinder;

[0024] The flow channels of the first hydraulic outlet and the cooling liquid inlet are provided with a first one-way valve, and the flow channels of the first hydraulic inlet and the outlet of the cooling liquid containing tank are provided with a second one-way valve.

[0025] In an exemplary embodiment of the present application, the movable part comprises an elastic member arranged in the vertical direction and a pressurizing member, one end of the pressurizing member being connected to the elastic member, and the other end of the pressurizing member being connected to the piston rod, the pressurizing member being capable of pushing the piston rod to move towards the second hydraulic inlet during downward movement of the pressurizing member, the pressurizing member being capable of moving upwards under the elastic action of the elastic member, and the pressurizing member being capable of pulling the piston rod to move towards the first hydraulic inlet during upward movement of the pressurizing member; and / or

[0026] The cooling liquid radiator comprises cooling fins and a cooling box, the inlet of the cooling box is communicated with the cooling liquid outlet, a plurality of the cooling fins are protruded on the cooling box, and cooling flow channels are arranged between adjacent cooling fins.

[0027] The second aspect of the present application provides a display panel, comprising a back plate, an optical film, a light emitting piece and the heat dissipation device, the light emitting piece is arranged between the back plate and the optical film, the light emitting piece comprises a lamp plate and a plurality of light emitting sources arranged on the lamp plate, the light emitting sources are arranged on the side of the lamp plate facing the optical film, the back plate is provided with a plurality of through holes, the through holes correspond to the light emitting sources;

[0028] The heat dissipation device is arranged between the back plate and the lamp plate, the heat conducting piece is arranged on the side of the heat conducting plate facing the back plate, and the heat conducting piece corresponds to the through hole, the part of the heat conducting piece penetrating through the through hole is inserted into the heat dissipation hole.

[0029] The present application has the following beneficial effects:

[0030] The present application includes a heat dissipation device and a display panel, the heat dissipation device can conduct away the high temperature generated by the light emitting source during work through the heat conducting plate, and the heat is concentrated on the heat conducting plate and the heat conducting piece, the cooling liquid is introduced into the heat dissipation hole in which the heat conducting piece is inserted to take away the heat on the heat conducting piece and the heat conducting plate, the high temperature generated by the light emitting source is reduced, the service life of the light emitting source is improved, and the service life of the display panel is improved.

[0031] Other characteristics and advantages of the present application will become apparent from the following detailed description, or will be learned by practice of the present application.

[0032] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0033] The drawings incorporated into the specification and forming a part thereof, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0034] Figure 1 The structure schematic diagram of the heat dissipation device provided by the first embodiment or the second embodiment of the present application is shown in cooperation with the backlight module;

[0035] Figure 2An exploded view of the display panel provided in Embodiment 1 or Embodiment 2 of this application is shown;

[0036] Figure 3 A schematic diagram of the structure of the heat-conducting component provided in Embodiment 1 or Embodiment 2 of this application is shown;

[0037] Figure 4 An exploded structural diagram of the heat dissipation component provided in Embodiment 1 or Embodiment 2 of this application is shown;

[0038] Figure 5 This illustration shows a schematic diagram of the structure of the heat exchange component provided in Embodiment 1 or Embodiment 2 of this application, which is disposed in the heat dissipation hole;

[0039] Figure 6 It shows Figure 5 A partially enlarged schematic diagram showing the heat exchange component at point A inside the heat dissipation hole;

[0040] Figure 7 This illustration shows a cross-sectional structural diagram of a heat exchange component provided in Embodiment 1 or Embodiment 2 of this application, which is disposed within a heat dissipation hole.

[0041] Figure 8 This shows a schematic diagram of the structure of the second layer plate provided in Embodiment 1 or Embodiment 2 of this application;

[0042] Figure 9 A schematic diagram of the structure of the heat exchange component provided in Embodiment 1 or Embodiment 2 of this application is shown;

[0043] Figure 10 This paper shows a schematic diagram of the structure of the first boss, the base, and the second boss provided in Embodiment 1 or Embodiment 2 of this application;

[0044] Figure 11 This shows a schematic diagram of the heat dissipation device provided in Embodiment 1 or Embodiment 2 of this application;

[0045] Figure 12 A schematic diagram of the coolant flow path during the downward movement of the pressurized component provided in Embodiment 1 or Embodiment 2 of this application is shown.

[0046] Figure 13 This diagram illustrates the flow path of the coolant during the upward movement of the pressurized component provided in Embodiment 1 or Embodiment 2 of this application.

[0047] Figure 14 A schematic diagram of the structure of the coolant radiator provided in Embodiment 1 or Embodiment 2 of this application is shown;

[0048] Figure 15 A cross-sectional structural schematic diagram of the coolant radiator provided in Embodiment 1 or Embodiment 2 of this application is shown.

[0049] Explanation of reference numerals in the attached figures:

[0050] 10. Heat dissipation device; 11. Heat-conducting component; 110. Heat-conducting plate; 111. Heat-conducting element; 12. Heat dissipation component; 120. Coolant inlet; 121. Heat dissipation hole; 122. Coolant outlet; 123. Heat dissipation channel; 124. Heat exchanger; 1240. Heat-conducting hole; 1241. Heat exchange wheel; 12410. Base; 12411. First boss; 12412. Second boss; 12413. Flow hole; 1242. Heat conduction block; 1243. First sealing ring; 1244. Second sealing ring; 1245. Third sealing ring; 125. First layer plate; 1250. First through hole; 1251. First annular protrusion; 126. Second layer plate; 127. Third layer plate; 1270. Second through hole; 1271. 13. Second annular protrusion; 14. Coolant reservoir; 15. Coolant radiator; 16. Cooling fins; 17. Cooling tank; 18. Hydraulic assembly; 19. Hydraulic cylinder; 10. First hydraulic inlet; 11. Second hydraulic inlet; 12. First hydraulic outlet; 13. Second hydraulic outlet; 14. Movable part; 15. Elastic element; 16. Pressurizing element; 17. Piston rod; 18. Connecting part; 19. Push-pull part; 10. First check valve; 10. Second check valve; 21. Backlight module; 22. Back plate; 23. Through hole; 24. Light-emitting element; 25. Lamp board; 26. Light source; 37. Optical film; 48. Middle frame; 59. Diffuser plate; 60. Edge binding tape. Detailed Implementation

[0051] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0052] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0053] In this application, unless otherwise expressly specified and limited, the terms "assembly," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0054] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0055] Example 1

[0056] See Figure 1 and Figure 2 As shown, Embodiment 1 of this application provides a heat dissipation device 10, which can cool down the heat generated by the backlight module 20 in the Mini-LED display panel, improve the service life of the backlight module 20, and thus improve the service life of the Mini-LED display panel.

[0057] It should be noted that the heat dissipation device 10 is not limited to the heat dissipation of Mini-LED backlight, but can also be MicroLED backlight, LCD backlight, etc., which will not be elaborated here.

[0058] It is worth mentioning that, see Figure 2 As shown, the backlight module 20 in the Mini-LED display panel includes a back plate 21 and a light-emitting element 22. The light-emitting element 22 includes a lamp board 220 and a light source 221. The light source 221 is arranged in an array on the lamp board 220, and the light source 221 is located on the side of the lamp board 220 away from the back plate 21, that is, the light source 221 faces the light-emitting side, which is also the side of the display screen.

[0059] Further, see Figures 3 to 10As shown, in order to cool down the backlight module 20, the heat dissipation device 10 includes a heat-conducting component 11 and a heat dissipation component 12. The heat-conducting component 11 can conduct away the high temperature generated by the light-emitting element 22 in the backlight module 20, and the heat conducted by the heat-conducting component 11 is cooled down by the coolant and the heat dissipation component 12, thereby dissipating heat from the backlight module 20, improving the service life of the light-emitting element 22, and thus improving the service life of the display panel.

[0060] Among them, see Figure 2 As shown, the heat-conducting component 11 includes a heat-conducting plate 110, which can be disposed between the lamp panel 220 and the back plate 21 to absorb the heat generated by the light source 221 onto the heat-conducting plate 110, thereby reducing the temperature of the lamp panel 220 and the light source 221. To improve the heat absorption rate, the heat-conducting plate 110 can be made of a material with good thermal conductivity, such as silver, copper, gold, aluminum, diamond, silicon, etc. In addition, the area of ​​the heat-conducting plate 110 can be the same as the area of ​​the lamp panel 220, or the area of ​​the heat-conducting plate 110 can be larger than the area of ​​the lamp panel 220, to ensure better absorption of the heat generated by the lamp panel 220 and the light source 221.

[0061] In this embodiment, the heat-conducting plate 110 is made of heat-conducting copper plate so as to conduct and absorb the heat generated by the lamp plate 220 and the light source 221.

[0062] In addition, the heat conduction plate 110 can be connected to the back plate 21 and the lamp plate 220 by adhesive bonding to prevent the heat conduction plate 110 from shaking between the back plate 21 and the lamp plate 220 and to ensure the heat conduction effect.

[0063] For example, the side of the heat-conducting plate 110 away from the lamp plate 220 is fixedly connected to the back plate 21 by double-sided adhesive strips, and the side of the heat-conducting plate 110 away from the back plate 21 is fixedly connected to the side of the lamp plate 220 away from the light source 221 by thermally conductive adhesive coated on the entire surface.

[0064] It is understandable that the heat-conducting plate 110 and the lamp board 220 are connected by coating the entire surface with thermally conductive adhesive, which can improve the heat absorption of the lamp board 220 by the heat-conducting plate 110, thereby better dissipating heat from the lamp board 220 and the light source 221 and improving the service life of the light source 221.

[0065] like Figure 3As shown, in order to dissipate heat from the heat-conducting plate 110, the heat-conducting plate 110 also includes a heat-conducting element 111. The heat-conducting element 111 protrudes from the heat-conducting plate 110 and extends towards the back plate 21. The heat-conducting element 111 can conduct heat from the heat-conducting plate 110 to the heat dissipation assembly 12, and the heat conducted from the heat-conducting plate 110 to the heat-conducting element 111 is dissipated by the coolant. The heat flow through the light source 221—lamp panel 220—heat-conducting plate 110—heat-conducting element 111—coolant achieves heat dissipation for the lamp panel 220 and the light source 221, reducing the heat of the lamp panel 220 and the light source 221, thereby improving the lifespan of the light source 221 and ensuring display performance.

[0066] In this embodiment, the heat-conducting component 111 can also be made of the same material as the heat-conducting plate 110, such as silver, copper, gold, aluminum, diamond, silicon, etc., which can improve the heat conduction efficiency. In this embodiment, the heat-conducting component 111 is a copper pillar, and the heat-conducting component 111 is connected to the heat-conducting plate 110 by a detachable method such as riveting or threaded connection.

[0067] It should be noted that the heat dissipation component 12 can be disposed between the heat conduction plate 110 and the back plate 21, or it can be disposed on the back plate 21 away from the heat conduction plate 110. The back plate 21 is provided with through holes 210 to avoid the heat conduction component 111. The through holes 210 correspond to the heat conduction component 111 in terms of position and number, and the part of the heat conduction component 111 passing through the through holes 210 is connected to the heat dissipation component 12 to dissipate heat from the heat conduction plate 110 and the heat conduction component 111.

[0068] In one exemplary embodiment, a heat dissipation assembly 12 is disposed between a heat-conducting plate 110 and a back plate 21. The heat dissipation assembly 12 includes a coolant inlet 120, a heat dissipation hole 121, and a coolant outlet 122. The heat dissipation hole 121 communicates with the coolant inlet 120 and the coolant outlet 122. A heat-conducting element 111 is inserted into the heat dissipation hole 121. Coolant enters the heat dissipation hole 121 through the coolant inlet 120 to dissipate heat from the heat-conducting element 111, thereby dissipating heat from the lamp panel 220, the light source 221, and the heat-conducting plate 110, reducing the heat generated by the light source 221 and improving its lifespan. Furthermore, the coolant, after absorbing heat, flows out through the coolant outlet 122, thus completing the heat dissipation for the light source 22.

[0069] Another example, see Figure 1As shown, the heat dissipation assembly 12 is located on the side of the back plate 21 away from the heat-conducting plate 110. The heat dissipation assembly 12 includes a coolant inlet 120, a heat dissipation hole 121, and a coolant outlet 122. The heat dissipation hole 121 communicates with the coolant inlet 120 and the coolant outlet 122. The back plate 21 has a through hole 210 corresponding to the heat-conducting component 111. The portion of the heat-conducting component 111 passing through the through hole 210 is combined with the heat dissipation hole 121. Coolant enters the heat dissipation hole 121 through the coolant inlet 120 to dissipate heat from the heat-conducting component 111, thereby dissipating heat from the lamp panel 220, the light source 221, and the heat-conducting plate 110, reducing the heat generated by the light source 221 and improving its service life. In addition, the coolant that has absorbed heat flows out through the coolant outlet 122, thus completing the heat dissipation of the light source 22.

[0070] In this embodiment, the heat dissipation component 12 is disposed on the side of the back plate 21 away from the heat conduction plate 110, that is, the heat dissipation component 12 and the backlight module 20 are separated to reduce the thickness of the backlight module 20 and make the product more aesthetically pleasing.

[0071] It should be noted that this coolant can also be water or other heat-absorbing liquids.

[0072] In addition, the back panel 21 can be made of plastic, alloy or glass.

[0073] In this embodiment, due to the high light transmittance, high hardness, and high rigidity of glass, when used as a backplate 21, the backlight module 20 exhibits high flatness and bright, translucent edges, resulting in an appearance distinct from existing sheet metal backplate 21 module products. Therefore, modules using glass backplates 21 are more likely to attract consumers' attention. However, glass backplates 21 are not heat-resistant and are prone to cracking under high temperatures, leading to the failure of the backlight module 20. Therefore, this application employs a heat dissipation device 10 to dissipate the heat generated by the light-emitting element 22, improving the lifespan of the light-emitting element 22 and preventing the glass backplate 21 from cracking due to high temperatures, thus ensuring the integrity of the backlight module 20.

[0074] Furthermore, one or more heat-conducting elements 111 may be provided on the heat-conducting plate 110, and correspondingly, the heat dissipation assembly 12 is provided with a number of heat dissipation holes 121 corresponding to the heat-conducting elements 111, so as to realize the conduction of heat on the heat-conducting plate 110.

[0075] In some embodiments, a heat-conducting element 111 is provided at the center of the heat-conducting plate 110. The heat-conducting element 111 extends toward the back plate 21 and passes through the through hole 210 on the back plate 21. The part of the heat-conducting element 111 that passes through is inserted into the heat dissipation hole 121. Coolant flows into the heat dissipation hole 121 through the coolant inlet 120 to absorb heat from the heat-conducting element 111.

[0076] In the embodiments of this application, see Figure 3 As shown, the heat-conducting plate 110 employs multiple heat-conducting components 111, which are arranged in an array on the heat-conducting plate 110. Each heat-conducting component 111 corresponds one-to-one with a light source 221 on the lamp panel 220, i.e., one heat-conducting component 111 corresponds to one light source 221. Correspondingly, the heat dissipation assembly 12 includes multiple heat dissipation holes 121 corresponding to the heat-conducting components 111. In this way, by using one heat-conducting component 111 to correspond to one light source 221 and one heat dissipation hole 121, heat dissipation of the light source 221 can be ensured, the heat generated by the light source 221 can be reduced, and the service life of the light source 22 can be improved.

[0077] It is worth mentioning that the heat dissipation component 12 is provided with multiple heat dissipation holes 121. Each heat dissipation hole 121 corresponds to a coolant flow channel, meaning each heat dissipation hole 121 is independently set up. Independent coolant flows into each heat dissipation hole 121 to dissipate heat from the heat-conducting component 111, greatly improving heat dissipation for the heat-conducting component 111 and thus improving the heat dissipation effect on the light-emitting component 22. Alternatively, adjacent heat dissipation holes 121 can be interconnected through heat dissipation channels 123. The inlet end of the heat dissipation channel 123 is connected to the coolant inlet 120, and the outlet end of the heat dissipation channel 123 is connected to the coolant outlet 122. Connecting adjacent heat dissipation holes 121 through the heat dissipation channels 123 simplifies the coolant inflow structure and makes the overall design simpler.

[0078] In the embodiments of this application, see Figure 4 , Figure 5 and Figure 8 As shown, the heat dissipation assembly 12 is provided with a heat dissipation channel 123, which connects to adjacent heat dissipation holes 121. Coolant flows into the heat dissipation channel 123 through the coolant inlet 120, and flows through the heat dissipation channel 123 to each heat dissipation hole 121 to absorb heat from each heat-conducting component 111.

[0079] It should be noted that the multiple heat dissipation holes 121 are arranged in an array in both the row and column directions. The heat dissipation channel 123 can connect only the heat dissipation holes 121 in the row direction. Furthermore, adjacent heat dissipation holes 121 at the edge are connected through the heat dissipation channel 123 to form a coolant loop. Correspondingly, the heat dissipation channel 123 can also connect only the heat dissipation holes 121 in the column direction. Furthermore, adjacent heat dissipation holes 121 at the edge are connected through the heat dissipation channel 123 to form a coolant loop. The heat dissipation channel 123 can connect the heat dissipation holes 121 in both the row and column directions; that is, one heat dissipation hole 121 connects to adjacent heat dissipation holes 121 in the row direction and adjacent heat dissipation holes 121 in the column direction. This interconnection of heat dissipation holes 121 ensures effective heat dissipation for the heat-conducting component 111, improves coolant utilization, and thus improves the heat absorption efficiency of the heat-conducting component 111, enhances the heat absorption effect of the light-emitting component 22, and extends the service life of the light-emitting component 22.

[0080] In addition, a heat exchange component 124 is provided in the heat dissipation hole 121. The heat exchange component 124 includes a heat conduction hole 1240. The heat conduction component 111 is tightly inserted into the heat conduction hole 1240 to improve the heat absorption of the heat conduction component 111, thereby improving the heat absorption effect.

[0081] It should be understood that the opening area of ​​the heat dissipation hole 121 is greater than or equal to the area of ​​the heat exchange component 124, so as to ensure the contact area between the coolant and the heat exchange component 124 and avoid coolant leakage.

[0082] Among them, see Figure 9 and Figure 10 As shown, the heat exchange component 124 includes a heat exchange wheel 1241 and a heat conduction block 1242. The heat exchange wheel 1241 is provided with the aforementioned heat conduction holes 1240. The heat conduction block 1242 is disposed between the inner wall of the heat conduction holes 1240 and the heat conduction component 111. The heat is conducted to the heat exchange wheel 1241 through the heat conduction block 1242, thereby increasing the contact area of ​​the coolant and improving the heat absorption effect on the heat conduction component 111.

[0083] For example, see Figure 5 and Figure 6 As shown, the heat conduction block 1242 is embedded in the heat conduction hole 1240. When the heat conduction element 111 is inserted into the heat conduction hole 1240, the outer wall of the heat conduction element 111 is in close contact with the heat conduction block 1242, so that the heat on the heat conduction element 111 can be transferred to the heat exchange wheel 1241 through the heat conduction block 1242. When the coolant flows through the heat dissipation hole 121, it comes into contact with the heat exchange wheel 1241. In this way, the heat exchange between the coolant and the heat exchange wheel 1241 can increase the absorption area of ​​the coolant, thereby absorbing the heat on the heat conduction element 111 more quickly, reducing the heat of the heat conduction element 111 more quickly, and thus reducing the heat generated by the light-emitting element 22 more quickly.

[0084] It should be noted that the heat exchange wheel 1241 and the heat conduction block 1242 can be made of materials with good thermal conductivity, such as silver, copper, gold, aluminum, diamond, silicon, etc., to improve the thermal conductivity and enable the heat on the heat conduction component 111 to be transferred to the heat exchange wheel 1241 more quickly.

[0085] In this embodiment, the heat exchange wheel 1241 is made of copper and the heat conduction block 1242 is made of thermal grease, which can improve the conduction of heat on the heat conduction component 111 and reduce the heat on the heat conduction component 111 more quickly.

[0086] In addition, see Figure 9 and Figure 10 As shown, in order to prevent coolant from leaking out from the gap between the heat exchanger 124 and the heat dissipation hole 121, the heat exchanger 124 also includes a first sealing ring 1243. The first sealing ring 1243 is sleeved on the outer contour of the heat exchange wheel 1241. When the heat exchanger 124 is located inside the heat dissipation hole 121, the inner wall and the outer wall of the first sealing ring 1243 abut against the outer contour of the heat exchange wheel 1241 and the inner wall of the heat dissipation hole 121, respectively.

[0087] Furthermore, see Figure 4 and Figure 7 As shown, this heat dissipation assembly 12 includes a composite plate, which includes a first plate 125 and a second plate 126. The first plate 125 is provided with a first through hole 1250, and the position and number of the first through hole 1250 correspond to the position and number of the heat-conducting element 111. The second plate 126 is provided with the aforementioned heat dissipation hole 121 and heat dissipation channel 123. A heat exchange element 124 is provided in the heat dissipation hole 121. The heat-conducting element 111 is inserted into the heat-conducting hole 1240 of the heat exchange element 124 through the first through hole 1250. The coolant flows into the heat dissipation channel 123 through the coolant inlet 120 to dissipate heat from the heat exchange wheel 1241 and the heat-conducting element 111, so as to dissipate the high temperature generated by the light-emitting element 22.

[0088] For example, the first plate 125 and the second plate 126 have the same area. The first plate 125 has a first through hole 1250. The second plate 126 has heat dissipation holes 121 and heat dissipation channels 123. The opening area of ​​the first through hole 1250 is smaller than the opening area of ​​the heat dissipation hole 121. The first plate 125 covers the heat dissipation channel 123 on the second plate 126 to prevent coolant leakage, so that the coolant can flow in the heat dissipation channel 123 and the heat dissipation hole 121 to ensure the cooling effect.

[0089] It should be noted that the diameter of the first through hole 1250 can be the same as the cross-sectional area of ​​the heat-conducting element 111. Alternatively, the diameter of the first through hole 1250 can be larger than the cross-sectional area of ​​the heat-conducting element 111. The heat exchange wheel 1241 includes a base 12410 and a first boss 12411. The first boss 12411 protrudes from the base 12410 on the side near the first layer plate 125, and is located at the center of the base 12410. The aforementioned heat-conducting hole 1240 is provided at the center of the first boss 12411 and the base 12410. 2411 is inserted into the first through hole 1250 so that the part of the heat-conducting element 111 passing through the back plate 21 can fully contact the first boss 12411 and the heat-conducting hole 1240 of the base 12410, thereby increasing the contact area of ​​the heat-conducting element 111 and better transferring the heat on the heat-conducting element 111 to the heat exchange element 124, improving the heat dissipation effect on the heat-conducting element 111, thereby improving the heat dissipation effect on the light-emitting element 22 and increasing the service life of the light-emitting element 22.

[0090] In addition, see Figure 7 As shown, the first layer plate 125 is provided with a first annular protrusion 1251 in the direction close to the second layer plate 126. The first annular protrusion 1251 corresponds to the first through hole 1250, that is, the first annular protrusion 1251 is provided on the outer end face of the first through hole 1250. When the first boss 12411 is inserted into the first through hole 1250, the first boss 12411 is fitted with a second sealing ring 1244. The second sealing ring 1244 is fitted into the first through hole 1250, and its first annular protrusion 1251 abuts against the side of the base 12410 close to the first layer plate 125 to seal the heat dissipation hole 121. A portion of the first boss 12411 is inserted into the first through hole 1250. In this way, the second sealing ring 1244 and the first annular protrusion 1251 can prevent coolant leakage and ensure the heat dissipation effect of the coolant on the heat exchange component 124.

[0091] In addition, see Figure 4 , Figure 7 and Figure 10As shown, in order to further improve the heat dissipation effect of the heat exchange component 124, the heat dissipation assembly 12 also includes a third layer plate 127. The third layer plate 127 is located on the side of the second layer plate 126 away from the first layer plate 125. The side of the second layer plate 126 facing the third layer plate 127 is also provided with a heat dissipation channel 123, and the heat dissipation hole 121 is a through hole. That is, the heat dissipation channels 123 on both sides of the second layer plate 126 are connected through the heat dissipation hole 121, and the heat dissipation channels 123 are sealed by the first layer plate 125 and the third layer plate 127 to prevent coolant leakage and ensure heat dissipation effect. The third layer plate 127 adopts the same structural design as the first layer plate 125, that is, the third layer plate 127 has a second through hole 1270 with the same diameter as the first through hole 1250 on the first layer plate 125. The third layer plate 127 has a second annular protrusion 1271 in the direction close to the second layer plate 126. The heat exchange component 124 includes a second boss 12412, which is symmetrical to the first boss 12411 relative to the heat exchange wheel 1241. The second boss 12412 also has a heat conduction hole 1240, that is, the heat conduction hole 1240 is also through. A perforation 210 is provided to pass through the first boss 12411, the base 12410, and the second boss 12412. A heat conduction block 1242 is provided inside the heat conduction hole 1240 to improve the heat conduction effect on the heat conduction component 111. In addition, a third sealing ring 1245 is also provided between the second boss 12412 and the second through hole 1270. The third sealing ring 1245 is sleeved in the second through hole 1270, and part of the second boss 12412 is inserted into the second through hole 1270. The third sealing ring 1245 and the second annular protrusion 1271 can prevent coolant leakage.

[0092] It is worth mentioning that, in order to ensure the stability of the first sealing ring 1243, the second sealing ring 1244, and the third sealing ring 1245, grooves for the second sealing ring 1244 and the third sealing ring 1245 can be formed on the outer contours of the base 12410, the first boss 12411, and the second boss 12412 to prevent the second sealing ring 1244 and the third sealing ring 1245 from falling off.

[0093] It is understandable that grooves can also be formed on the inner walls of the heat dissipation hole 121, the first through hole 1250, and the second through hole 1270 to fix the first sealing ring 1243, the second sealing ring 1244, and the third sealing ring 1245 to the inner walls of the heat dissipation hole 121, the first through hole 1250, and the second through hole 1270.

[0094] In addition, see Figure 7 , Figure 9 and Figure 10As shown, in order to connect the heat dissipation channels 123 between the first layer plate 125 and the second layer plate 126 and the heat dissipation channels 123 between the third layer plate 127 and the second layer plate 126, the heat exchange wheel 1241 is provided with flow holes 12413 for coolant to flow through. This allows the coolant to flow in the heat dissipation channels 123 on both sides of the second layer plate 126, thereby improving the heat dissipation effect on the heat-conducting component 111.

[0095] It is understandable that the coolant inlet 120 can be connected to the heat dissipation channel 123 between the first layer plate 125 and the second layer plate 126, or it can be connected to the heat dissipation channel 123 between the third layer plate 127 and the second layer plate 126.

[0096] In the embodiment of the application, the coolant inlet 120 flows in from the heat dissipation channel 123 at the bottom position of the first layer plate 125 and the second layer plate 126, and flows into the heat dissipation channel 123 between the third layer plate 127 and the second layer plate 126 through the flow hole 12413, so that the heat dissipation channel 123 between the first layer plate 125 and the second layer plate 126 and the heat dissipation channel 123 between the third layer plate 127 and the second layer plate 126 are filled with coolant, so as to ensure the heat dissipation effect on the heat conducting component 111, thereby improving the heat dissipation effect on the light-emitting component 22 and increasing the service life of the light-emitting component 22.

[0097] It should be noted that the heat dissipation component 12 can also be an integrated board. The integrated board has heat dissipation channels 123 and heat dissipation holes 121 inside. Heat exchange components 124 are installed in the heat dissipation holes 121 during the manufacturing process. Assembly is more convenient with an integrated board, but replacement and maintenance are more difficult compared to composite boards.

[0098] Furthermore, when using composite panels in this application, the first layer 125, the second layer 126, and the third layer 127 can be made of iron or other metals with good thermal conductivity, such as silver or copper. The first layer 125 can be bonded to the second layer 126, and the second layer 126 can be bonded to the third layer 127.

[0099] In addition, a first coolant interface is provided at the coolant inlet 120 and a second coolant interface is provided at the coolant outlet 122. The first coolant interface and the second coolant interface can be threadedly connected to the coolant inlet 120 and the coolant outlet 122, making it easier to replace or install the coolant interface.

[0100] Further, see Figure 11As shown, the heat dissipation device 10 also includes a coolant reservoir 13, a coolant radiator 14, and a hydraulic assembly 15. The coolant reservoir 13 is used to contain coolant, the coolant radiator 14 is used to cool the coolant flowing out of the coolant outlet 122 of the heat dissipation assembly 12, and the hydraulic assembly 15 is used to pump the coolant in the coolant reservoir 13 into the heat dissipation hole 121 and to pump the coolant in the coolant radiator 14 into the coolant reservoir 13.

[0101] Understandably, the hydraulic component 15 can employ a structure such as a hydraulic pump or a hydraulic cylinder 150 to pump or discharge cooling pressure.

[0102] In this embodiment of the application, the hydraulic assembly 15 includes a hydraulic cylinder 150, a movable part 151, and a piston rod 152. The movable part 151 and the piston rod 152 can press the cooling liquid in the hydraulic cylinder 150 into or out.

[0103] Among them, see Figure 11 As shown, the hydraulic cylinder 150 includes a first hydraulic inlet 1500, a second hydraulic inlet 1501, a first hydraulic outlet 1502, and a second hydraulic outlet 1503. The first hydraulic inlet 1500 and the first hydraulic outlet 1502 are located on opposite sides of the hydraulic cylinder 150 in the radial direction. The second hydraulic inlet 1501 and the second hydraulic outlet 1503 are located on opposite sides of the hydraulic cylinder 150 in the radial direction. The first hydraulic inlet 1500 and the second hydraulic inlet 1501 are arranged in the longitudinal direction of the hydraulic cylinder 150, that is, the first hydraulic inlet 1500 and the second hydraulic inlet 1501 are respectively located on opposite sides of the hydraulic cylinder 150 in the longitudinal direction. The first hydraulic inlet 1500 of the hydraulic cylinder 150 is connected to the outlet of the coolant reservoir 13 through a delivery pipe to pump the coolant from the coolant reservoir 13 into the hydraulic cylinder 150. The second hydraulic inlet 1501 of the hydraulic cylinder 150... Similarly, the coolant is connected to the outlet of the coolant radiator 14 via a delivery pipe. The inlet of the coolant radiator 14 is connected to the second coolant interface at the coolant outlet 122 via a delivery pipe, so that the coolant after absorbing heat can be delivered to the coolant radiator 14 for cooling. Then, the cooled coolant after the coolant radiator 14 is cooled is pumped into the hydraulic cylinder 150. The first hydraulic outlet 1502 of the hydraulic cylinder 150 is also connected to the first coolant interface at the coolant inlet 120 via a delivery pipe, so that the coolant pumped into the coolant reservoir 13 by the hydraulic cylinder 150 is pumped into the coolant inlet 120 to cool the heat-conducting component 111. The second hydraulic outlet 1503 of the hydraulic cylinder 150 is connected to the inlet of the coolant reservoir 13 via a delivery pipe, so as to pump the cooled coolant after the coolant radiator 14 is cooled into the coolant reservoir 13.

[0104] See Figure 11As shown, the piston rod can move within the hydraulic cylinder. For example, the direction of movement of the piston rod is the length direction of the hydraulic cylinder. The piston rod 152 includes a connecting portion 1520 and a push-pull portion 1521. The push-pull portion 1521 is disposed inside the hydraulic cylinder 150 and contacts the inner wall of the hydraulic cylinder 150. That is, the area of ​​the push-pull portion 1521 is the same as the cross-sectional area of ​​the hydraulic cylinder 150, so as to form mutually isolated receiving spaces in the hydraulic cylinder 150. For example, the receiving space of the push-pull portion 1521 near the first hydraulic inlet 1500 and the first hydraulic outlet 1502 is the first receiving cavity, and the receiving space of the push-pull portion 1521 near the second hydraulic inlet 1501 and the second hydraulic outlet 1503 is the second receiving cavity. The side of the connecting part 1520 away from the push-pull part 1521 is fixedly connected to the movable part 151. The movable part 151 can control the movement of the push-pull part 1521 in the hydraulic cylinder 150 to change the accommodating space of the first accommodating cavity and the second accommodating cavity. For example, when the push-pull part 1521 moves toward the first hydraulic inlet 1500 / first hydraulic outlet 1502, the accommodating space of the first accommodating cavity gradually decreases, and the internal pressure gradually increases. The coolant stored in the coolant tank 13 in the first accommodating cavity is pumped into the coolant inlet 120 to cool and dissipate heat from the heat-conducting component 111. At the same time, the accommodating space of the second accommodating cavity gradually increases, and the coolant cooled in the coolant radiator 14 is collected into the second accommodating cavity through the second hydraulic inlet 1501. When the push-pull part 1521 moves toward the second hydraulic inlet 1501 / second hydraulic outlet 1503, the accommodating space of the first accommodating cavity gradually increases, and the internal pressure is released. The coolant in the coolant tank 13 is pumped into the first accommodating cavity through the first hydraulic inlet 1500 to temporarily store the coolant. At the same time, the accommodating space of the second accommodating cavity gradually decreases, and the internal pressure gradually increases. The coolant in the second accommodating cavity is pumped into the coolant tank 13 through the second hydraulic outlet 1503. This ensures continuous heat dissipation, constantly reducing the temperature of the light-emitting element 22 and extending its service life.

[0105] In addition, to prevent coolant backflow, check valves are installed on all delivery pipes. For example, a first check valve 16 is provided on the flow passage between the first hydraulic outlet 1502 and the coolant inlet 120, that is, a first check valve 16 is provided on the delivery pipe between the first hydraulic outlet 1502 and the coolant inlet 120; a second check valve 17 is provided on the flow passage between the first hydraulic outlet 1502 and the outlet of the coolant reservoir 13, that is, a second check valve 17 is provided on the delivery pipe between the first hydraulic outlet 1502 and the outlet of the coolant reservoir 13.

[0106] In addition, one-way valves can be provided on the delivery pipes of the second hydraulic inlet 1501 and the coolant radiator 14, the coolant outlet 122 and the coolant radiator 14, and the delivery pipes of the second hydraulic outlet 1503 and the coolant container 13 to ensure that the coolant flows according to the predetermined flow path.

[0107] It is worth mentioning that the delivery pipe can be a rubber hose, which makes the flow of coolant smoother.

[0108] In addition, in some embodiments, the heat dissipation device 10 may not use a moving part 151, but instead achieve the flow of coolant by human action on the piston rod 152.

[0109] In this embodiment of the application, in order to make it easier and more convenient for the push-pull part 1521 to move within the hydraulic cylinder 150, the movable part 151 includes an elastic element 1510 and a pressure element 1511. The elastic element 1510 and the pressure element 1511 can be arranged in the length direction of the hydraulic cylinder 150 so as to push the push-pull part 1521 to move.

[0110] For example, the length direction of the hydraulic cylinder 150 is the direction of gravity, that is, the hydraulic cylinder 150 is placed and fixed vertically. The first hydraulic inlet 1500 and the first hydraulic outlet 1502 of the hydraulic cylinder 150 are located on the side of the housing of the hydraulic cylinder 150 close to the moving part 151, and the second hydraulic inlet 1501 and the second hydraulic outlet 1503 are located on the side of the housing of the hydraulic cylinder 150 away from the moving part 151. The elastic element 1510 and the pressure element 1511 are arranged sequentially in the direction of gravity. One end of the elastic element 1510 is fixed, and the other end is fixedly connected to the pressure element 1511. When the pressure element 1511 moves in the direction of gravity, it can drive the elastic element 1510 to undergo elastic deformation. The other end of the elastic element 1510 is connected to the pressure element 1511. The pressure element 1511 is rigidly connected to the connecting part 1520, and the push-pull part 1521 can move inside the hydraulic cylinder 150 when the pressure element 1511 moves.

[0111] For example, see Figure 12As shown, when the pressurizing member 1511 moves vertically downward, the elastic member 1510 undergoes elastic deformation under the gravity of the pressurizing member 1511. The pressurizing member 1511 pushes the connecting part 1520 downward, and the connecting part 1520 then pushes the push-pull part 1521 to slide within the hydraulic cylinder 150, increasing the accommodating space of the first accommodating cavity and decreasing the accommodating space of the second accommodating cavity. The coolant in the coolant reservoir 13 is pumped into the heat dissipation channel 123 to dissipate heat from the heat-conducting member 111 and reduce the temperature of the light-emitting member 22. At the same time, the coolant that has absorbed heat is collected at the coolant radiator 14, where it is cooled and collected back into the coolant reservoir 13 via the hydraulic cylinder 150.

[0112] See Figure 13 As shown, during the upward vertical movement of the pressurizing member 1511, the elastic member 1510 undergoes elastic deformation during the downward vertical movement of the pressurizing member 1511. Therefore, during the upward movement of the pressurizing member 1511, the elastic member 1510 applies an upward elastic force to the pressurizing member 1511, which helps the pressurizing member 1511 return to its initial state more quickly, thereby increasing the moving speed of the push-pull part 1521. During the upward movement of the pressurizing member 1511, the push-pull part 1521 moves towards the direction of the first hydraulic inlet 1500 / first hydraulic outlet 1502, and the accommodating space of the first accommodating cavity gradually decreases, releasing the coolant in the coolant accommodating tank 13 into the heat dissipation channel 123 to dissipate heat from the heat-conducting member 111 and reduce the temperature of the light-emitting member 22. At the same time, the accommodating space of the second accommodating cavity gradually increases, so as to collect the cooled coolant in the coolant radiator 14 into the second accommodating cavity.

[0113] In some embodiments, the hydraulic cylinder 150 can be placed horizontally or at an angle, and the specific design can be adapted to different embodiments.

[0114] The pressure-applying component 1511 can be an object with a certain weight to push and pull the piston rod 152, such as a solid ball, a rectangular block, etc. The elastic component 1510 can be a spring, etc.

[0115] In this embodiment, the heat dissipation device 10 can dissipate heat and cool the light-emitting element 22 in the vehicle display panel, and can utilize the vibration of the vehicle to achieve the flow of coolant. For example, the elastic element 1510 is fixed to the vehicle. During vehicle movement, the vibration of the entire vehicle will cause the pressure element 1511 to move back and forth in the vertical direction, thereby causing the elastic element 1510 to undergo elastic deformation in the vertical direction, thereby achieving the flow of coolant.

[0116] In addition, in order to limit the movement position of the pressurizing member 1511, the movable part 151 also includes a limiting rail, on which the pressurizing member 1511 can slide to ensure the stability of the entire system.

[0117] Further, see Figure 14 and Figure 15 As shown, the coolant radiator 14 includes cooling fins 140 and a cooling box 141. The inlet of the cooling box 141 is connected to the coolant outlet 122. Multiple cooling fins 140 protrude from the side wall of the cooling box 141, and cooling channels are provided between adjacent cooling fins 140. When the vehicle is running, it will bring in a high airflow. The high-speed airflow flows into the cooling channels and quickly removes the temperature of the coolant in the cooling box 141, thereby achieving the cooling and heat dissipation treatment of the coolant.

[0118] It should be noted that the coolant radiator 14 can be made of materials with good heat dissipation performance, such as silver, copper, gold, aluminum, diamond, silicon, etc. In this embodiment, both the cooling fins 140 and the cooling box 141 can be made of aluminum, and the cooling box 141 includes multiple cooling pipes, including a first main pipe, branch pipes and a second main pipe. The first main pipe is connected to the second main pipe through the branch pipes. The first main pipe is connected to the coolant outlet 122, and the second main pipe is connected to the second hydraulic inlet 1501 of the hydraulic cylinder 150. The cooling pipes include multiple branch pipes, which correspond to the cooling channels formed by the cooling fins 140, so that the high-speed airflow can more quickly remove the high temperature of the coolant in the branch pipes and reduce the temperature of the coolant more rapidly.

[0119] In other words, this solution can achieve continuous operation through the coolant reservoir 13, coolant radiator 14, heat dissipation component 12, hydraulic cylinder 150, moving part 151 and piston rod 152, continuously dissipating and cooling the temperature generated by the light-emitting element 22, thereby improving the service life of the light-emitting element 22.

[0120] Example 2

[0121] Embodiment 2 of this application provides a display panel, which can be a vehicle-mounted Mini LED display panel. See [link / reference needed] Figure 2 As shown, it includes a back plate 21, an optical film 30, a light-emitting element 22, and a heat dissipation device 10 as mentioned in Embodiment 1. The light-emitting element 22 includes a lamp plate 220 and a plurality of light sources 221 arranged in an array on the lamp plate 220. The light sources 221 will generate a large temperature during operation. The heat dissipation device 10 cools down the temperature generated by the light-emitting element 22, thereby improving the service life of the light-emitting element 22.

[0122] In this embodiment, the back plate 21 is a glass back plate 21. Because the glass back plate 21 is prone to cracking when heated, a heat-conducting plate 110 is provided between the glass back plate 21 and the light-emitting element 22. A through hole 210 is provided on the glass back plate 21, and the through hole 210 corresponds to the heat-conducting element 111 on the heat-conducting plate 110. The part of the heat-conducting element 111 that passes through the through hole 210 corresponds to the heat dissipation hole 121. The heat-conducting element 111 is dissipated by the coolant, thereby releasing the heat generated by the light-emitting element 22 and improving the service life of the light-emitting element 22.

[0123] In addition, see Figure 2 As shown, the display panel also includes a middle frame 40, a diffuser plate 50, and a liquid crystal layer. The middle frame 40 is fixed to the outer edge of the back plate 21 by adhesive to form a placement groove in the glass back plate 21. The diffuser plate 50, the optical film 30, and the liquid crystal layer are placed in the placement groove in sequence, and the liquid crystal layer is bonded and fixed to the middle frame 40 by the edge-sealing tape 60.

[0124] In the embodiments of this application, see Figure 4 As shown, the first layer plate 125, the second layer plate 126, the third layer plate 127 and the heat exchange component 124 in the heat dissipation assembly 12 are located on the side of the back plate 21 away from the heat conduction plate 110. The heat conduction component 111 passes through the through hole 210 of the glass back plate 21 and is in contact with the heat conduction hole 1240 in the heat exchange component 124. A heat conduction block 1242 is provided in the heat conduction hole 1240 to transfer the heat on the heat conduction component 111 to the heat exchange wheel 1241. The heat on the heat exchange path is absorbed by the coolant, thereby reducing the heat on the heat conduction component 111, reducing the temperature of the light-emitting component 22 and improving the service life of the light-emitting component 22.

[0125] To ensure effective heat dissipation for the heat-conducting component 111, see [reference needed]. Figure 1 and Figure 2 As shown, the side of the first layer plate 125 away from the second layer plate 126 is attached to the back plate 21, and the heat dissipation assembly 12 is fixed to the back plate 21 by the edge binding tape 60.

[0126] In this embodiment, the heat dissipation device 10 can continuously cool the heat generated by the light-emitting element 22, thereby preventing the back plate 21 from cracking and improving the service life of the light-emitting element 22.

[0127] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0128] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A heat dissipation device, characterized in that, include: A heat-conducting assembly, the heat-conducting assembly including a heat-conducting plate and a heat-conducting element protruding from the heat-conducting plate; A heat dissipation assembly, comprising a coolant inlet, heat dissipation holes, and a coolant outlet, wherein the heat dissipation holes correspond to the heat-conducting element, and the heat-conducting element is inserted into the heat dissipation holes; The coolant inlet and the coolant outlet are connected to the heat dissipation hole. The coolant can flow from the coolant inlet into the heat dissipation hole to absorb heat from the heat-conducting component. After absorbing heat, the coolant flows out through the coolant outlet. The heat dissipation component further includes a heat dissipation channel, which connects to adjacent heat dissipation holes and is also connected to the coolant inlet and the coolant outlet. The heat dissipation hole is provided with a heat exchange component, which includes a heat exchange wheel and a first sealing ring. The heat exchange wheel is provided with a heat conduction hole, and the heat conduction component is tightly inserted into the heat conduction hole. The first sealing ring is sleeved on the outer contour of the heat exchange wheel, and the inner wall of the heat dissipation hole is abutted and connected to the side of the first sealing ring away from the heat exchange wheel. The heat dissipation assembly includes a first plate, a second plate, and a third plate. The first plate has a first through hole corresponding to the heat-conducting element. The second plate is located on the side of the first plate away from the heat-conducting element, and has heat dissipation holes and heat dissipation channels. The heat exchange element is located within the heat dissipation holes on the second plate, and the first plate covers the heat dissipation channels. The heat exchange wheel includes a base and a first boss. The first boss protrudes from the base and is located on the side of the base close to the first plate. The first boss is inserted into the first through hole, and a second sealing ring is provided between the first boss and the first through hole. The third plate is located on the side of the second plate away from the heat-conducting element. On one side of the first layer plate, the third layer plate is provided with a second through hole, which corresponds to the heat-conducting element. The second layer plate is provided with a heat dissipation channel on the side near the third layer plate, and the third layer plate covers the heat dissipation channel of the second layer plate near the third layer plate. The heat exchange wheel also includes a second boss, which protrudes from the side of the base away from the first layer plate and is inserted into the second through hole. A third sealing ring is provided between the second boss and the second through hole. The base is provided with a flow hole for the flow of coolant, which connects the heat dissipation channel of the second layer plate near the first layer plate and the heat dissipation channel of the second layer plate near the third layer plate.

2. The heat dissipation device according to claim 1, characterized in that, The heat-conducting component includes a plurality of heat-conducting elements, which are arranged in an array on the heat-conducting plate. The heat dissipation component includes a plurality of heat dissipation holes, which correspond one-to-one with the heat-conducting elements.

3. The heat dissipation device according to claim 1, characterized in that, The heat exchange component further includes a heat conduction block, which is disposed between the inner wall of the heat conduction hole and the heat conduction component, and the heat conduction block is in contact with both the inner wall of the heat conduction hole and the heat conduction component.

4. The heat dissipation device according to any one of claims 1 to 3, characterized in that, The heat dissipation device also includes: Coolant reservoir; A coolant radiator, wherein the inlet of the coolant radiator is connected to the coolant outlet; A hydraulic assembly includes a hydraulic cylinder, a movable part, and a piston rod. The hydraulic cylinder includes a first hydraulic inlet, a second hydraulic inlet, a first hydraulic outlet, and a second hydraulic outlet. The first hydraulic inlet and the first hydraulic outlet are located on the same side of the hydraulic cylinder, and the second hydraulic inlet and the second hydraulic outlet are also located on the same side of the hydraulic cylinder. The first hydraulic inlet is located on the side of the hydraulic cylinder closer to the movable part, and the second hydraulic inlet is located on the side of the hydraulic cylinder farther from the movable part. The first hydraulic inlet communicates with the outlet of a coolant reservoir, and the second hydraulic inlet communicates with the outlet of a coolant radiator. The first hydraulic outlet communicates with the coolant inlet, and the second hydraulic outlet communicates with the inlet of the coolant reservoir. The piston rod is movable within the hydraulic cylinder. When the piston rod moves toward the first hydraulic inlet, it pumps coolant from the hydraulic cylinder into the coolant inlet and collects coolant from the coolant radiator into the hydraulic cylinder. When the piston rod moves toward the second hydraulic inlet, it pumps coolant from the hydraulic cylinder into the coolant reservoir and vice versa. A first check valve is provided on the flow channel between the first hydraulic outlet and the coolant inlet, and a second check valve is provided on the flow channel between the first hydraulic inlet and the outlet of the coolant reservoir.

5. The heat dissipation device according to claim 4, characterized in that, The movable component includes an elastic element and a pressure element arranged vertically. One end of the pressure element is connected to the elastic element, and the other end is connected to the piston rod. The pressure element can push the piston rod towards the second hydraulic inlet during downward movement, and can also move upward under the elastic action of the elastic element. During upward movement, the pressure element can pull the piston rod towards the first hydraulic inlet; and / or The coolant radiator includes cooling fins and a cooling tank. The inlet of the cooling tank is connected to the coolant outlet. Multiple cooling fins protrude from the cooling tank, and cooling channels are provided between adjacent cooling fins.

6. A display panel, characterized in that, The device includes a back plate, an optical film, a light-emitting element, and a heat dissipation device as described in any one of claims 1-5. The light-emitting element is disposed between the back plate and the optical film. The light-emitting element includes a lamp plate and a plurality of light sources arranged in an array on the lamp plate. The light sources are disposed on the side of the lamp plate facing the optical film. The back plate is provided with a plurality of through holes, and the through holes correspond to the light sources. In the heat dissipation device, the heat-conducting plate is disposed between the back plate and the lamp plate, the heat-conducting element is disposed on the side of the heat-conducting plate facing the back plate, and the heat-conducting element corresponds to the through hole, with the portion of the heat-conducting element passing through the through hole inserted into the heat dissipation hole.

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